An etching device and its explosion-proof method

Abstract

The present invention belongs to the field of etching technology and discloses an etching device and an explosion-proof method thereof. The etching device includes an etching reaction box and a liquid storage tank. The liquid storage tank is connected to the etching reaction box via a liquid pipeline to form a circulation path. The liquid storage tank is provided with a heater, a cooling coil, and multiple temperature sensors. A drain pipe is provided at the bottom of the liquid storage tank, and a valve is provided on the drain pipe. The valve is configured to connect the drain pipe with the liquid storage tank to drain the etching liquid in the liquid storage tank when the production value preset by the etching device is reached or the temperature sensor alarm is triggered. The etching device forms a circulation loop between the etching reaction box and the liquid storage tank via the liquid pipeline, which can improve the utilization rate of the etching liquid and effectively monitor the temperature of the etching liquid. When the temperature of the etching liquid is abnormal or reaches the production value preset by the etching device, the etching liquid in the liquid storage tank can be discharged in time to prevent explosion.

Description

Technical Field

[0001] The present invention relates to the field of etching technology, and in particular to etching equipment and an explosion-proof method thereof. Background Art

[0002] Due to the advantages of copper wire manufacturing processes such as low resistance and low latency, signal addressing speeds are faster, scan lines are denser, and display quality is clearer. Currently, copper is commonly used instead of aluminum for the wires in large-scale thin-film transistor liquid crystal displays. The current copper wire etching process typically uses a hydrogen peroxide-based etching solution, which has the following problems when used: as the etching process continues, the concentration of copper ions in the etching solution continues to rise. The hydrogen peroxide undergoes chemical changes that accelerate its decomposition under the action of copper ions. Furthermore, as the copper wire etching process continues, the concentration of copper ions in the etching solution continues to increase, and the decomposition rate of hydrogen peroxide also becomes increasingly faster. The decomposition rate of hydrogen peroxide will increase dramatically, generating large amounts of gas and heat, which can easily cause the machine to explode.

[0003] Traditional copper etching equipment uses a temperature monitoring system to monitor the etching solution in real time. When the temperature exceeds a set point, the heater automatically shuts off, and the cooling coils activate to lower the temperature. However, when the etching equipment experiences an abnormality, the temperature can rise rapidly within a short period of time, making it difficult for the cooling coils to effectively lower the temperature, potentially leading to explosions.

[0004] Therefore, an etching device and an explosion-proof method thereof are urgently needed to solve the problems in the prior art. Summary of the Invention

[0005] The purpose of the present invention is to provide an etching device and an explosion-proof method thereof, which can solve the problem in the prior art that the etching solution temperature rises sharply during the etching process and the cooling coil cannot effectively cool it down, thereby causing explosion.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] An etching device, comprising:

[0008] Etching reaction box;

[0009] A liquid storage tank is connected to the etching reaction tank through a liquid pipeline to form a circulation path, and a heater is provided in the liquid storage tank to heat the etching liquid in the liquid storage tank;

[0010] The liquid storage tank is further provided with a cooling coil and a plurality of temperature sensors, wherein cooling water flows through the cooling coil, and the temperature sensors are configured to detect the temperature in the liquid storage tank;

[0011] A drain pipe is provided at the bottom of the liquid storage tank, and a valve is provided on the drain pipe. The valve is configured to connect the drain pipe with the liquid storage tank when the preset production value of the etching equipment is reached or the temperature sensor alarms, thereby draining the etching solution in the liquid storage tank.

[0012] Optionally, a copper ion monitor is provided on the liquid storage tank, and the copper ion monitor is used to detect the copper ion concentration of the etching solution.

[0013] Optionally, a pressure sensor is further provided on the liquid storage tank, and the pressure sensor is used to detect the pressure in the liquid storage tank.

[0014] Optionally, the position of the liquid inlet of the liquid pipeline connecting the etching reaction box and the liquid storage tank is higher than the position of the liquid outlet, so that the etching liquid flows back into the liquid storage tank.

[0015] Optionally, a plurality of ball valves are provided on the chemical solution pipeline, and an opening is provided on the ball body of the ball valve in the direction of flow of the etching chemical solution.

