Method for manufacturing laminated body, laminated body and method for forming microstructure

Abstract

The present invention provides a method for manufacturing a laminated body, a laminated body and a method for forming a microstructure, which can form a state in which the gas between a mold and a formed object is reliably removed and can perform single-chip processing in an imprint method. The method for manufacturing a laminated body comprises: a sealing material (4) configuration step, in which the sealing material (4) is configured on either or both of the mold (1) and the object (2) in such a manner that the sealing material (4) can surround the molded surface of the object (2) when the mold (1) and the object (2) are laminated; a decompression step, in which the atmosphere around the mold (1) and the object (2) is decompressed while the mold (1) and the object (2) are separated; a sealing step, in which the mold (1) and the object (2) are overlapped and the mold (1) and the object (2) are sealed with the sealing material (4); and a first pressurizing step, in which a fluid is used to pressurize the mold (1) and the object (2) while the mold (1) and the object (2) are sealed, wherein the sealing material (4) is configured to have fluidity at least in the sealing step, and the sealing material (4) is only adhered to either the mold (1) or the object (2) when the mold (1) and the object (2) are demolded.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a laminated body, a laminated body and a method for forming a microstructure, which are characterized in that a mold and a molded object are laminated together after the gas between them is removed. Background Art

[0002] In recent years, nanoimprint technology has attracted attention as a method for forming ultra-fine patterns at the micron level, nanometer level, etc. This is a technology that pressurizes a mold with a fine pattern on a molded object such as a resin to transfer the pattern to the molded object. In this imprint technology, in order to expand the transfer area, an imprint device that uses fluid pressure is considered.

[0003] Here, in an imprinting device using fluid pressure, the gas between the mold and the object sometimes causes uneven pressurization during transfer, resulting in poor transfer. Therefore, a degassing unit is provided to reduce the pressure of the atmosphere around the mold and the object to be formed and remove the gas between the mold and the object to be formed (for example, Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. WO2012 / 165310 Summary of the invention

[0007] However, in this device, in order to prevent gas from entering between the mold and the object to be formed, it is necessary to seal the space between the mold and the object to be formed by a sealing unit until the transfer is completed, so there is a problem that single-piece processing cannot be performed.

[0008] Therefore, the present invention aims to provide a method for manufacturing a laminate, a method for forming a laminate and a fine structure, which can form a state in which the gas between the mold and the object to be formed is reliably removed and can perform single-chip processing in the imprint method.

[0009] In order to achieve the above-mentioned purpose, the method for manufacturing a laminated body of the present invention is used to manufacture a laminated body of a mold and a formed object, and the method for manufacturing a laminated body is characterized in that it includes: a sealing material configuration step, in which a sealing material is configured on either or both of the mold and the formed object in a manner that the sealing material can surround the formed surface of the formed object when the mold and the formed object are bonded together; a decompression step, in which the atmosphere around the mold and the formed object is decompressed while the mold and the formed object are separated; a sealing step, in which the mold and the formed object are overlapped and the mold and the formed object are sealed with the sealing material; and a first pressurizing step, in which a fluid is pressurized while the mold and the formed object are sealed, the sealing material being configured to have fluidity at least in the sealing step, and the sealing material is only bonded to either the mold or the formed object when the mold and the formed object are demolded.

[0010] In this case, the first surface treatment process can also be provided before the sealant configuration process, in which the first surface treatment process is formed in the mold and the object to be formed, so that the bonding force between the mold and the object to be formed and the sealant is improved. The first surface treatment part can be set to the primer that improves the bonding force between the sealant and the mold or the sealant and the object to be formed. In addition, the first surface treatment part can also be set to implement plasma treatment or corona treatment that improves the bonding force between the sealant and the mold or the sealant and the object to be formed. In addition, the first surface treatment part can also be set to be formed with the concave-convex that improves the bonding force between the sealant and the mold or the sealant and the object to be formed.

[0011] In addition, a second surface treatment step may be provided before the sealing material configuration step, in which a second surface treatment portion is formed on either the mold or the object to be formed to reduce the adhesion between the mold and the sealing material.

