A method for treating exhaust gas based on a combination of microwaves and plasma

Abstract

The application provides a method for comprehensively treating waste gas based on microwaves and plasma, and relates to the technical field of waste gas treatment, and comprises the following steps: obtaining waste gas to be treated from an air inlet; treating the waste gas to be treated under the action of microwaves and plasma based on a preset period; and discharging the treated gas from an air outlet. The application realizes the treatment of waste gas under the joint action of a microwave source and high-pressure plasma, avoids mutual interference between microwaves and plasma, has a simple device structure, and has high waste gas treatment efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of waste gas treatment, in particular to a method for comprehensively treating waste gas based on microwaves and plasma. BACKGROUND

[0002] With the continuous development of the scale of industrial manufacturing enterprises in China, environmental pollution caused by industrial waste gas is one of the important sources of environmental pollution at present. A large amount of organic and inorganic substances harmful to human body in industrial waste gas are directly discharged into the atmosphere, which can cause serious harm to the environment and human body. Therefore, the treatment technology of waste gas has attracted people's attention.

[0003] The current treatment method of chemical industry waste gas mainly includes thermal combustion, catalytic combustion, absorption and adsorption, condensation recovery, biological treatment and corona discharge. Moreover, these methods are mainly suitable for single plasma treatment technology or microwave treatment technology to treat waste gas.

[0004] However, the existing technology has the problems of low treatment efficiency, high treatment cost and inability to solve the mutual interference between multiple treatment methods. SUMMARY

[0005] The present application aims to solve the problem of easy coking on the anode plate in the existing plasma waste gas treatment process, which reduces the efficiency of plasma treatment of waste gas.

[0006] To achieve the above-mentioned purpose, the technical solutions adopted by the embodiments of the present application are as follows:

[0007] In a first aspect, the present application provides a method for comprehensively treating waste gas based on microwaves and plasma, comprising:

[0008] obtaining the waste gas to be treated from the gas inlet;

[0009] treating the waste gas to be treated under the action of microwaves and plasma based on a preset period;

[0010] discharging the treated gas from the gas outlet.

[0011] Optionally, the preset period includes a first period and a second period; the waste gas to be treated is treated under the action of microwaves and plasma based on the first period and the second period.

[0012] Optionally, the treatment of the waste gas to be treated under the action of microwaves and plasma based on the first period and the second period comprises:

[0013] The microwave is used to treat the waste gas to be treated in the first period, and the plasma is used to treat the waste gas to be treated in the second period.

[0014] Optionally, the treating the waste gas to be treated in the second period by using the plasma comprises:

[0015] Under the action of the negative high-voltage direct current power supply, the plasma is generated between the core wire and the cavity wall.

[0016] Under the action of the plasma, the waste gas to be treated is treated in the second period.

[0017] Optionally, the treating the waste gas to be treated in the first period by using the microwave comprises:

[0018] The microwave is generated under the action of the microwave source, and the microwave is used to treat the waste gas to be treated in the first period.

[0019] Optionally, the obtaining the waste gas to be treated from the air inlet comprises:

[0020] The fan obtains the waste gas to be treated from the air inlet at a preset air speed.

[0021] In a second aspect, the application further discloses a device for comprehensively treating waste gas based on microwaves and plasma, which comprises a cavity, an air inlet, an air outlet, a negative high-voltage direct current power supply, a microwave source and a core wire.

[0022] The microwave source is arranged outside the cavity, the positive pole of the negative high-voltage direct current power supply is connected with the core wire, and the negative pole of the negative high-voltage direct current power supply is connected outside the cavity; the waste gas enters the reaction cavity from the air inlet and is treated under the joint action of the microwave source, the negative high-voltage direct current power supply and the core wire, and the treated gas is discharged from the air outlet.

[0023] In a third aspect, the application further discloses a device for comprehensively treating waste gas based on microwaves and plasma, which comprises an obtaining module, a treating module and an outputting module.

[0024] The obtaining module is used for obtaining the waste gas to be treated from an air inlet.

[0025] The treating module is used for treating the waste gas to be treated under the action of microwaves and plasma based on a preset period.

[0026] The outputting module is used for discharging the treated gas from an air outlet.

[0027] In a fourth aspect, the present application also discloses an electronic device, comprising a processor and a memory, wherein the memory is configured to store instructions, and the processor is configured to execute the instructions stored in the memory, so that the device executes the method for treating waste gas based on microwave and plasma as described in the first aspect.

