High-cohesiveness anti-cracking epoxy powder composition and preparation method thereof

An epoxy powder, high-adhesion technology, used in non-polymer adhesive additives, epoxy resin adhesives, adhesive types, etc., can solve problems such as affecting electrical properties, chip corrosion, product cracking, etc. Enhance the anti-delamination ability, enhance the bonding performance, and facilitate the processing and use of the effect

CN113969125APending Publication Date: 2022-01-25法拉新材料连云港有限公司
8 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2022-01-25

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention relates to a high-cohesiveness anti-cracking epoxy powder composition and a preparation method thereof, and belongs to the technical field of electronic component packaging materials. The high-cohesiveness anti-cracking epoxy powder composition comprises, by mass, 10%-20% of polyaromatic epoxy resin, 15%-25% of self-made special epoxy resin, 10%-15% of a curing agent, 3%-5% of a polyaromatic curing agent, 0.1%-2% of an accelerant, 0-50% of a filler, 0.3-2% of a specially treated coupling agent, 0.3-3% of a levelling agent and 0.5-5% of pigment. According to the composition, the self-made special epoxy resin is matched with the polyaromatic epoxy resin, and meanwhile, the specially treated coupling agent is used for activating the filler, so that the adhesion between the epoxy powder composition and a chip substrate can be remarkably improved; the water absorption rate is reduced, the toughness is improved, the anti-cracking performance of the encapsulated electronic component in a severe environment is improved, and the composition is mainly applied to the aspect of electronic component encapsulation.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the technical field of packaging materials for electronic components, in particular to a high-adhesive anti-cracking epoxy powder composition and a preparation method thereof. Background technique

[0002] With the development of science and technology, the safety and reliability requirements of electronic components are constantly increasing, which also puts forward higher and higher requirements for the packaging materials of electronic components. Especially with the continuous expansion of the application field, under high temperature and high humidity, the encapsulation material outside the electronic components is easily bonded weakly, resulting in delamination between the encapsulation material and the chip substrate. After water vapor enters the layer, it will cause chip corrosion and affect the electrical performance. Moreover, under high temperature environment, the water vapor in the layer will generate great expansi...

Examples

Embodiment Construction

[0032] Below by specific embodiment content of the present invention is described in further detail, and following embodiment is descriptive, not limiting, can not limit protection scope of the present invention with this.

[0033] Each component is accurately weighed, added to a high-speed mixer and mixed evenly, the mixed material is melted and mixed in a twin-screw extruder at 170 degrees, the tablet is cooled and crushed, and the appropriate particle size is sieved to test the product performance index . The addition ratio of each embodiment and comparative example is as follows, and formula unit is mass fraction.

[0034] Wherein self-made special epoxy resin 1 is prepared as follows:

[0035] Add 45kg of tetrafunctional glycidylamine epoxy resin (TGDDM) into the reaction kettle, and heat the resin to 100°C. Add 4.5kg of oxalic acid and stir for 1 hour to fully mix the oxalic acid and epoxy resin. Add accelerator TPP, heat up to 150°C, vacuumize, and fully react for 3-...