inductive component

Abstract

The present application provides an inductor component with a configuration that reduces the effects of firing and has a small number of winding turns of a winding wire, a small variation in the L value of each turn of the winding wire, and easy fine adjustment of the L value. The inductor component includes a single-layer glass plate that is a cuboid shape having a length, a width, and a height, the length being longer than the width, a bottom surface defined by the length and the width, and a top surface on the back side of the bottom surface; a bottom surface conductor and a top surface conductor disposed above the bottom surface and above the top surface, respectively; a through-hole formed in the single-layer glass plate; a base insulating layer disposed above the bottom surface conductor; and a first terminal electrode and a second terminal electrode disposed above the base insulating layer. A winding wire formed by electrically connecting the bottom surface conductor, the top surface conductor, and the through-hole is wound around a winding axis parallel to the bottom surface and the length, and the winding wire, the first terminal electrode, and the second terminal electrode are electrically connected to form an inductor element.

Description

Technical Field

[0001] The present invention relates to inductive components. Background Art

[0002] Japanese Patent Application Publication No. 2013-98350 discloses a method for manufacturing a laminated inductor component comprising a multi-layer glass body with conductors incorporated therein. Specifically, a plurality of glass green sheets, formed by laminating a glass paste containing glass powder, are prepared by printing and applying a conductive paste containing a conductive powder such as Ag or Cu. Next, the plurality of glass green sheets coated with the printed conductive paste are stacked and cut into individual sheets. At this stage, the ends of the conductive paste are exposed from the individual sheets.

[0003] Next, the single piece is fired to form a laminated glass body formed by sintering the glass paste and an internal conductor formed by sintering the conductor paste. At this time, the internal conductor is integrated with the laminated glass body and is taken into the interior of the laminated glass body with only the end portion exposed.

[0004] Next, the ends of the internal conductors exposed from the laminated glass body are plated to form terminal electrodes for electrical connection to the outside. This completes a laminated inductor component including an inductor element composed of the internal conductors and the terminal electrodes.

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2013-98350

[0006] Regarding the above-mentioned laminated inductor component, a new inductor component is proposed in US Application No. 16 / 838,918, which is based on US Provisional Application No. 62 / 830,158.

[0007] The inductor component includes: a single-layer glass plate; an outer surface conductor serving as at least a portion of an electrical element and disposed above the outer surface of the single-layer glass plate; and terminal electrodes serving as terminals of the electrical element, disposed above the outer surface of the single-layer glass plate and electrically connected to the outer surface conductor.

[0008] The inductor component further includes a through wiring serving as at least a portion of the electrical element, the through wiring penetrating through a through hole formed in the single glass plate and electrically connected to the outer surface conductor.

[0009] Moreover, in the inductor component, the above-mentioned outer surface includes a bottom surface which is one of the main surfaces of the above-mentioned single-layer glass plate and a top surface located on the back side of the above-mentioned bottom surface, the above-mentioned terminal electrodes include a first terminal electrode and a second terminal electrode which are input and output terminals of the above-mentioned electrical element, the above-mentioned first terminal electrode and the above-mentioned second terminal electrode are shaped so as to have a main surface parallel to the above-mentioned bottom surface above the above-mentioned bottom surface, the above-mentioned outer surface conductor includes a bottom surface conductor and a top surface conductor which are respectively arranged above the above-mentioned bottom surface and above the above-mentioned top surface and are electrically connected to each other through the above-mentioned through wiring, and the above-mentioned bottom surface conductor, the above-mentioned top surface conductor and the winding wiring composed of the above-mentioned through wiring are wound around a winding axis parallel to the above-mentioned bottom surface.

[0010] For the sake of standardization, inductor components are often configured in a rectangular shape, for example, a quadrilateral with a length twice its width, on the substrate on which they are mounted. Specifically, in these inductor components, a single glass plate may be a rectangular parallelepiped with a length, width, and height, where the length is longer than the width, and the bottom surface is defined by the length and width. This situation presents the following issues.

[0011] Figure 3 This is a schematic perspective view of an inductor component 1 according to a comparative example. In inductor component 1, first and second terminal electrodes 121, 122, located above bottom surface 100b, are arranged on the same layer as bottom conductor 11b of wound wiring 110. In this case, first and second terminal electrodes 121, 122, and bottom conductor 11b can be formed simultaneously, facilitating manufacturing. On the other hand, in inductor component 1, the area within which bottom conductor 11b can be formed is limited by first and second terminal electrodes 121, 122, limiting the number of turns of wound wiring 110.

[0012] Figure 4This is a schematic perspective view of an inductor component 1a according to a comparative example. In the inductor component 1a, on the bottom surface 100b, the bottom conductor 11b extends in the longitudinal direction (X direction) of the single-layer glass plate 10, the base insulating layer 15 is arranged on the bottom conductor 11b, and the terminal electrodes 12 are arranged on the base insulating layer 15. In this case, by forming the outer surface conductor 11 and the terminal electrodes 12 in different layers, the layout of the outer surface conductor 11 and the terminal electrodes 12 can be designed more freely. In addition, by forming the outer surface conductor 11 along the longitudinal direction of the single-layer glass plate 10, the inner diameter of the winding wiring is increased, thereby improving the efficiency of obtaining the L value and Q value of the inductor element relative to the outer shape of the inductor component 1a. On the other hand, in the inductor component 1a, the winding axis of the winding wiring is parallel to the width direction of the single-layer glass plate 10, so the winding axis is relatively short, and the number of winding turns of the winding wiring is limited. Furthermore, in the inductor component 1a, the inductance value (L value) varies significantly per turn of the winding wiring, making it difficult to finely adjust the L value. Summary of the Invention

[0013] An inductor component according to one embodiment of the present invention has a structure that reduces the effects of firing and imposes fewer restrictions on the number of turns of the winding wiring. Furthermore, in the inductor component according to one embodiment of the present invention, the change in the L value per turn of the winding wiring is relatively small, making it easy to finely adjust the L value.

[0014] An inductor component according to one embodiment of the present invention comprises: a single-layer glass plate having a rectangular parallelepiped shape having a length, a width, and a height, the length being longer than the width, and having a bottom surface defined by the length and the width, and a top surface located on the back side of the bottom surface; a bottom conductor and a top conductor, respectively arranged above the bottom surface and above the top surface; a through wiring extending through a through hole formed in the single-layer glass plate; a base insulating layer arranged above the bottom conductor; and a first terminal electrode and a second terminal electrode, arranged above the base insulating layer. In the inductor component, a winding wiring electrically connecting the bottom conductor, the top conductor, and the through wiring is wound around a winding axis parallel to the bottom surface and the length, and the winding wiring, the first terminal electrode, and the second terminal electrode are electrically connected to form an inductor element.

[0015] In this specification, the term "single-layer glass plate" is a concept relative to a laminated glass body, and more specifically refers to a plate of glass in which a conductor is integrated within the glass, that is, an internal conductor is not incorporated therein.

[0016] Furthermore, the "outer surface of the single-layer glass sheet," including the bottom and top surfaces of the single-layer glass sheet, does not simply refer to the surface facing the outer periphery of the single-layer glass sheet, but rather the surface that forms the boundary between the outer and inner sides of the glass body of the single-layer glass sheet. Furthermore, "above the outer surface (bottom or top surface)" does not refer to an absolute direction such as vertically upward, defined by the direction of gravity, but rather refers to a direction toward the outer side, between the outer side and the inner side, with the outer surface as a reference and the outer surface as the boundary. Therefore, "above the outer surface" refers to a relative direction determined by the orientation of the outer surface. As described above, "disposed above the outer surface of the single-layer glass sheet" means the glass body located outside the glass body and not incorporated into the single-layer glass sheet.

[0017] Furthermore, the surfaces of the through-holes and grooves of the sintered single-layer glass sheet also serve as the boundary between the outer and inner sides of the glass body and are therefore included in the "outer surface of the single-layer glass sheet" described above. The boundary between the outer and inner sides of the glass body can be easily ascertained by cross-sectional analysis of the single-layer glass sheet using a scanning electron microscope (SEM) or the like.

[0018] In addition, "above" of an element includes not only the position above the element, that is, the position above the element separated by other objects, and the position above the element separated by a gap, but also the position directly above the element (on).

[0019] In the inductor component described above, the bottom conductor, top conductor, and through-wiring are not enclosed within the single-layer glass plate, reducing the effects of firing. Furthermore, in the inductor component described above, the first and second terminal electrodes are disposed above the base insulating layer disposed above the bottom conductor, thereby minimizing restrictions on the number of turns of the wound wiring. Furthermore, in the inductor component described above, the wound wiring is wound about a winding axis parallel to the length of the single-layer glass plate. This reduces restrictions on the number of turns of the wound wiring, and the L value changes relatively little per turn of the wound wiring, making it easier to finely adjust the L value. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic perspective view of the inductor component 6 as viewed from the top surface side.

[0021] Figure 2 This is a schematic plan view of the inductor component 6 as viewed from the top surface side.

[0022] Figure 3 This is a schematic perspective view of the inductor component 1 as viewed from the bottom side.

[0023] Figure 4 This is a schematic perspective view of the inductor component 1a as viewed from the bottom side.

[0024] Figure 5 This is a schematic perspective view of the inductor component 1 as viewed from the top surface side.

[0025] Figure 6 2 is a schematic cross-sectional view of the inductor component 1 .

[0026] Figure 7 2 is a schematic cross-sectional view of the inductor component 1 .

[0027] Figure 8 2 is a schematic cross-sectional view of the inductor component 1 .

[0028] Figure 9 1 is a schematic top view of the inductor component 1 .

