A server

Abstract

The present application provides a server, which includes a cabinet, and a node, a backplane and a heat dissipation component arranged in the cabinet. The node includes a circuit board and an electronic device arranged on the circuit board. The backplane is arranged at the end of the node, and the surface of the backplane is perpendicular to the surface of the circuit board of the node. The heat dissipation component is arranged on the side of the backplane away from the node for dissipating heat for the node. The direction perpendicular to the surface of the circuit board is the first direction, the direction perpendicular to the surface of the node backplane is the second direction, and the direction perpendicular to both the first direction and the second direction is the third direction. The width of the backplane along the third direction is smaller than the width of the node along the third direction. The backplane can avoid a part of the node so that the high-heat area of ​​the node is directly opposite to the heat dissipation component to improve the heat dissipation effect of the node. There is no obstacle to the cooling air of the heat dissipation component, which can reduce the energy consumption of the heat dissipation component and reduce the system noise of the server.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a server. Background Art

[0002] With the continuous improvement of technology, the power of electronic devices has gradually increased, such as the power of processors, memory and hard disks. The power density of electronic devices is getting higher and higher, and the heat generated is also increasing. Therefore, higher requirements are placed on the heat dissipation performance of electronic devices.

[0003] Figure 1 It is a structural schematic diagram of a server in the prior art. As shown in the figure, in the prior art, taking an electronic device as a server as an example, the server includes a plurality of nodes 1 arranged in sequence, and the above-mentioned nodes 1 are electrically connected to the backplane 2 through a connector to achieve electrical connection between the plurality of nodes 1. The above-mentioned backplane 2 is arranged at one end of the above-mentioned plurality of nodes 1, and is arranged approximately vertically with the node 1, so that each node 1 can be electrically connected to the backplane 2. The server also includes a heat dissipation component 3, and the heat dissipation component 3 includes a plurality of heat dissipation fans, which are arranged on the side of the backplane 2 away from the node 1, and the plurality of heat dissipation fans are connected to the backplane 2. In the prior art, the backplane 2 will block a large amount of cooling air, resulting in poor heat dissipation effect of the server. In addition, the backplane 2 is located in the air duct of the heat dissipation component 3, which is prone to generate system noise. Summary of the invention

[0004] The present application provides a server to improve the heat dissipation effect of the server, reduce the energy consumption of the heat dissipation components, and reduce the system noise of the server.

[0005] In the first aspect, the present application provides a server, which includes a cabinet, and a node, a backplane and a heat dissipation component arranged in the cabinet. The node includes a circuit board and an electronic device arranged on the circuit board, so as to realize the core structure of the server function. The backplane is arranged at the end of the node, and the surface of the backplane is roughly perpendicular to the surface of the circuit board of the node. The heat dissipation component is arranged on the side of the backplane away from the node. Since the node generates more heat when working, the heat dissipation component can dissipate heat for the node to improve the working effect of the node and the server. The direction perpendicular to the surface of the circuit board is the first direction, the direction perpendicular to the surface of the node backplane is the second direction, and the direction perpendicular to both the first direction and the second direction is the third direction. The width of the backplane along the third direction is less than the width of the heat dissipation component along the third direction. The specific backplane at least avoids the vents of part of the heat dissipation component, and part of the area of ​​the node is directly opposite to the heat dissipation component, and a ventilation duct is formed between the heat dissipation component and the node, and the ventilation duct is located on the side of the backplane. The node is directly located in the ventilation duct, which can improve the heat dissipation effect of the node. In addition, the cooling air of the heat dissipation component can flow directly between the heat dissipation component and the node without any obstacles. Therefore, the heat dissipation efficiency of the heat dissipation component is also relatively high, which is beneficial to reducing the energy consumption of the heat dissipation component and also beneficial to reducing the system noise of the server.