[0016] Optionally, a plurality of pipeline supports are provided on the liquid medicine pipeline, and the pipeline supports are used to support the liquid medicine pipeline.

[0017] An explosion-proof method for etching equipment, using the above-mentioned etching equipment, comprising:

[0018] heating the etching solution in the liquid storage tank by the heater, and when the temperature of the etching solution exceeds a first set value, the heater is automatically powered off, and cooling water is simultaneously introduced into the cooling coil disposed in the liquid storage tank to cool the etching solution;

[0019] When the temperature of the etching solution exceeds the first set value and is less than the second set value, pure water at room temperature is introduced into the liquid storage tank to mix the etching solution with the pure water at room temperature to reduce the temperature of the etching solution;

[0020] When the production value preset by the etching equipment is reached or the temperature of the etching solution exceeds the second set value, the valve is opened to drain the etching solution in the liquid storage tank.

[0021] Optionally, a copper ion monitor is provided in the liquid storage tank to detect the copper ion concentration in the liquid storage tank. If the copper ion concentration in the liquid storage tank exceeds a preset concentration within a preset time, the valve is opened to drain the etching solution in the liquid storage tank.

[0022] Optionally, a pressure relief pipeline is provided on the upper portion of the liquid storage tank, and the pressure relief pipeline is connected to a negative pressure exhaust fan, so that the liquid storage tank is in a negative pressure state;

[0023] When the negative pressure exhaust fan becomes abnormal and the pressure in the liquid storage tank exceeds the preset pressure, the power supply of the etching equipment is cut off, the etching process is stopped, the valve is opened, and the etching solution in the liquid storage tank is emptied.

[0024] Optionally, an excess liquid level overflow port is provided on the upper portion of the liquid storage tank, the excess liquid level overflow port is communicated with the drain pipe, and the diameter of the excess liquid level overflow port is twice that of the liquid inlet of the liquid storage tank.

[0025] Beneficial effects of the present invention:

[0026] The etching equipment provided by the present invention forms a circulation loop between the etching reaction box and the liquid storage tank through the liquid pipeline, which can improve the utilization rate of the etching liquid and effectively monitor the temperature of the etching liquid. A drain pipe is provided at the bottom of the liquid storage tank, and a valve is provided on the drain pipe. The valve can promptly empty the etching liquid in the liquid storage tank when the preset value of the etching equipment is reached or when the temperature sensor alarms, thereby preventing explosion and improving the safety factor in the etching process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 is a schematic diagram of the etching equipment provided by the present invention;

[0028] Figure 2 The process of the explosion-proof method of the etching equipment provided by the present invention is Figure 1 ;

[0029] Figure 3 The process of the explosion-proof method of the etching equipment provided by the present invention is Figure 2 .

[0030] In the picture:

[0031] 1. Etching reaction box;

[0032] 2. Liquid storage tank; 21. Drain pipe; 211. Valve; 2111. Manual valve; 2112. Pneumatic valve; 22. Over-liquid level overflow port; 23. Etching solution; 24. Room-temperature pure water;

[0033] 3. Liquid medicine pipeline; 31. Ball valve; 32. Pipeline bracket; 33. Uninterruptible power supply;

[0034] 4. Heater;

[0035] 5. Cooling coil;

[0036] 6. Temperature sensor;

[0037] 7. Copper ion monitor;

