Antenna device

Abstract

The first conductive plate (110) is located apart from the first surface (302) of the substrate (300) and on the first surface (302) side of the substrate (300). In addition, the first conductive plate (110) has an opening (112). The first conductive portion (120) electrically connects the first conductive plate (110) and the substrate (300). The second conductive plate (210) is located apart from the first surface (302) of the substrate (300) and on the first surface (302) side of the substrate (300). The second conductive portion (220) electrically connects the second conductive plate (210) and the substrate (300). The second conductive plate (210) is located inside the opening (112) of the first conductive plate (110).

Description

TECHNICAL FIELD

[0001] The present application relates to an antenna device. BACKGROUND

[0002] In recent years, an antenna device having a plurality of resonators has been developed. For example, as described in Patent Document 1, an antenna device having a laminated patch antenna has been developed. The antenna device of Patent Document 1 has a substrate (for example, a printed circuit board (PCB)), a first patch antenna, and a second patch antenna. The first patch antenna is adjusted to be used for a first frequency band (for example, a Satellite Digital Audio Radio Service (SDARS) frequency band). The second patch antenna is adjusted to be used for a second frequency band (for example, a Global Positioning System (GPS) frequency band). The second patch antenna is positioned on the substrate. The first patch antenna is positioned on the second patch antenna.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT DOCUMENTS

[0005] Patent Document 1: U.S. Patent No. 7277056 SUMMARY

[0006] The present inventors have examined a problem of making the manufacturing of an antenna device having a plurality of resonators easy. For example, in the case of the antenna device of Patent Document 1, sometimes the characteristics (for example, a resonance frequency) of the antenna device vary with unevenness of the dielectric material of the first patch antenna and the second patch antenna. Therefore, in order to suppress the variation of the characteristics of the antenna device, sometimes a complicated process is required for the manufacturing of the antenna device.

[0007] One of the objects of the present application is to make the manufacturing of an antenna device easy. Other objects of the present application will be apparent from the description of the present specification.

[0008] An antenna device of one embodiment of the present application has:

[0009] a substrate having a first surface;

[0010] a first resonator having a first conductive plate and a first conductive portion, the first conductive plate being apart from the first surface of the substrate and positioned on the first surface side of the substrate, the first conductive plate having an opening, the first conductive portion electrically connecting the first conductive plate and the substrate; and

[0011] a second resonator having a second conductive plate and a second conductive portion, the second conductive plate being apart from the first surface of the substrate and positioned on the first surface side of the substrate, the second conductive portion electrically connecting the second conductive plate and the substrate,

[0012] The second conductive plate is located inside the opening of the first conductive plate.

[0013] Inventive Effects

[0014] According to the above-described aspect of the present application, it is possible to make the manufacturing of the antenna device easy. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a perspective view of an antenna device of an embodiment.

[0016] Figure 2 is a perspective view of a first resonator shown in Figure 1 from the opposite side of Figure 1 is a perspective view of a second resonator shown in

[0017] Figure 3 is a perspective view of a second resonator shown in Figure 1 from the opposite side of Figure 1 is a perspective view of a second resonator shown in

[0018] Figure 4 is a plan view of a first face of a substrate shown in Figure 1

[0019] Figure 5 is a plan view of a second face of a substrate shown in Figure 1

[0020] is a block diagram showing a part of the antenna device shown in Figure 6 Figure 1

[0021] Figure 7 is a chart showing an example of a frequency characteristic of VSWR (Voltage Standing Wave Ratio) in each of a first feeding section (observation point P1 of Figure 6 ) and a second feeding section (observation point P2 of Figure 6 ) of the first resonator.

[0022] Figure 8 is a chart showing an example of a frequency characteristic of VSWR in each of a first feeding section (observation point P3 of Figure 6 ) and a second feeding section (observation point P4 of Figure 6 ) of the second resonator.

[0023] Figure 9 is a chart showing an example of a frequency characteristic of VSWR in a section (observation point P5 of Figure 6 ) of the first hybrid circuit connected to the duplexer.

[0024] Figure 10 is a chart showing an example of a frequency characteristic of VSWR in a section (observation point P6 of Figure 6 ​​​A graph illustrating the frequency characteristics of the VSWR at observation point P6.

[0025] Figure 11 This indicates the input / output section of the duplexer. Figure 6 A graph showing an example of the frequency characteristics of the VSWR at observation point P7.

[0026] Figure 12 This is a diagram illustrating an example of the pointing characteristics of the gain (dBi) of the first oscillator.

[0027] Figure 13 This is a diagram illustrating an example of the pointing characteristics of the axial ratio (dB) of the first oscillator.

[0028] Figure 14 This is a diagram illustrating an example of the pointing characteristics of the gain (dBi) of the second oscillator.

[0029] Figure 15 This is a diagram illustrating an example of the pointing characteristics of the axial ratio (dB) of the second oscillator.

[0030] Figure 16 This is an example graph showing the relationship between the heights of the first and second oscillators and the directional characteristics of the gain of the second oscillator.

[0031] Figure 17 This is a perspective view of the antenna device in the first modified example.

[0032] Figure 18 This is a perspective view of the antenna device in the second variation. Detailed Implementation

[0033] Hereinafter, the antenna device according to an embodiment of the present invention will be described using the accompanying drawings. Furthermore, in all the drawings, the same reference numerals are used for the same constituent elements, and descriptions are omitted where appropriate. The antenna device of this embodiment described below can be used, for example, as a vehicle-mounted antenna device; in addition, besides vehicle-mounted applications, it can be used in various devices depending on its intended use.

[0034] In this specification, unless otherwise specified, the ordinal numbers such as "first", "second", "third" are used only to distinguish the constituents with the same name, and do not imply any specific characteristics of the constituents (e.g., order or importance).

[0035] Figure 1 This is a perspective view of the antenna device 10 according to the embodiment. Figure 2 From Figure 1 Observe from the opposite side Figure 1 The first oscillator 100 is shown in a three-dimensional view. Figure 3 From Figure 1 Observe from the opposite side Figure 1A perspective view of the second resonator 200 is shown.

