Adaptive cooling framework

Abstract

The present invention relates to providing a thermal management system for a device. One example determines a temperature reading associated with one or more components of the device and compares the temperature reading to an optimal operating temperature. The example can selectively couple or decouple a heat dissipation element based at least on the temperature reading associated with one or more components of the device to achieve the optimal operating temperature.

Description

[0001] background

[0002] The increased use of mobile devices around the world has stimulated greater advancements in efforts to increase the processing power associated with mobile devices. At the same time, the convenience of carrying such mobile devices is also extremely important, and as a result, mobile devices have become thinner and more portable. Due to the thinness of modern mobile devices, heat dissipation can be difficult, particularly due to the increase in processing power of mobile devices and the lack of available space to adequately provide heat sinks for processing elements. As a result, heat can often accumulate in mobile devices, which can lead to degradation of various components and a reduction in the overall efficiency of the mobile device. Summary of the invention

[0003] This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0004] The description generally relates to techniques for heat dissipation in a device. One example relates to a device that includes a processing unit, a touch-sensitive display surface, a first heat dissipation element coupled to the processing unit, a second heat dissipation element coupled to the touch-sensitive display surface, and a thermally conductive element selectively coupled between the first heat dissipation element and the second heat dissipation element, the thermally conductive element being positionable to allow or restrict heat flow between the first heat dissipation element and the second heat dissipation element based at least on temperature readings associated with the processing unit and the touch-sensitive display surface.

[0005] Another example relates to an alternative device that may include multiple heat-generating electronic components, a thermally conductive system dispersed throughout the device to carry heat away from the heat-generating electronic components, and one or more doors dispersed throughout the thermally conductive system, the one or more doors being selectively engageable to allow heat conduction between elements of the thermally conductive system or disengaged to limit heat conduction between elements of the thermally conductive system based at least on temperature readings associated with the heat-generating electronic components.

[0006] Another example includes a method or technique that can be performed on a device. The method can include determining a temperature reading associated with at least one of a touch-sensitive display or a processing unit, comparing the determined temperature reading to an optimal operating temperature, and selectively coupling or decoupling a first heat dissipation element associated with the touch-sensitive display from a second heat dissipation element associated with the processing unit based at least on whether the determined temperature exceeds the optimal operating temperature.

[0007] The examples listed above are intended to provide a quick reference to aid the reader and are not intended to limit the scope of the concepts described herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The detailed description is described with reference to the accompanying drawings. In the drawings, the leftmost digit(s) of a reference number identifies the drawing in which the reference number first appears. The use of similar reference numbers in different instances in the specification and the drawings may indicate similar or identical items.

[0010] Figures 1A-1E An example device consistent with some implementations of the present inventive concepts is illustrated.

[0011] Figure 2 Example procedures consistent with some implementations of the present inventive concepts are illustrated.

[0012] Figure 3 Example scenarios consistent with some implementations of the present inventive concepts are illustrated.

[0013] Detailed Description

[0014] Overview

[0015] The present inventive concepts relate to heat dissipation in devices, such as mobile devices, where the thinness of the device is important to consumers. Due to the thinness of such devices, heat generated by various components of the device can adversely affect the performance of the device and result in an unfavorable user experience with the device. Therefore, the concepts discussed herein discuss methods of heat dissipation and efficient thermal management in these types of devices.

[0016] Figures 1A-1E An example device 100 is shown that appears to be a tablet-style computing device. Figure 1A A partial cutaway view of the device 100 is shown, and Figure 1B-1E Various cross-sectional views of the device 100 are depicted. Figure 1A As shown, device 100 may have a device housing 102, which may cover the back of device 100 and / or the sides of device 100. Display 104 may also be included in device 100 for displaying information or receiving input. Device 100 may also include a collection of heat generating electronic components 106. In this example, heat generating electronic components 106 may include a processing module 108, which may include various electronic processing components, such as processor 108A and memory 108B.

[0017] The device 100 may further include a touch display module 110 associated with the display 104. The device 100 may further include a heat conduction system 112 that may be distributed throughout the device 100 and may be used to dissipate heat generated by the heat generating electronic components 106. Figure 1A The processing module 108 and the touch display module 110 are depicted as being positioned on a similar X reference axis, but in some implementations, the set of heat generating electronic components 106 can be positioned along a Z reference axis in a manner sandwiched between the device housing 102 and the display 104, such as Figure 1B Depicted.

