Para-synthesis system and para-synthesis method

Abstract

The embodiment of the present application provides a counterpoint synthesis system and a counterpoint synthesis method. The moving component of the counterpoint synthesis system is used to move the first chip unit RRR to the laser working module. The adsorption table is used to adsorb the first chip unit RRR and move the blank fourth chip unit WWW to the lower part of the adsorption table, so that the first chip unit RRR and the fourth chip unit WWW are counterpoint synthesized into the first intermediate chip unit RWW; the moving component moves the second chip unit GGG to the laser working module, and the adsorption table adsorbs the second chip unit GGG, so that the second chip unit GGG and the first intermediate chip unit RWW are counterpoint synthesized into the second intermediate unit RGW; the moving component is further used to move the third chip unit BBB to the laser working module, and the adsorption table adsorbs the third chip unit BBB, so that the third chip unit BBB and the second intermediate unit RGW are counterpoint synthesized into the LED chip unit RGB. The counterpoint accuracy and full automation degree of the massive transfer synthesis process of the LED chip unit in the Micro LED processing technology are achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, and particularly to a alignment synthesis system and an alignment synthesis method. Background Art

[0002] With the continuous progress of science and production technology, more energy-efficient and bendable OLED screens were introduced in previous years. Compared with OLED screens, LCD screens are too thick, have a lower contrast ratio, and a slow response speed; although OLED screens have many advantages, their lifespan is not long enough and the resolution is relatively low. Considering the advantages and disadvantages of the former two, the concepts of MicroLED and MiniLED were proposed in recent years. MiniLED is to miniaturize the direct-lit LED backlight module and make the panel color palette very good and the contrast ratio very high; however, this approach increases the usage of LEDs, the cost is very high, and it is not easy to promote and use on a large scale.

[0003] The difference between MicroLED and OLED is that it does not use organic substances for manufacturing, but a new material, gallium nitride. Therefore, it will not have the image burnin (commonly known as screen burn-in phenomenon) like OLED even after long-term use. Like OLED displays, MicroLED displays have perfect black, excellent color, and almost perfect viewing angles, and they are brighter, less prone to aging, and in the long run, cheaper than OLEDs. MicroLED TVs are also based on a modular system, allowing users to customize the screen size. Currently, compared with OLEDs, the production cost of MicroLED is still too high, and the existing mass transfer solutions lead to too high production costs. Summary of the Invention

[0004] To solve the above technical problems, embodiments of the present invention provide an alignment synthesis system and an alignment synthesis method.

[0005] In a first aspect, embodiments of the present invention provide an alignment synthesis system for synthesizing LED chip units using initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip; the alignment synthesis system includes a laser detection unit, a suction table, and a moving component, where,

[0006] The moving component is used to move the first chip unit RRR to the laser working module, and the suction table is used to adsorb the first chip unit RRR and move the fourth chip unit WWW to the lower part of the suction table, so that the first chip unit RRR and the fourth chip unit WWW are aligned and synthesized into a first intermediate chip unit RWW;

[0007] The moving component is also used to move the second chip unit GGG to the laser working module, and the adsorption table is used to adsorb the second chip unit GGG, so that the second chip unit GGG is aligned with the first intermediate chip unit RWW to synthesize a second intermediate unit RGW;

[0008] The moving component is also used to move the third chip unit BBB to the laser working module, and the adsorption table is used to adsorb the third chip unit BBB, so that the third chip unit BBB is aligned with the second intermediate unit RGW to synthesize an LED chip unit RGB.

[0009] According to a specific implementation manner of the present disclosure, the alignment synthesis system further includes a manipulator, a left pre-calibration module, a left pre-calibration stage, a right pre-calibration module, and a right pre-calibration stage.

[0010] According to a specific implementation manner of the present disclosure, the alignment synthesis system includes a first left stage, a second left stage, the left pre-calibration stage, the left pre-calibration module, the left loading and unloading module, and the left magazine switching module arranged on the left side along the operation flow direction, and a first right stage, a second right stage, the right pre-calibration stage, the right pre-calibration module, the right loading and unloading module, and the right magazine switching module arranged symmetrically on the right side along the operation flow direction. Among them, the first left stage and the first right stage are arranged at one end close to the laser working module, and the left magazine switching module and the right magazine switching module are arranged at one end far from the laser working module.

[0011] In a second aspect, an embodiment of the present invention provides an alignment synthesis method applied to the alignment synthesis system in any one of the first aspects; the method includes:

[0012] Prepare a preset number of initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip;

[0013] Repeat the step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence; where

[0014] The step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence includes:

[0015] The moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table;

[0016] Align and synthesize the fourth chip unit WWW into the first intermediate chip unit RWW;

[0017] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the second chip unit GGG is aligned and synthesized with the first intermediate chip unit RWW into the second intermediate unit RGW;

[0018] The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and the third chip unit BBB is aligned and synthesized with the second intermediate unit RGW into the chip unit RGB.

[0019] According to a specific implementation manner of the present disclosure, the alignment and synthesis system further includes a manipulator, a left pre-calibration module, a left pre-calibration stage, a right pre-calibration module, and a right pre-calibration stage;

[0020] Before the steps that the moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table, the method further includes:

[0021] The manipulator transports the first chip unit RRR to the right pre-calibration stage, and the right pre-calibration module performs pre-alignment on the first chip unit;

[0022] The manipulator transports the fourth crystal unit WWW to the left pre-calibration stage, and the left pre-calibration module of the left pre-calibration stage performs pre-alignment on the fourth chip unit.

[0023] According to a specific implementation manner of the present disclosure, the alignment and synthesis system includes the left loading and unloading module and the left cassette switching module arranged on the left side along the operation flow direction, and the right loading and unloading module and the right cassette switching module arranged symmetrically on the right side along the operation flow direction, wherein the left cassette switching module and the right cassette switching module are arranged at one end far from the laser working module;

[0024] The step of preparing a preset number of initial chip units includes:

[0025] Place the right cassette filled with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB on the right cassette switching module, and place the left cassette filled with the fourth chip unit WWW on the left cassette switching module;

[0026] The right loading and unloading module takes out the first chip unit RRR from the right cassette of the right cassette switching module, and jumps to execute the step of the manipulator transporting the first chip unit RRR to the right pre-loading stage;

[0027] The left loading and unloading module takes out the fourth chip unit WWW from the left cassette of the left cassette switching module, and jumps to execute the step of the manipulator transporting the fourth chip unit WWW to the left pre-loading stage.

[0028] According to a specific embodiment of the present disclosure, the alignment and synthesis system includes a first left stage and a second left stage arranged on the left side along the operation flow direction, the left pre-loading stage and the left pre-alignment module, and a right pre-loading stage including a first right stage and a second right stage arranged symmetrically on the right side along the operation flow direction. Among them, the first left stage and the first right stage are arranged at one end close to the laser working module;

[0029] The steps of the moving component moving the first chip unit RRR to the laser working module and the adsorption stage adsorbing the first chip unit RRR include:

[0030] The manipulator transports the first chip unit RRR to the first right stage according to the pre-alignment information collected by the pre-alignment module;

[0031] The first right stage moves to the laser working module under the drive of the X / Y axis, the adsorption stage of the laser working module adsorbs the first chip unit RRR, and the first right stage moves away from the laser working module;

[0032] The steps of the moving component moving the fourth chip unit WWW to the lower part of the adsorption stage include:

[0033] The second right stage moves the fourth chip unit WWW to the lower part of the laser working module.

