Resonator components and flexible filters

Abstract

The present invention discloses a resonator assembly and a flexible filter. The resonator assembly includes a flexible substrate and a resonator layer located on at least one side of the flexible substrate, wherein the resonator layer includes at least one group of resonance units, each group of resonance units includes at least two resonators that support each other and are electrically connected to each other, and the angle between the arrangement direction of the resonators and the surface of the flexible substrate where the resonators are located is greater than 0 degrees. A cavity structure is formed between the at least two mutually supporting resonators of the resonance unit and the flexible substrate, and the surface of the flexible substrate has a stress buffer structure at a position corresponding to at least one cavity structure. The arrangement of the resonator assembly in this embodiment can reduce the area of ​​the resonator assembly in the direction of the surface of the flexible substrate, which is conducive to the miniaturization of the device. The flexible substrate can improve the flexibility of the resonator assembly, and the stress buffer structure can release stress, better cooperate with the deformation that may occur in the flexible substrate, and improve the stress resistance and yield of the resonator assembly.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of electronic technology, and in particular to a resonator component and a flexible filter. Background Art

[0002] With the development of science and technology, filters are being used more and more widely. In recent years, flexible electronic devices have replaced traditional rigid substrate integrated devices and become an important development trend in future electronic technology. Currently, most filters are made using rigid substrates, while filters made using flexible substrates have a low yield.

[0003] The filter is composed of resonators. In current filters, the resonators are usually laid out flat on a substrate using a planar layout method, that is, the resonators are in a horizontal direction, resulting in a larger filter area. Summary of the Invention

[0004] The present invention provides a resonator component and a flexible filter, which can save the layout area of ​​the flexible filter and improve the yield of the flexible filter.

[0005] In a first aspect, an embodiment of the present invention provides a resonator assembly, comprising a flexible substrate and a resonator layer located on at least one side of the flexible substrate;

[0006] The resonator layer includes at least one group of resonance units, each group of resonance units includes at least two resonators that support each other and are electrically connected to each other, and the angle between the arrangement direction of the resonators and the surface of the flexible substrate where the resonators are located is greater than 0 degrees;

[0007] A cavity structure is formed between the at least two mutually supporting resonators of the resonance unit and the flexible substrate. A stress buffer structure is provided on the surface of the flexible substrate at a position corresponding to at least one of the cavity structures.

[0008] Optionally, the stress buffer structure on the surface of the flexible substrate includes at least one groove on the surface of the flexible substrate.

[0009] Optionally, the resonator includes a lower electrode, a piezoelectric layer, and an upper electrode that are stacked, and the two resonators that support each other in the resonance unit are electrically connected via their own lower electrodes.

[0010] Optionally, at least two groups of the resonance units are provided on one side surface of the flexible substrate.

[0011] Optionally, a first resonator layer is provided on the first surface of the flexible substrate, and a second resonator layer is provided on the second surface of the flexible substrate. The first surface and the second surface are two opposite surfaces of the flexible substrate, and the resonant units of the first resonator layer and the resonant units of the second resonator layer are arranged alternately.

[0012] Optionally, the first surface of the flexible substrate includes at least a protrusion, and the second surface of the flexible substrate includes at least a depression. In the thickness direction of the flexible substrate, the protrusions of the first surface correspond to the depressions of the second surface.

[0013] Optionally, the flexible substrate is U-shaped, the first surface serves as the raised portion, and the second surface serves as the recessed portion.

[0014] Optionally, both the first surface and the second surface include a convex portion and a concave portion, and in the thickness direction of the flexible substrate, the concave portion of the first surface corresponds to the convex portion of the second surface.

[0015] Optionally, the resonant unit of the first resonator layer is arranged on the raised portion of the first surface, and the resonant unit of the second resonator layer is arranged on the raised portion of the second surface; or the resonant unit of the first resonator layer is arranged on the recessed portion of the first surface, and the resonant unit of the second resonator layer is arranged on the recessed portion of the second surface.

[0016] In a second aspect, an embodiment of the present invention provides a flexible filter, comprising the resonator assembly described in any one of the first aspects.

[0017] Optionally, the flexible filter includes at least two resonator components, the resonator components are stacked, and the resonant units in at least two adjacent layers of the resonator components are electrically connected.

[0018] Optionally, in at least two layers of the resonator assembly, the resonator layers are located on the same side of the flexible substrate in the resonator assembly where they are located.

[0019] Optionally, in at least two adjacent resonator assemblies, the resonator layers are located on different sides of the flexible substrate in the resonator assemblies in which they are located.

