Semiconductor process equipment and heating device thereof

Abstract

The present invention discloses semiconductor processing equipment and a heating device therefor. The disclosed semiconductor processing equipment includes a gas source chamber and a pipeline assembly, the pipeline assembly communicating with the gas source chamber and located outside the gas source chamber. The disclosed heating device includes a housing and a heating assembly, the housing being used to enclose a closed heating chamber with the gas source chamber, the pipeline assembly being located within the heating chamber, and the heating assembly being located within the heating chamber and configured to heat the pipeline assembly within the heating chamber. This solution can solve the problem of exposed gaps forming at the intersection of the heating tapes when the pipeline assembly is heated by the heating tapes, which can cause gas within the pipeline assembly to condense and clog the pipeline assembly.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a semiconductor process equipment and a heating device thereof. Background Art

[0002] The processing of semiconductor devices by semiconductor process equipment usually needs to be carried out in a process chamber. In some process links, it is necessary to fill the process chamber with reactants (such as reaction gases or steam pulses) used to process semiconductor devices so that a reaction occurs in the process chamber to process the semiconductor devices. Before the reactants enter the process chamber, the reactants need to be prepared in advance. When preparing the reactants, it is necessary to first input a carrier gas into the gas source chamber through a pipeline assembly, and the carrier gas carries the reactants into the process chamber through the pipeline assembly. In order to make the carrier gas and reactants have good thermal kinetic energy in the pipeline assembly, the pipeline assembly needs to be heated.

[0003] Because pipeline assemblies typically consist of multiple pipes and valves, conventional heating methods typically involve attaching separate heating tape to each of these pipes and valves. This heating process is known as "segmented heating," which creates gaps where the heating tapes meet, potentially leading to condensation of carrier gas and reactants that can clog the pipeline assembly. Summary of the Invention

[0004] The invention discloses semiconductor process equipment and a heating device thereof, which solves the problem that when a pipeline component is wrapped and heated by a heating belt, exposed gaps are easily formed at the intersection of the heating belts, causing gas in the pipeline component to condense and block the pipeline component.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, the present application discloses a heating device for semiconductor process equipment, wherein the semiconductor process equipment includes a gas source chamber and a pipeline assembly, wherein the pipeline assembly is in communication with the gas source chamber and is located outside the gas source chamber;

[0007] The heating device includes a shell and a heating component. The shell is used to form a closed heating chamber with the gas source chamber. The pipeline component is arranged in the heating chamber. The heating component is arranged in the heating chamber and is used to heat the pipeline component in the heating chamber.

[0008] In the second aspect, the present application also discloses a semiconductor process equipment, comprising a gas source chamber, a pipeline assembly, a process chamber and the heating device described in the first aspect, wherein the heating device is used to heat the pipeline assembly; the pipeline assembly is respectively connected to the gas source chamber and the process chamber, and is used to output the reactants in the gas source chamber to the process chamber.

[0009] The technical solution adopted by the present invention can achieve the following technical effects:

[0010] The present application arranges the heating device into a structure including a shell and a heating component, so that a closed heating chamber can be formed by the shell and the gas source chamber, so that the pipeline assembly and the heating component can be arranged in the heating chamber, and then the pipeline assembly in the heating chamber can be heated by the heating component. Since the shell and the gas source chamber form a closed heating chamber, when the heating component is heated, the temperature in the heating chamber can be kept relatively uniform as a whole, so that the pipe group assembly in the heating chamber is heated relatively uniformly as a whole, thereby effectively avoiding the problem of gas condensation and clogging the pipeline assembly due to exposed gaps at the intersection of the heating belts when the pipeline assembly is wrapped and heated by the heating belt, and also avoiding the problem of uneven heating of the pipeline assembly due to the discontinuity of the heating belt when the pipeline assembly is wrapped and heated by the heating belt. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 A schematic structural diagram of a semiconductor process equipment disclosed in an embodiment of the present invention;

[0012] Figure 2 A cross-sectional view of a semiconductor process equipment disclosed in an embodiment of the present invention;

[0013] Figure 3 This is a schematic diagram of the second heating belt abutting against the housing according to an embodiment of the present invention;

[0014] Figure 4 This is a schematic structural diagram of the fifth shell portion disclosed in an embodiment of the present invention;

[0015] Figure 5 This is a schematic structural diagram of the third shell portion disclosed in an embodiment of the present invention;

[0016] Figure 6 This is a schematic structural diagram of the fourth shell portion disclosed in an embodiment of the present invention;

[0017] Figure 7 This is a schematic structural diagram of a heat pipe disclosed in an embodiment of the present invention.

