An organic light emitting display panel and a manufacturing method thereof
By setting grooves on the substrate and filling them with a material with poor conductivity, the problem of lateral leakage crosstalk in the charge generation layer of silicon-based OLEDs was solved, achieving high current-emitting power and good flatness, and extending device life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HEFEI BOE ZHUOYIN TECH CO LTD
- Filing Date
- 2021-10-19
- Publication Date
- 2026-05-29
AI Technical Summary
In existing technologies, silicon-based OLEDs are prone to lateral leakage crosstalk in AR/VR applications due to the small pixel pitch, and the mask process is complex and easily deformed, affecting the shape of the display panel.
By setting grooves on the substrate and filling them with first and second fillers with poor conductivity, a partition space and a device layer are formed by vacuum evaporation, which eliminates lateral leakage crosstalk and maintains the flatness of the display panel.
It improves the power efficiency of current emission, maintains good flatness, simplifies the processing steps, and extends the device life.
Smart Images
Figure CN113964162B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of organic light-emitting display technology, and in particular to an organic light-emitting display panel and its manufacturing method. Background Technology
[0002] OLED (Organic Light Emitting Diode) features all-solid-state operation, self-emissive technology, high contrast, and wide viewing angles, making it the next-generation flat panel display technology after LCD (Liquid Crystal Display). Silicon-based OLEDs are becoming increasingly widespread in AR / VR applications. High-brightness products generally use stacked OLED white light devices. However, because the pixel density (ppi) is too high (>2000), the pixel pitch is too small (~1µm), and the charge generation layer used in the stacked devices has strong conductivity, crosstalk between pixels is easily generated due to lateral leakage of the charge generation layer.
[0003] To prevent crosstalk caused by lateral leakage of functional layers, some functional layers need to be isolated. The existing technology uses a mask, but using a mask requires a complex mesh stretching process, and the mask is prone to deformation during use or may not adhere tightly to the substrate, resulting in a shadow effect and affecting the overall shape of the organic light-emitting display panel. Summary of the Invention
[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. To this end, the present invention proposes an organic light-emitting display panel and a method for manufacturing the same, which can effectively eliminate the unevenness of the organic light-emitting display panel's topography.
[0005] In a first aspect, the present invention provides an organic light-emitting display panel, comprising:
[0006] A substrate, wherein a plurality of grooves are provided on the upper surface of the substrate, and a first filler is disposed in the grooves;
[0007] A first device layer is located on the upper surface of the substrate and forms a partition space at the position corresponding to the groove, and a second filler is disposed in the partition space;
[0008] The second device layer is located on the first device layer and the second filler.
[0009] Optionally, the first device layer includes an anode layer, a first hole transport layer, and a charge generation layer sequentially disposed on the substrate.
[0010] Optionally, the second device layer includes a second hole transport layer, an electron transport layer, and a cathode layer sequentially disposed on the charge generation layer.
[0011] Optionally, the first filler and the second filler are made of the same material as the second hole transport layer.
[0012] Optionally, the cross-sectional shape of the groove is approximately spherical, and the groove includes an inner cavity and a slot flush with the upper surface of the substrate. The orthographic projection of the slot on the substrate is located within the orthographic projection range of the inner cavity on the substrate.
[0013] Optionally, the bottom of the groove is provided with a third device layer with the same structure as the first device layer. The third device layer is located within the orthographic projection range of the groove on the substrate. The first filler fills the inner cavity and contacts the inner wall of the inner cavity.
[0014] Secondly, the present invention provides a method for manufacturing an organic light-emitting display panel, the method comprising:
[0015] Provide a substrate;
[0016] A groove is formed on the upper surface of the substrate;
[0017] A first device layer is patterned on the substrate, and a partition space is formed at the position corresponding to the groove.
[0018] A first filler is formed within the groove;
[0019] A second filling material is formed within the partitioned space;
[0020] A second device layer is formed above the first device layer and the second filler.
[0021] Optionally, the first filler and the second filler are formed in the groove by vacuum evaporation. During the formation of the first filler and the second filler, the substrate is controlled to reciprocate and rotate by an angle θ about the central axis of the groove. The angle θ is 0°-90°.
[0022] Optionally, during the formation of the first device layer and the second device layer, the angle θ is kept at 0°.
[0023] Optionally, during any stage of forming the first device layer, the first filler, the second filler, or the second device layer, the substrate is controlled to rotate in its plane.
