Multi-layer ceramic capacitor end detection device and detection method

Abstract

The present invention discloses an end detection device for multilayer ceramic capacitors, which includes an introduction plate, cutting glue, and an ultrasonic scanning microscope; a plurality of introduction holes are formed in the introduction plate, and the introduction holes are used for implanting upright multilayer ceramic capacitors; the cutting glue is used for pasting each of the multilayer ceramic capacitors implanted into the introduction holes; the ultrasonic scanning microscope includes a water tank and a sensor probe arranged above the water tank, the water tank is used for carrying the introduction plate implanted with a plurality of multilayer ceramic capacitors, and the sensor probe is used for scanning the multilayer ceramic capacitors to obtain an entity scan image and a back scan image of the scanning area. The present invention can judge whether each multilayer ceramic capacitor is a defective product one by one through the entity scan image and the back scan image, thereby realizing batch detection of multilayer ceramic capacitors, with short detection time, high efficiency, and high precision measurement. The present invention discloses a method for detecting the ends of multilayer ceramic capacitors.

Description

Technical Field

[0001] The present invention relates to the technical field of multi-layer ceramic capacitors, and particularly to a device and a method for detecting the ends of multi-layer ceramic capacitors. Background Art

[0002] A multi-layer ceramic capacitor (MLCC) is formed by laminating printed ceramic dielectric films with internal electrodes in a staggered manner and then sintering them at a high temperature in one go to form a ceramic chip, and then sealing metal layers (end electrodes) at both ends of the ceramic chip. During the production process of MLCC, various detections are required. For example, the ends of MLCC may have states such as electrode ejection and end swelling. Such end defects will seriously affect the electrical performance of MLCC. Therefore, it is necessary to detect the ends of MLCC.

[0003] The existing ultrasonic scanning sample preparation method is a horizontal sample preparation method, that is, after arranging many multi-layer ceramic capacitors horizontally, the internal structure of MLCC is scanned using an ultrasonic scanning microscope. This method can detect whether there are defects such as cracks, delamination, inclusions, and holes inside MLCC, but it cannot identify abnormal end conditions such as electrode ejection and end swelling of MLCC. Another existing method is destructive physical analysis (DPA). This method requires arranging MLCC samples neatly one by one and then curing and grinding them. Therefore, the detection time is long, the efficiency is low, and the DPA sampling quantity is small, and the detection rate of abnormal products is relatively low.

[0004] Therefore, it is necessary to provide a detection device and a detection method with a short detection time, high efficiency, and capable of accurately detecting the end conditions of MLCC to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a device for detecting the ends of multi-layer ceramic capacitors with a short detection time, high efficiency, and capable of accurately detecting the end conditions of MLCC.

[0006] Another purpose of the present invention is to provide a method for detecting the ends of multi-layer ceramic capacitors with a short detection time, high efficiency, and capable of accurately detecting the end conditions of MLCC.

[0007] To achieve the above object, the technical solution of the present invention is: to provide a multi-layer ceramic capacitor end detection device, which includes an introduction plate, cutting glue, and an ultrasonic scanning microscope; wherein, a plurality of introduction holes are formed on the introduction plate, and the introduction holes are used for implanting upright multi-layer ceramic capacitors; the cutting glue is used for pasting each of the multi-layer ceramic capacitors implanted into the introduction holes; the ultrasonic scanning microscope includes a water tank, a sensor probe arranged above the water tank, a controller electrically connected to the sensor probe, and a display device electrically connected to the controller. The water tank is used for carrying the introduction plate implanted with a plurality of the multi-layer ceramic capacitors, the sensor probe is used for scanning the multi-layer ceramic capacitors to obtain a physical scan image and a back scan image of the scan area, and the controller is used for controlling the display device to display the physical scan image and the back scan image.

[0008] Preferably, the thickness of the introduction plate is less than or equal to the height of the multi-layer ceramic capacitor, and the diameter of the introduction hole is greater than or equal to the outer diameter of the multi-layer ceramic capacitor, so as to ensure that the multi-layer ceramic capacitors implanted into the introduction holes are in an upright state, facilitating the detection of the end defects thereof.

[0009] Preferably, at least one piece of the cutting glue is pasted on one side of the introduction plate, and the area of each piece of the cutting glue is less than or equal to the area of the introduction plate, and each piece of the cutting glue forms a scan area.

[0010] Preferably, the controller is further used for obtaining the echo waveform of a single multi-layer ceramic capacitor and controlling the display device to display the echo waveform, and further confirming whether the multi-layer ceramic capacitor is a defective product through the phase change of the echo waveforms of the multi-layer ceramic capacitors.

[0011] Compared with the prior art, since the multi-layer ceramic capacitor end detection device of the present invention first sets an introduction plate to batch-implant upright multi-layer ceramic capacitors, and uses cutting glue to paste each of the upright multi-layer ceramic capacitors implanted into the introduction holes, and then uses the sensor probe of the ultrasonic scanning microscope to scan the multi-layer ceramic capacitors on the introduction plate to obtain a physical scan image and a back scan image of the scan area. Since ultrasonic waves cannot propagate in the air, when there are holes caused by abnormal conditions such as electrode ejection or end bulging of the multi-layer ceramic capacitor, the ultrasonic waves return and the back wave is advanced, resulting in the physical scan image of the multi-layer ceramic capacitor showing white. Correspondingly, its back scan image will show black or dark gray. Therefore, in the present invention, it is possible to judge whether each multi-layer ceramic capacitor is a defective product one by one through the physical scan image and the back scan image of the scan area, thereby realizing the batch detection of multi-layer ceramic capacitors, with short detection time, high efficiency, and accurate detection of the end conditions of multi-layer ceramic capacitors and high precision measurement.

