Source bottle assembly, temperature control method thereof, and semiconductor process equipment

Abstract

The present invention discloses a source bottle assembly and a temperature control method thereof, and a semiconductor process equipment. The source bottle assembly includes a first valve group, a second valve group, a first heater, a second heater, and a temperature control assembly; the first valve group is located between the second valve group and the first heater, the first heater is used to heat the first valve group and the second valve group, the second heater is arranged close to the second valve group, and the second heater is used to heat the second valve group; the first valve group is provided with a first temperature detecting member, the first temperature detecting member is used to detect the temperature of the first valve group, the second valve group is provided with a second temperature detecting member, the second temperature detecting member is used to detect the temperature of the second valve group; the first temperature detecting member and the second temperature detecting member are both electrically connected to the temperature control assembly, and the temperature control assembly is connected to the second heater control. The above scheme can solve the problem of poor heating uniformity of the valve of the source bottle assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip manufacturing, and in particular to a source bottle component, a temperature control method thereof, and semiconductor process equipment. Background Art

[0002] Atomic layer deposition (ALD) deposits a material onto a wafer surface layer by layer in the form of a single atomic film. During the deposition process, two or more chemical vapor phase reaction gases react sequentially on the wafer surface to produce a solid film.

[0003] In related art, a solid source within a source bottle assembly is heated to a gaseous state, and then the gaseous source is introduced into a semiconductor chamber as a reactant gas to initiate a reaction. In related art, the source bottle assembly includes multiple valves and pipelines, connecting the source bottle assembly to the semiconductor chamber via these valves and pipelines. To prevent condensation of the gas source due to low valve temperatures, a heater is installed on the source bottle to heat the valves.

[0004] However, the temperature of some valves close to the heater is high, while the temperature of some valves far from the heater is low, thus resulting in poor heating uniformity of the valves of the source bottle assembly. Summary of the Invention

[0005] The invention discloses a source bottle assembly, a temperature control method thereof, and semiconductor process equipment, so as to solve the problem of poor heating temperature uniformity of a valve of the source bottle assembly.

[0006] In order to solve the above problems, the present invention adopts the following technical solutions:

[0007] A source bottle assembly is used in semiconductor process equipment, the source bottle assembly comprising a first valve group, a second valve group, a first heater, a second heater and a temperature control assembly;

[0008] The first valve group is located between the second valve group and the first heater, the first heater is used to heat the first valve group and the second valve group, and the second heater is located close to the second valve group, and the second heater is used to heat the second valve group;

[0009] The first valve group is provided with a first temperature detecting member, the first temperature detecting member is used to detect the temperature of the first valve group, and the second valve group is provided with a second temperature detecting member, the second temperature detecting member is used to detect the temperature of the second valve group;

[0010] The first temperature detection member and the second temperature detection member are both electrically connected to the temperature control component, and the temperature control component is controlled and connected to the second heater. The temperature control component is used to receive the temperatures detected by the first temperature detection member and the second temperature detection member. The temperature control component includes a first temperature comparator, and the temperature control component is used to compare the temperatures detected by the first temperature comparator of the first temperature detection member and the second temperature detection member to obtain a temperature difference, and control the second heater to heat the second valve group according to the temperature difference.

[0011] A semiconductor process equipment comprises a semiconductor chamber and the above-mentioned source bottle assembly, wherein the semiconductor chamber is communicated with the source assembly.

[0012] A temperature control method for a source bottle assembly is provided. The control method is applied to the above-mentioned source bottle assembly and comprises:

[0013] Acquire the temperature of the first valve group to obtain a first temperature, and acquire the temperature of the second valve group to obtain a second temperature;

[0014] A first temperature difference is obtained according to the first temperature and the second temperature, and the second heater is turned on when the first temperature difference is greater than a first preset temperature difference.

