Substrate handling device and substrate handling method

Abstract

The present application relates to a substrate carrying device and a substrate carrying method, and provides a substrate carrying device and the like capable of suppressing a situation where handoff of a substrate cannot be performed. A substrate carrying device (100) includes a carrying arm (63) having a first suction portion (65) for holding a substrate by suction of a first surface of the substrate, a moving portion (64) for moving the carrying arm (63), and a table (72) on which the substrate is placed. The table (72) has a second suction portion (73) provided to protrude from an upper surface of the table (72) for holding a second surface of the substrate opposite to the first surface by suction. When handoff of the substrate held by one of the carrying arm (63) and the table (72) to the other is performed, the first suction portion (65) is moved to a position opposite to the second suction portion (73) by the moving portion (64).

Description

Technical Field

[0001] This invention relates to a substrate handling apparatus and a substrate handling method. Background Technology

[0002] Conventionally, there exist component pressing production lines that perform multiple processes, including a process of attaching an anisotropic conductive film (ACF) as an adhesive member to the end of a substrate such as a liquid crystal panel or an organic EL (Electro Luminescence) panel, and a process of thermally pressing electronic components such as drive circuits onto the substrate via the ACF.

[0003] In such component pressing production lines, in order to move the substrate between multiple devices that perform each process, a substrate handling device is used to hold (support) and move the substrate (see, for example, Patent Document 1).

[0004] Patent Document 1 discloses a substrate holding device having a substrate holding plate on which a substrate is placed, and a protrusion on the main surface of the substrate holding plate for adsorbing and holding the substrate. Accordingly, in order to hold the substrate by means of the protrusion, the substrate does not come into contact with the surface of the substrate holding plate, and therefore the substrate is less likely to be damaged.

[0005] Prior art literature

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2008-210965

[0008] When the substrate, such as an organic EL panel, is flexible, if the worktable on which the substrate is placed has a protrusion on its surface for adsorbing the substrate, the substrate may deform at the adsorption location. Furthermore, for example, when the substrate is transported to the worktable by a transport arm, it may bend due to stress applied to the substrate during the transfer. Because of these issues, if the worktable has a protrusion, the adsorption portion for adsorbing the substrate may not make proper contact with the substrate and thus fail to adsorb it, preventing the transfer of the substrate between the transport arm and the worktable. Summary of the Invention

[0009] The problem that the invention aims to solve

[0010] The present invention provides a substrate handling device that can suppress the transfer of substrates that cannot be performed.

[0011] Methods for solving problems

[0012] One aspect of the present invention relates to a substrate handling apparatus comprising: a handling arm having a first adsorption portion for adsorbing and holding a first surface of a substrate; a moving portion for moving the handling arm; and a worktable for holding the substrate, the worktable having a second adsorption portion protruding from the upper surface of the worktable for adsorbing and holding a second surface of the substrate opposite to the first surface, wherein when the substrate held in one of the handling arm and the worktable is transferred to the other, the first adsorption portion is moved by the moving portion to a position opposite to the second adsorption portion.

[0013] Furthermore, one aspect of the present invention relates to a substrate handling method comprising: a first step in which a first adsorption portion of a transport arm adsorbs and holds a first surface of a substrate; a second step in which a second adsorption portion of a worktable adsorbs and holds a second surface of the substrate opposite to the first surface; and a third step in which the substrate held by one of the transport arm and the worktable is transferred to the other, wherein in the third step, the first adsorption portion is moved to a position opposite to the second adsorption portion, and then the substrate held by one is transferred to the other.

[0014] Furthermore, these general or specific methods can be implemented either through systems, methods, integrated circuits, computer programs, or storage media such as computer-readable CD-ROMs, or through any combination of systems, methods, integrated circuits, computer programs, and storage media.

[0015] Invention Effects

[0016] According to the present invention, a substrate handling apparatus or the like can be provided that can suppress situations where substrate transfer cannot be performed. Attached Figure Description

[0017] Figure 1 This is a top view showing the component assembly line involved in the embodiment.

[0018] Figure 2 This is a schematic diagram illustrating the process of assembling components in a component assembly line according to the embodiment.

[0019] Figure 3 This is a block diagram illustrating the structure of the substrate handling apparatus according to an embodiment.

[0020] Figure 4 This is a cross-sectional view showing the substrate holding section included in the substrate transport apparatus according to the embodiment.

[0021] Figure 5 This is a schematic structural diagram used to explain the suction mechanism included in the substrate handling apparatus according to the embodiments.

[0022] Figure 6 This is a cross-sectional view used to illustrate the deformation of the substrate caused by the worktable of the substrate handling apparatus according to the embodiment holding the substrate.

[0023] Figure 7 This is a flowchart illustrating the first example of the processing steps of the substrate handling apparatus according to the embodiment.

[0024] Figure 8 This is a cross-sectional view illustrating the first example of the processing steps of the substrate handling apparatus according to the embodiment.

[0025] Figure 9 This is a flowchart illustrating the second example of the processing steps of the substrate handling apparatus according to the embodiment.

[0026] Symbol Explanation

[0027] 1: Component assembly line;

[0028] 1a, 1b, 1c: Abutment;

[0029] 2: Computer;

[0030] 2a: Control unit;

[0031] 2b: Storage section;

[0032] 3: Substrate;

[0033] 3a: Page 1;

[0034] 3b: Page 2;

[0035] 4: Electrode section;

[0036] 5: Components;

[0037] 6: ACF;

[0038] 20: Attachment part;

[0039] 30: Pre-compression joint;

[0040] 31: Component mounting mechanism;

[0041] 32: Component Supply Department;

[0042] 40: Formal crimping section;

[0043] 60, 60A, 60B, 60C, 60D: First substrate holding section;

[0044] 61: Mobile base;

[0045] 63: Handling arm;

[0046] 64: Mobile Department;

[0047] 65: First adsorption section;

[0048] 66: First adsorption pore;

[0049] 70, 70A, 70B, 70C, 70D, 70E: Second substrate holding section;

[0050] 71, 71B, 71C, 71D: Workbench moving part;

[0051] 72, 72A, 72B, 72C, 72D, 72E: Workbench;

[0052] 72a: Upper surface;

[0053] 73: Second adsorption section;

[0054] 74: Second adsorption pore;

[0055] 100: Substrate handling device;

[0056] 110: Vacuum piping;

[0057] 111: 1st piping;

[0058] 112: 2nd piping;

[0059] 113: The third piping;

[0060] 114: 4th pipe;

[0061] 120: Valve;

[0062] 121: Valve No. 1;

[0063] 122: Valve No. 2;

[0064] 123: Valve No. 3;

[0065] 130: Regulator;

[0066] 140: Vacuum pump;

[0067] 150, 151, 152, 153, 154, 155, 156, 157, 158: contacts;

[0068] 160: Gas supply source;

[0069] 170: Atmospheric Opening Section;

[0070] 200: Attracting institutions. Detailed Implementation

[0071] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, the embodiments described below are all specific examples of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangements of constituent elements, connection methods, steps, and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention.