[0029] Figure 10 1 is a schematic top view of the inductor component 1 .

[0030] Figure 11 1 is a schematic top view of the inductor component 1 .

[0031] Figure 12 2 is a schematic cross-sectional view of the inductor component 1 .

[0032] Figure 13 It is a schematic cross-sectional view of the inductor component 1a.

[0033] Figure 14 It is a schematic side view of the inductor component 1 .

[0034] Figure 15 2 is a schematic cross-sectional view of the capacitor component 2 .

[0035] Figure 16 is a circuit diagram of the electronic component 3.

[0036] Figure 17 It is a schematic top view of the electronic component 3 .

[0037] Figure 18 It is a schematic cross-sectional view of the electronic component 3 .

[0038] Figure 19 It is a schematic bottom view of the electronic component 3 .

[0039] Figure 20 It is a schematic perspective view of the electronic component 4 .

[0040] Figure 21 It is a schematic cross-sectional view of the electronic component mounting substrate 5 .

[0041] Description of Reference Signs

[0042] 1, 1a, 6…inductor component; 10, 60…single-layer glass plate; 11, 61…outer surface conductor; 11b, 61b…bottom surface conductor; 61t…top surface conductor; 12, 62…terminal electrode; 63…through wiring; 15, 65…base insulating layer; 100, 600…outer surface; 100b, 600b…bottom surface; 100t, 600t…top surface; 110, 610…winding wiring; 121, 621…first terminal electrode; 122, 622…second terminal electrode; AX…winding axis; L…inductor element; V…through hole. DETAILED DESCRIPTION

[0043] Below, while using the attached Figure 1 The following describes an embodiment of one aspect of the present invention. Note that the drawings are schematic and the dimensions, positional relationships, and shapes of the entirety and individual parts may be distorted or omitted.

[0044] <Implementation Method>

[0045] The inductor component 6 according to the embodiment will be described below. Figure 1 This is a schematic perspective view of the inductor component 6 as viewed from the top surface side. Figure 2 This is a schematic top view of the inductor component 6 as viewed from the top side.

[0046] 1. Overview

[0047] The schematic structure of the inductor component 6 will be described. The inductor component 6 is a surface-mount electronic component that includes an inductor element L and is used as an electrical component, for example, in a high-frequency signal transmission circuit. The inductor component 6 includes: a single-layer glass plate 60 having a rectangular parallelepiped shape having a length Le, a width W, and a height T, where the length Le is longer than the width W. The inductor component 6 includes a bottom surface 600b defined by the length Le and the width W, and a top surface 600t located behind the bottom surface 600b; a bottom surface conductor 61b and a top surface conductor 61t, respectively disposed above the bottom surface 600b and above the top surface 600t; a through-hole 63 extending through a through-hole V formed in the single-layer glass plate 60; a base insulating layer 65 disposed above the bottom surface conductor 61b; and first and second terminal electrodes 621 and 622, serving as terminal electrodes 62, disposed above the base insulating layer 65.

[0048] In the inductor component 6, the winding wiring 610 electrically connecting the bottom conductor 61b, the top conductor 61t and the through wiring 63 is wound around the winding axis AX parallel to the bottom surface 600b and the length Le, and the winding wiring 610, the first terminal electrode 621 and the second terminal electrode 622 are electrically connected to form the inductor element L.

[0049] With the above-described structure, in the inductor component 6, the bottom surface conductor 61b, the top surface conductor 61t, and the terminal electrodes 62, which serve as the outer surface conductor 61, are arranged above the bottom surface 600b and the top surface 600t of the outer surface 600 of the single-layer glass plate 60. Therefore, the outer surface conductor 61 and the terminal electrodes 62 are not taken into the single-layer glass plate 60. Similarly, in the inductor component 6, the through-hole wiring 63 extends through the through-hole V in the outer surface 600 of the single-layer glass plate 60, and the through-hole wiring 63 is also not taken into the single-layer glass plate 60. Therefore, the influence of firing on the inductor component 6 can be reduced.

[0050] In addition, in the inductor component 6, the first terminal electrode 621 and the second terminal electrode 622 are arranged above the base insulating layer 65 arranged above the bottom conductor 61b, so that the formation range of the bottom conductor 61b can be set independently of the first terminal electrode 621 and the second terminal electrode 622, the design freedom of the winding wiring 610 is improved, and the number of winding turns of the winding wiring 610 is less restricted.

[0051] Furthermore, in the inductor component 6, the wound wiring 610 is wound about a winding axis AX parallel to the length Le of the single-layer glass plate 60. This makes the winding axis AX relatively long, thereby increasing the degree of design freedom for the wound wiring 610 and reducing restrictions on the number of turns of the wound wiring 610. Furthermore, in this case, the inner diameter of the wound wiring 610 is oriented parallel to the width W of the single-layer glass plate 60, allowing for a relatively small inner diameter. This reduces the variation in the L value per turn of the wound wiring 610. Consequently, the inductor component 6 facilitates fine adjustment of the L value. This is particularly advantageous in circuit design where reduced characteristic variation is required.

[0052] Furthermore, in the inductor component 6, the first terminal electrode 621 and the second terminal electrode 622 are shaped so as to have a main surface above the bottom surface 600b and parallel to the bottom surface 600b. With this structure, the inductor component 6 includes input and output terminals of the inductor element L on the bottom surface 600b side. The input and output terminals of the inductor element L have surfaces parallel to the bottom surface 600b that can be soldered. Consequently, the inductor component 6 becomes a surface-mount electronic component that can be surface-mounted with the bottom surface 600b as the mounting surface, thereby reducing the mounting area.

[0053] Furthermore, the first and second terminal electrodes 621 and 622 may have any shape as long as they have a principal surface parallel to the bottom surface 600b, and may also include portions other than these. For example, the first and second terminal electrodes 621 and 622 may be L-shaped, with principal surfaces also above the end surface perpendicular to the bottom surface 600b of the single-layer glass plate 60, or may be oblique electrodes with triangular principal surfaces also above the side surfaces perpendicular to the bottom surface 600b and end surfaces of the single-layer glass plate 60. Furthermore, the first and second terminal electrodes 621 and 622 may also have principal surfaces above the top surface 600t of the single-layer glass plate 60, or may be five-sided electrodes with principal surfaces above the bottom surface 600b, the top surface 600t, the end surface, and two side surfaces.

[0054] Furthermore, in the inductor component 6, the first terminal electrode 621 and the second terminal electrode 622 are located at positions overlapping the bottom conductor 61b when viewed from a direction parallel to the height T. This allows the bottom conductor 61b to be formed over a wider area, improving the design freedom of the wound wiring 610 and increasing the L value.

[0055] Furthermore, in the inductor component 6, the wound wiring 610 is wound twice at a position overlapping with the first terminal electrode 621 and at a position overlapping with the second terminal electrode 622, respectively, when viewed from a direction parallel to the height T. This further increases the L value. Furthermore, in the inductor component 6, the wound wiring 610 may not be wound, may be wound once, or may be wound three or more times at a position overlapping with the first terminal electrode 621 or the second terminal electrode 622, when viewed from a direction parallel to the height T.

[0056] However, if the overlap between the bottom conductor 61b and the first terminal electrode 621 or the second terminal electrode 622 increases, the formation of parasitic capacitance tends to reduce the Q value of the inductor element L. In view of this, it is more preferable that the wound wiring 610 not be wound more than three times at the position overlapping the first terminal electrode 621 or the position overlapping the second terminal electrode 622 when viewed from a direction parallel to the height T.

[0057] In the inductor component 6 , the base insulating layer 65 preferably covers the entire bottom surface 600 b . This prevents the bottom surface 600 b from directly interfering with the outside, thereby improving the strength and durability of the single glass plate 60 .

[0058] In inductor component 6, base insulating layer 65 preferably covers the entire bottom conductor 61b. This prevents short circuits between bottom conductors 61b and between bottom conductor 61b and terminal electrode 62. Furthermore, since bottom conductor 61b does not directly interfere with the outside world, damage to bottom conductor 61b and short circuits with external circuits can be prevented.

[0059] Furthermore, the inductor component 6 includes the through wiring 63 , thereby enabling wiring to be formed perpendicularly to the outer surface conductor 61 and the terminal electrode 62 disposed above the outer surface 600 , thereby increasing the degree of freedom in forming the inductor element L.

[0060] In addition, in the inductor component 6, the winding wiring 610 is wound around the winding axis AX parallel to the bottom surface 600b. Therefore, the winding axis AX is parallel to the mounting surface of the inductor component 6. The main component of the magnetic flux generated by the inductor element L, that is, the magnetic flux passing through the inner diameter of the winding wiring 610 does not cross the mounting substrate, which can reduce the reduction in the Q value of the inductor element L caused by eddy current loss and can also reduce the noise radiation to the mounting substrate.

[0061] As shown in the drawings, for ease of explanation, the direction parallel to the length Le of the single-layer glass plate 60 and extending from the first terminal electrode 621 toward the second terminal electrode 622 is referred to below as the X direction. Furthermore, the direction perpendicular to the X direction, parallel to the height T of the single-layer glass plate 60 and extending from the bottom surface 600 b toward the top surface 600 t, is referred to as the Z direction. The direction parallel to the width W of the single-layer glass plate 60, i.e., perpendicular to the X and Z directions and forming a right-handed system when arranged in the order of X, T, and Z, is referred to as the Y direction. In cases where the directions are not considered, directions parallel to the X, Y, and Z directions may be referred to as the L, W, and T directions, respectively.