[0020] Optionally, in the resonator assemblies of adjacent layers, the resonator layer of one layer of the resonator assemblies includes at least two groups of resonance units, the adjacent groups of resonance units are electrically connected, the resonator layer of another layer of the resonator assemblies includes at least one group of resonance units, the resonator layers of the resonator assemblies of adjacent layers are arranged relative to each other, and the resonance units of the resonator layers of adjacent layers are arranged in an staggered manner, and the distance between the two adjacent layers of the flexible substrate is less than the sum of the thicknesses of the resonance units in the two adjacent resonator layers.

[0021] Optionally, the flexible substrates of the resonator components in adjacent layers are bonded together via a bonding structure.

[0022] Optionally, in the resonator assemblies of adjacent layers, a group of the resonant units in one layer of the resonator assemblies form a set resonant structure with two adjacent groups of the resonant units in another layer of the resonator assemblies, and in the set resonant structure, a vertical projection of a group of the resonant units in one layer of the resonator assemblies on the other layer of the resonator assemblies is at least partially located between the two adjacent groups of the resonant units in the other layer of the resonator assemblies.

[0023] Optionally, the resonator assembly comprises at least three layers, and vertical projections of the set resonant structures on two sides of the same flexible substrate on the flexible substrate do not overlap.

[0024] Optionally, the resonant unit of the resonator assembly is electrically connected to the bonding structure via a connecting wire, and the connecting wire is in a shape of a straight line, a curve or a polygon.

[0025] Optionally, the resonator layers in two adjacent resonator assemblies are arranged back to back, the flexible substrates in the two adjacent resonator assemblies are connected via a conductive film, and the resonant unit is electrically connected to the conductive film via a connecting line in the flexible substrate.

[0026] An embodiment of the present invention provides a resonator assembly and a flexible filter. The resonator assembly includes a flexible substrate and a resonator layer located on at least one side of the flexible substrate, wherein the resonator layer includes at least one group of resonance units, each group of resonance units includes at least two mutually supporting and electrically connected resonators, and the angle between the arrangement direction of the resonators and the surface of the flexible substrate where the resonators are located is greater than 0 degrees. A cavity structure is formed between the at least two mutually supporting resonators of the resonance unit and the flexible substrate, and the surface of the flexible substrate has a stress buffer structure at a position corresponding to at least one cavity structure. The angle between the arrangement direction of the resonators and the surface of the flexible substrate where the resonators are located is greater than 0 degrees, which can reduce the area of ​​the resonator assembly in the direction of the surface of the flexible substrate, which is conducive to the miniaturization of the device. At the same time, the flexible substrate can improve the flexibility of the resonator assembly, and the surface of the flexible substrate has a stress buffer structure, which can release stress, better accommodate the deformation that may occur in the flexible substrate, and improve the stress resistance of the resonator assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic structural diagram of a resonator assembly provided by an embodiment of the present invention;

[0028] Figure 2 is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention;

[0029] Figure 3 is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention;

[0030] Figure 4 is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention;

[0031] Figure 5 1 is a schematic structural diagram of a flexible filter provided by an embodiment of the present invention;

[0032] Figure 6 is a structural diagram of another flexible filter provided by an embodiment of the present invention;

[0033] Figure 7 A circuit diagram of a flexible filter provided by an embodiment of the present invention;

[0034] Figure 8 is a structural diagram of another flexible filter provided by an embodiment of the present invention;

[0035] Figure 9 is a structural diagram of another flexible filter provided by an embodiment of the present invention;

[0036] Figure 10 This is a circuit diagram of another flexible filter provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0037] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0038] Figure 1 This is a schematic diagram of the structure of a resonator assembly provided by an embodiment of the present invention, with reference to Figure 1 The resonator assembly includes a flexible substrate 100 and a resonator layer 200 located on at least one side of the flexible substrate 100;

[0039] The resonator layer 200 includes at least one group of resonant units 210, each group of resonant units 210 includes at least two resonators 211 that support each other and are electrically connected to each other, and the angle between the arrangement direction of the resonators 211 and the surface of the flexible substrate 100 where the resonators 211 are located is greater than 0 degrees;

[0040] A cavity structure 300 is formed between the at least two mutually supporting resonators 211 of the resonance unit 210 and the flexible substrate 100 . A stress buffer structure 110 is formed on the surface of the flexible substrate 100 at a position corresponding to at least one of the cavity structures 300 .