[0038] 8. Pressure relief line; 81. Pressure sensor. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0040] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0041] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0042] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are used to refer to positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate description and simplify operation, and are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0043] This embodiment provides an etching device, such as Figure 1As shown, the etching equipment includes an etching reaction box 1 and a liquid storage tank 2. The etching reaction box 1 and the liquid storage tank 2 are connected by a liquid pipeline 3 to form a circulation path. The etching liquid 23 circulates in the circulation path, which can improve the utilization rate of the etching liquid 23. The liquid storage tank 2 is equipped with a heater 4, a cooling coil 5, and multiple temperature sensors 6. The heater 4 is used to heat the etching liquid 23 to increase the etching speed. The multiple temperature sensors 6 are used to detect the temperature of the etching liquid 23. When the temperature of the etching liquid 23 reaches the preset temperature of any temperature sensor 6, cooling water is introduced into the cooling coil 5 to cool the etching liquid 23 and prevent the liquid storage tank 2 from exploding. A drain pipe 21 is provided at the bottom of the liquid storage tank 2, and a valve 211 is provided on the drain pipe 21. Under normal circumstances, the valve 211 is in a normally closed state. When the set value of the etching equipment is reached or the temperature of the etching solution 23 reaches the preset temperature of any temperature sensor 6, the valve 211 opens to discharge the etching solution 23 in the liquid storage tank 2 through the drain pipe 21 to prevent the liquid storage tank 2 from exploding.

[0044] Alternatively, as Figure 1 As shown, in this embodiment, three temperature sensors 6 are provided. One of the temperature sensors is a thermocouple type, which is used to monitor the temperature of the etching solution 23 in real time. The other two temperature sensors 6 are used for over-temperature protection, that is, when the temperature of the etching solution 23 exceeds a preset temperature, the power supply of the etching equipment is promptly cut off. Specifically, the temperature sensors 6 used for over-temperature protection are one mechanical temperature sensor and one thermocouple type temperature sensor, to prevent one temperature sensor 6 from failing and thus losing its protective effect.

[0045] like Figure 1 As shown, a normal temperature pure water adding pipe is provided on the upper part of the liquid storage tank 2. When the temperature of the liquid continues to rise, the cooling coil 5 cannot effectively cool the etching liquid 23. Normal temperature pure water 24 is added into the liquid storage tank 2 through the normal temperature pure water adding pipe. The normal temperature pure water 24 is mixed with the etching liquid 23 to further reduce the temperature of the etching liquid 23.

[0046] Optionally, a copper ion monitor 7 is provided on the liquid storage tank 2, which is used to detect the copper ion concentration of the etching solution 23. When the copper ion concentration in the etching solution 23 exceeds a preset copper ion concentration, the valve 211 opens to discharge the etching solution 23 in the liquid storage tank 2 through the drain pipe 21.

[0047] Alternatively, as Figure 1 As shown, a pressure sensor 81 is also provided in the liquid storage tank 2. The pressure sensor 81 can detect the pressure in the liquid storage tank 2. When the pressure in the liquid storage tank 2 exceeds a preset pressure value, the power supply of the electrical components in the etching equipment is cut off, the etching process is stopped, and the valve 211 is opened to discharge the etching solution 23 in the liquid storage tank 2 to prevent an explosion due to excessive pressure.

[0048] Alternatively, as Figure 1 As shown, the valve 211 in this embodiment includes a manual valve 2111 and a pneumatic valve 2112. The manual valve 2111 is in a normally open state, and the pneumatic valve 2112 is in a normally closed state. When the etching equipment reaches a preset production value, the preset production value includes production time or production quantity, or when the temperature, pressure or copper ion concentration in the liquid storage tank 2 is too high, the pneumatic valve 2112 opens and the etching solution 23 in the liquid storage tank 2 is drained through the drain pipe 21.

[0049] Alternatively, as Figure 1 As shown, the position of the liquid inlet of the liquid pipeline 3 between the etching reaction box 1 and the liquid storage tank 2 is higher than the position of the liquid outlet, so that the etching liquid 23 in the liquid pipeline 3 flows back into the liquid storage tank 2, preventing the etching liquid 23 from remaining in the liquid pipeline 3.

[0050] Optionally, a plurality of ball valves 31 are provided on the liquid medicine pipeline 3. The provision of the plurality of ball valves 31 can intercept the etching liquid 23 in sections according to actual production requirements. Furthermore, an opening is provided on the ball of the ball valve 31, and the opening is oriented in the direction of the flow of the etching liquid 23, which can ensure that when the ball valve 31 is closed, the etching liquid 23 remaining in the ball is connected to the liquid medicine pipeline 3, thereby preventing the etching liquid 23 from continuing to react in the ball and causing the ball valve 31 to explode. It is understandable that the ball valve 31 in the pipeline supplying from bottom to top is provided with an opening on the upper surface of the ball, and the ball valve 31 in the liquid medicine pipeline 3 discharging from top to bottom is provided with a hole on the lower surface of the ball, thereby reducing the accumulation of liquid inside the ball and thus reducing the risk of causing an explosion.

