Rotating shaft sealing device and semiconductor substrate processing device using the same

Abstract

The present invention discloses a rotating shaft sealing device. According to an embodiment of the present invention, the rotating shaft sealing device is installed in a semiconductor substrate processing device for rotating a semiconductor loading unit for accommodating a semiconductor substrate and processing the semiconductor substrate, and includes: a hollow housing installed in the semiconductor substrate processing device; a rotating shaft accommodated in the housing and connected to the semiconductor loading unit to transmit a rotational force to the semiconductor loading unit; a bearing supporting the rotating shaft so that the rotating shaft can rotate in the housing; a sealing part having a plurality of sealing members for sealing a gap between the housing and the rotating shaft; and a power transmission part installed at one end of the rotating shaft and transmitting a rotational force to the rotating shaft.

Description

Technical Field

[0001] The present invention relates to a rotary shaft sealing device and a semiconductor substrate processing device using the same, and to a rotary shaft sealing device for preventing fluid from leaking between a rotary shaft and a housing and a semiconductor substrate processing device having the same. Background Art

[0002] Semiconductor devices are used to mass-produce integrated circuits. In order to deposit a film of a predetermined thickness on a substrate such as a semiconductor wafer or glass, physical vapor deposition (PVD) such as sputtering and chemical vapor deposition (CVD) using chemical reactions are used. Chemical vapor deposition methods include atmospheric pressure chemical vapor deposition (APCVD), low pressure chemical vapor deposition (LPCVD), plasma organic chemical vapor deposition (Plasma Enhanced CVD), etc. In addition, furnace equipment for substrate heat treatment is used for film formation, oxidation, annealing and impurity diffusion treatment of semiconductor wafers.

[0003] In such semiconductor equipment, a rotary shaft sealing device of a vacuum pressure device is used. The rotary shaft sealing device is provided on an outer peripheral surface facing a high pressure area and a low pressure area and rotating between them to seal the high pressure area and the low pressure area from each other.

[0004] A conventional sealing device for vacuum pressure equipment includes a housing and a rotating shaft coupled through the housing. The rotating shaft faces a high pressure area and a low pressure area, and the housing is located at the junction of the high pressure area and the low pressure area. In addition, a sealing member for sealing is provided between the housing and the rotating shaft. The sealing member for sealing is used to seal the gap between the housing and the rotating shaft, so friction is also generated between the rotating shaft and the sealing member.

[0005] In such a sealing device, it is necessary to prevent foreign matter from flowing into the semiconductor vacuum pressure device, or conversely, to prevent foreign matter from flowing from the semiconductor vacuum pressure device. Summary of the invention

[0006] Technical issues to be solved

[0007] An object of an embodiment of the present invention is to provide a rotary shaft sealing device and a semiconductor substrate processing device using the same, which do not require a separate lubricating oil supply, thereby making the structure very simple.

[0008] In addition, the purpose of the embodiment of the present invention is to minimize the vibration of the rotating shaft of the rotating shaft sealing device, prevent foreign matter such as particles from the semiconductor substrate processing device from flowing into the rotating shaft sealing device, and prevent foreign matter from the rotating shaft sealing device from leaking into the semiconductor substrate processing device.

[0009] The problems to be solved in the embodiments are not limited to the above problems, and those skilled in the art can clearly understand other problems not mentioned herein from the following description.

[0010] Technical methods to solve problems

[0011] According to an embodiment of the present invention, a rotating shaft sealing device is installed in a semiconductor substrate processing device for rotating a semiconductor loading unit for accommodating a semiconductor substrate and processing the semiconductor substrate, and may include: a hollow shell installed in the semiconductor substrate processing device; a rotating shaft accommodated in the shell and connected to the semiconductor loading unit to transmit the rotational force to the semiconductor loading unit; a bearing supporting the rotating shaft so that the rotating shaft can rotate in the shell; a sealing part having a plurality of seals arranged in the shell to seal the gap between the shell and the rotating shaft; and a power transmission part installed at one end of the rotating shaft and transmitting the rotational force to the rotating shaft.

