Glass pane module

Abstract

A glass plate module according to the present invention is capable of joining a wiring that supplies electric power, and has a glass plate, a heating wire arranged on the glass plate, and a power supply portion arranged on the glass plate and supplying electric power to the heating wire, the power supply portion being formed of a conductive printed circuit having metal fine particles with a higher thermal expansion rate than the glass plate as a main component, and the power supply portion having a thickness that is thinner than a thickness of the heating wire.

Description

Technical Field

[0001] This invention relates to a glass plate module. Background Technology

[0002] Patent Document 1 discloses a connection terminal that connects to a conductive power supply section formed on a glass panel of an automobile. Heating wires for devices such as demisters and antenna conductors are connected to this power supply section. Furthermore, wiring such as cables is connected to the connection terminal, and power is supplied to the power supply section via the connection terminal, thereby heating the glass panel using the heating wires or receiving power from the antenna conductor via the power supply section to receive radio waves.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Publication No. 2014-519149 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] However, the aforementioned connection terminals are fixed to the power supply section using solder. But there is a concern that the power supply section or the glass plate may crack when external force is applied to the connection terminals.

[0008] The present invention was made to solve the above-mentioned problems. Its purpose is to provide a glass plate module with a connection terminal or wiring fixed on the power supply section. In this glass plate module, even if an external force is applied to the connection terminal or wiring, cracks can be suppressed in the glass plate or power supply section.

[0009] Technical solutions for solving technical problems

[0010] Item 1. A glass panel module capable of connecting to power supply wiring, the glass panel module having:

[0011] glass plate;

[0012] Heating wires disposed on the aforementioned glass plate; and

[0013] A power supply unit disposed on the glass plate, connected to the wiring, and supplying power to the heating wire.

[0014] The aforementioned power supply section is formed from conductive printed circuits whose main components are metal particles with a thermal expansion coefficient greater than that of the aforementioned glass plate.

[0015] The thickness of the aforementioned power supply section is thinner than the thickness of the aforementioned heating wire.

[0016] Item 2. The glass plate module as described in Item 1, wherein the width of the power supply section is 5 mm or more.

[0017] Item 3. The glass plate module as described in Item 1 or 2, wherein the heating wire is formed of a conductive printed circuit with the same metal particles as the power supply unit as the main component.

[0018] Item 4. The glass plate module as described in Item 3, wherein the thickness of the conductive printed circuit forming the heating wire is 3 μm or more.

[0019] Item 5. The glass plate module as described in any one of items 1 to 4, wherein the width of the heating wire is 0.2 mm or more and 3.0 mm or less.

[0020] Item 6. The glass plate module as described in Item 5, wherein the width of the power supply section is wider than the width of the heating wire, and when the thickness of the power supply section is set to D1 and the thickness of the heating wire is set to D2, 0.4≤D1 / D2≤0.9 is satisfied.

[0021] Item 7. The glass plate module as described in any one of items 1 to 6, wherein the heating wire is a camera window heating wire disposed in the glass plate in the area where the camera is used for shooting, or a de-icing device heating wire.

[0022] Item 8. A glass panel module capable of connecting to a power supply wiring, the glass panel module having:

[0023] glass plate;

[0024] Conductive connecting parts disposed on the aforementioned glass plate and connected to electrical components; and

[0025] A power supply unit disposed on the glass plate, connected to the wiring, and supplying power to the electrical components via the connecting member.

[0026] The aforementioned power supply section is formed from conductive printed circuits whose main components are metal particles with a thermal expansion coefficient greater than that of the aforementioned glass plate.

[0027] The thickness of the power supply unit is thinner than the thickness of the connecting component.

[0028] Item 9. The glass plate module as described in Item 8, wherein the width of the power supply section is 5 mm or more.

[0029] Item 10. The glass plate module as described in Item 8 or 9, wherein the connecting component is formed of a conductive printed circuit with the same metal particles as the power supply unit as the main component.

[0030] Item 11. The glass plate module as described in Item 10, wherein the thickness of the conductive printed circuit forming the connecting component is 3 μm or more.

[0031] Item 12. The glass plate module as described in any one of items 8 to 11, wherein the width of the connecting member is 0.2 mm or more and 3.0 mm or less.

[0032] Item 13. The glass plate module as described in Item 12, wherein the width of the power supply unit is wider than the width of the connecting member, and when the thickness of the power supply unit is set to D1 and the thickness of the connecting member is set to D2, 0.4≤D1 / D2≤0.9 is satisfied.

[0033] Item 14. The glass plate module as described in any one of items 8 to 13, wherein the aforementioned electrical component is a dimming component or a breakage detection component.

[0034] Item 15. A glass panel module capable of engaging electrical wiring, the glass panel module having:

[0035] glass plate;

[0036] Antenna conductors disposed on the aforementioned glass plate; and

[0037] A power supply unit disposed on the aforementioned glass plate, connected to the aforementioned wiring, and receiving power from the aforementioned antenna conductor.

[0038] The aforementioned power supply section is formed from conductive printed circuits whose main components are metal particles with a thermal expansion coefficient greater than that of the aforementioned glass plate.

[0039] The thickness of the power supply section is thinner than the thickness of the antenna conductor.

[0040] Item 16. The glass plate module as described in Item 15, wherein the width of the power supply section is 5 mm or more.

[0041] Item 17. The glass plate module as described in Item 15 or 16, wherein the antenna conductor is formed of a conductive printed circuit with the same metal particles as the power supply unit as the main component.

[0042] Item 18. The glass plate module as described in Item 17, wherein the thickness of the conductive printed circuit forming the antenna conductor is 3 μm or more.

[0043] Item 19. The glass plate module as described in any one of items 15 to 18, wherein the width of the antenna conductor is 0.3 mm or more and 3.0 mm or less.

[0044] Item 20. The glass plate module as described in Item 19, wherein the width of the power supply section is wider than the width of the electrical component, and when the thickness of the power supply section is set to D1 and the thickness of the electrical component is set to D2, 0.4≤D1 / D2≤0.9 is satisfied.

[0045] Item 21. The glass plate module as described in any one of items 1 to 20, wherein the aforementioned metal particles are primarily composed of silver or copper particles.

[0046] Item 22. The glass plate module as described in Item 21, wherein the aforementioned metal particles are primarily composed of silver or copper particles.

[0047] Item 23. The glass plate module as described in any one of items 1 to 22, further comprising: solder disposed on the power supply section; and terminals fixed to the power supply section by means of the solder.

[0048] Item 24. The glass plate module as described in any one of items 1 to 22, further comprising: solder disposed on the power supply section; and wiring fixed to the power supply section by the solder.

[0049] Item 25. The glass module as described in Item 23 or 24, wherein the solder is a lead-free solder.

[0050] Item 26. The glass module as described in any one of items 1 to 25, wherein the glass plate is transparent glass, heat-absorbing glass, or soda-lime glass.

[0051] Item 27. The glass plate module as described in Item 26, characterized in that: when the thickness of the glass plate on which the power supply section is formed is set to Dx, the breaking strength H of the power supply section of the glass plate satisfies the following formula:

[0052] H≥76.8 / Dx 2 .

[0053] Item 28. The glass plate module as described in Item 27, wherein when the thickness of the power supply section is set to D1, the following formula is satisfied:

[0054] D1≤(81.4-(76.8÷Dx 2 )) / 3.0.

[0055] Item 29. The glass plate module as described in Item 28, wherein the power supply section is formed of a conductive printed circuit containing silver microparticles, the conductivity of which is 2 μΩ·cm or more and 10 Ω·cm or less.

[0056] Item 30. The glass plate module as described in any one of items 1 to 29, further comprising a mask layer stacked on the glass plate, wherein the power supply unit is disposed on the mask layer.

[0057] Item 31. The glass plate module as described in any one of items 1 to 30, wherein the glass plate is not tempered glass.

[0058] Item 32. The glass plate module as described in any one of items 1 to 31, wherein the glass plate is formed of laminated glass having an outer glass plate, an inner glass plate and an interlayer disposed between the outer glass plate and the inner glass plate.

[0059] Item 33. The glass plate module as described in Item 32, wherein the inner glass plate has a cutout, and the power supply unit is disposed on the exposed surface of the outer glass plate that is exposed to the outside through the cutout.

[0060] Item 34. The glass plate module as described in Item 32, wherein the power supply unit is disposed on the inner glass plate.

[0061] Invention Effects

[0062] Using this invention, it is possible to suppress cracks in the power supply section or glass plate. Attached Figure Description

[0063] Figure 1 This is a top view showing one embodiment of the windshield according to the present invention.

[0064] Figure 2 yes Figure 1 Cross-sectional view.