[0006] When the above-mentioned backplane is specifically set, the backplane can be set in the middle area of ​​the heat dissipation component along the third direction, that is, the size of the heat dissipation component on both sides of the backplane is close, so a ventilation duct can be formed on both sides of the backplane along the third direction. In this solution, the backplane only blocks the cooling wind in the middle area of ​​the node, or in other words, only the middle area of ​​the node is not directly located in the ventilation duct, but the cooling wind of the area opposite to the two sides of the node and the backplane is not blocked, and the cooling wind on both sides of the backplane can also dissipate heat for the area of ​​the node blocked by the backplane, so the overall cooling effect of the server is better.

[0007] When the above-mentioned backplane is specifically set, the backplane can be an integrated structure or a split structure. For example, the backplane can include two backplanes, a node backplane and a heat dissipation backplane. The node backplane has a node connector, and the node is electrically connected to the node backplane through the node connector; the heat dissipation backplane has a heat dissipation component connector, and the heat dissipation component is electrically connected to the heat dissipation backplane through the heat dissipation component connector. In this solution, the heat dissipation backplane and the node backplane are set separately, so that the width of the node backplane and the heat dissipation backplane can be made smaller in the third direction, reducing the area of ​​the heat dissipation component blocked by the backplane, and improving the heat dissipation effect of the server.

[0008] In another possible technical solution, the backplane can be an integrated structure of a node backplane and a heat dissipation backplane, that is, a node connector and a heat dissipation component connector are provided on the backplane, the nodes are electrically connected to the node connector, and the heat dissipation components are electrically connected to the heat dissipation component connector. This solution can reduce the space occupied by the backplane, which is conducive to improving the integration of the server and simplifying the installation steps of the server.

[0009] The node may include a first area opposite to the backplane and a second area avoiding the backplane, the first area is electrically connected to the backplane, and the second area extends to the end of the heat dissipation component along the second direction. In this solution, there is no backplane blocking the second area and the heat dissipation component, so that the second area can be extended to the end of the heat dissipation component to increase the size of the node and improve the integration of the server.

[0010] The heat dissipation component has a vent, and when the back plate is specifically arranged, the back plate can avoid the vent, so that the back plate does not block the cooling air generated by the heat dissipation component, which is beneficial to improving the heat dissipation efficiency of the heat dissipation component and reducing system noise.

[0011] The heat dissipation assembly may further include a receiving groove, and the back plate is disposed in the receiving groove. Since the back plate blocks the cooling air, the cooling air generating component of the heat dissipation assembly is disposed on the side of the back plate away from the node, and its efficiency is also low. Therefore, in this solution, a receiving groove is formed in the heat dissipation assembly on the side of the back plate away from the node to accommodate the back plate. This solution can increase the setting space of the node in the second direction to increase the size of the node, which is conducive to improving the integration of the server.

[0012] When the heat dissipation assembly is specifically arranged, the heat dissipation assembly may include at least one row of fan boxes, each row of fan boxes includes at least two fan boxes, the at least two fan boxes are arranged along the third direction, that is, each row of fan boxes extends along the third direction, and the back plate is arranged between the at least two fan boxes in each row. In the specific technical solution, the number of fan boxes on both sides of the back plate may be the same or different, and can be arranged according to the actual product structure.

[0013] In a specific embodiment, each row of fan boxes may include two fan boxes, and the backplane may be disposed between the two fan boxes. In this solution, on the one hand, the backplane may be disposed in the middle of the node along the third direction. On the other hand, it is also advantageous to connect the fan box to the backplane to provide power and control signals to the fan box.

[0014] When the heat dissipation assembly includes at least two rows of fan boxes, the at least two rows of fan boxes are arranged along the first direction, and the height sum of the fan boxes along the first direction is close to the height sum of the nodes along the first direction, so that the fan boxes can better dissipate heat for the nodes.

[0015] In order to realize the control of the fan box, each fan box can be provided with at least one fan controller, and the fan controller can be electrically connected to the backplane. In this solution, when a fan fails or needs routine maintenance, at most only one fan box needs to be maintained. At this time, the remaining fan boxes of the heat dissipation assembly can remain in working state to dissipate heat for the server, ensuring that the server can work normally.

[0016] Specifically, each fan box may include at least one fan, and each fan has a fan controller, that is, the fan and the fan controller correspond one to one. In this solution, when a fan fails or needs routine maintenance, only one fan can be maintained to enable the heat dissipation component to have a stronger heat dissipation capacity.

