Package structure and related measurement method of package structure

Abstract

The present disclosure relates to a package structure and a measurement method related to the package structure. The present disclosure provides a measurement method, which includes providing a substrate, a device placed on the substrate, and a lid placed on the substrate and the device, illuminating a top surface of the device through an opening of the lid to obtain a first focal plane associated with the top surface of the device, illuminating a lower end of the opening of the lid to obtain a second focal plane associated with the lid at the lower end of the opening, and deriving a distance between the top surface of the device and an inner surface of the lid facing the top surface of the device based on a difference between a level of the first focal plane and a level of the second focal plane. The present disclosure also provides a package structure for the measurement.

Description

TECHNICAL FIELD

[0001] Embodiments of the present invention relate to a package structure and a measurement method related to the package structure. BACKGROUND

[0002] Semiconductor devices are typically encapsulated using a molding material and then can be mounted on a substrate of a circuit system including, for example, a printed circuit board (PCB). After encapsulating a semiconductor device, some parameters related to the semiconductor device inside the molding material are difficult to determine. Conventional measurement methods cannot accurately obtain the parameters because these methods inevitably accumulate deviations or tolerances of components in the package structure. The derived parameters are often incorrect or not accurate enough.

[0003] Therefore, there is a continuous need to modify the package structure and the measurement method for determining parameters inside the package structure. SUMMARY

[0004] Embodiments of the present invention relate to a measurement method comprising: providing a substrate, a device placed on the substrate, and a cover placed over the substrate and the device, wherein the cover includes an opening placed over the device and tapered toward the device, and the opening includes a lower end close to the device; illuminating a top surface of the device through the opening to obtain a first focal plane associated with the top surface of the device; illuminating the lower end of the opening of the cover to obtain a second focal plane associated with the cover at the lower end of the opening; and deriving a distance between the top surface of the device and an inner surface of the cover facing the top surface of the device based on a difference between a horizontal height of the first focal plane and a horizontal height of the second focal plane.

[0005] Embodiments of the present invention relate to a measurement method comprising: encapsulating a device within a package structure, the package structure comprising: a substrate; a cover covering the substrate and the device; a sidewall connecting the substrate and the cover; a first electrode pair placed between a top surface of the device and an inner surface of the cover facing the top surface; measuring a capacitance between the device and the package structure through the first electrode pair; and deriving a distance between the top surface and the inner surface based on the measurement of the capacitance.

[0006] Embodiments of the present invention relate to a package structure comprising: a substrate; a device placed on the substrate; and a cover placed over the substrate and the device, wherein the cover includes an opening placed over the device and tapered toward the device. BRIEF DESCRIPTION OF DRAWINGS

[0007] Aspects of the disclosure, as described in the detailed description and illustrated in the accompanying drawings, are presented by way of example and not limitation. It will be apparent to one skilled in the art that various features and / or variations described can be combined, can be substituted, or eliminated for similar embodiments, or can be applied to other embodiments of the disclosure not specifically described. Thus, for example, features described in one embodiment in the detailed description or one drawing figure can be combined with features described in another embodiment in the detailed description or another drawing figure. Unless otherwise expressly stated, mechanisms of the present disclosure can be implemented in hardware, firmware, software, or any combination thereof.

[0008] Figure 1 is a schematic cross-sectional view showing a package structure according to some embodiments of the present disclosure.

[0009] Figure 2 and Figure 3 is a schematic cross-sectional view showing a package structure having differently shaped openings in Figure 1 according to other embodiments of the present disclosure.

[0010] Figures 4 to 8 is a schematic cross-sectional view showing a package structure having various additional components in any of Figures 1 to 3 according to some embodiments of the present disclosure.

[0011] Figure 9 is a schematic cross-sectional view showing another package structure according to some embodiments of the present disclosure.

[0012] Figure 10 shows top views of openings in various shapes according to some embodiments of the present disclosure.

[0013] Figures 11 to 14 is a schematic cross-sectional view showing other package structures according to some embodiments of the present disclosure.

[0014] Figure 15 is a flow diagram illustrating a method of fabricating a package structure according to some embodiments of the present disclosure.

[0015] Figures 16A to 16K is a schematic cross-sectional view illustrating sequential fabrication levels of a package structure in Figure 11 according to some embodiments of the present disclosure.

[0016] Figure 17 is a flow diagram illustrating another method of fabricating a package structure according to some embodiments of the present disclosure.

[0017] Figures 18A to 18I is a schematic cross-sectional view illustrating sequential fabrication levels of a package structure in Figure 12 according to some embodiments of the present disclosure.

[0018] Figure 19 is a flow diagram illustrating a method for measuring a gap width within a package structure according to some embodiments of the present disclosure.

[0019] Figure 20A andFigure 20B is a schematic cross-sectional view showing sequential operations of a method in accordance with some embodiments of the present disclosure. Figure 19

[0020] Figure 20C is a schematic cross-sectional view showing sequential operations of a method in accordance with some embodiments of the present disclosure. Figure 19 Figure 9 is a schematic cross-sectional view showing sequential operations of a method in accordance with some embodiments of the present disclosure.

[0021] Figure 21 is a flowchart showing another method for measuring a gap width within a package structure in accordance with some embodiments of the present disclosure. DETAILED DESCRIPTION

[0022] The following disclosure provides many different embodiments, or examples, for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. For example, in the following description, a first feature can be described as being formed over or on a second feature. This can include embodiments where the first feature is formed directly on the second feature, and can also include embodiments where additional features can be formed between the first and second features such that the first and second features can not be directly in contact. In some embodiments, the present disclosure can refer to reference numerals and / or letters in various instances. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and / or configurations discussed.

[0023] Moreover, spatial and / or positional terms, such as "below," "lower," "bottom," "above," "upper," and the like, can be used herein for ease of describing relative relationships between elements or features as illustrated in the figures. In some embodiments, the spatial and / or positional terms are intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the figures. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial and / or positional descriptions used herein can be interpreted accordingly.

