Electrode array and body implantable device comprising the same

Abstract

An electrode array includes a housing, a plurality of first contact electrodes exposed to an outside of the housing, a plurality of second contact electrodes exposed to the outside of the housing, a first lead group disposed in the housing and electrically connected to the first contact electrodes, and a second lead group disposed in the housing and electrically connected to the second contact electrodes, the plurality of first contact electrodes and the first lead group being disposed on different planes in the housing.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0104032, filed on August 19, 2020, and Korean Patent Application No. 10-2021-0081373, filed on June 23, 2021, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] The present invention relates to an electrode array and a body implantable device including the electrode array. Background Technology

[0004] Many medical devices have been developed to help people who have lost specific functions, either congenitally or acquiredly. Among these medical devices are implantable devices, including neuro-assistive devices.

[0005] As one of the human implantable devices, the cochlear implant system uses electrical stimulation to stimulate the auditory nerve of a person with auditory function to help them perceive sound. The cochlear implant system is recognized as the most effective neuro-assistive device developed to date, and the number of such cochlear implants is increasing every year.

[0006] Cochlear implant systems can include external devices placed outside the body and internal devices placed inside the body.

[0007] External devices are used to receive sounds from outside the human body and convert the received sounds into electrical signals. These external devices include a microphone (transmitter), a speech processor (speech synthesizer), and a transmission antenna (transmitter). In this case, the microphone and transmission antenna can be combined with headphones.

[0008] The internal device is used to stimulate the auditory nerve using signals transmitted from an external device, and the internal device includes a receiver and electrodes for receiving and stimulating the nerve.

[0009] The cochlear implant system converts the physical vibrations of sound signals into electrical signals through amplification and filtering by an external speech processor. The acoustic sound transmitted from the microphone attached to the outside of the body is transmitted to the auditory nerve fibers through electrodes implanted in the cochlea, without passing through the tympanic membrane or ossicles.

[0010] However, conventional electrodes suffer from increased cost and time, as well as reduced yield, because platinum electrodes and wires are manually resist-welded and molded in silicon. Furthermore, the manual resistance welding of electrodes and wires limits the ability to increase the number of electrodes. Summary of the Invention

[0011] The present invention can provide an electrode array that can be easily manufactured and a body implantable device including the electrode array.

[0012] Furthermore, the present invention can provide an electrode array having an increased number of electrodes per unit length and a body implantable device including the electrode array.

[0013] The problems to be solved by the present invention are not limited thereto. It will be understood that the invention also includes the objectives or effects that can be achieved from the technical solutions or embodiments described below.

[0014] An electrode structure according to one embodiment includes: a contact electrode portion including a plurality of contact electrodes, a plurality of first wires, and a plurality of connecting wires connecting the plurality of contact electrodes and the plurality of first wires; a pad portion including a plurality of pads and a plurality of second wires connected to the plurality of pads; and a connecting portion including a plurality of third wires, the plurality of third wires connecting the plurality of first wires and the plurality of second wires, and disposed between the contact electrode portion and the pad portion, wherein the plurality of first wires and the plurality of third wires extend along a first direction.

[0015] Multiple second conductors can be bent at a predetermined angle relative to multiple third conductors along a second direction perpendicular to the first direction.

[0016] The plurality of first wires, the plurality of second wires, and the plurality of third wires include adjacent groups of first wires and groups of second wires, and the distance between the groups of first wires and groups of second wires in the connection portion along the second direction may be greater than the distance between the groups of first wires and groups of second wires in the contact electrode portion and the pad portion along the second direction, and the second direction may be perpendicular to the first direction.

[0017] The connecting portion may include a fold portion, which may include a space formed by a pattern, in which a first wire group and a second wire group are spaced apart.

[0018] Multiple contact electrodes can be spaced apart from each other along a first direction.

[0019] Multiple connecting wires may include a moire pattern.

[0020] Multiple contact electrodes, multiple first wires, multiple connecting wires, solder pads, multiple second wires, and multiple third wires can be integrally formed.

[0021] An electrode array according to one embodiment includes: an electrode structure; a first housing including a first groove extending along a first direction; a second housing extending from the first housing and having a second groove; and a cover layer covering the first groove and the second groove and having a plurality of electrode holes. The electrode structure is folded around a fold such that contact electrode portions and connection portions are disposed in the first groove, solder pad portions are disposed in the second groove, the plurality of contact electrodes and a plurality of first wires overlap each other, an insulating layer is provided between them, and each of the plurality of electrode holes exposes one of the plurality of contact electrodes.

[0022] The thickness of the first housing along a third direction can be inversely proportional to the distance between the first housing and the second housing, and the third direction can be perpendicular to the first direction and the second direction.

[0023] The thickness of the first shell along the second direction can be inversely proportional to the distance between the first shell and the second shell.

[0024] The first shell, the second shell, and the covering layer can be formed integrally.

[0025] An electrode array according to another embodiment includes: an electrode structure; a first housing including a first groove extending along a first direction; a second housing extending from the first housing and having a second groove; a cover layer covering the first groove and the second groove and having a plurality of electrode holes; and an insulating layer surrounding the electrode structure and exposing contact electrodes. The electrode structure is based on alternating inward and outward folds in rows 1 to (n-1), with contact electrode portions and connecting portions disposed in the first groove, and pad portions disposed in the second groove. Each of the plurality of electrode holes exposes one of the plurality of contact electrodes. Rows 1 to (n-1) divide the electrode structure along a second direction into n regions (n ​​is an integer greater than or equal to 2), each region extending along the first direction.

[0026] An electrode array according to another embodiment includes: an electrode structure; and an insulating layer surrounding the electrode structure and exposing contact electrodes. The electrode structure is folded in a direction in which the contact electrodes are exposed about a reference line dividing the electrode structure along a second direction. In the folded electrode structure, the contact electrodes are exposed on an outer circumferential surface, and the folded electrode structure is bent into a cylindrical shape supported by a core bundle disposed in the electrode structure. The second direction is perpendicular to the first direction.

[0027] The core bundle may include a helical spring.

[0028] Multiple third conductors may include a moiré pattern.

[0029] An electrode array according to another embodiment includes: a first electrode structure; and a second electrode structure disposed on the first electrode structure. The first electrode structure includes: a first contact electrode portion including a plurality of first contact electrodes, a plurality of first first conductive lines, and a plurality of first connecting conductive lines connecting the plurality of first contact electrodes and the plurality of first first conductive lines; a first pad portion including a plurality of first pads and a plurality of second first conductive lines connected to the plurality of first pads; and a first connecting portion including a plurality of third first conductive lines connecting the plurality of first first conductive lines and the plurality of second first conductive lines, and disposed between the first contact electrode portion and the first pad portion. The plurality of first first conductive lines and the plurality of third first conductive lines extend along a first direction. The second electrode structure includes: a second contact electrode portion comprising a plurality of second contact electrodes, a plurality of first and second conductive lines, and a plurality of second connecting conductive lines connecting the plurality of second contact electrodes and the plurality of first and second conductive lines; a second pad portion comprising a plurality of second pads and a plurality of second and second conductive lines connected to the plurality of second pads; and a second connecting portion comprising a plurality of third and second conductive lines, the plurality of third and second conductive lines connecting the plurality of second and second conductive lines and disposed between the second contact electrode portion and the second pad portion. The plurality of first and second conductive lines and the plurality of third and second conductive lines extend along a first direction. The first contact electrode portion is folded around a reference line dividing the first contact portion along a second direction, and the second contact electrode portion is folded around a reference line dividing the second contact portion along the second direction.

[0030] The plurality of first contact electrodes of the first electrode structure and the plurality of second contact electrodes of the second electrode structure can be configured to be offset along the vertical direction.

[0031] The device includes: a first housing including a first groove extending along a first direction; a second housing extending from the first housing and having a second groove; a cover layer covering the first groove and the second groove and having a plurality of electrode holes; an insulating layer surrounding the first electrode structure and exposing the first contact electrode; and an insulating layer surrounding the second electrode structure and exposing the second contact electrode. A first contact electrode portion, a first connecting portion, a second contact electrode portion, and a second connecting portion may be disposed in the first groove, and a first pad portion and a second pad portion may be disposed in the second groove.

[0032] Multiple third first wires and multiple third second wires at least partially overlap each other along a third direction. In the first groove, multiple first contact electrodes and multiple second contact electrodes may be adjacent to each other along a first direction and may not overlap each other along a third direction.

[0033] Multiple third first conductors and multiple third second conductors may include a moiré pattern.

[0034] According to one embodiment, the ease of manufacturing can be improved because the electrode structure is manufactured by patterning electrodes and wires using lasers, and the electrode array is formed by folding the electrode structure.

[0035] In addition, the number of electrodes per unit length has increased.

[0036] The various advantages and effects of the present invention are not limited to those described above, and will be more readily understood in the process of describing specific embodiments of the invention. Attached Figure Description

[0037] Figure 1 This is a conceptual diagram of an implantable device according to one embodiment.

[0038] Figure 2 This is an exemplary view showing the application of a second unit of an implantable device according to an embodiment to the human body.

[0039] Figure 3 This is a view showing the electrode array according to the first embodiment.

[0040] Figure 4 yes Figure 3 A magnified view of section X in the middle.

[0041] Figure 5 yes Figure 4 An enlarged view of part A.

[0042] Figure 6 It is along Figure 5 The view captured by the I-I' line.

[0043] Figure 7 It is shown Figure 3 A schematic diagram of the cross-section of the pad portion.

[0044] Figure 8 From Figure 4 A side view.