[0024] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
[0025] The solution of this application creates a barrier between the working areas of the first device layer through grooves, preventing current from flowing between the working areas and eliminating crosstalk caused by lateral leakage current. At the same time, the first and second fillers fill the grooves and the barrier space, which can play a good supporting role and keep the shape of the second device layer flat. This organic light-emitting display board is easy to process and can maintain good flatness, thereby improving the efficiency and performance of the device product. Attached Figure Description
[0026] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:
[0027] Figure 1 This illustration shows a structural diagram of an organic light-emitting display panel with a collapsed cathode layer, as provided in an embodiment of this application.
[0028] Figure 2 A schematic diagram of the structure of the organic light-emitting display panel provided in an embodiment of this application is shown.
[0029] Figure 3 This illustration shows a schematic diagram of the structure of an organic light-emitting display panel provided in an embodiment of this application, where the first filler and the second filler are made of the same material.
[0030] Figure 4 A functional layered schematic diagram of an organic light-emitting display panel provided in an embodiment of this application is shown.
[0031] Figures 5-10 A schematic diagram of the manufacturing process of the organic light-emitting display panel provided in the embodiments of this application is shown.
[0032] Figure 11 A schematic diagram showing a projection blind zone in conventional vacuum evaporation provided in an embodiment of this application is shown.
[0033] Figure 12 A schematic diagram of the structure of the substrate when the first filler is tilted during vacuum evaporation according to an embodiment of this application is shown.
[0034] Figure 13 An exemplary flowchart of an organic light-emitting display panel manufacturing method provided in an embodiment of this application is shown.
[0035] Figure label:
[0036] 1000-Organic Light Emitting Diode Display Panel
[0037] 10-Substrate, 101-Groove
[0038] 20-First device layer, 201-Isolation space, 202-Anode layer, 203-First hole transport layer, 204-Charge generation layer.
[0039] 30 - Second device layer, 301 - Second hole transport layer, 302 - Electron transport layer, 303 - Cathode layer
[0040] 40 - Third device layer
[0041] 50 - First filler,
[0042] 60 - Second filler. Detailed Implementation
[0043] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0044] In the description of this application, it should be understood that the terms "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," and "horizontal," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0045] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0046] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.
[0047] refer to Figure 1The diagram shows a stacked organic light-emitting display panel, which includes multiple functional layers stacked sequentially. To prevent crosstalk caused by lateral leakage of functional layers, some functional layers need to be isolated. In the prior art, a mask is used, but using a mask requires a complex mesh stretching process. Furthermore, the mask is prone to deformation during use or may not adhere tightly to the substrate 10, resulting in a shadow effect and affecting the overall shape of the organic light-emitting display panel 1000.
[0048] This application first provides an organic light-emitting display panel 1000, referencing... Figure 2 The organic light-emitting display panel 1000 includes,
[0049] The substrate 10 has a plurality of grooves 101 on its upper surface, and a first filler 50 is disposed in the grooves 101.
[0050] The first device layer 20 is located on the upper surface of the substrate 10 and forms a partition space 201 at the position corresponding to the groove 101. A second filler 60 is disposed in the partition space 201.
[0051] The second device layer 30 is located on the first device layer 20 and the second filler 60.
[0052] The first device layer 20 on the substrate 10 is divided into two working areas by a groove 101. The groove 101 isolates the working areas of the first device layer 20, preventing current from flowing between them and eliminating crosstalk caused by lateral leakage. At the same time, the first filler 50 and the second filler 60 fill the groove 101 and the partition space 201, providing good support and keeping the second device layer 30 flat. This organic light-emitting display panel 1000 is easy to process and can maintain good flatness, improving the efficiency and performance of the device product.
[0053] It should be noted that the first filler 50 and the second filler 60 can be made of materials with poor electrical conductivity, including but not limited to any one of poly(p-phenylenevinyl) compounds, polythiophene compounds, polysilane compounds, triphenylmethane compounds, triarylamine compounds, hydrazone compounds, pyrazoline compounds, chezolium compounds, carbazole compounds, and butadiene compounds.
[0054] It should be noted that the first filler 50 fills the entire groove 101 and makes a sealed contact with the inner wall of the groove 101, thus eliminating any remaining space in the groove 101. The upper surface of the first filler 50 is flush with the upper surface of the substrate 10. Here, flush connection means that the upper surface of the first filler 50 is flush with the upper surface of the substrate 10, and the contact position between the upper surface of the first filler 50 and the upper surface of the substrate 10 is close to zero gap, ensuring that the functional layer above the substrate 10 and the first filler 50 can maintain a flat shape at the groove opening.