[0018] Figure 1B A cross section of a portion of an example device 100 including a thermally conductive system 112 is depicted according to one implementation. As depicted, the device 100 may include a device housing 102, which may be a glass backplane or other such material covering the back of the device. The device 100 may also include a processing module 108, which may be a system-on-chip (SOC) printed circuit board assembly having several hardware electronic components attached and / or soldered to the printed circuit board. Such electronic components may include a central processing unit (CPU), such as a processor 108A, a graphics processing unit (GPU), a memory such as a memory 108B (e.g., flash memory), and other electronic components such as capacitors, resistors, transistors, or IC chips.

[0019] The processing module 108 may also execute various subsystems (such as a memory management system, which may be used to handle the allocation of memory resources) that operate on the device 100 and may be stored in the memory of the SOC. The processing module 108 may also store and execute a thermal management system, which may be used to optimize device performance while keeping the device 100 within a safe operating temperature.

[0020] The thermal conductivity system 112 of the device 100 may include an internal heat dissipation element 114, which can be used to dissipate heat throughout the device by thermal conduction. The heat dissipation element 114 can be a structural element that can be in contact with various components of the device 100 (such as the processing module 108) to dissipate heat generated from the components. For example, the heat dissipation element 114 can be a structural element (such as a metal middle frame) disposed within the device 100 and used as a heat sink. In some implementations, the heat dissipation element 114 can be an alternative type of heat sink, such as a metal sheet or graphite sheet, a graphite sheet, a heat pipe, a vapor chamber, or any other such element that can be used as a heat sink for the entire device 100. In addition, the heat dissipation element 114 can be divided into multiple sections by way of thermal conductive heat (s) 116, which can be selectively engaged or disengaged to guide heat flow throughout the device 100, as shown in reference. Figure 1C Described in more detail.

[0021] The device 100 may also include an image generation module 118, which may be an electronic component for generating an image to be displayed by the device 100. In some implementations, the image generation module 118 may be a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, or other types of light emitting structures that may be used to generate an image.

[0022] The device 100 may also include a display 104, which may be composed of a touch display module 110 and a protective surface 120. The touch display module 110 may display an image generated from the image generation module 118 (such as an image depicting a graphical user interface (GUI)), which may enable a user to interact with the device 100 through touch of a simple or multi-touch gesture, or via a stylus or pen. The protective surface 120 may be disposed on the surface of the touch display module 110, which may provide protection for the touch display module 110 from scratches, dirt, or other particles. In some implementations, the protective surface 120 may be a thin sheet of transparent glass, or may be a transparent anti-scratch film. However, in some implementations, the protective surface 120 may be integrated with the touch display module 110 as a layer (such as by covering the top surface of the touch display module 110 with glass).

[0023] The heat transfer system 112 of the device 100 is Figure 1C is described in more detail in Figure 1C As described in the foregoing, the heat dissipation element 114 can be composed of an upper beam 114A and a lower beam 114B. The heat conducting element (s) 116 can be an assembly that can be composed of heat conducting elements 122A and 122B and a positioning element 124. The heat conducting element 122A can be thermally coupled to the upper beam 114A, and the heat conducting element 122B can be thermally coupled to the lower beam 114B. In one example, the heat conducting elements 122A and 122B can be solid conductive materials (such as metal strips extending toward the opposite beams of the frame), and in some instances, can be formed as an integral part of their respective beams.

[0024] The positioning element 124 can be selectively engaged to thermally couple the thermally conductive elements 122A and 122B, thereby permitting heat flow, or selectively disengaged to thermally decouple the thermally conductive elements 122A and 122B, thereby isolating heat to a specific area of ​​the heat dissipation element 114. Specifically, the positioning element 124 can contact the thermally conductive element 122A with the thermally conductive element 122B when activated by the thermal management system, thereby providing a thermal conduction path between the upper beam 114A and the lower beam 114B. For example, each of the thermally conductive elements 122A and 122B can be slightly bent to contact each other by magnetic force to make contact. Alternatively, one or more parts of the heat dissipation element 114 or (all) heat conductive heat 116 can be slidably movable (such as by being on a track), and when the positioning element 124 is activated, the one or more parts of the heat dissipation element 114 and / or (all) heat conductive heat 116 can slide to contact each other to allow heat flow.

