Intermediate connection member for electrically interconnecting two circuit units

Abstract

The present disclosure relates to an intermediate connection member, an electronic module, an electronic device, and a method of manufacturing the intermediate connection member. The intermediate connection member includes: a first insulating substrate portion; a second insulating substrate portion; an insulating layer portion disposed between the first insulating substrate portion and the second insulating substrate portion and formed of a material different from that of the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions disposed between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction such that two end portions of the plurality of first wiring portions in the first direction are exposed to the outside; and a plurality of second wiring portions disposed between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction such that two end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

Description

Technical Field

[0001] The present invention relates to an intermediate connection member for electrically interconnecting two circuit units. Background Art

[0002] An imaging device including a camera as an example of an electronic device (e.g., a digital camera or a smart phone) includes an imaging module as an example of an electronic module. The imaging module includes a plurality of electronic components. In the case of the imaging module, one of the plurality of electronic components is an image sensor. Each electronic component is mounted on a rigid board such as a printed wiring board, and due to the demand for miniaturization of the electronic device, there is an increasing need to mount electronic components densely on a substrate in the imaging module.

[0003] As an example of a structure for achieving a high-density arrangement, a three-dimensional mounting structure constituted by a multilayer structure formed by stacking circuit units is known. As a method for forming a three-dimensional mounting structure, a method of interconnecting two circuit units facing each other by using solder balls and a method of interconnecting two circuit units facing each other by using an intermediate connection member including wirings are known. In the case where electronic components are arranged between two rigid boards of two circuit units, a method of interconnecting two circuit units by using an intermediate connection member is used.

[0004] Japanese Patent Laid-Open No. 2001-111232 discloses an intermediate connection member formed by defining a plurality of through-holes in an insulating substrate and injecting a conductor into the through-holes of the insulating substrate.

[0005] Due to the demand for further miniaturization of electronic devices, there is a need for further miniaturization of a three-dimensional mounting structure including an intermediate connection member, and there is a need to reduce the pitch of wirings in the intermediate connection member. In a method of forming wirings in through-holes, holes are generally drilled in an insulating substrate by mechanical drilling. If an attempt is made to reduce the pitch between through-holes, a portion formed of an insulating material between the through-holes becomes thin, and this causes a problem that it is difficult to maintain high-precision processing while satisfying the requirement of reducing the wiring pitch, such as peeling or deformation of the thin portion during drilling. Summary of the Invention

[0006] According to a first aspect of the present invention, a method for manufacturing an intermediate connection member for electrically connecting a first unit and a second circuit unit arranged opposite to each other includes: forming a first insulating substrate including a first main surface provided with a plurality of first grooves; forming a second insulating substrate including a second main surface provided with a plurality of second grooves; arranging a plurality of first conductive members in the plurality of first grooves; arranging a plurality of second conductive members in the plurality of second grooves; forming a structure by bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate with an insulating member positioned between the first insulating substrate and the second insulating substrate, such that the extending directions of the plurality of first conductive members and the plurality of second conductive members are aligned; and cutting the structure in a second direction intersecting a first direction in which the plurality of first conductive members and the plurality of second conductive members extend.

[0007] According to a second aspect of the present invention, an intermediate connection member for electrically connecting a first circuit unit and a second circuit unit arranged opposite to each other includes: a first insulating substrate portion; a second insulating substrate portion; an insulating layer portion provided between the first insulating substrate portion and the second insulating substrate portion and formed of a material different from that of the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions provided between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction, such that two end portions of the plurality of first wiring portions in the first direction are exposed to the outside; and a plurality of second wiring portions provided between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction, such that two end portions of the plurality of second wiring portions in the first direction are exposed to the outside.

[0008] According to a third aspect of the present invention, an intermediate connection member for electrically connecting a first circuit unit and a second circuit unit arranged opposite to each other includes a plurality of first wiring portions arranged at intervals in a second direction intersecting a first direction. Each of the plurality of first wiring portions is provided to extend in the first direction, such that two end faces of the plurality of first wiring portions in the first direction are exposed to the outside. At least one of the plurality of first wiring portions has a first width, and at least another of the plurality of first wiring portions has a second width greater than the first width.

[0009] According to a fourth aspect of the present invention, an intermediate connection member for electrically connecting a first circuit unit and a second circuit unit disposed opposite to each other includes a plurality of first wiring portions, and the plurality of first wiring portions are arranged at intervals in a second direction intersecting a first direction. Each of the plurality of first wiring portions is provided to extend in the first direction such that two end faces of the plurality of first wiring portions in the first direction are exposed to the outside. At least one of the plurality of first wiring portions has a first thickness, and at least another one of the plurality of first wiring portions has a second thickness greater than the first thickness.

[0010] According to a fifth aspect of the present invention, an intermediate connection member for electrically connecting a first circuit unit and a second circuit unit disposed opposite to each other includes a first insulating substrate portion; and a plurality of first wiring portions, and the plurality of first wiring portions are provided on the first insulating substrate portion and arranged at intervals in a second direction intersecting a first direction. Each of the plurality of first wiring portions is provided to extend in the first direction such that two end faces of the plurality of first wiring portions in the first direction are exposed to the outside. The first insulating substrate portion has a first groove portion, and a width of the first groove portion is greater than a width of one of the plurality of first wiring portions and / or a depth of the first groove portion is greater than a thickness of one of the plurality of first wiring portions.

[0011] With reference to the accompanying drawings, other features of the present invention will become apparent from the following description of exemplary embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is an explanatory view of a digital camera as an example of an electronic device according to a first embodiment.

[0013] Figure 2A is a plan view of an imaging module as an example of an electronic module according to a first embodiment.

[0014] Figure 2B is a cross-sectional view of the imaging module according to a first embodiment.

[0015] Figure 3A is a perspective view of an intermediate connection member according to a first embodiment.

[0016] Figure 3B is Figure 3A an enlarged view of a part of the intermediate connection member shown.

[0017] Figure 4A is a view for describing a manufacturing method of the intermediate connection member according to a first embodiment.

[0018] Figure 4BIt is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0019] Figure 5A It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0020] Figure 5B It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0021] Figure 5C It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0022] Figure 6A It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0023] Figure 6B It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0024] Figure 6C It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0025] Figure 7A It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0026] Figure 7B It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0027] Figure 7C It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0028] Figure 8A It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0029] Figure 8B It is a diagram for describing a manufacturing method of an intermediate connecting member according to the first embodiment.

[0030] Figure 9A It is a diagram for describing a manufacturing method of an imaging module according to the first embodiment.

[0031] Figure 9B It is a diagram for describing a manufacturing method of an imaging module according to the first embodiment.

[0032] Figure 9C It is a diagram for describing a manufacturing method of an imaging module according to the first embodiment.

[0033] Figure 10AIt is a diagram for describing a method of manufacturing an imaging module according to a first embodiment.

[0034] Figure 10B It is a diagram for describing a method of manufacturing an imaging module according to a first embodiment.

[0035] Figure 10C It is a diagram for describing a method of manufacturing an imaging module according to a first embodiment.

[0036] Figure 11A It is a perspective view of an intermediate connection member according to a second embodiment.

[0037] Figure 11B It is Figure 11A An enlarged view of a part of the intermediate connection member shown.

[0038] Figure 12A It is a diagram for describing a method of manufacturing an intermediate connection member according to a second embodiment.

[0039] Figure 12B It is a diagram for describing a method of manufacturing an intermediate connection member according to a second embodiment.

[0040] Figure 12C It is a diagram for describing a method of manufacturing an intermediate connection member according to a second embodiment.

[0041] Figure 12D It is a diagram for describing a method of manufacturing an intermediate connection member according to a second embodiment.

[0042] Figure 13 It is a perspective view of an intermediate connection member according to a third embodiment.

[0043] Figure 14 It is a perspective view of an intermediate connection member according to a fourth embodiment.

[0044] Figure 15A It is a perspective view of an intermediate connection member according to a fifth embodiment.

[0045] Figure 15B It is an explanatory diagram of two insulating substrate portions according to a fifth embodiment.

[0046] Figure 16A It is a perspective view of an intermediate connection member according to a sixth embodiment.

[0047] Figure 16B It is an explanatory diagram of two insulating substrate portions according to a sixth embodiment.

[0048] Figure 17A It is an explanatory diagram of an intermediate connection member of a modification example.

[0049] Figure 17B It is an explanatory diagram of an intermediate connection member of a modified example.

[0050] Figure 18A It is a perspective view of an intermediate connection member according to the seventh embodiment.

[0051] Figure 18B It is an explanatory diagram of an insulating substrate portion according to the seventh embodiment.

[0052] Figure 19 It is a perspective view of an intermediate connection member according to the eighth embodiment.

[0053] Figure 20A It is an explanatory diagram of an intermediate connection member of a modified example.

[0054] Figure 20B It is an explanatory diagram of an intermediate connection member of a modified example. Specific embodiments

[0055] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0056] First embodiment

[0057] Figure 1 It is an explanatory diagram of a digital camera 100 which is an example of a camera device used as an electronic device according to the first embodiment. The digital camera 100 is a digital camera with an interchangeable lens, and includes a camera body 101. A lens barrel 102 including a lens is detachably attached to the camera body 101. The lens barrel 102 is an interchangeable lens, that is, a lens unit.

[0058] The camera body 101 includes a housing 111, and an imaging module 200 and a processing module 400 provided inside the housing 111. The imaging module 200 and the processing module 400 are electrically communicatively connected to each other via a cable (not shown).

[0059] The imaging module 200 is an example of an electronic module, and has a three-dimensional mounting structure. The imaging module 200 includes circuit units 201 and 202, and a plurality of intermediate connection members 300. In the present embodiment, the circuit unit 201 serves as a first circuit unit, and the circuit unit 202 serves as a second circuit unit. The circuit unit 201 is a printed wiring board, a printed circuit board, or a semiconductor package, and is a semiconductor package in the present embodiment. The circuit unit 202 is a printed wiring board, a printed circuit board, or a semiconductor package, and is a printed circuit board in the present embodiment. The circuit units 201 and 202 are arranged to be separated from each other in the Z direction which is the stacking direction, and are electrically and mechanically interconnected by a plurality of intermediate connection members 300. That is, the intermediate connection members 300 are used to electrically and mechanically interconnect the circuit units 201 and 202 which are disposed opposite to each other in the Z direction.

[0060] The circuit unit 201 includes a wiring board 211 and an image sensor 212 as an example of a first electronic component mounted on the wiring board 211. The wiring board 211 is a packaging board. Additionally, the wiring board 211 is a rigid board. The image sensor 212 is a semiconductor component and an imaging component.

[0061] The circuit unit 202 includes a wiring board 221 and a plurality of storage elements 222 as an example of a second electronic component mounted on the wiring board 221. The wiring board 221 is a printed circuit board. Additionally, the wiring board 221 is a rigid board. The storage elements 222 are semiconductor components and are capable of storing image data in the present embodiment. The electronic components (the storage elements 222 mounted on the wiring board 221 in the present embodiment) are arranged between the wiring boards 211 and 221. Therefore, in the present embodiment, the wiring boards 211 and 221 are electrically and mechanically interconnected by a plurality of intermediate connection members 300 such that the storage elements 222 do not interfere with the wiring board 211.

[0062] For example, the image sensor 212 can be a complementary metal oxide semiconductor: CMOS image sensor or a charge coupled device: CCD image sensor. The image sensor 212 has a function of converting incident light passing through the lens barrel 102 into an electrical signal.

[0063] The processing module 400 includes a printed circuit board 401 and an image processing device 402 as a semiconductor device mounted on the printed circuit board 401. For example, the image processing device 402 is a digital signal processor. The image processing device 402 has a function of obtaining an electrical signal from the image sensor 212, performing processing for correcting the obtained electrical signal, and generating image data.

[0064] Figure 2A is a plan view of the imaging module 200, and Figure 2B is a cross-sectional view of the imaging module 200. In Figure 2A for ease of description, the illustration of the circuit unit 201 is omitted. Figure 2B is a cross-sectional view of the imaging module 200 taken along the line IIB-IIB of Figure 2A The circuit unit 201 of the imaging module 200 includes a frame 213 provided on the wiring board 211 and a lid 214 provided on the frame 213. For example, a glass substrate is used as the lid 214.

[0065] A plurality of intermediate connection members 300 are arranged to surround the plurality of storage elements 222. In the present embodiment, five intermediate connection members 300 and two storage elements 222 are provided.

[0066] In the wiring board 211, a plurality of pads 215 are arranged on the main surface 2112 opposite to the main surface 2111 on which the image sensor 212 is mounted. A solder mask (not shown) may be provided on the main surface 2112. In this case, openings are preferably provided in the solder mask at positions corresponding to the pads 215. The shape of each of the pads 215 is not particularly limited, and may be, for example, circular or polygonal in a plan view. In addition, the relationship between the solder mask and the pads may be one of solder mask defined: SMD and non-solder mask defined: NSMD. As the insulating material of the insulating substrate of the wiring board 211, a resin with a small coefficient of thermal expansion is used.

[0067] In the wiring board 221, a plurality of pads 225 and a plurality of pads 226 are arranged on the main surface 2211 on which the storage elements 222 are mounted. The plurality of storage elements 222 are bonded to the plurality of pads 226 via solder 230. A solder mask (not shown) may be provided on the main surface 2211. In this case, openings are preferably provided in the solder mask at positions corresponding to the pads 225 and 226. The shape of each of the pads 225 and 226 is not particularly limited, and may be, for example, circular or polygonal in a plan view. In addition, the relationship between the solder mask and the pads may be either SMD or NSMD. As the insulating material of the insulating substrate of the wiring board 221, a resin such as FR-4 is used.

[0068] Each of the intermediate connection members 300 includes a plurality of wiring portions 310 extending in the Z direction. Both end faces 3101 and 3102 of each of the wiring portions 310 in the Z direction are exposed to the outside. The end face 3101 is electrically and mechanically connected to a corresponding one of the pads 215 via solder 240, and the end face 3102 is electrically and mechanically connected to a corresponding one of the pads 225 via solder 250.

[0069] Each of the pads 215, 225, and 226 is an electrode formed of a metal such as copper as a conductive material. For example, each of the pads 215, 225, and 226 is a signal electrode, a power supply electrode, a ground electrode, or a dummy electrode.

[0070] Figure 3A is a perspective view of the intermediate connection member 300 according to the first embodiment. Figure 3B is Figure 3A an enlarged view of a part of the shown intermediate connection member 300.

[0071] The intermediate connection member 300 is a rigid plate having a rectangular parallelepiped shape and having a pair of end faces 301 and 302 each for bonding in the Z direction. Here, the longitudinal direction of the intermediate connection member 300 is the X direction, the width direction of the intermediate connection member 300 is the Y direction, and the height direction of the intermediate connection member 300 is the Z direction. The Z direction serves as the first direction, the X direction serves as the second direction, and the Y direction serves as the third direction. The X direction, the Y direction, and the Z direction intersect each other. In the present embodiment, the X direction, the Y direction, and the Z direction are perpendicular to each other.

