Substrate fixing device

Abstract

The present disclosure provides a substrate fixing device for fixing and adsorbing a large-sized square substrate. The substrate fixing device includes a chuck mechanism and a rotating mechanism. The chuck mechanism has a first surface and a second surface disposed opposite to the first surface. The chuck mechanism includes a plurality of vacuum suction cups, a plurality of clamping mechanisms disposed on the first surface and defining a rectangular edge region, and the plurality of vacuum suction cups and the plurality of clamping mechanisms are disposed within the rectangular edge region. The rotating mechanism is connected to the second surface of the chuck mechanism to drive the chuck mechanism to rotate. The periphery of the large-sized square substrate is correspondingly disposed within the rectangular edge region of the chuck mechanism, so that the plurality of vacuum suction cups can adsorb on the surface of the large-sized square substrate, and the plurality of clamping mechanisms can clamp the periphery of the large-sized square substrate.

Description

Technical Field

[0001] The present disclosure relates to a fixing device, and particularly to a substrate fixing device applied to fan-out wafer-level packaging.

Background Art

[0002] Fan-out Panel Level Package (FOPLP) is a breakthrough technology extended from Fan-out Wafer Level Package (FOWLP). Fan-out Panel Level Package is a packaging technology derived under the requirement of multi-die integration and further consideration of reducing production costs.

[0003] Fan-out Panel Level Package (FOPLP) can improve production efficiency by using a larger area square substrate. Since the production cost has the opportunity to be more competitive than Fan-out Wafer Level Package (FOWLP), it has attracted great attention in the market. In order to increase production capacity, in recent years, the above-mentioned square substrate has shown a trend towards large size. For example, the area size of the currently used square substrate has reached 600mm x 600mm.

[0004] However, when using a single-wafer rotating device to clean and etch a large-size square substrate, due to the large amount of warpage deformation of the large-size square substrate (the maximum thickness deformation reaches ±12mm), it is very difficult to establish vacuum fixation using a general vacuum chuck mechanism, so that the large-size square substrate is prone to lateral slippage under high-speed rotation.

[0005] In view of this, how to provide a substrate fixing device that can adsorb the warpage deformation amount of a large-size square substrate in a vacuum manner and prevent lateral slippage of the large-size square substrate under high-speed rotation is an urgent problem to be solved in this industry.

Summary of the Invention

[0006] An object of the present disclosure is to provide a substrate fixing device, which has a plurality of vacuum suction cups that can adsorb the warpage deformation amount of a large-size square substrate in a vacuum manner, and a clamping mechanism that can effectively clamp the sides (periphery) of the large-size square substrate, thereby preventing the large-size square substrate from lateral slippage that may occur under high-speed rotation during the single-wafer wet rotating etching or cleaning process.

[0007] To achieve the above object, a substrate fixing device of the present disclosure is suitable for fixing and adsorbing a large-size square substrate, and the substrate fixing device includes:

[0008] The chuck mechanism has a first surface and a second surface disposed opposite to the first surface. The chuck mechanism includes a plurality of vacuum suction cups, a plurality of clamping mechanisms disposed on the first surface and defining a rectangular edge region, and both the plurality of vacuum suction cups and the plurality of clamping mechanisms are disposed within the rectangular edge region; and

[0009] A rotating mechanism is connected to the lower side of the second surface of the chuck mechanism to drive the chuck mechanism to rotate;

[0010] Wherein, the periphery of the large-size square substrate is correspondingly disposed within the rectangular edge region of the chuck mechanism, so that the plurality of vacuum suction cups can adsorb on the surface of the large-size square substrate, and the plurality of clamping mechanisms can clamp on the periphery of the large-size square substrate.

[0011] In the substrate fixing device of the present disclosure, the plurality of vacuum suction cups are communicated with a vacuum pumping system, so that when the plurality of vacuum suction cups contact the surface of the large-size square substrate, the vacuum pumping system can perform a vacuum pumping operation.

[0012] In the substrate fixing device of the present disclosure, the chuck mechanism further includes a plurality of water baffle plates. The plurality of water baffle plates respectively correspond to the plurality of vacuum suction cups and are disposed on the outer rings of the plurality of vacuum suction cups.

[0013] In the substrate fixing device of the present disclosure, when the plurality of vacuum suction cups are four vacuum suction cups, the four vacuum suction cups are respectively used to adsorb at the four corners of the large-size square substrate.

[0014] In the substrate fixing device of the present disclosure, when the plurality of clamping mechanisms are four clamping mechanisms, the four clamping mechanisms are respectively used to clamp on the four sides of the large-size square substrate.

