Semiconductor test radio frequency probe tape

Abstract

The present invention discloses a semiconductor test radio frequency probe tape, which includes: a first claw, a second claw, a third claw and a tape portion that are arranged at intervals from each other. The second claw is located between the first claw and the third claw. The first claw includes a first head, a first middle part and a first tail. The second claw includes a second head, a second middle part and a second tail. The third claw includes a third head, a third middle part and a third tail. The tape portion is connected to the first tail, the second tail and the third tail. The tape portion is at the probe tail, and the probe head is not affected by lint and will not damage the product contact, thereby facilitating the production of high-quality semiconductor test radio frequency probes.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor testing, and particularly to a semiconductor testing radio frequency probe. Background Art

[0002] The existing semiconductor testing radio frequency probe tape includes: a first claw, a second claw, a third claw and a tape part which are arranged at intervals. The second claw is located between the first claw and the third claw. The first claw includes a first head, a first middle part and a first tail. The second claw includes a second head, a second middle part and a second tail. The third claw includes a third head, a third middle part and a third tail. The tape part is connected to the first head, the second head and the third head. When the tape is removed and there are residual hairs on the head and it contacts the test piece, the product contacts will be damaged.

[0003] Therefore, it is necessary to improve the existing technology. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: to provide a semiconductor testing radio frequency probe tape for manufacturing high-quality semiconductor testing radio frequency probes.

[0005] To solve the above technical problem, the technical solution of the present invention is as follows:

[0006] A semiconductor testing radio frequency probe tape includes: a first claw, a second claw, a third claw and a tape part which are arranged at intervals. The second claw is located between the first claw and the third claw. The first claw includes a first head, a first middle part and a first tail. The second claw includes a second head, a second middle part and a second tail. The third claw includes a third head, a third middle part and a third tail;

[0007] Wherein, the tape part is connected to the first tail, the second tail and the third tail.

[0008] Compared with the prior art, the tape part of the present invention is connected to the first tail, the second tail and the third tail. The tape part is at the tail of the probe, and the probe head is not affected by hairs and will not damage the product contacts, which is beneficial to producing high-quality semiconductor testing radio frequency probes.

[0009] Further, the width of the second middle part is less than the width of the second tail, and the width of the second head is less than the width of the second middle part.

[0010] Further, the first middle part extends from the first tail towards the second middle part, the first head is parallel to the second head, and the first tail is parallel to the second tail.

[0011] Further, the third middle part extends from the third tail part towards the second middle part, the third head part is parallel to the second head part, and the third tail part is parallel to the second tail part.

[0012] Further, the tape part includes a long slot, the long slot is located at the front end of the tape part, the long slot penetrates the upper surface of the tape part, and the long slot does not penetrate the lower surface of the tape part.

[0013] Further, the long slot penetrates the upper surface of the first tail part, and the tape part does not penetrate the lower surface of the first tail part.

[0014] Further, the long slot penetrates the upper surface of the second tail part, and the tape part does not penetrate the lower surface of the second tail part.

[0015] Further, the long slot penetrates the upper surface of the third tail part, and the tape part does not penetrate the lower surface of the third tail part.

[0016] Further, the tape part is provided with a perforation, and the perforation penetrates the upper surface and the lower surface of the tape part in the up and down direction.

[0017] Further, the length of the long slot is greater than the sum of the widths of the first claw, the second claw and the third claw. Description of the Drawings

[0018] Figure 1 is a perspective view of a semiconductor test radio frequency probe according to an embodiment of the present invention.

[0019] Figure 2 is another perspective view of a semiconductor test radio frequency probe according to an embodiment of the present invention.

[0020] Figure 3 is an exploded view of a semiconductor test radio frequency probe according to an embodiment of the present invention.

[0021] Figure 4 is another perspective exploded view of a semiconductor test radio frequency probe according to an embodiment of the present invention.

[0022] Figure 5 is a perspective sectional view of a semiconductor test radio frequency probe according to an embodiment of the present invention.

[0023] Figure 6 is a perspective view of a cable according to an embodiment of the present invention.

[0024] Figure 7 is an exploded view of a cable according to an embodiment of the present invention.

[0025] Figure 8 is a partial enlarged view of a cable according to an embodiment of the present invention.

[0026] Figure 9It is a perspective view of a semiconductor test radio frequency probe tape in an embodiment of the present invention.

