Display device, bending gasket module and assembly method thereof

Abstract

The present disclosure provides a display device, a bending gasket module and an assembly method thereof, wherein the display device comprises: a protective cover plate; a display module, comprising a display surface facing a side of the protective cover plate, and a back side facing away from a side of the protective cover plate; a chip-on-chip film, at least partly located on the back side and bound and connected to a side of the display module; a driver chip, located on a side of the chip-on-chip film on the back side facing the display module, and bound and connected to the chip-on-chip film; a bending gasket, located between the driver chip and the back side, and the thickness of the portion of the bending gasket in contact with the driver chip is greater than the thickness of the remaining portion.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display device, a bending gasket module and an assembly method thereof. Background Art

[0002] With the increasing popularity of smart phones and wearable electronic products, people have higher and higher requirements for screen-to-body ratio. Under the trend of full screen, the border of the display module (MDL) is getting narrower and narrower, especially the border binding the display module and the chip on film (COF), which has particularly high requirements and strict control. Summary of the invention

[0003] In one aspect, an embodiment of the present disclosure provides a display device, including:

[0004] Protective cover;

[0005] A display module, comprising a display surface facing the protective cover plate, and a back surface facing away from the protective cover plate;

[0006] A chip-on-chip film, at least partially located on the back surface and bound and connected to one side of the display module;

[0007] A driving chip is located on a side of the chip-on-film on the back side facing the display module and is bound and connected to the chip-on-film;

[0008] The bent gasket is located between the driving chip and the back surface, and the thickness of the portion of the bent gasket in contact with the driving chip is greater than the thickness of the remaining portion.

[0009] Optionally, in the above-mentioned display device provided by the embodiment of the present disclosure, the bending gasket includes: a first film layer and a second film layer stacked together; wherein the second film layer is in contact with the driving chip, and the area of ​​the second film layer is smaller than that of the first film layer.

[0010] Optionally, in the above-mentioned display device provided by an embodiment of the present disclosure, the first film layer and the second film layer are an integrated structure.

[0011] Optionally, in the above display device provided by the embodiment of the present disclosure, the orthographic projection of the second film layer on the plane where the driver chip is located completely covers the driver chip. Optionally, in the above display device provided by the embodiment of the present disclosure, in the vertical direction of the plane where the bending gasket is located, the sum of the thickness of the first film layer and the thickness of the second film layer is greater than or equal to 0.2 mm.

[0012] Optionally, in the above-mentioned display device provided by an embodiment of the present disclosure, one side of the display module bound to the chip-on-film is bent toward the back side, and the entire chip-on-film is located on the back side.

[0013] Optionally, in the above-mentioned display device provided by an embodiment of the present disclosure, one side of the chip-on-film is bound and connected to one side of the display module on the display surface, and the other side of the chip-on-film is bent from the display surface toward the back surface.

[0014] Optionally, in the above-mentioned display device provided by an embodiment of the present disclosure, in the direction of the bending axis, the width of the first film layer is the same as the width of the second film layer.

[0015] Optionally, in the above-mentioned display device provided by an embodiment of the present disclosure, the width of the first film layer and the width of the second film layer are greater than or equal to 7 mm and less than or equal to 12 mm.

[0016] Optionally, in the above-mentioned display device provided by the embodiment of the present disclosure, the cross-section of the bending gasket on the side away from the bending axis is a vertical plane.

[0017] Optionally, in the above-mentioned display device provided by the embodiment of the present disclosure, in the vertical direction of the vertical plane, the length of the first film layer is greater than or equal to 8 mm and less than or equal to 15 mm, and the length of the second film layer is greater than or equal to 3 mm and less than or equal to 7 mm.