[0065] Figure 3 This is a cross-sectional view of laminated glass.

[0066] Figure 4 It is a block diagram showing the general structure of an in-vehicle system.

[0067] Figure 5 This is a top view showing the heating element.

[0068] Figure 6 This is a cross-sectional view of the area near the power supply section of the heating element.

[0069] Figure 7 This is a cross-sectional view showing the screen printing of the heating element.

[0070] Figure 8 This is a diagram showing the outline of the ring bending test.

[0071] Figure 9 It is a graph showing the relationship between the film thickness of the power supply section and the destructive stress of each type of glass plate.

[0072] Figure 10 It is a graph showing the relationship between the reciprocal of the square of the thickness of the glass plate and the breaking stress.

[0073] Figure 11 It is a graph showing the relationship between the thickness of the glass plate and the thickness of the power supply section.

[0074] Figure 12These are cross-sectional views showing other examples of heating element configurations.

[0075] Figure 13 This is a top view of the windshield with the antenna installed. Detailed Implementation

[0076] First, using Figure 1 and Figure 2 The structure of the windshield according to this embodiment will be described. Figure 1 This is a top view of the windshield. Figure 2 yes Figure 1 The cross-sectional view. For ease of explanation, [the following will be shown]. Figure 1 The vertical direction is called "up and down", "vertical", or "longitudinal". Figure 1 The left and right directions are called "left and right". Figure 1 This example illustrates the windshield as seen from inside the vehicle. That is, Figure 1 The inside of the paper is the outside of the car. Figure 1 The side of the paper facing the observer is the inside of the car.

[0077] The windshield has a generally rectangular laminated glass 10, which is installed at an angle on the vehicle body. Furthermore, a mask layer 110 is provided on the inner surface 130 of the laminated glass 10 facing inwards to block the view from outside the vehicle, allowing the camera device 2 to be positioned so that it is not visible from outside the vehicle. However, the camera device 2 is a camera used to capture the situation outside the vehicle. Therefore, a camera window (opening) 113 is provided in the mask layer 110 at a position corresponding to the camera device 2, through which the camera device 2, installed inside the vehicle, can capture the situation outside the vehicle.

[0078] Image processing device 3 is connected to imaging device 2, and processes the images captured by imaging device 2 using image processing device 3. Imaging device 2 and image processing device 3 constitute vehicle system 5, which can provide various information to passengers based on the processing of image processing device 3.

[0079] Additionally, as described later, a heating element 6 is provided on the inner surface of the windshield in the area corresponding to the camera window 113 to defog and de-ice the area of ​​the windshield corresponding to the camera window 113. The components will be explained below.

[0080] <1. Laminated Glass>

[0081] Figure 3 This is a cross-sectional view of the laminated glass. As shown in the figure, the laminated glass 10 has an outer glass plate 11 and an inner glass plate 12, with a resin interlayer 3 disposed between these glass plates 11 and 12. Their structure will be described below.

[0082] <1-1. Glass Plate>

[0083] First, the description will begin with the outer glass panel 11 and the inner glass panel 12. The outer glass panel 11 and the inner glass panel 12 can be made of known glass panels, or they can be formed from heat-absorbing glass, general transparent glass, green glass, or UV green glass. However, these glass panels 11 and 12 need to achieve visible light transmittance according to the safety standards of the countries where automobiles are used. For example, the outer glass panel 11 ensures the necessary solar radiation absorption rate, while the inner glass panel 12 adjusts the visible light transmittance to meet safety standards. Hereinafter, examples of transparent glass, heat-absorbing glass, and soda-lime glass are given.

[0084] (Transparent glass)

[0085] SiO2: 70-73% by mass;

[0086] Al2O3: 0.6–2.4% by mass;

[0087] CaO: 7-12% by mass;

[0088] MgO: 1.0–4.5% by mass;

[0089] R2O: 13-15% by mass (R is an alkali metal);

[0090] Total iron oxide (T-Fe2O3) converted to Fe2O3: 0.08–0.14% by mass.

[0091] (Heat-absorbing glass)

[0092] The composition of heat-absorbing glass can be, for example, as follows: based on the composition of transparent glass, the ratio of all iron oxide (T-Fe2O3) converted to Fe2O3 is 0.4 to 1.3% by mass, the ratio of CeO2 is 0 to 2% by mass, the ratio of TiO2 is 0 to 0.5% by mass, and the skeletal components of the glass (mainly SiO2 and Al2O3) are reduced only by the increase in T-Fe2O3, CeO2 and TiO2.

[0093] (Sodium-calcium glass)

[0094] SiO2: 65-80% by mass;

[0095] Al2O3: 0–5% by mass;

[0096] CaO: 5-15% by mass;

[0097] MgO: 2% by mass or more;

[0098] NaO: 10-18% by mass;

[0099] K2O: 0-5% by mass;

[0100] MgO + CaO: 5–15% by mass;

[0101] Na₂O + K₂O: 10–20% by mass;

[0102] SO3: 0.05–0.3% by mass;

[0103] B2O3: 0-5% by mass;

[0104] Total iron oxide (T-Fe2O3) converted to Fe2O3: 0.02-0.03% by mass.

[0105] The thickness of the laminated glass involved in this embodiment is not particularly limited. As an example, the total thickness of the outer glass plate 11 and the inner glass plate 12 can be 2.1 to 6 mm. From the viewpoint of lightweighting, it is preferable that the total thickness of the outer glass plate 11 and the inner glass plate 12 is 2.4 to 3.8 mm, more preferably 2.6 to 3.4 mm, and particularly preferably 2.7 to 3.2 mm. Thus, in order to achieve lightweighting, it is necessary to reduce the total thickness of the outer glass plate 11 and the inner glass plate 12. Therefore, the thickness of each glass plate is not particularly limited, and the thickness of the outer glass plate 11 and the inner glass plate 12 can be determined, for example, as described below.

[0106] The outer glass panel 11 primarily needs to be durable and impact-resistant against external obstacles. For example, if this laminated glass is used as a windshield in a car, it needs to be resistant to impacts from flying objects such as small stones. On the other hand, a larger thickness increases the weight, which is not preferable. From this perspective, the thickness of the outer glass panel 11 is preferably 1.8 to 2.3 mm, and more preferably 1.9 to 2.1 mm. The thickness can be determined based on the intended use of the glass.

[0107] The thickness of the inner glass plate 12 can be equal to that of the outer glass plate 11. For example, to achieve a lighter laminated glass, the thickness of the inner glass plate 12 can be smaller than that of the outer glass plate 11. Specifically, considering the strength of the glass, a thickness of 0.6 to 2.0 mm is preferred, 0.8 to 1.6 mm is more preferred, and 1.0 to 1.4 mm is particularly preferred. A thickness of 0.8 to 1.3 mm is even more preferred. The thickness of the inner glass plate 12 can also be determined according to the intended use of the glass.

[0108] Here, an example of a method for measuring the thickness of a bent glass plate (laminated glass) 1 will be described. First, the measurement positions are two points, one above the other, on the center line S extending vertically from the center of the glass plate in the left-right direction. The measuring equipment is not particularly limited; for example, a thickness gauge such as the SM-112 manufactured by Teclock Corporation can be used. During measurement, the bent surface of the glass plate is placed on a flat surface, and the thickness gauge is used to clamp the end of the glass plate for measurement. This method can be performed even when the glass plate is flat, just as it would be in a bent case.

[0109] As will be described later, power supply units 64 and 65 for supplying power to the heating element 6 are provided in the laminated glass 1. At least 9mm thick wire is required to install connection terminals or wiring to these power supply units 64 and 65. 2 The area is specified. Furthermore, since force is applied to the wiring, it is preferable that the glass panel has a breaking strength sufficient to prevent glass breakage when a force of 50N is applied to this area. This is based on the German automotive standard test specification (AK2.1 of German Car Manufacturer).

[0110] Specifically, when the thickness of the outer glass plate 11 or the inner glass plate 12, which is provided with the power supply section 64, 65, is set to Dx (mm) in the laminated glass, the breaking strength H (MPa) of these glass plates preferably satisfies the following formula.

[0111] H≥76.8 / Dx 2 (1)

[0112] <1-2. Intermediate Membrane>

[0113] The intermediate membrane 3 is formed of at least one layer, as an example, such as Figure 3 As shown, the structure can be composed of three layers, in which a soft core layer 131 is sandwiched between an outer layer 132 that is harder than the core layer 131. However, it is not limited to this structure, and can be formed by multiple layers having a core layer 131 and at least one outer layer 132 disposed on the side of the outer glass plate 11. For example, it is also possible to form: an intermediate film 3 consisting of two layers including a core layer 131 and one outer layer 132 disposed on the side of the outer glass plate 11; or an intermediate film 3 having an even number of outer layers 132 disposed on both sides of the core layer 131; or an intermediate film 3 sandwiching the core layer 131 and having an odd number of outer layers 132 disposed on one side and an even number of outer layers 132 disposed on the other side. In the case of only one outer layer 132, it is disposed on the side of the outer glass plate 11 as described above, in order to improve the resistance to breakage from external forces from outside the vehicle or the outside. In addition, the sound insulation performance is also higher when there are more outer layers 132.