[0018] Description of reference numerals:

[0019] 100-gas source chamber,

[0020] 200-Pipeline components,

[0021] 300-shell, 310-third shell, 320-fourth shell, 330-fifth shell,

[0022] 410-second heating belt, 420-first base, 430-first adjustment assembly, 431-first adjustment bolt, 432-locking nut, 433-tray, 440-second base, 450-second adjustment assembly,

[0023] 500-heat pipe, 510-air outlet,

[0024] 600- regulating valve,

[0025] 700-heating assembly, 710-first heating belt, 720-heat conducting plate. DETAILED DESCRIPTION

[0026] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] The technical solutions disclosed in various embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] Please refer to Figures 1 to 7 The present invention discloses a heating device for semiconductor process equipment. The heating device can be used to heat reactants before entering a process chamber of the semiconductor process equipment.

[0029] The semiconductor process equipment includes a gas source chamber 100 and a pipeline assembly 200. The pipeline assembly 200 is connected to the gas source chamber 100 and is located outside the gas source chamber 100. The gas source chamber 100 is used to store reactants used in the semiconductor device process. The pipeline assembly 200 includes a plurality of valves ( Figure 2 Circles in ) and multi-segment pipelines ( Figure 2 The pipe section connected between the two circles in the middle is used to transport gas. Specifically, the pipe assembly 200 is used to transport the carrier gas for carrying the reactants to the gas source chamber 100, and to input the reactants carried by the carrier gas in the gas source chamber 100 into the process chamber.

[0030] The heating device includes a shell 300 and a heating component 700. The shell 300 is used to form a closed heating chamber with the gas source chamber 100. The shell 300 can be in contact with an outer wall of the gas source chamber 100 to form a closed heating chamber; the shell 300 can also be clamped on the outer wall of the gas source chamber 100, and part of the gas source chamber 100 can be located in the heating chamber to form a closed heating chamber. There is no limitation on the specific structure of the heating chamber formed by the shell 300 and the gas source chamber 100. The heating component 700 can be a heating wire or an infrared heating lamp. There is no specific limitation on the structure of the heating component 700.

[0031] The piping assembly 200 is located within the heating chamber. The portion of the gas source chamber 100 that communicates with the piping assembly 200 is located within the portion surrounding the heating chamber. The heating assembly 700 is located within the heating chamber and is used to heat the heating chamber. The heating assembly 700 heats the heating chamber, thereby heating the piping assembly 200 within the heating chamber.

[0032] During the specific implementation process, the shell 300 and the gas source chamber 100 form a closed heating chamber, the pipeline assembly 200 is arranged in the heating chamber, the heating assembly 700 is arranged in the heating chamber to heat the heating chamber, and the heating chamber heats the pipeline assembly 200 to heat the carrier gas and reactants in the pipeline assembly 200.

[0033] The present application sets the heating device to include a structure including a shell 300 and a heating assembly 700, so that the shell 300 and the gas source chamber 100 can enclose a closed heating chamber, so that the pipe assembly 200 and the heating assembly 700 can be arranged in the heating chamber, and the heating chamber can be heated by the heating assembly 700. Since the shell 300 and the gas source chamber 100 enclose a closed heating chamber, when the heating assembly 700 heats the heating chamber, the temperature in the heating chamber can be kept relatively uniform, so that the pipe assembly in the heating chamber is heated relatively uniformly as a whole, thereby effectively avoiding the problem of exposed gaps at the intersection of the heating tapes when the pipe assembly 200 is wrapped and heated, causing gas condensation in the pipe assembly 200 to block the pipe assembly 200, and also avoiding the problem of uneven heating of the pipe assembly 200 due to the discontinuity of the heating tape when the pipe assembly 200 is wrapped and heated.