[0012] The sealing material is configured to adhere only to the formed object when the mold and the formed object are demolded, and can be formed of a material that can be removed by etching the formed surface. In addition, the sealing material can also be formed of a water-soluble resin. In addition, the sealing material can also be formed of a material whose adhesive force is reduced by irradiating light.

[0013] In addition, the sealing material configuration process is more preferably configured in the following manner: when the mold and the object to be formed are made parallel, the distance obtained by subtracting the thickness of the sealing material from the distance between the mold and the object to be formed at the position where the sealing material is configured is equal to or less than the distance between the mold and the formed surface of the object to be formed.

[0014] Furthermore, it is more preferable that the first pressurizing step is performed at atmospheric pressure.

[0015] In addition, the bonding body of the present invention is a bonding body of a mold having a molding surface and a molded object having a molded surface bonded to the molding surface, and the bonding body is characterized in that it has a sealing material that bonds the mold and the molded object in a manner of surrounding the molded surface, and the sealing material is configured to bond to only one of the mold and the molded object when the mold and the molded object are demolded.

[0016] In this case, it is more preferred that any one of the mold and the formed object has the first surface treatment portion that improves the bonding force between the mold and the formed object and the sealant. The first surface treatment portion may also be a primer that improves the bonding force between the sealant and the mold or the sealant and the formed object. In addition, the first surface treatment portion may also be a surface that has been subjected to plasma treatment or corona treatment that improves the bonding force between the sealant and the mold or the sealant and the formed object. The first surface treatment portion may also be a concave-convex that improves the bonding force between the sealant and the mold or the sealant and the formed object.

[0017] Furthermore, it is more preferable that either the mold or the molded object has a second surface treatment portion that reduces the adhesive force between either the mold or the molded object and the sealing material.

[0018] In addition, the sealing material is configured to adhere only to the formed object when the mold and the formed object are demoulded, and can be formed of a material that can be removed by etching the formed surface. In addition, the sealing material can also be formed of a water-soluble resin. In addition, the sealing material can also be formed of a material whose adhesive force decreases by irradiating light.

[0019] In addition, the microstructure forming method of the present invention is used to form a microstructure on a molded object, and the microstructure forming method is characterized by comprising a demolding step of separating the mold of the above-mentioned bonded body of the present invention from the molded object.

[0020] In this case, a second pressurizing step may be included in which the bonded body is pressurized by a fluid at a pressure greater than atmospheric pressure.

[0021] Furthermore, the method may include a light irradiation step of irradiating the bonded body with light to cure the molded object.

[0022] Furthermore, the method may include a sealing material removing step of removing the sealing material from the mold or the formed object.

[0023] In addition, the sealing material removing step may include removing the sealing material by dissolving it. In addition, the sealing material removing step may include removing the sealing material from the object to be formed by etching the surface to be formed.

[0024] Effects of the Invention

[0025] According to the present invention, by using a sealing material, it is possible to create a state in which the gas between the mold and the object to be formed is reliably removed. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a plan view showing a sealing material and a molded object according to the present invention.

[0027] Figure 2 It is a partial end view showing the sealing material arrangement step according to the present invention.

[0028] Figure 3 It is a partial end view showing another sealing material disposing step according to the present invention.

[0029] Figure 4 It is a partial end view showing another sealing material disposing step according to the present invention.

[0030] Figure 5 It is a partial end view showing another sealing material disposing step according to the present invention.

[0031] Figure 6 It is a partial end view showing the sealing step according to the present invention.

[0032] Figure 7 It is a partial end view showing another sealing step according to the present invention.

[0033] Figure 8 It is a partial end view showing the bonded body according to the present invention.

[0034] Fig. 9 It is a partial end view showing the demolding step according to the present invention.

[0035] Fig.10 It is a partial end view showing another demolding step according to the present invention.

[0036] Fig.11 It is a partial end view showing the sealing material removing step according to the present invention.

[0037] Description of Reference Numerals

[0038] 1. Mold

[0039] 2 Formed object

[0040] 4 Sealing material

[0041] 5. Enclosed Space

[0042] 21 substrate

[0043] 22 Formed layer DETAILED DESCRIPTION

[0044] use Figures 1 to 9 The method for producing a bonded body of the present invention is described below. The method for producing a bonded body of the present invention is used to produce a bonded body of a mold 1 and a molded object 2, and mainly includes a sealing material placement step, a decompression step, a sealing step, and a first pressurization step.