[0018] Optionally, in the above display device provided by the embodiment of the present disclosure, it further comprises: a first back film and a heat dissipation film sequentially located on the side of the back surface facing the bent gasket, and a second back film located on the side of the bent gasket away from the back surface;

[0019] In a direction perpendicular to the plane where the bending gasket is located, the thickness of the first film layer is less than or equal to the difference between the bending diameter and the sum of the thickness of the first back film, the thickness of the heat dissipation film, and the thickness of the second back film.

[0020] Optionally, in the above-mentioned display device provided in the embodiment of the present disclosure, it further includes: a flexible circuit board bound and connected to the chip-on-film;

[0021] The COF includes: a first terminal bound and connected to the display module, and a second terminal bound and connected to the flexible circuit board; wherein the first terminal and the second terminal are located on a side of the COF bound to the driving chip.

[0022] On the other hand, an embodiment of the present disclosure provides a bending gasket module, comprising:

[0023] A bending gasket, wherein the bending gasket is the bending gasket in the above-mentioned display device;

[0024] A first release film is located on a side of the bending gasket to be bonded to the back of the display module;

[0025] The second release film is located on a side where the bending gasket and the driving chip are to be bonded.

[0026] Optionally, in the above-mentioned bending gasket module provided in an embodiment of the present disclosure, the second release film includes: a third film layer and a fourth film layer stacked; wherein the fourth film layer is in contact with the first film layer, and the area of ​​the fourth film layer is smaller than the area of ​​the third film layer;

[0027] In a direction perpendicular to the plane where the bending gasket is located, the thickness of the fourth film layer is the same as the thickness of the second film layer; and the orthographic projection of the fourth film layer on the plane where the bending gasket is located does not overlap with the second film layer.

[0028] Optionally, in the above-mentioned bending gasket module provided in the embodiment of the present disclosure, the third film layer and the fourth film layer are an integral structure.

[0029] On the other hand, an embodiment of the present disclosure provides an assembly method of the above-mentioned bending gasket module, comprising:

[0030] Tear off the first release film;

[0031] Laying the side of the bent gasket separated from the first release film to the back side of the display module;

[0032] Tear off the second release film;

[0033] The side of the bent gasket separated from the second release film is attached to the driving chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic cross-sectional structure diagram of a display device provided in an embodiment of the present disclosure;

[0035] Figure 2 A schematic diagram of another cross-sectional structure of a display device provided in an embodiment of the present disclosure;

[0036] Figure 3 A front view of a bent gasket provided in an embodiment of the present disclosure;

[0037] Figure 4 A side view of a bent gasket provided in accordance with an embodiment of the present disclosure;

[0038] Figure 5 A bottom view of a display device provided by an embodiment of the present disclosure;

[0039] Figure 6 For along Figure 5 Sectional view along line I-II;

[0040] Figure 7A side view of a bending gasket module provided in an embodiment of the present disclosure;

[0041] Figure 8 A top view of a second release film provided in an embodiment of the present disclosure;

[0042] Fig. 9 A top view of the bending gasket module provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. It should be noted that the size and shape of the figures in the drawings do not reflect the actual proportions, and the purpose is only to illustrate the contents of the present disclosure. And the same or similar numbers throughout represent the same or similar elements or elements with the same or similar functions. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0044] Unless otherwise defined, the technical or scientific terms used herein shall have the usual meanings understood by persons of ordinary skill in the field to which the present disclosure belongs. The words "first", "second" and similar terms used in the present disclosure specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Inside", "outside", "upper", "lower" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0045] In the related art, in order to ensure that the frame of the display module and the chip-on-chip film is narrow, a bending scheme is generally adopted. Specifically, there are two bending schemes: first, the frame of the chip-on-chip film bound to the display module is bent toward its back; second, the chip-on-chip film is bound to the display surface of the display module, and the chip-on-chip film is bent toward the back of the display module. After bending using the above two bending schemes, a bending spacer is also required to stick the bent chip-on-chip film or display module to the heat dissipation film (SCF) on the back of the display module. Generally, near the bending area is the placement area of ​​the driver chip (D-IC). In actual products, the driver chip bound to the chip-on-chip film is also pasted together with the bending spacer, so as to use the buffering effect of the bending spacer to prevent the driver chip from being damaged during strength tests such as falling / rolling / extrusion of the entire machine. However, with the trend of narrower and narrower borders between the display module and the chip-on-cover film, the bending radius becomes smaller and smaller, resulting in smaller and smaller space between the chip-on-cover film or the display module and the heat dissipation film after bending. As a result, the bending gasket arranged between the chip-on-cover film or the display module and the heat dissipation film after bending becomes thinner and thinner, and the thinner bending gasket cannot play a buffering and protective role for the driver chip.