[0072] The intermediate connection member 300 includes a plurality of wiring portions 311 serving as a plurality of first wiring portions and a plurality of wiring portions 312 serving as a plurality of second wiring portions. The plurality of wiring portions 311 and the plurality of wiring portions 312 constitute Figure 2A and Figure 2B the plurality of wiring portions 310 shown.

[0073] The intermediate connection member 300 includes an insulating substrate portion 321 serving as a first insulating substrate portion and an insulating substrate portion 322 serving as a second insulating substrate portion. In addition, the intermediate connection member 300 includes an insulating layer portion 323 disposed between the insulating substrate portions 321 and 322 and formed of a material different from that of the insulating substrate portions 321 and 322.

[0074] The plurality of wiring portions 311 are disposed between the insulating substrate portion 321 and the insulating layer portion 323. In addition, the plurality of wiring portions 311 are disposed at a certain distance from each other in the X direction. In addition, the plurality of wiring portions 311 are disposed to extend in the Z direction. Accordingly, both end faces 3111 and 3112 in the Z direction of each of the plurality of wiring portions 311 are exposed to the outside in the two end faces 301 and 302 of the intermediate connection member 300 so as to be bondable to the wiring boards 211 and 221 via solder.

[0075] The plurality of wiring portions 312 are disposed between the insulating substrate portion 322 and the insulating layer portion 323. In addition, the plurality of wiring portions 312 are disposed at a certain distance from each other in the X direction. In addition, the plurality of wiring portions 312 are disposed to extend in the Z direction. Accordingly, both end faces 3121 and 3122 in the Z direction of each of the plurality of wiring portions 312 are exposed to the outside in the two end faces 301 and 302 of the intermediate connection member 300 so as to be bondable to the wiring boards 211 and 221 via solder.

[0076] In addition, the plurality of connection portions 311 and the plurality of connection portions 312 are alternately arranged in the X direction. The insulating layer portion 323 is disposed between the plurality of connection portions 311 and the plurality of connection portions 312. That is, the plurality of connection portions 311 and the plurality of connection portions 312 are separated from each other in the Y direction. Therefore, the plurality of connection portions 311 and the plurality of connection portions 312 are arranged in a staggered manner in the X direction. Due to this staggered arrangement of the plurality of connection portions 311 and the plurality of connection portions 312, a further high-density arrangement of the wirings can be achieved, and thus a further miniaturization of the imaging module 200 can be achieved. It should be noted that in the case where a high-density arrangement of the wirings is not required, the plurality of connection portions 311 and the plurality of connection portions 312 may be arranged opposite to each other instead of in a staggered manner.

[0077] The insulating layer portion 323 is formed by solidifying, i.e., curing, an adhesive. That is, the insulating substrate portion 321, the insulating substrate portion 322, the plurality of connection portions 311, and the plurality of connection portions 312 are integrated via the insulating layer portion 323, and thus the intermediate connection member 300 is formed.

[0078] The insulating substrate portions 321 and 322 are formed of the same insulating material. The insulating material of the insulating substrate portions 321 and 322 is glass epoxy resin. Glass epoxy resin is a material obtained by, for example, impregnating a glass fabric obtained by weaving glass fibers into a cloth shape with a liquid epoxy resin and thermally hardening the epoxy resin, and is also referred to as epoxy glass, epoxy resin glass resin, etc. The insulating layer portion 323 is formed by, for example, solidifying an adhesive containing epoxy resin or silicone resin as a main component. Each of the connection portions 311 and 312 is formed of a conductive material such as copper.

[0079] Each of the plurality of connection portions 311 is formed with the same diameter. Therefore, a wire through which a large current flows (for example, a connection portion serving as a ground wire among the plurality of connection portions 311) can be formed of a material different from that of the other connection portions, that is, can be formed of a material having a lower resistivity. The same applies to the plurality of connection portions 312.

[0080] The length L of the intermediate connection member 300 in the X direction is smaller than the lengths of the wiring boards 211 and 221. The width W of the intermediate connection member 300 in the Y direction depends on the areas of the main surfaces 2112 and 2211 of the wiring boards 211 and 221 and the method for manufacturing the imaging module 200.

[0081] When the intermediate connection member 300 is erected relative to the wiring board 221 during the manufacturing process and the intermediate connection member 300 is bonded to the wiring board 221 with solder, the width W of the intermediate connection member 300 is preferably 1 mm or more. Further, in consideration of high-density arrangement, the width W of the intermediate connection member 300 is preferably 5 mm or less.

[0082] Further, among the electronic components mounted on the main surface 2211 of the wiring board 221, the storage element 222 has the largest height. The height H of the intermediate connection member 300 in the Z direction is preferably greater than the height of the storage element 222. For example, when the height of the storage element 222 in the Z direction is 1.6 mm, the height H of the intermediate connection member 300 is preferably greater than 1.6 mm.

[0083] Among the plurality of wiring portions 311 and the plurality of wiring portions 312, the pitch P between the two closest wiring portions 311 and 312 is preferably 0.36 mm to 0.44 mm. Thus, the intermediate connection member 300 can be manufactured with high precision while achieving a narrow pitch between the wiring portions 311 and 312.

[0084] A method for manufacturing the intermediate connection member 300 will be described. Figures 4A to 8B is a diagram for describing steps of a method for manufacturing the intermediate connection member 300.

[0085] In Figure 4A and Figure 4B shown steps, a mother material 500 having a plate shape is prepared. Figure 4A is a plan view of the mother material 500, and Figure 4B is a cross-sectional view of the mother material 500 taken along the line IV-IV shown in Figure 4A . Although the description is omitted here, two mother materials 500 are prepared. The mother material 500 is formed of an insulating material such as glass epoxy (e.g., FR-4). Figure 3A The thickness W of the intermediate connection member 300 shown in

[0086] is preferably 5 mm or less. Thus, the thickness of the mother material 500 is preferably 2.5 mm or less. Figure 5A and Figure 5B shown steps, a process of defining a plurality of grooves in the main surface 501 of each of the two mother materials 500 is performed. Thus, in Figure 5A is a plan view of the insulating substrate 601, and Figure 5B is along Figure 5AA cross-sectional view of the insulating substrate 601 taken along the line V-V. The groove 621 serves as the first groove. The main surface 611 serves as the first main surface. The insulating substrate 601 serves as the first insulating substrate.

[0087] Similarly, in Figure 5C the step shown, an insulating substrate 602 having a main surface 612 provided with a plurality of grooves 622 is formed. Figure 5C is a cross-sectional view of the insulating substrate 602. The groove 622 serves as the second groove. The main surface 612 serves as the second main surface. The insulating substrate 602 serves as the second insulating substrate.

[0088] The plurality of grooves 621 are defined at intervals in the X direction and extend in the Z direction. Similar to the plurality of grooves 621, the plurality of grooves 622 are defined at intervals in the X direction and extend in the Z direction. Although in this embodiment each of the plurality of grooves 621 and the plurality of grooves 622 is defined as a straight shape, each of the plurality of grooves 621 and the plurality of grooves 622 may be defined as a curved shape.

[0089] The width and depth of each of the grooves 621 and 622 are set according to the diameter of the wiring portions 311 and 312 to be formed. For example, when the diameter of the wire to be described later is φ0.2 mm, the width and depth of each of the grooves 621 and 622 are preferably each set to about 0.2 mm, which is the same as the diameter of the wire. In addition, it is preferable that the pitch of the plurality of grooves 621 and the pitch of the plurality of grooves 622 are set to the same value, and for example, each pitch is set to about 0.57 mm.

[0090] Although in this embodiment the cross-sectional shape of each of the grooves 621 and 622 is a rectangular shape, the cross-sectional shape is not limited thereto and may be, for example, a semi-circular shape. Although the process for defining the grooves 621 and 622 is preferably performed by machining using a cutting machine device or a slicing machine device, the grooves 621 and 622 can be defined by masking the base material 500 with a resist or the like and physically processing the base material 500 using a milling device. In addition, the insulating substrates 601 and 602 can be molded using a mold having a shape suitable for defining the grooves. It is easier to form an insulating substrate having a plurality of grooves close to each other than to form an insulating substrate having a plurality of through holes close to each other. Therefore, the insulating substrate 601 having a plurality of grooves 621 and the insulating substrate 602 having a plurality of grooves 622 can be formed with high precision.

[0091] Next, in Figure 6A and Figure 6B the step shown, a plurality of conductive members 701 are arranged in the plurality of grooves 621. Figure 6Ais a plan view of an insulating substrate 601 in which a plurality of conductive members 701 are arranged, and Figure 6B is a cross-sectional view taken along line VI-VI of the insulating substrate 601 in which a plurality of conductive members 701 are arranged Figure 6A . The conductive member 701 serves as a first conductive member. Similarly, in the Figure 6C step shown, a plurality of conductive members 702 are arranged in a plurality of grooves 622. Figure 6C is a cross-sectional view of an insulating substrate 602 in which a plurality of conductive members 702 are arranged. The conductive member 702 serves as a second conductive member.

[0092] Each of the plurality of conductive members 701 and the plurality of conductive members 702 is a wire formed of a metal such as copper. In the present embodiment, the diameter of each of the conductive members 701 is set to the same value. In the present embodiment, the diameter of each of the conductive members 702 is also set to the same value. Further, in the present embodiment, the diameter of each of the conductive members 701 and the diameter of each of the conductive members 702 are also set to the same value.

[0093] Although in the present embodiment, the cross-sectional shape of the wire is circular, the cross-sectional shape is not limited thereto and may be a polygon such as a quadrilateral. In Figure 6A and Figure 6B the step shown, a plurality of conductive members 701 are assembled in a plurality of grooves 621. In Figure 6C the step shown, a plurality of conductive members 702 are assembled in a plurality of grooves 622. Therefore, it is possible to suppress the conductive member 701 from falling off from the groove 621 of the insulating substrate 601 in a subsequent step, and it is possible to suppress the conductive member 702 from falling off from the groove 622 of the insulating substrate 602 in a subsequent step.

[0094] When the conductive member 701 is assembled in the groove 621, an adhesive (not shown) may be applied in the groove 621 in advance. Similarly, when the conductive member 702 is assembled in the groove 622, an adhesive (not shown) may be applied in the groove 622 in advance. As the adhesive, an adhesive that hardens at about room temperature is preferably selected. Therefore, it is possible to effectively suppress the conductive member 701 from falling off from the groove 621 of the insulating substrate 601, and it is possible to effectively suppress the conductive member 702 from falling off from the groove 622 of the insulating substrate 602.

[0095] It should be noted that although it is preferred to assemble the wires in the grooves as a method of arranging the conductive members 701 and 702 in the grooves 621 and 622, the method is not limited thereto. For example, a conductive paste can be applied in the grooves by a dispenser or the like and the paste can be fired to form the conductive members. The materials of the conductive members 701 and 702 can be formed of any material as long as the material is conductive. For example, the material can be an inorganic material such as copper, silver or aluminum, or an organic material such as conductive rubber.

[0096] Considering the bonding property with the pads of the wiring boards 211 and 221 via solder and the operability and deformation of the conductive members 701 and 702 when the conductive members 701 and 702 are arranged in the grooves 621 and 622, the diameter and thickness of the conductive members 701 and 702 are preferably greater than or equal to 0.05 mm and less than or equal to 2 mm. Considering the high-density arrangement of the wires, the diameter and thickness of the conductive members 701 and 702 are more preferably less than or equal to 0.5 mm.

[0097] Next, the steps for forming Figures 7A to 7C the structure 800 shown will be described. In this series of steps, the structure 800 is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 (with the insulating member 651 located between the main surface 611 and the main surface 612) together such that the directions in which the plurality of conductive members 701 extend and the directions in which the plurality of conductive members 702 extend are aligned. In this series of steps, the structure 800 is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 together such that the plurality of conductive members 701 and the plurality of conductive members 702 are alternately arranged in the X direction.

[0098] The steps for forming Figures 7A to 7C the structure 800 shown will be described in detail below. First, in Figure 7A the step shown, an adhesive 650 is applied on the main surface 611 of the insulating substrate 601. The adhesive 650 is, for example, an insulating adhesive containing epoxy resin or silicone resin as a main component. As the adhesive 650, for example, an adhesive that is thermally cured at about 100 °C can be selected.

[0099] Next, in Figure 7BIn the steps shown, before the adhesive 650 cures, the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650 such that the adhesive 650 is sandwiched between the main surfaces 611 and 612. The insulating substrates 601 and 602 are aligned by an alignment device (not shown). Thus, while controlling the thickness of the layer of the adhesive 650, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together with the plurality of conductive members 701 and the plurality of conductive members 702 positioned between the insulating substrate 601 and the insulating substrate 602. Alignment between the insulating substrates 601 and 602 can be performed by causing the end faces of the insulating substrates 601 and 602 to abut against a contact member (not shown), or can be performed by using pre-formed alignment marks (not shown). Additionally, in order to control the thickness of the layer of the adhesive 650, an insulating spacer serving as a thickness control material can be mixed into the adhesive 650.

[0100] Then, in Figure 7C the steps shown, the adhesive 650 cures to form the insulating member 651. As described above, by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 using the adhesive 650, the insulating member 651 is formed via the solidified adhesive 650.

[0101] In the present embodiment, the processing structure 800 is formed to create the intermediate connection member 300. The insulating substrate 601 in the structure 800 corresponds to the insulating substrate portion 321 in the intermediate connection member 300. The insulating substrate 602 in the structure 800 corresponds to the insulating substrate portion 322 in the intermediate connection member 300. The insulating member 651 in the structure 800 corresponds to the insulating layer portion 323 in the intermediate connection member 300. The conductive member 701 in the structure 800 corresponds to the wiring portion 311 in the intermediate connection member 300. The conductive member 702 in the structure 800 corresponds to the wiring portion 312 in the intermediate connection member 300.

[0102] To inhibit in the subsequent reflow step Figure 3AFrom the perspective of the peeling of the insulating substrate portions 321 and 322 shown, the thickness of the insulating member 651 that forms the insulating layer portion 323 in the Y direction is preferably greater than or equal to 10 μm. In the case where the thickness is less than 10 μm, the insulating substrate portions 321 and 322 may peel from each other, or the conductive members 701 and 702 may be short-circuited when the conductive members 701 and 702 are arranged opposite to each other. Additionally, considering the deformation of the conductive members, etc., the thickness of the insulating member 651 that forms the insulating layer portion 323 in the Y direction is preferably less than or equal to 300 μm. In the case where the thickness is greater than 300 μm, due to moisture absorption, the conductive members may be deformed or the insulating layer portion 323 may not have sufficient mechanical strength. That is, the thickness of the insulating member 651 that forms the insulating layer portion 323 in the Y direction is preferably 10 μm to 300 μm. Therefore, the thickness of the insulating layer portion 323 in the Y direction is preferably 10 μm to 300 μm.