[0045] Furthermore, in the present specification, the mold 1 is formed of, for example, "metals such as nickel", "ceramics", "carbon materials such as glassy carbon", "silicon", etc., and has a prescribed pattern on one end face (molding surface 15). The pattern can be formed by precision machining the molding surface 15. In addition, it can also be formed on a silicon substrate by semiconductor micromachining techniques such as etching, or by electroplating the surface of the silicon substrate by electroforming, such as nickel electroplating, and then peeling off the metal plating. In addition, a resin mold made by imprinting technology can also be used. In this case, the mold 1 can also be formed into a film-like shape that is flexible relative to the molding surface of the molded object 2. Of course, as long as the mold 1 can form a fine pattern, there is no particular limitation on the material or its manufacturing method.

[0046] In addition, the molding pattern formed on the mold 1 includes not only geometric shapes including concave and convex shapes, but also patterns for transferring a specified surface state, such as a transfer of a mirror state with a specified surface roughness, or patterns for transferring optical elements such as lenses with a specified curved surface. In addition, the minimum size of the width of the convex portion or the width of the concave portion in the plane direction of the molding pattern is formed to various sizes such as less than 100 μm, less than 10 μm, less than 2 μm, less than 1 μm, less than 100 nm, and less than 10 nm. In addition, the size in the depth direction is also formed to various sizes such as more than 10 nm, more than 100 nm, more than 200 nm, more than 500 nm, more than 1 μm, more than 10 μm, and more than 100 μm.

[0047] In addition, the molded object 2 can be any as long as it has a molded surface 25 that can be imprinted. For example, there is a molded object obtained by forming a molded layer 22 with fluidity on a substrate 21 or a film formed of a resin, an inorganic compound, or a metal, or a molded object that is only in the form of a substrate, or a molded object that is in the form of a flexible film. In addition, it can also be a molded object as described below: a molded layer 22 with fluidity is formed on the mold 1, and the molded layer 22 is bonded to the substrate 21 side when the substrate 21 and the mold 1 are pressurized. In addition, the molded object 2 is not limited to a flat surface, and for example, it also includes a shape in which the molded surface is a curved surface such as a lens.

[0048] As the material of the molded object 2 , for example, a photocurable resin, a thermosetting resin, or a thermoplastic resin can be used.

[0049] As photocurable resin or thermosetting resin, compounds containing unsaturated hydrocarbon groups such as vinyl, allyl groups, etc. can be used as compounds containing epoxides, (meth) acrylate compounds, vinyl ether compounds, and diallyl nadic imide compounds. In this case, in order to carry out thermal polymerization, compounds containing polymerization-reactive groups can be used alone, and in order to improve thermosetting, a thermoreactive initiator can also be added to use. It can also be a mode that can form a molding pattern by adding a photoreactive initiator and irradiating light to promote polymerization. As a thermoreactive free radical initiator, organic peroxides and azo compounds can be preferably used, and as a photoreactive free radical initiator, acetophenone derivatives, benzophenone derivatives, benzoin ether derivatives, xanthone derivatives, etc. can be preferably used. In addition, reactive monomers can be used in a mode without solvents, or can be used in a mode of desolvating after being dissolved in a solvent and applied.

[0050] In addition, as thermoplastic resins, cycloolefin resins such as cycloolefin ring-opening polymerization / hydrogen addition (COP) or cycloolefin copolymer (COC), acrylic resins, polycarbonate, vinyl ether resins, perfluoroalkoxy resins (PFA) or fluororesins such as polytetrafluoroethylene (PTFE), polystyrene, polyimide resins, polyester resins, etc. can be used.

[0051] In the sealing material placement step, the sealing material 4 is placed on one or both of the mold 1 and the molded object 2 so as to surround the molding surface 25 of the molded object 2 when the mold 1 and the molded object 2 are bonded together. Figure 1 , Figure 2 The figure shows a case where a sealing material 4 is arranged on the side of the formed object 2. Figure 3 Indicates the case where it is arranged on the mold 1 side. Figure 4 The case where the sealing material 4 is disposed on both the mold 1 and the molded object 2 is shown.

