Systems and methods for managing airflow in a data center

Abstract

This document describes an airflow management system and method. The system includes a top layer and a bottom layer, and each layer has a dedicated airflow management and hardware system that operates independently. The top layer is a ceiling air plenum and may include fan coils arranged in a hot aisle containment or cold aisle containment manner. The top layer receives fresh air from its own air source and discharges hot air through its own exhaust port. The bottom layer may include server racks arranged in a hot aisle containment or cold aisle containment manner. One or more servers in the bottom layer may include air cooling components and liquid cooling components, and receive cooling liquid from the top layer and cooling air from its own air source.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to airflow management in a data center. More specifically, embodiments of the present disclosure relate to hybrid and modular methods for managing airflow in a data center. Background Art

[0002] With the booming development of AI applications, cloud computing, and data-driven applications, data centers have become increasingly critical for companies to maintain their competitive edge. Maintaining a data center is expensive and part of the cost involves cooling the data center.

[0003] Modern data centers typically include servers with different lifespans, so the cooling system needs to be upgraded frequently to meet the cooling requirements. Additionally, modern data centers often use a single air source, which may not be the most efficient cooling solution for all types of IT equipment or infrastructure. Moreover, modern data centers usually only use recirculated cooling air, whose quality may be far better than that of natural fresh air. The quality of natural fresh air is usually poor in some areas and may damage the electronic equipment in the data center.

[0004] Therefore, a flexible, resilient, modular, and hybrid cooling method using multiple air sources will reduce the cooling cost of a data center by improving cooling efficiency and reducing capital costs. Summary of the Invention

[0005] One aspect of the present application provides an airflow management system for cooling a data center, including: a first layer including a plurality of fan coils; and a second layer below the first layer and connected to the first layer through a plurality of liquid circuits and liquid connectors, the second layer including a plurality of electronic racks arranged in multiple rows, each electronic rack including one or more servers, wherein at least one server in the second layer includes a liquid cooling component and an air cooling component, and wherein the liquid cooling component receives cooling liquid from one of the plurality of fan coils through one of the plurality of liquid circuits and one of the plurality of liquid connectors, and the air cooling component receives cooling air from an air source dedicated to the second layer.

[0006] Another aspect of the present application provides a method for managing air flow in a cooled data center, including: providing a first layer including a plurality of fan coils; providing a second layer directly below the first layer and connected to the first layer through a plurality of liquid circuits and liquid connectors, the second layer including a plurality of electronic racks arranged in multiple rows, each electronic rack including one or more servers, wherein at least one server in the second layer includes a liquid cooling component and an air cooling component; receiving, by the liquid cooling component in each of at least one server, cooling liquid from one of the plurality of fan coils through one of the plurality of liquid circuits and one of the plurality of liquid connectors; and receiving, by the air cooling component in the server, cooling air from a cooling air source dedicated to the second layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the present invention are shown by way of example and not limitation in the accompanying drawings, in which like reference numerals represent similar elements.

[0008] Figure 1 A perspective view showing a data center system according to one embodiment.

[0009] Figure 2 A side view showing an air flow management system according to one embodiment.

[0010] Figure 3 Another side view showing an air flow management system according to one embodiment.

[0011] Figure 4A and 4B A top view showing the design of the top layer according to various embodiments.

[0012] Figure 5 A design showing an air flow management system according to one embodiment.

[0013] Figure 6 Another design showing an air flow management system according to one embodiment.

[0014] Figure 7 Another embodiment showing an air flow management system according to one embodiment.

[0015] Figure 8 A method showing the management of air flow in a data center according to one embodiment. DETAILED DESCRIPTION

[0016] Various embodiments and aspects of the present invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are examples of the present disclosure and should not be construed as limiting the present disclosure. Many specific details are described to provide a thorough understanding of the various embodiments of the present disclosure. However, in some instances, well-known or conventional details are not described in order to provide a concise discussion of the embodiments of the present disclosure.

[0017] Reference to "one embodiment" or "an embodiment" in the specification means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present disclosure. The phrase "in one embodiment" appearing in various places in the specification need not all refer to the same embodiment.

[0018] According to various embodiments, systems and methods for managing airflow in a data center are described herein. In one embodiment, the system includes a top layer and a bottom layer. The top layer is a ceiling air plenum and can store fan coils arranged in a hot aisle containment or cold aisle containment manner. The top layer receives fresh air from its own air source and discharges hot air through its own exhaust port. The bottom layer can include server racks arranged in a hot aisle containment or cold aisle containment manner. One or more servers in the bottom layer can include air cooling components and liquid cooling components, and receive and circulate cooling liquid from the top layer and receive cooling air from its own air source, and discharge air through its own exhaust port.