[0114] The core layer 131 is softer than the outer layer 132, and its hardness is not particularly limited. The materials constituting each layer 131 and 132 are not particularly limited; for example, materials can be selected based on Young's modulus. Specifically, at a frequency of 100 Hz and a temperature of 20 degrees Celsius, a modulus of 1 to 20 MPa is preferred, more preferably 1 to 18 MPa, and particularly preferably 1 to 14 MPa. Within this range, STL descent can be prevented in the low-frequency range below approximately 3500 Hz. On the other hand, the Young's modulus of the outer layer 132, as described later, is preferably high to improve sound insulation performance in the high-frequency range; at a frequency of 100 Hz and a temperature of 20 degrees Celsius, it can be 560 MPa or more, 600 MPa or more, 650 MPa or more, 700 MPa or more, 750 MPa or more, 880 MPa or more, or 1300 MPa or more. Furthermore, the upper limit of the Young's modulus of the outer layer 132 is not particularly limited; for example, it can be set from a processability perspective. For example, experience shows that at pressures above 1750 MPa, machinability, especially cutting, becomes difficult.

[0115] Furthermore, as a specific material, the outer layer 132 can be made of, for example, polyvinyl butyral resin (PVB). Polyvinyl butyral resin is preferred due to its excellent adhesion to each glass plate and its excellent penetration resistance. On the other hand, the core layer 131 can be made of, for example, ethylene vinyl acetate resin (EVA), or a polyvinyl acetal resin that is softer than the polyvinyl butyral resin constituting the outer layer. By sandwiching a soft core layer therebetween, the same adhesion and penetration resistance as a single-layer resin interlayer can be maintained, and the sound insulation performance can be significantly improved.

[0116] Typically, the hardness of polyvinyl acetal resin can be controlled by (a) the degree of polymerization of the polyvinyl alcohol used as the starting material, (b) the degree of acetalization, (c) the type of plasticizer, and (d) the proportion of plasticizer added. Therefore, by appropriately adjusting at least one of these conditions, even with the same polyvinyl butyral resin, it is possible to produce a rigid polyvinyl butyral resin for the outer layer 132 and a soft polyvinyl butyral resin for the core layer 131. Furthermore, the hardness of the polyvinyl acetal resin can also be controlled by the type of aldehyde used in the acetalization, the co-acetalization of multiple aldehydes, or the pure acetalization of a single aldehyde. While not always the case, there is a tendency for polyvinyl acetal resins obtained using aldehydes with more carbon atoms to be softer. Therefore, for example, if the outer layer 132 is made of polyvinyl butyral resin, the core layer 131 can be made of polyvinyl acetal resin obtained by acetalizing aldehydes (e.g., n-hexanal, 2-ethylbutanal, n-heptanal, n-octanal) with 5 or more carbon atoms using polyvinyl alcohol. It should be noted that the resin is not limited to the above-mentioned resins as long as the specified Young's modulus can be obtained.

[0117] Furthermore, the total thickness of the intermediate film 3 is not particularly specified, but is preferably 0.3 to 6.0 mm, more preferably 0.5 to 4.0 mm, and particularly preferably 0.6 to 2.0 mm. The thickness of the core layer 131 is preferably 0.1 to 2.0 mm, more preferably 0.1 to 0.6 mm. On the other hand, the thickness of each outer layer 132 is preferably 0.1 to 2.0 mm, more preferably 0.1 to 1.0 mm. Alternatively, the total thickness of the intermediate film 3 can be kept constant, while the thickness of the core layer 131 can be adjusted.

[0118] The thicknesses of the core layer 131 and the outer layer 132 can be measured, for example, as described below. First, the cross-section of the laminated glass is magnified to 175x using a microscope (e.g., a Keyence VH-5500). Then, the thicknesses of the core layer 131 and the outer layer 132 are determined visually and measured. To eliminate errors caused by visual inspection, the number of measurements is set to 5, and the average value is taken as the thickness of the core layer 131 and the outer layer 132. For example, a magnified photograph of the laminated glass can be taken, in which the core layer or the outer layer 132 can be identified, and its thickness measured.

[0119] Furthermore, the thickness of the core layer 131 and outer layer 132 of the interlayer film 3 does not necessarily need to be the same across the entire surface; for example, it can be wedge-shaped when used in laminated glass for a rising display. In this case, the thickness of the core layer 131 or outer layer 132 of the interlayer film 3 is measured at the position with the smallest thickness, i.e., the lowest edge of the laminated glass. When the interlayer film 3 is wedge-shaped, the outer glass plate and the inner glass plate are not arranged in parallel, but such an arrangement is also included in the glass plate of the present invention. That is, in the present invention, for example, the arrangement of the outer glass plate and the inner glass plate is included when the interlayer film 3 uses a core layer 131 or outer layer 132 whose thickness varies at a rate of less than 3 mm per 1m.

[0120] The manufacturing method of the intermediate film 3 is not particularly limited. Examples include: uniformly mixing the aforementioned resin components such as polyvinyl acetal resin, plasticizer, and other additives as needed, and then extruding each layer together; or laminating two or more resin films produced using this method by pressing, lamination, or other methods. The resin films used in lamination methods such as pressing and lamination can be either single-layer or multi-layer structures. Furthermore, in addition to being formed from multiple layers as described above, the intermediate film 3 can also be formed from a single layer.

[0121] <2. Mask Layer>

[0122] Next, the mask layer 110 will be described. For example... Figure 1 and Figure 2 As illustrated, in this embodiment, the mask layer 110 is laminated on the inner surface (inner surface of the inner glass panel 12) 130 of the laminated glass 10 on the vehicle interior side, and is formed along the periphery of the laminated glass 10. Specifically, as Figure 1 As illustrated, the mask layer 110 in this embodiment can be divided into a peripheral region 111 along the periphery of the laminated glass 10 and a protruding region 112 that protrudes downward from the upper edge of the laminated glass 10 in a rectangular shape. The peripheral region 111 blocks light from entering from the periphery of the windshield. On the other hand, the protruding region 112 is configured to be invisible from outside the vehicle to the camera device 2 disposed inside the vehicle.

[0123] However, if the mask layer 110 obstructs the shooting range of the shooting device 2, it is impossible to use the shooting device 2 to capture the situation outside the vehicle. Therefore, in this embodiment, a trapezoidal shooting window 113 is provided at a position corresponding to the shooting device 2 in the protruding area 112 of the mask layer 110, so that the shooting device 2 can capture the situation outside the vehicle. That is, the shooting window 113 is provided independently of the unobstructed area 120 which is further inward in the surface direction than the mask layer 110. In addition, the shooting window 113 is the area where the material of the mask layer 110 is not laminated, and the laminated glass has the aforementioned visible light transmittance, thereby enabling the capture of the situation outside the vehicle. The size of the shooting window 113 is not particularly limited, for example, it can be 7000 mm. 2 above.

[0124] In addition to being stacked on the inner surface of the inner glass plate 12 as described above, the mask layer 110 can also be stacked on the inner surface of the outer glass plate 11 and the outer surface of the inner glass plate 12, for example. Alternatively, it can be stacked on both the inner surface of the outer glass plate 11 and the inner surface of the inner glass plate 12.

[0125] Next, the material of the mask layer 110 will be described. The material of the mask layer 110 can be appropriately selected according to the implementation method, as long as it can block the view from outside the vehicle. For example, dark ceramics such as black, brown, gray, and dark blue can be used.

[0126] When black ceramic is chosen as the material for the mask layer 110, for example, black ceramic is laminated onto the periphery of the inner surface 130 of the inner glass plate 12 by screen printing, and the ceramic laminated together with the inner glass plate 12 is heated. This allows the mask layer 110 to be formed at the periphery of the inner glass plate 12. Furthermore, when printing the black ceramic, areas where the black ceramic is not printed are provided. This allows the imaging window 113 to be formed. Various materials can be used for the ceramic used in the mask layer 110. For example, ceramics with the compositions shown in Table 1 below can be used for the mask layer 110.