[0024] ​​While the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Moreover, as used herein, the terms "substantially", "about" or "approximately" generally mean within values or ranges that can be considered acceptable by one of ordinary skill in the art. Alternatively, the terms "substantially", "about" or "approximately" mean within an acceptable standard error of the mean when considered by one of ordinary skill in the art. Those skilled in the art can understand that the acceptable standard error of the mean can vary with different technologies. Unless otherwise indicated, all numerical ranges, amounts, values and percentages disclosed herein (e.g., those for quantities of materials, durations, temperatures, operational conditions, ratios of amounts, and the like) are to be understood as approximations based on the teachings of the disclosure. Accordingly, unless indicated otherwise, the numerical parameters set forth in the present disclosure and attached claims are approximations that can vary depending upon the requirements of the particular application. At the very least, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges can be expressed here as from one endpoint to the other endpoint or between two endpoints. Unless otherwise specified, all ranges disclosed herein are inclusive of the endpoints.

[0025] For some devices encapsulated by a molding material to form a package structure, there is a need to leave a space between the device and the molding material. For example, an optical device including a lens module requires a gap in order to accommodate a proper focal length from the lens to an image sensor such as a CMOS image sensor (CIS) or a charge-coupled device (CCD) image sensor.

[0026] Controlling the gap size (e.g., gap width or gap volume) inside the package structure is important. For example, in some applications, it is desirable to precisely control the gap size for considerations such as air flow resistance or heat dissipation of the device inside the package structure. In some embodiments, the gap size affects the flexibility of the device when the device is subjected to external impact or mechanical force. Thus, the gap size generally relates to the durability of the device inside the package structure, especially for optical devices. In particular, the gap size is critical to the performance of these optical devices.

[0027] However, it is difficult to measure the gap size once the device is encapsulated. Moreover, it is not easy to precisely control the gap size. For a package structure using epoxy or ceramic as the molding material, the gap size is controlled by the dimensions (e.g., thickness or height) of the device and the molding material. Although the gap size can be directly determined by observing the difference between the dimensions of the device and a portion of the molding material, it is difficult to obtain the precision of the gap size.

[0028] Figure 1 FIG. 1 is a schematic cross-sectional view showing a package structure P10 according to some embodiments of the present disclosure. The package structure P10 includes a molding member 100 and a device 120 inside the molding member 100. In some embodiments, the molding member 100 includes a base 102, a lid 104 covering the base 102, and a sidewall 106 connecting the base 102 and the lid 104. In some embodiments, the device 120 is placed on the base 102, surrounded by the sidewall 106, and covered by the lid 104. In some embodiments, the device 120 has a top surface S1 facing the lid 104 and a bottom surface B1 facing the base 102. In some embodiments, the bottom surface B1 contacts the base 102. In some embodiments, the base 102, the lid 104, and the sidewall 106 are separable. In other embodiments, the base 102, the lid 104, and the sidewall 106 can be integral such that the molding member 100 is a single structure enclosing the device 120. In some embodiments, the molding member 100 is made of, for example but not limited to, epoxy or ceramic (e.g., low temperature co-fired (LTCC) ceramic or high temperature co-fired (HTCC) ceramic). In some embodiments, the device 120 includes an active component or a passive component, for example but not limited to, a complementary metal-oxide-semiconductor (CMOS), a micro-electro-mechanical system (MEMS), a stack of CMOS and MEMS, a resistor, a capacitor, an inductor, an image sensor, a motion sensor, a microphone, a speaker, or a motion stabilizer.

[0029] Still referring to FIG. 1 Figure 1 In some embodiments, the lid 104 includes an opening 110 penetrating the lid 104. In some embodiments, the opening 110 is located above the device 120 such that the device 120 in the molding member 100 is at least partially exposed through the opening 110. In some embodiments, the opening 110 has a frustoconical shape. In some embodiments, the opening 110 tapers toward the device 120. In some embodiments, the opening 110 has a first width W1 at an upper end E1 of the opening 110 away from the device 120 and a second width W2 at a lower end E2 of the opening 110 close to the device 120. In some embodiments, the first width W1 is between 50 um and 1000 um and is greater than the second width W2. In some embodiments, the difference between the first width and the second width is between about 5 micrometers (um) and about 100 um.

[0030] Still referring to FIG. 1 Figure 1In some embodiments, the gap 130 is located within the molded part 100 between the cap 104 and the device 120. In some embodiments, the sidewall 106 has a height D1, the device 120 has a thickness D2, and the gap 130 has a gap width G1, wherein the gap width G1 is defined as the distance between the top surface S1 of the device 120 and the inner surface of the cap 104 facing the device 120. In some embodiments, the gap width G1 is between about 5 μm and about 500 μm.

[0031] In other embodiments, the opening 110 may have different shapes. Figure 2 and Figure 3 Other embodiments of this disclosure are shown in Figure 1 A schematic cross-sectional view of a packaging structure P10 with openings 110 of varying shapes. (Refer to...) Figure 2 In one embodiment, the opening 110 has a width that remains constant from a first width W1 up to the center of the opening 110, and then tapers towards the base 102 to a second width W2. (See reference...) Figure 3 In another embodiment, the opening 110 has a width that starts from a first width W1, increases toward the central portion of the opening 110, and then tapers toward the base 102 to a second width W2. In some embodiments, the first width W1 is greater than the second width W2.

[0032] Figures 4 to 8 The embodiments shown in this disclosure are based on some of the embodiments. Figures 1 to 3 A schematic cross-sectional view of the package structure P10, which includes various additional components. (See reference) Figure 4 In some embodiments, the opening 110 of the cap 104 may be filled with a sealing member 150. The sealing member 150 protects the device 120 in the encapsulation structure P10 from particulate or moisture contamination. In some embodiments, the sealing member 150 is made of, but is not limited to, epoxy resin, polysiloxane, silicone sealant, plastic, glass, metal, or ceramic. In some embodiments, the sealing member 150 may be opaque or transparent. In some embodiments, the sealing member 150 can be easily removed from the encapsulation structure P10, and thus the opening 110 is formed by removing the sealing member 150.

