Wafer heating source coating machine

Abstract

The application discloses a wafer heating coating source machine, which comprises a rack, a feeding mechanism, a conveying mechanism, a solvent coating mechanism, a rotating mechanism, a magnetic stirrer, a heating mechanism and a collecting mechanism are sequentially arranged on the rack from left to right, a solvent bottle for containing a diffusion source is placed on the magnetic stirrer, a first carrying mechanism is arranged on one side of the feeding mechanism and the conveying mechanism, a second carrying mechanism is arranged on one side of the conveying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer and the heating mechanism, a third carrying mechanism is arranged on the right end of the heating mechanism and one side of the collecting mechanism, and a turnover mechanism is arranged on the other side of the third carrying mechanism; the wafer is automatically coated with the source, the wafer is completely dried and cooled after coating with the source through the arrangement of the heating mechanism, the product quality is ensured, the wafer is automatically placed through the third carrying mechanism and the turnover mechanism, manual carrying is avoided, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer production equipment, in particular to a wafer heating source coating machine. BACKGROUND

[0002] In the semiconductor process, the wafer needs to pass through the processing process of various machines, and in the production process of the semiconductor wafer, the surface of the wafer needs to be coated with a source before boron expansion. Before the boron expansion of the cleaned wafer, the source coating, baking and sheet collecting operations need to be performed. At present, the source coating is mainly performed by workers using a brush to dip the diffusion source and then coat the wafer. The use of the brush by workers to coat the source affects the uniformity of the boron source on the wafer surface, the production efficiency is low, and the quality is uncontrollable. In the prior art, a drying module is arranged on the wafer source coating machine. However, in the continuous production process of the wafer, it is difficult for a single drying module to completely dry the wafer, and after drying, the wafer needs to be cooled and collected. The existing wafer source coating machine is difficult to completely dry the wafer while cooling and collecting the wafer on one equipment, which affects the quality of the wafer. SUMMARY

[0003] The present application aims to provide a wafer heating source coating machine to solve the problems in the background art.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0005] A wafer heating source coating machine comprises a rack, a protective cover arranged above the rack, and the rack is composed of a first support table, a second support table and a third support table connected in sequence from left to right.

[0006] A feeding mechanism, a conveying mechanism, a solvent coating mechanism, a rotating mechanism, a magnetic stirrer, a heating mechanism and a collecting mechanism are arranged in sequence from left to right above the rack, the magnetic stirrer is provided with a solvent bottle for containing a diffusion source, the feeding mechanism and the conveying mechanism are provided with a first conveying mechanism on one side, the conveying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer and the heating mechanism are provided with a second conveying mechanism on one side, and the right end of the heating mechanism and one side of the collecting mechanism are provided with a third conveying mechanism, and the other side of the third conveying mechanism is provided with a turnover mechanism.

[0007] The feeding mechanism, the conveying mechanism, the first conveying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer and the second conveying mechanism are arranged on the first support table, the heating mechanism is arranged on the second support table, and the collecting mechanism, the third conveying mechanism and the turnover mechanism are arranged on the third support table.

[0008] The discharging mechanism and the receiving mechanism are used for storing wafers, the conveying mechanism comprises a conveyor, a supporting leg, a receiving box, a blocking rod and a blocking cylinder, the conveyor is fixed on the supporting leg, the receiving box is arranged on the outer side of the middle section of the conveyor in an inclined manner, the blocking rod is connected with the blocking cylinder, and the blocking cylinder is fixed on the conveyor and opposite to the receiving box;

[0009] The first conveying mechanism is used for conveying the wafer from the discharging mechanism to the conveying mechanism, the second conveying mechanism is used for conveying the wafer from the conveying mechanism to the rotating mechanism, the third conveying mechanism is used for conveying the wafer from the heating mechanism to the receiving mechanism.

[0010] The solvent coating mechanism comprises a brush holder head used for fixing a brush, the brush holder head is fixed on a rotating lifting mechanism, the rotating lifting mechanism is used for driving the brush to dip into a solvent bottle to absorb the diffusion source, and then driving the brush to move above the rotating mechanism.

[0011] The rotating mechanism comprises a coating source disc, a rotating disc, a first synchronous pulley, a second synchronous pulley and a third motor, the rotating disc is arranged concentrically in the coating source disc, the mounting shaft at the lower end of the rotating disc is rotatably mounted in the coating source disc, the first synchronous pulley is fixed on the mounting shaft of the coating source disc and is in transmission connection with the second synchronous pulley through a synchronous belt, and the second synchronous pulley is fixed on the motor shaft of the third motor.