[0025] Positioning element 124 can be any type of positioning element that can couple or decouple one or more parts of heat dissipation element 114 to allow heat to move. For example, positioning element 124 can be an electromagnet, a hinge, a motor, or a sliding mechanism that can move heat-conducting elements 122A and 122B to contact each other. Alternatively, positioning element 124 can position an object that allows heat conduction between heat-conducting elements 122A and 122B. For example, positioning element 124 can be a heat pipe or a steam chamber that can conduct heat between heat-conducting elements 122A and 122B when engaged, or can prevent heat from flowing when disengaged.

[0026] The engagement and disengagement of the thermal conductive heat(es) 116 may be determined by a thermal management system in response to, for example, temperature readings from one or more thermal sensors 126, which may be placed at various points in the device 100. Figure 1C As depicted, thermal sensors may be placed on upper beam 114A, lower beam 114B, and / or touch display module 110 in order to accurately represent temperature readings associated with these components to the thermal management system. The specific steps performed by the thermal management system in engaging and disengaging the thermal conductive heat(es) based at least on the thermal temperature readings will be described below with respect to Figure 2 and 3 To quote.

[0027] Figure 1D An example of thermally conductive door(s) 116 being in a disengaged position is depicted, which may occur based on instructions from a thermal management system. In this example, the thermal management system wants to isolate heat to a certain area of ​​the device 100, and therefore the thermally conductive door(s) 116 are disengaged to block the heat flow path between the upper beam 114A and the lower beam 114B. Specifically, in response to instructions from the thermal management system, the positioning element 124 (depicted as an electromagnet) may be disengaged, which may cause the thermally conductive elements 122A and 122B to move away from each other so that the elements are no longer in contact. For example, since the positioning element 124 may be an electromagnet, the polarity of the magnet may be changed to cause the thermally conductive elements 122A and 122B to repel each other and isolate heat to their respective beams. As Figure 1D As depicted in , the positioning element 124 may be included as part of both thermally conductive elements 122A and 122B (ie, both elements may have electromagnets), or in some implementations, the positioning element 124 may be included in only one of the thermally conductive elements.

[0028] As such, the thermally conductive heat sink(s) 116 comprised of the thermally conductive elements 122A, 122B and the positioning element 124 may function as thermally conductive heat sinks that may be turned on or off based on instructions from, for example, a thermal management system. The thermal management system may engage or disengage the thermal sink in response to a temperature reading provided by the thermal sensor 126, such as in response to comparing the current temperature reading to an optimal operating temperature for each component (which may be stored in, for example, a thermal lookup table in a memory). The specific steps performed by the thermal management system in engaging and disengaging the thermal sink are described below with respect to FIG. Figure 2 and 3 To quote.

[0029] Replacement Implementation

[0030] Figure 1E An alternative implementation of the device 100 is depicted. In this implementation, in addition to the processing module 108, the image generation module 118, and the touch display module 110, the device 100 may also include a dedicated graphics processing module 128. The graphics processing module 128 may be, for example, a graphics processing unit (GPU), which may allow the device 100 to handle computer graphics and image processing more efficiently, thereby alleviating processing requirements on the processing module 108. In this example, the graphics processing module 128 may also generate a large amount of heat within the device 100, which may adversely affect the overall operating performance of the device 100.

[0031] Thus, in this implementation, the heat dissipation element 114 may include multiple sub-sections (such as an upper beam 114A, a lower beam 114B, and a secondary upper beam 114C). In addition, there may be multiple thermally conductive heats 116A, 116B, and 116C disposed within the device 100, which may be used to direct the flow of heat around the device 100 in a variety of different ways depending on the processing load of each component. In this example, the thermally conductive heats 116A, 116B, and 116C may use a vapor chamber as a thermally conductive element. In this implementation, the thermal management system may determine whether the vapor chamber may be engaged to allow heat to be conducted through the chamber (such as by filling the chamber with a working thermally conductive fluid by means of a pump to allow heat to be conducted through the chamber). Alternatively, the fluid in the chamber may be reduced, thereby forming a vacuum in the chamber, which may reduce the heat transfer capability to a minimum.

[0032] For example, based on Figure 1E , certain thermally conductive heat pads may be selectively engaged or disengaged based on commands from the thermal management system. For example, processing module 108 and graphics processing module 128 may be generating excessive heat. In this example, the thermal management system may compare the temperatures of processing module 108 and graphics processing module 128 to optimal temperature specifications and may then determine the best action for handling the excess heat by using the thermally conductive heat pads.