[0012] Also, the sealing portion may be disposed at an upper portion of the bearing so as to be closer to a flange portion of the housing coupled to the semiconductor substrate processing apparatus, and the power transmission portion may be disposed at a lower portion of the bearing.

[0013] Furthermore, the sealing part includes: one or more vacuum seals for maintaining the vacuum of the semiconductor substrate processing device; and one or more elastic seals for supporting the rotating shaft and suppressing vibration, and the vacuum seals and the elastic seals can be made of plastic material, and the elastic seal can have greater elastic force than the vacuum seal.

[0014] Furthermore, the vacuum seal may be a lip seal having an arc-shaped lip formed on the inner circumference of an annular seal, and the elastic seal may be an elastic member inserted into the interior of a seal body.

[0015] Furthermore, an annular rotation preventing member may be provided on the outer peripheral surfaces of the vacuum seal and the elastic seal facing the housing to prevent the vacuum seal and the elastic seal from rotating relative to the housing in the housing.

[0016] Furthermore, the vacuum seal and the elastic seal are arranged adjacent to each other in series, the vacuum seal may be arranged closer to a flange portion of the housing coupled to the semiconductor substrate processing device than the elastic seal, and the elastic seal may be closer to the bearing than the vacuum seal.

[0017] Furthermore, when the interior of the semiconductor substrate processing apparatus is pressurized, the sealing portion may further include a pressure seal for preventing foreign matter from flowing from the semiconductor substrate processing apparatus into the interior.

[0018] Furthermore, a labyrinth seal for preventing foreign matter from the semiconductor substrate processing apparatus from flowing into the housing may be provided on the upper portion of the sealing portion.

[0019] Also, the housing may include a cooling water jacket disposed around the sealing portion to cool the sealing portion.

[0020] Furthermore, the housing may include: a purge gas inlet channel disposed in the housing to prevent foreign matter from the semiconductor substrate processing device from flowing into the housing; and a purge gas inlet disposed on a side of the housing to introduce purge gas from the outside through the purge gas inlet channel.

[0021] Furthermore, a labyrinth seal for preventing foreign matter from the semiconductor substrate processing device from flowing into the housing may be provided on the upper portion of the sealing portion, and the purge gas moving through the purge gas inlet channel may be supplied to the semiconductor substrate processing device through the labyrinth seal.

[0022] According to an embodiment of the present invention, a semiconductor substrate processing device for processing semiconductor substrates may include: a process tube, which accommodates a plurality of semiconductor substrates inside; a semiconductor loading unit, which is configured to be able to rise and fall in the process tube; a nozzle unit, which is arranged on the inner side of the process tube to inject process gas; a sealing cap, which is connected to the semiconductor loading unit and seals the lower part of the process tube; and a rotating shaft sealing device, which performs a sealing function while rotating the semiconductor loading unit, wherein the rotating shaft sealing device may include: a hollow shell, which is installed on the sealing cap; a rotating shaft, which is accommodated in the shell and connected to the semiconductor loading unit to transmit the rotational force to the semiconductor loading unit; a bearing, which supports the rotating shaft so that the rotating shaft can rotate in the shell; a sealing part, which has a plurality of seals that seal the gap between the shell and the rotating shaft; and a power transmission part, which is installed at one end of the rotating shaft and transmits the rotational force to the rotating shaft.

[0023] Also, the sealing portion may be disposed at an upper portion of the bearing so as to be closer to a flange portion of the housing coupled with the sealing cap, and the power transmission portion may be disposed at a lower portion of the bearing.

[0024] Furthermore, the sealing part includes: one or more vacuum seals for maintaining the vacuum of the process tube; and one or more elastic seals for supporting the rotating shaft and suppressing vibration. The vacuum seals and the elastic seals can be made of plastic material, and the elastic seals can have greater elastic force than the vacuum seals.

[0025] Furthermore, the vacuum seal may be a lip seal having an arc-shaped lip formed on the inner circumference of an annular seal, and the elastic seal may be an elastic member inserted into the interior of a seal body.

[0026] Furthermore, an annular rotation preventing member may be provided on the outer peripheral surfaces of the vacuum seal and the elastic seal facing the housing to prevent the vacuum seal and the elastic seal from rotating relative to the housing in the housing.