[0012] The heating mechanism comprises a mounting profile, heating tables, cooling tables, receiving rods, grooves, a second cylinder, connecting feet, sliding rails, guide blocks, connecting blocks and a third cylinder, a plurality of heating tables are arranged at equal distances on the upper end of the mounting profile, a plurality of cooling tables are also arranged at equal distances on the upper end of the mounting profile, the cooling tables are arranged at the right ends of the heating tables, the heating tables and the cooling tables are of the same structure and are each provided with a groove, the grooves are used for placing wafers and the receiving rods, the receiving rods are arranged in parallel in two, the left and right ends of the two receiving rods are fixed on the connecting blocks, the connecting blocks are fixed on the upper ends of the output ends of the third cylinder, the lower end of the mounting profile is fixedly provided with the sliding rails, the sliding rails are slidably arranged in the guide blocks, the guide blocks and the second cylinder are fixed on the second supporting table, and the piston rod of the second cylinder is fixedly connected with the mounting profile through the connecting feet.

[0013] Preferably, the first conveying mechanism, the second conveying mechanism and the third conveying mechanism are arranged at the center of the rack, and the discharging mechanism, the conveying mechanism, the solvent coating mechanism, the rotating mechanism, the magnetic stirrer, the heating mechanism and the receiving mechanism are arranged in two groups and symmetrically arranged on the front and back sides of the first conveying mechanism, the second conveying mechanism and the third conveying mechanism.

[0014] Preferably, the discharging mechanism comprises a fourth motor, a placing plate, a fixing plate, a mounting rod, an air nozzle, a positioning rod, a top disc, a lead screw and a top post, the fixing plate is fixed on the first support table, the placing plate is arranged in parallel above the fixing plate, the lower end of the fixing plate is fixedly installed with the fourth motor, the motor shaft of the fourth motor is connected with the lead screw, the two top posts are arranged in parallel on the two sides of the lead screw respectively, the lower ends of the two top posts are fixedly installed on the adjusting plate, a screw hole matched with the lead screw is arranged at the center of the adjusting plate, the two top posts are slidably installed on the fixing plate, the upper ends of the two top posts are fixed on the lower end of the top disc, the top disc is arranged at the center of the placing plate, the upper end of the top disc is used for stacking wafers, a plurality of positioning rods arranged in a circular array are fixedly installed on the upper end of the placing plate, the upper ends of the two positioning rods are also fixedly installed with two mounting rods, and the air nozzle is fixed above the mounting rods.

[0015] Preferably, the discharging mechanism and the discharging mechanism are the same in structure.

[0016] Preferably, the first carrying mechanism comprises a mounting box, a guide rail, a first air cylinder, a suction cup mounting seat and a suction cup, the guide rail is arranged in the mounting box, the first air cylinder is fixed outside the mounting box, the piston rod of the first air cylinder extends into the mounting box and is connected with a sliding block, the sliding block is slidably arranged on the guide rail, the sliding block is fixed with the suction cup mounting seat on the outside, and the suction cup mounting seat is fixedly installed with a suction cup used for adsorbing wafers.

[0017] Preferably, the rotating lifting mechanism comprises a first mounting plate fixed on the rack, a threaded sleeve rotatably installed on the first mounting plate, a screw threadedly installed in the threaded sleeve, a first pulley installed on the screw, a second pulley in transmission connection with the first pulley through a belt, the second pulley being fixed on the motor shaft of a first motor, the lower end of the threaded sleeve being fixedly connected with a third pulley, the third pulley being in transmission connection with a fourth pulley through a belt, the fourth pulley being fixed on the motor shaft of a second motor, and the first motor and the second motor being both fixed on the first mounting plate.

[0018] Preferably, the turnover mechanism comprises a third linear module, a rotary air cylinder and a fourth mounting plate, the rotary air cylinder is fixedly installed on the moving end of the third linear module, the fourth mounting plate is fixedly installed on the output end of the rotary air cylinder, and one wafer clamping mechanism is installed on the fourth mounting plate.

[0019] Preferably, the second carrying mechanism comprises a first linear module, a moving block, a fourth air cylinder and a second mounting plate, the moving block is fixedly installed on the output end of the first linear module, the fourth air cylinder is fixed outside the moving block, the output end of the fourth air cylinder is fixedly connected with the second mounting plate, and one wafer clamping mechanism is installed at the left end and the right end of the lower end of the second mounting plate respectively.

[0020] Preferably, the third conveying mechanism comprises a second linear module, a fifth cylinder and a third mounting plate, the fifth cylinder is fixedly installed on the moving end of the second linear module, a third mounting plate is fixedly installed on the output end of the fifth cylinder, and a wafer clamping mechanism is installed on the lower end of the third mounting plate.

[0021] Preferably, the wafer clamping mechanism comprises a double-head cylinder, a fifth mounting plate and a clamping rod, a fifth mounting plate is installed on each output end of the double-head cylinder, and two clamping rods are symmetrically installed on the lower end of the fifth mounting plate.