[0033] For example, if the processing module 108 is generating excessive heat, but the temperature of the graphics processing module 128 is below the specification temperature (and therefore has additional capacity to absorb heat), the thermal conductive pads 116A and 116C can be disengaged to limit the flow of heat from both the upper beam 114A and the secondary upper beam 114C to the lower beam 114B in an effort to avoid overheating the touch display module 110. However, the thermal conductive pad 116B can be engaged to attempt to spread the heat between the upper beam 114A and the secondary upper beam 114C, thereby providing additional heat dissipation capacity. Additionally, in instances of high GPU computing requirements, the graphics processing module 128 can be isolated by disengaging the thermal conductive pads 116B and 116C to avoid adversely affecting the operation of the processing module 108 or the touch display module 110, thereby preventing excessive heat from flowing to the remaining components in the device 100.

[0034] Although Figure 1E Three sections of heat sink element 114 and three thermally conductive gates 116 are depicted, but it will be appreciated that any number of elements and / or gates may be used to allow for a greater amount of granular control over the flow of heat in device 100. For example, lower beam 114B may be further subdivided into multiple subsections with thermally conductive gates dispersed throughout the subsections.

[0035] Will further understand, Figures 1A-1E The provided example of the thermally conductive system depicted in is not the only implementation contemplated, and other types of thermally conductive assemblies may also be used. For example, a mechanical hinge may be used with an electric motor to pivot the thermally conductive strip toward and away from the upper and lower beams of the thermally conductive system based on instructions from the thermal management system.

[0036] Example Heat Dissipation Methods

[0037] The following discussion presents an overview of functionality related to using a thermally conductive heat sheet for heat dissipation according to one implementation. Figure 2 An exemplary method 200 consistent with the present inventive concepts is illustrated. The method 200 may be performed, for example, by a thermal management system stored and executed by the processing module 108.

[0038] At block 202, the thermal management system may determine temperature readings associated with one or more components of the device. For example, a temperature reading associated with the touch display module 110 may be measured using a thermal sensor associated with the touch display module. Additionally, temperature readings associated with the upper beam 114A and the lower beam 114B may be measured using their associated thermal sensors.

[0039] At block 204, the thermal management system may compare the determined temperature readings to the optimal operating temperatures for each of the components associated with the device. Such optimal operating temperatures may be stored in a thermal lookup table, such as stored in a memory of the processing module 108, and may be predefined by a developer of the device 100.

[0040] For example, the touch display module 110 may have an optimal operating temperature of 48 degrees Celsius for the purpose of ensuring safe operation for a user, and use of the touch display may become unsafe for a user to maintain physical contact with the touch display for an extended period of time when a temperature reading associated with the touch display module 110 exceeds the optimal operating temperature. As such, the thermal management system may determine various courses of action to reduce the temperature associated with the touch display module 110 so that use of the touch display module is no longer unsafe for the user.

[0041] Specifically, at block 206, the thermal management system selectively couples or decouples heat dissipating elements (such as upper beam 114A and lower beam 114B) by engaging or disengaging thermal conductive heat pad(s) 116 dispersed throughout the device 100, as exemplified in FIG. Figures 1A-1E The engagement and disengagement of the thermal conductive heat(es) 116 can assist in moving heat throughout the device 100 for the purpose of achieving optimal system performance. In some examples, the thermal sensor can measure the ambient temperature associated with the device along with both the upper beam temperature and the lower beam temperature, and the engagement or disengagement of the thermal conductive heat(es) 116 can be based on optimized system performance taking into account each temperature measurement.

[0042] For example, refer to Figure 3 , table 300 depicts example scenarios illustrating the use of temperature readings and determining optimized system performance responses. The first scenario 302A depicts the processing module 108 operating at 5 watts of power, while the touch display module 118 operating at 1 watt of power. That is, in this scenario, the processing module has high power consumption, while the touch display module has low power consumption.

[0043] Given an ambient temperature of 25 degrees, an upper beam temperature of 55 degrees, and a lower beam temperature of 52 degrees, a thermal sensor associated with the processing module may report an operating temperature of 75 degrees (and thus may have a margin to a specification temperature of 90 degrees), while a thermal sensor associated with the touch display module may report an operating temperature of 50 degrees (and thus may exceed the specification temperature of 48 degrees). Additionally, in scenario 302A, the thermally conductive heat sink in this scenario is engaged, thereby allowing heat to flow between the upper beam and the lower beam. In such instances, the thermal management system may determine that the temperature of the touch display module is above the optimal operating temperature, and the intended outcome of the thermal management system in this case is typically to reduce the amount of power consumption of the processing module.