[0027] Furthermore, the vacuum seal and the elastic seal are arranged adjacent to each other in series, the vacuum seal may be arranged closer to a flange portion of the housing coupled to the semiconductor substrate processing device than the elastic seal, and the elastic seal may be closer to the bearing than the vacuum seal.

[0028] Furthermore, when the interior of the semiconductor substrate processing apparatus is pressurized, the sealing portion may further include a pressure seal for preventing foreign matter from flowing from the semiconductor substrate processing apparatus into the interior.

[0029] Furthermore, a labyrinth seal for preventing foreign matter from the semiconductor substrate processing apparatus from flowing into the housing may be provided on the upper portion of the sealing portion.

[0030] Also, the housing may include a cooling water jacket disposed around the sealing portion to cool the sealing portion.

[0031] Furthermore, the housing may include: a purge gas inlet channel disposed in the housing to prevent foreign matter from the semiconductor substrate processing device from flowing into the housing; and a purge gas inlet disposed on a side of the housing to introduce purge gas from the outside through the purge gas inlet channel.

[0032] Furthermore, a labyrinth seal for preventing foreign matter from the semiconductor substrate processing device from flowing into the housing may be provided on the upper portion of the sealing portion, and the purge gas moving through the purge gas inlet channel may be supplied to the semiconductor substrate processing device through the labyrinth seal.

[0033] Effects of the Invention

[0034] According to the rotary shaft sealing device and the semiconductor substrate processing device using the same according to the embodiment of the present invention, the friction force can be minimized by making the sealing part and the rotating object in line contact, so that a separate lubricating oil supply is not required, thereby making the structure very simple.

[0035] In addition, it is possible to minimize the vibration of the rotating shaft of the rotating shaft sealing device and prevent foreign matter such as particles from the semiconductor substrate processing device from flowing into the rotating shaft sealing device.

[0036] In addition, since the rotary shaft sealing device includes a cooling water jacket, the temperature of the sealing portion can be maintained at a relatively low temperature, thereby extending the life of the sealing portion.

[0037] Furthermore, by arranging the sealing portion on the upper portion of the bearing, it is possible to prevent foreign matter generated in the bearing from flowing into the semiconductor substrate processing apparatus.

[0038] Furthermore, by causing the purge gas to flow toward the upper portion of the sealing portion and to be discharged to the semiconductor substrate processing apparatus, foreign matter generated in the semiconductor substrate processing apparatus can be prevented from flowing into the sealing portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 The drawings are drawings showing a rotary shaft sealing device and a semiconductor substrate processing device according to an embodiment of the present invention.

[0040] Figure 2 FIG. 1 is a perspective view showing a rotary shaft sealing device according to an embodiment of the present invention.

[0041] Figure 3 To display Figure 2 A plan view of a rotary shaft sealing device.

[0042] Figure 4 To display the edge Figure 2 Cross-sectional view taken along line IV-IV.

[0043] Figure 5 FIG. 1 is a cross-sectional view showing a rotary shaft sealing device according to another embodiment of the present invention.

[0044] Figure 6 FIG. 1 is a diagram schematically showing the structure of a sealing portion according to an embodiment of the present invention.

[0045] Figure 7 FIG. 1 is a diagram schematically showing the structure of a sealing portion according to another embodiment of the present invention. DETAILED DESCRIPTION

[0046] Below, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. However, the present invention can be implemented in various forms and is not limited to the embodiments described herein. In addition, in order to clearly describe the embodiments of the present invention in the accompanying drawings, parts not related to the description will be omitted.

[0047] The terms used herein are only used to describe specific embodiments and are not intended to limit the present invention. Unless the context clearly dictates otherwise, a singular expression may include a plural expression.

[0048] In this specification, terms such as "including" or "having" are used to express the existence of features, numbers, steps, operations, constituent elements, accessories or their combinations recorded in the specification, and do not exclude the presence of one or more other features, numbers, steps, operations, constituent elements, accessories or their combinations, or additional functions.

[0049] In addition, the following embodiments are provided to enable a person of ordinary skill in the art to more clearly explain, and the shapes and sizes of elements in the drawings may be exaggerated for clearer description.