[0127] [Table 1]

[0128] First and second colored ceramic paste Pigment *1 quality% 10 Resin (cellulose resin) quality% 10 Organic solvent (pine oil) quality% 10 Glass adhesive *2 quality% 70 Viscosity dPs 150

[0129] *1. Main components: copper oxide, chromium oxide, iron oxide, and manganese oxide;

[0130] *2. Main components: bismuth borosilicate, zinc borosilicate.

[0131] <3. In-vehicle system>

[0132] Next, using Figure 4 The vehicle-mounted system 5, which includes a shooting device (information acquisition device) 2 and an image processing device 3, will be described. Figure 4 Example of the configuration of vehicle system 5. For example... Figure 4 As illustrated, the vehicle system 5 according to this embodiment includes the above-described shooting device 2 and the image processing device 3 connected to the shooting device 2.

[0133] The image processing apparatus 3 is a device for processing the captured image obtained by the imaging device 2. For example, as a hardware configuration, the image processing apparatus 3 has general hardware such as a storage unit 31, a control unit 32, and an input / output unit 33 connected via a bus. However, the hardware configuration of the image processing apparatus 3 is not limited to such an example, and the specific hardware configuration of the image processing apparatus 3 can be appropriately added, omitted, or supplemented according to the implementation method.

[0134] Storage unit 31 stores various data and programs (not shown) used in the processing executed by control unit 32. Storage unit 31 can be implemented, for example, via a hard disk or via a recording medium such as a USB flash drive. Furthermore, the various data and programs stored in storage unit 31 can be obtained from recording media such as CDs (Compact Discs) or DVDs (Digital Versatile Discs). Storage unit 31 can also be referred to as an auxiliary storage device.

[0135] As described above, the laminated glass 10 is positioned at an angle and bent relative to the vertical direction. Furthermore, the imaging device 2 photographs the external environment of the vehicle through this laminated glass 10. Therefore, the image obtained by the imaging device 2 is distorted due to the orientation, shape, refractive index, optical defects, etc., of the laminated glass 10. Additionally, the camera lens of the imaging device 2 also experiences inherent aberrations. Therefore, the storage unit 31 can also store correction data for correcting the image distortion caused by the aberrations of the laminated glass 10 and the camera lens.

[0136] The control unit 32 has one or more processors, such as a microprocessor or CPU (Central Processing Unit), and peripheral circuitry (ROM (Read Only Memory), RAM (Random Access Memory), interface circuitry, etc.) used by the processor for processing. ROM, RAM, etc., can also be referred to as main storage devices in the sense of the address space processed by the processor located within the control unit 32. The control unit 32 functions as an image processing unit 321 by executing various data and programs stored in the storage unit 31.

[0137] The image processing unit 321 processes the captured image obtained by the imaging device 2. The processing of the captured image can be appropriately selected according to the implementation method. For example, the image processing unit 321 can analyze the captured image by pattern matching or the like to identify the subject captured in the captured image. In this embodiment, the imaging device 2 captures the situation in front of the vehicle, so based on the subject identification, the image processing unit 321 can further determine whether there are any living beings such as people in front of the vehicle. Moreover, if a person is captured in front of the vehicle, the image processing unit 321 can output a warning message according to a predetermined method. For example, the image processing unit 321 can also perform predetermined processing on the captured image. Furthermore, the image processing unit 321 can also output the processed captured image to a display device (not shown) connected to the image processing device 3.

[0138] The input / output unit 33 is one or more interfaces for transmitting and receiving data from external devices and sources located outside the image processing device 3. The input / output unit 33 may be, for example, an interface for connecting to a user interface, or an interface such as USB (Universal Serial Bus). In this embodiment, the image processing device 3 is connected to the imaging device 2 via the input / output unit 33 to obtain images captured by the imaging device 2.

[0139] In addition to the dedicated device designed for the services provided, such an image processing device 3 can also be used with general-purpose devices such as PCs (Personal Computers) and tablet computers.

[0140] Furthermore, the aforementioned imaging device 2 is mounted on a bracket (not shown), which is mounted on the mask layer 110. Therefore, in this state, by adjusting the mounting of the imaging device 2 to the bracket and the mounting of the bracket to the mask layer 110, the optical axis of the camera of the imaging device 2 passes through the imaging window 113. Additionally, a cover (not shown) is mounted on the bracket to cover the imaging device 2. Therefore, the imaging device 2 is positioned within the space enclosed by the laminated glass 10, the bracket, and the cover, and is not visible from inside the vehicle; even from outside the vehicle, only a portion of the imaging device 2 is visible through the imaging window 113. Moreover, the imaging device 2 and the aforementioned input / output unit 33 are connected via a cable (not shown), which extends from the cover and connects to the image processing device 3, which is positioned at a predetermined location inside the vehicle.

[0141] <4. Overview of the heating element>

[0142] Next, refer to Figure 5 The heating element 6 will be described below. Figure 5As shown, the heating element 6 consists of a first heating wire 61, a second heating wire 62, a connecting wire 63, and two power supply units 64 and 65. The first heating wire 61 and the second heating wire 62 are arranged on the inner surface of the inner glass panel 12 through the camera lens 113. More specifically, the first heating wire 61 and the second heating wire 62 are connected in parallel and pass through the camera lens 113. The first heating wire 61 is positioned to pass through the upper part of the camera lens 113, and the second heating wire 62 is positioned to pass through the lower part of the camera lens 113.

[0143] The first heating wire 61 passes through the imaging window 113 and is constructed by combining a plurality of parallel main portions 611 and a plurality of connecting portions 612 disposed on the outside of the imaging window 113 and connecting the ends of adjacent main portions 611 to each other. That is, because the plurality of main portions 611 and connecting portions 612 are combined, the first heating wire 61 is arranged to reciprocate multiple times in the imaging window 113. The spacing between adjacent main portions 611 is not particularly limited, but is preferably 1 mm or more, and more preferably 5 mm or more. In particular, the spacing between the main portions 611 of the first heating wire 61 is preferably 20 times or more the line width. This is to balance the line width and spacing of the first heating wire 61. For example, if the line width is reduced, the resistance value increases, and sufficient heat cannot be obtained under a certain voltage. If the spacing between the first heating wires 61 is reduced, it may obstruct the field of view from the imaging device 2 and affect the field of view.

[0144] The connecting portion 612 is U-shaped, but it can also be curved as a whole. This is because abnormal heat may occur if sharp corners (bends) are provided in the connecting portion 612.

[0145] Furthermore, the first power supply section 64 and the second power supply section 65 are connected to both ends of the first heating wire 61 via the aforementioned connecting line 63. Each power supply section 64 and 65 is rectangular in shape, and as described later, terminals are fixed to each power supply section 64 and 65 using solder. Moreover, a power supply voltage of, for example, 10 to 50V is applied to each terminal.

[0146] The first power supply unit 64 and the second power supply unit 65 are located away from the shooting window 113, but both are located on the mask layer 110. In addition, the connecting line 63 is also located on the mask layer 110.

[0147] The second heating wire 62 is constructed in the same manner as the first heating wire 61. Specifically, it is constructed by combining multiple parallel main sections 621 and multiple curved sections 622 arranged on the outside of the shooting window 113, connecting the ends of adjacent main sections 621 to each other. Because multiple main sections 621 and curved sections 622 are combined, the second heating wire 62 is also configured to reciprocate multiple times within the shooting window 113. The main sections 621 of the second heating wire 62 are arranged parallel to the main sections 611 of the first heating wire 61. Furthermore, both ends of the second heating wire 62 are connected to the first power supply section 64 and the second power supply section 65 via the aforementioned connecting line 63. Therefore, the first heating wire 61 and the second heating wire 62 are connected in parallel with respect to the two power supply sections 64 and 65, each forming a parallel circuit. For example, if the area of ​​the shooting window 113 is large, the heat generated by the main sections 611 and 612 may decrease due to their increased length. Therefore, when the heating element 6 is composed of multiple parallel circuits, sufficient heat generation can be obtained because the lengths of the first heating wire 61 and the second heating wire 62 are shortened. Furthermore, with a constant applied voltage, sufficient current can flow by reducing the resistance value. As a result, sufficient heat generation can be obtained.

[0148] Furthermore, by increasing the length of the connecting wire 63, the resistance of that part increases, thus allowing for adjustment of the heat generation. That is, the heat generation of the first and second heating wires 61 and 62 can be reduced.