[0046] In view of the above problems existing in the related art, the present disclosure provides a display device, such as Figure 1 and Figure 2 As shown, including:

[0047] Protective cover 1;

[0048] The display module 2 comprises a display surface A facing the protective cover plate 1 and a back surface facing away from the protective cover plate 1;

[0049] A chip-on-film 3, at least partly located on the back and bound to one side of the display module 2;

[0050] The driving chip 4 is located on the side of the back cover film 3 facing the display module 2 and is bound and connected to the cover film 3;

[0051] The bent gasket 5 is located between the driving chip 4 and the back surface, and the thickness of the portion of the bent gasket 5 that contacts the driving chip 4 is greater than the thickness of the remaining portion.

[0052] In the above-mentioned display device provided by the embodiment of the present disclosure, by making the thickness of the contact portion of the bending gasket 5 with the driver chip 4 greater than the thickness of the remaining portion, the thinner remaining portion can achieve the bonding effect on the bent display module 2 or the chip-on-chip film 3, and at the same time, the thicker contact portion can play a buffering and protective role for the driver chip 4. Therefore, while ensuring the original bonding function of the bending gasket 5, it effectively solves the technical problem in the related art that the bending gasket 5 is too thin to protect the driver chip 4. In addition, since the bending gasket 5 has both the dual functions of bonding and buffering, it avoids the use of two bonding equipment and two bonding processes to respectively achieve the bonding of the bent display module 2 or the chip-on-chip film 3 and the buffering protection of the driver chip 4, thereby ensuring the production efficiency of the production line without the need for additional bonding equipment.

[0053] Optionally, in the above display device provided in the embodiment of the present disclosure, if Figures 1 to 4 As shown, the bending gasket 5 includes: a first film layer 501 and a second film layer 502 which are stacked; wherein the second film layer 502 is in contact with the driver chip 4, and the area of ​​the second film layer 502 is smaller than the area of ​​the first film layer 501. It can be understood that the first film layer 501 in the present disclosure can be equivalent to the bending gasket in the related art. In the present disclosure, the second film layer 502 is specifically added to the area of ​​the first film layer 501 corresponding to the driver chip 4 to achieve the buffering protection effect on the driver chip 4. Optionally, the shape of the second film layer 502 can be a cuboid, a prism, a cylinder, a trapezoidal table, etc.

[0054] Optionally, in the above-mentioned display device provided by the embodiment of the present disclosure, the first film layer 501 and the second film layer 502 can be an integral structure, or can be two independent film layers, which is not limited here. It is easy to understand that when the first film layer 501 and the second film layer 502 are an integral structure, the bending gasket 5 formed by the first film layer 501 and the second film layer 502 can be an organic double-sided adhesive or an inorganic double-sided adhesive; and when the first film layer 501 and the second film layer 502 are two independent film layers, the first film layer 501 is preferably an organic double-sided adhesive or an inorganic double-sided adhesive, and the second film layer 502 has a single-sided adhesive (such as a grid adhesive, Foam) on the side in contact with the driver chip 4.

[0055] Optionally, in the above display device provided in the embodiment of the present disclosure, if Figure 1 , Figure 2 and Figure 5 As shown, the orthographic projection of the second film layer 502 on the plane where the driver chip 4 is located completely covers the driver chip 4, so as to achieve effective protection for the driver chip 4. Figure 5 As shown, the lateral dimension difference Δd between the second film layer 502 and the driving chip 4 is ≥1 mm.