[0051] Alternatively, as Figure 1 As shown, a plurality of pipeline supports 32 are arranged at intervals on the liquid medicine pipeline 3. The pipeline supports 32 can support the liquid medicine pipeline 3 to prevent the pipeline from being deformed and the etching liquid 23 from remaining in the pipeline.

[0052] Optionally, the ball valves 31 in the liquid medicine pipeline 3 are all connected to an uninterruptible power supply 33 to prevent force majeure from causing the ball valves 31 to lose power and become ineffective, resulting in the ball valves 31 being unable to close in time.

[0053] This embodiment also provides an explosion-proof method for etching equipment, using the above-mentioned etching equipment, such as Figure 2As shown, the explosion-proof method of the etching equipment includes heating the etching solution 23 in the liquid storage tank 2 with a heater 4. When the temperature of the etching solution 23 exceeds a first set value, the heater 4 is automatically powered off, and cooling water is simultaneously introduced into the cooling coil 5 in the liquid storage tank 2 to cool the etching solution 23. When the temperature of the etching solution 23 exceeds the first set value and is less than a second set value, room-temperature pure water 24 is introduced into the liquid storage tank 2, and the room-temperature pure water 24 is mixed with the etching solution 23 to reduce the temperature of the etching solution 23. When the preset production value of the etching equipment is reached or the temperature of the etching solution 23 exceeds the second set value, the valve 211 is opened to empty the etching solution 23 in the liquid storage tank 2 to prevent the temperature of the etching solution 23 from continuing to rise, causing the liquid storage tank 2 to explode.

[0054] The explosion-proof method for etching equipment provided in this embodiment can effectively monitor the temperature of the etching solution 23 and take multiple measures to cool the etching solution 23 in time when the temperature is too high, thereby preventing the etching solution 23 from exploding.

[0055] Alternatively, as Figure 3 As shown, a copper ion monitor 7 is provided in the liquid storage tank 2 for detecting the copper ion concentration of the etching solution 23 in the liquid storage tank 2. If the copper ion concentration exceeds a preset concentration within a preset time, the valve 211 is opened to drain the etching solution 23 in the liquid storage tank 2.

[0056] Alternatively, as Figure 1 and Figure 3 As shown, a pressure relief pipe 8 is provided on the upper part of the liquid storage tank 2, and the pressure relief pipe 8 is connected to the negative pressure exhaust fan, so that the liquid storage tank 2 is in a negative pressure state. When the negative pressure exhaust fan malfunctions and the pressure in the liquid storage tank 2 exceeds the preset pressure, the power supply of the etching equipment is promptly cut off, the etching process is stopped, and the valve 211 is opened to drain the etching solution 23 in the liquid storage tank 2.

[0057] Optionally, an over-liquid level overflow port 22 is provided at the upper part of the liquid storage tank 2, the over-liquid level overflow port 22 is connected to the drain pipe 21, and the diameter of the over-liquid level overflow port 22 is twice that of the liquid inlet of the liquid storage tank 2, to ensure that when the liquid level of the etching solution 23 in the liquid storage tank 2 continues to rise, the etching solution 23 can be discharged from the liquid storage tank 2 in time through the over-liquid level overflow port 22.