[0033] refer to Figure 5In some embodiments, the opening 110 of the cap 104 can be covered by a cap member 160. The cap member 160 can protect the device 120 within the package structure P10 from particulate or moisture contamination. In some embodiments, the cap member 160 is made of, for example but not limited to, plastic, glass, metal, or ceramic. In some embodiments, the area of the cap member 160 is greater than or less than the area of the cap 104. In other embodiments, the area of the cap member 160 is substantially equal to the area of the cap 104.

[0034] Referring to Figure 6 In some embodiments, the package structure P10 can be sealed in a housing member 170. The housing member 170 can protect the device 120 in the package structure P10 from particulate or moisture contamination. In some embodiments, the housing member 170 is made of, for example but not limited to, epoxy, silicone, glass glue, plastic, glass, metal, or ceramic. In some embodiments, the housing member 170 can be opaque or transparent.

[0035] In some embodiments, any one or a combination of the sealing member 150, the cap member 160, and the housing member 170 can be placed on the package structure P10, depending on the actual need.

[0036] For example, referring to Figure 7 In some embodiments, the opening 110 of the cap 104 is filled with the sealing member 150 and covered by the cap member 160. In these embodiments, the sealing member 150 can provide adhesion of the cap member 160 to the cap 104.

[0037] Referring to Figure 8 In some embodiments, the opening 110 of the cap 104 is filled with the sealing member 150, and the package structure P10 is encapsulated in the housing member 170. The housing member 170 can be in contact with the sealing member 150. In these embodiments, the sealing member 150 can provide adhesion of the housing member 170 to the cap 104.

[0038] Figure 9is a schematic cross-sectional view showing a package structure P20 according to some embodiments of the present disclosure. The package structure P20 is similar to the package structure P10, except that the lid 104 of the package structure P20 includes portions having different thicknesses. Thus, there can be multiple gap widths G2, G3, and G4, etc. between the top surface S1 of the device 120 and the interior surface of the lid 104 facing the device 120. In some embodiments, an opening 110 can be placed in each location of the lid 104 having different thicknesses. Thus, multiple openings 110 can be placed individually in the lid 104, and the openings 110 expose portions of the device 120 inside the molded part 100. In some embodiments, each of the openings 110 has a larger width at a top end away from the device 120 and a smaller width at a bottom end close to the device 120.

[0039] In some embodiments, the shape of the opening 110 is not limited. Figure 10 is a top view showing the opening 110 in various shapes according to some embodiments of the present disclosure. Portions of the device 120 are visible through the opening 110, while most of the device 120 is shielded underneath the lid 104. In some embodiments, the shape of the opening 110 from the top view can be various shapes, such as a circle, a triangle, a rectangle, a square, an L-shape, etc., as long as the opening 110 tapers toward the device 120.

[0040] Figure 11 and Figure 12 is a schematic cross-sectional view showing package structures P30 and P40 according to some embodiments of the present disclosure. The package structures P30 and P40 are similar to the package structure P10, except that the package structures P30 and P40 further include two electrode pairs.

[0041] Referring to Figure 11 , the package structure P30 includes a first electrode pair 180 and a second electrode pair 190 placed between the top surface S1 of the device 120 and the interior surface of the lid 104 facing the top surface S1.

[0042] In some embodiments, the first electrode pair 180 and the second electrode pair 190 are made of an electrically conductive material such as aluminum, copper, iron, silver, or gold. In some embodiments, the first electrode pair 180 includes a first electrode 180A attached to the top surface S1 of the device 120 and a second electrode 180B attached to the inner surface of the lid 104, where the first electrode 180A is aligned with the second electrode 180B. In some embodiments, the second electrode pair 190 includes a third electrode 190A attached to the top surface S1 of the device 120 and a fourth electrode 190B attached to the inner surface of the lid 104, where the third electrode 190A is aligned with the fourth electrode 190B. In some embodiments, a protruding member 120P is formed on the top surface S1 of the device 120. In these embodiments, the third electrode 190A is placed on and supported by the protruding member 120P. In some embodiments, the protruding member 120P is configured to ensure contact between the third electrode 190A and the fourth electrode 190B.

[0043] Referring to Figure 12 , the package structure P40 is similar to the package structure P30 in Figure 11 except for the location of the protruding member. In some embodiments, a protruding member 104P is formed on the inner surface of the lid 104. In these embodiments, the fourth electrode 190B is placed on and supported by the protruding member 104P. In some embodiments, the protruding member 104P is configured to ensure contact between the third electrode 190A and the fourth electrode 190B.

[0044] Figure 13 and Figure 14 are schematic cross-sectional views showing package structures P50 and P60 according to some embodiments of the present disclosure. The package structures P50 and P60 are similar to the package structures P30 and P40, respectively, except that the lid 104 of the package structures P50 and P60 does not have any opening. In these embodiments, the device 120 is completely encapsulated in the molding member 100.

[0045] Figure 15 is a flowchart illustrating a method 200 of fabricating a package structure according to some embodiments of the present disclosure. Figures 16A to 16K is a schematic cross-sectional view illustrating sequential fabrication levels of the package structure P30 in Figure 11 according to some embodiments of the present disclosure.

[0046] In operation S201, a device 120A is provided, as shown in Figure 16A . In some embodiments, a photolithography process is performed on the device 120A to form a patterned photoresist 192 thereon.

[0047] In operation S203, a portion of the device 120A is removed, as shown in Figure 16B In some embodiments, a dry or wet etching process is performed on the device 120A to remove a portion of the device 120A that is not protected by the patterned photoresist 192. After the patterned photoresist 192 is removed, the remaining device refers to the device 120 as illustrated in any of Figures 1 to 14 In some embodiments, after operation S203, a protruding component 120P is formed over the top surface SI of the device 120.

[0048] In operation S205, a metal layer 194A is formed on the device 120, as shown in Figure 16C In some embodiments, a physical vapor deposition (PVD) process or an atomic layer deposition (ALD) process is used to conformally form the metal layer 194A on the device 120 and the protruding component 120P. In some embodiments, the metal layer 194A is made of a conductive material such as aluminum, copper, iron, silver, or gold. In some embodiments, the thickness of the metal layer 194A is known and uniformly controlled.