[0045] Figure 9 It is set in Figure 2 An enlarged view of the contact electrode portion inside the cochlea.

[0046] Figure 10 This is a view showing an electrode structure according to one embodiment.

[0047] Figure 11 yes Figure 10 A magnified view of section B.

[0048] Figure 12 yes Figure 10 A magnified view of section C.

[0049] Figure 13 yes Figure 10 An enlarged view of part D.

[0050] Figure 14 This is a plan view showing the substrate and the conductive material disposed on the substrate.

[0051] Figure 15 This is a cross-sectional view showing the substrate and the conductive material disposed on the substrate.

[0052] Figure 16 This is a view illustrating the process of forming an electrode structure by patterning a conductive material disposed on a substrate.

[0053] Figure 17 This is a cross-sectional view showing the process of forming an electrode structure by patterning a conductive material disposed on a substrate.

[0054] Figure 18a This is a rear view of the substrate, in which folding guide grooves and alignment holes are formed on the rear surface of the substrate.

[0055] Figure 18b yes Figure 18a Front view.

[0056] Figure 19 yes Figure 18b Cross-sectional view.

[0057] Figure 20 This is a cross-sectional view showing the process of applying insulating material to the substrate and electrode structure.

[0058] Figure 21 This is a cross-sectional view showing the folded substrate and electrode structure.

[0059] Figure 22 This is a cross-sectional view showing the electrode structure with the substrate removed.

[0060] Figure 23 This is a cross-sectional view showing the formation of a housing in an electrode structure from which the substrate has been removed.

[0061] Figure 24 This is a view showing the electrode structure according to the second embodiment.

[0062] Figure 25a and Figure 25b This is a view showing the electrode structure according to the third embodiment.

[0063] Figure 26 This is a view showing the process of stacking the first electrode structure and the second electrode structure.

[0064] Figure 27 This is a view showing the electrode structure according to the fourth embodiment.

[0065] Figure 28 This is a view illustrating the process of manufacturing an electrode array according to the fourth embodiment.

[0066] Figure 29 This is a view showing the electrode array according to the fourth embodiment.

[0067] Figure 30 This is a view showing the electrode array according to the fifth embodiment.

[0068] Figure 31 This is a view illustrating an embodiment of the contact electrode.

[0069] Figure 32 This is a view showing the contact electrode coated with insulating material.

[0070] Figure 33 It is along Figure 32 A cross-sectional view taken from line III-III'.

[0071] Figure 34 This is a view showing another embodiment of the contact electrode.

[0072] Figure 35 This is a view showing yet another embodiment of the contact electrode.

[0073] Figure 36 This is a diagram illustrating another embodiment of the contact electrode.

[0074] Figure 37 This is a view showing the first electrode structure of the electrode array according to the sixth embodiment.

[0075] Figure 38 It is along Figure 37 A cross-sectional view taken along the AA direction.

[0076] Figure 39 It is along Figure 37 A cross-sectional view taken along the BB direction.

[0077] Figure 40 This is a view showing the second electrode structure of the electrode array according to the sixth embodiment.

[0078] Figure 41 This is a view showing the second electrode structure in a state based on imaginary line folding.

[0079] Figure 42 It is along Figure 41 Cross-sectional view in the CC direction.

[0080] Figure 43 This is a view showing the second electrode structure separated from the substrate.

[0081] Figure 44 This is a view showing the state in which the second electrode structure is stacked on top of the first electrode structure.

[0082] Figure 45 This is a view showing the first electrode structure in a state based on imaginary line folding.

[0083] Figure 46a It is along Figure 45 Cross-sectional view in the FF direction.

[0084] Figure 46b It is along Figure 45 A cross-sectional view in the GG direction.

[0085] Figure 47 This is a view showing the electrode array according to the sixth embodiment.

[0086] Figure 48a It is along Figure 47 A cross-sectional view taken along the HH direction.

[0087] Figure 48b It is along Figure 47 A cross-sectional view taken in direction II. Detailed Implementation

[0088] Because the present invention can have various variations and embodiments, specific embodiments are shown and described in the accompanying drawings. However, this is not intended to limit the invention to the specific embodiments, and it should be understood that all modifications, equivalents, and substitutions are included within the spirit and scope of the invention.

[0089] Terms including ordinal numbers such as "second" and "first" can be used to describe various elements, but these elements are not limited by these terms. The terms above are used only to distinguish one component from another. For example, without departing from the scope of the invention, a second component may be referred to as a first component, and similarly, a first component may be referred to as a second component. The term includes a combination of several related listed terms or any one of several related listed terms.

[0090] When a component is referred to as being "connected" or "in contact" with another component, it should be understood that the other component may be directly connected to or in contact with the other component, but other components may exist between them. On the other hand, when it is said that an element is "directly connected" or "directly in contact" with another element, it should be understood that there are no other elements in between them.

[0091] The terminology used in this application is for describing specific embodiments only and is not intended to limit the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions. In this application, terms such as “comprising” or “having” are intended to indicate the presence of features, quantities, steps, operations, components, portions, or combinations thereof described in the specification, but it should be understood that this does not preclude the possibility of the presence or addition of one or more other features, quantities, steps, operations, components, portions, or combinations thereof.

[0092] Unless otherwise specified, all terms used herein, including technical or scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Terms such as those defined in common dictionaries shall be construed as having a meaning consistent with their meaning in the relevant technical context, and shall not be construed as having an ideal or overly formal meaning, unless expressly defined in this application.

[0093] In the following description, embodiments will be described in detail with reference to the accompanying drawings. However, regardless of the reference numerals, the same or corresponding parts will be given the same reference numerals and repeated descriptions will be omitted.

[0094] Figure 1 This is a conceptual diagram of an implantable device according to one embodiment. Figure 2 This is an exemplary view showing the application of a second unit of an implantable device according to an embodiment to the human body.

[0095] refer to Figure 1 and Figure 2 An implantable device 1 according to one embodiment may include a first unit 100 and a second unit 200, which can communicate with each other. Hereinafter, one type of implantable device, namely a cochlear implantation system, will be described as an example. However, the embodiments are not limited thereto. For example, the second unit 200 may be a device that provides electrical signals to another organ or other organs of the human body.

[0096] The first unit 100 can convert sound signals into electrical signals and provide electrical signals, and may include a first coil 140 for power supply. The first unit 100 can be disposed on the exterior of the skin. That is, the first unit 100 can be an external device installed on the exterior of the body and not implanted inside the body.

[0097] The first unit 100 may include a transmitter 110, a sound processor 120, a transmitter 130, and a first coil 140.

[0098] Transmitter 110 can detect acoustic signals. The acoustic signals may include speech signals or sound signals. Various electronic devices capable of detecting acoustic signals can be selected for transmitter 110. In one embodiment, transmitter 110 may be a microphone, but is not limited thereto. Transmitter 110 may include a volume adjuster that adjusts the volume of the received acoustic signals.

[0099] The sound processor 120 can receive sound signals sensed by the transmitter 110 and convert the sound signals into electrical signals. The sound processor 120 may include a voice processor.

[0100] Transmitter 130 can receive and transmit electrical signals from sound processor 120. First coil 140 can be powered. However, the invention is not limited thereto, and transmitter 130 can be omitted. That is, first unit 100 may not include a separate transmitter 130. In this case, first unit 100 can receive and transmit electrical signals from sound processor 120 to second unit 200, while power is transmitted to second unit 200 through first coil 140.

[0101] The first unit 100 may include a power source (not shown). The power source is a structure for supplying power to the first unit 100 and may include a replaceable battery, a rechargeable battery, etc.

[0102] The power source can receive and store electrical power from an external source. For example, the power source may include a capacitor element, such as a capacitor. The capacitor element can receive and store electrical power from an external power source via wires, or wirelessly receive electrical power from an external power source via a first coil 140 of the first unit 100.

[0103] For example, in charging mode, the first coil 140 can wirelessly receive power from the coil of an external power source through electromagnetic induction and store the power in the capacitor element, while in transmission mode, the power of the capacitor element can be wirelessly transmitted to the second coil 210 of the second unit 200.

[0104] Here, although electromagnetic induction can be used to transmit power through coils, the embodiments are not limited to this, and other wireless power transmission technologies can also be used.

[0105] The second unit 200 can be an internal implant inserted into the skin. In one embodiment, the second unit 200 can be inserted into the subcutaneous fat layer, but is not limited thereto.

[0106] The second unit 200 can receive electrical signals from the first unit 100 and stimulate the auditory nerve fibers in the cochlea 10.

[0107] The second unit 200 may include: a receiver 220; circuitry 230 configured to process signals received from the first unit 100 to generate a stimulation signal; and an electrode array 1000 having a plurality of electrodes (not shown) configured to stimulate auditory nerve fibers in the cochlea 10 by means of an electrical signal in response to the stimulation signal transmitted from the circuitry 230.

[0108] Receiver 220 can receive signals from first unit 100. For example, receiver 220 may include a second coil 210 that receives signals and power together with the first coil 140. When power is transmitted, the first coil 140 of first unit 100 can transmit power signals and data signals for electrical stimulation together. For example, the first coil 140 can change the amplitude or phase of the power signal and transmit data signals together with the power signal.

[0109] Optionally, receiver 220 can directly receive signals from transmitter 130 of first unit 100. Transmitter 130 and receiver 220 can communicate using various communication technologies, not limited to specific communication technologies. Furthermore, data signals can be communicated separately from electrical signals via separate communication means or at separate frequencies not described above.

