Wafer carrier

Abstract

A wafer carrier device for cleaning wafers, the wafer carrier device is placed on a placement surface, the wafer carrier device includes a first base, a vacuum suction cup, a first adjustment member and a second base, the vacuum suction cup is pivotally mounted on the first base; the first adjustment member is respectively connected to the first base and the vacuum suction cup, and the first adjustment member can be controlled to drive the disk surface of the vacuum suction cup to tilt at a first angle relative to the placement surface; the second base has a carrying surface and is arranged on a side adjacent to the vacuum suction cup, whereby, when performing a cleaning process, the wafer can be firmly adsorbed and fixed on the vacuum suction cup, and the design that the disk surface of the vacuum suction cup can tilt at a first angle relative to the placement surface and the second base is arranged on a side adjacent to the vacuum suction cup can make the wafer slide smoothly from the vacuum suction cup to the carrying surface of the second base.

Description

Technical Field

[0001] The present invention relates to a wafer carrier device, and in particular to a wafer carrier device suitable for cleaning wafers. Background Art

[0002] The wafers used in semiconductor manufacturing are manufactured from crystal ingots produced during the crystal growth process through multiple processes such as slicing, grinding, and polishing. During each step, inorganic or organic particles may adhere to the front or back of the wafer. Furthermore, during semiconductor manufacturing, wafers must undergo repeated manufacturing processes such as deposition, lithography, and etching, resulting in residual metal, inorganic, and organic particles on the wafer surface. These particles can cause surface defects and affect product yield. Therefore, to remove particles or contaminants, the wafers undergo multiple cleaning processes to maintain surface cleanliness at all times.

[0003] A typical single-chip cleaning module usually includes a wafer carrier and a cleaning device. The cleaning device includes, for example, a brush and a rinser. When performing a cleaning process, the wafer is placed on the wafer carrier, and a solution such as a cleaning agent or deionized water is sprayed on the wafer surface by the rinser, and the wafer surface is scrubbed by the brush to remove particles on the wafer surface. After completing the cleaning process, the wafer is taken out. However, the existing wafer carrier is generally arranged horizontally, and the wafer is not easy to take out. Therefore, the structural design of the existing wafer carrier is still not perfect and there is still room for improvement. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a wafer carrying device that is convenient for taking out wafers.

[0005] In order to achieve the above-mentioned purpose, the present invention provides a chip carrier device for cleaning chips, wherein the chip carrier device is placed on a placement surface, and the chip carrier device includes a first base body, a vacuum suction cup, a first adjustment member and a second base body, and the vacuum suction cup is pivotally mounted on the first base body; the first adjustment member is respectively connected to the first base body and the vacuum suction cup, and the first adjustment member can be manipulated to drive the disk surface of the vacuum suction cup to tilt at a first angle relative to the placement surface; the second base body is arranged on a side adjacent to the vacuum suction cup, and the second base body has a carrying surface.

[0006] The effect of the present invention is that when the cleaning process is carried out, the chip can be firmly adsorbed and fixed on the vacuum suction cup, and the plate surface of the vacuum suction cup can be tilted at the first angle relative to the placement surface and the second base is arranged on the side adjacent to the vacuum suction cup, so that the chip can smoothly slide from the vacuum suction cup to the supporting surface of the second base, thereby facilitating the user to remove the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 FIG. 1 is a perspective view of a wafer carrier according to a preferred embodiment of the present invention.

[0008] Figure 2 Schematic diagram of partial decomposition of components of the wafer carrier device of the above preferred embodiment.

[0009] Figure 3 for Figure 2 Enlarged view of label A.

[0010] Figure 4 for Figure 2 Enlarged view of label B.

[0011] Figure 5 for Figure 2 Enlarged view of label C.

[0012] Figure 6 It is a schematic diagram of the partial components of the wafer carrier device of the above preferred embodiment.

[0013] Figure 7 Schematic top view of the wafer carrier of the above preferred embodiment.

[0014] Figure 8A 、 8B Schematic diagram of the wafer carrier device of the above preferred embodiment.

[0015] Figure 9 It is a three-dimensional diagram of the wafer carrier device of the above preferred embodiment.

[0016] Figure 10 FIG. 1 is a schematic top view of the second base of the wafer carrier device of the preferred embodiment.

[0017] Figure 11 for Figure 10 11-11 direction cross-sectional schematic diagram.

[0018] Figure 12 for Figure 10 12-12 direction cross-sectional schematic diagram.