[0049] In operation S207, a photolithography process is performed on the metal layer 194A, as shown in Figure 16D After operation S207, a patterned photoresist 196 is formed on the metal layer 194A.

[0050] In operation S209, a portion of the metal layer 194A is removed, as shown in Figure 16E In some embodiments, a dry or wet etching process is performed on the metal layer 194A to remove a portion of the metal layer 194A that is not protected by the patterned photoresist 196. After the patterned photoresist 196 is removed, the remaining metal layer 194A forms a first electrode 180A on the device 120 and a third electrode 190A on the protruding component 120P above the device 120.

[0051] In operation S211, a bottom holder 108 is provided, as shown in Figure 16F In some embodiments, the bottom holder 108 includes a substrate 102 and a sidewall 106 connected to the substrate 102. In some embodiments, the bottom holder 108 is made of an epoxy or a ceramic and includes a lead frame (not shown).

[0052] In operation S213, the device 120 is bonded to the bottom holder 108, as shown in Figure 16GThe device 120 with the first electrode 180A and the third electrode 190A is attached to the substrate 102 using a wire bonding process in some embodiments. The device 120 placed on the substrate 102 is surrounded by the sidewall 106. A die attach film (DAF, not shown) is placed between the device 120 and the substrate 102 to increase adhesion therebetween in some embodiments.

[0053] In operation S215, the lid 104A is provided, as shown in FIG. 2B. In some embodiments, the lid 104A is made of the same material as the bottom holder 108. The lid 104A has an outer surface S2 and an inner surface S3 opposite to the outer surface S2. In some embodiments, the hole 110A is formed at the inner surface S3. The hole 110A can be formed by removing a portion of the lid 104A using a drilling process or an etching process. In some embodiments, the hole 110A has a frustoconical shape tapering towards the inner surface S3. Figure 16H In operation S217, electrodes are formed on the lid 104A, as shown in FIG. 2C. In some embodiments, the second electrode 180B and the fourth electrode 190B are formed on the outer surface S2. The formation of the second electrode 180B and the fourth electrode 190B includes at least performing a deposition process, a photolithography process, and an etching process on the lid 104A. In some embodiments, a horizontal distance between the second electrode 180B and the fourth electrode 190B on the lid 104A is substantially the same as a horizontal distance between the first electrode 180A and the third electrode 190A on the device 120.

[0054] Figure 16I In operation S219, a drilling process is performed on the lid 104A, as shown in FIG. 2D. In some embodiments, a portion of the lid 104 inside the hole 110A is further drilled to form an opening 110, such that the opening 110 penetrates the lid 104. The opening 110 connects the outer surface S2 and the inner surface S3. In some embodiments, the opening 110 has a frustoconical shape tapering towards the inner surface S3.

[0055] In operation S221, the lid 104 is attached to the bottom holder 108, as shown in FIG. 2E. In some embodiments, the lid 104 is attached to the bottom holder 108 by a soldering process. In some embodiments, the lid 104 is attached to the bottom holder 108 by a welding process. Figure 16J In operation S221, the lid 104 is attached to the bottom holder 108, as shown in FIG. 2E. In some embodiments, the lid 104 is attached to the bottom holder 108 by a soldering process. In some embodiments, the lid 104 is attached to the bottom holder 108 by a welding process.

[0056] Figure 16K ​​As shown in the diagram. In some embodiments, the attachment of the cap 104 to the bottom retainer 108 is such that the outer surface S2 faces the device 120. At this time, the second electrode 180B is aligned with the first electrode 180A, and the fourth electrode 190B is aligned with the third electrode 190A. In some embodiments, the third electrode 190A is supported by a protruding member 120P to ensure contact between the third electrode 190A and the fourth electrode 190B. In some embodiments, the opening 110 is formed before the cap 104 is placed on the base 102 and the device 120. In other embodiments, the base 102, cap 104, and sidewall 106 can be formed simultaneously, and the molding member 100 comprising the base 102, cap 104, and sidewall 106 can be a single structure encapsulating the device 120. In these embodiments, the opening 110 can be formed after the encapsulation device 120. In some embodiments, sealant (not shown) is placed between the cap 104 and the bottom retainer 108 to increase adhesion therebetween. Therefore, generally forming Figure 11 The packaging structure is P30.

[0057] Figure 17 This is a flowchart illustrating a method 300 for manufacturing a packaging structure according to some embodiments of the present disclosure. Figures 18A to 18I This is a pictorial illustration based on some embodiments disclosed herein. Figure 12 A schematic cross-sectional view of the sequential fabrication stage of the P40 package structure in the image.

[0058] In operation S301, device 120 is provided and a metal layer 194B is formed on device 120, such as Figure 18A As shown in the figure. In some embodiments, a PVD process or an ALD process is used to form the metal layer 194B. In some embodiments, the metal layer 194B is made of a conductive material such as aluminum, copper, iron, silver, or gold. In some embodiments, the thickness of the metal layer 194B is known and uniformly controlled.

[0059] In operation S303, a photolithography process is performed on metal layer 194B, such as... Figure 18B As shown in the diagram. After operation S303, a patterned photoresist 198 is thus formed on the metal layer 194B.

[0060] In operation S305, metal layer 194B is partially removed, such as... Figure 18C As shown in the figure. In some embodiments, a dry or wet etching process is performed on the metal layer 194B to remove portions of the metal layer 194B that are not protected by the patterned photoresist 198. After the patterned photoresist 198 is removed, the remaining metal layer 194B forms the first electrode 180A and the third electrode 190A on the device 120.

[0061] In operation S307, a bottom holder 108 is provided, as shown in Figure 18D In some embodiments, the bottom holder 108 includes a substrate 102 and a sidewall 106 connected to the substrate 102. In some embodiments, the bottom holder 108 is made of epoxy or ceramic and includes a lead frame (not shown).