[0022] Compared with the prior art, the present application has the following beneficial effects:

[0023] The present application realizes automatic wafer coating through the setting of the conveying mechanism, the solvent coating mechanism, the rotating mechanism and the magnetic stirrer, realizes complete drying and cooling of the wafer after coating through the setting of the heating mechanism, guarantees product quality, realizes automatic wafer placement through the third conveying mechanism and the turnover mechanism, improves efficiency, avoids manual conveying, reduces the work load of workers, and improves production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0025] Figure 2 It is a schematic diagram of the internal structure of the present application;

[0026] Figure 3 It is a schematic diagram of the internal structure of the present application;

[0027] Figure 4 It is a schematic diagram of the mechanism structure above the first support table of the present application;

[0028] Figure 5 It is a schematic diagram of the material placing mechanism structure of the present application;

[0029] Figure 6 It is a schematic diagram of the conveying mechanism and the first conveying mechanism structure of the present application;

[0030] Figure 7 It is a schematic diagram of the solvent coating mechanism structure of the present application;

[0031] Figure 8 It is a schematic diagram of the rotating mechanism structure of the present application;

[0032] Figure 9 It is a schematic diagram of the heating mechanism structure of the present application;

[0033] Figure 10 It is a schematic diagram of the enlarged structure of area A of the present application;

[0034] Figure 11Structure schematic diagram of the second carrying mechanism of the present application;

[0035] Figure 12 Structure schematic diagram of the third carrying mechanism and the turnover mechanism of the present application;

[0036] Figure 13 Structure schematic diagram of the third carrying mechanism of the present application;

[0037] Figure 14 Structure schematic diagram of the turnover mechanism of the present application;

[0038] Figure 15 Structure schematic diagram of the wafer clamping mechanism of the present application.

[0039] In the figure: 1 frame, 101 first support table, 102 second support table, 103 third support table, 2 material placing mechanism, 21 fourth motor, 22 placing plate, 23 fixed plate, 24 mounting rod, 25 air nozzle, 26 positioning rod, 27 top disc, 28 screw rod, 29 top column, 3 conveying mechanism, 31 transmission machine, 32 support leg, 33 material collecting box, 34 material blocking rod, 35 material blocking cylinder, 4 first carrying mechanism, 41 mounting box, 42 guide rail, 43 first cylinder, 44 suction cup mounting seat, 45 suction cup, 5 solvent coating mechanism, 501 first mounting plate, 502 screw rod, 503 threaded sleeve, 504 first pulley, 505 second pulley, 506 first motor, 507 third pulley, 508 fourth pulley, 509 second motor, 510 brush clamping head, 511 brush, 6 rotating mechanism, 61 source coating disc, 62 rotating disc, 63 first synchronous pulley, 64 second synchronous pulley, 65 third motor, 7 magnetic stirrer, 8 heating mechanism, 801 mounting profile, 802 heating table, 803 cooling table, 804 material receiving rod, 805 groove, 806 second cylinder, 807 connecting foot, 808 sliding rail, 809 guide block, 810 connecting block, 811 third cylinder, 9 second carrying mechanism, 91 first linear module, 92 moving block, 93 fourth cylinder, 94 second mounting plate, 10 material collecting mechanism, 11 third carrying mechanism, 111 second linear module, 112 fifth cylinder, 113 third mounting plate, 12 turnover mechanism, 121 third linear module, 122 rotating cylinder, 123 fourth mounting plate, 13 wafer, 14 solvent bottle, 15 wafer clamping mechanism, 151 double-head cylinder, 152 fifth mounting plate, 153 clamping rod, 16 protective cover. DETAILED DESCRIPTION

[0040] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present application.

[0041] Please refer to Figure 1 -15, the present application provides a technical solution:

[0042] A wafer heating source coating machine, which comprises a rack 1, a protective cover 16 is arranged above the rack 1, and the rack 1 is composed of a first support table 101, a second support table 102 and a third support table 103 connected in sequence from left to right.

[0043] A material feeding mechanism 2, a conveying mechanism 3, a solvent coating mechanism 5, a rotating mechanism 6, a magnetic stirrer 7, a heating mechanism 8 and a material collecting mechanism 10 are arranged in sequence from left to right above the rack 1, and the magnetic stirrer 7 is placed with a solvent bottle 14 for containing a diffusion source, the diffusion source in the solvent bottle 14 is stirred by the magnetic stirrer 7 to keep the diffusion source uniform and ensure the quality of the source coating. A first carrying mechanism 4 is arranged on one side of the material feeding mechanism 2 and the conveying mechanism 3, a second carrying mechanism 9 is arranged on one side of the conveying mechanism 3, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7 and the heating mechanism 8, and a third carrying mechanism 11 is arranged at the right end of the heating mechanism 8 and on one side of the material collecting mechanism 10, and a turnover mechanism 12 is arranged on the other side of the third carrying mechanism 11.

[0044] The first carrying mechanism 4, the second carrying mechanism 9 and the third carrying mechanism 11 are arranged at the center of the rack 1, and the material feeding mechanism 2, the conveying mechanism 3, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7, the heating mechanism 8 and the material collecting mechanism 10 are arranged in two groups, which are symmetrically arranged on the front and back sides of the first carrying mechanism 4, the second carrying mechanism 9 and the third carrying mechanism 11.

