Electronic package and packaging method

Abstract

The present invention discloses an electronic package and a packaging method, comprising: a first chip and a second chip are mounted on the same side of a substrate; a ground wire is arranged inside the substrate; an electromagnetic shielding device is arranged on one side of the first chip; a plastic encapsulation material is sealed and connected to the substrate; and a solder ball is mounted on the other side of the substrate. The present invention mounts the first chip and the second chip on a substrate with an embedded ground wire through a reflow soldering process, mounts the electromagnetic shielding device above the first chip through a tinning process to achieve electromagnetic shielding of the chip, uses a MUF process for plastic encapsulation, and mounts the solder ball on one side of the substrate to obtain an electronic package with electromagnetic shielding function. At the same time, thermal conductive glue can be applied to the top of the first chip, and plastic encapsulation can be performed using a MUF combined with a bare chip process to obtain an electronic package with electromagnetic shielding function and heat dissipation function. The present invention can effectively avoid electromagnetic interference between chips and solve the problem of complex process for achieving electromagnetic shielding function.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor packaging and relates to an electronic packaging component and a packaging method. Background Art

[0002] As the number of chips in a system-level package increases, the electromagnetic waves generated by the chips inevitably interfere with each other's normal operation. Therefore, electromagnetic shielding is essential in system-level packaging. Currently, system-level packaging typically places grounding wires at the edges of the cutting paths and within the substrate. For chips that need to be isolated, grooves are first cut around them to remove the plastic encapsulant, then filled with conductive silver glue. After cutting into individual chips, metal sputtering is used to connect them to the ground wire and silver glue to meet the electromagnetic shielding requirements of the relevant chips. However, this processing method is complex and costly, and cutting offset can also affect the yield. Summary of the Invention

[0003] The purpose of the present invention is to solve the problems in the prior art and provide an electronic package and a packaging method to avoid mutual electromagnetic interference between chips and solve the problem of complex process for realizing electromagnetic shielding function.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] An electronic package, comprising: a plastic packaging material, an electromagnetic shielding device, a first chip, a second chip, a substrate, a solder ball, and a ground wire;

[0006] The first chip and the second chip are mounted on the same side of the substrate; the ground wire is arranged inside the substrate; the electromagnetic shielding device is arranged on one side of the first chip; the plastic encapsulation material is sealed and connected to the substrate; and the solder ball is mounted on the other side of the substrate.

[0007] A further improvement of the present invention is:

[0008] The number of solder balls is several.

[0009] The electromagnetic shielding device adopts a first electromagnetic shielding component. One side of the first electromagnetic shielding component is a fence-type structure, and the other side is a cross-shaped structure; the interior of the first electromagnetic shielding component is a grid-shaped structure.

[0010] The electromagnetic shielding device adopts a second electromagnetic shielding component, one side of the second electromagnetic shielding component is a fence-type structure; the interior of the second electromagnetic shielding component is a grid-like structure.

[0011] Thermal conductive glue is applied on one side of the first chip, and the thermal conductive glue is filled between the first chip and the second electromagnetic shielding component.

[0012] A packaging method, comprising:

[0013] The first chip and the second chip are mounted on the substrate; the first electromagnetic shielding component is mounted above the first chip; the plastic encapsulation compound and the substrate are encapsulated, solder balls are mounted on one side of the substrate, and a ground wire is installed inside the substrate. The plastic encapsulation compound and the substrate are encapsulated using the MUF process.

[0014] A packaging method, comprising:

[0015] The first and second chips are mounted on the substrate; the second electromagnetic shielding component is attached above the first chip. The plastic encapsulation compound and substrate are encapsulated, solder balls are installed on one side of the substrate, a ground wire is installed inside the substrate, and thermally conductive adhesive is filled between the first chip and the second electromagnetic shielding component. The plastic encapsulation compound and substrate are encapsulated using a MUF combined with bare chip process. The first chip is mounted on one side of the substrate using a reflow process; the electromagnetic shielding component is attached to the first chip using a tinning process.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention uses a reflow soldering process to attach a first chip and a second chip to a substrate with an embedded ground wire. A tinning process is used to attach an electromagnetic shielding component to the top of the first chip to achieve electromagnetic shielding of the chips. The chip is then plastic-sealed using a MUF process, and a solder ball is mounted on one side of the substrate to obtain an electronic package with electromagnetic shielding. Furthermore, thermally conductive adhesive can be applied to the top of the first chip, and plastic-sealed using a MUF combined with a bare chip process to obtain an electronic package with both electromagnetic shielding and heat dissipation functions. This invention effectively prevents electromagnetic interference between chips and solves the current problem of complex processes for achieving electromagnetic shielding. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a structural diagram of the electronic package of the present invention;

[0020] Figure 2 is a cross-sectional view of the electromagnetic shielding element of the present invention;