[0050] Hereinafter, preferred embodiments according to the present invention will be described with reference to the accompanying drawings.

[0051] Figure 1 The figure is a diagram showing a rotary shaft sealing device and a semiconductor substrate processing device according to an embodiment of the present invention. Figure 2 A perspective view showing a rotary shaft sealing device according to an embodiment of the present invention. Figure 3 To display Figure 2 A plan view of a rotary shaft sealing device.

[0052] First, refer to Figure 1 The semiconductor substrate processing device 10 according to an embodiment of the present invention may be, for example, a vertical furnace device for heat treating a semiconductor substrate. The semiconductor substrate processing device 10 includes a process tube 220, a semiconductor loading unit 250, a nozzle unit 230, a sealing cap 224 and a rotating shaft sealing device 100.

[0053] The process tube 220 has a space capable of accommodating a plurality of semiconductor substrates W that need to be heat treated, and its bottom is open, and the bottom can be closed or opened by a sealing cap 224. When the bottom of the process tube 220 is closed by the sealing cap 224, an O-ring 226 may be provided between the flange 222 of the process tube 220 and the sealing cap 224 for sealing.

[0054] The semiconductor loading unit 250 is used to hold a plurality of semiconductor substrates W, and may be configured to be able to be raised and lowered in the process tube 220. Specifically, the semiconductor loading unit 250 may hold the semiconductor substrates W and the processed substrates at predetermined intervals in the vertical direction. The heat preservation mechanism 252 and the turntable 254 may be disposed at the lower portion of the semiconductor loading unit 250. The semiconductor loading unit 250, the heat preservation mechanism 252 and the turntable 254 may be raised and lowered relative to the process tube 220 together with the sealing cap 224 by the lifting device 270. In the position where the semiconductor loading unit 250 is lowered, a plurality of semiconductor substrates W may be arranged on the semiconductor loading unit 250, and in the raised position, the semiconductor loading unit 250 is accommodated in the process tube 220, whereby the bottom of the process tube 220 may be closed by the sealing cap 224.

[0055] In addition, a nozzle unit 230 for injecting a process gas to be processed into the semiconductor substrate W is provided in the process tube 220 , and an exhaust pipe 240 for exhausting the process gas and maintaining the inside of the process tube 220 in vacuum may be provided.

[0056] In addition, a heating assembly 210 for heating the process tube 220 may be disposed around the process tube 220. The heater assembly 210 may heat-treat the semiconductor substrate W accommodated in the semiconductor loading unit 250 using radiant heat.

[0057] The rotary shaft sealing device 100 is used to perform a sealing function while rotating the semiconductor loading unit 250. A shaft through hole is formed at the central portion of the sealing cap 224, and one end of the rotary shaft 120 of the rotary shaft sealing device 100 can protrude through the shaft through hole. The turntable 254 is connected to one end of the protruding rotary shaft 120. Therefore, the turntable 254 rotates according to the rotation of the rotary shaft 120, and the semiconductor loading unit 250 arranged on the turntable 254 can also rotate together.

[0058] Reference Figures 2 to 4 The rotating shaft sealing device 100 is used to rotate the semiconductor loading unit 250. The rotating shaft sealing device 100 may include a housing 110, a rotating shaft 120, a bearing 130, a sealing part 150 and a power transmission part 140.

[0059] The housing 110 is hollow and can accommodate the rotating shaft 120, the bearing 130, the sealing part 150 and the power transmission part 140. A flange part 112 mounted on the semiconductor substrate processing device can be provided on the upper part of the housing 110. Figure 1As shown, when the semiconductor substrate processing device is a furnace device, the rotary shaft sealing device 100 can be installed at the lower part of the sealing cap 224. An O-ring 113 can be provided on the flange portion 112 to seal between the flange portion 112 and the sealing cap 224. In addition, a driving device 200 such as a motor can be provided on one side of the housing 110.

