Cutting device for precise semiconductor equipment part machining

Abstract

The utility model discloses a cutting device for precise semiconductor equipment part machining, which comprises a machining table, a cutting cooling device is mounted on the machining table, and a part limiting device is fixedly mounted on the end face of the machining table. The cutting cooling device is installed, the liquid storage tank of the cutting liquid is arranged below the machining table, the cutting liquid can be sprayed out from the spray head through the liquid pump, cooling is carried out when a part is cut, thermal deformation and abrasion of a cutter can be reduced, the machining quality is improved, the service life of the cutter is prolonged, and the machining efficiency is improved. In addition, the used cutting fluid can flow into the fluid storage tank again through a filter plate, a filter screen is arranged in the fluid storage tank, chippings doped in the cutting fluid can be filtered, a part limiting device is installed, the position of each moving block can be adjusted according to the size of a part, the part is pressed through a pressing plate to be limited, and therefore the cutting fluid can be conveniently and rapidly cut. And the nuts arranged up and down are used for fastening, so that the stability of part limiting is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of parts processing, in particular to a cutting device for processing parts of precision semiconductor equipment. Background Art

[0002] Semiconductor equipment is the production equipment required for the production of various semiconductor products, and also includes the machinery and equipment required for the production of semiconductor raw materials. It is a supporting link in the semiconductor industry chain. The parts used in its semiconductor equipment need to be cut during the processing process and cut into the required size and scraps.

[0003] The prior art has a publication number of CN219381118U. The technical solution disclosed in this patent document is as follows: a cutting device for semiconductor parts processing, including a workbench. The utility model can recycle the debris generated during cutting through the cooperation of an air pump, a first dust hood, a telescopic hose, a second motor, a threaded rod and a second dust hood, thereby reducing pollution to the surrounding environment and ensuring the life and health of the staff.

[0004] The above patent uses an electric push rod to make the limit rod rest on the part to limit the part, but the single limit block has a poor positioning effect on the part, and cutting is also required, which has a vibration effect. In addition, the above patent does not have a cooling structure. When cutting is performed, high temperature is generated due to friction, which causes problems such as burning and cracking of the parts, thereby reducing the quality of part processing. Utility Model Content

[0005] The purpose of the present invention is to provide a cutting device for processing precision semiconductor equipment parts to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: a cutting device for processing precision semiconductor equipment parts, comprising a processing table, a cutting cooling device installed on the processing table, and a parts limiting device fixedly installed on the end surface of the processing table.

[0007] The cutting cooling device comprises a cutting fluid cooling component, which is arranged below the processing table. The cutting components are slidably mounted on the front and rear outer walls of the processing table.

[0008] The part limiting device includes a filter plate, which is fixedly connected to the inner wall of the processing table. Slide grooves are provided around the filter plate, and limiting components are slidably installed in the slide grooves.

[0009] As a further preferred embodiment of the present technical solution, a support is fixedly connected to the bottom side of the processing table, and a guide rail is provided on the front and rear outer walls of the processing table.

[0010] As a further preferred embodiment of the present technical solution, the cutting fluid cooling assembly includes a liquid storage tank, which is arranged on a support, a liquid inlet pipe is provided on the front side of the liquid storage tank, a box door is provided on one side of the liquid storage tank, a filter is fixedly connected to the inner wall of the liquid storage tank and is in an inclined state, a lower hopper is fixedly connected to the top side of the liquid storage tank, and the lower hopper is connected to the processing table.

[0011] In the above technical solution, the used cutting fluid can flow back into the fluid storage tank through the filter plate, and a filter screen is provided in the fluid storage tank to filter out debris mixed in the cutting fluid.

[0012] As a further preferred embodiment of the present technical solution, a liquid pump is provided at the liquid outlet end of the liquid storage tank, a connecting pipe is provided at the liquid outlet end of the liquid pump, and a nozzle is fixedly connected to the other end of the connecting pipe.

[0013] In the above technical solution, the cutting fluid can be sprayed out from the nozzle by a liquid pump, thereby cooling the parts while they are being cut.

[0014] As a further preferred embodiment of the present technical solution, the cutting assembly includes a bracket, the bracket is slidably connected in the guide rail 1, the top side of the bracket is fixedly connected to the top plate, and the bottom side of the top plate is provided with the guide rail 2.

[0015] As a further preferred embodiment of the present technical solution, a slider is slidably connected to the inner side of the guide rail 2, an electric push rod is installed on the bottom side of the slider, a motor is installed on the output end of the electric push rod, a cutter is fixedly connected to the output end of the motor, and the nozzle is arranged next to the motor.