[0062] In operation S309, a device 120 is bonded to the bottom holder 108, as shown in Figure 18E In some embodiments, the device 120 with the first electrode 180A and the third electrode 190A is attached to the substrate 102 using a wire bonding process. The device 120 placed on the substrate 102 is surrounded by the sidewall 106. In some embodiments, a die attach film (DAF, not shown) is placed between the device 120 and the substrate 102 to increase adhesion therebetween.

[0063] In operation S311, a cap 104A is provided, as shown in Figure 18F In some embodiments, the cap 104A is made of the same material as the bottom holder 108. The cap 104A has an outer surface S2 and an inner surface S3 opposite the outer surface S2. In some embodiments, a protruding part 104P is formed on the outer surface S2. The formation of the protruding part 104P includes at least performing a deposition process, a photolithography process, and an etching process on the cap 104A. In some embodiments, the protruding part 104P is formed using the same material as the bottom holder 108. In some embodiments, a hole 110A is formed at the inner surface S3. The hole 110A can be formed by removing a portion of the cap 104A using a drilling process or an etching process. In some embodiments, the hole 110A has a truncated cone shape tapering towards the inner surface S3.

[0064] In operation S313, a second electrode 180B and a fourth electrode 190B are formed on the cap 104A, as shown in Figure 18G In some embodiments, the second electrode 180B is formed on the outer surface S2 of the cap 104A and the fourth electrode 190B is formed on the protruding part 104P. The formation of the second electrode 180B and the fourth electrode 190B includes at least performing a deposition process, a photolithography process, and an etching process on the cap 104A. In some embodiments, a horizontal distance between the second electrode 180B and the fourth electrode 190B on the cap 104A is substantially the same as a horizontal distance between the first electrode 180A and the third electrode 190A on the device 120.

[0065] In operation S315, a drilling process is performed on the cap 104A, as shown in Figure 18HAs shown in the figure. In some embodiments, a portion of the cap 104 inside the hole 110A is further drilled to form an opening 110, such that the opening 110 penetrates the cap 104. The opening 110 connects the outer surface S2 and the inner surface S3. In some embodiments, the opening 110 has a frustoconical shape that tapers toward the inner surface S3.

[0066] In operation S317, the cap 104 is attached to the bottom retainer 108, as follows: Figure 18I As shown in the diagram. In some embodiments, the attachment of the cap 104 to the bottom retainer 108 is such that the outer surface S2 faces the device 120. At this time, the second electrode 180B is aligned with the first electrode 180A, and the fourth electrode 190B is aligned with the third electrode 190A. In some embodiments, the fourth electrode 190B is supported by a protruding member 104P to ensure contact between the third electrode 190A and the fourth electrode 190B. In some embodiments, sealant (not shown) is placed between the cap 104 and the bottom retainer 108 to increase adhesion therebetween. Therefore, generally forming... Figure 12 The package structure is P40.

[0067] Figure 19 This is a flowchart illustrating a method 400 for measuring the gap width within a package structure according to some embodiments of this disclosure. In some embodiments, method 400 is an optical measurement. In some embodiments, the measurement can be performed after the package structure is formed. Figures 1 to 3 Method 400 is executed in any of the encapsulation structures P10. Figure 20A and Figure 20B This is a demonstration of some embodiments based on the present disclosure. Figure 19 A schematic cross-sectional view of the sequential operation of method 400 in the diagram.

[0068] In some embodiments, method 400 is according to Figure 19 The operation S401 in the package structure P10 begins.

[0069] refer to Figure 20A In some embodiments, according to Figure 19Operation S403 in FIG. 4A illuminates the top surface S1 of the device 120. In some embodiments, the light source 140 is used. In some embodiments, the light source 140 is configured to emit visible light, such as white light. In some embodiments, the light source 140 is configured to emit non-visible light, such as X-ray, infrared (IR), or ultraviolet (UV). In some embodiments, the light source 140 can emit radiation to illuminate a portion of the package structure P10. In some embodiments, the illumination can be adjusted by a motor (not shown) so that the radiation can be focused on a desired portion of the package structure P10, such as the top surface S1 of the device 120 or the cover 104 at the lower end E2 of the opening 110. In some embodiments, the opening 110 acts as an optical window for the radiation to pass through.

[0070] Still referring to Figure 20A , the light source 140 emits a first radiation hv1 that passes through the opening 110 and is focused on the top surface S1 of the device 120. In some embodiments, the top surface S1 of the device 120 is illuminated by the first radiation hv1 to obtain a first focal plane Fl associated with the top surface S1 of the device 120. In some embodiments, the first focal plane Fl refers to a plane in which an image of the top surface S1 of the device 120 is sharpest. The first focal plane Fl is substantially coplanar with the top surface S1 of the device 120.

[0071] Referring to Figure 20B , in some embodiments, according to Figure 19 Operation S405 in FIG. 4A illuminates the lower end E2 of the opening 110 of the cover 104. In some embodiments, after emitting the first radiation hv1, the light source 140 emits a second radiation hv2 that passes through the opening 110 and is focused on the lower end E2 of the opening 110 on the cover 104. In some embodiments, the lower end E2 of the opening 110 of the cover 104 is illuminated by the second radiation hv2 to obtain a second focal plane F2 associated with the cover 104 at the lower end E2 of the opening 110. In some embodiments, the second focal plane F2 refers to a plane in which an image is sharpest at the lower end E2 of the opening 110 of the cover 104. The second focal plane F2 is substantially coplanar with an inner surface of the cover 104 facing the top surface S1 of the device 120, and the second focal plane F2 is substantially parallel to the first focal plane Fl. In some embodiments, the opening 110 is tapered towards the device 120 so that the first radiation hv1 and the second radiation hv2 can not be blocked by a portion of the cover 104.

[0072] Referring to Figure 20A and Figure 20B , in some embodiments, according to Figure 19In operation S407, the gap width G1 is derived based on the first focal plane F1 and the second focal plane F2. In some embodiments, the distance between the top surface S1 of the device 120 and the inner surface of the cover 104 facing the top surface S1 of the device 120 can be derived based on the first focal plane F1 and the second focal plane F2. By calculating the difference between the horizontal heights of the first focal plane F1 and the second focal plane F2, a distance substantially equal to the gap width G1 within the encapsulation structure P10 can be obtained.