[0072] Furthermore, the figures are schematic diagrams and may not be strictly illustrative. Also, the same symbols are sometimes used to label the same structural components in the figures, and some explanations are simplified or omitted.

[0073] Furthermore, in this specification and accompanying drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional orthogonal coordinate system. The X-axis and Y-axis are orthogonal to each other and are both orthogonal to the Z-axis. Additionally, in the following embodiments, the positive direction of the substrate transport direction is sometimes defined as the positive X-axis direction, the positive Z-axis direction as upward, and the negative Z-axis direction as downward.

[0074] (Implementation Method)

[0075] [Overall Summary]

[0076] First, refer to Figure 1 as well as Figure 2 The overall outline of the component assembly line including the substrate handling device involved in the embodiment will be described.

[0077] Figure 1 This is a top view of the component assembly line 1 involved in the implementation method. Figure 2 This is a schematic diagram illustrating the process of installing component 5 on component assembly line 1 according to the embodiment. Additionally, in Figure 1 The attraction mechanism 200 (see reference) is omitted. Figure 3 or Figure 5 As shown in the diagram, the suction mechanism 200 is a mechanism for vacuum adsorption of the substrate 3 by the first substrate holding parts 60A to 60D and the second substrate holding parts 70A to 70E.

[0078] The component mounting line 1 is a component mounting system used for producing organic EL panels, etc., which heat-presses components 5, such as drive circuits, onto a substrate 3. Specifically, the component mounting line 1 attaches an anisotropic conductive material (ACF6) to a substrate 3 on which electrode portions 4 are formed, and heat-presses the substrate 3 and components 5 together with the ACF6 in between.

[0079] The component assembly line 1 includes an attachment section 20, a pre-pressing section 30, a final pressing section 40, a substrate handling device 100, and a computer 2. Additionally, in... Figure 1In the diagram, computer 2 is shown as a functional block. Computer 2 is connected to each device of the attachment unit 20, pre-pressing unit 30, formal pressing unit 40 and substrate transport device 100 in a manner that enables wireless communication or wired communication via control lines, and controls each device.

[0080] The attachment section 20, pre-pressing section 30, and final pressing section 40 are connected in this sequence. The component assembly line 1 performs component assembly operations by attaching components 5 to multiple electrode sections 4, which are located around the periphery of a rectangular substrate 3, such as an organic EL panel substrate, which is moved upstream of the attachment section 20 to the transport substrate 3. The component assembly line 1 appropriately transports the substrate 3 via the substrate transport device 100 while the attachment section 20, pre-pressing section 30, and final pressing section 40 perform their respective operations on the substrate 3. Each of the multiple electrode sections 4 is, for example, composed of multiple electrodes.

[0081] The attachment section 20 is a device for performing an attachment operation, in which the ACF6, which serves as an adhesive component, is attached to the electrode section 4 of the substrate 3.

[0082] The attachment section 20 has a plurality of attachment heads arranged in the X-axis direction above the base 1b. In this embodiment, the attachment section 20 has two attachment heads. Each attachment head has a supply section for supplying ACF6 and an attachment piece for attaching ACF6 to the substrate 3. The plurality of attachment heads attach the ACF6 supplied from the supply section to positions on the substrate 3 corresponding to the plurality of electrode sections 4.

[0083] The pre-pressing part 30 is a device for performing the pre-pressing process. The pre-pressing process is performed on the substrate 3 at the position where the ACF6 is attached by the attachment part 20, where the component 5 is mounted and pre-pressed.

[0084] The pre-pressed joint 30 includes a component mounting mechanism 31 and a component supply section 32.

[0085] The component mounting mechanism 31 is mounted on the base 1b and includes a mounting head, a mounting head moving mechanism, and a mounting support platform. The mounting head moves freely in the horizontal plane via the mounting head moving mechanism and moves up and down in the Z-axis direction to pick up the component 5 supplied by the component supply unit 32 from above. The component mounting mechanism 31 mounts the picked-up component 5 on the ACF6 and presses it together with the substrate 3 onto the mounting support platform, thereby pre-pressing the component 5 onto the substrate 3.

[0086] The component supply unit 32 is a mechanism that supplies component 5 to the component mounting mechanism 31.

[0087] The formal pressing section 40 is an apparatus for performing the formal pressing process (i.e., the hot pressing process), in which the component 5, which is pre-pressed onto the substrate 3 by the pre-pressing section 30, is formally pressed (i.e., hot-pressed) onto the substrate 3. Thus, the electrode section 4 and the component 5 formed on the substrate 3 are electrically connected via the ACF6.

[0088] The substrate handling device 100 is a device for handling substrate 3.

[0089] The substrate transport apparatus 100 holds the substrate 3, which has been moved into the second substrate holding portion 70A, via the first substrate holding portion 60A, and then transports it to the second substrate holding portion 70B. In this embodiment, the second substrate holding portion 70B is a stage for placing the substrate 3 on which the attachment portion 20 attaches the ACF6.

[0090] Furthermore, the substrate transport device 100 holds the substrate 3 with ACF6 attached via the first substrate holding portion 60B and transports it to the second substrate holding portion 70C. In this embodiment, the second substrate holding portion 70C is a stage for holding the substrate 3 on which the pre-pressing portion 30 pre-presses the component 5.

[0091] Furthermore, the substrate transport device 100 holds the substrate 3 pre-pressed with the component 5 via the first substrate holding part 60C and transports it to the second substrate holding part 70D. In this embodiment, the second substrate holding part 70D is a stage for placing the substrate 3 on which the formal pressing part 40 performs formal pressing of the component 5.

[0092] In addition, the substrate transport device 100 holds the substrate 3, on which the component 5 has been formally pressed, through the first substrate holding part 60D and transports it to the second substrate holding part 70E.

[0093] Furthermore, the number of first substrate holding portions provided in the substrate transport apparatus 100 is not particularly limited. The substrate transport apparatus 100 may have one or more first substrate holding portions.

[0094] Furthermore, the number of second substrate holding portions provided in the substrate transport apparatus 100 is not particularly limited. The substrate transport apparatus 100 may have one or more second substrate holding portions.