[0060] The bearing 130 may be provided in the housing 110 to support the rotating shaft 120 so that it can rotate within the housing 110. In the present embodiment, the bearing 130 is provided at the upper portion of the power transmission portion 140 and is generally provided at approximately the center of the housing 110 to suppress the vibration of the rotating shaft 120 and stably support the rotating shaft 120. In the present embodiment, the bearing 130 is a thrust bearing and may be a double-row angular contact bearing. The double-row angular contact bearing 130 may support a load applied to the rotating shaft 120 so as to support a load of the semiconductor loading unit 250 accommodating a plurality of semiconductor substrates W. At the same time, a gasket 116 may be provided for filling a gap between the bearing 130 and the sealing portion 150.

[0061] The sealing part 150 is used to seal the gap between the housing 110 and the rotating shaft 120. The sealing part 150 prevents foreign matter (particles, etc.) generated in the rotating shaft sealing device 100 from flowing into the vacuum semiconductor substrate processing device provided on the upper side of the rotating shaft sealing device 100, and performs sealing so that the interior of the semiconductor substrate processing device is kept in vacuum. The sealing part 150 may be arranged by combining a plurality of sealing members. The sealing part 150 will be described in detail later.

[0062] The power transmission part 140 is disposed at one end of the rotating shaft 120, that is, at the lower part of the bearing 130 in this embodiment, and is configured to transmit the rotational force to the rotating shaft 120. The rotational force generated by the driving device 200 such as a motor can be transmitted to the rotating shaft 120 through the power transmission part 140. In this embodiment, the power transmission part 140 can be configured as a worm gear to change the direction of the rotational force generated by the driving device 200. Thus, the height of the housing 110 can be reduced and the size of the rotating shaft sealing device 100 can be miniaturized, thereby saving space and being easy to install, and can also be convenient for replacement and maintenance.

[0063] In the present embodiment, the sealing portion 150 may be arranged at a position closer to the flange portion 112 of the housing 110 coupled to the semiconductor substrate processing device than the bearing 130, that is, at the upper portion of the bearing 130. In addition, the power transmission portion 140 may have a structure arranged at the lower portion of the bearing 130. Thus, foreign matter such as particles that may be generated during the operation of the bearing 130 can be prevented from flowing into the semiconductor substrate processing device due to the pressure difference. In addition, since the bearing 130 is provided between the power transmission portion 140 and the sealing portion 150, the rotating shaft 120 can be supported more stably.

[0064] In addition, when the semiconductor substrate processing device is operated in a high temperature environment similar to a furnace device, since the sealing portion 150 is arranged near the flange portion 112 rather than other components to be closer to the semiconductor substrate processing device, the temperature of the sealing portion 150 can be relatively high among the components of the rotating shaft sealing device 100. In the present embodiment, a cooling water jacket 182 can be provided at the circumference of the sealing portion 150 to cool the sealing portion 150. Accordingly, the life of the plurality of seals 152, 156 provided in the sealing portion 150 can be extended by lowering the temperature of the sealing portion 150.

[0065] At the same time, the semiconductor substrate processing process in the semiconductor substrate processing device may be terminated, or the pressure in the semiconductor substrate processing device may be changed to a pressure higher than the atmospheric pressure instead of a vacuum for cleaning or the like. In this case, the pressure inside the semiconductor substrate processing device may be higher than the pressure inside the rotating shaft sealing device 100. As a result, foreign matter such as particles remaining in the semiconductor substrate processing device may flow back into the interior of the rotating shaft sealing device 100. In order to prevent this, in the present embodiment, a labyrinth seal 114 may be provided on the flange portion 112 of the housing 110.

[0066] In addition, in the present embodiment, a purge gas inflow channel 172 may be provided in the wall of the housing 110 to prevent foreign matter (e.g., the particles) remaining in the semiconductor substrate processing device from flowing into the rotary shaft sealing device 100. In addition, a purge gas inlet 170 may be provided on the side surface of the housing 110 to introduce purge gas from the outside through the purge gas inflow channel 172. The purge gas inflow channel 172 may extend upward to the flange portion 112 in the wall of the housing 110, and may be communicated with the labyrinth seal 114 provided in the flange portion 112. Thus, the purge gas flowing through the purge gas inflow channel 172 may pass through the labyrinth seal 114 and be supplied to the semiconductor substrate processing device.