[0044] However, since users generally do not want the device to artificially throttle processor performance, according to the disclosed implementation, an adaptive midframe may be used instead to implement the second scenario 302B. As depicted, scenario 302B indicates that both the processing module and the touch display module are operating at the same power level as scenario 302A, but since the thermal management system determines that the temperature of the touch display module exceeds the optimal operating temperature, the door may be disengaged instead to limit heat dissipation throughout the device.

[0045] Specifically, by disengaging the door, the temperature of the upper beam associated with the processing module can rise to 57 degrees, while the temperature of the lower beam associated with the touch display module can drop to 48 degrees. As a result, the temperature of the processing module may rise slightly, but the temperature of the touch display module is sufficiently reduced to reach the optimal operating temperature that meets the temperature specification. Therefore, by disengaging the door and limiting the heat conduction between the upper beam and the lower beam, the processing module power and system performance can be kept constant while avoiding overheating of the touch display module.

[0046] A second example may be depicted by scenarios 304A and 304B. In scenario 304A, the processing module is operating at 2 watts (considered a low operating power level for the processing module) and the touch display module is operating at 3 watts (considered a high operating power level for the touch display module (such as running at full brightness)). In this scenario, the door is currently disengaged and as a result, the upper beam temperature is 50 degrees (i.e., cooler due to the low power level for the processing module) and the lower beam temperature is 53 degrees (i.e., higher due to the high power level for the touch display module). Additionally, the touch display module is 49 degrees, and because the temperature of the touch display module exceeds the optimal operating temperature, the device may seek to reduce this temperature, which is typically achieved by reducing the brightness associated with the touch display module.

[0047] However, the user also does not want the device to reduce screen brightness when in heavy use, and therefore, a second scenario 304B may be implemented instead. As depicted, scenario 304B indicates that both the processing module and the touch display module are operating at the same power level as scenario 304A, but because the thermal management system determines that the temperature of the touch display module exceeds the optimal operating temperature, the door may be engaged instead to allow heat to be dispersed throughout the device.

[0048] Specifically, by engaging the gate, heat can flow from the lower beam to the upper beam. As previously mentioned, the processing module is operating at a low power level, while the touch display module is operating at a higher operating power than the processing module, and as a result, the upper beam associated with the processing module has additional heat dissipation capabilities. Therefore, by engaging the gate, heat can flow from the lower beam to the upper beam, thereby moving the heat away from the touch display module and reducing the operating temperature of the touch display module to 48 degrees. In addition, by dissipating heat between the upper beam and the lower beam, the temperature of the touch display module can be reduced without reducing the brightness of the touch display module.

[0049] At block 208, the thermal management system may further adjust the power levels of components of the device, such as the processing module 108 or the touch display module 110, based at least on whether engagement or disengagement can achieve the optimal operating temperature associated with the components. For example, in contrast to reference scenario 304B, engagement of the door may still not be sufficient to reduce the temperature of the touch display module to 48 degrees. In this instance, the thermal management system may specify that the touch display module 110 may reduce brightness to achieve the desired optimal operating temperature. The process may then loop back to block 202 to continuously evaluate the temperature associated with the device 100 and engage or disengage the door appropriately depending on the current state of the device.

[0050] It will be appreciated that in certain implementations, the thermal management system can actively monitor the current temperature associated with the heat-generating electronic components 106, and can predict whether one or more electronic components are likely to exceed the optimal operating temperature set for the component. For example, the thermal management system can continuously monitor the operating temperature of the touch display module 110, and when the temperature approaches 48 degrees, the door can be actively engaged or disengaged as appropriate to prevent the operating temperature of the touch display module 110 from exceeding the optimal operating temperature.

[0051] Device Implementation

[0052] This implementation can be performed in various scenarios on various devices. Although the device 100 described herein relates to a mobile device, the concepts discussed above can be used for any type of processing device that generates heat that can adversely affect operating performance, such as various computers and computing devices, including desktop computers and monitors, blade servers, cloud servers, global positioning system (GPS) units, cameras, head-mounted displays, wearable smart devices, etc. Specifically, as long as the device has some computing hardware that generates heat, the device can perform heat dissipation according to the implementation described above. Of course, not all device implementations can be shown, and, from the above and following descriptions, other device implementations are obvious to those skilled in the art.