[0103] Next, in Figure 8A and Figure 8B In the steps shown, the structure 800 is cut in the X direction. Figure 8A is a plan view of the structure 800, and Figure 8B is a cross-sectional view of the structure 800 taken along the line VIII-VIII of Figure 8A . By cutting the structure 800 in the X direction along a line that is separated by a distance H from each other in the Z direction, the end faces 3111, 3112, 3121, and 3122 of the wiring portions 311 and 312 shown in Figure 3A can be exposed. In the present embodiment, by cutting the structure 800 in the X direction and the Z direction, an intermediate connection member 300 having a predetermined size, that is, having a predetermined length L, height H, and width W can be formed. For example, an intermediate connection member 300 is formed as follows. In the intermediate connection member, the thickness of each of the insulating substrate portions 321 and 322 in the Y direction is 0.5 mm, the thickness of the insulating layer portion 323 in the Y direction is 0.085 mm, and the intermediate connection member has a length L of 41.0 mm, a height H of 2.0 mm, and a width W of 1.085 mm. The structure 800 is cut by using a cutting machine device, a wire saw device, etc. In this step, one intermediate connection member 300 can be formed from one structure 800, or multiple intermediate connection members 300 can be formed from one structure 800. In the case where multiple intermediate connection members 300 are formed from one structure 800, one structure 800 can be cut in the X direction at intervals of H in the Z direction. Additionally, one structure 800 can be cut in the Z direction at intervals of L in the X direction.

[0104] Note that the direction of the cutting structure 800 may be inclined with respect to the conductive members 701 and 702. In this case, the end face of the formed wiring portion has an elliptical shape, which has a larger cross-sectional area than a circle, and thus the bonding area with the solder can be larger.

[0105] According to the manufacturing process described above, an intermediate connection member 300 can be obtained in which the wiring portions 311 and 312 are arranged with high precision as shown. Figure 3A In addition, a high-precision intermediate connection member 300 including the wiring portions 311 and 312 arranged at a high density with a small pitch can be obtained.

[0106] Here, the pitch between the two closest wiring portions among the plurality of wiring portions 311 and 312 is represented by P. The ratio H / P of the height H of the intermediate connection member 300 in the Z direction to the pitch P is preferably greater than or equal to 4. For example, if the pitch P is set to 0.4 mm and the height H is set to 2.0 mm, the ratio H / P is 5. As described above, the intermediate connection member 300 having a large height H can be formed while arranging the wiring portions 311 and 312 at a high density.

[0107] Next, a method for manufacturing the imaging module will be described. Figures 9A to 10C FIG. is a diagram for describing steps of a method for manufacturing the imaging module 200 according to the first embodiment.

[0108] As shown, a wiring board 221 is prepared. Then, a solder paste P1 containing solder powder and a flux is supplied onto pads 225 and 226 on the wiring board 221, as shown. Figure 9A As the solder powder, for example, Sn-Ag-Cu solder powder is used. The solder paste P1 can be supplied by, for example, screen printing or using a dispenser. Figure 9B Similar to so-called offset printing, the solder paste P1 can be supplied to cover the entire surface of the pads 225 and 226, or the solder paste P1 can be supplied to cover a part of the surfaces of the pads 225 and 226.

[0109] Next, as shown, the storage element 222, the intermediate connection member 300, and chip components (not shown) are placed on the wiring board 211, as shown.

[0110] Next, as shown, Figure 9C the storage element 222, the intermediate connection member 300, and chip components (not shown) are placed on the wiring board 211, as shown. Figure 9CAs shown. Chip components not shown are, for example, capacitors or resistors. The storage element 222, the intermediate connection member 300, and chip components not shown are placed on corresponding pads by using a mounter or the like. That is, the storage element 222 is placed on the pad 226, and the intermediate connection member 300 is placed on the pad 225. At this time, the intermediate connection member 300 is mounted on the wiring board 221 such that the end face 3102 of the wiring portion 310 of the intermediate connection member 300 contacts the solder paste P1. The intermediate connection member 300 is preferably capable of standing upright without any support mechanism after being mounted on the wiring board 221.

[0111] Next, in a reflow furnace (not shown), the following reflow process is performed, in which the solder paste P1 is heated to a temperature equal to or higher than the melting point of the solder powder to melt and agglomerate the solder powder, and then cooled to a temperature lower than the melting point of the solder powder to solidify the solder paste P1. Due to the solidification of the solder, the storage element 222, the intermediate connection member 300, and chip components not shown are electrically and mechanically bonded to the wiring board 221, as Figure 10A shown. That is, a structure in which the intermediate connection member 300 and the circuit unit 202 are bonded via solder is manufactured. The wiring portion 310 of the intermediate connection member 300 is electrically connected to the pad 225 via the solder 250.

[0112] Next, as Figure 10B shown, the solder paste P2 containing solder powder and a flux is supplied to the pad 215 on the wiring board 211. As the solder powder, for example, Sn - Ag - Cu solder powder is used. The solder paste P2 can be supplied by, for example, screen printing or using a dispenser. Similar to so - called offset printing, the solder paste P2 can be supplied to cover the entire surface of the pad 215, or the solder paste P2 can be supplied to cover a part of the surface of the pad 215.

[0113] Then, as Figure 10C shown, the circuit unit 201 is mounted on the intermediate connection member 300 on the circuit unit 202. The circuit unit 201 is placed on the intermediate connection member 300 by using a mounter or the like. At this time, the circuit unit 201 is mounted on the intermediate connection member 300 such that the solder paste P2 contacts the end face 3101 of the wiring portion 310 of the intermediate connection member 300.

[0114] Next, in a reflow furnace (not shown), a reflow process is performed, in which the solder paste P2 is heated to a temperature equal to or higher than the melting point of the solder powder to melt and agglomerate the solder powder, and then cooled to a temperature lower than the melting point of the solder powder to solidify the solder paste P2. Due to the solidification of the solder, the intermediate connection member 300 is bonded to the circuit unit 201 via the solder, and thus the Figure 2B shown imaging module 200 is manufactured.

[0115] In the imaging module 200 manufactured in this manner, there is no connection failure between the intermediate connection member 300 and the circuit units 201 and 202, and thus sufficient optical performance of the image sensor 212 included in the circuit unit 201 can be ensured.

[0116] Second Embodiment

[0117] Next, the intermediate connection member according to the second embodiment will be described. Figure 11A is a perspective view of the intermediate connection member 300A according to the second embodiment. Figure 11B is Figure 11A An enlarged view of a part of the intermediate connection member 300A shown. It should be noted that in the second embodiment, elements substantially the same as those in the first embodiment are denoted by the same reference numerals in the drawings and their description will be omitted.

[0118] The intermediate connection member 300A is a rigid plate having a rectangular parallelepiped shape, and each of the paired end faces 301 and 302 in the Z direction serves as a connection surface. The intermediate connection member 300A includes a plurality of wiring portions 311 and a plurality of wiring portions 312.

[0119] The intermediate connection member 300A includes insulating substrate portions 321 and 322. In addition, the intermediate connection member 300A includes an insulating layer portion 323A provided between the insulating substrate portions 321 and 322 and formed of a material different from that of the insulating substrate portions 321 and 322.

[0120] A plurality of wiring portions 311 are arranged between the insulating substrate portion 321 and the insulating layer portion 323A. A plurality of wiring portions 312 are arranged between the insulating substrate portion 322 and the insulating layer portion 323A.

[0121] The insulating layer portion 323A includes three insulating layers 323A-1, 323A-2, and 323A-3. The insulating layer 323A-1 serves as the first insulating layer. The insulating layer 323A-2 serves as the second insulating layer. The insulating layer 323A-3 serves as the third insulating layer. The insulating layers 323A-1 and 323A-2 are formed by the solidification of an adhesive of the same material. The insulating layer 323A-3 is arranged between the insulating layers 323A-1 and 323A-2. The insulating layer 323A-3 is formed of a material different from that of the insulating layers 323A-1 and 323A-3. The insulating layers 323A-1 and 323A-2 are formed by curing an adhesive containing epoxy resin or silicone resin as a main component, for example. The insulating layer 323A-3 is formed of polyimide, for example.

[0122] The thickness W of the insulating layer portion 323A in the Y direction is preferably 10 μm to 300 μm, as in the first embodiment.

[0123] Next, a method of manufacturing the intermediate connection member 300A according to the second embodiment will be described. The following will refer to Figures 12A to 12D Steps for the method of manufacturing the intermediate connection member 300A according to the second embodiment will be described. The method of manufacturing the intermediate connection member 300A according to the second embodiment is the same as the method of manufacturing the intermediate connection member 300 according to the first embodiment, except for the step of forming Figures 7A to 7C the structure shown. That is, in Figures 12A to 12D the structure 800A formed in the step shown is different from the structure 800 formed in the first embodiment. Therefore, only the step of forming Figures 12A to 12D the structure 800A shown will be described. In this series of steps, the structure 800A is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 together with the insulating member 651A located between the insulating substrate 601 and the insulating substrate 602, such that the directions in which the plurality of conductive members 701 extend and the directions in which the plurality of conductive members 702 extend are aligned. In this series of steps, the structure 800A is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 together such that the plurality of conductive members 701 and the plurality of conductive members 702 are alternately arranged in the X direction.

[0124] In the step of forming Figures 12A to 12D the structure 800A shown, the insulating member 651A is formed by bonding the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 together with the insulating sheet 650A-3 located between the insulating substrate 601 and the insulating substrate 602 using an adhesive. The following will describe in detail the steps for forming the structure 800A. First, in Figure 12A the step shown, an adhesive 650A-1 is applied to the main surface 611 of the insulating substrate 601. The adhesive 650A-1 is, for example, an insulating adhesive containing epoxy resin or silicone resin as a main component.

[0125] Next, in Figure 12B the step shown, the insulating sheet 650A-3 is placed on the adhesive 650A-1 before the adhesive 650A-1 is cured, and then an adhesive 650A-2 having the same composition as the adhesive 650A-1 is further applied on the insulating sheet 650A-3. The insulating sheet 650A-3 is a sheet having a film shape and formed of polyimide or the like.

[0126] Next, in Figure 12CIn the steps shown, the main surface 612 of the insulating substrate 602 is brought into contact with the adhesive 650A-2. The insulating substrates 601 and 602 are aligned by an alignment device (not shown). The insulating sheet 650A-3 defines the thickness of each layer of the adhesives 650A-1 and 650A-2 in the Y direction, and thus makes the thicknesses of the layers of the adhesives 650A-1 and 650A-2 uniform in the Y direction. Accordingly, while controlling the thicknesses of the layers of the adhesives 650A-1 and 650A-2, the main surface 611 of the insulating substrate 601 and the main surface 612 of the insulating substrate 602 are bonded together in a state where the plurality of conductive members 701 and the plurality of conductive members 702 are located between the insulating substrate 601 and the insulating substrate 602. The alignment between the insulating substrates 601 and 602 can be performed by causing the end faces of the insulating substrates 601 and 602 to abut against a contact member (not shown), or can be performed by using pre-formed alignment marks (not shown).

[0127] Then, the adhesives 650A-1 and 650A-2 are cured to form Figure 12D the insulating member 651A shown. The insulating member 651A is composed of an insulating layer 651A-1 formed by curing the adhesive 650A-1, an insulating layer 651A-2 formed by curing the adhesive 650A-2, and the insulating sheet 650A-3.

[0128] In the present embodiment, the intermediate connection member 300A is formed by the cutting structure 800A. The cutting method is substantially the same as that in the first embodiment. The insulating substrate 601 in the structure 800A corresponds to the insulating substrate portion 321 in the intermediate connection member 300A. The insulating substrate 602 in the structure 800A corresponds to the insulating substrate portion 322 in the intermediate connection member 300A. The insulating member 651A in the structure 800A corresponds to the insulating layer portion 323A in the intermediate connection member 300A. The conductive member 701 in the structure 800A corresponds to the wiring portion 311 in the intermediate connection member 300A. The conductive member 702 in the structure 800A corresponds to the wiring portion 312 in the intermediate connection member 300A.

[0129] In addition, the insulating layer 651A-1 in the structure 800A corresponds to the insulating layer 323A-1 in the intermediate connection member 300A. The insulating layer 651A-2 in the structure 800A corresponds to the insulating layer 323A-2 in the intermediate connection member 300A. The insulating sheet 650A-3 in the structure 800A corresponds to the insulating layer 323A-3 in the intermediate connection member 300A.

[0130] Similarly according to the second embodiment, similar to the first embodiment, an intermediate connection member 300A in which the wiring portions 311 and 312 are arranged with high precision can be obtained. Additionally, a high-precision intermediate connection member 300A including the wiring portions 311 and 312 arranged at a small pitch and with high density can be obtained. It should be noted that the manufacturing method for the imaging module according to the second embodiment is substantially the same as that of the first embodiment, and thus its description will be omitted.

[0131] Third Embodiment

[0132] Next, an intermediate connection member according to the third embodiment will be described. Figure 13 is a perspective view of an intermediate connection member 300B according to the third embodiment. It should be noted that in the third embodiment, elements substantially the same as those in the first embodiment are denoted by the same reference numerals in the drawings and their description will be omitted. Additionally, the manufacturing method for the intermediate connection member 300B is also substantially the same as that of the first embodiment, and thus its description will be omitted.

[0133] The intermediate connection member 300B includes insulating substrate portions 321 and 322 and an insulating layer portion 323. Additionally, the intermediate connection member 300B includes a wiring portion group 311B composed of a plurality of first wiring portions and a wiring portion group 312B composed of a plurality of second wiring portions. The wiring portion groups 311B and 312B are formed of a metal such as copper.

[0134] The wiring portion group 311B includes a wiring portion 311B-1 and a wiring portion 311B-2 having a diameter larger than that of the wiring portion 311B-1. The wiring portion group 312B includes a wiring portion 312B-1 and a wiring portion 312B-2 having a diameter larger than that of the wiring portion 312B-1.

[0135] Therefore, a larger current can flow in the wiring portions 311B-2 and 312B-2 compared to the wiring portions 311B-1 and 312B-1. Therefore, the wiring portions 311B-2 and 312B-2 can be used as, for example, ground wires. When manufacturing the intermediate connection member 300B, a wiring having a larger wiring diameter than that used for the wiring portions 311B-1 and 312B-1 can be used for the wiring portions 311B-2 and 312B-2. For example, when the diameter of each of the wiring portions 311B-1 and 312B-1 is set to φ0.2 mm, the diameter of each of the wiring portions 311B-2 and 312B-2 used as ground wires can be set to φ0.3 mm, which is larger than φ0.2 mm.

[0136] The connection part groups 311B and 312B may each include a connection part having a first diameter and a connection part having a second diameter larger than the first diameter. In the present embodiment, the connection parts 311B-1 and 312B-1 serve as the connection parts having the first diameter, and the connection parts 311B-2 and 312B-2 serve as the connection parts having the second diameter. It should be noted that a configuration may be adopted in which only one of the connection part groups 311B and 312B includes the connection parts 311B-2 or 312B-2 having a diameter larger than that of the connection parts 311B-1 or 312B-1. That is, the configuration of the connection part group is not limited as long as the diameter of at least one connection part in the connection part groups 311B and 312B is larger than that of the other connection parts. In addition, the insulating layer part 323 may be configured in a manner similar to the insulating layer part 323A of the second embodiment.