[0062] According to the above definition, the upper direction of the bottom surface 600b, which is the outer surface 600, refers to the direction from the bottom surface 600b toward the direction opposite to the z-direction, and the upper direction of the top surface 600t, which is the outer surface 600, refers to the direction from the top surface 600t toward the z-direction. In addition, the thickness of the outer surface conductor 61 refers to the thickness in a direction perpendicular to the outer surface 600 located below the outer surface conductor 61.

[0063] 2. Departmental Structure

[0064] (Single glass plate 60)

[0065] The single-layer glass plate 60 functions as an insulator and a structural member for the inductor component 6. From the perspective of manufacturing methods, the material for the single-layer glass plate 60 is preferably a photosensitive glass plate, such as Foturan II (registered trademark of Schott AG). In particular, the single-layer glass plate 60 preferably contains cerium oxide (cerium dioxide: CeO2). In this case, the cerium oxide acts as a sensitizer, facilitating processing using photolithography.

[0066] However, the single-layer glass plate 60 can be processed by mechanical processing such as drilling and sandblasting, dry or wet etching using photoresist / metal mask, laser processing, etc., and therefore can also be a glass plate without photosensitivity. In addition, the single-layer glass plate 60 can also be obtained by sintering a glass paste or formed by a known method such as a float process.

[0067] The single-layer glass plate 60 is a single-layer plate-shaped member that has internal conductors and other components integrated within the glass body, but does not incorporate wiring. Specifically, the single-layer glass plate 60 has an outer surface 600 that serves as the boundary between the outer and inner sides of the glass body. The through-holes V formed in the single-layer glass plate 60 also serve as the boundary between the outer and inner sides of the glass body and are therefore included in the outer surface 600.

[0068] The single-layer glass sheet 60 is essentially amorphous, but may also have crystalline portions. For example, in the case of Foturan II, the dielectric constant of amorphous glass is 6.4. However, by crystallizing it, the dielectric constant can be reduced to 5.8. This reduces parasitic capacitance between conductors near the crystalline portions.

[0069] (Outer surface conductor 61)

[0070] The outer surface conductor 61 is a wiring arranged above the outer surface 600 of the single-layer glass plate 60, that is, outside the single-layer glass plate 60, and constitutes at least a portion of the inductor element L, an electrical component. More specifically, the outer surface conductor 61 includes a bottom surface conductor 61b arranged on the bottom surface 600b of the single-layer glass plate 60, and a top surface conductor 61t arranged on the top surface 600t of the single-layer glass plate 60. The bottom surface conductor 61b and the top surface conductor 61t extend in the W direction, slightly tilted toward the L direction. As a result, the wound wiring 610 forms a spiral shape, with the bottom surface conductor 61b and the top surface conductor 61t shifting to the next winding.

[0071] The outer surface conductor 61 is made of a high-quality conductive material such as copper, silver, gold, or alloys thereof. The outer surface conductor 61 may also be a metal film formed by plating, vapor deposition, sputtering, or the like, or a metal sintered body obtained by coating and sintering a conductor paste. Alternatively, the outer surface conductor 61 may have a multilayer structure formed by stacking multiple metal layers. In the absence of a protective film, a coating of nickel, tin, gold, or the like may be formed on the outermost layer. The thickness of the outer surface conductor 61 is preferably 5 μm to 50 μm.

[0072] In addition, the outer surface conductor 61 is preferably formed by a semi-additive method, thereby making it possible to form an outer surface conductor 61 with low resistance, high precision and high aspect ratio. For example, the outer surface conductor 61 can be formed as follows. First, a titanium layer and a copper layer are sequentially formed as seed layers on the entire outer surface 600 of the monolithic single-layer glass plate 60 by sputtering or chemical plating, and a carved photoresist is formed on the seed layer. Next, a copper layer is formed on the seed layer in the opening of the photoresist by plating. Then, the photoresist and the seed layer are removed by wet etching or dry etching. In this way, an outer surface conductor 61 carved into an arbitrary shape can be formed on the outer surface 600 of the single-layer glass plate 60.

[0073] (Terminal electrode 62)

[0074] The terminal electrode 62 is a terminal of the inductor element L disposed above the outer surface 600 of the single-layer glass plate 60 and electrically connected to the outer surface conductor 61. Figure 1 As shown, the terminal electrodes 62 are exposed to the outside of the inductor component 6. More specifically, the terminal electrodes 62 include a first terminal electrode 621 and a second terminal electrode 622 disposed on the bottom surface 600b of the single-layer glass plate 60. The first terminal electrode 621 and the second terminal electrode 622 are exposed to the outside only on the bottom surface 600b.

[0075] However, the terminal electrodes 62 are not limited to the above structure, and may be three or more, and may be formed on the end surface adjacent to the bottom surface 600b, the side surface, or the top surface 600t. The terminal electrodes 62 can be made of the same materials and using the same manufacturing methods as those exemplified for the outer surface conductor 61.

[0076] Furthermore, the terminal electrode 62 does not need to protrude beyond the base insulating layer 65 covering the bottom conductor 61b, and the main surface of the terminal electrode 62 may be located closer to the single-layer glass plate 60 than the base insulating layer 65. In this case, solder balls may be formed on the main surface of the terminal electrode 62 to improve mounting performance.

[0077] (Through-wiring 63)

[0078] The through-hole wiring 63 is a wiring that passes through a through-hole V formed in the single-layer glass plate 60 and is electrically connected to the outer surface conductor 61, constituting at least a portion of the inductor element L. In particular, the wound wiring 610 composed of the outer surface conductor 61 and the through-hole wiring 63 has a spiral shape wound around a winding axis AX and constitutes the main portion of the inductor element L. The through-hole wiring 63 can be formed in the through-hole V pre-formed in the single-layer glass plate 60 using the materials and manufacturing methods exemplified for the outer surface conductor 61.

[0079] (Base Insulating Layer 65)

[0080] The base insulating layer 65 is a component that protects the outer surface conductor 61 from external forces and prevents damage to the outer surface conductor 61, thereby improving the insulation properties of the outer surface conductor 61. The base insulating layer 65 is preferably an inorganic film such as an oxide, nitride, or oxynitride of silicon, hafnium, or the like, which has excellent insulation properties and can be formed into thin films. However, the base insulating layer 65 can also be a resin film such as epoxy or polyimide, which is easier to form. In particular, the base insulating layer 65 is preferably composed of a material with a low dielectric constant, thereby reducing the parasitic capacitance formed between the bottom surface conductor 61b and the terminal electrode 62.

[0081] In addition, you can also Figure 1 、 Figure 2 As shown, the base insulating layer 65 covers the single glass plate 60 and the top surface conductor 61t on the top surface 600t, thereby forming a pickup surface of a mounting machine when mounting the inductor component 6 on a mounting substrate.

[0082] Furthermore, the formation height and adhesion of the outer surface conductor 61 and the terminal electrode 62 , the electrical characteristics of the inductor element L, and the like can be adjusted by the base insulating layer 65 .

[0083] The base insulating layer 65 can be formed by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.), or by applying and thermosetting a paste-like resin.

[0084] Furthermore, in the inductor component 6, the base insulating layer 65 is disposed on the bottom conductor 61b, and the terminal electrode 62 is disposed on the base insulating layer 65. By forming the bottom conductor 61b and the terminal electrode 62 in different layers, the layout of the bottom conductor 61b and the terminal electrode 62 can be designed more freely.

[0085] Furthermore, the terminal electrode 62 can be electrically connected to the bottom conductor 61b and the through-hole wiring 63 via through-hole wiring formed in the base insulating layer 65. Furthermore, the base insulating layer 65 is not limited to being provided with only the terminal electrode 62, but can also be provided with wiring electrically connected to the bottom conductor 61b and the through-hole wiring 63 as a rewiring layer. This further increases the degree of freedom in the design of the inductor element L.

[0086] 3. Processing method of single-layer glass plate 60

[0087] In the inductor component 6, the single-layer glass plate 60 is a processed body having pre-formed through-holes V and other components prior to forming the inductor element L, such as the outer surface conductor 61, terminal electrodes 62, and through-wiring 63. While processing this single-layer glass plate 60 can be performed using known methods, including the method described above, processing using photosensitive glass is most preferred, as it allows for high-precision processing. The processing method using this photosensitive glass will be described below.

[0088] (1) Prepare the substrate

[0089] First, a photosensitive glass substrate, which is an aggregate of the parts that will form the single-layer glass plate 60, is prepared. For example, Foturan II can be used as the photosensitive glass substrate. Photosensitive glass substrates generally contain oxides of silicon, lithium, aluminum, cerium, and the like, and thus are capable of high-precision photolithography.

[0090] (2) Exposure

[0091] Next, the portion of the prepared photosensitive glass substrate where through-holes V, cavities, crystallized portions, grooves, and the like are to be formed is irradiated with ultraviolet light, for example, having a wavelength of approximately 310 nm. This ultraviolet light irradiation oxidizes metal ions, such as cerium ions, in the photosensitive glass, releasing electrons. By adjusting the ultraviolet light exposure dose according to the thickness of the photosensitive glass substrate, the resulting processing depth of the single-layer glass plate 60 can be controlled. For example, by setting the exposure dose high, through-holes V can be formed that extend from the bottom surface 600b to the top surface 600t of the single-layer glass plate 60. By setting the exposure dose low, non-through holes, such as cavities and grooves, can be formed.

