Heat dissipation assembly and electronic device

Abstract

The application relates to a heat dissipation assembly and an electronic device. The heat dissipation assembly comprises: a fan with an impeller, and an air inlet and an air outlet formed on both sides of the impeller; a first heat dissipation member connected with a heat source and arranged on one side of the air outlet; a second heat dissipation member arranged on one side of the air inlet; a Stirling heat engine comprising a cold cavity, a hot cavity in communication with the cold cavity and a connecting rod structure connected between the cold cavity and the hot cavity; the hot cavity is connected with the first heat dissipation member, and the cold cavity is connected with the second heat dissipation member; the connecting rod structure moves according to the back-and-forth flow of air between the hot cavity and the cold cavity to drive the impeller to rotate. In the heat dissipation assembly, the heat generated by the heat source is conducted to the hot cavity, so that a temperature difference is formed between the hot cavity and the cold cavity, air flows between the two cavities and drives the fan to blow and dissipate heat through the connecting rod. The heat dissipation efficiency of the heat dissipation assembly is high, the energy utilization rate is improved, the energy consumption of the system is reduced, and the heat dissipation effect can be intelligently adjusted according to the temperature of the heat source.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of heat dissipation, and particularly relates to a heat dissipation assembly and an electronic device. BACKGROUND

[0002] At present, for electronic devices such as CPE (Customer Premise Equipment), PC (Personal Computer) and router, a fan is generally driven and controlled by taking power from a PCB (Printed Circuit Boards) to dissipate heat of a heat source of the electronic device. However, the fan needs to consume additional power, which increases the system energy consumption of the electronic device and shortens the endurance time of the electronic device. SUMMARY

[0003] Therefore, it is necessary to provide a heat dissipation assembly capable of reducing system energy consumption, and an electronic device with the heat dissipation assembly.

[0004] In one aspect, the present application provides a heat dissipation assembly, which comprises:

[0005] a fan having an impeller, and an air inlet and an air outlet formed on two sides of the impeller respectively;

[0006] a first heat dissipation member for connecting a heat source, the first heat dissipation member being arranged on one side of the air outlet;

[0007] a second heat dissipation member arranged on one side of the air inlet; and

[0008] a Stirling heat engine comprising a cold cavity, a hot cavity in communication with the cold cavity and a connecting rod structure connected between the cold cavity and the hot cavity; the hot cavity is connected with the first heat dissipation member, and the cold cavity is connected with the second heat dissipation member; the connecting rod structure is connected with the impeller and moves according to the back-and-forth flow of air between the hot cavity and the cold cavity to drive the impeller to rotate.

[0009] The heat generated by the heat source is conducted to the hot cavity through the first heat dissipation member, so that the gas in the hot cavity realizes the process of isochoric heat absorption and isothermal expansion. In addition, the airflow on the side of the air inlet is relatively low in temperature, so that the second heat dissipation member on the side of the air inlet cools the cold cavity, and the gas in the cold cavity realizes the process of isochoric heat release and isothermal compression. Thus, the low-temperature airflow in the cold cavity is heated after absorbing heat when entering the hot cavity, and the heated gas is cooled when returning to the cold cavity. The transmission between the hot cavity and the cold cavity through the connecting rod structure enables the airflow to flow back and forth between the cold cavity and the hot cavity, and finally continuously transfers heat from the first heat dissipation member to the second heat dissipation member, achieving heat dissipation of the heat source. At the same time, the impeller rotates continuously under the driving of the connecting rod structure, thereby blowing and cooling the first heat dissipation member and the heat source, achieving the purpose of heat dissipation. Under the combined action of heat conduction of the first heat dissipation member and blowing of the fan, the heat source can realize rapid heat dissipation and maintain a certain temperature range, so that the heat dissipation assembly has high heat dissipation efficiency. In addition, the Stirling heat engine fully utilizes the heat of the heat source to convert the heat energy into the kinetic energy of the fan, so that the fan can work without additional power supply from the PCB, improving the energy utilization rate and reducing the energy consumption of the electronic device, thereby prolonging the endurance time of the electronic device. In addition, the more the load of the heat source, the higher the temperature, the more heat is conducted to the hot cavity through the first heat dissipation member, and the greater the temperature difference between the hot cavity and the cold cavity, and the faster the speed of the impeller, thereby increasing the flow rate of the airflow blown out of the air outlet, so as to improve the heat dissipation effect. The less the load of the heat source, the lower the temperature, the smaller the temperature difference between the hot cavity and the cold cavity, and the smaller the speed of the impeller or even no rotation. Thus, the heat dissipation assembly can automatically adjust the heat dissipation effect according to the temperature of the heat source, achieving the purpose of intelligent adjustment.

