An airborne distributed SAR signal processing system and its architecture design method
By designing an integrated missile-based distributed SAR signal processing system, using microsystem packaging technology and waveform multiplexing design, the existing system has been solved, and the system is miniaturized and intelligent, and the needs of complex electromagnetic environments are realized.
Patent Information
- Application Number
- CN202111316527.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-11-08
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2041-11-08
AI Technical Summary
Due to the discrete subsystem design of existing ammunition-load distributed SAR systems, the product is large in size, single in function, and low in intelligence, which cannot meet market demand and cannot adapt to complex electromagnetic environments.
By designing a bomb-mounted distributed SAR signal processing system including an intermediate frequency signal processing microsystem and a distributed SAR information processing microsystem, the SRIO high-speed bus is used for data interaction, and these microsystems are integrated into SiP modules, combining the microsystem packaging process and waveform multiplexing design to achieve miniaturization and intelligence of the system.
The signal processing hardware system is miniaturized, lightweight and low power consumption, making the system more versatile and can be adapted to different platforms such as airborne, satellite, and vehicle, improving the intelligence of the system and its adaptability to complex electromagnetic environments.
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Figure CN114021516B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of missile-borne distributed SAR signal processing, and more specifically, to a missile-borne distributed SAR signal processing system and its architecture design method. Background Art
[0002] The missile-borne distributed SAR system includes subsystems such as a missile-borne SAR transmitter, a missile-borne SAR receiver, and a missile-borne data link. Each subsystem is implemented by independent hardware and software. This discrete subsystem design results in a large product volume, single function, and low intelligence level, unable to meet market demands.
[0003] In the existing missile-borne distributed SAR imaging system, the transmitter and the receiver first calibrate the space-time-frequency synchronization information of the transmitter and the receiver through the missile-borne data link system. Then, during the movement of the launch platform and the receiving platform, the target area is imaged and identified through the distributed SAR imaging system. This system architecture is simple, with each system module being independent and having a single function, resulting in a large system volume, single mission mode, and low intelligence level, unable to adapt to complex electromagnetic environments. Summary of the Invention
[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a missile-borne distributed SAR signal processing system and its architecture design method, effectively reducing the size, weight, and power consumption of the signal processing hardware system, making the signal processing hardware system more versatile and capable of adapting to different platforms such as airborne, spaceborne, and vehicle-borne platforms.
[0005] The purpose of the present invention is achieved through the following solutions:
[0006] A missile-borne distributed SAR signal processing system includes an intermediate frequency signal processing microsystem and a distributed SAR information processing microsystem. The intermediate frequency signal processing microsystem and the distributed SAR information processing microsystem are interconnected through an SRIO high-speed bus for data interaction.
[0007] Furthermore, the intermediate frequency signal processing microsystem and the distributed SAR information processing microsystem are respectively integrated into the SiP form to obtain an intermediate frequency signal processing microsystem SiP module and a distributed SAR information processing microsystem SiP module.
[0008] Further, the intermediate frequency signal processing microsystem includes a digital-to-analog converter (DAC), an analog-to-digital converter (ADC), a field-programmable gate array (FPGA), a first double data rate 3 (DDR3) memory, a first Flash memory, a controller ARM, a first power supply, and a clock. The DAC and ADC are respectively connected to the FPGA. The controller ARM is connected to the FPGA. The first DDR3 memory, the first Flash memory, the first power supply, and the clock are respectively connected to the FPGA and the controller ARM.
[0009] Further, the distributed SAR information processing microsystem includes a central processing unit (CPU), a graphics processing unit (GPU), a second DDR3 memory, a second Flash memory, and a second power supply. The second DDR3 memory, the second Flash memory, and the second power supply are respectively connected to the CPU. The CPU is connected to the GPU.
[0010] Further, the intermediate frequency signal processing microsystem SiP module and the distributed SAR information processing microsystem SiP module are soldered and assembled on a printed circuit board (PCB) to form the signal processing hardware of the distributed SAR system.
[0011] An architecture design method for an airborne distributed SAR signal processing system as described in any one of the above, includes the steps of:
[0012] S1, making the array antenna and the radio frequency front end of the SAR imaging and the airborne data link system share through waveform multiplexing, separating the SAR imaging signal and the data link signal during signal processing in the signal processing system and then processing them separately;
[0013] S2, using the microsystem packaging process to implement the signal processing system described in step S1.