[0149] The linewidth of each heating wire 61, 62 is preferably 1 to 500 μm, more preferably 1 to 400 μm, and even more preferably 1 to 300 μm. This is because a smaller linewidth makes it more difficult to identify, thus making it suitable for the imaging window 113. It is particularly preferable that the linewidth of the main portions 611, 621 of each heating wire 61, 62 is within the above-mentioned range. On the other hand, if the linewidth is too small, it may be impossible to manufacture. In addition, when the applied voltage of the parallel circuit is constant, if the linewidth is too small, the resistance increases, and as a result, the current flowing in the circuit decreases, making it impossible to heat sufficiently. Here, the linewidth refers to the linewidth of the largest portion of the cross-sectional shape of each heating wire 61, 62. For example, when the cross-sectional shape of the heating wire 61, 62 is trapezoidal, the width of the lower part is the linewidth; when the cross-sectional shape of the heating wire 61, 62 is circular, the diameter is the linewidth. Regarding the width of heating wires 61 and 62, for example, a microscope such as the VHX-200 (manufactured by Keyence) can be adjusted to 1000x for measurement.

[0150] Furthermore, the thickness of the heating lines 61, 62, and connecting lines 63 is preferably 4 to 20 μm, and more preferably 5 to 15 μm. This is because when the thickness is less than 4 μm, for example, when printing the heating lines 61, 62, and connecting lines 63 on the mask layer 110, as will be described later, the metal particles contained in the heating lines 61 to 63 may be absorbed by the mask layer 110, thereby potentially causing variations in the thickness of the heating lines 61 to 63 and making it impossible to obtain a uniform resistance value. On the other hand, when the thickness exceeds 20 μm, the resistance value becomes too low, thus increasing the possibility of localized breakage of the glass plate.

[0151] The heating wires 61 and 62, connecting wires 63, and power supply parts 64 and 65 constituting the heating element 6 are made of silver. Furthermore, the heating wires 61 and 62, connecting wires 63, and power supply parts 64 and 65 are formed, for example, by screen printing. That is, a silver paste containing silver particles is applied by printing, followed by drying, thereby forming the heating wires 61 and 62, connecting wires 63, and power supply parts 64 and 65. The heating element 6 can be integrally formed by printing, but it can also be formed from different materials. For example, the power supply parts 64 and 65 can be formed only of silver, while the heating wires 61, 62, and connecting wires 63 can be formed from a material different from silver. For example, the heating wires 61, 62, and connecting wires 63 can be formed from materials containing various metal particles such as copper (or tin-plated copper), gold, aluminum, magnesium, cobalt, and tungsten. A material with a resistivity of 3.0 × 10⁻⁶ is particularly preferred. -8 Copper, gold, and aluminum with a Ωm or less.

[0152] Furthermore, when the power supply sections 64 and 65 are formed as silver metal particles, the conductivity of the power supply sections 64 and 65 formed from silver paste is preferably 2 μΩ·cm or more and 10 Ω·cm or less, and more preferably 2 μΩ·cm or more and 4 Ω·cm or less. The thermal shrinkage rate difference of the silver printed circuit largely depends on the silver content. In addition, the resistivity depends on the silver content. Therefore, the conductivity as described above is preferred.

[0153] <5. Terminal configuration in the power supply section>

[0154] Next, the configuration of the terminals in power supply sections 64 and 65 will be explained. For example... Figure 6As shown, the terminal 8 is fixed to the power supply units 64 and 65 using solder 7. The terminal 8 has a plate-shaped mounting portion 81, an upright portion 82 extending from the end of the mounting portion 81, and an extension portion 83 extending substantially parallel to the mounting portion 81 from the upper end of the upright portion 82. These are integrally formed from a plate-shaped conductive material. Plate-shaped fixing portions 831 are provided on both sides of the extension portion 83 to secure the conductive cable 9. Therefore, the power supplied by the conductive cable is supplied to the power supply units 64 and 65 via the terminal 8 and solder 7, thereby heating the wires 61 and 62.

[0155] The solder 7 can be any type of lead-free solder or leaded solder, preferably lead-free solder. When using lead-free solder, for example, lead-free solder with a Sn content of 90% or more is relatively hard and may cause cracking when bonded to the laminated glass sheet. In this case, a softer lead-free solder based on indium or bismuth can be used for bonding. Furthermore, compared to leaded solder, lead-free solder has lower ductility, resulting in a greater force applied to the glass sheet. Therefore, when using lead-free solder, the glass sheet is more prone to cracking compared to leaded solder. Thus, in this embodiment, as described later, the crack prevention effect is particularly significant when using lead-free solder.

[0156] In this embodiment, the power supply sections 64 and 65 are rectangular, but their shape is not particularly limited as long as they are larger than the mounting portion 81 of the terminal 8. Furthermore, the thickness of the power supply sections 64 and 65 is thinner than that of the heating wires 61 and 62 and the connecting wire 63. More specifically, the thickness of the power supply sections 64 and 65 is preferably 3 to 15 μm, and more preferably 3 to 10 μm. On the other hand, the thickness of the heating wires 61, 62 and the connecting wire 63 is thicker than that of the power supply sections 64 and 65, preferably 4 to 20 μm, and more preferably 5 to 15 μm. The relationship between the power supply sections 64 and 65 and the heating wires 61 and 62 described below can also be applied to the relationship between the power supply sections 64 and 65 and the connecting wire 63.

[0157] When the thickness of the power supply sections 64 and 65 is less than 3 μm, the silver particles are absorbed by the solder 7, which may prevent them from bonding with the connector or electrical wiring. On the other hand, when the thickness of the power supply sections 64 and 65 is 15 μm or more, the breaking strength of the glass decreases due to the tensile stress generated by the heating wires 61 and 62 or the connecting wires 63, and the necessary breaking strength of the glass may not be obtained.

[0158] In addition, when the thickness of the power supply section 64 and 65 is set to D1 and the thickness of the connecting wire 63 (or heating wire 61 and 62) is set to D2, D1 is formed to be thinner than D2, and preferably D1 / D2 is 0.4 or more and 0.9 or less.

[0159] Furthermore, the relationship between the thickness D1 of the power supply section 64, 65 and the thickness Dx of the inner glass plate 12 or outer glass plate 11 on which the power supply section 64, 65 is provided preferably satisfies the following equation (2).

[0160] D1≤(81.4-(76.8 / Dx 2 )) / 3.0 (2)

[0161] In the case where the power supply sections 64 and 65 are formed by screen printing, for example Figure 7 As shown, the support portion 92 at the periphery of the support mesh 91 is formed higher than the mesh 91. Furthermore, the height of the mesh 91 differs for the power supply portions 64 and 65 and the heating wires 61-63, which have different thicknesses. Therefore, since the scraper 93 cannot sufficiently press the periphery of the mesh 91, there is a tendency for the edges of the power supply portions 64 and 65 to be formed higher than the central portion. The central portion is the portion where the terminal 8 is disposed and the solder 7 is located; the thickness of this portion is the thickness of the aforementioned power supply portions 64 and 65, referred to as D1. The thickness of the edges of the power supply portions 64 and 65 is referred to as D5. As described above, the thickness D5 of the edges of the power supply portions 64 and 65 is greater than the thickness D1 of the central portion, and the relationship between these thicknesses D1 and D5 preferably satisfies the following equation (3).

[0162] 0.4≤D1 / D5≤0.9 (3)

[0163] By setting D1 / D5 to 0.4 or higher, the resistance value of terminal 8 can be ensured, and the heat generated by terminal 8 can be suppressed. On the other hand, by setting D1 / D5 to 0.9 or lower, the tensile stress caused by the difference in thermal expansion between silver and the glass plate can be suppressed.

[0164] The heating element 6, constructed as described above, is covered by a bracket and its cover, making it invisible from inside the vehicle. Furthermore, since the connecting wires 63 and the power supply units 64 and 65 are disposed on the mask layer 110, they are also invisible from outside the vehicle. The heating wire 6 may not be completely covered by the bracket and cover; at least the portion corresponding to the viewing window 113 may be covered. Alternatively, only a portion of the power supply units 64 and 65 and the connecting wire 63 may be exposed from the bracket. However, to avoid contact from inside the vehicle, it is preferable that the heating wire 6 is completely covered by the bracket or cover. Alternatively, even if a portion of the heating wire 6 is exposed from the bracket, it may be covered by the cover.

[0165] <6. Windshield Manufacturing Method>

[0166] Next, the manufacturing method of the windshield will be described. First, a mask layer 110 is laminated onto at least one of an outer glass plate 11 and an inner glass plate 12, both formed into a predetermined shape. Next, the aforementioned heating element 6 is formed on the inner surface of the inner glass plate 12 (including the mask layer 110) by printing. Then, the glass plates 11 and 12 are formed in a bending manner. This method is not particularly limited; for example, it can be performed using known pressing molding. Alternatively, the outer glass plate 11 and inner glass plate 12 are overlapped and placed on a molding die, which is then heated in a furnace. This allows the glass plates 11 and 12 to be bent by their own weight.