[0137] Fourth Embodiment

[0138] Next, the intermediate connection member according to the fourth embodiment will be described. Figure 14 is a perspective view of the intermediate connection member 300C according to the fourth embodiment. It should be noted that in the fourth embodiment, elements substantially the same as those in the first embodiment are denoted by the same reference numerals in the drawings and their description will be omitted. In addition, the manufacturing method for the intermediate connection member 300C is also substantially the same as that of the first embodiment, and thus its description will be omitted. Although the intermediate connection member 300 including the layered structure of two insulating substrate parts 321 and 322 has been described in the first embodiment, in which a plurality of connection parts 311 and a plurality of connection parts 312 are arranged in the connection part between the two insulating substrates, the configuration is not limited thereto. Any configuration may be adopted as long as the intermediate connection member includes three or more insulating substrate parts and a plurality of first connection parts and a plurality of second connection parts are arranged in the connection part between two adjacent insulating substrate parts.

[0139] The intermediate connection member 300C of the fourth embodiment includes three insulating substrate parts 321C-1, 322C, and 321C-2. When the insulating substrate part 321C-1 serves as the first insulating substrate part, the insulating substrate part 322C serves as the second insulating substrate part. In addition, when the insulating substrate part 321C-2 serves as the first insulating substrate part, the insulating substrate part 322C serves as the second insulating substrate part. The insulating material constituting the insulating substrate parts 321C-1, 322C, and 321C-2 is, for example, FR-4.

[0140] The insulating layer portion 323C-1 is disposed between the insulating substrate portions 321C-1 and 322C, and the insulating layer portion 323C-2 is disposed between the insulating substrate portions 321C-2 and 322C. The insulating layer portions 323C-1 and 323C-2 are formed of an insulating material different from the insulating materials constituting the insulating substrate portions 321C-1, 322C, and 321C-2. The insulating layer portions 323C-1 and 323C-2 are formed by curing, for example, an insulating adhesive containing epoxy resin or silicone resin as a main component.

[0141] The intermediate connection member 300C of the fourth embodiment includes a plurality of wiring portions 311-1 serving as a plurality of first wiring portions and a plurality of wiring portions 312-1 serving as a plurality of second wiring portions. The plurality of wiring portions 311-1 are disposed between the insulating substrate portion 321C-1 and the insulating layer portion 323C-1 so as to extend in the Z direction, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 312-1 are disposed between the insulating substrate portion 322C and the insulating layer portion 323C-1 so as to extend in the Z direction, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 311-1 and the plurality of wiring portions 312-1 are alternately arranged in the X direction.

[0142] In addition, the intermediate connection member 300C includes a plurality of wiring portions 311-2 serving as a plurality of first wiring portions and a plurality of wiring portions 312-2 serving as a plurality of second wiring portions. The plurality of wiring portions 311-2 are disposed between the insulating substrate portion 321C-2 and the insulating layer portion 323C-2 so as to extend in the Z direction, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 312-2 are disposed between the insulating substrate portion 322C and the insulating layer portion 323C-2 so as to extend in the Z direction, and both end faces in the Z direction are exposed to the outside. The plurality of wiring portions 311-2 and the plurality of wiring portions 312-2 are alternately arranged in the X direction.

[0143] As described above, also according to the fourth embodiment, similar to the first embodiment, an intermediate connection member 300C in which the wiring portions 311-1, 312-1, 311-2, and 312-2 are arranged with high precision can be obtained. In addition, also according to the fourth embodiment, the intermediate connection member 300C can be manufactured with high precision while realizing a wiring structure with a small pitch. It should be noted that although the insulating layer portions 323C-1 and 323C-2 have substantially the same configuration as the insulating layer portion 323 of the first embodiment, the insulating layer portions 323C-1 and 323C-2 can have substantially the same configuration as the insulating layer portion 323A of the second embodiment.

[0144] Fifth Embodiment

[0145] Next, the intermediate connection member of the fifth embodiment will be described. Figure 15A is a perspective view of the intermediate connection member 300D according to the fifth embodiment. It should be noted that the structure and manufacturing method of the intermediate connection member 300D of the fifth embodiment are substantially the same as those of the intermediate connection member 300B of the third embodiment. That is, the manufacturing method of the intermediate connection member 300D of the fifth embodiment is substantially the same as the manufacturing method of the intermediate connection member 300 used in the first embodiment.

[0146] The intermediate connection member 300D includes a wiring portion group 311D constructed in substantially the same manner as the wiring portion group 311B of the third embodiment and a wiring portion group 312D constructed in substantially the same manner as the wiring portion group 312B of the third embodiment. In addition, the intermediate connection member 300D includes an insulating substrate portion 321D constructed in substantially the same manner as the insulating substrate portion 321 of the third embodiment, an insulating substrate portion 322D constructed in substantially the same manner as the insulating substrate portion 322 of the third embodiment, and an insulating layer portion 323D constructed in substantially the same manner as the insulating layer portion 323 of the third embodiment. The insulating substrate portion 321D serves as the first insulating substrate portion, and the insulating substrate portion 322D serves as the second insulating substrate portion. The insulating substrate portions 321D and 322D face each other, with the insulating layer portion 323D located between the insulating substrate portions 321D and 322D. The insulating substrate portions 321D and 322D are formed of the same material (e.g., glass epoxy resin) as the insulating substrate portions 321 and 322 described in the first embodiment. The insulating layer portion 323D is formed of a material different from that of the insulating substrate portions 321D and 322D and the same material (e.g., a solidified adhesive containing epoxy resin or silicone resin as a main component) as the insulating layer portion 323 described in the first embodiment.

[0147] In the fifth embodiment, the wiring section group 311D includes a plurality of wiring sections 311D-0 as a plurality of first wiring sections. In this embodiment, the wiring section group 311D includes seven wiring sections 311D-0. The plurality of wiring sections 311D-0 are arranged at intervals in the X direction. Each of the wiring sections 311D-0 is arranged to extend in the Z direction such that both end faces thereof in the Z direction are exposed to the outside. The material of each of the wiring sections 311D-0 is a conductive material such as copper. The plurality of wiring sections 311D-0 include, for example, six wiring sections 311D-1 as at least one first wiring section, and one wiring section 311D-2 as at least another first wiring section having a different size and / or shape from the wiring section 311D-1. The number of the wiring sections 311D-1 is preferably two or more, and is six in the fifth embodiment. The number of the wiring sections 311D-2 is preferably less than the number of the wiring sections 311D-1, and is one in the fifth embodiment.

[0148] The wiring section group 312D is arranged at a position away from the wiring section group 311D in the Y direction. The wiring section group 312D includes a plurality of wiring sections 312D-0 as a plurality of second wiring sections. In this embodiment, the wiring section group 312D includes seven wiring sections 312D-0. The plurality of wiring sections 312D-0 are arranged at intervals in the X direction. Each of the wiring sections 312D-0 is arranged to extend in the Z direction such that both end faces thereof in the Z direction are exposed to the outside. The material of each of the wiring sections 312D-0 is a conductive material such as copper. The plurality of wiring sections 312D-0 include, for example, six wiring sections 312D-1 as at least one second wiring section, and one wiring section 312D-2 as at least another second wiring section having a different size and / or shape from the wiring section 312D-1. The number of the wiring sections 312D-1 is preferably two or more, and is six in the fifth embodiment. The number of the wiring sections 312D-2 is preferably less than the number of the wiring sections 312D-1, and is one in the fifth embodiment.

[0149] In the manufacturing process of the imaging module in the fifth embodiment, preferably, the intermediate connection member 300D is provided with alignment marks for improving the alignment accuracy between the intermediate connection member 300D and Figure 9C the wiring board 221 shown. By providing alignment marks for the intermediate connection member 300D, the wiring sections can be arranged with high precision in the imaging module.

[0150] In addition, in the manufacturing process of the intermediate connection member 300 in the first embodiment, the insulating substrates 601 and 602 are bonded together by using an adhesive, as Figure 7CAs shown and described above. Similarly, in the fifth embodiment, in the manufacturing process of the intermediate connection member 300D, the insulating substrates corresponding to the insulating substrate portions 321D and 322D are bonded together by using an adhesive. At this time, in order to improve the alignment accuracy, it is preferable that at least one of the two insulating substrates is provided with alignment marks. By providing alignment marks for the insulating substrates, the wiring portions can be arranged in the intermediate connection member 300D with high precision.

[0151] Therefore, in the fifth embodiment, the wiring portion 311D-2 among the plurality of wiring portions 311D-0 and the wiring portion 312D-2 among the plurality of wiring portions 312D-0 are used as alignment marks. The wiring portion 311D-2 is the wiring portion located at the end in the X direction among the plurality of wiring portions 311D-0. The wiring portion 312D-2 is the wiring portion located at the end in the X direction among the plurality of wiring portions 312D-0.

[0152] The width of each of the wiring portions 311D-1 in the X direction is the width W11D. The width W11D is used as the first width. The width of the wiring portion 311D-2 in the X direction is the width W12D which is larger than the width W11D. The width W12D is used as the second width. Since, as described above, the width W12D of the wiring portion 311D-2 is larger than the width W11D of each of the wiring portions 311D-1, the wiring portion 311D-2 can be used as an alignment mark.

[0153] In addition, the thickness of each of the wiring portions 311D-1 in the Y direction is the thickness T1D. The thickness T1D is used as the first thickness. The thickness of the wiring portion 311D-2 in the Y direction is the thickness T2D which is larger than the thickness T1D. The thickness T2D is used as the second thickness. Since, as described above, the thickness T2D of the wiring portion 311D-2 is larger than the thickness T1D of the wiring portion 311D-1, the wiring portion 311D-2 can be used as an alignment mark.

[0154] Each of the wiring portions 311D-1 and 311D-2 is formed of, for example, a wire, and the diameter of the wiring portion 311D-2 is larger than the diameter of each of the wiring portions 311D-1. Therefore, the width W12D of the wiring portion 311D-2 is larger than the width W11D of each of the wiring portions 311D-1, and the thickness T2D of the wiring portion 311D-2 is larger than the thickness T1D of each of the wiring portions 311D-1.

[0155] Each of the wiring portions 312D-1 has a width W13D in the X direction. The width W13D serves as a third width. The wiring portion 312D-2 has a width W14D in the X direction that is larger than the width W13D. The width W14D serves as a fourth width. Since, as described above, the width W14D of the wiring portion 312D-2 is larger than the width W13D of the wiring portion 312D-1, the wiring portion 312D-2 can be used as an alignment mark.

[0156] In addition, each of the wiring portions 312D-1 has a thickness T3D in the Y direction. The thickness T3D serves as a third thickness. The wiring portion 312D-2 has a thickness T4D in the Y direction that is larger than the thickness T3D. The thickness T4D serves as a fourth thickness. Since, as described above, the thickness T4D of the wiring portion 312D-2 is larger than the thickness T3D of each of the wiring portions 312D-1, the wiring portion 312D-2 can be used as an alignment mark.

[0157] Each of the wiring portions 312D-1 and 312D-2 is formed of, for example, a wire, and the diameter of the wiring portion 312D-2 is larger than the diameter of the wiring portion 312D-1. Accordingly, the width W14D of the wiring portion 312D-2 is larger than the width W13D of each of the wiring portions 312D-1, and the thickness T4D of the wiring portion 312D-2 is larger than the thickness T3D of each of the wiring portions 312D-1.

[0158] In the fifth embodiment, a plurality of wiring portions 311D-0 are arranged on the insulating substrate portion 321D, and a plurality of wiring portions 312D-0 are arranged on the insulating substrate portion 322D. The configurations of the insulating substrate portion 321D on which the wiring portions 311D-0 are arranged and the insulating substrate portion 322D on which the wiring portions 312D-0 are arranged will be described in detail below. Figure 15B is an explanatory view of two insulating substrate portions 321D and 322D according to the fifth embodiment. Figure 15B is a plan view of the insulating substrate portions 321D and 322D as viewed in the Z direction.

[0159] The insulating substrate portion 321D has a surface 3211D and a surface 3212D opposite to the surface 3211D in the Y direction. The insulating substrate portion 322D has a surface 3221D and a surface 3222D opposite to the surface 3221D in the Y direction. Figure 15A The illustrated insulating layer portion 323D is disposed between the surfaces 3212D and 3222D. That is, the surfaces 3212D and 3222D face each other, with the insulating layer portion 323D therebetween.

[0160] A plurality of wiring portions 311D-0 are arranged on the surface 3212D, and a plurality of wiring portions 312D-0 are arranged on the surface 3222D. That is, the plurality of wiring portions 311D-0 are arranged between the insulating substrate portion 321D and the insulating layer portion 323D, and the plurality of wiring portions 312D-0 are arranged between the insulating substrate portion 322D and the insulating layer portion 323D.

[0161] A plurality of groove portions 31D-0 corresponding to the plurality of wiring portions 311D-0 are defined in the surface 3212D. The plurality of groove portions 31D-0 are defined at intervals in the X direction. Each of the groove portions 31D-0 extends in the Z direction. The plurality of groove portions 31D-0 include a plurality of groove portions 31D-1 corresponding to the plurality of wiring portions 311D-1 and a groove portion 31D-2 corresponding to the wiring portion 311D-2. The groove portion 31D-2 serves as the first groove portion.

[0162] Each of the wiring portions 311D-1 is arranged in a corresponding one of the groove portions 31D-1. The wiring portion 311D-2 is arranged in the groove portion 31D-2. Therefore, the width W22D of the groove portion 31D-2 in the X direction is greater than the width W21D of each of the groove portions 31D-1 in the X direction, that is, greater than the width W11D of each of the wiring portions 311D-1 in the X direction. In addition, the depth D2D of the groove portion 31D-2 in the Y direction is greater than the depth D1D of each of the groove portions 31D-1 in the Y direction, that is, greater than the thickness T1D of each of the wiring portions 311D-1 in the Y direction.

[0163] The width W21D of each of the groove portions 31D-1 is preferably greater than the width W11D of each of the wiring portions 311D-1. That is, the width W21D of each of the groove portions 31D-1 is preferably greater than 1.0 times the width W11D of each of the wiring portions 311D-1. For example, the width W21D of each of the groove portions 31D-1 is preferably 1.1 times or more the width W11D of each of the wiring portions 311D-1, can be 1.5 times or more the width W11D, or can be 2.0 times or more the width W11D. In addition, the width W21D of each of the groove portions 31D-1 is preferably 20 times or less the width W11D of each of the wiring portions 311D-1.