[0092] As an exposure device for the above-mentioned ultraviolet light irradiation, a contact photolithography machine or stepper that generates ultraviolet light with a wavelength of approximately 310nm can be used. Alternatively, a laser irradiation device including a femtosecond laser can be used as a light source. Furthermore, when using a femtosecond laser, the laser light is focused inside the photosensitive glass substrate, thereby allowing electrons to be emitted from the metal oxide only by the focused portion. In other words, the laser-irradiated surface of the photosensitive glass substrate can be rendered insensitive, making only the interior of the substrate photosensitive.

[0093] This further increases the degree of design freedom for the single-layer glass plate 60. For example, the bottom surface 600b and top surface 600t, which are the outer surfaces of the inductor component 6 where the conductor 61 is formed, are not exposed, and the portions located further inward, that is, portions other than the exposed surface of the photosensitive glass substrate, can also be processed.

[0094] (3) Firing

[0095] The exposed photosensitive glass substrate is fired. Specifically, it is fired at two stages of temperature, for example, first at around 500°C. As a result, in the ultraviolet irradiation portion of the photosensitive glass substrate, the released electrons reduce ions such as silver, gold, and copper to form nanoclusters of metal atoms. Next, it is fired at around 560°C. As a result, the nanoclusters of metal atoms become crystal nuclei, and crystalline phases such as lithium metasilicate are precipitated around them. In addition, crystalline phases such as lithium metasilicate are easily dissolved in fluoric acid, and this characteristic is utilized in the subsequent etching process.

[0096] Furthermore, after the crystal phase is uniformly precipitated in the plane of the photosensitive glass substrate, the temperature distribution in the firing furnace needs to be uniform, preferably within ±3°C.

[0097] (4) Etching

[0098] After firing, an etching step is performed using an aqueous hydrofluoric acid solution. The concentration of the aqueous hydrofluoric acid solution is preferably 5-10%, for example. In the etching step, the entire fired photosensitive glass substrate is immersed in the aqueous hydrofluoric acid solution. This etches only the crystalline phase within the substrate, forming through-holes and blind vias. The aqueous hydrofluoric acid solution may also contain acids other than hydrofluoric acid, such as hydrochloric acid and nitric acid, for the purpose of smoothing the surface of the etched photosensitive glass substrate.

[0099] Furthermore, when a crystallized portion is formed in the single-layer glass plate 60, for example, the portion of the crystallized phase that becomes the crystallized portion can be covered with a barrier layer resistant to aqueous hydrofluoric acid solution to prevent the aqueous hydrofluoric acid solution from penetrating into the crystallized phase. Furthermore, after the above-mentioned steps, the photosensitive glass substrate can be polished to adjust its thickness as needed.

[0100] (5) Conductor formation

[0101] On the outer surface of the photosensitive glass substrate after the etching step, the outer surface conductor 61, through-wiring 63, etc. are formed by, for example, a semi-additive process. The outer surface conductor 61 and through-wiring 63 can be formed from a single seed layer or by different processes. In addition, when the thickness of the outer surface conductors 61 is made different, for example, the outer surface conductors 61 can be partially covered with a protective film, and only the exposed portions of the outer surface conductors 61 can be further plated, or a seed layer can be formed again to form a multi-layer conductor layer.

[0102] After the conductors are formed, a resin is applied or laminated to form a base insulating layer 65, and terminal electrodes 62 are formed on the base insulating layer 65 using the same method as above. The photosensitive glass substrate is then singulated using a dicing blade or the like, thereby completing the inductor component 6 having the single glass plate 60.

[0103] In the above-described manufacturing method, conductors such as the outer surface conductor 61 , the terminal electrode 62 , and the through-hole wiring 63 are formed after the single glass plate 60 of the inductor component 6 is fired, thereby reducing the influence of firing.

[0104] Furthermore, in the above description, the crystallized portion is formed by covering it with a barrier layer resistant to aqueous hydrofluoric acid solution during the etching process. However, the present invention is not limited to this. For example, the photosensitive glass substrate after conductor formation or the inductor component 6 after singulation may be irradiated with ultraviolet light again to slightly crystallize the irradiated portion, thereby forming the crystallized portion. This further increases the degree of freedom in forming the crystallized portion.

[0105] 4. Modifications

[0106] As mentioned above, the inductor component 6 has been described as an embodiment. However, the inductor component 6 may have the following additional configurations that are not described above.

[0107] For example, in the inductor component 6, the single-layer glass plate 60 may also have a reinforcement portion having a higher hardness than the surrounding area. Electronic components such as the inductor component 6 are susceptible to damage due to external forces or thermal shock during the manufacturing process or after assembly. In particular, stress is likely to concentrate at the interfaces between the various elements with different physical properties—the single-layer glass plate 60, the outer surface conductor 61, the terminal electrode 62, and the through-hole wiring 63—and cracks are likely to enter the single-layer glass plate 60 from these interfaces. In this structure, the reinforcement portion can appropriately reinforce the strength against localized damage and cracks, thereby improving the strength of the inductor component 6.

[0108] The reinforcing portion can be formed, for example, by using photosensitive glass for the single-layer glass plate 60 and then partially crystallizing the single-layer glass plate 60, similar to the crystallized portion described above. The transmittance of the reinforcing portion can be appropriately controlled by the amount and duration of ultraviolet light irradiation, heating, and the like.

[0109] In particular, the reinforcement portion is preferably located below the outer surface conductor 61 or the terminal electrode 62 to effectively reduce the local damage and cracks. Furthermore, the reinforcement portion is more preferably located below the outer periphery of the outer surface conductor 61 or the terminal electrode 62.

[0110] In the inductor component 6, the outer surface conductor 61 is part of the inductor element L. However, the outer surface conductor 61 is not limited to this and may be part of an electrical component other than the inductor element L, for example, part of a capacitor element. In this case, the inductor component is an LC composite filter component that also includes a capacitor element.

[0111] Similarly, the inductor component may include a plurality of electrical elements, and may be two or more inductor elements, two or more capacitor elements, or a combination thereof.

[0112] The manufacturing method of the inductor component 6 may be modified as appropriate. For example, in the manufacturing method described above, a photosensitive glass substrate having an outer surface conductor formed thereon may be cut by photolithography to form a single glass plate.

[0113] The above-described manufacturing method reduces debris generated when singulating a photosensitive glass substrate and enables high-precision cutting. Furthermore, unlike cutting blades, which physically impact the photosensitive glass substrate during cutting, the generation of microcracks in the individual glass sheets can be suppressed. Furthermore, compared to using cutting blades, the amount of cutting material used during singulation can be reduced, allowing the number of individual glass sheets to be obtained from the same photosensitive glass substrate size to be increased.

[0114] While the inductor component 6 includes a single glass plate 60, a structure in which multiple single glass plates are joined and stacked may also be employed. For example, the single glass plates can be joined together using photosensitive glass, which can be surface-activated by wet or dry etching, to directly join the glass plates. Alternatively, the top surface of a single glass plate and the bottom surface of another single glass plate can be joined together with an adhesive layer of, for example, a thermosetting resin or thermoplastic resin interposed between them.

[0115] In this case, the outer surface conductors can be formed on the individual glass sheets before joining, or after the individual glass sheets are joined. Furthermore, but not limited to this, for example, grooves can be formed on the top surfaces of the joined individual glass sheets, or the individual glass sheets can be joined after the grooves are formed on the top surfaces, and then the outer surface conductors can be formed in the grooves. Furthermore, preferably, forming the outer surface conductors in the grooves after joining allows for closer contact between the two individual glass sheets. Furthermore, when using an adhesive layer, this is also preferred because the adhesive layer can plastically deform to fill the space between the individual glass sheets.

[0116] In addition, the inductor component 6 is a surface-mount electronic component, but is not limited thereto. For example, it may be an electronic component for three-dimensional mounting.

[0117] Furthermore, the various features described above can be added, deleted, or changed independently. Furthermore, known structures can also be added, deleted, or changed in these embodiments.

[0118] The present invention is not limited to the above-described embodiment, and the design can be modified without departing from the spirit of the present invention. For example, the characteristic features of each reference example described below can be incorporated into the present invention in various forms.

[0119] <First Reference Example>

[0120] The inductor component 1 according to the first reference example will be described below. Figure 3 This is a schematic perspective view of the inductor component 1 as viewed from the bottom side. Figure 5 This is a schematic perspective view of the inductor component 1 as viewed from the top surface side.

[0121] 1. Overview

[0122] The schematic structure of the inductor component 1 will be described. The inductor component 1 is a surface-mount electronic component that includes an inductor element L, for example, used in a high-frequency signal transmission circuit. The inductor component 1 includes: a single-layer glass plate 10; an outer surface conductor 11, which serves as at least a portion of the inductor element L and is located above the outer surface 100 of the single-layer glass plate 10; and terminal electrodes 12, which serve as terminals of the inductor element L and are located above the bottom surface 100b of the single-layer glass plate 10 and are electrically connected to the outer surface conductor 11.

[0123] According to the above structure, in the inductor component 1, the outer surface conductor 11 and the terminal electrode 12 are arranged above the outer surface 100 of the single-layer glass plate 10. Therefore, the outer surface conductor 11 and the terminal electrode 12 are not taken into the single-layer glass plate 10. Therefore, the influence of firing on the inductor component 1 can be reduced.

[0124] Furthermore, the inductor component 1 further includes at least a portion of a through-wiring 13 serving as the inductor element L. The through-wiring 13 penetrates a through-hole V formed in the single-layer glass plate 10 and is electrically connected to the outer surface conductor 11 .

[0125] With the above configuration, in the inductor component 1 , wiring can be formed perpendicularly to the outer surface conductor 11 and the terminal electrode 12 disposed above the outer surface 100 , thereby improving the degree of freedom in forming the inductor element L.

