Substrate processing apparatus and substrate processing method

Abstract

The present inventive concepts provide a substrate processing apparatus and a substrate processing method, the substrate processing apparatus including a first process chamber group including a plurality of process chambers each including a laser beam emission unit that applies a laser beam to a substrate to heat the substrate, one laser beam generator that generates the laser beam applied to the substrate through the laser beam emission unit of each of the plurality of process chambers included in the first process chamber group, and a beam movement module including one or more mirrors corresponding to the plurality of process chambers included in the first process chamber group. Each of the one or more mirrors is moved to a position in which the mirror forms an optical path of the laser beam toward a predetermined one of the plurality of process chambers.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0117842, filed with the Korean Intellectual Property Office on September 14, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a substrate processing apparatus and a substrate processing method. Background Technology

[0004] Various processes, such as photolithography, etching, ashing, ion implantation, thin film deposition, and cleaning, are performed on substrates to manufacture semiconductor devices or liquid crystal displays. Among these processes, etching or cleaning is the process of removing unwanted areas from a thin film formed on the substrate. High selectivity, high etching rate, and etching uniformity are required for the thin film, and with the increasing integration of semiconductor devices, even higher levels of etching selectivity and etching uniformity are needed.

[0005] Generally, in etching or cleaning processes, chemical treatment, rinsing, and drying steps are performed sequentially on the substrate. In the chemical treatment step, chemicals are dispensed onto the substrate to etch thin films formed on it or remove foreign matter. In the rinsing step, a rinsing solution, such as deionized water (DI water), is dispensed onto the substrate. The treatment of substrates using fluids may be accompanied by heating of the substrate. Summary of the Invention

[0006] An embodiment of the present invention provides a substrate processing apparatus for improving etching performance.

[0007] Embodiments of the present invention provide a substrate processing apparatus for precisely controlling the temperature of a substrate by rapidly raising and lowering the substrate temperature.

[0008] Embodiments of the present invention provide a substrate processing apparatus for effectively adjusting light distribution when heating the substrate by applying a laser beam to the substrate.

[0009] Embodiments of the present invention provide a substrate processing apparatus for effectively adjusting light intensity when heating the substrate by applying a laser beam to the substrate.

[0010] The present invention provides a substrate processing apparatus for reducing manufacturing costs.

[0011] An embodiment of the present invention provides a substrate processing apparatus for reducing the floor space (the amount of space occupied by the apparatus).

[0012] Embodiments of the present inventive concept provide a substrate processing apparatus and a substrate processing method for performing a process without a delay in a plurality of substrate processing devices using a single laser beam source.

[0013] Embodiments of the present inventive concept provide a substrate processing apparatus that changes a heating condition according to a different environment of each process chamber although a single laser beam generator is used.

[0014] The technical problems to be solved by the present inventive concept are not limited to the above-mentioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art from the following description.

[0015] According to an embodiment, a substrate processing apparatus includes a first process chamber group including a plurality of process chambers each including a laser beam emission unit that applies a laser beam to a substrate to heat the substrate, one laser beam generator that generates the laser beam applied to the substrate through the laser beam emission unit of each of the plurality of process chambers included in the first process chamber group, and a beam movement module including one or more mirrors corresponding to the plurality of process chambers included in the first process chamber group. Each of the one or more mirrors is moved to a position in which the mirror forms a light path of the laser beam toward a predetermined one of the plurality of process chambers.

[0016] In an embodiment, the beam movement module can be optically connected to the laser beam emission unit of each of the plurality of process chambers through a laser beam transmission member provided corresponding to the laser beam emission unit.

[0017] In an embodiment, the laser beam transmission member can be implemented with an optical fiber.

[0018] In an embodiment, each of the plurality of mirrors can be moved between a first position and a second position through a linear motion.

[0019] In an embodiment, each of the plurality of mirrors can be moved between a first position and a second position through tilting.

[0020] In an embodiment, the tilting is performed with a rotation axis of the mirror provided as a center.

[0021] In an embodiment, one laser beam generator can have a power output of several kilowatts.

[0022] In an embodiment, each of the plurality of process chambers can further include a substrate support unit supporting and rotating a substrate, and a liquid distribution unit including a chemical distribution nozzle distributing a chemical to a substrate supported on the substrate support unit.

[0023] In an embodiment, the chemical distributed by the liquid distribution unit can be a liquid containing phosphoric acid.

[0024] In an embodiment, the substrate processing apparatus can further include a controller. Each of the plurality of process chambers can perform a first process of distributing a chemical to a substrate and a second process of heating the substrate with a laser beam. The controller can perform control such that each of the plurality of process chambers included in the first process chamber group sequentially performs the first process and the second process over time, and the plurality of process chambers simultaneously perform different processes, and can control the beam movement module such that the one or more mirrors form an optical path toward one of the plurality of process chambers in which the second process is performed, and the laser beam generated from the one laser beam generator is delivered to the one process chamber in which the second process is performed.

[0025] In an embodiment, each of the plurality of process chambers can additionally perform a third process of distributing a rinse solution to a substrate and replacing the chemical with the rinse solution, and each of the plurality of process chambers included in the first process chamber group can sequentially perform the first process, the second process, and the third process over time.

[0026] In an embodiment, the substrate support unit can include a window member disposed below the substrate and formed of a material through which a laser beam emitted from a laser beam emission unit is transmittable, a chuck pin supporting a side portion of the substrate and spacing the substrate apart from the window member by a predetermined interval, a rotation housing coupled with the window member and having an empty space extending therethrough in an up / down direction and providing a path along which the laser beam is delivered, and a driving member rotating the rotation housing. The laser beam emission unit can be disposed below the window member.

[0027] In an embodiment, the laser beam emission unit can include a lens module including at least one lens unit and refracting the laser beam to process the laser beam to correspond to a shape of the substrate, and a distance between the lens unit of the lens module and an end portion of the laser beam delivery member can be adjustable.

[0028] In an embodiment, each of the plurality of process chambers can further include a stage that moves the laser beam emitting unit upward and downward to adjust a distance between the laser beam emitting unit and the substrate.

[0029] According to an embodiment, a method for processing a plurality of substrates using a substrate processing apparatus is provided. The substrate processing apparatus includes a plurality of process chambers each processing a single substrate and a laser beam generator generating a laser beam. Each of the plurality of process chambers performs a first process of dispensing a chemical onto the substrate and a second process of heating the substrate with the laser beam. Each of the plurality of process chambers sequentially performs the first process and the second process over time, and the plurality of process chambers simultaneously performs different processes. The laser beam generated from the laser beam generator is optically connected to the plurality of process chambers through a plurality of optical paths. The laser beam is applied only to one of the plurality of process chambers performing the second process along an optical path connected to the one process chamber.

[0030] In an embodiment, the optical paths connected to the remaining process chambers except for the one of the plurality of process chambers performing the second process can be closed.

[0031] In an embodiment, each of the plurality of process chambers can additionally perform a third process of dispensing a rinse solution onto the substrate and replacing the chemical with the rinse solution, and each of the plurality of process chambers can sequentially perform the first process, the second process, and the third process over time.

[0032] In an embodiment, the laser beam generator can have a power output of several kilowatts.