[0164] The width W22D of the groove portion 31D-2 is preferably greater than the width W12D of the wiring portion 311D-2. That is, the width W22D of the groove portion 31D-2 is preferably greater than 1.0 times the width W12D of the wiring portion 311D-2. For example, the width W22D of the groove portion 31D-2 is preferably 1.1 times or more the width W12D of the wiring portion 311D-2, can be 1.5 times or more the width W12D, or can be 2.0 times or more the width W12D. Additionally, the width W22D of the groove portion 31D-2 is preferably 20 times or less the width W12D of the wiring portion 311D-2.

[0165] The depth D1D of each of the groove portions 31D-1 is preferably greater than the thickness T1D of each of the wiring portions 311D-1. That is, the depth D1D of each of the groove portions 31D-1 is preferably greater than 1.0 times the thickness T1D of each of the wiring portions 311D-1. For example, the depth D1D of each of the groove portions 31D-1 is preferably 1.1 times or more the thickness T1D of each of the wiring portions 311D-1, can be 1.5 times or more the thickness T1D, or can be 2.0 times or more the thickness T1D. Additionally, the depth D1D of each of the groove portions 31D-1 is preferably 20 times or less the thickness T1D of each of the wiring portions 311D-1.

[0166] The depth D2D of the groove portion 31D-2 is preferably greater than the thickness T2D of the wiring portion 311D-2. That is, the depth D2D of the groove portion 31D-2 is preferably greater than 1.0 times the thickness T2D of the wiring portion 311D-2. For example, the depth D2D of the groove portion 31D-2 is preferably 1.1 times or more the thickness T2D of the wiring portion 311D-2, can be 1.5 times or more the thickness T2D, or can be 2.0 times or more the thickness T2D. Additionally, the depth D2D of the groove portion 31D-2 is preferably 20 times or less the thickness T2D of the wiring portion 311D-2.

[0167] A plurality of groove portions 32D-0 corresponding to the plurality of wiring portions 312D-0 are defined in the surface 3222D. The plurality of groove portions 32D-0 are defined at intervals in the X direction. Each of the groove portions 32D-0 extends in the Z direction. The plurality of groove portions 32D-0 include a plurality of groove portions 32D-1 corresponding to the plurality of wiring portions 312D-1 and a groove portion 32D-2 corresponding to the wiring portion 312D-2. The groove portion 32D-2 serves as the second groove portion.

[0168] Each of the connection portions 312D-1 is disposed in a corresponding one of the groove portions 32D-1. The connection portion 312D-2 is disposed in the groove portion 32D-2. Thus, the width W24D of the groove portion 32D-2 in the X direction is greater than the width W23D of each of the groove portions 32D-1 in the X direction, that is, greater than the width W13D of each of the connection portions 312D-1 in the X direction. In addition, the depth D4D of the groove portion 32D-2 in the Y direction is greater than the depth D3D of each of the groove portions 32D-1 in the Y direction, that is, greater than the thickness T3D of each of the connection portions 312D-1 in the Y direction.

[0169] The width W23D of each of the groove portions 32D-1 is preferably greater than the width W13D of each of the connection portions 312D-1. That is, the width W23D of each of the groove portions 32D-1 is preferably greater than 1.0 times the width W13D of each of the connection portions 312D-1. For example, the width W23D of each of the groove portions 32D-1 is preferably 1.1 times or more the width W13D of each of the connection portions 312D-1, can be 1.5 times or more the width W13D, or can be 2.0 times or more the width W13D. In addition, the width W23D of each of the groove portions 32D-1 is preferably 20 times or less the width W13D of each of the connection portions 312D-1.

[0170] The width W24D of the groove portion 32D-2 is preferably greater than the width W14D of the connection portion 312D-2. That is, the width W24D of the groove portion 32D-2 is preferably greater than 1.0 times the width W14D of the connection portion 312D-2. For example, the width W24D of the groove portion 32D-2 is preferably 1.1 times or more the width W14D of the connection portion 312D-2, can be 1.5 times or more the width W14D, or can be 2.0 times or more the width W14D. In addition, the width W24D of the groove portion 32D-2 is preferably 20 times or less the width W14D of the connection portion 312D-2.

[0171] The depth D3D of each of the groove portions 32D-1 is preferably greater than the thickness T3D of each of the wiring portions 312D-1. That is, the depth D3D of each of the groove portions 32D-1 is preferably greater than 1.0 times the thickness T3D of each of the wiring portions 312D-1. For example, the depth D3D of each of the groove portions 32D-1 is preferably 1.1 times or more, can be 1.5 times or more, or can be 2.0 times or more of the thickness T3D of each of the wiring portions 312D-1. In addition, the depth D3D of each of the groove portions 32D-1 is preferably 20 times or less of the thickness T3D of each of the wiring portions 312D-1.

[0172] The depth D4D of the groove portion 32D-2 is preferably greater than the thickness T4D of the wiring portion 312D-2. That is, the depth D4D of the groove portion 32D-2 is preferably greater than 1.0 times the thickness T4D of the wiring portion 312D-2. For example, the depth D4D of the groove portion 32D-2 is preferably 1.1 times or more, can be 1.5 times or more, or can be 2.0 times or more of the thickness T4D of the wiring portion 312D-2. In addition, the depth D4D of the groove portion 32D-2 is preferably 20 times or less of the thickness T4D of the wiring portion 312D-2.

[0173] In this way, as viewed in the Z direction, the area of the wiring portion 311D-2 is larger than the area of each of the wiring portions 311D-1, and the area of the wiring portion 312D-2 is larger than the area of each of the wiring portions 312D-1. Therefore, each of the wiring portions 311D-2 and 312D-2 serves as an alignment mark, and thus the alignment accuracy of the intermediate connection member 300D with respect to Figure 9C the shown wiring board 221 is improved. In addition, since the area of each of the wiring portions 311D-2 and 312D-2 is large as viewed in the Z direction, the self-alignment effect of the intermediate connection member 300D with respect to the wiring board 221 is improved when the intermediate connection member 300D is bonded to the wiring board 221 with solder.

[0174] In the fifth embodiment, the wiring portion 311D-2 having a width W12D and a thickness T2D and included in the plurality of wiring portions 311D-0 and the wiring portion 312D-2 having a width W14D and a thickness T4D and included in the plurality of wiring portions 312D-0 are displaced from each other in the X direction. That is, among the plurality of wiring portions 311D-0 and the plurality of wiring portions 312D-0, the distance between the wiring portions 311D-2 and 312D-2 is greater than the distance between two of the other wiring portions. Accordingly, in the manufacturing process of the imaging module in the fifth embodiment, the alignment accuracy of the intermediate connection member 300D with respect to the wiring board 221 is further improved. In addition, when the intermediate connection member 300D is bonded to the wiring board 221 with solder, the self-alignment effect of the intermediate connection member 300D with respect to the wiring board 221 is further improved. Further, in the manufacturing process of the intermediate connection member 300D, the alignment accuracy when bonding together the insulating substrate corresponding to the insulating substrate portion 321D and the insulating substrate corresponding to the insulating substrate portion 322D is further improved.

[0175] Note that although the case where each of the wiring portions 311D-2 and 312D-2 serves as an alignment mark has been described, the configuration is not limited thereto. For example, a configuration may be adopted in which the wiring portion 312D-2 and the groove portion 32D-2 can be omitted and only the wiring portion 311D-2 is used as an alignment mark. Further, in the intermediate connection member 300D, the wiring portion group 312D, that is, the plurality of wiring portions 312D-0, may be omitted. Also in this case, the wiring portion 311D-2 can be used as an alignment mark.

[0176] Further, although preferably, the width W12D of the wiring portion 311D-2 is greater than the width W11D of each of the wiring portions 311D-1 and the thickness T2D of the wiring portion 311D-2 is greater than the thickness T1D of each of the wiring portions 311D-1, the configuration is not limited thereto. For example, when the width W12D of the wiring portion 311D-2 is greater than the width W11D of each of the wiring portions 311D-1, the thickness T2D of the wiring portion 311D-2 may be equal to or less than the thickness T1D of each of the wiring portions 311D-1. In this case, preferably, the width W22D of the groove portion 31D-2 is greater than the width W21D of each of the groove portions 31D-1 and the depth D2D of the groove portion 31D-2 is equal to or less than the depth D1D of each of the groove portions 31D-1. Similarly, when the thickness T2D of the wiring portion 311D-2 is greater than the thickness T1D of each of the wiring portions 311D-1, the width W12D of the wiring portion 311D-2 may be equal to or less than the width W11D of each of the wiring portions 311D-1. In this case, preferably, the depth D2D of the groove portion 31D-2 is greater than the depth D1D of each of the groove portions 31D-1 and the width W22D of the groove portion 31D-2 is equal to or less than the width W21D of each of the groove portions 31D-1. That is, it is sufficient that the groove portion 31D-2 is a groove portion whose width is greater than the width of each of the groove portions 31D-1 (i.e., greater than the width of each of the wiring portions 311D-1) and / or whose thickness is greater than the depth of each of the groove portions 31D-1 (i.e., greater than the thickness of each of the wiring portions 311D-1). In these cases, the wiring portion 311D-2 can also be used as an alignment mark.

[0177] Similarly, although preferably the width W14D of the wiring portion 312D-2 is greater than the width W13D of each of the wiring portions 312D-1 and the thickness T4D of the wiring portion 312D-2 is greater than the thickness T3D of each of the wiring portions 312D-1, the configuration is not limited thereto. For example, in the case where the width W14D of the wiring portion 312D-2 is greater than the width W13D of each of the wiring portions 312D-1, the thickness T4D of the wiring portion 312D-2 may be equal to or less than the thickness T3D of each of the wiring portions 312D-1. In this case, preferably, the width W24D of the groove portion 32D-2 is greater than the width W23D of each of the groove portions 32D-1 and the depth D4D of the groove portion 32D-2 is equal to or less than the depth D3D of each of the groove portions 32D-1. Similarly, in the case where the thickness T4D of the wiring portion 312D-2 is greater than the thickness T3D of each of the wiring portions 312D-1, the width W14D of the wiring portion 312D-2 may be equal to or less than the width W13D of each of the wiring portions 312D-1. In this case, preferably, the depth D4D of the groove portion 32D-2 is greater than the depth D3D of each of the groove portions 32D-1 and the width W24D of the groove portion 32D-2 is equal to or less than the width W23D of each of the groove portions 32D-1. That is, it is sufficient that the groove portion 32D-2 is a groove portion whose width is greater than the width of each of the groove portions 32D-1 (i.e., greater than the width of each of the wiring portions 312D-1) and / or whose thickness is greater than the depth of each of the groove portions 32D-1 (i.e., greater than the thickness of each of the wiring portions 312D-1). In these cases, the wiring portion 312D-2 can also be used as an alignment mark.

[0178] In addition, although the case where the wiring portion group 311D (i.e., a plurality of wiring portions 311D-0) includes one wiring portion 311D-2 has been described, the configuration is not limited thereto, and the wiring portion group 311D may include two or more wiring portions 311D-2. In this case, preferably, each of the two wiring portions positioned at the corresponding ends in the X direction among the plurality of wiring portions 311D-0 is a wiring portion 311D-2.

[0179] Similarly, although the case where the wiring portion group 312D (i.e., a plurality of wiring portions 312D-0) includes one wiring portion 312D-2 has been described, the configuration is not limited thereto, and the wiring portion group 312D may include two or more wiring portions 312D-2. In this case, preferably, each of the two wiring portions positioned at the corresponding ends in the X direction among the plurality of wiring portions 312D-0 is a wiring portion 312D-2.

[0180] In addition, although each of the plurality of connection portions 311D-0 has been described as being a wire, the configuration is not limited thereto. As long as each of the plurality of connection portions 311D-0 is formed of a conductive material, the plurality of connection portions 311D-0 can be in any form. Therefore, for example, a configuration can be adopted in which part or all of the plurality of connection portions 311D-0 are formed of conductor patterns.

[0181] Similarly, although each of the plurality of connection portions 312D-0 has been described as being a wire, the configuration is not limited thereto. As long as each of the plurality of connection portions 312D-0 is formed of a conductive material, the plurality of connection portions 312D-0 can be in any form. Therefore, for example, a configuration can be adopted in which part or all of the plurality of connection portions 312D-0 are formed of conductor patterns.

[0182] In addition, although the connection portions 311D-2 and 312D-2 have been described as being disposed in the groove portions 31D-2 and 32D-2, respectively, the configuration is not limited thereto, and one or both of the connection portions 311D-2 and 312D-2 can be omitted. In this case, the groove portion in which the connection portion is not provided can be used as an alignment mark. It should be noted that the groove portion in which the connection portion is not provided is filled with a part of the insulating layer portion 323D.

[0183] Sixth Embodiment

[0184] Next, the intermediate connection member of the sixth embodiment will be described. Figure 16A is a perspective view of the intermediate connection member 300E according to the sixth embodiment. It should be noted that the configuration and manufacturing method of the intermediate connection member 300E of the sixth embodiment are substantially the same as the configuration and manufacturing method of the intermediate connection member 300B of the third embodiment. That is, the manufacturing method for the intermediate connection member 300E of the sixth embodiment is substantially the same as the manufacturing method for the intermediate connection member 300 of the first embodiment.

[0185] The intermediate connection member 300E includes a wiring portion group 311E and a wiring portion group 312E. Additionally, the intermediate connection member 300E includes an insulating substrate portion 321E, an insulating substrate portion 322E, and an insulating layer portion 323E. The insulating substrate portion 321E serves as a first insulating substrate portion, and the insulating substrate portion 322E serves as a second insulating substrate portion. The insulating substrate portions 321E and 322E face each other, with the insulating layer portion 323E positioned between the insulating substrate portions 321E and 322E. The insulating substrate portions 321E and 322E are formed of the same material (e.g., glass epoxy resin) as the insulating substrate portions 321 and 322 described in the first embodiment. The insulating layer portion 323E is formed of a material different from that of the insulating substrate portions 321E and 322E and the same material (e.g., a solidified adhesive containing epoxy resin or silicone resin as a main component) as the insulating layer portion 323 described in the first embodiment.

[0186] In the sixth embodiment, the wiring portion group 311E includes a plurality of wiring portions 311E-0 as a plurality of first wiring portions. For example, in the present embodiment, the wiring portion group 311E includes seven wiring portions 311E-0. The plurality of wiring portions 311E-0 are arranged at a certain distance apart in the X direction. Each of the wiring portions 311E-0 is arranged to extend in the Z direction such that both end faces thereof in the Z direction are exposed to the outside. The material of each of the wiring portions 311E-0 is a conductive material such as copper. The plurality of wiring portions 311E-0 include, for example, six wiring portions 311E-1 as at least one first wiring portion, and one wiring portion 311E-2 as at least another first wiring portion having a different size and / or shape from the wiring portion 311E-1. The number of the wiring portions 311E-1 is preferably greater than or equal to 2, and is 6 in the sixth embodiment. The number of the wiring portions 311E-2 is preferably less than the number of the wiring portions 311E-1, and is 1 in the sixth embodiment.