[0015] In the substrate fixing device of the present disclosure, when the plurality of vacuum suction cups are eight vacuum suction cups, the eight vacuum suction cups are respectively used to adsorb at the four corners and four sides of the large-size square substrate.

[0016] In the substrate fixing device of the present disclosure, when the plurality of clamping mechanisms are eight clamping mechanisms, each clamping mechanism is respectively disposed between two adjacent vacuum suction cups to clamp on the four sides of the large-size square substrate.

[0017] In the substrate fixing device of the present disclosure, the eight vacuum suction cups are vacuum suction cups that extend radially outward in an eight-claw shape from the center of the chuck mechanism.

[0018] In the substrate fixing device of the present disclosure, the plurality of vacuum suction cups are vacuum suction cups having elastic deformation characteristics.

[0019] In the substrate fixing device of the present disclosure, the vacuum value when each vacuum suction cup adsorbs on the surface of the large-size square substrate can be detected and controlled by the main control area.

[0020] To make the above content of the present disclosure more obvious and understandable, the following specifically provides preferred embodiments and, in conjunction with the accompanying drawings, makes a detailed description as follows.

Description of the Drawings

[0021] Figure 1 It is a perspective view of the substrate fixing device of the present disclosure.

[0022] Figure 2 It is a top view of the substrate fixing device of the present disclosure.

[0023] Figure 3 It is a perspective view of the chuck mechanism and the vacuum pumping system of the substrate fixing device of the present disclosure.

[0024] Figure 4 It is a perspective view of the vacuum chuck and the water baffle of the substrate fixing device of the present disclosure.

[0025] Figure 5 It is a perspective view of the clamping mechanism of the substrate fixing device of the present disclosure.

Detailed Embodiment

[0026] In order to make the above and other objects, features, and advantages of the present disclosure more obvious and understandable, the following will specifically provide preferred embodiments of the present disclosure and, in conjunction with the accompanying drawings, make a detailed description as follows. Furthermore, the directional terms mentioned in the present disclosure, such as up, down, top, bottom, front, back, left, right, inside, outside, side layer, surrounding, center, horizontal, lateral, vertical, longitudinal, axial, radial, the uppermost layer or the lowermost layer, etc., are only references to the directions in the attached drawings. Therefore, the directional terms used are for explaining and understanding the present disclosure, rather than for limiting the present disclosure.

[0027] In the figures, units with similar structures are denoted by the same reference numerals.

[0028] The present disclosure relates to a substrate fixing device that can adsorb the warpage deformation of a large-sized square substrate in a vacuum manner, preventing the large-sized square substrate from experiencing lateral slippage that may occur under high-speed rotation during a single-wafer wet rotary etching or cleaning process.

[0029] Please refer to Figure 1 、 2 simultaneously. A substrate fixing device 100 of the present disclosure is suitable for fixing and adsorbing a large-sized square substrate 500. Among them, the substrate fixing device 100 includes a chuck mechanism 200 and a rotating mechanism 300.

[0030] As Figure 1 shown, the chuck mechanism 200 has a first surface 210 and a second surface 220 disposed opposite to the first surface 210. The chuck mechanism 200 includes a plurality of vacuum chucks 212 and a plurality of clamping mechanisms 214 disposed on the first surface 210 and defines a rectangular edge region 216 (asFigure 2 the diagonal area shown), and the plurality of vacuum suction cups 212 and the plurality of clamping mechanisms 214 are both disposed within the rectangular edge area 216. The rotating mechanism 300 is connected to the lower side of the second surface 220 of the chuck mechanism 200 to drive the chuck mechanism 200 to rotate.

[0031] When the large-sized square substrate 500 is placed on the chuck mechanism 200, the peripheral edge 510 of the large-sized square substrate 500 is correspondingly disposed within the rectangular edge area 216 of the chuck mechanism 200, so that the plurality of vacuum suction cups 212 can adsorb on the surface of the large-sized square substrate 500, and the plurality of clamping mechanisms 214 can clamp the peripheral edge 510 of the large-sized square substrate 500.

[0032] As Figure 3 shown, the plurality of vacuum suction cups 212 of the chuck mechanism 200 are adapted to communicate with the vacuum pumping system 400 disposed below. When the plurality of vacuum suction cups 212 contact the surface of the large-sized square substrate 500, the vacuum pumping system 400 can perform a vacuum pumping operation.