[0012] Correspondingly, the present invention also provides a method for detecting the end heads of multilayer ceramic capacitors, which includes the following steps:

[0013] (1) Provide an introduction plate having a plurality of introduction holes, paste cutting glue on one side surface of the introduction plate, and turn over the introduction plate so that the cutting glue is located at its bottom;

[0014] (2) Place a plurality of multilayer ceramic capacitors in the area of the introduction plate where the cutting glue is pasted, and vertically implant each multilayer ceramic capacitor into one of the introduction holes, and one end of each multilayer ceramic capacitor is bonded to the cutting glue;

[0015] (3) Uniformly spray alcohol on the multilayer ceramic capacitors, and then place the introduction plate implanted with the plurality of multilayer ceramic capacitors into the water tank of an ultrasonic scanning microscope;

[0016] (4) Control the sensor probe of the ultrasonic scanning microscope to scan the scanning area on the introduction plate according to a preset scanning method to obtain a physical scanning image and a back scanning image of the scanning area, and display the physical scanning image and the back scanning image through a display device;

[0017] (5) Determine whether each of the multilayer ceramic capacitors in the scanning area is a defective product through the physical scanning image and the back scanning image.

[0018] Preferably, in the method for detecting the end heads of multilayer ceramic capacitors of the present invention, the step (5) is specifically: if the multilayer ceramic capacitor is black in the physical scanning image and white in the back scanning image, then this layer of ceramic capacitor is a good product; on the contrary, if the multilayer ceramic capacitor is white in the physical scanning image and black or dark gray in the back scanning image, then this multilayer ceramic capacitor is a defective product.

[0019] Preferably, in the method for detecting the end heads of multilayer ceramic capacitors of the present invention, the following steps are further included:

[0020] (6) Obtain the echo waveforms of each of the multilayer ceramic capacitors determined to be defective products in the step (5) one by one, and display the echo waveforms of each of the multilayer ceramic capacitors through the display device, and further confirm whether this multilayer ceramic capacitor is a defective product through the phase change of the echo waveforms of each of the multilayer ceramic capacitors.

[0021] Preferably, in the method for detecting the end heads of multilayer ceramic capacitors of the present invention, the step (6) includes the following steps:

[0022] (61) Obtain the echo waveform of the multi-layer ceramic capacitor that is a normal product as a reference waveform, display the reference waveform through the display device, and select an interval with relatively gentle phase change on the reference waveform as the reference interval;

[0023] (62) Obtain the echo waveform of one of the multi-layer ceramic capacitors determined to be defective in step (5) above, and display the echo waveform below the reference waveform through the display device;

[0024] (63) Check the waveform phase change in the interval corresponding to the reference interval on the echo waveform. If the waveform phase change in this interval is larger than that in the reference interval, then this multi-layer ceramic capacitor is a defective product; then return to step (62).

[0025] Preferably, in the method for detecting the end of a multi-layer ceramic capacitor of the present invention, before step (4), the following steps are further included:

[0026] Preset the scanning range, and the area of the scanning range is less than or equal to the area of each piece of the cutting glue.

[0027] Compared with the prior art, in the method for detecting the end of a multi-layer ceramic capacitor of the present invention, first, a plurality of multi-layer ceramic capacitors are batch-implanted into the implantation holes of the introduction plate, and each multi-layer ceramic capacitor is implanted vertically. Then, the cutting glue is used to paste each multi-layer ceramic capacitor implanted and erected in the implantation holes. Next, the sensor probe of the ultrasonic scanning microscope is used to scan the multi-layer ceramic capacitors on the introduction plate to obtain the solid scanning image and the back scanning image of the scanning area. Since ultrasonic waves cannot propagate in the air, when there are abnormal conditions such as electrode ejection or end bulge in the multi-layer ceramic capacitor, resulting in holes, the ultrasonic waves return and the back wave advances. As a result, the solid scanning image of this multi-layer ceramic capacitor shows white. Correspondingly, its back scanning image will show black or dark gray. Therefore, in the present invention, whether each multi-layer ceramic capacitor is a defective product can be judged one by one through the solid scanning image and the back scanning image of the scanning area, thereby realizing the batch detection of multi-layer ceramic capacitors, with short detection time, high efficiency, and the ability to accurately detect the end conditions of multi-layer ceramic capacitors, and high detection accuracy. Description of the Drawings

[0028] Figure 1 is a schematic structural diagram of the ultrasonic scanning microscope of the multi-layer ceramic capacitor end detection device of the present invention.

[0029] Figure 2 is a schematic structural diagram of the introduction plate of the multi-layer ceramic capacitor end detection device of the present invention.

[0030] Figure 3Yes Figure 2 Schematic diagram of the structure of the import board after pasting and cutting glue in

[0031] Figure 4 Yes Figure 3 Schematic diagram of the structure of the import board for importing multi-layer ceramic capacitors in

[0032] Figure 5 Yes Figure 3 Partial cross-sectional view in

[0033] Figure 6 Yes Figure 4 Partial cross-sectional view of

[0034] Figure 7 Schematic diagram of the state where the import board implanted with multi-layer ceramic capacitors is placed in the water tank of the ultrasonic scanning microscope.

[0035] Figure 8 An entity scan image obtained by scanning with an ultrasonic scanning microscope in the present invention.