[0052] The seal material 4 can be arranged in any way as long as it does not have a bad influence on the formed surface in the sealing process described later. For example, from the cost aspect of the seal material 4, it can be surrounded with the shortest distance as much as possible. In addition, it is also possible to surround in a manner that a space is left between the formed surface 25 for cutting off the part configured with the seal material 4.

[0053] In addition, the sealing material 4 is configured to have a thickness that can reliably seal the mold 1 and the molded object 2 in the sealing process described later. Figure 2 to Figure 5 As shown, when the mold 1 and the molded object 2 are parallel, it is more preferable to arrange them in the following manner: the distance B obtained by subtracting the thickness of the sealant 4 from the distance between the mold 1 and the molded object 2 (substrate 21) at the position where the sealant 4 is arranged is equal to or less than the distance A between the molding surface of the mold 1 and the molded surface of the molded object 2. As long as it is configured in this way, the sealant 4 can be sealed in a manner that reliably contacts the mold 1 and the molded object 2 through the sealing process described later (refer to Figure 6 , Figure 7 ).

[0054] In the decompression process, in order to remove the gas between the mold 1 and the object 2 that causes bubbles when laminating, the atmosphere around the mold 1 and the object 2 is decompressed while the mold 1 and the object 2 are separated. The decompression is set to at least a pressure below which transfer failure does not occur due to residual gas when the molding pattern of the mold 1 is transferred to the object 2. This also depends on the material of the object 2, and can be set to 50Pa or less, preferably 10P or less. The decompression method can be any method as long as it can decompress the atmosphere around the mold 1 and the object 2. For example, a method of degassing the gas in the vacuum chamber where the mold 1 and the object 2 are provided using a vacuum pump or the like can be used.

[0055] like Figure 6 , Figure 7 As shown, in the sealing step, the mold 1 and the formed object 2 are overlapped, and the mold 1 and the formed object 2 are sealed with a sealing material 4. Thus, it is sufficient as long as a closed space 5 can be formed by the mold 1, the formed object 2 and the sealing material 4. In addition, the molding surface 15 of the mold 1 and the molding surface 25 of the formed object 2 can be in contact.

[0056] like Figure 8As shown, in the first pressurizing step, the mold 1 and the object 2 are sealed by a fluid. Thus, the mold 1 and the object 2 can be attached to each other without bubbles. In the first pressurizing step, any pressure can be used as long as it is higher than the pressure in the closed space 5 formed by the mold 1, the object 2 and the sealing material 4 and the mold 1 and the object 2 are in close contact. For example, the pressure can be applied at atmospheric pressure.

[0057] In addition, in the laminating body manufacturing method of the present invention, the above-mentioned sealant 4 uses a sealant with fluidity at least in the sealing process. Thus, even if there are concavo-convex etc. on the surface of the mold 1 or the formed object 2, it is possible to reliably seal by flowing. As the sealant, for example, a light-curing resin or a thermosetting resin can be used. In addition, as long as it can function as the sealant, the same material as the formed object can also be used.

[0058] In addition, the sealing material 4 is configured so that when the mold 1 and the formed object 2 are demolded, the sealing material 4 is only bonded to one of the mold 1 and the formed object 2. Thus, after the mold 1 and the formed object 2 are demolded, the sealing material 4 can be easily removed. For example, when the sealing material 4 is configured so that the sealing material 4 is bonded to the formed object 2 side during demolding, it is sufficient to remove the portion bonded with the sealing material 4 from the formed object 2 by cutting. In the case where there is a step of cutting the formed object 2 in the process after demolding, the removal can be performed in the cutting process.

[0059] The seal material 4 is configured to adhere only to the molded object 2 when the mold 1 and the molded object 2 are demolded, and can be formed of a material that can be removed by etching the molded surface 25. By adopting this method, the seal material 4 can be removed simultaneously during etching, which can simplify the process.