[0033] Please refer to Figure 4 , the chuck mechanism 200 of the substrate fixing device 100 of the present disclosure further includes a plurality of water baffle plates 218. The plurality of water baffle plates 218 respectively correspond to the plurality of vacuum suction cups 212 and are disposed on the outer rings of the plurality of vacuum suction cups 212. In this way, when performing a cleaning and etching operation on the large-sized square substrate 500 at a high speed rotation, the chemical liquid sprayed onto the large-sized square substrate 500 will be guided into the plurality of water baffle plates 218 due to the arrangement of the plurality of water baffle plates 218, effectively preventing the sprayed chemical liquid from penetrating into the plurality of vacuum suction cups 212, and further affecting the vacuum adsorption function of the plurality of vacuum suction cups 212.

[0034] As Figure 5 shown, in a preferred embodiment of the present disclosure, the clamping mechanism 214 of the chuck mechanism 200 is a clamping mechanism in a beak shape. As shown in the figure, the clamping mechanism 214 has a first end 214a and a second end 214b disposed opposite to the first end 214a. The first end 214a is disposed toward the center of the chuck mechanism 200, the second end 214b is disposed away from the center of the chuck mechanism 200, and the weight of the second end 214b is greater than the weight of the first end 214a.

[0035] The clamping mechanism 214 is pivotally connected to the base 232 by a rotating shaft 230 disposed between the first end 214a and the second end 214b. When the large-sized square substrate 500 is placed on the chuck mechanism 200 and has not yet rotated, due to the greater weight of the second end 214b of the clamping mechanism 214, the second end 214b will droop with the rotating shaft 230 as the fulcrum, thereby driving the first end 214a to lift. Therefore, at this time, the clamping mechanism 214 does not clamp or fix the large-sized square substrate 500 (i.e., the clamping mechanism 214 is in a loose state at this time). That is, when the chuck mechanism 200 has not rotated, the large-sized square substrate 500 is only subjected to the vacuum adsorption force of the vacuum chuck 212.

[0036] Next, when the rotating mechanism 300 drives the chuck mechanism 200 to rotate, the second end 214b with a greater weight will be lifted with the rotating shaft 230 as the fulcrum due to the centrifugal force generated by the rotation, thereby driving the first end 214a to press down (in the direction of the arrow shown in the figure), and clamping and fixing the large-sized square substrate 500 by the mechanical contact force generated when the first end 214a presses down (i.e., the clamping mechanism 214 is in a clamping state at this time). In this way, since the large-sized square substrate 500 is simultaneously subjected to the vacuum adsorption of the vacuum chuck 212 and the clamping of the clamping mechanism 214 during high-speed rotation, the large-sized square substrate 500 can be effectively prevented from laterally slipping off. In addition, even if the large-sized square substrate 500 in a rotating state slightly slips off due to insufficient vacuum adsorption force of the vacuum chuck 212, the situation where the large-sized square substrate 500 flies off the chuck mechanism 200 and is damaged can be eliminated due to the clamping and fixing of the clamping mechanism 214.

[0037] Please refer to again Figure 1 and Figure 2 , in a preferred embodiment of the substrate fixing device 100 of the present disclosure, when the number of the plurality of vacuum chucks 212 is eight vacuum chucks 212, the eight vacuum chucks 212 can respectively and correspondingly adsorb to the four corners and four sides of the large-sized square substrate 500.

[0038] At the same time, the number of the plurality of clamping mechanisms 214 can correspondingly be eight clamping mechanisms 214, and each clamping mechanism 214 is respectively disposed between two adjacent vacuum chucks 212 to clamp the four sides of the large-sized square substrate 500. In other words, in the illustrated embodiment, two clamping mechanisms 214 are provided on each side of the large-sized square substrate 500 to ensure the stability during the clamping operation of the large-sized square substrate 500.

[0039] Preferably, Figure 1 and Figure 2The eight vacuum suction cups 212 of the illustrated embodiment are vacuum suction cups 212 that extend radially outward in an octopus-like shape from the center of the self-clamping chuck mechanism 200. In addition, a vacuum suction cup 212a can be selectively provided at the center of the chuck mechanism 200 to enhance the vacuum adsorption force on the large-sized square substrate 500.

[0040] It should be noted that those with ordinary knowledge in the art can also adjust the number of the plurality of vacuum suction cups and the plurality of clamping mechanisms, so as to complete the setting of the plurality of vacuum suction cups and the plurality of clamping mechanisms in a more economical way.