[0126] In the inductor component 1, the outer surface 100 of the single-layer glass plate 10 includes a bottom surface 100b, which is one of the principal surfaces of the single-layer glass plate 10. The terminal electrodes 12 include a first terminal electrode 121 and a second terminal electrode 122, which serve as input and output terminals of the inductor element L. Furthermore, in the inductor component 1, the first terminal electrode 121 and the second terminal electrode 122 are shaped so as to have principal surfaces above the bottom surface 100b and parallel to the bottom surface 100b.

[0127] According to the above structure, the inductor component 1 has input and output terminals of the inductor element L on the bottom surface 100b side. The input and output terminals of the inductor element L have a surface for solder attachment in a direction parallel to the bottom surface 100b, thereby becoming a surface-mounted electronic component that can be surface-mounted using the bottom surface 100b as the mounting surface and can reduce the mounting area.

[0128] In inductor component 1, outer surface 100 further includes a top surface 100t located on the back side of bottom surface 100b. Outer surface conductor 11 is disposed above bottom surface 100b and above top surface 100t, respectively, and includes bottom surface conductor 11b and top surface conductor 11t electrically connected to each other via through-hole wiring 13. Furthermore, in inductor component 1, wound wiring 110, comprising bottom surface conductor 11b, top surface conductor 11t, and through-hole wiring 13, is wound around a winding axis AX parallel to bottom surface 100b.

[0129] According to the above structure, the winding axis AX is parallel to the mounting surface of the inductor component 1. Therefore, the main component of the magnetic flux generated by the inductor element L, that is, the magnetic flux passing through the inner diameter of the winding wiring 110, does not cross the mounting substrate, which can reduce the Q value reduction of the inductor element L caused by eddy current loss, and can also reduce the noise radiation to the mounting substrate.

[0130] Furthermore, in the inductor component 1, the single-layer glass plate 10 has a cavity C. This reduces the effective dielectric constant compared to a single-layer glass plate 10 without the cavity C, and can reduce parasitic capacitance formed between any of the outer surface conductor 11, the terminal electrode 12, the through-hole wiring 13, and the wiring pattern of the mounting substrate. In particular, it is possible to suppress a decrease in the self-resonant frequency of the inductor element L.

[0131] Furthermore, through the processing method described below, the cavity C can be formed in any shape at any location on the single-layer glass plate 10. For example, in the inductor component 1, the cavity C1 is formed around the terminal electrode 12. Furthermore, in the inductor component 1, the wound wiring 110 is wound two or more times around the winding axis AX, and the single-layer glass plate 10 has a cavity C2 between adjacent wound wirings 110. Furthermore, in the inductor component 1, the single-layer glass plate 10 has a cavity C3 at a position including the winding axis AX.

[0132] Thus, in the inductor component 1, if cavities C1 to C3 are formed at locations where the potential difference is large and electric lines of force are likely to be generated, the parasitic capacitance can be further effectively reduced. Furthermore, the inductor component 1 may include only one or two of the cavities C1 to C3, or may not include cavities C1 to C3. Furthermore, cavities C1 to C3 may or may not penetrate the single-layer glass plate 10, as long as they are formed at least near the wiring. For example, none of cavities C1 to C3 penetrate the single-layer glass plate 10. Furthermore, cavities C1 to C3 may be filled with a magnetic material such as a ferrite plate, metal magnetic powder, or a resin containing magnetic powder such as ferrite powder.

[0133] And, as Figure 5As shown, in the inductor component 1, the single-layer glass plate 10 has a crystal portion 101 (indicated by hatching). The crystal portion 101 adjusts the effective dielectric constant of the single-layer glass plate 10, thereby increasing or decreasing the parasitic capacitance formed between any of the outer surface conductor 11, the terminal electrode 12, the through-hole wiring 13, and the wiring pattern of the mounting substrate. In particular, the self-resonant frequency of the inductor element L can be adjusted.

[0134] exist Figure 5 In the inductor component 1, the single-layer glass sheet 10 includes a crystal portion 101 at a position including the winding axis AX. However, the position of the crystal portion 101 is not limited to that of the cavity C1 to C3; the positions of the crystal portion 101 may be interchanged. Alternatively, only one of the cavity C and the crystal portion 101 may be present, or neither. Furthermore, when both the cavity C3 and the crystal portion 101 are located at a position including the winding axis AX, as in the inductor component 1, their depths may be the same or different, and the cavity C1 and the crystal portion 101 may be adjacent to or separated by a gap.

[0135] Next, the cross-sectional shape of the inductor component 1 will be described. Figure 6 and Figure 7 : is a schematic cross-sectional view of the inductor component 1. Specifically, Figure 6 The cross section is a cross section that includes the winding axis AX and is perpendicular to the bottom surface 100b, and is an enlarged cross section of a portion near the bottom surface 100b on the second terminal electrode 122 side. Figure 7 The cross section is an enlarged cross section of a portion near the top surface 100t, which includes the winding axis AX and is perpendicular to the top surface 100t.

[0136] like Figure 6 and Figure 7 As shown, in the inductor component 1, the bottom surface 100b and the top surface 100t of the outer surface 100 of the single-layer glass plate 10 have grooves G1 and G2 respectively, which are recessed relative to the surrounding area. The outer surface conductor 11 includes a groove conductor 11g arranged in the grooves G1 and G2.

[0137] In the above structure, the grooves G1 and G2 limit the range within which the groove conductor 11g is formed, allowing the groove conductor 11g to be formed with high precision. Consequently, in the inductor component 1, the shape and characteristics of the inductor element L are further improved. Furthermore, since the terminal electrodes 12 protrude toward the bottom surface 100b more readily than the groove conductor 11g, solder is less likely to adhere to the groove conductor 11g when the inductor component 1 is mounted on a mounting substrate, improving the mountability of the inductor component 1.

[0138] In this case, it is more preferable to place a single glass plate 10 between adjacent slot conductors 11g. This further improves the insulation and migration resistance between adjacent slot conductors 11g via the single glass plate 10. In this case, the spacing between the slot conductors 11g can be narrower than when no single glass plate 10 is interposed, thereby improving the efficiency of obtaining the inductance value (L value) relative to the outer shape of the inductor component 1.

[0139] In addition, if Figure 6 As shown, the thickness 11T of the slot conductor 11g on the bottom surface 100b side of the inductor component 1 is smaller than the depth G1T of the slot G1. This prevents the slot conductor 11g from protruding from the single-layer glass plate 10, making it less likely to be damaged during the manufacture and assembly of the inductor component 1.

[0140] Furthermore, in the inductor component 1, as Figure 6 As shown, it is preferable to include a protective film 14 covering the outer surface conductor 11 (slot conductor 11g). This can prevent damage to the outer surface conductor 11. Moreover, in the inductor component 1, the thickness 11T of the slot conductor 11g is smaller than the depth G1T of the slot G1, so the protective film 14 can be made thinner. This means that the proportion of the protective film 14 in the height dimension of the inductor component 1 can be reduced. In this case, the inner diameter of the winding shape of the winding wiring 110 can be increased, thereby improving the efficiency of obtaining the L value and Q value of each outer shape of the inductor component 1.

[0141] Furthermore, protective film 14 is not a required feature. Inductor component 1 may not have protective film 14, or may only partially have protective film 14. For example, it is particularly preferable that protective film 14 covers outer surface conductor 11, leaving terminal electrode 12 exposed. While also not required, covering single-layer glass plate 10 with protective film 14 can reduce damage to single-layer glass plate 10.

[0142] In addition, if Figure 7 As shown, on the top surface 100t side of the inductor component 1, the thickness 11T of the slot conductor 11g is greater than the depth G2T of the slot G2. Thus, while limiting the height dimension of the inductor component 1, the thickness 11T of the slot conductor 11g can be increased compared to the outer surface conductor 11 disposed on the top surface 100t, which is not located on the slot G2. This reduces the DC resistance of the slot conductor 11g. This improves the efficiency of achieving the Q value for each external shape of the inductor component 1. Furthermore, increasing the thickness 11T increases the thermal capacitance of the slot conductor 11g, thereby improving the heat dissipation characteristics of the inductor element L.

[0143] In the above description, the bottom surface 100b and top surface 100t of the inductor component 1 have grooves G1 and G2, respectively. These grooves G1 and G2 have depths G1T and G2T that differ in relation to the thickness 11T of the slot conductor 11g. However, the inductor component 1 is not limited to this structure. For example, the groove G1 may be formed on the top surface 100t, and the groove G2 may be formed on the bottom surface 100b. Alternatively, only one of the grooves G1 or G2 may be formed on both the bottom surface 100b and the top surface 100t, or on one side.

[0144] Furthermore, the grooves G1 and G2 are not essential components of the inductor component 1 . Figure 8 is a schematic cross-sectional view of the inductor component 1, which is equivalent to Figure 6 The cross section of Figure 8 As shown, the outer surface conductor 11 may not include the slot conductor 11g. In addition, the outer surface conductor 11 may have a structure with a slot G1 per turn, a structure with a slot G2, or a structure without a slot.

[0145] In addition, if Figure 6 As shown, the inductor component 1 further includes a fixing portion 123 that protrudes from the second terminal electrode 122 toward the interior of the single-layer glass plate 10. Although not shown, the first terminal electrode 121 also has the same structure. This improves the fixing force of the terminal electrode 12 to the single-layer glass plate 10. Figure 6 In the embodiment, the fixing portion 123 protrudes from the bottom surface 100 b to the middle position of the single-layer glass plate 10 , but the fixing portion 123 may protrude to the top surface 100 t and penetrate the single-layer glass plate 10 .