[0187] The wiring section group 312E is arranged at a position away from the wiring section group 311E in the Y direction. The wiring section group 312E includes a plurality of wiring sections 312E-0 as a plurality of second wiring sections. For example, in the present embodiment, the wiring section group 312E includes seven wiring sections 312E-0. The plurality of wiring sections 312E-0 are arranged at intervals in the X direction. Each of the wiring sections 312E-0 is arranged to extend in the Z direction such that both end faces thereof in the Z direction are exposed to the outside. The material of each of the wiring sections 312E-0 is a conductive material such as copper. The plurality of wiring sections 312E-0 include, for example, six wiring sections 312E-1 as at least one second wiring section, and one wiring section 312E-2 as at least another second wiring section having a different size and / or shape from the wiring section 312E-1. The number of the wiring sections 312E-1 is preferably greater than or equal to 2, and is 6 in the sixth embodiment. The number of the wiring sections 312E-2 is preferably less than the number of the wiring sections 312E-1, and is 1 in the sixth embodiment.

[0188] Here, in the manufacturing process of the electronic module, the intermediate connection member needs to be accurately aligned with respect to the wiring board to which the intermediate connection member is to be joined. Therefore, in the manufacturing process of the camera module in the sixth embodiment, preferably, the intermediate connection member 300E is provided with alignment marks for improving the alignment accuracy between the intermediate connection member 300E and Figure 9C the wiring board 221 shown. By providing alignment marks for the intermediate connection member 300E, the wiring sections can be arranged in the camera module with high accuracy.

[0189] In addition, in the manufacturing process of the intermediate connection member 300E in the sixth embodiment, the insulating substrate corresponding to the insulating substrate portion 321E and the insulating substrate corresponding to the insulating substrate portion 322E are bonded together by using an adhesive. At this time, in order to improve the alignment accuracy, preferably, at least one of the two insulating substrates is provided with alignment marks. By providing alignment marks for the insulating substrate, the wiring sections can be arranged in the intermediate connection member 300E with high accuracy.

[0190] Therefore, in the sixth embodiment, the wiring section 311E-2 among the plurality of wiring sections 311E-0 and the wiring section 312E-2 among the plurality of wiring sections 312E-0 are used as alignment marks. The wiring section 311E-2 is the wiring section located at the end in the X direction among the plurality of wiring sections 311E-0. The wiring section 312E-2 is the wiring section located at the end in the X direction among the plurality of wiring sections 312E-0.

[0191] Each of the wiring portions 311E-1 has a width W11E in the X direction. The width W11E is used as a first width. The wiring portion 311E-2 has a width W12E in the X direction that is larger than the width W11E. The width W12E is used as a second width. Since, as described above, the width W12E of the wiring portion 311E-2 is larger than the width W11E of each of the wiring portions 311E-1, the wiring portion 311E-2 can be used as an alignment mark.

[0192] In addition, each of the wiring portions 311E-1 has a thickness T1E in the Y direction. The thickness T1E is used as a first thickness. The wiring portion 311E-2 has a thickness T2E in the Y direction that is larger than the thickness T1E. The thickness T2E is used as a second thickness. Since, as described above, the thickness T2E of the wiring portion 311E-2 is larger than the thickness T1E of each of the wiring portions 311E-1, the wiring portion 311E-2 can be used as an alignment mark.

[0193] Each of the wiring portions 311E-1 and 311E-2 is formed of, for example, a wire, and the diameter of the wiring portion 311E-2 is larger than the diameter of the wiring portion 311E-1. Accordingly, the width W12E of the wiring portion 311E-2 is larger than the width W11E of each of the wiring portions 311E-1, and the thickness T2E of the wiring portion 311E-2 is larger than the thickness T1E of each of the wiring portions 311E-1.

[0194] Each of the wiring portions 312E-1 has a width W13E in the X direction. The width W13E is used as a third width. The wiring portion 312E-2 has a width W14E in the X direction that is larger than the width W13E. The width W14E is used as a fourth width. Since, as described above, the width W14E of the wiring portion 312E-2 is larger than the width W13E of each of the wiring portions 312E-1, the wiring portion 312E-2 can be used as an alignment mark.

[0195] In addition, each of the wiring portions 312E-1 has a thickness T3E in the Y direction. The thickness T3E is used as a third thickness. The wiring portion 312E-2 has a thickness T4E in the Y direction that is larger than the thickness T3E. The thickness T4E is used as a fourth thickness. Since, as described above, the thickness T4E of the wiring portion 312E-2 is larger than the thickness T3E of each of the wiring portions 312E-1, the wiring portion 312E-2 can be used as an alignment mark.

[0196] Each of the connection portions 312E-1 and 312E-2 is formed of, for example, a wire, and the diameter of the connection portion 312E-2 is larger than that of each of the connection portions 312E-1. Therefore, the width W14E of the connection portion 312E-2 is larger than the width W13E of each of the connection portions 312E-1, and the thickness T4E of the connection portion 312E-2 is larger than the thickness T3E of each of the connection portions 312E-1.

[0197] In the sixth embodiment, a plurality of connection portions 311E-0 are arranged on the insulating substrate portion 321E, and a plurality of connection portions 312E-0 are arranged on the insulating substrate portion 322E. The structures of the insulating substrate portion 321E on which the connection portions 311E-0 are arranged and the insulating substrate portion 322E on which the connection portions 312E-0 are arranged will be described in detail below. Figure 16B is an explanatory view of two insulating substrate portions 321E and 322E according to the sixth embodiment. Figure 16B is a plan view of the insulating substrate portions 321E and 322E as viewed in the Z direction.

[0198] The insulating substrate portion 321E has a surface 3211E and a surface 3212E opposite to the surface 3211E. The insulating substrate portion 322E has a surface 3221E and a surface 3222E opposite to the surface 3221E. Figure 16A The illustrated insulating layer portion 323E is disposed between the surfaces 3212E and 3222E. That is, the surfaces 3212E and 3222E face each other, with the insulating layer portion 323E located between the surfaces 3212E and 3222E.

[0199] A plurality of connection portions 311E-0 are arranged on the surface 3211E, and a plurality of connection portions 312E-0 are arranged on the surface 3221E. That is, a plurality of connection portions 311E-0 are arranged on the outer surface 3211E of the insulating substrate portion 321E, and a plurality of connection portions 312E-0 are arranged on the outer surface 3221E of the insulating substrate portion 322E. It should be noted that an insulating layer (not shown) may be provided on each of the surfaces 3211E and 3221E.

[0200] A plurality of groove portions 31E-0 corresponding to the plurality of connection portions 311E-0 are defined in the surface 3211E. The plurality of groove portions 31E-0 are defined at intervals in the X direction. Each of the groove portions 31E-0 extends in the Z direction. The plurality of groove portions 31E-0 include a plurality of groove portions 31E-1 corresponding to the plurality of connection portions 311E-1 and a groove portion 31E-2 corresponding to the connection portion 311E-2. The groove portion 31E-2 serves as the first groove portion.

[0201] Each of the wiring portions 311E-1 is disposed in a corresponding one of the groove portions 31E-1. The wiring portion 311E-2 is disposed in the groove portion 31E-2. Accordingly, the width W22E of the groove portion 31E-2 in the X direction is greater than the width W21E of each of the groove portions 31E-1 in the X direction, that is, greater than the width W11E of each of the wiring portions 311E-1 in the X direction. In addition, the depth D2E of the groove portion 31E-2 in the Y direction is greater than the depth D1E of each of the groove portions 31E-1 in the Y direction, that is, greater than the thickness T1E of each of the wiring portions 311E-1 in the Y direction.

[0202] The width W21E of each of the groove portions 31E-1 is preferably greater than the width W11E of each of the wiring portions 311E-1. That is, the width W21E of each of the groove portions 31E-1 is preferably greater than 1.0 times the width W11E of each of the wiring portions 311E-1. For example, the width W21E of each of the groove portions 31E-1 is preferably 1.1 times or more the width W11E of each of the wiring portions 311E-1, may be 1.5 times or more the width W11E, or may be 2.0 times or more the width W11E. In addition, the width W21E of each of the groove portions 31E-1 is preferably 20 times or less the width W11E of each of the wiring portions 311E-1.

[0203] The width W22E of the groove portion 31E-2 is preferably greater than the width W12E of the wiring portion 311E-2. That is, the width W22E of the groove portion 31E-2 is preferably greater than 1.0 times the width W12E of the wiring portion 311E-2. For example, the width W22E of the groove portion 31E-2 is preferably 1.1 times or more the width W12E of the wiring portion 311E-2, may be 1.5 times or more the width W12E, or may be 2.0 times or more the width W12E. In addition, the width W22E of the groove portion 31E-2 is preferably 20 times or less the width W12E of the wiring portion 311E-2.

[0204] The depth D1E of each of the groove portions 31E-1 is preferably greater than the thickness T1E of each of the wiring portions 311E-1. That is, the depth D1E of each of the groove portions 31E-1 is preferably greater than 1.0 times the thickness T1E of each of the wiring portions 311E-1. For example, the depth D1E of each of the groove portions 31E-1 is preferably 1.1 times or more the thickness T1E of each of the wiring portions 311E-1, may be 1.5 times or more the thickness T1E, or may be 2.0 times or more the thickness T1E. Additionally, the depth D1E of each of the groove portions 31E-1 is preferably 20 times or less the thickness T1E of each of the wiring portions 311E-1.

[0205] The depth D2E of the groove portion 31E-2 is preferably greater than the thickness T2E of the wiring portion 311E-2. That is, the depth D2E of the groove portion 31E-2 is preferably greater than 1.0 times the thickness T2E of the wiring portion 311E-2. For example, the depth D2E of the groove portion 31E-2 is preferably 1.1 times or more the thickness T2E of the wiring portion 311E-2, may be 1.5 times or more the thickness T2E, or may be 2.0 times or more the thickness T2E. Additionally, the depth D2E of the groove portion 31E-2 is preferably 20 times or less the thickness T2E of the wiring portion 311E-2.

[0206] A plurality of groove portions 32E-0 corresponding to the plurality of wiring portions 312E-0 are defined in the surface 3221E. The plurality of groove portions 32E-0 are defined at intervals in the X direction. Each of the groove portions 32E-0 extends in the Z direction. The plurality of groove portions 32E-0 include a plurality of groove portions 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove portion 32E-2 corresponding to the wiring portion 312E-2. The groove portion 32E-2 serves as a second groove portion.

[0207] Each of the wiring portions 312E-1 is disposed in a corresponding one of the groove portions 32E-1. The wiring portion 312E-2 is disposed in the groove portion 32E-2. Accordingly, the width W24E of the groove portion 32E-2 in the X direction is greater than the width W23E of each of the groove portions 32E-1 in the X direction, that is, greater than the width W13E of each of the wiring portions 312E-1 in the X direction. Additionally, the depth D4E of the groove portion 32E-2 in the Y direction is greater than the depth D3E of each of the groove portions 32E-1 in the Y direction, that is, greater than the thickness T3E of each of the wiring portions 312E-1 in the Y direction.

[0208] The width W23E of each of the groove portions 32E-1 is preferably greater than the width W13E of each of the wiring portions 312E-1. That is, the width W23E of each of the groove portions 32E-1 is preferably greater than 1.0 times the width W13E of each of the wiring portions 312E-1. For example, the width W23E of each of the groove portions 32E-1 is preferably 1.1 times or more the width W13E of each of the wiring portions 312E-1, can be 1.5 times or more the width W13E, or can be 2.0 times or more the width W13E. Additionally, the width W23E of each of the groove portions 32E-1 is preferably 20 times or less the width W13E of each of the wiring portions 312E-1.

[0209] The width W24E of the groove portion 32E-2 is preferably greater than the width W14E of the wiring portion 312E-2. That is, the width W24E of the groove portion 32E-2 is preferably greater than 1.0 times the width W14E of the wiring portion 312E-2. For example, the width W24E of the groove portion 32E-2 is preferably 1.1 times or more the width W14E of the wiring portion 312E-2, can be 1.5 times or more the width W14E, or can be 2.0 times or more the width W14E. Additionally, the width W24E of the groove portion 32E-2 is preferably 20 times or less the width W14E of the wiring portion 312E-2.

[0210] The depth D3E of each of the groove portions 32E-1 is preferably greater than the thickness T3E of each of the wiring portions 312E-1. That is, the depth D3E of each of the groove portions 32E-1 is preferably greater than 1.0 times the thickness T3E of each of the wiring portions 312E-1. For example, the depth D3E of each of the groove portions 32E-1 is preferably 1.1 times or more the thickness T3E of each of the wiring portions 312E-1, can be 1.5 times or more the thickness T3E, or can be 2.0 times or more the thickness T3E. Additionally, the depth D3E of each of the groove portions 32E-1 is preferably 20 times or less the thickness T3E of each of the wiring portions 312E-1.

[0211] The depth D4E of the groove portion 32E-2 is preferably greater than the thickness T4E of the wiring portion 312E-2. That is, the depth D4E of the groove portion 32E-2 is preferably greater than 1.0 times the thickness T4E of the wiring portion 312E-2. For example, the depth D4E of the groove portion 32E-2 is preferably 1.1 times or more the thickness T4E of the wiring portion 312E-2, can be 1.5 times or more the thickness T4E, or can be 2.0 times or more the thickness T4E. Additionally, the depth D4E of the groove portion 32E-2 is preferably 20 times or less the thickness T4E of the wiring portion 312E-2.

[0212] In this way, when observed in the Z direction, the area of the wiring portion 311E-2 is larger than the area of each of the wiring portions 311E-1, and the area of the wiring portion 312E-2 is larger than the area of each of the wiring portions 312E-1. Accordingly, each of the wiring portions 311E-2 and 312E-2 serves as an alignment mark, and thus the alignment accuracy of the intermediate connection member 300E with respect to Figure 9C the wiring board 221 shown is improved. Additionally, since the area of each of the wiring portions 311E-2 and 312E-2 is large when observed in the Z direction, the self-alignment effect of the intermediate connection member 300E with respect to the wiring board 221 is improved when the intermediate connection member 300E is bonded to the wiring board 221 with solder.

[0213] In the sixth embodiment, the wiring portion 311E-2 having a width W12E and a thickness T2E and included in the plurality of wiring portions 311E-0 and the wiring portion 312E-2 having a width W14E and a thickness T4E and included in the plurality of wiring portions 312E-0 are displaced from each other in the X direction. That is, among the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0, the distance between the wiring portions 311E-2 and 312E-2 is greater than the distance between two of the other wiring portions. Accordingly, the alignment accuracy of the intermediate connection member 300E with respect to the wiring board 221 is further improved during the manufacturing process of the imaging module in the sixth embodiment. Additionally, when the intermediate connection member 300E is bonded to the wiring board 221 with solder, the self-alignment effect of the intermediate connection member 300E with respect to the wiring board 221 is further improved. Furthermore, the alignment accuracy when bonding the insulating substrate corresponding to the insulating substrate portion 321E and the insulating substrate corresponding to the insulating substrate portion 322E together during the manufacturing process of the intermediate connection member 300E is further improved.