[0021] Figure 3 A top view of the electromagnetic shielding element of the present invention;

[0022] Figure 4 is a cross-sectional view of another electromagnetic shielding element of the present invention;

[0023] Figure 5A top view of another electromagnetic shielding component of the present invention;

[0024] Figure 6 A cross-sectional view of a substrate containing a ground line according to the present invention;

[0025] Figure 7 This is a diagram showing the installation of the chip and substrate of the present invention;

[0026] Figure 8 This is the installation diagram of the electromagnetic shielding component;

[0027] Figure 9 This is the plastic packaging installation diagram of the plastic packaging material;

[0028] Figure 10 This is a packaging diagram of the electronic package of the present invention;

[0029] Figure 11 Another structural diagram of the electronic package of the present invention;

[0030] Figure 12 A structural diagram of an electronic package that meets heat dissipation and electromagnetic shielding requirements;

[0031] Figure 13 The cross-sectional view of the substrate with thermal conductive adhesive;

[0032] Figure 14 Another installation diagram of the electromagnetic shielding component;

[0033] Figure 15 Another installation diagram for the plastic packaging material;

[0034] Figure 16 This is a packaging diagram of the electronic package of the present invention.

[0035] Among them: 1- plastic packaging material, 2- first electromagnetic shielding component, 3- first chip, 4- second chip, 5- substrate, 6- solder ball, 7- ground wire, 8- thermal conductive adhesive, 9- second electromagnetic shielding component. DETAILED DESCRIPTION

[0036] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0039] In the description of the embodiments of the present invention, it should be noted that if the terms "upper," "lower," "horizontal," "inner," etc. appear, the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the inventive product is typically placed when in use. These terms are merely for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first," "second," etc. are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0040] In addition, if the term "horizontal" appears, it does not mean that the component must be absolutely horizontal, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0041] In the description of the embodiments of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0042] The present invention is described in further detail below with reference to the accompanying drawings:

[0043] See also Figure 1 , Figure 1 An electronic package is disclosed, including: a first chip 3 and a second chip 4 mounted on the same side of a substrate 5; a ground wire 7 arranged inside the substrate 5; an electromagnetic shielding device arranged on one side of the first chip 3; a plastic encapsulation material 1 is sealed and connected to the substrate 5; and a solder ball 6 is mounted on the other side of the substrate 5.

[0044] The electromagnetic shielding device is arranged on one side of the first chip 3 and can shield the electromagnetic interference between the first chip 3 and the second chip 4. By sealing the plastic packaging material 1 and the substrate 5 and soldering the solder ball 6 to one side of the substrate 5, a completely closed electronic package is obtained.

[0045] There are several solder balls 6 .

[0046] The electromagnetic shielding device adopts a first electromagnetic shielding component 2 , one side of the first electromagnetic shielding component 2 is a fence-like structure, and the other side is a cross-shaped structure; the interior of the first electromagnetic shielding component 2 is a grid-like structure.

[0047] See also Figure 2 and Figure 3 The first electromagnetic shielding component has a fence-like structure at the bottom, which facilitates welding and allows the plastic molding compound to flow easily. The top of the first electromagnetic shielding component has a grid-like structure to facilitate the flow of the molding compound. The top of the first electromagnetic shielding component has a cross-shaped structure, which facilitates the nozzle to grasp the electromagnetic shielding component during assembly. The cross-shaped design facilitates the flow of the molding compound.

[0048] The electromagnetic shielding device adopts a second electromagnetic shielding member 9 , one side of which is a fence-like structure; the interior of the second electromagnetic shielding member 9 is in a grid shape.

[0049] See also Figure 4 and Figure 5 The top of the second electromagnetic shielding member 9 is not grooved, which is convenient for demolding the bare chip during plastic packaging and printing the required stamp during the subsequent process.

[0050] A heat-conducting adhesive 8 is applied to one side of the first chip 3 , and the heat-conducting adhesive 8 is filled between the first chip 3 and the second electromagnetic shielding member 9 . The heat-conducting adhesive 8 can effectively conduct heat from the first chip 3 .

[0051] The electronic package disclosed in the present invention may include several chips, and the first chip 3 and the second chip 4 are used as a comparison to illustrate the shielding effect of the electronic package.

[0052] A packaging method, comprising:

[0053] The first chip 3 and the second chip 4 are mounted on the substrate 5; the first electromagnetic shielding component 2 is mounted above the first chip 3; the plastic encapsulation material 1 and the substrate 5 are encapsulated, the solder ball 6 is mounted on one side of the substrate 5, and the ground wire 7 is installed inside the substrate 5.