[0095] Furthermore, transporting (moving in) the substrate 3 to the second substrate holding section 70B is also referred to as transporting (moving in) the substrate 3 to the attachment section 20. Furthermore, transporting (moving in) the substrate 3 to the second substrate holding section 70C is also referred to as transporting (moving in) the substrate 3 to the pre-pressing section 30. Furthermore, transporting (moving in) the substrate 3 to the second substrate holding section 70D is also referred to as transporting (moving in) the substrate 3 to the formal pressing section 40.

[0096] The specific structure of the substrate handling device 100 will be described later.

[0097] Computer 2 is a control device (computer) used to control the operation of each device in the component assembly line 1, including the substrate handling device 100. Specifically, computer 2 is implemented through a communication interface for communicating with the attachment unit 20, the pre-pressing unit 30, the formal pressing unit 40, and the substrate handling device 100, a non-volatile memory storing programs, a volatile memory serving as a temporary storage area for executing programs, input / output ports for transmitting and receiving signals, and a processor for executing programs.

[0098] Computer 2 controls the attachment unit 20, pre-pressing unit 30, formal pressing unit 40, and substrate transport device 100 to enable each work unit (attachment unit 20, pre-pressing unit 30, and formal pressing unit 40) to perform various operations on substrate 3. Furthermore, the substrate transport device 100 performs substrate transport operations by moving substrate 3 to worktables 72B, 72C, and 72D located near the work units so that each work unit can perform its respective operation. For example, the substrate transport device 100 transports substrate 3 placed on worktable 72A to worktable 72B via the first substrate holding unit 60A, and transports substrate 3 placed on worktable 72B after the attachment operation has been completed to worktable 72C via the first substrate holding unit 60B. Furthermore, for example, the substrate transport apparatus 100 transports the substrate 3, which has been placed on the worktable 72C and has completed the pre-pressing operation, to the worktable 72D via the first substrate holding part 60C, and transports the substrate 3, which has been placed on the worktable 72D and has completed the formal pressing operation, to the worktable 72E via the first substrate holding part 60D. The transport of the substrate 3 from the upstream side to the downstream side in the substrate transport operation is performed synchronously by each operation unit and the substrate transport apparatus 100.

[0099] [Structure of the substrate handling device]

[0100] Next, the specific structure of the substrate handling device 100 will be described.

[0101] Figure 3 This is a block diagram illustrating the structure of the substrate handling apparatus 100 according to an embodiment. Figure 4 This is a cross-sectional view showing the substrate holding portions (first substrate holding portion 60 and second substrate holding portion 70) included in the substrate transport apparatus 100 according to the embodiment. The first substrate holding portion 60 and the second substrate holding portion 70 are both examples of substrate holding portions included in the substrate transport apparatus 100.

[0102] In addition, Figure 3 In this context, the substrate holding section, which holds and transports the substrate 3 by vacuum adsorption, as in the first substrate holding sections 60A, 60B, 60C, and 60D, is shown as the first substrate holding section 60. Furthermore, in... Figure 3In this diagram, a substrate holding portion, which holds the substrate 3 placed by vacuum adsorption, like multiple second substrate holding portions 70A, 70B, 70C, 70D, and 70E, is shown as the second substrate holding portion 70. Furthermore, Figure 4 The hollow arrows shown indicate the orientation of the adsorption substrate 3. The substrate 3 is, for example, flat, with the first surface 3a and the second surface 3b being approximately parallel.

[0103] Figure 1 The first substrate holding portions 60A, 60B, 60C, and 60D shown have the same structure. Furthermore, the second substrate holding portion 70A has the same structure as the second substrate holding portion 70E. In addition, the second substrate holding portions 70B, 70C, and 70D also include stage moving portions 71B, 71C, and 71D, respectively, on top of the structure of the second substrate holding portion 70A.

[0104] The table moving parts 71B, 71C, and 71D are mechanisms for moving or rotating the table 72B, 72C, and 72D in the X-axis direction, Y-axis direction, and Z-axis direction, respectively. The table moving parts 71B, 71C, and 71D are implemented, for example, by guide members and motors.

[0105] In addition, the second substrate holding part 70A and the second substrate holding part 70E may or may not have a stage moving part. The stage moving part is used to move the stages 72A and 72E in the X-axis direction, Y-axis direction and Z-axis direction or rotate them around the Z-axis.

[0106] like Figure 3 As shown, the substrate transport apparatus 100 includes a movable base 61, a first substrate holding part 60, a second substrate holding part 70, a suction mechanism 200, and a computer 2.

[0107] The movable base 61 is a track that extends across base 1a, base 1b and base 1c in the X-axis direction and is used to move the first substrate holding part 60 in the X-axis direction.

[0108] The first substrate holding section 60 is a mechanism for holding and transporting the substrate 3 by vacuum adsorption. The first substrate holding section 60 includes a transport arm 63 and a moving section 64.

[0109] The transport arm 63 is used to hold the substrate 3 by vacuum adsorption. Specifically, the first substrate holding part 60 holds the substrate 3 by vacuum adsorption of the upper surface (first surface 3a) of the substrate 3 through the first adsorption hole 66. The transport arm 63 extends in the Y-axis direction, has a first adsorption part 65 at one end, and is connected to the moving part 64 at the other end.

[0110] The first adsorption part 65 contacts the substrate 3 when the transport arm 63 holds the substrate 3, and is an adsorption pad used to adsorb and hold the first surface 3a of the substrate 3. The first adsorption part 65 is, for example, an elastic member such as rubber. The first adsorption part 65 is provided with a first adsorption hole 66.

[0111] The first adsorption hole 66 is a hole used by the transport arm 63 to hold the substrate 3 by vacuum adsorption. The first adsorption hole 66 is a cavity formed inside the transport arm 63 and communicates with a cavity that communicates with the vacuum piping 110. The transport arm 63 holds the substrate 3 by vacuum adsorption through the first adsorption hole 66.

[0112] The moving part 64 is a drive mechanism for moving the conveying arm 63. The moving part 64 is connected to the conveying arm 63 and is movably mounted on the moving base 61. The moving part 64 includes, for example, a motor, gears, etc.

[0113] The second substrate holding section 70 holds the substrate 3 by vacuum adsorption. The second substrate holding section 70 includes a worktable 72 and a worktable moving section 71.

[0114] The worktable 72 has the same structure as worktables 72A to 72E, and serves as a platform for placing the substrate 3. Specifically, the worktable 72 has a second adsorption hole 74 on its upper surface 72a. In other words, the substrate 3 placed on the upper surface 72a is held in place by vacuum adsorption through the second adsorption hole 74. In this embodiment, the second adsorption hole 74 is configured to extend from the upper surface 72a to the lower surface of the worktable 72. Furthermore, only one end of the second adsorption hole 74 needs to be located on the upper surface 72a of the worktable 72; the other end may not be on the lower surface. The worktable 72 has a second adsorption portion 73 as a protrusion on its upper surface 72a.