[0015] The technical solution adopted by the present invention can achieve the following beneficial effects:

[0016] In the source bottle assembly disclosed in the present invention, since the first heater is closer to the first valve group, the temperature of the first valve group is higher. The first valve group is provided with a first temperature detection member, and the second valve group is provided with a second temperature detection member. The temperature control component can control the second heater to heat the second valve group based on the temperature values ​​detected by the first temperature detection member and the second temperature detection member, thereby reducing the temperature difference between the first valve group and the second valve group. In this solution, the second heater can assist in heating the second valve group, thereby making the heating of the first valve group and the second valve group more uniform, thereby making the valve heating uniformity better. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0018] Figure 1 and Figure 2 A schematic structural diagram of a source bottle assembly disclosed in an embodiment of the present invention;

[0019] Figure 3A side view of a first valve assembly in a source bottle assembly disclosed in an embodiment of the present invention;

[0020] Figure 4 This is a temperature rise curve diagram of the valve of the source bottle assembly disclosed in an embodiment of the present invention;

[0021] Figures 5 to 7 This is a flow chart of a temperature control method for a source bottle assembly disclosed in an embodiment of the present invention;

[0022] Description of reference numerals:

[0023] 100-source bottle assembly, 110-first valve group, 120-second valve group, 1201-groove, 130-first heater, 140-second heater, 150-temperature control assembly, 151-first temperature comparator, 152-first difference compensator, 153-logic controller, 154-first power regulator, 155-control switch, 156-second temperature comparator, 157-second difference compensator, 158-second power regulator, 160-first temperature detection element, 170-second temperature detection element, 180-insulation part, 190-bottle body. DETAILED DESCRIPTION

[0024] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0026] like Figures 1 to 3 As shown, an embodiment of the present invention discloses a source bottle assembly 100 for use in semiconductor process equipment. The disclosed source bottle assembly 100 includes a first valve group 110, a second valve group 120, a first heater 130, a second heater 140, a temperature control assembly 150, and a bottle body 190.

[0027] The first valve group 110 is located between the second valve group 120 and the first heater 130. The first valve group 110 is connected to the bottle body 190 through the second valve group 120. The bottle body 190 contains a reaction source.

[0028] The first heater 130 is used to heat the first valve group 110 and the second valve group 120 . The second heater 140 is disposed close to the second valve group 120 and is used to heat the second valve group 120 .

[0029] The first valve group 110 is provided with a first temperature detector 160 for detecting the temperature of the first valve group 110 . The second valve group 120 is provided with a second temperature detector 170 for detecting the temperature of the second valve group 120 .

[0030] The first temperature sensing member 160 and the second temperature sensing member 170 are both electrically connected to the temperature control assembly 150. The temperature control assembly 150 is controllably connected to the second heater 140. The temperature control assembly 150 is configured to receive temperatures detected by the first temperature sensing member 160 and the second temperature sensing member 170 and control the second heater 140 to heat the second valve assembly 120 based on the temperatures detected by the first temperature sensing member 160 and the second temperature sensing member 170.

[0031] During operation, the first temperature detector 160 detects that the temperature of the first valve group 110 is a first temperature. The second temperature detector 170 detects that the temperature of the second valve group 120 is a second temperature. When the temperature difference between the first and second temperatures is greater than a preset temperature difference, the temperature control component 150 activates the second heater 140 to heat the second valve group 120.

[0032] In the embodiment disclosed in the present application, since the first heater 130 is closer to the first valve group 110, the temperature of the first valve group 110 is higher. The first valve group 110 is provided with a first temperature detecting member 160, and the second valve group 120 is provided with a second temperature detecting member 170. The temperature control component 150 can control the second heater 140 to heat the second valve group 120 according to the temperature values ​​detected by the first temperature detecting member 160 and the second temperature detecting member 170, thereby reducing the temperature difference between the first valve group 110 and the second valve group 120. The second heater 140 can assist in heating the second valve group 120, thereby making the heating of the first valve group 110 and the second valve group 120 more uniform, thereby making the valve heating uniformity of the source bottle assembly 100 better.

[0033] In another optional embodiment, a heat insulating portion 180 may be provided between the first valve group 110 and the second valve group 120. In this solution, the heat insulating portion 180 can prevent the second heater 140 from affecting the temperature of the first valve group 110.

[0034] To ensure more uniform heating of the second valve group 120, in another optional embodiment, there may be at least two second heaters 140, and the second valve group 120 may be located between the at least two second heaters 140. In this solution, the second valve group 120 is located between the at least two second heaters 140, thereby ensuring more even heating of the valves on both sides of the second valve group 120, and further ensuring more uniform heating of the valves within the second valve group 120.