[0010] In one aspect, the present application provides an electronic device, comprising:

[0011] a housing, the housing being provided with an air inlet and an air outlet;

[0012] a heat source built-in in the housing; and

[0013] The heat dissipation assembly described above is built-in in the housing and connected with the heat source; the air inlet, the air inlet, the air outlet and the air outlet are sequentially communicated.

[0014] In the electronic device described above, the heat dissipation assembly can realize efficient heat dissipation of the heat source, and can fully utilize the heat energy of the heat source to improve the energy utilization rate and reduce the system energy consumption of the electronic device. In addition, the heat dissipation assembly can also automatically adjust the heat dissipation effect according to the temperature of the heat source, achieving the purpose of intelligent adjustment, so as to maintain the heat source within a certain working temperature range, prolong the service life of the heat source, improve the reliability and user experience of the electronic device, and make the electronic device meet the development trend of energy saving and emission reduction and intelligent adjustment. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 Structure diagram of part structure of electronic device of the present application;

[0016] Figure 2 Structure diagram of part structure of electronic device of the present application; Figure 1 Physical section view of the structure shown in the figure;

[0017] Figure 3 Structure diagram of part structure of electronic device of the present application; Figure 2 Axial side view of the structure shown in the figure;

[0018] Figure 4 Structure diagram of part structure of electronic device of the present application; Figure 2 Structure diagram of heat dissipation assembly in the structure shown in the figure;

[0019] Figure 5 Structure diagram of heat dissipation assembly in the structure shown in the figure; Figure 4 Simplified structure diagram of Stirling heat engine in the heat dissipation assembly shown in the figure;

[0020] Figure 6 Structure diagram of heat dissipation assembly in the structure shown in the figure; Figure 4 Exploded structure diagram of heat dissipation assembly in the structure shown in the figure;

[0021] Figure 7 Structure diagram of heat dissipation assembly in the structure shown in the figure; Figure 4 Structure diagram of heat dissipation assembly in the structure shown in the figure;

[0022] Figure 8 Structure diagram of heat dissipation assembly in the structure shown in the figure; Figure 1 Another installation state diagram of heat dissipation assembly in the electronic device shown in the figure. DETAILED DESCRIPTION

[0023] In order to make the above purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below. In the following description, a lot of specific details are set forth in order to fully understand the present application, but the present application can be implemented in many other ways different from the description herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0024] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the present application.

[0025] In addition, the terms "first", "second", etc. are used only for the purpose of description and are not to be interpreted in a relative manner or to imply relative importance or to imply a number of the technical features indicated. Thus, the features defined as "first", "second", etc. can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0026] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0028] In combination Figure 1 With Figure 3 As shown, the electronic device generally has a heat source 100 and a PCB board 200, the heat source 100 is connected with the PCB board 200, the built-in power supply or external power supply of the electronic device is connected with the PCB board 200, and the PCB board 200 supplies power for the heat source 100. The heat source 100 consumes electric energy in the working process and generates a large amount of heat, which will cause the temperature of the heat source 100 to rise, and once the temperature exceeds a certain range, the heat source 100 will face the risk of failure. Therefore, it is of great significance to maintain the heat source 100 within a certain working temperature range by using an efficient heat dissipation method, which improves the reliability of the electronic device and the user experience. Generally, the heat source 100 in the electronic device is a chip.

[0029] The present application protects an electronic device with a heat dissipation assembly 300, which plays a role of heat dissipation for a heat source 100 in the electronic device. The electronic device can be a CPE (Customer Premise Equipment), a router, a PC (Personal Computer), etc.

[0030] In combination Figures 1 to 6 As shown in the figure, in some embodiments, the heat dissipation assembly 300 includes a fan 310, a first heat dissipation member 330, a second heat dissipation member 360 and a Stirling heat engine 350. The fan 310 has an impeller 313, and an air inlet 311 and an air outlet 312 are formed on both sides of the impeller 313, which can force the airflow to flow in from the air inlet 311 and out from the air outlet 312 when the impeller 313 rotates. The first heat dissipation member 330 is arranged on one side of the air outlet 312 and connected with the heat source 100. The second heat dissipation member 360 is arranged on one side of the air inlet 311. The Stirling heat engine 350 includes a cold cavity 351, a hot cavity 352 and a connecting rod structure 353, the hot cavity 352 is in communication with the cold cavity 351, and the connecting rod structure 353 is connected between the cold cavity 351 and the hot cavity 352. The hot cavity 352 is connected with the first heat dissipation member 330, and the cold cavity 351 is connected with the second heat dissipation member 360. The connecting rod structure 353 is connected with the impeller 313 and moves according to the back-and-forth flow of the airflow between the hot cavity 352 and the cold cavity 351 to drive the impeller 313 to rotate.

