Heat dissipation structure of phased array antenna, phased array antenna and satellite platform

Abstract

The present invention relates to the field of aerospace thermal control technology, and in particular to a heat dissipation structure of a phased array antenna, a phased array antenna and a satellite platform. The heat dissipation structure of the phased array antenna is used to dissipate heat for the phased array antenna of the satellite platform. The satellite platform includes a satellite cabin board. The heat dissipation structure of the phased array antenna includes a first heat pipe, a flat heat pipe and a second heat pipe. The first heat pipe is buried in the satellite cabin board. The flat heat pipe is arranged on the inner surface of the satellite cabin board to support the antenna assembly of the phased array antenna. A first protrusion is arranged on the flat heat pipe. The first protrusion is located in the satellite cabin board and the outer side surface of the first protrusion and the part of the flat heat pipe located outside the first protrusion are in contact with the first heat pipe. The second heat pipe is arranged on the inner surface of the satellite cabin board. The heat dissipation structure of the phased array antenna in the present invention occupies a small space, solves the heat dissipation problem of the antenna assembly, shortens the heat dissipation path, improves the heat dissipation efficiency, and ensures the normal operation of the phased array antenna on the satellite platform.

Description

Technical Field

[0001] The present invention relates to the field of aerospace thermal control technology, and in particular to a heat dissipation structure of a phased array antenna, a phased array antenna and a satellite platform. Background Art

[0002] At present, the application fields of phased array antennas for communication functions mainly include space-borne phased array antennas and ground-based phased array antennas. Due to the particularity and complexity of the space-borne environment, the phased array antennas used on satellite platforms cannot be cooled by air cooling or water cooling, but can only be cooled by radiation and heat conduction. Moreover, the heat dissipation methods of radiation and heat conduction cannot provide a heat dissipation surface with a constant temperature for the phased array antenna. The existing phased array antennas used in space-borne environments have high heat flux density and poor heat dissipation capacity. Summary of the invention

[0003] The object of the present invention is to provide a heat dissipation structure of a phased array antenna, which occupies a small space, can shorten the heat dissipation path, improve the heat dissipation efficiency, and ensure that the phased array antenna can operate normally for a long time on a satellite platform.

[0004] In order to achieve the above objectives, the following technical solutions are provided:

[0005] A heat dissipation structure of a phased array antenna is used to dissipate heat for a phased array antenna of a satellite platform, wherein the satellite platform includes a satellite cabin panel, including:

[0006] A first heat pipe, buried in the satellite cabin panel;

[0007] A flat heat pipe is arranged on the inner surface of the satellite cabin panel, and a first protrusion for mounting an antenna assembly is arranged on the flat heat pipe, the first protrusion is located inside the satellite cabin panel, and an outer side surface of the first protrusion and the flat heat pipe located outside the first protrusion are both in contact with the first heat pipe;

[0008] A second heat pipe is disposed on the inner surface of the satellite cabin panel.

[0009] Further, a projection of the second heat pipe on the satellite cabin panel and a projection of the first heat pipe on the satellite cabin panel are arranged crosswise.

[0010] Further, a plurality of the first heat pipes and a plurality of the second heat pipes are respectively provided, and the plurality of the first heat pipes are arranged at intervals along the axial direction of the second heat pipe, and the plurality of the second heat pipes are arranged at intervals along the axial direction of the first heat pipe.

[0011] Furthermore, a first thermally conductive insulating pad is sandwiched between the flat heat pipe and the first heat pipe.

[0012] Furthermore, a second protrusion is provided on the surface of the flat heat pipe facing away from the first protrusion, and the second protrusion is used to connect some components of the antenna assembly.

[0013] Furthermore, a plurality of the second protrusions are provided, and the plurality of the second protrusions are arranged on the flat heat pipe at intervals.

[0014] Furthermore, a second thermally conductive insulating pad is provided on the second protrusion.

[0015] Furthermore, it also includes a thermal control coating, which is arranged on the surface of the satellite cabin panel.