[0146] The fixing portion 123 is formed in the hole formed in the single glass plate 10 , but the entire hole is preferably filled with the fixing portion 123 . This further improves the fixing force of the terminal electrode 12 to the single glass plate 10 .

[0147] In addition, the fixing portion 123 is not an essential structure of the inductor component 1, and the fixing portion 123 may not be provided, or the fixing portion 123 may be provided on only one side of the first terminal electrode 121 and the second terminal electrode 122. Figure 6 In the figure, two fixing portions 123 protrude from the second terminal electrode 122 , but the number is not limited to this number and may be one or three or more.

[0148] As shown in the accompanying drawings, for ease of explanation, the x-direction is the longitudinal direction of the single-layer glass sheet 10, which is the direction from the first terminal electrode 121 toward the second terminal electrode 122. Furthermore, the z-direction is the direction perpendicular to the x-direction, which is the direction from the bottom surface 100b toward the top surface 100t. The y-direction is the direction perpendicular to the x-direction and the z-direction, which forms a right-handed system when the x, y, and z directions are arranged in this order. In cases where the directions are not considered, directions parallel to the x-direction, the y-direction, and the z-direction may be referred to as the L-direction, the W-direction, and the T-direction, respectively.

[0149] According to the above definition, the upper side of the bottom surface 100b of the outer surface 100 refers to the direction from the bottom surface 100b toward the opposite direction of the z direction, and the upper side of the top surface 100t of the outer surface 100 refers to the direction from the top surface 100t toward the z direction. In addition, the thickness of the outer surface conductor 11 such as the slot conductor 11g refers to the thickness in the direction perpendicular to the outer surface 100 located below the outer surface conductor 11. For example, Figure 6 、 Figure 7 In FIG, the thickness of the slot conductor 11g is the thickness of the conductor in the T direction.

[0150] 2. Departmental Structure

[0151] (Single glass plate 10)

[0152] The single-layer glass plate 10 functions as an insulator and a structural member of the inductor component 1. From the perspective of the manufacturing method described below, the material of the single-layer glass plate 10 is preferably a photosensitive glass plate, such as Foturan II (registered trademark of Schott AG). In particular, the single-layer glass plate 10 preferably contains cerium oxide (cerium dioxide: CeO2). In this case, the cerium oxide acts as a sensitizer, facilitating processing using photolithography.

[0153] However, the single-layer glass plate 10 can be processed by mechanical processing such as drilling and sandblasting, dry or wet etching using a photoresist / metal mask, laser processing, etc., and therefore can also be a glass plate without photosensitivity. In addition, the single-layer glass plate 10 can also be obtained by sintering a glass paste or formed by a known method such as a float process.

[0154] The single-layer glass plate 10 is a single-layer plate-shaped member that has internal conductors integrated within the glass body, but does not incorporate wiring. Specifically, the single-layer glass plate 10 has an outer surface 100 that serves as the boundary between the outer and inner sides of the glass body. The through-holes V and grooves G1 and G2 formed in the single-layer glass plate 10 also serve as the boundary between the outer and inner sides of the glass body and are therefore included in the outer surface 100.

[0155] The single-layer glass sheet 10 is essentially amorphous, but may also have a crystalline portion 101. For example, in the case of Foturan II, the dielectric constant of amorphous glass is 6.4. However, by crystallizing it, the dielectric constant can be reduced to 5.8. This reduces the parasitic capacitance between conductors near the crystalline portion 101.

[0156] (Outer surface conductor 11)

[0157] The outer surface conductor 11 is a wiring located above the outer surface 100 of the single-layer glass plate 10, that is, outside the single-layer glass plate 10, and constitutes at least a portion of an electrical component, namely, an inductor element L. More specifically, the outer surface conductor 11 includes a bottom surface conductor 11b located on the bottom surface 100b of the single-layer glass plate 10, and a top surface conductor 11t located on the top surface 100t of the single-layer glass plate 10. The bottom surface conductor 11b extends in the W direction, while the top surface conductor 11t extends in the W direction, slightly inclined toward the L direction. Consequently, the wound wiring 110 forms a spiral shape, with the top surface conductor 11t winding its way to the next turn.

[0158] The outer surface conductor 11 is made of a high-quality conductive material such as copper, silver, gold, or alloys thereof. It can also be a metal film formed by plating, vapor deposition, sputtering, or the like, or a metal sintered body obtained by coating and sintering a conductor paste. Furthermore, the outer surface conductor 11 can have a multilayer structure formed by stacking multiple metal layers. In the absence of the protective film 14, a coating of nickel, tin, gold, or the like can be formed on the outermost layer. The thickness of the outer surface conductor 11 is preferably not less than 5 μm and not more than 50 μm.

[0159] In addition, the outer surface conductor 11 is preferably formed by a semi-additive method, thereby making it possible to form an outer surface conductor 11 with low resistance, high precision and high aspect ratio. For example, the outer surface conductor 11 can be formed as follows. First, a titanium layer and a copper layer are sequentially formed as seed layers on the entire outer surface 100 of the monolithic single-layer glass plate 10 by sputtering or chemical plating, and a carved photoresist is formed on the seed layer. Next, a copper layer is formed on the seed layer in the opening of the photoresist by plating. Then, the photoresist and the seed layer are removed by wet etching or dry etching. In this way, the outer surface conductor 11 carved into an arbitrary shape can be formed on the outer surface 100 of the single-layer glass plate 10.

[0160] (Terminal electrode 12)

[0161] The terminal electrode 12 is a terminal of the inductor element L disposed above the outer surface 100 of the single-layer glass plate 10 and electrically connected to the outer surface conductor 11. Figure 5As shown, the terminal electrodes 12 are exposed outside the inductor component 1. More specifically, the terminal electrodes 12 include a first terminal electrode 121 and a second terminal electrode 122 disposed on the bottom surface 100b of the single-layer glass plate 10. The first terminal electrode 121 and the second terminal electrode 122 are exposed to the outside only on the bottom surface 100b.

[0162] However, the terminal electrodes 12 are not limited to the above structure, and may be three or more, and may be formed on the side surfaces adjacent to the bottom surface 100b or the top surface 100t. The terminal electrodes 12 can be made of the same materials and using the same manufacturing methods as those exemplified for the outer surface conductor 11.

[0163] In addition, for example, Figure 6 As shown, the terminal electrode 12 is formed on the outer surface 100 of the single-layer glass plate 10 located above the outer surface conductor 11, and protrudes upward from the outer surface conductor 11. Figure 7 As shown, the terminal electrode 12 is thicker than the outer surface conductor 11 and thus protrudes upward from the outer surface conductor 11. Furthermore, when the outer surface conductor 11 is covered with the protective film 14, the terminal electrode 12 does not necessarily need to protrude from the protective film 14. The main surface of the terminal electrode 12 may be located closer to the single-layer glass plate 10 than the protective film 14. In this case, solder balls may be formed on the main surface of the terminal electrode 12 to improve mounting performance.

[0164] Furthermore, the inductor component 1 includes a fixing portion 123 that protrudes from the terminal electrode 12 into the interior of the single-layer glass plate 10. This can be accomplished by, for example, forming a blind hole or through-hole in the single-layer glass plate 10 using a processing method described below before forming the terminal electrode 12. Then, using the materials and manufacturing methods exemplified for the outer surface conductor 11, a conductor is formed within the blind hole or through-hole. For example, a seed layer can be formed within the blind hole or through-hole and in the surrounding area where the terminal electrode is to be formed, and then a conductor is formed by plating to fill the blind hole or through-hole. The terminal electrode 12 and the fixing portion 123 can be formed independently, or they can be formed from the same seed layer, forming the terminal electrode 12 and the fixing portion 123 integrally, resulting in a terminal electrode 12 with a higher anchoring effect.

[0165] (Through-wiring 13)

[0166] The through-hole wiring 13 is a wiring that passes through a through-hole V formed in the single-layer glass plate 10 and is electrically connected to the outer surface conductor 11, constituting at least a portion of the inductor element L. In particular, the wound wiring 110 composed of the outer surface conductor 11 and the through-hole wiring 13 has a spiral shape wound around a winding axis AX and constitutes a major portion of the inductor element L. The through-hole wiring 13 can be formed within the through-hole V pre-formed in the single-layer glass plate 10 using the materials and manufacturing methods exemplified for the outer surface conductor 11 by the method described below.

[0167] In addition, Figure 3 and Figure 5 In the embodiment, the through-hole wiring 13 is formed in a through hole V formed in a direction perpendicular to the bottom surface 100 b and the top surface 100 t, but the present invention is not limited to this. For example, in the single-layer glass plate 10 after singulation, the through hole V may be formed in a direction parallel to the bottom surface 100 b and the top surface 100 t, and the wiring may extend in a direction parallel to the bottom surface 100 b and the top surface 100 t.

[0168] (Protective film 14)

[0169] The protective film 14 is a member that protects the outer surface conductor 11 from external forces, prevents damage to the outer surface conductor 11, and improves the insulation properties of the outer surface conductor 11. The protective film 14 is preferably an inorganic film such as an oxide, nitride, or oxynitride of silicon, hafnium, or the like, which has excellent insulation properties and can be formed into a thin film. However, the protective film 14 may also be a resin film such as epoxy or polyimide, which is easier to form.

[0170] In addition, you can also Figure 7 As shown, the protective film 14 covers the single glass plate 10 and the outer surface conductor 11 (slot conductor 11g) on ​​the top surface 100t, thereby forming a pickup surface for a mounting machine when mounting the inductor component 1 on a mounting substrate.