[0031] In the heat dissipation assembly 300, the heat generated by the heat source 100 is conducted to the hot cavity 352 via the first heat dissipation member 330, so that the gas in the hot cavity 352 realizes the process of isochoric heat absorption and isothermal expansion. In addition, due to the relatively low temperature of the airflow on the side of the air inlet 311, the second heat dissipation member on the side of the air inlet 311 cools the cold cavity 351, so that the gas in the cold cavity 351 realizes the process of isochoric heat release and isothermal compression. Thus, the low-temperature airflow in the cold cavity 351 is heated after entering the hot cavity 352, and the heated gas is cooled after returning to the cold cavity 351. The transmission between the hot cavity 352 and the cold cavity 351 through the connecting rod structure 353 makes the airflow flow back and forth between the cold cavity 351 and the hot cavity 352, and finally continuously transfers heat from the first heat dissipation member 330 to the second heat dissipation member 360, realizing the heat dissipation of the heat source 100. At the same time, under the driving of the connecting rod structure 353, the impeller 313 continuously rotates, thereby blowing and cooling the first heat dissipation member 330 and the heat source 100, achieving the purpose of heat dissipation. Under the combined action of heat conduction of the first heat dissipation member 330 and blowing of the fan 310, the heat source 100 can realize rapid heat dissipation and maintain in a certain temperature range, so that the heat dissipation assembly 300 has high heat dissipation efficiency. In addition, the Stirling heat engine 350 fully utilizes the heat of the heat source 100 to convert the heat energy into the kinetic energy of the fan 310, so that the fan 310 can work without additional power supply from the PCB 200, improving the energy utilization rate and reducing the energy consumption of the electronic device, thereby prolonging the endurance time of the electronic device.

[0032] In addition, the more the load of the heat source 100 is, the higher the temperature of the heat source 100 will be, the more heat will be conducted to the hot cavity 352 via the first heat dissipation member 330, and the greater the temperature difference between the hot cavity 352 and the cold cavity 351 will be, so that the rotating speed of the impeller 313 is faster, thereby increasing the flow rate of the airflow blown out of the air outlet 312, so as to improve the heat dissipation effect. The less the load of the heat source 100 is, the lower the temperature of the heat source 100 will be, and the smaller the temperature difference between the hot cavity 352 and the cold cavity 351 will be, so that the rotating speed of the impeller 313 is smaller or even does not need to rotate. Thus, the heat dissipation assembly 300 can automatically adjust the heat dissipation effect according to the temperature of the heat source 100, achieving the purpose of intelligent adjustment.

[0033] It should be noted that, Figure 2 In the illustrated embodiment, the fan 310 is an axial fan. In other embodiments, the fan 310 can also be a centrifugal fan, a mixed flow fan, or other types of fans. For various types of fans 310, the fan 310 has an air inlet 311 and an air outlet 312. Figure 2 In the illustrated embodiment, the first heat dissipation member 330 is located in the axial direction of the axial fan. In other embodiments, the positions of the fan 310 and the first heat dissipation member 330 can be adjusted according to the type of the fan 310.

[0034] Combining Figures 1 to 6 As shown in some embodiments, the hot cavity 352 comprises a first cylinder 352a and a first piston 352b slidingly arranged in the first cylinder 352a, the cold cavity 351 comprises a second cylinder 351a and a second piston 351b slidingly arranged in the second cylinder 351a, one end of the connecting rod structure 353 is connected with the first piston 352b, and the other end is connected with the second piston 351b. The connecting rod structure 353 can realize transmission between the first piston 352b and the second piston 351b, so as to make the gas flow in the hot cavity 352 and the cold cavity 351 flow periodically back and forth. Further, the gas medium in the hot cavity 352 and the cold cavity 351 is hydrogen or helium.

[0035] Further, the connecting rod structure 353 comprises a first rod 353a, a second rod 353b, a third rod 353c and a fourth rod 353d. One end of the first rod 353a is fixedly connected with the first piston 352b, and the other end is rotatably connected with the second rod 353b. The end of the second rod 353b away from the first rod 353a is rotatably connected to a certain position P of the impeller 313. One end of the third rod 353c is fixedly connected with the second piston 351b, and the other end is rotatably connected with the fourth rod 353d. The end of the fourth rod 353d away from the third rod 353c is rotatably connected to the certain position P. The certain position P deviates from the rotation center Q of the impeller 313. The second rod 353b and the fourth rod 353d are rotatably connected to the same position of the impeller 313, so that the impeller 313 rotates around the rotation center Q under the joint action of the two.