[0019] Embodiments provide a highly cost - efficient architecture for managing airflow to cool high - density IT clusters in a data center. In one embodiment, the airflow management system can include different types of IT devices, including liquid - cooled IT devices and air - cooled IT devices. Additionally, the system can achieve more accurate air distribution based on the load to be cooled and the air temperature and quality outside the data center. Additionally, various embodiments in the present disclosure provide an architecture for deploying upgraded IT devices cooled in a hybrid manner into a pure air - cooled infrastructure, and this architecture can be used to design cooling solutions for new IT clusters. This architecture can also be used to upgrade or reconfigure existing IT clusters, data center rooms, or PoDs so that they can continue to support new IT devices.

[0020] In one embodiment, the fan coils in the top layer can be used to recirculate the cooling fluid from the top layer to the server racks in the bottom layer. The server racks can receive the cooling fluid from the top layer and distribute the cooling fluid to the liquid - cooled server loops in the server racks. Then, the hot fluid from the server racks is pumped back to the top layer to the fan coils. The pump for pumping the fluid can be installed on either layer. The fan coils in the top layer can be arranged in a cold aisle containment or hot aisle containment manner.

[0021] In one embodiment, the top floor includes a cooling unit for cooling fresh air directly drawn from the outside of the data center for cooling the fan coils on the top floor. The bottom floor includes a second dedicated air source, which is an indoor air cooling unit available for recirculating internal data center air through the electronic racks on the bottom floor.

[0022] In one embodiment, the airflow management system includes a fresh air cooling system attached to the top floor and the bottom floor. The fresh air cooling system includes a fresh air inlet, a fan wall, and a cooling air chamber; and can be configured to generate different pressures in the air chamber to supply different amounts of air to the top floor and the bottom floor.

[0023] In one embodiment, the bottom floor includes a chilled water system and a computer room air handler (CRAH) unit. The chilled water system can supply chilled water to the CRAH unit. In one embodiment, different types of cooling architectures and cooling devices can be integrated into the bottom floor structure for airflow recirculation and regulation.

[0024] Figure 1 A perspective view of a data center system according to one embodiment is shown. Referring Figure 1 , data center system 100 includes an IT room 101, a cold air chamber 102, and a hot air chamber 103. IT room 101 includes a plurality of electronic racks, such as electronic racks 111 and 112. Each electronic rack houses one or more IT components arranged in a stacked manner. The IT components can be computer servers that provide data services to clients. Alternatively, the IT components can be peripheral devices or network devices such as cloud storage systems. Each IT component can include one or more processors, memories, and / or storage devices that can generate heat during operation. The electronic racks are arranged in multiple rows of electronic racks, in this example, rows 104 and 105 of electronic racks. The multiple rows of electronic racks are arranged separately to form one or more cold channels and one or more hot channels. In this embodiment, although only two rows of electronic racks 104 and 105 are shown, more rows can be accommodated in IT room 101.

[0025] In one embodiment, each row of the electronic racks is located at or sandwiched between a cold aisle and a hot aisle. In this example, row 104 and row 105 are spaced apart from each other to form cold aisle 114A, hot aisle 115, and cold aisle 114B. Hot aisle 115 is formed between row 104 and row 105. Row 104 is located at or sandwiched between cold aisle 114A and hot aisle 115, while row 105 is located at or sandwiched between cold aisle 114B and hot aisle 115. In one embodiment, hot aisle 115 is contained or enclosed by a hot aisle enclosure (or container or other housing). In another embodiment, the cold aisle rather than the hot aisle is contained within an enclosed environment. In yet another embodiment, both the hot aisle and the cold aisle are contained within an enclosed environment. In one embodiment, the rear ends of the electronic racks in row 104 and row 105 face hot aisle 115, while the front ends of the electronic racks face cold aisle 114A or cold aisle 114B and are away from hot aisle 115.

[0026] In one embodiment, cold air chamber 102 is located and adjacent to a first side of IT chamber 101, while hot air chamber 103 is located and adjacent to a second side of IT chamber 101. In this example, the first side and the second side are opposite sides of IT chamber 101. Cold air chamber 102 is configured to receive cold or cool air from a cold air source (such as cold air source 180) via one or more inlets. Cold air is allowed to enter IT chamber 101 from cold air chamber 102 through one or more openings (not shown) provided in the wall between the cold air chamber and IT chamber 101. The cold air enters IT chamber 101 to form cold aisles 114A and 114B.