[0045] The material feeding mechanism 2, the conveying mechanism 3, the first carrying mechanism 4, the solvent coating mechanism 5, the rotating mechanism 6, the magnetic stirrer 7 and the second carrying mechanism 9 are arranged on the first support table 101, the heating mechanism 8 is arranged on the second support table 102, and the material collecting mechanism 10, the third carrying mechanism 11 and the turnover mechanism 12 are arranged on the third support table 103.

[0046] The discharging mechanism 2 and the receiving mechanism 10 are used for storing the wafers 13, and the receiving mechanism 10 and the discharging mechanism 2 are the same in structure. The discharging mechanism 2 comprises a fourth motor 21, a placing plate 22, a fixing plate 23, a mounting rod 24, an air nozzle 25, a positioning rod 26, a top disc 27, a lead screw 28 and a top column 29, the fixing plate 23 is fixed on the first supporting table 101, the placing plate 22 is arranged in parallel above the fixing plate 23, the lower end of the fixing plate 23 is fixedly installed with the fourth motor 21, the motor shaft of the fourth motor 21 is connected with the lead screw 28, two top columns 29 are arranged in parallel at the two sides of the lead screw 28 respectively, the lower ends of the two top columns 29 are fixedly installed on the adjusting plate, the center of the adjusting plate is provided with a screw hole matched with the lead screw 28, the two top columns 29 are slidably installed on the fixing plate 23, the upper ends of the two top columns 29 are fixed on the lower end of the top disc 27, the top disc 27 is arranged at the center of the placing plate 22, the upper end of the top disc 27 is used for stacking the wafers 13, the upper end of the placing plate 22 is fixedly installed with a plurality of positioning rods 26 arranged in a circular array, the upper end of the placing plate 22 is also fixedly provided with two mounting rods 24 symmetrically, the upper end of the mounting rod 24 is fixedly provided with the air nozzle 25. The wafers 13 without source coating are placed on the top disc 27, the positions of the wafers 13 without source coating are constrained by the four positioning rods 26, the air nozzle 25 blows air to the uppermost wafer 13 without source coating, so that the suction disc 45 only sucks one wafer 13 at a time, the fourth motor 21 drives the lead screw 28 to rotate, the adjusting plate moves up and down under the action of the screw thread, when working, the adjusting plate drives the top disc 27 to rise through the two top columns 29, so that the uppermost wafer 13 without source coating is always at the same height, which is convenient for the first carrying mechanism 4 to carry.

[0047] The conveying mechanism 3 comprises a conveying machine 31, a supporting leg 32, a receiving box 33, a blocking rod 34 and a blocking cylinder 35, the conveying machine 31 is fixed on the supporting leg 32, the outer side of the middle section of the conveying machine 31 is obliquely provided with the receiving box 33, the blocking rod 34 is connected with the blocking cylinder 35, the blocking cylinder 35 is fixed on the conveying machine 31 and opposite to the receiving box 33; the wafers 13 without source coating are carried to the conveying machine 31 by the first carrying mechanism 4, in the conveying process of the wafers 13 from left to right, whether the wafers 13 are single or double is detected by a sensor, if the wafers 13 are double or more, the blocking cylinder 35 drives the blocking rod 34 to rise, so as to separate two or more wafers 13 stacked together, the excess wafers are blown into the receiving box 33, so that only one wafer 13 without source coating is conveyed to the right end of the conveying machine 31 at a time.

[0048] The first carrying mechanism 4 is used for carrying the wafer 13 from the feeding mechanism 2 to the conveying mechanism 3, and comprises a mounting box 41, a guide rail 42, a first cylinder 43, a suction cup mounting seat 44 and a suction cup 45. In the embodiment, the guide rail 42, the first cylinder 43, the suction cup mounting seat 44 and the suction cup 45 are provided with two, which can carry the wafer 13 without source on the front and rear sides of the first carrying mechanism 4. The guide rail 42 is arranged in the mounting box 41, and the first cylinder 43 is fixed outside the mounting box 41. The piston rod of the first cylinder 43 extends into the mounting box 41 and is connected with a sliding block. The sliding block is slidably arranged on the guide rail 42. The suction cup mounting seat 44 is fixed on the outside of the sliding block. The suction cup 45 for adsorbing the wafer 13 is fixedly arranged at the lower end of the suction cup mounting seat 44. The suction cup 45 is driven to move left and right by the extension and retraction of the piston rod of the first cylinder 43, so as to realize the carrying of the wafer 13.

[0049] The second carrying mechanism 9 is used for carrying the wafer 13 from the conveying mechanism 3 to the rotating mechanism 6, and then carrying the wafer 13 from the rotating mechanism 6 to the heating mechanism 8, as shown in FIG. 6. Figure 7 The solvent coating mechanism 5 comprises a brush holder 510 for fixing a brush 511. The brush holder 510 is fixed on a rotating lifting mechanism. The rotating lifting mechanism is used for driving the brush 511 to dip into the solvent bottle 14 to absorb the diffusion source, and then driving the brush 511 to move above the rotating mechanism 6.

