An optical element and a VCSEL laser device

Abstract

The present application provides an optical element, comprising a main lens and a light-transmitting glass with a light-transmitting conductive coating; the light-transmitting glass with the light-transmitting conductive coating is fixedly connected to the main lens; a clearance area is provided at the bottom of the main lens, and the clearance area is used for the conductive boss of an external substrate to contact the light-transmitting conductive coating, and the conductive boss is connected to an external circuit for monitoring whether the main lens is defective or detached; a groove is provided at the bottom of the main lens, the surface of the groove is a first optical interface, the upper surface of the main lens is a second optical interface, and at least one of the curved surfaces of the first optical interface and the second optical interface is a free-form surface; the groove and the substrate enclose a light source cavity, and the light source cavity includes a chip placement area and a light propagation area; a VCSEL chip is disposed in the chip placement area. The present invention monitors the working state of the main lens to prevent potential harm to human eyes caused by the dropping or defect of the optical element. The present invention also synchronously provides a VCSEL laser device having the above advantages.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of chip technology, and in particular, to an optical element and a VCSEL laser device. Background Art

[0002] Currently, a vertical cavity surface emitting laser (VCSEL) chip uses an engineering diffuser for beam expansion. The engineering diffuser bonds a polymer layer on the surface of a flat quartz glass and uses micro-refraction technology (including refraction and diffraction) to diffuse light. And the engineering diffuser is placed on a support component Holder connected to a substrate, as Figure 1 shown. Due to a large amount of total reflection of the flat glass and light loss caused by the micro-structure of the polymer layer, the engineering diffuser is set on the Holder with a small bonding area to the Holder and is bonded with UV glue, which is extremely easy to fall off. In actual tests, the optical loss of the VCSEL chip after beam expansion by the engineering diffuser is large, so the light output efficiency is relatively low. Moreover, the polymer layer is prone to high-temperature melting and peeling, or failure caused by glue infiltration and pollutant filling, or the engineering diffuser directly falls off, and the laser beam with extremely high energy directly irradiates out, posing a potential safety hazard to the human eye during use.

[0003] Therefore, the current engineering diffuser has a large optical loss and is prone to falling off. When the engineering diffuser falls off, the laser emitted by the VCSEL chip is likely to burn the human eye. How to prevent this situation from occurring is a technical problem that those skilled in the art urgently need to solve. Summary of the Invention

[0004] The embodiments of the present application provide an optical element and a VCSEL laser device. The optical element has an ITO layer, which can emit a signal when the optical element falls off to prevent accidents.

[0005] In a first aspect, the embodiments of the present application provide an optical element, including: a main lens and a transparent glass with a light-transmitting conductive coating;

[0006] The transparent glass with the light-transmitting conductive coating is fixedly connected to the main lens;

[0007] A clearance area is provided at the bottom of the main lens. The clearance area is used for the conductive boss of the external substrate to contact the light-transmitting conductive coating. The conductive boss is connected to an external circuit and is used to monitor whether the main lens is damaged or falls off.

[0008] In a possible implementation manner, the light-transmitting conductive coating is indium tin oxide ITO.

[0009] In a possible implementation, a groove is provided on the bottom surface of the main lens, and the surface of the groove is the first optical interface;

[0010] The top surface or upper surface of the main lens is the second optical interface;

[0011] At least one of the first optical interface and the second optical interface is a pre-designed free-form surface for adjusting the exit angle or spot effect of the exit light.

[0012] In a possible implementation, a light source cavity is formed between the groove and the substrate; the light source cavity includes a light propagation region and a chip placement region; the chip placement region is used to place a VCSEL chip, the VCSEL chip is disposed in the chip placement region, the light emitted by the VCSEL chip passes through the light propagation region, passes through the first optical interface, enters the main lens, and then exits the main lens through the second optical interface to complete light control.

[0013] In a possible implementation, the upper and lower parts of the main lens are injection molded above and below the transparent glass with a transparent conductive coating.

[0014] In a possible implementation, the main lens is a silica gel lens, a transparent resin lens or a molded glass lens, and the refractive index is greater than 1.4.

[0015] In a possible implementation, the main lens is formed by die pressing or injection molding.