[0017] The fan box may further include at least two fans, and all fans of each fan box share a fan controller. This solution can reduce the number of fan controllers required for the heat dissipation component, simplify the structure of the server, and simplify the complexity of the heat dissipation component control. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A structural diagram of a server in the prior art;

[0019] Figure 2 A schematic diagram of the structure of a backplane in the prior art;

[0020] Figure 3 A schematic diagram of the structure of a server in an embodiment of the present application;

[0021] Figure 4 Another structural diagram of the server in the embodiment of the present application;

[0022] Figure 5 Another structural diagram of the server in the embodiment of the present application;

[0023] Figure 6 Another structural diagram of the server in the embodiment of the present application;

[0024] Figure 7 Another structural diagram of the server in the embodiment of the present application.

[0025] Reference numerals:

[0026] 10-cabinet; 1-node;

[0027] 11-circuit board; 12-electronic device;

[0028] 13- first zone; 14- second zone;

[0029] 15- extension part; 2- back plate;

[0030] 21-node backplane; 22-heat dissipation backplane;

[0031] 23-ventilation hole; 24-node connector;

[0032] 25-heat dissipation component connector; 3-heat dissipation component;

[0033] 31-ventilation port; 32-accommodation slot;

[0034] 33-Blower box. DETAILED DESCRIPTION

[0035] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0036] In order to facilitate understanding of the server provided in the embodiment of the present application, its application scenario is first introduced below.

[0037] The server provided in the embodiment of the present application may include a cabinet, a plurality of nodes and a heat dissipation component arranged in the cabinet, etc. The above-mentioned node includes a circuit board, on which a plurality of electronic devices are arranged, and each node is electrically connected through a node backplane to realize the function of the server. The above-mentioned heat dissipation component is arranged at one end of the node for dissipating heat for the node. As the power density of the server becomes higher and higher, improving the heat dissipation capacity of the server has become an important problem that needs to be solved at present. Of course, under the reminder of the technical solution of the present application, a technical solution similar to the present application can also be applied in electronic devices such as network devices or storage devices to avoid ventilation ducts and improve the heat dissipation effect of electronic equipment.

[0038] like Figure 1 As shown, in the prior art, the backplane 2 of the server is located between the node 1 and the heat dissipation component 3 , and the cooling air generated by the heat dissipation component 3 needs to pass over the backplane 2 to achieve heat dissipation for the node 1 . Figure 2 It is a schematic diagram of the structure of the backplane in the prior art, in which the dotted circle represents the heat dissipation component 3. In the prior art, a vent 23 is provided on the backplane 2 so that the cooling air generated by the heat dissipation component 3 passes through the vent 23, thereby dissipating heat for the node 1. The heat dissipation effect of the server in this solution is limited, the heat dissipation efficiency of the heat dissipation component 3 is low, and the cooling air passing through the vent 23 is prone to generate noise, resulting in a large system noise. To this end, the present application provides a server to improve the heat dissipation effect of the server, improve the heat dissipation efficiency of the heat dissipation component 3, and reduce the system noise of the server.

[0039] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0040] References to "one embodiment" or "a specific embodiment" described in this specification mean that one or more embodiments of the present application include a particular feature, structure or characteristic described in conjunction with the embodiment. The terms "include", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0041] Figure 3 It is a structural schematic diagram of a server in an embodiment of the present application. As shown in the figure, the server includes a cabinet 10 and a node 1, a backplane 2 and a heat dissipation component 3 arranged in the cabinet 10. The above-mentioned cabinet 10 can be specifically box-shaped or bracket-shaped, and the present application is not limited thereto. The cabinet 10 mainly plays the role of carrying structures such as the node 1 and the heat dissipation component 3. The above-mentioned node 1 includes a circuit board 11 and an electronic device 12 arranged on the circuit board 11. The above-mentioned electronic device 12 is used as a core component of the server to realize the function of the server. For example, the above-mentioned electronic device 12 can be a central processing unit CPU and a chip. However, the above-mentioned electronic device 12 is also prone to generate heat. In order to keep the server working reliably and for a long time, it is necessary to ensure that the server has a good heat dissipation effect. The above-mentioned node 1 is electrically connected to the backplane 2 to realize the interconnection between each node 1. The backplane 2 is arranged at one end of the node 1, and the surface of the backplane 2 is perpendicular to the surface of the circuit board 11 of the node 1. The heat dissipation component 3 is arranged on the side of the backplane 2 away from the node 1, that is, the backplane 2 is located between the heat dissipation component 3 and the node 1.

