Alignment mechanism, alignment method, film forming apparatus, and film forming method

Abstract

The alignment mechanism of the present invention is an alignment mechanism for position adjustment of a substrate and a mask, characterized by comprising: a substrate suction member for suctioning and holding a substrate; a mask support member for supporting a mask; a temporary support member provided to the mask support member for temporarily supporting at least one of the substrate suctioned to the substrate suction member and the mask placed on the mask support member; a horizontal coarse stage mechanism that mounts the mask support member and the temporary support member and moves the mask support member and the temporary support member in a horizontal plane; and a vertical coarse stage mechanism that elevates and lowers the horizontal coarse stage mechanism.

Description

Technical Field

[0001] The present invention relates to an alignment mechanism, an alignment method, a film forming device and a film forming method. Background Art

[0002] The application areas of organic EL display devices (OLEDs) are expanding not only in smartphones, televisions, and automotive displays, but also in VR HMDs (Virtual Reality Head Mount Displays). In particular, displays used in VR HMDs require high-precision pixel pattern formation to reduce user dizziness.

[0003] In the manufacture of an organic EL display device, when forming an organic light-emitting element (organic EL element; OLED) that constitutes the organic EL display device, a film-forming material ejected from a film-forming source of a film-forming device is formed on a substrate through a mask having a pixel pattern formed thereon, thereby forming an organic layer and a metal layer.

[0004] In such a film forming apparatus, in order to improve film forming accuracy, the relative position of the substrate and the mask is measured before the film forming process. If the relative position is misaligned, a process is required to relatively move the substrate and / or the mask to adjust the position (alignment).

[0005] Therefore, the conventional film forming apparatus includes an alignment stage mechanism connected to the substrate support unit and the mask stage, respectively. In addition, the film forming apparatus is provided with an alignment camera for photographing the alignment marks formed on the substrate and the mask. In addition, the film forming apparatus is provided with a conveying mechanism for carrying out and carrying in the substrate and the mask. The film forming apparatus uses the conveying mechanism to carry out the transfer of the substrate or the mask. The alignment mechanism performs alignment based on the relative position information of the substrate and the mask obtained by the alignment camera. In addition, in order to perform high-precision alignment, a high-resolution alignment camera is required. However, the field of view of the high-resolution alignment camera is relatively narrow, and in the case of the transfer accuracy of the conveying mechanism, it is difficult to transfer the alignment marks formed on the substrate and the mask within the field of view of the alignment camera. In addition, it is difficult to improve the transfer accuracy of the conveying mechanism in terms of the mechanism. Therefore, the film deposition apparatus is equipped with a coarse alignment camera, which has a low resolution but a relatively wide field of view, and a fine alignment camera, which has a relatively narrow field of view but a high resolution. The process is divided into coarse alignment, where the alignment marks formed on the substrate and mask are moved into the field of view of the fine alignment camera, and fine alignment, where the alignment marks on the substrate and mask are precisely aligned to improve film deposition accuracy. Furthermore, the alignment mechanism includes multiple actuators (e.g., two X-direction motors and one Y-direction motor) for aligning the alignment marks captured by the camera. Summary of the Invention

[0006] Problems to be solved by the invention

[0007] In conventional film deposition systems, a separate alignment mechanism is used to align the substrate and mask during the rough alignment process. This requires extra space for the rough alignment mechanism, leading to increased system size and cost.

[0008] An object of the present invention is to provide a structure of an alignment mechanism that reduces the size and cost of the device while maintaining a rough alignment function.

[0009] Solutions to Problems

[0010] The alignment mechanism of the present invention is an alignment mechanism for adjusting the position of a substrate and a mask, and is characterized in that the alignment mechanism includes: a substrate adsorption component, which is used to adsorb and hold the substrate; a mask supporting component, which supports the mask; a temporary receiving component, which is equipped on the mask supporting component and is used to temporarily support at least one of the substrate adsorbed on the substrate adsorption component and the mask placed on the mask supporting component; a horizontal coarse motion stage mechanism, which carries the mask supporting component and the temporary receiving component to move the mask supporting component and the temporary receiving component in a horizontal plane; and a vertical coarse motion stage mechanism, which raises and lowers the horizontal coarse motion stage mechanism.

[0011] The alignment method of the present invention is an alignment method for adjusting the position of a substrate and a mask using an alignment mechanism, wherein the alignment mechanism includes: a substrate adsorption component, the substrate adsorption component is used to adsorb and hold the substrate; a mask support component, the mask support component supports the mask; a temporary receiving component, the temporary receiving component is equipped on the mask support component, temporarily supporting the substrate and the mask; a horizontal coarse motion stage mechanism, the horizontal coarse motion stage mechanism carries the mask support component and the temporary receiving component, so that the mask support component and the temporary receiving component move in a horizontal plane; and a vertical coarse motion stage mechanism, the vertical coarse motion stage mechanism enables the horizontal The coarse motion stage mechanism is raised and lowered, and is characterized in that the alignment method includes: a temporary substrate receiving process, in which the temporary receiving component is used to support the moved-in substrate; a substrate position adjustment process, in which the horizontal coarse motion stage mechanism is driven to move the mask support component and the temporary receiving component in the horizontal plane, thereby adjusting the position of the substrate supported by the temporary receiving component relative to the substrate adsorption component; and a substrate adsorption process, in which the substrate whose position is adjusted in the substrate position adjustment process is adsorbed on the substrate adsorption component.

[0012] Another embodiment of the alignment method of the present invention is an alignment method for adjusting the position of a substrate and a mask using an alignment mechanism, the alignment mechanism comprising: a substrate adsorption component, the substrate adsorption component being used to adsorb and hold the substrate; a mask support component, the mask support component supporting the mask; a temporary receiving component, the temporary receiving component being equipped on the mask support component for temporarily supporting the substrate and the mask; a horizontal coarse motion stage mechanism, the horizontal coarse motion stage mechanism carrying the mask support component and the temporary receiving component so that the mask support component and the temporary receiving component move in a horizontal plane; and a vertical coarse motion stage mechanism, the vertical coarse motion stage mechanism The stage mechanism enables the horizontal coarse motion stage mechanism to be raised and lowered, and is characterized in that the alignment method includes: a mask temporary receiving process, in which the temporary receiving component is used to support the moved-in mask; a mask position adjustment process, in which the horizontal coarse motion stage mechanism is driven to move the mask support component and the temporary receiving component in a horizontal plane, thereby adjusting the position of the mask supported by the temporary receiving component; and a mask loading process, in which the mask whose position is adjusted in the mask position adjustment process is loaded on the mask supporting component.

[0013] Effects of the Invention

[0014] According to the present invention, a rough alignment operation can be performed without providing a rough alignment mechanism for each substrate and mask, thereby reducing the size and cost of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a portion of an apparatus for manufacturing an electronic device.

[0016] Figure 2 This is a schematic diagram of a film forming apparatus including an alignment mechanism according to one embodiment of the present invention.

[0017] Figure 3a It is a schematic diagram of a fine movement stage mechanism according to one embodiment of the present invention.

[0018] Figure 3b It is a schematic diagram of a fine movement stage mechanism according to one embodiment of the present invention.

[0019] Figure 3c It is a schematic diagram of a fine movement stage mechanism according to one embodiment of the present invention.

[0020] Figure 3d It is a schematic diagram of a fine movement stage mechanism according to one embodiment of the present invention.

[0021] Figure 4a This is a schematic diagram showing the structure of a magnetic levitation linear motor according to one embodiment of the present invention.

[0022] Figure 4b This is a schematic diagram showing the structure of a magnetic levitation linear motor according to one embodiment of the present invention.

[0023] Figure 5 This is a schematic diagram showing the structure of a deadweight compensation member according to one embodiment of the present invention.

[0024] Figure 6a These are diagrams illustrating a series of operations of rough alignment according to one embodiment of the present invention.

[0025] Figure 6b These are diagrams illustrating a series of operations of rough alignment according to one embodiment of the present invention.

[0026] Figure 6c These are diagrams illustrating a series of operations of rough alignment according to one embodiment of the present invention.

[0027] Figure 6d These are diagrams illustrating a series of operations of rough alignment according to one embodiment of the present invention.

[0028] Figure 6e These are diagrams illustrating a series of operations of rough alignment according to one embodiment of the present invention.

[0029] Figure 7 This is a diagram showing a rough alignment mechanism included in a mask fixing mechanism according to one embodiment of the present invention.

[0030] Figure 8a This is a diagram conceptually illustrating an alignment processing procedure using a rough alignment mechanism according to an embodiment of the present invention when an alignment mark is significantly deviated from the field of view of a camera.

[0031] Figure 8b This is a diagram conceptually illustrating an alignment processing procedure using a rough alignment mechanism according to an embodiment of the present invention when an alignment mark is significantly deviated from the field of view of a camera.

[0032] Figure 8c This is a diagram conceptually illustrating an alignment processing procedure using a rough alignment mechanism according to an embodiment of the present invention when an alignment mark is significantly deviated from the field of view of a camera.