[0014] The beneficial effects of the present invention include:
[0015] (1) By combining design methods and packaging processes such as integrated radio frequency, waveform multiplexing, and microsystem packaging process, the present invention can carry multiple subsystems, integrate more functions, and achieve miniaturization and intelligence in a limited platform space.
[0016] (2) By combining the design concept of waveform multiplexing of distributed SAR and airborne data link with the microsystem packaging process, while realizing the functions of the multi-functional collaborative distributed SAR system, the present invention effectively reduces the size, weight, and power consumption of the signal processing hardware system, making the signal processing hardware system more versatile and capable of adapting to different platforms such as airborne, spaceborne, and vehicle-mounted.
[0017] (3) The present invention can effectively reduce the volume of the distributed SAR system, enhance the intelligence of the system, adapt to complex electromagnetic environments, and meet market demands. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 is a schematic diagram of the existing system architecture;
[0020] Figure 2 is a schematic diagram of the system architecture of the present invention;
[0021] Figure 3 is a composition diagram of the transmitter system of the present invention;
[0022] Figure 4 is a composition diagram of the receiver system of the present invention;
[0023] Figure 5 is a schematic diagram of the signal processing hardware of the present invention;
[0024] Figure 6 is a top view of the intermediate frequency signal processing microsystem SiP module of the present invention;
[0025] Figure 7 is a side view of the intermediate frequency signal processing microsystem SiP module of the present invention;
[0026] Figure 8 is a top view of the distributed SAR information processing microsystem SiP module of the present invention;
[0027] Figure 9 is a side view of the distributed SAR information processing microsystem SiP module of the present invention;
[0028] In the figure, 1 - SiP cover plate, 2 - TSV via hole, 3 - SiP housing. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] All the features disclosed in all the embodiments in this specification, or all the steps in the methods or processes implicitly disclosed, except for mutually exclusive features and / or steps, can be combined and / or extended, replaced in any manner.
[0030] Such as Figures 1 to 9As shown in the figure, a missile-borne distributed SAR signal processing system includes an intermediate frequency signal processing microsystem and a distributed SAR information processing microsystem. The intermediate frequency signal processing microsystem and the distributed SAR information processing microsystem are interconnected through an SRIO high-speed bus for data interaction.
[0031] In an alternative embodiment of the present invention, the intermediate frequency signal processing microsystem and the distributed SAR information processing microsystem are respectively integrated into the SiP form to obtain an intermediate frequency signal processing microsystem SiP module and a distributed SAR information processing microsystem SiP module. Specifically, as Figure 7 、 Figure 9 shown, two SiP modules of the intermediate frequency signal processing microsystem and the distributed SAR information processing microsystem are formed by SiP technologies such as TSV and three-dimensional heterogeneous integration, and both are provided with a SiP cover plate 1, TSV vias 2, and a SiP housing 3.
[0032] In an alternative embodiment of the present invention, the intermediate frequency signal processing microsystem includes a digital-to-analog converter DAC, an analog-to-digital converter ADC, a programmable logic device FPGA, a first memory DDR3, a first memory Flash, a controller ARM, a first power supply, and a clock. The digital-to-analog converter DAC and the analog-to-digital converter ADC are respectively connected to the programmable logic device FPGA, the controller ARM is connected to the programmable logic device FPGA, and the first memory DDR3, the first memory Flash, the first power supply, and the clock are respectively connected to the programmable logic device FPGA and the controller ARM.
[0033] In an alternative embodiment of the present invention, the distributed SAR information processing microsystem includes a processor CPU, a graphics processor GPU, a second memory DDR3, a second memory Flash, and a second power supply. The second memory DDR3, the second memory Flash, and the second power supply are respectively connected to the processor CPU, and the processor CPU is connected to the graphics processor GPU.
[0034] In an alternative embodiment of the present invention, the intermediate frequency signal processing microsystem SiP module and the distributed SAR information processing microsystem SiP module are welded and assembled on a PCB board to form the signal processing hardware of the distributed SAR system.