[0016] As a further preferred embodiment of the present technical solution, the limiting assembly includes a moving block, which is slidably connected in a slide groove, and a screw is fixedly connected to the moving block. The outer walls of the screw are sleeved with a pressure plate, and the upper and lower sides of the outer walls of the screw are threadedly connected with nuts, and the two nuts are respectively located above and below the pressure plate.

[0017] In the above technical solution, the position of each moving block can be adjusted according to the size of the part, and the part can be pressed by the pressure plate to limit it, and tightened by the nuts set up above and below to improve the stability of the part's limitation.

[0018] The utility model provides a cutting device for processing precision semiconductor equipment parts, which has the following beneficial effects:

[0019] (1) The utility model installs a cutting cooling device and sets a cutting fluid storage tank under the processing table. The cutting fluid can be sprayed out from the nozzle through a liquid pump, thereby cooling the parts when cutting, reducing the temperature of the cutting area, preventing the parts and the cutter from overheating, and thus reducing thermal deformation and cutter wear, thereby improving the processing quality and the service life of the cutter. In addition, the used cutting fluid can flow back into the storage tank through the filter plate, and a filter screen is set in the storage tank to filter the debris mixed in the cutting fluid. The debris can be rolled out by opening the box door later, which is convenient for disposal.

[0020] (2) The present invention can adjust the position of each moving block according to the size of the part by installing a part limiting device, and press the part by a pressure plate to limit it, and tighten it by nuts set up above and below, thereby improving the stability of the part limitation. Compared with fixing the part by a single limiting block, it is more effective. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the utility model;

[0023] Figure 3 It is an enlargement of Figure A of the present utility model;

[0024] Figure 4 This is a schematic structural diagram of the cutting assembly of the utility model;

[0025] In the figure: 1. Processing table; 11. Support; 12. Guide rail 1; 2. Cutting cooling device; 3. Part limiting device; 21. Cutting fluid cooling assembly; 22. Cutting assembly; 211. Liquid storage tank; 212. Liquid inlet pipe; 213. Box door; 214. Filter screen; 215. Lower hopper; 216. Liquid pump; 217. Connecting pipe; 218. Nozzle; 221. Bracket; 222. Top plate; 223. Slider; 224. Motor; 225. Cutter; 226. Electric push rod; 31. Filter plate; 32. Slide; 33. Limiting assembly; 331. Moving block; 332. Screw; 333. Pressing plate; 334. Nut. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0027] The utility model provides a technical solution: Figure 1As shown, in this embodiment, a cutting device for processing parts of precision semiconductor equipment includes a processing table 1, a cutting cooling device 2 is installed on the processing table 1, a part limiting device 3 is fixedly installed on the end face of the processing table 1, a support 11 is fixedly connected to the bottom side of the processing table 1, and a guide rail 12 is provided on the front and rear outer walls of the processing table 1.

[0028] like Figure 2 and Figure 4 As shown, the cutting cooling device 2 includes a cutting fluid cooling component 21, which is arranged under the processing table 1, and a cutting component 22 is slidably installed on the front and rear outer walls of the processing table 1. The cutting fluid cooling component 21 includes a liquid storage tank 211, which is arranged on the support 11, and a liquid inlet pipe 212 is provided on the front side of the liquid storage tank 211, and a box door 213 is provided on one side of the liquid storage tank 211. The inner wall of the liquid storage tank 211 is fixedly connected with a filter screen 214, and is in an inclined state. The top side of the liquid storage tank 211 is fixedly connected with a lower hopper 215, and the lower hopper 215 is connected to the processing table 1. A liquid pump 216 is provided at the liquid outlet end of the liquid storage tank 211, and a connecting pipe 217 is provided at the liquid outlet end of the liquid pump 216. The other end of the connecting pipe 217 is fixedly connected with a nozzle 218. The cutting component 22 includes a bracket 221, which is slidably connected in the guide rail 12, and the top side of the bracket 221 is fixedly connected with the top plate 2 22. A guide rail 2 is provided on the bottom side of the top plate 222, and a slider 223 is slidably connected in the guide rail 2. An electric push rod 226 is installed on the bottom side of the slider 223, and a motor 224 is installed on the output end of the electric push rod 226. The nozzle 218 is arranged next to the motor 224. A cutting cooling device 2 is installed, and a cutting fluid storage tank 211 is provided under the processing table 1. The cutting fluid can be sprayed out from the nozzle 218 through the liquid pump 216, and then the parts are cooled when being cut, thereby reducing the temperature of the cutting area and preventing the parts and the cutter from overheating, thereby reducing thermal deformation and cutter wear, improving processing quality and cutter service life. In addition, the used cutting fluid can flow back into the liquid storage tank 211 through the filter plate 31, and a filter screen 214 is provided in the liquid storage tank 211, which can filter the debris mixed in the cutting fluid. The debris can be rolled out by opening the box door 213 later, which is convenient for disposal.