[0033] Figure 8d This is a diagram conceptually illustrating an alignment processing procedure using a rough alignment mechanism according to an embodiment of the present invention when an alignment mark is significantly deviated from the field of view of a camera.

[0034] Figure 8e This is a diagram conceptually illustrating an alignment processing procedure using a rough alignment mechanism according to an embodiment of the present invention when an alignment mark is significantly deviated from the field of view of a camera.

[0035] Figure 8f This is a diagram conceptually illustrating an alignment processing procedure using a rough alignment mechanism according to an embodiment of the present invention when an alignment mark is significantly deviated from the field of view of a camera. DETAILED DESCRIPTION

[0036] Preferred embodiments and examples of the present invention are described below with reference to the accompanying drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, the hardware and software configurations, processing flow, manufacturing conditions, dimensions, materials, and shapes of the devices described below are not intended to limit the scope of the present invention to these configurations unless otherwise specified.

[0037] The present invention can be applied to an apparatus for depositing various materials on the surface of a substrate to form a film, and can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum deposition.

[0038] As the material for the substrate, any material can be selected, such as a semiconductor (e.g., silicon), glass, a thin film of a polymer material, or a metal. For example, the substrate may be a silicon wafer or a substrate having a thin film of polyimide or the like laminated on a glass substrate. Furthermore, as the film-forming material, any material can be selected, such as an organic material or a metallic material (e.g., a metal, a metal oxide, etc.).

[0039] Furthermore, the present invention can be applied not only to vacuum deposition systems based on thermal evaporation, but also to film-forming systems including sputtering systems and CVD (Chemical Vapor Deposition) systems. Specifically, the technology of the present invention can be applied to manufacturing equipment for various electronic devices, such as semiconductor devices, magnetic devices, and electronic components, as well as optical components. Specific examples of electronic devices include light-emitting elements, photoelectric conversion elements, and touchscreens.

[0040] The present invention is preferably applicable to apparatus for manufacturing organic light-emitting elements such as OLEDs and organic photoelectric conversion elements such as organic thin-film solar cells. Furthermore, electronic devices in the present invention also include display devices (e.g., organic EL display devices) or lighting devices (e.g., organic EL lighting devices) equipped with light-emitting elements, and sensors (e.g., organic CMOS image sensors) equipped with photoelectric conversion elements.

[0041] <Electronic device manufacturing equipment>

[0042] Figure 1 It is a plan view schematically showing the structure of a portion of an electronic device manufacturing apparatus.

[0043] Figure 1 The manufacturing apparatus is used, for example, to manufacture display panels for organic EL display devices for VR HMDs. In the case of VR HMD display panels, after forming a film for forming organic EL elements on a silicon wafer of a predetermined size (e.g., 300 mm), the silicon wafer is cut along the areas between the element formation areas (scribe lines) to produce multiple small-sized panels.

[0044] The electronic device manufacturing apparatus of this embodiment generally includes a plurality of cluster devices 1 and a relay device connecting the cluster devices.

[0045] The cluster device 1 includes a film forming device 11 for processing (eg forming a film) a substrate W, a mask storage device 12 for storing masks before and after use, and a transfer chamber 13 arranged in the center thereof. Figure 1 As shown, the transfer chamber 13 is connected to the film forming device 11 and the mask stocker 12 respectively.

[0046] A transfer robot 14 for transferring a substrate W and a mask is arranged in the transfer chamber 13. The transfer robot 14 is a robot having a structure in which a robot hand for holding the substrate W or the mask is attached to a multi-jointed arm, for example.

[0047] In the film forming apparatus 11, a film forming material ejected from a film forming source passes through a mask and is formed on a substrate W. The film forming apparatus 11 performs a series of film forming processes, including transfer of the substrate W / mask to the transfer robot 14, adjustment (alignment) of the relative position of the substrate W and mask, securing the substrate W to the mask, and film formation.

[0048] In a manufacturing device for manufacturing an organic EL display device, the film forming device 11 can be divided into an organic film forming device and a metallic film forming device according to the type of material to be formed. The organic film forming device forms a film of an organic film forming material on a substrate W by evaporation or sputtering, and the metallic film forming device forms a film of a metallic film forming material on a substrate W by evaporation or sputtering.

[0049] In a manufacturing apparatus for manufacturing an organic EL display device, which film forming apparatus is arranged at which position depends on the stacked structure of the organic EL element to be manufactured. A plurality of film forming apparatuses are arranged according to the stacked structure of the organic EL element for forming a film.

[0050] In the case of an organic EL element, it usually has a structure in which a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode are stacked in sequence on a substrate W formed with an anode, and an appropriate film-forming device is arranged along the flow direction of the substrate in such a way that these layers can be formed in sequence.

[0051] For example, in Figure 1 In the configuration, the film forming device 11a forms a hole injection layer HIL and / or a hole transport layer HTL, the film forming devices 11b and 11f form a blue light emitting layer, the film forming device 11c forms a red light emitting layer, the film forming devices 11d and 11e form a green light emitting layer, the film forming device 11g forms an electron transport layer ETL and / or an electron injection layer EIL, and the film forming device 11h forms a cathode metal film. Figure 1 In the embodiment shown, due to the characteristics of the raw materials, the film forming speed of the blue light emitting layer and the green light emitting layer is slower than the film forming speed of the red light emitting layer. Therefore, in order to achieve a balance in processing speed, two film forming devices are used to form the blue light emitting layer and the green light emitting layer respectively. However, the present invention is not limited to this and may also have other configuration structures.

[0052] In the mask stocker 12, new masks used in the film forming process in the film forming apparatus 11 and used masks are stored separately in multiple cassettes. The transport robot 14 transports used masks from the film forming apparatus 11 to the cassettes of the mask stocker 12, and transports new masks stored in other cassettes of the mask stocker 12 to the film forming apparatus 11.

[0053] The relay device connecting the plurality of cluster devices 1 includes a routing chamber 15 for transferring substrates W between the cluster devices 1 .

[0054] The transfer robot 14 in the transfer chamber 13 receives a substrate W from the upstream path chamber 15 and transfers it to one of the film forming apparatuses 11 (e.g., the film forming apparatus 11a) within the cluster apparatus 1. Furthermore, the transfer robot 14 receives a substrate W after film formation processing has been completed in the cluster apparatus 1 from one of the plurality of film forming apparatuses 11 (e.g., the film forming apparatus 11e) and transfers it to the downstream path chamber 15.

[0055] In addition to the path chamber 15, the transfer device can also include a buffer chamber (not shown) for absorbing differences in processing speeds of substrates W in the upstream and downstream cluster devices 1, and a swirl chamber (not shown) for changing the orientation of the substrates W. For example, the buffer chamber includes a substrate loading section for temporarily storing multiple substrates W, and the swirl chamber includes a substrate rotation mechanism (such as a rotating stage or a transfer robot) for rotating the substrates W 180 degrees. This ensures that the substrates W are oriented in the same direction in both the upstream and downstream cluster devices, facilitating substrate processing.

[0056] The path chamber 15 according to one embodiment of the present invention may also include a substrate loader (not shown) for temporarily storing a plurality of substrates W and a substrate rotating mechanism. In other words, the path chamber 15 may also function as a buffer chamber and a swirl chamber.

[0057] The film forming apparatus 11, mask stocker 12, and transfer chamber 13, which make up the group apparatus 1, are maintained in a high vacuum state during the organic light-emitting device manufacturing process. The routing chamber 15 of the transfer apparatus is typically maintained in a low vacuum state, but can be maintained in a high vacuum state as needed.

[0058] The substrate W on which multiple layers constituting the organic EL element have been formed is conveyed to a sealing device (not shown) for sealing the organic EL element, a cutting device (not shown) for cutting the substrate into a predetermined panel size, and the like.

[0059] In this embodiment, referring to Figure 1 , the structure of the manufacturing device of the electronic device is described, but the present invention is not limited to this. It can have other types of devices and chambers, and the configuration between the above-mentioned devices and chambers can be changed.

[0060] For example, the electronic device manufacturing apparatus according to one embodiment of the present invention may not be Figure 1 The group type shown is not an in-line type. Specifically, a structure can be employed in which the substrate W and mask are placed on a carrier and transported through multiple film forming apparatuses arranged in a row while film formation is performed. Alternatively, a structure combining the group and in-line types is possible. For example, the group type manufacturing apparatus can be used for the organic layer formation process, while the in-line type manufacturing apparatus can be used for the electrode layer (cathode layer) formation process, the sealing process, and the cutting process.

[0061] Hereinafter, the specific structure of the film forming apparatus 11 will be described.

[0062] <Film Forming Equipment>

[0063] Figure 2 Schematic diagram showing the structure of a film forming apparatus 11 according to one embodiment of the present invention. In the following description, an XYZ orthogonal coordinate system is used, in which the vertical direction is the Z direction and the horizontal plane is the XY plane. X To express the rotation angle around the X axis, use θ Y To express the rotation angle around the Y axis, use θ Z To represent the rotation angle around the Z axis.

[0064] Figure 2 An example of a film forming apparatus 11 that forms a film on a substrate W through a mask M by heating a film forming material to evaporate or sublime the material.