[0035] An architecture design method based on the missile-borne distributed SAR signal processing system described above includes the steps of:
[0036] S1, through waveform multiplexing, the array antenna and radio frequency front end of the SAR imaging and missile-borne data link system are shared, and when signal processing is performed in the signal processing system, the SAR imaging signal and the data link signal are separated and then processed separately;
[0037] S2. Implement the signal processing system described in step S1 by using the microsystem packaging process.
[0038] The embodiments of the present invention can effectively reduce the volume of the distributed SAR system, improve the intelligence of the system, adapt to complex electromagnetic environments, and meet market demands. It has the following advantages:
[0039] 1) Miniaturization, which enables the distributed SAR system to be more easily integrated into various application platforms, such as automotive autonomous driving, satellite exploration, precision guidance, etc.;
[0040] 2) Anti-interference. Through measures such as single-polarization transmission, dual-polarization reception, and waveform multiplexing, while improving the system resource utilization rate, it can effectively perform anti-interference and enhance environmental adaptability;
[0041] 3) Adopt the information processing architecture of CPU + GPU, make full use of the advantages of parallel computing of GPU, realize fast SAR imaging and image processing such as target recognition and positioning, reduce information processing delay, and enhance the real-time performance of distributed SAR information processing;
[0042] 4) At the software level, it is developed based on the operating system and application software. To the greatest extent, the application software is decoupled from the hardware. The real-time operating system is combined with application software such as distributed SAR imaging, target detection and recognition, and missile-borne data links, making the system reconfigurable and intelligent. Through software reconfiguration or upgrade, the system is adapted and updated, greatly shortening the R & D cycle of similar products, reducing R & D costs, and enhancing the competitive advantage of the products.
[0043] Parts not involved in the present invention are the same as or can be implemented by using the prior art.
[0044] The above technical solutions are only one implementation manner of the present invention. For those skilled in the art, based on the disclosed application methods and principles of the present invention, it is very easy to make various types of improvements or deformations, not limited to the methods described in the above specific implementation manners of the present invention. Therefore, the previously described manner is only preferred and does not have a restrictive meaning.
[0045] Except for the above examples, those skilled in the art can obtain inspiration according to the above disclosure or make other embodiments by using the knowledge or technology in related fields. The features of each embodiment can be interchanged or replaced. As long as the changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, they should all be within the protection scope of the appended claims of the present invention.
Claims
1. An airborne distributed SAR signal processing system, characterized in that It includes an intermediate frequency signal processing microsystem and a distributed SAR information processing microsystem. The intermediate frequency signal processing microsystem and the distributed SAR information processing microsystem are interconnected through an SRIO high-speed bus for data interaction; Integrate the intermediate frequency signal processing microsystem and the distributed SAR information processing microsystem into SiP form respectively to obtain an intermediate frequency signal processing microsystem SiP module and a distributed SAR information processing microsystem SiP module; The intermediate frequency signal processing microsystem includes a digital-to-analog converter DAC, an analog-to-digital converter ADC, a programmable logic device FPGA, a first memory DDR3, a first memory Flash, a controller ARM, a first power supply, and a clock. The digital-to-analog converter DAC and the analog-to-digital converter ADC are respectively connected to the programmable logic device FPGA, the controller ARM is connected to the programmable logic device FPGA, and the first memory DDR3, the first memory Flash, the first power supply, and the clock are respectively connected to the programmable logic device FPGA and the controller ARM; The distributed SAR information processing microsystem includes a processor CPU, a graphics processor GPU, a second memory DDR3, a second memory Flash, and a second power supply. The second memory DDR3, the second memory Flash, and the second power supply are respectively connected to the processor CPU, and the processor CPU is connected to the graphics processor GPU.
2. The airborne distributed SAR signal processing system according to claim 1, wherein Solder and assemble the intermediate frequency signal processing microsystem SiP module and the distributed SAR information processing microsystem SiP module on a PCB board to form the signal processing hardware of the distributed SAR system.
3. An architecture design method for an airborne distributed SAR signal processing system according to any one of claims 1 to 2, characterized in that It includes the steps: S1, Make the array antenna and radio frequency front end of the SAR imaging and missile-borne data link system share through waveform multiplexing, and separate and process the SAR imaging signal and the data link signal respectively when performing signal processing in the signal processing system; S2, Use the microsystem packaging process to implement the signal processing system described in step S1.
Citation Information
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