[0016] Furthermore, a phased array antenna is provided, comprising the heat dissipation structure of the phased array antenna as described in any one of the above items, wherein the antenna assembly comprises:

[0017] a first antenna module, the first antenna module comprising an antenna transmitting unit and an electronic component, the electronic component being disposed on the first protrusion, the antenna transmitting unit being disposed on the electronic component and extending out of an outer surface of the satellite cabin panel;

[0018] The second antenna module is disposed on a surface of the flat heat pipe that is away from the first protrusion.

[0019] Furthermore, the electronic component includes a multi-layer circuit board, an AOP module and an antenna carrier, the multi-layer circuit board is arranged on the first protrusion, the AOP module is arranged on the multi-layer circuit board, the antenna carrier is arranged on the AOP module, and the antenna transmitting unit is arranged on the antenna carrier.

[0020] Furthermore, the second antenna module includes a wave control board and a first chip component and a second chip component arranged on the wave control board, the first chip component is clamped between the flat heat pipe and the wave control board, and the second chip component is arranged on the surface of the wave control board away from the flat heat pipe.

[0021] Furthermore, the first chip assembly includes an AI chip, a power chip and a refresh chip, and the AI ​​chip, the power chip and the refresh chip are arranged on the flat heat pipe at intervals.

[0022] Furthermore, the second chip assembly includes a plurality of heat generating chips, and the plurality of heat generating chips are arranged on the wave control board at intervals.

[0023] Furthermore, a satellite platform is provided, comprising a phased array antenna as described in any of the above items, wherein a mounting hole is opened on the satellite cabin panel, part of the first heat pipe is located in the mounting hole and abuts against the flat heat pipe, the first protrusion and the electronic component are accommodated in the mounting hole, and the antenna transmitting unit extends out from the outer surface of the satellite cabin panel.

[0024] Furthermore, it also includes a shell arranged opposite to the mounting hole, the shell is respectively connected to the satellite cabin panel and the flat heat pipe, and the second antenna module is accommodated in the shell.

[0025] The beneficial effects of the present invention are:

[0026] The heat dissipation structure of the phased array antenna provided in the present invention supports the antenna assembly through a flat heat pipe arranged on the inner surface of the satellite cabin board, wherein the first protrusion on the flat heat pipe extends into the satellite cabin board so that the outer side of the first protrusion and the flat heat pipe located outside the first protrusion can be close to the first heat pipe pre-buried in the satellite cabin board, and the flat heat pipe cooperates with the first heat pipe to accelerate heat dissipation, reduce conduction thermal resistance and contact thermal resistance, shorten the heat dissipation path, and quickly conduct the heat generated by the antenna assembly when working to the satellite cabin board. At the same time, by setting a second heat pipe, the satellite cabin board is further cooled and the heat is dissipated to the cold space, which is conducive to reducing the temperature difference between the antenna assembly and the satellite cabin board, improving the heat dissipation quality of the heat dissipation structure of the phased array antenna to the antenna assembly, and ensuring the normal operation of the antenna assembly.

[0027] The phased array antenna provided in the present invention installs the first antenna module of the antenna assembly on the first protrusion, and arranges the second antenna module on the surface of the flat heat pipe away from the first protrusion, reasonably distributes the positions of antenna components with different high heat, and optimizes the heat dissipation path, so that the heat generated by the first antenna module with higher heat consumption during operation can be more quickly conducted to the cabin board and dissipated, thereby ensuring the normal operation of the antenna transmitting unit.

[0028] The satellite platform provided in the present invention opens a mounting hole on the satellite cabin panel, thereby realizing the abutment of the first heat pipe buried in the satellite cabin panel with the flat-plate heat pipe supporting the antenna assembly, thereby reducing the space required for installing the first heat pipe, the flat-plate heat pipe and the antenna assembly in the direction perpendicular to the satellite cabin panel, and reducing the overall envelope size of the satellite. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0030] Figure 1 A schematic diagram of a phased array antenna provided in an embodiment of the present invention applied to a satellite platform Figure 1 ;

[0031] Figure 2 for Figure 1 The enlarged view of point A in the middle;

[0032] Figure 3 A schematic diagram of the structure of a first heat pipe and a flat heat pipe of a heat dissipation structure of a phased array antenna provided in an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of the structure of a phased array antenna provided in an embodiment of the present invention;

[0034] Figure 5 A schematic diagram of a phased array antenna provided in an embodiment of the present invention applied to a satellite platform Figure 2 ;

[0035] Figure 6 A schematic structural diagram of a phased array antenna and a housing of a satellite platform provided in an embodiment of the present invention;

[0036] Figure 7 A schematic structural diagram of a satellite cabin panel of a satellite platform provided by an embodiment of the present invention;

[0037] Figure 8 A schematic diagram of a phased array antenna provided in an embodiment of the present invention applied to a satellite platform Figure 3 .