[0056] Optionally, in the display device provided in the embodiment of the present disclosure, in order to better protect the driver chip 4 and make the product thinner as a whole, Figure 1 and Figure 2 As shown, in the vertical direction of the plane where the bending gasket 5 is located, the thickness d of the first film layer 501 is 11 The thickness d of the second film layer 502 12 The sum d1 is greater than or equal to 0.2mm. The upper limit of d1 can be adjusted according to the reserved space of the whole machine. For example, when the reserved space of the whole machine is 0.1mm, d1 can be less than or equal to 0.3mm. Of course, if the reserved space of the whole machine where the driver chip 4 is located is large, the value of d1 can be appropriately increased, so that the driver chip 4 can be more fully protected.

[0057] Optionally, in the display device provided in the embodiment of the present disclosure, in order to ensure that the binding frame is narrow, such as Figure 1 As shown, the side of the display module 2 bound to the chip-on-cover film 3 can be bent toward the back, and the entire chip-on-cover film 3 is located on the back. Figure 2 As shown, one side of the chip-on-film 3 is bound and connected to one side of the display module 2 at the display surface A, and the other side of the chip-on-film 3 is bent from the display surface A toward the back.

[0058] Optionally, in the display device provided in the embodiment of the present disclosure, in order to facilitate the cutting and forming of the bending gasket 5, as shown in FIG. Figures 1 to 3 As shown, in the bending axis direction (i.e. Figure 1 and Figure 2 In the direction perpendicular to the paper surface), the width W of the first film layer 501 11 The width W of the second film layer 502 12 Same, optionally W 11 and W 12 are both greater than or equal to 7 mm and less than or equal to 12 mm. Preferably, in order to further facilitate the cutting and forming of the bending gasket 5, as Figure 1 and Figure 2 As shown, the cross section of the bending gasket 5 away from the bending axis (i.e., the right cross section) is a vertical plane. Optionally, in the vertical direction of the vertical plane, the length L of the first film layer 501 is 11 The length L of the second film layer 502 is greater than or equal to 8 mm and less than or equal to 15 mm. 12 Greater than or equal to 3 mm and less than or equal to 7 mm.

[0059] Optionally, in the above display device provided in the embodiment of the present disclosure, if Figure 1 and Figure 2 As shown, it can also generally include: a first back film 6 and a heat dissipation film 7 located sequentially on the back side facing the bending gasket 5, and a second back film 8 located on the side of the bending gasket 5 away from the back side;

[0060] In the vertical direction of the plane where the bending gasket 5 is located, the thickness d of the first film layer 501 is 11 is less than or equal to the difference between the bending diameter 2R and the sum of the thickness d2 of the first back film 6, the thickness d3 of the heat dissipation film 7, and the thickness d4 of the second back film 8. Figure 1 The thickness d of the first film layer 501 is 11 The thickness d2 of the first back film 6, the thickness d3 of the heat dissipation film 7, the thickness d4 of the second back film 8, and the thickness d5 of the display module 2 are equal to the difference between the bending diameter 2R and the sum of the thickness d2 of the first back film 6, the thickness d3 of the heat dissipation film 7, the thickness d4 of the second back film 8, and the thickness d5 of the display module 2, that is 11 is smaller than the difference between the bending diameter 2R and the sum of the thickness d2 of the first back film 6, the thickness d3 of the heat dissipation film 7, and the thickness d4 of the second back film 8; Figure 2 The thickness d of the first film layer 501 is 11 It is equal to the difference between the bending diameter 2R and the sum of the thickness d2 of the first back film 6 , the thickness d3 of the heat dissipation film 7 , and the thickness d4 of the second back film 8 .