[0029] like Figure 2 and Figure 3When the locking cam 331 is unlocked, the locking cam 332 is unlocked and the locking cam 333 is unlocked, so that the locking cam 333 can be unlocked.

[0030] The present invention provides a cutting device for processing parts of precision semiconductor equipment, and its specific working principle is as follows: the part is placed in the middle of the filter plate 31, the movable block 331 is adjusted in the slide groove 32 according to the size of the part, and the pressure plate 333 is moved to press it on the part, and then the upper and lower nuts 334 are tightened to tighten it; when cutting, the bracket 221 and the slider 223 are slid according to the position to be cut, and the cutter 225 is positioned on the part by the electric push rod 226, and the motor 224 is started to cut the part; and in order to prevent the high temperature generated by friction from affecting the part during cutting, the liquid pump 216 is started to spray the cutting fluid in the liquid storage tank 211 from the nozzle 218, and the used cutting fluid flows back into the liquid storage tank 211 through the filter plate 31, and the debris carried by the cutting fluid can be filtered out by the filter screen 214, and the debris can be rolled down by opening the box door 213.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cutting device for processing precision semiconductor equipment parts, comprising a processing table (1), characterized in that: A cutting cooling device (2) is installed on the processing table (1), and a part limiting device (3) is fixedly installed on the end surface of the processing table (1); The cutting cooling device (2) comprises a cutting fluid cooling component (21), the cutting fluid cooling component (21) being arranged below the processing table (1), and the cutting components (22) being slidably mounted on the front and rear outer walls of the processing table (1); The part limiting device (3) comprises a filter plate (31), the filter plate (31) being fixedly connected to the inner wall of the processing table (1), the filter plate (31) being provided with sliding grooves (32) around the periphery, and the limiting components (33) being slidably installed in the sliding grooves (32).

2. A cutting device for processing precision semiconductor equipment parts according to claim 1, characterized in that: A support (11) is fixedly connected to the bottom side of the processing table (1), and a guide rail (12) is provided on the front and rear outer walls of the processing table (1).

3. The cutting device for processing precision semiconductor equipment parts according to claim 1, characterized in that: The cutting fluid cooling assembly (21) comprises a liquid storage tank (211), the liquid storage tank (211) being arranged on a support (11), a liquid inlet pipe (212) being arranged on the front side of the liquid storage tank (211), a box door (213) being arranged on one side of the liquid storage tank (211), a filter screen (214) being fixedly connected to the inner wall of the liquid storage tank (211) and being in an inclined state, a lower hopper (215) being fixedly connected to the top side of the liquid storage tank (211), and the lower hopper (215) being connected to the processing table (1).

4. A cutting device for processing precision semiconductor equipment parts according to claim 3, characterized in that: A liquid pump (216) is provided at the liquid outlet end of the liquid storage tank (211), a connecting pipe (217) is provided at the liquid outlet end of the liquid pump (216), and a nozzle (218) is fixedly connected to the other end of the connecting pipe (217).

5. The cutting device for processing precision semiconductor equipment parts according to claim 1, characterized in that: The cutting assembly (22) comprises a bracket (221), the bracket (221) is slidably connected in the guide rail 1 (12), a top plate (222) is fixedly connected to the top side of the bracket (221), and a guide rail 2 is provided on the bottom side of the top plate (222).

6. A cutting device for processing precision semiconductor equipment parts according to claim 5, characterized in that: A slider (223) is slidably connected in the guide rail 2, an electric push rod (226) is installed on the bottom side of the slider (223), a motor (224) is installed on the output end of the electric push rod (226), a cutter (225) is fixedly connected to the output end of the motor (224), and the nozzle (218) is arranged next to the motor (224).

7. The cutting device for processing precision semiconductor equipment parts according to claim 1, characterized in that: The limiting assembly (33) includes a moving block (331), each of the moving blocks (331) is slidably connected in the slide groove (32), each of the moving blocks (331) is fixedly connected with a screw rod (332), the outer wall of each of the screw rods (332) is sleeved with a pressure plate (333), and the upper and lower sides of the outer wall of each of the screw rods (332) are threadedly connected with nuts (334), and the two nuts (334) are respectively located above and below the pressure plate (333).

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