[0036] Figure 9 Yes Figure 8 Back scan image corresponding to the entity scan in

[0037] Figure 10 Yes Figure 8 Partial enlarged schematic diagram of

[0038] Figure 11 An echo waveform diagram obtained by an ultrasonic scanning microscope in the present invention. Detailed implementation manners

[0039] Now, embodiments of the present invention will be described with reference to the accompanying drawings, in which like reference numerals represent like elements. The present invention aims to provide a detection device and a detection method capable of batch detecting the end abnormalities of multi-layer ceramic capacitors (abbreviated as MLCC) to improve the detection efficiency and accuracy.

[0040] First, in combination with Figures 1-3As shown in the figure, the end detection device for multilayer ceramic capacitors provided by the present invention includes an introduction plate 100, a cutting adhesive 200, and an ultrasonic scanning microscope 300. Among them, a plurality of introduction holes 110 are penetratingly formed in the introduction plate 100, and the introduction holes 110 are used for implanting the erected multilayer ceramic capacitors 2; the cutting adhesive 200 is used to paste the multilayer ceramic capacitors 2 implanted in the introduction holes 110 to keep the multilayer ceramic capacitors 2 in an erected state. The introduction plate 100 implanted with the multilayer ceramic capacitors 2 is placed below the ultrasonic scanning microscope 300 and scanned by the ultrasonic scanning microscope 300. Since the ultrasonic waves emitted by the ultrasonic scanning microscope 300 are transmitted to the inside of the sample, if they encounter substances with different densities or elastic coefficients, reflected echoes will be generated, that is, refraction, reflection and other phenomena will occur when passing through the interface between two different materials, and waveform phase and energy changes will occur when passing through materials with different impedances. By collecting the changes in reflected energy information or phase information, defects such as delamination, cracks or voids inside the sample can be detected. Using the above principle of the ultrasonic scanning microscope 300, the present invention can quickly detect whether the ends of the multilayer ceramic capacitors 2 are abnormal.

[0041] Refer to the following Figures 2-6 As shown in the figure, in the present invention, the size of the introduction plate 100 is not specifically limited and can be flexibly selected according to needs. However, the thickness of the introduction plate 100 and the aperture of the introduction holes 110 need to be specifically set according to the specifications of the multilayer ceramic capacitors 2 to be detected. Specifically, the aperture of the introduction holes 110 needs to be greater than or equal to the outer diameter of the multilayer ceramic capacitors 2 to be detected, preferably slightly greater than the outer diameter of the multilayer ceramic capacitors 2 to be detected, to ensure that the multilayer ceramic capacitors 2 can be erected and implanted into the introduction holes 110. At the same time, the thickness of the introduction plate 100 is preferably less than or equal to the height of the multilayer ceramic capacitors 2 to be detected, to ensure that the multilayer ceramic capacitors 2 are erected and implanted and then exposed on the surface of the introduction plate 100, so as to facilitate scanning and detecting the defective conditions of their ends.

[0042] In the present invention, for multilayer ceramic capacitors 2 of different specifications (such as 0402 specification, 0603 and above specifications, etc.), a variety of models of introduction plates 100 can be preset. During detection, according to the specific specifications of the multilayer ceramic capacitors 2 to be detected, the corresponding model of introduction plate 100 can be directly selected, which can make the detection more convenient and efficient.

[0043] Refer to Figures 3-6 As shown in the figure, in a specific embodiment of the present invention, first paste the cutting adhesive 200 on one side of the introduction plate 100, and then turn over the introduction plate 100 and the cutting adhesive 200 so that the cutting adhesive 200 is located at the bottom of the introduction plate 100. Refer to Figure 5As shown, the multilayer ceramic capacitor 2 is then vertically implanted into the insertion hole 110, so that one end of the multilayer ceramic capacitor 2 is adhered to the cutting adhesive 200. Refer to Figure 4 , Figure 6 As shown, the fixing of the multilayer ceramic capacitor 2 is achieved through the cutting adhesive 200. Of course, the method of fixing the multilayer ceramic capacitor 2 with the cutting adhesive 200 is not limited to the present embodiment. For example, in other embodiments, the multilayer ceramic capacitor 2 can also be first vertically implanted into the insertion hole 110 on the insertion board 100, and then the cutting adhesive 200 is adhered to one end of the multilayer ceramic capacitor 2 to achieve fixation as well.

[0044] Continue to refer to Figures 3-7 As shown, in the present invention, at least one piece of cutting adhesive 200 is adhered to the insertion board 100, and the area of each piece of cutting adhesive 200 is less than or equal to the area of the insertion board 100. That is to say, one piece of cutting adhesive 200 can be adhered to one side of the insertion board 100, and the area of this cutting adhesive 200 is less than or equal to the area of the insertion board 100. For example Figure 3 In the embodiment shown, a way of adhering a piece of cutting adhesive 200 with a smaller area to one side of the insertion board 100 is illustrated; or multiple pieces of cutting adhesive 200 can be adhered to one side of the insertion board 100 at intervals, and the area of each piece of cutting adhesive 200 is less than or equal to the area of the insertion board 100. For example Figure 7 In the embodiment shown, a way of adhering three pieces of cutting adhesive 200 with smaller areas to one side of the insertion board 100 is illustrated, and the three pieces of cutting adhesive 200 are spaced apart from each other. In the present invention, each piece of cutting adhesive 200 forms a scanning area, and the ultrasonic scanning microscope 300 sequentially scans each scanning area to obtain the entity scanning image and the back scanning image of each scanning area (details will be described later).