[0110] Circuit 230 can generate stimulation signals by processing electrical signals received from receiver 220. Circuit 230 may have an integrated circuit (IC) for generating stimulation signals. Circuit 230 can perform various functions necessary for the normal operation of implantable device 1, such as signal processing, communication, etc., and circuit 230 consists of one or more functional modules.

[0111] In addition, circuit 230 may include a terminal electrically connected to one end of electrode array 1000, and signals (e.g., current, voltage, etc.) may be provided to circuit 230 or electrode array 1000 through the terminal.

[0112] The electrode array 1000 may have a structure in which multiple electrodes (not shown) are disposed on an insulating layer. The electrode array 1000 may be formed thin to be inserted into the cochlea 10 of a human body. The electrode array 1000 may transmit stimulation signals generated from circuit 230 to the cochlea 10, and the stimulation signals may stimulate the auditory nerve of the cochlea 10. The user of the implantable device 1 may perceive external sounds by stimulating the auditory nerve.

[0113] Figure 3 This is a view showing an electrode array according to one embodiment. Figure 4 yes Figure 3 A magnified view of section X in the middle. Figure 5 yes Figure 4 An enlarged view of part A. Figure 6It is along Figure 5 The view captured by the I-I' line. Figure 7 It is shown Figure 3 A schematic diagram of the cross-section of the pad portion. Figure 8 From Figure 4 A side view.

[0114] In the following text, reference will be made to Figures 3 to 8 An electrode array according to one embodiment is described.

[0115] refer to Figure 3 An electrode array 1000 according to one embodiment includes: a first housing 1100; a second housing 1200; and an electrode structure (not shown) disposed in the first housing 1100 and the second housing 1200. The overall construction of the electrode array 1000 will be described below, and the electrode structure will be described in detail later.

[0116] refer to Figures 3 to 6 Multiple wires 1701, 1703, and 1704, as well as multiple contact electrodes 1801, may be disposed in the first housing 1100. More specifically, the first housing 1100 may include a first recess 1110. Multiple wires 1701, 1703, and 1704, as well as multiple contact electrodes 1801, may be disposed in the first recess 1110.

[0117] Contact electrode 1801 may be exposed to the outside of the electrode array. More specifically, the first housing 1100 may include a first cover layer 1301 to cover the first wire 1701, the third wire 1703, the connecting wire 1704, and the contact electrode 1801 disposed in the first recess 1110. The first cover layer 1301 may include a plurality of electrode holes 1310 to expose at least a portion of the plurality of contact electrodes 1801. In one embodiment, the plurality of electrode holes 1310 may be matched one-to-one with the plurality of contact electrodes 1801, such that each electrode hole 1310 exposes one first electrode 1801, but the embodiment is not limited thereto.

[0118] When the implantable device 1 collects biosignals, the electrode port 1310 can serve as an inlet for the biosignal to be collected; when the implantable device 1 transmits biostimulation signals to the body, the electrode port 1310 can serve as an outlet for the biostimulation signals. Multiple electrode ports 1310 can exist, and the number of electrode ports 1310 can be the same as the number of terminals in the circuit 230, but the embodiment is not limited to this. Furthermore, as mentioned above, the number of electrode ports 1310 can be the same as the number of contact electrodes 1801, but the embodiment is not limited to this. The number of electrode ports 1310 can be adjusted appropriately as needed.

[0119] When the implantable device 1 is inserted into the cochlea, multiple exposed contact electrodes 1801 can contact the auditory nerve fibers. The contact electrodes 1801 in contact with the auditory nerve fibers can transmit external signals to the auditory nerve fibers, or conversely, transmit signals from the auditory nerve fibers to the outside. However, this is only an example, and as described above, the implantable device according to this embodiment can be implanted and used in other body organs. Because the multiple contact electrodes 1801 are in contact with the body, they can be made of materials that are harmless to the body. For example, the multiple contact electrodes 1801 may include platinum-iridium (PtIr), but are not limited to this.

[0120] exist Figure 7 In the image, (a) is a view showing the second housing, (b) is a view showing a plurality of second wires and a plurality of pads disposed in a second recess of the second housing, and (c) is a view showing the cover layer covering the second housing.

[0121] refer to Figure 7 Multiple second conductors 1702 and multiple pads 1802 may be disposed in the second housing 1200. More specifically, the second housing 1200 may include a second recess 1120. Multiple second conductors 1702 and multiple pads 1802 may be disposed in the second recess 1120. A second cover layer 1302 may be disposed on the second recess 1120, in which multiple second conductors 1702 and multiple pads 1802 are disposed. That is, the second cover layer 1302 may cover the second recess 1120.

[0122] The second cover layer 1302 may be disposed on the second recess 1120 of the second housing 1200, and cover all or part of the pads 1802 disposed within the second recess. The pads 1802 may be connected to the circuit 230 disposed on the second housing 1200. There are no restrictions on the connection method between the pads 1802 and the circuit 230. In one embodiment, a contact hole may be formed in the second housing 1200, and the pads and the circuit may be connected using the contact hole or a feed-through.

[0123] Circuit 230 transmits electrical signals to pads 1802 connected to the circuit. Pads 1802 can transmit electrical signals to auditory nerve fibers via a second wire 1702, a third wire 1703, a first wire 1701, a connecting wire 1704, and a contact electrode 1801 connected in sequence. Furthermore, in a reverse mechanism, biosignals can be transmitted to circuit 230 via contact electrode 1801, connecting wire 1704, first wire 1701, third wire 1703, second wire 1702, and pads 1802. These electrical signals can be those necessary for the operation of the implantable device 1.

[0124] The first housing 1100, the second housing 1200, and the covering layers 1301 and 1302 can be integrally formed. That is, the first housing 1100, the second housing 1200, and the covering layers 1301 and 1302 can include the same insulating material. Furthermore, since the first housing 1100, the second housing 1200, and the covering layers 1301 and 1302 can come into contact with the body, they can be made of materials that are harmless to the body.

[0125] For example, the insulating material may include a silicone elastomer. The insulating material can prevent unwanted short circuits between the contact electrode 1801, the pad 1802, and the corresponding components of the wires 1701, 1702, 1703, and 1704, and prevent the inflow of electrical signals from the outside.

[0126] As an example, refer to Figure 6 and Figure 7 An insulating material can be disposed between the contact electrode 1801 and the first wire 1701 to serve as an insulating layer. That is, Figure 6 and Figure 7 The interior of the first groove 1110 can be filled with insulating material. Similarly, the interior of the second groove 1120 can be filled with insulating material. At the same time, the insulating material can also serve as a housing 1100, 1200 surrounding the contact electrode 1801, pad 1802, first to third conductors 1701, 1702, 1703 and connecting conductor 1704, thereby blocking the inflow of unwanted electrical signals from the outside.

[0127] refer to Figure 3 , Figure 4 and Figure 8 According to this embodiment, the thickness of the electrode array 1000 can become smaller as it moves away from the second housing 1200. The thickness is the length along a third direction (i.e., the z-direction). More specifically, according to this embodiment, the dimension of the first housing 1100 along the third direction can be inversely proportional to its distance from the second housing 1200. In other words, as the position of the first housing 1100 along the first direction moves away from the second housing 1200, the thickness of the first housing 1100 can gradually decrease. However, the embodiment is not limited to this; the thickness of the first housing 1100 along the first direction can be the same.

[0128] Furthermore, according to this embodiment, the width of the electrode array 1000 can become smaller as it moves away from the second housing. The width is the length along the second direction (i.e., the y-direction). More specifically, the dimension of the first housing 1100 along the second direction according to this embodiment can be inversely proportional to its distance from the second housing 1200. In other words, the width of the first housing 1100 can gradually decrease as it moves away from the second housing 1200 along the first direction. However, the embodiment is not limited to this; the width of the first housing 1100 along the first direction can be the same.

[0129] The reason why the width and thickness of the first housing 1100 are inversely proportional to the distance from the second housing 1200 will be referred to Figure 2 and Figure 9 Describe it.

[0130] Figure 9 It is set in Figure 2 A magnified view of the contact electrodes inside the cochlea.

[0131] refer to Figure 2 and Figure 9 When the electrode array according to this embodiment is implanted in the body, the electrode array can be bent during implantation to allow for appropriate connection to nerves according to the body organs. For example, in order to implant the body implantable device 1 according to this embodiment into the cochlea 10, it needs to be bent according to the shape of the cochlea 10 for implantation. Therefore, it may be advantageous for the first housing 1100 in which the electrodes to be connected to the body are located to be flexible.

[0132] To increase the flexibility of the electrode array 1000 according to this embodiment, a flexible material can be used. Furthermore, if the width and thickness of the first housing 1100 are formed to be inversely proportional to the distance from the second housing 1200, the flexibility of the electrode array 1000 can be further increased.

[0133] In the following text, reference will be made to Figures 10 to 13 The basic shape and structure of an electrode structure disposed inside an electrode array according to one embodiment are described.

[0134] Figure 10 This is a view showing an electrode structure according to one embodiment. Figure 11 yes Figure 10 A magnified view of section B. Figure 12 yes Figure 10 A magnified view of section C. Figure 13 yes Figure 10 An enlarged view of part D.

[0135] refer to Figures 10 to 13 According to one embodiment, the electrode structure 1500 may include a contact electrode portion 1601, a pad portion 1602, and a connection portion 1603.

[0136] The contact electrode portion 1601 may be a region in which a plurality of contact electrodes 1801, a plurality of first wires 1701, and a plurality of connecting wires 1704 are disposed. The pad portion 1602 may be a region in which a plurality of pads 1802 and second wires 1702 are disposed. The connecting portion 1603 may be a region in which a plurality of third wires 1703 are disposed and a fold portion 1400 is positioned.