[0054] A packaging method, comprising:

[0055] The first chip 3 and the second chip 4 are installed on the substrate 5; the second electromagnetic shielding component 9 is mounted above the first chip 3; the plastic encapsulation material 1 and the substrate 5 are encapsulated, the solder ball 6 is installed on one side of the substrate 5, the ground wire 7 is installed inside the substrate 5, and the thermal conductive glue 8 is filled between the first chip 3 and the second electromagnetic shielding component 9.

[0056] The electronic package obtained by encapsulating the plastic encapsulation material 1 and the substrate 5 using the MUF combined with bare chip process is lighter and thinner than the electronic package obtained by encapsulating the plastic encapsulation material 1 and the substrate 5 using the MUF process.

[0057] The first chip 3 is mounted on one side of the substrate 5 by adopting a reflow soldering process; and the electromagnetic shielding device is mounted on the first chip 3 by adopting a tinning process.

[0058] See also Figure 6 and Figure 7 , the first chip 3 is mounted on the substrate 5 with the buried ground line 7 by a reflow process; Figure 8 , the first electromagnetic shielding member 2 is mounted on one side of the first chip 3 by a tinning process to achieve electromagnetic shielding of the first chip 3; see Figure 9 and Figure 10 The MUF process is used to plastic-encapsulate the plastic encapsulation material 1 and the substrate 5, and the solder ball 6 is welded to one side of the substrate 5 to obtain an electronic package with electromagnetic shielding function.

[0059] See also Figure 11 and Figure 12 , Figure 11 and Figure 12 A structural diagram of another electronic package that meets the requirements of heat dissipation and electromagnetic shielding is disclosed.

[0060] The first chip 3 is mounted on the substrate 5 with the buried ground line 7 by a reflow process; Figure 13 and Figure 14 , apply thermal conductive glue 8 on the top of the first chip 3, and use the tinning process to mount the second electromagnetic shielding member 9 on the top of the first chip 3; see Figure 15 and Figure 16 The MUF combined with bare chip process is used to plastic-encapsulate the plastic encapsulation material 1 and the substrate 5, and the solder ball 6 is soldered to one side of the substrate 5. At the same time, the second electromagnetic shielding component 9 is in contact with the air to obtain an electronic package with electromagnetic shielding and heat dissipation functions.

[0061] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An electronic package, characterized in that: include: Plastic encapsulation material (1), electromagnetic shielding device, first chip (3), second chip (4), substrate (5), solder ball (6) and ground wire (7); The first chip (3) and the second chip (4) are mounted on the same side of the substrate (5); the ground wire (7) is arranged inside the substrate (5); the electromagnetic shielding device is arranged on one side of the first chip (3); the plastic encapsulation material (1) is sealed and connected to the substrate (5); the solder ball (6) is mounted on the other side of the substrate (5); The electromagnetic shielding device adopts a first electromagnetic shielding member (2), the bottom of the first electromagnetic shielding member (2) is a fence-type structure, the upper part of the first electromagnetic shielding member is provided with an internal structure, the internal structure is in a grid shape, and the top surface of the upper part is provided with openings in a cross shape; Alternatively, the electromagnetic shielding device adopts a second electromagnetic shielding member (9), the bottom of the second electromagnetic shielding member (9) is a fence-type structure; an internal structure is provided on the upper portion of the second electromagnetic shielding member (9), the internal structure is in a grid shape, and the top surface of the upper portion has no openings; A heat-conducting adhesive (8) is applied to one side of the first chip (3), and the heat-conducting adhesive (8) is filled between the first chip (3) and the second electromagnetic shielding component (9).

2. The electronic package according to claim 1, wherein: The number of the solder balls (6) is several.

3. A packaging method according to claim 1, characterized in that: include: The first chip (3) and the second chip (4) are mounted on the substrate (5); the first electromagnetic shielding component (2) is mounted above the first chip (3); the plastic encapsulation material (1) and the substrate (5) are packaged, the solder ball (6) is mounted on one side of the substrate (5), and the ground wire (7) is mounted inside the substrate (5); Alternatively, the first chip (3) and the second chip (4) are mounted on the substrate (5); the second electromagnetic shielding component (9) is mounted above the first chip (3); the plastic encapsulation material (1) and the substrate (5) are packaged, the solder ball (6) is mounted on one side of the substrate (5), the ground wire (7) is mounted inside the substrate (5), and the thermal conductive glue (8) is filled between the first chip (3) and the second electromagnetic shielding component (9).

4. The packaging method according to claim 3, wherein: The MUF combined with bare chip process is used to encapsulate the plastic encapsulation material (1) and the substrate (5).

5. The packaging method according to claim 3, wherein: The first chip (3) is mounted on one side of the substrate (5) using a reflow soldering process; and the electromagnetic shielding device is mounted on the first chip (3) using a tinning process.

6. The packaging method according to claim 3, wherein: The MUF process is used to encapsulate the plastic encapsulation material (1) and the substrate (5).

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