[0045] Next, refer to Figure 1 As shown, the ultrasonic scanning microscope 300 includes a frame body 310, a water tank 320, a sensor probe 330, a display device 340, and a controller 350. Among them, the water tank 320 and the sensor probe 330 are respectively installed on the frame body 310. The water tank 320 is used to carry the insertion board 100 implanted with the multilayer ceramic capacitor 2. The sensor probe 330 is disposed above the water tank 320 and is electrically connected to the controller 350. The controller 350 controls the sensor probe 330 to scan the scanning area on the insertion board 100 according to a preset scanning method to obtain the entity scanning image and the back scanning image of the scanning area; the display device 340 is electrically connected to the controller 350, and the controller 350 controls the display device 340 to display the entity scanning image and the back scanning image.

[0046] Understandably, the display device 340 and the controller 350 can be installed on the frame 310, or can be installed at a position outside the frame 310 according to actual usage needs, so as to facilitate the operator's viewing and operation.

[0047] In the present invention, the model of the sensor probe 330 can be selected according to the specific specifications of the multi-layer ceramic capacitor 2 to be detected. Different models of sensor probes 330 are used for multi-layer ceramic capacitors 2 of different specifications to improve the detection accuracy. For example, in a specific embodiment, the multi-layer ceramic capacitor 2 to be detected is of the 0603 and above specifications, and at this time, the sensor probe 330 of SK075 / 050 is selected.

[0048] Continuing to combine Figure 1 、 Figure 4 、 Figure 7 As shown, before the ultrasonic scanning microscope 300 of the present invention works, the scanning range of the sensor probe 330 can be set according to the size of each scanning area, that is, the scanning range of the sensor probe 330 is set according to the size of each piece of cutting glue 200. Therefore, the scanning range is less than or equal to the area of each piece of cutting glue 200. For example, in a specific embodiment, the size of a piece of cutting glue 200 is 70mm * 70mm, then the scanning range of the sensor probe 330 is set to be less than or equal to 70mm * 70mm. As for the scanning method of the sensor probe 330, it is the conventional method of the ultrasonic scanning microscope 300 and will not be described in detail.

[0049] Combined with Figure 1 、 Figures 3-6 、 Figures 8-10 As shown, in the present invention, it is possible to judge whether the end of the multi-layer ceramic capacitor 2 is abnormal according to the entity scanning diagram and the back scanning diagram. Specifically, when ultrasonic waves propagate in a medium, refraction, reflection and other phenomena will occur when passing through different media, and changes in waveform phase and energy will occur when passing through materials with different impedances. Therefore, the ultrasonic scanning microscope 300 uses this characteristic to detect abnormal conditions such as electrode ejection or end bulge at the end of the multi-layer ceramic capacitor 2, and forms an image according to the change of the received signal.

[0050] More specifically, when the multilayer ceramic capacitor 2 has abnormal terminations such as electrode ejection or terminal bulging, the ultrasonic wave returns, and the back wave advances, causing the solid scan image of the multilayer ceramic capacitor 2 to appear white. Conversely, the solid scan image appears black. Therefore, after obtaining the above-mentioned solid scan image and the corresponding back scan image, each multilayer ceramic capacitor 2 in the solid scan image is checked one by one. If the multilayer ceramic capacitor 2 appears black in the solid scan image and white in the corresponding back scan image, it indicates that the multilayer ceramic capacitor 2 is a good product. Correspondingly, when the multilayer ceramic capacitor 2 appears white in the solid scan image and black or dark gray in the corresponding back scan image, it indicates that the multilayer ceramic capacitor 2 is a defective product.

[0051] Specifically refer to Figures 8-10 shown as Figure 8 The solid scan image of a scanned area obtained by scanning according to the present invention is shown. Figure 10 is Figure 8 a partial enlarged schematic view. As can be seen from Figure 8 it, most of the multilayer ceramic capacitors 2 appear black in the solid scan image, and only a very small number appear white. The defective products that appear white are marked as 2` for easy distinction, as shown in the boxes in Figure 8 and Figure 10 . Referring again to Figure 9 shown as Figure 8 the back scan image corresponding to the solid scan image shown in Figure 9 As can be seen from Figure 8 it, the multilayer ceramic capacitors corresponding to the positions of the defective products 2` in Figure 8 all appear black or dark gray. Therefore, these multilayer ceramic capacitors are all defective products 2`. And the multilayer ceramic capacitors 2 corresponding to the positions of the multilayer ceramic capacitors 2 that appear black in

[0052] Next, in combination with Figure 1 and Figures 8-11As shown, in a more preferred embodiment of the present invention, on the basis of the above overall judgment, an ultrasonic scanning microscope 300 can be further used to confirm the multilayer ceramic capacitors initially judged as abnormal products 2' in the above steps, so as to achieve the purpose of precise detection. Specifically, since the ultrasonic waves emitted by the ultrasonic scanning microscope 300 penetrate into the sample interior and are reflected by an interface within the sample to form an echo, the internal condition of the sample can be judged by using the phase change of the echo waveform. Therefore, the present invention uses the ultrasonic scanning microscope 300 to obtain the echo waveform of the multilayer ceramic capacitors that are the abnormal products 2' to further confirm.