[0060] As a method for bonding the sealing material 4 to only one of the mold 1 and the molded object 2 when the mold 1 and the molded object 2 are demolded, it is sufficient to make the bonding force of the side to be bonded to the sealing material 4 greater than the bonding force of the side not bonded to the sealing material 4. Of course, the bonding force of the side not bonded to the sealing material 4 is smaller than the force that causes the sealing material 4 to be damaged.

[0061] For example, the first surface treatment step is performed before the sealant disposing step, and in the first surface treatment step, a first surface treatment portion is formed on either the mold 1 or the formed object 2 to improve the bonding force between the mold 1 and the formed object 2 and the sealant 4. As the first surface treatment portion, the bonding force can be improved chemically or physically.

[0062] In this case, as the first surface treatment portion, for example, a primer that improves the bonding force between sealant 4 and mold 1 or sealant 4 and the formed object 2 can be used. In addition, as the first surface treatment portion, plasma treatment or corona treatment that improves the bonding force between sealant 4 and mold 1 or sealant 4 and the formed object 2 can also be implemented. And, as the first surface treatment portion, the concavo-convex that improves the bonding force between sealant 4 and mold 1 or sealant 4 and the formed object 2 can also be formed. Of course, the above-mentioned two or more modes can also be used in combination.

[0063] In addition, before the sealant disposing step, a second surface treatment step is performed, in which a second surface treatment portion that reduces the adhesive force between the sealant 4 and the mold 1 and the molded object 2 is formed on either one of the mold 1 and the molded object 2. In this case, a release agent, for example, can be used as the second surface treatment portion.

[0064] As described above, the sealing material 4 can be removed by cutting or the like, or a material that is easy to remove after demolding can be used. For example, the sealing material 4 is configured so that the sealing material 4 is only bonded to the molded object 2 when the mold 1 and the molded object 2 are demolded, and can be formed of a material that can be removed by etching the molded surface 25. By adopting such a method, the sealing material 4 can be removed simultaneously when the molded object 2 is etched.

[0065] In addition, the sealing material 4 may be made of a water-soluble resin, thereby making it easy to clean.

[0066] In addition, the sealant 4 can also be set to a material whose adhesive force is reduced by irradiating light of a specified wavelength. In this case, when the specified wavelength is different from the wavelength of the light used for photo-embossing, the sealant 4 can be removed by irradiating the specified light after the pattern transfer is reliably performed by photo-embossing. In addition, when the specified wavelength is the same as the wavelength of the light used for photo-embossing, the adhesive force of the sealant 4 can be reduced while irradiating the light of photo-embossing.

[0067] Next, use Figure 8 The laminated body of the present invention is described. The laminated body of the present invention is a laminated body comprising a mold 1 having a molding surface 15 and a molded object 2 having a molded surface 25 that is laminated to the molding surface 15, and a sealing material 4 that bonds the mold 1 to the molded object 2 in a manner that surrounds the molded surface 25. In addition, the sealing material 4 is configured so that when the mold 1 and the molded object 2 are demolded, the sealing material 4 is bonded to only one of the mold 1 and the molded object 2. In addition, the same parts as those described in the above-mentioned method for manufacturing the laminated body of the present invention are marked with the same figure marks and the description is omitted.

[0068] Here, as described in the bonding method of the present invention, either one of the mold 1 and the formed object 2 may also have the first surface treatment portion that improves the bonding force between the mold 1 and the formed object 2 and the sealant 4. In this case, the first surface treatment portion can use a primer that improves the bonding force between the sealant 4 and the mold 1 or the sealant 4 and the formed object 2. In addition, the first surface treatment portion may also be a surface that has been subjected to plasma treatment or corona treatment that improves the bonding force between the sealant 4 and the mold 1 or the sealant 4 and the formed object 2. In addition, the first surface treatment portion may also be a concave-convex that improves the bonding force between the sealant 4 and the mold 1 or the sealant 4 and the formed object 2.

[0069] In addition, as described in the laminate manufacturing method of the present invention, either the mold 1 or the formed object 2 may have a second surface treatment portion that reduces the adhesive force between the mold 1 and the formed object 2 and the sealant 4. In this case, a release agent, for example, can be used as the second surface treatment portion.