[0036] The antenna device 10 will be described in detail using Figure 1 The antenna device 10 has the first resonator 100, the second resonator 200, and the substrate 300. The substrate 300 has a first surface 302 and a second surface 304. The second surface 304 is on the opposite side of the first surface 302. The first resonator 100 has a first conductive plate 110, two first conductive portions 120, and four third conductive portions 130. The second resonator 200 has a second conductive plate 210, two second conductive portions 220, and four fourth conductive portions 230. The first conductive plate 110 is apart from and on (on the first surface 302 side) the first surface 302 of the substrate 300. The first conductive plate 110 is opposite to the first surface 302. The first conductive plate 110 can be parallel or inclined to the first surface 302 as long as it is opposite to the first surface 302. In addition, the first conductive plate 110 has an opening 112. Each of the first conductive portions 120 is connected to the first conductive plate 110, and electrically connects the first conductive plate 110 and the substrate 300. Each of the third conductive portions 130 is connected to the first conductive plate 110, and is inserted into the substrate 300. The second conductive plate 210 is apart from and on (on the first surface 302 side) the first surface 302 of the substrate 300. The second conductive plate 210 is opposite to the first surface 302. The second conductive plate 210 can be parallel or inclined to the first surface 302 as long as it is opposite to the first surface 302. The second conductive plate 210 is inside the opening 112 of the first conductive plate 110 as viewed in a direction perpendicular to the first surface 302 of the substrate 300. Each of the second conductive portions 220 is connected to the second conductive plate 210, and electrically connects the second conductive plate 210 and the substrate 300. Each of the fourth conductive portions 230 is connected to the second conductive plate 210, and is inserted into the substrate 300.

[0037] According to the present embodiment, the characteristics (e.g., resonance frequency) of the first resonator 100 can be adjusted by a simple method such as adjustment of the shape of the first conductive plate 110, adjustment of the distance between the first conductive plate 110 and the substrate 300, and the like. The characteristics of the second resonator 200 can also be adjusted by the same simple method. Thus, the manufacturing of the antenna device 10 can be facilitated.

[0038] The antenna device 10 will be described in detail using Figures 1 to 3 The antenna device 10 will be described in detail using

[0039] In the present embodiment, the first vibrator 100 and the second vibrator 200 have resonance frequencies different from each other. For example, the resonance frequency of the second vibrator 200 is higher than the resonance frequency of the first vibrator 100. However, the resonance frequency of the second vibrator 200 can be lower than the resonance frequency of the first vibrator 100, or can be the same as the resonance frequency of the first vibrator 100. More specifically, in the present embodiment, the first vibrator 100 functions as a GNSS (Global Navigation Satellite System) band antenna (for example, a GPS (Global Positioning Satellite) band antenna), and the second vibrator 200 functions as an SXM (SiriusXM) band antenna. However, as will be clear from the description of the present specification, the same configuration as the present embodiment can also be applied to an antenna different from the above-described antennas.

[0040] In the present embodiment, the distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second vibrator 200 is greater than or equal to the distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first vibrator 100. Specifically, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second vibrator 200 is greater than or equal to the shortest distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first vibrator 100. In this case, as will be described later, it is possible to make the gain of the second vibrator 200 good. However, it can also be that, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second vibrator 200 is shorter than the shortest distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first vibrator 100.

[0041] The first vibration piece 100 is made of sheet metal. Specifically, the first conductive plate 110, the first conductive portion 120, and the third conductive portion 130 are integrated. In other words, the first conductive portion 120 and the third conductive portion 130 are physically connected to the first conductive plate 110. Also, a portion of the first vibration piece 100 from the first conductive plate 110 to the first conductive portion 120 and the third conductive portion 130 is bent from a direction along the first surface 302 of the substrate 300 toward a direction toward the first surface 302 of the substrate 300. The first vibration piece 100 is formed by bending sheet metal. Therefore, compared to a case where the first conductive portion 120 and the third conductive portion 130 are attached to the first conductive plate 110 by welding, the first vibration piece 100 can be easily manufactured. However, the manufacturing method of the first vibration piece 100 is not limited to this example. For example, at least one of the first conductive portion 120 and the third conductive portion 130 can not be integrated with the first conductive plate 110 by bending sheet metal, but can be attached to the first conductive plate 110 by welding, for example, to be integrated with the first conductive plate 110.

[0042] The first conductive plate 110 has an inner edge that defines the opening 112, and an outer edge that is located outside the inner edge. The inner edge of the first conductive plate 110 is a region of a quadrangle (the opening 112). However, the shape of the inner edge of the first conductive plate 110 is not limited to the above-described quadrangular shape, and can be a circular shape or a polygonal shape, for example. The outer edge of the first conductive plate 110 is a region of a rectangle (the quadrangle can not be a strict quadrangle. By bending the third conductive portion 130 toward the direction from the first conductive plate 110 toward the first surface 302 of the substrate 300, the shape becomes a shape in which four corners of the quadrangle are cut off. That is, strictly speaking, the shape of the outer edge of the first conductive plate 110 is an octagonal shape.). The outer edge of the first conductive plate 110 does not have a cutout that is recessed toward the inner side of the first conductive plate 110 or a protrusion that protrudes toward the outer side of the first conductive plate 110. That is, each side of the outer edge of the first conductive plate 110 is a straight line shape. Therefore, compared to a case where the outer edge of the first conductive plate 110 has a cutout that is recessed toward the inner side of the first conductive plate 110 or a protrusion that protrudes toward the outer side of the first conductive plate 110, the first vibration piece 100 is easily bent, and the molding of the first vibration piece 100 becomes easy. Also, compared to a case where the outer edge of the first conductive plate 110 has a cutout that is recessed toward the inner side of the first conductive plate 110 or a protrusion that protrudes toward the outer side of the first conductive plate 110, the adjustment of the length (also including the electrical length) of each side of the outer edge of the first conductive plate 110 is easy, and the design of the first vibration piece 100 becomes easy. However, the shape of the outer edge of the first conductive plate 110 is not limited to the above-described shape, and can be a circle, for example. In addition, the outer edge of the first conductive plate 110 can have the above-described cutout or protrusion.