[0067] Figure 5 FIG. 1 is a cross-sectional view showing a rotary shaft sealing device according to another embodiment of the present invention.

[0068] Reference Figure 5 According to another embodiment of the present invention, a rotary shaft sealing device and Figure 4 The rotary shaft sealing device shown is the same, the only difference is that it includes a branch portion 172a additionally provided from the purge gas inflow channel 172 toward the sealing portion 150. Since the purge gas inflow channel 172 is connected to the buffer space 150a inside the sealing portion 150 through the branch portion 172a, even if foreign matter such as particles is left between the sealing portions 150, it can be removed by the purge gas. In this embodiment, the buffer space 150a can be provided between the elastic seals 156.

[0069] Meanwhile, a vacuum pump (not shown) may be connected to the purge gas inflow channel 172. Thus, the buffer space 150a communicated with the branch portion 172a may be maintained in a vacuum. Therefore, even if a portion of the vacuum seal 152 is damaged, the vacuum in the region A may be maintained thanks to the vacuum-forming buffer space 150a.

[0070] Below, refer to Figure 6 The structure of the sealing portion used in the above-mentioned rotating shaft sealing device will be described in detail.

[0071] Reference Figure 6 According to an embodiment of the present invention, the sealing part 150 may include a plurality of vacuum seals 152 and a plurality of elastic seals 156. The vacuum seal 152 is used to maintain the vacuum of the semiconductor substrate processing device arranged on the upper part of the rotating shaft sealing device 100, and the elastic seal 156 is used to support the rotating shaft 120 and suppress vibration. Both the vacuum seal 152 and the elastic seal 156 can be formed of plastic material. In addition, the elastic seal 156 can have a greater elastic force than the vacuum seal 152, and can be more than twice.

[0072] The vacuum seal 152 is a lip seal made of plastic material with an arc-shaped lip formed on the inner circumference of the annular seal, such as Figure 6 As shown, it bends in opposite directions to maintain the vacuum in region A where the vacuum is formed.

[0073] The elastic seal 156 is used to support the rotating shaft 120 together with the bearing 130 so that when the rotating shaft 120 rotates, the axis 122 does not change due to vibration or the like. In addition, when the axis 122 changes, there may be a gap between the rotating shaft 120 and the vacuum seal 152, and foreign matter may be introduced therebetween. In the present embodiment, even if the axis 122 changes, since the elastic seal 156 is provided, it is possible to prevent foreign matter flowing into the area B between the rotating shaft 120 and the vacuum seal 152. The elastic seal 156 includes a sealing body 156a made of a plastic material having a groove formed in one direction, and an elastic member 156b accommodated in the sealing body 156a to press the sealing body 156a toward the rotating shaft 120 (156b). The elastic member 156b may be, for example, an O-ring, a square ring, or a metal spring, but is not limited thereto.

[0074] The vacuum seal 152 and the elastic seal 156 are arranged in series with each other in the direction of the axis 122, as shown in FIG. Figure 4 As shown, the vacuum seal 152 is closer to the flange portion 112 of the housing 110 than the elastic seal 156, and the elastic seal 156 can be closer to the bearing 130 than the vacuum seal 152. In addition, the vacuum seal 152 and the elastic seal 156 can be respectively provided in plurality, so that even if any one of the vacuum seal 152 or the elastic seal 156 is damaged, its function can be maintained.

[0075] In addition, in order to prevent the vacuum seal 152 and the elastic seal 156 from rotating relative to the housing 110 inside the housing 110, a rotation preventing member 159 may be provided on the outer circumferential surface of the housing 110 facing the vacuum seal 152 and the elastic seal 156. The rotation preventing member 159 is used to further press the vacuum seal 152 and the elastic seal 156 toward the rotating shaft 120. In addition, when the rotation preventing member 159 is not present, that is, the friction between the rotation preventing member 159 and the vacuum seal 152 and the elastic seal 156 is greater than when the vacuum seal 152 and the elastic seal 156 are in direct contact with the inner circumferential surface of the housing 110. As a result, the vacuum seal 152 and the elastic seal 156 can be suppressed from rotating relative to the housing 110 inside the housing 110.