[0033] In an embodiment, a mirror can be provided on each of the plurality of optical paths, and each mirror can form an optical path toward a corresponding one of the plurality of process chambers at a first position. The mirror can be movable to a second position at which the mirror does not obstruct the optical path of the laser beam. Among the mirrors, a mirror located on an upstream side of the optical path formed by the mirror located at the first position can be located at the second position, and the laser beam generated from the laser beam generator can be transmitted to the process chamber performing the second process.

[0034] In an embodiment, the chemical dispensed in the first process can be a liquid containing phosphoric acid.

[0035] According to an embodiment, a substrate processing apparatus includes a first process chamber group including a plurality of process chambers, a laser beam generator generating a laser beam, a beam moving module including a plurality of mirrors corresponding to the plurality of process chambers included in the first process chamber group, and a controller. Each of the plurality of process chambers includes a substrate support unit supporting and rotating a substrate, a liquid distribution unit including a chemical distribution nozzle distributing a chemical to the substrate supported on the substrate support unit, and a laser beam emission unit applying the laser beam to the substrate to heat the substrate. The substrate support unit includes a window member disposed below the substrate and formed of a material through which the laser beam emitted from the laser beam emission unit is transmissible, a chuck pin supporting a side portion of the substrate and spacing the substrate apart from the window member by a predetermined interval, a rotation housing coupled with the window member and having an empty space extending therethrough in an up / down direction and providing a path along which the laser beam is transmitted, and a driving member rotating the rotation housing. The laser beam emission unit is disposed below the window member and is optically connected by a laser beam transmission member connected with the laser beam emission unit of each of the plurality of process chambers. Each of the plurality of mirrors moves between a first position at which the mirror forms an optical path of the laser beam toward a corresponding one of the plurality of process chambers and a second position at which the mirror does not obstruct the optical path of the laser beam. The controller performs control such that the mirror forming the optical path toward a selected one of the plurality of process chambers is positioned at the first position, the mirror positioned on an upstream side of the optical path formed by the mirror positioned at the first position is positioned at the second position, and the laser beam generated from one laser beam generator is transmitted to the selected process chamber. BRIEF DESCRIPTION OF DRAWINGS

[0036] The above and other objects and features will become apparent from the following description, taken in conjunction with the accompanying drawings, wherein:

[0037] Figure 1 is a plan view illustrating a substrate processing apparatus according to an embodiment of the present inventive concept;

[0038] Figure 2 is a cross-sectional view illustrating a substrate processing apparatus disposed in a process chamber of Figure 1

[0039] Figure 3 is a side view of a laser beam emission unit according to the first embodiment;​

[0040] Figure 4 is a schematic cross-sectional view showing a first use state of a laser beam emitting unit according to a first embodiment of the present inventive concept; Figure 3

[0041] Figure 5 is a schematic cross-sectional view showing a second use state of a laser beam emitting unit according to a first embodiment of the present inventive concept; Figure 3

[0042] Figure 6 shows a variation of laser beam intensity depending on adjustment of a distance between an end of a first laser beam delivery member and a lens unit;

[0043] Figure 7 is a side view of a laser beam emitting unit of a second embodiment;

[0044] Figure 8 is a cross-sectional view showing a beam moving module according to a first embodiment of the present inventive concept;

[0045] Figure 9 is a schematic view showing another embodiment of a connection relationship between a laser beam generator and a beam moving module of the present inventive concept;

[0046] Figures 10 to 12 successively shows operations of a substrate processing apparatus applying a beam moving module according to a first embodiment of the present inventive concept;

[0047] Figures 13 to 15 successively shows operations of a substrate processing apparatus applying a beam moving module according to a second embodiment of the present inventive concept;

[0048] Figures 16 to 18 successively shows operations of a substrate processing apparatus applying a beam moving module according to a third embodiment of the present inventive concept; and

[0049] Figure 19 is a flowchart showing a method for operating a substrate processing apparatus according to an embodiment of the present inventive concept. DETAILED DESCRIPTION

[0050] ​​Hereinafter, embodiments of the present inventive concept will be described in detail with reference to the accompanying drawings so that those skilled in the art to which the present inventive concept pertains can easily practice the present inventive concept. The present inventive concept may, however, be implemented in various forms and is not limited to the embodiments described herein. In addition, in describing the embodiments of the present inventive concept, when a detailed description of the known functions or configurations associated with the present inventive concept can make the subject matter of the present inventive concept unnecessarily obscure, the detailed description is omitted. Also, components that perform similar functions and operations are designated by like reference numerals throughout the accompanying drawings.

[0051] The terms "include" and "comprise" in the specification are "open" expressions that only indicate the presence of the corresponding components, and unless otherwise specifically stated, do not exclude the presence of additional components. In particular, it should be understood that the terms "include", "comprise" and "have", when used herein, refer to the presence of the stated features, integers, steps, operations, components and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, components and / or groups thereof.

[0052] Unless otherwise stated, the singular form of the term can include the plural form. In addition, in the drawings, the shape and size of the components can be exaggerated for clear illustration.

[0053] In the present embodiment, a process of etching a substrate using a treatment liquid is described as an example. However, the present embodiment is not limited thereto, and can be applied to various substrate processing processes using a liquid, such as a cleaning process, an ashing process, a developing process, and the like.

[0054] Here, the substrate can have a broad concept including all substrates used to manufacture semiconductor elements, flat panel displays (FPD), and other objects having circuit patterns formed on thin films. Examples of the substrate include a silicon wafer, a glass substrate, an organic substrate, and the like.

[0055] Hereinafter, embodiments of the present inventive concept will be described in detail with reference to the accompanying drawings. Figures 1 to 19 Embodiments of the present inventive concept will be described in detail.

[0056] Figure 1 A plan view of a substrate processing apparatus 1 according to an embodiment of the present inventive concept is shown. Referring to FIG. 1, the substrate processing apparatus 1 includes an index module 10 and a process module 20. The index module 10 includes a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 20 are arranged in a row in order. Figure 1

[0057] ​Hereinafter, the direction in which the load port 120, the transfer frame 140, and the process module 20 are arranged is referred to as a first direction 12, the direction perpendicular to the first direction 12 when viewed from above is referred to as a second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0058] The carrier 18 having the substrate W accommodated therein is seated on the load port 120. A plurality of load ports 120 can be provided. The load ports 120 are arranged in a row along the second direction 14. The number of load ports 120 can be increased or decreased according to the process efficiency and footprint of the process module 20. The carrier 18 has a plurality of slots (not shown) formed therein, in which the substrate W is accommodated in a state arranged horizontally with respect to the ground. A front opening unified pod (FOUP) can be used as the carrier 18.

[0059] The process module 20 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260.

[0060] The transfer chamber 240 is arranged such that the longitudinal direction of the transfer chamber is parallel to the first direction 12. A plurality of process chambers 260 can be arranged on one side or the opposite side of the transfer chamber 240. On the opposite side of the transfer chamber 240, the plurality of process chambers 260 can be arranged to be symmetrical with respect to the transfer chamber 240. Some of the process chambers 260 are arranged along the longitudinal direction of the transfer chamber 240. In addition, other process chambers 260 are stacked with each other. That is, the process chambers 260 can be arranged in an A x B array on one side of the transfer chamber 240. Here, A denotes the number of process chambers 260 arranged in a row along the first direction 12, and B denotes the number of process chambers 260 arranged in a column along the third direction 16. When four or six process chambers 260 are arranged on one side of the transfer chamber 240, the process chambers 260 can be arranged in a 2 x 2 or 3 x 2 array. The number of process chambers 260 can be increased or decreased. Alternatively, the process chambers 260 can be arranged only on one side of the transfer chamber 240. In another case, the process chambers 260 can be arranged in a single layer on the opposite side of the transfer chamber 240.