[0034] In an optional embodiment, the housing 300 may include at least two shell parts, and the at least two shell parts may include a first shell part and a second shell part. The first shell part may be connected to the second shell part by welding or screw fastening, and the first shell part and the second shell part may be clamped in the gas source chamber 100 to connect the housing 300 to the gas source chamber 100, so as to achieve the installation of the housing 300 and the gas source chamber 100. The first shell part, the second shell part and the gas source chamber 100 may enclose at least part of the heating chamber. The first shell part and the second shell part may be separated to separate the housing 300 from the gas source chamber 100, or the first shell part and the second shell part may be clamped in the gas source chamber 100 and pulled out along the outer wall of the gas source chamber 100 to separate the housing 300 from the gas source chamber 100.

[0035] By connecting the first and second shell portions and sandwiching them within the gas source chamber 100, the housing 300 is connected to the gas source chamber 100, thereby enabling installation of the housing 300 and the gas source chamber 100. This allows the first and second shell portions, along with the gas source chamber 100, to enclose at least a portion of the heating chamber. By configuring the housing 300 as comprising the first and second shell portions, with the first and second shell portions sandwiched within the gas source chamber, installation of the housing 300 and the gas source chamber 100 is achieved, while also simplifying disassembly between the housing 300 and the gas source chamber 100, thereby facilitating maintenance of components within the heating chamber.

[0036] In an optional embodiment, the shell 300 may include at least two shell portions, and the at least two shell portions may include a third shell portion 310, a fourth shell portion 320 and a fifth shell portion 330. The third shell portion 310 and the fourth shell portion 320 are clamped in the gas source chamber 100 to achieve the installation of the shell 300 and the gas source chamber 100. The third shell portion 310 and the fourth shell portion 320 are both connected to the fifth shell portion 330 which is U-shaped as a whole, and the third shell portion 310 and the fourth shell portion 320 are arranged opposite to each other. The third shell portion 310, the fourth shell portion 320, the fifth shell portion 330 and the gas source chamber 100 form a closed heating chamber.

[0037] In an optional embodiment, the heating device may include a second heating belt 410, a first base 420, and a first adjustment assembly 430. The second heating belt 410 may be wrapped around the outer wall of the gas source chamber 100 and may be used to heat the gas source chamber 100. The first adjustment assembly 430 may be connected between the first base 420 and the second heating belt 410 and may be used to drive the second heating belt 410 into contact with the housing 300, so that the gas source chamber 100 can be located within the enclosed space enclosed by the second heating belt 410 and the housing 300. The housing 300 may be supported on the first base 420, or alternatively, on other supporting components.

[0038] When the second heating belt 410 is wrapped around the outer wall of the gas source chamber 100, a gap may exist at the connection between the second heating belt 410 and the shell 300, resulting in a cold spot in the gas source chamber 100 at the gap and causing uneven heating. By connecting the first adjustment component 430 between the second heating belt 410 and the first base 420, the first adjustment component 430 can adjust the second heating belt 410 to abut against the shell 300, thereby positioning the gas source chamber 100 within the enclosed space enclosed by the second heating belt 410 and the shell 300. This effectively solves the problem of uneven heating caused by cold spots in the gas source chamber 100 due to the gap between the second heating belt 410 and the shell 300 due to loose wrapping, thereby effectively improving the heating performance within the gas source chamber 100.

[0039] In an alternative embodiment, the first adjustment assembly 430 may include a first adjustment bolt 431, a locking nut 432, and a tray 433. The second heating belt 410 may be supported on the tray 433, and the tray 433 may support the gas source chamber 100 via the heating belt. The first end of the first adjustment bolt 431 may be fixedly connected to the tray 433, and the second end of the first adjustment bolt 431 may be threadedly connected to the first base 420. The first adjustment bolt 431 may be rotated relative to the first base 420 to adjust the distance between the tray 433 and the first base 420, thereby driving the second heating belt 410 into contact with the housing 300. The locking nut 432 may be threadedly engaged with the first adjustment bolt 431 and abutted against the first base 420 to limit the rotation of the first adjustment bolt 431. Specifically, the first end of the first adjustment bolt 431 is fixedly connected to the tray 433, and rotation of the first adjustment bolt 431 relative to the first base 420 may cause the first adjustment bolt 431 to rotate.