[0065] The film forming device 11 includes: a vacuum container 21, which is maintained in a vacuum environment or an inert gas environment such as nitrogen; a fine-motion stage mechanism 22, which is arranged in the vacuum container 21 and is used to move the film in at least the X direction, the Y direction and the θ direction. Z The position of the substrate W is adjusted in the direction; the mask stage 23 is arranged in the vacuum container 21 and supports the mask M; the substrate adsorption component 24 is arranged in the vacuum container 21 and adsorbs and holds the substrate W; the receiving claw 28 is arranged in the vacuum container 21 and temporarily receives the substrate W and the mask M; the mask receiving pin 281 receives the mask when the mask is transferred from the receiving claw 28 to the mask stage 23; the coarse movement stage 232 is equipped with the mask stage 23 and the receiving claw 28, and is used to move the coarse movement stage 232 in the X direction and the Y direction θ Z and a film forming source 25 disposed in the vacuum container 21 and containing a film forming material, and granulating and ejecting the film forming material during film formation.

[0066] The film forming apparatus 11 according to one embodiment of the present invention may further include a magnetic force applying member 26 for bringing the mask M into close contact with the substrate W using a magnetic force.

[0067] The vacuum container 21 of the film forming device 11 of one embodiment of the present invention includes a first vacuum container part 211 equipped with a micro-motion stage mechanism 22 and a second vacuum container part 212 equipped with a film forming source 25. For example, a vacuum pump P connected to the second vacuum container part 212 is used to maintain the entire internal space of the vacuum container 21 in a high vacuum state.

[0068] Furthermore, a retractable member 213 is provided between at least the first vacuum vessel section 211 and the second vacuum vessel section 212. The retractable member 213 reduces the transmission of vibrations from the vacuum pump connected to the second vacuum vessel section 212 and from the ground or floor on which the film forming apparatus 11 is installed, from the second vacuum vessel section 212 to the first vacuum vessel section 211. The retractable member 213 may be, for example, a bellows, but the present invention is not limited thereto; any other member may be used as long as it can reduce the transmission of vibrations between the first vacuum vessel section 211 and the second vacuum vessel section 212.

[0069] The vacuum container 21 includes a reference frame 215 fixedly connected to the micro-stage mechanism 22. In one embodiment of the present invention, it can also be, for example Figure 2 As shown, a retractable member 213 is further provided between the reference frame 215 and the first vacuum container 211. This can further reduce the transmission of external vibrations to the fine movement stage mechanism 22 via the reference frame 215.

[0070] A vibration isolation unit 216 is provided between the reference frame 215 and the installation stand 217 of the film forming apparatus 11 . The vibration isolation unit 216 is used to reduce vibration transmitted from the ground or floor to the reference frame 215 through the installation stand 217 of the film forming apparatus 11 .

[0071] The fine-motion stage mechanism 22 is a stage mechanism for adjusting the position of the substrate W or the substrate adsorption member 24 using a magnetic levitation linear motor, and is capable of at least adjusting the positions in the X direction, the Y direction, and the θ direction. Z direction, preferably the X direction, Y direction, Z direction, θ X Direction, θ Y Direction, θ Z The positions of the substrate W or the substrate adsorption member 24 in these six directions are adjusted.

[0072] The fine-motion stage mechanism 22 includes a stage reference plate portion 221 (first plate portion) functioning as a fixed stage, a fine-motion stage plate portion 222 (second plate portion) functioning as a movable stage, and a magnetic levitation unit 223 for magnetically levitating and moving the fine-motion stage plate portion 222 relative to the stage reference plate portion 221.

[0073] The mask stage 23 is a stage portion on which the mask M is placed during alignment and film formation.

[0074] The mask stage 23 is mounted on a coarse movement stage 232 that is movable horizontally (in the X, Y, and θ directions). This allows alignment marks formed on substrate W and mask M to be moved so that they fall within the field of view of the alignment camera. Furthermore, the mask stage 23 and coarse movement stage 232 are mounted on a coarse movement Z stage mechanism 233. This allows for easy adjustment of the vertical distance between substrate W and mask M. The coarse movement stage 232 and coarse movement Z stage mechanism 233 are mechanically driven by a servo motor and a ball screw (not shown).

[0075] The mask stage 23 further includes receiving claws 28 for temporarily receiving the substrate W and the mask M carried into the vacuum container 21 by the transfer robot 14 .

[0076] The receiving claw 28 is provided on the mask stage 23 and is capable of temporarily receiving the substrate W or the mask M from the transfer robot 14. The receiving claw 28 is capable of supporting the substrate W or the mask M during the coarse alignment operation in which the substrate W or the mask M is moved to the center of the field of view of the fine alignment camera using the coarse motion stage 232. The receiving claw 28 has a drive shaft and is capable of taking two positions: a receiving position for the substrate W or the mask M and a retreat position in which it does not interfere with the substrate W or the mask M. The receiving claw 28 is capable of placing the temporarily received substrate W on the substrate suction component 24 that suctions the substrate W during the film formation process via the drive shaft and the coarse motion Z stage mechanism 233. Similarly, the receiving claw 28 is capable of placing the temporarily received mask M on the mask stage 23 that places the mask M during the film formation process.

[0077] The mask receiving pin 281 is configured to be able to rise and fall relative to the mask supporting surface of the mask stage 23. For example, Figure 2 As shown, the coarse motion Z stage mechanism 233 can be used to enable the mask receiving pins 281 to be raised and lowered relative to the mask support surface of the mask stage 23. However, the present invention is not limited to this, and other structures are also possible as long as the mask receiving pins 281 can be raised and lowered relative to the mask support surface of the mask stage 23. For example, the mask receiving pins 281 can also be configured to have an independent lifting mechanism to enable them to be raised and lowered.

[0078] After the rough alignment is completed, the coarse Z stage mechanism 233 is lowered. Figure 2The mask receiving pins 281 in the mask stage 23 are raised relative to the mask support surface of the mask stage 23, and the mask M is transferred to the mask receiving pins 281. The receiving claws 28 move to the retracted position, and the coarse movement Z stage mechanism 233 is raised, transferring the mask M from the mask receiving pins 281 to the mask stage 23. Conversely, when unloading a used mask M, the coarse movement Z stage mechanism 233 is lowered, causing the mask receiving pins 281, which have been raised relative to the mask mounting surface of the mask stage 23, to receive the mask M placed on the mask stage 23. In this state, the receiving claws 28 are moved to the mask receiving position, and the coarse movement Z stage mechanism 233 is raised, thereby lifting the mask M with the receiving claws 28, allowing the manipulator of the transport robot 14 to receive the mask M.

[0079] The mask M has an opening pattern corresponding to the thin film pattern formed on the substrate W and is supported by the mask stage 23. For example, the mask M used in the manufacture of an organic EL display panel for a VR-HMD includes a fine metal mask (Fine Metal Mask) and an open mask (Open Mask). The fine metal mask is a metal mask formed with a fine opening pattern corresponding to the RGB pixel pattern of the light-emitting layer of the organic EL element, and the open mask is used to form the common layers of the organic EL element (hole injection layer, hole transport layer, electron transport layer, electron injection layer, etc.).

[0080] The opening pattern of the mask M is defined by a partition pattern that prevents particles of the film forming material from passing therethrough.

[0081] The substrate suction member 24 suctions and holds the substrate W as a film formation object transported by the transport robot 14 provided in the transport chamber 13 . The substrate suction member 24 is provided on the fine movement stage plate portion 222 as the movable stage of the fine movement stage mechanism 22 .

[0082] The substrate adsorption member 24 is, for example, an electrostatic chuck having a structure in which a circuit such as a metal electrode is embedded in a dielectric / insulator (eg, ceramic) base.

[0083] The electrostatic suction cup serving as the substrate adsorption component 24 can be a Coulomb force type electrostatic suction cup, a Johnson-Rahbeck force type electrostatic suction cup, or a gradient force type electrostatic suction cup. The Coulomb force type electrostatic suction cup has a dielectric with relatively high resistance sandwiched between the electrode and the adsorption surface, and adsorption is performed by the Coulomb force between the electrode and the adsorbed body. The Johnson-Rahbeck force type electrostatic suction cup has a dielectric with relatively low resistance sandwiched between the electrode and the adsorption surface, and adsorption is performed using the Johnson-Rahbeck force generated between the adsorption surface of the dielectric and the adsorbed body. The gradient force type electrostatic suction cup uses an uneven electric field to adsorb the adsorbed body.

[0084] When the adsorbent is a conductor or semiconductor (silicon wafer), it is preferred to use a Coulomb force type electrostatic chuck or a Johnson-Rabec force type electrostatic chuck. When the adsorbent is an insulator such as glass, it is preferred to use a gradient force type electrostatic chuck.

[0085] The electrostatic chuck can be formed of a single plate or multiple sub-plates. In addition, when formed of a single plate, it can also have multiple circuits inside and be controlled so that the electrostatic attraction varies depending on the position within the plate.