[0016] In a second aspect, an embodiment of the present application provides a VCSEL laser device, including an optical element as described in the first aspect above, a substrate, and a VCSEL chip;

[0017] The optical element is fixedly connected to the substrate;

[0018] The VCSEL chip is disposed on the substrate;

[0019] A conductive boss is provided on the substrate;

[0020] The conductive boss is connected to the ITO layer of the optical element and forms an electrical circuit.

[0021] In a possible implementation, at least two or more solder pads and two sets of electrical circuits are provided at the bottom of the substrate to complete the connection between the control of the VCSEL chip and the ITO layer circuit.

[0022] In a possible implementation, the optical element is fixedly connected to the substrate, and the optical axis of the optical element coincides with the optical axis of the VCSEL chip.

[0023] As can be seen from the above technical solutions, the embodiments of the present application have the following advantages:

[0024] The embodiments of the present application provide an optical element and a VCSEL laser device. By adopting the structure of an indium tin oxide (ITO) layer, the working state of the main lens can be monitored through the ITO layer. When the main lens falls off, the optical element cannot complete normal light control, and the ITO layer is disconnected from the conductive boss on the substrate, so that the connection circuit between the ITO layer and the outside is disconnected, thereby sending a signal to the external host to warn the user that the VCSEL device fails and needs to be repaired or the power supply of the VCSEL laser device needs to be disconnected, avoiding accidents such as eye burns caused by the user using the laser emitter without knowing it. Description of the Drawings

[0025] Figure 1 Schematic diagram of the current VCSEL laser device;

[0026] Figure 2 Cross-sectional view of Embodiment 1 of the optical element in the embodiments of the present application;

[0027] Figure 3 Schematic diagram of the VCSEL laser device in the embodiments of the present application;

[0028] Figure 4 Top view of the substrate provided with the VCSEL chip in the embodiments of the present application;

[0029] Figure 5 For Figure 4 Cross-sectional view corresponding to the A-A section in

[0030] Figure 6 Bottom view of the substrate 201 in the embodiments of the present application;

[0031] Figure 7 Exploded view of Embodiment 2 of the optical element provided by the present application;

[0032] Figure 8 Front view of Embodiment 2 of the optical element provided by the present application;

[0033] Figure 9 Cross-sectional view of another optical element provided in Embodiment 3 of the present application;

[0034] Figure 10 Exploded view of another optical element provided in Embodiment 3 of the present application. Detailed Embodiments

[0035] The embodiments of the present application provide an optical element and a VCSEL laser device. The optical element has an ITO layer and can emit a signal when the optical element falls off to prevent accidents.

[0036] In the description and claims of this application and the above-mentioned drawings, the terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of this application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "corresponding to" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0037] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or having more advantages than other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0038] Currently, a vertical cavity surface emitting laser (VCSEL) chip uses an engineering diffuser for beam expansion, as Figure 1 shown. Figure 1 is a schematic diagram of a current VCSEL laser device. An engineering diffuser is covered on the substrate provided with the VCSEL chip. The engineering diffuser is formed by bonding a polymer layer on the surface of a flat quartz glass and uses micro-refraction technology (including refraction and diffraction) to diffuse light. And the engineering diffuser is placed on a Holder connected to the substrate, as Figure 1 shown. Due to a large amount of total reflection of the flat glass and the fact that the microstructure of the polymer layer will cause light loss, the engineering diffuser is set on the Holder with a small bonding area to the Holder and is bonded with UV glue, which is extremely easy to fall off. In actual tests, the optical loss of the VCSEL chip after beam expansion by the engineering diffuser is relatively large, so the light output efficiency is relatively low. Moreover, the polymer layer is prone to high-temperature melting and peeling, or failure caused by glue infiltration and pollutant filling, or the engineering diffuser directly falls off, and the laser beam with extremely high energy irradiates directly, posing a potential safety hazard to human eyes during use.

[0039] Therefore, to solve Figure 1Regarding the technical problems of the VCSEL laser device shown, the embodiments of the present application break through the existing packaging technology and optical system. The light-transmitting glass provided with an ITO layer is inlaid inside the main lens with a double free-form surface, and then connected to the substrate of the external circuit, and the main lens is fixed on the substrate. The entire packaging system is simple and stable, and safer during application. The entire optical system has a high light transmittance and low light loss, and can effectively reduce the problem of eye injury caused by the lens falling. The following is a detailed description by specific embodiments.