[0019] Figure 13 Schematic side view of the wafer carrier of the above preferred embodiment.

[0020] Figure 14 Schematic side view of the wafer carrier of the above preferred embodiment.

[0021] Figure 15 Schematic side view of the wafer carrier of the above preferred embodiment.

[0022] Figure 16Schematic side view of the wafer carrier of the above preferred embodiment.

[0023] Figure 17 for Figure 14 Schematic diagram of some components marked D. DETAILED DESCRIPTION

[0024] In order to explain the present invention more clearly, preferred embodiments are given and described in detail with reference to the accompanying drawings. Figure 1 As shown, a chip carrier device 1 of a preferred embodiment of the present invention is used to clean a single chip and place it on a placement surface L. The placement surface L can be, for example, a sink surface with multiple drainage holes or a work surface.

[0025] Please cooperate Figure 2 The wafer carrier 1 comprises a first base 10, a vacuum chuck 20, two first adjustment members 30, two second adjustment members 40, a fixing member 50, two pivots 60 and a second base 70. The vacuum chuck 20 comprises a porous ceramic plate 22 and a carrier 24. The porous ceramic plate 22 is mounted on the carrier 24. Figure 3 As shown, the side wall of the carrier 24 has two protrusions 241 protruding outward from the side wall. The carrier 24 is connected to a vacuum device (not shown). The disk surface S2 of the porous ceramic disk 22 is used to carry a chip. The chip can be firmly adsorbed on the porous ceramic disk 22 through the vacuum of the vacuum device.

[0026] Please cooperate Figures 1 to 7 The first base 10 has two opposite side walls 10a (such as Figure 2 As shown), 10b (as shown Figure 9 As shown), one of the side walls 10a has a first coupling hole 101 and a second coupling hole 102 (as shown Figure 4 Please cooperate again. Figure 5The first adjusting member 30 has a coupling portion 301 at one end and an operating end 302 at the other end that is larger than the first coupling hole 101. The coupling portion 301 of the first adjusting member 30 passes through the first coupling hole 101 of the first base 10 and is then sleeved on the protrusion 241 of the vacuum suction cup 20 to be coupled to the vacuum suction cup 20 and the first base 10 and move with the vacuum suction cup 20. The operating end 302 of the first adjusting member 30 has an arc-shaped limiting hole 302a. The fixing member 50 passes through the arc-shaped limiting hole 302a and is locked to the second coupling hole 102 of the first base 10. In this embodiment, the other side wall 10b of the first base 10 also has a first coupling hole 101, and the coupling portion 301 of the other first adjusting member 30 passes through the first coupling hole 101 of the first base 10 and is then sleeved on the protrusion 241 of the vacuum suction cup 20. In this way, the vacuum chuck 20 is pivotally mounted on the first base 10. In other embodiments, the protruding piece 241 of the vacuum chuck 20 may be directly passed through the other side wall 10b to achieve the purpose of pivoting.

[0027] By manipulating the first adjustment member 30, the user can tilt the surface S2 of the vacuum chuck 20 relative to the placement surface L by a first angle θ1. After adjusting the first adjustment member 30 to the appropriate position, the user can clamp the operating end 302 of the first adjustment member 30 against the first base 10 via the fixing member 50, thereby fixing the rotation angle of the vacuum chuck 20. In this manner, the user can tilt the surface S2 of the vacuum chuck 20 to a desired angle to improve the removal of particles from the wafer surface during cleaning, and to prevent liquid from remaining on the wafer and the surface S2 during cleaning. In this embodiment, the first adjustment member 30 is coupled to the vacuum chuck 20 by means of screws 80 secured to the protrusion 241 of the vacuum chuck 20 and the screw holes of the first adjustment member 30. In other embodiments, the first adjustment member can be coupled to the vacuum chuck by other means, and the present invention is not limited thereto.