[0214] Note that, although the case where each of the wiring portions 311E-2 and 312E-2 is used as an alignment mark has been described, the configuration is not limited thereto. For example, a configuration may be adopted in which the wiring portion 312E-2 and the groove portion 32E-2 are omitted and only the wiring portion 311E-2 is used as an alignment mark. Further, in the intermediate connection member 300E, the wiring portion group 312E, i.e., a plurality of wiring portions 312E-0, may be omitted. Also in this case, the wiring portion 311E-2 can be used as an alignment mark.

[0215] Further, although preferably the width W12E of the wiring portion 311E-2 is greater than the width W11E of each of the wiring portions 311E-1 and the thickness T2E of the wiring portion 311E-2 is greater than the thickness T1E of each of the wiring portions 311E-1, the configuration is not limited thereto. For example, when the width W12E of the wiring portion 311E-2 is greater than the width W11E of each of the wiring portions 311E-1, the thickness T2E of the wiring portion 311E-2 may be equal to or less than the thickness T1E of each of the wiring portions 311E-1. In this case, preferably the width W22E of the groove portion 31E-2 is greater than the width W21E of each of the groove portions 31E-1 and the depth D2E of the groove portion 31E-2 is equal to or less than the depth D1E of each of the groove portions 31E-1. Similarly, when the thickness T2E of the wiring portion 311E-2 is greater than the thickness T1E of each of the wiring portions 311E-1, the width W12E of the wiring portion 311E-2 may be equal to or less than the width W11E of each of the wiring portions 311E-1. In this case, preferably the depth D2E of the groove portion 31E-2 is greater than the depth D1E of each of the groove portions 31E-1 and the width W22E of the groove portion 31E-2 is equal to or less than the width W21E of each of the groove portions 31E-1. That is, it is sufficient that the groove portion 31E-2 is a groove portion whose width is greater than the width of each of the groove portions 31E-1 (i.e., greater than the width of each of the wiring portions 311E-1) and / or whose thickness is greater than the depth of each of the groove portions 31E-1 (i.e., greater than the thickness of each of the wiring portions 311E-1). In these cases, the wiring portion 311E-2 can also be used as an alignment mark.

[0216] Similarly, although it is preferable that the width W14E of the wiring portion 312E-2 is greater than the width W13E of each of the wiring portions 312E-1 and the thickness T4E of the wiring portion 312E-2 is greater than the thickness T3E of each of the wiring portions 312E-1, the configuration is not limited thereto. For example, when the width W14E of the wiring portion 312E-2 is greater than the width W13E of each of the wiring portions 312E-1, the thickness T4E of the wiring portion 312E-2 may be equal to or less than the thickness T3E of each of the wiring portions 312E-1. In this case, it is preferable that the width W24E of the groove portion 32E-2 is greater than the width W23E of each of the groove portions 32E-1 and the depth D4E of the groove portion 32E-2 is equal to or less than the depth D3E of each of the groove portions 32E-1. Similarly, when the thickness T4E of the wiring portion 312E-2 is greater than the thickness T3E of each of the wiring portions 312E-1, the width W14E of the wiring portion 312E-2 may be equal to or less than the width W13E of each of the wiring portions 312E-1. In this case, it is preferable that the depth D4E of the groove portion 32E-2 is greater than the depth D3E of each of the groove portions 32E-1 and the width W24E of the groove portion 32E-2 is equal to or less than the width W23E of each of the groove portions 32E-1. That is, it is sufficient that the groove portion 32E-2 is a groove portion whose width is greater than the width of each of the groove portions 32E-1 (i.e., greater than the width of each of the wiring portions 312E-1) and / or whose thickness is greater than the depth of each of the groove portions 32E-1 (i.e., greater than the thickness of each of the wiring portions 312E-1). In these cases, the wiring portion 312E-2 can also be used as an alignment mark.

[0217] In addition, although the case where the wiring portion group 311E (i.e., a plurality of wiring portions 311E-0) includes one wiring portion 311E-2 has been described, the configuration is not limited thereto, and the wiring portion group 311E may include two or more wiring portions 311E-2. In this case, it is preferable that each of the two wiring portions positioned at the corresponding ends in the X direction among the plurality of wiring portions 311E-0 is a wiring portion 311E-2.

[0218] Similarly, although the case where the wiring portion group 312E (i.e., a plurality of wiring portions 312E-0) includes one wiring portion 312E-2 has been described, the configuration is not limited thereto, and the wiring portion group 312E may include two or more wiring portions 312E-2. In this case, it is preferable that each of the two wiring portions positioned at the corresponding ends in the X direction among the plurality of wiring portions 312E-0 is a wiring portion 312E-2.

[0219] In addition, although it has been described that each of the plurality of wiring portions 311E-0 is a wire, the configuration is not limited thereto. As long as each of the plurality of wiring portions 311E-0 is formed of a conductive material, the plurality of wiring portions 311E-0 can be in any form. Therefore, for example, a configuration can be adopted in which part or all of the plurality of wiring portions 311E-0 are formed of conductor patterns.

[0220] Similarly, although it has been described that each of the plurality of wiring portions 312E-0 is a wire, the configuration is not limited thereto. As long as each of the plurality of wiring portions 312E-0 is formed of a conductive material, the plurality of wiring portions 312E-0 can be in any form. Therefore, for example, a configuration can be adopted in which part or all of the plurality of wiring portions 312E-0 are formed of conductor patterns.

[0221] Figure 17A and Figure 17B are explanatory diagrams of the intermediate connection members 300E-1 and 300E-2 of the modification examples, respectively. Although it has been described in the sixth embodiment that the wiring portions 311E-2 and 312E-2 are respectively arranged in the groove portions 31E-2 and 32E-2, the configuration is not limited thereto, and Figure 16A one or both of the shown wiring portions 311E-2 and 312E-2 can be omitted. In Figure 17A and Figure 17B of the modification examples, both the wiring portions 311E-2 and 312E-2 are omitted. Figure 17A The groove portions 31E-2 and 32E-2 of the shown intermediate connection member 300E-1 are not filled with anything and each serves as an alignment mark.

[0222] In addition, Figure 17B the groove portions 31E-2 and 32E-2 of the shown intermediate connection member 300E-2 are respectively filled with insulators 324E and 325E. Each of the insulators 324E and 325E is an insulator formed of a material or color different from that of the insulating substrate portions 321E and 322E, and each serves as an alignment mark.

[0223] Seventh Embodiment

[0224] Next, the intermediate connection member of the seventh embodiment will be described. Figure 18AThis is a perspective view of the intermediate connection member 300F according to the seventh embodiment. It should be noted that the intermediate connection member 300F of the seventh embodiment has a structure in which the insulating substrate portion 321F is used instead of the insulating substrate portions 321E and 322E and the insulating layer portion 323E of the intermediate connection member 300E of the sixth embodiment. In the manufacturing method of the intermediate connection member 300F of the seventh embodiment, the step of bonding the insulating substrate portions 321E and 322E together is omitted from the manufacturing method of the intermediate connection member 300E of the sixth embodiment.

[0225] Similar to the sixth embodiment, the intermediate connection member 300F includes a wiring portion group 311E and a wiring portion group 312E. In addition, the intermediate connection member 300F includes an insulating substrate portion 321F. The insulating substrate portion 321F serves as a first insulating substrate portion. The insulating substrate portion 321F is formed of the same material (e.g., glass epoxy resin) as the insulating substrate portions 321 and 322 described in the first embodiment.

[0226] In the seventh embodiment, the wiring portion group 311E includes a plurality of wiring portions 311E-0 as a plurality of first wiring portions. For example, in the present embodiment, the wiring portion group 311E includes seven wiring portions 311E-0. The material of each of the wiring portions 311E-0 is a conductive material such as copper. The plurality of wiring portions 311E-0 includes at least one (e.g., six) wiring portion 311E-1 and at least another (e.g., one) wiring portion 311E-2. The wiring portion group 312E is arranged at a position away from the wiring portion group 311E in the Y direction. The wiring portion group 312E includes a plurality of wiring portions 312E-0 as a plurality of second wiring portions. For example, in the present embodiment, the wiring portion group 312E includes seven wiring portions 312E-0. The plurality of wiring portions 312E-0 includes at least one (e.g., six) wiring portion 312E-1 and at least another (e.g., one) wiring portion 312E-2.

[0227] In the manufacturing process of the imaging module in the seventh embodiment, preferably, the intermediate connection member 300F is provided with alignment marks for improving the alignment accuracy between the intermediate connection member 300F and Figure 9C the wiring board 221 shown. By providing alignment marks for the intermediate connection member 300F, the wiring portions can be arranged with high precision in the imaging module.

[0228] Therefore, in the seventh embodiment, the wiring portion 311E-2 among the plurality of wiring portions 311E-0 and the wiring portion 312E-2 among the plurality of wiring portions 312E-0 are used as alignment marks. The wiring portion 311E-2 is a wiring portion positioned at an end portion in the X direction among the plurality of wiring portions 311E-0. The wiring portion 312E-2 is a wiring portion positioned at an end portion in the X direction among the plurality of wiring portions 312E-0. Each of the wiring portions 311E-1, 311E-2, 312E-1, and 312E-2 has the width and thickness described in the sixth embodiment.

[0229] Each of the wiring portions 311E-0 and 312E-0 is formed of, for example, a wire. In the seventh embodiment, the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0 are arranged on the same insulating substrate portion 321F. The structure of the insulating substrate portion 321F on which the wiring portions 311E-0 and 312E-0 are arranged will be described in detail below. Figure 18A is an explanatory view of the insulating substrate portion 321F according to the seventh embodiment. Figure 18B is a plan view of the insulating substrate portion 321F as viewed in the Z direction. The insulating substrate portion 321F has a surface 3211F and a surface 3212F opposite to the surface 3211F in the Y direction.

[0230] The plurality of wiring portions 311E-0 are arranged on the surface 3211F, and the plurality of wiring portions 312E-0 are arranged on the surface 3212F. That is, the plurality of wiring portions 311E-0 are arranged on the outer surface 3211F of the insulating substrate portion 321F, and the plurality of wiring portions 312E-0 are arranged on the outer surface 3212F of the insulating substrate portion 321F. It should be noted that an insulating layer (not shown) may be provided on each of the surfaces 3211F and 3212F.

[0231] A plurality of groove portions 31E-0 that are constructed in substantially the same manner as in the sixth embodiment and correspond to the plurality of wiring portions 311E-0 are defined in the surface 3211F. The plurality of groove portions 31E-0 are defined at regular intervals in the X direction. Each of the groove portions 31E-0 extends in the Z direction. The plurality of groove portions 31E-0 include a plurality of groove portions 31E-1 corresponding to the plurality of wiring portions 311E-1 and a groove portion 31E-2 corresponding to the wiring portion 311E-2. The groove portion 31E-2 serves as the first groove portion. Each of the wiring portions 311E-1 is arranged in a corresponding one of the groove portions 31E-1. The wiring portion 311E-2 is arranged in the groove portion 31E-2.

[0232] A plurality of groove portions 32E-0, which are constructed in substantially the same manner as in the sixth embodiment and correspond to the plurality of wiring portions 312E-0, are defined in the surface 3212F. The plurality of groove portions 32E-0 are defined at intervals in the X direction. Each of the groove portions 32E-0 extends in the Z direction. The plurality of groove portions 32E-0 include a plurality of groove portions 32E-1 corresponding to the plurality of wiring portions 312E-1 and a groove portion 32E-2 corresponding to the wiring portion 312E-2. The groove portion 32E-2 serves as the second groove portion. Each of the wiring portions 312E-1 is disposed in a corresponding one of the groove portions 32E-1. The wiring portion 312E-2 is disposed in the groove portion 32E-2.

[0233] In the seventh embodiment, each of the groove portion 31E-1, the groove portion 31E-2, the set portion 32E-1, and the groove portion 32E-2 has the width and depth described in the sixth embodiment.

[0234] In this way, when viewed in the Z direction, the area of the wiring portion 311E-2 is larger than the area of each of the wiring portions 311E-1, and the area of the wiring portion 312E-2 is larger than the area of each of the wiring portions 312E-1. Accordingly, each of the wiring portions 311E-2 and 312E-2 serves as an alignment mark, and thus the alignment accuracy of the intermediate connection member 300F with respect to Figure 9C the wiring board 221 shown is improved. In addition, since the area of each of the wiring portions 311E-2 and 312E-2 is large when viewed in the Z direction, the self-alignment effect of the intermediate connection member 300F with respect to the wiring board 221 is improved when the intermediate connection member 300F is bonded to the wiring board 221 with solder.

[0235] In the seventh embodiment, the wiring portion 311E-2 included in the plurality of wiring portions 311E-0 and the wiring portion 312E-2 included in the plurality of wiring portions 312E-0 are displaced from each other in the X direction. That is, among the plurality of wiring portions 311E-0 and the plurality of wiring portions 312E-0, the distance between the wiring portions 311E-2 and 312E-2 is greater than the distance between two of the other wiring portions. Accordingly, the alignment accuracy of the intermediate connection member 300F with respect to the wiring board 221 is further improved in the manufacturing process of the imaging module in the seventh embodiment.

[0236] It should be noted that modifications similar to the modification example of the sixth embodiment are applicable to the seventh embodiment.

[0237] Eighth Embodiment

[0238] Next, the intermediate connection member of the eighth embodiment will be described. Figure 19This is a perspective view of the intermediate connection member 300G according to the eighth embodiment.

[0239] The intermediate connection member 300G includes a wiring portion group 311G and a wiring portion group 312G. In addition, the intermediate connection member 300G includes an insulating substrate portion 321G that serves as a first insulating substrate portion. The insulating substrate portion 321G is formed of the same material (e.g., glass epoxy resin) as the insulating substrate portions 321 and 322 described in the first embodiment.

[0240] In the eighth embodiment, the wiring portion group 311G includes a plurality of wiring portions 311G-0 as a plurality of first wiring portions. For example, in the present embodiment, the wiring portion group 311G includes seven wiring portions 311G-0. The material of each of the wiring portions 311G-0 is a conductive material such as copper. The plurality of wiring portions 311G-0 includes at least one (e.g., six) wiring portion 311G-1 and at least another (e.g., one) wiring portion 311G-2. The wiring portion group 312G is disposed at a position away from the wiring portion group 311G in the Y direction. The wiring portion group 312G includes a plurality of wiring portions 312G-0 as a plurality of second wiring portions. For example, in the present embodiment, the wiring portion group 312G includes seven wiring portions 312G-0. The plurality of wiring portions 312G-0 includes at least another (e.g., six) wiring portion 312G-1 and at least one (e.g., one) wiring portion 312G-2.

[0241] In the manufacturing process of the imaging module in the eighth embodiment, preferably, the intermediate connection member 300G is provided with alignment marks for improving the alignment accuracy between the intermediate connection member 300G and Figure 9C the wiring board 221 shown. By providing alignment marks for the intermediate connection member 300G, the wiring portions can be arranged with high precision in the imaging module.