[0035] In another optional embodiment, the first valve assembly 110 may include a plurality of first valves spaced apart, and the first temperature detector 160 may be located between adjacent first valves. In this embodiment, the first temperature detector 160 may be located between two first valves, enabling more accurate detection of the temperatures of the two first valves, thereby providing a more accurate temperature measurement.

[0036] Optionally, one of the first valves can be connected to a semiconductor chamber of a semiconductor process equipment, thereby passing the solid source in the bottle 190 into the semiconductor chamber. The other first valve is used to discharge residual gas in the bottle 190 and empty the bottle 190.

[0037] In another optional embodiment, the second valve assembly 120 may include a plurality of second valves spaced apart, and the second temperature detecting member 170 may be located between two adjacent second valves. In this embodiment, the second temperature detecting member 170 is located between two adjacent second valves, thereby enabling the second temperature detecting member 170 to measure the temperature between the two adjacent second valves, thereby achieving more accurate temperature measurement.

[0038] In another optional embodiment, the second valve assembly 120 may be provided with a groove 1201, and a portion of the second heater 140 may be located in the groove 1201. In this case, the second heater 140 may be inserted into the groove 1201 provided in the second valve assembly 120, thereby making the installation of the second heater 140 more convenient.

[0039] Specifically, the second valve group 120 may include a mounting portion and the aforementioned plurality of second valves, wherein the plurality of second valves may be mounted on the mounting portion, and the groove 1201 may be formed on the mounting portion. Of course, the second valve group 120 may also have other structures, which are not limited herein.

[0040] In another optional embodiment, the temperature control component 150 may include a first temperature comparator 151, a first difference compensator 152, a logic controller 153, a first power regulator 154 and a control switch 155. The first temperature comparator 151 is connected to both the first temperature detection component 160 and the second temperature detection component 170. The first temperature comparator 151 can be used to compare the temperatures detected by the first temperature detection component 160 and the second temperature detection component 170.

[0041] The first temperature comparator 151 is connected to the first difference compensator 152 and the logic controller 153. The logic controller 153 is connected to the control switch 155. The first difference compensator 152 is connected to the first power regulator 154. The first power regulator 154 is connected to the second heater 140 via the control switch 155.

[0042] The first difference compensator 152 can be used to obtain a compensation value based on the data of the first temperature comparator 151, the logic controller 153 can be used to control the on and off of the control switch 155, and the first power regulator 154 is used to adjust the power of the second heater 140 according to the compensation value obtained by the first difference compensator 152.

[0043] During the specific operation, the temperature difference between the first valve group 110 and the second valve group 120 is compared with the first preset temperature difference in the first temperature comparator 151. When the temperature difference between the first valve group 110 and the second valve group 120 is greater than the first preset temperature difference, the first difference compensator 152 obtains a first compensation value, where the compensation value is the power calculated by the following formula (1). At the same time, the logic controller 153 outputs a first signal, and the control switch 155 receives the first signal, so that the control switch 155 is closed, and the first compensation value is written into the first power regulator 154 as the first adjustment power. The second heater 140 adjusts its temperature according to the first adjustment power. In this solution, the heating amount of the second heater 140 is obtained by obtaining the temperature difference between the first valve group 110 and the second valve group 120, thereby improving the temperature control accuracy of the second valve group 120.

[0044] The specific temperature control process in the embodiment of the present application is as follows: first, the required temperature of the first valve group 110 and the second valve group 120 is determined. This required temperature can be determined based on the vaporization temperature of the solid source in the bottle body 190. The required temperature can be used as the initial temperature of the first heater 130 to heat the first valve group 110 and the second valve group 120.

[0045] The temperature of the first valve group 110 is then detected by the first temperature detection element 160, and the temperature detected by the first temperature detection element 160 may be t1. The temperature of the second valve group 120 is detected by the second temperature detection element 170, and the temperature detected by the second temperature detection element 170 is t2. The temperature difference ∆t is obtained based on t1 and t2. ∆t can be compared with the first preset temperature difference, and this process is performed within the first temperature comparator 151. When ∆t is greater than the first preset temperature difference, the compensation power of the second heater 140 can be calculated according to the following formula (1).