[0028] In a fifth aspect, the present application also discloses a computer readable storage medium, wherein the computer readable storage medium stores computer execution instructions, and when the instructions are executed, the computer executes the method for treating waste gas based on microwave and plasma as described in the first aspect.

[0029] The method for treating waste gas based on microwave and plasma provided by the present application comprises the following steps: obtaining waste gas to be treated from an air inlet; treating the waste gas to be treated based on a preset period under the action of microwave and plasma; and discharging the treated gas from an air outlet. That is, the waste gas to be treated is treated in a time sequence manner based on a microwave source and high-voltage plasma, so that the mutual interference between the microwave and the plasma is effectively avoided, the device structure is simple, and the waste gas treatment efficiency is high. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0031] Figure 1 The method for treating waste gas based on microwave and plasma provided by the present application comprises the following steps: obtaining waste gas to be treated from an air inlet; treating the waste gas to be treated based on a preset period under the action of microwave and plasma; and discharging the treated gas from an air outlet. That is, the waste gas to be treated is treated in a time sequence manner based on a microwave source and high-voltage plasma, so that the mutual interference between the microwave and the plasma is effectively avoided, the device structure is simple, and the waste gas treatment efficiency is high.

[0032] Figure 2 The device for treating waste gas based on microwave and plasma provided by the present application comprises the following steps: obtaining waste gas to be treated from an air inlet; treating the waste gas to be treated based on a preset period under the action of microwave and plasma; and discharging the treated gas from an air outlet. That is, the waste gas to be treated is treated in a time sequence manner based on a microwave source and high-voltage plasma, so that the mutual interference between the microwave and the plasma is effectively avoided, the device structure is simple, and the waste gas treatment efficiency is high.

[0033] Figure 3 The device for treating waste gas based on microwave and plasma provided by the present application comprises the following steps: obtaining waste gas to be treated from an air inlet; treating the waste gas to be treated based on a preset period under the action of microwave and plasma; and discharging the treated gas from an air outlet. That is, the waste gas to be treated is treated in a time sequence manner based on a microwave source and high-voltage plasma, so that the mutual interference between the microwave and the plasma is effectively avoided, the device structure is simple, and the waste gas treatment efficiency is high.

[0034] Figure 4 The device for treating waste gas based on microwave and plasma provided by the present application comprises the following steps: obtaining waste gas to be treated from an air inlet; treating the waste gas to be treated based on a preset period under the action of microwave and plasma; and discharging the treated gas from an air outlet. That is, the waste gas to be treated is treated in a time sequence manner based on a microwave source and high-voltage plasma, so that the mutual interference between the microwave and the plasma is effectively avoided, the device structure is simple, and the waste gas treatment efficiency is high. DETAILED DESCRIPTION

[0035] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0037] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0038] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the present application is usually placed, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation and cannot be understood as indicating or implying relative importance.

[0039] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0040] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] First, the terms involved in the present application are explained:

[0042] Plasma: Plasma is a collection of charged positive particles, negative particles (including positive ions, negative ions, electrons, free radicals and active groups, etc.), in which the positive and negative charges are equal, so it is called plasma, which is electrically neutral in macroscopic. Plasma is composed of electrons, ions, free radicals and neutral particles, and is an electrically conductive fluid that is electrically neutral overall.

[0043] Electrode: refers to a component in an electronic or electrical device, equipment, used as a two-end input or output current in a conductive medium (solid, gas, vacuum or electrolyte solution). The electrode that inputs current is called anode or positive electrode, and the electrode that outputs current is called cathode or negative electrode.

[0044] Figure 1 The method flowchart provided by an embodiment of the present application for treating waste gas based on microwave and plasma is shown in the figure; Figure 2 The device schematic diagram provided by another embodiment of the present application for treating waste gas based on microwave and plasma is shown in the figure; Figure 3 The device schematic diagram provided by another embodiment of the present application for treating waste gas based on microwave and plasma is shown in the figure; Figure 4 The schematic diagram of the plasma waste gas treatment equipment provided by another embodiment of the present application is shown in the figure. The following will be combined Figures 1 to 4 The method for treating waste gas based on microwave and plasma provided by the embodiment of the present application will be described in detail.

[0045] The technical solutions in the embodiments of the present application will be clearly and completely described in the following with reference to the drawings in the embodiments of the present application.