[0115] The second adsorption portion 73 contacts the substrate 3 when the substrate 3 is placed on the worktable 72, and is an adsorption pad used to hold the second surface 3b of the substrate 3 opposite to the first surface 3a. Furthermore, the second adsorption portion 73 is provided (formed) on a protrusion of the worktable 72, protruding from the upper surface 72a of the worktable 72. The second adsorption portion 73 is, for example, an elastic member such as rubber. In this embodiment, a second adsorption hole 74 is provided (in other words, formed) in the second adsorption portion 73.

[0116] Furthermore, in this embodiment, the worktable 72 has a second adsorption portion 73 as a protrusion on its upper surface 72a. Specifically, the upper surface 72a of the worktable 72 has a flat portion and a second adsorption portion 73 that is a separate component from the flat portion, but this is not a limitation. For example, the worktable 72 may also have a flat portion and a protrusion formed integrally with the flat portion by the same component, which protrudes from a part of the flat portion.

[0117] Furthermore, the shapes of the first adsorption portion 65 and the second adsorption portion 73 are not particularly limited, but they are the same in this embodiment. Accordingly, when the substrate 3 is transferred between the transport arm 63 and the worktable 72, the first adsorption portion 65 and the second adsorption portion 73 overlap when viewed from the normal direction of the first surface 3a or the second surface 3b of the substrate 3. Therefore, when viewed from the normal direction of the first surface 3a or the second surface 3b of the substrate 3, the adsorption position and adsorption range are consistent in the first adsorption portion 65 and the second adsorption portion 73, thus facilitating a smooth transfer of the substrate 3. In other words, this prevents situations where the transport arm 63 and the worktable 72 cannot transfer the substrate 3.

[0118] The second adsorption hole 74 is a hole used by the worktable 72 to hold the substrate 3 by vacuum adsorption. The second adsorption hole 74 is a through hole extending from the upper surface 72a to the lower surface of the worktable 72, and is connected to a through hole that communicates with the vacuum piping 110. The worktable 72 holds the substrate 3 by vacuum adsorption through the second adsorption hole 74.

[0119] The table moving part 71 has the same structure as the table moving parts 71B, 71C, and 71D, and is a mechanism for moving the table 72 in the X-axis direction, Y-axis direction, and Z-axis direction or rotating it about the Z-axis. The table moving part 71 is implemented, for example, by a guide member and a motor.

[0120] The first substrate holding portion 60 and the second substrate holding portion 70 are disposed in the region in front of the attachment portion 20, the pre-pressing portion 30 and the formal pressing portion 40 (the region on the negative Y-axis side).

[0121] Vacuum piping 110 is used to vacuum-adsorb the substrate 3 via the first adsorption hole 66 or the second adsorption hole 74, thereby holding the substrate 3 in the first substrate holding portion 60 or the second substrate holding portion 70. For example, one end of vacuum piping 110 is connected to communicate with the first adsorption hole 66 and the second adsorption hole 74, and the other end is connected to communicate with a vacuum pump 140. The pressure (air pressure) inside vacuum piping 110 is reduced by the vacuum pump 140, thereby causing the first substrate holding portion 60 to vacuum-adsorb the substrate 3 via the first adsorption hole 66, and the second substrate holding portion 70 to vacuum-adsorb the substrate 3 via the second adsorption hole 74.

[0122] The suction mechanism 200 is a mechanism for vacuum suction of the substrate 3 in the first substrate holding portions 60A to 60D and the second substrate holding portions 70A to 70E. The suction mechanism 200 includes a vacuum piping 110, a valve 120, a regulator 130, and a vacuum pump 140.

[0123] Valve 120 is a solenoid valve used to switch whether the first substrate holding section 60 vacuum adsorbs the substrate 3, and also a solenoid valve used to switch whether the second substrate holding section 70 vacuum adsorbs the substrate 3. Control unit 2a is connected to valve 120 via control lines, etc., to control valve 120, thereby switching whether the first substrate holding section 60 vacuum adsorbs the substrate 3, and whether the second substrate holding section 70 vacuum adsorbs the substrate 3.

[0124] The regulator 130 is a pressure regulator (valve) used to adjust the adsorption force when the substrate 3 is vacuum adsorbed by the vacuum pump 140 through the first adsorption hole 66 or the second adsorption hole 74.

[0125] The vacuum pump 140 is used to vacuum adsorb the substrate 3 through the first adsorption hole 66 or the second adsorption hole 74.

[0126] Figure 5 This is a schematic structural diagram used to explain the suction mechanism 200 included in the substrate handling apparatus 100 according to the embodiment. Additionally, in Figure 5 The diagram shows a schematic representation of the structure by which the substrate 3 is vacuum-adsorbed via the stage 72. Furthermore, Figure 5 The hollow arrow shown indicates the direction of suction by the vacuum pump 140.

[0127] For example, vacuum piping 110 includes a first piping 111, a second piping 112, and a third piping 113.

[0128] The first piping 111 is connected to the vacuum pump 140 at one end and splits into two strands at the other end. One end of the two strands is directly connected to the first valve 121, and the other end of the two strands is a vacuum piping connected to the first valve 121 via the regulator 130.

[0129] The second piping 112 is a vacuum piping that is connected at one end to the first valve 121 and at the other end to the second valve 122.

[0130] The third pipe 113 is a vacuum pipe that is connected at one end to the second valve 122 and at the other end to the worktable 72 (more specifically, the second adsorption hole 74 provided in the second adsorption part 73 of the worktable 72).

[0131] In addition, for example, valve 120 includes a first valve 121 and a second valve 122.

[0132] Valve 121 and valve 122 are solenoid valves that can be switched at one end by a connection target (in other words, based on the suction path of vacuum pump 140).

[0133] For example, contacts 151 and 152 of the first valve 121 are connected to the first piping 111, which is divided into two branches. One contact 151, as one end, is connected to the vacuum pump 140 via the first piping 111 without going through the regulator 130. The other contact 152, as one end, is connected to the vacuum pump 140 via the first piping 111 and the regulator 130. Furthermore, contact 150, as the other end of the first valve 121, is connected to contact 153 of the second valve 122 via the second piping 112. Thus, the first valve 121 is used to switch between a stronger (higher) attraction path that directly reduces the internal pressure (air pressure) of the first piping 111 through the vacuum pump 140 and a weaker (lower) attraction path that reduces the internal pressure of the first piping under controlled conditions through the regulator 130.