[0053] As used herein, the terms "device," "computer," "computing device," "blade server," and / or "cloud server" may refer to any type of device having a certain amount of hardware processing capability and / or hardware storage / memory capability. The processing capability provided by processing module 108 may include one or more hardware processors 108A (e.g., hardware processing units / cores) that can execute data in the form of computer-readable instructions to provide functionality. The computer-readable instructions and / or data may be stored on memory 108B.

[0054] The memory 108B associated with the processing module 108 may be internal or external to the device 100 and may include any one or more of volatile or non-volatile memory, a hard drive, a flash storage device, and / or an optical storage device (e.g., a CD, a DVD, etc.), among others. As used herein, the term "computer-readable medium" may include signals. Conversely, the term "computer-readable storage medium" excludes signals. Computer-readable storage media include "computer-readable storage devices." Examples of computer-readable storage devices include volatile storage media such as RAM, non-volatile storage media such as hard drives, optical disks, and flash memory, among others.

[0055] In some cases, processor 108A can be a general-purpose hardware processor. In other cases, processing module 108 can utilize SOC type design. In SOC design implementation, the functionality provided by the device can be integrated on a single SOC or multiple coupled SOCs. One or more associated processors can be configured to coordinate with shared resources (such as memory, storage, etc.), and / or with one or more dedicated resources (such as hardware blocks configured to perform certain specific functions). Thus, the term "processor" as used herein may also refer to a central processing unit (CPU), a graphics processing unit (GPU), a controller, a microcontroller, a processor core, or other types of processing devices suitable for implementation in both conventional computing architectures and SOC designs.

[0056] Alternatively or additionally, the functionality described herein may be performed at least in part by one or more hardware logic components. As an example and not limitation, illustrative types of hardware logic components that may be used include field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chip (SOCs), complex programmable logic devices (CPLDs), etc.

[0057] In some configurations, any modules / code discussed herein may be implemented in software, hardware, and / or firmware. In any case, the modules / code may be provided during the manufacture of the device or by an intermediary that prepares the device for sale to the end user. In other instances, the end user may later install these modules / code (such as by downloading an executable code and installing the executable code on a corresponding device).

[0058] It is also noted that the device 100 may generally have input and / or output functionality. For example, the device 100 may have various input mechanisms, such as a keyboard, a mouse, a touchpad, voice recognition, gesture recognition (e.g., using a depth camera (such as a stereo or time-of-flight camera system, an infrared camera system, an RGB camera system) or using an accelerometer / gyroscope, facial recognition, etc.). The device 100 may also have various output mechanisms (such as a printer, a monitor, etc.).

[0059] It is also noted that the devices described herein can function independently or in a collaborative manner to implement the described techniques. For example, the methods described herein can be performed on a single device (such as device 100), and / or distributed across multiple computing devices communicating on one or more local area networks (LANs), the Internet, etc. For example, a central thermal management system can be provided on a cloud server, where thermal management of networked servers can be handled by the central thermal management system.

[0060] Additional Examples

[0061] Various device examples are described above. Additional examples are described below. One example includes a device that includes a processing unit, a touch-sensitive display surface, a first heat sink coupled to the processing unit, a second heat sink coupled to the touch-sensitive display surface, and a thermally conductive element selectively coupled between the first heat sink and the second heat sink that can be positioned to allow or restrict heat flow between the first heat sink and the second heat sink based at least on temperature readings associated with the processing unit and the touch-sensitive display surface.

[0062] Another example may include any of the above and / or following examples, wherein the thermally conductive element may be positioned to allow or restrict heat flow through the use of positioning elements.

[0063] Another example may include any of the above and / or following examples, wherein the positioning element is an electromagnet, a hinge, a motor, a sliding mechanism, or a pump.

[0064] Another example may include any of the above and / or following examples, wherein the thermally conductive element is a metal strip positioned to contact the first heat dissipating element and the second heat dissipating element by engaging a magnet that moves the metal strip.

[0065] Another example may include any of the above and / or following examples, wherein the thermally conductive element is a chamber that can be filled with a thermally conductive fluid from a pump to allow heat to flow between the first heat dissipating element and the second heat dissipating element.