[0041] The arrangement direction of the resonator 211 is the extension direction of the plane in which the multiple stacked structures included in the resonator 211 are located. Optionally, the resonator 211 includes a stacked lower electrode 2111, a piezoelectric layer 2112, and an upper electrode 2113. The two mutually supporting resonators 211 in the resonance unit 210 are electrically connected via their own lower electrodes 2111, that is, the two resonators 211 in the resonance unit 210 are connected in series. The arrangement direction of the resonator 211 is the direction of the plane in which the lower electrode 2111 is located, or the direction of the plane in which the piezoelectric layer 2112 is located, or the direction of the plane in which the upper electrode 2113 is located. The closer the angle between the arrangement direction of the resonator 211 and the surface of the flexible substrate 100 in which the resonator 211 is located is to 90 degrees, the smaller the layout area of ​​the resonator assembly is, which is more conducive to the miniaturization of the device. Compared to laying the resonator 211 directly on the flexible substrate 100, that is, the plane of the resonator 211 is parallel to the plane of the flexible substrate 100, in this embodiment, the angle between the orientation of the resonator 211 and the surface of the flexible substrate 100 where the resonator 211 is located is greater than 0 degrees, which can reduce the layout area of ​​the resonator assembly. The effective area of ​​the resonator 211 is related to the shape of the resonator. For example, when the resonator 211 is projected as a rectangle in its orientation, the effective area of ​​the resonator is determined by the length and width of the rectangle. The resonator can also have other shapes, which are not specifically limited in this embodiment.

[0042] When forming the resonant unit 210, a sacrificial layer may be deposited on the flexible substrate 100, and then the sacrificial layer may be etched to form a triangular shape as shown in the cavity structure 300. A lower electrode layer may be deposited on the etched sacrificial layer, and the lower electrode layer may be patterned to form a triangular shape as shown in the cavity structure 300. Figure 1 A piezoelectric material layer is deposited on the lower electrode 2111 and patterned to form a piezoelectric layer 2112. An upper electrode layer is deposited on the piezoelectric layer 2112 and patterned to form an upper electrode 2113. Finally, the sacrificial layer is released to form the resonant unit 210.

[0043] In the prior art, the resonator 211 is directly laid flat on the flexible substrate 100, and a cavity structure is required to be set between the flexible substrate 100 and the resonator 211. The cavity structure is an indispensable structure for the resonator to resonate. In this embodiment, after the resonator 211 is set, a cavity structure 300 will naturally form between the two mutually supporting resonators 211 and the flexible substrate 100. No additional setting is required, and the process is simpler. In addition, the substrate of the resonator component is a flexible substrate 100, which can improve the flexibility of the resonator component and buffer stress. Corresponding to the position of at least one cavity structure 300, the surface of the flexible substrate 100 has a stress buffer structure 110. Optionally, the stress buffer structure 110 on the surface of the flexible substrate 100 includes at least one groove on the surface of the flexible substrate 100. The stress buffer structure 110 can further release the stress on the resonator component, reduce the probability of damage to the resonator component due to stress, and improve the yield rate of the resonator component.

[0044] In this embodiment, the angle between the resonator's orientation and the surface of the flexible substrate on which the resonator resides is greater than 0 degrees. This reduces the area of ​​the resonator assembly relative to the flexible substrate's surface, facilitating device miniaturization. Furthermore, the flexible substrate enhances the resonator assembly's flexibility. The surface of the flexible substrate includes a stress buffer structure that releases stress, better accommodating potential deformation of the flexible substrate, improving the resonator assembly's stress resistance and yield.

[0045] Optionally, the first surface of the flexible substrate includes at least a protrusion, and the second surface of the flexible substrate includes at least a depression. In the thickness direction of the flexible substrate, the protrusion of the first surface corresponds to the depression of the second surface.

[0046] Continue to refer Figure 1 Optionally, the flexible substrate 100 is U-shaped, the first surface 101 serves as the raised portion 103 , and the second surface 102 serves as the recessed portion 104 .

[0047] The flexible substrate 100 includes two opposite surfaces, namely an upper surface and a lower surface. In this embodiment, a resonance unit 210 is provided on one side of the upper surface. The upper surface is referred to as the first surface 101 and the lower surface is referred to as the second surface 102. The first surface 101 is convex and the second surface 102 is concave.

[0048] Figure 2 A schematic diagram of the structure of another resonator assembly provided in an embodiment of the present invention, referring to Figure 2 Optionally, at least two groups of resonance units 210 are provided on one side surface of the flexible substrate 100 .