[0086] In addition, although Figure 2 Although not shown in the figure, the following structure may be adopted: a cooling component (such as a cooling plate) is provided on the opposite side of the adsorption surface of the substrate adsorption component 24 to suppress the temperature rise of the substrate W, thereby suppressing the deterioration and degradation of the organic material deposited on the substrate W.

[0087] The film forming source 25 includes a crucible (not shown) for storing the film forming material to be formed on the substrate W, a heater (not shown) for heating the crucible, and a baffle (not shown) for preventing the film forming material from scattering onto the substrate until the evaporation rate from the film forming source 25 becomes constant. The film forming source 25 can have various structures, such as a point film forming source and a linear film forming source, depending on the application.

[0088] The film forming source 25 may include a plurality of crucibles containing different film forming materials. In such a configuration, the plurality of crucibles containing different film forming materials may be movably provided at the film forming position so that the film forming material can be changed without exposing the vacuum container 21 to the atmosphere.

[0089] The magnetic force applying member 26 is a member for pulling the mask M toward the substrate W by magnetic force and making it in close contact during the film forming process, and is provided so as to be movable vertically. For example, the magnetic force applying member 26 is composed of an electromagnet and / or a permanent magnet.

[0090] Although Figure 2 Although not shown in the figure, the film forming apparatus 11 may also include a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the thickness of the film deposited on the substrate.

[0091] A magnetic force applying member lifting mechanism 261 for lifting the magnetic force applying member 26 is provided on the outer side of the upper portion of the vacuum container 21 (on the atmospheric side).

[0092] The film forming apparatus 11 according to one embodiment of the present invention further includes an alignment camera unit 27 , which is provided on the upper outer side (atmosphere side) of the vacuum container 21 and is used to photograph alignment marks formed on the substrate W and the mask M.

[0093] In this embodiment, the alignment camera unit 27 can include a coarse alignment camera for roughly adjusting the relative position of the substrate W and the mask M, and a fine alignment camera for highly accurately adjusting the relative position of the substrate W and the mask M. The coarse alignment camera has a relatively wide field of view and low resolution, while the fine alignment camera has a relatively narrow field of view but high resolution.

[0094] The coarse alignment cameras and fine alignment cameras are positioned corresponding to the alignment marks formed on the substrate W and the mask M. For example, the fine alignment cameras are positioned so that the four cameras form the four corners of a rectangle, and the coarse alignment cameras are positioned in the center of two opposing sides of the rectangle. However, the present invention is not limited to this configuration and may employ other configurations depending on the positions of the alignment marks on the substrate W and the mask M.

[0095] like Figure 2 As shown, the alignment camera unit 27 of the film-forming apparatus 11 according to one embodiment of the present invention images the alignment marks from the upper atmospheric side of the vacuum chamber 21 through a vacuum-compatible cylinder 214 provided in the vacuum chamber 21. By arranging the alignment camera so as to enter the interior of the vacuum chamber 21 via the vacuum-compatible cylinder in this manner, even when the substrate W and mask M are supported relatively far from the reference frame 215 due to the intervention of the fine-motion stage mechanism 22, the focus can be aligned with the alignment marks formed on the substrate W and mask M. The position of the lower end of the vacuum-compatible cylinder can be appropriately determined based on the focal depth of the alignment camera and the distance of the substrate W / mask M from the reference frame 215.

[0096] Although Figure 2 Although not shown in the figure, since the interior of the sealed vacuum container 21 is dark during the film forming process, in order to use the alignment camera that enters the inside of the vacuum container 21 to photograph the alignment mark, an illumination light source that illuminates the alignment mark from below can also be provided.

[0097] The film forming apparatus 11 includes a control unit (not shown). The control unit has functions such as controlling the transport and alignment of the substrate W / mask M and controlling film formation. The control unit may also have a function of controlling the voltage applied to the electrostatic chuck.

[0098] The control unit can be composed of, for example, a computer having a processor, memory, storage device, I / O, etc. In this case, the functions of the control unit are realized by having the processor execute a program stored in the memory or storage device. The computer can be a general-purpose personal computer, an embedded computer, or a PLC (Programmable Logic Controller). Alternatively, a circuit such as an ASIC or FPGA can be used to implement part or all of the functions of the control unit. In addition, a control unit can be provided for each film forming apparatus, or a single control unit can be configured to control multiple film forming apparatuses.

[0099] <Rough alignment mechanism>

[0100] Below, refer to Figure 2 , a rough alignment mechanism according to one embodiment of the present invention is described.

[0101] The rough alignment operation refers to the operation of moving the alignment marks formed on the substrate W and the mask M within the field of view of the fine alignment camera in the alignment camera unit 27. The mechanism that performs the rough alignment operation is called a rough alignment mechanism.

[0102] The rough alignment mechanism of the present invention includes: a receiving claw 28 (holding member), which can support the substrate W and the mask M during the rough alignment operation, and has a driving mechanism to obtain two positions: a receiving position for the substrate W or the mask M and a retreat position to avoid interference with the substrate W or the mask M; a mask stage 23, on which the receiving claw 28 is installed, which supports the mask M during the film forming process; a coarse motion stage mechanism 232 (horizontal coarse motion stage mechanism), The receiving claw 28 and the mask stage 23 are moved in the planar direction (XYθ direction), so that the alignment marks formed on the substrate W and the mask M can be moved (adjusted) within the field of view of the fine alignment camera; the coarse Z stage mechanism 233 (vertical coarse stage mechanism), the coarse Z stage mechanism 233 supports the coarse stage mechanism 232 so that it moves in the vertical direction; and the mask receiving pin 281, the mask receiving pin 281 temporarily supports the mask M when the mask M is handed over from the receiving claw 28 to the mask stage 23.

[0103] <Micro-motion stage mechanism>

[0104] Below, refer to Figures 3a to 3d 、 Figure 4a 、 Figure 4b 、 Figure 5 , a micro-motion stage mechanism 22 according to an embodiment of the present invention will be described.

[0105] Figures 3a to 3d1 and 2 are a schematic top view and a schematic cross-sectional view of the fine movement stage mechanism 22 according to one embodiment of the present invention.

[0106] As described above, the fine motion stage mechanism 22 includes a stage reference plate 221 functioning as a fixed stage, a fine motion stage plate 222 functioning as a movable stage, and a magnetic levitation unit 223 for magnetically levitating and moving the fine motion stage plate 222 relative to the stage reference plate 221 .

[0107] The stage reference plate portion 221 is a member that serves as a reference for the movement of the fine movement stage plate portion 222 and is provided so as to fix its position. Figure 2 As shown, the stage reference plate portion 221 is provided and fixed to the reference frame 215 of the vacuum chamber 21 in parallel with the XY plane.

[0108] Since the stage reference plate portion 221 is a component that serves as a reference for the movement of the fine motion stage plate portion 222, it is preferably configured so as not to be affected by interference such as vibration from a vacuum pump or the ground due to the retractable member 213 and the vibration isolation unit 216.

[0109] The fine movement stage plate portion 222 is provided so as to be movable relative to the stage reference plate portion 221. A substrate holding member 24, such as an electrostatic chuck, is provided on one main surface (e.g., the lower surface) of the fine movement stage plate portion 222. Therefore, the position of the substrate holding member 24 and the substrate W held thereto can be adjusted by moving the fine movement stage plate portion 222.

[0110] The magnetic levitation unit 223 of one embodiment of the present invention includes: a magnetic levitation linear motor 31, which is used to generate a driving force for moving the fine-motion stage plate 222 serving as a movable platform relative to the stage reference plate 221 serving as a fixed platform; a position measuring component, which is used to measure the position of the fine-motion stage plate 222; a self-weight compensation component 33, which compensates for the gravity applied to the fine-motion stage plate 222 by providing a suspension force that causes the fine-motion stage plate 222 to suspend relative to the stage reference plate 221; and an origin positioning component 34, which determines the origin position of the fine-motion stage plate 222.

[0111] The magnetic levitation linear motor 31 is a driving source that generates a driving force for moving the fine movement stage plate portion 222, for example. Figure 3aAs shown, it includes: two X-direction magnetic levitation linear motors 311, which generate driving force for moving the fine motion stage plate 222 along the X direction; two Y-direction magnetic levitation linear motors 312, which generate driving force for moving the fine motion stage plate 222 along the Y direction; and three Z-direction magnetic levitation linear motors 313, which generate driving force for moving the fine motion stage plate 222 along the Z direction.

[0112] By using the plurality of magnetic levitation linear motors 31, the fine movement stage plate 222 can be moved in six degrees of freedom (in the X direction, the Y direction, the Z direction, the θ direction, the Z ... X Direction, θ Y Direction, θ Z direction) movement.

[0113] For example, by driving the X-direction magnetic levitation linear motor 311 , the Y-direction magnetic levitation linear motor 312 , and the Z-direction magnetic levitation linear motor 313 in the same direction, translational movement in the X, Y, and Z directions can be achieved.