[0171] 3. Processing Method of Single-layer Glass Plate 10

[0172] In the inductor component 1, the single-layer glass plate 10 is a processed body having pre-formed through-holes V, cavities C, crystallized portions 101, grooves G1 and G2, and the like, prior to forming the inductor elements L, such as the outer surface conductors 11, terminal electrodes 12, and through-wiring 13. While processing this single-layer glass plate 10 can be performed using known methods, including those described above, processing using photosensitive glass is most preferred, as it allows for high-precision processing. The processing method using this photosensitive glass will be described below.

[0173] (1) Prepare the substrate

[0174] First, a photosensitive glass substrate, which is an aggregate of parts that will form the single-layer glass plate 10, is prepared. For example, Foturan II can be used as the photosensitive glass substrate. Photosensitive glass substrates generally contain oxides of silicon, lithium, aluminum, cerium, and the like, and thus can handle high-precision photolithography.

[0175] (2) Exposure

[0176] Next, the portions of the prepared photosensitive glass substrate where through-holes V, cavities C, crystal portions 101, and grooves G1 and G2 are to be formed are irradiated with ultraviolet light, for example, having a wavelength of approximately 310 nm. This ultraviolet light irradiation oxidizes metal ions, such as cerium ions, in the photosensitive glass due to the light energy, releasing electrons. By adjusting the ultraviolet light irradiation intensity according to the thickness of the photosensitive glass substrate, the resulting processing depth of the single-layer glass plate 10 can be controlled. For example, by setting the irradiation intensity high, through-holes V can be formed that penetrate from the bottom surface 100b to the top surface 100t of the single-layer glass plate 10. By setting the irradiation intensity low, non-through holes, such as cavities C and grooves G1 and G2, can be formed.

[0177] As an exposure device for the above-mentioned ultraviolet light irradiation, a contact photolithography machine or stepper that generates ultraviolet light with a wavelength of approximately 310nm can be used. Alternatively, a laser irradiation device including a femtosecond laser can be used as a light source. Furthermore, when using a femtosecond laser, the laser light is focused inside the photosensitive glass substrate, thereby allowing electrons to be emitted from the metal oxide only by the focused portion. In other words, the surface of the laser-irradiated portion of the photosensitive glass substrate is insensitive to light, allowing only the interior to be exposed to light.

[0178] This further increases the degree of design freedom of the single-layer glass plate 10. For example, while the cavity C3 and crystal portion 101 of the inductor component 1 are not exposed on the bottom surface 100b and top surface 100t where the outer surface conductor 11 is formed, processing can also be performed on portions located further inward than these portions, i.e., portions other than the exposed surface of the photosensitive glass substrate.

[0179] (3) Firing

[0180] The exposed photosensitive glass substrate is fired. Specifically, it is fired at two stages of temperature, for example, first at around 500°C. As a result, in the ultraviolet irradiation portion of the photosensitive glass substrate, the released electrons reduce ions such as silver, gold, and copper to form nanoclusters of metal atoms. Next, it is fired at around 560°C. As a result, the nanoclusters of metal atoms become crystal nuclei, and crystalline phases such as lithium metasilicate are precipitated around them. In addition, crystalline phases such as lithium metasilicate are easily dissolved in fluoric acid, and this characteristic is utilized in the subsequent etching process.

[0181] Furthermore, after the crystal phase is uniformly precipitated in the plane of the photosensitive glass substrate, the temperature distribution in the firing furnace needs to be uniform, preferably within ±3°C.

[0182] (4) Etching

[0183] After firing, an etching step is performed using an aqueous hydrofluoric acid solution. The concentration of the aqueous hydrofluoric acid solution is preferably 5-10%, for example. In the etching step, the entire fired photosensitive glass substrate is immersed in the aqueous hydrofluoric acid solution. This etches only the crystalline phase within the substrate, forming through-holes and blind vias. The aqueous hydrofluoric acid solution may also contain acids other than hydrofluoric acid, such as hydrochloric acid and nitric acid, for the purpose of smoothing the surface of the etched photosensitive glass substrate.

[0184] Furthermore, when a crystal portion 101 is formed on a single-layer glass plate 10, for example, the portion of the crystal phase that becomes the crystal portion 101 may be covered with a barrier layer resistant to aqueous hydrofluoric acid solution to prevent the aqueous hydrofluoric acid solution from penetrating into the crystal phase. Furthermore, after the above-described steps, the photosensitive glass substrate may be polished to adjust its thickness as needed.

[0185] (5) Conductor formation

[0186] On the outer surface of the photosensitive glass substrate after the etching process, the outer surface conductor 11, the terminal electrode 12, the through wiring 13, etc. are formed by, for example, a semi-additive method. The outer surface conductor 11, the terminal electrode 12, and the through wiring 13 can be formed by a single seed layer or by different processes. In addition, when the thickness of the outer surface conductor 11 and the terminal electrode 12 is different, for example, the outer surface conductor 11 can be covered with a protective film 14, and only the portion to be the terminal electrode 12 can be further plated, or a seed layer can be formed again to form a multi-layer conductor layer.

[0187] After the conductors are formed, a protective film 14 is formed by coating or laminating a resin as needed, and the photosensitive glass substrate is cut into pieces using a dicing blade or the like, thereby completing the inductor component 1 including the single glass plate 10 .

[0188] In the above-described manufacturing method, conductors such as the outer surface conductor 11 , the terminal electrode 12 , and the through-hole wiring 13 are formed after the single glass plate 10 of the inductor component 1 is fired, thereby reducing the influence of firing.

[0189] Furthermore, in the above description, the crystal portion 101 is formed by covering it with a barrier layer resistant to aqueous hydrofluoric acid solution during the etching process. However, the present invention is not limited to this. For example, the photosensitive glass substrate after conductor formation or the inductor component 1 after singulation may be irradiated with ultraviolet light again to slightly crystallize the irradiated portion, thereby forming the crystal portion 101. This further increases the degree of freedom in forming the crystal portion 101.

[0190] 4. Modifications

[0191] The inductor component 1 has been described above as the first reference example. However, the inductor component 1 may have the following additional configurations not described above.

[0192] (Low transmittance portion 102)

[0193] Figure 9 、 Figure 10 、 Figure 11 This is a schematic top view of an inductor component 1. The inductor component 1 has a low-transmittance portion 102 (indicated by shading) on ​​at least a portion of the outer surface 100 of a single-layer glass plate 10, having a lower light transmittance than the surrounding area. This improves visibility within the single-layer glass plate 10, which has high light transmittance and low visibility, and facilitates the manufacture and handling of the inductor component 1. Furthermore, the low-transmittance portion 102 only needs to have lower light transmittance than the surrounding area at at least a certain wavelength. For example, the transmittance may be lower at a certain wavelength or multiple wavelengths of infrared, visible, or ultraviolet light.

[0194] The low transmittance portion 102 can be formed, for example, by using photosensitive glass for the single-layer glass plate 10 and then partially crystallizing the single-layer glass plate 10, similar to the aforementioned crystallized portion 101. The transmittance of the low transmittance portion 102 can be appropriately controlled by adjusting the amount and duration of ultraviolet light irradiation, heating, and the like.

[0195] In addition, if Figure 9 As shown, the low transmittance portion 102 is preferably located on one side of the outer surface 100 of the single-layer glass plate 10, for example, Figure 9 The outer periphery of the top surface 100t is shown in FIG.

[0196] In addition, if Figure 10 As shown, it is preferred that the low transmittance portion 102 is formed on one side of the outer surface 100 of the single-layer glass plate 10, for example, Figure 10 The top surface 100t is in the shape of a cross. This allows the cross shape to be used as an alignment mark for photolithography or the like, improving processing accuracy. Furthermore, the cross shape can be used as a directional mark indicating the polarity of the inductor component 1.

[0197] In addition, if Figure 11 As shown, the low transmittance portion 102 may also be formed on one side of the outer surface 100 of the single-layer glass plate 10, for example, Figure 11 In the embodiment, the top surface 100t is formed entirely, thereby preventing the bottom conductor 11b and the terminal electrode 12 on the opposite side, for example, the bottom surface 100b, from being transparent, thereby improving the recognition accuracy from the top surface 100t. In addition, in this case, the amorphous portion of the single-layer glass plate 10 may be partially left, for example, by leaving a cross shape. Figure 10 Such alignment marks and directional marks.

[0198] (Base insulating layer 15)

[0199] Figure 12 is a schematic cross-sectional view of the inductor component 1, which is equivalent to Figure 6 The location can also be Figure 12 As shown, the inductor component 1 further comprises an outer surface 100 of the single-layer glass plate 10, Figure 12 In the figure, the base insulating layer 15 is located on the bottom surface 100b, and the terminal electrodes 12 are arranged on the base insulating layer 15. In this case, the outer surface conductor 11 may also be arranged on the base insulating layer 15. In this way, the outer surface conductor 11 and the terminal electrodes 12 can be arranged not only directly above the outer surface 100 of the single-layer glass plate 10, but also above the outer surface 100 with another component (the base insulating layer 15) interposed therebetween.

[0200] The base insulating layer 15 can adjust the formation height and adhesion of the outer surface conductor 11 and the terminal electrode 12 , the electrical characteristics of the inductor element L, and the like.

[0201] The insulating base layer 15 can be formed, for example, by laminating a resin film such as ABFGX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.) on the photosensitive glass substrate before forming the seed layer in the above-mentioned manufacturing method, or by applying and thermosetting a paste-like resin.