[0038] In the figure:

[0039] 100-satellite cabin board; 101-mounting hole; 102-housing; 1021-bottom plate; 1022-frame;

[0040] 200-antenna assembly; 201-antenna transmitting unit; 202-electronic assembly; 2021-multilayer circuit board; 2022-AOP module; 2023-antenna carrier board; 203-wave control board; 204-first chip assembly; 2041-AI chip; 2042-power chip; 2043-refresh chip; 205-second chip assembly;

[0041] 1- first heat pipe;

[0042] 2-flat heat pipe; 21-first protrusion; 22-first thermally conductive insulating pad; 23-second protrusion; 231-second thermally conductive insulating pad;

[0043] 3- Second heat pipe. DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the technical solution of the present invention, the technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0045] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product is usually placed when in use, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, or to distinguish different structures or components, and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0048] See also Figures 1 to 4 This embodiment provides a heat dissipation structure of a phased array antenna, which is used to dissipate heat for the phased array antenna of a satellite platform. The satellite platform includes a satellite cabin panel 100, and the heat dissipation structure of the phased array antenna includes a first heat pipe 1, a flat heat pipe 2 and a second heat pipe 3. Optionally, a mounting hole 101 is provided through the satellite cabin panel 100; the first heat pipe 1 is buried in the satellite cabin panel 100, and part of the first heat pipe 1 is accommodated in the mounting hole 101; the flat plate heat pipe 2 is provided on the inner surface of the satellite cabin panel 100, for installing and supporting the antenna assembly 200. Furthermore, a first protrusion 21 for supporting the antenna assembly 200 is provided on the flat plate 2, and the first protrusion 21 is located in the mounting hole 101 opened on the satellite cabin panel 100, and the outer side surface of the first protrusion 21 and the flat plate heat pipe 2 located outside the first protrusion 21 can both be abutted against the first heat pipe 1 accommodated in the mounting hole 101; the second heat pipe 3 is provided on the inner surface of the satellite cabin panel 100. Flat plate heat pipe 2 first heat pipe 1 Flat plate heat pipe 2 first heat pipe 1

[0049] The heat dissipation structure of the phased array antenna in this embodiment supports the antenna assembly 200 through the flat heat pipe 2 arranged on the inner surface of the satellite cabin board 100, wherein the first protrusion 21 on the flat heat pipe 2 extends into the mounting hole 101 in the satellite cabin board 100 so that the outer side of the first protrusion 21 and the flat heat pipe 2 located outside the first protrusion 21 can be close to the first heat pipe 1 pre-buried in the satellite cabin board 100, which is conducive to reducing thermal resistance. The above-mentioned structural setting uses the flat heat pipe 2 and the first heat pipe 1 to accelerate heat dissipation, reduce conduction thermal resistance and contact thermal resistance, shorten the heat dissipation path, and make the heat generated by the antenna assembly 200 when working quickly transferred to the satellite cabin board 100 for heat dissipation. At the same time, by setting the second heat pipe 3, the satellite cabin board 100 is further cooled and the heat is dissipated to the cold space, which is conducive to reducing the temperature difference between the antenna assembly 200 and the satellite cabin board 100 of the phased array antenna, improving the heat dissipation quality of the heat dissipation structure of the phased array antenna to the antenna assembly 200, and ensuring the normal operation of the antenna assembly 200.

[0050] Optionally, the projection of the second heat pipe 3 on the satellite cabin panel 100 is arranged crosswise with the projection of the first heat pipe 1 on the satellite cabin panel 100. The second heat pipe 3 arranged on the satellite cabin panel 1 cooperates with the position of the first heat pipe 1, which is conducive to dissipating the heat collected by the satellite cabin panel 100 to the surrounding cold space, thereby improving the heat dissipation efficiency of the satellite cabin panel 100.