[0043] The four third conductive portions 130 (third conductive portion 130a, third conductive portion 130b, third conductive portion 130c, and third conductive portion 130d) are located at positions that are 90° apart around the center of the first conductive plate 110. Therefore, compared to a case in which less than four (for example, two) third conductive portions 130 are provided, the first vibrator 100 can be stably supported by the substrate 300 via the four third conductive portions 130. Each third conductive portion 130 is fixed to the substrate 300, for example, by solder (not shown). In the present embodiment, the four third conductive portions 130 are connected to the outer edge of the first conductive plate 110. In more detail, the four third conductive portions 130 are connected to the four corners of the outer edge of the first conductive plate 110. In this way, each third conductive portion 130 is electrically connected to the outer edge of the first conductive plate 110. However, the number and arrangement of the third conductive portions 130 are not limited to those shown in the example. Figure 1 and Figure 2

[0044] The two first conductive portions 120 (first conductive portion 120a and first conductive portion 120b) are located at positions that are 90° apart around the center of the first conductive plate 110. Two feed points are formed by the two first conductive portions 120. Therefore, the first vibrator 100 can transmit and receive circularly polarized waves. The first vibrator 100 can be more stably supported by the substrate 300 by using not only the third conductive portions 130 but also the first conductive portions 120. Each first conductive portion 120 is fixed to the substrate 300, for example, by solder (not shown). In the present embodiment, the two first conductive portions 120 are connected to the outer edge of the first conductive plate 110. In more detail, the first conductive portion 120a is connected to the center portion between the third conductive portion 130a and the third conductive portion 130b in the outer edge of the first conductive plate 110. The first conductive portion 120b is connected to the center portion between the third conductive portion 130a and the third conductive portion 130d in the outer edge of the first conductive plate 110. In this way, each first conductive portion 120 is electrically connected to the outer edge of the first conductive plate 110. In the present embodiment, the first vibrator 100 can be formed by bending the first conductive portions 120 located at the outer edge of the first conductive plate 110 toward the first surface 302 of the substrate 300. Therefore, compared to a case in which the first conductive portions 120 are connected to the inner edge of the first conductive plate 110, the first vibrator 100 is easily bent, and the first vibrator 100 is easily manufactured. However, the number and arrangement of the first conductive portions 120 are not limited to those shown in the example. Figure 1 and Figure 2 ​The first conductive portion 120 can be connected to the inner edge of the first conductive plate 110. The number of the first conductive portions 120 can be one or more. The number of the feeding points can be less than the number of the first conductive portions 120. In this case, the first conductive portion 120 not forming the feeding point functions as a support portion of the first vibrator 100.

[0045] The second vibrator 200 is made of a sheet metal material. Specifically, the second conductive plate 210, the second conductive portion 220, and the fourth conductive portion 230 are integrated. In other words, the second conductive portion 220 and the fourth conductive portion 230 are physically connected to the second conductive plate 210. Moreover, the portion of the second vibrator 200 from the second conductive plate 210 to the second conductive portion 220 and the fourth conductive portion 230 is bent in a direction toward the first surface 302 of the substrate 300 from the first surface 302 of the substrate 300. The second vibrator 200 is formed by bending the sheet metal material. Therefore, the second vibrator 200 can be easily manufactured compared to the case where the second conductive portion 220 and the fourth conductive portion 230 are attached to the second conductive plate 210 by welding. However, the manufacturing method of the second vibrator 200 is not limited to this example. For example, at least one of the second conductive portion 220 and the fourth conductive portion 230 can not be integrated with the second conductive plate 210 by bending the sheet metal material, but can be attached to the second conductive plate 210 by welding, for example, to be integrated with the second conductive plate 210.

[0046] The second conductive plate 210 has a quadrangular shape (the quadrangular shape can not be a strict quadrangular shape. By making the fourth conductive portion 230 be bent from the second conductive plate 210 in a direction toward the first surface 302 of the substrate 300, four corners of the quadrangular shape are cut off. That is, the shape of the second conductive plate 210 is strictly an octagonal shape.) The outer edge of the second conductive plate 210 does not have a cutout recessed toward the inside of the second conductive plate 210 or a protrusion protruding toward the outside of the second conductive plate 210. That is, each side of the outer edge of the second conductive plate 210 is in a straight line shape. Therefore, compared to a case where the outer edge of the second conductive plate 210 has a cutout recessed toward the inside of the second conductive plate 210 or a protrusion protruding toward the outside of the second conductive plate 210, the second vibrator 200 is easily bent, and the molding of the second vibrator 200 becomes easy. Also, compared to a case where the outer edge of the second conductive plate 210 has a cutout recessed toward the inside of the second conductive plate 210 or a protrusion protruding toward the outside of the second conductive plate 210, the adjustment of the length (also including the electrical length) of each side of the outer edge of the second conductive plate 210 is easy, and the design of the second vibrator 200 becomes easy. However, the shape of the outer edge of the second conductive plate 210 is not limited to the above-described shape, and can be, for example, a circular shape and a polygonal shape. In addition, the outer edge of the second conductive plate 210 can have the above-described cutout or protrusion.

[0047] The four fourth conductive portions 230 (the fourth conductive portion 230a, the fourth conductive portion 230b, the fourth conductive portion 230c, and the fourth conductive portion 230d) are located at positions that are 90° apart around the center of the second conductive plate 210. Therefore, compared to a case where less than four (for example, two) fourth conductive portions 230 are provided, the second vibrator 200 can be stably supported by the four fourth conductive portions 230 to the substrate 300. Each fourth conductive portion 230 is fixed to the substrate 300 by, for example, solder (not shown). In the present embodiment, the four fourth conductive portions 230 are connected to the outer edge of the second conductive plate 210. In more detail, the four fourth conductive portions 230 are connected to the four corners of the outer edge of the second conductive plate 210. In this way, each fourth conductive portion 230 is electrically connected to the outer edge of the second conductive plate 210. However, the number and the arrangement of the fourth conductive portions 230 are not limited to the example shown in FIG. 2. Figure 1 and Figure 3