[0049] In this embodiment, two groups of resonance units 210 are provided on one side surface of the flexible substrate 100 . The upper electrodes 2113 of two adjacent groups of resonance units 210 can be connected by a connecting line, thereby realizing a series connection between the two adjacent groups of resonance units 210 .

[0050] Compared to at least two groups of resonant units 210 laid flat on one side of the flexible substrate 100, the angle between the orientation of the resonators 211 of the resonant units 210 in this embodiment and the surface of the flexible substrate 100 on which the resonators 211 are located is greater than 0 degrees. This reduces the area of ​​the resonant assembly along the surface of the flexible substrate 100, facilitating device miniaturization. Furthermore, a stress buffer structure 110 is provided between each resonant unit 210 and the flexible substrate 100, which relieves stress in the resonator assembly and improves the yield rate of the resonator assembly.

[0051] Continue to refer Figure 2 Optionally, both the first surface 101 and the second surface 102 include a protrusion 103 and a depression 104 , and in the thickness direction of the flexible substrate 100 , the depression 104 of the first surface 101 corresponds to the protrusion 103 of the second surface 102 .

[0052] The flexible substrate 100 includes two opposite surfaces, an upper surface and a lower surface. The upper surface can be a first surface 101 and the lower surface can be a second surface 102, or the upper surface can be the second surface 102 and the lower surface can be the first surface 101. In this embodiment, the upper surface is exemplarily shown as the first surface 101 and the lower surface is the second surface 102.

[0053] Figure 3 A schematic diagram of the structure of another resonator assembly provided in an embodiment of the present invention, referring to Figure 3 Optionally, a first resonator layer 201 is provided on the first surface 101 of the flexible substrate 100, and a second resonator layer 202 is provided on the second surface 102 of the flexible substrate 100. The first surface 101 and the second surface 102 are two opposite surfaces of the flexible substrate 100, and the resonance units 210 of the first resonator layer 201 and the resonance units 210 of the second resonator layer 202 are alternately arranged.

[0054] In this embodiment and the following embodiments, the first surface 101 and the second surface 102 of the flexible substrate 100 are exemplarily shown to include protrusions 103 and recesses 104 . In the thickness direction of the flexible substrate 100 , the recesses 104 on the first surface 101 correspond to the protrusions 103 on the second surface 102 .

[0055] In this embodiment, the upper surface of the flexible substrate 100 is exemplarily shown as the first surface 101, and the lower surface is exemplarily shown as the second surface 102. Furthermore, the first resonator layer 201 includes one resonant unit 210, and the second resonator layer 202 includes one resonant unit 210. The resonant units 210 of the first resonator layer 201 and the resonant units 210 of the second resonator layer 202 are arranged in an alternating manner. That is, the projections of the resonant units 210 of the first resonator layer 201 and the resonant units 210 of the second resonator layer 202 on the plane of the flexible substrate 100 do not overlap. This prevents the resonant units 210 on both sides of the flexible substrate 100 from interfering with each other during resonance, thereby reducing interference between the resonant units 210.

[0056] Continue to refer Figure 3 Optionally, the resonance unit 210 of the first resonator layer 201 is disposed on the raised portion 103 of the first surface 101 , and the resonance unit 210 of the second resonator layer 202 is disposed on the raised portion of the second surface 102 .

[0057] The recessed portions 104 and the raised portions 103 of the flexible substrate 100 are arranged in an alternating manner. Therefore, the resonant units 210 of the first resonator layer 201 are arranged on the raised portions 103 of the first surface 101, and the resonant units 210 of the second resonator layer 202 are arranged on the raised portions of the second surface 102. This allows the resonant units 210 located on the first surface 101 and the resonant units 210 located on the second surface 102 to be arranged in an alternating manner.

[0058] Figure 4 is a schematic structural diagram of another resonator assembly provided by an embodiment of the present invention, with reference to Figure 4 Optionally, the resonance unit 210 of the first resonator layer 201 is disposed in the recessed portion 104 of the first surface 101 , and the resonance unit 210 of the second resonator layer 202 is disposed in the recessed portion 104 of the second surface 102 .

[0059] In this embodiment, the resonant units 210 of the first resonator layer 201 are disposed on the raised portion 103 of the first surface 101, and the resonant units 210 of the second resonator layer 202 are disposed on the raised portion of the second surface 102; or the resonant units 210 of the first resonator layer 201 are disposed on the recessed portion 104 of the first surface 101, and the resonant units 210 of the second resonator layer 202 are disposed on the recessed portion 104 of the second surface 102. This allows the resonant units 210 located on different sides of the flexible substrate 100 to be staggered, thereby avoiding interference between the resonant units 210 during operation.