[0034] In a third aspect, an embodiment of the present invention provides an alignment and synthesis method, which is applied to the alignment and synthesis system described in any one of the first aspects; the method includes:

[0035] Prepare a preset number of initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip;

[0036] Repeat the step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence; wherein,

[0037] The step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence includes:

[0038] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table;

[0039] Align and synthesize the fourth chip unit WWW into the first intermediate chip unit GWW;

[0040] The moving component moves the second chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the second chip unit RRR aligns and synthesizes the second intermediate unit GRW with the first intermediate chip unit GWW;

[0041] The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and the third chip unit BBB aligns and synthesizes the chip unit GRB with the second intermediate unit GRW.

[0042] Fourthly, an embodiment of the present invention provides an alignment and synthesis method, which is applied to the alignment and synthesis system described in any one of the first aspects; the method includes:

[0043] Prepare a preset number of initial chip units, wherein the initial chip units include a first chip unit BBB, a second chip unit GGG, a third chip unit RRR, and a fourth chip unit WWW, and W is a blank chip;

[0044] Repeat the step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence; wherein,

[0045] The step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence includes:

[0046] The moving component moves the first chip unit BBB to the laser working module, the adsorption table adsorbs the first chip unit BBB, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table;

[0047] Align and synthesize the fourth chip unit WWW into the first intermediate chip unit BWW;

[0048] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the second chip unit GGG is aligned and synthesized with the first intermediate chip unit RWW into the second intermediate unit BGW;

[0049] The moving component moves the third chip unit RRR to the laser working module, the adsorption table adsorbs the third chip unit RRR, and the third chip unit RRR is aligned and synthesized with the second intermediate unit BGW into the chip unit BGR.

[0050] In a fifth aspect, an embodiment of the present invention provides an alignment and synthesis method, which is applied to the alignment and synthesis system described in any one of the first aspects; the method includes:

[0051] Prepare a preset number of initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip;

[0052] The moving component moves the first chip unit RRR to the laser working module, and the adsorption table adsorbs the first chip unit RRR;

[0053] The first chip unit RRR is aligned and synthesized with the fourth chip unit WWW that is sequentially moved to the lower part of the adsorption table into the first intermediate chip unit RWW;

[0054] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the first intermediate chip unit RWW is aligned and synthesized with the second chip unit GGG that is sequentially moved under the laser working module into the second intermediate unit RGW;

[0055] The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and the third chip unit BBB is aligned and synthesized with the second intermediate unit RGW that is sequentially moved under the laser working module into the chip unit RGB.

[0056] The above-mentioned alignment synthesis system and alignment synthesis method provided by the present application. The alignment synthesis system includes a laser detection unit, a suction table, and a moving component. The moving component is used to move the first chip unit RRR to the laser working module. The suction table is used to adsorb the first chip unit RRR and move the fourth chip unit WWW to the lower part of the suction table, so that the first chip unit RRR and the fourth chip unit WWW are aligned and synthesized into a first intermediate chip unit RWW. The moving component is further used to move the second chip unit GGG to the laser working module. The suction table is used to adsorb the second chip unit GGG, so that the second chip unit GGG and the first intermediate chip unit RWW are aligned and synthesized into a second intermediate unit RGW. The moving component is further used to move the third chip unit BBB to the laser working module. The suction table is used to adsorb the third chip unit BBB, so that the third chip unit BBB and the second intermediate unit RGW are aligned and synthesized into an LED chip unit RGB. The alignment accuracy and full automation degree of the massive transfer synthesis process of the LED chip unit in the Micro LED processing technology are realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as limiting the protection scope of the present invention. In each drawing, similar components are numbered similarly.

[0058] Figure 1 FIG. shows a schematic structural diagram of the alignment synthesis system provided by the embodiment of the present application;

[0059] Figure 2 FIG. shows a comparison diagram of the chip units involved in the alignment synthesis system provided by the embodiment of the present application;

[0060] Figure 3 FIG. shows a schematic diagram of the chip unit alignment replacement process involved in the alignment synthesis system provided by the embodiment of the present application.

[0061] Summary of reference numerals in the drawings:

[0062] Laser working module 1;

[0063] First right carrier 2, first left carrier 3, second right carrier 4, second left carrier 5; right pre-alignment carrier 6, left pre-alignment carrier 7, right pre-alignment module 8, left pre-alignment module 9;

[0064] Right loading and unloading module 10, left loading and unloading module 11, right cassette switching module 12, left cassette switching module 13;

[0065] Robot 14. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0067] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0068] Hereinafter, the terms "including", "having" and their cognates, which may be used in various embodiments of the present invention, are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or adding the possibility of one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0069] Furthermore, the terms “first”, “second”, “third”, etc. are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0070] Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as those generally understood by those skilled in the art to which the various embodiments of the present invention belong. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meanings as the contextual meanings in the relevant technical field and will not be interpreted as having idealized meanings or overly formal meanings unless clearly defined in the various embodiments of the present invention.

[0071] Example 1

[0072] See also Figure 1 , is a schematic diagram of the structure of a counter-position synthesis system provided by an embodiment of the present invention. Figure 1 As shown, the alignment synthesis system is used to synthesize LED wafer units using initial wafer units. Figure 2 and Figure 3As shown, the initial chip unit Carrier1 includes a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW of Carrier2, where W is a blank chip; the alignment synthesis system includes a laser detection unit, an adsorption table, and a moving component.

[0073] The moving component is used to move the first chip unit RRR to the laser working module 1, and the adsorption table is used to adsorb the first chip unit RRR and move the fourth chip unit WWW to the lower part of the adsorption table, so that the first chip unit RRR and the fourth chip unit WWW are aligned and synthesized into a first intermediate chip unit RWW;

[0074] The moving component is further used to move the second chip unit GGG to the laser working module 1, and the adsorption table is used to adsorb the second chip unit GGG, so that the second chip unit GGG and the first intermediate chip unit RWW are aligned and synthesized into a second intermediate unit RGW;

[0075] The moving component is further used to move the third chip unit BBB to the laser working module 1, and the adsorption table is used to adsorb the third chip unit BBB, so that the third chip unit BBB and the second intermediate unit RGW are aligned and synthesized into an LED chip unit RGB.

[0076] According to a specific embodiment of the present disclosure, the alignment synthesis system further includes a manipulator 14, a left pre-calibration module 9, a left pre-calibration stage 7, a right pre-calibration module 8, and a right pre-calibration stage 6.