[0053] Continuing to combine Figure 1 、 Figure 11 As shown, during specific confirmation, first adjust the sensor probe 330 so that it faces one of the multilayer ceramic capacitors 2. At this time, the controller 350 can obtain the echo waveform of a single multilayer ceramic capacitor 2, and the controller 350 controls the display device 340 to display the echo waveform of the multilayer ceramic capacitor 2. Whether the multilayer ceramic capacitor 2 is an abnormal product can be confirmed through the phase change of its echo waveform, thus achieving the purpose of precise detection.

[0054] Continuing to refer to Figure 8 、 Figures 10-11 As shown, when it is necessary to further confirm the multilayer ceramic capacitors initially judged as abnormal products 2' in the entity scan diagram and the back scan diagram, first, obtain the echo waveform of a multilayer ceramic capacitor 2 that is a normal product as a reference waveform. Specifically, adjust the sensor probe 330 so that it faces one of the multilayer ceramic capacitors 2 that is a normal product. The controller 350 obtains the echo waveform of the multilayer ceramic capacitor 2, and the controller 350 controls the display device 340 to display the echo waveform of the multilayer ceramic capacitor 2. For example, the echo waveform M1 in the upper part of Figure 11 is the reference waveform. Moreover, a specific interval can be selected on this reference waveform as a reference interval. By checking the waveform phase change within the interval corresponding to this reference interval, for example, in the manner shown in Figure 11 , specifically select an interval A1 - A2 with relatively gentle waveform phase change in the reference waveform M1 as the reference interval, and use the waveform phase change within the reference interval A1 - A2 on the reference waveform M1 as a reference benchmark. After selection, the controller 350 automatically stores the width of the interval A1 - A2.

[0055] Refer to Figure 1 、 Figure 9 、 Figure 11As shown, then, adjust the sensor probe 330 so that it faces one of the multilayer ceramic capacitors initially judged as abnormal product 2`, thereby obtaining the echo waveform of the multilayer ceramic capacitor that is the abnormal product 2`. The controller 350 controls the display device 340 to display the echo waveform M2 of the abnormal product 2` below the above-mentioned reference waveform M1, as Figure 11 shown. It can be seen from this echo waveform M2 that within the interval A1 - A2, its waveform phase changes greatly, and within the same interval A1 - A2, the phase change of the echo waveform M2 is greater and more intense than the waveform phase change within the reference interval of the above-mentioned reference waveform M1. Thus, it can be confirmed that the multilayer ceramic capacitor initially judged as abnormal product 2` is indeed an abnormal product.

[0056] Next, adjust the sensor probe 330 so that it faces another multilayer ceramic capacitor initially judged as abnormal product 2`, and repeat the above process to confirm one by one to achieve the purpose of precise detection.

[0057] In summary, due to the end detection device for multilayer ceramic capacitors of the present invention, first, an introduction plate 100 is provided to batch-implant the erected multilayer ceramic capacitors 2, and a cutting adhesive 200 is used to paste each of the erected multilayer ceramic capacitors 2 implanted into the introduction holes 110. Then, the sensor probe 330 of the ultrasonic scanning microscope 300 is used to scan the multilayer ceramic capacitors 2 on the introduction plate 100 to obtain a physical scan image and a back scan image of the scanned area. Since ultrasonic waves cannot propagate in the air, when there are holes caused by abnormal conditions such as electrode ejection or end bulge of the multilayer ceramic capacitor 2, the ultrasonic waves return and the back wave advances, resulting in the physical scan image of the multilayer ceramic capacitor 2 showing white. Correspondingly, its back scan image will show black or dark gray. Therefore, in the present invention, whether each multilayer ceramic capacitor 2 is an abnormal product can be judged one by one through the physical scan image and the back scan image of the scanned area, thereby realizing the batch detection of the multilayer ceramic capacitors 2, with short detection time, high efficiency, and the ability to accurately detect the end conditions of the multilayer ceramic capacitors 2 and high precision of precise detection.

[0058] Next, in combination with Figures 1-11 shown, the end detection method for multilayer ceramic capacitors provided by the present invention uses the end detection device for multilayer ceramic capacitors as described above. Therefore, the structure of the end detection device for multilayer ceramic capacitors will not be described repeatedly. The end detection method for multilayer ceramic capacitors of the present invention specifically includes the following steps:

[0059] S01: Provide an introduction plate 100 having a plurality of introduction holes 110, paste a cutting adhesive 200 on one side surface of the introduction plate 100, and turn over the introduction plate 100 so that the cutting adhesive 200 is located at its bottom;

[0060] As Figure 3, Figure 5 , Figure 7 As shown in Figure 5 and Figure 7 , at least one piece of cutting glue 200 is pasted on the import board 100 according to specific detection needs. The area of each piece of cutting glue 200 is less than or equal to the area of the import board 100. That is to say, a whole piece of cutting glue 200 can be pasted on one side of the import board 100, and the area of this cutting glue 200 is less than or equal to the area of the import board 100. For example, Figure 3 In the embodiment shown in Figure 3 , a way of pasting a piece of cutting glue 200 with a smaller area on one side of the import board 100 is shown; multiple pieces of cutting glue 200 can also be pasted at intervals on one side of the import board 100, and the area of each piece of cutting glue 200 is less than or equal to the area of the import board 100. For example, Figure 7 In the embodiment shown in Figure 7 , a way of pasting three pieces of cutting glue 200 with smaller areas on one side of the import board 100 is shown. The three pieces of cutting glue 200 are spaced apart from each other. And each piece of cutting glue 200 forms a scanning area.