[0027] Hot air chamber 103 is configured to discharge hot air from hot aisle 115 and return the hot or warm air to the cold air source for heat exchange. Note that cold air source 180 may include a heat exchanger or a cooler. For example, cold air source 180 may be an IDEC system or device. Alternatively, cold air source 115 may simply be the natural ambient air outside data center system 100.

[0028] In one embodiment, both the cold air chamber 102 and the hot air chamber 103 can be directly connected to the surrounding environment, enabling both the cold air chamber 102 and the hot air chamber 103 to directly draw fresh air from the outside and directly discharge it to the outside. An evaporative cooler is a device that cools air through the evaporation of water. Evaporative cooling is different from typical air conditioning systems that use vapor compression or absorption refrigeration cycles. Evaporative cooling works by utilizing the high enthalpy of vaporization of water. The temperature of dry air can be significantly reduced through the conversion of liquid water to water vapor (evaporation). Indirect evaporative cooling reduces the temperature and increases the humidity of air by utilizing the latent heat of evaporation to turn liquid water into water vapor. In this process, the energy in the air does not change. Warm dry air becomes cool moist air. The heat of the outside air is used to evaporate water. In addition to some types of heat exchangers, indirect evaporative cooling also uses direct evaporative cooling to transfer cold energy to the supply air in the cooling process. The cool moist air from the indirect evaporative cooling process never comes into direct contact with the supply air of the air conditioner.

[0029] Refer back to Figure 1 , in this example, the cold air is received from one or more inlets or air intakes provided on the wall of the cold air chamber 102, where the wall is substantially parallel to the third side of the IT chamber 101. The third side of the IT chamber 101 is substantially perpendicular to the first and second sides, while the first and second sides are substantially parallel to each other. Similarly, the hot air is discharged from the hot air chamber 103 to the external environment or returned to the cold air source 180 via one or more outlets or air outlets provided on the wall of the hot air chamber 102, where the wall is substantially parallel to the third side of the IT chamber 101.

[0030] According to one embodiment, the hot channel 115 is housed or accommodated within the hot channel housing 120 such that hot air cannot escape or spill out from the hot channel 115 into other areas of the IT chamber 101, such as the cold channels 114A and 114B. Instead, the hot air enters the hot air chamber 103 from the hot channel via one or more openings (e.g., windows, doors) provided on the wall between the hot channel 115 and the hot air chamber 103. In one embodiment, the opening allows an operator or user to enter the hot channel 115 from the hot air chamber 103 to access the rear end of the electronic rack, for example, for maintenance services. Doors are required on 102 and 103 to enable the operator to enter the cold air chamber 102 and the hot air chamber 103. And according to some embodiments, no door is required on the hot channel 115, and no door is required on the wall between the cold air chamber 102 and the IT chamber 101.

[0031] Similarly, the opening provided in the wall between the cold air chamber 102 and the IT chamber 101 may include one or more doors to allow an operator or user to enter the cold channels 114A and 114B from the cold air chamber 102. As a result, entering or leaving the cold or hot channels will not significantly affect the cold air distribution and hot air exhaust. That is, since the hot channel accommodation 120 separates the hot channel 115 from the cold channels 114A and 114B and the rest of the IT chamber 101, entering or leaving the hot channel 115 will not change the cold air distribution in the cold channels 114A and 114B. Similarly, since opening the doors for user entry or exit will not mix cold air and hot air, entering or leaving the cold channels 114A and 114B will not affect the hot air exhaust in the hot channel 115.

[0032] In one embodiment, Figure 1 the data center architecture described in Figure 2 , 3 and Figures 5 to 7 can be used as the underlying layer 203 of the airflow management system described in Figure 2 , Figure 3 and Figures 5 to 7 to the top layer 201.

[0033] Figure 2 FIG. 21 shows a side view of an airflow management system 100 according to one embodiment. As Figure 2 shown, the airflow management system 100 includes a top layer 201 and an underlying layer 203. The top layer is a ceiling air plenum including a plurality of fan coils (e.g., fan coils 223 and 225). Each fan coil operates as an air - liquid heat exchanger. The air source inlets 205 and 209 can be used to supply fresh air to a cooling unit (not shown) to cool the top layer, which has its own hot air outlet 234.