[0061] The buffer unit 220 is arranged between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space in which the substrate W stays before being transferred between the transfer chamber 240 and the transfer frame 140. The buffer unit 220 has a plurality of slots (not shown) formed therein, in which the substrate W is accommodated. The slots (not shown) are spaced apart from each other along the third direction 16. The buffer unit 220 is open at a side facing the transfer frame 140, and at the opposite side facing the transfer chamber 240.

[0062] The transfer frame 140 transfers the substrate W between the carrier 18 located at the load port 120 and the buffer unit 220. An index track 142 and an index robot 144 are provided in the transfer frame 140. The index track 142 is provided such that its longitudinal direction is parallel to the second direction 14. The index robot 144 is mounted on the index track 142 and linearly moves along the index track 142 in the second direction 14. The index robot 144 includes a base 144a, a body 144b, and a plurality of index arms 144c. The base 144a is movable along the index track 142. The body 144b is coupled to the base 144a. The body 144b is movable along the third direction 16 on the base 144a. In addition, the body 144b is rotatable on the base 144a. The index arms 144c are coupled to the body 144b and are movable forward and backward relative to the body 144b. A plurality of index arms 144c can be provided. The index arms 144c can be independently driven. The index arms 144c are stacked with a gap therebetween along the third direction 16. Some of the index arms 144c can be used to transfer the substrate W from the process module 20 to the carrier 18, and other index arms 144c can be used to transfer the substrate W from the carrier 18 to the process module 20. Thus, during the transfer of the substrate W between the carrier 18 and the process module 20 by the index robot 144, particles generated from the substrate W to be processed are prevented from adhering to the processed substrate W.

[0063] The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260, and between the process chambers 260. A guide track 242 and a main robot 244 are provided in the transfer chamber 240. The guide track 242 is provided such that the longitudinal direction of the guide track is parallel to the first direction 12. The main robot 244 is mounted on the guide track 242 and linearly moves on the guide track 242 along the first direction 12. The main robot 244 has a base 244a, a body 244b, and a plurality of main arms 244c. The base 244a is movable along the guide track 242. The body 144b is coupled to the base 244a. The body 244b is movable along the third direction 16 on the base 244a. In addition, the body 244b is rotatable on the base 244a. The main arms 224c are coupled to the body 244b and are movable forward and backward relative to the body 244b. A plurality of main arms 244c can be provided. The main arms 244c can be independently driven. The main arms 244c are stacked with a gap therebetween along the third direction 16.

[0064] The process chambers 260 are equipped with substrate processing apparatuses 300 for performing liquid processing on the substrates W. The substrate processing apparatuses 300 can have different structures depending on the type of liquid processing performed by the substrate processing apparatuses 300. Alternatively, the substrate processing apparatuses 300 in the respective process chambers 260 can have the same structure. Optionally, the process chambers 260 can be divided into a plurality of groups. The substrate processing apparatuses 300 in the process chambers 260 belonging to the same group can have the same structure, while the substrate processing apparatuses 300 in the process chambers 260 belonging to different groups can have different structures.

[0065] Figure 2 is a cross-sectional view showing a substrate processing apparatus 300 disposed in a process chamber 260 according to an embodiment. Figure 1 Figure 2 The substrate processing apparatus 300 includes a processing vessel 320, a substrate support unit 340, a lift unit 360, a liquid distribution unit 390, and a controller (not shown).

[0066] ​The process container 320 has a container shape that is open at its top. The process container 320 includes a first recovery bowl 321 and a second recovery bowl 322. The recovery bowls 321 and 322 recover different process fluids used for the process. The first recovery bowl 321 has a circular ring shape that surrounds the substrate support unit 340. The second recovery bowl 322 has a circular ring shape that surrounds the substrate support unit 340. In one embodiment, the first recovery bowl 321 has a circular ring shape that surrounds the second recovery bowl 322. The second recovery bowl 322 can be inserted into the first recovery bowl 321. The height of the second recovery bowl 322 can be greater than the height of the first recovery bowl 321. The second recovery bowl 322 can include a first guide portion 326 and a second guide portion 324. The first guide portion 326 can be disposed at the top of the second recovery bowl 322. The first guide portion 326 can extend toward the substrate support unit 340. The first guide portion 326 can be formed to be inclined upward toward the substrate support unit 340. In the second recovery bowl 322, the second guide portion 324 can be spaced downward from the first guide portion 326. The second guide portion 324 can extend toward the substrate support unit 340. The second guide portion 324 can be formed to be inclined upward toward the substrate support unit 340. A first inlet 324a through which a process liquid is introduced is formed between the first guide portion 326 and the second guide portion 324. A second inlet 322a is disposed below the second guide portion 324. The first inlet 324a and the second inlet 322a can be located at different heights. The second guide portion 324 can have a hole (not shown) formed therein, and the process liquid introduced through the first inlet 324a can flow to a second recovery line 322b connected to the bottom of the second recovery bowl 322 through the hole (not shown). The hole (not shown) of the second guide portion 324 can be formed at the lowest position of the second guide portion 324. The process liquid recovered by the first recovery bowl 321 flows to a first recovery line 321b connected to the bottom of the first recovery bowl 321. The process liquid introduced into the recovery bowls 321 and 322 can be supplied to an external process liquid regeneration system (not shown) through the recovery lines 321b and 322b and can be regenerated by the regeneration system.

[0067] The lift unit 360 moves the process container 320 linearly in the up / down direction. For example, the lift unit 360 can be coupled to the second recovery bowl 322 of the process container 320 and can move the second recovery bowl 322 in the up / down direction to change the height of the process container 320 with respect to the substrate support unit 340. The lift unit 360 includes a bracket 362, a movable shaft 364, and an actuator 366. The bracket 362 is fixedly attached to the outer wall of the process container 320, and the movable shaft 364 is fixedly coupled to the bracket 362 and is moved in the up / down direction by the actuator 366. When the substrate W is loaded onto or unloaded from the substrate support unit 340, the second recovery bowl 322 of the process container 320 is moved downward so that the upper portion of the substrate support unit 340 protrudes beyond the process container 320. Specifically, the second recovery bowl 322 of the process container 320 is moved downward so that the upper portion of the substrate support unit 340 further protrudes beyond the first guide portion 326. Further, when a process is performed, the height of the process container 320 is adjusted according to the type of process liquid dispensed onto the substrate W so as to introduce the process liquid into the preset recovery bowls 321 and 322. Alternatively, the lift unit 360 can move the substrate support unit 340 in the up / down direction instead of the process container 320. In another case, the lift unit 360 can raise or lower the entire process container 320 in the up / down direction. The lift unit 360 is provided to adjust the relative height between the process container 320 and the substrate support unit 340. The embodiments of the process container 320 and the lift unit 360 can be provided in various structures and methods according to design, as long as the relative height between the process container 320 and the substrate support unit 340 can be adjusted.

[0068] The substrate support unit 340 supports and rotates the substrate W during a process.

[0069] The substrate support unit 340 includes a window member 348, a rotation housing 342, a chuck pin 346, and a driving member 349.

