Functional module and assembly method thereof, and electronic device

Abstract

The present invention provides a functional module and an assembly method thereof, as well as an electronic device including the functional module. The functional module includes a heat sink, a functional device and a connection structure. The connection structure includes a first clamping portion provided on the heat sink and a second clamping portion provided on the functional device, the first clamping portion is one of a buckle and a clamping edge matched with the buckle, and the second clamping portion is the other of the buckle and the clamping edge. The first clamping portion and the second clamping portion are mutually engaged, so that the heat sink is fixed to the functional device, and the heat generated by the functional device can be dissipated through the heat sink. In the functional module provided by the present invention, the heat sink and the functional device are contact-connected by a clamping connection structure, and there is no heat-conducting medium between the two, which enhances the heat dissipation effect on the functional device, and the heat sink is clamped and fixed to the functional device, which is conducive to the disassembly or installation of the radiator.

Description

Technical Field

[0001] The present invention relates to the field of electronic equipment, and in particular to a functional module with excellent heat dissipation effect and an assembling method thereof, as well as electronic equipment comprising the functional module. Background Art

[0002] As we all know, some functional devices (such as chips) will generate a large current during operation. In addition to supplying the functional devices with energy for normal operation, the remaining energy will be dissipated in the form of heat. Therefore, the functional devices will generate heat during operation. If the functional devices are allowed to generate heat without being suppressed, malfunctions may occur due to overheating, so heat dissipation must be performed on the functional devices.

[0003] At present, thermally conductive silicone is usually used as a connecting medium to stick the heat sink on the surface of the functional device, and the temperature of the functional device is transferred to the heat sink by heat conduction, and then the heat sink is cooled by natural air cooling. However, thermally conductive silicone itself is not a good conductor of heat. Its main function is to firmly stick the heat sink to the surface of the functional device. The thermal conductivity of thermally conductive silicone is generally lower than that of metal heat sinks. Thermally conductive silicone actually slows down the conduction of heat. Therefore, the method of using thermally conductive silicone to stick the heat sink to dissipate heat from the functional device does not achieve the best effect. Summary of the invention

[0004] In order to solve the problems of the prior art, the present invention provides a functional module and an assembly method thereof, and an electronic device. In the functional module, the heat sink and the functional device are contact-connected by a snap-fit ​​connection structure, and there is no heat-conducting medium between the two, which enhances the heat dissipation effect on the functional device. Moreover, the heat sink is snap-fitted and fixed to the functional device, which is convenient for disassembly or installation of the radiator.

[0005] In order to achieve the above-mentioned object, on the one hand, the present invention provides a functional module, including a heat sink, a functional device and a connection structure. The connection structure includes a first clamping portion provided on the heat sink and a second clamping portion provided on the functional device, the first clamping portion is one of a buckle and a clamping edge matched with the buckle, and the second clamping portion is the other of the buckle and the clamping edge. The first clamping portion and the second clamping portion are mutually engaged, so that the heat sink is fixed to the functional device, and the heat generated by the functional device can be dissipated through the heat sink.

[0006] In one embodiment, the heat sink has a first heat conduction surface, the functional device has a second heat conduction surface, the first clamping portion has a first clamping surface parallel to the first heat conduction surface, and the second clamping portion has a second clamping surface parallel to the second heat conduction surface. When the heat sink is fixed to the functional device, the first heat conduction surface is correspondingly attached to the second heat conduction surface, and the first clamping surface is correspondingly attached to the second clamping surface.

[0007] Wherein, when the heat sink and the functional device are separated from each other, there is a first size between the first clamping surface and the first heat conduction surface, and there is a second size between the second clamping surface and the second heat conduction surface; when the heat sink is fixed to the functional device and used for heat dissipation, there is a third size between the first clamping surface and the first heat conduction surface, and between the second clamping surface and the second heat conduction surface; the first size and the second size are both smaller than the third size.

[0008] In one embodiment, the first engaging portion is a buckle provided on the heat sink, and the second engaging portion is a clamping edge provided on the functional device;

[0009] The buckle includes an extension section and a clamping section connected to the extension section, the extension section extends in a direction perpendicular to the first heat conduction surface and away from the first heat conduction surface, the clamping section is connected to one end of the extension section away from the first heat conduction surface and extends away from the extension section in a direction parallel to the first heat conduction surface, the clamping section has a first surface facing the first heat conduction surface, and the first surface is the first clamping surface;

[0010] The clamping edge extends in a direction parallel to the second heat conducting surface. The clamping edge has a second surface away from the second heat conducting surface. The second surface is the second clamping surface.