[0028] Please cooperate again Figure 2The second base body 70 has a bearing surface S1. The second base body 70 is disposed on a side adjacent to the vacuum chuck 20. The two sidewalls 10a and 10b of the first base body 10 each have an axial hole 103. The two pivots 60 pass through the axial holes 103 and are coupled to the second base body 70. Thus, the second base body 70 can rotate relative to the first base body 10 about the two pivots 60. The two second adjustment members 40 are bolts. One end of each bolt is screwed into the bottom of the second base body 70, and the other end abuts the placement surface L. By adjusting the degree of screwing of each bolt with the second base body 70, the bearing surface S1 of the second base body 70 is tilted relative to the placement surface L by a second angle θ2. In this way, when the cleaning process is completed, the design of tilting the surface S2 of the vacuum chuck 20 at the first angle θ1 relative to the placement surface L and the second base 70 being positioned on a side adjacent to the vacuum chuck 20 allows the wafer to slide smoothly from the vacuum chuck 20 to the supporting surface S1 of the second base 70, thereby facilitating the user to remove the wafer. In other embodiments, the number of pivots may also be one, for example, by simultaneously passing a pivot through the side wall of the first base 10 and the second base 70, thereby achieving the purpose of pivoting the second base 70 relative to the first base 10. In addition, in this embodiment, the number of bolts is illustrated as two, but in practice, the number of bolts may also be one or more than two.

[0029] 8 , the user can also adjust the second adjustment member 40 to tilt the supporting surface S1 of the second base body 70 relative to the placement surface L to a second angle θ2 that matches the first angle θ1, so as to smoothly receive the chip W that slides from the vacuum suction cup 20 to the supporting surface S1 of the second base body 70. It is worth mentioning that the disk surface S2 of the vacuum suction cup 20 is arranged at a position higher than the supporting surface S1 of the second base body 70 relative to the placement surface, wherein the first angle θ1 is between 5 and 17 degrees, and the second angle θ2 is between 10 and 12 degrees. Preferably, the first angle θ1 is between 10 and 15 degrees, and the second angle θ2 is between 11 and 12 degrees. The first angle θ1 of the present invention is selected to be between 5 and 17 degrees because the disk surface S2 of the vacuum suction cup 20 is tilted relative to the placement surface L. The first angle θ1 is greater than or equal to 5 degrees, which can make the wafer slide smoothly from the vacuum suction cup 20 to the supporting surface S1 of the second base body 70, and can avoid the problem that the disk surface S2 of the vacuum suction cup 20 is not easy to slide to the supporting surface S1 of the second base body 70 due to insufficient tilt angle, thereby limiting the first angle θ 1 is less than or equal to 17 degrees, which has the effect of making the chip stably slide from the vacuum suction cup 20 to the supporting surface S1 of the second base body 70, and at the same time can prevent the chip on the vacuum suction cup 20 from slipping due to the excessive inclination angle of the disk surface S2 of the vacuum suction cup 20, thereby causing the chip W to be scratched; the second angle θ2 of the present invention is selected to be between 10 and 12 degrees, so as to make the supporting surface S1 of the second base body 70 tilt relative to the placement surface L to match the first angle θ1, thereby smoothly receiving the chip W that slides from the vacuum suction cup 20 to the supporting surface S1 of the second base body 70, and limiting the second angle θ2 to be greater than or equal to 10 degrees can avoid the problem of collision when the chip W slides from the vacuum suction cup 20 to the supporting surface S1 due to the large height difference between the supporting surface S1 and the disk surface S2 of the vacuum suction cup 20. In this embodiment, the first angle θ1 and the second angle θ2 are both described with an angle of 12 degrees as an example. In practice, the user can adjust the first angle θ1 and the second angle θ2 to different angles according to the usage conditions. For example, the user can set the first angle θ1 to be greater than or equal to the second angle θ2, so that the chip W can slide smoothly from the vacuum suction cup 20 to the supporting surface S1 of the second base body 70, and achieve a buffering effect on the supporting surface S1 of the second base body 70.

[0030] It is worth mentioning that the vacuum chuck 20 includes two stops 242, which are arranged at the periphery of the disk surface S2 of the vacuum chuck 20. Each of the stops 242 can be controlled to move between a first position and a second position. When each of the stops 242 is in the first position, it protrudes from the disk surface S2 of the vacuum chuck 20. When each of the stops 242 is in the second position, it is flush with or lower than the disk surface S2 of the vacuum chuck 20. For example, when performing a wafer cleaning process, Figure 8A As shown, each of the stoppers 242 is located at the first position P1 protruding from the surface S2 of the vacuum chuck 20, which can prevent the wafer W from slipping off the vacuum chuck 20. When the user wants to take out the wafer W, he can press each of the stoppers 242. Figure 8B As shown, the stoppers 242 are retracted and engaged to be located at the second position P2, that is, at a position flush with the surface S2 of the vacuum chuck 20, so that the wafer W can smoothly slide from the vacuum chuck 20 to the supporting surface S1 of the second base 70. Then, the user can press each of the stoppers 242 again to release each of the stoppers 242 and pop it back to the first position P1 for subsequent wafer cleaning processes. The number of stoppers 242 can also be one or more than three. In other embodiments, when the user presses each of the stoppers 242 to retract and engage it to be located at the second position P2, each of the stoppers 242 can also be located at a position lower than the surface of the vacuum chuck.