[0036] Further, the Stirling heat engine 350 comprises a gas pipe 354, two ends of the gas pipe 354 are connected with the first cylinder 352a and the second cylinder 351a respectively, and the internal space of the first cylinder 352a and the internal space of the second cylinder 351a are communicated, so that the gas in the cold cavity 351 and the hot cavity 352 can flow periodically back and forth through the gas pipe 354.

[0037] In some embodiments, at least one heat dissipation channel 331 is formed through the inside of the first heat dissipation member 330, and the air inlet 311, the air outlet 312 and the heat dissipation channel 331 are sequentially communicated to form an air flow channel. By arranging the heat dissipation channel 331 inside the first heat dissipation member 330, the surface area of the first heat dissipation member 330 can be increased, thereby facilitating rapid heat dissipation. Under the rotating action of the impeller 313 in the fan 310, the air flow can flow into the heat dissipation channel 331 from the air inlet 311, and then flow out of the air outlet 312, and further into the heat dissipation channel 331 to blow and dissipate heat on the surface of the first heat dissipation member 330, and finally the air flow after being heated is discharged from the end of the heat dissipation channel 331 away from the air outlet 312.

[0038] In some embodiments, the first heat dissipating member 330 comprises a heat dissipating body 332 connected with the heat source 100, and a connecting plate 333 connected between the heat dissipating body 332 and the heat cavity 352, the heat dissipating body 332 is spaced apart from the fan 310, and the heat dissipating passage 331 is formed in the heat dissipating body 332. In this way, the heat dissipating passage 331 is spaced apart from the air outlet 312, and the air flow blown out of the air outlet 312 can be diffused to a larger space, so that the first heat dissipating member 330 can be blown and cooled in a larger area, so as to improve the cooling effect. Especially when the heat dissipating passage 331 is multiple, in this way, the air flow blown out of the air outlet 312 can flow into each heat dissipating passage 331, so as to accelerate the cooling. In addition, the heat dissipating body 332 can conduct the heat generated by the heat source 100 to the connecting plate 333, and then transmit to the heat cavity 352 through the connecting plate 333.

[0039] Further, the air flow passage is linear. It can be understood that the air inlet 311, the air outlet 312 and the heat dissipating passage 331 are arranged in sequence along a straight line and are sequentially communicated, so that the length of the air flow passage can be shortened, and the flow path of the air flow can be shortened, so that the air flow carrying heat can be quickly discharged, thereby accelerating the cooling. Further, the air inlet 311 is coaxially arranged with the air inlet 311, and the heat dissipating passage 331 extends in a direction parallel to the axis direction of the air inlet 311, so that the air flow passage is substantially linear.

[0040] In some embodiments, the heat dissipating body 332 comprises a first heat dissipating plate 332a, a second heat dissipating plate 332b, and a third heat dissipating plate 332c connected between the first heat dissipating plate 332a and the second heat dissipating plate 332b. The first heat dissipating plate 332a is connected with the heat source 100, and the second heat dissipating plate 332b is connected with the connecting plate 333. The number of the third heat dissipating plate 332c is at least two, and each third heat dissipating plate 332c is spaced apart. The first heat dissipating plate 332a, the second heat dissipating plate 332b and the two adjacent third heat dissipating plates 332c together form a heat dissipating passage 331, and the first heat dissipating plate 332a, the second heat dissipating plate 332b and the third heat dissipating plate 332c more than two together form a plurality of heat dissipating passages 331. Thus, at least two third heat dissipating plates 332c can cooperate with the first heat dissipating plate 332a and the second heat dissipating plate 332b to obtain at least one heat dissipating passage 331. In this way, the surface area of the heat dissipating body 332 can be increased, and the cooling capacity of the heat dissipating body 332 can be improved.

[0041] Further, the third heat dissipation plates 332c are evenly distributed between the first heat dissipation plate 332a and the second heat dissipation plate 332b, so that a plurality of heat dissipation channels 331 with consistent caliber and consistent extending direction can be obtained. Further, the air inlet 311 and the air outlet 312 are coaxially arranged, and the third heat dissipation plate 332c, the first heat dissipation plate 332a and the second heat dissipation plate 332b extend in a direction parallel to the axial direction of the air inlet 311, so that the heat dissipation channels 331 can extend along the axial direction of the air inlet 311.