[0077] According to a specific embodiment of the present disclosure, the alignment synthesis system includes a first left stage 3, a second left stage 5, the left pre-calibration stage 7, the left pre-calibration module 9, the left loading and unloading module 11, and the left magazine switching module 13 arranged on the left side along the operation flow direction, and a first right stage 2, a second right stage 4, the right pre-calibration stage 6, the right pre-calibration module 8, the right loading and unloading module 10, and the right magazine switching module 12 arranged symmetrically on the right side along the operation flow direction. Among them, the first left stage 3 and the first right stage 2 are arranged at one end close to the laser working module 1, and the left magazine switching module 13 and the right magazine switching module 12 are arranged at one end far from the laser working module 1.

[0078] Specifically, among the above components, the laser working module 1 is lifted and lowered by a galvanometer under the drive of a motor lead screw module. The pre-calibration stage is a fixed stage with a backlight. When there is a chip on the stage, the backlight is turned on to cooperate with the camera on the pre-calibration module to capture the MARK points on the chip and determine the position status coordinates of the chip. The pre-calibration module is a motor lead screw module that drives the pre-calibration camera to move back and forth. When there is a chip that needs to be pre-calibrated, the module moves the camera directly above the pre-calibration stage to pre-align and position the chip. After completion, it returns to the initial position to avoid interference. The loading and unloading module is a motor lead screw module with an arm with adsorption holes fixed on the slider. The module controls the arm to extend into and out of the lower part of the product in the cassette. Then, the cassette switching module descends to transfer the chip to the arm for adsorption and then takes out the chip. The cassette switching module is a module with lifting and left-right movement functions. The lifting is a motor lead screw module, and the left-right switching is a rack and pinion device. The position where the arm of the loading and unloading module picks up the material can be selected by controlling the lifting and left-right switching of the cassette. It should be noted that the above-mentioned motor lead screw modules and rack and pinion devices can be replaced by devices such as synchronous belts, chains, linear motors, and cylinders with corresponding functions, and should not be construed as a limitation on the possible real-time structures. Figure 2 In it, Carrier1 is fixed on the adsorption stage at the top of the upper alignment device, and Carrier2 is on the stage of the six-axis motion platform.

[0079] The alignment and synthesis system provided in this embodiment solves the problem of transferring gallium nitride inorganic light-emitting units from Carrier 1 to Carrier 2 during the "mass transfer" process of MicroLED. A chip manufacturing method disclosed by the present invention improves production efficiency by optimizing the chip manufacturing sequence. It optimizes the alignment accuracy and full automation degree of the mass transfer and synthesis process of LED chip units in the Micro LED processing technology.

[0080] Next, the specific processes of multiple alignment and synthesis methods that can be implemented by the above alignment and synthesis system will be explained respectively using Embodiments 2-5.

[0081] Embodiment 2

[0082] An embodiment of the present invention provides an alignment and synthesis method applied to Figure 1 the alignment and synthesis system described above; the method includes:

[0083] Prepare a preset number of initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip;

[0084] Repeat the step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence; where

[0085] The step of using each fourth chip unit WWW to synthesize an LED chip unit RGB by aligning and combining with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence includes:

[0086] The moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table;

[0087] Align and synthesize the fourth chip unit WWW into the first intermediate chip unit RWW;

[0088] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the second chip unit GGG is aligned and combined with the first intermediate chip unit RWW to form the second intermediate unit RGW;

[0089] The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and the third chip unit BBB is aligned and combined with the second intermediate unit RGW to form the chip unit RGB.

[0090] According to a specific embodiment of the present disclosure, the alignment and synthesis system further includes a manipulator, a left pre-alignment module, a left pre-alignment stage, a right pre-alignment module 8, and a right pre-alignment stage;

[0091] Before the step that the moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table, the method further includes:

[0092] The manipulator transports the first chip unit RRR to the right pre-alignment stage, and the right pre-alignment module 8 performs pre-alignment on the first chip unit;

[0093] The manipulator transports the fourth crystal unit WWW to the left pre-alignment stage, and the left pre-alignment module of the left pre-alignment stage performs pre-alignment on the fourth chip unit.

[0094] According to a specific embodiment of the present disclosure, the alignment and synthesis system includes the left loading and unloading module and the left magazine switching module arranged on the left side along the operation flow direction, and the right loading and unloading module and the right magazine switching module arranged symmetrically on the right side along the operation flow direction, wherein the left magazine switching module and the right magazine switching module are arranged at one end far from the laser working module;

[0095] The step of preparing a preset number of initial chip units includes:

[0096] Place the right cartridge filled with the first chip unit RRR, the second chip unit GGG, and the third chip BBB on the right cartridge switching module, and place the left cartridge filled with the fourth chip unit WWW on the left cartridge switching module;

[0097] The right loading and unloading module takes out the first chip unit RRR from the right cartridge of the right cartridge switching module, and jumps to execute the step of the manipulator transporting the first chip unit RRR to the right pre-loading stage;

[0098] The left loading and unloading module takes out the fourth chip unit WWW from the left cartridge of the left cartridge switching module, and jumps to execute the step of the manipulator transporting the fourth chip unit WWW to the left pre-loading stage.

[0099] According to a specific embodiment of the present disclosure, the alignment and synthesis system includes a first left stage and a second left stage arranged on the left side along the operation flow direction, the left pre-loading stage, the left pre-alignment module, and a right pre-loading stage including a first right stage and a second right stage symmetrically arranged on the right side along the operation flow direction. Among them, the first left stage and the first right stage are arranged at one end close to the laser working module;

[0100] The steps of the moving component moving the first chip unit RRR to the laser working module and the adsorption stage adsorbing the first chip unit RRR include:

[0101] The manipulator transports the first chip unit RRR to the first right stage according to the pre-alignment information collected by the pre-alignment module;

[0102] The first right stage moves to the laser working module under the drive of the X / Y axis, the adsorption stage of the laser working module adsorbs the first chip unit RRR, and the first right stage moves away from the laser working module;

[0103] The steps of the moving component moving the fourth chip unit WWW to below the adsorption stage include:

[0104] The second right stage moves the fourth chip unit WWW to below the laser working module.

[0105] Next, the full process of the alignment and synthesis method will be explained with a specific example.

[0106] The cassettes filled with the initial chip units Carrier 1's first chip unit RRR, second chip unit GGG, third chip unit BBB and Carrier 2's fourth chip unit WWW are respectively fixed to the right cassette switching module 12 and the left cassette switching module 13.

[0107] As Figure 3 shown, the upper right loading module 10 takes out Carrier 1 (RRR①) from the cassette of the right cassette switching module 12, and the manipulator 14 transports Carrier 1 (RRR①) to the right pre-loading stage 6, and the right pre-alignment module 8 pre-aligns Carrier 1 (RRR①).

[0108] At the same time, the left loading and unloading module 11 takes out Carrier 2 (WWW①) from the cassette of the left cassette switching module 13, and the manipulator 14 transports Carrier 2 (WWW①) to the left pre-loading stage 7, and the left pre-alignment module 9 pre-aligns Carrier 2 (WWW①).