[0042] The direction perpendicular to the surface of the circuit board 11 is the first direction X, the direction perpendicular to the backplane 2 is the second direction Y, and the direction perpendicular to the first direction X and the second direction Y is the third direction Z. Then the width of the backplane 2 along the third direction Z is smaller than the width of the heat dissipation component 3 along the third direction Z, so that a ventilation duct located on the side of the backplane 2 along the third direction Z is formed between the heat dissipation component 3 and the node 1. Thus, the blocking of the cooling air generated by the heat dissipation component 3 by the backplane 2 can be reduced, so that the cooling air generated by the heat dissipation component 3 directly passes through the node 1, and is used to dissipate heat for the electronic device 12 generating heat in the node 1. In order to improve the heat dissipation effect of the node 1, the service life and reliability of the server are improved; in addition, there is no obstruction on the ventilation duct for the cooling air generated by the heat dissipation component 3, the heat dissipation efficiency of the heat dissipation component 3 is high, the energy consumption of the heat dissipation component 3 can be reduced, and the system noise is not easy to generate. Taking the heat dissipation component including a fan as an example, in this scheme, when the node power consumption is the same, the speed of the fan in this scheme can be lower, and thus the energy consumption is lower and the noise is also lower. It is conducive to reducing costs and improving user experience.

[0043] The technical solution of this application is applicable to any frame-type server with multiple nodes and front and rear air ducts, such as servers, network switches, and routers, which are not listed here one by one. For example, the above-mentioned server can be a multi-node server, which supports multiple pluggable nodes, and multiple nodes are electrically connected through a backplane for power supply and communication. The multi-node server includes a ventilation duct extending front and back, which is parallel to the surface of the node, and the heat dissipation component is arranged on the front or rear side of the server for dissipating heat for the node.

[0044] It is worth noting that in the embodiment of the present application, the surface of the backplane 2 is perpendicular to the surface of the circuit board 11 of the node 1, which means that the surface of the backplane 2 is approximately perpendicular to the surface of the circuit board 11 of the node 1, rather than being absolutely perpendicular. For example, due to installation errors and other reasons, the surface of the backplane 2 may be approximately perpendicular to the surface of the circuit board 11 of the node 1. In addition, the backplane 2 is roughly plate-shaped, and the surface of the backplane 2 refers to the surface on the side with the largest surface area; similarly, the circuit board 11 of the node 1 is also plate-shaped, and the surface of the circuit board 11 also refers to the surface on the side with the largest surface area.

[0045] Please continue to refer to Figure 3In one embodiment, the backplane 2 may include a node backplane 21 and a heat dissipation backplane 22, wherein the node backplane 21 has a node connector 24, and the node 1 is electrically connected to the node backplane 21 through the node connector 24. The heat dissipation backplane 22 has a heat dissipation component connector 25, and the heat dissipation component 3 is electrically connected to the heat dissipation backplane 22 through the heat dissipation component connector 25 to realize the power-on and control of the heat dissipation component 3. The heat dissipation backplane 22 is arranged roughly parallel to the node backplane 21. In a specific embodiment, the widths of the heat dissipation backplane 22 and the node backplane 21 along the third direction Z may be the same or different, and the present application does not make specific restrictions. It is only necessary to make the width of the heat dissipation backplane 22 along the third direction Z smaller than the width of the node 1 along the third direction Z, and the width of the node backplane 21 along the third direction Z is also smaller than the width of the node 1 along the third direction Z.