[0034] In one embodiment, the underlying layer 203 is an IT area where a plurality of electronic racks (also referred to as server racks) are arranged in different ways, such as in a cold channel accommodation manner or a hot channel accommodation manner, as described in detail in Figure 1 . As Figure 2 shown, the underlying layer 203 includes four rows of electronic racks 224, 227, 229, and 231, which form two cold channels 226 and 228 and one hot channel 230. In another embodiment, the four rows of electronic racks 224, 227, 229, and 231 can form two hot channels 226 and 228 and one cold channel 230. The detailed structure of the hot channel accommodation or cold channel accommodation is described in Figure 2Not shown in the figure. The bottom layer 203 may have dedicated air source inlets 222 and 207 for supplying cooling air, and may have its own hot air return port (not shown in this figure). Reference numerals 205 and 209 represent different parts of the same air source inlet, and reference numerals 222 and 207 represent different parts of another air source inlet.

[0035] In one embodiment, each cold channel in the bottom layer 203 may correspond to a fan coil unit in the top layer 201. For example, the cold channel 226 corresponds to the fan coil unit 225, and the cold channel 228 corresponds to the fan coil unit 223. Each electronic rack may have similar cooling components and may be connected to the top layer 201 in a similar manner. Figure 2 The electronic rack 227 is used to show the cooling components and the connection mechanism. In another embodiment, the fan coil units may be two separate units 225 and 223.

[0036] In one embodiment, the electronic rack 227 may house multiple servers. This figure uses the server 233 as an example to illustrate the cooling components within each server. As shown, the server 233 may include a liquid cooling component 239 and an air cooling component 242. The rack liquid distribution unit 237 on the electronic rack 227 may receive cooling liquid from the top layer 201 through the liquid connector 232 using the liquid loop 229, and may distribute the received cooling liquid to the liquid cooling component 239 within the servers in the electronic rack 227 through the fluid loop and connection unit 235. The air cooling component 242 may use the cooling air supplied by the air source inlets 222 and 207 for cooling.

[0037] Therefore, the server 233 can be cooled in a hybrid manner and can be cooled simultaneously by cooling air and cooling liquid. Through the fluid loop and connection unit 235 and the liquid loop 229, the cooling fluid circulates between the liquid cooling component 239 and the fan coil unit 225.

[0038] Figure 3 Shows another side view of the airflow management system 100 according to one embodiment. This view also shows a side view of the other side of the data center system. As mentioned before, the components in the top layer 201 and the bottom layer 203 are separately arranged and are only connected through the liquid loop 307 and liquid connectors (not shown). A pumping system (not shown) may be used to pump the coolant into the liquid loop 307. The hot air return port 315 may be implemented using a pipe. The electronic rack 317 in the bottom layer 203 is Figure 2 the same electronic rack as shown above. The air source inlet 303 may be used to supply cooling air to the bottom layer 203. The air source inlet 303 may be a different part of the air source inlets 222 and 207.

[0039] From Figure 3In the view shown, the top layer 201 may include a plurality of fan coils 305, 306, and 308, as well as a plurality of hot air exhaust ports 310 and 311. The air source inlets 301 and 313 may be the same air source inlets 209 and 225 for supplying fresh air to the top layer 201. The air source inlets 301 and 313 are used to supply cooling air to the cold aisle of the top layer 201, and the hot air exhaust ports 310 and 311 are the exhaust sides connected to the hot aisle of the top layer 201.

[0040] In one embodiment, the air source inlets 301 and 313 and the air source inlet 303 are two separate and also different cooling sources. Alternatively, each of the reference numerals 301, 303, and 313 may be a different air source. The air source inlets 301 and 303 may draw fresh outside air, and the air source inlet 303 may draw cooling air recycled from the internal data center. Each air source inlet has its own air discharge outlet. The reference numerals 303 and 301 may be two different parts of the same air source that have been divided according to cooling needs.

[0041] Figure 4A and 4B Shows a top view of the design of the top layer 201 according to various embodiments.

[0042] In Figure 4A the top layer, the fan coils are arranged in two rows 406 and 408, and the two rows 406 and 408 are arranged in a cold aisle accommodation manner, similar to the way the electronic racks in the bottom layer 203 in Figure 2 are arranged. Fresh air 409 may enter the cold aisle 403 formed by the two rows of electronic racks 406 and 408. The fan system 410 may optionally be used to pump the air flow. Hot air 407 and 412 may be discharged from the fan coils into the hot aisle 405 or the surrounding environment. The fans in the fan system 410 may be individually controlled or operated at a set speed.