[0046] (1)

[0047] W is the heating power of the second heater 140, ∆t is the temperature difference between the first valve group 110 and the second valve group 120, Kp is the power adjustment ratio adjustment parameter of the second heater 140, Ki is the integral adjustment parameter for the power adjustment of the second heater 140, Kd is The second heater 140 power adjustment differential adjustment parameter, the above Kp、Ki and Kd are all constants.

[0048] The above calculation process can be specifically carried out in the first difference compensator 152. The first compensation value obtained by the first difference compensator 152 is written into the first power regulator 154 as the first adjustment power. At the same time, the logic controller 153 receives a signal that the second heater 140 needs to be heated, thereby closing the control switch 155, so that the first power regulator 154 and the second heater 140 are connected to adjust the heating power of the second heater 140.

[0049] If ∆t is less than or equal to the first preset temperature difference, it means that the temperatures of the first valve group 110 and the second valve group 120 are similar, and therefore the second heater 140 does not need to be turned on.

[0050] In the above embodiment, the initial temperature of the first heater 130 can be determined based on manual experience, resulting in poor accuracy of the temperature input by the first heater 130. Therefore, in another alternative embodiment, a temperature control assembly 150 is controllably connected to the first heater 130 and is used to control the first heater 130. In this solution, the temperature control assembly 150 can also regulate the first heater 130, thereby improving the accuracy of the temperature of the first heater 130 and, in turn, achieving better heating uniformity between the first valve group 110 and the second valve group 120.

[0051] During specific operation, the temperature control assembly 150 can compare the initial temperature with the minimum value detected by the first temperature detector 160 and the second temperature detector 170. In other words, the minimum temperature between the first and second temperatures is compared. If the minimum value is lower than the initial temperature, it indicates that the first valve group 110 and the second valve group 120 have not reached the required temperature. Therefore, a compensation value can be calculated based on the temperature difference between the minimum value and the initial temperature to compensate the first heater 130.

[0052] The specific calculation can be obtained according to formula (2):

[0053] (2)

[0054] T1 is the temperature of the first heater, ∆t1 is the temperature difference between the minimum value and the initial temperature of the first valve group 110 and the second valve group 120, that is, the temperature difference between the valve temperature setting value and the valve steady-state temperature, Kp1 is the power adjustment ratio adjustment parameter of the first heater 130, Ki1 is the integral adjustment parameter for the power adjustment of the first heater 130, Kd1 is The first heater 130 power adjustment differential adjustment parameter, the above Kp1, K1i and Kd1 are all constants. At this time, T1 The new temperature is input to the first heater 130 .

[0055] The above embodiments can improve the convenience and efficiency of operation and increase the accuracy of temperature control.

[0056] It should be noted that the temperature adjustment condition for the first heater 130 is to determine whether the ∆t value is consistently less than or equal to the first predetermined temperature difference over a period of time. Under this condition, the determination of whether a steady-state error exists is then made. This period of time can be freely set according to operating conditions, for example, five minutes or ten minutes.

[0057] Furthermore, the temperature control component 150 may include a second temperature comparator 156, a second difference compensator 157 and a second power regulator 158. The second temperature comparator 156 is connected to the first temperature detection component 160 and the second temperature detection component 170. The second temperature comparator 156 is used to compare the temperatures detected by the first temperature detection component 160 and the second temperature detection component 170.

[0058] The second temperature comparator 156 is connected to a second difference compensator 157. The second difference compensator 157 is connected to a second power regulator 158. The second power regulator 158 is controllably connected to the first heater 130. The second difference compensator 157 can be used to obtain a compensation value based on data from the second temperature comparator 156, and the second power regulator 158 can be used to adjust the power of the first heater 130 based on the compensation value obtained by the second difference compensator 157.

[0059] In this solution, the temperatures of the first valve group 110 and the second valve group 120 are compared with the temperature value of the first heater 130 through the second temperature comparator 156. If the minimum value in the first valve group 110 or the second valve group 120 is less than the preset value of the first heater 130, it indicates that there is a steady-state error. Therefore, the second compensation value is obtained through the second difference compensator 157. The second compensation value can be written into the second power regulator 158 as the second adjustment power to perform temperature compensation on the first heater 130.