[0027] Description of reference numerals in the figure: housing 10, upper wall surface 11, fifth wall surface 111, sixth wall surface 112, lower wall surface 12, front wall surface 13, rear wall 14, first shell 15, first connection hole 151, first contact surface 152, first wall surface 153, second wall surface 154, first through hole 155, second shell 16, second connection hole 161, second contact surface 162, third wall surface 163, fourth wall surface 164, second through hole 165, probe 50, connector 51, first connection portion 511, second connection portion 512, test head 52, cable 53, inclined plane 531, front end surface 532, first claw 54, first head 541, first middle portion 542, first tail 543, second claw 55, second head 551, second middle portion 552, second tail 553, third claw 56, third head 561, third middle portion 562, third tail 563, inner conductor 57, shielding layer 58, grounding layer 581, insulating layer 582, outer shell 59, bolt 61. Detailed implementation manners

[0028] Here, exemplary embodiments will be described in detail, and examples thereof are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present invention. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0029] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "the" and "said" used in the present invention and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0030] It should be understood that the "first", "second" and similar terms used in the specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, the similar terms such as "one" or "a" do not indicate a quantity limitation, but indicate that there is at least one; "a plurality" indicates a quantity of two or more. Unless otherwise specified, similar terms such as "head", "tail", "lower part" and / or "upper part" are only for convenience of description and are not limited to a position or a spatial orientation. The terms "comprising" or "including" and similar terms mean that the elements or items appearing before "comprising" or "including" cover the elements or items listed after "comprising" or "including" and their equivalents, and do not exclude other elements or items.

[0031] The exemplary embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Without conflict, the features in the following embodiments and implementation manners can be supplemented or combined with each other.

[0032] As Figures 1 to 9 shown, a semiconductor test radio frequency probe conforming to the present invention includes a housing 10 and a probe 50.

[0033] The housing 10 includes an upper wall surface 11, a lower wall surface 12, a front wall surface 13 and a rear wall surface 14. The front wall surface 13 and the rear wall surface 14 are respectively located on the front and rear sides of the housing 10, and the upper wall surface 11 and the lower wall surface 12 are respectively located on the upper and lower sides of the housing 10.

[0034] The probe 50 includes a connector 51, a test head 52 and a cable 53. The cable 53 is at least partially connected between the connector 51 and the test head 52. The connector 51 includes a first connection portion 511 and a second connection portion 512. The first connection portion 511 is located inside the housing 10, and the second connection portion 512 is located outside the housing 10 and on the side of the upper wall surface 11. The cable 53 penetrates forward through the front wall surface 13 from inside the housing 10, and the test head 52 is connected to the front end of the cable 53.

[0035] The front end of the cable 53 includes an inclined plane 531 facing downward, and the test head 52 is attached to the inclined plane 531. By providing the inclined surface 531, the present invention facilitates the tape cutting of the test head 52 and reduces the processing difficulty of the test head 52.

[0036] The test head 52 extends forward beyond the cable 53. The cable 53 includes a front end surface 532, and the front end surface 532 of the cable 53 is perpendicular to the test head 52, thus facilitating the testing of the test head 52.

[0037] As Figure 9 shown, the test head 52 includes a first claw 54, a second claw 55, a third claw 56 and a tape portion 71 that are arranged at intervals. The second claw 55 is located between the first claw 54 and the third claw 56. The second claw 55 is located between the first claw 54 and the third claw 56. The first claw 54 includes a first head 541, a first middle part 542 and a first tail part 543. The second claw 55 includes a second head 551, a second middle part 552 and a second tail part 553. The third claw 56 includes a third head 561, a third middle part 562 and a third tail part 563. The tape portion 71 is connected to the first tail part 543, the second tail part 553 and the third tail part 563. The tape portion 71 is connected to the first tail part 543, the second tail part 553 and the third tail part 563. The tape portion 71 is at the tail of the probe, and the probe head (the first head 541, the second head 551, the third head 561) is not affected by hair debris and will not damage the product contacts, thus being beneficial to producing high-quality semiconductor test radio frequency probes.

[0038] The width of the second middle part 552 is smaller than that of the second tail part 553, and the width of the second head part 561 is smaller than that of the second middle part 552. The second head part 561 and the second tail part 553 are in the shape of straight rods, and the second middle part 552 is in the shape of a cone.