[0242] Therefore, in the eighth embodiment, the wiring portion 311G-2 among the plurality of wiring portions 311G-0 and the wiring portion 312G-2 among the plurality of wiring portions 312G-0 serve as alignment marks. The wiring portion 311G-2 is the wiring portion located at the end portion in the X direction among the plurality of wiring portions 311G-0. The wiring portion 312G-2 is the wiring portion located at the end portion in the X direction among the plurality of wiring portions 312G-0. Each of the wiring portions 311G-1, 311G-2, 312G-1, and 312G-2 has the width and thickness described in the sixth embodiment.

[0243] Each of the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0 is formed of, for example, a conductor pattern. In the eighth embodiment, the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0 are arranged on the same insulating substrate portion 321G.

[0244] The insulating substrate portion 321G has a surface 3211G and a surface 3212G that faces the surface 3211G in the Y direction. The plurality of wiring portions 311G-0 are arranged on the surface 3211G, and the plurality of wiring portions 312G-0 are arranged on the surface 3212G. That is, the plurality of wiring portions 311G-0 are arranged on the outer surface 3211G of the insulating substrate portion 321G, and the plurality of wiring portions 312G-0 are arranged on the outer surface 3212G of the insulating substrate portion 321G. Note that an insulating layer (not shown) may be provided on each of the surfaces 3211G and 3212G.

[0245] In this way, as viewed in the Z direction, the area of the wiring portion 311G-2 is larger than the area of each of the wiring portions 311G-1, and the area of the wiring portion 312G-2 is larger than the area of each of the wiring portions 312G-1. Therefore, each of the wiring portions 311G-2 and 312G-2 serves as an alignment mark, and thus the alignment accuracy of the intermediate connection member 300G with respect to Figure 9C the wiring board 221 shown is improved. In addition, since the area of each of the wiring portions 311G-2 and 312G-2 is large as viewed in the Z direction, the self-alignment effect of the intermediate connection member 300G with respect to the wiring board 221 is improved when the intermediate connection member 300G is bonded to the wiring board 221 with solder.

[0246] In the eighth embodiment, the wiring portion 311G-2 included in the plurality of wiring portions 311G-0 and the wiring portion 312G-2 included in the plurality of wiring portions 312G-0 are displaced from each other in the X direction. That is, among the plurality of wiring portions 311G-0 and the plurality of wiring portions 312G-0, the distance between the wiring portions 311G-2 and 312G-2 is greater than the distance between two of the other wiring portions. Therefore, the alignment accuracy of the intermediate connection member 300G with respect to the wiring board 221 is further improved in the manufacturing process of the imaging module in the eighth embodiment.

[0247] Note that, although the case where each of the wiring portions 311G-2 and 312G-2 serves as an alignment mark has been described in the eighth embodiment, the configuration is not limited thereto. For example, a configuration may be adopted in which the wiring portion 312G-2 is omitted and only the wiring portion 311G-2 is used as an alignment mark. Further, in the intermediate connection member 300G, the wiring portion group 312G, that is, a plurality of wiring portions 312G-0, may be omitted. Also in this case, the wiring portion 311G-2 can be used as an alignment mark.

[0248] Further, the width and / or thickness of each of the wiring portions 311G-2 and 312G-2 in the eighth embodiment may also be modified in a manner similar to the modification examples of the width and / or thickness of each of the wiring portions 311D-2 and 312D-2 in the fifth embodiment.

[0249] Further, although the case where the wiring portion group 311G (that is, a plurality of wiring portions 311G-0) includes one wiring portion 311G-2 has been described, the configuration is not limited thereto, and the wiring portion group 311G may include two or more wiring portions 311G-2. In this case, preferably, each of the two wiring portions positioned at the corresponding ends in the X direction among the plurality of wiring portions 311G-0 is a wiring portion 311G-2.

[0250] Similarly, although the case where the wiring portion group 312G (that is, a plurality of wiring portions 312G-0) includes one wiring portion 312G-2 has been described, the configuration is not limited thereto, and the wiring portion group 312G may include two or more wiring portions 312G-2. In this case, preferably, each of the two wiring portions positioned at the corresponding ends in the X direction among the plurality of wiring portions 312G-0 is a wiring portion 312G-2.

[0251] Figure 20A and Figure 20B are explanatory views of the intermediate connection members 300G-1 and 300G-2 of the modification examples, respectively. First, the Figure 20A intermediate connection member 300G-1 of the modification example shown will be described. The intermediate connection member 300G-1 includes an insulating substrate portion 321G-1, a plurality of wiring portions 311G-1, and a plurality of wiring portions 312G-1. The insulating substrate portion 321G-1 has a surface 3211G-1 including a groove portion 31G-2 and a surface 3212G-1 including a groove portion 32G-2. The surface 3212G-1 faces the surface 3211G-1 in the Y direction. The groove portion 31G-2 serves as a first groove portion, and the groove portion 32G-2 serves as a second groove portion.

[0252] The groove portion 31G-2 is preferably a groove portion having a width greater than the width W11G of each of the wiring portions 311G-1 and / or a depth greater than the thickness T1G of each of the wiring portions 311G-1. In Figure 20A In the intermediate connection member 300G-1 of the illustrated modified example, the width W22G of the groove portion 31G-2 in the X direction is larger than the width W11G of each of the wiring portions 311G-1 in the X direction. Further, the depth D2G of the groove portion 31G-2 in the Y direction is larger than the thickness T1G of each of the wiring portions 311G-1 in the Y direction.

[0253] The groove portion 32G-2 is preferably a groove portion having a width greater than the width W13G of each of the wiring portions 312G-1 and / or a depth greater than the thickness T3G of each of the wiring portions 312G-1. In Figure 20A In the intermediate connection member 300G-1 of the illustrated modified example, the width W24G of the groove portion 32G-2 in the X direction is larger than the width W13G of each of the wiring portions 312G-1 in the X direction. Further, the depth D4G of the groove portion 32G-2 in the Y direction is larger than the thickness T3G of each of the wiring portions 312G-1 in the Y direction.

[0254] According to the above configuration, each of the groove portions 31G-2 and 32G-2 can be used as an alignment mark, and thus the alignment accuracy of the intermediate connection member 300G-1 with respect to Figure 9C the wiring board 221 shown is improved.

[0255] The groove portions 31G-2 and 32G-2 are preferably displaced from each other in the X direction. It should be noted that in the intermediate connection member 300G-1, the groove portion 32G-2 can be omitted. Further, the insulating substrate portion 321G-1 can have a plurality of groove portions 31G-2 or a plurality of groove portions 32G-2.

[0256] The intermediate connection member 300G-2 of the Figure 20B illustrated modified example will be described. Similar to the intermediate connection member 300G-1, the intermediate connection member 300G-2 includes an insulating substrate portion 321G-1, a plurality of wiring portions 311G-1, and a plurality of wiring portions 312G-1. Figure 20B The groove portions 31G-2 and 32G-2 of the illustrated intermediate connection member 300G-2 are filled with insulators 324G and 325G, respectively. Each of the insulators 324G and 325G is an insulator formed of a material or color different from that of the insulating substrate portion 321G-1, and each serves as an alignment mark.

[0257] According to the above configuration, the insulators 324G and 325G can each be used as alignment marks, and thus improve the alignment accuracy of the intermediate connection member 300G-2 relative to Figure 9C the wiring board 221 shown.

[0258] The groove portions 31G-2 and 32G-2 are preferably displaced from each other in the X direction. It should be noted that, in the intermediate connection member 300G-2, the groove portion 32G-2 and the insulator 325G may be omitted. Additionally, the insulating substrate portion 321G-1 may have a plurality of groove portions 31G-2 or a plurality of groove portions 32G-2.

[0259] The present invention is not limited to the above embodiments and can be modified in various ways within the technical concept of the present invention. For example, a plurality of embodiments can be combined. Additionally, at least one part of the elements of an embodiment can be deleted or replaced. Further, new matters can be added to at least one embodiment. For example, in the sixth to eighth embodiments, at least a part of the plurality of wiring portions 312, other than their two end faces in the Z direction, can be covered with an insulating film (e.g., a solder resist film provided on the insulating substrate portion 321). The insulating film suppresses short circuits and corrosion of the plurality of wiring portions 312. Additionally, the effects described in the embodiments are merely an enumeration of the most preferred effects achievable by the present invention, and the effects of the present invention are not limited to those described in the embodiments. It should be noted that the disclosure of this specification is not limited to the matters explicitly described in this specification and includes all matters that can be grasped from this specification and the accompanying drawings of this specification. Additionally, the disclosure of this specification includes the complementary set of each individual concept described in this specification. That is, for example, in the case where this specification includes a description that "A is B", it can be said that this specification discloses that "A is not B", even if the explicit description of "A is not B" is omitted. This is because "A is B" is described on the premise that the case of "A is not B" has also been considered.

[0260] Although the case where the electronic component is an image sensor or a storage element has been described as an example in the above embodiments, the configuration is not limited thereto. For example, the electronic component can be a semiconductor device for image processing, or a power integrated circuit: power IC. For example, the electronic component can be a semiconductor device for communication or a control IC. Additionally, although the case where the electronic module is a camera module has been described as an example, the configuration is not limited thereto. For example, the electronic module can be a memory module, a signal processing module, a power supply module, a communication module, or a control module.

[0261] In addition, although the case where the electronic device is a digital camera has been described as an example, the configuration is not limited thereto. For example, the electronic device may be a mobile communication device. For example, the electronic device may be an information device such as a smartphone or a personal computer, or a communication device such as a modem or a router. Alternatively, the electronic device may be an office device such as a printer or a copier, a medical device such as a radiography device, a magnetic imaging device, an ultrasonic imaging device or an endoscope, an industrial device such as a robot or a semiconductor manufacturing device, or a transportation device such as an automobile, an airplane or a ship. In the case where wiring is provided in a limited space within the housing of the electronic device, the size of the electronic device can be reduced and the wiring arrangement density can be increased by using the intermediate connection member 300. The electronic module of the present invention is applicable to various electronic devices.

[0262] Although the present invention has been described with reference to exemplary embodiments, it should be understood that the present invention is not limited to the disclosed exemplary embodiments. The scope of the following claims should be given the broadest interpretation so as to cover all such variations and equivalent structures and functions.

Claims

1. A method for manufacturing an intermediate connection member for electrically connecting a first circuit unit and a second circuit unit to each other, the first circuit unit and the second circuit unit being arranged opposite to each other, the method comprises: forming a first insulating substrate including a first main surface provided with a plurality of first grooves; forming a second insulating substrate including a second main surface provided with a plurality of second grooves; arranging a plurality of first conductive members in the plurality of first grooves; arranging a plurality of second conductive members in the plurality of second grooves; forming a structure by bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate together with an insulating member disposed between the first insulating substrate and the second insulating substrate, such that the directions in which the plurality of first conductive members extend and the directions in which the plurality of second conductive members extend are aligned; and cutting the structure in a second direction intersecting a first direction in which the plurality of first conductive members and the plurality of second conductive members extend.

2. The method according to claim 1, wherein, forming the structure includes bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate together such that the plurality of first conductive members and the plurality of second conductive members are alternately arranged in the second direction.

3. The method according to claim 1, wherein, each of the plurality of first conductive members and the plurality of second conductive members is a wire, wherein arranging the plurality of first conductive members in the plurality of first grooves includes fitting the plurality of first conductive members in the plurality of first grooves, and wherein arranging the plurality of second conductive members in the plurality of second grooves includes fitting the plurality of second conductive members in the plurality of second grooves.

4. The method according to claim 3, wherein, arranging the plurality of first conductive members in the plurality of first grooves includes applying an adhesive in the plurality of first grooves, and wherein arranging the plurality of second conductive members in the plurality of second grooves includes applying an adhesive in the plurality of second grooves.

5. The method according to claim 1, wherein, forming the structure includes forming the insulating member by bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate together with an adhesive.

6. The method according to claim 1, wherein, forming the structure includes forming the insulating member by bonding the first main surface of the first insulating substrate and the second main surface of the second insulating substrate together with an adhesive in a state where an insulating sheet is disposed between the first insulating substrate and the second insulating substrate.

7. The method according to claim 1, wherein, the thickness of the insulating member formed by forming the structure is 10 μm to 300 μm.

8. An intermediate connection member for electrically connecting a first circuit unit and a second circuit unit to each other, the first circuit unit and the second circuit unit being arranged opposite to each other, the intermediate connection member comprises: a first insulating substrate portion; a second insulating substrate portion; an insulating layer portion disposed between the first insulating substrate portion and the second insulating substrate portion and formed of a material different from that of the first insulating substrate portion and the second insulating substrate portion; a plurality of first wiring portions disposed between the first insulating substrate portion and the insulating layer portion so as to extend in a first direction, such that two end portions of the plurality of first wiring portions in the first direction are exposed to the outside; and a plurality of second wiring portions disposed between the second insulating substrate portion and the insulating layer portion so as to extend in the first direction, such that two end portions of the plurality of second wiring portions in the first direction are exposed to the outside, wherein the insulating layer portion includes a first insulating layer, a second insulating layer, and a third insulating layer, the second insulating layer is formed of the same material as the first insulating layer, and the third insulating layer is disposed between the first insulating layer and the second insulating layer and formed of a material different from that of the first insulating layer and the second insulating layer.

9. The intermediate connection member according to claim 8, wherein, the plurality of first wiring portions and the plurality of second wiring portions are alternately arranged in a second direction intersecting the first direction.

10. The intermediate connection member according to claim 8, wherein, the first insulating layer and the second insulating layer are formed by curing an adhesive containing epoxy resin or silicone resin as a main component, and / or wherein the third insulating layer is formed of polyimide.

11. The intermediate connection member according to claim 8, wherein, the thickness of the insulating layer portion is 10 μm to 300 μm.

12. The intermediate connection member according to claim 8, wherein, the ratio of the height of the intermediate connection member in the first direction to the distance between two closest wiring portions among the plurality of first wiring portions and the plurality of second wiring portions is 4 or more, one of the two closest wiring portions is included in the plurality of first wiring portions, and the other of the two closest wiring portions is included in the plurality of second wiring portions.

13. A method for manufacturing an electronic module, the method comprises: preparing the intermediate connection member according to any one of claims 8 to 12; bonding the intermediate connection member to the first circuit unit with solder; and bonding the intermediate connection member to the second circuit unit with solder.

14. An electronic module, the electronic module comprises: a first circuit unit including a first electronic component; a second circuit unit disposed opposite to the first circuit unit and including a second electronic component; and The intermediate connection member according to any one of claims 8 to 12, the intermediate connection member electrically connecting the first circuit unit and the second circuit unit to each other.

15. The electronic module according to claim 14, wherein, the first electronic component is an image sensor.

16. An electronic device, the electronic device comprising: a housing; and the electronic module according to claim 14, the electronic module being disposed in the housing.

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