[0070] The window member 348 is located below the substrate W. The window member 348 can have a shape substantially corresponding to the substrate W. For example, when the substrate W is a circular wafer, the window member 348 can have a substantially circular shape. The window member 348 can have the same diameter as the substrate W, or can have a smaller or larger diameter than the substrate W. The window member 348 can allow a laser beam to pass through the window member 348 and reach the substrate W. The window member 348 can protect components of the substrate support unit 340 from chemicals and can be provided in various sizes and shapes according to design. The window member 348 has a larger diameter than the substrate W.

[0071] The window member 348 can be formed of a material having high light transmittance. Accordingly, a laser beam emitted from the laser beam emitting unit 400 can be transmitted through the window member 348. The window member 348 can be formed of a material having excellent corrosion resistance so as not to react with chemicals. For example, the window member 348 can be formed of quartz, glass, sapphire, or the like.

[0072] A rotary housing 342 can be disposed on a bottom surface of the window member 348. The rotary housing 342 supports an edge of the window member 348. The rotary housing 342 has an empty space extending therethrough in the up / down direction. The empty space formed by the rotary housing 342 can have an inner diameter that gradually increases from a portion adjacent to the laser beam emitting unit 400 toward the window member 348. The rotary housing 342 can have a cylindrical shape, the inner diameter of which gradually increases from a lower end to an upper end. The empty space in the rotary housing 342 can allow a laser beam emitted from a laser beam emitting unit 400 (to be described below) to be applied to the substrate W without being interfered by the rotary housing 342. A connection portion between the rotary housing 342 and the window member 348 can have an air-tight structure such that chemicals dispensed onto the substrate W do not flow toward the laser beam emitting unit 400.

[0073] A driving member 349 can be coupled with the rotary housing 342 and can rotate the rotary housing 342. Any member capable of rotating the rotary housing 342 can be used as the driving member 349. For example, the driving member 349 can be a hollow motor. According to one embodiment, the driving member 349 includes a stator 349a and a rotor 349b. The stator 349a is fixed in one position, and the rotor 349b is coupled with the rotary housing 342. In the illustrated embodiment, a hollow motor having the rotor 349b disposed inside and the stator 349a disposed outside is shown. A lower portion of the rotary housing 342 can be coupled with the rotor 349b and can be rotated by rotation of the rotor 349b. In the case where a hollow motor is used as the driving member 349, a hollow motor having a small hollow space can be selected to correspond to the narrow lower portion of the rotary housing 342. Accordingly, manufacturing costs can be reduced. According to one embodiment, the stator 349a of the driving member 349 can be fixedly coupled to a support wall on which the process container 320 is supported. According to one embodiment, the substrate support unit 340 can further include a cover member 343 that protects the driving member 349 from chemicals.

[0074] The liquid dispensing unit 390 can be an assembly for dispensing a chemical onto the substrate W from above the substrate W and can include at least one chemical dispensing nozzle. The liquid dispensing unit 390 can pump out a chemical from a storage tank (not shown), can transfer the chemical, and can dispense the chemical onto the substrate W through the chemical dispensing nozzle. The liquid dispensing unit 390 can include an actuator and can move between a process position directly above the center of the substrate W and a standby position outside the substrate W by the actuator.

[0075] The liquid dispensing unit 390 can dispense various chemicals onto the substrate W according to a substrate processing process. In a process of etching a silicon nitride thin film, the liquid dispensing unit 390 can dispense a chemical containing phosphoric acid (H3PO4) onto the substrate W. The liquid dispensing unit 390 can further include a deionized water (DIW) dispensing nozzle for rinsing a surface of the substrate after an etching process, and an isopropyl alcohol (IPA) dispensing nozzle and a nitrogen (N2) dispensing nozzle for performing a drying process after the rinsing process. Although not shown, the liquid dispensing unit 390 can include a nozzle moving member (not shown) that supports and moves the chemical dispensing nozzle. The nozzle moving member (not shown) can include a support shaft (not shown), an arm (not shown), and an actuator (not shown). The support shaft (not shown) is located at one side of the process container 320. The support shaft (not shown) is in the shape of a rod, and a longitudinal direction of the support shaft is parallel to the third direction 16. The support shaft (not shown) can be rotatable by the actuator (not shown). The arm (not shown) is coupled to an upper end of the support shaft (not shown). The arm (not shown) can extend from the support shaft (not shown) at a right angle to the support shaft. The chemical dispensing nozzle is fixedly coupled to one end of the arm (not shown). When the support shaft (not shown) is rotated, the chemical dispensing nozzle is able to swing together with the arm (not shown). The chemical dispensing nozzle can move between the process position and the standby position. Alternatively, the support shaft (not shown) can be upwardly and downwardly movable. Further, the arm (not shown) can be forwardly and rearwardly movable along a longitudinal direction of the arm.

[0076] The laser beam emitting unit 400 is for applying a laser beam to the substrate W assembly. The laser beam emitting unit 400 can be located below the window member 348 of the substrate support unit 340. The laser beam emitting unit 400 can emit a laser beam toward the substrate W located on the substrate support unit 340. The laser beam emitted from the laser beam emitting unit 400 can be applied to the substrate W through the window member 348 of the substrate support unit 340. Accordingly, the substrate W can be heated to a set temperature.

[0077] The laser beam emitting unit 400 can be configured to uniformly apply the laser beam to the entire surface of the substrate W. The laser beam emitting unit 400 is not particularly limited as long as the laser beam emitting unit 400 can uniformly apply the laser beam to the entire surface of the substrate W. Hereinafter, the laser beam emitting unit 400-1 according to a first embodiment will be described with reference to Figures 3 to 5 The laser beam emitting unit 400-1 according to the first embodiment will be described, and reference will be made to Figure 7 The laser beam emitting unit 400-2 according to the second embodiment will be described.

[0078] Hereinafter, the laser beam emitting unit 400-1 according to the first embodiment will be described with reference to Figure 3 and Figure 5 The laser beam emitting unit 400-1 according to the first embodiment will be described. Figure 3 is a side view of the laser beam emitting unit 400-1 according to the first embodiment. Referring to Figure 3 , the laser beam emitting unit 400-1 can include a lens module 442. The laser beam emitting unit 400-1 can receive the laser beam from the first laser beam transmitting member 443. Figure 4 is a schematic cross-sectional view showing a first use state of the laser beam emitting unit 400-1 according to the first embodiment of Figure 3 . Further, referring to Figure 4 , the lens module 442 includes a lens unit 442b and a lens barrel 442a that supports and houses the lens unit 442b. The lens unit 442b can be implemented by a combination of a plurality of lenses. For example, the lens unit 442b can include a concave lens or a convex lens. For example, the lens unit 442b can include a first lens 442b-1, a second lens 442b-2, and a third lens 442b-3. The first lens 442b-1 can have a concave upper surface and can diverge the laser beam. The second lens 442b-2 can have a convex upper surface and a concave lower surface, and can diverge the laser beam. The third lens 442b-3 can have a concave lower surface and can diverge the laser beam. Although the lens unit 442b is implemented by a combination of three lenses 442b-1, 442b-2, and 442b-3, this is for ease of description, and the number of lenses constituting the lens unit 442b and their types can be variously selected according to the design of the substrate processing apparatus 300.