[0043] In Figure 4B the fan coils are arranged in a hot aisle accommodation manner. In this embodiment, the entire top layer area is located in the cold aisle 417. Fresh air 411, 418, and 419 may be supplied to the top layer 201 and then pumped into the hot aisle 415 to cool the fan coils. The discharge fan 412 may be used to discharge the hot air to the outside. The ceiling heat discharge outlet (such as Figure 2 the hot air exhaust port 234 in

[0044] In one embodiment, Figure 4A the fan system 410 described may be used in Figure 4B the embodiment described. Similarly, Figure 4B the discharge fan 412 in Figure 4AIn the described embodiments.

[0045] Figure 5 Shows the design of an airflow management system 500 according to one embodiment. More specifically, this embodiment shows the design of the cooling infrastructure in the airflow management system.

[0046] In one embodiment, the system includes a separate air source. The top layer 201 includes a cooling unit 505 for guiding external air, which is used to draw in fresh external air into the cooling unit 505 and pump the fresh external air to the top layer 201. The cooling unit 505 does not need to cool the fresh external air, but can only be used as a fan system. The bottom layer 203 includes an indoor air cooling unit 503 for supplying cooling air to the IT cluster area 508 in the data center. The cooling air used by the indoor air cooling unit 503 is recycled in the data center. The indoor air cooling unit 503 can also receive the hot air generated by the data center, cool the hot air again and blow it into the IT cluster 508 again. In this design, there can be two airflows. One of the airflows is formed by the cooling air coming out of the indoor air cooling unit 503 and the hot air return port 501. The other airflow is formed by the cooling air coming out of the cooling unit 505 for guiding external air and the hot air coming out of the hot air discharge port 234. The two airflows can be operated and configured independently.

[0047] As shown, the top layer 201 can have its own hot air discharge port 234, and the hot air generated by the top layer 201 is discharged into the surrounding environment of the data center through the hot air discharge port 234. For example, the data center is placed outside the building. The bottom layer 203 also has its own hot air return port 501. However, instead of discharging the hot air as the hot air discharge port 234 of the top layer 201 to the external environment, the hot air return port 501 discharges the hot air back to the indoor air cooling unit 503, where the hot air is cooled into cold air 507 and the cold air 507 is recycled back to the IT cluster 508.

[0048] Figure 6 Shows another design of an airflow management system 100 according to one embodiment. In this embodiment, the airflow management system includes a single air source to supply fresh air to a fresh air cooling system 601, which only uses fresh air and does not use recycled air. The IT cluster 607 is attached to the fresh air cooling system 601. The fresh air cooling system 601 can include a fresh air inlet 602, a fan wall 603, and a cooling air chamber 605. The cooling air chamber 605 can be adjusted to generate different pressure conditions and distribution patterns indoors, so as to supply different amounts of air to the top layer 201 and the bottom layer 203.

[0049] Figure 7Shows another embodiment of the airflow management system 100 according to one embodiment. This embodiment uses a hybrid airflow management system that includes different types of cooling systems.

[0050] The top layer 201 uses a cooling unit for guiding external air 701, while the bottom layer 203 uses a combination of a traditional chilled water system 703 and a computer room air handler (CRAH) unit 705. The CRAH unit 705 is located within the IT cluster area 707 to condition and recirculate the internal airflow. The CRAH unit 705 can use fans and chilled water coils to remove heat. Since the CRAH unit 705 may not have a compressor, less energy can be consumed. The chilled water system 703 is used to supply chilled water to the CRAH unit 705. For the purpose of recirculating and conditioning the airflow to the bottom layer, other types of cooling systems or cooling solutions for the data center can be integrated with the bottom layer, while the top layer can be directly designed with free air cooling in various embodiments.

[0051] Figure 8 Shows a method for managing airflow in a data center. As Figure 8 shown, in block 801, a first layer is provided as a ceiling air plenum. The ceiling air plenum includes a plurality of fan coils arranged in a cold aisle containment manner or a hot aisle containment manner. In block 803, a second layer is provided. The second layer represents an information technology (IT) cluster that includes a plurality of electronic racks arranged in a cold aisle containment manner or a hot aisle containment manner. Each electronic rack includes one or more servers, and at least one server in the second layer includes liquid cooling components and air cooling components. The second layer is directly located below the first layer and is connected to the first layer through a liquid circuit and a liquid connector. In block 805, the liquid cooling components in each of at least one server receive cooling liquid from the fan coils through one of the liquid circuits and one of the liquid connectors. In block 807, the air cooling components in the servers receive cooling air from a dedicated cooling air source for the second layer.