[0040] Embodiment 1

[0041] Figure 2 This is a cross-sectional view of Embodiment 1 of the optical element in the embodiments of the present application. The optical element provided by the embodiments of the present application can be installed on a substrate with a VCSEL chip to form a VCSEL laser device. It can be understood that the optical element provided by the embodiments of the present application can also be installed on other devices, such as an LED chip, and the embodiments of the present application do not limit this. The following embodiments of the present application will describe this optical element in detail.

[0042] The optical element includes a main lens 101 and a light-transmitting glass 102 with an indium tin oxide (ITO) layer 103. The light-transmitting glass 102 is fixedly connected to the main lens 101. Specifically, the light-transmitting glass 102 can be embedded in the bottom surface of the main lens 101 or at an internal position within the main lens 101. The embodiments of the present application do not limit the bonding method between the light-transmitting glass 102 and the main lens 101. The light-transmitting glass 102 has an ITO layer 103 thereon. The ITO layer 103 can be embedded inside the light-transmitting glass 102 or mounted on the bottom surface of the light-transmitting glass 102. The embodiments of the present application do not limit this. When the optical element is mounted on a substrate, the ITO layer 103 forms an electrical circuit with a conductive boss on the substrate; when the optical element is detached from the substrate, the ITO layer 103 is disconnected from the conductive boss. Therefore, when the optical element is detached from the substrate, the connected circuit can detect this open-circuit state and thus take defensive measures, such as disconnecting the power supply of the VCSEL chip, emitting an alarm sound, notifying an external host, etc. The embodiments of the present application do not limit this defensive measure. That is to say, the ITO layer 103 realizes the monitoring of the working state of the main lens 101. Once the main lens 101 falls off, resulting in the optical element being unable to complete normal light control, the connection circuit between the ITO layer 103 and the outside will be disconnected, and a signal can be sent to the external host to warn the user that the VCSEL device is faulty and needs repair, thus avoiding accidental injuries such as eye burns caused by the user using the laser emitter without knowledge. In the prior art, it is impossible to detect the detachment of the Diffuser. When the user uses the VCSEL device when the Diffuser has fallen off, accidental accidents are likely to occur. It can be seen that the embodiments of the present application can better improve the safety of the VCSEL device. Moreover, using the ITO layer 103 for conduction detection is very stable and reliable. When the optical element falls off, it can definitely be detected without false negatives.

[0043] As Figure 2 shown, an avoidance area is provided at the bottom of the main lens 101. The avoidance area is for the conductive boss of the external substrate to come into contact with the ITO layer. The conductive boss is connected to an external circuit and is used to monitor whether the main lens 101 is damaged or has fallen off. When the optical element is mounted on a substrate, the conductive boss on the substrate can be inserted into this avoidance area and come into contact with the ITO layer in the main lens 101 to form an electrical circuit. In a possible case, this avoidance area can be rectangular or other suitable shapes, as long as the conductive boss can be smoothly inserted into the main lens and come into contact with the ITO layer in the main lens 101. The embodiments of the present application do not make specific limitations on this. In some possible cases, the conductive boss can have an interference fit with the avoidance area, so that the optical element can be more tightly mounted on the substrate. Relative to Figure 1In the prior art where the diffuser is directly supported above the substrate, the embodiments of the present application can make the optical elements fit more closely, prevent the optical elements from falling off, and improve the stability of the VCSEL laser device.

[0044] In some possible embodiments, the ITO layer 103 can also be a light-transmitting conductive coating made of other materials, which mainly realizes the functions of light transmission and conductivity. First, the light emitted by the VCSEL chip can pass through this coating. Or rather, when this coating is embedded in the main lens 101 along with the light-transmitting glass 102, it reduces the influence on the light. And since this coating can conduct electricity, it can form an electrical circuit with the conductive boss, so that it can be monitored whether the main lens 101 is damaged or fallen off. Therefore, in the embodiments of the present application, the conductive coating formed of other materials should also be within the scope of the present application. Compared with Figure 1 the prior art shown, this light-transmitting conductive coating can monitor whether the main lens 101 is damaged or fallen off, preventing potential harm to human eyes caused by the dropping or damage of the optical elements. And by using indium tin oxide (ITO), the light-transmitting property and conductivity of the coating can be relatively good, and it is currently the best material.