[0079] The first laser beam transmitting member 443 is an assembly that transmits a laser beam generated from a laser beam generator 500 to the lens module 442. For example, the first laser beam transmitting member 443 can be an optical fiber. An end portion of the first laser beam transmitting member 443 can be coupled to the fastening member 441, and the first laser beam transmitting member 443 can be coupled with the lens module 442 through the fastening member 441. The fastening member 441 is configured to adjust the distance between the end portion of the first laser beam transmitting member 443 and the lens unit 442b.

[0080] Figure 5 is a schematic cross-sectional view illustrating a second use state of the laser beam emitting unit 400-1 according to the first embodiment of Figure 3 Figure 5 In the second use state, the distance between the end portion of the first laser beam transmitting member 443 and the lens unit 442b is greater than Figure 4 the distance between the end portion of the first laser beam transmitting member 443 and the lens unit 442b in the first use state of Figure 5 In the second use state of Figure 4 the laser beam can be distributed more widely than in the first use state of the intensity of the laser beam can be adjusted.

[0081] Figure 6 is shown according to the adjustment of the distance between the end portion of the first laser beam transmitting member 443 and the lens unit 442b. The Y-axis (vertical axis) indicates the magnitude of intensity, and the X-axis (horizontal axis) indicates the position of the laser beam with respect to a 300-mm wafer. As the end portion of the first laser beam transmitting member 443 moves toward the lens unit 442b, the magnitude of intensity increases, and the irradiation area narrows. It can be seen from the experimental example that when the distance to the target (e.g., wafer) is reduced by 4 mm, the magnitude of intensity increases and the irradiation area narrows compared to when the distance to the target (e.g., wafer) is increased by 4 mm.

[0082] Although not shown, the relative distances between the lenses constituting the lens unit 442b can be changed to adjust the irradiation area and the intensity of each area.

[0083] Figure 7 is a side view of a laser beam emitting unit 400-2 according to a second embodiment. Referring to Figure 7The laser beam emitting unit 400-2 can include a reflecting unit 445, an imaging unit 446, a sensing unit 447, and a collimator 448. The reflecting unit 445 can reflect a portion of a laser beam, which is generated by the laser beam generator 500 and transmitted through the first laser beam transmitting member 443, toward the lens module 442, and can allow the remaining portion to pass through. To this end, the reflecting unit 445 can include a mirror 145a installed at a 45-degree angle.

[0084] The imaging unit 446 can be coupled to the reflecting unit 445. The imaging unit 446 can photograph the laser beam passing through the reflecting unit 445, and can convert the laser beam into image data. The imaging unit 446 can analyze the image data to check whether the laser beam is output from the laser beam generator 500 as designed, and whether the laser beam is transmitted through the first laser beam transmitting member 443 as designed.

[0085] The sensing unit 447 can be coupled to the reflecting unit 445 and can sense the intensity of the laser beam input to the reflecting unit 445. For example, the sensing unit 447 can be a photo detector. When the intensity of the laser beam is too high, the substrate W can be rapidly heated. In contrast, when the intensity of the laser beam is too low, it can take a long time to heat the substrate W. The sensing unit 447 can determine whether the intensity of the laser beam is an appropriate value.

[0086] Although it has been described that the laser beam emitting unit 400 is disposed below the substrate W and applies the laser beam to the back surface of the substrate W, the inventive concept is not limited thereto. The laser beam emitting unit 400 can be disposed above the substrate W and can apply the laser beam to the front side of the substrate W.

[0087] Referring to Figure 2 The laser beam emitting unit 400 can be coupled to the XYZ stage 460. The XYZ stage 460 can include a lifting actuator 461 and a coupling member 462 connected with the lifting actuator 461 and coupled with the laser beam emitting unit 400. The position of the laser beam emitting unit 400 with respect to the substrate W can be adjusted by the XYZ stage 460. In addition, the laser beam intensity can be adjusted by adjusting the distance between the laser beam emitting unit 400 and the substrate W through the lifting actuator 461.

[0088] The first laser beam delivery member 443 of the laser beam emitting unit 400 is one of a plurality of first laser beam delivery members 443 connected with the beam moving module 600. The beam moving module 600 can be optically connected with one laser beam generator 500. The optical connection between the laser beam generator 500 and the beam moving module 600 can be formed through a second laser beam delivery member 543. The second laser beam delivery member 543 can be implemented with an optical fiber. Alternatively, the second laser beam delivery member 543 can be implemented with a plurality of mirrors forming an optical transmission path. In the case where the laser beam generator 500 and the beam moving module 600 are optically connected through the second laser beam delivery member 543, the laser beam generator 500 and the beam moving module 600 can be located at different positions, and thus the degree of freedom in design can be improved.

[0089] The laser beam generator 500 can generate a laser beam. The laser beam generator 500 can generate a laser beam having a wavelength that the substrate W can easily absorb. According to an embodiment, the laser beam generator 500 can be implemented with a high-power device having a power output of 4 kW to 5 kW. A high-power beam energy must be applied to the substrate W to heat the substrate W. A high-power laser beam generator is generally expensive, and thus the manufacturing cost can be increased when one high-power laser beam generator is provided for each process chamber.

[0090] Meanwhile, according to an embodiment, the laser beam generator 500 can receive a signal of a pulse generator and can generate a laser beam in a pulse form. The pulse form can be a form in which the laser beam is turned on / off, or can be a form in which the intensity of the laser beam is periodically changed from a first intensity to a second intensity and from the second intensity to the first intensity.

[0091] Figure 8 FIG. 6 is a cross-sectional view illustrating a beam moving module 600 according to a first embodiment of the present inventive concept. Hereinafter, the beam moving module 600 will be described with reference to FIG. 6. Figure 8A light beam moving module 600 is described. The light beam moving module 600 includes a mirror unit 610. The mirror unit 610 includes as many mirrors as the process chambers 260. For example, as an example of the process chambers 260, three process chambers 260a, 260b, and 260c are shown. Three mirrors 611, 612, and 613 corresponding to the three process chambers 260a, 260b, and 260c, respectively, are shown. The mirror unit 610 can be disposed inside a housing 630. The inside of the housing 630 can be disposed in an environment that minimizes interference of light. The first mirror 611 forms a light path provided to the first process chamber 260a. The first mirror 611 transmits a laser beam to the first laser beam transmission member 443a that guides to the first process chamber 260a. The second mirror 612 forms a light path provided to the second process chamber 260b. The second mirror 612 transmits a laser beam to the first laser beam transmission member 443b that guides to the second process chamber 260b. The third mirror 613 forms a light path provided to the third process chamber 260c. The third mirror 613 transmits a laser beam to the first laser beam transmission member 443c that guides to the third process chamber 260c. Each mirror disposed in the mirror unit 610 can be independently moved between a first position and a second position. The first position is a position in which the mirror forms a path along which a laser beam is reflected and transmitted to a corresponding process chamber, and the second position is a position to which the mirror is moved backward from the first position and at which the mirror does not change the path of the laser beam. The movement of the mirror can be performed by driving a motor connected to the mirror.

[0092] In an embodiment, when the second laser beam transmission member 543 connected to the laser beam generator 500 is implemented with an optical fiber, a collimator 640 can be disposed on an end of the second laser beam transmission member 543. Meanwhile, according to an embodiment, the collimator 640 can be omitted when the laser beam generated from the laser beam generator 500 is collimated.