[0040] By configuring the first adjustment assembly 430 to comprise a first adjustment bolt 431, a lock nut 432, and a tray 433, with the first end of the first adjustment bolt 431 fixedly connected to the tray 433 and the second end of the first adjustment bolt 431 threadedly connected to the first base 420, the tray 433 can support the second heating belt 410 and the gas source chamber 100. Furthermore, by rotating the tray 433 and driving the first adjustment bolt 431, the spacing between the tray 433 and the first base 420 can be adjusted. Adjusting the spacing between the tray 433 and the first base 420 thereby adjusts the movement of the second heating belt 410 supported on the tray 433, thereby driving the second heating belt 410 into contact with the housing 300, thereby forming a closed space between the second heating belt 410 and the housing 300. Adjusting the movement of the tray 433 by rotating the first adjustment bolt 431, and thereby adjusting the contact of the second heating belt 410 with the housing 300, provides relatively high adjustment precision and is easy to operate and control. By tightening the locking nut 432 , the first adjusting bolt 431 can stably support the tray 433 after adjustment.

[0041] In an optional embodiment, the heating device may include a second heating belt 410, a second base 440, and a second adjustment assembly 450. The second heating belt 410 may be wrapped around the outer wall of the gas source chamber 100. The second heating belt 410 may be used to heat the gas source chamber 100. The housing 300 may be connected to the second base 440 via the second adjustment assembly 450. The second adjustment assembly 450 may adjust the distance between the housing 300 and the second base 440 to drive the housing 300 to abut against the second heating belt 410, so that the gas source chamber 100 is located within the enclosed space enclosed by the second heating belt 410 and the housing 300. The second heating belt 410 may be supported on the second base 440. Of course, the second heating belt 410 may also be supported on other supporting components.

[0042] By setting a second heating belt 410, the second heating belt 410 is wrapped around the gas source chamber 100 to heat the gas source chamber 100. By connecting the second adjusting component 450 between the second base 440 and the shell 300, the second adjusting component 450 can adjust the distance between the shell 300 and the second base 440, thereby moving the shell 300 so that the second heating belt 410 abuts against the shell 300, so that the gas source chamber 100 is located in the closed space surrounded by the second heating belt 410 and the shell 300, thereby avoiding the problem of cold spots in the gas source chamber 100 due to loose wrapping of the heating belt when heating, thereby effectively improving the heating performance of the gas source chamber 100.

[0043] Preferably, Figure 1 and Figure 2As shown, the second base 440 can be a plurality of support members arranged on the outer wall of the shell, and the support members are provided with studs and nuts. The studs and nuts can serve as the second adjustment component 450 to adjust the distance between the shell 300 and the support members, that is, the shell 300 is moved in the vertical direction by rotating the adjustment nut, and then the shell 300 and the top of the gas source chamber 100 are sealed at the joint surface, thereby achieving sealing and heat preservation of the top of the gas source chamber.

[0044] In an optional embodiment, the heating device may include a heat distribution pipe 500. The first end of the heat distribution pipe 500 may be located outside the heating chamber, and the second end of the heat distribution pipe may extend through the housing 300 into the heating chamber. The heat distribution pipe 500 may be used to transport gas into the heating chamber. The gas transported by the heat distribution pipe 500 may be a dry and clean gas, such as nitrogen or clean compressed air.

[0045] By providing a uniform heat pipe 500, one end of which extends into the heating chamber, the uniform heat pipe 500 can transport gas into the heating chamber, thereby evenly distributing the gas within the heating chamber. Consequently, when the heating assembly 700 is heated, the input gas absorbs heat and is evenly distributed within the heating chamber, resulting in relatively uniform heat within the heating chamber and uniform heating of the pipe assembly 200. Furthermore, when the input gas is dry and clean, the internal environment is more conducive to protecting the pipe assembly 200, thereby reducing corrosion of the pipe assembly 200.