[0042] In some embodiments, the connecting plate 333 is welded to the outer surface of the heat cavity 352. Alternatively, a thermally conductive interface material is filled between the connecting plate 333 and the outer surface of the heat cavity 352. In this way, the connecting plate 333 and the heat cavity 352 can be seamlessly connected, so that the heat of the connecting plate 333 can be quickly conducted to the heat cavity 352. In other embodiments, the connecting plate 333 and the heat cavity 352 can also be connected and fixed by, for example, screw locking. At this time, the connecting plate 333 and the outer surface of the heat cavity 352 are only in contact but not welded, so that there is a micro gap between the connecting plate 333 and the outer surface of the heat cavity 352, and the existence of the micro gap will hinder the heat transfer from the connecting plate 333 to the heat cavity 352. By filling the thermally conductive interface material between the connecting plate 333 and the outer surface of the heat cavity 352, the micro gap can be filled, so as to improve the heat conduction performance.

[0043] Specifically, the connecting plate 333 includes a first connecting portion 333a and a second connecting portion 333b, and the first connecting portion 333a is connected with the second connecting portion 333b. The first connecting portion 333a is connected with the heat dissipation main body 332, specifically, the first connecting portion 333a is integrally formed with the second heat dissipation plate 332b. The second connecting portion 333b is in the form of a flat plate and is in surface-to-surface engagement with the outer surface of the heat cavity 352, so that the connecting plate 333 and the outer surface of the heat cavity 352 have a large contact area, realizing the rapid heat transfer from the first heat dissipation member 330 to the heat cavity 352 and improving the heat transfer efficiency. Specifically, the second connecting portion 333b is welded to the outer surface of the heat cavity 352 to realize the welding with the outer surface of the heat cavity 352. Alternatively, the second connecting portion 333b and the outer surface of the heat cavity 352 are filled with a thermally conductive interface material. Further, the thermally conductive interface material can be a silicone grease, a thermally conductive gel, a thermally conductive pad, etc. Further, at least part of the connecting plate 333 extends along the circumference of the air outlet 312. Specifically, the second connecting portion 333b extends along the circumference of the air outlet 312.

[0044] In the present application, to avoid the contact between the connecting plate 333 and the cold cavity 351, a support plate 390 is arranged on the outer surface of the hot cavity 352, and the connecting plate 333 is installed on the support plate 390. The support plate 390 plays a supporting role for the connecting plate 333, and at the same time, the heat of the connecting plate 333 is conducted to the hot cavity 352 through the support plate 390. Specifically, the second connecting part 333b is in surface-to-surface engagement with the support plate 390. In other embodiments, the support plate 390 can also be integrally formed with the second connecting part 333b. In order to achieve rapid heat transfer from the connecting plate 333 to the hot cavity 352, the support plate 390 needs to have high thermal conductivity. Specifically, the material of the support plate 390 can be a high-thermal-conductivity metal, such as aluminum, aluminum alloy, copper, copper alloy, etc. The material of the support plate 390 can also be a high-thermal-conductivity functional material, such as high-thermal-conductivity graphite. The support plate 390 can also be a heat pipe. Further, to ensure that the support plate 390 has high thermal conductivity, it is required that the thermal conductivity of the support plate 390 is greater than 150 W / m·K.

[0045] In some embodiments, the heat dissipation assembly 300 includes two first heat dissipation members 330 arranged at intervals, and the two first heat dissipation members 330 have a receiving gap 380 for accommodating the heat source 100. By arranging the heat source 100 between the two first heat dissipation members 330, the two first heat dissipation members 330 can collectively dissipate heat from the heat source 100, thereby improving the heat dissipation effect. Further, in the embodiment in which the heat dissipation body 332 includes the first heat dissipation plate 332a, two first heat dissipation plates 332a are included in the two first heat dissipation members 330, and the two first heat dissipation plates 332a are arranged in parallel at intervals to form the receiving gap 380. It can be understood that the air outlet 312 communicates with one end of the receiving gap 380, and the airflow blown out of the air outlet 312 can enter the receiving gap 380 to directly blow and dissipate heat from the heat source 100. In the embodiment shown in the figure, the air outlet 312 is arranged on the side of the heat dissipation body 332 away from the heat source 100, and the airflow blown out of the air outlet 312 can directly flow through the receiving gap 380 to dissipate heat from the heat source 100. In other embodiments, the air outlet 312 can also be arranged on the side of the heat dissipation body 332 close to the heat source 100, and the airflow blown out of the air outlet 312 can also directly flow through the receiving gap 380 to dissipate heat from the heat source 100. Figure 2 In the embodiment shown in the figure, the first heat dissipation member 330 is two, and in other embodiments, the number of first heat dissipation members 330 can also be set to 4, 6, 8, etc. according to the number of heat sources 100 in the electronic device.