[0060] An embodiment of the present invention further provides a flexible filter, which includes the resonator assembly in any one of the above embodiments.

[0061] The beneficial effects of the flexible filter in this embodiment are the same as those of the resonator assembly, and are not described in detail herein.

[0062] Optionally, the flexible filter includes at least two resonator components, the resonator components are stacked, and the resonant units in at least two adjacent layers of the resonator components are electrically connected.

[0063] Each resonator assembly includes a flexible substrate. In the thickness direction of the flexible filter display, the resonator assemblies to which the two flexible substrates are closest can be referred to as adjacent resonator assemblies. After the resonant units in adjacent resonator assemblies are electrically connected, the resonant units can be connected in series or in parallel, and then combined with other structures such as inductors or capacitors to achieve the filtering effect of the flexible filter. Compared with different resonator assemblies laid out on the same plane, the stacked arrangement of the resonator assemblies in this embodiment can reduce the layout area of ​​the flexible filter, which is conducive to the miniaturization of the device.

[0064] Figure 5 This is a schematic diagram of the structure of a flexible filter provided by an embodiment of the present invention, with reference to Figure 5 Optionally, in at least two layers of resonator components, the resonator layer 200 is located on the same side of the flexible substrate 100 in the resonator component where it is located.

[0065] In this embodiment, a flexible filter is exemplarily shown to include two layers of resonator assemblies, each of which includes a resonant unit 210. One resonator assembly includes a first flexible substrate 1001 and a resonant unit 210, and the other resonator assembly includes a second flexible substrate 1002 and a resonant unit 210. The resonant unit 210 of the resonator assembly to which the first flexible substrate 1001 belongs is disposed on the first surface 101 of the first flexible substrate 1001, and the resonant unit 210 of the resonator assembly to which the second flexible substrate 1002 belongs is disposed on the first surface 101 of the second flexible substrate 1002. The resonant unit 210 of the resonator assembly to which the second flexible substrate 1002 belongs includes a first resonator 2101 and a second resonator 2102 interconnected by lower electrodes 2111. The resonant unit 210 of the resonator assembly to which the first flexible substrate 1001 belongs includes a third resonator 2103 and a fourth resonator 2104 electrically interconnected by the lower electrodes 2111. The resonant units 210 in the two-layer resonator assembly can be connected in series, that is, the upper electrode of the second resonator 2102 is electrically connected to the upper electrode of the third resonator 2103; or, the upper electrode of the second resonator 2102 is electrically connected to the upper electrode of the fourth resonator 2104.

[0066] The resonant units 210 in the two-layer resonator assembly can also be connected in parallel, with the upper electrode 2113 of the first resonator 2101 electrically connected to the upper electrode 2113 of the third resonator 2103, and the upper electrode 2113 of the second resonator 2102 electrically connected to the upper electrode 2113 of the fourth resonator 2104 (i.e. Figure 5 Alternatively, the upper electrode 2113 of the first resonator 2101 is electrically connected to the upper electrode 2113 of the fourth resonator 2104, and the upper electrode 2113 of the second resonator 2102 is electrically connected to the upper electrode 2113 of the third resonator 2103.

[0067] The resonators in the resonator assemblies on different layers are connected via connecting wires, and the connecting wires pass through the second flexible substrate 1002 .

[0068] Figure 6 A schematic diagram of another flexible filter structure provided by an embodiment of the present invention, referring to Figure 6 Optionally, in at least two adjacent resonator components, the resonator layers 200 are located on different sides of the flexible substrate 100 in the resonator components in which they are located.

[0069] This embodiment exemplifies a flexible filter comprising two adjacent layers of resonator assemblies. One resonator assembly comprises a first flexible substrate 1001 and a resonator layer 200, while the other adjacent resonator assembly comprises a second flexible substrate 1002 and a resonator layer 200. The resonator layer 200 of the resonator assembly to which the first flexible substrate 1001 belongs is located on the first surface 101 of the first flexible substrate 1001, while the resonator layer 200 of the resonator assembly to which the second flexible substrate 1002 belongs is located on the second surface 102 of the second flexible substrate 1002.