[0046] In an optional embodiment, the portion of the heat pipe 500 extending into the heating chamber can be extended along the inner wall of the shell 300 through a fixed bracket, the second end of the heat pipe 500 can be sealed, and the portion of the heat pipe 500 extending into the heating chamber can be provided with a plurality of spaced apart air outlet holes 510.

[0047] By extending the portion of the heat pipe 500 that extends into the heating chamber along the inner wall of the housing 300, the heat pipe 500 not only transports gas but also supports and strengthens the housing 300. The portion of the heat pipe 500 that extends into the heating chamber is provided with multiple, spaced-apart air outlets 510. This allows for even distribution of gas within the heating chamber and convection when gas is delivered to the heating chamber. This allows the heat within the heating chamber to be more evenly distributed when the heating assembly 700 heats the heating chamber. This allows the pipe assembly to be heated through both heat conduction and convection, achieving uniform heating of the entire pipe assembly within the enclosed space.

[0048] Specifically, the diameter of the air outlet hole 510 may be between 0.5 and 3 mm. Of course, the diameter of the air outlet hole 510 may also be other sizes.

[0049] In an optional embodiment, the heating device may include a regulating valve 600. The regulating valve 600 may be located near the first end of the uniform heat pipe 500. The regulating valve 600 may be used to adjust the air pressure within the heating chamber. The regulating valve 600 may control the pressure of the gas delivered by the uniform heat pipe 500. The uniform heat pipe 500 may also control the air pressure within the heating chamber by controlling the gas delivered to the heating chamber.

[0050] By setting a regulating valve 600 on the uniform heat pipe 500, the regulating valve 600 can control the pressure of the gas transported by the uniform heat pipe 500. The uniform heat pipe 500 can also control the gas pressure in the heating chamber by controlling the gas transported into the heating chamber, thereby achieving precise control of the environment of the heating chamber, thereby making the heating of the pipeline assembly 200 by the heating chamber more stable.

[0051] In an optional embodiment, the heating assembly 700 may include a first heating belt 710, which may be laid along the inner wall of the housing 300. By laying the first heating belt 710 along the inner wall of the housing 300, the first heating belt 710 heats the heating chamber more evenly, and the housing 300 also provides a foundation for the installation of the first heating belt 710, making the structure more compact.

[0052] Furthermore, the heating assembly 700 also includes a heat conducting plate 720, which can be connected to the housing 300. The heat conducting plate 720 can be laid along the inner wall of the housing 300, so that the first heating belt 710 is sandwiched between the housing 300 and the heat conducting plate 720. By providing the heat conducting plate 720, the heat conducting plate 720 and the housing 300 can be connected by screws, so that the first heating belt 710 can be sandwiched between the housing 300 and the heat conducting plate 720. The heat conducting plate 720 can ensure that the heat from the first heating belt 710 is transferred to the heating chamber more evenly. When the heating power of the first heating belt 710 is unstable, the temperature change of the heat conducting plate 720 will not change rapidly, thereby making the heating more stable. The heat conducting plate 720 also has the function of insulating the heating chamber.

[0053] Specifically, the heat conducting plate 720 is preferably made of aluminum alloy with a thickness of 2 to 5 mm. Of course, the heat conducting plate can also be made of other materials and thicknesses.

[0054] The present application discloses a semiconductor process equipment, which includes a gas source chamber 100 (e.g., a source bottle), a pipeline assembly 200, a process chamber, and a heating device disclosed in the above embodiment. The heating device is used to heat the pipeline assembly 200. The pipeline assembly 200 is respectively connected to the gas source chamber 100 and the process chamber, and is used to output the reactants in the gas source chamber 100 to the interior of the process chamber. The pipeline assembly 200 is heated by the heating device so that the reactants heated by the heating device in the pipeline assembly 200 can be input into the process chamber, thereby meeting the process of the semiconductor device in the process chamber.

[0055] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0056] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. A heating device for semiconductor process equipment, used for heating reactants entering a process chamber of the semiconductor process equipment before entering the process chamber, characterized in that: The semiconductor process equipment comprises a gas source chamber (100) and a pipeline assembly (200), wherein the gas source chamber (100) is used to store the reactant, and the pipeline assembly (200) is communicated with the gas source chamber (100) and is located outside the gas source chamber (100); The heating device comprises a shell (300) and a heating assembly (700), wherein the shell (300) is used to enclose a closed heating chamber with the gas source chamber (100), the pipeline assembly (200) is arranged in the heating chamber, and the heating assembly (700) is arranged in the heating chamber and is used to heat the pipeline assembly (200) in the heating chamber.