[0061] After flipping, the cutting glue 200 is located at the bottom of the import board 100. Refer to Figure 5 shown, Figure 5 Only a partial view of the import board 100 and the cutting glue 200 is schematically drawn. The number of import holes 110 on the import board 100 is not limited to that shown in this figure.

[0062] S02: Place multiple multilayer ceramic capacitors 2 in the area of the import board 100 where the cutting glue 200 is pasted, and make each multilayer ceramic capacitor 2 vertically implanted into an import hole 110, so that one end of each multilayer ceramic capacitor 2 is bonded to the cutting glue 200;

[0063] Refer to Figure 4 , Figure 6 As shown in Figure 4 and Figure 6 , sprinkle multiple multilayer ceramic capacitors 2 to be detected in the area of the import board 100 where the cutting glue 200 is pasted, and by shaking or other means, make each multilayer ceramic capacitor 2 implanted into an import hole 110. Since the aperture of the import hole 110 is adapted to the outer diameter of the multilayer ceramic capacitor 2, it can be ensured that the multilayer ceramic capacitor 2 is vertically implanted, and one end of the multilayer ceramic capacitor 2 is pasted on the cutting glue 200, thereby ensuring that the multilayer ceramic capacitor 2 is in a vertical state during the detection process. Figure 6 Only a few multilayer ceramic capacitors 2 implanted into the import holes 110 are schematically drawn. The number of multilayer ceramic capacitors 2 and import holes 110 is not limited to that shown in this figure.

[0064] S03: Uniformly spray alcohol on the multilayer ceramic capacitors 2, and then put the import board 100 implanted with multiple multilayer ceramic capacitors 2 into the water tank 320 of the ultrasonic scanning microscope 300;

[0065] In this step, spraying alcohol is to avoid the presence of water bubbles between the gaps of the multilayer ceramic capacitor 2, which may affect the acoustic scanning result and cause misjudgment. Of course, it is not limited to eliminating water bubbles by spraying alcohol, and other methods can also be used.

[0066] Refer to Figure 7 As shown, the figure shows the state where the lead-in board 100 implanted with multiple multilayer ceramic capacitors 2 is placed in the water tank 320 of the ultrasonic scanning microscope 300. In Figure 7 the embodiment shown, a method of pasting three spaced cutting adhesives 200 on one side surface of the lead-in board 100 is shown, that is, three scanning areas are formed on the lead-in board 100.

[0067] S04: Control the operation of the sensor probe 330 to scan the scanning areas on the lead-in board 100 according to a preset scanning method, obtain the entity scan image and the back scan image of the scanning areas, and display the entity scan image and the back scan image through the display device 340;

[0068] Specifically, when ultrasonic waves propagate in a medium, if they pass through different media, refraction, reflection and other phenomena will occur, and when passing through materials with different impedances, changes in waveform phase and energy will occur. Therefore, the ultrasonic scanning microscope 300 utilizes this characteristic to detect abnormal conditions at the ends of the multilayer ceramic capacitor 2, such as electrode ejection or end bulge at the ends. More specifically, the sensor probe 330 scans each scanning area on the lead-in board 100 according to a preset scanning method, and each scanning area obtains an entity scan image (see [[ID=1×]] Figure 8 ) and the corresponding back scan image (see Figure 9 ).

[0069] S05: Judge whether each of the multilayer ceramic capacitors 2 in the scanning area is a defective product through the entity scan image and the back scan image.

[0070] In the method for detecting the ends of the multilayer ceramic capacitor of the present invention, the step S05 is specifically as follows: If the multilayer ceramic capacitor 2 appears black in the entity scan image and white in the back scan image, then this layer of ceramic capacitor is a good product; conversely, if the multilayer ceramic capacitor 2 appears white in the entity scan image and black or dark gray in the back scan image, then this multilayer ceramic capacitor 2 is a defective product.

[0071] More specifically, when there are abnormalities at the terminals of the multilayer ceramic capacitor 2, such as electrode ejection or end bulge, the ultrasonic waves emitted by the ultrasonic scanning microscope 300 return, and the back wave advances, causing the solid scan image of the multilayer ceramic capacitor 2 to appear white. Conversely, the solid scan image appears black. Therefore, after obtaining the above-mentioned solid scan image and the corresponding back scan image, first check each multilayer ceramic capacitor 2 in the solid scan image one by one. If the multilayer ceramic capacitor 2 appears black in the solid scan image and white in the corresponding back scan image, it indicates that the multilayer ceramic capacitor 2 is a good product. Correspondingly, when the multilayer ceramic capacitor 2 appears white in the solid scan image and black or dark gray in the corresponding back scan image, it indicates that the multilayer ceramic capacitor 2 is a defective product.

[0072] Specifically refer to Figures 8-10 shown in Figure 8 The solid scan image of a scanned area obtained by scanning according to the present invention is shown. [[ID=I]] Figure 10 is Figure 8 a partial enlarged schematic view. As can be seen from Figure 8 it, most of the multilayer ceramic capacitors 2 appear black in the solid scan image, and only a very small number appear white. The defective products that appear white are marked as 2` for easy distinction, as shown in the boxes in Figure 8 and Figure 10 . Referring again to Figure 9 shown in Figure 8 , which is the back scan image corresponding to the solid scan image shown in Figure 9 . As can be seen from Figure 8 , the multilayer ceramic capacitors corresponding to the positions of the defective products 2` in Figure 8 all appear black or dark gray. Therefore, these multilayer ceramic capacitors are all defective products 2`. And the multilayer ceramic capacitors 2 corresponding to the positions of the multilayer ceramic capacitors 2 that appear black in Figure 8 all appear white. Therefore, these multilayer ceramic capacitors 2 are all good products. Through the solid scan image and the corresponding back scan image of the present invention, the defective products 2` of the multilayer ceramic capacitors on the lead-in board 100 can be quickly screened out, thereby realizing rapid detection and improving the detection effect.