[0070] Continue to refer Figure 6 In adjacent layers of resonator assemblies, the resonator layer 200 of one resonator assembly includes at least two groups of resonant units 210, and the adjacent groups of resonant units 210 are electrically connected. The resonator layer 200 of another resonator assembly includes at least one group of resonant units 210. The resonator layers 200 of adjacent layers of resonator assemblies are arranged opposite to each other, and the resonant units 210 of adjacent layers of resonator layers 200 are arranged in an staggered manner. The distance between two adjacent layers of flexible substrates 100 is less than the sum of the thicknesses of the resonant units 210 in the two adjacent resonator layers 200.

[0071] In this embodiment, each resonator assembly includes three resonant units 210, and adjacent groups of resonant units 210 are electrically connected via upper electrodes 2113 and connecting wires. A gap structure 01 can be formed between two adjacent resonant units 210 located in the same resonator layer 200, and a resonant unit 210 of a resonator layer 200 adjacent to this resonator layer 200 can be partially located in this gap structure 01, so that the distance between two adjacent layers of flexible substrate 100 is less than the sum of the thicknesses of the resonant units 210 in the two adjacent layers of resonator 200, thereby reducing the overall thickness of the filter and facilitating the thinning of the device. At the same time, the angle between the setting direction of the resonator 211 and the surface of the flexible substrate 100 where the resonator 211 is located is greater than 0 degrees, which can reduce the area of ​​the resonator assembly in the direction of the surface of the flexible substrate 100, facilitating the miniaturization of the device. The flexible substrate 100 can improve the flexibility of the resonator component. The surface of the flexible substrate 100 has a stress buffer structure 110, which can release stress and better cooperate with the deformation that may occur in the flexible substrate 100, thereby improving the stress resistance and yield of the flexible filter.

[0072] refer to Figure 5 and Figure 6 Optionally, the flexible substrates 100 of adjacent layers of resonator components are bonded together via a bonding structure 400 . Figure 5 The resonator components in adjacent layers are electrically connected via the bonding structure 400 and the connecting wire 02 .

[0073] Continue to refer Figure 6 Optionally, in adjacent layers of resonator components, a group of resonant units 210 in one layer of resonator components and two adjacent groups of resonant units 210 in another layer of resonator components form a set resonant structure 500, and a vertical projection of a group of resonant units 210 in one layer of resonator components in the set resonant structure 500 on the other layer of resonator components is at least partially located between the two adjacent groups of resonant units 210 in the other layer of resonator components.

[0074] In the resonant structure 500, a vertical projection of a group of resonant units 210 in one layer of resonator components on another layer of resonator components is set to be at least partially located between two adjacent groups of resonant units 210 in the other layer of resonator components. This can reduce the impact of the resonance of two adjacent resonant units 210 in one layer of resonator components on the resonant units 210 in the other layer of resonator components.

[0075] The bonding structure 400 is made of a conductive material, and adjacent layers of resonator components can be electrically connected via the bonding structure 400 .

[0076] Optionally, the flexible filter of any embodiment of the present invention further includes a sealing ring, which is arranged between two adjacent flexible substrates. The two adjacent flexible substrates and the sealing ring therebetween form a sealing structure, and each resonator and bonding structure is located in the sealing structure.

[0077] Continue to refer Figure 6 Optionally, the resonant unit 210 of the resonator assembly is electrically connected to the bonding structure 400 via a connecting line 02 , and the shape of the connecting line 02 is a straight line, a curve, or a polygon.

[0078] Connecting wire 02 can be made of the same material as the upper electrode 2113 of resonator 211, meaning it can be fabricated on the same layer as the upper electrode 2113, thereby simplifying the filter fabrication process. Connecting wire 02 can be in the form of a straight line, a curve, or a polygon. Curving connecting wire 02 is less likely to break due to stress, thereby improving the stress resistance of the flexible filter.

[0079] Figure 7 A circuit diagram of a flexible filter provided by an embodiment of the present invention, Figure 7 The circuit diagram can correspond to Figure 6 The structural diagram of the flexible filter is shown in FIG. Figure 7 Only part of the circuit diagram of the flexible filter is shown, refer to Figure 6 and Figure 7 The upper electrode 2113 of the resonator 211 of a certain resonator layer 200 is electrically connected to the upper electrode 2113 of the resonator 211 of another resonator layer 200 of the same set resonant structure 500 through the bonding structure 400 and the connecting wire 02, thereby making the resonant units 210 located in different resonator layers 200 in the same set resonant structure 500 connected in parallel, and the resonant units 210 in adjacent set resonant structures 500 connected in series.