[0114] By adjusting the driving directions of the two X-direction magnetic levitation linear motors 311 and the two Y-direction magnetic levitation linear motors 312, the θ Z For example, by driving the X-direction magnetic levitation linear motor 311a in the +X direction, driving the X-direction magnetic levitation linear motor 311b in the -X direction, driving the Y-direction magnetic levitation linear motor 312a in the +Y direction, and driving the Y-direction magnetic levitation linear motor 312bb in the -Y direction, the fine movement stage plate 222 can be rotated and moved counterclockwise about the Z axis.

[0115] Similarly, by adjusting the driving directions of the three Z-direction magnetic levitation linear motors 313, the θ X Direction, θ Y Movement in direction.

[0116] Figure 3a The number and arrangement of the magnetic levitation linear motors 31 shown are merely illustrative, and the present invention is not limited thereto. As long as the fine movement stage plate 222 can be moved in a desired direction, other numbers and arrangements are also possible.

[0117] Figure 4a is a schematic diagram showing the structure of the Z-direction magnetic levitation linear motor 313, Figure 4b Schematic diagram showing the structure of the X-direction or Y-direction magnetic levitation linear motor 311, 312.

[0118] The magnetic levitation linear motor 31 includes a stator 314 provided on the stage reference plate portion 221 and a mover 315 provided on the fine movement stage plate portion 222 .

[0119] like Figure 4a and Figure 4b As shown, the stator 314 of the magnetic levitation linear motor 31 includes a magnetic field generating component such as a coil 3141 for flowing current, and the movable element 315 includes a magnetic body such as a permanent magnet 3151 .

[0120] The magnetic levitation linear motor 31 applies a driving force to the permanent magnet 3151 of the movable element 315 using a magnetic field generated by flowing current through the coil 3141 of the stator 314. The magnetic levitation linear motor 311 can adjust the direction of the force applied to the permanent magnet 3151, which serves as the movable element 315, by adjusting the direction of the current flowing through the stator 314.

[0121] For example, Figure 4a As shown in (b), if the direction of the current flowing in the coil 3141 of the stator 314 is set to rotate counterclockwise, then Figure 4a In (a), an N pole is induced on the left side (-X side) of coil 3141, and an S pole is induced on the right side (+X side). Therefore, a force is applied to movable element 315 in the downward (-Z) direction. Conversely, if the direction of the current flowing through coil 3141 is set to rotate clockwise, movable element 315 can be moved in the upward (+Z) direction.

[0122] Likewise, Figure 4b The X-direction magnetic levitation linear motor 311 or the Y-direction magnetic levitation linear motor 312 shown can also move the movable element 315 in the X direction or the Y direction respectively by controlling the direction of the current flowing in the coil 3141 of the stator 314 .

[0123] The position measuring component of the magnetic levitation unit 223 according to one embodiment of the present invention is used to measure the position of the fine movement stage plate 222, and includes a laser interferometer 32 and a reflector 324. The reflector 324 is provided on the fine movement stage plate 222 so as to face the laser interferometer 32. The reflector 324 may be, for example, a plane mirror.

[0124] The laser interferometer 32 irradiates a measuring beam onto a reflecting portion 324 provided on the fine movement stage plate portion 222 and detects the reflected beam, thereby measuring the position of the reflecting portion 324 (the position of the fine movement stage plate portion 222). More specifically, the laser interferometer 32 can measure the position of the fine movement stage plate portion 222 based on the interference light between the reflected light of the measuring beam and the reflected light of the reference beam.

[0125] The position measurement components of the magnetic levitation unit 223 of one embodiment of the present invention include: an X-direction position measurement unit, which is used to measure the position of the fine-motion stage plate 222 in the X direction; a Y-direction position measurement unit, which is used to measure the position in the Y direction; and a Z-direction position measurement unit, which is used to measure the position in the Z direction.

[0126] like Figure 3a As shown, the laser interferometer 32 of the position measurement component of one embodiment of the present invention includes: two X-direction laser interferometers 321, which are used to detect the position of the fine-motion stage plate portion 222 in the X-axis direction; one Y-direction laser interferometer 322, which is used to detect the position of the fine-motion stage plate portion 222 in the Y-axis direction; and three Z-direction laser interferometers 323, which are used to detect the position of the fine-motion stage plate portion 222 in the Z-axis direction.

[0127] In the fine movement stage plate portion 222, a reflecting portion 324 for reflecting the measuring beam from the laser interferometer 32 is provided so as to face the laser interferometer 32. For example, the reflecting portion 324 includes an X-direction reflecting portion 3241 provided so as to face the X-direction laser interferometer 321, a Y-direction reflecting portion 3242 provided so as to face the Y-direction laser interferometer 322, and a Z-direction reflecting portion 3243 provided so as to face the Z-direction laser interferometer 323.

[0128] The X-direction position measuring unit includes an X-direction laser interferometer 321 and an X-direction reflecting unit 3241 , the Y-direction position measuring unit includes a Y-direction laser interferometer 322 and a Y-direction reflecting unit 3242 , and the Z-direction position measuring unit includes a Z-direction laser interferometer 323 and a Z-direction reflecting unit 3243 .

[0129] exist Figure 3a In the illustrated embodiment, the X-direction reflecting portion 3241 and the Z-direction reflecting portion 3243 are plane mirrors arranged on the side and upper surface of a component, but the present invention is not limited to this. As long as each reflecting portion 324 can reflect the measuring light beam from the laser interferometer 32 opposite to it and return it to the laser interferometer 32, it may also have other structures and configurations.

[0130] By configuring the position measuring unit in this manner, the position of the fine movement stage plate portion 222 can be precisely measured in six degrees of freedom. Specifically, the X-direction laser interferometer 321, the Y-direction laser interferometer 322, and the Z-direction laser interferometer 323 can be used to measure the X-direction position, the Y-direction position, and the Z-direction position of the fine movement stage plate portion 222. Furthermore, by providing a plurality of X-direction laser interferometers 321, the rotation (θ) around the Z axis can also be measured. Z In addition, by setting up multiple Z-direction laser interferometers 323, the rotation direction (θ X or θ Y ) position (i.e., the inclination angle of the fine-motion stage plate portion 222).

[0131] However, the present invention is not limited to Figure 3a and Figure 3b The number and arrangement of the laser interferometers 32 and the reflecting parts 324 shown in the figure are as long as the six degrees of freedom (X, Y, Z, θ) of the fine-motion stage plate 222 can be measured. X ,θ Y ,θ Z ) position, or may have other numbers and configurations. For example, two Y-direction laser interferometers may be provided instead of only one X-direction laser interferometer.

[0132] The control unit of the film-forming apparatus 11 according to one embodiment of the present invention controls the magnetic levitation linear motor 31 based on position information of the fine movement stage plate portion 222 (or the substrate holding member 24 provided on the fine movement stage plate portion 222) measured by the laser interferometer 32. For example, the control unit of the film-forming apparatus 11 moves the fine movement stage plate portion 222 or the substrate holding member 24 to a positioning target position determined based on the position of the fine movement stage plate portion 222 or the substrate holding member 24 measured by the laser interferometer 32 and the relative positional offset between the substrate W and the mask M measured by the alignment camera unit 27. This allows the position of the fine movement stage plate portion 222 or the substrate holding member 24 to be controlled with high precision, down to nanometers.

[0133] In this embodiment, a structure using a laser interferometer as a component for measuring the position of the fine motion stage plate portion 222 is described, but the present invention is not limited to this. As long as the position of the fine motion stage plate portion 222 can be measured, other position measuring components may also be used.

[0134] The self-weight compensation component 33 is a component for compensating the weight of the fine movement stage plate portion 222, for example, Figure 3d and Figure 5As shown, the self-weight compensation component 33 of one embodiment of the present invention utilizes the repulsive force or attractive force between the first magnet portion 331 arranged on the side of the carrier reference plate portion 221 and the second magnet portion 332 arranged on the side of the fine motion carrier plate portion 222 to provide a suspension force of a magnitude corresponding to the gravity applied to the fine motion carrier plate portion 222.

[0135] The first magnet portion 331 and the second magnet portion 332 can be formed of electromagnets or permanent magnets.

[0136] For example, Figure 3d As shown, by arranging the first magnet portion 331 provided on the side of the stage reference plate portion 221 and the second magnet portion 332 provided on the side of the fine-motion stage plate portion 222 so that magnetic poles of opposite polarities are opposed to each other, the first magnet portion 331 provided on the side of the stage reference plate portion 221 attracts the second magnet portion 332 provided on the side of the fine-motion stage plate portion 222 upward, thereby offsetting the gravity applied to the fine-motion stage plate portion 222.

[0137] Alternatively, the gravity of the fine movement stage plate 222 can be offset by the repulsive force between the first magnet 331 provided on the stage reference plate 221 side and the second magnet 332 provided on the fine movement stage plate 222 side.

[0138] For example, Figure 5 As shown, the first magnet portion 331 and the second magnet portion 332 may be arranged so that their magnetic poles of the same polarity face each other, and a spacer 333 extending in the Z direction may be sandwiched between the fine movement stage plate portion 222 and the second magnet portion 332, with the lower end of the second magnet portion 332 being arranged higher than the lower end of the first magnet portion 331. In other words, the length of the spacer 333 in the Z direction may be set so that the lower end of the second magnet portion 332 provided on the fine movement stage plate portion 222 side is higher than the lower end of the first magnet portion 331 provided on the stage reference plate portion 221 side (i.e., further away from the fine movement stage plate portion 222).