[0058] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. An etching device, characterized in that: include: Etching reaction box (1); A liquid storage tank (2) is connected to the etching reaction tank (1) through a liquid medicine pipeline (3) to form a circulation path. A heater (4) is provided in the liquid storage tank (2), and the heater (4) can heat the etching liquid (23) in the liquid storage tank (2); A cooling coil (5) and a plurality of temperature sensors (6) are further provided in the liquid storage tank (2); cooling water flows through the cooling coil (5); and the temperature sensors (6) are configured to detect the temperature in the liquid storage tank (2); When the temperature of the etching solution (23) exceeds a first set value, the heater (4) is automatically powered off, and cooling water is simultaneously introduced into the cooling coil (5) disposed in the liquid storage tank (2); When the temperature of the etching solution (23) exceeds the first set value and is less than the second set value, pure water (24) at normal temperature is introduced into the liquid storage tank (2); A drain pipe (21) is provided at the bottom of the liquid storage tank (2), and a valve (211) is provided on the drain pipe (21). The valve (211) is configured to connect the drain pipe (21) with the liquid storage tank (2) and drain the etching liquid (23) in the liquid storage tank (2) when the temperature reaches a preset production value of the etching equipment or the temperature sensor (6) detects that the temperature of the etching liquid (23) exceeds the second set value.

2. The etching device according to claim 1, characterized in that A copper ion monitor (7) is provided on the liquid storage tank (2), and the copper ion monitor (7) is used to detect the copper ion concentration of the etching solution (23).

3. The etching equipment according to claim 1, characterized in that The liquid storage tank (2) is also provided with a pressure sensor (81), and the pressure sensor (81) is used to detect the pressure in the liquid storage tank (2).

4. The etching equipment according to claim 1, characterized in that The position of the liquid inlet of the liquid pipeline (3) connecting the etching reaction box (1) and the liquid storage box (2) is higher than the position of the liquid outlet, so that the etching liquid (23) flows back into the liquid storage box (2).

5. The etching device according to any one of claims 1 to 4, characterized in that: A plurality of ball valves (31) are provided on the liquid medicine pipeline (3), and an opening is provided on the ball body of the ball valve (31) in the direction of flow of the etching liquid medicine (23).

6. The etching device according to any one of claims 1 to 4, characterized in that: A plurality of pipeline supports (32) are provided on the liquid medicine pipeline (3), and the pipeline supports (32) are used to support the liquid medicine pipeline (3).

7. An explosion-proof method for etching equipment, using the etching equipment according to any one of claims 1 to 6, characterized in that: include: The heater (4) is used to heat the etching solution (23) in the liquid storage tank (2); when the temperature of the etching solution (23) exceeds a first set value, the heater (4) is automatically powered off, and cooling water is simultaneously introduced into the cooling coil (5) disposed in the liquid storage tank (2) to cool the etching solution (23); When the temperature of the etching solution (23) exceeds the first set value and is less than the second set value, pure water (24) at normal temperature is introduced into the liquid storage tank (2), and the etching solution (23) is mixed with the pure water (24) at normal temperature to reduce the temperature of the etching solution (23); When the production value preset by the etching equipment is reached or the temperature of the etching solution (23) exceeds the second set value, the valve (211) is opened to drain the etching solution (23) in the liquid storage tank (2).

8. The explosion-proof method for etching equipment according to claim 7, characterized in that: A copper ion monitor (7) is provided on the liquid storage tank (2) for detecting the copper ion concentration in the liquid storage tank (2). If the copper ion concentration in the liquid storage tank (2) exceeds a preset concentration within a preset time, the valve (211) is opened to drain the etching solution (23) in the liquid storage tank (2).

9. The explosion-proof method for etching equipment according to claim 7, characterized in that: A pressure relief pipeline (8) is provided on the upper portion of the liquid storage tank (2), and the pressure relief pipeline (8) is connected to a negative pressure exhaust fan, so that the liquid storage tank (2) is in a negative pressure state; When the negative pressure exhaust fan malfunctions and the pressure in the liquid storage tank (2) exceeds a preset pressure, the power supply of the etching device is cut off, the etching process is stopped, the valve (211) is opened, and the etching solution (23) in the liquid storage tank (2) is emptied.

10. The explosion-proof method for etching equipment according to claim 7, characterized in that: An over-liquid-level overflow port (22) is provided on the upper portion of the liquid storage tank (2), the over-liquid-level overflow port (22) being in communication with the liquid discharge pipe (21), and the diameter of the over-liquid-level overflow port (22) being twice that of the liquid inlet of the liquid storage tank (2).

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