[0066] Another example may include any of the above and / or following examples, wherein the temperature reading is compared to an optimal operating temperature.

[0067] Another example may include any of the above and / or following examples, wherein the thermally conductive element is positioned to allow heat to flow between the first heat dissipation element and the second heat dissipation element when a temperature reading associated with the touch-sensitive display surface exceeds the optimal operating temperature and the touch-sensitive display surface has a higher operating power than the processing unit.

[0068] Another example may include any of the above and / or below examples, wherein the apparatus further includes a third heat dissipation element selectively coupled to one or more of the first heat dissipation element or the second heat dissipation element using at least a second thermally conductive element.

[0069] Another example includes a device that includes a plurality of heat-generating electronic components, a thermally conductive system dispersed throughout the device to carry heat away from the heat-generating electronic components, and one or more doors dispersed throughout the thermally conductive system that can be selectively engaged to allow heat conduction between elements of the thermally conductive system or disengaged to limit heat conduction between elements of the thermally conductive system based at least on temperature readings associated with the heat-generating electronic components.

[0070] Another example may include any of the above and / or following examples, wherein the door includes a thermally conductive element and a positioning element.

[0071] Another example may include any of the above and / or following examples, wherein the thermally conductive element is a solid conductive material capable of conducting heat.

[0072] Another example may include any of the above and / or following examples, wherein the solid conductive material is metal or graphite.

[0073] Another example may include any of the above and / or following examples, wherein the positioning element is an electromagnet, a hinge, a motor, a sliding mechanism, or a pump.

[0074] Another example may include any of the above and / or following examples, wherein the temperature reading is compared to an optimal operating temperature associated with the heat generating electronic component.

[0075] Another example may include any of the above and / or following examples, wherein upon determining that the temperature reading exceeds the optimal operating temperature, the door is selectively engaged or disengaged.

[0076] Another example may include any of the above and / or following examples, wherein the door is engaged when a temperature reading associated with a first heat generating electronic component exceeds an optimal operating temperature of the first heat generating electronic component and the first heat generating electronic component has a higher operating power than a second heat generating electronic component.

[0077] Another example includes a method comprising determining a temperature reading associated with at least one of a touch-sensitive display or a processing unit, comparing the determined temperature reading to an optimal operating temperature, and selectively coupling or decoupling a first heat dissipation element associated with the touch-sensitive display with a second heat dissipation element associated with the processing unit based at least on whether the determined temperature exceeds the optimal operating temperature.

[0078] Another example may include any of the above and / or following examples, wherein the first heat dissipation element is coupled or decoupled with the second heat dissipation element by selectively engaging or disengaging a thermally conductive heat element coupled between the first heat dissipation element and the second heat dissipation element.

[0079] Another example may include any of the above and / or following examples, wherein the thermally conductive heat element includes a thermally conductive element and a positioning element.

[0080] Another example may include any of the above and / or following examples, wherein the method further includes determining whether selective coupling or decoupling of the first heat dissipation element with the second heat dissipation element reduces a temperature reading associated with the touch-sensitive display or the processing unit, and adjusting power to at least one of the touch-sensitive display or the processing unit upon determining that the temperature reading has not been reduced to an optimal operating temperature.

[0081] Conclusion

[0082] Although the subject of the present invention is described in language specific to structural features and / or method actions, it is understood that the subject defined in the appended claims is not necessarily limited to the specific features or actions described above. Instead, the specific features and actions described above are disclosed as example forms of implementing the claims, and other features and actions recognized by those skilled in the art are intended to fall within the scope of the claims.

Claims

1. A device comprising: a touch-sensitive display surface configured to emit an image; a touch display module configured to display the image through the touch-sensitive display surface, the touch display module having a first defined maximum operating temperature; a first heat dissipation element positioned above the touch display module and in a heat receiving relationship with the touch display module; an image generation module configured to generate the image, the image generation module being positioned above and in thermal receiving relationship with the first heat dissipating element; a second heat dissipation element positioned above the image generation module and thermally isolated from the image generation module; a processor unit positioned above and in thermally receiving relationship with the second heat dissipating element, the processor unit having a second defined maximum operating temperature; as well as a selectively controllable thermal conductive heat member thermally coupled between the first heat dissipation element and the second heat dissipation element, the selectively controllable thermal conductive heat member being configured to thermally couple the first heat dissipation element and the second heat dissipation element when the touch display module is at the first defined maximum operating temperature and the processor unit is below the second defined maximum operating temperature, and to thermally decouple the first heat dissipation element and the second heat dissipation element when the touch display module is at the first defined maximum operating temperature and the processor unit is at the second defined maximum operating temperature.