[0073] In some embodiments, the gap width G1 derived from method 400 is more accurate than simply subtracting the thickness D2 of device 120 from the height D1 of sidewall 106. Although different molded parts 100 and different devices 120 have the same product or device specifications, they inevitably have tolerances in their height or thickness. Therefore, when deriving the gap width G1 based on the dimensions of molded parts 100 and devices 120, the tolerances accompanying the height of molded parts 100 and the thickness of devices 120 are also taken into account, which makes it less accurate.

[0074] In some embodiments, the optical measurement method 400 does not consider tolerances related to the dimensions of the molded part 100 and the device 120; instead, the method 400 calculates the difference between two horizontal heights of the focal plane. Therefore, the gap width G1 can be obtained with greater accuracy. On the other hand, for package structures where the gap requires precise size control, the method 400 is beneficial for improving the performance and reliability of devices within the package structure.

[0075] In some embodiments, method 400 may also be performed to obtain Figure 9 The package structure P20 has multiple gap widths G2, G3 and G4. Figure 20C This is a schematic cross-sectional view illustrating a method 400 applied to a package structure P20 according to some embodiments of this disclosure. Figure 19 Operation S401 in the middle provides Figure 9 The packaging structure P20 is described in [the document]. According to... Figure 19 In operation S403, the top surface S1 of the device 120 inside the packaging structure P20 is irradiated to obtain the first focal plane F1. According to Figure 19 In operation S405, each lower end E2 of each opening 110 near the device 120 is illuminated to obtain a second focal plane F3, F4, and F5. According to... Figure 19 In operation S407, the gap widths G2, G3 and G4 can be derived by calculating the difference between the horizontal heights of the first focal plane F1 and the second focal plane F3, the difference between the horizontal heights of the first focal plane F1 and the second focal plane F4, and the difference between the horizontal heights of the first focal plane F1 and the second focal plane F5.

[0076] Figure 21 This is a flowchart illustrating a method 500 for measuring the gap width within a package structure according to some embodiments of this disclosure. In some embodiments, method 500 is an electrical measurement. In some embodiments, it may be used... Figure 15 Method 200 is formed Figure 11 The package structure P30 or using Figure 17 Method 300 is formed Figure 12 The encapsulation structure P40 in the code executes method 500.

[0077] In some embodiments, method 500 is according to Figure 21 S501 provides operation Figure 11 The package structure P30 or Figure 12 The encapsulation structure begins at P40. In some embodiments, the thicknesses of the two electrode pairs at 180 and 190 are known.

[0078] according to Figure 21 In operation S503, the capacitance between device 120 and package structure P30 or P40 is measured via the first electrode pair 180. In some embodiments, the capacitance measurement is performed between the first electrode 180A and the second electrode 180B.

[0079] according to Figure 21 In operation S505, the gap width G1 is derived based on capacitance measurement. In some embodiments, the obtained capacitance can be used to derive the distance d (not shown) between the top surface S1 of the device 120 and the inner surface of the cover 104. In some embodiments, deriving the distance d includes deriving the interval between the first electrode 180A and the second electrode 180B. In some embodiments, the deriving is based on the equation for capacitance of a parallel-plate capacitor:

[0080] C = ε0 × A / d, where

[0081] C stands for capacitance, measured in farads (F).

[0082] ε0 is the electrical constant, i.e., 8.854 × 10⁻⁶. -12 F / m; and

[0083] A is the area of ​​each of the 180 first electrode pairs, expressed in square meters (m²). 2 (in units of )

[0084] Therefore, the gap width G1 can be derived by summing the thickness and distance d of the first electrode pair 180. In some embodiments, the gap width G1 obtained based on capacitance measurement can be compared with the gap width G1 obtained based on optical measurement to verify the accuracy of the capacitance measurement. In some embodiments, these results can be correlated with each other.

[0085] In some embodiments, the second electrode pair 190 can be used to measure the resistance between the device 120 and the package structure P30 or P40 for precision consideration purposes. In some embodiments, the resistance measurement is performed between the third electrode 190A and the fourth electrode 190B. In some embodiments, when the contact between the third electrode 190A and the fourth electrode 190B is established, the resistance will be a finite value (i.e., not extremely high), which shows that the circuit is not broken. In some embodiments, the obtained resistance indicates whether the molded component 100 and the device 120 are properly positioned. The alignment of the first electrode 180A and the second electrode 180B is crucial to the capacitance measurement. In some embodiments, the obtained resistance can indicate whether the third electrode 190A and the fourth electrode 190B are properly aligned, and the obtained resistance further indicates whether the first electrode 180A and the second electrode 180B are properly aligned. In some embodiments, the electrical measurement can employ one electrode pair or two electrode pairs to achieve the gap width derivation.

[0086] In some embodiments, the gap width obtained by the electrical measurement can be correlated with the gap width obtained by the optical measurement. In some embodiments, after the correlation between the optical measurement and the electrical measurement is formed and the results thereof match each other, only the electrode pair used for the capacitance and / or resistance measurement inside the molded component is needed and the optical measurement can be omitted. In some embodiments, the package structure that does not include any opening (e.g., P50 in Figure 13 and P60 in Figure 14 can also be used to obtain the gap width, thus providing that the process for making the package structure is stable enough.

[0087] The present disclosure is directed to a measurement method that enables the precise gap width within a package structure to be obtained using optical measurement and / or electrical measurement.

[0088] For the optical measurement, the package structure includes at least one opening in the cover of the molded component that encapsulates the device. A portion of the device can be exposed through the opening. A light source is used to emit a first radiation through the opening to illuminate the device and obtain a first focal plane. In some embodiments, the light source emits a second radiation through the opening to illuminate a lower end of the opening of the cover and obtain a second focal plane. The gap width can be derived based on the difference between the horizontal height of the first focal plane and the horizontal height of the second focal plane. The opening is tapered towards the device such that the radiation can avoid being blocked by the portion of the cover. In some embodiments, after the optical measurement, the opening can be filled with a sealing component to prevent the device in the package structure from being contaminated by particles and moisture. A cover component can be placed on the opening filled with the sealing component to provide further protection to the device.