[0051] See also Figure 1 and Figure 8 A plurality of first heat pipes 1 and a plurality of second heat pipes 3 are respectively arranged, and the plurality of first heat pipes 1 are arranged at intervals along the axial direction of the second heat pipe 3, and the plurality of second heat pipes 3 are arranged at intervals along the axial direction of the first heat pipe 1, so that the plurality of first heat pipes 1 and the plurality of second heat pipes 3 cooperate to form an orthogonal heat pipe network on the satellite cabin panel 100, thereby improving the temperature uniformity of the entire satellite cabin panel 100, and further improving the heat dissipation efficiency of the heat dissipation surface on the satellite cabin panel 100.

[0052] Optionally, the heat dissipation structure of the phased array antenna in this embodiment further includes a thermal control coating, which is disposed on the surface of the satellite cabin panel 100. Specifically, the outer surface of the satellite cabin panel 100 facing away from the second heat pipe 3 is sprayed with KS-Z white paint as a heat dissipation surface to dissipate the heat accumulated on the satellite cabin panel 100 to the external space. Specifically, the initial absorption rate of the white paint is 0.14 and the emissivity is 0.92.

[0053] Optionally, the satellite cabin panel 100 is provided with E51-M black paint on the inner surface of the second heat pipe 3 to perform isothermal design.

[0054] Optionally, the inner wall of the flat heat pipe 2 in this embodiment has a vacuum cavity with a capillary structure, the cavity is evacuated and a working fluid is injected, heat is transferred based on the phase change process of the working fluid in the cavity, and three-dimensional heat conduction is realized, wherein the maximum equivalent thermal conductivity of the flat heat pipe 2 can be 2000W / m / K, the maximum equivalent thermal conductivity in the normal direction can be 100W / m / K, and the maximum heat flux density can reach 40W / cm 2 .

[0055] See also Figure 4 A first thermally conductive insulating pad 22 is sandwiched between the flat heat pipe 2 and the first heat pipe 1 . The first thermally conductive insulating pad 22 facilitates heat conduction and heat dissipation, thereby improving the heat conduction efficiency between the flat heat pipe 2 and the first heat pipe 1 .

[0056] See also Figure 2 and Figure 4 A second protrusion 23 is provided on the surface of the flat heat pipe 2 away from the first protrusion 21, that is, the first protrusion 21 and the second protrusion 23 are respectively located on both sides of the flat heat pipe 2, and the first protrusion 21 and the second protrusion 22 are used to install and support devices with different heat consumption of the antenna assembly 200. At the same time, the setting of the second protrusion 23 ensures that the device of the antenna assembly 200 arranged on the second protrusion 23 can be in contact with the flat heat pipe 2, and a certain heat dissipation gap is left between the flat heat pipe 2, thereby improving the heat dissipation effect.

[0057] See also Figure 4 , a second heat-conducting insulating pad 231 is provided on the second protrusion 23. The second heat-conducting insulating pad 231 has good viscosity, flexibility, good compression performance and excellent thermal conductivity, and can completely discharge the air between the second protrusion 23 and the components of the antenna assembly 200, so as to achieve full contact and enhance the heat transfer efficiency between the antenna assembly 200 and the second protrusion 23. Optionally, the thickness of the second heat-conducting insulating pad 231 in this embodiment is 0.3 mm, and the compression amount is designed to be 50%, that is, when the second heat-conducting insulating pad 231 is used, its thickness can be compressed to 0.15 mm to reduce the thermal resistance of the second heat-conducting insulating pad 231 itself in the thickness direction.

[0058] Alternatively, see Figure 3 and Figure 4 A plurality of second protrusions 23 are provided, and the plurality of second protrusions 23 are spaced apart on the flat heat pipe 2 so that the plurality of components of the antenna assembly 200 are spaced apart on the flat heat pipe 2 to prevent the occurrence of excessively high local temperatures and thus affect the normal operation of the antenna assembly 200.

[0059] Optionally, the first heat pipe 1 and the second heat pipe 3 are both I-shaped double-hole ammonia axial groove heat pipes, and the pipe material is aluminum alloy.