[0137] The contact electrode 1801, pad 1802, first conductor 1701, second conductor 1702, third conductor 1703, and connecting conductor 1704 can be formed as a single unit. In other words, the contact electrode 1801, pad 1802, first conductor 1701, second conductor 1702, third conductor 1703, and connecting conductor 1704 can all be connected.

[0138] That is, the contact electrode 1801 is connected to the connecting wire 1704, the connecting wire 1704 is connected to the first wire 1701, the first wire 1701 is connected to the third wire 1703, the third wire 1703 is connected to the second wire 1702, and the second wire 1702 is connected to the pad 1802, so that they can be integrally formed.

[0139] Since the contact electrode 1801, pad 1802, first conductor 1701, second conductor 1702, third conductor 1703, and connecting conductor 1704 are integrally formed, they can be made of the same material. For example, the contact electrode 1801, pad 1802, first conductor 1701, second conductor 1702, third conductor 1703, and connecting conductor 1704 may include a conductive material; in one embodiment, the conductive material may include platinum-iridium (PtIr).

[0140] The folded portion 1400 can be positioned within the connecting portion 1603 and can be a reference area for the folded electrode structure 1500. As one embodiment, the folded portion 1400 can be a space extending in a first direction (i.e., longitudinally) after passing through the center of the connecting portion 1603. However, this embodiment is not limited to this; the folded portion 1400 may not pass through the center of the connecting portion 1603.

[0141] The fold 1400 can be appropriately modified and shaped to include portions that need to be folded. For example, when the electrode structure 1500 needs to be folded two or more times, the electrode structure 1500 may include two or more folds 1400.

[0142] In this case, each fold 1400 can be formed to include a section to be folded. During the manufacturing process of the electrode array 1000 according to this embodiment, the electrode structure 1500 can be folded and disposed in the housings 1100 and 1200, and the fold 1400 can be a space formed to facilitate folding in the corresponding process.

[0143] The contact electrode portion 1601 and the connecting portion 1603 may be disposed in the first housing 1100, and the pad portion 1602 may be disposed in the second housing 1200.

[0144] refer to Figure 11 The contact electrode 1801, the first wire 1701, and the connecting wire 1704 can be disposed in the contact electrode portion 1601. In one embodiment, the contact electrode 1801 can be matched one-to-one with the first wire 1701. That is, one contact electrode can be connected to one wire. However, this embodiment is not limited to this.

[0145] More specifically, the first conductor 1701 and the contact electrode 1801 can be connected by a connecting conductor 1704. The connecting conductor 1704 may be a conductor formed such that its end facing a second direction relative to the end of the first conductor 1701 extending in a first direction, to connect the contact electrode 1801 and the first conductor 1701. That is, the electrode structure 1500 according to this embodiment may include a connecting conductor 1704 that connects the first conductor 1701 and the contact electrode 1801, and bends from the first conductor 1701 along the second direction.

[0146] As described above, the first conductor 1701, the connecting conductor 1704, and the contact electrode 1801 can form an integral structure as a structure that is connected to each other.

[0147] When the electrode structure 1500 is folded around the fold 1400 to form the electrode array 1000, all or part of the connecting wire 1704 can be folded. The contact electrode portion 1601 can be folded around the connecting wire 1704, such that the contact electrode 1801 and the first wire 1701 are positioned facing each other. An insulating layer can be disposed between the opposing contact electrode 1801 and the first wire 1701. The insulating layer may include an insulating material, such as the aforementioned silicone elastomer.

[0148] The connecting wire 1704 can have various structures that facilitate folding. In one embodiment, the connecting wire 1704 may include a zigzag pattern. In another embodiment, the connecting wire 1704 may include an embossed pattern. In yet another embodiment, the connecting wire 1704 may include a moiré pattern. When the connecting wire 1704 includes such a pattern, the tensor applied to the corresponding wire during bending can be reduced compared to the tensor of a straight line, thereby increasing flexibility. If the flexibility of the wire is improved, the risk of short circuits due to the tensor applied during bending is reduced, thereby providing stability to the device. However, any structure capable of increasing flexibility can be applied to the connecting wire 1704, and this embodiment is not limited to zigzag patterns, embossed patterns, or moiré patterns. Furthermore, the connecting wire 1704 may have a straight shape.

[0149] refer to Figure 12 The third conductor 1703 and the folding part 1400 can be positioned in the connecting part 1603.

[0150] As described above, the fold 1400 can be a space formed to facilitate the folding of the electrode structure 1500, and can be a space through which the wire does not pass.

[0151] In order to form the folded portion 1400, the first conductor 1701 and the third conductor 1703, located in the area where the contact electrode portion 1601 and the connecting portion 1603 are connected, may have curved patterns BP1 and BP2 in some areas.

[0152] In other words, the first conductor 1701 and the third conductor 1703 may include a bending pattern at a predetermined angle at the location where the two conductors are connected to each other, and the space formed by the bending pattern may be a fold 1400. In order to form the fold 1400, the first conductor 1701 and the third conductor 1703 may be bent multiple times.

[0153] The third conductor 1703 may include a first conductor group TG1 and a second conductor group TG2, which are divided by a virtual line L1 passing through the center of the fold 1400, and the first conductor group TG1 and the second conductor group TG2 may have curved patterns BP1 and BP2, respectively. However, this embodiment is not limited to this, and the curved pattern may be formed only in one of the first conductor group TG1 and the second conductor group TG2.

[0154] From another perspective, wires 1701, 1702, and 1703 may include a pattern that bypasses the fold 1400. That is, the space in the third electrode unit 1603 where wires 1701, 1702, and 1703 arranged at regular intervals along the second direction are moved away along the second direction and returned to the original intervals can be the fold 1400.

[0155] More specifically, the spacing between the first conductor group TG1 and the second conductor group TG2 may differ in the contact electrode portion 1601, the connection portion 1603, and the pad portion 1602. The spacing between the first conductor group TG1 and the second conductor group TG2 in the connection portion 1603 may be greater than the spacing between the first conductor group TG1 and the second conductor group TG2 in the contact electrode portion 1601 and the pad portion 1602. The fold portion 1400 may include a space formed by patterns spaced apart at predetermined distances by the first conductor group TG1 and the second conductor group TG2 in the connection portion 1603.

[0156] refer to Figure 13 The pad portion 1602 may include a plurality of second conductors 1702 and a plurality of pads 1802. The second conductors 1702 are conductors extending from the third conductor 1703, and may have a pattern of bending at a predetermined angle along a second direction in the area where the two conductors are connected. That is, the plurality of pads 1802 may be disposed on one side of the virtual line L1.

[0157] This is to prevent the pads 1802 from overlapping each other along a third direction when the electrode array 1000 is formed by the folded electrode structure 1500. The pads 1802 are configured to connect to corresponding terminals of the circuit 230 disposed on the second housing, so they should not overlap each other along a third direction. The bending angle can be appropriately adjusted for each specific shape of the electrode structure 1500. For example, as in Figure 24 In the embodiment shown, the bending angle can be less than [a certain value] so that the electrode structure 1500 does not interfere with the connection to the circuit 230 even when the pad 1802 and the second conductor 1702 partially overlap. Figure 13 The bending angle in the embodiment. Moreover, even if the pads 1802 overlap along a third direction, they will not bend if there are no connection problems according to the specific design of the circuit 230.

[0158] The pad 1802 and the second conductor 1702 can be matched one-to-one. The second conductor 1702 and the third conductor 1703 can also be matched one-to-one. However, this embodiment is not limited to this and can be matched in multiple ways. As described above, the pad 1802, the second conductor 1702, and the third conductor 1703 can be formed as a single unit. That is, it can be a single construction.

[0159] As described above, the pads 1802 can be connected to the electrodes of the circuit 230 via contact holes formed in the second housing 1200 or via feedthrough holes. Here, the electrodes of the circuit 230 can form individual channels. Therefore, each contact electrode 1801 extending from the pads 1802 can form an independent channel, and the number of contact electrodes 1801 and the number of pads 1802 can correspond to the number of channels, but this embodiment is not limited thereto.

[0160] In the following text, reference will be made to Figures 14 to 2 5. A method for manufacturing an electrode array 1000 according to an embodiment is described.

[0161] Figure 14 This is a plan view showing the substrate and the conductive material disposed on the substrate. Figure 15 This is a cross-sectional view showing the substrate and the conductive material disposed on the substrate.

[0162] First, the patterning fabrication steps will be described. (Reference) Figure 14 and Figure 15 The patterning preparation step is the step of forming a conductive material 1520 on the substrate 1511. In one embodiment, the substrate 1511 may be a self-adhesive film, and the conductive material may be platinum-iridium foil (PtIr foil). However, this embodiment is not limited to this; any material that can be used in the patterning process can be used as the substrate 1511, and any conductive material that is easy to pattern and harmless to the human body can be used as the conductive material 1520.

[0163] Figure 16 This is a view illustrating the process of forming an electrode structure by patterning a conductive material disposed on a substrate. Figure 17 This is a cross-sectional view showing the process of forming an electrode structure by patterning a conductive material disposed on a substrate.

[0164] Next, perform the patterning step. (See reference) Figure 16 and Figure 17 The patterning step is a step of forming the electrode structure 1500 by patterning a conductive material 1520 disposed on a substrate. In one embodiment, the conductive material 1520 can be patterned using a laser. However, it is not limited to laser patterning.

[0165] When the patterning step is completed, the conductive material 1520 can have the following properties: Figure 16 The shape of electrode structure 1500 is shown.