[0055] A second filler 60 is provided inside the partition space 201. The second filler 60 has the same function as the first filler 50, which is to fill the partition space 201. The upper surface of the second filler 60 is flush with the upper surface of the first device layer 20. It should be noted that the flush connection here has the same meaning as the flush connection between the first filler 50 and the upper surface of the substrate 10, so that the functional layer above the first device layer 20 and the second filler 60 can maintain a flat shape.
[0056] In some embodiments of this application, such as Figure 1 As shown, the first device layer 20 includes an anode layer 202, a first hole transport layer 203 and a charge generation layer 204 sequentially disposed on the substrate 10.
[0057] Specifically, the first device layer 20 may include an anode layer 202, an ITO layer, a pixel defining layer, a first hole transport layer 203 and a charge generation layer 204 sequentially disposed on the substrate 10. The material of the substrate 10 may be any one of SiN, SiO or SiON.
[0058] The anode layer 202 can be formed by magnetron sputtering or vacuum evaporation, and the first hole transport layer 203 and the charge generation layer 204 can be formed by vacuum evaporation.
[0059] In some embodiments of this application, the second device layer 30 includes a second hole transport layer, an electron transport layer, and a cathode layer 303 sequentially disposed on the charge generation layer 204.
[0060] Specifically, the second device layer 30 may include a second hole injection layer, a second hole transport layer, a red light-emitting layer, a green light-emitting layer, an electron transport layer, an electron injection layer, a cathode layer 303, an organic capping layer, and a chemical vapor deposition (CVD) layer sequentially disposed on the charge generation layer 204, wherein the material of the CVD layer includes any one of SiON, SiN, or SiO.
[0061] This embodiment provides an organic light-emitting display panel 1000, such as Figure 4 As shown, based on the above structure, it includes, in sequence, an anode layer 202, a first hole injection layer, a first hole transport layer 203, a resistive blocking layer, a blue light-emitting layer, a hole blocking layer, a charge generation layer 204, a second hole injection layer, a second hole transport layer, a red light-emitting layer, a green light-emitting layer, an electron transport layer, an electron injection layer, a cathode layer 303, an organic capping layer, and a CVD layer disposed on the substrate 10.
[0062] Compared to the traditional OLED display panel 1000, this OLED display panel 1000 has extremely high current luminous power efficiency, which can increase exponentially with the number of devices. When tested at the same current density, the aging mechanism of this OLED display panel 1000 is similar to that of the traditional OLED display panel 1000. However, the initial brightness of this OLED display panel 1000 can become very large with a very small driving current, making it very suitable for lighting applications. If converted to the same initial brightness, the lifespan of this OLED display panel 1000 is much longer than that of the traditional OLED display panel 1000.
[0063] The anode layer 202 can be formed by magnetron sputtering, the first hole injection layer to the organic capping layer can be formed by vacuum evaporation, and the CVD layer can be formed by chemical vapor deposition.
[0064] In some embodiments of this application, such as Figure 3 As shown, the first filler 50 and the second filler 60 are made of the same material as the second hole transport layer, and the three are an integral structure that can be integrally formed during the manufacturing process, simplifying the processing steps.
[0065] In some embodiments of this application, see Figure 1 and Figure 11 The cross-sectional shape of the groove 101 is approximately spherical. The groove 101 includes an inner cavity and a slot flush with the upper surface of the substrate 10. The orthographic projection of the slot on the substrate 10 is located within the orthographic projection range of the inner cavity on the substrate 10.
[0066] To better isolate the charge generation layer 204, the cross-section of the groove 101 is approximately spherical. During the formation of the charge generation layer 204, particles are shot straight towards the groove 101 and fall into the projection area of the groove opening onto the substrate 10. At the same time, a significant projection blind zone D is generated between the particles and the inner wall of the groove 101. The charge generation layer 204 will not be formed in the projection blind zone D. Thus, the charge generation layer 204 in the first device layer 20 is isolated at the groove 101, and crosstalk will not occur between pixels due to lateral leakage of the charge generation layer 204.
[0067] Furthermore, the shape of the cross-section of the groove 101 is not specifically limited, but the inner wall of the groove 101 needs to be concave inward. In addition to the cross-section being approximately spherical, it can also be trapezoidal, where the upper short side of the trapezoid is in the direction of the groove opening, the lower long side is in the direction of the groove bottom, and the two sides of the trapezoid are the two side walls of the groove 101.