2. The heating device according to claim 1, characterized in that The shell (300) includes at least two shell parts, and the at least two shell parts include a first shell part and a second shell part, the first shell part is used to be connected to the second shell part, the first shell part and the second shell part are clamped in the gas source chamber (100) to connect the shell (300) to the gas source chamber (100), and the first shell part, the second shell part and the gas source chamber (100) surround at least part of the heating chamber.

3. The heating device according to claim 1, characterized in that The heating device comprises a second heating belt (410), a first base (420) and a first adjustment component (430); The second heating belt (410) is wrapped around the outer wall of the gas source chamber (100); The first adjusting component (430) is connected between the first base (420) and the second heating belt (410), and the first adjusting component (430) is used to drive the second heating belt (410) to abut against the shell (300), so that the gas source chamber (100) is located in a closed space surrounded by the second heating belt (410) and the shell (300).

4. The heating device according to claim 3, characterized in that The first adjustment assembly (430) includes a first adjustment bolt (431), a locking nut (432) and a tray (433); the second heating belt (410) is supported on the tray (433); the first end of the first adjustment bolt (431) is fixedly connected to the tray (433); the second end of the first adjustment bolt (431) is threadedly connected to the first base (420); the first adjustment bolt (431) rotates relative to the first base (420) to adjust the distance between the tray (433) and the first base (420) to drive the second heating belt (410) to abut against the shell (300); the locking nut (432) is threadedly matched with the first adjustment bolt (431); the locking nut (432) is used to abut against the first base (420) to limit the rotation of the first adjustment bolt (431).

5. The heating device according to claim 1, characterized in that The heating device comprises a second heating belt (410), a second base (440) and a second adjustment component (450); The second heating belt (410) is wrapped around the outer wall of the gas source chamber (100); The shell (300) is connected to the second base (440) through the second adjustment component (450). The second adjustment component (450) drives the shell (300) to abut against the second heating belt (410) by adjusting the distance between the shell (300) and the second base (440), so that the gas source chamber (100) is located in a closed space surrounded by the second heating belt (410) and the shell (300).

6. The heating device according to claim 1, characterized in that The heating device comprises a heat distribution pipe (500), wherein a first end of the heat distribution pipe (500) is located outside the heating chamber, and a second end of the heat distribution pipe passes through the shell (300) and extends into the heating chamber, and the heat distribution pipe (500) is used to transport gas to the heating chamber.

7. The heating device according to claim 6, characterized in that The portion of the heat-distributing pipe (500) extending into the heating chamber is extended along the inner wall of the shell (300), the second end of the heat-distributing pipe (500) is sealed, and the portion of the heat-distributing pipe (500) extending into the heating chamber is provided with a plurality of spaced-apart air outlet holes (510).

8. The heating device according to claim 6, characterized in that The heating device comprises a regulating valve (600), the regulating valve (600) being arranged on the heat-uniform pipe (500) in an area close to the first end, and the regulating valve (600) being used to regulate the air pressure in the heating chamber.

9. The heating device according to claim 1, characterized in that The heating assembly (700) comprises a first heating belt (710), and the first heating belt (710) is laid along the inner wall of the shell (300).

10. The heating device according to claim 9, characterized in that The heating assembly (700) further comprises a heat conducting plate (720), wherein the heat conducting plate (720) is laid along the inner wall of the shell (300), so that the first heating belt (710) is sandwiched between the shell (300) and the heat conducting plate (720).

11. A semiconductor process equipment, characterized in that: The invention comprises a gas source chamber (100), a pipeline assembly (200), a process chamber and a heating device according to any one of claims 1 to 10, wherein the heating device is used to heat the pipeline assembly (200); the pipeline assembly (200) is respectively connected to the gas source chamber (100) and the process chamber, and is used to output the reactants in the gas source chamber (100) to the process chamber.

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