[0166] Figure 18a This is a rear view of the substrate, in which folding guide grooves and alignment holes are formed on the rear surface of the substrate. Figure 18b yes Figure 18a Front view. Figure 19 yes Figure 18b Cross-sectional view.

[0167] Next, the substrate processing steps can be performed. (See reference) Figure 18a , Figure 18b and Figure 19The substrate processing step is a step of forming the folded guide groove 1513 and the alignment hole 1514 by processing the rear surface of the substrate 1511. The rear surface of the substrate 1511 is a surface facing the opposite direction to the surface on which the electrode structure 1500 is formed.

[0168] The folding guide groove 1513 is a groove formed on the rear surface of the substrate 1511 to facilitate folding when the electrode structure 1500 is folded along the folding line. The spacing of the groove can be appropriately modified and applied according to the body implantable device 1 to be manufactured.

[0169] The alignment hole 1514 is a structure that guides the electrode structure 1500 to fold accurately during folding. Accurate folding can be achieved by checking that the mutually facing alignment holes 1514 are correctly aligned during folding.

[0170] Alignment holes 1514 can be formed outside the area on the substrate 1511 where the electrode structure 1500 is formed. Unlike the folded guide groove 1513, the alignment holes 1514 are formed to completely penetrate the substrate 1511. If alignment holes are formed in the area where the electrode structure 1500 is positioned, the electrode structure 1500 may be damaged. The specific number or location of alignment holes 1514 can be appropriately modified and applied according to the purpose and size of the implantable body device 1 to be manufactured.

[0171] Figure 20 This is a cross-sectional view showing the process of applying insulating material to the substrate and electrode structure.

[0172] After the substrate processing step, the insulating material application step can be performed.

[0173] refer to Figure 20 The insulating material application step involves applying insulating material 1540 to the substrate 1511 and the electrode structure 1500 formed on the substrate 1511. The insulating material 1540 can be applied using an insulating material application device 1530. The insulating material 1540 may include a silicon elastomer. The applied insulating material 1540 prevents short circuits between contact electrodes 1801, between pads 1802, or between contact electrodes 1801, pads 1802, and wires 1701, 1702, 1703, and 1704, and prevents the introduction of unwanted electrical signals from the outside. Furthermore, the insulating material 1540 not only insulates the components but also securely bonds each component and fixes it in the desired position.

[0174] Figure 21 This is a cross-sectional view showing the folded substrate and electrode structure.

[0175] After applying insulating material 1540, the folding step can be performed. (See reference) Figure 21 The folding step is a step in which the substrate 1511 and the electrode structure 1500 are folded using the alignment hole 1514 and the folding guide groove 1513 after the insulating material 1540 is applied to the substrate 1511 and the electrode structure 1500.

[0176] Alignment hole 1514 can be configured to check whether folding is performed correctly, and folding guide groove 1513 can be configured to facilitate folding of substrate 1511. This folding can be formed along virtual line L1, in which folding guide groove 1513 is formed. The folding direction of substrate 1511 and electrode structure 1500 can be folded along the direction in which substrate 1511 is exposed to the outside. In other words, substrate 1511 and electrode structure 1500 can be folded along the direction in which the applied insulating material 1540 contacts each other. Therefore, portions of electrode structure 1500 can face each other, and insulating material 1540 can be located between portions of electrode structure 1500. Insulating material 1540 positioned between folded and facing electrode structures 1500 can serve as an insulating layer. That is, the insulating layer can be used to prevent unwanted short circuits between contact electrode 1801 and multiple wires.

[0177] In addition, to improve insulation performance and bonding strength, insulation material 1540 can be reapplied once or multiple times before the folding step.

[0178] Figure 22 This is a cross-sectional view showing the electrode structure with the substrate removed.

[0179] After the folding step, a substrate removal step can be performed. (See reference) Figure 22 The substrate removal step is the step of removing the substrate 1511 from the folded electrode structure 1500 and the insulating layer positioned between the folded electrode structure 1500. When the substrate 1511 is removed, a portion of the electrode structure 1500 may be exposed to the outside. The exposed portion of the electrode structure 1500 may be a contact electrode 1801.

[0180] Figure 23 This is a cross-sectional view showing the formation of a housing in an electrode structure from which the substrate has been removed.

[0181] Next, the shell forming step can be performed. (See reference) Figure 23After removing the substrate 1511, housings 1100 and 1200 can be formed around the folded electrode structure 1500. Housings 1100 and 1200 may include the first housing 1100 and the second housing 1200 as described above, and each of housings 1100 and 1200 may include cover layers 1301 and 1302. Cover layers 1301 and 1302 can be used to cover the electrode structure 1500 folded as part of housings 1100 and 1200.

[0182] Electrode holes 1310 may be formed on a portion of the first cover layer 1301. Electrode holes 1310 are openings that expose contact electrodes 1801 beneath the first cover layer 1301 to the outside. Electrode holes 1310 may be formed for each of a plurality of contact electrodes 1801. That is, one electrode hole 1310 exposes one contact electrode 1801. In this case, the number of electrode holes 1310 may be the same as the number of contact electrodes 1801. The number of electrode holes 1310 may be the same as the number of channels in the circuit 230.

[0183] Housings 1100 and 1200, as well as cover layers 1301 and 1302, may all comprise the same material. In one embodiment, housings 1100 and 1200, as well as cover layers 1301 and 1302, may comprise an insulating material 1540 applied in an insulating material application step. More specifically, housings 1100 and 1200, as well as cover layers 1301 and 1302, may comprise a silicone elastomer. Housings 1100 and 1200, as well as cover layers 1301 and 1302, are formed of the same insulating material 1540, and the insulating layers may be formed integrally.

[0184] Figure 24 This is a view illustrating an electrode structure according to another embodiment. For the electrode structure according to another embodiment of the invention, the description of the substantially the same construction as described above will be simplified, and the differences will be mainly described.

[0185] refer to Figure 24 The electrode structure 1500 may include a contact electrode portion 1601, a pad portion 1602, and a connection portion 1603.

[0186] The contact electrode portion 1601 may be a region in which a plurality of contact electrodes 1801, a plurality of first wires 1701, and a plurality of connecting wires 1704 are disposed. The pad portion 1602 may be a region in which a plurality of pads 1802 and second wires 1702 are disposed. The connecting portion 1603 may be a region in which a plurality of third wires 1703 are disposed and a fold portion 1400 is positioned. The first wires 1701, second wires 1702, and third wires 1703 may be individual wires connecting the contact electrodes 1801 and the pads 1802.

[0187] The electrode structure 1500 may include a virtual line L1 that traverses the electrode structure 1500 along a first direction. The virtual line L1 may divide the electrode structure 1500 into two adjacent regions along a second direction. The virtual line L1 may traverse the fold 1400.

[0188] As described above, a virtual line L1 serving as a reference line can be used to fold the electrode structure 1500 in order to form an electrode array 1000. (Reference) Figure 24 An enlarged view of the pad portion 1602 shows that the virtual line L1 can cross the pad portion 1602. When folded around the virtual line L1, a portion of the pad portion 1602 can bend and overlap each other.

[0189] For example, the second conductor group TG2 connected to the multiple pads 1802 can be bent and positioned above the pads 1802. That is, the multiple pads 1802 can be positioned at the bottom, and the bent second conductor group TG2 can be positioned at the top. However, since an insulating layer is disposed between the multiple pads 1802 and the second conductor group TG2, they can be electrically insulated.

[0190] In this embodiment, there is no problem connecting the electrodes of the circuit 230 and the pads 1802 even when a portion of the pad portion 1602 overlaps. This is because even if a portion of the pad portion 1602 partially overlaps due to folding, the pads 1802 will not overlap.

[0191] When forming the electrode array 1500, the electrode structure 1500 according to this embodiment can be folded two or more times as needed. When the electrode structure 1500 is folded n-1 times (n is an integer greater than or equal to 2), the electrode structure 1500 may include lines 1 to n-1, L1, L2, which are imaginary lines that divide the region into n (n is an integer greater than or equal to 2) regions along a second direction. The lines 1 to n-1 do not cross each other and may each be a virtual line extending along a first direction.

[0192] During the folding process, the electrode structure 1500 can be folded alternately by inward and outward folding based on the first line to the (n-1)th line.

[0193] Figure 24 The electrode structure 1500, which requires two folds (i.e., when n is 3), is shown. Reference Figure 24 The electrode structure 1500 can first be folded inward around the first line L1. Then, the electrode structure 1500 can be folded outward along the second line L2, which serves as the center. The reason for alternating inward and outward folding is to expose the contact electrode 1801 to the outside of the completed electrode array 1000. Although, as an example, in Figure 24 The electrode structure 1500 has been described as being folded twice, but this embodiment is not limited to this.

[0194] Figure 25a and Figure 25b This is a view showing an electrode structure according to another embodiment.

[0195] The electrode structure according to this embodiment may include multiple electrode structures that are separate from each other. Hereinafter, a group of multiple electrode structures will be referred to as an electrode structure group.

[0196] An electrode structure group may include electrode structures 1 through n (where n is an integer of 2 or greater). Electrode structures 1 through n may be separate from each other.

[0197] The i-th electrode structure (an integer greater than or equal to 1 and less than or equal to n) may include an i-th contact electrode portion, an i-th pad portion, and an i-th connection portion. The i-th contact electrode portion, the i-th pad portion, and the i-th connection portion correspond to... Figure 10 The embodiment includes the contact electrode portion 1601, the pad portion 1602, and the connection portion 1603.