[0048] ​Two second conductive portions 220 (second conductive portion 220a and second conductive portion 220b) are located at positions that are 90° apart around the center of the second conductive plate 210. Two feeding points are formed by the two second conductive portions 220. Thus, the second vibrator 200 can transmit and receive circularly polarized waves. The second vibrator 200 can be more stably supported to the substrate 300 by using the second conductive portion 220 in addition to the fourth conductive portion 230. Each second conductive portion 220 is fixed to the substrate 300 by, for example, solder (not shown). In the present embodiment, the two second conductive portions 220 are connected to the outer edge of the second conductive plate 210. More specifically, the second conductive portion 220a is connected to the center portion between the fourth conductive portion 230a and the fourth conductive portion 230b in the outer edge of the second conductive plate 210. The second conductive portion 220b is connected to the center portion between the fourth conductive portion 230c and the fourth conductive portion 230d in the outer edge of the second conductive plate 210. In this way, each second conductive portion 220 is electrically connected to the outer edge of the second conductive plate 210. However, the number and arrangement of the second conductive portions 220 are not limited to the example shown in FIG. 8. For example, the number of second conductive portions 220 can be one to form only one feeding point, or three or more to form three or more feeding points. Alternatively, even if the number of second conductive portions 220 is plural, the number of feeding points can be less than the number of second conductive portions 220. In this case, the second conductive portions 220 that do not form feeding points function as support portions of the second vibrator 200. Figure 1 and Figure 3 For example, the number of second conductive portions 220 can be one to form only one feeding point, or three or more to form three or more feeding points. Alternatively, even if the number of second conductive portions 220 is plural, the number of feeding points can be less than the number of second conductive portions 220. In this case, the second conductive portions 220 that do not form feeding points function as support portions of the second vibrator 200.

[0049] In the present embodiment, the third conductive portion 130 (third conductive portion 130a) around the center of the first conductive plate 110 between the two first conductive portions 120 and the fourth conductive portion 230 (fourth conductive portion 230c) around the center of the second conductive plate 210 between the two second conductive portions 220 are located on opposite sides of the center of the first conductive plate 110 or the second conductive plate 210. The two first conductive portions 120 and the two second conductive portions 220 are located at symmetrical positions across the center of the first conductive plate 110 or the second conductive plate 210. Thus, the two first conductive portions 120 of the first vibrator 100 and the two second conductive portions 220 of the second vibrator 200 can be spaced apart by a sufficient distance from each other. Thus, isolation between the first vibrator 100 and the second vibrator 200 can be ensured. However, the layout of the first vibrator 100 and the second vibrator 200 is not limited to this example.

[0050] In the present embodiment, the antenna device 10 has two vibrators (the first vibrator 100 and the second vibrator 200). However, the antenna device 10 can further have other vibrators. The other vibrators can be located outside the second vibrator 200 in a manner surrounding the second vibrator 200, for example.

[0051] In the present embodiment, the first resonator 100 has the third conductive portion 130. However, the first resonator 100 can not have the third conductive portion 130. Even when the first resonator 100 does not have the third conductive portion 130, the first conductive plate 110 can be supported by the first conductive portion 120 in such a manner that the first conductive plate 110 is separated from the first surface 302 of the substrate 300. Similarly, the second resonator 200 can not have the fourth conductive portion 230.

[0052] In the present embodiment, the center of the first conductive plate 110 and the center of the second resonator 200 are aligned with each other. However, the center of the first conductive plate 110 and the center of the second resonator 200 can be offset from each other.

[0053] In the present embodiment, the first resonator 100 and the second resonator 200 do not have a conductive portion for grounding to the substrate 300. Therefore, it is not necessary to form such a conductive portion, and the manufacturing of the first resonator 100 and the second resonator 200 becomes easy. However, at least one of the first resonator 100 and the second resonator 200 can have a conductive portion for grounding to the substrate 300.

[0054] In the present embodiment, the first conductive portion 120 and the third conductive portion 130 are physically directly connected to the first conductive plate 110. However, the first conductive portion 120 and the third conductive portion 130 can be physically separated from the first conductive plate 110, and can be electrically connected to the first conductive plate 110 via a conductive member (for example, a copper wire). Similarly, in the present embodiment, the second conductive portion 220 and the fourth conductive portion 230 are physically directly connected to the second conductive plate 210. However, the second conductive portion 220 and the fourth conductive portion 230 can be physically separated from the second conductive plate 210, and can be electrically connected to the second conductive plate 210 via a conductive member (for example, a copper wire).

[0055] In the present embodiment, the first conductive portion 120 and the third conductive portion 130 are conductive plates. However, the first conductive portion 120 and the third conductive portion 130 can be, for example, a wire having conductivity such as a copper wire. The first conductive portion 120 only needs to be able to electrically connect the first conductive plate 110 and the substrate 300. Similarly, the second conductive portion 220 and the fourth conductive portion 230 are conductive plates. However, the second conductive portion 220 and the fourth conductive portion 230 can be, for example, a wire having conductivity such as a copper wire. The second conductive portion 220 only needs to be able to electrically connect the second conductive plate 210 and the substrate 300.

[0056] In this embodiment, all components constituting the second oscillator 200 (the second conductive plate 210, the second conductive portion 220, and the fourth conductive portion 230) are located inside the opening 112 of the first conductive plate 110. However, it is also possible that some components constituting the second oscillator 200, such as the second conductive portion 220, are located outside the opening 112 of the first conductive plate 110 of the first oscillator 100. Various other configurations can also be adopted as long as the second conductive plate 210 of the second oscillator 200 is located inside the opening 112 of the first conductive plate 110 of the first oscillator 100.

[0057] Figure 4 yes Figure 1 The top view of the first side 302 of the substrate 300 shown. Figure 5 yes Figure 1 The top view of the second side 304 of the substrate 300 shown.

[0058] Reference Figures 1 to 3 Use Figure 4 as well as Figure 5 The antenna device 10 will be described in detail below.

[0059] The substrate 300 is, for example, a printed circuit board (PCB). The substrate 300 has two first holes 310 (first holes 310a and 310b), four second holes 320 (second holes 320a, 320b, 320c, and 320d), two third holes 330 (third holes 330a and 330b), and four fourth holes 340 (fourth holes 340a, 340b, 340c, and 340d). The substrate 300 also has a first hybrid circuit 350a, a second hybrid circuit 350b, and a duplexer 360. The substrate 300 also has wirings 352a, 352b, 352c, 352d, 362a, and 362b. In one example, the regions in the substrate 300 that overlap with the first conductive plate 110 of the first oscillator 100 and the regions that overlap with the second conductive plate 210 of the second oscillator 200, excluding the regions of the first hole 310, the second hole 320, the third hole 330 and the fourth hole 340 and their surrounding areas, may have a conductive pattern with a fixed potential (e.g., ground potential).

[0060] In each of the two first holes 310, a first conductive portion 120 different from each other is inserted. That is, the first conductive portion 120a and the first conductive portion 120b are inserted into the first hole 310a and the first hole 310b, respectively. The first conductive portion 120a inserted into the first hole 310a is electrically connected to the first hybrid circuit 350a via a wire 352a. The first conductive portion 120b inserted into the first hole 310b is electrically connected to the first hybrid circuit 350a via a wire 352b. The first hybrid circuit 350a is electrically connected to the duplexer 360 via a wire 362a.

[0061] In each of the four second holes 320, a third conductive portion 130 different from each other is inserted. That is, the third conductive portion 130a, the third conductive portion 130b, the third conductive portion 130c, and the third conductive portion 130d are inserted into the second hole 320a, the second hole 320b, the second hole 320c, and the second hole 320d, respectively. On the second face 304 side of the substrate 300, each of the second holes 320 is surrounded by a first fixed pattern 322. In addition, a part of each of the second holes 320 can not be surrounded by the first fixed pattern 322. The first fixed pattern 322 is provided in order to fix the third conductive portion 130 to the substrate 300. The third conductive portion 130 is fixed to the substrate 300 by, for example, soldering the portion of the third conductive portion 130 inserted into the substrate 300 and the first fixed pattern 322. The first fixed pattern 322 surrounds the portion of the third conductive portion 130 inserted into the substrate 300 and is separated from the portion of the third conductive portion 130, for example, by a gap. Thus, a capacitance can be formed between the third conductive portion 130 and the first fixed pattern 322. Moreover, the capacitance is adjusted according to the distance between the third conductive portion 130 and the first fixed pattern 322, and the resonance frequency of the first vibrator 100 can be adjusted.

[0062] In each of the two third holes 330, a second conductive portion 220 different from each other is inserted. That is, the second conductive portion 220a and the second conductive portion 220b are inserted into the third hole 330a and the third hole 330b, respectively. The second conductive portion 220a inserted into the third hole 330a is electrically connected to the second hybrid circuit 350b via a wire 352c. The second conductive portion 220b inserted into the third hole 330b is electrically connected to the second hybrid circuit 350b via a wire 352d. The second hybrid circuit 350b is electrically connected to the duplexer 360 via a wire 362b.

[0063] In each of the four fourth holes 340, a different fourth conductive portion 230 is inserted. That is, the fourth conductive portions 230a, 230b, 230c, and 230d are inserted into the fourth holes 340a, 340b, 340c, and 340d, respectively. On the second surface 304 side of the substrate 300, each fourth hole 340 is surrounded by a second fixing pattern 342. Alternatively, a portion of each fourth hole 340 may not be surrounded by the second fixing pattern 342. The second fixing pattern 342 is provided for fixing the fourth conductive portion 230 to the substrate 300. The fourth conductive portion 230 is fixed to the substrate 300 by, for example, soldering the portion of the fourth conductive portion 230 inserted into the substrate 300 to the second fixing pattern 342. The second fixing pattern 342 surrounds the portion of the insertion substrate 300 in the fourth conductive portion 230 and is separated from that portion of the fourth conductive portion 230, for example, by a gap. Therefore, a capacitor can be formed between the fourth conductive portion 230 and the second fixing pattern 342. Moreover, by adjusting this capacitor according to the distance between the fourth conductive portion 230 and the second fixing pattern 342, the resonant frequency of the second oscillator 200 can be adjusted.

[0064] The first fixed pattern 322 is configured to form an effective capacitance not only between the first conductive portion 120 and the first fixed pattern 322, but also between the first conductive plate 110 and the first fixed pattern 322. For example, by increasing the area of ​​the first fixed pattern 322 in a way that increases the area of ​​the overlapping region between the first conductive plate 110 and the first fixed pattern 322, the capacitance between the first conductive plate 110 and the first fixed pattern 322 can be increased. As a result, the resonant frequency of the first oscillator 100 can be reduced. Similarly, the second fixed pattern 342 is configured to form an effective capacitance between the second conductive plate 210 and the second fixed pattern 342. Likewise, by increasing the area of ​​the second fixed pattern 342 in a way that increases the area of ​​the overlapping region between the second conductive plate 210 and the second fixed pattern 342, the capacitance between the second conductive plate 210 and the second fixed pattern 342 can be increased. As a result, the resonant frequency of the second oscillator 200 can be reduced.

[0065] Figure 6 It means Figure 1 A block diagram of the antenna device 10 is shown. (Refer to...) Figures 1 to 5 and use Figure 6 Here is an example to illustrate the operation of antenna device 10.

[0066] When the antenna device 10 receives an electric wave, the first hybrid circuit 350a shifts the phases of a signal (a signal to be described later that passes through the observation point PI) output from the first conductive portion 120a of the first vibrator 100 and a signal (a signal to be described later that passes through the observation point P2) output from the first conductive portion 120b of the first vibrator 100 by 90° from each other. Also, the first hybrid circuit 350a outputs a combined signal (a signal to be described later that passes through the observation point P5) generated by combining these signals whose phases are shifted by 90° from each other to the duplexer 360. On the other hand, the second hybrid circuit 350b shifts the phases of a signal (a signal to be described later that passes through the observation point P3) output from the second conductive portion 220a of the second vibrator 200 and a signal (a signal to be described later that passes through the observation point P4) output from the second conductive portion 220b of the second vibrator 200 by 90° from each other. Also, the second hybrid circuit 350b outputs a combined signal (a signal to be described later that passes through the observation point P6) generated by combining these signals whose phases are shifted by 90° from each other to the duplexer 360. The duplexer 360 outputs a signal (a signal to be described later that passes through the observation point P7) generated by combining the combined signal (a signal to be described later that passes through the observation point P5) output from the first hybrid circuit 350a and the combined signal (a signal to be described later that passes through the observation point P6) output from the second hybrid circuit 350b.

[0067] When the antenna device 10 transmits radio waves, the duplexer 360 separates the signal input to the duplexer 360 (the signal passing through and input from observation point P7, described later) into two signals (the signal passing through observation point P5 and the signal passing through observation point P6, described later). The duplexer 360 then outputs one and the other of the two separated signals to the first mixing circuit 350a and the second mixing circuit 350b, respectively. The first mixing circuit 350a separates the signal output from the duplexer 360 (the signal passing through observation point P5, described later) into two signals (the signal passing through observation point P1 and the signal passing through observation point P2, described later), causing the phases of these two signals to be offset by 90°. The first mixing circuit 350a then outputs one and the other of these two signals, with their phases offset by 90°, to the first conductive part 120a and the first conductive part 120b of the first vibrator 100, respectively. Finally, a circularly polarized radio wave is transmitted through the first conductive plate 110. On the other hand, the second mixing circuit 350b separates the signal output from the duplexer 360 (the signal passing through observation point P6, described later) into two signals (the signal passing through observation point P3 and the signal passing through observation point P4, described later), causing the phases of these two signals to be offset by 90°. Furthermore, the second mixing circuit 350b outputs one of these two signals, with their phases offset by 90°, to the second conductive part 220a and the second conductive part 220b of the second oscillator 200, respectively. And, a circularly polarized radio wave is transmitted through the second conductive plate 210.

[0068] Next, use Figures 7 to 15 Simulation results are presented to illustrate various characteristics of the antenna device 10 in the embodiment. Figures 7 to 15 In this design, the dimensions of the first oscillator 100 are 45mm × 45mm × 8mm, and the dimensions of the second oscillator 200 are 25mm × 25mm × 9mm. That is, the height of the second oscillator 200 (9mm) is greater than the height of the first oscillator 100 (8mm). The height of the first oscillator 100 is the shortest distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first oscillator 100 in a direction perpendicular to the first surface 302 of the substrate 300. The height of the second oscillator 200 is the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second oscillator 200 in a direction perpendicular to the first surface 302 of the substrate 300. Figures 7 to 15 In this configuration, the first element 100 operates as an antenna in the GPS band, and the second element 200 operates as an antenna in the SXM band.

[0069] Figure 7 This indicates the first feed section of the first oscillator 100 ( Figure 6 observation point P1, Figure 1 The first conductive part 120a) and the second feed part (Figure 6 the observation point P2 of the first conductive portion 120b of the first duplexer 360, Figure 1 a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. The VSWR in the observation point PI and the observation point P2 is approximately 3 around the frequency 1525 MHz.

[0070] Figure 8 is a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. Figure 6 the observation point P3 of the second conductive portion 220a of the second duplexer 360, Figure 1 the second conductive portion 220b and the second feed portion 220a of the second duplexer 360, Figure 6 the observation point P4 of the second conductive portion 220b of the second duplexer 360, Figure 1 a graph showing an example of the frequency characteristics of VSWR in each of the second conductive portion 220b and the second feed portion 220a of the second duplexer 360. The VSWR in the observation point P3 and the observation point P4 is approximately 2 around the frequency 2340 MHz.

[0071] Figure 9 is a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. Figure 6 the observation point P5 of the first hybrid circuit 350a, a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. The VSWR in the observation point PI and the observation point P2 is approximately 3 around the frequency 1525 MHz.

[0072] Figure 10 Figure 6 is a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. the observation point P6 of the second hybrid circuit 350b,

[0073] a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. The VSWR in the observation point PI and the observation point P2 is approximately 3 around the frequency 1525 MHz. Figure 11 Figure 6 is a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360.

[0074] the observation point P7 of the input / output portion of the duplexer 360, Figure 12 a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. The VSWR in the observation point PI and the observation point P2 is approximately 3 around the frequency 1525 MHz. Figure 12

[0075] is a graph showing an example of the frequency characteristics of VSWR in each of the first conductive portion 120b and the second conductive portion 120a of the first duplexer 360. Figure 13 the observation point P7 of the input / output portion of the duplexer 360, Figure 13The gain of the second radiator 200 at the position where the inside of the inverted triangle is filled with 1 is 1.8 dBi.

[0076] Figure 14 is a graph showing an example of the directivity characteristics of the gain (dBi) of the second radiator 200. The gain of the second radiator 200 at the position where the inside of the inverted triangle is filled with 1 is 1.8 dBi. Figure 14

[0077] Figure 15 is a graph showing an example of the directivity characteristics of the axial ratio (dB) of the second radiator 200. The axial ratio of the second radiator 200 at the position where the inside of the inverted triangle is filled with 1 is 3.1 dB. Figure 15

[0078] Next, the relationship between the height of the first radiator 100 and the height of the second radiator 200 and the influence thereof on the characteristics of the antenna device 10 will be described using the simulation results of Figure 16

[0079] Figure 16 is a graph showing an example of the relationship between the height of each of the first radiator 100 and the second radiator 200 and the directivity characteristics of the gain of the second radiator 200. Figure 16 The antenna device 10 in each of Embodiment 1 to Embodiment 3 of Figure 16 The direction from the lower side to the upper side in Embodiment 1 of

[0080] In Embodiment 1 of Figure 16 , the height of the second radiator 200 is 1 mm higher than the height of the first radiator 100. That is, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second radiator 200 is longer than the shortest distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first radiator 100.

[0081] In Embodiment 2 of Figure 16 , the height of the second radiator 200 is equal to the height of the first radiator 100. That is, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second radiator 200 is equal to the shortest distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first radiator 100.

[0082] In Embodiment 3 of Figure 16 ​​​In Embodiment 3, the height of the second vibrator 200 is 1 mm lower than the height of the first vibrator 100. That is, in the direction perpendicular to the first surface 302 of the substrate 300, the shortest distance from the first surface 302 of the substrate 300 to the second conductive plate 210 of the second vibrator 200 is shorter than the shortest distance from the first surface 302 of the substrate 300 to the first conductive plate 110 of the first vibrator 100.

[0083] In Figure 16 In the area surrounded by the double-dot chain line, the gain becomes higher in the order of Embodiment 3, Embodiment 2, and Embodiment 1. From this result, it can be said that the higher the height of the second conductive plate 210 with respect to the first conductive plate 110, the higher the radiation efficiency.

[0084] Figure 17 is a perspective view showing the antenna device 10 of the first modification. The antenna device 10 of the present modification is the same as the antenna device 10 of the embodiment except for the following points.

[0085] The antenna device 10 further has a dielectric 400. The dielectric 400 is located between the first conductive plate 110 and the substrate 300 and between the second conductive plate 210 and the substrate 300. In other words, the dielectric 400 extends from the area overlapping the second conductive plate 210 to the area overlapping the first conductive plate 110. By the dielectric 400, the capacitance between the first conductive plate 110 and the substrate 300 can be increased, and the size of the first conductive plate 110 can be reduced while maintaining the performance of the first vibrator 100, as compared with the case where the antenna device 10 does not have the dielectric 400. Similarly, by the dielectric 400, the capacitance between the second conductive plate 210 and the substrate 300 can be increased, and the size of the second conductive plate 210 can be reduced while maintaining the performance of the second vibrator 200, as compared with the case where the antenna device 10 does not have the dielectric 400.

[0086] The dielectric 400 can be solid or hollow. The dielectric 400 can be a dielectric member mounted to the substrate 300, the first conductive plate 110, or the second conductive plate 210, or can be a dielectric layer stacked on the substrate 300. When the dielectric 400 is a dielectric layer, the first conductive plate 110 and the second conductive plate 210 can be formed on the dielectric layer (dielectric 400) by patterning. In Figure 17In the illustrated example, each of the first conductive portions 120 of the first vibrator 100 is positioned outside the dielectric 400, and each of the second conductive portions 220 of the second vibrator 200 is inserted into a hole formed in the dielectric 400. By inserting the second conductive portions 220 into the dielectric 400, the second conductive portions 220 can be supported by the dielectric 400. However, each of the first conductive portions 120 of the first vibrator 100 can also be inserted into a hole formed in the dielectric 400. By inserting the first conductive portions 120 into the dielectric 400, the first conductive portions 120 can be supported by the dielectric 400.

[0087] The height (thickness) of the dielectric 400 can be changed in accordance with the capacitance between the first conductive plate 110 and the substrate 300 and the capacitance between the second conductive plate 210 and the substrate 300. In the direction perpendicular to the first face 302 of the substrate 300, the dielectric 400 can be, for example, the entire region between the first conductive plate 110 and the substrate 300, or only a part of the region between the first conductive plate 110 and the substrate 300. Alternatively, the dielectric 400 can be, for example, the entire region between the second conductive plate 210 and the substrate 300, or only a part of the region between the second conductive plate 210 and the substrate 300.

[0088] In the present modification, the first vibrator 100 does not have Figure 1 the third conductive portion 130 illustrated. Even if the first vibrator 100 does not have the third conductive portion 130, by mounting the first conductive plate 110 on the dielectric 400, the first conductive plate 110 can be positioned away from the first face 302 of the substrate 300. However, the first vibrator 100 can also have the third conductive portion 130. In this case, the third conductive portion 130 can be positioned outside the dielectric 400, or can be inserted into a hole formed in the dielectric 400. Similarly, in the present modification, the second vibrator 200 does not have Figure 1 the fourth conductive portion 230 illustrated. However, the second vibrator 200 can also have the fourth conductive portion 230. In this case, the fourth conductive portion 230 can be inserted into a hole formed in the dielectric 400.

[0089] Figure 18 is a perspective view of an antenna device 10 of a second modification. The antenna device 10 of the present modification is the same as the antenna device 10 of the embodiment, except for the following points.

[0090] The antenna device 10 also has a first dielectric 410 and a second dielectric 420. The first dielectric 410 is located between the first conductive plate 110 and the substrate 300. The second dielectric 420 is located between the second conductive plate 210 and the substrate 300. The first dielectric 410 and the second dielectric 420 are apart from each other. By the first dielectric 410, the capacitance between the first conductive plate 110 and the substrate 300 can be increased, and the size of the first conductive plate 110 can be reduced while maintaining the performance of the first resonator 100, as compared with a case where the antenna device 10 does not have the first dielectric 410. Similarly, by the second dielectric 420, the capacitance between the second conductive plate 210 and the substrate 300 can be increased, and the size of the second conductive plate 210 can be reduced while maintaining the performance of the second resonator 200, as compared with a case where the antenna device 10 does not have the second dielectric 420. Further, since the first dielectric 410 and the second dielectric 420 are apart from each other, the capacitance between the first conductive plate 110 and the substrate 300 and the capacitance between the second conductive plate 210 and the substrate 300 can be adjusted independently, as compared with a case where the first dielectric 410 and the second dielectric 420 are connected to each other as shown in FIG. 3. Figure 17

[0091] The first dielectric 410 and the second dielectric 420 can each be solid or hollow. The first dielectric 410 can be a dielectric member mounted to the substrate 300 or the first conductive plate 110, or can be a dielectric layer stacked on the substrate 300. When the first dielectric 410 is a dielectric layer, the first conductive plate 110 can be formed on the dielectric layer (first dielectric 410) by patterning. In the example shown in FIG. 4, each of the first conductive portions 120 is located outside the first dielectric 410. However, each of the first conductive portions 120 can be inserted into a hole formed in the first dielectric 410. In this case, the first conductive portions 120 can be supported by the first dielectric 410. The same approach as the first dielectric 410 can be employed with respect to the second dielectric 420. Figure 18

[0092] The height (thickness) of the first dielectric 410 can be changed in accordance with the capacitance between the first conductive plate 110 and the substrate 300. In a direction perpendicular to the first surface 302 of the substrate 300, the first dielectric 410 can be located in the entire region between the first conductive plate 110 and the substrate 300, or can be located in only a part of the region between the first resonator 100 and the substrate 300. The height (thickness) of the second dielectric 420 can also be determined in the same manner.

[0093] ​​In the present modification example, the dielectric is present on both of the first conductive plate 110 and the substrate 300 and the second conductive plate 210 and the substrate 300. However, the dielectric can be present on only one of the first conductive plate 110 and the substrate 300 and the second conductive plate 210 and the substrate 300. That is, the dielectric can be present on at least one of the first conductive plate 110 and the substrate 300 and the second conductive plate 210 and the substrate 300.

[0094] In the present modification example, the first vibrator 100 does not have the third conductive portion 130 illustrated in FIG. 1. Even if the first vibrator 100 does not have the third conductive portion 130, the first conductive plate 110 can be positioned away from the first surface 302 of the substrate 300 by mounting the first conductive plate 110 on the first dielectric 410. However, the first vibrator 100 can have the third conductive portion 130. In this case, the third conductive portion 130 can be positioned outside the first dielectric 410 or can be inserted into a hole formed in the first dielectric 410. Similarly, in the present modification example, the second vibrator 200 does not have the fourth conductive portion 230 illustrated in FIG. 1. However, the second vibrator 200 can have the fourth conductive portion 230 illustrated in FIG. 1. In this case, the fourth conductive portion 230 can be positioned outside the second dielectric 420 or can be inserted into a hole formed in the second dielectric 420. Figure 1 Figure 1 In the present modification example, the first vibrator 100 does not have the third conductive portion 130 illustrated in FIG. 1. Even if the first vibrator 100 does not have the third conductive portion 130, the first conductive plate 110 can be positioned away from the first surface 302 of the substrate 300 by mounting the first conductive plate 110 on the first dielectric 410. However, the first vibrator 100 can have the third conductive portion 130. In this case, the third conductive portion 130 can be positioned outside the first dielectric 410 or can be inserted into a hole formed in the first dielectric 410. Similarly, in the present modification example, the second vibrator 200 does not have the fourth conductive portion 230 illustrated in FIG. 1. However, the second vibrator 200 can have the fourth conductive portion 230 illustrated in FIG. 1. In this case, the fourth conductive portion 230 can be positioned outside the second dielectric 420 or can be inserted into a hole formed in the second dielectric 420. Figure 1

[0095] The above describes the embodiments and the modifications of the present application with reference to the drawings, but these are examples of the present application and various configurations other than the above can be employed.

[0096] This application claims priority based on Japanese Application No. 2019-137639 filed on July 26, 2019, the entire disclosure of which is incorporated herein.

[0097] Explanation of Reference Signs

[0098] 10 Antenna device

[0099] 100 First vibrator

[0100] 110 First conductive plate

[0101] 112 Opening

[0102] 120 First conductive portion

[0103] 120a First conductive portion

[0104] 120b First conductive portion

[0105] 130 Third conductive portion

[0106] 130a Third conductive portion​​

[0107] 130b 3rd conductive portion

[0108] 130c 3rd conductive portion

[0109] 130d 3rd conductive portion

[0110] 200 2nd vibrator

[0111] 210 2nd conductive plate

[0112] 220 2nd conductive portion

[0113] 220a 2nd conductive portion

[0114] 220b 2nd conductive portion

[0115] 230 4th conductive portion

[0116] 230a 4th conductive portion

[0117] 230b 4th conductive portion

[0118] 230c 4th conductive portion

[0119] 230d 4th conductive portion

[0120] 300 substrate

[0121] 302 1st face

[0122] 304 2nd face

[0123] 310 1st hole

[0124] 310a 1st hole

[0125] 310b 1st hole

[0126] 320 2nd hole

[0127] 320a 2nd hole

[0128] 320b 2nd hole

[0129] 320c 2nd hole

[0130] 320d 2nd hole

[0131] 322 1st fixed pattern

[0132] 330 3rd hole

[0133] 330a 3rd hole

[0134] 330b 3rd hole

[0135] 340 4th hole

[0136] 340a 4th hole

[0137] 340b 4th hole

[0138] 340c 4th hole

[0139] 340d 4th hole

[0140] 342 2nd fixed pattern

[0141] 350a 1st hybrid circuit

[0142] 350b 2nd hybrid circuit

[0143] 352a wiring

[0144] 352b wiring

[0145] 352c wiring

[0146] 352d wiring

[0147] 360 duplexer

[0148] 362a wiring

[0149] 362b wiring

[0150] 400 dielectric

[0151] 410 1st dielectric

[0152] 420 2nd dielectric

Claims

1. An antenna device, characterized in that, have: A substrate having a first side; A first oscillator for a first frequency band having a first conductive plate and a first conductive portion, the first conductive plate being separate from and located on the side of the first surface of the substrate and having an opening, the first conductive portion electrically connecting the first conductive plate and the substrate; and A second oscillator for a second frequency band higher than the first frequency band, having a second conductive plate and a second conductive portion, wherein the second conductive plate is separated from and located on the side of the first surface of the substrate, and the second conductive portion electrically connects the second conductive plate and the substrate. The second conductive plate is located inside the opening of the first conductive plate and does not overlap with the first conductive plate in a plane parallel to the first surface. There are two first conductive parts, which are located at a 90° interval around the center of the first conductive plate, forming two feed points. There are two second conductive parts, which are located at a 90° interval around the center of the second conductive plate, forming two feed points. The centers of the two first conductive portions and the two second conductive portions are located on opposite sides of each other, separated by the first conductive plate or the second conductive plate.

2. The antenna device according to claim 1, characterized in that, The distance from the first surface of the substrate to the second conductive plate of the second oscillator is greater than or equal to the distance from the first surface of the substrate to the first conductive plate of the first oscillator.

3. The antenna device according to claim 1, characterized in that, The first oscillator also has a third conductive portion located around the center of the first conductive plate between the two first conductive portions. The second oscillator also has a fourth conductive portion located around the center of the second conductive plate between the two second conductive portions. The third conductive part and the fourth conductive part are located on opposite sides of each other, separated by the center of the first conductive plate or the second conductive plate.

4. The antenna device according to claim 1, characterized in that, The portion of the first oscillator from the first conductive plate to the first conductive part bends from the direction along the first surface of the substrate toward the direction approaching the first surface. The portion of the second oscillator from the second conductive plate to the second conductive part bends from the direction along the first surface of the substrate toward the direction approaching the first surface.

5. The antenna device according to claim 1, characterized in that, It also has a dielectric located between the first conductive plate and the substrate and between the second conductive plate and the substrate.

6. The antenna device according to claim 1, characterized in that, The first conductive plate of the first oscillator has an inner edge defining the opening and an outer edge located outside the inner edge. The first conductive part is electrically connected to the outer edge of the first conductive plate.

7. The antenna device according to claim 1, characterized in that, The first conductive plate of the first oscillator has an inner edge defining the opening and an outer edge located outside the inner edge. The outer edge of the first conductive plate is straight.

8. The antenna device according to any one of claims 1 to 7, characterized in that, The first frequency band is the GNSS frequency band. The second frequency band is the SXM band.

Images