[0060] This embodiment also provides a phased array antenna, including the heat dissipation structure of the phased array antenna, wherein the antenna assembly 200 includes a first antenna module and a second antenna module respectively installed on both sides of the flat heat pipe 2. Figures 2 to 6 The first antenna module includes an antenna transmitting unit 201 and an electronic component 202. The electronic component 202 is arranged on the first protrusion 21. The antenna transmitting unit 201 is arranged on the electronic component 202 and extends out of the outer surface of the satellite cabin board 100. The second antenna module is arranged on the second protrusion 23 of the flat heat pipe 2 away from the first protrusion 21. The phased array antenna provided in this embodiment reasonably distributes the positions of antenna components with different high heat content by installing the first antenna module of the antenna assembly 200 on the first protrusion 21 and arranging the second antenna module on the second protrusion 22 of the flat heat pipe 2 away from the first protrusion 21, optimizing the heat dissipation path, so that the heat generated by the first antenna module with higher heat consumption during operation can be more quickly conducted to the cabin board and dissipated, thereby ensuring the normal operation of the antenna transmitting unit.

[0061] Alternatively, see Figure 2 and Figure 4 The electronic component 202 includes a multi-layer circuit board 2021 welded on the first protrusion 21, and an AOP module 2022 welded on the multi-layer circuit board 2021, wherein the AOP module 2022 is a packaged electronic structure carrying a chip to achieve functions such as signal transmission and processing. Further, the antenna carrier 2023 is arranged on the surface of the AOP module 2022 away from the multi-layer circuit board 2021, and the antenna transmitting unit 201 is arranged on the AOP module 2022 of the electronic component 202 through the antenna carrier 2023, and exposes the outer surface of the satellite cabin board 100. Specifically, the antenna transmitting unit 201 is welded to the antenna carrier 2023, and the surface of the antenna carrier 2023 away from the antenna transmitting unit 201 is welded on the AOP module 2022, so that the antenna transmitting unit 201 is exposed on the outer surface of the satellite cabin board 100 to achieve signal transmission and reception. In actual engineering applications, there are multiple antenna transmitting units 201 and AOP modules 2022, and each AOP module 2022 is equipped with 5 chips. The total power consumption of the AOP module 2022 can reach 2.5W, and about 85% of the heat loss of the antenna assembly 200 is concentrated on the AOP module 2022. As an electronic component with high power consumption, the AOP module 2022 in the above structural setting can conduct heat to the flat heat pipe 2 through the multi-layer circuit board 2021, and the welding of the multi-layer circuit board 2021 and the flat heat pipe 2 is also conducive to reducing the contact thermal resistance to accelerate heat dissipation.

[0062] See also Figure 2 and Figure 4The second antenna module includes a wave control board 203 and a first chip assembly 204 and a second chip assembly 205 arranged on the wave control board 203. The wave control board 203 is spaced apart from the flat heat pipe 2. The first chip assembly 204 is sandwiched between the second heat conductive insulating pad 231 and the wave control board 203. The above arrangement enables the first chip assembly 204 with relatively high heat consumption to conduct heat to the first heat pipe 1 and the satellite cabin board 100 through the heat conductive pad 331 and the flat heat pipe 2 in sequence. The second chip assembly 205 with relatively low heat consumption is arranged on the surface of the wave control board 203 away from the flat heat pipe 2. By optimizing the position arrangement of the wave control board 203, the first chip assembly 204 and the second chip assembly 205 in the second antenna module, the heat dissipation of the antenna assembly 200 is optimized, the heat dissipation path of the device with high heat consumption is reduced, and the heat dissipation efficiency is improved.

[0063] Alternatively, see Figure 4 The first chip assembly 204 includes an AI chip 2041, a power chip 2042 and a refresh chip 2043. A plurality of second protrusions 23 are provided, and the plurality of second protrusions 23 are arranged at intervals on the flat heat pipe 2, so that the AI ​​chip 2041, the power chip 2042 and the refresh chip 2043 can be correspondingly welded on a second protrusion 23, wherein the AI ​​chip 2041 is a FPGA (Field Programmable Gate Array) chip, which is a device with high heat consumption in the first chip assembly 204. By optimizing the setting position of the first chip assembly 204 on the wave control board 203, its heat dissipation path can be reduced.