[0039] The first middle part 542 extends from the first tail part 543 towards the second middle part 552. The first head part 541 is parallel to the second head part 552, and the first tail part 543 is parallel to the second tail part 553. The first head part 541 and the first tail part 543 are in the shape of straight rods, and the first middle part 542 is in the shape of a curve.

[0040] The third middle part 562 extends from the third tail part 563 towards the second middle part 552. The third head part 561 is parallel to the second head part 552, and the third tail part 563 is parallel to the second tail part 553. The third head part 561 and the third tail part 563 are in the shape of straight rods, and the third middle part 562 is in the shape of a curve.

[0041] The strip part 74 includes a long strip groove 75. The long strip groove 75 is located at the front end of the strip part 74. The long strip groove 75 penetrates the upper surface 81 of the strip part 74, and the long strip groove 75 does not penetrate the lower surface 82 of the strip part 74. The setting of the long strip groove 75 facilitates the blanking of the strip part 74.

[0042] The long strip groove 75 penetrates the upper surface 81 of the first tail part 543, and the strip part 74 does not penetrate the lower surface 82 of the first tail part 543.

[0043] The long strip groove 75 penetrates the upper surface 81 of the second tail part, and the strip part 74 does not penetrate the lower surface 82 of the second tail part 553.

[0044] The long strip groove 75 penetrates the upper surface 81 of the third tail part, and the strip part 74 does not penetrate the lower surface 82 of the third tail part 563.

[0045] The strip part 74 is provided with a perforation 76. The perforation 76 penetrates the upper surface 81 of the strip part 74 and the lower surface 81 of the strip part 74 in the up and down direction.

[0046] The length of the long strip groove 75 is greater than the sum of the widths of the first claw 54, the second claw 55 and the third claw 56.

[0047] As Figures 1 to 8 shown, the connector 51 is detachably connected to the housing 10, so as to facilitate the replacement of different types of connectors 51. The connector 51 is a radio frequency (RF) connector, so as to facilitate the replacement of different RF connectors to meet different application requirements. The connector 51 includes an external thread (not labeled), and the housing 10 includes an internal thread (not labeled). The connector 51 and the housing 10 are detachably connected through the external thread and the internal thread.

[0048] The housing 10 includes a first housing 15 and a second housing 16, and the first housing 15 and the second housing 16 are detachably connected together. The semiconductor test radio frequency probe further includes a plurality of bolts 61. The first housing 15 includes a first connection hole 151, and the second housing 16 includes a second connection hole 161. The bolts 61 are inserted into the first connection hole 151 and the second connection hole 161, and the bolts 61 detachably connect the first housing 15 and the second housing 16 together. The first housing 15 is provided with a first through hole 155, and the second housing 16 is provided with a second through hole 165. The first through hole 155 and the second through hole 165 are correspondingly arranged, and the cable 53 passes through the first through hole 155 and the second through hole 165. The present invention adopts the first housing 15 and the second housing 1 with a split structure, which can be detached by bolts 61. Different types of housings 10 can be installed according to different requirements, and the applicable scenarios are relatively wide.

[0049] The first housing 15 includes the above-mentioned front wall surface 13 and the above-mentioned lower wall surface 12, and the second housing 16 includes the above-mentioned upper wall surface 11 and the above-mentioned rear wall surface 14. The first housing 15 includes a first contact surface 152 in contact with the second housing 16, and the second housing 16 includes a second contact surface 162 in contact with the first housing 15. The first contact surface 152 includes a first wall surface 153 and a second wall surface 154. The first wall surface 153 is parallel to the lower wall surface 12, and the second wall surface 154 extends forward and upward obliquely from the first wall surface 153. The second contact surface 162 includes a third wall surface 163 and a fourth wall surface 164. The third wall surface 163 is parallel to and in contact with the first wall surface 153, and the fourth wall surface 164 is parallel to and in contact with the second wall surface 154.

[0050] The upper wall surface 11 includes a fifth wall surface 111 and a sixth wall surface 112. The fifth wall surface 111 is parallel to the lower wall surface 12, and the sixth wall surface 112 extends forward and upward obliquely from the fifth wall surface 111. The sixth wall surface 112 is parallel to the second wall surface 154 and the fourth wall surface 164.