[0139] With this structure, the second magnet 332 provided on the fine movement stage plate 222 side receives a repulsive force upward from the first magnet 331 provided on the stage reference plate 221 side, thereby canceling out the gravity applied to the fine movement stage plate 222 .

[0140] In order to support the fine-motion stage plate 222 more stably, it is preferred that Figure 3a As shown, the self-weight compensation components 33 are provided at least at three locations in the XY plane. For example, preferably, they are provided symmetrically around the center of gravity of the fine movement stage plate 222.

[0141] As described above, in the film forming apparatus 11 according to one embodiment of the present invention, the use of the deadweight compensation member 33 can reduce the load on the magnetic levitation linear motor 31 and the heat generated by the magnetic levitation linear motor 31. This can suppress thermal degradation of the organic material formed on the substrate W.

[0142] That is, if the weight of the fine movement stage plate 222 is supported solely by the Z-direction magnetic levitation linear motor 313 without using the deadweight compensation member 33, an excessive load would be applied to the Z-direction magnetic levitation linear motor 313, generating considerable heat, which could potentially cause degradation of the organic material being deposited on the substrate W. In this embodiment, the gravity applied to the fine movement stage plate 222 is offset by the deadweight compensation member 33. Therefore, the Z-direction magnetic levitation linear motor 313 only needs to provide the driving force for fine movement in the Z direction to the fine movement stage plate 222 suspended by the deadweight compensation member 33, thereby reducing the load.

[0143] In one embodiment of the present invention, the self-weight compensation component 33 is implemented by magnets, but the present invention is not limited thereto. As long as it can offset the gravity of the fine motion stage plate 222 and make it levitate, it may also have other structures.

[0144] The origin positioning member 34 of the magnetic levitation unit 223 of one embodiment of the present invention is a member that determines the origin position of the fine movement stage plate 222 and can be composed of a kinematic coupling including a triangular pyramid-shaped concave portion 341 and a hemispherical convex portion 342 .

[0145] For example, Figure 3c As shown, a triangular pyramid-shaped recess 341 is provided on the stage reference plate 221 side, and a hemispherical protrusion 342 is provided on the fine movement stage plate 222 side. When the hemispherical protrusion 342 is inserted into the triangular pyramid-shaped recess 341, the hemispherical protrusion 342 contacts the inner surface of the triangular pyramid-shaped recess 341 at three supporting points, thereby determining the position of the fine movement stage plate 222.

[0146] like Figure 3a As shown, by symmetrically providing three such kinematic coupling type origin positioning members 34 at equal intervals (e.g., 120° intervals) around the center of the fine movement stage plate 222, the center position of the fine movement stage plate 222 can be maintained constant. Specifically, the laser interferometer 32 is used to measure the position of the fine movement stage plate 222 when the fine movement stage plate 222 is brought close to the stage reference plate 221 and the convex portions 342 of the three origin positioning members are seated in the concave portions 341, and this position is used as the origin position.

[0147] According to the film forming apparatus 11 of one embodiment of the present invention, by using three kinematic coupling devices as the origin positioning member 34 , the origin position of the fine movement stage plate 222 can be determined to be constant, and the position of the fine movement stage plate 222 can be controlled more precisely.

[0148] <Rough alignment method>

[0149] Hereinafter, a rough alignment method for adjusting the alignment marks formed on the substrate W and the mask M using the rough alignment mechanism of the present invention so as to enter the field of view of the fine alignment camera will be described for each of the substrate W and the mask M.

[0150] First, a method of roughly aligning the mask M will be described.

[0151] The mask M is carried into the vacuum chamber 21 by the transport robot 14 and handed over to the receiving claws 28. The coarse motion Z stage mechanism 233 to which the receiving claws 28 are attached brings the mask M supported by the receiving claws 28 close to a preset measurement distance of the rough alignment camera.

[0152] When the mask M is within the measurement distance of the rough alignment camera, the alignment mark of the mask M is photographed by the rough alignment camera, and the position of the alignment mark of the mask M in the XYθ direction within the field of view of the rough alignment camera is measured. Based on the measurement result, the coarse motion stage mechanism 232 is used to move the mask M so that the alignment mark of the mask M comes to the center of the field of view of the rough alignment camera.

[0153] Next, the coarse motion Z stage mechanism 233 transfers the mask M, supported by the receiving claws 28, to the mask receiving pins 281. After the mask M moves away from the receiving claws 28 and is transferred to the mask receiving pins 281, the drive mechanism moves the receiving claws 28 to a retracted position. Furthermore, after the mask M moves away from the receiving claws 28 and is transferred to the mask receiving pins 281, the coarse motion stage mechanism 232 moves its position in the X, Y, and θ directions to the respective stroke centers (origins). This operation ensures that the position of the mask M in the X, Y, and θ directions is always aligned with the stroke center of the coarse motion stage mechanism 232, regardless of the transport position of the mask M by the robot hand.

[0154] Next, the coarse movement Z stage mechanism 233 is moved upward to receive the mask M from the mask receiving pins 281 and place it on the mask setting surface of the mask stage 23 , thereby completing the rough alignment of the mask M.

[0155] Next, a method of roughly aligning the substrate W will be described.

[0156] 6 is a diagram illustrating a series of operations from the rough alignment operation described above, in which the substrate W is loaded into the film forming apparatus 11 while the alignment mark of the mask M is aligned with the center of the coarse movement stage mechanism 232, to the completion of the rough alignment.

[0157] First, the receiving claw 28 that has moved to the retreat position is returned to the receiving position. In this state, the substrate W is carried into the vacuum container 21 by the transport robot 14 and is handed over to the receiving claw 28 ( Figure 6a ). Similar to the rough alignment operation of the mask M, the coarse motion Z stage mechanism 233 equipped with the receiving claw 28 brings the substrate W supported by the receiving claw 28 close to a predetermined measurement distance of the rough alignment camera. When the substrate W reaches the measurement distance of the rough alignment camera, the rough alignment camera is used to capture the alignment mark of the substrate W, and the position of the alignment mark of the substrate W in the XYθ direction within the field of view of the rough alignment camera is measured ( Figure 6b Based on the measurement result, the coarse motion stage mechanism 232 is used to move the substrate W so that the alignment mark of the substrate W comes to the center of the field of view of the rough alignment camera ( Figure 6c ).

[0158] Next, when the substrate W supported by the receiving claw 28 is brought sufficiently close to or in contact with the substrate adsorption component provided on the fine motion stage mechanism 22 by the coarse motion Z stage mechanism 233, a substrate adsorption voltage is applied to the substrate adsorption component, and the substrate W is adsorbed to the substrate adsorption component by electrostatic attraction ( Figure 6d ). When the substrate W is adsorbed onto the substrate adsorption component, the adsorption surface of the substrate adsorption component can be made to adsorb the entire surface of the substrate W at the same time, or the substrate W can be adsorbed sequentially from one area of ​​the multiple areas of the substrate adsorption component toward other areas. The rough alignment of the substrate W is completed by the adsorption of the substrate W onto the substrate adsorption component. At this time, a plastic mechanism can also be added to the receiving claw 28, and the plastic mechanism is intended to alleviate the impact caused by the contact or collision of the substrate W with the substrate adsorption component. After the substrate W is adsorbed onto the substrate adsorption component on the micro-motion stage mechanism 22, the driving mechanism is used to move the receiving claw 28 to the retreat position.

[0159] During the above rough alignment process of the substrate W, the alignment mark of the mask M may sometimes move from the alignment completion position performed previously. In the state where the rough alignment of the substrate W is completed, that is, after the substrate W is adsorbed on the substrate adsorption component on the fine motion stage mechanism 22, the aforementioned rough alignment action of the mask M is performed again, thereby moving the alignment mark of the mask M that has moved from the center of the field of view of the alignment camera to the center of the field of view of the camera again. That is, after the mask M placed on the mask stage 23 is raised to the measurement distance of the aforementioned rough alignment camera, the position of the alignment mark of the mask M is measured using the rough alignment camera, and the mask M is moved using the coarse motion stage mechanism 232 so that the alignment mark of the mask M comes to the center of the field of view of the camera ( Figure 6e ) Thus, the rough alignment is completed by adjusting the alignment marks formed on the substrate W and the mask M so as to enter the field of view of the fine alignment camera.

[0160] <Fine alignment method>

[0161] The control unit of the film forming apparatus 11 drives the coarse motion Z stage mechanism 233 to bring the substrate suction member 24 relatively close to the mask stage 23. At this time, the control unit brings the substrate suction member 24 relatively close to the mask stage 23 (for example, by raising the mask stage 23 or lowering the substrate W) until the distance between the substrate W suctioned to the substrate suction member 24 and the mask M supported by the mask stage 23 reaches a preset fine alignment measurement distance.

[0162] When the distance between the substrate W and the mask M reaches the fine alignment measurement distance, the alignment marks of the substrate W and the mask M are photographed by the fine alignment camera, and the XYθ Z The relative position of the substrate W and the mask M in the direction is measured, and the relative position deviation amount is calculated based on the measurement result.