[0045] A groove is provided on one side (the bottom surface) of the main lens 101, and the surface of this groove is the first optical interface. The other side (the top surface) of the main lens 101 is the second optical interface. Both the upper and lower surfaces of the main lens 101 are free-form surfaces, and the emission angle of the light emitted by the VCSEL chip and the spot effect of the irradiation can be changed through the two optical interfaces above and below. In the prior art, as Figure 1 shown, generally a polymer layer is provided on the quartz glass to change the emission angle of the emitted light. This polymer layer forms patterns through etching and other methods, resulting in relatively large light loss and possibly diffraction phenomena, which is not conducive to the emission of light. In the embodiments of the present application, the emission angle of the light is adjusted by means of two optical free-form surfaces above and below, without the need for a polymer layer, so the light loss is relatively small. And by means of the optical free-form surfaces, the emission angle of the light and the spot effect of the irradiation are adjusted, with a large adjustment range, good adjustment effect, and small light loss.

[0046] In some embodiments, the first optical interface 1011 is a pre-designed free-form surface, and the second optical interface 1012 is a common optical interface. In other embodiments, the second optical interface 1012 is a pre-designed free-form surface, and the first optical interface 1011 is a common optical interface. In still other embodiments, both the first optical interface 1011 and the second optical interface 1012 are pre-designed free-form surfaces. The specific implementation method can be designed according to actual needs. The embodiments of the present application do not limit this. When both the first optical interface 1011 and the second optical interface 1012 are pre-designed free-form surfaces, the outgoing light can be adjusted more greatly, and a richer spot effect can be obtained. This is Figure 1 not achievable by the prior art shown.

[0047] As Figure 2 can be seen, the light-transmitting glass 102 can be embedded in the main lens 101, and the bottom surface (groove surface) of the main lens 101 is the first optical interface 1011, and the top surface of the main lens is the second optical interface 1012. In the embodiments of the present application, the first optical interface 1011 and the second optical interface 1012 are preset free-form surfaces and can be adjusted according to actual needs. Both the upper and lower surfaces (the first optical interface 1011 and the second optical interface 1012) of the main lens 101 are free-form surfaces, and the emission angle of the light emitted by the VCSEL chip and the spot effect of the irradiation can be changed through the upper and lower optical interfaces. The embodiments of the present application adjust the emission angle of the light through the upper and lower optical free-form surfaces, do not require a polymer layer, and thus have less light loss.

[0048] When the optical element is installed on the substrate provided with the VCSEL chip, the bottom groove of the main lens 101 and the substrate enclose a light source cavity. The light source cavity includes a light propagation region 1013 and a chip placement region 1014. Among them, the VCSEL chip can be placed in the chip placement region 1014. The outgoing light of the VCSEL chip can pass through the light propagation region 1013, enter the main lens 101 through the first optical interface 1011, and then exit the main lens 101 through the second optical interface 1012. Since at least one of the first optical interface 1011 and the second optical interface 1012 is a free-form surface that can be adjusted according to actual needs and can adjust the refraction direction of the light, optical elements with different emission angles can be prepared according to actual needs. That is to say, the embodiments of the present application adjust the angle at which the outgoing light exits the main lens 101 through the first optical interface 1011 and the second optical interface 1012 that are free-form surfaces, thereby controlling the light, discarding the flat glass and polymer layer in the prior art, simplifying the structure, improving the working reliability of the component, and at the same time achieving the effect of simplifying the manufacturing process.

[0049] In the embodiment of the present application, the transparent glass 102 with the ITO layer 103 can divide the main lens 101 into upper and lower parts. It can be understood that the upper and lower parts of the main lens 101 clamp the transparent glass 102. In the manufacturing process, the production personnel can first place the transparent glass 102 with the ITO layer 103 into a mold, and then perform injection molding from the upper and lower sides of the mold to form the main lens 101. This injection molding method is simple and efficient, and can embed the transparent glass 102 with the ITO layer 103 inside the main lens 101 without a complex structure, improving the production efficiency.