[0050] The rotating lifting mechanism comprises a first mounting plate 501 fixed on the rack 1. A threaded sleeve 503 is rotatably arranged on the first mounting plate 501. A screw rod 502 is threadedly arranged in the threaded sleeve 503. A first pulley 504 is arranged on the screw rod 502. The first pulley 504 is in transmission connection with a second pulley 505 through a belt. The second pulley 505 is fixed on the motor shaft of a first motor 506. The screw rod 502 is driven to rotate by the first motor 506, the first pulley 504 and the second pulley 505, so as to realize the rotary swing of the screw rod 502. The lower end of the threaded sleeve 503 is fixedly connected with a third pulley 507. The third pulley 507 is in transmission connection with a fourth pulley 508 through a belt. The fourth pulley 508 is fixed on the motor shaft of a second motor 509. The first motor 506 and the second motor 509 are both fixed on the first mounting plate 501. The threaded sleeve 503 is driven to rotate by the second motor 509, the third pulley 507 and the fourth pulley 508. Since the threaded sleeve 503 and the screw rod 502 are threadedly arranged, the threaded sleeve 503 realizes the rising or falling of the screw rod 502 in the rotating process.

[0051] The rotating mechanism 6 comprises a source coating disc 61, a rotating disc 62, a first synchronous pulley 63, a second synchronous pulley 64 and a third motor 65, the rotating disc 62 is concentrically arranged in the source coating disc 61, the mounting shaft at the lower end of the rotating disc 62 is rotatably mounted in the source coating disc 61, the first synchronous pulley 63 is fixed on the mounting shaft of the source coating disc 61, and the first synchronous pulley 63 is in driving connection with the second synchronous pulley 64 through a synchronous belt, and the second synchronous pulley 64 is fixed on the motor shaft of the third motor 65. The second carrying mechanism 9 carries the wafer 13 without source coating from the conveying mechanism 3 to the rotating disc 62 of the rotating mechanism 6, the rotating lifting mechanism rotates the brush 511 to above the solvent bottle 14, then drives the brush 511 to move downward to dip the diffusion source, then the brush 511 rises and rotates to above the center of the wafer 13 without source coating, the rotating disc 62 and the wafer 13 without source coating above the rotating disc 62 are driven to rotate by the third motor 65, the first synchronous pulley 63 and the second synchronous pulley 64, then the rotating lifting mechanism drives the brush 511 to swing to the outside of the wafer 13, so that the wafer 13 is coated with the source, after the source coating is completed, the rotating lifting mechanism drives the brush 511 to return to above the solvent bottle 14, and the source is uniformly coated through the rotation of the rotating disc 62 and the swinging of the brush 511.

[0052] The second carrying mechanism 9 comprises a first linear module 91, a moving block 92, a fourth cylinder 93 and a second mounting plate 94, and two groups of the second carrying mechanism 9 are symmetrically arranged in the embodiment. The moving block 92 is fixedly installed on the output end of the first linear module 91, the fourth cylinder 93 is fixed on the outer side of the moving block 92, the output end of the fourth cylinder 93 is fixedly connected with the second mounting plate 94, and the second mounting plate 94 is provided with a wafer clamping mechanism 15 at each left end and right end of the lower end. By installing two wafer clamping mechanisms 15 at the lower end of the second mounting plate 94, the wafer 13 can be carried from the conveying mechanism 3 to the rotating mechanism 6 and carried from the rotating mechanism 6 to the heating mechanism 8, so that the carrying time is saved, and the interference of the wafer 13 on the conveying mechanism 3, the rotating mechanism 6 and the heating mechanism 8 is prevented.

[0053] The heating mechanism 8 comprises a mounting profile 801, a heating table 802, a cooling table 803, a receiving rod 804, a groove 805, a second cylinder 806, a connecting foot 807, a sliding rail 808, a guide block 809, a connecting block 810 and a third cylinder 811. A plurality of heating tables 802 are equidistantly arranged on the upper end of the mounting profile 801, and a plurality of cooling tables 803 are equidistantly arranged on the upper end of the mounting profile 801. The cooling tables 803 are arranged on the right end of the heating tables 802. In this embodiment, there are 14 heating tables 802 and 4 cooling tables 803. The cooling tables are arranged above the third support table 103. The heating tables 802 and the cooling tables 803 have the same structure, and the grooves 805 are arranged on the heating tables 802 and the cooling tables 803. The grooves 805 are used for placing the wafers 13 and the receiving rods 804. Two receiving rods 804 are arranged in parallel, and the left and right ends of the two receiving rods 804 are fixed on the connecting blocks 810. The two connecting blocks 810 are fixed on the upper end of the output end of the third cylinder 811. The lower end of the mounting profile 801 is fixedly connected with the sliding rail 808. The sliding rail 808 is slidably arranged in the guide block 809. The guide block 809 and the second cylinder 806 are fixed on the second support table 102. The piston rod of the second cylinder 806 is fixedly connected with the mounting profile 801 through the connecting foot 807.