[0060] In the above embodiment, the first temperature comparator 151 and the second temperature comparator 156 can be the same component, that is, the source bottle assembly 100 is provided with a single temperature comparator. Alternatively, the first temperature comparator 151 and the second temperature comparator 156 can be two independent components, that is, the source bottle assembly 100 is provided with two temperature comparators.

[0061] In the above embodiment, the specific operating process of the source bottle assembly 100 disclosed in this application is as follows: first, the required temperatures of the first valve group 110 and the second valve group 120 are input, and the required temperatures are used as the initial heating temperature of the first heater 130. The temperature t1 of the first valve group 110, the temperature t2 of the second valve group 120, and the actual temperature t3 of the first heater 130 are respectively collected. The difference between t1 and t2 is then compared with a first preset temperature difference. When the difference between t1 and t2 is greater than the first preset temperature difference, the second heater 140 is activated to heat the second valve group 120. The specific compensation process has been mentioned above and will not be repeated here. The first preset temperature difference here can be 5°C, of ​​course, it can also be other degrees, and this is not limited here. When the difference between t1 and t2 is less than or equal to the first preset temperature difference, the second heater 140 is turned off.

[0062] If the difference between t1 and t2 is less than or equal to the second preset temperature difference, or if the second heater 140 heats the second valve group 120 for a period of time, and the minimum of t1 and t2 is compared with t3, and the difference between the minimum and t3 is greater than the second preset temperature difference, it indicates that the first valve group 110 and the second valve group 120 have not reached a stable temperature state, and the second valve group 120 needs to be heated for a period of time before the above comparison is repeated. The second preset temperature difference may be 5°C.

[0063] When the difference between the minimum value and t3 is less than or equal to the second preset temperature difference, it indicates that the first valve group 110 and the second valve group 120 have reached a stable temperature state. The minimum value is then compared with t3. If the minimum value is greater than or equal to t3, it indicates that both the first valve group 110 and the second valve group 120 have reached the desired temperature. If the minimum value is less than t3, it indicates that both the first valve group 110 and the second valve group 120 have not reached the desired temperature. Therefore, the temperature of the first heater 130 needs to be compensated. The heating temperature of the first heater 130 is calculated. The specific calculation process has been mentioned above and will not be repeated here. The first heater 130 heats the first valve group 110 and the second valve group 120 at the compensated temperature.

[0064] As attached Figure 4 As shown, the set temperature of the valve in the source bottle assembly 100 can be 200°C, curve 3 is the ideal temperature rise curve of the valve, curve 2 is the temperature rise curve of the first valve group 110, and the temperature rise curve of the first valve group 110 is shown in FIG. Figure 4 It can be seen that the ideal temperature rise process is basically achieved. Curve 3 is the temperature rise curve of the second valve group 120, which can maintain good tracking of curve 2. In the embodiment disclosed in this application, the valve heating of the entire source bottle assembly 100 is controlled by a double closed loop, which can effectively and automatically complete temperature setting, calibration, and heating uniformity adjustment.

[0065] Based on the source bottle assembly 100 of any of the above embodiments of the present invention, an embodiment of the present application further discloses a semiconductor process equipment, and the disclosed semiconductor process equipment includes the source bottle assembly 100 described in any of the above embodiments.

[0066] The semiconductor process equipment further includes a semiconductor chamber, which is connected to the source bottle assembly 100. The source bottle assembly 100 provides a reaction source for the semiconductor chamber.

[0067] Based on the source bottle assembly 100 of any of the above embodiments of the present invention, the embodiment of the present invention further discloses a temperature control method of the source bottle assembly 100, which is applied to any of the above-mentioned source bottle assemblies 100, such as Figure 5 As shown, the temperature control method includes:

[0068] S100: Obtain the temperature of the first valve group 110 to obtain a first temperature. Obtain the temperature of the second valve group 120 to obtain a second temperature.

[0069] S200 , obtaining a first temperature difference according to the first temperature and the second temperature, and turning on the second heater 140 when the first temperature difference is greater than a first preset temperature difference.