[0050] In the embodiment of the present application, the main lens 101 is made of silicone lens, transparent resin lens or molded glass lens material, which is a lens formed by mold pressing or injection molding, and the processing is simple and efficient. The main lens 101 in the embodiment of the present application is made of silicone, resin, or molded glass by mold pressing or injection molding, and the production process is mature and stable. In practical applications, the main lens 101 can also be prepared from other suitable materials, which is not limited in the embodiment of the present application. The structure of the main lens 101 in the embodiment of the present application is not complex and is easy to process. In the prior art, as Figure 1 shown, it is necessary to deposit a polymer layer on the quartz glass and also perform etching on the polymer layer, and the process is very complex. Therefore, the manufacturing process in the embodiment of the present application is simple and efficient, saving costs. Moreover, the embodiment of the present application adopts mold pressing or injection molding, and the process is mature and stable, and can produce main lenses 101 of different shapes.

[0051] In a possible embodiment, the refractive index of the main lens 101 is greater than 1.4. Generally, the refractive index of the transparent glass 102 is generally between 1.5 and 1.6. Therefore, the refractive index of the main lens 101 being greater than 1.4 can be close to the refractive index of the transparent glass 102, reducing the influence on the outgoing light. In one possible case, if the refractive index of the main lens 101 is the same as that of the transparent glass 102, the effect of the outgoing light is better.

[0052] Figure 3 This is a schematic diagram of the VCSEL laser device in the embodiment of the present application. It can be seen that when the optical element is installed on the substrate, the ITO layer 103 is in contact connection with the conductive boss 203 to form an electrical circuit, and at this time, the current can flow normally through the ITO layer 103 and the conductive boss 203. When the optical element is detached from the substrate, the connection between the ITO layer 103 and the conductive boss 203 is disconnected, and the current cannot flow normally. Therefore, the external circuit connected to the conductive boss 203 will be disconnected, and a signal can be sent to the external host to warn the user that the VCSEL device fails and needs to be repaired, avoiding accidental injuries such as eye burns caused by the user using the laser emitter without knowing.

[0053] Figure 4It is a top view of a substrate provided with a VCSEL chip in an embodiment of the present application. Figure 5 is Figure 4 the sectional view corresponding to the A-A section in. A VCSEL chip 202 is provided on the substrate 201 in the embodiment of the present application. The VCSEL chip 202 can be mounted on the substrate 201 in a face-up mounting manner or in a flip-chip mounting manner, and the embodiment of the present application does not limit this. In some embodiments, as Figure 3 shown, the VCSEL chip 202 is connected to a conductive sheet on the substrate 201 through a suture 204 (which can also be called a gold wire, a metal wire, a conductive wire or a lead). When an optical element is mounted on the substrate 201, the light source cavity formed by the groove of the main lens 101 and the substrate 201 can protect the VCSEL chip 202 and the suture 204. However, in the prior art as Figure 1 shown, the VCSEL chip and the suture are not protected and are easily damaged. Therefore, compared with the prior art, the embodiment of the present application has higher safety and better device stability.

[0054] In the embodiment of the present application, a conductive boss 203 is further provided on the substrate 201. When an optical element is mounted on the substrate 201, the conductive boss 203 is connected to the ITO layer 103 on the optical element to form an electrical circuit, so that when the optical element is detached from the substrate 201, the current connected to the conductive boss 203 can detect the disconnection of the electrical circuit, and corresponding measures can be taken to avoid accidents. At the same time, the conductive boss 203 is inserted into the main lens 101 and connected to the ITO layer 103, increasing the adhesion force between the main lens 101 and the substrate 201 and reducing the risk of the entire optical element falling.