[0073] Combined with Figure 1 , Figure 4 , Figure 7 shown, in another preferred embodiment of the method for detecting the terminals of the multilayer ceramic capacitor of the present invention, before the above step S04, the following steps are further included:

[0074] Preset the scanning range, and the area of the scanning range is less than or equal to the area of the cutting adhesive 200.

[0075] Specifically, the scanning range of the sensor probe 330 is set according to the size of each piece of cutting glue 200, so the scanning range is less than or equal to the area of each piece of cutting glue 200. For example, in a specific embodiment, the size of a piece of cutting glue 200 is 70mm * 70mm, then the scanning range of the sensor probe 330 is set to be less than or equal to 70mm * 70mm.

[0076] The following is combined with Figure 1 、 Figures 8-11 As shown, in a more preferred embodiment of the end detection method for multi-layer ceramic capacitors of the present invention, on the basis of the above overall judgment, the multi-layer ceramic capacitors initially judged as abnormal products 2` in the above steps can be further confirmed to achieve the purpose of precise detection.

[0077] Specifically, since the ultrasonic wave emitted by the ultrasonic scanning microscope 300 transmits into the sample and is reflected by an interface in the sample to form an echo, the internal condition of the sample can be judged by using the phase change of the echo waveform. Therefore, the present invention uses the ultrasonic scanning microscope 300 to obtain the echo waveform of the multi-layer ceramic capacitor that is the abnormal product 2` for further confirmation.

[0078] Combined with Figure 1 、 Figure 11 As shown, in this embodiment, the detection method further includes the following steps on the basis of the above steps:

[0079] S06: Obtain the echo waveform of a multi-layer ceramic capacitor 2 that is a normal product as a reference waveform, and select an interval with relatively gentle phase change on this reference waveform as the reference interval;

[0080] Specifically combined with Figure 8 、 Figures 10-11 As shown, first, obtain the echo waveform of a multi-layer ceramic capacitor 2 that is a normal product as a reference waveform. Specifically, adjust the sensor probe 330 to face one of the multi-layer ceramic capacitors 2 that are normal products, and obtain the echo waveform of this multi-layer ceramic capacitor 2 through the controller 350. The controller 350 controls the display device 340 to display the echo waveform of this multi-layer ceramic capacitor 2. For example, the echo waveform M1 in the upper part of Figure 11 is the reference waveform. Then, specifically select an interval on this reference waveform as the reference interval. For example, in the manner shown in Figure 11 , specifically select an interval A1 - A2 with relatively gentle waveform phase change in the reference waveform M1 as the reference interval, use the waveform phase change within the reference interval A1 - A2 on the reference waveform M1 as the reference standard, and after selection, the controller 350 automatically stores the width of the interval A1 - A2.

[0081] S07: Obtain the echo waveform of one of the multi-layer ceramic capacitors determined to be defective products 2` in the above step S05, and display the echo waveform below the reference waveform through the display device;

[0082] Combined with Figure 1 , Figure 9 , Figure 11 As shown, adjust the sensor probe 330 so that it faces one of the multi-layer ceramic capacitors initially judged to be defective product 2`, thereby obtaining the echo waveform of the multi-layer ceramic capacitor that is the defective product 2`. The controller 350 controls the display device 340 to display the echo waveform M2 of the defective product 2` below the above reference waveform M1, as Figure 11 shown.

[0083] S08: Check the waveform phase change in the interval corresponding to the reference interval on the echo waveform. If the waveform phase change in this interval is larger than that of the reference waveform, then this multi-layer ceramic capacitor is a defective product 2`; then return to step S07.

[0084] As Figure 11 shown, it can be seen from the echo waveform M2 that in the interval A1 - A2, its waveform phase change is larger, and in the same interval A1 - A2, the phase change of the echo waveform M2 is larger and more intense than that of the above reference waveform M1. Thus, it can be confirmed that the multi-layer ceramic capacitor initially judged to be defective product 2` is indeed a defective product.

[0085] Next, adjust the sensor probe 330 so that it faces another multi-layer ceramic capacitor initially judged to be defective product 2`, and repeat the above process for confirmation until all the multi-layer ceramic capacitors initially judged to be defective product 2` in the above step S05 are confirmed one by one, so as to achieve the purpose of accurate detection.

[0086] In summary, due to the end detection method of the multi-layer ceramic capacitor of the present invention, first, a plurality of multi-layer ceramic capacitors 2 are batch-implanted into the introduction holes 110 of the introduction plate 100, and each multi-layer ceramic capacitor 2 is implanted vertically. The cutting glue 200 is used to paste each multi-layer ceramic capacitor 2 implanted vertically into the introduction holes 110. Then, the sensor probe 330 of the ultrasonic scanning microscope 300 is used to scan the multi-layer ceramic capacitors 2 on the introduction plate 100 to obtain an entity scan image and a back scan image of the scanned area. Since ultrasonic waves cannot propagate in the air, when there are abnormal conditions such as electrode ejection or end bulging in the multi-layer ceramic capacitor 2, resulting in holes, the ultrasonic waves return and the back wave advances. As a result, the entity scan image of the multi-layer ceramic capacitor 2 shows white. Correspondingly, its back scan image will show black or dark gray. Therefore, in the present invention, whether each multi-layer ceramic capacitor 2 is a defective product can be judged one by one through the entity scan image and the back scan image of the scanned area, thereby realizing batch detection of the multi-layer ceramic capacitors 2, with short detection time, high efficiency, and accurate detection of the end conditions of the multi-layer ceramic capacitors 2, and high precision measurement accuracy.