[0070] In this solution, the temperature control component 150 can determine the temperature difference based on the temperature values ​​detected by the first temperature detection component 160 and the second temperature detection component 170. The temperature control component 150 controls the second heater 140 to heat the second valve group 120, thereby reducing the temperature difference between the first valve group 110 and the second valve group 120. The second heater 140 can provide auxiliary heating to the second valve group 120, thereby achieving more uniform heating of the first valve group 110 and the second valve group 120, thereby improving valve heating uniformity.

[0071] In another optional embodiment, as Figure 6 As shown, step S200 includes:

[0072] S210 , comparing the first temperature difference with a first preset temperature difference via the first temperature comparator 151 .

[0073] S220 , when the first temperature difference is greater than the first preset temperature difference, the first difference compensator 152 obtains a first compensation value, and the logic controller 153 outputs a first signal.

[0074] S230 , the control switch 155 receives the first signal to close the control switch 155 , and the first power regulator 154 obtains the first regulated power according to the first compensation value.

[0075] S240 , the second heater 140 adjusts its temperature according to the first adjustment power.

[0076] In this solution, the heating amount of the second heater 140 is obtained by obtaining the temperature difference between the first valve group 110 and the second valve group 120, thereby improving the temperature control accuracy of the second valve group 120.

[0077] In another optional embodiment, as Figure 7 As shown, after S200, it also includes:

[0078] S310 , obtaining temperature change values ​​of the first valve group 110 and the second valve group 120 within a first preset time.

[0079] S320: If the temperature change value is less than the second preset temperature difference, obtain the temperature values ​​of the first valve group 110 and the second valve group 120, compare the temperature of the first valve group 110 with the temperature of the second valve group 120, and take the minimum value of the two temperatures;

[0080] S330, when the minimum value is less than the preset heating value of the first heater 130, obtaining a steady-state error;

[0081] S340, obtaining a second compensation value according to the steady-state error;

[0082] S350 , compensating the first heater 130 according to the second compensation value.

[0083] In this solution, the temperatures of the first valve group 110 and the second valve group 120 are compared with the temperature value of the first heater 130 through the second temperature comparator 156. If the minimum value of the first valve group 110 or the second valve group 120 is less than the preset value of the first heater 130, it indicates that a steady-state error exists. Therefore, the second compensation value is obtained through the second difference compensator 157, and the compensated power is obtained through the second power regulator 158 to perform temperature compensation on the first heater 130.

[0084] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0085] The foregoing is merely an embodiment of the present invention and is not intended to limit the present invention. It will be apparent to those skilled in the art that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention are intended to be included within the scope of the claims of the present invention.

Claims

1. A source bottle assembly for use in semiconductor process equipment, characterized in that: The source bottle assembly comprises a first valve group (110), a second valve group (120), a first heater (130), a second heater (140) and a temperature control assembly (150); The first valve group (110) is located between the second valve group (120) and the first heater (130), the first heater (130) is used to heat the first valve group (110) and the second valve group (120), the second heater (140) is arranged close to the second valve group (120), and the second heater (140) is used to heat the second valve group (120); The first valve group (110) is provided with a first temperature detection member (160), the first temperature detection member (160) is used to detect the temperature of the first valve group (110), and the second valve group (120) is provided with a second temperature detection member (170), the second temperature detection member (170) is used to detect the temperature of the second valve group (120); The first temperature detection element (160) and the second temperature detection element (170) are both electrically connected to the temperature control component (150), and the temperature control component (150) is control-connected to the second heater (140). The temperature control component (150) is used to receive the temperatures detected by the first temperature detection element (160) and the second temperature detection element (170); the temperature control component (150) includes a first temperature comparator (151), and the temperature control component (150) is used to compare the temperatures detected by the first temperature comparator (151) on the first temperature detection element (160) and the second temperature detection element (170) to obtain a temperature difference, and according to the temperature difference, control the second heater (140) to heat the second valve group (120).

2. The source bottle assembly according to claim 1, wherein: A heat insulating portion (180) is provided between the first valve group (110) and the second valve group (120).

3. The source bottle assembly according to claim 1, wherein: The number of the second heaters (140) is at least two, and the second valve group (120) is located between at least two of the second heaters (140).