[0011] In one embodiment, the first size is smaller than or equal to the second size.

[0012] In one embodiment, the difference between the first size and the third size is 0.04 mm-0.05 mm, and / or the difference between the second size and the third size is 0.03 mm-0.05 mm.

[0013] In one embodiment, the engaging section further has a third surface parallel to the first surface and away from the first heat conducting surface, and a fourth dimension is defined between the first surface and the third surface;

[0014] The card edge is made by removing part of the material of the functional device, the functional device is formed with a receiving groove corresponding to and adjacent to the card edge, the receiving groove has a fourth surface parallel to the second surface and opposite to the second surface, and a fifth dimension is defined between the second surface and the fourth surface;

[0015] Among them, the fourth size is smaller than or equal to the fifth size; when the buckle is correspondingly engaged with the card edge, the buckle is received in the receiving groove corresponding to the card edge.

[0016] The heat sink is provided with a buckle at two opposite ends in the first direction, the first heat conduction surface is located between the extension sections of the two buckles, and the respective engagement sections of the two buckles extend toward each other; and / or,

[0017] At least one buckle is provided in the region between the two opposite ends of the heat sink in the first direction, the buckle is convexly provided on the first heat conduction surface, one end of the buckle segment is connected to the end of the extension section of the buckle away from the first heat conduction surface, and the other end extends toward one end of the heat sink in the first direction, or the portion between the two opposite ends of the buckle segment is connected to the end of the extension section of the buckle away from the first heat conduction surface, and the two opposite ends of the buckle segment extend toward the two opposite ends of the heat sink in the first direction respectively;

[0018] The functional device has a receiving groove at a position of the second heat conducting surface corresponding to each buckle to form a buckle edge matched with the buckle;

[0019] Wherein, the length directions of the buckle, the clamping edge and the receiving groove are all the second direction, and the second direction is not parallel to the first direction.

[0020] In one embodiment, the engaging section of the buckle is provided with a first chamfer at least on an edge of the first engaging surface, and / or the engaging edge is provided with a second chamfer at least on an edge of the second engaging surface.

[0021] On the other hand, the present invention further provides an electronic device, comprising the above-mentioned functional module.

[0022] On the other hand, the present invention also provides a method for assembling a functional module, which is applied to the above-mentioned functional module. The method for assembling the functional module includes: heating the first clamping part or the second clamping part of the buckle to enlarge the clamping space of the buckle, the clamping space being the space of the buckle for accommodating the second clamping part or the first clamping part of the clamping edge; placing the heat sink on one side of the functional device in the pushing direction, and aligning the clamping edge with the clamping space of the buckle, the pushing direction being the length direction of the second clamping part; and pushing the heat sink along the pushing direction until the clamping edge is accommodated in the clamping space, so that the heat sink is fixed to the functional device.

[0023] Compared with the prior art, the present invention has the following beneficial effects: by respectively providing the first clamping part and the second clamping part on the heat sink and the functional device of the functional module, the first clamping part and the second clamping part are correspondingly clamped to form a connection structure, so that the heat sink and the functional device are contact-connected through the clamping connection structure, there is no heat-conducting medium between the two, the thermal conductivity is high, and the heat dissipation effect on the functional device is enhanced. Furthermore, the heat sink is fixed to the functional device by clamping, which is conducive to disassembly or installation of the heat sink as needed, and improves the assembly convenience of the functional module.

[0024] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0026] Figure 1 It is a schematic cross-sectional structure diagram of a heat sink of a functional module provided by one embodiment of the present invention being fixed to a functional device via a connecting structure.

[0027] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure of the heat sink.

[0028] Figure 3 yes Figure 1 Schematic diagram of the cross-sectional structure of the functional device in.

[0029] Figure 4 yes Figure 2 Schematic diagram of the three-dimensional structure of the heat sink.

[0030] Figure 5 yes Figure 3 Schematic diagram of the three-dimensional structure of the functional device.

[0031] Figure 6 It is a schematic cross-sectional structure diagram of a heat sink of a functional module provided by another embodiment of the present invention being fixed to a functional device via a connecting structure.

[0032] Figure 7 It is a schematic cross-sectional structure diagram of a heat sink of a functional module provided by another embodiment of the present invention being fixed to a functional device through a connecting structure.