[0064] Alternatively, see Figure 4 The second chip assembly 205 includes a plurality of heat-generating chips with low heat consumption, and the plurality of heat-generating chips are arranged at intervals on the wave control board 203 to facilitate heat dissipation.

[0065] Optionally, the antenna carrier board 2023, the multi-layer circuit board 2021 and the wave control board 203 are all printed circuit boards.

[0066] This embodiment also provides a satellite platform, including the above-mentioned phased array antenna, see Figures 6 to 8A mounting hole 101 is formed through the satellite cabin panel 100 of the satellite platform. The shape and size of the mounting hole 101 can be set according to the shapes and installation positions of the first heat pipe 1 and the flat heat pipe 2 to ensure that part of the first heat pipe 1 is located in the mounting hole 101 and is in contact with the flat heat pipe 2. The first protrusion 21 and the electronic component 202 are accommodated in the mounting hole 101, and the antenna transmitting unit 201 extends out of the outer surface of the satellite cabin panel 100. The satellite platform provided in this embodiment has a mounting hole 101 opened on the satellite cabin panel 100, so that the first heat pipe 1 buried in the satellite cabin panel 100 is abutted against the flat heat pipe 2 supporting the antenna assembly 200, and the space required for installing the first heat pipe 1, the flat heat pipe 2 and the antenna assembly 200 is reduced in a direction perpendicular to the satellite cabin panel 100. That is, by opening the mounting hole 101 and accommodating the first antenna module in the mounting hole 101, and partially accommodating the flat heat pipe 2 in the mounting hole 101, the space required for installing the first heat pipe 1, the flat heat pipe 2 and the antenna assembly 200 in a direction perpendicular to the cabin panel 1 is reduced by the thickness of the cabin panel, thereby making the overall size of the phased array antenna thinner. When the heat dissipation structure of the phased array antenna and the phased array antenna are applied to the satellite platform, the overall envelope size of the satellite is reduced.

[0067] The satellite platform in this embodiment further includes a housing 102 disposed opposite to the mounting hole 101. Figures 6 to 8 The shell 102 is connected to the cabin board 1 and the flat plate heat pipe 2 respectively, and the second antenna module is accommodated in the shell 102. The flat plate heat pipe 2 is fixed to the outer surface of the satellite cabin board 1 through the shell 102, and the flat plate heat pipe 2 and the second antenna module are also enclosed. Except for the antenna transmitting unit 201 exposed on the cabin board 1, the other parts of the antenna assembly 200 are all in the mounting hole 101 and the shell 102, so that the overall size of the phased array antenna is thinner and the integration is high, which is conducive to reducing the overall envelope size of the satellite when the phased array antenna in this embodiment is applied to the satellite platform.

[0068] Alternatively, see Figures 6 to 8 The shell 102 includes a bottom plate 1021 and a frame 1022 surrounding the bottom plate 1021. The bottom plate 1021 and the frame 1022 form a shell 102 with an opening, and the opening of the shell 102 faces the mounting hole 101. The flat heat pipe 2 is connected to the inner surface of the frame 1022 by screws, and the frame 1022 is installed on the cabin plate 1 by screws, which is convenient for installation and maintenance.

[0069] Optionally, the satellite cabin panel 100 in this embodiment is an aluminum skin aluminum honeycomb panel, wherein the skin thickness is 0.5 mm and the honeycomb thickness is 10 mm.

[0070] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A heat dissipation structure of a phased array antenna, used for dissipating heat from a phased array antenna of a satellite platform, wherein the satellite platform comprises a satellite cabin panel (100), characterized in that: include: A first heat pipe (1) is buried in the satellite cabin panel (100); A flat plate heat pipe (2) is arranged on the inner surface of the satellite cabin panel (100), the flat plate heat pipe (2) is provided with a first protrusion (21) for mounting an antenna assembly (200), the first protrusion (21) is located inside the satellite cabin panel (100), and the outer side surface of the first protrusion (21) and the flat plate heat pipe (2) located outside the first protrusion (21) are both in contact with the first heat pipe (1); a second heat pipe (3), the second heat pipe (3) being arranged on the inner surface of the satellite cabin panel (100); The projection of the second heat pipe (3) on the satellite cabin panel (100) and the projection of the first heat pipe (1) on the satellite cabin panel (100) are arranged to intersect each other; A first heat-conducting insulating pad (22) is sandwiched between the flat heat pipe (2) and the first heat pipe (1).