[0109] After Carrier 1 (RRR①) completes pre-alignment, the manipulator 14 transports Carrier 1 (RRR①) to the right carrier stage 2 of Carrier 1 according to the position information of the pre-alignment, and the carrier stage docks and adsorbs it. At the same time, Carrier 2 (WWW①) on the left pre-loading stage 7 completes pre-alignment, and the manipulator 14 transports it to the right carrier stage 4 of Carrier 2.

[0110] The left loading and unloading module 11 takes out Carrier 2 (WWW②) from the cassette of the left cassette switching module 13, and the manipulator 14 transports it to the left pre-loading stage 7 for pre-alignment. After completing pre-alignment, the manipulator 14 transports Carrier 2 (WWW②) to the left carrier stage 5 of Carrier 2. The left loading and unloading module 11 continues to take out Carrier 2 (WWW③) from the cassette of the left cassette switching module 13, and the manipulator 14 transports it to the left pre-loading stage 7 for pre-alignment.

[0111] After the pre-alignment of the right cassette Carrier 1 is completed, it is transported to the right carrier stage 2 for adsorption, and several Carrier 2s are transported out at intervals on the left (respectively located on the right carrier stage 4, left carrier stage 5 and left carrier stage 7)

[0112] Meanwhile, the right carrier stage 2 of Carrier 1 carrying Carrier 1 (RRR①) moves under the drive of the X / Y axis to under the laser working module 1. The right carrier stage 2 of Carrier 1 raises Carrier 1 (RRR①) to closely contact the adsorption stage of the laser working module 1, and then the adsorption stage adsorbs Carrier 1 (RRR①), and the right carrier stage 2 of Carrier 1 enters the avoidance area.

[0113] The right carrier 4 of Carrier 2 moves Carrier 2 (WWW①) under the laser working module 1, aligns with Carrier 1 (RRR①), and the first laser processing starts. At the same time, the upper right loading module 10 takes out Carrier 1 (RRR②) from the cassette of the right cassette switching module 12. The manipulator 14 transports Carrier 1 (RRR②) to the right pre-alignment carrier 6. The right pre-alignment module 8 pre-aligns Carrier 1 (RRR②). After the pre-alignment is completed, the manipulator 14 transports Carrier 1 (RRR②) to the left carrier 3 of Carrier1. The carrier positions and adsorbs Carrier 1 (RRR②).

[0114] After the first laser processing is completed, the state of Carrier 1 (RRR①) on the adsorption table of the laser working module 1 becomes Carrier 1 (RR_①). The right carrier 4 of Carrier 2 moves Carrier 2 (RWW①) to the unloading position. The left carrier 5 of Carrier 2 moves Carrier 2 (WWW②) to the working position, and the second laser processing starts. The manipulator 14 transports Carrier 2 (RWW①) to the left loading and unloading module 11. The left loading and unloading module 11 sends Carrier 2 (RWW①) into the empty position of the cassette, then takes out Carrier 2 (WWW④). At the same time, the manipulator 14 transports Carrier 2 (WWW③) on the left pre-alignment carrier 7 to the right carrier 4 of Carrier 2, and then transports Carrier 2 (WWW④) on the left loading and unloading module 11 to the left pre-alignment carrier 7. After the second laser processing is completed, the state of Carrier 2 (WWW②) becomes Carrier 2 (RWW②), the state of Carrier 1 (RR_①) on the adsorption table of the laser working module 1 becomes Carrier 1 (R_._①), the left carrier 5 of Carrier 2 moves Carrier 2 (RWW②) to the unloading position, and the right carrier 4 of Carrier 2 moves Carrier 2 (WWW③) to the working position, and the third laser processing starts.

[0115] The manipulator 14 transports the Carrier 2 (RWW②) to the left loading and unloading module 11. The left loading and unloading module 11 sends the Carrier 2 (RWW②) into the empty position of the magazine, and then takes out the Carrier 2 (WWW⑤). At the same time, the manipulator 14 transports the Carrier 2 (WWW④) on the left pre-calibration stage 7 to the left Carrier 2 stage 5, and then transports the Carrier 2 (WWW⑤) on the left loading and unloading module 11 to the left pre-calibration stage 7. After three laser processing operations are completed, the state of the Carrier 2 (WWW③) changes to Carrier 2 (RWW③), and the state of the Carrier 1 (R_._①) on the adsorption stage of the laser working module 1 changes to Carrier 1 (_._._①). The right Carrier 2 stage 4 carrying the Carrier 2 (RWW③) moves to the unloading position. The manipulator 14 transports the Carrier 2 (RWW③) to the left loading and unloading module 11. The left loading and unloading module 11 sends the Carrier 2 (RWW③) into the empty position of the magazine, and then takes out the Carrier 2 (WWW⑥). At the same time, the right Carrier 1 stage 2 takes away the Carrier 1 (_._._①) on the adsorption stage of the laser working module 1 and moves to the unloading position. The left Carrier 1 stage 3 carrying the Carrier 1 (RRR②) moves under the laser working module 1. After alignment, the Carrier 1 (RRR②) is adsorbed on the adsorption stage of the laser working module 1. Then, the Carrier 2 (WWW④), Carrier 2 (WWW⑤), Carrier 2 (WWW⑥), and all subsequent Carrier 2 (WWW) repeat the actions of Carrier 2 (WWW①), Carrier 2 (WWW②), Carrier 2 (WWW③); the Carrier 1 (RRR②) and all subsequent Carrier 1 (RRR) repeat the actions of Carrier 1 (RRR①) until the states of all Carrier 2 (WWW) change to Carrier 2 (RWW).

[0116] The above steps complete the transfer of red grains R. The transfer of green grains G and blue grains B is consistent with the red grain transfer step. Repeat the above steps to complete the transfer of green and blue grains, transfer the grains on Carrier 1 (GGG) to Carrier 2 (RWW), change the state of Carrier 2 (RWW) to Carrier 2 (RGW), and then transfer the grains on Carrier 1 (BBB) ​​to Carrier 2 (RGW), change the state of Carrier 2 (RGW) to Carrier 2 (RGB), until all Carrier 2 (WWW) wafers in the material box are processed. Take away the material boxes filled with Carrier 1 (_._._, _._._, _._._) and Carrier 2 (RGB, RGB, RGB) on the right material box switching module 12 and the left material box switching module 13.

[0117] In summary, the main synthesis process of the alignment synthesis system provided in this embodiment is: provide a blank wafer WWW to receive the R, G, and B grains that are removed by the laser from the first wafer RRR, the second wafer GGG, and the third wafer BBB. For example, simplify WWW into a 9 by 9 square, that is, the horizontal and vertical coordinates are both 1-9, and according to the color formation principle of the display screen, WWW, R, G, and B grains are arranged alternately. After the alignment is completed, rows 1, 4, and 7 of WWW receive the R grains from the second wafer RRR, and rows 2, 5, and 8 of WWW receive the G grains from the second wafer GGG, and finally rows 3, 6, and 9 of WWW receive the B grains from the second wafer BBB. In this way, WWW can be transformed from a blank wafer into a Carrier 2 with alternating R, G, and B grains.