[0033] Figure 8 It is a schematic diagram of the framework structure of the electronic device provided by the present invention.

[0034] Fig. 9 It is a flow chart of the method for assembling the functional modules provided by the present invention.

[0035] Main component symbols

[0036] Functional module 1

[0037] Heat sink 20

[0038] Functional Devices 40

[0039] Connection structure 60

[0040] The first engaging portion 61

[0041] Extension 612

[0042] Clamping section 614

[0043] The second engaging portion 62

[0044] 63 card space

[0045] Storage slot 64

[0046] First heat conduction surface A1

[0047] Second heat conduction surface A2

[0048] First engaging surface B1

[0049] Second engagement surface B2

[0050] Third surface B3

[0051] Fourth surface B4

[0052] First size C1

[0053] Second size C2

[0054] The third size C3

[0055] Fourth size C4

[0056] Fifth size C5

[0057] First direction X

[0058] Second direction Y

[0059] Electronic equipment 2

[0060] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0061] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. It is understood that the embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0062] Please also read Figures 1 to 3 The present invention provides a functional module 1, comprising a heat sink 20, a functional device 40, and a connecting structure 60 for connecting the heat sink 20 and the functional device 40. Specifically, the connecting structure 60 comprises a first clamping portion 61 provided on the heat sink 20 and a second clamping portion 62 provided on the functional device 40. The first clamping portion 61 is one of a buckle and a clamping edge matched with the buckle, and the second clamping portion 62 is the other of the buckle and the clamping edge.

[0063] like Figure 1 As shown, the first engaging portion 61 and the second engaging portion 62 engage with each other, so that the heat sink 20 is fixed to the functional device 40, so that the heat generated by the functional device 40 can be dissipated through the heat sink 20. It can be understood that, compared with the prior art in which the heat sink is fixed to the functional device by a heat-conducting medium such as heat-conducting silica gel to dissipate heat for the functional device, in the functional module 1 provided by the present invention, the heat sink 20 and the functional device 40 are contact-connected by the engaging connection structure 60, and there is no heat-conducting medium between the two, and the thermal conductivity is high, so that the heat dissipation effect of the heat sink 20 on the functional device 40 can be enhanced. Furthermore, the heat sink 20 is fixed to the functional device 40 by engaging, which is also conducive to disassembly or installation of the heat sink 20 as needed, thereby improving the assembly convenience of the functional module 1.

[0064] Among them, Figure 2As shown, the heat sink 20 has a first heat conduction surface A1, the first engaging portion 61 has a first engaging surface B1 parallel to the first heat conduction surface A1, and when the heat sink 20 and the functional device 40 are separated from each other, a first dimension C1 is defined between the first engaging surface B1 and the first heat conduction surface A1. Figure 3 As shown, the functional device 40 has a second heat conducting surface A2, the second engaging portion 62 has a second engaging surface B2 parallel to the second heat conducting surface A2, and when the heat sink 20 and the functional device 40 are separated from each other, a second dimension C2 is defined between the second engaging surface B2 and the second heat conducting surface A2. Figure 1 As shown, when the heat sink 20 is fixed to the functional device 40 by the connecting structure 60, the first heat conduction surface A1 and the second heat conduction surface A2 are correspondingly fitted, so that the heat of the functional device 40 is transferred to the heat sink 20 and dissipated by the heat sink 20, and the first engaging surface B1 and the second engaging surface B2 are correspondingly fitted to prevent the heat sink 20 from being separated from the functional device 40. When the heat sink 20 is fixed to the functional device 40 and used for heat dissipation, there is a third dimension C3 between the first engaging surface B1 and the first heat conduction surface A1, and between the second engaging surface B2 and the second heat conduction surface A2. Considering that the heat sink 20 and the functional device 40 will expand due to heat when dissipating heat, in the embodiment of the present invention, the first dimension C1 and the second dimension C2 are both configured to be smaller than the third dimension C3.

[0065] It is understandable that the longer the functional device 40 works in the power-on state, the greater the heat generated by the functional device 40, and the temperature of the functional device 40 will gradually increase until it stabilizes, and the temperature of the heat sink 20 will also gradually increase until it stabilizes. Therefore, the thermal expansion deformation of the heat sink 20 and the functional device 40 will gradually increase with the working heat generation of the functional device 40, and there is a maximum value. In addition, different types of functional devices 40 will have different working heat generation under the same working time, and accordingly, the thermal expansion deformation of the heat sink 20 and the functional device 40 will not be different. That is to say, the third dimension C3 is related to the type and working time of the functional device 40, and can be determined according to actual conditions.