[0046] Figure 4 Another structural diagram of the server of the embodiment of the present application is shown in FIG. Figure 5 Another structural diagram of the server in the embodiment of the present application is shown in FIG. Figure 4 and Figure 5 As shown, in one embodiment, the backplane 2 is provided with a node connector 24 and a heat sink assembly connector 25, the node 1 is electrically connected to the node connector 24, and the heat sink assembly 3 is electrically connected to the heat sink assembly connector 25. That is, in this embodiment, the node backplane 21 and the heat sink backplane 22 are an integrated structure, so that the space occupied by the backplane 2 can be reduced, which is conducive to improving the integration of the server. In addition, the structure of the server in this solution is relatively simple, which is also conducive to installing the server.

[0047] When the above backplane is specifically set, the backplane 2 can be set in any area opposite to the node 1 along the third direction Z, and can be designed according to the needs. However, in order to improve the heat dissipation effect of the node, please continue to refer to Figure 3 and Figure 4 In a specific embodiment, the backplane 2 can be arranged in the middle of the heat dissipation component 3 along the third direction Z, that is, the width of the parts of the heat dissipation component 3 on both sides of the backplane 2 is roughly the same. This solution allows the node 1 to be located in the ventilation duct from both sides and can directly receive cooling air, so the area of ​​the node 1 blocked by the backplane 2 can also have a certain cooling effect, and the overall cooling effect of the node 1 is better. In addition, the backplane 2 and the node 1 are usually connected through a node connector 24. In this embodiment, since the backplane 2 corresponds to the middle of the node 1, when the node 1 is provided with a node connector 24 connected to the backplane 2, for a full-width node, the node connector 24 is also arranged in the middle of the node 1. The signal routing when the electronic device 12 of the node 1 is connected to the node connector 24 is also shorter, which is conducive to simplifying the signal routing structure of the node 1.

[0048] Please continue to refer to Figure 5, the width of the back plate 2 along the third direction Z may be no greater than one third of the width of the heat dissipation assembly 3 along the third direction Z, so the back plate 2 occupies less space, providing more channels for the cooling air generated by the heat dissipation assembly 3, which is beneficial to improving the heat dissipation effect of the server. In specific applications, the width of the back plate 2 along the third direction Z can be made as small as possible on the premise of meeting the use requirements, so as to reduce the space occupied by the back plate 2, and also help to increase the channels for the cooling air generated by the heat dissipation assembly 3, thereby improving the integration and heat dissipation effect of the server.

[0049] Please continue to refer to Figure 5 In a specific embodiment, the heat dissipation component 3 has a vent 31, and the cooling wind generated by the heat dissipation component 3 flows through the vent 31. In this embodiment, the back plate 2 completely avoids the vent 31, so the cooling wind generated by the heat dissipation component 3 can directly flow through the node 1 to form a ventilation channel without being blocked by the back plate 2. In other words, the back plate 2 does not block the vent 31 of the heat dissipation component 3, and the cooling wind generated by the heat dissipation component 3 can achieve the function of cooling the node 1 without causing waste, thereby improving the heat dissipation efficiency of the heat dissipation component 3 and reducing the energy consumption of the heat dissipation component 3.

[0050] Please combine Figure 4 and Figure 5 The heat dissipation component 3 also has a receiving groove 32, and the backplane 2 is received in the receiving groove 32. When the backplane 2 avoids the vent 31 of the heat dissipation component 3, a connector connected to the heat dissipation connector of the backplane 2 can be provided in the area opposite to the heat dissipation component 3 and the backplane 2, which occupies a small space. The receiving groove 32 can be provided here, and the backplane 2 can be provided in the receiving groove 32. In order to make the node 1 cooperate with the structure of the backplane 2 in the receiving groove 32, an extension part 15 can be provided in the area where the node 1 is connected to the backplane 2, and the connector connecting the node 1 and the backplane 2 is provided in the above-mentioned extension part 15, so that the extension part 15 with the connector extends into the receiving groove 32 of the heat dissipation component 3 and is connected to the node connector 24 of the backplane 2. This solution can make the size of the node larger and set more electronic devices 12 when the size of the server is certain, which is conducive to improving the integration of the server. Of course, in another embodiment, the node may not have the extension portion 15 , and the node connector 24 of the backplane 2 is located outside the accommodating groove 32 or at the edge of the accommodating groove 32 , and the node can be directly connected to the backplane 2 without extending into the accommodating groove 32 .