[0046] It should be understood that the specific embodiments described herein are only used to explain the present application, and are not used to limit the present application.

[0047] The embodiment of the present application provides a method for treating waste gas based on microwave and plasma, which is applied to a waste gas treatment equipment. The following will be combined Figure 1 The steps included in the method will be specifically introduced.

[0048] Step 101: obtaining the waste gas to be treated from the air inlet.

[0049] Optionally, the fan obtains the waste gas to be treated from the air inlet at a preset air speed.

[0050] In the embodiment of the present application, the waste gas to be treated includes oxygen O2, nitrogen N2, volatile organic compounds (VOCs), carbon monoxide CO, ammonia NH3 and hydrogen sulfide H2S, ozone O3 and unbearable odor or gas that makes people feel unpleasant.

[0051] Illustratively, a fan is installed at the air inlet of the waste gas treatment device, and under the action of the fan, the waste gas to be treated enters the metal canning cavity at a preset speed, and under the open state of the microwave source and the negative high-voltage direct current source, the plasma generated between the core wire and the inner wall of the cavity treats the waste gas to be treated.

[0052] Step 102: based on a preset period, the waste gas to be treated is treated under the action of microwaves and plasma.

[0053] In the embodiment of the application, the microwave refers to an electromagnetic wave with a frequency of 300MHz-300GHz, which is a limited frequency band of radio waves, i.e. an electromagnetic wave with a wavelength of 0.1mm-1m. The microwave frequency is higher than the general radio wave frequency, and is usually also called "ultra-high frequency electromagnetic wave". As an electromagnetic wave, the microwave also has wave-particle duality. The basic properties of microwaves usually exhibit three characteristics of penetration, reflection and absorption. For glass, plastic and porcelain, microwaves are almost penetrated without being absorbed. For water and food, microwaves are absorbed to heat themselves. And for metal, microwaves are reflected.

[0054] Due to the characteristics of microwaves, the transmission distance of microwaves in air is short, but the maneuverability is good, the working frequency is wide, and in addition to the application of millimeter wave technology in 5G mobile communication, microwave transmission is mostly in metal waveguide and dielectric waveguide.

[0055] Plasma is a collection of charged positive particles and negative particles (including positive ions, negative ions, electrons, free radicals and active groups, etc.), in which the positive and negative charges are equal, so it is called plasma, which is electrically neutral in macroscopic view. Plasma is composed of electrons, ions, free radicals and neutral particles, and is an electrically conductive fluid that maintains electrical neutrality as a whole.

[0056] Optionally, the preset period includes a first period and a second period; and the waste gas to be treated is treated based on the first period and the second period under the action of microwaves and plasma.

[0057] In the embodiment of the application, the first period is the time length of treating the waste gas to be treated by microwaves. Optionally, the first period can be set according to the actual processing needs of the user. Correspondingly, the second period is the time length of treating the waste gas to be treated by plasma. Optionally, the second period can be set according to the actual processing needs of the user. The first period and the second period can be the same or different, thereby improving the intelligence of the system.

[0058] Illustratively, under the open state of the negative high-voltage direct current source, the plasma is generated between the core wire and the inner wall of the cavity. The plasma acts on the waste gas to be treated entering the cavity in the second period to treat the waste gas to be treated.

[0059] Optionally, the waste gas to be treated is treated by using plasma in the second period, comprising:

[0060] Under the action of the negative high-voltage direct current power supply, the plasma is generated between the core wire and the cavity wall.

[0061] Under the action of the plasma, the waste gas to be treated is treated in the second period.

[0062] In the embodiment of the present application, in the second preset period, the waste gas to be treated entering the metal tank cavity generates plasma between the core wire and the inner wall of the cavity under the opening state of the negative high-voltage direct current power supply, and the plasma acts on the waste gas to be treated entering the cavity in the second period to treat the waste gas to be treated. The microwave treatment of waste gas and the plasma treatment of waste gas treat the waste gas according to the time sequence, which avoids the mutual interference between the microwave source and the plasma when they are treated at the same time, thereby reducing the service life of the microwave source.

[0063] Optionally, the waste gas to be treated is treated based on the first period under the action of the microwave, comprising:

[0064] Under the action of the microwave source, the microwave is generated, and the microwave treats the waste gas to be treated in the first period.