[0066] It can also be understood that when the heat sink 20 and the functional device 40 are in a natural state (i.e., a state where heat dissipation is not being performed), in order to ensure that the first engaging portion 61 and the second engaging portion 62 can be engaged and fixed with each other, the key dimension (i.e., the first dimension C1 or the second dimension C2) corresponding to the first engaging portion 61 or the second engaging portion 62 as a buckle must be smaller than or equal to the key dimension (i.e., the second dimension C2 or the first dimension C1) corresponding to the second engaging portion 62 or the first engaging portion 61 as a clip. Specifically, Figure 1 As shown, in one embodiment of the present invention, the first engaging portion 61 is a buckle provided on the heat sink 20, the second engaging portion 62 is a clamping edge provided on the functional device 40, and the first dimension C1 corresponding to the first engaging portion 61 is less than or equal to the second dimension C2 corresponding to the second engaging portion 62. Preferably, in this embodiment, the first dimension C1 is less than the second dimension C2, so that the buckle and the clamping edge are interference-fitted, which can prevent the heat sink 20 from being detached from the functional device 40 when the functional module 1 in the non-heat dissipation state is subjected to external force or shakes.

[0067] It is well known that the temperature of the heat sink 20 as a heated body will be lower than the temperature of the functional device 40 as a heating body, but the deformation of the thermal expansion of an object is proportional to the temperature change of the object and the thermal expansion coefficient of its own material. It is well known to those skilled in the art that, considering the influence of temperature change and material thermal expansion coefficient on the heat sink 20 and the functional device 40, the thermal expansion deformation of the heat sink 20 is generally greater than the thermal expansion deformation of the functional device 40. Therefore, in this embodiment, the difference between the first dimension C1 and the third dimension C3 corresponding to the buckle is designed to be 0.04mm-0.05mm, and the difference between the second dimension C2 and the third dimension C3 corresponding to the clip edge is designed to be 0.03mm-0.05mm. In other words, the key dimensions of each of the first snap-fitting portion 61 and the second snap-fitting portion 62 (i.e., the first dimension C1 and the second dimension C2) are respectively designed with reserved thermal expansion deformation amounts, and the reserved thermal expansion deformation amount of the first snap-fitting portion 61 which is a buckle is greater than the reserved thermal expansion deformation amount of the second snap-fitting portion 62 which is a clip edge. In this way, it can not only ensure that the first snap-fitting portion 61 and the second snap-fitting portion 62 remain engaged in the heat dissipation state, so that the heat sink 20 in the heat dissipation state is engaged and fixed on the functional device 40, but also when the heat sink 20 and the functional device 40 are transformed from the heat dissipation state to the natural state, that is, when the snap-fitting portion and the clip edge are restored from the thermal expansion state to the natural state, the cold contraction deformation amount of the snap-fitting portion is greater than the deformation amount of the clip edge, which is conducive to a tighter engagement of the snap-fitting portion and the clip edge.

[0068] Of course, in other embodiments, according to the actual conditions of the thermal expansion deformation of the heat sink 20 and the functional module 40, the difference between the first dimension C1 corresponding to the buckle and the third dimension C3, and the difference between the second dimension C2 corresponding to the card edge and the third dimension C3 can be designed with other reasonable difference ranges respectively. Preferably, the reserved thermal expansion deformation corresponding to the buckle is greater than the reserved thermal expansion deformation of the card edge, and there is no limitation on this.

[0069] It should be noted that, in one embodiment of the present invention, when the heat sink 20 is fixed to the functional device 40 by means of the connecting structure 60, the first snap-fitting portion 61 or the second snap-fitting portion 62 of the snap-fitting may be heated first, for example, by uniformly heating with a hot air gun, so that the snap-fitting expands due to the heat, thereby increasing the first dimension C1 corresponding to the snap-fitting, thereby facilitating the insertion of the second snap-fitting portion 62 or the first snap-fitting portion 61 of the snap-fitting edge into the snap-fitting, and after the snap-fitting cools down, an interference fit between the snap-fitting and the snap-fitting edge may be achieved, thereby fixing the heat sink 20 to the functional device 40.