[0089] For electrical measurements, the package structure contains at least one pair of electrodes. One of the electrodes is attached to the device, and the other electrode is attached to the inner surface of the lid facing the device. The pair of electrodes can be used to measure the capacitance between the molded part and the device. The obtained capacitance can be used to derive the separation between the pair of electrodes according to the equation for the capacitance of a parallel plate capacitor. Since the thickness of the electrodes is known, the gap width can be derived by summing the thickness and the separation of the pair of electrodes. In some embodiments, additional pairs of electrodes can be used for resistance measurements. Similar to the electrodes for capacitance measurements, one of the electrodes is attached to the device, and the other electrode is attached to the inner surface of the lid. However, since resistance measurements require the two electrodes to be in contact with each other, a protruding part is placed on the device or on the inner surface of the lid to support one of the electrodes to ensure proper contact between the two electrodes. The resistance measurements can ensure that the molded part and the device are properly positioned or that the pair of electrodes for capacitance measurements are properly aligned so that the separation can be accurately derived.

[0090] According to the optical and electrical measurements provided by the present disclosure, tolerances related to the dimensions of the molded part and the device do not have to be considered. Thus, the gap width inside the package structure can be measured with much greater precision. Moreover, the gap width obtained by the optical measurement and by the electrical measurement can be related to each other. Thus, without the need for an opening for the optical measurement, a package structure that contains only a pair of electrodes inside the molded part can be used to measure the capacitance and / or the resistance.

[0091] One aspect of the present disclosure provides a measurement method. The measurement method includes providing a substrate, a device placed on the substrate, and a lid placed over the substrate and the device, wherein the lid includes an opening placed over the device and tapered toward the device, and the opening includes a lower end proximate to the device; illuminating a top surface of the device through the opening to obtain a first focal plane associated with the top surface of the device; illuminating at the lower end of the opening of the lid to obtain a second focal plane associated with the lid at the lower end of the opening; and deriving a distance between the top surface of the device and an inner surface of the lid facing the top surface of the device based on a difference between a horizontal height of the first focal plane and a horizontal height of the second focal plane.

[0092] In some embodiments, the top surface of the device and the lower end of the opening of the lid are illuminated by X-ray, infrared (IR), ultraviolet (UV), or visible light.

[0093] In some embodiments, the illuminating includes adjusting a focal point on the top surface of the device or at the lower end of the opening of the lid.

[0094] In some embodiments, the first focal plane is substantially coplanar with the top surface of the device, and the second focal plane is substantially coplanar with the interior surface of the cover facing the top surface of the device.

[0095] In some embodiments, the first focal plane is substantially parallel to the second focal plane.

[0096] In some embodiments, the measurement method further comprises sealing the opening after the derivation of the distance.

[0097] In some embodiments, the opening is formed by removing a portion of the cover.

[0098] In some embodiments, the opening is formed prior to placing the cover over the substrate and the device.

[0099] Another aspect of the disclosure provides another measurement method. The measurement method comprises: enclosing a device in a packaging structure, the packaging structure comprising: a substrate; a cover covering the substrate and the device; a sidewall connecting the substrate and the cover; a first electrode pair placed between a top surface of the device and an interior surface of the cover facing the top surface; measuring a capacitance between the device and the packaging structure through the first electrode pair; and deriving a distance between the top surface and the interior surface based on the measurement of the capacitance.

[0100] In some embodiments, the first electrode pair comprises: a first electrode placed on the top surface of the device; and a second electrode placed on the interior surface of the cover, and the first electrode and the second electrode are aligned.

[0101] In some embodiments, the derivation of the distance comprises deriving a separation between the first electrode and the second electrode.

[0102] In some embodiments, the measurement method further comprises: measuring a resistance between the device and the packaging structure through a second electrode pair, the second electrode pair being placed between the top surface and the interior surface and comprising: a third electrode placed on the top surface of the device; and a fourth electrode placed on the interior surface of the cover.

[0103] In some embodiments, the third electrode and the fourth electrode are aligned.

[0104] In some embodiments, the measurement method further comprises: forming a protruding member on the top surface of the device; and placing the third electrode on the protruding member.

[0105] In some embodiments, the method of measuring further comprises forming a protruding member on the interior surface of the lid; and placing the fourth electrode on the protruding member.

[0106] Another aspect of the disclosure provides a package structure. The package structure comprises: a substrate; a device placed on the substrate; a lid placed over the substrate and the device, wherein the lid comprises an opening placed over the device and tapered towards the device.

[0107] In some embodiments, a distance between a top surface of the device and an interior surface of the lid facing the top surface of the device is between about 5 um and about 500 um.

[0108] In some embodiments, the opening has a first width and a second width, the second width being located above the first width and substantially greater than the first width.

[0109] In some embodiments, a difference between the first width and the second width is between about 5 um and about 100 um.

[0110] In some embodiments, the package structure further comprises a sealing member filling or covering the opening.

[0111] The foregoing outlines features of several embodiments so that those skilled in the art can better understand the aspects of the disclosure. Those skilled in the art should appreciate that they can readily use the disclosure as a basis for designing or modifying other operations and structures for carrying out the same purposes and / or achieving the same advantages of the embodiments introduced herein. Those skilled in the art will realize that the equivalent constructions do not depart from the spirit and scope of the disclosure, and that they can make various changes, substitutions, and alterations herein without departing from the spirit and scope of the disclosure.