[0134] For example, contact 154 at one end of the second valve 122 is connected to the worktable 72 via the third pipe 113. Furthermore, contact 155 at the other end of the second valve 122 is connected to the fourth pipe 114, which serves as a path for increasing the pressure inside the third pipe 113. Additionally, contact 153 at the other end of the second valve 122 is connected to the first valve 121 via the second pipe 112. Thus, the second valve 122 switches between a path that decreases the pressure inside the third pipe 113 and a path that increases the pressure inside the third pipe 113. In other words, by controlling the second valve 122, the opening and closing of the vacuum adsorption of the substrate 3 onto the worktable 72 is switched.

[0135] In addition, Figures 3-5 Only one vacuum piping 110, valve 120, regulator 130, and vacuum pump 140 are shown in the illustration, but the substrate transport apparatus 100 may also have multiple of these structures connected to any of the worktables 72A-72E. Furthermore, although not shown, the substrate transport apparatus 100 also includes these structures connected to the transport arms 63. Moreover, if the substrate transport apparatus 100 has multiple transport arms 63, such as the first substrate holding sections 60A-60D, it may also have multiple structures connected to any of the multiple transport arms 63. Even in such cases, some components, such as the vacuum pump 140, may be a single (common) component.

[0136] According to the above structure, it is possible to switch between the following states in the transport arm 63 and the worktable 72: a first state in which the substrate 3 is vacuum-adsorbed using a first adsorption force, a second state in which the substrate 3 is vacuum-adsorbed using a second adsorption force weaker than the first attraction force via the regulator 130, and a third state in which the substrate 3 is not vacuum-adsorbed.

[0137] Furthermore, the substrate transport apparatus 100 may also include a mechanism for rapidly switching from a state where the substrate 3 is vacuum-adsorbed to a state where the substrate 3 is not vacuum-adsorbed. For example, the substrate transport apparatus 100 includes... Figure 5 The third valve 123, gas supply source 160, and atmospheric opening 170 are shown. Figure 5 The single-dotted arrow shown indicates the direction of gas supply from gas supply source 160.

[0138] Gas supply source 160 is a gas tank storing compressed gas used to increase the pressure inside the third pipe 113 and the fourth pipe 114. The type of gas is, for example, air, but can be any and is not particularly limited. Gas supply source 160 is connected, for example, via the third valve 123 to the fourth pipe 114 connected to the second valve 122.

[0139] The third valve 123 is a solenoid valve used to switch whether to supply gas from the gas supply source 160 in order to rapidly increase the internal pressure of the third pipe 113 and the fourth pipe 114. The internal pressure of the third pipe 113 and the fourth pipe 114 is reduced so that the first adsorption section 65 or the second adsorption section 73 vacuum adsorbs the substrate 3.

[0140] For example, contact 156 at one end of the third valve 123 is connected to the fourth piping 114. In addition, contact 157 at the other end of the third valve 123 is connected to the gas supply source 160, and contact 158 ​​at the other end of the third valve 123 is connected to the atmospheric opening 170.

[0141] The atmospheric opening 170 is an opening used to bring the internal pressure of the third pipe 113 and the fourth pipe 114 to atmospheric pressure.

[0142] Control unit 2a switches, for example, whether to supply gas from gas supply source 160 in order to quickly increase the pressure inside the third pipe 113 connected to the second adsorption hole 74 provided on the worktable 72 by controlling the third valve 123.

[0143] In addition, Figure 5 The example shown is a workbench 72, but the transport arm 63 can also be connected to the gas supply source 160 via the third valve 123.

[0144] Figure 6This is a cross-sectional view used to illustrate the deformation of the substrate 3 caused by the worktable 72 of the substrate handling apparatus 100 according to the embodiment holding the substrate 3.

[0145] in addition, Figure 6 The substrate 3 is held by the worktable 72, which is part of the conveying arm 63. Figure 4 A cross-sectional view showing an enlarged view of the area enclosed by the dashed line VI. Furthermore, Figure 6 The hollow arrow shown indicates the orientation of the adsorption substrate 3.

[0146] Imagine that substrate 3 is a flexible substrate, such as an organic EL panel. That is, the transport arm 63 of the first substrate holding part 60 holds the flexible substrate 3 by adsorbing its first surface 3a. Furthermore, the worktable 72 of the second substrate holding part 70 holds the flexible substrate 3 by adsorbing its second surface 3b. In this case, the substrate 3 placed on the worktable 72 may deform due to its own weight. More specifically, because of the presence of the second adsorption part 73, the substrate 3 will bend if placed on the worktable 72. Furthermore, even when the substrate 3 is held by the transport arm 63, it will also bend due to its own weight because it is not held outside the adsorption area. Therefore, for example, even if the substrate 3 placed on the worktable 72 is adsorbed by the first adsorption part 65, because the first surface 3a is bent, there is a possibility that the first adsorption part 65 and the substrate 3 will not make proper contact and thus cannot adsorb the first surface 3a of the substrate 3 by the first adsorption part 65.

[0147] Therefore, when the substrate 3 held on one of the transport arm 63 and the worktable 72 is transferred to the other, the substrate transport device 100 positions the first adsorption part 65 and the second adsorption part 73 in opposite positions.

[0148] In this embodiment, the transport arm 63 has four first adsorption portions 65. Furthermore, the worktable 72 has four second adsorption portions 73. The four first adsorption portions 65 and the four second adsorption portions 73 are configured to be positioned one-to-one opposite each other via the moving part 64 during the exchange of substrates 3. The number of first adsorption portions 65 provided in the transport arm 63 is not particularly limited. Similarly, the number of second adsorption portions 73 provided in the worktable 72 is not particularly limited. Furthermore, when at least one of the first adsorption portions 65 and the second adsorption portions 73 is multiple, at least one pair of the first adsorption portions 65 and the second adsorption portions 73 need to be positioned opposite each other during the exchange of substrates 3. Of course, it is more preferable that all of the first adsorption portions 65 and the second adsorption portions 73 are positioned one-to-one.

[0149] Furthermore, for example, the transport arm 63 may have four first adsorption portions 65, and the worktable 72 may have ten second adsorption portions 73. The number of first adsorption portions 65 on the transport arm 63 may also differ from the number of second adsorption portions 73 on the worktable 72. In this case, for example, during the transfer of substrate 3, the control unit 2a may control the moving unit 64 so that each of the four first adsorption portions 65 is opposite to any one of the ten second adsorption portions 73. Thus, when the number of first adsorption portions 65 and second adsorption portions 73 differs, during the transfer of substrate 3, the control unit 2a controls the moving unit 64 so that the fewer adsorption portion among the first adsorption portions 65 and the second adsorption portions 73 is opposite to any one of the more adsorption portions.