[0055] Figure 6 It is a bottom view of the substrate 201 in the embodiment of the present application. Please combine Figure 5 and Figure 6, It can be seen that at least two or more pads are further provided at the bottom of the substrate in the embodiments of the present application, and two sets of electrical circuits are used to complete the connection between the control of the VCSEL chip and the ITO layer circuit. In a possible embodiment, the pads may include a first pad 205 and a second pad 206. Among them, the first pad 205 is connected to the VCSEL chip 202 and is used to connect the VCSEL chip 202 to an external circuit or power supply. The second pad 206 is connected to the conductive bump 203 and is used to transmit the electrical signal between the conductive bump 203 and the external circuit. It can be understood that the first pad 205 and the second pad 206 can be connected to an external circuit or an external host to transmit electrical signals or currents to achieve specific functions. The embodiments of the present application can provide a connection method for an external circuit or an external host through the pads, and the connection method is simple and has good expandability. It can be understood that the electrical circuit formed by the first pad 205 and the electrical circuit formed by the second pad 206 can be two different sets of electrical circuits, which respectively complete the control of the VCSEL chip and the connection of the ITO layer circuit. Then these two sets of electrical circuits will not affect each other and can each achieve appropriate functions, which is convenient for the design of the external circuit. In another possible case, the two sets of electrical circuits can be connected to save circuit resources, and the embodiments of the present application do not limit this.

[0056] In a possible embodiment, the optical axis of the optical element coincides with the optical axis of the VCSEL chip. When the optical axes coincide, the spot effect of the VCSEL laser device is the best. In some cases, due to engineering errors and other situations, the optical axes cannot completely coincide, so the VCSEL laser device may emit an elliptical spot. Therefore, if a centrosymmetric spot is desired, the optical axis of the optical element should be made to coincide with the optical axis of the VCSEL chip as much as possible in the process. If the embodiments of the present application adopt the implementation manner in which the optical axis of the optical element coincides with the optical axis of the VCSEL chip, then compared with the Figure 1 prior art shown, the embodiments of the present application can achieve such a good spot effect and have a very excellent application prospect.

[0057] In the embodiment of the present application, the light-transmitting glass 102 can be glass without hollow connecting ribs, so there is no need for corresponding hollow small holes on the main lens 101 either. In this embodiment, since there is no need to specifically make hollow small holes on the main lens 101, the production process is simpler, the production cost is lower, and the production yield and efficiency are higher. Specifically, in some cases, the light-transmitting glass 102 can be produced by shaving off the connecting ribs of the originally light-transmitting glass 102 with connecting ribs. In other cases, a suitable process can be used to directly prepare the light-transmitting glass 102 without connecting ribs, and the embodiment of the present application does not limit this. Using this light-transmitting glass 102 without hollow connecting ribs can make the structure of the light-transmitting glass 102 simpler, facilitate assembly and disassembly, and also facilitate recycling.

[0058] In the embodiment of the present application, the light-transmitting glass 102 can be attached to the main lens 101 by adhesion. In another case, the light-transmitting glass 102 can be fixed by the clamping of the conductive boss 203 and the main lens 101. In another case, the light-transmitting glass 102 can also be placed in a suitable position by inlaying. In practical applications, other methods can also be used to fix the light-transmitting glass 102, such as obtaining the light-transmitting glass 102 through an injection molding process from top to bottom, and the embodiment of the present application does not limit this. No matter which method is used, the embodiment of the present application can stably assemble the light-transmitting glass 102 in the optical element and achieve a good assembly effect.

[0059] Embodiment Two

[0060] Figure 7 It is an exploded view of Embodiment Two of the optical element provided by the present application. Figure 8 It is a front view of Embodiment Two of the optical element provided by the present application. The optical element in Embodiment Two includes a main lens 101, a light-transmitting glass 102 with an indium tin oxide ITO layer 103, and a connecting rib 104 on the side of the light-transmitting glass 102. Among them, the main lens 101, the light-transmitting glass 102, and the indium tin oxide ITO layer 103 are similar to those described in Embodiment One above and will not be elaborated here.

[0061] In the embodiment of the present application, there is a connecting rib 104 on the side of the light-transmitting glass 102. Therefore, when producing the main lens 101 by an injection molding process, instead of using the up-and-down injection method, a single-sided injection method can be used. The injection material can flow in from above or below the mold, then pass through the space beside the connecting rib 104 to fill the entire mold, and finally injection molding is achieved. Using this method, injection molding is simpler, the production efficiency is improved, and the injection cost is reduced.