[0112] Moreover, the scope of the disclosure is not intended to be limited to particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein can be utilized according to the present disclosure. Accordingly, the appended claims as

[0113]

NOTATION AND ABBREVIATIONS

[0114] 100: molded member

[0115] 102: base

[0116] 104: lid

[0117] 104A: lid

[0118] 104P: protruding part

[0119] 106: sidewall

[0120] 108: bottom holder

[0121] 110: opening

[0122] 110A: hole

[0123] 120: device

[0124] 120A: device

[0125] 120P: protruding part

[0126] 130: gap

[0127] 140: light source

[0128] 150: sealing part

[0129] 160: lid part

[0130] 170: housing part

[0131] 180: first electrode pair / electrode pair

[0132] 180A: first electrode

[0133] 180B: second electrode

[0134] 190: second electrode pair / electrode pair

[0135] 190A: third electrode

[0136] 190B: fourth electrode

[0137] 192: patterned photoresist

[0138] 194A: metal layer

[0139] 194B: metal layer

[0140] 196: patterned photoresist

[0141] 198: patterned photoresist

[0142] 200: method

[0143] 300: method

[0144] 400: method

[0145] 500: method

[0146] B1: bottom surface

[0147] D1: height

[0148] D2: thickness

[0149] E1: upper end

[0150] E2: lower end

[0151] F1: first focal plane

[0152] F2: second focal plane

[0153] F3: second focal plane

[0154] F4: second focal plane

[0155] F5: second focal plane

[0156] G1: gap width

[0157] G2: gap width

[0158] G3: gap width

[0159] G4: gap width

[0160] hv1: first radiation

[0161] hv2: second radiation

[0162] P10: package structure

[0163] P20: package structure

[0164] P30: package structure

[0165] P40: package structure

[0166] P50: package structure

[0167] P60: package structure

[0168] S1: top surface

[0169] S2: outer surface

[0170] S3: inner surface

[0171] S201: operation

[0172] S203: operation

[0173] S205: operation

[0174] S207: Operation

[0175] S209: Operation

[0176] S211: Operation

[0177] S213: Operation

[0178] S215: Operation

[0179] S217: Operation

[0180] S219: Operation

[0181] S221: Operation

[0182] S301: Operation

[0183] S303: Operation

[0184] S305: Operation

[0185] S307: Operation

[0186] S309: Operation

[0187] S311: Operation

[0188] S313: Operation

[0189] S315: Operation

[0190] S317: Operation

[0191] S401: Operation

[0192] S403: Operation

[0193] S405: Operation

[0194] S407: Operation

[0195] S501: Operation

[0196] S503: Operation

[0197] S505: Operation

[0198] W1: First width

[0199] W2: Second width

Claims

1. A measurement method, comprising: A substrate, a device placed on the substrate, and a cover placed on the substrate and the device are provided, wherein the cover includes an opening that is placed above the device and tapers toward the device, and the opening includes a portion near the lower end of the device; The top surface of the device is illuminated through the opening to obtain a first focal plane associated with the top surface of the device; Irradiate the lower end of the opening of the cover to obtain a second focal plane associated with the cover at the lower end of the opening; and The distance between the top surface of the device and the inner surface of the cover facing the top surface of the device is derived based on the difference between the horizontal height of the first focal plane and the horizontal height of the second focal plane.

2. The measurement method according to claim 1, wherein the top surface of the device and the lower end of the opening of the cover are irradiated by X-rays, infrared (IR), ultraviolet (UV), or visible light.

3. The measurement method of claim 1, wherein the irradiation comprises adjusting a focal point on the top surface of the device or at the lower end of the opening of the cover.

4. The measurement method according to claim 1, wherein the first focal plane is substantially coplanar with the top surface of the device, and the second focal plane is substantially coplanar with the inner surface of the cover facing the top surface of the device.

5. The measurement method according to claim 1, wherein the first focal plane is substantially parallel to the second focal plane.

6. The measurement method of claim 1, further comprising sealing the opening after the distance is derived.

7. The measurement method of claim 1, wherein the opening is formed by removing a portion of the cap.

8. The measurement method according to claim 1, wherein the opening is formed before the cap is placed on the substrate and the device.

9. A measurement method, comprising: The device is encapsulated within a packaging structure, the packaging structure comprising: a substrate; a cap covering the substrate and the device; a sidewall connecting the substrate and the cap; and a first electrode pair disposed between a top surface of the device and an inner surface of the cap facing the top surface. The capacitance between the device and the package structure is measured using the first electrode pair; and The distance between the top surface and the inner surface is derived based on the measurement of the capacitance.

10. The measurement method according to claim 9, wherein the first electrode pair comprises: The first electrode is placed on the top surface of the device; and a second electrode, which is placed on the inner surface of the cover, with the first electrode aligned with the second electrode.

11. The measurement method of claim 10, wherein the derivation of the distance includes deriving the interval between the first electrode and the second electrode.

12. The measurement method according to claim 9, further comprising: The resistance between the device and the package structure is measured by means of a second electrode pair, the second electrode pair being placed between the top surface and the inner surface and including: a third electrode placed on the top surface of the device; and a fourth electrode placed on the inner surface of the cover.

13. The measurement method according to claim 12, wherein the third electrode is aligned with the fourth electrode.

14. The measurement method according to claim 12, further comprising: A protruding component is formed on the top surface of the device; And place the third electrode on the protruding component.

15. The measurement method according to claim 12, further comprising: A protruding part is formed on the inner surface of the cap; And place the fourth electrode on the protruding component.

16. A packaging structure comprising: Base; The device is placed on the substrate; A cap is placed on the base and the device; The first electrode is placed on the top surface of the device; and, A second electrode is placed on the inner surface of the cover, wherein the first electrode is aligned with the second electrode. The cover includes an opening that is positioned above the device and tapers toward the device.

17. The packaging structure of claim 16, wherein the distance between the top surface of the device and the inner surface of the cap facing the top surface of the device is between about 5 μm and about 500 μm.

18. The packaging structure of claim 16, wherein the opening has a first width and a second width, the second width being above the first width and substantially larger than the first width.

19. The packaging structure of claim 18, wherein the difference between the first width and the second width is between about 5 μm and about 100 μm.

20. The packaging structure of claim 18, further comprising a sealing component that fills or covers the opening.

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