[0150] Furthermore, regarding the first and second adsorption forces mentioned above, there are no special limitations as long as the second adsorption force is lower (weaker) than the first adsorption force. For example, the second adsorption force can be less than half of the first adsorption force. For example, the first adsorption force is around -70 kPa, and the second adsorption force is around -30 kPa.

[0151] Refer again Figure 3 The computer 2 is a computer used to control the various components of the substrate transport apparatus 100. In this embodiment, the computer 2 will be described as being included in the component assembly line 1 of the substrate transport apparatus 100. For example, the computer 2 controlling the various components of the substrate transport apparatus 100 may be the same as, or different from, the computer controlling the attachment section 20, pre-pressing section 30, and other devices other than the substrate transport apparatus 100 included in the component assembly line 1.

[0152] For example, computer 2 has a control unit 2a and a storage unit 2b.

[0153] The control unit 2a is a processing unit for controlling the attachment unit 20, the pre-pressing unit 30, the final pressing unit 40, and the substrate transport apparatus 100. The control unit 2a is implemented, for example, by a control program stored in the storage unit 2b and used to control each device in the component assembly line 1, and a CPU (Central Processing Unit) that executes the control program. Alternatively, the control unit 2a can also be implemented using dedicated electronic circuitry. The control unit 2a is communicatively connected to the substrate transport apparatus 100, for example, via a communication interface provided by the computer 2.

[0154] Furthermore, when the substrate 3 held between the transport arm 63 and the worktable 72 is transferred to the other, the control unit 2a moves the first adsorption part 65 to a position opposite to the second adsorption part 73 by controlling the moving part 64. That is, for example, when the substrate 3 held between the transport arm 63 and the worktable 72 is transferred to the other, the first adsorption part 65 is moved to a position opposite to the second adsorption part 73 by the moving part 64.

[0155] Furthermore, the control unit 2a controls the adsorption force of the first adsorption unit 65 and the second adsorption unit 73. Specifically, the control unit 2a controls the adsorption force through the first adsorption hole 66 and the second adsorption hole 74 by controlling the pressure of the vacuum piping 110. More specifically, the control unit 2a controls the air pressure inside the vacuum piping 110 by controlling the control valve 120, thereby controlling the adsorption force of the conveying arm 63 through the first adsorption hole 66 and the adsorption force of the worktable 72 through the second adsorption hole 74.

[0156] For example, when the control unit 2a places the substrate 3 held in the transport arm 63 onto the worktable 72 by controlling the control valve 120, it reduces the adsorption force of the first adsorption unit 65 on the substrate 3, and then causes the second adsorption unit 73 to adsorb and hold the substrate 3.

[0157] In addition, for example, when the control unit 2a places the substrate 3 held in the transport arm 63 onto the worktable 72 by controlling the control valve 120 and the third valve 123, it supplies gas to the vacuum piping 110 to reduce the adsorption force of the 11th adsorption unit 65 on the substrate 3, and then causes the second adsorption unit 73 to adsorb and hold the substrate 3.

[0158] Furthermore, for example, when the control unit 2a causes the transport arm 63 to adsorb and hold the substrate 3 placed on the worktable 72 by controlling the control valve 120, it reduces the adsorption force of the second adsorption unit 73 on the substrate 3, and then causes the first adsorption unit 65 to adsorb and hold the substrate 3.

[0159] In addition, for example, when the control unit 2a causes the transport arm 63 to adsorb and hold the substrate 3 placed on the worktable 72 by the control valve 120 and the third valve 123, it supplies gas to the vacuum piping 110 to reduce the adsorption force of the second adsorption unit 73 on the substrate 3, and then causes the first adsorption unit 65 to adsorb and hold the substrate 3.

[0160] Furthermore, the adsorption force in the first substrate holding portion 60 and the adsorption force in the second substrate holding portion 70 can be the same or different.

[0161] The storage unit 2b stores various data required for component assembly operations, such as the dimensions of the substrate 3 (e.g., display panels manufactured by the component assembly line 1), the types, installation positions, and installation directions of the components 5 mounted on the substrate 3, and the timing of transporting the substrate 3 between different work units, as well as the control programs executed by the control unit 2a. The storage unit 2b is implemented using ROM (Read Only Memory), RAM (Random Access Memory), or similar memory.

[0162] [Processing steps of the substrate handling device]

[0163] Next, the specific operation of the substrate handling device 100 will be explained.

[0164] <Example 1>

[0165] Figure 7 This is a flowchart illustrating a first example of the processing steps of the substrate handling apparatus 100 according to the embodiment. Specifically, Figure 7 This is a flowchart illustrating the process of transferring the substrate 3 held by the transport arm 63 to the worktable 72. Figure 8 This is a cross-sectional view used to illustrate the first example of the processing steps of the substrate handling apparatus 100 according to the embodiment.

[0166] First, the control unit 2a controls the moving unit 64 and the valve 120 to hold the first adsorption part 65 of the transport arm 63 adsorbing the first surface 3a of the substrate 3 (step S101).

[0167] Next, the control unit 2a controls the moving unit 64 to move the conveying arm 63 to a position where the first adsorption unit 65 and the second adsorption unit 73 are opposite each other (step S102). Figure 8 As shown in (a), the first adsorption part 65 and the second adsorption part 73 are arranged in opposite positions. Furthermore, in step S102, the first adsorption part 65 adsorbs the substrate 3 by vacuum adsorption (adsorption ON state), while the second adsorption part 73 does not perform vacuum adsorption (adsorption OFF state).

[0168] Next, the control unit 2a raises the worktable 72 by controlling the worktable moving unit 71, thereby bringing the second surface 3b of the substrate 3 into contact with the second adsorption unit 73 (step S103). Figure 8 As shown in (b), the substrate 3 is sandwiched between the first adsorption part 65 and the second adsorption part 73, which are positioned opposite each other across the substrate 3. Furthermore, in step S103, the first adsorption part 65 adsorbs the substrate 3 by vacuum adsorption (adsorption on state), while the second adsorption part 73 does not perform vacuum adsorption (adsorption off state).

[0169] Next, control unit 2a reduces the adsorption force of the first adsorption section 65 via control valve 120 (step S104). Specifically, control unit 2a increases the pressure within the vacuum piping 110 via control valve 120, thereby reducing the adsorption force via the first adsorption orifice 66. For example, control unit 2a switches the connection between contacts 150 and 151 to contacts 150 and 152 by controlling the first valve 121. Furthermore, control unit 2a sets the adsorption force of the first adsorption section 65 to zero via control valve 120. For example, control unit 2a switches the connection between contacts 153 and 154 to contacts 154 and 155 by controlling the second valve 122. Furthermore, contact 155 is connected to either the atmospheric vent 170 or the gas supply source 160 via the fourth piping 114 and the third valve 123. Furthermore, by supplying gas from the atmospheric opening 170 or the gas supply source 160, the adsorption force of the first adsorption section 65 is set to zero (atmospheric pressure).