[0031] In addition, the chip carrier device 1 includes four guide members 90 and two stop members 92. The carrying surface S1 of the second seat body has a first side 701 and a second side 702 opposite to each other. The first side 701 is located close to the first seat body 10 relative to the second side 702. The multiple guide members 90 protrude from the carrying surface S1 of the second seat body 70 and are arranged on the periphery of the carrying surface S1. A sliding path is formed between the multiple guide members 90 for the chip W to pass through. The stop member 92 protrudes from the carrying surface S1 of the second seat body 70 and is arranged at the position of the second side 702 and is located on the sliding path. Thus, the chip W can enter the surface of the carrying surface S1 of the second seat body 70 through the guide cluster of the multiple guide members 90 and enter the sliding path, and stay on the carrying surface S1 of the second seat body 70 by being stopped by the stop member 92.

[0032] like Figure 1As shown, the guide members 90 of this embodiment are illustrated by taking two groups of paired guide members as an example. The two groups of guide members include two first guide members 901 and two second guide members 902. These first guide members 901 are arranged at a position close to the first side 701, and these second guide members 902 are arranged at a position farther away from the first side 701 relative to the multiple first guide members 901. The minimum distance between these first guide members 901 and the minimum distance between these second guide members 902 are both greater than the diameter of the chip, and the minimum distance between the multiple second guide members 902 is smaller than the minimum distance between the multiple first guide members 901. Therefore, a sliding path with a gradually decreasing width is formed between these first guide members 901 and between these second guide members 902. In practice, the guide members can also be provided in only one group or in more than two groups, which can also achieve the purpose of guiding the chip from the sliding path into the surface of the supporting surface S1 of the second base 70 and preventing the chip from leaving the supporting surface S1. It should be noted that the number of stoppers 92 in this embodiment is two, and the minimum distance between the two stoppers 92 is set to be smaller than the diameter of the chip W. In practice, the number of stoppers 92 can also be one or more than two, which can still achieve the effect of stopping the chip W and allowing the chip W to stay on the supporting surface S1 of the second base 70.

[0033] Please cooperate Figures 9 to 12 The second seat 70 has a first water inlet 703 and a second water inlet 704, the first water inlet 703 and the second water inlet 704 are respectively connected to a water source, and the water source can be a deionized water source. The chip carrier 1 includes two flow regulating valves respectively arranged at the first water inlet 703 and the second water inlet 704 to adjust the water flow through the first water inlet 703 and the second water inlet 704. The carrying surface S1 has a plurality of grooves 705, a plurality of first water outlets 706 and a plurality of second water outlets 707. The first water inlet 703 is connected to the plurality of first water outlets 706, the second water inlet 704 is connected to the plurality of second water outlets 707, and as Figure 11 As shown, the second seat 70 has a first channel 708 and a second channel 709, the first channel 708 connects the first water inlet 703 and the plurality of first water outlets 706, the second channel 709 connects the second water inlet 704 and the plurality of second water outlets 707, wherein the plurality of first water outlets 706 are arranged on the first side 701 of the supporting surface S1, and the plurality of second water outlets 707 are arranged on the second side 702 of the supporting surface S1, each of the grooves 705 extends from the first side 701 of the supporting surface S1 toward the second side 702, and the plurality of grooves 705 are as shown in FIG. Figure 12 V-groove shown.

[0034] Thus, water can flow from the first water inlet 703 or the second water inlet 704 into the first channel 708 and the second channel 709, respectively, and then be discharged from the multiple first water outlets 706 and the multiple second water outlets 707 and injected into the multiple grooves 705, thereby assisting the smooth movement of the wafer on the supporting surface S1 of the second base 70. For example, when the wafer slides from the vacuum chuck 20 onto the supporting surface S1 of the second base 70, the user can open the water source connected to the first water inlet 703 so that water can flow out from the multiple first water outlets 706 provided on the first side 701 and be guided by the multiple grooves 705 toward the second side 702. In this way, when the wafer slides from the vacuum chuck 20 to the supporting surface S1 of the second base 70, it can slide smoothly to the supporting surface S1 of the second base 70 with the assistance of the water flow on the supporting surface S1.