[0061] Optionally, in the above display device provided in the embodiment of the present disclosure, if Figure 1 , Figure 2 and Figure 6 As shown, it may also include: a flexible circuit board 9 bound and connected to the chip-on-film 3;

[0062] The COF 3 includes: a first terminal 301 connected to the display module 2, and a second terminal 302 connected to the flexible circuit board 9; wherein the first terminal 301 and the second terminal 302 are located on one side of the COF 3 connected to the driver chip 4. Figure 6 As shown, the display module 2 is provided with display terminals 301 ′ corresponding to the first terminals 301 one by one, and the flexible circuit board 9 is provided with connection terminals 302 ′ corresponding to the second terminals 302 one by one.

[0063] Since the first terminal 301, the second terminal 302 and the driver chip 4 are located on different sides, the COF 3 needs to be made into a double-layer board, which is costly. In the present disclosure, the first terminal 301 and the second terminal 302 are arranged on the side of the COF 3 bound to the driver chip 4, so that the COF 3 can be made into a single-layer board, thereby reducing the cost.

[0064] Generally, in the above-mentioned display device provided in the embodiment of the present disclosure, if Figure 1 and Figure 2 As shown, it may also include: a polarizer 10 located on the side where the display surface A of the display module 2 is located, a first optical adhesive (OCA) layer 11 located between the display module 2 and the polarizer 10, and a second optical adhesive layer 12 located between the polarizer 10 and the protective cover plate 10.

[0065] Based on the same inventive concept, an embodiment of the present disclosure provides a bending gasket module. Since the principle of solving the problem by the bending gasket module is similar to the principle of solving the problem by the above-mentioned display device, the implementation of the bending gasket module provided by the embodiment of the present disclosure can refer to the implementation of the above-mentioned display device provided by the embodiment of the present disclosure, and the repeated parts will not be repeated.

[0066] Specifically, the embodiment of the present disclosure provides a bending gasket module, such as Figure 7 As shown, including:

[0067] A bending gasket 5, which is the bending gasket 5 in the above-mentioned display device;

[0068] The first release film 13 is located on the side where the bending gasket 5 and the back surface of the display module 2 are to be bonded;

[0069] The second release film 14 is located on the side where the bending gasket 5 and the driving chip 4 are to be bonded.

[0070] Film material attaching factories generally use roller attaching to attach the bending gasket 5 to the back of the display module 2. Therefore, it is required that the bending gasket 5 should not have a step difference on the surface of the second release film 14 when the roller is attached. However, the bending gasket 5 itself has a step difference. If the second release film 14 uses a conventional uniform thickness release film, there will inevitably be a step difference on the surface of the second release film 14, which is not conducive to roller attachment. Therefore, the present disclosure proposes a new structural design for the second release film 14. Specifically, Figure 7 As shown, the thickness of the portion of the second release film 14 in contact with the first film layer 501 is greater than the thickness of other portions, thereby weakening the surface discontinuity of the second release film 14 .

[0071] Optionally, in the above-mentioned bending gasket module provided in the embodiment of the present disclosure, as Figure 7 and Figure 8 As shown, the second release film 14 includes: a third film layer 1401 and a fourth film layer 1402 which are stacked; wherein the fourth film layer 1402 is in contact with the first film layer 501, and the area of ​​the fourth film layer 1402 is smaller than the area of ​​the third film layer 1401. It can be understood that the third film layer 1401 in the present disclosure can be equivalent to a conventional equal-thickness release film in the related art. In the present disclosure, the fourth film layer 1402 is specifically provided in the area of ​​the third film layer 1401 corresponding to the first film layer 501 and not overlapping with the second film layer 502, so as to cooperate with the bending gasket 5 of the special-shaped structure, so as to facilitate the use of a roller to attach the bending gasket module to the back of the display module 2.