[0046] Further, the two sides of the PCB 200 are both installed with the heat source 100, and then the PCB 200 and the heat source 100 are located in the receiving gap 380 together. The two first heat dissipation members 330 correspond to the two sides of the PCB 200 respectively. In this way, a larger number of heat sources 100 can be installed on the PCB 200, thereby improving the utilization rate of the PCB 200. At the same time, the two first heat dissipation members 330 can also dissipate heat from the heat sources 100 on the two sides of the PCB 200 respectively. Further, a plurality of heat sources 100 are installed on the same side of the PCB 200, and the plurality of heat sources 100 are arranged at intervals. In this way, it is beneficial for the airflow to flow through each heat source 100 sufficiently, thereby achieving a better heat dissipation effect.

[0047] It should be noted that the first heat dissipation member 330 mentioned above is mainly used for dissipating heat of the heat source 100 and conducting part of the heat to the heat cavity 352. In order to realize rapid heat transfer from the first heat dissipation member 330 to the heat cavity 352, the first heat dissipation member 330 needs to have high thermal conductivity. Specifically, the material of the first heat dissipation member 330 can be a high-thermal-conductivity metal, for example, aluminum, aluminum alloy, copper, copper alloy, etc. The material of the first heat dissipation member 330 can also be a high-thermal-conductivity functional material, for example, high-thermal-conductivity graphite. The first heat dissipation member 330 can also be a vapor chamber (VC). Further, in order to ensure that the first heat dissipation member 330 has high thermal conductivity, it is required that the thermal conductivity of the first heat dissipation member 330 is greater than 150 W / m·K.

[0048] In combination with Figure 1 With Figure 7 As shown in FIG. 6, in some embodiments, the second heat dissipation member 360 is arranged on one side of the air inlet 311 and connected to the cold cavity 351. By arranging the second heat dissipation member 360, the heat of the cold cavity 351 can be quickly dissipated, and the cold cavity 351 can be maintained at a lower temperature, so as to facilitate the formation of a temperature difference between the cold cavity 351 and the heat cavity 352.

[0049] In order to realize rapid heat dissipation, the second heat dissipation member 360 needs to have high thermal conductivity. The material of the second heat dissipation member 360 can be a metal, for example, aluminum, aluminum alloy, copper, copper alloy, etc. The material of the second heat dissipation member 360 can also be a high-thermal-conductivity functional material, for example, high-thermal-conductivity graphite. The second heat dissipation member 360 can also be a vapor chamber (VC). Further, in order to ensure that the second heat dissipation member 360 has high thermal conductivity, it is required that the thermal conductivity of the second heat dissipation member 360 is greater than 150 W / m·K.

[0050] In some embodiments, the second heat dissipation member 360 extends along the circumference of the air inlet 311, and is formed with a plurality of flow guide grooves 361 extending along the radial direction of the air inlet 311 and communicating with the air inlet 311. The arrangement of the plurality of flow guide grooves 361 can increase the surface area of the second heat dissipation member 360, improve the heat dissipation capacity of the second heat dissipation member 360, and collectively guide the airflow from the periphery to the air inlet 311, so as to maintain the cold cavity 351 at a lower temperature.

[0051] Further, the second heat dissipation member 360 comprises a first heat conduction plate 362 and a plurality of second heat conduction plates 363. The first heat conduction plate 362 is connected to the cold cavity 351 and extends along the circumference of the air inlet 311. The plurality of second heat conduction plates 363 are connected to the first heat conduction plate 362. Any two adjacent second heat conduction plates 363 are spaced apart to form a flow guide groove 361. The first heat conduction plate 362 extending along the circumference of the air inlet 311 can provide a larger installation space for installing more second heat conduction plates 363, thereby improving the heat dissipation capacity of the second heat dissipation member 360. Specifically, the second heat conduction plate 363 extends along the radial direction of the air inlet 311 in a plate shape. In this way, the gap between any two adjacent second heat conduction plates 363 extends along the radial direction of the air inlet 311 and communicates with the air inlet 311, thereby forming a flow guide groove 361. A plurality of second heat conduction plates 363 can form a plurality of flow guide grooves 361.

