Atomizer core structure based on MEMS silicon-based heating plate and manufacturing method thereof

Abstract

The present invention discloses an atomizer core structure based on a MEMS silicon-based heating plate, comprising: a silicon-based heating plate and a porous ceramic core, the silicon-based heating plate comprising a heating wire and a silicon-based substrate, the heating wire is made on the surface of the silicon-based substrate, an array of atomization micropores are arranged on the silicon-based substrate, the silicon-based substrate is fixedly mounted on the porous ceramic core, and the atomization micropores are connected to the porous ceramic core. The present invention also discloses a method for manufacturing an atomizer core structure based on a MEMS silicon-based heating plate. Compared with the prior art, the present invention avoids leakage of the atomizer core, reduces processing difficulty, improves the yield rate, increases the atomization heating area of ​​the atomizer core, improves temperature uniformity, increases the amount of mist, and reduces dry burning.

Description

Technical Field

[0001] The present invention belongs to the field of liquid heating atomizer cores, and in particular relates to an atomizer core structure based on a MEMS silicon-based heating sheet and a manufacturing method thereof. Background Art

[0002] As the core component of liquid atomization products, the heating atomization core is used to heat the liquid and turn it into a mist aerosol form. Liquid heating atomization cores mainly include cotton-wrapped atomization cores and porous ceramic atomization cores. In the cotton-wrapped atomization core, the metal heating wire and the cotton core are in direct contact. At high temperatures, the metal components in the heating wire and the debris of the cotton core material may be carried by the aerosol formed by atomization and inhaled by the user, causing potential health hazards. At the same time, the cotton core is in non-uniform contact with the metal heating wire, the heating is uneven, and the high-temperature carbonization will also cause the resistance of the heating wire to change, which in turn causes the temperature of the heating wire to change, making the atomization uniformity, stability, and consistency poor. The porous ceramic atomization core consists of two parts: porous ceramic and heating electrode. The porous ceramic is sintered at high temperature to form a bowl-shaped structure. The heating film is designed to be attached to the ceramic surface in a specific shape. During operation, the heating film heats the liquid to form mist by uniform heating, which is emitted by the ceramic micropores.

[0003] In the existing porous ceramic atomizer core, in order to have a certain liquid absorption and storage capacity, the fired microporous ceramic needs to maintain a certain micropore size and porosity, resulting in the following three problems in the porous ceramic atomizer core:

[0004] 1. Due to the existence of porous structure, the liquid locking ability of ceramic core is reduced and it is easy to leak. At present, the liquid locking ability is usually improved by reducing the porosity and the number of pores, but at the same time, its liquid absorption and storage ability is reduced.

[0005] Second, since microporous ceramics are loose and not hard enough, it is difficult to integrate the metal heating wire with the ceramic core with high yield, and the metal heating wire needs to be extra thickened to avoid damage to the ceramic core caused by the external conductive column.

[0006] 3. The thermal conductivity of the ceramic core is low and uneven, and the metal heating wire cannot cover the entire atomization surface, making it difficult to increase the atomization volume, and the local temperature is prone to being too high, causing dry burning. Summary of the invention

[0007] The purpose of the present invention is to provide an atomizer core structure based on a MEMS silicon-based heating plate and a manufacturing method thereof, so as to avoid leakage of the atomizer core, reduce processing difficulty, improve yield rate, increase the atomization heating area of ​​the atomizer core, improve temperature uniformity, increase the amount of mist, and reduce dry burning.

[0008] In order to achieve the above-mentioned objectives, on the one hand, the present invention provides an atomization core structure based on a MEMS silicon-based heating plate, comprising: a silicon-based heating plate and a porous ceramic core, the silicon-based heating plate comprising a heating wire and a silicon-based substrate, the heating wire is made on the surface of the silicon-based substrate, an array of atomization micropores is arranged on the silicon-based substrate, the silicon-based substrate is fixedly mounted on the porous ceramic core, and the atomization micropores are connected to the porous ceramic core.

[0009] As a further description of the above technical solution:

[0010] The thickness of the silicon-based substrate is 5-400 microns.

[0011] As a further description of the above technical solution:

[0012] The diameter of the atomization micropores is 2-20 microns.