[0054] The second carrying mechanism 9 carries the coated wafers 13 from the rotating mechanism 6 to the leftmost heating table 81 of the heating mechanism 8. The third cylinder 811 is started, the piston rod of the third cylinder 811 is stretched upwards, the receiving rod 804 is driven to rise through the connecting block 810, until the receiving rod 804 reaches below the coated wafer 13. The second carrying mechanism 9 releases the coated wafer 13. The piston rod of the third cylinder 811 is retracted downwards, so that the coated wafer 13 reaches the heating table 81 for drying. Before the next coated wafer 13 reaches the leftmost heating table 81, the second cylinder 806 is started. Under the action of the sliding rail 808 and the guide block 809, the mounting profile 801 is pushed to move rightwards by the distance of one heating table 81. When the next coated wafer 13 reaches the leftmost heating table 81, the third cylinder 811 is started. The piston rod of the third cylinder 811 is stretched upwards, and the second cylinder 806 is retracted at the same time, so as to drive the mounting profile 801 to reset. The receiving rod 804 and the first coated wafer 13 are raised. After the second coated wafer 13 is received, the third cylinder 811 is reset. The first coated wafer 13 is dried on the second heating table 81 from the left. In this way, the coated wafers 13 are dried on the 14 heating tables 81 from left to right, and then are cooled on the 4 cooling tables 803. In the process of transferring the coated wafers 13 from the coating to the receiving, the coated wafers 13 are dried on the heating tables 81 for a longer time, so that the coated wafers 13 are completely dried. The cooling tables 803 are arranged to cool the dried coated wafers 13, which is convenient for receiving and storing.

[0055] The third carrying mechanism 11 is used for carrying the wafer 13 from the cooling table 803 at the right end of the heating mechanism 8 to the receiving mechanism 10, and the third carrying mechanism 11 comprises a second linear module 111, a fifth cylinder 112 and a third mounting plate 113, the fifth cylinder 112 is fixedly installed on the moving end of the second linear module 111, and the output end of the fifth cylinder 112 is fixedly installed with the third mounting plate 113, and the lower end of the third mounting plate 113 is installed with a wafer clamping mechanism 15.

[0056] The turning mechanism 12 comprises a third linear module 121, a rotating cylinder 122 and a fourth mounting plate 123, the rotating cylinder 122 is fixedly installed on the moving end of the third linear module 121, and the output end of the rotating cylinder 122 is fixedly installed with the fourth mounting plate 123, and the fourth mounting plate 123 is installed with a wafer clamping mechanism 15.

[0057] The wafer clamping mechanism 15 comprises a double-head cylinder 151, a fifth mounting plate 152 and a clamping rod 153, the two output ends of the double-head cylinder 151 are respectively installed with a fifth mounting plate 152, and the lower end of the fifth mounting plate 152 is symmetrically installed with two clamping rods 153, and through the extension and retraction of the piston rod of the double-head cylinder 151, the two fifth mounting plates 152 are driven to relatively approach or move away, and the four clamping rods 153 are driven to clamp the wafer.

[0058] The working principle of the present application is as follows:

[0059] The wafer 13 without a source is carried from the feeding mechanism 2 to the conveying mechanism 3 through the first carrying mechanism 4, the wafer 13 without a source is conveyed from the left end to the right end through the conveying mechanism 3, the wafer 13 without a source is separated from the wafer 13 with a source through the blocking rod 34 and the blocking cylinder 35 in the conveying process, so that only one wafer 13 without a source is conveyed to the right end of the conveying machine 31 each time; then the wafer 13 without a source is carried from the conveying mechanism 3 to the rotating mechanism 6 through the second carrying mechanism 9, the brush 511 is dipped into the solvent bottle 14 to absorb the diffusion source under the drive of the solvent coating mechanism 5, then the brush 511 is moved above the rotating mechanism 6 to coat the wafer 13 without a source, after the coating is completed, the wafer 13 with a source is carried from the rotating mechanism 6 to the heating mechanism 8 through the second carrying mechanism 9, and the wafer 13 without a source is carried into the rotating mechanism 6; the wafer 13 with a source is completely dried and cooled through the heating mechanism 8; after the drying and cooling are completed, the wafer 13 is carried from the heating mechanism 8 to the receiving mechanism 10 through the third carrying mechanism 11 for storage, in addition, the present application also sets the turning mechanism 12, the wafer 13 after drying can be taken out and turned over, and the wafer 13 is carried into the receiving mechanism 10 through the third carrying mechanism 11, so as to facilitate the placement of the wafer 13 according to the customer's demand.

[0060] While embodiments of the application have been shown and described, it is to be understood that the application is not limited to the details of the embodiments described, since various modifications can be made by those skilled in the art, without departing from the spirit and scope of the application, which are defined by the appended claims and their equivalents.