[0052] In some embodiments, the second heat dissipation member 360 is welded to the outer surface of the cold cavity 351. Alternatively, a heat-conducting interface material is filled between the second heat dissipation member 360 and the outer surface of the cold cavity 351. In this way, the second heat dissipation member 360 and the outer surface of the cold cavity 351 can be seamlessly connected, so that the heat of the cold cavity 351 can be quickly conducted to the second heat dissipation member 360. In other embodiments, the second heat dissipation member 360 and the outer surface of the cold cavity 351 can also be connected and fixed by, for example, screw locking. At this time, the second heat dissipation member 360 and the outer surface of the cold cavity 351 are only in contact but not welded, so that there is a micro gap between the second heat dissipation member 360 and the outer surface of the cold cavity 351. The existence of the micro gap will hinder the heat transfer from the cold cavity 351 to the second heat dissipation member 360. By filling a heat-conducting interface material between the second heat dissipation member 360 and the outer surface of the cold cavity 351, the micro gap can be filled, thereby improving the heat conduction performance. Specifically, the first heat conduction plate 362 is welded to the outer surface of the cold cavity 351 to achieve welding with the outer surface of the cold cavity 351. Alternatively, a heat-conducting interface material is filled between the first heat conduction plate 362 and the outer surface of the cold cavity 351. Further, the heat-conducting interface material can be a silicone grease, a heat-conducting gel, a heat-conducting pad, etc.

[0053] Again referring to Figures 1 to 3 In the present application, the electronic device further comprises a shell 500, and the heat source 100 and the heat dissipation assembly 300 are built-in the shell 500. The shell 500 is provided with an air inlet hole 510 and an air outlet hole 520. The air inlet hole 510, the air inlet 311, the air outlet 312, and the air outlet hole 520 are sequentially communicated. In this way, the airflow enters the inside of the shell 500 through the air inlet hole 510, and is further blown to the first heat dissipation member 330 and the heat source 100 in sequence after passing through the air inlet 311 and the air outlet 312 under the rotating action of the impeller 313, and finally carries part of the heat to flow out from the air outlet hole 520.

[0054] Further, the air inlet holes 510 are multiple, and each of the multiple air inlet holes 510 extends along the axial direction of the air inlet 311 and is uniformly distributed to correspond to the entire air inlet 311. The air outlet holes 520 are multiple, and each of the multiple air outlet holes 520 extends along the axial direction of the air outlet 312 and is uniformly distributed to correspond to the entire air outlet 312.

[0055] Further, the Stirling heat engine 350 is located between the shell 500 and the fan 310 and is spaced apart from the shell 500. The Stirling heat engine 350 is spaced apart from the shell 500, so that heat exchange between the Stirling heat engine 350 and the shell 500 is avoided to affect the temperature of the hot cavity 352 and the cold cavity 351. In addition, the Stirling heat engine 350 can also make full use of the gap between the shell 500 and the fan 310, so as to avoid the waste of the internal space of the shell 500 and improve the space utilization.

[0056] Further, the second heat dissipation member 360 is close to the air inlet holes 510, so that the temperature of the second heat dissipation member 360 is substantially equal to the ambient temperature, so that the cold cavity 351 can be maintained at a relatively low temperature. Further, the shell 500 is spaced apart from the first heat dissipation member 330, so that heat exchange between the first heat dissipation member 330 and the shell 500 is avoided.

[0057] For the above electronic device, according to the needs of the internal installation environment, the air inlet holes 510 can be arranged at any position of the shell 500, and the air inlet holes 510 are only required to correspond to the air inlet 311 of the fan 310, and the first heat dissipation member 330 is arranged on the side of the air outlet 312 of the fan 310, and the air outlet holes 520 correspond to the side of the first heat dissipation member 330 away from the air outlet 312, so that the same use effect can be achieved. For example, as shown in Figure 1 , the air inlet holes 510 are arranged below the electronic device, and the air outlet holes 520 are arranged above the electronic device, so that the air flows from bottom to top. Figure 8 , the air outlet holes 520 are arranged below the electronic device, and the air inlet holes 510 are arranged above the electronic device, so that the air flows from top to bottom.

[0058] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the description.