[0163] If the relative position offset between the substrate W and the mask M is larger than the specified threshold, the mask M is lowered again (or the substrate W is raised again). After the substrate W and the mask M are separated, the moving target position of the fine-motion stage plate 222 is calculated based on the position of the fine-motion stage plate 222 measured by the laser interferometer 32 and the relative position offset between the substrate W and the mask M.

[0164] Based on the calculated target position, the position of the fine movement stage plate 222 is measured by the laser interferometer 32, and the magnetic levitation linear motor 31 is used to move the fine movement stage plate 222 in the XYθ direction. Z The fine movement stage plate portion 222 is driven to a movement target position in the direction, thereby adjusting the relative position of the substrate W and the mask M.

[0165] This process is repeated until the relative positional deviation between the substrate W and the mask M becomes smaller than a predetermined threshold value.

[0166] When the relative positional deviation between the substrate W and the mask M is smaller than a predetermined threshold, the substrate W is lowered to a vapor deposition position where the film formation surface of the substrate W adsorbed by the substrate adsorption member 24 contacts the upper surface of the mask M.

[0167] When the substrate W reaches the vapor deposition position where the mask M contacts the substrate W, the magnetic force applying member 26 is lowered to pull the mask M closer via the substrate W, so that the substrate W and the mask M come into close contact with each other.

[0168] In this process, in order to confirm whether the XYθ of the substrate W and the mask M is generated Z The relative position of the substrate W and the mask M is measured using a fine alignment camera to prevent position deviation in the direction. When the measured relative position deviation is above a specified threshold, the substrate W and the mask M are separated again (for example, the substrate W is raised) to a specified distance, and the relative position between the substrate W and the mask M is adjusted, and the same process is repeated.

[0169] When the substrate W and the mask M are located at the vapor deposition position and the relative positional deviation between the substrate W and the mask M is smaller than a predetermined threshold, the alignment step is completed and the film formation step is started.

[0170] <Film Formation Process>

[0171] According to the alignment method of this embodiment, when the relative positional deviation between the substrate W and the mask M is smaller than a predetermined threshold, the shutter of the film forming source 25 is opened and the film forming material is formed on the substrate W through the mask M.

[0172] After vapor deposition to a desired thickness, the magnetic force applying member 26 is raised to separate the mask M, and the mask stage 23 is lowered.

[0173] Next, the manipulator of the transport robot 14 is moved into the vacuum chamber 21 of the film forming apparatus 11, and a substrate separation voltage of zero (0) or opposite polarity is applied to the electrode portion of the substrate adsorption member 24 to separate the substrate W from the substrate adsorption member 24. The separated substrate W is then carried out of the vacuum chamber 21 by the transport robot 14.

[0174] In addition, in the above description, the film forming device 11 is set to a so-called upward evaporation method (upward deposition) structure in which the film is formed with the film forming surface of the substrate W facing downward in the vertical direction, but the present invention is not limited to this. It can also be a structure in which the substrate W is arranged on the side of the vacuum container 21 in a vertically upright state and the film is formed with the film forming surface of the substrate W parallel to the direction of gravity.

[0175] As described above, according to the present invention, a receiving claw serving as a holding component for temporarily receiving a substrate and a mask carried into a film forming apparatus is configured to move between a receiving position for receiving the substrate and the mask and a retreat position for preventing interference between the substrate and the mask. By arranging this structure together with the mask stage in a coarse motion stage mechanism, there is no need to separately arrange a stage mechanism for moving the substrate and a stage mechanism for moving the mask. A common stage mechanism can be used to perform a rough alignment of the substrate and the mask, thereby reducing the size and cost of the apparatus.

[0176] <Other Implementation Methods>

[0177] The above-described embodiment is merely an example of the present invention, and the present invention is not limited to the configuration of the above-described embodiment, but can be modified appropriately within the scope of the technical concept.

[0178] For example, Figure 7 As shown, during the rough alignment action described above, or when the mask M is attracted to the side of the substrate W by the magnetic force applying component 26 after the alignment is completed, in order to prevent the mask M from shaking on the mask table 23 and causing the position to shift, a mask fixing mechanism 29 can be further provided on the mask table 23.

[0179] As shown, the mask fixing mechanism 29 can prevent the mask M on the mask stage 23 from moving when the mask stage 23 is moved by the coarse movement stage mechanism 232 or the like for the aforementioned rough alignment while the mask M is placed on the mask setting surface of the mask stage 23. This can further improve the accuracy of the rough alignment operation of the mask M.

[0180] Furthermore, the rough alignment mechanism of the present invention can also cope with the case where the alignment mark is significantly deviated from the camera's field of view during the rough alignment described above. FIG8 is a diagram conceptually illustrating the alignment processing steps using the rough alignment mechanism of the present invention in this case. Figure 8a It is the same as the aforementioned Figure 6b The corresponding figure shows a situation where the substrate W carried into the film forming apparatus 11 is photographed at the measurement position for rough alignment, with the alignment mark of the mask M aligned with the center of the coarse movement stage mechanism 232. As shown in the figure, the alignment mark of the substrate W is outside the camera's field of view and cannot be found. In this way, when the alignment mark cannot be found within the camera's field of view, the coarse movement stage mechanism 232 is driven back and forth and left and right in the horizontal plane while searching for the alignment mark of the substrate W ( Figure 8bIf the alignment mark of the substrate W is found, then after calculating its coordinates, the aforementioned operation of adsorbing the substrate W onto the substrate adsorption component and driving the coarse motion stage mechanism 232 in this state to move the mask M is repeated, thereby reducing the distance between the alignment mark of the substrate W and the alignment mark of the mask M, so that both marks enter the field of view of the camera ( Figure 8c When the two marks enter the camera field of view together, first, the coarse motion stage mechanism 232 is driven so that the alignment mark of the substrate W comes to the center of the camera field of view, so that the substrate W with the position adjustment is adsorbed on the substrate adsorption component ( Figure 8d ), then, after driving the coarse motion stage mechanism 232 in the opposite direction with the same movement amount to return the alignment of the mask M to its original position within the camera field of view ( Figure 8e ), and finally, the coarse motion stage mechanism 232 is driven so that the alignment mark of the mask M comes to the center of the field of view of the camera ( Figure 8f ). Thus, even when the alignment mark is significantly deviated from the field of view of the camera, an alignment operation using the rough alignment mechanism of the present invention can be achieved.

[0181] Description of Reference Numerals

[0182] 11: Film forming device

[0183] 22: Micro-motion stage mechanism

[0184] 23: Mask stage

[0185] 24: Substrate adsorption components

[0186] 28: Receiving claw (holding part)

[0187] 232: Coarse motion stage mechanism

[0188] 233: Coarse motion Z stage mechanism

[0189] 29: Mask fixing mechanism

Claims

1. An alignment mechanism for adjusting the position of a substrate and a mask, characterized in that: The alignment mechanism comprises: A substrate adsorption component, the substrate adsorption component is used to adsorb and hold the substrate; a mask supporting member, the mask supporting member supporting the mask; a temporary receiving member provided on the mask supporting member and configured to temporarily support at least one of the substrate adsorbed on the substrate adsorbing member and the mask placed on the mask supporting member; a horizontal coarse motion stage mechanism, the horizontal coarse motion stage mechanism carrying the mask support member and the temporary receiving member so as to move the mask support member and the temporary receiving member in a horizontal plane; and a vertical coarse motion stage mechanism, which raises and lowers the horizontal coarse motion stage mechanism; By driving the horizontal coarse motion stage mechanism and moving the mask supporting member and the temporary receiving member in a horizontal plane, the position of the substrate temporarily supported by the temporary receiving member relative to the substrate adsorption member is adjusted before the substrate is adsorbed and held by the substrate adsorption member. The substrate adsorption member adsorbs and holds the position-adjusted substrate.

2. The alignment mechanism according to claim 1, wherein: The temporary receiving member can take two positions: a receiving position where the substrate or the mask can be received, and a retreat position where interference with the substrate or the mask can be avoided.

3. The alignment mechanism according to claim 2, wherein: The temporary receiving member moves from the receiving position to the retreat position after the substrate supported by the temporary receiving member is positionally adjusted and adsorbed on the substrate adsorption member, or after the mask supported by the temporary receiving member is positionally adjusted and placed on the mask supporting member.

4. The alignment mechanism according to any one of claims 1 to 3, characterized in that: The alignment mechanism further includes a position detection component for detecting positions of substrate alignment marks formed on the substrate and mask alignment marks formed on the mask. The horizontal coarse motion stage mechanism moves the mask support component and the temporary receiving component in a horizontal plane based on the detected substrate alignment mark and the mask alignment mark, so as to adjust the position of the substrate or mask supported by the temporary receiving component or the mask placed on the mask support component.

5. The alignment mechanism according to any one of claims 1 to 3, characterized in that: The mask support member further includes a mask fixing mechanism capable of suppressing loosening of the mask placed on the mask support member.