[0051] Please continue to refer to Figure 4When the heat dissipation component 3 is specifically set, the heat dissipation component 3 can include at least one row of fan boxes 33, each row of fan boxes 33 extends along the third direction Z, and when the heat dissipation component 3 includes two rows or more than two rows of fan boxes 33, each row of fan boxes 33 is arranged along the first direction X. Each row of fan boxes 33 can include at least two fan boxes 33, and the backplane 2 is arranged between the at least two fan boxes 33. In a specific embodiment, the number of fan boxes 33 on both sides of the backplane 2 can be the same or different, and the present application does not impose any restrictions. It can be selected according to the actual layout of the product. In this solution, the areas of the node 1 on both sides of the backplane 2 can be located in the ventilation duct, and the ventilation ducts on both sides can also dissipate heat to the area opposite to the backplane 2 of the node 1, so as to improve the heat dissipation effect of the node 1.

[0052] like Figure 4 In the illustrated embodiment, each row of fan boxes 33 includes two fan boxes 33, and each side of the backplane 2 has a fan box 33, which facilitates the electrical connection between the fan in the fan box 33 and the heat dissipation component connector 25 of the backplane 2 located in the middle, and helps to simplify the structure of the heat dissipation component 3. In addition, the backplane 2 is arranged between the two fan boxes 33 in each row, which is also conducive to improving the heat dissipation effect of the server, especially the heat dissipation effect of the area corresponding to the node 1 and the backplane 2.

[0053] In order to form the above-mentioned receiving groove 32 for receiving the back plate 2 in the heat dissipation assembly 3, the two fan boxes 33 in each row of fan boxes 33 can be inserted forward and backward. That is, each fan box 33 includes a groove, and the two fan boxes 33 in each row are inserted forward and backward so that the grooves of the two fan boxes 33 are opposite to each other to form the receiving groove 32.

[0054] The number of rows of the fan boxes 33 included in the heat dissipation assembly 3 is not specifically limited, and the number of rows of the fan boxes 33 can be selected according to the height of the nodes 1 arranged along the first direction X. The height of the fan boxes 33 along the first direction X should be not less than the height of the nodes 1 arranged along the first direction X, or the difference is not much, so that the fan boxes 33 have sufficient heat dissipation capacity to dissipate heat for the nodes 1.

[0055] When the heat dissipation component 3 is specifically set, each of the above-mentioned fan boxes 33 has at least one fan controller, and the fan controller is electrically connected to the heat dissipation component connector 25 of the backplane 2 to transmit control signals and electrical energy to realize the control and power supply of the fan box 33. When the heat dissipation component 3 is maintained by this solution, at most one fan box 33 is stopped at a time, and the remaining fan boxes 33 can normally dissipate heat for the node 1, so the heat dissipation component 3 can be maintained without shutting down the server. For example, when a fan in the fan box 33 is damaged or a routine maintenance inspection is performed, only the fan box 33 that needs to be processed can be stopped to ensure the normal operation of the server.

[0056] In a specific embodiment, each fan may have a fan controller, that is, each fan is controlled separately. When a fan needs to be maintained, only the fan currently being maintained may be stopped, so that most fans in the heat dissipation assembly 3 are working, and the heat dissipation effect of the server is better.

[0057] In another specific embodiment, each fan box 33 may include at least two fans, and all fans in each fan box 33 share a fan controller. Each time a fan box 33 is shut down, the entire fan box 33 stops working. This solution can reduce the number of fan controllers, reduce the complexity of wiring and the difficulty of control. In addition, each fan box 33 has a fan controller, which can also reduce the demand for the backplane 2. The heat dissipation component connector 25 provided on the backplane 2 can be less, and the size of the backplane 2 can be designed to be smaller. It is beneficial to increase the size of the ventilation area of ​​the server and improve the heat dissipation effect of the server.