[0093] Figure 9 is a schematic view showing another embodiment of a connection relationship between the inventive concept laser beam generator 500 and the light beam moving module 600. According to another embodiment, the second laser beam transmission member 543 can not be disposed between the laser beam generator 500 and the light beam moving module 600, and the laser beam generator 500 and the light beam moving module 600 can be directly connected to each other. In the case where the laser beam generator 500 and the light beam moving module 600 are directly connected to each other, the collimator 640 can be omitted. However, in the case where the laser beam generator 500 and the light beam moving module 600 are directly connected to each other, it is necessary to secure sufficient space in which the laser beam generator 500 and the light beam moving module 600 are disposed, and thus the degree of freedom of design can be lower than that in the embodiment of Figure 8 .

[0094] Figures 10 to 12 The operations of the substrate processing apparatus to which the light beam moving module 600 according to the first embodiment of the present inventive concept is applied are sequentially shown.

[0095] Referring to Figure 10 , the first mirror 611 is located at the first position and reflects the laser beam to deliver the laser beam to the first process chamber 260a corresponding to the first mirror 611. Referring to Figure 11 , the first mirror 611 moves to the second position and does not change the path of the laser beam. In other words, the first mirror 611 moves to the second position, and the laser beam moves straight ahead without interference from the first mirror 611. The laser beam is reflected by the second mirror 612 and delivered to the second process chamber 260b corresponding to the second mirror 612. Referring to Figure 12 , the second mirror 612 moves to the second position and does not change the path of the laser beam. In other words, the second mirror 612 moves to the second position, and the laser beam moves straight ahead without interference from the first mirror 611 and the second mirror 612. The laser beam is reflected by the third mirror 613 and delivered to the third process chamber 260c corresponding to the third mirror 613. As described above with reference to Figures 10 to 12 , the laser beam generated and delivered by the laser beam generator 500 can be sequentially delivered to the first process chamber 260a, the second process chamber 260b, and the third process chamber 260c by the operation of the mirror unit 610.

[0096] Figures 13 to 15 The operations of the substrate processing apparatus to which the light beam moving module 1600 according to the second embodiment of the present inventive concept is applied are sequentially shown.

[0097] First, the operations of the substrate processing apparatus to which the light beam moving module 1600 according to the second embodiment of the present inventive concept is applied will be described with reference to Figure 13The operation of the light beam moving module 1600 and the substrate processing apparatus according to the second embodiment of the present inventive concept is described. The light beam moving module 1600 includes a mirror unit 1610. The mirror unit 1610 includes as many mirrors as the first set of process chambers 260. For example, as an example of the first set of process chambers 260, three process chambers 260a, 260b, and 260c are shown. Three mirrors 1611, 1612, and 1613 corresponding to the three process chambers 260a, 260b, and 260c, respectively, are shown. The first mirror 1611 forms a light path provided to the first process chamber 260a. The first mirror 1611 transmits the laser beam to the first laser beam transmission member 443a that directs to the first process chamber 260a. The second mirror 1612 forms a light path provided to the second process chamber 260b. The second mirror 1612 transmits the laser beam to the first laser beam transmission member 443b that directs to the second process chamber 260b. The third mirror 1613 forms a light path provided to the third process chamber 260c. The third mirror 1613 transmits the laser beam to the first laser beam transmission member 443c that directs to the third process chamber 260c. Each mirror disposed in the mirror unit 1610 can be independently moved between a first position and a second position. The first position is a position where the mirror forms a path along which the laser beam is reflected and transmitted to the corresponding process chamber, and the second position is a position to which the mirror is rotated about a rotation axis from the first position and at which the mirror does not change the path of the laser beam. The movement of the mirror can be performed by driving a motor connected to the rotation axis.

[0098] Referring to Figure 13 , the first mirror 1611 is in the first position and reflects the laser beam to transmit the laser beam to the first process chamber 260a corresponding to the first mirror 1611. Referring to Figure 14 , the first mirror 1611 moves to the second position and does not change the path of the laser beam. In other words, the first mirror 1611 moves to the second position, and the laser beam moves straight ahead without interference from the first mirror 1611. The laser beam is reflected by the second mirror 1612 and transmitted to the second process chamber 260b corresponding to the second mirror 612. Referring to Figure 15 , the second mirror 1612 moves to the second position and does not change the path of the laser beam. In other words, the second mirror 1612 moves to the second position, and the laser beam moves straight ahead without interference from the first mirror 1611 and the second mirror 1612. The laser beam is reflected by the third mirror 1613 and transmitted to the third process chamber 260c corresponding to the third mirror 1613. As described above with reference to Figures 13 to 15 , the laser beam generated and transmitted by the laser beam generator 500 can be sequentially transmitted to the first process chamber 260a, the second process chamber 260b, and the third process chamber 260c by the operation of the mirror unit 1610.

[0099] In the above embodiments, three process chambers 260 have been described as an example. However, the number of process chambers 260 can be increased or decreased in consideration of the use and floor space of the apparatus. When the number of process chambers 260 is increased or decreased, the number of corresponding mirrors can also be increased or decreased accordingly.

[0100] Figures 16 to 18 The operation of the substrate processing apparatus to which the light beam moving module 2600 according to the third embodiment of the present inventive concept is applied is sequentially shown.

[0101] First, the operation of the light beam moving module 2600 according to the third embodiment of the present inventive concept will be described with reference to Figure 16 The operation of the light beam moving module 2600 according to the third embodiment of the present inventive concept will be described with reference to The light beam moving module 2600 includes a mirror unit 2610. The mirror unit 2610 is movable to correspond to a first group of process chambers 260. For example, as an example of the first group of process chambers 260, three process chambers 260a, 260b, and 260c are shown. A first mirror 2611 capable of transmitting a laser beam to each of the three process chambers 260a, 260b, and 260c is shown. At a first position, the first mirror 2611 forms an optical path providing the first process chamber 260a. The first mirror 2611 transmits the laser beam to a first laser beam transmission member 443a directed to the first process chamber 260a. The first mirror 2611 moves to a second position and forms an optical path provided to the second process chamber 260b. The first mirror 2611 transmits the laser beam to a first laser beam transmission member 443b directed to the second process chamber 260b. The first mirror 2611 moves to a third position and forms an optical path provided to the third process chamber 260c. The first mirror 2611 transmits the laser beam to a first laser beam transmission member 443c directed to the third process chamber 260c. The first mirror 2611 disposed in the mirror unit 2610 is movable between the first position, the second position, and the third position. The first position is a position at which the first mirror 2611 forms a path along which the laser beam is reflected and transmitted to the first process chamber 260a. The second position is a position to which the first mirror 2611 is moved backward from the first position, at which the first mirror 2611 forms a path along which the laser beam is reflected and transmitted to the second process chamber 260b. The third position is a position to which the first mirror 2611 is moved backward from the second position, at which the first mirror 2611 forms a path along which the laser beam is reflected and transmitted to the third process chamber 260c. The movement of the first mirror 2611 can be performed by driving a linear motor (not shown) connected to the first mirror 2611.

[0102] Referring to Figure 16 , the first mirror 2611 is located at the first position and reflects the laser beam to transmit the laser beam to the first process chamber 260a corresponding to the first mirror 2611. Referring to Figure 17The first mirror 2611 moves to the second position, and the laser beam is reflected by the first mirror 2611 located at the second position and delivered to the second process chamber 260b. Referring to Figure 18 The first mirror 2611 moves to the third position, and the laser beam is reflected by the first mirror 2611 located at the third position and delivered to the third process chamber 260c. As described above with reference to Figures 16 to 18 The laser beam generated and delivered by the laser beam generator 500 can be sequentially delivered to the first process chamber 260a, the second process chamber 260b, and the third process chamber 260c by the operation of the mirror unit 2610.