Claims

1. A wafer heating coating source machine, comprising a rack (1), a protective cover (16) arranged above the rack (1), the rack (1) being composed of a first support table (101), a second support table (102) and a third support table (103) connected in sequence from left to right, characterized in that: a feeding mechanism (2), a conveying mechanism (3), a solvent coating mechanism (5), a rotating mechanism (6), a magnetic stirrer (7), a heating mechanism (8) and a receiving mechanism (10) are arranged in sequence from left to right above the rack (1), the magnetic stirrer (7) is provided with a solvent bottle (14) for containing diffusion source, a first carrying mechanism (4) is arranged on one side of the feeding mechanism (2) and the conveying mechanism (3), a second carrying mechanism (9) is arranged on one side of the conveying mechanism (3), the solvent coating mechanism (5), the rotating mechanism (6), the magnetic stirrer (7) and the heating mechanism (8), a third carrying mechanism (11) is arranged on one side of the right end of the heating mechanism (8) and the receiving mechanism (10), and a turnover mechanism (12) is arranged on the other side of the third carrying mechanism (11); the feeding mechanism (2), the conveying mechanism (3), the first carrying mechanism (4), the solvent coating mechanism (5), the rotating mechanism (6), the magnetic stirrer (7) and the second carrying mechanism (9) are arranged on the first support table (101), the heating mechanism (8) is arranged on the second support table (102), and the receiving mechanism (10), the third carrying mechanism (11) and the turnover mechanism (12) are arranged on the third support table (103); the feeding mechanism (2) and the receiving mechanism (10) are used for storing wafers (13), the conveying mechanism (3) comprises a conveyor (31), a support leg (32), a receiving box (33), a material blocking rod (34) and a material blocking cylinder (35), the conveyor (31) is fixed on the support leg (32), the receiving box (33) is arranged on the outer side of the middle section of the conveyor (31) in an inclined manner, the material blocking rod (34) is connected with the material blocking cylinder (35), the material blocking cylinder (35) is fixed on the conveyor (31) and opposite to the receiving box (33); the first carrying mechanism (4) is used for carrying the wafer (13) from the feeding mechanism (2) to the conveying mechanism (3), the second carrying mechanism (9) is used for carrying the wafer (13) from the conveying mechanism (3) to the rotating mechanism (6), and then carrying the wafer (13) from the rotating mechanism (6) to the heating mechanism (8), and the third carrying mechanism (11) is used for carrying the wafer (13) from the heating mechanism (8) to the receiving mechanism (10); the solvent coating mechanism (5) comprises a brush holder (510) for fixing a brush (511), the brush holder (510) is fixed on a rotating lifting mechanism, the rotating lifting mechanism is used for driving the brush (511) to dip diffusion source in the solvent bottle (14), and then driving the brush (511) to move above the rotating mechanism (6). The rotating mechanism (6) comprises a coating source disc (61), a rotating disc (62), a first synchronous pulley (63), a second synchronous pulley (64) and a third motor (65), the rotating disc (62) is concentrically arranged in the coating source disc (61), a mounting shaft at the lower end of the rotating disc (62) is rotatably mounted in the coating source disc (61), the first synchronous pulley (63) is fixed on the mounting shaft of the coating source disc (61), and the first synchronous pulley (63) is in transmission connection with the second synchronous pulley (64) through a synchronous belt, the second synchronous pulley (64) is fixed on the motor shaft of the third motor (65); The heating mechanism (8) comprises a mounting profile (801), a heating table (802), a cooling table (803), a material receiving rod (804), a groove (805), a second cylinder (806), a connecting leg (807), a sliding rail (808), a guide block (809), a connecting block (810) and a third cylinder (811), a plurality of heating tables (802) are equidistantly arranged at the upper end of the mounting profile (801), a plurality of cooling tables (803) are also equidistantly arranged at the upper end of the mounting profile (801), the cooling tables (803) are arranged at the right end of the heating tables (802), the heating tables (802) and the cooling tables (803) are the same in structure, and the grooves (805) are arranged on the heating tables (802) and the cooling tables (803), the grooves (805) are used for placing wafers (13) and the material receiving rod (804), the two material receiving rods (804) are arranged in parallel, the left and right ends of the two material receiving rods (804) are fixed on the connecting block (810), the connecting block (810) is fixed on the output end of the third cylinder (811), the lower end of the mounting profile (801) is fixedly provided with the sliding rail (808), the sliding rail (808) is slidably arranged in the guide block (809), and the guide block (809) and the second cylinder (806) are fixed on the second supporting table (102); the piston rod of the second cylinder (806) is fixedly connected with the mounting profile (801) through the connecting leg (807); The material receiving mechanism (10) and the material placing mechanism (2) are the same in structure; The first carrying mechanism (4) comprises a mounting box (41), a guide rail (42), a first cylinder (43), a suction cup mounting seat (44) and a suction cup (45), the guide rail (42) is arranged in the mounting box (41), the first cylinder (43) is fixed outside the mounting box (41), the piston rod of the first cylinder (43) extends into the mounting box (41) and is fixedly connected with a sliding block, the sliding block is slidably arranged on the guide rail (42), and the outer side of the sliding block is fixedly provided with the suction cup mounting seat (44); and the lower end of the suction cup mounting seat (44) is fixedly provided with the suction cup (45) for adsorbing the wafer (13).