[0059] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a heat dissipation assembly of a Stirling engine, which comprises the following components: a fan with an impeller, and an air inlet and an air outlet formed on two sides of the impeller respectively; a first heat dissipation component for connecting a heat source, which is arranged on one side of the air outlet; a second heat dissipation component arranged on one side of the air inlet; and a Stirling engine comprising a cold cavity, a hot cavity connected with the cold cavity and a connecting rod structure connected between the cold cavity and the hot cavity; the hot cavity is connected with the first heat dissipation component, and the cold cavity is connected with the second heat dissipation component; the connecting rod structure is connected with the impeller and moves according to the back-and-forth flow of air between the hot cavity and the cold cavity to drive the impeller to rotate; the heat dissipation assembly comprises two first heat dissipation components arranged at intervals, and a receiving gap for accommodating the heat source is arranged between the two first heat dissipation components; the air outlet is communicated with one end of the receiving gap, and the air blown out from the air outlet can enter the receiving gap; the first heat dissipation component comprises a heat dissipation main body connected with the heat source and a connecting plate connected between the heat dissipation main body and the hot cavity; the heat dissipation main body is arranged at intervals with the fan; the heat dissipation main body comprises a first heat dissipation plate, a second heat dissipation plate and a third heat dissipation plate connected between the first heat dissipation plate and the second heat dissipation plate; the first heat dissipation plate is connected with the heat source, the second heat dissipation plate is connected with the connecting plate, the number of the third heat dissipation plates is at least two, and the third heat dissipation plates are arranged at intervals; the first heat dissipation plate, the second heat dissipation plate and two adjacent third heat dissipation plates jointly form a heat dissipation channel; the air inlet, the air outlet and the heat dissipation channel are sequentially communicated to form an air flow channel, and the two first heat dissipation plates are arranged in parallel at intervals to form the receiving gap. The hot cavity comprises a first cylinder and a first piston slidingly arranged in the first cylinder; the cold cavity comprises a second cylinder and a second piston slidingly arranged in the second cylinder; one end of the connecting rod structure is connected with the first piston, and the other end is connected with the second piston.

2. The heat dissipation assembly of claim 1, wherein, The connecting rod structure comprises a first rod body, a second rod body, a third rod body and a fourth rod body; one end of the first rod body is fixedly connected with the first piston, and the other end is rotatably connected with the second rod body; the end of the second rod body away from the first rod body is rotatably connected with a given position of the impeller; one end of the third rod body is fixedly connected with the second piston, and the other end is rotatably connected with the fourth rod body; the end of the fourth rod body away from the third rod body is rotatably connected with the given position; and the given position deviates from the rotation center of the impeller.

3. The heat dissipation assembly of claim 2, wherein, The Stirling engine comprises an air pipe, two ends of the air pipe are connected with the first cylinder and the second cylinder respectively, and the air pipe connects the internal space of the first cylinder with the internal space of the second cylinder.

4. The heat dissipation assembly of claim 2, wherein, A support plate is arranged on the outer surface of the hot cavity, and the connecting plate is mounted on the support plate.

5. The heat dissipation assembly of claim 1, wherein, The thermal conductivity of the support plate is greater than 150 W / m.K.

6. The heat dissipating assembly of claim 5, wherein, The connecting plate is welded on the outer surface of the hot cavity.

7. The heat dissipating assembly of claim 1, wherein, The connecting plate and the outer surface of the hot cavity are filled with a heat-conducting interface material.

8. The heat dissipating assembly of claim 1, wherein, ​ 9. The heat dissipating assembly of claim 1, wherein, The second heat-dissipating member is welded to the outer surface of the cold cavity, or a heat-conducting interface material is filled between the second heat-dissipating member and the outer surface of the cold cavity.

10. The heat dissipating assembly of claim 1, wherein, The second heat-dissipating member extends along the circumference of the air inlet and is formed with a plurality of flow guide grooves extending along the radial direction of the air inlet and communicating with the air inlet.

11. The heat dissipating assembly of claim 10, wherein, The second heat-dissipating member comprises a first heat-conducting plate connected with the cold cavity and extending along the circumference of the air inlet, and a plurality of second heat-conducting plates, each of which is connected with the first heat-conducting plate, and any two adjacent second heat-conducting plates are spaced apart to form the flow guide grooves.

12. An electronic device, comprising: Comprise: a housing, the housing is provided with an air inlet hole and an air outlet hole; a heat source, which is built-in in the housing; and The heat-dissipating assembly as claimed in any one of claims 1 to 11 is built-in in the housing and connected with the heat source; the air inlet hole, the air inlet, the air outlet, and the air outlet hole are sequentially communicated.

13. The electronic device of claim 12, wherein, The Stirling heat engine is located between the housing and the fan and is spaced apart from the housing.

14. The electronic device of claim 12, wherein, The electronic device comprises a PCB board, both sides of the PCB board are provided with the heat source; the heat-dissipating assembly comprises two spaced-apart first heat-dissipating members, and the two first heat-dissipating members correspond to both sides of the PCB board, respectively.

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