[0103] In the above-described embodiments, three process chambers 260 have been described as an example. However, the number of process chambers 260 can be increased or decreased in consideration of the purpose and floor space of the apparatus.

[0104] In the first and second embodiments, when the number of process chambers 260 is increased or decreased, the number of corresponding mirrors can also be increased or decreased accordingly.

[0105] Figure 19 is a flowchart illustrating a method for operating a substrate processing apparatus according to an embodiment of the inventive concept. In the flowchart of Figure 19 In the flowchart, the passage of time is indicated by a timeline.

[0106] According to an embodiment, before laser heating, a pre-process of dispensing a chemical and forming a puddle of the chemical on the substrate W is performed in the first process chamber 260a (S11). The chemical can be a liquid that improves process efficiency by heating. According to an embodiment, the chemical can be a liquid containing phosphoric acid. Although a process of forming a puddle of a chemical is exemplified, a different process can be performed before laser heating.

[0107] After the pre-process, the substrate W is heated by applying a laser beam to the substrate W in the first process chamber 260a (S12). In the case where step S12 is performed in the first process chamber 260a, step S11 of the pre-process before laser heating is performed in the second process chamber 260b.

[0108] When the step S12 of heating the substrate W by applying the laser beam to the substrate W in the first process chamber 260a is completed, a post-process of rinsing chemicals (S13) is performed. At this time, the rinsing solution can be an aqueous solution of phosphoric acid, SC-1, DI, IPA, or the like. Although a process of rinsing chemicals is exemplified, a different process can be performed after the laser heating. In a case where the step S13 is performed in the first process chamber 260a, the step S12 of heating the substrate W by applying the laser beam to the substrate W is performed in the second process chamber 260b. Further, in a case where the step S12 is performed in the second process chamber 260b, the step S11 is performed in the third process chamber 260c.

[0109] When the post-process after the laser heating is completely performed on the substrate W in the first process chamber 260a, the step S11 of the pre-process before the laser heating can be performed again in the first process chamber 260a. At this time, the step S13 of the post-process after the laser heating is performed on the substrate W in the second process chamber 260b. Further, the step S12 of heating the substrate W by applying the laser beam to the substrate W is performed in the third process chamber 260c.

[0110] When the step S12 of heating the substrate W by applying the laser beam to the substrate W in the third process chamber 260c is completed, the step S12 of heating the substrate W by applying the laser beam to the substrate W can be performed again in the first process chamber 260a. At this time, the step S13 of the post-process after the laser heating is performed on the substrate W in the third process chamber 260c. Further, the step S11 can be performed in the second process chamber 260b.

[0111] The steps S11, S12, and S13 can be repeated a plurality of times. For example, the steps S11, S12, and S13 can be repeated four or more times.

[0112] In a case where the substrate processing apparatus and the method for operating the substrate processing apparatus according to the embodiments of the present inventive concept are used, a plurality of process chambers 260 can share one laser beam generator 500, and thus manufacturing costs can be reduced. Further, a reduction in floor space can be achieved by a relatively simple configuration of the beam movement modules 600, 1600, and 2600. Further, a plurality of process chambers 260 can be efficiently operated without delay using the laser beam generated from one laser beam generator 500. Further, a reduction in process time and an improvement in processing efficiency can be achieved by sequentially operating the process chambers 260.

[0113] Further, according to the embodiment of the present inventive concept, the laser beam intensity can be adjusted by adjusting the distance between the end of the first laser beam delivery member 443 and the lens unit 442b. Thus, even if one laser beam generator 500 is used, the heating conditions depending on different environments of each process chamber 260 can be changed.

[0114] To sequentially deliver a high-power laser beam for processing (e.g., heating) a substrate W to a plurality of process chambers, the embodiment of the present inventive concept can be modified to various application examples. The process chambers can be chambers for heating rather than chambers for cleaning or etching. For example, the process chambers can be annealing chambers.

[0115] The laser beam generator 500 and the beam moving module 600, 1600, or 2600 according to the embodiment of the present inventive concept can be disposed in a lower layer in which the process chambers 260 are disposed. For example, in a case where a first group of process chambers 260 is disposed in a row and a second group of process chambers 260 is disposed in a row under the first group of process chambers 260, a spacing distance can be disposed in a layer between the first group and the second group or in a layer under the second group, and the laser beam generator 500 and the beam moving module 600, 1600, or 2600 can be disposed in the spacing distance. The laser beam generator 500 and the beam moving module 600, 1600, or 2600 that apply a laser beam to the first group of process chambers 260 can be disposed separately from the laser beam generator 500 and the beam moving module 600, 1600, or 2600 that apply a laser beam to the second group of process chambers 260.

[0116] As described above, according to the embodiment of the present inventive concept, the etching performance of a substrate processing apparatus can be improved.

[0117] According to the embodiment of the present inventive concept, the temperature of a substrate can be rapidly increased and decreased, and thus can be accurately controlled.

[0118] According to the embodiment of the present inventive concept, the light distribution can be effectively adjusted when a substrate is heated by applying a laser beam to the substrate.

[0119] According to the embodiment of the present inventive concept, the light intensity can be effectively adjusted during the application of a laser beam to a substrate.

[0120] According to the embodiment of the present inventive concept, the manufacturing cost of a substrate processing apparatus can be reduced.

[0121] According to the embodiment of the present inventive concept, the floor space (the amount of space occupied by the apparatus) of a substrate processing apparatus can be reduced.

[0122] According to embodiments of the present inventive concept, processing can be performed without delay in a plurality of substrate processing apparatuses using a single laser beam generator.

[0123] According to embodiments of the present inventive concept, heating conditions dependent on different environments can be changed for each process chamber, although a single laser beam generator is used.

[0124] Effects of the present inventive concept are not limited to what has been described hereinabove with reference to the embodiments, and any other effects not mentioned herein will become apparent to those skilled in the art from the present description and the annexed drawings.

[0125] Although the present inventive concept has been described with reference to the embodiments, it is apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the present inventive concept. Therefore, it is understood that the above embodiments are illustrative in all aspects and are not restrictive.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: A first process chamber group, comprising a plurality of process chambers, each of the plurality of process chambers including a laser beam emitting unit configured to apply a laser beam to a substrate to heat the substrate. A laser beam generator, the laser beam generator being configured to generate a laser beam applied to the substrate via a laser beam emitting unit in each of the plurality of process chambers included in the first process chamber group; and A beam movement module, the beam movement module including a plurality of mirrors corresponding to the plurality of process chambers included in the first process chamber group, Each of the plurality of mirrors is moved to a position where it forms an optical path for the laser beam toward a predetermined process chamber from the plurality of process chambers. Each of the plurality of mirrors moves between a first position and a second position. At the first position, the mirror forms an optical path for the laser beam toward a corresponding process chamber. At the second position, the mirror does not obstruct the optical path of the laser beam. When the plurality of mirrors are in the first position, the plurality of mirrors are arranged in a row. Each of the plurality of process chambers further includes: A substrate support unit, the substrate support unit being configured to support and rotate the substrate; and A liquid dispensing unit, the liquid dispensing unit including a chemical dispensing nozzle configured to dispense chemicals onto a substrate supported on the substrate support unit.