[0070] In addition, the sealing material 4 can also use a material that is easy to remove after demoulding. For example, the sealing material 4 is configured to be bonded only to the molded object 2 when the mold 1 and the molded object 2 are demoulded, and can be formed by a material that can be removed by etching the molded surface 25. In addition, the sealing material 4 can also be set to a water-soluble resin. In addition, the sealing material 4 can also be set to a material that reduces the bonding force by irradiating light of a specified wavelength.

[0071] In addition, the microstructure forming method of the present invention is described. The microstructure forming method of the present invention is used to form a microstructure on a molded object 2, and at least includes a demolding step of separating the mold 1 of the above-mentioned laminated body of the present invention from the molded object 2. In the demolding step, Fig. 9 The seal material 4 is demolded in a manner such that it is bonded only to the molded object 2 as shown, or Fig.10 As shown, the seal material 4 is demolded so as to be bonded only to the mold 1. As the demolding method, a conventionally used method can be used.

[0072] In addition, the microstructure forming method of the present invention may also include a second pressurizing step of pressurizing the laminated body with a fluid at a pressure greater than atmospheric pressure before the demolding step. Thus, the pattern of the mold 1 can be reliably transferred to the formed object 2. In addition, when the pattern of the mold 1 is transferred to the formed object 2 by the first pressurizing step of the above-mentioned laminate manufacturing method, the second pressurizing step may not be performed.

[0073] When the fine structure forming method of the present invention is applied to photoimprinting, a light irradiation step is included in which the laminate is irradiated with light to cure the molded object 2. In this case, the irradiated light has a wavelength capable of curing the molded object 2.

[0074] The sealing material removal step is to remove the sealing material 4 from the mold 1 or the molded object 2. For example, the sealing material 4 is bonded to the molded object 2 during demolding. Fig.11 As shown, as long as the part bonded with the sealant 4 is removed from the formed object 2 by cutting. In the case where there is a process of cutting the formed object 2 in the process after demolding, the removal can be performed in the cutting process. In addition, the sealant removal process can also remove the sealant 4 by dissolving it. In this case, as long as the sealant 4 is set to a water-soluble resin, the sealant 4 can be easily cleaned with water. In addition, the sealant removal process can also remove the sealant 4 from the formed object 2 by etching the molded surface 25. In the case where there is a process of etching the formed object 2 in the process after demolding, the removal can be performed while etching.

[0075] Furthermore, when the sealing material 4 is made of a material whose adhesive force is reduced by irradiation with light of a predetermined wavelength, the sealing material removing step may be performed by irradiating the sealing material 4 with light of a predetermined wavelength to reduce the adhesive force and then removing the sealing material.

Claims

1. A method for manufacturing a laminated body, which is used to manufacture a laminated body of a mold and a molded object, the method for manufacturing a laminated body is characterized by comprising: a sealing material disposing step of disposing a sealing material on one or both of the mold and the object to be formed so as to surround a formed surface of the object to be formed when the mold and the object to be formed are bonded together; a decompression step of decompressing the atmosphere around the mold and the object to be formed while the mold and the object to be formed are separated; A sealing step of overlapping the mold and the object to be formed and sealing the mold and the object to be formed with the sealing material; as well as The first pressurizing step is to pressurize the mold and the object to be formed by a fluid so that they are in close contact with each other while the space between the mold and the object to be formed is sealed. The sealing material is configured to have fluidity at least in the sealing step, and to adhere to only one of the mold and the molded object when the mold and the molded object are separated.

2. The method for manufacturing a laminate according to claim 1, wherein: A first surface treatment step is provided before the sealing material configuration step. In the first surface treatment step, a first surface treatment portion is formed on either the mold or the formed object to improve the adhesion between the mold and the formed object and the sealing material.

3. The method for manufacturing a laminate according to claim 2, wherein: The first surface treatment portion is a primer that improves the adhesive force between the sealing material and the mold or between the sealing material and the formed object.

4. The method for manufacturing a laminate according to claim 2, wherein: The first surface treatment portion is subjected to a plasma treatment or a corona treatment for improving the adhesive force between the sealing material and the mold or between the sealing material and the formed object.