6. The alignment mechanism according to any one of claims 1 to 3, characterized in that: The alignment mechanism further includes a fine-motion stage mechanism, and the fine-motion stage mechanism is capable of adjusting the position of the substrate adsorption component.

7. The alignment mechanism according to claim 6, wherein: The micro-motion stage mechanism is a magnetic levitation stage mechanism including a fixed plate portion, a movable plate portion and a magnetic levitation unit. The fixed plate portion is fixedly arranged parallel to the adsorption surface of the substrate adsorption component. The movable plate portion can move relative to the fixed plate portion. The magnetic levitation unit is used to make the movable plate portion magnetically levitate and move relative to the fixed plate portion.

8. The alignment mechanism according to claim 7, wherein: The substrate adsorption component is provided on the movable plate portion.

9. A film forming device for forming a film of a film forming material on a substrate via a mask, characterized in that: The film forming device comprises: Vacuum container; The alignment mechanism according to any one of claims 1 to 8, wherein the alignment mechanism is provided in the vacuum container and is used to adjust the positions of the substrate and the mask; and The film forming source is provided in the vacuum container and is used for storing a film forming material and granulating the film forming material for ejection.

10. An alignment method for adjusting the positions of a substrate and a mask using an alignment mechanism, the alignment mechanism comprising: A substrate adsorption component, the substrate adsorption component is used to adsorb and hold the substrate; a mask supporting member, the mask supporting member supporting the mask; a temporary receiving member, the temporary receiving member being provided on the mask supporting member and temporarily supporting the substrate and the mask; A horizontal coarse motion stage mechanism, which carries the mask support member and the temporary receiving member to move the mask support member and the temporary receiving member in a horizontal plane; and a vertical coarse motion stage mechanism, which raises and lowers the horizontal coarse motion stage mechanism, characterized in that The alignment method comprises: a substrate temporary receiving step, in which the brought-in substrate is supported by the temporary receiving member, wherein the temporary receiving member is configured to temporarily support the substrate before the substrate is adsorbed and held by the substrate adsorption member, and to temporarily support the mask before the mask is supported by the mask support member; a substrate position adjustment step, in which, while the substrate is temporarily supported by the temporary receiving member, the mask supporting member and the temporary receiving member are moved in a horizontal plane by driving the horizontal coarse motion stage mechanism, thereby adjusting the position of the substrate supported by the temporary receiving member relative to the substrate adsorption member, wherein the mask supporting member is configured to support the mask after the mask is temporarily supported by the temporary receiving member, and the temporary receiving member is configured to temporarily support the substrate before the substrate is adsorbed and held by the substrate adsorption member, and to temporarily support the mask before the mask is supported by the mask supporting member; and A substrate adsorption process, in which the substrate whose position is adjusted in the substrate position adjustment process by driving the horizontal coarse motion stage mechanism and moving the mask support component and the temporary receiving component in the horizontal plane is adsorbed on the substrate adsorption component.

11. The alignment method according to claim 10, wherein: Before the substrate temporary receiving step, the alignment method further includes: a mask temporary receiving step, in which the mask is temporarily received by the temporary receiving member; a mask position adjustment step in which the mask supporting member and the temporary receiving member are moved in a horizontal plane by driving the horizontal coarse motion stage mechanism, thereby adjusting the position of the mask supported by the temporary receiving member; and A mask placing step of placing the mask whose position has been adjusted in the mask position adjusting step on the mask supporting member.

12. The alignment method according to claim 11, wherein: After the substrate adsorption process, the alignment method also includes a mask position readjustment process. In the mask position readjustment process, the mask support component and the temporary receiving component are moved again in the horizontal plane by driving the horizontal coarse motion stage mechanism, thereby adjusting the position of the mask placed on the mask support component.

13. The alignment method according to claim 11 or 12, characterized in that: The temporary receiving member can take two positions: a receiving position and a retreat position. The receiving position is a position capable of receiving the substrate or the mask, and the retreat position is a position capable of avoiding interference with the substrate or the mask. After the mask is placed on the mask support member in the mask placement step, the temporary receiving member is moved from the receiving position to the retreat position.

14. The alignment method according to any one of claims 10 to 12, characterized in that: The temporary receiving member can take two positions: a receiving position and a retreat position. The receiving position is a position capable of receiving the substrate or the mask, and the retreat position is a position capable of avoiding interference with the substrate or the mask. After the substrate is adsorbed onto the substrate adsorption member in the substrate adsorption step, the temporary receiving member is moved from the receiving position to the retreat position.

15. The alignment method according to claim 11 or 12, characterized in that: When the horizontal coarse movement stage mechanism is driven to move the mask support member in the mask position adjustment step, the position of the mask on the mask support member is fixed by a mask fixing mechanism.

16. The alignment method according to any one of claims 10 to 12, characterized in that: The alignment mechanism further includes a position detection component for detecting positions of substrate alignment marks formed on the substrate and mask alignment marks formed on the mask. In the substrate position adjustment operation of the substrate position adjustment step, the position of the substrate supported by the temporary receiving member is adjusted based on the substrate alignment mark detected by the position detection member.

17. The alignment method according to claim 16, wherein: The substrate position adjustment step of driving the horizontal coarse movement stage mechanism to adjust the position of the substrate further includes a step of using the vertical coarse movement stage mechanism to move the horizontal coarse movement stage mechanism to a position where the substrate alignment mark can be measured by the position detection component.

18. The alignment method according to claim 12, wherein: The alignment mechanism further includes a position detection component for detecting positions of substrate alignment marks formed on the substrate and mask alignment marks formed on the mask. The substrate position adjustment action in the substrate position adjustment step and the mask position adjustment action in the mask position adjustment step and the mask position readjustment step respectively adjust the position of the substrate or mask supported by the temporary receiving member or the mask placed on the mask supporting member based on the substrate alignment mark or the mask alignment mark detected by the position detection member. In the substrate position adjustment step of adjusting the position of the substrate, when the substrate alignment mark cannot be found within the detection field of the position detection component, The alignment method further comprises: a step of driving the horizontal coarse motion stage mechanism to search for the substrate alignment mark; The coordinates of the searched substrate alignment mark are calculated, and based on the calculated coordinates, the substrate position adjustment process, the substrate adsorption process and the mask position readjustment process are repeatedly performed to make the mask alignment mark and the substrate alignment mark enter the detection field of view of the position detection component together.

19. The alignment method according to claim 16, wherein: The alignment mechanism further includes a micro-motion stage mechanism, which is capable of adjusting the position of the substrate adsorption component. The alignment method further includes a step of finely adjusting the relative position between the position-adjusted substrate and the mask using the fine-motion stage mechanism.

20. The alignment method according to claim 19, wherein: The micro-motion stage mechanism is a magnetic levitation stage mechanism including a fixed plate portion, a movable plate portion and a magnetic levitation unit. The fixed plate portion is fixedly arranged parallel to the adsorption surface of the substrate adsorption component. The movable plate portion can move relative to the fixed plate portion. The magnetic levitation unit is used to make the movable plate portion magnetically levitate and move relative to the fixed plate portion.

21. The alignment method according to claim 20, wherein: The substrate adsorption component is provided on the movable plate portion.

22. An alignment method for adjusting the positions of a substrate and a mask using an alignment mechanism, the alignment mechanism comprising: A substrate adsorption component, the substrate adsorption component is used to adsorb and hold the substrate; a mask supporting member, the mask supporting member supporting the mask; a temporary receiving member, the temporary receiving member being provided on the mask supporting member and temporarily supporting the substrate and the mask; A horizontal coarse motion stage mechanism, which carries the mask support member and the temporary receiving member to move the mask support member and the temporary receiving member in a horizontal plane; and a vertical coarse motion stage mechanism, which raises and lowers the horizontal coarse motion stage mechanism, characterized in that The alignment method comprises: a mask temporary receiving step, in which the brought-in mask is supported by the temporary receiving member, wherein the temporary receiving member is configured to temporarily support the substrate before the substrate is adsorbed and held by the substrate adsorption member, and to temporarily support the mask before the mask is supported by the mask supporting member; a mask position adjustment step, in which, while the mask is temporarily supported by the temporary receiving member, the mask supporting member and the temporary receiving member are moved in a horizontal plane by driving the horizontal coarse motion stage mechanism, thereby adjusting the position of the mask supported by the temporary receiving member, wherein the mask supporting member is configured to support the mask after the mask is temporarily supported by the temporary receiving member, the temporary receiving member is configured to temporarily support the substrate before the substrate is adsorbed and held by the substrate adsorption member, and can temporarily support the mask before the mask is supported by the mask supporting member; and A mask placing step is performed in which the mask, whose position is adjusted in the mask position adjusting step by driving the horizontal coarse motion stage mechanism and moving the mask supporting member and the temporary receiving member in a horizontal plane, is placed on the mask supporting member.

23. A film forming method for forming a film of a film forming material on a substrate via a mask, characterized in that: The film forming method comprises: a step of adjusting the positions of the substrate and the mask by the alignment method according to any one of claims 10 to 22; and A step of forming a film of a film-forming material granulated by a film-forming source on the substrate through the mask.

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