[0058] Figure 6 Another structural schematic diagram of the server of the embodiment of the present application is shown in the figure. In this scheme, the node 1 can include a first section 13 opposite to the backplane 2, and a second section 14 avoiding the backplane 2. The first section 13 can have a node connector 24 and other structures, so as to be electrically connected to the backplane 2. The second section 14 can extend to the end of the heat dissipation component 3. Specifically, the end of the heat dissipation component 3 refers to the end of the heat dissipation component 3 along the second direction Y toward the node 1. In addition, the second section 14 extends to the end of the heat dissipation component 3, which does not mean that the second section 14 of the node 1 is in contact with the end of the heat dissipation component 3, but when the installation process and other conditions are met, the second section 14 of the node 1 is as close to the end of the heat dissipation component 3 as possible to increase the area of ​​the circuit board of the node 1. In this embodiment, there is no structure such as a backplane 2 between the second section 14 and the heat dissipation component 3, so it can be directly extended to the end of the heat dissipation component 3. Compared with the prior art, when the size of the server is certain, this scheme is also conducive to increasing the size of the node 1, so that more electronic devices 12 are arranged on the node 1, which can improve the integration of the server.

[0059] When electronic devices 12 are arranged on the circuit board 11 of the node 1, the electronic devices 12 with less heat generation can be arranged in the first area, and the electronic devices 12 with more heat generation can be arranged in the second area. Because the second area is directly opposite to the vents 31 of the heat dissipation component 3, the cooling effect is better, which is conducive to the heat dissipation of the electronic devices 12 with more heat generation, so as to improve the heat dissipation effect of the node 1.

[0060] In the drawings of the above embodiment, the node 1 of the server is used as a full-width node as a specific embodiment for description. However, for other embodiments, please refer to Figure 7, Figure 7 This is another structural diagram of the server in the embodiment of the present application. The node 1 of the above server can also be a half-width node, and the technical solution in the present application is also applicable. When the server is a half-width node, it can also have the features in the above embodiment, which will not be described one by one here. In short, the present application does not limit the shape and size of the node 1.

[0061] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A server, characterized in that: include: A node, comprising a circuit board and an electronic device arranged on the circuit board; A heat dissipation component, disposed at one end of the node; A back plate is disposed between the heat dissipation component and the node, and a surface of the back plate is perpendicular to a surface of the circuit board. A width of the back plate along a third direction is smaller than a width of the heat dissipation component along the third direction. A ventilation channel located on the side of the back plate is formed between the heat dissipation component and the node; The direction perpendicular to the surface of the circuit board is the first direction, the direction perpendicular to the surface of the node backplane is the second direction, and the third direction is perpendicular to the first direction and the second direction; The heat dissipation assembly includes a receiving groove, and the back plate is received in the receiving groove; The node includes a first area portion opposite to the backplane, and a second area portion avoiding the backplane, the first area portion being electrically connected to the backplane; The second section extends to an end of the heat dissipation component facing the node.

2. The server according to claim 1, characterized in that: The back plate is arranged at the middle portion of the heat dissipation component along the third direction.

3. The server according to claim 1, characterized in that: The backplane includes a node backplane and a heat dissipation backplane, the node backplane is electrically connected to the node, and the heat dissipation backplane is electrically connected to the heat dissipation component.

4. The server according to claim 1, characterized in that: The backplane is provided with a node connector and a heat dissipation component connector, the node connector is electrically connected to the node, and the heat dissipation component connector is electrically connected to the heat dissipation component.

5. The server according to claim 1, characterized in that: The heat dissipation component has a vent, and the back plate avoids the vent.

6. The server according to any one of claims 1 to 5, characterized in that: The heat dissipation assembly includes at least one row of fan boxes, each row of the fan boxes includes at least two fan boxes, and each row of the fan boxes extends along a third direction, and the back plate is arranged between the at least two fan boxes.

7. The server according to claim 6, characterized in that: Each of the fan boxes includes at least one fan, and each fan has a fan controller.

8. The server according to claim 6, characterized in that: Each of the fan boxes includes at least two fans, and the at least two fans share a fan controller.

Images