[0080] Figure 8 A schematic diagram of another flexible filter structure provided by an embodiment of the present invention, referring to Figure 8 Optionally, the flexible filter includes at least three layers of resonator components, and the vertical projections of the set resonant structures 500 located on both sides of the same flexible substrate 100 on the flexible substrate 100 do not overlap.

[0081] In this embodiment, the flexible filter includes three layers of resonator components, where the first layer of resonator components includes a first flexible substrate 1001, the second layer of resonator components includes a second flexible substrate 1002, and the third layer of resonator components includes a third flexible substrate 1003. Furthermore, the vertical projections of the set resonant structures 500 on both sides of the second flexible substrate 1002 in the middle layer on the second flexible substrate 1002 do not overlap. In other embodiments, the vertical projections of the set resonant structures 500 on both sides of the first flexible substrate 1001 on the first flexible substrate 1001 may not overlap, or the vertical projections of the set resonant structures 500 on both sides of the third flexible substrate 1003 on the third flexible substrate 1003 may not overlap.

[0082] The vertical projections of the set resonant structures 500 on two sides of the same flexible substrate 100 on the flexible substrate 100 do not overlap, thereby avoiding mutual influence between the resonant units 210 on two sides of the same flexible substrate 100 .

[0083] Figure 9 A schematic diagram of another flexible filter structure provided by an embodiment of the present invention, referring to Figure 9 Optionally, the resonator layers 200 in two adjacent layers of resonator components are arranged back to back, the flexible substrates 100 in the two adjacent layers of resonator components are connected through a conductive film 600, and the resonant unit 210 is electrically connected to the conductive film 600 through a connecting line 02 in the flexible substrate 100.

[0084] Each resonator component includes a flexible substrate. In the thickness direction of the flexible filter, the resonator components to which the two flexible substrates closest in distance belong can be referred to as two adjacent layers of resonator components. In this embodiment, it is exemplified that one layer of resonator components of the flexible filter includes a first flexible substrate 1001 and a resonator layer 200, and the adjacent resonator component includes a second flexible substrate 1002 and a resonator layer 200. The resonant unit 210 of the resonator component to which the first flexible substrate 1001 belongs is arranged on the second surface 102 of the first flexible substrate 1001, and the resonant unit 210 of the resonator layer 200 in the resonator component to which the second flexible substrate 1002 belongs is arranged on the first surface 101 of the second flexible substrate 1002.

[0085] In this embodiment, two flexible substrates 100 are included between the resonant units of adjacent layers of resonator assemblies, so that the mutual interference between the resonant units 210 between adjacent layers of resonator assemblies is small, and the projections of the resonant units of different layers of resonator assemblies in the thickness direction of the flexible substrate 100 can at least partially overlap, thereby further reducing the layout area of ​​the flexible filter, which is conducive to the miniaturization of the device. The angle between the setting direction of the resonator 211 and the surface of the flexible substrate 100 where the resonator 211 is located is greater than 0 degrees, which can reduce the area of ​​the resonator assembly in the direction of the surface of the flexible substrate 100, which is conducive to the miniaturization of the device. The stress buffer structure 110 can release stress, better cooperate with the possible deformation of the flexible substrate 100, and improve the stress resistance and yield of the flexible filter.

[0086] Figure 10 A circuit diagram of another flexible filter provided by an embodiment of the present invention, Figure 10 The circuit diagram can correspond to Figure 9 The structural diagram of the flexible filter is shown in FIG. Figure 10 Only part of the circuit diagram of the flexible filter is shown, refer to Figure 9 and Figure 10 The upper electrode 2113 of the resonator 211 of the resonator layer 200 of the resonator assembly to which the first flexible substrate 1001 belongs is electrically connected to the upper electrode 2113 of a resonator 211 of the resonator layer 200 of the resonator assembly to which the second flexible substrate 1002 belongs via the connecting wire 02 and the conductive film 600, thereby connecting the resonator units 210 located in different resonator layers 200 in parallel. At the same time, adjacent resonator units 210 located in the same resonator layer 200 are connected via the connecting wire 02 and the conductive film 600, thereby connecting the resonator units 210 located in the same resonator layer 200 in series.