[0072] Optionally, in the above-mentioned bending gasket module provided in the embodiment of the present disclosure, as Figure 7As shown, in the vertical direction of the plane where the bending gasket 5 is located, the thickness d6 of the fourth film layer 1402 and the thickness d 12 The same, in order to minimize the difference.

[0073] Optionally, in the above-mentioned bending gasket module provided in the embodiment of the present disclosure, as Figure 7 As shown, the orthographic projection of the fourth film layer 1402 on the plane where the bending gasket 5 is located does not overlap with the second film layer 502. Here, it is mainly considered that when the second release film 14 is attached to the bending gasket 5, if there is no gap between the fourth film layer 1402 and the second film layer 502, the side of the fourth film layer 1402 will be attached to the side of the second film layer 502, so that the surface of the third film layer 1401 will appear to be convex and uneven, resulting in the roller being unable to attach. Optionally, the distance S between the fourth film layer 1402 and the second film layer 502 can be greater than or equal to 0.3mm and less than or equal to 0.8mm, preferably 0.5mm.

[0074] Optionally, in the above-mentioned bending gasket module provided in the embodiment of the present disclosure, as Figure 7 and Fig. 9 As shown, the orthographic projection of the fourth film layer 1402 on the plane where the bending gasket 5 is located and the area where the orthographic projection of the third film layer 1401 on the plane where the bending gasket 5 is located and the area where the first film layer 501 is not overlapped completely overlap. The purpose of this is to use the third film layer 1401 and the fourth film layer 1402 that are extra relative to the first film layer 501 as tearing handles, and to ensure that when the first film layer 501 is torn off, the third film layer 1401 that fills the gap of the bending gasket 5 is also torn off together and will not remain on the product. Here, the adhesion between the third film layer 1401 and the fourth film layer 1402 can also be adjusted to ensure that the two can be torn off together, but from the actual situation, the adhesion between the third film layer 1401 and the fourth film layer 1402 is unstable, so that the two can sometimes be torn off together and sometimes cannot be torn off together, resulting in the equipment sometimes working normally and sometimes alarming, which is not conducive to mass production.

[0075] Optionally, in the above-mentioned bending gasket module provided in the embodiment of the present disclosure, the third film layer 1401 and the fourth film layer 1402 can be an integral structure or two independent film layers, which is not limited here.

[0076] Optionally, in the bending gasket module provided in the embodiment of the present disclosure, since the first release film 13 is in contact with and adheres to the first film layer 501 of equal thickness design, the first release film 13 can be a film of equal thickness without special design.

[0077] Accordingly, the embodiment of the present disclosure provides an assembly method of the above-mentioned bending gasket module, comprising:

[0078] Tear off the first release film;

[0079] The side of the bent gasket separated from the first release film is attached to the back of the display module; specifically, the first film layer of the bent gasket is attached to the heat dissipation film on the back of the display module by roller attachment;

[0080] Tear off the second release film;

[0081] The bent gasket is separated from one side of the second release film and is bonded to the driver chip.

[0082] In the above-mentioned display device, bending gasket module and assembly method thereof provided in the embodiment of the present disclosure, the display device includes: a protective cover plate; a display module, including a display surface facing the protective cover plate, and a back side away from the protective cover plate; a chip-on-cover film, at least partly located on the back side and bound and connected to one side of the display module; a driver chip, located on the side of the chip-on-cover film on the back side facing the display module, and bound and connected to the chip-on-cover film; a bending gasket, located between the driver chip and the back side, and the thickness of the portion of the bending gasket in contact with the driver chip is greater than the thickness of the remaining portion. By making the thickness of the portion of the bending gasket in contact with the driver chip greater than the thickness of the remaining portion, the thinner remaining portion can achieve a bonding effect on the bent display module or the chip-on-cover film, and at the same time, the thicker contact portion can play a buffering and protective role on the driver chip. Therefore, while ensuring the original bonding function of the bending gasket, the technical problem of the bending gasket being too thin to protect the driver chip in the related art is effectively solved.