2. The substrate processing apparatus according to claim 1, wherein, Each of the plurality of mirrors moves between the first position and the second position by linear motion.

3. The substrate processing apparatus according to claim 1, wherein, Each of the plurality of mirrors moves between the first position and the second position by tilting.

4. The substrate processing apparatus according to claim 3, wherein, The tilting is performed with the rotation axis of the mirror as the center.

5. The substrate processing apparatus according to claim 1, wherein, The beam moving module is optically connected to the laser beam emitting unit of each of the plurality of process chambers via a laser beam transmission component corresponding to the laser beam emitting unit.

6. The substrate processing apparatus according to claim 5, wherein, The laser beam transmission component is implemented using optical fiber.

7. The substrate processing apparatus according to claim 1, wherein, The laser beam generator has a power output of several kilowatts.

8. The substrate processing apparatus according to claim 1, wherein, The substrate support unit includes: A window member is disposed below the substrate and is formed of a material through which the laser beam emitted from the laser beam emitting unit can pass; A chuck pin, configured to support a side portion of the substrate and space the substrate from the window member at a predetermined interval; A rotating housing having an empty space extending through it in an up / down direction, the rotating housing being coupled to the window member and configured to provide a path along which the laser beam is transmitted; and A drive member configured to rotate the rotating housing, and The laser beam emitting unit is located below the window component.

9. The substrate processing apparatus according to claim 1, wherein, The chemical dispensed by the liquid dispensing unit is a liquid containing phosphoric acid.

10. The substrate processing apparatus according to claim 1, further comprising: Controller Each of the plurality of process chambers performs the following: A first process of dispensing chemicals onto the substrate; and The second process of heating the substrate with the laser beam, and Wherein, the controller: The execution control causes each of the plurality of process chambers included in the first process chamber group to sequentially execute the first process and the second process over time, and the plurality of process chambers to simultaneously execute different processes; and The beam movement module is controlled such that: the plurality of mirrors form an optical path toward one of the plurality of process chambers, in which the second process is performed; and the laser beam generated from the laser beam generator is transmitted to the process chamber, in which the second process is performed.

11. The substrate processing apparatus according to claim 1, further comprising: Controller Each of the aforementioned process chambers performs the following: The first process of dispensing chemicals onto the substrate; and The second process of heating the substrate with the laser beam, and Wherein, the controller: The execution control causes each of the plurality of process chambers included in the first process chamber group to sequentially execute the first process and the second process over time, and the plurality of process chambers to simultaneously execute different processes; and The beam movement module is controlled such that: a mirror configured to form an optical path toward one of the plurality of process chambers is in a first position, in which the second process is performed; a mirror located on the upstream side of the optical path is in a second position, the optical path being formed by the mirror in the first position among the plurality of mirrors; and the laser beam generated from the laser beam generator is transmitted to the process chamber in which the second process is performed.

12. The substrate processing apparatus according to claim 10 or 11, wherein, Each of the plurality of process chambers additionally performs a third process of dispensing a rinsing solution onto the substrate and replacing the chemicals with the rinsing solution, and Each of the plurality of process chambers included in the first process chamber group sequentially executes the first process, the second process, and the third process over time.

13. The substrate processing apparatus according to claim 5, wherein, The laser beam emitting unit includes a lens module, which includes at least one lens unit. The lens module is configured to refract the laser beam to shape it into a form corresponding to the substrate. The distance between the lens unit of the lens module and the end of the laser beam transmission component is adjustable.

14. The substrate processing apparatus according to claim 1, wherein, Each of the plurality of process chambers further includes a platform configured to move the laser beam emitting unit up and down to adjust the distance between the laser beam emitting unit and the substrate.

15. A method for processing multiple substrates using a substrate processing apparatus, wherein, The substrate processing equipment includes multiple process chambers and a laser beam generator. Each process chamber is configured to process a single substrate, and the laser beam generator is configured to generate a laser beam. Each of the multiple process chambers performs the following: The first process of dispensing chemicals onto the substrate; and The second process of heating the substrate using the laser beam. In this configuration, each of the plurality of process chambers sequentially executes the first process and the second process over time, and the plurality of process chambers simultaneously execute different processes. The laser beam generated from the laser beam generator is optically connected to the plurality of process chambers through multiple optical paths, and The laser beam is applied to only one process chamber, following an optical path connected to one of the plurality of process chambers where the second process is performed. Mirrors are respectively arranged on the plurality of optical paths, and each mirror is configured to form an optical path toward a corresponding process chamber in a first position. The mirror is movable to a second position, in which it does not obstruct the optical path of the laser beam. Among the multiple mirrors, the mirror located on the upstream side of the optical path is positioned in a second position, the optical path being formed by the mirror located in the first position; and the laser beam generated from the laser beam generator is transmitted to the process chamber where the second process is performed. When the plurality of mirrors are in the first position, the plurality of mirrors are arranged in a row.

16. The method of claim 15, wherein, Close the optical paths to all process chambers except for one of the process chambers that performs the second process.

17. The method according to claim 15, wherein, Each of the plurality of process chambers additionally performs a third process of dispensing a rinsing solution onto the substrate and replacing the chemicals with the rinsing solution, and In this process, each of the multiple processing chambers sequentially executes the first process, the second process, and the third process over time.

18. The method according to claim 15, wherein, The laser beam generator has a power output of several kilowatts.

19. The method according to claim 15, wherein, The chemical dispensed in the first process is a liquid containing phosphoric acid.

20. A substrate processing apparatus, the substrate processing apparatus comprising: The first process chamber group includes multiple process chambers; A laser beam generator, wherein the laser beam emitter is configured to generate a laser beam; A beam movement module, the beam movement module including a plurality of mirrors corresponding to the plurality of process chambers included in the first process chamber group; as well as Controller Each of the plurality of process chambers includes: A substrate support unit configured to support and rotate the substrate; A liquid dispensing unit, the liquid dispensing unit including a chemical dispensing nozzle configured to dispense a chemical onto a substrate supported on a substrate support unit; and A laser beam emitting unit is configured to apply the laser beam to the substrate to heat the substrate. The substrate support unit includes: A window member is disposed below the substrate and is formed of a material through which the laser beam emitted from the laser beam emitting unit can pass; A chuck pin, configured to support a side portion of the substrate and space the substrate from the window member at a predetermined interval; A rotating housing having an empty space extending through it in an up / down direction, the rotating housing being coupled to the window member and configured to provide a path along which the laser beam is transmitted; and A drive member configured to rotate the rotating housing. The laser beam emitting unit is located below the window component. The beam moving module is optically connected via a laser beam transmitting component, which is connected to the laser beam emitting unit of each of the plurality of process chambers. Each of the plurality of mirrors moves between a first position and a second position. At the first position, the mirror forms an optical path for the laser beam toward a corresponding process chamber. At the second position, the mirror does not obstruct the optical path of the laser beam. The controller performs control such that: a mirror configured to form an optical path toward a selected process chamber from the plurality of process chambers is positioned in a first position; a mirror located upstream of the optical path, the optical path being formed by the mirror positioned in the first position; and a laser beam generated from the laser beam generator is transmitted to the selected process chamber. When the plurality of mirrors are in the first position, the plurality of mirrors are arranged in a row.

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