[0167] Thus, when the outer glass plate 11 and the inner glass plate 12 are formed, a laminated body is then formed with the intermediate film 3 sandwiched between the outer glass plate 11 and the inner glass plate 12. The intermediate film 3 is larger than the glass plates 11 and 12.

[0168] Next, the laminate is placed in a rubber bag, and pre-bonding is performed at approximately 70–110°C while applying reduced pressure and suction. Other pre-bonding methods can also be used, such as heating the laminate in an oven at 45–65°C. Then, the laminate is pressed with rollers at 0.45–0.55 MPa. Next, the laminate is heated again in an oven at 80–105°C, and then pressed again with rollers at 0.45–0.55 MPa. This completes the pre-bonding process.

[0169] Next, the main bonding is performed. For the pre-bonded laminate, the main bonding is performed using an autoclave, for example, at 8–15 atmospheres and 100–150°C. Specifically, for example, the main bonding can be performed at 14 atmospheres and 135°C. Through the above pre-bonding and main bonding, the intermediate film 3 is bonded to each of the glass plates 11 and 12. Then, the intermediate film 3 exposed from the outer glass plate 11 and the inner glass plate 12 is cut off.

[0170] Next, solder 7 is used to fix terminals 8 to the power supply sections 64 and 65. In this way, the windshield is completed.

[0171] <7. Characteristics>

[0172] Using the windshield described above, the following effects can be achieved.

[0173] (1) Heating wires 61 and 62 are positioned to pass through the imaging window 113, thus preventing the laminated glass 10 from becoming blurry. Furthermore, the heating wires 61 and 62 can be used to de-ice the laminated glass 10. Therefore, when light is received through the imaging window 113 using the imaging device 2, it is possible to prevent obstruction of light transmission due to blurring of the imaging window 113, thus preventing inaccurate measurements. As a result, information processing can be performed correctly.

[0174] (2) The heating element 6 is covered by the bracket and its cover, so it cannot be seen from the inside of the vehicle. It also prevents passengers from coming into contact with the heating element 6.

[0175] (3) While there is no risk of external tensile force being applied to the heating wires 61 and 62, the connection terminals and wiring used for power supply are connected to the power supply sections 64 and 65, and external forces may act on them, potentially causing cracks in the power supply section or the glass plate. Therefore, the power supply sections 64 and 65 require higher glass breaking strength compared to the heating wires 61 and 62. Consequently, in this embodiment, the thickness D1 of the power supply sections 64 and 65 is thinner than the thickness D2 of the heating wires 64 and 65. The power supply sections 64 and 65 contain metallic particles such as silver, which have a larger difference in thermal shrinkage rate compared to the glass plate 10. Therefore, a larger thickness of the power supply section can lead to a reduction in the tensile stress generated by the glass plate 10 and a decrease in the breaking strength of the glass plate 10.

[0176] Therefore, in this embodiment, by making the thickness of the power supply sections 64 and 65 smaller than that of the heating wires 61 and 62, the tensile stress generated by the glass plate 10 is reduced, and the breaking strength of the glass plate 10 corresponding to the power supply sections 64 and 65 is improved. As a result, even if an external force is applied to the power supply sections 64 and 65, cracks in the glass plate 10 or the power supply sections 64 and 65 can be suppressed.

[0177] Specifically, regarding the relationship between the thickness D1 of the power supply sections 64 and 65 and the thickness D2 of the thinnest heating wires 61 and 62 (or connecting wires 63), D1 / D2 is preferably 0.4 or more and 0.9 or less. The reason is as follows: Compared to the heating wires 61 and 62, the power supply sections 64 and 65 are wider, thus the current density per unit width is lower, and heat generation is suppressed. However, at the junction with the heating wires 61 and 62, the current density increases. Therefore, when the value of D1 / D2 is less than 0.4, the thickness difference at the junction of the power supply sections 64 and 65 with the heating wires 61 and 62 becomes large, resulting in heat generation and potential energy loss. On the other hand, when D1 / D2 is greater than 0.9, the thickness of the power supply sections 64 and 65 becomes excessive, and therefore, as mentioned above, the destructive strength at the power supply sections 64 and 65 decreases, potentially causing cracks in the glass plate 10.

[0178] (4) The width of the power supply section 64 and 65 is larger than that of the heating wires 61 and 62 and the connecting wire 63. Therefore, the heat generation of the power supply section 64 and 65, which do not require heat generation, can be reduced, and the heat generation of the heating wires 61 and 62 can be increased, thereby effectively generating heat in the shooting window 113.

[0179] Furthermore, the power supply sections 64 and 65 are formed from conductive printed circuits containing metallic particles such as silver. The heating element 6, which includes the power supply sections 64 and 65, is printed before the glass plate is formed and is fixed to the inner glass plate 12 during glass forming. However, when cooled to room temperature, its thermal expansion differs from that of the glass plate, thus generating thermal stress at the interface with the inner glass plate 12. As a result, the breaking strength of the inner glass plate 12 is weakened at the locations where the power supply sections 64 and 65 are formed.

[0180] As described above, in this embodiment, the thickness of the power supply sections 64 and 65 is less than that of the heating wires 61 and 62. However, as shown in the following formula (4), when the thickness d (D1 mentioned above) of the power supply sections 64 and 65 is reduced, the warping of the glass plate (1 / R) can be reduced. DTE The smaller the value, the smaller the tensile stress generated on the surface of the glass plate. As a result, the decrease in the breaking strength of the glass plate 12 where the power supply sections 64 and 65 are formed can be suppressed.

[0181]

[0182] Among them, E f Young's modulus of silver; E s Young's modulus of the glass plate; ν f : Poisson's ratio of silver; ν S α: Poisson's ratio of the glass plate; d: thickness of the power supply section; D: thickness of the glass plate; f : Coefficient of thermal expansion of silver; α s : Coefficient of thermal expansion of the glass plate; ΔT: Temperature difference between the temperature at which the power supply unit is fixed and room temperature; 1 / R DTE : Curvature of the interface between the power supply section and the glass plate.

[0183] (5) However, in order to avoid obstructing the camera's field of view, and to make up for the line width and ensure a certain amount of heat generation, the heating wires 61 and 62 configured as described above in the shooting window 113 need to have a lower resistance. Therefore, the heating wires 61 and 62 need to be thicker.

[0184] Furthermore, as described later, when using heating wire as a de-icing device, in order to ensure heat generation per unit area, to compensate for the wire width, and to heat sufficiently with a certain current, the resistance value needs to be reduced. Therefore, similarly, the thickness of the heating wire needs to be increased.

[0185] Furthermore, as will be discussed later, a wider linewidth in the antenna conductor makes it easier for passengers to identify the antenna, therefore a thinner linewidth is preferred. However, to adjust the impedance of the antenna conductor, its thickness needs to be increased.

[0186] However, when using screen printing to form heating lines 61, 62, connecting lines 63, and power supply units 64, 65 (hereinafter referred to as heating lines, etc.), the thickness of the printed heating lines, etc. is determined by the height or thickness of the screen mesh, so the thickness cannot be changed.

[0187] Therefore, the inventors of this invention discovered that in screen printing, the thickness of heating lines, etc., which have narrower line widths, can be controlled by adjusting the thickness of the emulsion applied to the screen. That is, by applying an emulsion to the upper surface of the screen, the thickness of the screen is controlled, thereby controlling the thickness of the heating lines, etc. Therefore, for example, increasing the thickness of the emulsion allows for a thicker printed product, and decreasing the thickness of the emulsion or not applying an emulsion allows for a thinner printed product. This allows the power supply sections 64 and 65 to have different thicknesses from the heating lines, etc.

[0188] In addition to screen printing, inkjet printing is another method. In this method, the printing thickness is determined by the wettability of the glass and the ink, making it difficult to control. In contrast, by diluting the ink with a solvent and adjusting the concentration of conductive metal particles, the thickness after firing can be adjusted. This allows for thinning of heating wires, etc. Alternatively, if a thicker heating wire is desired, repeated printing or the use of ink with less dilution can be employed.

[0189] In order to study the thickness of the power supply parts 64 and 65, the following tests were conducted.

[0190] (A. Experiment 1)

[0191] As shown below, a tensile test was conducted on a glass plate made of 1.8 mm thick soda-lime glass, or a glass plate on which a 10 μm thick mask layer (composition as shown in Table 1 above) was laminated. For the tensile test, a 5 mm × 10 mm power supply section was formed on the glass plate using a paste containing silver (conductive metal particles) or a paste containing copper (conductive metal particles), and a 9 mm thick coating was applied to this power supply section. 2 A small amount of lead-free solder was used to fix the wiring. A force of 50 N was applied to the wiring at a 90° angle relative to a glass plate. The result was then evaluated as described below.