[0076] In addition, in the case of disassembling and assembling the rotating shaft sealing device 100 due to damage, inspection, etc., even if the surface roughness of the housing 110 is relatively rough, during the disassembly and assembly process, the rotation preventing member 159 rubs against the inner circumferential surface of the housing 110, whereby the sealing portion 150 can minimize damage caused by the low surface roughness of the housing 110. In addition, since the rotation preventing member 159 has an advantage of being reusable even if it is damaged to some extent, the rotating shaft sealing device 100 can be disassembled and assembled more easily.

[0077] Figure 7 FIG. 1 is a diagram schematically showing the structure of a sealing portion according to another embodiment of the present invention.

[0078] Reference Figure 7 According to another embodiment of the present invention, the sealing portion and Figure 6 The embodiment shown is the same, and the only difference is that only a pressure seal 158 is added. When pressure is applied to the temporal portion of the semiconductor substrate processing device for cleaning or the like, the pressure seal 158 prevents foreign matter from flowing into the semiconductor substrate processing device. In the present embodiment, the pressure seal 158 is arranged in front of the vacuum seal 152, that is, the pressure seal 158 is closer to the labyrinth seal 114 than the vacuum seal 152. Like the vacuum seal 152, the pressure seal 158 can be a lip seal formed of a plastic material with an arc-shaped lip formed on the inner circumference of the annular seal. As shown in the figure, when pressure is applied to the area (A), the pressure seal 158 has a curved shape in the direction of the area (A) to prevent foreign matter from flowing into the area (A).

[0079] According to the rotary shaft sealing device and the semiconductor substrate processing device using the same according to the above-mentioned embodiment, the friction force can be minimized by making the sealing part and the rotating object come into line contact, so that separate lubricating oil supply is not required, thereby making the structure very simple.

[0080] In addition, it is possible to minimize the vibration of the rotating shaft of the rotating shaft sealing device and prevent foreign matter such as particles from the semiconductor substrate processing device from flowing into the rotating shaft sealing device.

[0081] In addition, since the rotary shaft sealing device includes a cooling water jacket, the temperature of the sealing portion can be maintained at a relatively low temperature, thereby extending the life of the sealing portion.

[0082] Furthermore, by arranging the sealing portion on the upper portion of the bearing, it is possible to prevent foreign matter generated in the bearing from flowing into the semiconductor substrate processing apparatus.

[0083] Furthermore, by causing the purge gas to flow toward the upper portion of the sealing portion and to be discharged to the semiconductor substrate processing apparatus, foreign matter generated in the semiconductor substrate processing apparatus can be prevented from flowing into the sealing portion.

[0084] In summary, specific components and the like are described through specific matters, limited embodiments and drawings, but this is only to help further understand the present invention, and the present invention is not limited to the above embodiments. A person skilled in the art can make various changes and modifications based on the above description.

[0085] Therefore, the spirit of the present invention should not be limited to the above embodiments, but only to the following claims, and all equivalent substitutes of the following claims are included in the scope of the claims of the present invention.

Claims

1. A rotary shaft sealing device installed in a semiconductor substrate processing device for rotating a semiconductor loading unit for accommodating a semiconductor substrate and processing the semiconductor substrate, characterized in that: include: a hollow housing mounted on the semiconductor substrate processing device; a rotating shaft accommodated in the housing and connected to the semiconductor loading unit to transmit a rotating force to the semiconductor loading unit; a bearing supporting the rotating shaft so that the rotating shaft can rotate within the housing; a sealing portion having a plurality of sealing members disposed in the housing to seal a gap between the housing and the rotating shaft; and a power transmission part installed at one end of the rotating shaft and transmitting the rotational force to the rotating shaft; The sealing part includes: one or more vacuum seals for maintaining the vacuum of the semiconductor substrate processing device, and one or more elastic seals for supporting the rotating shaft and suppressing vibration. The vacuum seal and the elastic seal are made of plastic material, and the elastic seal has a greater elastic force than the vacuum seal. The vacuum seal and the elastic seal are arranged adjacent to each other in series. The vacuum seal is arranged closer to a flange portion of the housing coupled to the semiconductor substrate processing apparatus than the elastic seal is, and The elastomeric seal is closer to the bearing than the vacuum seal.