5. The method for manufacturing a laminate according to claim 2, wherein: The first surface treatment portion has projections and depressions that enhance adhesion between the sealing material and the mold or between the sealing material and the molded object.

6. The method for producing a laminated body according to any one of claims 1 to 5, characterized in that: A second surface treatment step is provided before the sealing material disposing step. In the second surface treatment step, a second surface treatment portion is formed on either the mold or the formed object to reduce the adhesion between the mold and the sealing material.

7. The method for producing a laminated body according to any one of claims 1 to 5, characterized in that: The sealing material is configured so as to adhere only to the object to be formed when the mold and the object to be formed are separated, and is formed of a material that can be removed by etching the molding surface.

8. The method for producing a laminated body according to any one of claims 1 to 5, characterized in that: The sealing material is formed of a water-soluble resin.

9. The method for producing a laminated body according to any one of claims 1 to 5, characterized in that: The sealing material is formed of a material whose adhesive strength is reduced by irradiation with light.

10. The method for producing a laminated body according to any one of claims 1 to 5, characterized in that: The sealing material configuration process is configured in the following manner: when the mold and the object to be formed are made parallel, the distance obtained by subtracting the thickness of the sealing material from the distance between the mold and the object to be formed at the position where the sealing material is configured is equal to or less than the distance between the mold and the formed surface of the object to be formed.

11. The method for producing a laminated body according to any one of claims 1 to 5, characterized in that: The first pressurizing step is performed by pressurizing at atmospheric pressure.

12. A laminated body, which is a laminated body of a mold having a molding surface and a molded object having a molded surface that is laminated to the molding surface, wherein: A sealing material is provided for bonding the mold and the object to be formed in a manner of surrounding the formed surface, the sealing material seals the mold and the object to be formed with an atmosphere below 50 Pa, and the sealing material is configured to bond only to one of the mold and the object to be formed when the mold and the object to be formed are demolded.

13. The adhesive body according to claim 12, characterized in that: Either the mold or the molded object has a first surface treatment portion that improves adhesion between the mold or the molded object and the sealing material.

14. The adhesive body according to claim 13, characterized in that: The first surface treatment portion is a primer that improves the adhesive force between the sealing material and the mold or between the sealing material and the formed object.

15. The adhesive body according to claim 13, characterized in that: The first surface treated portion is a surface subjected to a plasma treatment or a corona treatment for improving the adhesive force between the sealing material and the mold or between the sealing material and the formed object.

16. The adhesive body according to claim 13, characterized in that: The first surface treatment portion is a concavo-convex portion that improves the adhesive force between the sealing material and the mold or between the sealing material and the molded object.

17. The laminate according to any one of claims 12 to 16, characterized in that: Either the mold or the molded object has a second surface treatment portion that reduces adhesion between the mold or the molded object and the sealing material.

18. The laminate according to any one of claims 12 to 16, characterized in that: The sealing material is configured so as to adhere only to the object to be formed when the mold and the object to be formed are separated, and is formed of a material that can be removed by etching the molding surface.

19. The laminate according to any one of claims 12 to 16, characterized in that: The sealing material is formed of a water-soluble resin.

20. The laminate according to any one of claims 12 to 16, characterized in that: The sealing material is formed of a material whose adhesive strength is reduced by irradiation with light.

21. A method for forming a microstructure, which is used to form a microstructure on a formed object, wherein: The method comprises a demolding step of separating the mold of the bonded body according to any one of claims 12 to 20 from the object to be formed.

22. The method for forming a microstructure according to claim 21, wherein: The method includes a second pressurizing step in which the bonded body is pressurized by a fluid at a pressure greater than atmospheric pressure.

23. The microstructure forming method according to claim 21 or 22, characterized in that: The method comprises a light irradiation step of irradiating the bonded body with light to cure the formed object.

24. The microstructure forming method according to claim 21 or 22, characterized in that: The method includes a sealing material removing step of removing the sealing material from the mold or the object to be formed.

25. The method for forming a microstructure according to claim 24, wherein: The sealing material removing step removes the sealing material from the object to be formed by etching the surface to be formed.

26. The method for forming a microstructure according to claim 24, wherein: The sealing material removing step is to remove the sealing material by dissolving the sealing material.

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