[0198] The i-th contact electrode portion may include a plurality of i-th connecting wires extending from a plurality of i-th contact electrodes, a plurality of first i-th wires, and a plurality of i-th connecting wires connecting the plurality of i-th contact electrodes and the plurality of first i-th wires. The i-th contact electrodes, the first i-th wires, and the i-th connecting wires respectively correspond to Figure 11 The embodiment includes contact electrode 1801, first wire 1701, and connecting wire 1704.

[0199] The i-th pad portion may include multiple i-th pads and multiple second i-th conductors connected to the multiple i-th pads. The i-th pads and the second i-th conductors respectively correspond to Figure 13 The embodiment includes pad 1802 and second conductor 1702.

[0200] The i-th connection portion may include multiple third i-th wires connecting multiple first i-th wires and multiple second i-th wires. The third i-th wires correspond to... Figure 12 The third conductor 1703 in the embodiment. The i-th connection portion may be disposed between the i-th contact electrode portion and the i-th pad portion.

[0201] The length of the i-th electrode structure along the first direction can be inversely proportional to i. That is, the distance between the i-th contact electrode and the i-th pad among the plurality of i-th contact electrodes closest to the i-th pad can be greater than the distance between the (i+1)-th contact electrode and the (i+1)-th pad among the plurality of i+1-th contact electrodes furthest from the (i+1)-th pad. This is to prevent overlap between the first contact electrode and the n-th contact electrode when multiple electrode structures are overlapped during the formation of the electrode array 1000.

[0202] Figure 25a and Figure 25b An electrode structure group with two electrode structures (i.e., when n is 2) is shown. For ease of description, the case of n = 2 will be used as an example, but n is not limited to 2.

[0203] When n is 2, the electrode structure group may include a first electrode structure 1500a and a second electrode structure 1500b.

[0204] Figure 25a This is a view showing the structure of the first electrode.

[0205] refer to Figure 25a The first electrode structure 1500a may include a first contact electrode portion 1601a, a first pad portion 1602a, and a first connection portion 1603a.

[0206] The first contact electrode portion 1601a may include a plurality of first contact electrodes 1801a, a plurality of first first wires 1701a, and a plurality of first connecting wires 1704a extending from the plurality of first contact electrodes 1801a to connect the plurality of first contact electrodes 1801a and the plurality of first first wires 1701a. The first pad portion 1602a may include a plurality of first pads 1802a and a plurality of second first wires 1702a connected to the plurality of first pads 1802a.

[0207] The first connection portion 1603a may include a plurality of third first wires 1703a that connect a plurality of first first wires 1701a and a plurality of second first wires 1702a. The first connection portion 1603a may be disposed between the first contact electrode portion 1601a and the first pad portion 1602a.

[0208] The first electrode structure 1500a can undergo the same process as in the above embodiments, until... Figure 22 The substrate removal step shown is used to form the electrode array 1000.

[0209] The first electrode structure 1500a may include a first line L1, which is a virtual line that crosses a plurality of first connecting wires 1704a along a first direction. During the formation of the electrode array 1000, the first electrode structure 1500a can be folded based on the first line L1. More specifically, the first contact electrode portion 1601a of the first electrode structure 1500a can be folded based on the first line L1. When the first contact electrode portion 1601a is folded based on the first line L1, a plurality of first contact electrodes 1801a and a plurality of first connecting wires 1701a can overlap along a third direction, with an insulating film inserted between the plurality of first contact electrodes 1801a and the plurality of first connecting wires 1701a. The first contact electrode portion 1601a and the first connecting portion 1603a can be disposed in a first groove of the first housing, and the first pad portion 1602a can be disposed in a second groove of the second housing.

[0210] refer to Figure 25b The second electrode structure 1500b may include a second contact electrode portion 1601b, a second pad portion 1602b, and a second connection portion 1603b.

[0211] The second contact electrode portion 1601b may include a plurality of second contact electrodes 1801b, a plurality of first second wires 1701b, and a plurality of second connecting wires 1704b extending from the plurality of second contact electrodes 1801b to connect the plurality of second contact electrodes 1801b and the plurality of second second wires 1701b.

[0212] The second pad portion 1602b may include a plurality of second pads 1802b and a plurality of second conductors 1702b connected to the plurality of second pads 1802b.

[0213] The second connection portion 1603b may include a plurality of third second conductors 1703b that connect a plurality of first second conductors 1701b and a plurality of second second conductors 1702b. The second connection portion 1603b may be disposed between the second contact electrode portion 1601b and the second pad portion 1602b.

[0214] Similarly, the second electrode structure 1500b can undergo the same process as in the above embodiments, until... Figure 22 The substrate removal step shown is used to form the electrode array 1000.

[0215] The second electrode structure 1500b may include a first line L1, which is a virtual line that crosses a plurality of second connecting wires 1704b along a first direction. During the formation of the electrode array 1000, the second electrode structure 1500b can be folded based on the first line L1. More specifically, the second contact electrode portion 1601b of the second electrode structure 1500b can be folded based on the first line L1. When the second contact electrode portion 1601b is folded based on the first line L1, a plurality of second contact electrodes 1801b and a plurality of first and second connecting wires 1701b can overlap along a third direction, with an insulating layer inserted between the plurality of second contact electrodes 1801b and the plurality of first and second connecting wires 1701b. The second contact electrode portion 1601b and the second connecting portion 1603b can be disposed in a first groove of the first housing, and the second pad portion 1602a can be disposed in a second groove of the second housing.

[0216] In this embodiment, the process of stacking the first electrode structure 1500a and the second electrode structure 1500b is also performed to form the electrode array 1000.

[0217] Figure 26 This is a view showing the process of stacking the first electrode structure 1500a and the second electrode structure 1500b.

[0218] refer to Figure 26 (a) The second electrode structure 1500b can be disposed on the first electrode structure 1500a. To minimize the step difference between the first contact electrode 1801a and the second contact electrode 1801b after the electrode structures 1500a and 1500b are stacked, some of the insulating material 1540 covering the first electrode structure 1500a can be removed. The insulating material 1540 can serve as an insulating layer between corresponding components. When the second electrode structure 1500a is disposed where the insulating material 1540 is removed, the step difference between the first contact electrode 1801a and the second contact electrode 1801b can be minimized, such as... Figure 26 As shown in (b).

[0219] In the following text, reference will be made to Figure 25a , Figure 25b and Figure 26 Describe the lengths of the first electrode structure 1500a and the second electrode structure 1500b along the first direction.

[0220] The plurality of first contact electrodes 1801a may include a first first contact electrode to a first s-th contact electrode (s is an integer greater than or equal to 1), which are arranged sequentially along a first direction starting from a point away from the first pad portion 1602a. That is, the first first contact electrode may be the contact electrode farthest from the first pad portion 1602a, and the first s-th contact electrode may be the contact electrode closest to the first pad portion 1602a.

[0221] The plurality of second contact electrodes 1801b may include second first contact electrodes to second t-th contact electrodes (t is an integer greater than or equal to 1), which are arranged sequentially along a first direction starting from a point away from the second pad portion 1602b. That is, the second first contact electrode may be the contact electrode farthest from the second pad portion 1602b, and the second t-th contact electrode may be the contact electrode closest to the second pad portion 1602b.

[0222] The distance between the first s-th contact electrode and the first pad portion 1602a can be greater than the distance between the second first contact electrode and the second pad portion 1602b. That is, the distance between the first s-th contact electrode positioned closest to the first pad portion 1602a and the first pad portion 1602a can be greater than the distance between the first s-th contact electrode positioned furthest from the second pad portion 1602b and the second pad portion 1602b. Otherwise, if the distance between the second first contact electrode and the second pad portion 1602b is greater than the distance between the first s-th contact electrode and the first pad portion, some of the plurality of second contact electrodes 1801b can overlap with some of the plurality of first contact electrodes 1801a.

[0223] The length of the first electrode structure 1500a along the first direction can be greater than the length of the second electrode structure 1500b along the first direction. This is because if the length of the first electrode structure 1500a along the first direction is less than the length of the second electrode structure 1500b along the first direction, then the plurality of second contact electrodes 1801b may overlap with the plurality of first contact electrodes 1801a.

[0224] Multiple first and second conductors 1701b and multiple second contact electrodes 1801b may be stacked with a third first conductor 1703c, with an insulating layer inserted between them. Furthermore, multiple third first conductors 1703a and multiple third second conductors 1703b may overlap along a third direction, with an insulating layer inserted between them.

[0225] refer to Figure 25a and Figure 25b The first connecting wire 1704a and the second connecting wire 1704b may include a moiré pattern or a zigzag pattern.

[0226] refer to Figure 25a and Figure 25b The first pad portion 1602a and the second pad portion 1602b may have patterns such that when the second electrode structure 1500b is stacked on the first electrode structure 1500a, the first pad portion 1602a and the second pad portion 1602b do not overlap each other. For example, as Figure 25a As shown, the first pad portion 1602a can be patterned such that the first pad 1802a and the second first conductor 1702a face the X1 and Y2 directions, respectively. Figure 25b As shown, the second pad portion 1602b can be patterned such that the second pad 1802b and the second second conductor 1702b face the X2 direction and the Y1 direction.

[0227] Figure 27 This is a view showing an electrode structure according to another embodiment.

[0228] refer to Figure 27 The electrode structure 1500 may include a contact electrode portion 1601, a pad portion 1602, and a connection portion 1603.

[0229] The contact electrode portion 1601 may be a region in which a plurality of contact electrodes 1801, a plurality of first wires 1701, and a plurality of connecting wires 1704 are disposed. The pad portion 1602 may be a region in which a plurality of pads 1802 and second wires 1702 are disposed. The connection portion 1603 may be a region in which a plurality of third wires 1703 are disposed.