[0068] Furthermore, the dimensions of the groove 101 are not specifically limited, and the diameter of the groove opening of the groove 101 can be 2um-1000um.
[0069] In some embodiments of this application, a third device layer with the same structure as the first device layer 20 is provided at the bottom of the groove 101. The third device layer is located within the orthographic projection range of the groove on the substrate 10. The first filler 50 fills the inner cavity and contacts the inner wall of the inner cavity.
[0070] A first filler 50 is provided inside the groove 101, and the first filler 50 covers the third device layer. It should be noted that the third device layer has the same structure as the first device layer 20. It is the part of the first device layer 20 that is deposited at the bottom of the groove 101 through the groove opening during vacuum evaporation.
[0071] In forming the various functional layers, the OLED display panel can be formed through vacuum evaporation or inkjet printing. Vacuum evaporation refers to a process in which the coating material (or film material) is evaporated and vaporized under vacuum conditions using a specific heating and evaporation method. The particles then travel in a straight line to the surface of the substrate 10 and condense to form a film. Figure 11 As the particles are in a linear motion state, some of the charge generation layer 204 particles condense into a film on the surface of the substrate 10, while another part of the charge generation layer 204 particles condense into a film at the bottom of the groove 101. The charge generation layer 204 particle films on the surface of the substrate 10 and at the bottom of the groove 101 are discontinuous, thus separating the charge generation layer 204. However, during the process of the particles being shot towards the groove 101, a projection blind zone D may also be formed with the inner cavity of the groove 101, and the groove 101 cannot be filled, resulting in residual space. Due to the existence of residual space, the particles of subsequent evaporation will always have gaps at the edge of the groove 101. At the same time, the coating thickness at the edge of the groove 101 is very thin. Under the combined effect of the above, the functional layer of the subsequent coating collapses at the groove 101, resulting in an uneven cathode morphology and cathode puncture.
[0072] In some embodiments of this application, during the formation of the first filler 50 and the second filler 60 by vacuum evaporation, in order to ensure that the vaporized material particles can fill the groove 101 and the partition space 201 and avoid generating a projection blind area D on the inner wall of the groove 101, the tilt angle of the substrate 10 is repeatedly adjusted during the vacuum evaporation process, such as... Figure 13 as well as Figures 5-10 As shown, the specific process is as follows:
[0073] Step 10: Form a groove 101 on the upper surface of the substrate 10 by etching process;
[0074] Step 20: The first device layer 20 is patterned on the substrate 10 by vacuum evaporation, and the partition space 201 is formed at the position corresponding to the groove 101;
[0075] Step 30: Form the first filler 50 in the groove 101 by vacuum evaporation;
[0076] Step 40 Cathode layer 303: A second filler 60 is formed in the partition space 201 by vacuum evaporation;
[0077] Step 50 Third device layer: The second device layer 30 is formed on top of the first device layer 20 and the second filler 60 by vacuum evaporation.
[0078] In some embodiments of this application, the substrate 10 can be made of a mixture of SiN and SiO. The etching process for forming the groove 101 on the substrate 10 is detailed below:
[0079] Step 101: First, SiO is deposited on the upper surface of the substrate 10 using CVD (Chemical Vapor Deposition) process, and then SiN is deposited.
[0080] Step 102: Expose and develop the substrate 10 to form a pattern, and dry etch to remove SiN and SiO;
[0081] Step 103: Taking advantage of the different etching ratios of SiN and Si, wet etching is used to remove part of the substrate 10 at the corresponding position of the pattern to form a groove 101. Taking advantage of the isotropic nature of the wet etching process, an inwardly concave arc surface or an inwardly concave slope surface is formed on the sidewall of the groove 101. The arc or slope can be freely realized according to the specific preset process parameters.
[0082] It should be noted that vacuum evaporation is a process in which the coating material is evaporated and vaporized under vacuum conditions using a specific heating and evaporation method. The particles fly to the surface of the substrate 10 in a linear motion and condense into a film. When performing the vacuum evaporation process on the substrate 10 to be evaporated, the substrate 10 to be evaporated is placed in a vacuum chamber, and then the evaporation target is heated so that the target molecules detach from the evaporation target and are ejected, and then attach to the substrate 10 to be evaporated to form the desired pattern.
[0083] During the pattern formation process, a mask can be used. Target molecules detach from the vapor deposition target and are emitted through the light-transmitting area of the mask to attach to the substrate 10 to be vapor-deposited, so as to form the desired pattern. For example, if the first device layer 20 needs to reserve a certain blank area on the surface of the substrate 10, a mask is placed in the blank area on the surface of the substrate 10. The opaque area of the mask blocks the blank area. After the vapor deposition is completed, the blank area on the surface of the substrate 10 will not be vapor-deposited with target molecules.