[0192] A: The power supply unit did not peel it off from the glass plate;

[0193] B: Part of the power supply unit remains, but the power supply unit is detached at the interface with the glass plate;

[0194] C: The power supply section is peeled off from the interface with the glass plate or the mask layer;

[0195] D: The glass panel at the bottom of the power supply unit is broken and peeled off.

[0196] The results are as follows.

[0197] [Table 2]

[0198] conductive particles Thickness of power supply section substrate Tensile test Ag 4.0μm glass plate A Ag 3.2μm glass plate A Ag 3.1μm Glass plate with mask layer A Ag 3.0μm glass plate A Ag 2.8μm glass plate B Ag 2.9μm Glass plate with mask layer B Ag 2.5μm glass plate C Ag 2.0μm glass plate C Cu 3.1μm glass plate A Cu 2.8μm glass plate B Cu 2.0μm glass plate C

[0199] Based on the above results, the thickness of the power supply section is preferably 3.0 μm or more. Comparing silver and copper, silver has a linear thermal expansion coefficient of 18.9 μm / (m·K), while copper has a coefficient of thermal expansion of 16.5 μm / (m·K). Therefore, due to the high thermal expansion coefficient of silver, the difference in thermal expansion coefficients between the glass plates tends to be large. Consequently, the possibility of cracking is high when the power supply section is formed from silver. Therefore, in Experiment 2 described below, the power supply section was formed from silver. Specifically, a silver paste with a metal content of 95% after firing was used. Furthermore, since the difference in thermal expansion coefficients between the mask layer and the glass plate is smaller than that between silver and the mask layer, the influence of the mask layer can be ignored.

[0200] (B. Experiment 2)

[0201] Three glass plates of different thicknesses were used, and power supply sections of varying silver thicknesses were formed. The wiring for these power supply sections was then connected using lead-free solder, similar to Test 1. However, in Test 2, no mask layer was formed; the power supply section was formed directly on the glass plate. The tensile and circumferential bending tests (ASTM-C1499-1) were then performed on the samples prepared in this manner.

[0202] In the ring bending test, such as Figure 8 As shown, a 12mm diameter load ring was placed on the power supply unit, and a 60mm diameter support ring was placed below the glass plate. Then, with a stress rate of 1MPa / sec, the load ring was used to press against the power supply unit, and the breaking stress (breaking strength) of the glass plate was calculated. The results are as follows.

[0203] [Table 3]

[0204]

[0205] Figure 9 This is a graph showing the relationship between the film thickness of the power supply section and the destructive strength, extracted from Table 3. According to... Figure 9 The chart shows that the relationship between the film thickness of the power supply section and the breaking strength is basically the same regardless of the type of glass. Therefore, it can be concluded that the breaking strength does not differ with the type of glass. Furthermore, according to... Figure 9The relationship between the film thickness (x below) and the destructive strength (y below) of the power supply section is expressed by the following equation (5).

[0206] y = -3.0025x + 81.35 (5)

[0207] Figure 10 This is a graph showing the relationship between the reciprocal of the square of the thickness of the glass plates extracted from Table 3 and the breaking strength, along with the results of tensile tests. According to... Figure 10 Let x be the reciprocal of the square of the glass plate thickness Dx, and y be the breaking strength (H). Using the relationship y = 76.8x as the boundary, peeling of the power supply part was observed in the tensile test. That is, it can be seen that by satisfying the above equation (1), peeling of the power supply part from the glass plate can be suppressed.

[0208] Furthermore, based on equations (1) and (5), equation (2) can be derived. That is, the relationship between the thickness of the power supply section and the glass plate can be specified. Figure 11 This is a diagram representing equation (2). In the example above, silver paste with a content of 95% of the fired metal particles was used, but even if it is less than 95%, the relationships in the above equations are still satisfied. This is true. The reason is that when the content of metal particles decreases, the amount of metal dominating the coefficient of thermal expansion decreases, thus showing a tendency for the coefficient of thermal expansion to decrease. The same applies when using metal particles other than silver. For example, this is because silver has a higher coefficient of thermal expansion than copper.

[0209] <8. Variations>

[0210] The present invention has been described above as one embodiment, but the present invention is not limited to the above embodiment. Various modifications can be made without departing from its spirit. The following variations can also be appropriately combined.

[0211] <8-1>

[0212] The wiring pattern of the heating element 6 is not limited to the pattern shown in the above embodiment, and can be various patterns. For example, the number of main portions 611 and 621 of the first and second heating wires 61 and 62, the number of connecting portions 612 and 622, the direction of the main portions 611 and 621, the length of the connecting wire 63, the direction of the connecting wire 63, and the position of the power supply portions 64 and 65 can be appropriately changed. In addition, in the above embodiment, two heating wires 61 and 62 are connected in parallel, but three or more heating wires can also be connected in parallel. Alternatively, one heating wire can be connected in series with respect to the power supply portions 64 and 65. Furthermore, the line widths of the heating wires 61 and 62 and the connecting wire 63 can also be the same, for example, the connecting portions 612 and 622 and the connecting wire 63 of the heating wires 61 and 62 can be made larger relative to the main portions 611 and 621. As a result, the heat generation of the parts that do not contribute to the heating of the imaging window 113 can be reduced.

[0213] Furthermore, the shape of the shooting window 113 can be any shape other than a trapezoid, as long as the shooting device 2 can take pictures, it can be changed appropriately. Moreover, when the shape of the shooting window is changed, the wiring pattern of the heating element 6 can also be changed appropriately.

[0214] <8-2>

[0215] In the above embodiment, a portion of the heating element 6 (power supply part 64, 65, connecting line 63 and connecting part 612, 622) is disposed on the mask layer 110, but it can also be disposed directly on the inner glass plate 12.

[0216] <8-3>

[0217] like Figure 12 As shown, the heating element 6 can also be disposed on the inner surface of the outer glass panel 11. In this case, a cutout 125 is formed at the end of the inner glass panel 12, through which the outer glass panel 11 is exposed to the outside. Moreover, when the power supply unit 6 is disposed in this exposed portion, the terminals are easy to install.

[0218] <8-4>

[0219] The masking layer 110 may also consist of a masking film that can be adhered to the laminated glass 10, thereby blocking the view from outside the vehicle. In the case where the masking film is adhered to the outer surface of the inner glass panel 12, it can be adhered before pre-adhesion or after main adhesion.

[0220] In addition, from the viewpoint of preventing the light path from becoming blurred, the mask layer 110 is not necessary in the laminated glass 10. It is sufficient to install the heating wire 6 or the anti-fog sheet 7 in the area where the light passes (the shooting window: the information acquisition area).

[0221] <8-5>

[0222] In the above embodiment, the heating wire used to heat the shooting window 113 is based on the present invention. However, as long as the glass plate can be heated, for example, a de-icing device installed on the windshield or a defogger installed on the transparent glass can be used as the heating wire. Furthermore, when the heating wire is a heating wire for a de-icing device, a mask layer can be formed on the inner surface of the outer glass plate 11 of the laminated glass, and the heating wire for the de-icing device can be formed on this mask layer. In this case, a mask layer can be omitted from the inner glass plate 12. The heating wires 61 to 63 can be disposed on a single-pane glass plate instead of a laminated glass plate.

[0223] <8-6>

[0224] In the above embodiment, heating wires 61 and 62 (and connecting wire 63) are heated by supplying power to power supply units 64 and 65. However, in addition to heating wires 61-63, electrical components such as dimming elements and damage detection elements can also be used as the objects to which power is supplied. When using such electrical components, a connecting member with the same configuration as heating wires 61-63 is disposed on the glass plate 1 or mask layer 110, and the power supply unit and the electrical component are connected by this connecting member. Therefore, the dimensions and specifications of the connecting member can be the same as those of the heating wires described above.

[0225] <8-7>

[0226] When configuring an antenna conductor to receive power, it can be constructed in the same way as a heating wire. For example... Figure 13 As shown, the antenna conductor 69 can be disposed on the inner surface (or on the mask layer 110) of either the inner glass panel 12 or the outer glass panel 11, and connected to the power supply unit 64. The power supply unit 64 can be disposed on either glass panel 11 or 12, or on the mask layer 110 formed on that glass panel. The antenna conductor 69 is made of wire formed using the same method (screen printing, etc.) as the heating wires 61 and 62, and is thinner than the power supply units 64 and 65. Furthermore, the configuration of the power supply unit 64 is the same as in the embodiment described above. Figure 13 The shape of the antenna conductor 69 shown is an example. The antenna conductor 69 can be appropriately constructed from an antenna pattern for various media such as AM, FM, digital television, and DAB. Furthermore, on the power supply section 64, a terminal 8 is fixed using solder 7, and a conductive cable connected to this terminal 8 is connected to the receiver for each media via an amplifier. As described above, when an antenna is installed, similar to the above embodiment, it is also possible to suppress the decrease in the destructive strength of the glass plates 11 and 12 at the location where the power supply section 64 is installed.