[0118] The alignment synthesis method provided in this embodiment first replaces one grain in all fourth wafer units with a red grain R, and then replaces the green grain G and the blue grain B in sequence, thereby realizing a fully automatic cyclic alignment synthesis scheme and optimizing the processing flow of mass transfer.

[0119] Example 3

[0120] The embodiment of the present invention provides a method for synthesizing the Figure 1 The method of the said counter-position synthesis system comprises:

[0121] Prepare a preset number of initial wafer units, wherein the initial wafer units include a first wafer unit RRR, a second wafer unit GGG, a third wafer unit BBB and a fourth wafer unit WWW, where W is a blank wafer;

[0122] Repeat the step of using each fourth chip unit WWW to synthesize an LED chip unit RGB by aligning and combining with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence; wherein,

[0123] The step of using each fourth chip unit WWW to synthesize an LED chip unit RGB by aligning and combining with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence includes:

[0124] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table;

[0125] Align and combine the fourth chip unit WWW to synthesize a first intermediate chip unit GWW;

[0126] The moving component moves the second chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the second chip unit RRR aligns and combines with the first intermediate chip unit GWW to synthesize a second intermediate unit GRW;

[0127] The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and the third chip unit BBB aligns and combines with the second intermediate unit GRW to synthesize a chip unit GRB.

[0128] The difference between the alignment and combination method provided in this embodiment and the alignment and combination method of the above embodiment is that, first, one grain in all the fourth chip units is replaced with a green grain G, and then the red grain R and the blue grain B are replaced in sequence, realizing a fully automatic cyclic alignment and combination scheme and optimizing the processing flow of mass transfer.

[0129] Embodiment 4

[0130] The embodiment of the present invention provides an alignment and combination method applied to Figure 1 the alignment and combination system described above; the method includes:

[0131] Prepare a preset number of initial chip units, wherein the initial chip units include a first chip unit BBB, a second chip unit GGG, a third chip unit RRR, and a fourth chip unit WWW, and W is a blank chip;

[0132] Repeat the step of using each fourth chip unit WWW to synthesize an LED chip unit RGB by aligning and combining with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence; wherein,

[0133] The step of using each fourth chip unit WWW to synthesize an LED chip unit RGB by aligning and combining with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence includes:

[0134] The moving component moves the first chip unit BBB to the laser working module, the adsorption table adsorbs the first chip unit BBB, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table;

[0135] Align and synthesize the fourth chip unit WWW to form a first intermediate chip unit BWW;

[0136] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the second chip unit GGG is aligned and combined with the first intermediate chip unit RWW to form a second intermediate unit BGW;

[0137] The moving component moves the third chip unit RRR to the laser working module, the adsorption table adsorbs the third chip unit RRR, and the third chip unit RRR is aligned and combined with the second intermediate unit BGW to form a chip unit BGR.

[0138] The difference between the alignment and synthesis method provided in this embodiment and the alignment and synthesis method in the above embodiment is that, first, one grain in all the fourth chip units is replaced with a blue grain B, and then the green grain G and the red grain R are replaced in sequence, realizing a fully automatic cyclic alignment and synthesis scheme, and optimizing the processing flow of mass transfer.

[0139] Embodiment 5

[0140] The embodiment of the present invention provides an alignment and synthesis method, which is applied to Figure 1 the described alignment and synthesis system; the method includes:

[0141] Prepare a preset number of initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip;

[0142] The moving component moves the first chip unit RRR to the laser working module, and the adsorption table adsorbs the first chip unit RRR;

[0143] The first chip unit RRR is aligned and combined with the fourth chip unit WWW that is sequentially moved to the lower part of the adsorption table to form a first intermediate chip unit RWW;

[0144] The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the first intermediate chip unit RWW is aligned and synthesized with the second chip unit GGG that is successively moved under the laser working module to form a second intermediate unit RGW;

[0145] The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and the third chip unit BBB that is successively moved under the laser working module with the second intermediate unit RGW is aligned and synthesized to form a chip unit RGB.

[0146] The difference between the alignment and synthesis method provided in this embodiment and the alignment and synthesis method of the above embodiment is that three grains in all the fourth chip units are first replaced with green grains G, red grains R, and blue grains B, and then the full-grain replacement is realized for the next fourth chip unit, realizing a fully automatic cyclic alignment and synthesis scheme and optimizing the processing flow of mass transfer.

[0147] The difference steps between this embodiment and the foregoing embodiment will be described in detail below.