[0202] Alternatively, the base insulating layer 15 may be disposed on the outer surface conductor 11 . Figure 4 is a schematic perspective view of the inductor component 1a of this modification example as viewed from the bottom side. Figure 13 It is a schematic cross-sectional view of the inductor component 1a. Figure 13 Equivalent to Figure 6 location.

[0203] In the inductor component 1a, a bottom conductor 11b extends in the L direction on the bottom surface 100b, which is the outer surface 100 of the single-layer glass plate 10. The base insulating layer 15 is disposed on the bottom conductor 11b, and the terminal electrodes 12 are disposed on the base insulating layer 15. Forming the outer surface conductor 11 and the terminal electrodes 12 in separate layers allows for greater flexibility in designing their layout. In particular, by forming the outer surface conductor 11 along the longitudinal direction of the single-layer glass plate 10, as in the inductor component 1a, the inner diameter of the wound wiring is increased, thereby improving the efficiency of achieving the L value and Q value of the inductor element L relative to the outer shape of the inductor component 1a.

[0204] Furthermore, the terminal electrode 12 can be electrically connected to the bottom conductor 11b and the through-hole wiring 13 via through-hole wiring (not shown) formed in the base insulating layer 15. Furthermore, the base insulating layer 15 is not limited to being provided with only the terminal electrode 12; wiring electrically connected to the bottom conductor 11b and the through-hole wiring 13 can also be provided as a rewiring layer. This further increases the degree of freedom in the design of the inductor element L.

[0205] Figure 14 It is a schematic side view of the inductor component 1 . Figure 14 This is a diagram of the inductor component 1 viewed from the side surface 100s parallel to the L direction and the T direction, among the surfaces connecting the bottom surface 100b and the top surface 100t. Figure 14 In the embodiment, the winding wiring 110 is omitted.

[0206] like Figure 14 As shown, in the inductor component 1, the single-layer glass plate 10 may also include a reinforcing portion 103 having a higher hardness than the surrounding area. Electronic components such as the inductor component 1 are susceptible to damage during the manufacturing process or after assembly due to external forces or thermal shock. In particular, stress is likely to concentrate at the interfaces between the various elements with different physical properties—the single-layer glass plate 10, the outer surface conductor 11, the terminal electrode 12, and the through-hole wiring 13—and cracks are likely to enter the single-layer glass plate 10 from these interfaces. In this structure, the reinforcing portion 103 can appropriately reinforce the strength against localized damage and cracks, thereby improving the strength of the inductor component 1.

[0207] Furthermore, the reinforcing portion 103 can be formed, for example, by using photosensitive glass for the single-layer glass plate 10 and then partially crystallizing the single-layer glass plate 10, similar to the aforementioned crystallized portion 101. The transmittance of the reinforcing portion 103 can be appropriately controlled by adjusting the amount and duration of ultraviolet light irradiation, heating, and the like.

[0208] In particular, it is preferable that the reinforcement portion 103 is located below the outer surface conductor 11 or the terminal electrode 12 to effectively reduce the local damage and cracks. Furthermore, it is more preferable that the reinforcement portion 103 is located below the outer periphery of the outer surface conductor 11 or the terminal electrode 12.

[0209] The manufacturing method of the inductor component 1 can also be modified as appropriate. For example, in the manufacturing method described above, a photosensitive glass substrate having an outer surface conductor formed thereon may be cut by photolithography to form a single glass plate.

[0210] The above-described manufacturing method reduces debris generated when singulating a photosensitive glass substrate and enables high-precision cutting. Furthermore, unlike cutting blades, which physically impact the photosensitive glass substrate during cutting, the generation of microcracks in the individual glass sheets can be suppressed. Furthermore, compared to using cutting blades, the amount of cutting material used during singulation can be reduced, allowing the number of individual glass sheets produced to be increased for the same photosensitive glass substrate size.

[0211] <Second Reference Example>

[0212] In the first reference example, the outer surface conductor is a part of the inductor element L, but the outer surface conductor is not limited thereto and may be a part of an electrical element other than the inductor element L. Figure 15 : is a schematic cross-sectional view of the capacitor component 2 of the second reference example. Figure 15 As shown, the capacitor component 2 is a surface-mounted electronic component including a capacitor element Cap widely used in electronic circuits as an electric component.

[0213] The capacitor component 2 includes: the above-mentioned single-layer glass plate 10; an outer surface conductor 21 serving as a portion of an electrical component, namely, a capacitor element Cap, which is arranged above the outer surface 100 of the single-layer glass plate 10; and a terminal electrode 22 serving as a terminal of the capacitor element Cap, which is arranged above the outer surface 100 and electrically connected to the outer surface conductor 21.

[0214] According to the above structure, in capacitor component 2, outer surface conductor 21 and terminal electrode 22 are arranged above outer surface 100 of single-layer glass plate 10. Therefore, outer surface conductor 21 and terminal electrode 22 are not taken into single-layer glass plate 10. Therefore, the influence of firing can be reduced in capacitor component 2.

[0215] In the capacitor component 2, the outer surface 100 of the single-layer glass plate 10 includes a bottom surface 100b, which is one of the main surfaces of the single-layer glass plate 10, and a top surface 100t located on the back side of the bottom surface 100b. The outer surface conductor 21 includes a top surface 100t located on the bottom surface 100b. Figure 15 The flat bottom plate electrode 21b is arranged on the top surface 100t (in the opposite direction of the z direction) and Figure 15 A flat top plate electrode 21t is provided.

[0216] According to the above configuration, in the capacitor component 2 , the bottom plate electrode 21 b and the top plate electrode 21 t face each other with the single glass plate 10 as a dielectric layer interposed therebetween, thereby constituting the capacitor element Cap.

[0217] In the capacitor element 2, the single-layer glass plate 10 has a cavity C21 at a position sandwiched between the bottom plate electrode 21b and the top plate electrode 21t. Figure 5 The crystal portion 101 is shown. Alternatively, the capacitor element 2 may include a high dielectric portion having a higher dielectric constant than that of the single glass plate 10 disposed in the cavity C21.

[0218] With the above-described structure, the capacitance value of the capacitor element Cap can be adjusted using the voids C21, the crystal portion 101, or the high-dielectric portion in the capacitor component 2. Specifically, the dielectric constants of the voids C21 and the crystal portion 101 are lower than those of the single-layer glass plate 10, thereby reducing the overall dielectric constant of the dielectric layer sandwiched between the bottom plate electrode 21b and the top plate electrode 21t. Furthermore, the dielectric constant of the high-dielectric portion is higher than that of the single-layer glass plate 10, thereby increasing the overall dielectric constant of the dielectric layer.

[0219] In particular, according to the method for forming the cavity C21 and the crystal portion 101 using the above-mentioned photosensitive glass substrate, the cavity C21 and the crystal portion 101 can be formed after forming the capacitor element Cap based on the bottom plate electrode 21b and the top plate electrode 21t. After measuring the electrical characteristics of the capacitor element Cap, the electrical characteristics can be adjusted, thereby improving the capacitance adjustment and yield of the capacitor component 2. In addition, the capacitor component 2 may include only one of the cavity C21, the crystal portion 101, or the high dielectric portion, or may include a combination of multiple thereof.

[0220] Furthermore, the capacitor component 2 further includes at least a portion of a through-wiring 23 serving as a capacitor element Cap. The through-wiring 23 penetrates a through-hole V formed in the single-layer glass plate 10 and is electrically connected to the outer surface conductor 21 .

[0221] According to the above structure, in the capacitor component 2, wiring can be formed in a direction perpendicular to the outer surface conductor 21 and the terminal electrode 22 arranged above the outer surface 100, thereby improving the degree of freedom in forming the capacitor element Cap. In the capacitor component 2, the through wiring 23 serves as the wiring connecting the top surface plate electrode 21t and the terminal electrode 22.

[0222] In addition, in the capacitor component 2, the terminal electrode 22 includes a first terminal electrode 221 and a second terminal electrode 222 serving as input and output terminals of the capacitor element Cap, and the first terminal electrode 221 and the second terminal electrode 222 are above the bottom surface 100b (opposite direction of the z direction) and have a main surface shape parallel to the bottom surface 100b.

[0223] According to the above structure, the capacitor component 2 has input and output terminals of the capacitor element Cap on the bottom surface 100b side, and the input and output terminals of the capacitor element Cap have a surface for solder attachment in a direction parallel to the bottom surface 100b, thereby becoming a surface-mounted electronic component that can be surface-mounted with the bottom surface 100b as the mounting surface and can reduce the mounting area.

[0224] Capacitor component 2 also includes a protective film 24 that partially covers bottom plate electrode 21b. This prevents damage to bottom plate electrode 21b and improves its insulation. In particular, protective film 24 exposes a portion of bottom plate electrode 21b, allowing that portion to serve as terminal electrode 22 (first terminal electrode 221).

[0225] <Third Reference Example>

[0226] In the first reference example and the second reference example, an electronic component including one electric element is used, but the present invention is not limited thereto, and a plurality of electric elements may be included in the electronic component. Figure 16 3 is a circuit diagram of an electronic component 3 according to a third reference example. The electronic component 3 is a surface-mount electronic component including an inductor element L and capacitor elements Cap1 and Cap2 as electrical components.

[0227] like Figure 16 As shown, in electronic component 3, first terminal electrode 321 serves as a common terminal for inductor element L and capacitor element Cap1, second terminal electrode 322 serves as a common terminal for inductor element L and capacitor element Cap2, and third terminal electrode 323 serves as a common terminal for capacitor elements Cap1 and Cap2. Thus, in electronic component 3, inductor element L and capacitor elements Cap1 and Cap2 form a π-type LC filter.

[0228] Next, the specific structure of the electronic component 3 will be described. