Multilayer electronic components

Abstract

The present invention provides a multilayer electronic component, which includes: a main body, including a capacitor forming part and an upper covering part and a lower covering part, the capacitor forming part including a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes are stacked with the dielectric layer interposed therebetween, the upper covering part and the lower covering part are respectively arranged on the upper surface and the lower surface of the capacitor forming part; and an external electrode, which is arranged on the main body and is electrically connected to at least some of the plurality of internal electrodes, wherein at least one of the upper covering part and the lower covering part has a step structure, and the step structure has a shorter length and / or width than the capacitor forming part.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0113162 filed on September 4, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC) is a chip capacitor for charging and discharging mounted on a printed circuit board of various electronic products such as image display devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smart phones, cellular phones, etc.

[0004] Multilayer ceramic capacitors can be used as components of various electronic devices due to their relatively small size, ability to ensure high capacity, and ease of installation. As electronic devices such as computers, mobile devices, etc. are miniaturized and increased in power, demand for miniaturized and high-capacity multilayer ceramic capacitors is increasing.

[0005] In addition, during the process of manufacturing multilayer ceramic capacitors, there are problems of chipping defects and cracks at the edges of the sheets caused by collisions between sheets. Specifically, in the case where a portion of the corner is not fully coated during the electrode coating process, there may be a problem of corner coverage defects. Such defects on the sheet may cause external defects and deterioration of moisture-proof reliability.

[0006] In this regard, generally, the corners of the body have been ground into rounded corners to prevent peeling defects. The wet grinding method, which is mainly used in the MLCC manufacturing process, involves adding a large amount of sheets and abrasives to a bucket filled with water and rotating it to grind the corners of the sheets by friction.

[0007] However, such a grinding method may further cause additional fractures such as peeling cracks due to impact caused by friction with abrasives, and may further reduce moisture resistance reliability due to moisture that is not completely evaporated after the wet grinding process. Summary of the invention

[0008] An aspect of the present disclosure is to provide a multilayer electronic component having improved external defects and enhanced moisture-proof reliability.

[0009] According to an exemplary embodiment of the present disclosure, a multilayer electronic component includes: a main body, including a capacitor forming part and an upper covering part and a lower covering part, the capacitor forming part including a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes are stacked and the dielectric layer is interposed between the plurality of internal electrodes, the upper covering part and the lower covering part are respectively arranged on the upper surface and the lower surface of the capacitor forming part; and an external electrode, which is arranged on the main body and is electrically connected to at least some of the plurality of internal electrodes, wherein at least one of the upper covering part and the lower covering part has a step structure, and the step structure has a shorter length and / or width than the capacitor forming part.

[0010] According to another exemplary embodiment, a multilayer electronic component includes: a main body, including a capacitor forming part and an upper covering part and a lower covering part, the capacitor forming part including a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes are stacked and the dielectric layer is interposed between the plurality of internal electrodes, the upper covering part and the lower covering part are respectively arranged on the upper surface and the lower surface of the capacitor forming part; and an external electrode, which is arranged on the main body and is electrically connected to at least some of the plurality of internal electrodes, wherein, compared with the capacitor forming part, at least one of the upper covering part and the lower covering part has a shorter length and / or width and a greater side surface roughness.

[0011] According to another exemplary embodiment, a multilayer electronic component includes: a main body including a capacitor forming part and an upper cover and a lower cover, the capacitor forming part including a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes being stacked in a thickness direction and the dielectric layer being interposed between the plurality of internal electrodes, the upper cover and the lower cover being respectively arranged on an upper surface and a lower surface of the capacitor forming part in the thickness direction; and an external electrode, which is arranged on the main body and is electrically connected to at least some of the plurality of internal electrodes. At least one of the upper cover and the lower cover has a plurality of step-forming layers stacked in the thickness direction. The plurality of step-forming layers have cross-sectional areas taken in a direction perpendicular to the thickness direction that are different from each other with respect to the thickness direction, and the cross-sectional areas decrease as they approach the outer surface of the main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0013] Figure 1 is a schematic diagram showing a multilayer electronic component according to an exemplary embodiment of the present disclosure;

[0014] Figure 2 It is shown Figure 1A schematic diagram of the subject in ;

[0015] Figure 3 It is shown Figure 2 FIG. 1 is a diagram of another exemplary embodiment of an enlarged view of portion B of FIG. 1 ;

[0016] Figure 4 It is along Figure 1 A cross-sectional view taken along line II' in FIG.

[0017] Figure 5 It is along Figure 1 A cross-sectional view taken along line II-II';

[0018] Figure 6 It is a schematic diagram showing the application Figure 1 An exploded perspective view of a step structure in a multi-layer electronic component;

[0019] Figure 7 and Figure 8 are respectively an XZ plane cross-sectional view and a YZ plane cross-sectional view of a multilayer electronic component according to another exemplary embodiment;

[0020] Fig. 9 are a perspective view and a Z-direction front view of a step structure of a multilayer electronic component according to an exemplary embodiment; and

[0021] Fig.10 is a diagram illustrating a process of manufacturing a stepped structure of a multilayer electronic component according to an exemplary embodiment. DETAILED DESCRIPTION

[0022] Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings. However, the present disclosure may be illustrated in different forms and should not be construed as being limited to the specific embodiments set forth herein. More specifically, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Therefore, for clarity of description, the shapes and sizes of the elements in the accompanying drawings may be exaggerated, and in the accompanying drawings, the elements indicated by the same reference numerals are the same elements.

[0023] In the accompanying drawings, some elements may be omitted to clearly describe the present disclosure, and the thickness may be exaggerated to clearly describe multiple layers and regions. The same reference numerals will be used to describe the same elements with the same functions within the scope of the same concept. In addition, throughout the specification, unless otherwise specified, when a part "includes" an element, it may also include another element without excluding another element.

[0024] In the drawings, the X direction may refer to a first direction, an L direction or a length direction, the Y direction may refer to a second direction, a W direction or a width direction, and the Z direction may refer to a third direction, a stacking direction, a T direction or a thickness direction.

[0025] Figure 1 is a schematic diagram showing a multilayer electronic component according to an exemplary embodiment of the present disclosure, Figure 2 It is shown Figure 1 Schematic diagram of the subject in . Figure 3 It is shown Figure 2 FIG. 1 is an enlarged view of part B of another exemplary embodiment of the present invention, Figure 4 It is along Figure 1 A cross-sectional view taken along line II' in FIG. Figure 5 It is along Figure 1 A cross-sectional view taken along line II-II' in FIG. Figure 6 It is a schematic diagram showing the application Figure 1 An exploded perspective view of the step structure in a multi-layer electronic component.

[0026] Will refer to Figures 1 to 6 A multilayer electronic component according to an exemplary embodiment is described in detail.

[0027] A multilayer electronic component 100 according to an exemplary embodiment may include a body 110 including a capacitance forming part A and upper and lower covering parts C1 and C2, the capacitance forming part A including a dielectric layer 111 and a plurality of internal electrodes 120 stacked in the Z direction with the dielectric layer 111 interposed therebetween, the upper and lower covering parts C1 and C2 being disposed on upper and lower surfaces of the capacitance forming part A in the Z direction, respectively; and an external electrode 130 disposed on the body 110 and electrically connected to at least some of the plurality of internal electrodes 120, wherein at least one of the upper and lower covering parts C1 and C2 has a step structure S. The step structure S has a shorter length and width than the capacitance forming part A.

[0028] In the body 110 , a plurality of dielectric layers 111 and internal electrodes 120 are alternately stacked.

[0029] The shape of the body 110 is not limited to any specific shape. Figure 1 and Figure 2 As shown in , the body 110 may have a hexahedral shape or any shape similar thereto. In addition, since the ceramic powder included in the body 110 shrinks during the sintering process, the body 110 may have a substantially hexahedral shape, not a completely rectangular parallelepiped shape.

[0030] The main body 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in a first direction (X direction); a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2, and are opposite to each other in a second direction (Y direction); and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1, the second surface 2, the third surface 3 and the fourth surface 4, and are opposite to each other in a third direction (Z direction).

[0031] The plurality of dielectric layers 111 forming the body 110 are in a sintered state, and the dielectric layers 111 may be integrated such that a boundary between adjacent dielectric layers 111 may be difficult to identify without using a scanning electron microscope (SEM).

[0032] The material of the dielectric layer 111 may not be limited to any specific material as long as sufficient capacitance can be obtained using it. For example, the dielectric layer 111 may be formed using barium titanate (BaTiO3) powder, lead-based composite perovskite materials, strontium titanate (SrTiO3)-based materials, etc. The material of the dielectric layer 111 may include various ceramic additives, organic solvents, plasticizers, coupling agents, dispersants, etc. added to barium titanate (BaTiO3) powder, etc. according to the intended purpose.

[0033] The body 110 includes: a capacitance forming portion A disposed in the body 110 ; and an upper cover portion C1 and a lower cover portion C2 disposed on an upper surface and a lower surface of the capacitance forming portion A, respectively.

[0034] The capacitance forming part A contributes to the capacitance formation of the multilayer electronic component 100, and includes a plurality of internal electrodes 120 stacked with a plurality of dielectric layers 111 interposed between the plurality of internal electrodes 120. The upper cover part C1 and the lower cover part C2 may be formed by vertically stacking the dielectric layer 111 in the upper and lower portions of the capacitance forming part A, and thus may serve to prevent the internal electrodes from being damaged due to physical stress or chemical stress.

[0035] According to an exemplary embodiment, at least one of the upper cover C1 and the lower cover C2 has a step structure S. That is, only one of the upper cover C1 and the lower cover C2 has the step structure S, or both the cover C1 and the lower cover C2 have the step structure S to be symmetrical in the third direction (eg, Figures 2 to 5 ).

[0036] In addition, the stepped structure S may include a plurality of step-forming layers 140. In this case, the term "step-forming layer" refers to the stacked dielectric layers 111 having steps. The number of step-forming layers 140 included in a single stepped structure S may vary without limitation.

[0037] The step structure S is a structure for smoothly forming the corner of the body 110, and thus the step structure S is formed to be shorter and narrower than the capacitance forming portion A. The shape of the corner of the body 110 may be diversified due to the step structure S; however, the shape of the corner of the body 110 being rounded or similar to a rounded corner is beneficial for preventing the body 110 from being broken. Therefore, preferably, in the area where the step structure S is formed, the corner of the body 110 may have a rounded shape.

[0038] In order to make the step-forming layer 140 have steps, adjacent step-forming layers 140 have different lengths or widths. In other words, the plurality of step-forming layers 140 have different lengths or widths, or different lengths and widths.

[0039] For example, Figure 4 As shown in , the upper cover C1 and the lower cover C2 are stacked in the third direction (Z direction), and may include a plurality of step-forming layers 140 having different lengths relative to the first direction (X direction). More specifically, the plurality of step-forming layers 140 included in the upper cover C1 have a shorter length relative to the first direction (X direction) as they are arranged closer to the fifth surface 5, and the plurality of step-forming layers 140 included in the lower cover C2 have a shorter length relative to the first direction (X direction) as they are arranged closer to the sixth surface 6.

[0040] Alternatively, if Figure 5 As shown in , the upper cover C1 and the lower cover C2 are stacked in the third direction (Z direction), and may include a plurality of step-forming layers 140 having different lengths relative to the second direction (Y direction). More specifically, the plurality of step-forming layers 140 included in the upper cover C1 have a shorter width relative to the second direction (Y direction) as they are arranged closer to the fifth surface 5, and the plurality of step-forming layers 140 included in the lower cover C2 have a shorter width relative to the second direction (Y direction) as they are arranged closer to the sixth surface 6.

[0041] In addition, the shape of the step-forming layer 140 is not limited to a specific shape. Figures 2 to 5 As shown in , the step-forming layer 140 may be formed such that the upper surface and the side surface of the step-forming layer 140 form a right angle or other angles relative to each other. Figures 7 to 9 As described, the side surface of the step-forming layer 140 may be curved.

[0042] As an example, in the case where the upper surface and the side surface of the step-forming layer 140 form a right angle, the step-forming layer 140 may have a shape such as Figure 6In this case, a plurality of step-forming layers 140 are stacked to form a single step structure S, and therefore, preferably, adjacent step-forming layers 140 are provided to have different cross-sectional areas.

[0043] That is, the plurality of step-forming layers 140 included in the upper cover C1 or the lower cover C2 may have different cross-sectional areas with respect to the third direction while having the same thickness. Figure 6 , the uppermost step-forming layer 140-1 has the smallest cross-sectional area 140S-1, and the adjacent step-forming layer 140-2 disposed therebelow may have a larger cross-sectional area 140S-2 than the uppermost step-forming layer 140-1. Similarly, toward the lower portion of the body 110, step-forming layers 140-3 and 140-4 having increased cross-sectional areas 140S-3 and 140S-4 may be disposed. When stacked, this layout of the step-forming layers 140 may be used as a whole to form a single step structure S having steps.

[0044] During lamination of the manufacturing process, the corners of the body 110 may be formed to have a rounded shape by forming a step structure S in which a plurality of step-forming layers 140 are stacked in the upper and lower portions of the body 110. That is, according to an exemplary embodiment including the step structure S, the corners of the body 110 may be manufactured to be rounded without grinding the corners of the body 110.

[0045] In this regard, peeling defects and corner covering defects of the external electrodes of the body 110 may be suppressed, and further, additional cracking of the body 110 or reduction in moisture-proof reliability due to grinding may be prevented.

[0046] In addition, in the case where the corner of the body 110 has a rounded shape, the curvature radius r of the rounded shape may be formed as follows: Figure 2 For example, the ratio of the radius of curvature r of the rounded shape to the thickness of the upper cover C1 or the lower cover C2 may be 0.7 to 1.

[0047] As a specific example, when the ratio of the radius of curvature r to the thickness of the upper cover C1 is 1, all the dielectric layers 111 forming the upper cover C1 are the step-forming layer 140 having a step. In contrast, when the ratio of the radius of curvature r to the thickness of the upper cover C1 is 0.7, 0.7 of the upper dielectric layers 111 among all the dielectric layers 111 forming the upper cover C1 are the step-forming layer 140 having a step, and 0.3 of the lower dielectric layers 111 are the dielectric layers 111 having a constant length and width.

[0048] As mentioned above, Figure 2, an exemplary embodiment is shown in which the width and length of the upper cover portion C1 gradually decrease in a direction away from the capacitance forming portion A. However, Figure 3 2 shows an exemplary embodiment in which the width and length of the upper cover portion C1 vary irregularly in some areas.

[0049] In the following, about Figure 3 The description of the upper cover portion C1 can be applied to the lower cover portion C2.

[0050] According to another exemplary embodiment, a portion of the upper cover portion C1 forms the step structure S, while the remaining portion may not form the step structure S. That is, Figure 3 As shown in , a portion of the upper cover C1 may have an irregular stacked structure in which the step structure S is not formed.

[0051] For example, the upper cover C1 may include a plurality of step structures S. More specifically, the upper cover C1 may have a first step structure S-1 and a second step structure S-2 at the same time. In this case, the number of step-forming layers 140 forming the first step structure S-1 and the second step structure S-2 may be the same or different. In addition, the spacing between the first step structure S-1 and the second step structure S-2 in the third direction is not particularly limited.

[0052] exist Figure 3 , only an exemplary embodiment in which two step structures S are included in a single cover portion C1 is shown; however, three or more additional step structures may be included.

[0053] In addition, the covering portion including the step structure S may further include an irregular layer 145 in which the step structure S is not formed. Figure 3 As shown in , the upper cover C1 may include both the step structure S and at least one irregular layer 145 .

[0054] The term "irregular layer" refers to a dielectric layer 111 stacked in the cover portion having a feature that violates the corresponding rule when a plurality of step-forming layers 140 are stacked according to a predetermined rule. For example, when a plurality of step-forming layers 140 are stacked according to a rule in which the width and length thereof gradually decrease in a direction away from the capacitance-forming portion A, an irregular layer 145 having an increased length and width may exist.

[0055] As an example, the upper cover portion C1 has a Figure 3 In the case of the first stepped structure S-1 and the second stepped structure S-2 stacked according to the predetermined rule shown in , an irregular layer 145 inconsistent with the rule of any one of the first stepped structure S-1 and the second stepped structure S-2 may be formed between the two stepped structures.

[0056] In this case, not only an exemplary embodiment in which a single irregular layer 145 is included between a plurality of step structures S but also an exemplary embodiment in which a plurality of irregular layers 145 are continuously stacked is possible. Figure 3 As shown in FIG. 1 , the irregular layer 145 may be formed between the step structure S and the capacitance forming part A. As shown in FIG.

[0057] The internal electrodes 120 and the dielectric layers 111 are alternately stacked. That is, the plurality of internal electrodes 120 are disposed opposite to each other with the dielectric layer 111 forming the body 110 interposed therebetween. Figure 2 As shown in , the internal electrode 120 may be exposed to the first surface 1 and the second surface 2 of the body 110 .

[0058] In this case, the internal electrodes 120 may be electrically isolated from each other by the dielectric layer 111 interposed therebetween. The body 110 may be formed by alternately stacking green sheets on which the internal electrodes having different polarities are printed and sintering the green sheets.

[0059] The material of the internal electrode 120 may not be limited to any specific material. The internal electrode 120 may be formed by using, for example, a conductive paste formed of a noble metal material such as palladium (Pd), a palladium-silver (Pd-Ag) alloy, etc., and at least one of nickel (Ni) and copper (Cu).

[0060] A screen printing method, a gravure printing method, or the like may be used as a printing method of the conductive paste, but the printing method of the conductive paste is not limited thereto.

[0061] The outer electrode 130 may be disposed on the body 110 and may be connected to the inner electrode 120. Figure 4 As shown in , the external electrodes 130 may be disposed on both sides of the body 110 and connected to the alternately stacked internal electrodes 120. In an exemplary embodiment, the multilayer electronic component 100 is shown as having two external electrodes 130 (e.g., a first external electrode and a second external electrode opposite to each other in a first direction), but the number and shape of the external electrodes 130 may vary depending on the shape of the internal electrode 120 or other intended purposes.

[0062] In addition, the material of the external electrode 130 may not be limited to any specific material as long as the material has conductivity, and may be determined in consideration of electrical properties, structural stability, etc. For example, the material may be metal. The external electrode 130 may also have a multi-layer structure.

[0063] For example, the external electrode 130 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer. More specifically, the electrode layer may be, for example, a sintered layer including a conductive metal and glass, and the conductive metal may be Cu. Alternatively, the electrode layer may be a resin electrode including a plurality of metal particles and a conductive resin.

[0064] As a specific example, the plating layer may be a Ni nickel layer or a Sn tin layer. The plating layer may be in the form of a Ni plating layer and a Sn plating layer sequentially formed on the electrode layer, or may include a plurality of Ni plating layers and / or Sn plating layers.

[0065] According to another exemplary embodiment, the side surfaces of the plurality of step-forming layers 140 may be curved. Figures 7 to 9 is shown in, and will therefore refer to Figures 7 to 9 Give a description.

[0066] Figure 7 and Figure 8 1 and 2 are respectively an XZ plane cross-sectional view and a YZ plane cross-sectional view of a multilayer electronic component according to another exemplary embodiment.

[0067] Reference Figure 7 and Figure 8 , each step-forming layer 140 may be formed such that a curved surface rather than a right angle is formed between the upper surface and the side surface of the step-forming layer 140. Figure 7 As shown in , a plurality of step-forming layers 140 having curved side surfaces are stacked in the third direction (Z direction) and may have different lengths relative to the first direction (X direction). Figure 8 As shown in , a plurality of step-forming layers 140 may be stacked in the third direction (Z direction) and may have different widths relative to the second direction (Y direction). A plurality of step-forming layers 140 may have different lengths relative to the first direction and different widths relative to the second direction, or may have different cross-sectional areas taken perpendicular to the third direction relative to the third direction.

[0068] By having the curved side surface as described above, additional breakage or cracking of the body 110 may be suppressed due to the corners of the step-forming layer 140 .

[0069] In this case, the step structure S may include a plurality of step-forming layers 140 having different widths from each other and smaller than the width of the capacitance forming portion A, or a plurality of step-forming layers 140 having different lengths from each other and smaller than the length of the capacitance forming portion A. Alternatively, the step structure S may include a plurality of step-forming layers 140 having a length and a width smaller than the length and the width of the capacitance forming portion A.

[0070] Furthermore, according to another exemplary embodiment, at least one of the upper cover portion C1 and the lower cover portion C2 has a shorter length and width and a greater side surface roughness than the capacitance forming portion A.

[0071] More specifically, at least one of the upper cover portion C1 and the lower cover portion C2 includes a step structure having a length and a width smaller than those of the capacitance forming portion A, and the step structure S may be formed by stacking a plurality of step forming layers 140 .

[0072] The side surface of the step-forming layer 140 may have a greater roughness than the side surface of the capacitance-forming portion A. Figure 8 As shown in , the surface of the step-forming layer 140 is not smooth and irregular. Even after a plurality of step-forming layers 140 are stacked, the side surface of the step-forming layer 140 is exposed to the outside, and thus the surface may maintain a large roughness.

[0073] The above structure can be obtained by not cutting the side surfaces of the covering parts C1 and C2 during the manufacturing of the covering parts C1 and C2 (in contrast, the side surface of the capacitance forming part A is cut). Such surface roughness characteristics may also exist in Figures 1 to 6 An exemplary embodiment of Fig. 9 In an exemplary embodiment of .

[0074] Fig. 9 1 is a perspective view and a Z-direction front view of a step structure of a multilayer electronic component according to an exemplary embodiment. Fig. 9 Among the step-forming layers 140 forming the step structure S, side surfaces of adjacent step-forming layers 140 are continuously connected to each other.

[0075] More specifically, the side surface of the step-forming layer 140 is curved and can be arranged so that the area size of the upper surface and the lower surface of the adjacent step-forming layers 140 contacting each other is the same. Therefore, the side surface of the step structure S stacked with a plurality of step-forming layers 140 can be formed to be smooth without any protrusions.

[0076] By integrally forming the side surface of the step structure S without any protrusion, additional breakage or cracking of the body 110 caused by the protrusion can be prevented. In addition, corner coverage defects caused by gaps between protruding areas where the external electrode 130 is not applied when the external electrode 130 is applied to both side surfaces of the body 110 can also be prevented.

[0077] Fig.10 is a diagram illustrating a process of manufacturing a stepped structure of a multilayer electronic component according to an exemplary embodiment.

[0078] Similar to the conductive paste printing method described previously, the step structure S may be manufactured by screen printing, gravure printing, or the like. For example, in the case of using screen printing, Fig.10 As shown in , the step-forming layer 140 may be stacked by sequentially printing the step-forming layer 140 layer by layer.

[0079] In this case, the step structure S is formed by first printing the step-forming layer 140 having the largest cross-sectional area and then printing the step-forming layer 140 having a gradually decreasing cross-sectional area. That is, when a plurality of step-forming layers 140 are stacked to have a gradually decreasing cross-sectional area in an upward direction, the step structure S can be realized. Figures 1 to 6 The shape of the step structure S in the upper cover portion C1 is shown in FIG.

[0080] Furthermore, when manufacturing the step structure S included in the lower cover portion C2, as shown in FIG. Fig.10 The step-forming layer 140 is printed sequentially as shown in FIG. 1 , and then its upper and lower parts are inverted. This can make the lowest step-forming layer have the smallest cross-sectional area and can be used to achieve the following example. Figures 1 to 6 The step structure S shown in FIG. 1 is included in the lower cover portion C2 .

[0081] In addition, when a plurality of step-forming layers 140 are sequentially printed and stacked, the side surface of the step-forming layer 140 may have a greater roughness than the side surface of the capacitance forming part A. As shown in FIG.

[0082] More specifically, if Fig.10 As shown in , the main body 110 as a unit main body can be obtained by cutting the stacked main body. In this case, before cutting the stacked main body, a plurality of step forming layers 140 may be printed and stacked in the upper portion of the main body 110. The length and width of the step forming layer 140 may be smaller than the length and width of the main body 110 disposed therebelow. Therefore, when the stacked main body is cut into a plurality of main bodies 110, the step forming layer 140 may not be cut.

[0083] When the cutting is performed as described above, the body 110 is formed to have a smooth side surface because the side surface has been cut, and the side surface of the step-forming layer 140 is not cut, and thus can be maintained in a stacked state after printing. That is, the side surface of the step-forming layer 140 has the roughness of a surface formed by a screen printing method or the like. Therefore, after cutting, the side surface of the body 110 and the side surface of the step-forming layer 140 may have different surface roughnesses.

[0084] In addition, the portion of the body 110 where the cutting is performed corresponds to the capacitance forming part A, and the step forming layer 140 that is not cut may form the first covering part C1 and the second covering part C2. Therefore, the side surfaces of the first covering part C1 and the second covering part C2 including the step structure S may have a roughness greater than that of the side surface of the capacitance forming part A.

[0085] According to an exemplary embodiment, the corners of the body are provided to be rounded, thereby preventing peeling defects and corner covering defects of the external electrodes.

[0086] Furthermore, according to the exemplary embodiment, additional breakage of the sheet caused by grinding is prevented, and moisture-proof reliability is improved.

[0087] Various advantageous advantages and effects of the present invention are not limited to the above description and may be more easily understood in the course of describing specific embodiments of the present disclosure.

[0088] While exemplary embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the invention as defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a main body, comprising a capacitor forming part and an upper covering part and a lower covering part, wherein the capacitor forming part comprises a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes are stacked with the dielectric layer interposed between the plurality of internal electrodes, and the upper covering part and the lower covering part are respectively disposed on an upper surface and a lower surface of the capacitor forming part; and an external electrode disposed on the body and electrically connected to at least some of the plurality of internal electrodes, wherein at least one of the upper cover portion and the lower cover portion has a stepped structure, and Wherein, compared with the capacitor forming portion, the step structure has a plurality of step forming layers having a shorter length and / or a shorter width.

2. The multilayer electronic component according to claim 1, wherein The external electrodes include a first external electrode and a second external electrode facing each other in a first direction of the body, and The body includes a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in the third direction.

3. The multilayer electronic component according to claim 2, wherein: The upper cover portion and the lower cover portion both have the step structure and are symmetrical in the third direction.

4. The multilayer electronic component according to claim 2, wherein: The upper cover and the lower cover each include the step structure, and the plurality of step-forming layers are stacked in the third direction and have different lengths from each other with respect to the first direction.

5. The multilayer electronic component according to claim 4, wherein: The plurality of step-forming layers included in the upper cover portion have shorter lengths with respect to the first direction as they are disposed closer to the fifth surface, and The plurality of step-forming layers included in the lower cover portion have shorter lengths with respect to the first direction as they are disposed closer to the sixth surface.

6. The multilayer electronic component according to claim 2, wherein: The upper cover and the lower cover each have the step structure, and the plurality of step-forming layers are stacked in the third direction and have different widths from each other with respect to the second direction.

7. The multilayer electronic component according to claim 6, wherein: The widths of the plurality of step-forming layers included in the upper cover portion with respect to the second direction are shorter as they are arranged closer to the fifth surface, and The widths of the plurality of step-forming layers included in the lower cover portion with respect to the first direction are shorter as they are disposed closer to the sixth surface.

8. The multilayer electronic component according to claim 2, wherein: The upper cover and the lower cover include the step structure, and the plurality of step-forming layers have the same thickness as each other and different cross-sectional areas with respect to the third direction.

9. The multilayer electronic component according to claim 8, wherein: Adjacent step-forming layers among the plurality of step-forming layers have side surfaces that are continuously connected to each other.

10. The multilayer electronic component according to claim 8, wherein The plurality of step-forming layers have curved side surfaces.

11. The multilayer electronic component according to claim 1, wherein A corner of the body has a rounded shape in a region where the step structure is provided.

12. The multilayer electronic component according to claim 11, wherein A ratio of a radius of curvature of the rounded shape to a thickness of the upper cover portion or the lower cover portion is 0.7 to 1.

13. The multilayer electronic component according to claim 1, wherein At least one of the upper cover portion and the lower cover portion has a plurality of step structures.

14. The multilayer electronic component according to claim 1, 8 or 13, wherein: The at least one of the upper cover part and the lower cover part having the stepped structure further includes an irregular layer where the stepped structure is not formed.

15. A multilayer electronic component comprising: a main body, comprising a capacitor forming part and an upper covering part and a lower covering part, wherein the capacitor forming part comprises a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes are stacked with the dielectric layer interposed between the plurality of internal electrodes, and the upper covering part and the lower covering part are respectively disposed on an upper surface and a lower surface of the capacitor forming part; and an external electrode disposed on the body and electrically connected to at least some of the plurality of internal electrodes, Wherein, compared with the capacitance forming portion, at least one of the upper covering portion and the lower covering portion has a shorter length and / or width and a greater side surface roughness.

16. The multilayer electronic component according to claim 15, wherein At least one of the upper cover portion and the lower cover portion has a stepped structure, The step structure includes a plurality of step-forming layers, and the plurality of step-forming layers have different widths from each other and are smaller than a width of the capacitance forming portion.

17. The multilayer electronic component according to claim 15, wherein: At least one of the upper cover portion and the lower cover portion has a stepped structure, The step structure includes a plurality of step-forming layers, and the plurality of step-forming layers have different lengths from each other and are shorter than the length of the capacitance forming portion.

18. A multilayer electronic component comprising: A main body, comprising a capacitor forming part and an upper covering part and a lower covering part, wherein the capacitor forming part comprises a dielectric layer and a plurality of internal electrodes, the plurality of internal electrodes are stacked in a thickness direction and the dielectric layer is interposed between the plurality of internal electrodes, and the upper covering part and the lower covering part are respectively arranged on an upper surface and a lower surface of the capacitor forming part in the thickness direction; as well as an external electrode disposed on the body and electrically connected to at least some of the plurality of internal electrodes, wherein at least one of the upper cover portion and the lower cover portion has a plurality of step-forming layers stacked in the thickness direction, and The plurality of step-forming layers have cross-sectional areas taken in a direction perpendicular to the thickness direction that are different from each other with respect to the thickness direction, and the cross-sectional areas decrease as approaching an outer surface of the body.

19. The multilayer electronic component according to claim 18, wherein: The plurality of step-forming layers have curved side surfaces.

20. The multilayer electronic assembly of claim 18, wherein: The plurality of step-forming layers form a step structure such that upper surfaces and side surfaces of the plurality of step-forming layers form a right angle with respect to each other.

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