[0227] <8-8>

[0228] In order to reduce the thickness of the power supply sections 64 and 65, for example, silver paste used for the power supply section can be used after being diluted with a solvent. Thus, by applying the silver paste and drying it, the solvent evaporates, thereby reducing the thickness of the dried silver, i.e., the thickness of the power supply sections 64 and 65.

[0229] <8-9>

[0230] In the above embodiment, the connecting terminal 8 is fixed to the power supply units 64 and 65 using solder 7, and the conductive cable 9 is connected to the connecting terminal 8, thereby supplying power to the power supply units 64 and 65. Alternatively, the conductors and other wiring of the conductive cable 9 can be directly fixed to the power supply units 64 and 65 using solder 7. The same applies when the antenna or electrical component described above is connected to the power supply unit.

[0231] <8-10>

[0232] In the above embodiment, an imaging device 2 with a camera was used as the information acquisition device of the present invention, but it is not limited to this, and various information acquisition devices can be used. That is, in order to acquire information from outside the vehicle, there is no particular limitation as long as light can be irradiated and / or received. For example, various devices such as lidar, light sensors, rain sensors, and light beacons that receive signals from outside the vehicle can be used. In addition, the opening such as the imaging window 113 can be provided on the mask layer 110, and multiple openings can be provided, depending on the type of light. For example, when a stereo camera is provided, two imaging windows are formed on the mask layer 110, and heating wires are arranged relative to each imaging window 113. The information acquisition device may or may not be in contact with the glass. In addition, the imaging window 113 does not need to be fully closed, and can also be partially open.

[0233] Symbol Explanation

[0234] 1. Laminated glass

[0235] 11. Outer glass panel

[0236] 12 Inner glass panel

[0237] 3. Intermediate membrane

[0238] 110 Mask layer

[0239] 113 Shooting window (opening)

[0240] 61-63 heating wires

[0241] Power Supply Department 64, 65

Claims

1. A glass panel module capable of connecting to power supply wiring, characterized in that it has: glass plate; Heating wires disposed on the glass plate; and A power supply unit disposed on the glass plate, directly or via connecting terminals, connects to the wiring and supplies power to the heating wire. The heating wire and the power supply unit are integrally formed from conductive printed circuits whose main components are metal particles with a thermal expansion coefficient greater than that of the glass plate. The thickness of the power supply section is thinner than the thickness of the heating wire.

2. The glass plate module as described in claim 1, characterized in that: The width of the power supply section is 5mm or more.

3. The glass plate module as described in claim 1, characterized in that: The heating wire is formed from a conductive printed circuit whose main components are the same metal particles as those in the power supply section.

4. The glass plate module as described in claim 3, characterized in that: The thickness of the conductive printed circuit forming the heating line is 3 μm or more.

5. The glass plate module as described in claim 1, characterized in that: The width of the heating wire is between 0.2mm and 3.0mm.

6. The glass plate module as described in claim 5, characterized in that: When the width of the power supply section is wider than the width of the heating wire, and the thickness of the power supply section is set to D1 and the thickness of the heating wire is set to D2, the condition 0.4≤D1 / D2≤0.9 is satisfied.

7. The glass plate module as described in claim 1, characterized in that: The heating wire is a camera window heating wire disposed in the glass plate in the area where the camera is shooting, or a de-icing device heating wire.

8. A glass panel module capable of connecting to power supply wiring, characterized in that it has: glass plate; Conductive connection components disposed on the glass plate and connected to electrical components; and A power supply unit disposed on the glass plate, directly or via connecting terminals, connects to the wiring and supplies power to the electrical components via the connecting members. The connecting component and the power supply unit are integrally formed from conductive printed circuits whose main components are metal particles with a thermal expansion coefficient greater than that of the glass plate. The thickness of the power supply unit is thinner than the thickness of the connecting component.

9. The glass plate module as described in claim 8, characterized in that: The width of the power supply section is 5mm or more.

10. The glass plate module as described in claim 8, characterized in that: The connecting component is formed from a conductive printed circuit whose main component is the same metal microparticles as those in the power supply section.

11. The glass plate module as described in claim 10, characterized in that: The thickness of the conductive printed circuit forming the connecting component is 3 μm or more.

12. The glass plate module as described in claim 8, characterized in that: The width of the connecting component is between 0.2 mm and 3.0 mm.

13. The glass plate module as described in claim 12, characterized in that: When the width of the power supply unit is wider than the width of the connecting component, and the thickness of the power supply unit is set to D1 and the thickness of the connecting component is set to D2, the condition 0.4≤D1 / D2≤0.9 is satisfied.

14. The glass plate module as described in claim 8, characterized in that: The electrical component is a dimming component or a damage detection component.

15. A glass panel module capable of connecting to wiring for receiving power, characterized in that it has: glass plate; Antenna conductors disposed on the glass plate; and A power supply unit disposed on the glass plate, connected directly or via connecting terminals to the wiring, and receiving power from the antenna conductor. The antenna conductor and the power supply unit are integrally formed from conductive printed circuits whose main components are metal particles with a thermal expansion coefficient greater than that of the glass plate. The thickness of the power supply section is thinner than the thickness of the antenna conductor.

16. The glass plate module as described in claim 15, characterized in that: The width of the power supply section is 5mm or more.

17. The glass plate module as described in claim 15, characterized in that: The antenna conductor is formed from a conductive printed circuit whose main component is the same metal microparticles as those in the power supply section.

18. The glass plate module as described in claim 17, characterized in that: The thickness of the conductive printed circuit forming the antenna conductor is 3 μm or more.

19. The glass plate module as described in claim 15, characterized in that: The width of the antenna conductor is between 0.3 mm and 3.0 mm.

20. The glass plate module as described in claim 19, characterized in that: When the width of the power supply section is wider than the width of the antenna conductor, and the thickness of the power supply section is set to D1 and the thickness of the antenna conductor is set to D2, the condition 0.4≤D1 / D2≤0.9 is satisfied.

21. The glass plate module according to any one of claims 1 to 20, characterized in that: The metal particles are mainly composed of silver or copper particles.

22. The glass plate module as described in claim 21, characterized in that: The metal particles are mainly composed of silver or copper particles.

23. The glass plate module as described in any one of claims 1 to 20, characterized in that: It also includes: solder disposed on the power supply section; and The terminals of the power supply unit are fixed using the solder.

24. The glass plate module according to any one of claims 1 to 20, characterized in that: It also includes: solder disposed on the power supply section; and The wiring is fixed to the power supply unit using the solder.

25. The glass plate module as described in claim 23, characterized in that: The solder is lead-free solder.

26. The glass plate module as described in claim 24, characterized in that: The solder is lead-free solder.

27. The glass plate module as described in any one of claims 1 to 20, characterized in that: The glass plate is transparent glass, heat-absorbing glass, or soda-lime glass.

28. The glass plate module as described in claim 27, characterized in that: When the thickness of the glass plate on which the power supply section is formed is set to Dx, the breaking strength H of the power supply section of the glass plate satisfies the following formula: H≥76.8 / Dx 2 。 29. The glass plate module as described in claim 28, characterized in that: When the thickness of the power supply section is set to D1, the following formula is satisfied: D1≤(81.4-(76.8÷Dx 2 )) / 3.0。 30. The glass plate module as described in claim 29, characterized in that: The power supply section is formed of a conductive printed circuit containing silver microparticles, the conductivity of which is more than 2 μΩ·cm and less than 10 Ω·cm.

31. The glass plate module according to any one of claims 1 to 20, characterized in that: It also has a mask layer stacked on the glass plate. The power supply unit is disposed on the mask layer.

32. The glass plate module according to any one of claims 1 to 20, characterized in that: The glass plate is not tempered glass.

33. The glass plate module as described in any one of claims 1 to 20, characterized in that: The glass plate is formed of laminated glass having an outer glass plate, an inner glass plate, and an interlayer disposed between the outer glass plate and the inner glass plate.

34. The glass plate module as described in claim 33, characterized in that: A cut is formed in the inner glass plate. The power supply unit is disposed on the exposed surface of the outer glass plate, which is exposed to the outside through the cut.

35. The glass plate module as described in claim 33, characterized in that: The power supply unit is disposed on the inner glass plate.

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