[0051] As Figure 8 shown, the second claw 55 includes a second head 551, a second middle part 552 and a second tail 553. The width of the second middle part 552 is smaller than the width of the second tail 553, and the width of the second head 551 is smaller than the width of the second middle part 552. The first claw 54 includes a first head 541, a first middle part 542 and a first tail 543. The first middle part 542 extends from the first tail 543 towards the second middle part 552. The first head 541 is parallel to the second head 551, and the first tail 543 is parallel to the second tail 553. The third claw 56 includes a third head 561, a third middle part 562 and a third tail 563. The third middle part 562 extends from the third tail 563 towards the second middle part 552. The third head 561 is parallel to the second head 551, and the third tail 563 is parallel to the second tail 553.

[0052] The cable 53 includes an inner conductor 57, a shielding layer 58, and a housing 59. The shielding layer 58 includes an insulating layer 582 and a grounding layer 581. The insulating layer 582 is located between the grounding layer 581 and the inner conductor 57, and the grounding layer 581 is located between the housing 59 and the insulating layer 582. Both the grounding layer 581 and the inner conductor 57 are conductive metals, and both the insulating layer 582 and the housing 59 are insulating plastics. The inner conductor 57 is electrically connected to the second claw 55, and the first claw 54 and the third claw 56 are electrically connected to the grounding layer 581. The second claw 55 is used to transmit test signals, and the first claw 54 and the third claw 56 are used for ground shielding.

[0053] Compared with the prior art, in the present invention, through the tape portion 71, the first tail portion 543, the second tail portion 553, and the third tail portion 563, the tape portion 71 is at the probe tail, and the probe head (the first head 541, the second head 551, the third head 561) is not affected by lint and will not damage the product contacts, which is beneficial to producing high-quality semiconductor test radio frequency probes. The setting of the inclined surface 531 facilitates the removal of the tape of the test head 52 and reduces the processing difficulty of the test head 52. The first shell 15 and the second shell 16 with a split structure are detachably connected by bolts 61, and different types of shells 10 can be installed according to different requirements, so the applicable scenarios are relatively wide. The connector 51 is detachably connected to the shell 10, which facilitates the replacement of different types of connectors 51. The connector 51 is a radio frequency (RF) connector, which facilitates the replacement of different RF connectors to meet different application needs.

[0054] The present invention is not limited to the above specific embodiments. Those of ordinary skill in the art starting from the above concepts and making various changes without creative labor fall within the protection scope of the present invention.

Claims

1. A semiconductor test radio frequency probe tape, characterized in that The semiconductor test radio frequency probe tape includes: a first claw, a second claw, a third claw, and a tape portion that are arranged at intervals. The second claw is located between the first claw and the third claw. The first claw includes a first head, a first middle part, and a first tail. The second claw includes a second head, a second middle part, and a second tail. The third claw includes a third head, a third middle part, and a third tail; Wherein, the tape portion is connected to the first tail, the second tail, and the third tail; the tape portion includes a long slot, the long slot is located at the front end of the tape portion, the long slot penetrates the upper surface of the tape portion, the long slot does not penetrate the lower surface of the tape portion, and the setting of the long slot facilitates the blanking of the tape portion.

2. The semiconductor test radio frequency probe tape as described in claim 1, characterized in that: The width of the second middle part is less than the width of the second tail, and the width of the second head is less than the width of the second middle part.

3. The semiconductor test radio frequency probe tape as described in claim 1, characterized in that: The first middle part extends from the first tail towards the second middle part, the first head is parallel to the second head, and the first tail is parallel to the second tail.

4. The semiconductor test radio frequency probe tape as described in claim 1, wherein: The third middle part extends from the third tail towards the second middle part, the third head is parallel to the second head, and the third tail is parallel to the second tail.

5. The semiconductor test radio frequency probe tape as described in claim 1, wherein: The long slot penetrates the upper surface of the first tail, and the tape portion does not penetrate the lower surface of the first tail.

6. The semiconductor test radio frequency probe tape according to claim 1, wherein: The long slot penetrates the upper surface of the second tail, and the tape portion does not penetrate the lower surface of the second tail.

7. The semiconductor test radio frequency probe tape as claimed in claim 1, wherein: The long slot penetrates the upper surface of the third tail, and the tape portion does not penetrate the lower surface of the third tail.

8. The semiconductor test radio frequency probe tape as claimed in claim 1, wherein: The tape portion is provided with a perforation, and the perforation penetrates the upper surface and the lower surface of the tape portion in the up and down direction.

9. The semiconductor test radio frequency probe tape as described in claim 1, wherein: The length of the long slot is greater than the sum of the widths of the first claw, the second claw, and the third claw.

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