[0148] The right carrier stage 4 of Carrier 2 moves Carrier 2 (WWW①) under the laser working module 1, aligns with Carrier 1 (RRR①), and the first laser processing begins. At the same time, the upper right loading module 10 takes out Carrier 1 (GGG①) from the cassette of the cassette switching module 12 on the right. The manipulator 14 transports Carrier 1 (GGG①) to the right pre-alignment carrier stage 6, and 8 pre-aligns Carrier 1 (GGG①). After the pre-alignment is completed, the manipulator 14 transports Carrier 1 (GGG①) to the left carrier stage 3 of Carrier 1, and the carrier stage positions and adsorbs Carrier 1 (GGG①). After the first laser processing is completed, the state of Carrier 1 (RRR①) on the adsorption stage of the laser working module 1 becomes Carrier 1 (RR_①). The right carrier stage 4 of Carrier 2 moves Carrier 2 (RWW①) to the unloading position, and the left carrier stage 5 of Carrier 2 moves Carrier 2 (WWW②) to the working position. The second laser processing begins. The manipulator 14 transports Carrier 2 (RWW①) to the right pre-alignment carrier stage 6, and then the manipulator 14 transports Carrier 2 (WWW③) on the left pre-alignment carrier stage 7 to the right carrier stage 4 of Carrier 2. After the second laser processing is completed, the state of Carrier 2 (WWW②) becomes Carrier 2 (RWW②), and the state of Carrier 1 (RR_①) on the adsorption stage of the laser working module 1 becomes Carrier 1 (R_._①). The left carrier stage 5 of Carrier 2 moves Carrier 2 (RWW②) to the avoidance area, and the right carrier stage 4 of Carrier 2 moves Carrier 2 (WWW③) to the working position. The third laser processing begins. After the third laser processing is completed, the state of Carrier 2 (WWW③) becomes Carrier 2 (RWW③), and the state of Carrier 1 (R_._①) on the adsorption stage of the laser working module 1 becomes Carrier 1 (_._._①). The right carrier stage 4 of Carrier 2 moves Carrier 2 (RWW③) to the avoidance area. At the same time, the right carrier stage 2 of Carrier 1 takes away Carrier 1 (_._._①) on the adsorption stage of the laser working module 1, moves to the unloading position, and the manipulator 14 transports Carrier 1 (_._._①) to the upper and lower right loading module 10. Then the upper and lower right loading module 10 sends Carrier 1 (_._._①) into the empty space of the cassette in the cassette switching module 12 on the right; the left carrier stage 3 of Carrier 1 moves Carrier 1 (GGG①) under the laser working module 1, and after alignment, Carrier 1 (GGG①) is adsorbed on the adsorption stage of the laser working module 1.After that, the left stage 5 of Carrier 2 carries Carrier 2 (RWW②) and moves to the processing position, and the four - time laser processing starts. When the four - time laser processing is about to be completed, the status of Carrier 1 (GGG①) changes to Carrier 1 (GG_①), and the status of Carrier 2 (RWW②) changes to Carrier 2 (RGW②); the left stage 5 of Carrier 2 carries Carrier 2 (RGW②) and moves to the unloading area, and the right stage 4 of Carrier 2 carries Carrier 2 (RWW③) and moves to the processing area, and the five - time laser processing starts. At the same time, the manipulator 14 transports Carrier 2 (RGW②) to the left pre - calibration stage 7, and transports Carrier 2 (RWW①) from the right pre - calibration stage 6 to the left stage 5 of Carrier 2; when the five - time laser processing is completed, the status of Carrier 1 (GG_①) changes to Carrier 1 (G_._①), the status of Carrier 2 (RWW③) changes to Carrier 2 (RGW③), the right stage 4 of Carrier 2 carries Carrier 2 (RGW③) and moves to the avoidance area, and the left stage 5 of Carrier 2 carries Carrier 2 (RWW①) and moves to the processing area, and the six - time laser processing starts. At the same time, the right loading and unloading module 10 takes out Carrier 1 (BBB①) from the right cassette switching module 12, and the manipulator 14 transports Carrier 1 (BBB①) to the right pre - calibration stage 6 for pre - calibration. After the pre - calibration is completed, the manipulator 14 transports Carrier 1 (BBB①) to the right stage 2 of Carrier 1. When the six - time laser processing is completed, the status of Carrier 1 (G_._①) changes to Carrier 1 (_._._①), the status of Carrier 2 (RWW①) changes to Carrier 2 (RGW①), and the left stage 5 of Carrier 2 carries Carrier 2 (RGW①) and moves to the avoidance area. The left stage 3 of Carrier 1 moves under the laser processing unit 1, picks up Carrier 1 (_._._①) on its adsorption stage, and the left stage 3 of Carrier 1 carries Carrier 1 (_._._①) and moves to the unloading position. Then the right stage 2 of Carrier 1 carries Carrier 1 (BBB①) and moves under the laser processing unit 1. After alignment, Carrier 1 (BBB①) is adsorbed on the adsorption stage of the laser working module 1, and the right stage 4 of Carrier 2 carries Carrier 2 (RGW③) and moves to the processing area, and the seven - time laser processing starts.Meanwhile, the robot 14 transports Carrier 1 (___①) to the right loading and unloading module 10. The right loading and unloading module 10 sends Carrier 1 (___①) into the empty space of the cassette in the right cassette switching module 12 and takes out Carrier 1 (RRR②) from it. Then, the robot 14 transports Carrier 1 (BBB①) to the right pre-calibration stage 6. After seven laser processing operations are completed, the status of Carrier 1 (BBB①) changes to Carrier 1 (BB_①), and the status of Carrier 2 (RGW③) changes to Carrier 2 (RGB③). The right stage 4 of Carrier 2 carries Carrier 2 (RGB③) and moves to the unloading area. At the same time, the left stage 5 of Carrier 2 carries Carrier 2 (RGW①) and moves to the processing area, and the eighth laser processing operation starts. The robot 14 transports Carrier 2 (RGB③) to the left loading and unloading module 11. The left loading and unloading module 11 sends Carrier 2 (RGB③) into the empty space of the cassette in the left cassette switching module 13 and then takes out Carrier 2 (WWW④) from the cassette in the left cassette switching module 13. At the same time, the robot 14 transfers Carrier 2 (RGW②) on the left pre-calibration stage 7 to the right stage 4 of Carrier 2. Then, the robot 14 transfers Carrier 2 (WWW④) to the left pre-calibration stage 7. After the eighth laser processing operation is completed, the status of Carrier 1 (BB_①) changes to Carrier 1 (B_._①), and the status of Carrier 2 (RGW①) changes to Carrier 2 (RGB①). The left stage 5 of Carrier 2 carries Carrier 2 (RGB①) and moves to the unloading area. At the same time, the right stage 4 of Carrier 2 carries Carrier 2 (RGW②) and moves to the processing area, and the ninth laser processing operation starts. Meanwhile, the left loading and unloading module 11 takes out Carrier 2 (WWW⑤) from the cassette in the left cassette switching module 13. The robot 14 transfers Carrier 2 (WWW⑤) to the left pre-calibration stage 7. The robot 14 transports Carrier 1 (RRR②) to the left stage 5 of Carrier 2.After nine laser processing operations are completed, the status of Carrier 1 (B_._①) changes to Carrier 1 (_._._①), and the status of Carrier 2 (RGW②) changes to Carrier 2 (RGB②). The right carrier table 4 of Carrier 2 moves Carrier 2 (RGB②) to the unloading area. The manipulator 14 transports Carrier 2 (RGB②) to the left loading and unloading module 11. The left loading and unloading module 11 sends Carrier 2 (RGB②) into the hole position of the cassette in the left cassette switching module 13 and takes out Carrier 2 (WWW⑥). At the same time, the right loading and unloading module 10 takes out Carrier 1 (GGG②) from the cassette in the right cassette switching module 12. Then the manipulator 14 transports Carrier 1 (GGG②) to the right pre-calibration carrier table 6. At the same time, the right carrier table 2 of Carrier 1 moves under the laser processing unit 1, takes down Carrier 1 (_._._①), and then the right carrier table 2 of Carrier 1 moves Carrier 1 (_._._①) to the unloading position. After that, the manipulator 14 transports Carrier 1 (_._._①) to the right loading and unloading module 10. The right loading and unloading module 10 sends Carrier 1 (_._._①) into the hole position of the cassette in the right cassette switching module 12. At the same time, the manipulator 14 transports Carrier 1 (GGG②) on the right pre-calibration carrier table 6 to the right carrier table 2 of Carrier 1. Then the manipulator 14 transfers Carrier 2 (WWW⑥) to the left pre-calibration carrier table 7.

[0149] Carrier 1 (RRR②), Carrier 1 (GGG②), Carrier 1 (BBB②) and Carrier 2 (WWW④), Carrier 2 (WWW⑤), Carrier 2 (WWW⑥) repeat step two until all the wafers in the cassette are processed. Then an operator removes the cassettes filled with Carrier 1 (_._._, _._._, _._._) and Carrier 2 (RGB, RGB, RGB) on the right cassette switching module 12 and the left cassette switching module 13.