[0070] In the embodiment of the present invention, the heat sink 20 may be, but is not limited to, a heat sink, a heat sink, or any other suitable heat sink or heat sink assembly, and the functional device 40 may be, but is not limited to, an electronic chip, a central processing unit, or other electronic components that generate heat when powered on, and this is not limited thereto. For ease of description, the following will take the heat sink 20 as a heat sink and the functional device 40 as an electronic chip as an example to further describe the detailed structure of the functional module 1.

[0071] For details, please refer to Figure 2 and Figure 4 In one embodiment of the present invention, the first engaging portion 61 is a buckle provided on the heat sink 20. The buckle includes an extension section 612 and a buckle section 614 connected to the extension section 612. The extension section 612 extends in a direction perpendicular to the first heat conduction surface A1 and away from the first heat conduction surface A1. The buckle section 614 is connected to an end of the extension section 612 away from the first heat conduction surface A1 and extends away from the extension section 612 along a first direction X parallel to the first heat conduction surface A1. The buckle section 614 has a first surface ( Figure 2 The upper surface of the locking section 614 is shown in the figure), and the first surface is the first locking surface B1.

[0072] The first engaging surface B1, the first heat conducting surface A1 and the wall surface of the extension section 612 connecting the first heat conducting surface A1 and the first engaging surface B1 form an engaging space 63 with an opening, and the engaging space 63 is used to accommodate the second engaging portion 63 as the engaging edge. The first dimension C1 is also the dimension of the engaging space 63 along the engaging edge. Figure 1 The vertical opening size in the.

[0073] More specifically, if Figure 2 and Figure 4 As shown, in one embodiment of the present invention, the heat sink 20 is provided with a buckle at two opposite ends in the first direction X, the first heat conduction surface A1 of the heat sink 20 is located between the extension sections 612 of the two buckles, and the respective engagement sections 614 of the two buckles extend toward each other. That is, the heat sink 20 is symmetrically provided with two buckles at two opposite ends in the first direction X, one of which is an L-shaped structure, and the other is a mirrored L-shaped structure. Figure 4 As shown, the length direction of each buckle and its corresponding engaging space 63 is the second direction Y, and the second direction Y is not parallel to the first direction X, that is, the second direction Y can be perpendicular to the first direction X or have an acute angle, preferably perpendicular.

[0074] Please also read Figure 3 and Figure 5 In one embodiment of the present invention, the second engaging portion 62 is a clamping edge provided on the functional device 40. The clamping edge is made by removing part of the material of the functional device 40 by cutting or etching or any other suitable method. The clamping edge extends along the first direction X parallel to the second heat conducting surface A2, and the clamping edge has a second surface ( Figure 3 The lower surface of the card edge shown in the figure), the second surface is the second card surface B2.

[0075] When part of the material of the functional device 40 is removed to form the card edge, the functional device 40 is formed with a receiving groove 64 corresponding to and adjacent to the card edge. The second dimension C2 is also the length of the card edge. Figure 1 The vertical thickness of the . Figure 1 When the buckle is correspondingly engaged with the card edge, the buckle is received in the receiving groove 64 corresponding to the card edge.

[0076] Specifically, Figure 3 and Figure 5As shown, in one embodiment of the present invention, the functional device 40 is provided with a receiving groove 64 at two opposite ends of the second heat conduction surface A2 in the first direction X, thereby forming two clamping edges, and the two clamping edges are respectively used to cooperate with two clamps at two opposite ends of the heat sink 20 in the first direction X, and the shape of each receiving groove 64 is the same as that of the corresponding clamp. Figure 5 As shown, the length direction of each of the clamping edges and the corresponding receiving groove 64 is also the second direction Y.

[0077] Further, please refer again to Figure 2 In one embodiment of the present invention, the engaging section 614 of each buckle further has a third surface B3 parallel to the first surface (i.e., the first engaging surface B1) and away from the first heat conducting surface A1, and a fourth dimension C4 is defined between the first surface and the third surface B3. The fourth dimension C4 is also the dimension of the engaging section 614 along the Figure 1 The vertical thickness of the . Figure 3 In one embodiment of the present invention, the receiving groove 64 has a fourth surface B4 which is parallel to the second surface (i.e., the second engaging surface B2) and opposite to the second surface, and a fifth dimension C5 is defined between the second surface and the fourth surface B4. The fifth dimension C5 is also defined as the space of the receiving groove 64 below the second engaging surface B2. Figure 1 The opening size in the numerical direction.

[0078] Optionally, in this embodiment, the fourth dimension C4 is less than or equal to the fifth dimension C5, so that the engaging section 614 of the buckle can be inserted into the partial space of the corresponding receiving groove 64 below the second engaging surface B2.