[0230] The electrode structure 1500 may include a virtual line L1 that traverses the electrode structure 1500 along a first direction. The virtual line L1 may divide the electrode structure 1500 into two adjacent regions along a second direction.

[0231] Figure 28 This is a view illustrating the process of manufacturing an electrode array according to one embodiment.

[0232] Figure 28 The manufacturing processes in (a) to (f) can be compared with those in the reference. Figures 14 to 22 The manufacturing processes described are basically the same.

[0233] Step (a) is the step of forming a conductive material 1520 on the substrate 1511. Step (b) illustrates the step of forming an electrode structure 1500 by patterning the conductive material 1520 into a desired shape. Step (c) is the step of forming an alignment hole 1514 and a folding guide groove 1513 by processing the substrate 1511. Step (d) illustrates the process of covering the patterned electrode structure 1500 by applying an insulating material 1540 to the substrate 1511. Step (e) illustrates the process of folding the substrate 1511, the insulating material 1540, and the electrode structure 1500. Folding can be based on... Figure 27 The virtual line L1 is formed. Step (f) illustrates the process of removing the substrate 1511 from the folded electrode structure 1500. In this process, the contact electrode 1801 may be exposed to the outside.

[0234] Steps (g) and (h) are steps to form a cylindrical folded electrode structure 1500. More specifically, the electrode structure 1500 can be manufactured in a cylindrical shape, wherein the externally exposed contact electrode 1801 is positioned on the outer circumferential surface by step (f). The core bundle 1900 can be disposed on the inner circumferential surface (or inside) of the cylindrical shape. The core bundle 1900 can serve as a skeleton for maintaining the shape of the completed electrode array 1000. Simultaneously, during the body implantation phase of the electrode array 1000, the core bundle 1900 can be used to guide a stylette, as described later.

[0235] The core bundle 1900 can be flexible. This is to suppress excessive pressure on surrounding tissues after implantation. For this purpose, the core bundle 1900 may include a helical spring made of stainless steel.

[0236] The core bundle 1900 can be used to assist in the precise implantation of the electrode array 1000 into the body. More specifically, the core bundle 1900 can form a hole penetrating the center of the electrode array 1000, and the core bundle 1900 can be implanted into the precise site using a probe disposed in the hole. The probe is an auxiliary tool with a certain degree of straightness and rigidity above a certain level, which can be used to assist the flexible electrode array 1000 in reaching the accurate position. The probe is used only during the implantation stage and can be removed from the electrode array 1000 after implantation. This is to prevent damage caused by the straight probe applying pressure to surrounding tissue.

[0237] Figure 29 This is a view showing an electrode array according to one embodiment.

[0238] refer to Figure 28 (h) and Figure 29 The core bundle 1900, serving as the framework, can be positioned on (or inside) the inner circumferential surface of the electrode array 1000. Wires 1701, 1702, 1703, and 1704 can be positioned outside the core bundle 1900. An insulating layer can be positioned outside the core bundle 1900 and the wires 1701, 1702, 1703, and 1704. Multiple externally exposed contact electrodes 1801 can be positioned outside the insulating layer.

[0239] Multiple contact electrodes can be positioned at one end of the cylindrical electrode array 1000. Multiple pads 1802 exposed to the outside and connected to the circuit 230 can be positioned at the other end of the cylindrical electrode array 1000.

[0240] Figure 30 This is a view showing an electrode array according to an embodiment.

[0241] Reference Figure 30 , the electrode array 1000 can be bent in the body as needed. For flexibility and stability, the wires can include a moiré pattern or a wavy pattern. In Figure 30 , as an example, the third wire 1703 has a moiré pattern or a wavy pattern, but this embodiment is not limited thereto, and all the wires in the above embodiments can include such a pattern to improve flexibility and stability. The patterns that the wires can have can not only include moiré patterns or wavy patterns, but also include various patterns that help improve flexibility and stability.

[0242] Figure 31 This is a view showing an embodiment of the contact electrode.

[0243] Refer Figure 31 , the contact electrode 1801 can have a rectangular shape with curved vertices. In addition, the contact electrode 1801 can include a plurality of fixing holes 1811a. In one embodiment, the fixing holes 1811a can be formed at each vertex of the contact electrode 1801. However, the shape of the contact electrode and the number and position of the fixing holes 1811a are exemplary and can be appropriately modified according to the situation.

[0244] Figure 32 This is a view showing the contact electrode coated with an insulating material. Figure 33 This is a Figure 32 cross-sectional view taken along the III-III' line of

[0245] Reference Figure 32 and Figure 33 , the fixing holes 1811a are configured to fix the contact electrode 1801 more firmly. More specifically, when fixing each structure of the electrode array 1000 by applying the insulating material 1540, by introducing the insulating material 1540 into the fixing holes 1811a formed in the contact electrode 1801, the fixing holes 1811a can play a role in fixing more stably.

[0246] Figure 34 This is a view showing another embodiment of the contact electrode. Figure 35 This is a view showing yet another embodiment of the contact electrode.

[0247] Reference Figure 34 and Figure 35 , the fixing holes 1811b and 1811c can be provided on both sides of the contact electrode 1801. That is, the fixing holes can be formed in a long strip shape in the left and right or upper and lower regions of the contact electrode 1801.

[0248] Figure 36This is a view showing another embodiment of the contact electrode.

[0249] refer to Figure 36 The fixing hole 1811d can be formed in an elongated shape in the four regions of the contact electrode 1801: upper, lower, left, and right.

[0250] Conventionally, in the manufacture of implantable devices, the electrodes that come into contact with the body and the wires connected to the electrodes are soldered separately. In this case, increasing the number of electrodes per unit length is limited.

[0251] In the electrode structure 1500 according to the above embodiment, the contact electrode 1801 and the wire are integrally formed, and they are folded or bent into a cylindrical shape to manufacture the electrode array 1000 and the body implantable device 1 including the electrode array 1000. Therefore, manufacturing precision is improved, thereby significantly increasing the number of electrodes per unit length. That is, the electrode structure 1500, electrode array 1000, and body implantable device 1 according to this embodiment can increase the number of first electrodes 1801 that can be disposed per unit length, thereby improving performance and precision.

[0252] Figure 37 This is a view showing the first electrode structure of the electrode array according to the sixth embodiment. Figure 38 It is along Figure 37 A cross-sectional view taken along the AA direction. Figure 39 It is along Figure 37 A cross-sectional view taken along the BB direction.

[0253] According to one embodiment, the first electrode structure EG1 and the second electrode structure EG2 can be manufactured separately, and they can be combined to manufacture an electrode array.

[0254] refer to Figure 37 and Figure 38 In the first electrode structure EG1, a first electrode pattern can be formed by forming a conductive material on a first substrate 1511a and then performing patterning. The first electrode pattern may include a first wire group TG1 and a plurality of first contact electrodes 1801a. The wire group may include the first wire, second wire, and third wire described above.

[0255] For example, sixteen first contact electrodes 1801a can be formed, but the number of first contact electrodes 1801a is not limited to this.

[0256] The first connecting wire 1704a can be formed between the first wire group TG1 and the first contact electrode 1801a, respectively. As described above, the first connecting wire 1704a can have various curved shapes to provide flexibility and stability during bending. The first insulating layer 1540a can be formed on the first wire group TG1 and the plurality of first contact electrodes 1801a. In addition, the alignment hole 1514 can be formed in the first substrate 1511a.

[0257] refer to Figure 39 The through-hole 1541 of the second contact electrode 1801b, which is provided with the second electrode structure EG2, can be formed in the first insulating layer 1540a. The through-hole 1541 can be formed to correspond to or be larger than the area of ​​the second contact electrode, so as to expose the second contact electrode.

[0258] Figure 40 This is a view showing the second electrode structure of the electrode array according to the sixth embodiment. Figure 41 This is a view showing the second electrode structure in a state based on imaginary line folding. Figure 42 It is a cross-sectional view along the CC direction. Figure 43 This is a view showing the second electrode structure separated from the substrate.

[0259] refer to Figure 40 In the second electrode structure EG2, the second electrode pattern can be formed by forming a conductive material on the second substrate 1511b and performing patterning. The second electrode pattern may include a second wire group TG2 and a plurality of second contact electrodes 1801b. For example, sixteen second contact electrodes 1801b may be formed, but the number is not limited thereto.

[0260] The second connecting wire 1704b can be formed between the second wire group TG2 and the second contact electrode 1801b, respectively. The second insulating layer 1540b can be formed on the second wire group TG2 and the plurality of second contact electrodes 1801b. The second electrode structure EG2 can be folded along the virtual line L1 that crosses the plurality of second connecting wires 1704b.

[0261] refer to Figure 41 and Figure 42 During the folding of the second electrode structure EG2 along the virtual line, the second connecting wire 1704b can be positioned on a different plane than the second contact electrode 1801b. Here, "different plane" can be defined as horizontal planes with different heights based on the reference plane.

[0262] Because the second electrode structure EG2 is bent, the upper surfaces of the second insulating layer 1540b face each other, so the interface EB1 of the folded second insulating layer 1540b may not be observed. Subsequently, as... Figure 43As shown, the second electrode structure EG2 can be fabricated by removing the second substrate 1511b.

[0263] Figure 44 This is a view showing the state in which the second electrode structure is stacked on top of the first electrode structure. Figure 45 This is a view showing the first electrode structure in a state based on imaginary line folding. Figure 46a It is along Figure 45 Cross-sectional view in the FF direction. Figure 46b It is along Figure 45 A cross-sectional view along the GG direction.