[0084] In some embodiments of this application, a vacuum chamber, a deposition target, and a heating unit are prepared during the vacuum evaporation process. The specific process of vacuum evaporation is as follows.
[0085] Step 201: Heat the vapor-deposited target of the first device layer 20 in a vacuum chamber using a heating unit;
[0086] Step 202: Place the substrate 10 horizontally inside the vacuum chamber and align the upper surface with the groove 101 with the vapor deposition target.
[0087] Step 203: The heated target molecules detach from the vapor-deposited target of the first device layer 20 and are ejected, adhering to the upper surface of the substrate 10 and the bottom of the groove 101.
[0088] Step 204: If the first device layer 20 includes multiple functional layers, then repeat steps 201-203 to sequentially deposit the vapor deposition target material corresponding to each functional layer.
[0089] In step 204, for example, if the first device layer 20 includes an anode layer 202, a first hole transport layer 203 and a charge generation layer 204 in sequence, then the target material of the anode layer 202 is first vapor-deposited, and then the first hole transport layer 203 and the charge generation layer 204 are vapor-deposited in sequence.
[0090] It should be noted that after the first device layer 20 is formed after the vapor deposition is completed, the first device layer 20 is distributed on the upper surface of the substrate 10 and the bottom of the groove 101. Since the bottom of the groove 101 is lower than the upper surface of the substrate 10, the first device layer 20 will be separated at the groove 101. The first device layer 20 has a certain thickness, so a part of the space will be formed above the groove opening of the groove 101 and between the first device layers 20. This part of the space is the partition space 201 described in this application.
[0091] In some embodiments of this application, such as Figure 12 As shown, the specific steps of vacuum evaporation deposition of the first filler 50 of this application include:
[0092] Step 301: The vapor deposition target of the first filler 50 is heated in the vacuum chamber by a heating unit;
[0093] Step 302: Place the substrate 10 horizontally (i.e., keep the angle θ at 0°) in the vacuum chamber and align the groove 101 with the vapor deposition target of the first filler 50. The heated target molecules detach from the vapor deposition target of the first filler 50 and are ejected, so that the target molecules adhere to the area corresponding to the groove 101.
[0094] Step 303: Control the substrate 10 to tilt and rotate 45° relative to the horizontal plane with the central axis of the groove 101 as the axis, so that the inner wall of the groove 101 is fully in contact with the target molecules, until the target molecules fill the groove 101 to form the first filler 50, so that the upper surface of the first filler 50 is flush with the groove opening of the groove 101 and flush with the upper surface of the substrate 10.
[0095] It should be noted that when the control base plate 10 reciprocates and rotates 45° relative to the horizontal plane with the central axis of the groove 101 as the axis, the base plate 10 can be driven by a motor to reciprocate within a certain angle range, or the motor can be driven by a crank rocker mechanism to reciprocate within a certain angle range. Taking the motor driving the base plate 10 to rotate as an example, specifically, a connecting plate is connected to the motor shaft, the base plate 10 is fixedly placed on the connecting plate, the motor is connected to a controller, and the controller controls the motor to reciprocate, and the angle of reciprocation is 45°.
[0096] In some embodiments of this application, the specific steps of vacuum evaporation of the second filler 60 include:
[0097] Step 401: The vapor deposition target of the second filler 60 is heated in the vacuum chamber by a heating unit;
[0098] Step 402: Place the substrate 10 horizontally in the vacuum chamber and align the partition space 201 with the vapor deposition target of the second filler 60. The heated target molecules detach from the vapor deposition target of the second filler 60 and are ejected, so that the target molecules adhere to the area corresponding to the partition space 201.
[0099] Step 403: Control the substrate 10 to tilt and rotate 45° relative to the horizontal plane with the central axis of the groove 101 or the central axis of the single space as the axis, so that the interior of the partition space 201 is fully in contact with the target molecules, until the target molecules fill the partition space 201 to form the second filler 60, so that the upper surface of the second filler 60 is flush with the upper opening of the partition space 201 and flush with the upper surface of the first device layer 20.
[0100] In some embodiments of this application, the specific steps of vacuum evaporation for depositing the second device layer 30 include:
[0101] Step 501: The vapor-deposited target of the second device layer 30 is heated in a vacuum chamber by a heating unit;
[0102] Step 502: Place the substrate 10 horizontally inside the vacuum chamber and align the surface of the first device layer 20 with the vapor deposition target.