[0087] The structures of other parts of the end detection device of the multi-layer ceramic capacitor involved in the present invention are all conventional structures well-known to those of ordinary skill in the art, and will not be described in detail here.

[0088] The above-disclosed are only the preferred embodiments of the present invention, and of course, the scope of the rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A terminal detection device for a multilayer ceramic capacitor, characterized in that Comprising: An introduction board, on which a plurality of introduction holes are provided, and the introduction holes are used for implanting vertically arranged multilayer ceramic capacitors; Cutting glue, at least one piece of the cutting glue is pasted on one side surface of the introduction board, the area of each piece of the cutting glue is less than or equal to the area of the introduction board, each piece of the cutting glue forms a scanning area, and the cutting glue is used for pasting and implanting each of the multilayer ceramic capacitors in the introduction holes; An ultrasonic scanning microscope, which includes a water tank, a sensor probe arranged above the water tank, a controller electrically connected to the sensor probe, and a display device electrically connected to the controller. The water tank is used for carrying the introduction board implanted with a plurality of the multilayer ceramic capacitors. The sensor probe is used for scanning the multilayer ceramic capacitors to obtain a physical scanning image and a back scanning image of the scanning area. The controller is used for controlling the display device to display the physical scanning image and the back scanning image; Wherein, when the multilayer ceramic capacitor appears black in the physical scanning image and white in the back scanning image, this layer of ceramic capacitor is a good product; when the multilayer ceramic capacitor appears white in the physical scanning image and black or dark gray in the back scanning image, this multilayer ceramic capacitor is a defective product.

2. The end detection device for a multilayer ceramic capacitor according to claim 1, wherein, The thickness of the introduction board is less than or equal to the height of the multilayer ceramic capacitor, and the aperture of the introduction hole is greater than or equal to the outer diameter of the multilayer ceramic capacitor.

3. The end detection device for a multilayer ceramic capacitor according to claim 1, wherein The controller is further used for obtaining the echo waveform of a single multilayer ceramic capacitor and controlling the display device to display the echo waveform, and further confirming whether this multilayer ceramic capacitor is a defective product through the phase change of the echo waveforms of each multilayer ceramic capacitor.

4. A method for detecting the end of a multilayer ceramic capacitor, characterized in that, Including the following steps: (1) Provide an introduction board with a plurality of introduction holes, paste at least one piece of cutting glue on one side surface of the introduction board, the area of each piece of the cutting glue is less than or equal to the area of the introduction board, each piece of the cutting glue forms a scanning area, and turn over the introduction board so that the cutting glue is located at its bottom; (2) Place a plurality of multilayer ceramic capacitors in the area of the introduction board pasted with the cutting glue, and vertically implant each multilayer ceramic capacitor into one of the introduction holes, so that one end of each multilayer ceramic capacitor is bonded to the cutting glue; (3) Uniformly spray alcohol on the multilayer ceramic capacitors, and then put the introduction board implanted with a plurality of the multilayer ceramic capacitors into the water tank of the ultrasonic scanning microscope; (4) Control the sensor probe of the ultrasonic scanning microscope to scan the scanning area on the introduction board according to a preset scanning method to obtain a physical scanning image and a back scanning image of the scanning area, and display the physical scanning image and the back scanning image through the display device; (5) Determine whether each of the multilayer ceramic capacitors in the scanned area is a defective product based on the entity scan image and the back scan image; wherein, if the multilayer ceramic capacitor appears black in the entity scan image and white in the back scan image, then this multilayer ceramic capacitor is a good product; conversely, if the multilayer ceramic capacitor appears white in the entity scan image and black or dark gray in the back scan image, then this multilayer ceramic capacitor is a defective product.

5. The end detection method for a multi-layer ceramic capacitor according to claim 4, characterized in that, It further includes the following steps: (6) Obtain the echo waveforms of each of the multilayer ceramic capacitors determined to be defective products in step (5) one by one, and display the echo waveforms of each of the multilayer ceramic capacitors through the display device. Further confirm whether this multilayer ceramic capacitor is a defective product based on the phase change of the echo waveforms of each of the multilayer ceramic capacitors.

6. The end detection method of the multi-layer ceramic capacitor according to claim 5, characterized in that, Step (6) includes the following steps: (61) Obtain the echo waveform of a multilayer ceramic capacitor that is a good product as a reference waveform, display the reference waveform through the display device, and select an interval with relatively gentle phase change on this reference waveform as the reference interval; (62) Obtain the echo waveform of a multilayer ceramic capacitor determined to be a defective product in step (5), and display the echo waveform below the reference waveform through the display device; (63) Check the phase change of the waveform in the interval corresponding to the reference interval on the echo waveform. If the phase change of the waveform in this interval is larger than that of the waveform in the reference interval, then this multilayer ceramic capacitor is a defective product; then return to step (62).

7. The end detection method for the multilayer ceramic capacitor according to claim 4, characterized in that, Before step (4), it further includes the following steps: Preset a scanning range, and the area of the scanning range is less than or equal to the area of each piece of the cutting glue.

Images