[0035] It is worth mentioning that the axial hole 103 of the side wall of the first base body 10 includes a first section 103a, a second section 103b and a third section 103c (please refer to the embodiment of the embodiment of the present invention) connected along the direction from the first base body 10 to the second base body 70. Figure 17 , Figure 17 for Figure 14 The second section 103b has an aperture smaller than that of the first section 103a and the third section 103c, and the pivot 60 can be displaced between the first section 103a, the second section and the third section 103c of the shaft hole 103 to change the distance between the second seat 70 and the vacuum suction cup 20, wherein the shaft diameter of the pivot 60 is slightly larger than the aperture of the second section 103b. Thus, when the pivot 60 is located at the position of the first section 103a or the third section 103c, the pivot 60 can be prevented from detaching from the first section 103a or the third section 103c by limiting the aperture of the second section 103b. In this embodiment, the shaft diameter of the pivot 60 is 0.1 mm larger than the aperture of the second section 103b as an example. For example, when the user wants to move the wafer on the supporting surface S1 of the second base 70 to the position of the vacuum chuck 20, the user can move the pivot 60 from the first section 103a of the shaft hole 103 through the second section to the third section 103c, thereby moving the second base 70 as shown in FIG. Figures 13 and 14 As shown in FIG. 2 , the vacuum chuck 20 is moved closer to the vacuum chuck 20, and then, as shown in FIG. Figures 15 to 16As shown, the second base 70 pivots toward the first base 10 about the pivot 60 to a position where the angle θ3 between the support surface S1 of the second base 70 and the placement surface L is greater than 90 degrees, thereby allowing the wafer W to be moved from the support surface S1 of the second base 70 to the position of the vacuum chuck 20. Furthermore, when the second base 70 pivots toward the first base 10 about the pivot 60, a user can open a water source connected to the second water inlet 704, allowing water to flow from the multiple second water outlets 707 provided on the second side 702 and be guided by the multiple grooves 705 toward the first side 701. In this way, when the second base 70 pivots toward the first base 10 about the pivot 60, the second base 70 can smoothly slide to a position close to the vacuum chuck 20 with the help of the water flow on the support surface S1.

[0036] To sum up, when performing the cleaning process, the chip can be firmly adsorbed and fixed on the vacuum suction cup 20 through the chip carrier 1 of the present invention, and the disk surface S2 of the vacuum suction cup 20 can be tilted at the first angle θ1 relative to the placement surface L, and the second base 70 is arranged on the side adjacent to the vacuum suction cup 20, so that the chip can smoothly slide from the vacuum suction cup 20 to the carrying surface S1 of the second base 70, so as to facilitate the user to remove the chip. In addition, when the user wants to move the chip located on the carrying surface S1 of the second base 70 to the position of the vacuum suction cup 20, the second base 70 can be flipped over to move the chip from the carrying surface S1 of the second base 70 to the position of the vacuum suction cup 20.

[0037] The above description is only a preferred embodiment of the present invention. Any equivalent changes made by applying the present description and the scope of the patent application should be included in the patent scope of the present invention.

[0038] Description of Reference Numerals

[0039] [The present invention]