[0087] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A resonator assembly, characterized in that comprising a flexible substrate and a resonator layer located on at least one side of the flexible substrate; The resonator layer includes at least one group of resonance units, each group of resonance units includes at least two resonators that support each other and are electrically connected to each other, and the angle between the arrangement direction of the resonators and the surface of the flexible substrate where the resonators are located is greater than 0 degrees; A cavity structure is formed between the at least two mutually supporting resonators of the resonant unit and the flexible substrate, and a stress buffer structure is provided on the surface of the flexible substrate at a position corresponding to at least one of the cavity structures, which can release stress and cooperate with the deformation of the flexible substrate to improve the stress resistance of the resonator assembly; The stress buffer structure on the surface of the flexible substrate comprises at least one groove on the surface of the flexible substrate; The resonator comprises a stacked lower electrode, a piezoelectric layer and an upper electrode, and the two resonators supporting each other in the resonance unit are electrically connected via their own lower electrodes; The first surface of the flexible substrate includes at least a protruding portion, and the second surface of the flexible substrate includes at least a recessed portion.

2. The resonator assembly according to claim 1, wherein At least two groups of the resonance units are provided on one side surface of the flexible substrate.

3. The resonator assembly according to claim 1, wherein A first resonator layer is provided on the first surface of the flexible substrate, and a second resonator layer is provided on the second surface of the flexible substrate. The first surface and the second surface are two opposite surfaces of the flexible substrate, and the resonant units of the first resonator layer and the resonant units of the second resonator layer are arranged alternately.

4. The resonator assembly according to any one of claims 1 to 3, characterized in that In a thickness direction of the flexible substrate, the raised portions of the first surface correspond to the recessed portions of the second surface.

5. The resonator assembly according to claim 4, characterized in that The flexible substrate is U-shaped, the first surface serves as the convex portion, and the second surface serves as the concave portion.

6. The resonator assembly according to claim 4, characterized in that The first surface and the second surface each include a convex portion and a concave portion, and in a thickness direction of the flexible substrate, the concave portion of the first surface corresponds to the convex portion of the second surface.

7. The resonator assembly according to claim 6, characterized in that The resonant unit of the first resonator layer is arranged on the convex portion of the first surface, and the resonant unit of the second resonator layer is arranged on the convex portion of the second surface; or the resonant unit of the first resonator layer is arranged on the concave portion of the first surface, and the resonant unit of the second resonator layer is arranged on the concave portion of the second surface.

8. A flexible filter, characterized in that: The resonator assembly comprises the resonator assembly according to any one of claims 1 to 7.

9. The flexible filter according to claim 8, characterized in that The invention comprises at least two resonator components, the resonator components are stacked, and the resonant units in at least two adjacent layers of the resonator components are electrically connected.

10. The flexible filter according to claim 9, characterized in that In at least two layers of the resonator assembly, the resonator layers are located on the same side of the flexible substrate in the resonator assembly where they are located.

11. The flexible filter according to claim 9, characterized in that In at least two adjacent resonator components, the resonator layers are located on different sides of the flexible substrate in the resonator components.

12. The flexible filter according to claim 11, characterized in that In the adjacent layers of the resonator assemblies, the resonator layer of one layer of the resonator assembly includes at least two groups of resonance units, and the adjacent groups of resonance units are electrically connected. The resonator layer of the other layer of the resonator assembly includes at least one group of resonance units. The resonator layers of the adjacent layers of the resonator assemblies are arranged relative to each other, and the resonance units of the adjacent layers of the resonator layers are arranged in an staggered manner. The distance between the two adjacent layers of the flexible substrate is less than the sum of the thicknesses of the resonance units in the two adjacent layers of the resonator layers.

13. The flexible filter according to claim 12, characterized in that The flexible substrates of adjacent layers of the resonator components are bonded together via a bonding structure.

14. The flexible filter according to claim 13, characterized in that In the resonator assemblies of adjacent layers, a group of the resonant units in one layer of the resonator assemblies and two adjacent groups of the resonant units in another layer of the resonator assemblies form a set resonant structure, and in the set resonant structure, a vertical projection of a group of the resonant units in one layer of the resonator assemblies on the other layer of the resonator assemblies is at least partially located between the two adjacent groups of the resonant units in the other layer of the resonator assemblies.

15. The flexible filter according to claim 14, characterized in that The resonator assembly comprises at least three layers, and vertical projections of the predetermined resonant structures on two sides of the same flexible substrate on the flexible substrate do not overlap.

16. The flexible filter according to claim 13, characterized in that The resonant unit of the resonator assembly is electrically connected to the bonding structure via a connecting wire, and the connecting wire is in a shape of a straight line, a curve or a polygon.

17. The flexible filter according to claim 11, characterized in that The resonator layers in two adjacent resonator assemblies are arranged back to back, the flexible substrates in the two adjacent resonator assemblies are connected via a conductive film, and the resonant units are electrically connected to the conductive film via connecting wires in the flexible substrates.

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