[0065] In the embodiment of the present application, the waste gas to be treated enters the metal tank cavity at a preset speed under the action of the fan from the air inlet, and the microwave is generated under the action of the microwave source to act on the waste gas to be treated in the first period.

[0066] It should be noted that under the action of the negative high-voltage direct current power supply, a large number of positive ions and negative ions are generated by ionizing air, and the number of negative ions is greater than that of positive ions. Therefore, in the present application, the negative high-voltage power supply is used to increase the concentration of negative ions. At the same time, under the high-voltage condition, the non-elastic collision between high-energy ions and gas molecules or atoms can be improved to generate free radicals, the reaction efficiency of free radicals and waste gas molecules is improved, the discharge time is increased, and the treatment efficiency of the waste gas is improved.

[0067] Step 103: discharging the treated gas from the air outlet.

[0068] In the embodiment of the present application, after the waste gas to be treated is treated by the microwave or the plasma, the generated harmless gas such as water vapor, carbon dioxide and oxygen is discharged from the air outlet. Further, a filter screen is arranged at the outlet of the waste gas treatment device, and the filter screen is used to filter the particulate matter generated after the reaction of the waste gas molecules. The filter screen is replaceable, thereby facilitating the later maintenance.

[0069] It should be noted that the gas inlet and the treatment port of the waste gas treatment device are respectively provided with a metal mesh, and the aperture of the metal mesh is less than or equal to 3 mm. Here, in order to prevent microwave leakage, the gas inlet and the gas outlet of the waste gas treatment device are respectively provided with a metal mesh. When the human body is close to the microwave radiation source for a long time, dizziness, sleep disorders, memory loss, bradycardia, and blood pressure drop may occur due to excessive radiation energy. When the microwave leakage reaches 1 mw / cm 2 , the eyes will suddenly feel blurred, the vision will decrease, and even cataracts will be caused. In order to protect the health of the user, the metal mesh is arranged at the inlet and outlet of the reaction cavity. The corners may produce microwave discharge under the action of the microwave, and dangerous accidents are prone to occur. The metal mesh can block the microwave leakage, reduce the harm of the microwave to the human body, and improve the safety of the system.

[0070] In the embodiment of the present application, the method for comprehensively treating waste gas based on microwave and plasma, and the waste gas treatment device, comprise: obtaining the waste gas to be treated from the gas inlet; treating the waste gas to be treated based on the preset period under the action of the microwave and the plasma; and discharging the treated gas from the gas outlet. That is, the waste gas to be treated is treated in a time sequence manner based on the microwave source and the high-voltage plasma, so as to effectively avoid the mutual interference between the microwave and the plasma, the device structure is simple, and the waste gas treatment efficiency is high.

[0071] In another possible embodiment, the present application further provides a device for comprehensively treating waste gas based on microwave and plasma, as shown in Figure 2 , the device comprises: a cavity 1, a gas inlet 2, a gas outlet 3, a negative high-voltage direct current power supply 4, a microwave source 5, and a core wire 6.

[0072] The microwave source 5 is arranged outside the cavity; the positive electrode of the negative high-voltage direct current power supply 4 is connected with the core wire 6; the negative electrode of the negative high-voltage direct current power supply 4 is connected outside the cavity 1; the waste gas enters the cavity 1 from the gas inlet, and is treated under the joint action of the microwave source 5, the negative high-voltage direct current power supply 4, and the core wire 6, and the treated gas is discharged from the gas outlet.

[0073] It should be noted that the same steps and the same content in the present embodiment and other embodiments are described with reference to the description of other embodiments, and will not be described here.

[0074] In the embodiment of the present application, the device for treating waste gas based on microwave and plasma in the present application comprises: a cavity 1, an air inlet 2, an air outlet 3, a negative high-voltage direct current power supply 4, a microwave source 5 and a core wire 6; wherein the microwave source 5 is arranged outside the cavity 1; the positive pole of the negative high-voltage direct current power supply 4 is connected with the core wire 6; the negative pole of the negative high-voltage direct current power supply 4 is connected outside the cavity 1; the waste gas enters the cavity 1 from the air inlet 2 and is treated under the joint action of the microwave source 5, the negative high-voltage direct current power supply 4 and the core wire 6, and the treated gas is discharged from the air outlet 3. That is, the present application treats the waste gas to be treated in a time sequence manner based on the microwave source and the high-voltage plasma, thereby effectively avoiding the mutual interference between the microwave and the plasma, the device structure is simple, and the waste gas treatment efficiency is high.