2. A wafer heated source coating apparatus as defined in claim 1, wherein: The first conveying mechanism (4), the second conveying mechanism (9) and the third conveying mechanism (11) are arranged at the center of the rack (1), and the feeding mechanism (2), the conveying mechanism (3), the solvent coating mechanism (5), the rotating mechanism (6), the magnetic stirrer (7), the heating mechanism (8) and the receiving mechanism (10) are arranged in two groups and symmetrically arranged on the front and back sides of the first conveying mechanism (4), the second conveying mechanism (9) and the third conveying mechanism (11).

3. A wafer heated source coating apparatus as defined in claim 2, wherein: The feeding mechanism (2) comprises a fourth motor (21), a placing plate (22), a fixed plate (23), a mounting rod (24), an air nozzle (25), a positioning rod (26), a top disc (27), a lead screw (28) and a top column (29), the fixed plate (23) is fixed on the first supporting table (101), the placing plate (22) is arranged in parallel above the fixed plate (23), the lower end of the fixed plate (23) is fixedly connected with the fourth motor (21), the motor shaft of the fourth motor (21) is connected with the lead screw (28), two top columns (29) are arranged in parallel on the two sides of the lead screw (28), the lower ends of the two top columns (29) are fixedly connected with the adjusting plate, a screw hole matched with the lead screw (28) is arranged at the center of the adjusting plate, the two top columns (29) are slidably arranged on the fixed plate (23), the upper ends of the two top columns (29) are fixedly connected with the lower end of the top disc (27), the top disc (27) is arranged at the center of the placing plate (22), the upper end of the top disc (27) is used for stacking the wafer (13), a plurality of positioning rods (26) are fixedly arranged on the upper end of the placing plate (22) in a circular array, two mounting rods (24) are symmetrically fixed on the upper end of the positioning rods (26), and the air nozzle (25) is fixedly arranged above the mounting rod (24).

4. A wafer-heated source coating machine according to claim 3, characterized in that: The rotating lifting mechanism comprises a first mounting plate (501) fixed on the rack (1), a threaded sleeve (503) rotatably arranged on the first mounting plate (501), a screw rod (502) threadedly arranged in the threaded sleeve (503), a first pulley (504) arranged on the screw rod (502), a second pulley (505) in transmission connection with the first pulley (504) through a belt, the second pulley (505) fixed on the motor shaft of a first motor (506), a third pulley (507) fixedly connected with the lower end of the threaded sleeve (503), a fourth pulley (508) in transmission connection with the third pulley (507) through a belt, the fourth pulley (508) fixed on the motor shaft of a second motor (509), and the first motor (506) and the second motor (509) fixed on the first mounting plate (501).

5. A wafer-heated source coating machine according to claim 3, characterized in that: The turnover mechanism (12) comprises a third linear module (121), a rotating air cylinder (122) and a fourth mounting plate (123), the rotating air cylinder (122) is fixedly arranged on the moving end of the third linear module (121), the fourth mounting plate (123) is fixedly arranged on the output end of the rotating air cylinder (122), and the wafer clamping mechanism (15) is arranged on the fourth mounting plate (123).

6. A wafer heated source coating apparatus as defined in claim 3, wherein: The second carrying mechanism (9) comprises a first linear module (91), a moving block (92), a fourth cylinder (93) and a second mounting plate (94), the output end of the first linear module (91) is fixedly provided with the moving block (92), the fourth cylinder (93) is fixed to the outer side of the moving block (92), the output end of the fourth cylinder (93) is fixedly connected with the second mounting plate (94), and the left and right ends of the lower end of the second mounting plate (94) are respectively provided with a wafer clamping mechanism (15).

7. A wafer heated source coating apparatus as defined in claim 3, wherein: The third carrying mechanism (11) comprises a second linear module (111), a fifth cylinder (112) and a third mounting plate (113), the fifth cylinder (112) is fixedly installed on the moving end of the second linear module (111), the output end of the fifth cylinder (112) is fixedly provided with the third mounting plate (113), and the lower end of the third mounting plate (113) is provided with a wafer clamping mechanism (15).

8. A wafer-heated source applicator as claimed in any one of claims 5 to 7, characterized in that: The wafer clamping mechanism (15) comprises a double-head cylinder (151), a fifth mounting plate (152) and a clamping rod (153), the two output ends of the double-head cylinder (151) are respectively provided with a fifth mounting plate (152), and the lower end of the fifth mounting plate (152) is symmetrically provided with two clamping rods (153).

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