2. The heat dissipation structure of the phased array antenna according to claim 1, characterized in that: A plurality of the first heat pipes (1) and a plurality of the second heat pipes (3) are respectively provided, wherein the plurality of the first heat pipes (1) are arranged at intervals along the axial direction of the second heat pipe (3), and the plurality of the second heat pipes (3) are arranged at intervals along the axial direction of the first heat pipe (1).

3. The heat dissipation structure of the phased array antenna according to claim 1, characterized in that: A second protrusion (23) is provided on the surface of the flat heat pipe (2) facing away from the first protrusion (21), and the second protrusion (23) is used to connect some components of the antenna assembly (200).

4. The heat dissipation structure of the phased array antenna according to claim 3, characterized in that: A plurality of the second protrusions (23) are provided, and the plurality of the second protrusions (23) are arranged at intervals on the flat plate heat pipe (2).

5. The heat dissipation structure of the phased array antenna according to claim 3, characterized in that: A second heat-conducting insulating pad (231) is provided on the second protrusion (23).

6. The heat dissipation structure of the phased array antenna according to any one of claims 1 to 5, characterized in that: It also comprises a thermal control coating, which is arranged on the surface of the satellite cabin panel (100).

7. A phased array antenna, characterized in that: A heat dissipation structure of a phased array antenna comprising any one of claims 1 to 6, wherein the antenna assembly (200) comprises: a first antenna module, the first antenna module comprising an antenna transmitting unit (201) and an electronic component (202), the electronic component (202) being arranged on the first protrusion (21), the antenna transmitting unit (201) being arranged on the electronic component (202) and extending out of the outer surface of the satellite cabin panel (100); A second antenna module, the second antenna module is arranged on a surface of the flat heat pipe (2) facing away from the first protrusion (21).

8. The phased array antenna according to claim 7, characterized in that: The electronic component (202) comprises a multi-layer circuit board (2021), an AOP module (2022) and an antenna carrier board (2023); the multi-layer circuit board (2021) is arranged on the first protrusion (21); the AOP module (2022) is arranged on the multi-layer circuit board (2021); the antenna carrier board (2023) is arranged on the AOP module (2022); and the antenna transmitting unit (201) is arranged on the antenna carrier board (2023).

9. The phased array antenna according to claim 7, characterized in that: The second antenna module comprises a wave control plate (203) and a first chip component (204) and a second chip component (205) arranged on the wave control plate (203), wherein the first chip component (204) is sandwiched between the flat heat pipe (2) and the wave control plate (203), and the second chip component (205) is arranged on a surface of the wave control plate (203) facing away from the flat heat pipe (2).

10. The phased array antenna according to claim 9, characterized in that: The first chip component (204) comprises an AI chip (2041), a power chip (2042) and a refresh chip (2043); the AI ​​chip (2041), the power chip (2042) and the refresh chip (2043) are arranged on the flat heat pipe (2) at intervals.

11. The phased array antenna according to claim 9, characterized in that: The second chip assembly (205) comprises a plurality of heat-generating chips, and the plurality of heat-generating chips are arranged at intervals on the wave control plate (203).

12. A satellite platform, characterized in that: The phased array antenna comprises the phased array antenna according to any one of claims 7 to 11, wherein a mounting hole (101) is provided on the satellite cabin panel (100), a portion of the first heat pipe (1) is located in the mounting hole (101) and abuts against the flat plate heat pipe (2), the first protrusion (21) and the electronic component (202) are accommodated in the mounting hole (101), and the antenna transmitting unit (201) extends out of the outer surface of the satellite cabin panel (100).

13. The satellite platform according to claim 12, characterized in that: It also comprises a shell (102) arranged opposite to the mounting hole (101), the shell (102) being connected to the satellite cabin panel (100) and the flat plate heat pipe (2) respectively, and the second antenna module being accommodated in the shell (102).

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