4. The source bottle assembly according to claim 1, wherein: The first valve group (110) comprises a plurality of first valves distributed at intervals, and the first temperature detection member (160) is located between adjacent first valves.

5. The source bottle assembly according to claim 1, wherein: The second valve group (120) comprises a plurality of second valves distributed at intervals, and the second temperature detection member (170) is located between adjacent second valves.

6. The source bottle assembly according to claim 1, wherein: The second valve assembly (120) is provided with a groove (1201), and a portion of the second heater (140) is located in the groove (1201).

7. The source bottle assembly according to claim 1, wherein: The temperature control component (150) further includes a first difference compensator (152), a logic controller (153), a first power regulator (154), and a control switch (155); the first temperature comparator (151) is connected to both the first temperature detection element (160) and the second temperature detection element (170); The first temperature comparator (151) is connected to the first difference compensator (152) and the logic controller (153); the logic controller (153) is connected to the control switch (155); the first difference compensator (152) is connected to the first power regulator (154); the first power regulator (154) is connected to the second heater (140) via the control switch (155); The first difference compensator (152) is used to obtain a compensation value based on data from the first temperature comparator (151), the logic controller (153) is used to control the on and off of the control switch (155), and the first power regulator (154) is used to regulate the power of the second heater (140) based on the compensation value obtained by the first difference compensator (152).

8. The source bottle assembly according to claim 1, wherein: The temperature control component (150) is controllably connected to the first heater (130), and the temperature control component (150) is used to control the first heater (130).

9. The source bottle assembly according to claim 8, characterized in that: The temperature control component (150) includes a second temperature comparator (156), a second difference compensator (157), and a second power regulator (158); the second temperature comparator (156) is connected to both the first temperature detection element (160) and the second temperature detection element (170); the second temperature comparator (156) is used to compare the temperatures detected by the first temperature detection element (160) and the second temperature detection element (170); The second temperature comparator (156) is connected to the second difference compensator (157), the second difference compensator (157) is connected to the second power regulator (158), and the second power regulator (158) is control-connected to the first heater (130); The second difference compensator (157) is used to obtain a compensation value according to data of the second temperature comparator (156), and the second power regulator (158) is used to regulate the power of the first heater (130) according to the compensation value obtained by the second difference compensator (157).

10. A semiconductor process equipment, characterized in that: The invention comprises a semiconductor chamber and the source bottle assembly according to any one of claims 1 to 9, wherein the semiconductor chamber is connected to the source bottle assembly.

11. A temperature control method for a source bottle assembly, characterized in that: The control method is applied to the source bottle assembly according to any one of claims 1 to 9, and the temperature control method includes: Acquiring the temperature of the first valve group (110) to obtain a first temperature, and acquiring the temperature of the second valve group (120) to obtain a second temperature; A first temperature difference is obtained according to the first temperature and the second temperature, and when the first temperature difference is greater than a first preset temperature difference, the second heater (140) is turned on.

12. The control method according to claim 11, characterized in that: Obtaining a first temperature difference according to the first temperature and the second temperature; and turning on the second heater (140) when the first temperature difference is greater than the first preset temperature difference comprises: comparing the first temperature difference with the first preset temperature difference by a first temperature comparator (151); When the first temperature difference is greater than the first preset temperature difference, the first difference compensator (152) obtains a first compensation value, and the logic controller (153) outputs a first signal; The control switch (155) receives a first signal to close the control switch (155), and the first power regulator (154) obtains a first regulated power according to the first compensation value; The second heater (140) adjusts its temperature according to the first adjustment power.

13. The control method according to claim 11, characterized in that: When the first temperature difference is greater than a first preset temperature difference, after turning on the second heater (140), the method further includes: Obtaining temperature change values ​​of the first valve group (110) and the second valve group (120) within a first preset time; When the temperature change value is less than a second preset temperature difference, obtaining the temperature values ​​of the first valve group (110) and the second valve group (120), and comparing the temperature of the first valve group (110) with the temperature of the second valve group (120), and taking the minimum value of the temperatures; When the minimum value is less than a preset heating value of the first heater (130), a steady-state error is obtained; obtaining a second compensation value according to the steady-state error; The first heater (130) is compensated according to the second compensation value.

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