[0170] When gas is supplied from gas supply source 160, the time required to reduce the adsorption force of the first adsorption section 65 to zero can be shortened compared to the case where gas is supplied from atmospheric opening 170. Furthermore, the control unit 2a can switch from the connection of contacts 156 and 157 to the connection of contacts 156 and 158 after supplying gas from gas supply source 160 by connecting contacts 156 and 157 of the third valve 123, raising the pressure in the third piping 113 to near atmospheric pressure. This shortens the time required to reduce the adsorption force of the first adsorption section 65 to zero and suppresses the occurrence of positional deviation of the substrate 3 caused by gas supplied from gas supply source 160 being blown out of the first adsorption section 65.

[0171] Alternatively, control unit 2a can control second valve 122 without controlling first valve 121, thereby directly setting the adsorption force of first adsorption unit 65 to zero without setting stages. Figure 8 As shown in (c), in step S104, for example, the first adsorption unit 65 does not perform vacuum adsorption (adsorption off state), and the second adsorption unit 73 does not perform vacuum adsorption (adsorption off state).

[0172] The control unit 2a transfers the substrate 3 held by the transport arm 63 to the worktable 72 by executing steps S102 to S104.

[0173] Next, the control unit 2a controls the valve 120 to cause the second adsorption unit 73 on the worktable 72 to adsorb and hold the second surface 3b of the substrate 3 (step S105). Figure 8As shown in (d), in step S105, the first adsorption unit 65 does not perform vacuum adsorption (adsorption off state), and the second adsorption unit 73 adsorbs the substrate 3 through vacuum adsorption (adsorption on state).

[0174] As described above, control unit 2a does not produce a state where both the first adsorption unit 65 and the second adsorption unit 73 are simultaneously performing vacuum adsorption. For example, as... Figure 8 As shown in (b), when the first adsorption part 65 is subjected to vacuum adsorption, if both the first adsorption part 65 and the second adsorption part 73 are in contact with the substrate 3, the substrate 3 will deform due to the vacuum adsorption effect of the first adsorption part 65, thus easily creating a gap between the second adsorption part 73 (which is not subjected to vacuum adsorption) and the substrate 3. Even if the second adsorption part 73 is subjected to vacuum adsorption in this state, the substrate 3 cannot be properly adsorbed due to this gap. Therefore, as... Figure 8 As shown in (c), when both the first adsorption part 65 and the second adsorption part 73 are in contact with the substrate 3, the control unit 2a sets both the first adsorption part 65 and the second adsorption part 73 to a state where vacuum adsorption is not performed. Therefore, by clamping the substrate 3 between the first adsorption part 65 and the second adsorption part 73, the transfer arm 63 and the worktable 72 exchange substrate 3 while suppressing positional deviation of the substrate 3 and suppressing deformation of the substrate 3 caused by vacuum adsorption.

[0175] In addition, in step S103, the control unit 2a raises the worktable 72 by controlling the worktable moving part 71, so that the second surface 3b of the substrate 3 comes into contact with the second adsorption part 73. However, if the moving part 64 is a structure that can move the transport arm 63 in the Z-axis direction, the transport arm 63 can also be lowered by controlling the moving part 64, so that the second surface 3b of the substrate 3 comes into contact with the second adsorption part 73.

[0176] <Example 2>

[0177] Figure 9 This is a flowchart illustrating a second example of the processing steps of the substrate handling apparatus 100 according to the embodiment. Specifically, Figure 9 This is a flowchart illustrating the process of transferring the substrate 3 held by the worktable 72 to the transport arm 63.

[0178] First, the control unit 2a uses the control valve 120 to hold the second adsorption unit 73 of the worktable 72 adsorbing the second surface 3b of the substrate 3 (step S201).

[0179] Next, the control unit 2a controls the moving unit 64 to move the conveying arm 63 to a position opposite the first adsorption unit 65 and the second adsorption unit 73 (step S202).

[0180] Next, the control unit 2a controls the worktable moving unit 71 to raise the worktable 72, so that the first surface 3a of the substrate 3 comes into contact with the first adsorption unit 65 (step S203).

[0181] Next, control unit 2a reduces the adsorption force of the second adsorption unit 73 via control valve 120 (step S204). Specifically, control unit 2a increases the pressure inside the vacuum piping 110 via control valve 120, thereby reducing the adsorption force through the second adsorption orifice 74. In step S204, for example, the first adsorption unit 65 does not perform vacuum adsorption (adsorption off state), and the second adsorption unit 73 does not perform vacuum adsorption (adsorption off state).

[0182] The control unit 2a transfers the substrate 3 held by the worktable 72 to the transport arm 63 by executing steps S202 to S204.

[0183] Next, the control unit 2a uses the control valve 120 to cause the first adsorption unit 65 of the transport arm 63 to adsorb and hold the first surface 3a of the substrate 3 (step S205). In step S205, the first adsorption unit 65 adsorbs the substrate 3 by vacuum adsorption (adsorption on state), and the second adsorption unit 73 does not perform vacuum adsorption (adsorption off state).

[0184] As described above, in the second example, the control unit 2a also does not generate a state where both the first adsorption unit 65 and the second adsorption unit 73 simultaneously perform vacuum adsorption. When both the first adsorption unit 65 and the second adsorption unit 73 are in contact with the substrate 3, the control unit 2a ensures that neither the first adsorption unit 65 nor the second adsorption unit 73 performs vacuum adsorption. Therefore, while the substrate 3 is held in place by the first adsorption unit 65 and the second adsorption unit 73, thus suppressing positional deviation of the substrate 3, and suppressing deformation of the substrate 3 caused by vacuum adsorption, the transport arm 63 and the worktable 72 transfer the substrate 3.

[0185] [Effects, etc.]

[0186] As described above, the substrate handling apparatus 100 according to the embodiment includes: a handling arm 63 having a first adsorption portion 65 for adsorbing and holding a first surface 3a of a substrate 3; a moving portion 64 for moving the handling arm 63; and a worktable 72 for holding the substrate 3. The worktable 72 has a second adsorption portion 73, which is configured to protrude from the upper surface 72a of the worktable 72 for adsorbing and holding a second surface 3b of the substrate 3 opposite to the first surface 3a. When a substrate 3 held in one of the handling arm 63 and the worktable 72 is transferred to the other, the first adsorption portion 65 is moved by the moving portion 64 to a position opposite to the second adsorption portion 73. For example, the first adsorption portion 65 and the second adsorption portion 73 adsorb and hold the substrate 3 by vacuum adsorption.