[0083] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present disclosure without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if these modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is also intended to include these modifications and variations.

Claims

1. A bending gasket module, wherein: include: A bending gasket, the bending gasket comprising: a first film layer and a second film layer stacked; wherein the second film layer is in contact with the driving chip, and the area of ​​the second film layer is smaller than the area of ​​the first film layer; A first release film is located on a side of the bending gasket to be bonded to the back of the display module; A second release film is located on a side where the bending gasket and the driving chip are to be bonded; The second release film comprises: a third film layer and a fourth film layer stacked in layers; wherein The fourth film layer contacts the first film layer, and an area of ​​the fourth film layer is smaller than an area of ​​the third film layer; In a direction perpendicular to the plane where the bending gasket is located, the thickness of the fourth film layer is the same as the thickness of the second film layer; and the orthographic projection of the fourth film layer on the plane where the bending gasket is located does not overlap with the second film layer.

2. The bending gasket module according to claim 1, wherein: The third film layer and the fourth film layer are an integrated structure.

3. A display device, wherein: include: Protective cover; A display module, comprising a display surface facing the protective cover plate, and a back surface facing away from the protective cover plate; A chip-on-chip film, at least partially located on the back surface and bound and connected to one side of the display module; A driving chip is located on a side of the chip-on-film on the back side facing the display module and is bound and connected to the chip-on-film; A bending gasket is located between the driving chip and the back surface, and the bending gasket is a bending gasket of the bending gasket module as claimed in claim 1 or 2.

4. The display device according to claim 3, wherein: The first film layer and the second film layer are an integrated structure.

5. The display device according to claim 4, wherein: The orthographic projection of the second film layer on the plane where the driver chip is located completely covers the driver chip.

6. The display device according to claim 4, wherein: In a direction perpendicular to the plane where the bending gasket is located, the sum of the thickness of the first film layer and the thickness of the second film layer is greater than or equal to 0.2 mm.

7. The display device according to claim 4, wherein: The display module is bound to a side of the chip-on-film that is bent toward the back surface, and the entire chip-on-film is located on the back surface.

8. The display device according to claim 4, wherein: One side of the chip-on-film is bound and connected to the display surface and one side of the display module, and the other side of the chip-on-film is bent from the display surface toward the back surface.

9. The display device according to claim 7 or 8, wherein: In the bending axis direction, the width of the first film layer is the same as the width of the second film layer.

10. The display device according to claim 9, wherein: The width of the first film layer and the width of the second film layer are greater than or equal to 7 mm and less than or equal to 12 mm.

11. The display device according to claim 7 or 8, wherein: The cross section of the bending gasket away from the bending axis is a vertical plane.

12. The display device according to claim 11, wherein: In the vertical direction of the vertical plane, the length of the first film layer is greater than or equal to 8 mm and less than or equal to 15 mm, and the length of the second film layer is greater than or equal to 3 mm and less than or equal to 7 mm.

13. The display device according to claim 7 or 8, wherein: It also includes: a first backing film and a heat dissipation layer sequentially located on the back side facing the bent gasket, and a second backing film located on the bent gasket side away from the back side; In a direction perpendicular to the plane where the bending gasket is located, the thickness of the first film layer is less than or equal to the difference between the bending diameter and the sum of the thickness of the first back film, the thickness of the heat dissipation layer, and the thickness of the second back film.

14. The display device according to claim 3, wherein: It also includes: a flexible circuit board bound and connected to the chip-on-film; The COF includes: a first terminal bound and connected to the display module, and a second terminal bound and connected to the flexible circuit board; wherein the first terminal and the second terminal are located on a side of the COF bound to the driving chip.

15. A method for assembling the bending gasket module as claimed in claim 1 or 2, wherein: include: Tear off the first release film; Laying the side of the bent gasket separated from the first release film to the back side of the display module; Tear off the second release film; The side of the bent gasket separated from the second release film is attached to the driving chip.

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