2. The apparatus of claim 1, wherein the selectively controllable thermally conductive heat source can be positioned to allow or restrict heat flow through the use of positioning elements.

3. The device of claim 2, wherein the positioning element is an electromagnet, a hinge, a motor, a sliding mechanism or a pump.

4. The apparatus of claim 3, wherein the positioning element is a metal strip that is positioned to contact the first heat dissipation element and the second heat dissipation element by engaging a magnet that moves the metal strip.

5. The apparatus of claim 3, wherein the selectively controllable thermally conductive door is a chamber that can be filled with a thermally conductive fluid from the pump to allow heat to flow between the first heat dissipating element and the second heat dissipating element. 6 . The device of claim 1 , further comprising a first temperature sensor for sensing a temperature of the touch display module.

7. The device of claim 6, wherein the first temperature sensor is positioned between the touch display module and the touch-sensitive display surface.

8. The apparatus of claim 1, further comprising a third heat dissipating element selectively coupled to one or more of the first heat dissipating element or the second heat dissipating element using at least a second selectively controllable thermally conductive thermal edge.

9. A device comprising: a touch-sensitive display configured to emit an image; a first heat generating electronic component configured to power the touch sensitive display and having a first defined maximum operating temperature; a first heat sink element positioned above and in heat receiving relationship with the first heat generating electronic component; a second heat generating electronic component positioned above and in heat receiving relationship with the first heat dissipating element; a second heat sink element positioned above the second heat generating electronic component; a third heat generating electronic component positioned above and in heat receiving relationship with the second heat dissipating element, the third heat generating electronic component having a second defined maximum operating temperature; as well as a selectively controllable thermal conductive heat layer thermally coupled between the first heat dissipation element and the second heat dissipation element, the selectively controllable thermal conductive heat layer being configured to thermally couple the first heat dissipation element and the second heat dissipation element when the first heat generating electronic component is at the first defined maximum operating temperature and the third heat generating electronic component is below the second defined maximum operating temperature, and to thermally decouple the first heat dissipation element and the second heat dissipation element when the first heat generating electronic component is at the first defined maximum operating temperature and the third heat generating electronic component is at the second defined maximum operating temperature.

10. The apparatus of claim 9, wherein the selectively controllable thermally conductive layer comprises a thermally conductive element and a positioning element.

11. The apparatus of claim 10, wherein the thermally conductive element is a solid conductive material capable of conducting heat.

12. The apparatus of claim 11, wherein the solid conductive material is metal or graphite.

13. The apparatus of claim 10, wherein the positioning element is an electromagnet, a hinge, a motor, a sliding mechanism, or a pump.

14. The apparatus of claim 9, further comprising a first temperature sensor positioned proximate the first heat generating electronic component and a second temperature sensor positioned proximate the second heat generating electronic component.

15. The apparatus of claim 14, further comprising a third temperature sensor positioned proximate the third heat generating electronic component.

16. The device of claim 9, wherein the first heat-generating electronic component comprises the touch-sensitive display.

17. A device comprising: a touch-sensitive display configured to emit an image; a first heat generating electronic component configured to power the touch sensitive display and having a first defined maximum operating temperature; a first heat sink element positioned above and in heat receiving relationship with the first heat generating electronic component; a second heat generating electronic component positioned above and in heat receiving relationship with the first heat dissipating element; a second heat dissipation element; a third heat generating electronic component positioned above and in heat receiving relationship with the second heat dissipating element, the third heat generating electronic component having a second defined maximum operating temperature; as well as a selectively controllable thermal conductive heat layer thermally coupled between the first heat dissipation element and the second heat dissipation element, the selectively controllable thermal conductive heat layer being configured to thermally couple the first heat dissipation element and the second heat dissipation element when the first heat generating electronic component is at the first defined maximum operating temperature and the third heat generating electronic component is below the second defined maximum operating temperature, and to thermally decouple the first heat dissipation element and the second heat dissipation element when the first heat generating electronic component is at the first defined maximum operating temperature and the third heat generating electronic component is at the second defined maximum operating temperature.

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