[0187] Accordingly, the first adsorption part 65 and the second adsorption part 73 clamp the substrate 3 at a position where they face each other. For example, if the substrate 3 is flexible and only a portion of the substrate 3 is held, the unheld portion may bend due to its own weight. In this case, if the substrate 3 is to be transferred outside the position where the first adsorption part 65 and the second adsorption part 73 face each other, a gap may easily form between the substrate 3 receiving part (the one subsequently vacuum-adsorbed) of the first adsorption part 65 and the second adsorption part 73 and the substrate 3. With a gap forming, vacuum adsorption may not be possible, and thus the substrate 3 may not be able to be adsorbed. That is, in such a state, the transfer of the substrate 3 may not be possible. Therefore, the transport arm 63 and the worktable 72 transfer the substrate 3 at the position where the first adsorption part 65 and the second adsorption part 73 clamp the substrate 3. Thus, the substrate transport device 100 can suppress the situation where the substrate 3 cannot be transferred.

[0188] Furthermore, for example, the substrate transport apparatus 100 also includes a control unit 2a, which controls the adsorption force of the first adsorption unit 65 and the second adsorption unit 73. For example, when the substrate 3 held on the transport arm 63 is placed on the worktable 72, the control unit 2a controls the suction mechanism 200 to reduce the adsorption force of the first adsorption unit 65 on the substrate 3, and then causes the second adsorption unit 73 to adsorb and hold the substrate 3.

[0189] Accordingly, the substrate 3 is transferred while suppressing deformation of the substrate 3 caused by vacuum adsorption. Therefore, the inability to transfer the substrate 3 is further suppressed.

[0190] Furthermore, for example, when the control unit 2a holds the substrate 3 placed on the worktable 72 by adsorbing the transfer arm 63, it controls the suction mechanism 200 to reduce the adsorption force of the second adsorption part 73 on the substrate 3, and then the first adsorption part 65 adsorbs and holds the substrate 3.

[0191] Accordingly, the substrate 3 is transferred while suppressing deformation of the substrate 3 caused by vacuum adsorption. Therefore, the inability to transfer the substrate 3 is further suppressed.

[0192] Furthermore, for example, the transport arm 63 holds the flexible substrate 3 by adsorbing its first surface 3a. Similarly, for example, the worktable 72 holds the flexible substrate 3 by adsorbing its second surface 3b.

[0193] For substrate 3, sometimes a flexible substrate, such as an organic EL panel, is used instead of a rigid substrate, such as a liquid crystal panel. Flexible substrate 3 is easily deformed by vacuum adsorption. Therefore, when substrate 3 is flexible, the substrate handling device 100 is particularly effective in holding substrate 3 by vacuum adsorption.

[0194] Furthermore, the substrate handling method according to the embodiment includes: a first step (steps S101 and S206), in which the first adsorption part 65 of the transport arm 63 adsorbs and holds the first surface 3a of the substrate 3; a second step (steps S105 and S201), in which the second adsorption part 73 of the worktable 72 adsorbs and holds the second surface 3b of the substrate 3 opposite to the first surface 3a; and a third step (steps S102 to S104 and steps S202 to S204), in which the substrate 3 held in one of the transport arm 63 and the worktable 72 is transferred to the other. In the third step, the first adsorption part 65 is moved to a position opposite to the second adsorption part 73, and then the substrate 3 held in one place is transferred to the other.

[0195] Therefore, it has the same effect as the substrate handling device 100.

[0196] (Other implementation methods)

[0197] The substrate handling apparatus and the like described above have been explained based on the above embodiments, but the present invention is not limited to the above embodiments.

[0198] For example, in the above embodiments, all or part of the components of computer 2 may be constructed by dedicated hardware, or may be implemented by executing software programs suitable for each component. Each component may also be implemented by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing software programs stored in storage media such as HDD (Hard Disk Drive) or semiconductor memory.

[0199] Furthermore, the components of computer 2 can also consist of one or more electronic circuits. These electronic circuits can be either general-purpose circuits or special-purpose circuits.

[0200] In one or more electronic circuits, semiconductor devices, integrated circuits (ICs), or large-scale integrated circuits (LSIs) may be included. ICs or LSIs can be integrated into a single chip or multiple chips. Here, they are referred to as ICs or LSIs, but the terminology may vary depending on the level of integration; they may be called system LSIs, very large-scale integrated circuits (VLSIs), or ultra-large-scale integrated circuits (ULSIs). Furthermore, field-programmable gate arrays (FPGAs), which are programmed after the LSI is manufactured, can also be used for the same purpose.

[0201] In addition, the present invention also includes various modifications that can be conceived by those skilled in the art to the various embodiments, and the implementation by arbitrarily combining the constituent elements and functions of the various embodiments without departing from the spirit of the present invention.

[0202] Industrial availability

[0203] The present invention can be used in component assembly lines for manufacturing display panels and other similar systems to hold and transport substrates.

Claims

1. A substrate handling device, comprising: The transport arm has a first adsorption part for holding the substrate by adsorbing the first surface of the substrate. The moving part causes the conveying arm to move; and The worktable holds the substrate. The worktable has a second adsorption section, which is configured to protrude from the upper surface of the worktable for adsorbing and holding the second surface of the substrate that faces the first surface. When the substrate held between the transport arm and the worktable is transferred to the other, the first adsorption part moves to a position opposite to the second adsorption part via the moving part. The substrate transport device further includes a control unit for controlling the adsorption forces of the first adsorption unit and the second adsorption unit. When the substrate held in the transport arm is placed on the worktable, the control unit reduces the adsorption force of the first adsorption unit on the substrate, and then causes the second adsorption unit to adsorb and hold the substrate.

2. The substrate handling apparatus according to claim 1, wherein, When the transport arm adsorbs and holds the substrate placed on the worktable, the control unit reduces the adsorption force of the second adsorption unit on the substrate, and then the first adsorption unit adsorbs and holds the substrate.

3. The substrate handling apparatus according to claim 1 or 2, wherein, The transport arm holds the substrate by adsorbing the first surface, which is flexible.

4. A substrate handling method, comprising: In the first process, the first surface of the substrate is held by the first adsorption part of the transport arm; In the second process, the second adsorption unit of the worktable adsorbs and holds the second surface of the substrate that faces the first surface; and In the third step, the substrate held by the transport arm is transferred to the worktable. In the third step, the first adsorption part is moved to a position opposite to the second adsorption part, and then the adsorption force of the first adsorption part on the substrate is reduced. Then, the second adsorption part adsorbs and holds the substrate, thereby transferring the substrate held by the transport arm to the worktable.

Images