2. The rotary shaft sealing device according to claim 1, characterized in that: The sealing portion is disposed on an upper portion of the bearing so as to be closer to a flange portion of the housing coupled to the semiconductor substrate processing apparatus, The power transmission part is disposed at a lower portion of the bearing.

3. The rotary shaft sealing device according to claim 1, characterized in that: The vacuum seal is a lip seal having an arc-shaped lip formed on the inner circumference of the annular seal. The elastic sealing member is an elastic component inserted into the interior of the sealing body.

4. The rotary shaft sealing device according to claim 1, characterized in that: An annular rotation preventing member is provided on the outer peripheral surfaces of the vacuum seal and the elastic seal facing the housing to prevent the vacuum seal and the elastic seal from rotating relative to the housing in the housing.

5. The rotary shaft sealing device according to claim 1, characterized in that: The sealing portion further includes a pressure seal for preventing foreign matter from flowing from the semiconductor substrate processing apparatus into the interior when the interior of the semiconductor substrate processing apparatus is pressurized.

6. The rotary shaft sealing device according to claim 1, characterized in that: A labyrinth seal for preventing foreign matter from the semiconductor substrate processing apparatus from flowing into the housing is provided on the upper portion of the sealing portion.

7. The rotary shaft sealing device according to claim 1, characterized in that: The housing includes a cooling water jacket disposed around the sealing portion to cool the sealing portion.

8. The rotary shaft sealing device according to claim 1, characterized in that: The housing comprises: a purge gas inflow passage provided in the housing to prevent foreign matter from the semiconductor substrate processing apparatus from flowing into the housing; and A purge gas inlet is provided at a side of the housing to introduce a purge gas from the outside through the purge gas inflow passage.

9. The rotary shaft sealing device according to claim 8, characterized in that: A labyrinth seal is provided on the upper portion of the sealing portion to prevent foreign matter from the semiconductor substrate processing device from flowing into the housing. The purge gas moving through the purge gas inflow passage is supplied to the semiconductor substrate processing apparatus through the labyrinth seal.

10. A semiconductor substrate processing device for processing a semiconductor substrate, characterized in that: include: a process tube that accommodates a plurality of semiconductor substrates therein; A semiconductor loading unit, which is configured to be able to be raised and lowered in the process tube; a nozzle unit disposed inside the process pipe to inject process gas; a sealing cap connected to the semiconductor loading unit and sealing a lower portion of the process tube; and a rotary shaft sealing device that performs a sealing function while rotating the semiconductor loading unit, The rotary shaft sealing device comprises: A hollow housing mounted on the sealing cap; a rotating shaft accommodated in the housing and connected to the semiconductor loading unit to transmit a rotating force to the semiconductor loading unit; a bearing supporting the rotating shaft so that the rotating shaft can rotate within the housing; a sealing portion having a plurality of sealing members for sealing a gap between the housing and the rotating shaft; and a power transmission part installed at one end of the rotating shaft and transmitting the rotational force to the rotating shaft; The sealing part includes: one or more vacuum seals for maintaining the vacuum of the semiconductor substrate processing device, and one or more elastic seals for supporting the rotating shaft and suppressing vibration. The vacuum seal and the elastic seal are made of plastic material, and the elastic seal has greater elasticity than the vacuum seal. The vacuum seal and the elastic seal are arranged adjacent to each other in series. The vacuum seal is arranged closer to a flange portion of the housing coupled to the semiconductor substrate processing apparatus than the elastic seal is, and The elastomeric seal is closer to the bearing than the vacuum seal.

11. The semiconductor substrate processing device according to claim 10, characterized in that: The sealing portion is disposed on an upper portion of the bearing so as to be closer to a flange portion of the housing coupled to the sealing cap, The power transmission part is disposed at a lower portion of the bearing.

12. The semiconductor substrate processing device according to claim 10, characterized in that: The vacuum seal is a lip seal having an arc-shaped lip formed on the inner circumference of the annular seal. The elastic sealing member is an elastic component inserted into the interior of the sealing body.

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