[0013] As a further description of the above technical solution:

[0014] The atomization micropores are round or square.

[0015] On the other hand, the present invention also provides a method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet, comprising the following steps:

[0016] S1, prepare silicon-based substrate;

[0017] S2, depositing metal on a silicon-based substrate and making a specific pattern through a dry etching or wet etching process to form a heating filament;

[0018] S3, etching atomized micropores on a silicon-based substrate;

[0019] S4, thinning the back side of the silicon-based substrate to expose the front side atomized micropores to form a silicon-based heating plate;

[0020] S5. Bond the silicon-based heating plate and the porous ceramic core to form an atomizing core.

[0021] As a further description of the above technical solution:

[0022] In step S2, the deposited metal is any one of Al, Ti / Au, Ti / Pt, Ti / TiN / Au, Ti / TiN / Pt, Ta / Au, Ta / Pt, Ta / TaN / Au, and Ta / TaN / Pt.

[0023] As a further description of the above technical solution:

[0024] In step S3, a dry etching process or a wet etching process is used to etch the atomized micropores.

[0025] As a further description of the above technical solution:

[0026] In step S5, the silicon-based heating plate and the porous ceramic core are directly bonded together or bonded together through a glass paste bonding process or a metal eutectic process.

[0027] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0028] 1. In the present invention, the atomization core structure includes a silicon-based heating plate and a porous ceramic core. The silicon-based substrate in the silicon-based heating plate is provided with micron or even submicron-level atomization micropores, which effectively porously lock the atomized liquid seeping out of the ceramic core to avoid leakage.

[0029] 2. In the present invention, the MEMS silicon-based heating plate in the atomizer core is in direct contact with the conductive column, protecting the porous ceramic core from being damaged by the conductive column and improving the assembly yield.

[0030] 3. In the present invention, the silicon-based heating plate in the atomizer core is in direct contact with the ceramic core, which increases the atomization heating area and improves the temperature uniformity, thereby increasing the amount of mist and reducing the dry burning phenomenon. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 It is a structural schematic diagram of an atomization core structure based on a MEMS silicon-based heating plate.

[0033] Figure 2 A schematic diagram of depositing metal on a silicon-based substrate in a method for manufacturing an atomization core structure based on a MEMS silicon-based heating plate.

[0034] Figure 3 It is a schematic diagram of etching atomization micropores on a silicon-based substrate in a method for manufacturing an atomization core structure based on a MEMS silicon-based heating plate.

[0035] Figure 4 A schematic diagram of thinning a silicon-based substrate in a method for manufacturing an atomization core structure based on a MEMS silicon-based heating plate.

[0036] Legend:

[0037] 1. Silicon-based heating plate; 11. Heating wire; 12. Silicon-based substrate; 121. Atomizing micropores; 2. Porous ceramic core. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] See also Figure 1-4 The present invention provides a technical solution: on the one hand, the present invention provides an atomization core structure based on a MEMS silicon-based heating plate, comprising: a silicon-based heating plate 1 and a porous ceramic core 2, the silicon-based heating plate 1 comprises a heating wire 11 and a silicon-based substrate 12, the heating wire 11 is made on the surface of the silicon-based substrate 12, an array of atomization micropores 121 are arranged on the silicon-based substrate 12, the silicon-based substrate 12 is fixedly mounted on the porous ceramic core 2, and the atomization micropores 121 are connected to the porous ceramic core 2.

[0040] The thickness of the silicon-based substrate 12 is 5-400 microns.

[0041] The diameter of the atomization micropores 121 is 2-20 microns.

[0042] The atomization micro-holes 121 are round holes or square holes.

[0043] On the other hand, the present invention also provides a method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet, comprising the following steps:

[0044] S1, preparing a silicon-based substrate 12;

[0045] S2, depositing metal on the silicon-based substrate 12, and making a specific pattern by dry etching or wet etching process to form the heating wire 11;

[0046] S3, etching atomized micropores 121 on the silicon-based substrate 12;

[0047] S4, thinning the back side of the silicon-based substrate 12 to expose the front side atomization micropores 121, thereby forming a silicon-based heating plate 1;

[0048] S5, bonding the silicon-based heating plate 1 and the porous ceramic core 2 to form an atomizing core.