[0150] In summary, for the alignment synthesis system and the alignment synthesis method provided in the present application, the alignment synthesis system includes a laser detection unit, an adsorption stage, and a moving component. The moving component is configured to move the first chip unit RRR to the laser working module. The adsorption stage is configured to adsorb the first chip unit RRR and move the fourth chip unit WWW to the lower part of the adsorption stage, so that the first chip unit RRR and the fourth chip unit WWW are aligned and synthesized into a first intermediate chip unit RWW. The moving component is further configured to move the second chip unit GGG to the laser working module. The adsorption stage is configured to adsorb the second chip unit GGG, so that the second chip unit GGG and the first intermediate chip unit RWW are aligned and synthesized into a second intermediate unit RGW. The moving component is further configured to move the third chip unit BBB to the laser working module. The adsorption stage is configured to adsorb the third chip unit BBB, so that the third chip unit BBB and the second intermediate unit RGW are aligned and synthesized into an LED chip unit RGB. The alignment accuracy and full automation degree of the massive transfer and synthesis process of the LED chip unit in the MicroLED processing technology are achieved.

[0151] In several embodiments provided by the present application, it should be understood that the disclosed devices and methods can also be implemented in other ways. The device embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the drawings show the possible architectures, functions, and operations of devices, methods, and computer program products according to multiple embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in an alternative implementation, the functions marked in the blocks may occur in a different order than marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram and / or flowchart, and the combination of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0152] In addition, each functional module or unit in various embodiments of the present invention may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.

[0153] As described above, it is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention.

Claims

1. A para-synthesis system, characterized in that, For synthesizing LED chip units by using initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip; the alignment synthesis system includes a laser working module, a suction table, and a moving component; wherein, The moving component is used to move the first chip unit RRR to the laser working module, the suction table is used to adsorb the first chip unit RRR, and move the fourth chip unit WWW to the lower part of the suction table, so that the first chip unit RRR and the fourth chip unit WWW are aligned and synthesized into a first intermediate chip unit RWW; The moving component is further used to move the second chip unit GGG to the laser working module, and the suction table is used to adsorb the second chip unit GGG, so that the second chip unit GGG and the first intermediate chip unit RWW are aligned and synthesized into a second intermediate unit RGW; The moving component is further used to move the third chip unit BBB to the laser working module, and the suction table is used to adsorb the third chip unit BBB, so that the third chip unit BBB and the second intermediate unit RGW are aligned and synthesized into an LED chip unit RGB; The alignment synthesis system further includes a manipulator, a first left carrier, a second left carrier, a left pre-calibration carrier, a left pre-calibration module, a left loading and unloading module, and a left cassette switching module arranged on the left along the operation flow direction, and a first right carrier, a second right carrier, a right pre-calibration carrier, a right pre-calibration module, a right loading and unloading module, and a right cassette switching module arranged symmetrically on the right along the operation flow direction. Among them, the first left carrier and the first right carrier are arranged at one end close to the laser working module, and the left cassette switching module and the right cassette switching module are arranged at one end far from the laser working module; Wherein, the left pre-calibration carrier and the right pre-calibration carrier are used to carry chips; the left pre-calibration module and the right pre-calibration module are used to respectively perform pre-alignment on the chips on the left pre-calibration carrier and the right pre-calibration carrier; the left loading and unloading module and the right loading and unloading module are used to respectively take out the chips in the left cassette switching module and the right cassette switching module, and the left cassette switching module and the right cassette switching module can be lifted and moved left and right, and are used to select the material taking positions of the left loading and unloading module and the right loading and unloading module by lifting and left and right switching.

2. A para-synthesis method, characterized in that, Applied to the alignment synthesis system according to claim 1; the method includes: Preparing a preset number of initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip; Repeatedly executing the step of aligning and synthesizing an LED chip unit RGB with each fourth chip unit WWW in turn with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB; wherein, The step of using each fourth chip unit WWW to be aligned and synthesized with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence to form an LED chip unit RGB includes: The moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table; The fourth chip unit WWW is aligned and synthesized into the first intermediate chip unit RWW; The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the second chip unit GGG is aligned and synthesized with the first intermediate chip unit RWW into the second intermediate unit RGW; The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and the third chip unit BBB is aligned and synthesized with the second intermediate unit RGW into the chip unit RGB; The alignment and synthesis system further includes a manipulator, a left pre-alignment module, a left pre-alignment stage, a right pre-alignment module, and a right pre-alignment stage; Before the step that the moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table, the method further includes: The manipulator transports the first chip unit RRR to the right pre-alignment stage, and the right pre-alignment module performs pre-alignment on the first chip unit; The manipulator transports the fourth crystal unit WWW to the left pre-alignment stage, and the left pre-alignment module of the left pre-alignment stage performs pre-alignment on the fourth chip unit; The alignment and synthesis system includes the left loading and unloading module and the left cassette switching module arranged on the left side along the operation flow direction, and the right loading and unloading module and the right cassette switching module arranged symmetrically on the right side along the operation flow direction. Among them, the left cassette switching module and the right cassette switching module are arranged at one end far from the laser working module; The step of preparing a preset number of initial chip units includes: Placing the right cassette filled with the first chip unit RRR, the second chip unit GGG, and the third chip BBB on the right cassette switching module, and placing the left cassette filled with the fourth chip unit WWW on the left cassette switching module; The right loading and unloading module takes out the first chip unit RRR from the right cassette of the right cassette switching module, and jumps to execute the step that the manipulator transports the first chip unit RRR to the right pre-alignment stage; The left loading and unloading module takes out the fourth chip unit WWW from the left cassette of the left cassette switching module, and jumps to execute the step that the manipulator transports the fourth chip unit WWW to the left pre-alignment stage.

3. The method according to claim 2, wherein The alignment synthesis system includes a first left-stage and a second left-stage arranged on the left along the operation flow direction, the left pre-alignment stage and the left pre-alignment module, and a right pre-alignment stage including a first right-stage and a second right-stage arranged symmetrically on the right along the operation flow direction. Among them, the first left-stage and the first right-stage are arranged at one end close to the laser working module; The step of the moving component moving the first chip unit RRR to the laser working module and the adsorption stage adsorbing the first chip unit RRR includes: The manipulator transports the first chip unit RRR to the first right-stage according to the pre-alignment information collected by the pre-alignment module; The first right-stage moves to the laser working module under the drive of the X / Y axis. The adsorption stage of the laser working module adsorbs the first chip unit RRR, and the first right-stage moves away from the laser working module; The step of the moving component moving the fourth chip unit WWW to below the adsorption stage includes: The second right-stage moves the fourth chip unit WWW to below the laser working module.