[0079] Optionally, in this embodiment, the engaging section 614 of the buckle is provided with a first chamfer (not shown in the figure) at least on the edge of the first engaging surface B1 (including two short sides extending along the first direction X and one long side extending along the second direction Y), and / or the clamping edge is provided with a second chamfer (not shown in the figure) at least on the edge of the second engaging surface B2 (including two short sides extending along the first direction X and one long side extending along the second direction Y). The first chamfer and the second chamfer can be chamfered or rounded. By providing chamfers on the edges of the engaging surfaces of the engaging section 614 and / or the clamping edge, when the buckle is pushed along its length direction to be clamped into the receiving groove 64 corresponding to the clamping edge, the engaging section 614 can be prevented from colliding with the edge of the clamping edge, which is conducive to the smooth clamping of the engaging section 614 into the corresponding receiving groove 64, and can also play a role in pushing and guiding.

[0080] See also Figure 6 , the functional module 1 provided in another embodiment of the present invention has a structure substantially the same as that of the functional module 1 in the above embodiment, except that: in another embodiment of the present invention, the heat sink 20 is provided with at least one buckle (i.e., the first buckle 61) in the region between the two opposite ends in the first direction X, and the buckle is convexly provided on the first heat conduction surface A1. Correspondingly, the functional device 40 is provided with a receiving groove 64 at a position corresponding to each buckle on the second heat conduction surface A2 to form the buckle edge (i.e., the second buckle 62) matched with the buckle, and the buckle edge is provided in the region between the two opposite ends of the second buckle surface A2 in the first direction X.

[0081] Among them, optionally, in one embodiment, one end of the snap-fit ​​section 614 of the snap-fit ​​is connected to one end of the extension section 612 of the snap-fit ​​away from the first heat conduction surface A1, and the other end extends toward one end of the heat sink 20 in the first direction X, and each of the snap-fits is an L-shaped structure or a mirrored L-shaped structure. In another embodiment, the portion between the opposite ends of the snap-fit ​​section 614 of the snap-fit ​​is connected to one end of the extension section 612 of the snap-fit ​​away from the first heat conduction surface A1, and the opposite ends of the snap-fit ​​section 614 of the snap-fit ​​respectively extend toward the opposite ends of the heat sink 20 in the first direction X, and each of the snap-fits is an inverted T-shaped structure.

[0082] Specifically, Figure 6 As shown, in another embodiment of the present invention, the heat sink 20 is provided with a buckle in an inverted T-shaped structure in the area between the two opposite ends in the first direction X, and the functional device 40 is provided with an inverted T-shaped receiving groove 64 at a position corresponding to the buckle on the second heat conduction surface A2, thereby forming a clamping edge that cooperates with the buckle.

[0083] It can be understood that, compared with respectively providing one buckle at the two opposite ends of the heat sink 20 in the first direction X, in this embodiment, the heat sink 20 can only provide one buckle in the area between the two opposite ends in the first direction X, and the structure is simpler.

[0084] See also Figure 7, the functional module 1 provided in another embodiment of the present invention has a structure that is basically the same as the functional module 1 in any of the above embodiments, except that: in another embodiment of the present invention, the heat sink 20 is provided with a buckle (i.e., the first clamping portion 61) at the two opposite ends in the first direction X, and at least one buckle is provided in the area between the two opposite ends in the first direction X. Correspondingly, the functional device 40 is provided with a receiving groove 64 at the position corresponding to each buckle on the second heat conduction surface A2 to form the clamping edge (i.e., the second clamping portion 62) that cooperates with the buckle. In this embodiment, the heat sink 20 is provided with the buckles at the two opposite ends in the first direction X and in the area between the two ends, and the functional device 40 is provided with a plurality of receiving grooves 64 to form a plurality of clamping edges, so that the heat sink 20 and the functional device 40 are clamped and fixed by the cooperation of a plurality of pairs of buckles and clamping edges, and the connection reliability is higher.

[0085] It can be understood that in other embodiments, the heat sink 20 can also be provided with a buckle (i.e., the first locking portion 61) at one end in the first direction X and at least one buckle is provided in the area between the two opposite ends in the first direction X. Correspondingly, the functional device 40 is provided with a receiving groove 64 at a position corresponding to each buckle on the second heat conduction surface A2 to form the locking edge (i.e., the second locking portion 62) that cooperates with the buckle. Similarly, the heat sink 20 and the functional device 40 can be fixed by the cooperation of multiple pairs of buckles and locking edges, and the connection reliability is also high, which will not be elaborated herein.