[0062] Embodiment Three

[0063] Figure 9 、Figure 10 Schematic diagram of the third embodiment of the optical element provided for this application. The optical element in the third embodiment includes a main lens 101, a light-transmitting glass 102 with an indium tin oxide (ITO) layer 103, and a connecting rib 104 on the side of the light-transmitting glass 102. Among them, the main lens 101, the light-transmitting glass 102, the indium tin oxide ITO layer 103, and the connecting rib 104 are similar to those described in the second embodiment above, and will not be elaborated here.

[0064] In the third embodiment, the center of the light-transmitting glass 102 is hollowed out and the center of the ITO layer 102 is hollowed out, as Figure 9 、 Figure 10 shown. Figure 9 Cross-sectional view of another optical element provided for the third embodiment of this application. Figure 10 Exploded view of another optical element provided for the third embodiment of this application. Combining Figure 9 、 Figure 10 It can be seen that the hollowing out of the center of the light-transmitting glass 102 and the center of the ITO layer 102 enables the groove on the bottom surface of the main lens 101 to be made larger, forming a larger light propagation area 1013 and a chip placement area 1014. Moreover, the outgoing light passes through the light propagation area 1013, enters the main lens 101 through the first optical interface 1011, and then exits the main lens 101 through the second optical interface 1012, without passing through the light-transmitting glass 102 and the ITO layer 103, resulting in less light loss. Other situations of this optical element are similar to those in the previous embodiments and will not be elaborated here. In the embodiments of this application, the groove on the bottom surface of the main lens 101 can be made larger, and a free-form surface with a large curvature can be made, which can better adjust the outgoing angle of the outgoing light and obtain more types and better spot effects.

[0065] Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the above-described systems, devices, and units can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated here.

Claims

1. An optical element, characterized in that, Comprising: A main lens and a light-transmitting glass with a light-transmitting conductive coating; The light-transmitting glass with the light-transmitting conductive coating is fixedly connected to the main lens and embedded in the main lens; A clearance area is provided at the bottom of the main lens, and the clearance area is used for the conductive bumps of the external substrate to contact the light-transmitting conductive coating. The conductive bumps are connected to an external circuit and are used to monitor whether the main lens is defective or detached; A groove is provided on the bottom surface of the main lens, and the surface of the groove is the first optical interface. The top surface of the main lens is the second optical interface. At least one of the first optical interface and the second optical interface is a pre-designed free-form surface; A light source cavity is formed between the groove and the substrate; the light source cavity includes a light propagation area and a chip placement area; the chip placement area is used for placing a VCSEL chip; the VCSEL chip is disposed in the chip placement area, and the light emitted by the VCSEL chip passes through the light propagation area, passes through the first optical interface, enters the main lens, and then exits the main lens through the second optical interface to complete light control.

2. The optical element according to claim 1, characterized in that, The light-transmitting conductive coating is indium tin oxide ITO.

3. The optical element according to claim 1, characterized in that The upper and lower parts of the main lens are injection-molded above and below the light-transmitting glass with the light-transmitting conductive coating.

4. The optical element according to claim 1, characterized in that, The main lens is a silicone lens, a transparent resin lens or a molded glass lens, and the refractive index is greater than 1.

4.

5. The optical element according to claim 4, characterized in that, The main lens is formed by die pressing or injection molding.

6. A VCSEL laser device, characterized in that, Comprising the optical element according to any one of claims 1 to 5, a substrate and a VCSEL chip; The optical element is fixedly connected to the substrate; The VCSEL chip is disposed on the substrate; Conductive bumps are provided on the substrate; The conductive bumps are connected to the light-transmitting conductive coating of the optical element and form an electrical circuit.

7. The VCSEL laser device according to claim 6, wherein, At least two pads are provided at the bottom of the substrate, and two sets of electrical circuits are used to complete the connection of the control of the VCSEL chip and the circuit of the light-transmitting conductive coating.

8. The VCSEL laser device according to claim 6, wherein the optical element is fixedly connected to the substrate, and the optical axis of the optical element coincides with the optical axis of the VCSEL chip.

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