[0052] In the foregoing specification, embodiments of the present invention have been described with reference to specific exemplary embodiments of the present disclosure. Obviously, various modifications can be made thereto without departing from the broader spirit and scope of the present invention as set forth in the appended claims. Accordingly, the specification and drawings are to be regarded as illustrative rather than restrictive.

[0053] As described above, embodiments of the present disclosure may be (or include) a non-transitory machine-readable medium (such as a microelectronic memory) storing instructions that program one or more data processing components (collectively referred to herein as "processors") to perform airflow management operations, such as controlling the fan speed of one or more fans of a battery module (and / or BBU rack). In other embodiments, some of these operations may be performed by specific hardware components that incorporate hardwired logic. Alternatively, these operations may be performed by any combination of programmed data processing components and fixed hardwired circuit components of any of the battery modules described herein.

[0054] Although certain aspects have been described and illustrated in the drawings, it will be understood that these aspects are merely illustrative and not limiting of the broad disclosure, and that various other modifications may be contemplated by those of ordinary skill in the art. The present disclosure is not limited to the specific structures and arrangements shown and described. Accordingly, this specification is to be regarded as illustrative rather than restrictive.

[0055] In some aspects, the present disclosure may include language such as "[element A] and at least one of [element B]". This language may refer to one or more of the elements. For example, "at least one of A and B" may refer to "A", "B", or "A and B". Specifically, "at least one of A and B" may refer to "at least one of A and at least one of B" or "at least one of A or B". In some aspects, the present disclosure may include language such as "[element A], [element B], and / or [element C]". This language may refer to the element or any combination thereof. For example, "A, B, and / or C" may refer to "A", "B", "C", "A and B", "A and C", "B and C", or "A, B, and C".

Claims

1. An air flow management system for cooling a data center, comprising: A first layer, including a plurality of fan coils; And A second layer, below the first layer and connected to the first layer through a plurality of liquid circuits and liquid connectors, the second layer including a plurality of electronic racks arranged in multiple rows, each electronic rack including one or more servers, Wherein at least one server in the second layer includes a liquid cooling component and an air cooling component, and Wherein the liquid cooling component receives cooling liquid from one of the plurality of fan coils through one of the plurality of liquid circuits and one of the plurality of liquid connectors, and the air cooling component receives cooling air from a fresh air cooling system attached to the first layer and the second layer to cool the first layer and the second layer, wherein the fresh air cooling system includes a fresh air inlet, a fan wall, and a cooling air chamber and is configured to: generate different pressure and distribution patterns in the cooling air chamber to supply different amounts of air to the first layer and the second layer.

2. The airflow management system according to claim 1, wherein Each of the one or more servers is placed on one of the electronic racks, and the electronic rack further includes a liquid distribution unit that receives the cooling liquid from one of the plurality of fan coils and distributes the received cooling liquid to the liquid cooling component in the server.

3. The airflow management system according to claim 1, wherein, The plurality of fan coils in the first layer are arranged in a cold aisle containment manner or a hot aisle containment manner.

4. A method for managing air flow in a cooled data center, comprising: Providing a first layer, including a plurality of fan coils; Providing a second layer, directly below the first layer and connected to the first layer through a plurality of liquid circuits and liquid connectors, the second layer including a plurality of electronic racks arranged in multiple rows, each electronic rack including one or more servers, wherein at least one server in the second layer includes a liquid cooling component and an air cooling component; Receiving, by the liquid cooling component in each of the at least one server, cooling liquid from one of the plurality of fan coils through one of the plurality of liquid circuits and one of the plurality of liquid connectors; and Receiving, by the air cooling component in the server, cooling air from a fresh air cooling system attached to the first layer and the second layer to cool the first layer and the second layer, wherein the fresh air cooling system includes a fresh air inlet, a fan wall, and a cooling air chamber and is configured to: generate different pressure and distribution patterns in the cooling air chamber to supply different amounts of air to the first layer and the second layer.

5. The method according to claim 4, wherein Each of the one or more servers is placed on one of the electronic racks, and the electronic rack further includes a liquid distribution unit that receives the cooling liquid from one of the plurality of fan coils and distributes the received cooling liquid to the liquid cooling component in the server.

6. The method according to claim 4, wherein The multiple fan coil units in the first layer are arranged in a cold aisle containment manner or a hot aisle containment manner.

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