4. A para-synthesis method, characterized in that, Applied to the alignment synthesis system described in claim 1; the method includes: Prepare a preset number of initial chip units. Among them, the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, where W is a blank chip; Repeat the step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence; among them, The step of using each fourth chip unit WWW to align and synthesize an LED chip unit RGB with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB in sequence includes: The moving component moves the second chip unit GGG to the laser working module, the adsorption stage adsorbs the second chip unit GGG, and the moving component moves the fourth chip unit WWW to below the adsorption stage; Align and synthesize the fourth chip unit WWW into a first intermediate chip unit GWW; The moving component moves the first chip unit RRR to the laser working module, the adsorption stage adsorbs the first chip unit RRR, and the first chip unit RRR and the first intermediate chip unit GWW are aligned and synthesized into a second intermediate unit GRW; The moving component moves the third chip unit BBB to the laser working module, the adsorption stage adsorbs the third chip unit BBB, and the third chip unit BBB and the second intermediate unit GRW are aligned and synthesized into a chip unit GRB; The alignment synthesis system further includes a manipulator, a left pre-alignment module, a left pre-alignment stage, a right pre-alignment module, and a right pre-alignment stage; Before the step that the moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to below the adsorption table, the method further includes: The manipulator transports the first chip unit RRR to the right pre-loading stage, and the right pre-alignment module performs pre-alignment on the first chip unit. The manipulator transports the fourth crystal unit WWW to the left pre-loading stage, and the left pre-alignment module of the left pre-loading stage performs pre-alignment on the fourth chip unit. The alignment and synthesis system includes the left loading and unloading module and the left magazine switching module arranged on the left side along the operation flow direction, and the right loading and unloading module and the right magazine switching module arranged symmetrically on the right side along the operation flow direction. Among them, the left magazine switching module and the right magazine switching module are arranged at one end far from the laser working module. The step of preparing a preset number of initial chip units includes: Placing the right magazine filled with the first chip unit RRR, the second chip unit GGG, and the third chip BBB on the right magazine switching module, and placing the left magazine filled with the fourth chip unit WWW on the left magazine switching module. The right loading and unloading module takes out the first chip unit RRR from the right magazine of the right magazine switching module, and jumps to execute the step that the manipulator transports the first chip unit RRR to the right pre-loading stage. The left loading and unloading module takes out the fourth chip unit WWW from the left magazine of the left magazine switching module, and jumps to execute the step that the manipulator transports the fourth chip unit WWW to the left pre-loading stage.

5. A para-synthesis method, characterized in that, Applied to the alignment and synthesis system according to claim 1; the method includes: Preparing a preset number of initial chip units, where the initial chip units include the first chip unit BBB, the second chip unit GGG, the third chip unit RRR, and the fourth chip unit WWW, and W is a blank chip. Repeatedly executing the step of aligning and synthesizing an LED chip unit RGB with each fourth chip unit WWW in sequence with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB; where The step of aligning and synthesizing an LED chip unit RGB with each fourth chip unit WWW in sequence with the first chip unit RRR, the second chip unit GGG, and the third chip unit BBB includes: The moving component moves the first chip unit BBB to the laser working module, the adsorption table adsorbs the first chip unit BBB, and the moving component moves the fourth chip unit WWW to below the adsorption table. Aligning and synthesizing the fourth chip unit WWW into the first intermediate chip unit BWW. The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the second chip unit GGG and the first intermediate chip unit RWW are aligned and synthesized into the second intermediate unit BGW. The moving component moves the third chip unit RRR to the laser working module, and the adsorption table adsorbs the third chip unit RRR, and aligns and synthesizes the third chip unit RRR with the second intermediate unit BGW to form a chip unit BGR; The alignment and synthesis system further includes a manipulator, a left pre-alignment module, a left pre-alignment stage, a right pre-alignment module, and a right pre-alignment stage; Before the step that the moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to below the adsorption table, the method further includes: The manipulator transports the first chip unit RRR to the right pre-alignment stage, and the right pre-alignment module performs pre-alignment on the first chip unit; The manipulator transports the fourth crystal unit WWW to the left pre-alignment stage, and the left pre-alignment module of the left pre-alignment stage performs pre-alignment on the fourth chip unit; The alignment and synthesis system includes the left loading and unloading module and the left cassette switching module arranged on the left side along the operation flow direction, and the right loading and unloading module and the right cassette switching module arranged symmetrically on the right side along the operation flow direction. Among them, the left cassette switching module and the right cassette switching module are arranged at one end far from the laser working module; The step of preparing a preset number of initial chip units includes: Placing a right cassette filled with the first chip unit RRR, the second chip unit GGG, and the third chip BBB on the right cassette switching module, and placing a left cassette filled with the fourth chip unit WWW on the left cassette switching module; The right loading and unloading module takes out the first chip unit RRR from the right cassette of the right cassette switching module, and jumps to execute the step that the manipulator transports the first chip unit RRR to the right pre-alignment stage; The left loading and unloading module takes out the fourth chip unit WWW from the left cassette of the left cassette switching module, and jumps to execute the step that the manipulator transports the fourth chip unit WWW to the left pre-alignment stage.

6. A para-synthesis method, characterized in that, Applied to the alignment and synthesis system according to claim 1; the method includes: Preparing a preset number of initial chip units, where the initial chip units include a first chip unit RRR, a second chip unit GGG, a third chip unit BBB, and a fourth chip unit WWW, and W is a blank chip; The moving component moves the first chip unit RRR to the laser working module, and the adsorption table adsorbs the first chip unit RRR; The first chip unit RRR is aligned and synthesized with the fourth chip unit WWW that sequentially moves below the adsorption table to form a first intermediate chip unit RWW; The moving component moves the second chip unit GGG to the laser working module, the adsorption table adsorbs the second chip unit GGG, and the first intermediate chip unit RWW is aligned and synthesized with the second chip unit GGG that sequentially moves under the laser working module to form a second intermediate unit RGW; The moving component moves the third chip unit BBB to the laser working module, the adsorption table adsorbs the third chip unit BBB, and sequentially moves with the second intermediate unit RGW to the third chip unit BBB under the laser working module for alignment and synthesis into a chip unit RGB; The alignment and synthesis system further includes a manipulator, a left pre-alignment module, a left pre-alignment stage, a right pre-alignment module, and a right pre-alignment stage; Before the step that the moving component moves the first chip unit RRR to the laser working module, the adsorption table adsorbs the first chip unit RRR, and the moving component moves the fourth chip unit WWW to the lower part of the adsorption table, the method further includes: The manipulator transports the first chip unit RRR to the right pre-alignment stage, and the right pre-alignment module performs pre-alignment on the first chip unit; The manipulator transports the fourth crystal unit WWW to the left pre-alignment stage, and the left pre-alignment module of the left pre-alignment stage performs pre-alignment on the fourth chip unit; The alignment and synthesis system includes the left loading and unloading module and the left cassette switching module arranged on the left side along the operation flow direction, and the right loading and unloading module and the right cassette switching module arranged symmetrically on the right side along the operation flow direction. Among them, the left cassette switching module and the right cassette switching module are arranged at one end far from the laser working module; The step of preparing a preset number of initial chip units includes: Placing a right cassette filled with the first chip unit RRR, the second chip unit GGG, and the third chip BBB on the right cassette switching module, and placing a left cassette filled with the fourth chip unit WWW on the left cassette switching module; The right loading and unloading module takes out the first chip unit RRR from the right cassette of the right cassette switching module, and jumps to execute the step that the manipulator transports the first chip unit RRR to the right pre-alignment stage; The left loading and unloading module takes out the fourth chip unit WWW from the left cassette of the left cassette switching module, and jumps to execute the step that the manipulator transports the fourth chip unit WWW to the left pre-alignment stage.

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