[0049] In step S2, the deposited metal is any one of Al, Ti / Au, Ti / Pt, Ti / TiN / Au, Ti / TiN / Pt, Ta / Au, Ta / Pt, Ta / TaN / Au, and Ta / TaN / Pt, all of which are metal materials harmless to the human body.

[0050] In step S3, the atomized micropores 121 are etched by dry etching or wet etching. The depth of the atomized micropores 121 ranges from several micrometers to several hundred micrometers, and the pore diameter is several micrometers or even sub-micrometers.

[0051] In step S5, the silicon-based heating plate 1 and the porous ceramic core 2 are bonded by direct bonding or by a glass paste bonding process or a metal eutectic process. According to the bonding process and structural requirements, a high-temperature pad may or may not be added between the silicon-based heating plate 1 and the porous ceramic core 2. The high-temperature pad includes but is not limited to cotton materials. Porous ceramics are not limited to a certain material.

[0052] Working principle: MEMS silicon-based heating sheets are used in the atomizer core to replace traditional metal heating wires. They are processed using micro-nano processing technology and are suitable for mass production. The metal heating wire is made on a silicon substrate with a certain thickness and atomization micropores. Finally, the processed MEMS silicon-based heating sheet is assembled and integrated onto the porous ceramic core to form a whole. The silicon substrate has a certain thickness to protect the porous ceramic core from being damaged by the conductive column. The metal heating wire is evenly and widely covered on the silicon substrate, and is transferred to the porous ceramic core through heat distribution and heat conduction on the silicon substrate, so that the porous ceramic core is heated more evenly, the atomization area is larger, the atomization amount is increased, and the dry burning phenomenon is reduced. The atomization micropores on the silicon substrate can be precisely processed to several microns or even sub-micron levels, effectively locking the atomized liquid seeping out of the ceramic core to prevent leakage.

[0053] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet, characterized in that: The atomization core structure comprises: a silicon-based heating plate (1) and a porous ceramic core (2), wherein the silicon-based heating plate (1) comprises a heating wire (11) and a silicon-based substrate (12), wherein the heating wire (11) is manufactured on the surface of the silicon-based substrate (12), and the silicon-based substrate (12) is provided with atomization micropores (121) arranged in an array, and the silicon-based substrate (12) is fixedly mounted on the porous ceramic core (2), and the atomization micropores (121) are connected to the porous ceramic core (2); The manufacturing method of the atomizer core structure comprises the following steps: S1, preparing a silicon-based substrate (12); S2, depositing metal on the silicon-based substrate (12), and making a specific pattern by dry etching or wet etching process to form a heating wire (11); S3, etching atomized micropores (121) on the silicon-based substrate (12); S4, thinning the back side of the silicon-based substrate (12) to expose the atomization micropores (121) on the front side, thereby forming a silicon-based heating plate (1); S5, laminating the silicon-based heating plate (1) and the porous ceramic core (2) to form an atomizing core; In the step S5, the silicon-based heating plate (1) and the porous ceramic core (2) are directly bonded together or bonded together by a glass paste bonding process or a metal eutectic process; A high temperature pad is added between the silicon-based heating plate 1 and the porous ceramic core 2, and the high temperature pad comprises cotton material.

2. The method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet according to claim 1, characterized in that: The thickness of the silicon-based substrate (12) is 5-400 microns.

3. A method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet according to claim 1 or 2, characterized in that: The diameter of the atomization micropores (121) is 2-20 micrometers.

4. The method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet according to claim 3, characterized in that: The atomization micropores (121) are round holes or square holes.

5. The method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet according to claim 1, characterized in that: In step S2, the deposited metal is any one of Al, Ti / Au, Ti / Pt, Ti / TiN / Au, Ti / TiN / Pt, Ta / Au, Ta / Pt, Ta / TaN / Au, and Ta / TaN / Pt.

6. The method for manufacturing an atomizer core structure based on a MEMS silicon-based heating sheet according to claim 1, characterized in that: In the step S3, the atomized micropores (121) are etched using a dry etching process or a wet etching process.

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