[0041] For example, in other aspects, the number of the plurality of vacuum suction cups 212 can be four vacuum suction cups 212, and the number of the plurality of clamping mechanisms 214 can be four clamping mechanisms 214. When the four vacuum suction cups 212 are respectively used to adsorb on the four corners of the large-sized square substrate 500, the four clamping mechanisms 214 can be respectively used to clamp the middle regions of the four sides of the large-sized square substrate 500, so as to complete the vacuum adsorption and clamping fixation operations on the large-sized square substrate 500 under the condition of symmetric arrangement.

[0042] Moreover, the plurality of vacuum suction cups 212 of the chuck mechanism 200 are vacuum suction cups with elastic deformation characteristics and corrosion resistance. Therefore, the elastic fault tolerance of the vacuum suction cups 212 will be sufficient to cope with the thickness deformation of up to ±12 mm of the large-sized square substrate 500, effectively ensuring the vacuum adsorption effect of the vacuum suction cups 212 on the large-sized square substrate 500. In addition, the vacuum value when each vacuum suction cup 212 adsorbs on the surface of the large-sized square substrate 500 can be detected and controlled by the main control area, so as to ensure the force of its vacuum adsorption.

[0043] In summary, the substrate fixing device 100 of the present disclosure can, through the setting of the plurality of vacuum suction cups 212, utilize the elastic deformation characteristics of the vacuum suction cups 212 to absorb the warpage deformation amount of the large-sized square substrate 500, so that the large-sized square substrate 500 can be fixed on the chuck mechanism 200 by the vacuum adsorption force of the plurality of vacuum suction cups 212. In addition, through the setting of the clamping mechanism 214, the operation of clamping and fixing the large-sized square substrate 500 during high-speed rotation can be further carried out, so as to effectively prevent the large-sized square substrate 500 from being broken due to possible lateral slippage during high-speed rotation during the single-wafer wet rotary etching or cleaning process.

[0044] The above is only the preferred embodiment of the present disclosure. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present disclosure, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present disclosure.

Claims

1. A substrate fixing device for fixing and adsorbing a large-sized square substrate, the substrate fixing device comprising: A chuck mechanism having a first surface and a second surface disposed opposite to the first surface. The chuck mechanism includes a plurality of vacuum suction cups, a plurality of clamping mechanisms disposed on the first surface and defining a rectangular edge region, and a plurality of water baffle plates. The plurality of water baffle plates respectively correspond to the plurality of vacuum suction cups and are disposed on the outer rings of the plurality of vacuum suction cups to guide the chemical liquid sprayed onto the large-sized square substrate to flow into the plurality of water baffle plates. And the plurality of vacuum suction cups and the plurality of clamping mechanisms are all disposed within the rectangular edge region, wherein the rectangular edge region defines two diagonals, and the plurality of vacuum suction cups are at least disposed at both ends of each of the diagonals of the rectangular edge region; and A rotating mechanism connected to the lower side of the second surface of the chuck mechanism to drive the chuck mechanism to rotate; Among them, The periphery of the large-sized square substrate is correspondingly disposed within the rectangular edge region of the chuck mechanism, so that the plurality of vacuum suction cups adsorb at least at the four corners of the surface of the large-sized square substrate, and the plurality of clamping mechanisms can clamp the periphery of the large-sized square substrate.

2. The substrate fixing device according to claim 1, wherein The plurality of vacuum suction cups are communicated with a vacuum pumping system. When the plurality of vacuum suction cups contact the surface of the large-sized square substrate, the vacuum pumping system performs a vacuum pumping operation.

3. The substrate fixing device according to claim 1, wherein, When the plurality of clamping mechanisms are four clamping mechanisms, the four clamping mechanisms respectively clamp the four sides of the large-sized square substrate.

4. The substrate fixing device according to claim 1, characterized in that, When the plurality of vacuum suction cups are eight vacuum suction cups, the eight vacuum suction cups respectively adsorb at the four corners and the four sides of the large-sized square substrate.

5. The substrate fixing device according to claim 4, characterized in that, When the plurality of clamping mechanisms are eight clamping mechanisms, each of the clamping mechanisms is respectively disposed between two adjacent vacuum suction cups to clamp the four sides of the large-sized square substrate.

6. The substrate fixing device according to claim 5, wherein, The eight vacuum suction cups are vacuum suction cups extending radially outward in an octopus-like shape from the center of the chuck mechanism.

7. The substrate fixing device according to claim 1, characterized in that, The plurality of vacuum suction cups are vacuum suction cups having elastic deformation characteristics.

8. The substrate fixing device according to claim 1, wherein, The vacuum value when each of the vacuum suction cups adsorbs on the surface of the large-sized square substrate can be detected and controlled by the main control area.

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