[0086] It should be noted that the connection structure 60 of the functional module 1 provided in any of the above embodiments is described by taking the first clamping portion 61 as a buckle provided on the heat sink 20 and the second clamping portion 62 as a clamping edge provided on the functional device 40 as an example. Obviously, in other embodiments, the first clamping portion 61 may be a clamping edge provided on the heat sink 20, and correspondingly, the second clamping portion 62 may be a buckle provided on the functional device 40. It is not difficult to understand that the clamping edge and the buckle may respectively have the same structure and function as the clamping edge and the buckle in the above embodiments, and no further description is given for this.

[0087] For further information, see Figure 8 The present invention also provides an electronic device 2, including a functional module 1 that generates heat when powered on. The functional module 1 can be the functional module 1 in any of the above embodiments, which has all the functions and features of the aforementioned functional module 1. For a more specific description, please refer to the relevant content of the aforementioned functional module 1, which will not be repeated here.

[0088] It is understandable that the electronic device 2 may also include other electronic components such as a controller and a display device. The electronic device 2 may be, but is not limited to, a notebook computer, a server, and the like.

[0089] For further information, see Fig. 9 The present invention also provides a method for assembling a functional module, which is applied to the functional module 1 in any of the above-mentioned embodiments. Specifically, Fig. 9 As shown, the assembly method of the functional module includes the following steps:

[0090] Step S1, heating the first engaging portion 61 or the second engaging portion 62 of the buckle to enlarge the engaging space of the buckle, wherein the engaging space is a space of the buckle for accommodating the second engaging portion 62 or the first engaging portion 61 of the buckle as a clamping edge.

[0091] Step S2, placing the heat sink 20 on one side of the functional device 40 in the pushing direction, and aligning the clamping edge with the clamping space of the buckle, the pushing direction being the length direction of the clamping edge.

[0092] Step S3 , pushing the heat sink 20 along the pushing direction until the locking edge is received in the locking space, so that the heat sink 20 is fixed to the functional device 40 .

[0093] Alternatively, if Figures 1 to 3 As shown, in one embodiment, the engaging section 614 of the buckle is provided with a first chamfer (not shown) at least on the edge of the first engaging surface B1 (including two short sides extending along the first direction X and one long side extending along the second direction Y), and / or the clamping edge is provided with a second chamfer (not shown) at least on the edge of the second engaging surface B2 (including two short sides extending along the first direction X and one long side extending along the second direction Y). The first chamfer and the second chamfer can be chamfered or rounded. By providing chamfers on the edges of the engaging surfaces of the engaging section 614 and / or the clamping edge, when the buckle is pushed along its length direction to be clamped into the receiving groove 64 corresponding to the clamping edge, the engaging section 614 can be prevented from colliding with the edge of the clamping edge, which is conducive to the smooth clamping of the engaging section 614 into the corresponding receiving groove 64, and can also play a role in pushing and guiding.

[0094] In summary, in the functional module 1 provided by the present invention, the first clamping portion 61 and the second clamping portion 62 are respectively provided through the heat sink 20 and the functional device 40, and the first clamping portion 61 and the second clamping portion 62 are correspondingly clamped to form a connection structure 60, so that the heat sink 20 and the functional device 40 are contact-connected through the clamping connection structure 60, and there is no heat-conducting medium such as heat-conducting silica gel between the two, and the thermal conductivity is high, which enhances the heat dissipation effect of the functional device 40. Furthermore, the heat sink 20 is fixed to the functional device 40 by clamping, which is simple to install, and the heat sink 20 can be disassembled as needed, which improves the assembly convenience of the functional module 1.