[0040] 1: Wafer carrier

[0041] 10: The first seat

[0042] 10a: Sidewall

[0043] 10b: Sidewall

[0044] 101: First binding hole

[0045] 102: Second binding hole

[0046] 103: shaft hole

[0047] 103a: First paragraph

[0048] 103c: The third paragraph

[0049] 20: Vacuum suction cup

[0050] 22: Porous ceramic disc

[0051] 24: Carrier

[0052] 241: Protruding parts

[0053] 242: Block

[0054] 30: First adjustment piece

[0055] 301: Joint

[0056] 302: Operation terminal

[0057] 302a: Arc-shaped limit hole

[0058] 40: Second adjustment piece

[0059] 50: Fixing parts

[0060] 60: Pivot

[0061] 70: Second seat

[0062] 701: First side

[0063] 702: Second side

[0064] 703: First water inlet

[0065] 704: Second water inlet

[0066] 705: Groove

[0067] 706: First water outlet

[0068] 707: Second water outlet

[0069] 708: First Channel

[0070] 709: Second Channel

[0071] 80: Screw

[0072] 90: Guide

[0073] 901: First guide

[0074] 902: Second guide

[0075] 92: Stopper

[0076] L: Placement surface

[0077] S1: bearing surface

[0078] S2: disk

[0079] θ1: first angle

[0080] θ2: second angle

[0081] θ3: Angle

[0082] W: chip

[0083] P1: First position

[0084] P2: Second position

Claims

1. A wafer carrier for cleaning a wafer, the wafer carrier being placed on a placement surface, the wafer carrier comprising: a first seat; a vacuum suction cup pivotally mounted on the first base; a first adjustment member connected to the first base and the vacuum suction cup, respectively, wherein the first adjustment member can be manipulated to drive the surface of the vacuum suction cup to tilt at a first angle relative to the placement surface; and A second base body is disposed on a side adjacent to the vacuum suction cup, and the second base body has a bearing surface. The supporting surface has multiple grooves and multiple first water outlets. The supporting surface of the second seat body has a first side and a second side opposite to each other. The first side is located close to the first seat body relative to the second side. The multiple first water outlets are arranged on the first side, and each of the grooves extends from the first side toward the second side.

2. The wafer carrier device according to claim 1, wherein: The utility model comprises a second adjusting member connected with the second base body. The second adjusting member can be manipulated to make the supporting surface of the second base body tilt at a second angle relative to the placement surface.

3. The wafer carrier device according to claim 2, wherein: The second adjustment member is a bolt, one end of which is screwed into the bottom of the second seat body, and the other end of which is against the placement surface. The bolt can be manipulated to change the second angle.

4. The wafer carrier device according to claim 2, wherein: The first angle is between 5 and 17 degrees, and the second angle is between 10 and 12 degrees.

5. The wafer carrier device according to claim 4, wherein: The first angle is greater than or equal to the second angle.

6. The chip carrier device as described in claim 1 comprises two guide members, wherein the multiple guide members protrude from the carrying surface of the second base and are arranged on the periphery of the carrying surface, and a sliding path is formed between the two guide members for the chip to pass through.

7. The wafer carrier according to claim 6, wherein: The at least one stopper is included. The at least one stopper protrudes from the bearing surface of the second seat and is arranged at the second side and located on the sliding path.

8. The wafer carrier device according to claim 1, wherein: The second base is pivotally mounted on the first base, and the second base is rotatable relative to the first base.

9. The wafer carrier device according to claim 8, wherein: The supporting surface has multiple grooves and multiple second water outlets. The supporting surface of the second seat body has a first side and a second side opposite to each other. The first side is located close to the first seat body relative to the second side. The multiple second water outlets are arranged on the second side, and each groove extends from the first side toward the second side.

10. The wafer carrier according to claim 8, wherein: The first base comprises a pivot, the side wall of the first base has an axis hole, the pivot passes through the axis hole and is combined with the second base, and the second base can rotate relative to the first base with the pivot as the axis.

11. The wafer carrier according to claim 10, wherein: The axial hole includes a first section, a second section and a third section that are connected along the direction from the first base body to the second base body, and the aperture of the second section is smaller than the apertures of the first section and the third section; the pivot system can be displaced between the first section, the second section and the third section of the axial hole to change the distance between the second base body and the vacuum suction cup.

12. The wafer carrier according to claim 1, wherein: It includes a fixing part, the side wall of the first base body has a first combining hole and a second combining hole, the first adjusting part passes through the first combining hole and is combined with the vacuum suction cup, the first adjusting part has an arc-shaped limiting hole, and the fixing part passes through the arc-shaped limiting hole and is combined with the second combining hole of the first base body.

13. The wafer carrier of claim 1, wherein: The vacuum suction cup includes a stopper disposed at a position on the periphery of the surface of the vacuum suction cup. The stopper can be controlled to move between a first position and a second position. When the stopper is in the first position, it protrudes from the surface of the vacuum suction cup. When the stopper is in the second position, it is flush with or lower than the surface of the vacuum suction cup.

14. The wafer carrier of claim 1, wherein: The vacuum chuck comprises a porous ceramic disc.

15. The wafer carrier of claim 1, wherein: The second base has a first water inlet for connecting to a water source, and the first water inlet is connected to the plurality of first water outlets.

16. The wafer carrier of claim 15, wherein: A flow regulating valve is included, which is arranged at the first water inlet to regulate the water flow through the first water inlet.

17. The wafer carrier of claim 9, wherein: The second base has a second water inlet for connecting to a water source, and the second water inlet is connected to the plurality of second water outlets.

18. The wafer carrier of claim 17, wherein: A flow regulating valve is included, which is arranged at the second water inlet to regulate the water flow through the second water inlet.

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