[0103] Step 503: The heated target molecules detach from the vapor-deposited target of the second device layer 30 and are ejected, adhering to the first device layer 20 and the second filler 60.
[0104] Step 504: If the second device layer 30 includes multiple functional layers, then repeat steps 50-3 device layer 1 to 50-3 device layer 3, and sequentially deposit the vapor deposition target corresponding to each functional layer.
[0105] In step 504, for example, if the second device layer 30 includes a second hole transport layer, an electron transport layer and a cathode layer 303 in sequence, then the target material for the second hole transport layer is first vapor-deposited, and then the electron transport layer and the cathode layer 303 are vapor-deposited in sequence.
[0106] By controlling the reciprocating rotation of the substrate 10, the interior of the groove 101 and the partition space 201 can face the target molecules at multiple angles. The target molecules of the first filler 50 and the second filler 60 can completely fill the interior of the groove 101 and the partition space 201 without forming a projection shadow. Therefore, it is convenient for the first filler 50 and the second filler 60 to be flush with the upper surfaces of the substrate 10 and the first device layer 20, respectively. This allows the second device layer 30 to be smoothly deposited at the groove opening of the groove 101 and the upper opening of the partition space 201 during the evaporation process. After the evaporation is completed, the cathode layer 303 of the display panel is flat, reducing the occurrence of cathode puncture.
[0107] In some embodiments of this application, during any stage of forming the first device layer 20, the first filler 50, the second filler 60, or the second device layer 30, the substrate 10 is controlled to rotate in its plane. This rotation can be driven by an electromechanical turntable, which allows the target material molecules to be deposited more uniformly onto the device layer of the display panel during the rotation process.
[0108] In the description of this specification, the references to terms such as "embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.
[0109] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.
Claims
1. An organic light-emitting display panel, characterized in that, The organic light-emitting display panel includes: A substrate, wherein a plurality of grooves are provided on the upper surface of the substrate, and a first filler is disposed in the grooves; the cross-sectional shape of the groove is approximately spherical, and the groove includes an inner cavity and a slot flush with the upper surface of the substrate, wherein the orthographic projection of the slot on the substrate is located within the orthographic projection range of the inner cavity on the substrate; the upper surface of the first filler is flush with the upper surface of the substrate. A first device layer is located on the upper surface of the substrate and forms a partition space at the position corresponding to the groove. A second filler is disposed in the partition space. The first device layer includes an anode layer, a first hole transport layer and a charge generation layer disposed sequentially on the substrate. A projection blind zone D is generated between the particles of the charge generation layer and the inner wall of the groove. The second device layer is located on the first device layer and the second filler; The first device layer, the first filler, the second filler, or the second device layer are formed by controlling the substrate to rotate in its plane.
2. The organic light-emitting display panel according to claim 1, characterized in that, The second device layer includes a second hole transport layer, an electron transport layer, and a cathode layer sequentially disposed on the charge generation layer.
3. The organic light-emitting display panel according to claim 2, characterized in that, The first filler and the second filler are made of the same material as the second hole transport layer.
4. The organic light-emitting display panel according to claim 1, characterized in that, The bottom of the groove is provided with a third device layer with the same structure as the first device layer. The third device layer is located within the orthographic projection range of the groove on the substrate. The first filler fills the inner cavity and contacts the inner wall of the inner cavity.
5. A method for manufacturing an organic light-emitting display panel as described in any one of claims 1-4, characterized in that, The method includes: Provide a substrate; A groove is formed on the upper surface of the substrate; A first device layer is patterned on the substrate, and a partition space is formed at the position corresponding to the groove. A first filler is formed within the groove; A second filling material is formed within the partitioned space; A second device layer is formed above the first device layer and the second filler.
6. The method for manufacturing an organic light-emitting display panel according to claim 5, characterized in that, The first filler and the second filler are formed in the groove by vacuum evaporation. During the formation of the first filler and the second filler, the substrate is controlled to tilt and rotate back and forth about the central axis of the groove by an angle θ, the angle θ being 0°-90°.
7. The method for manufacturing an organic light-emitting display panel according to claim 6, characterized in that, During the formation of the first device layer and the second device layer, the angle θ is maintained at 0°.
8. The method for manufacturing an organic light-emitting display panel according to claim 5, characterized in that, During any stage of forming the first device layer, the first filler, the second filler, or the second device layer, the substrate is controlled to rotate in its plane.