[0075] As shown in Figure 3 , it is a device for treating waste gas based on microwave and plasma provided in another embodiment of the present application. The device comprises: an acquisition module 301, a processing module 302 and an output module 303,

[0076] The acquisition module 301 is used for acquiring the waste gas to be treated from the air inlet.

[0077] The processing module 302 is used for treating the waste gas to be treated under the action of the microwave and the plasma based on a preset period.

[0078] The output module 303 is used for discharging the treated gas from the air outlet.

[0079] It should be noted that the same steps and the same content in the present embodiment and other embodiments are described with reference to the description of other embodiments, and will not be described here.

[0080] In the embodiment of the present application, the device for treating waste gas based on microwave and plasma in the present application comprises: an acquisition module 301, a processing module 302 and an output module 303, the acquisition module 301 is used for acquiring the waste gas to be treated from the air inlet; the processing module 302 is used for treating the waste gas to be treated under the action of the microwave and the plasma based on a preset period; and the output module 303 is used for discharging the treated gas from the air outlet. That is, the present application treats the waste gas to be treated in a time sequence manner based on the microwave source and the high-voltage plasma, thereby effectively avoiding the mutual interference between the microwave and the plasma, the device structure is simple, and the waste gas treatment efficiency is high.

[0081] Figure 4 It is a device for treating waste gas based on microwave and plasma provided in another embodiment of the present application. The device is integrated in a terminal device or a chip of a terminal device.

[0082] The device comprises: a memory 401 and a processor 402.

[0083] The memory 401 is configured to store a program, and the processor 402 invokes the program stored in the memory 401 to execute the above-mentioned method embodiments for treating waste gas based on microwave and plasma. The specific implementation and technical effects are similar, and will not be repeated here.

[0084] Preferably, the present application also provides a program product, for example, a computer readable storage medium, comprising a program which, when executed by a processor, is configured to perform the above-mentioned method embodiments.

[0085] In several embodiments provided by the present application, it should be understood that the disclosed apparatus and method can be implemented in other manners. For example, the embodiments of the apparatus described above are merely schematic; for example, the division of the units is only a logical function division; there can be another division manner in actual implementation; for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between different units, can be indirect couplings or communication connections through some interfaces, devices or units, and can be electric, mechanical or in other forms.

[0086] In addition, each function unit in the embodiments of the present application can be integrated into a processing unit, or each unit can exist alone physically, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be realized in the form of hardware, or in the form of hardware plus software function units.

[0087] The integrated unit realized in the form of software function units can be stored in a computer readable storage medium. The above-mentioned software function unit stored in a storage medium includes a plurality of instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor (English: processor) to execute part of the steps of the method of each embodiment of the present application. The aforementioned storage medium includes a U disk, a mobile hard disk, a read-only memory (English: Read-Only Memory, abbreviated as: ROM), a random access memory (English: Random Access Memory, abbreviated as: RAM), a magnetic disk or an optical disk, and various media that can store program codes.

Claims

1. A method for treating waste gas based on a combination of microwave and plasma technologies, characterized in that, include: The exhaust gas to be treated is obtained from the air inlet; The waste gas to be treated is treated by alternating microwave and plasma according to a preset cycle; The treated gas is discharged from the outlet.

2. The method according to claim 1, characterized in that, The preset period includes a first period and a second period; Microwave treatment is used in the first cycle, and plasma treatment is used in the second cycle.

3. The method according to claim 2, characterized in that, The process of treating the waste gas with plasma during the second cycle includes: Under the action of a negative high voltage DC power supply, plasma is generated between the core wire and the cavity wall; The plasma is used to treat the waste gas.

4. The method according to claim 2, characterized in that, The step of treating the waste gas with microwaves during the first cycle includes: generating microwaves through a microwave source to treat the waste gas.

5. The method according to claim 1, characterized in that, The process of obtaining the waste gas to be treated from the air inlet includes: The fan draws exhaust gas from the air inlet at a preset air speed.

6. An electronic device, characterized in that, include: Processor, memory; The memory stores computer program instructions; When the processor executes the instructions, it implements the method as described in any one of claims 1-5.

7. A computer-readable storage medium, characterized in that, It stores computer program instructions; When the instructions are executed by the processor, the method as described in any one of claims 1-5 is implemented.

Images