[0095] In the description of this specification, the reference terms "first" and "second" are only used for name distinction and do not have special designated meanings; in addition, it should be noted that in the description of this specification, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internally connected between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0096] In the description of this specification, the description with reference to the terms "embodiment", "specific embodiment", "example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0097] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A functional module, comprising a heat sink and a functional device, characterized in that: The functional module also includes a connection structure, and the connection structure includes: A first clamping portion, provided on the heat sink, wherein the first clamping portion is a buckle; and A second engaging portion, provided on the functional device, the second engaging portion being a locking edge that cooperates with the buckle; The heat sink has a first heat conduction surface, the functional device has a second heat conduction surface, the first clamping portion has a first clamping surface parallel to the first heat conduction surface, and the second clamping portion has a second clamping surface parallel to the second heat conduction surface; When the heat sink is fixed to the functional device, the first heat conduction surface is correspondingly attached to the second heat conduction surface, and the first clamping surface is correspondingly attached to the second clamping surface; when the heat sink and the functional device are separated from each other, a first size is provided between the first clamping surface and the first heat conduction surface, and a second size is provided between the second clamping surface and the second heat conduction surface; when the heat sink is fixed to the functional device and used for heat dissipation, a third size is provided between the first clamping surface and the first heat conduction surface, and between the second clamping surface and the second heat conduction surface; the first size and the second size are both smaller than the third size, and the difference between the first size and the third size is greater than the difference between the second size and the third size; Among them, the first snap-fitting part of the buckle expands under heating conditions so as to be snapped into the second snap-fitting part of the card edge, and the buckle and the card edge are snapped into each other through interference fit after cooling, so that the heat sink is fixed to the functional device, and the heat generated by the functional device can be dissipated through the heat sink.

2. The functional module according to claim 1, characterized in that: The buckle includes an extension section and a clamping section connected to the extension section, the extension section extends in a direction perpendicular to the first heat conduction surface and away from the first heat conduction surface, the clamping section is connected to one end of the extension section away from the first heat conduction surface and extends away from the extension section in a direction parallel to the first heat conduction surface, the clamping section has a first surface facing the first heat conduction surface, and the first surface is the first clamping surface; The clamping edge extends in a direction parallel to the second heat conducting surface. The clamping edge has a second surface away from the second heat conducting surface. The second surface is the second clamping surface.

3. The functional module according to claim 1, characterized in that: The difference between the first size and the third size is 0.04 mm-0.05 mm, and / or the difference between the second size and the third size is 0.03 mm-0.05 mm.

4. The functional module according to claim 2, characterized in that: The engaging section further comprises a third surface which is parallel to the first surface and away from the first heat conducting surface, and a fourth dimension is defined between the first surface and the third surface; The card edge is made by removing part of the material of the functional device, the functional device is formed with a receiving groove corresponding to and adjacent to the card edge, the receiving groove has a fourth surface parallel to the second surface and opposite to the second surface, and a fifth dimension is defined between the second surface and the fourth surface; Among them, the fourth size is smaller than or equal to the fifth size; when the buckle is correspondingly engaged with the card edge, the buckle is received in the receiving groove corresponding to the card edge.

5. The functional module according to claim 4, characterized in that: The heat sink is provided with a buckle at two opposite ends in the first direction, the first heat conduction surface is located between the extension sections of the two buckles, and the respective engagement sections of the two buckles extend toward each other; and / or, At least one buckle is provided in the region between the two opposite ends of the heat sink in the first direction, the buckle is convexly provided on the first heat conduction surface, one end of the buckle segment is connected to the end of the extension section of the buckle away from the first heat conduction surface, and the other end extends toward one end of the heat sink in the first direction, or the portion between the two opposite ends of the buckle segment is connected to the end of the extension section of the buckle away from the first heat conduction surface, and the two opposite ends of the buckle segment extend toward the two opposite ends of the heat sink in the first direction respectively; The functional device has a receiving groove at a position of the second heat conducting surface corresponding to each buckle to form a buckle edge matched with the buckle; Wherein, the length directions of the buckle, the clamping edge and the receiving groove are all the second direction, and the second direction is not parallel to the first direction.

6. The functional module according to claim 5, characterized in that: The engaging section of the buckle is provided with a first chamfer at least on an edge of the first engaging surface, and / or the engaging edge is provided with a second chamfer at least on an edge of the second engaging surface.

7. An electronic device, characterized in that: A functional module comprising a housing as described in any one of claims 1 to 6.

8. A method for assembling a functional module, applied to the functional module according to any one of claims 1 to 6, characterized in that: The assembly method of the functional module comprises: The first engaging portion of the buckle is heated to enlarge the engaging space of the buckle, wherein the engaging space is a space of the buckle for accommodating the second engaging portion of the buckle as a clamping edge; Placing the heat sink on one side of the functional device in the pushing direction, and aligning the clamping edge with the clamping space of the buckle, the pushing direction being the length direction of the clamping edge; and The heat sink is pushed along the pushing direction until the clamping edge is received in the clamping space, so that the heat sink is fixed to the functional device.

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