[0264] refer to Figure 44 The second electrode structure EG2 can be stacked on the stacking region SA1 of the first electrode structure EG1. The second contact electrode 1801b of the second electrode structure EG2 can be disposed at the position corresponding to the through hole 1541 of the first insulating layer 1540a. The second contact electrode 1801b can be exposed through the through hole 1541.

[0265] The second contact electrode 1801b can be inserted into the through hole 1541, but this embodiment is not limited to this. The second contact electrode 1801b can be disposed on the upper part of the through hole 1541.

[0266] Subsequently, the first electrode structure EG1 can be folded to surround the second electrode structure EG2. After the first electrode structure EG1 is folded to surround the second electrode structure EG2, the first substrate 1511a can be removed.

[0267] refer to Figure 45 The first conductor group TG1 and the second conductor group TG2 can be bent in the plan view so that the first contact electrode 1801a and the second contact electrode 1801b partially overlap. In this case, the width of the electrode array can be narrowed by the overlap width. However, this embodiment is not limited to this. In the plan view, the first conductor group TG1 and the second conductor group TG2 may not overlap with the first contact electrode 1801a and the second contact electrode 1801b.

[0268] refer to Figure 46a In the cross-section of only the portion where the first electrode structure EG1 is provided, the first contact electrode 1801a is provided on one side of the first insulating layer 1540a, and the first connecting wire 1704a is bent. Therefore, the first wire group TG1 can be provided on the other side of the first insulating layer 1540a.

[0269] refer to Figure 46bIn the cross-section of the stacked portion of the first electrode structure EG1 and the second electrode structure EG2, the second contact electrode 1801b is disposed on one side S1 of the second insulating layer 1540b, and the second connecting wire 1704b is bent so that the second wire group TG2 can be disposed on the other side of the second insulating layer 1540b. The thickness T2 of the stacked region can be greater than the thickness T1 of the first electrode structure EG1.

[0270] In this configuration, the first insulating layer 1540a can be stacked on the second insulating layer 1540b, and the first conductor group TG1 can be disposed on the other side S2 of the first insulating layer 1540a. In this configuration, the interface EB2 between the first insulating layer 1540a and the second insulating layer 1540b can form an unobserved insulating layer.

[0271] According to an embodiment, the first conductor group TG1 and the second conductor group TG2 can be disposed on different planes. For example, the second conductor group TG2 can be disposed on the interface EB2 between the insulating layers, and the first conductor group TG1 can be disposed on the upper surface of the insulating layer. That is, along the thickness direction, the second conductor group TG2 can be disposed in the region between the second contact electrode 1801b and the first conductor group TG1.

[0272] With this construction, the wires can be arranged on different planes, thereby reducing the width and / or thickness of the electrode array.

[0273] When manufactured with the same structure as in this embodiment, since fewer wires are arranged within the same width, the thickness of each wire, as well as the spacing and pitch between the wires, can be increased. Therefore, as the thickness of each wire increases, mechanical stability can be improved, and as the spacing between each wire increases, the possibility of short circuits between the wires can be reduced.

[0274] Although the specification describes it as a structure in which the first and second electrode structures are stacked, there is no particular limitation on the number of stacked electrode structures. The number of stacked electrode structures can be adjusted appropriately to facilitate wire design.

[0275] Figure 47 This is a view showing the electrode array according to the sixth embodiment. Figure 48a It is along Figure 47 A cross-sectional view taken along the HH direction. Figure 48b It is along Figure 47 A cross-sectional view taken in direction II.

[0276] refer to Figure 47 and 48aIn the electrode array 1000, the first contact electrode 1801a can form channels 1 to 16, and the second contact electrode 1801b can form channels 17 to 32. However, the number of contact electrodes can be adjusted as needed. The first contact electrode 1801a can be exposed to the outside through the electrode hole 1310 formed in the housing 1110.

[0277] refer to Figure 48b The second contact electrode 1801b can be exposed through the electrode hole 1310 formed in the housing 1110. In this case, in the cross-section of the area where the second contact electrode 1801b is disposed, the second wire group TG2 can be disposed in the area between the second contact electrode 1801b and the first wire group TG1. In this case, the cross-section of the first contact electrode 1801a and the first connecting wire 1704a may not be observable.

[0278] A first insulating region ILD1 can be formed between the second contact electrode 1801b and the second conductor group TG2, and a second insulating region ILD2 can be formed between the second conductor group TG2 and the first conductor group TG1. In this case, the thickness of the first insulating region ILD1 can be greater than the thickness of the second insulating region ILD2. Furthermore, the vertical distance d1 between the second contact electrode 1801b and the second conductor group TG2 can be greater than the vertical distance d2 between the second conductor group TG2 and the first conductor group TG1.

[0279] This is because the first insulating region ILD1 is formed by folding the second insulating layer on the second contact electrode 1801b and the second insulating layer on the second conductor group TG2, and the second insulating region ILD2 has the thickness of the first insulating layer formed on the first conductor group TG1.

[0280] However, this embodiment is not limited to this. The thicknesses of the first insulating region ILD1 and the second insulating region ILD2 may become the same, or the thickness of the second insulating region ILD2 may be increased by forming an additional insulating layer for bonding between the insulating layers.

[0281] Furthermore, although not shown, the electrode array may include a first pad portion electrically connected to the first conductor group TG1 and a second pad portion electrically connected to the second conductor group TG2 at its ends. The first and second pad portions may be disposed on the same plane to facilitate electrical connection with the circuit. Here, "on the same plane" may mean disposed at the same height from the reference plane. However, this embodiment is not limited to this; the first and second pad portions may be disposed on different planes.

[0282] The foregoing description primarily focuses on embodiments, but these are merely examples and do not limit the invention. Those skilled in the art will understand that various modifications and applications not illustrated above can be made without departing from the fundamental characteristics of these embodiments. For instance, each component specifically shown in this embodiment can be implemented through modification. Furthermore, differences related to these modifications and applications should be understood to be included within the scope of the invention as defined in the appended claims.

Claims

1. An electrode array comprising: a housing; a plurality of first contact electrodes exposed to an outside of the housing; a plurality of second contact electrodes exposed to the outside of the housing; a first lead group disposed within the housing and electrically connected to the first contact electrodes; and a second lead group disposed within the housing and electrically connected to the second contact electrodes, wherein the plurality of first contact electrodes and the first lead group are disposed on different planes within the housing, wherein the plurality of first contact electrodes and the plurality of second contact electrodes are disposed on the same plane, and wherein a plurality of first connection leads electrically connect the first lead group and the plurality of first contact electrodes, and a plurality of second connection leads electrically connect the second lead group and the plurality of second contact electrodes, wherein the plurality of first connection leads are bent to electrically connect the first lead group and the plurality of first contact electrodes, the plurality of second connection leads are bent to electrically connect the second lead group and the plurality of second contact electrodes, and wherein a vertical distance between the second contact electrodes and the second lead group is greater than a vertical distance between the second lead group and the first lead group. the second lead group is disposed in a region between the second contact electrodes and the first lead group.

2. The electrode array of claim 1, wherein, a distance between the first contact electrodes and the first lead group is greater than a distance between the second contact electrodes and the second lead group.

3. The electrode array of claim 1, wherein, further comprising:

4. The electrode array of claim 1, wherein, a first insulating region between the second contact electrodes and the second lead group; and a second insulating region between the second lead group and the first lead group. a thickness of the first insulating region is greater than a thickness of the second insulating region. further comprising:

5. The electrode array of claim 4, wherein, a first pad portion electrically connected to the first lead group; and a second pad portion electrically connected to the second lead group, 6. The electrode array of claim 1, wherein, wherein the first pad portion and the second pad portion are disposed on the same plane. 7.A body implantable device comprising: a first unit including a transmitter; and a second unit capable of communicating with the first unit, wherein the second unit includes: a circuit for generating a stimulation signal by processing an electrical signal; and an electrode array including a plurality of power sources to which a current signal is applied in response to the stimulation signal, wherein the electrode array comprises: a housing; a plurality of first contact electrodes exposed to an outside of the housing; a plurality of second contact electrodes exposed to the outside of the housing; a first lead group disposed within the housing and electrically connected to the first contact electrodes; and a second lead group disposed within the housing and electrically connected to the second contact electrodes, wherein the plurality of first contact electrodes and the first lead group are disposed on different planes within the housing, wherein the plurality of first contact electrodes and the plurality of second contact electrodes are disposed on the same plane, and wherein a plurality of first connection leads electrically connect the first lead group and the plurality of first contact electrodes, and a plurality of second connection leads electrically connect the second lead group and the plurality of second contact electrodes, wherein the plurality of first connection leads are bent to electrically connect the first lead group and the plurality of first contact electrodes, the plurality of second connection leads are bent to electrically connect the second lead group and the plurality of second contact electrodes, and wherein a vertical distance between the second contact electrodes and the second lead group is greater than a vertical distance between the second lead group and the first lead group. wherein a plurality of first connecting wires electrically connect the first wire group and the plurality of first contact electrodes; and a plurality of second connecting wires electrically connect the second wire group and the plurality of second contact electrodes, wherein the plurality of first connecting wires are bent to electrically connect the first wire group and the plurality of first contact electrodes, the plurality of second connecting wires are bent to electrically connect the second wire group and the plurality of second contact electrodes, and wherein a vertical distance between the second contact electrodes and the second wire group is greater than a vertical distance between the second wire group and the first wire group.

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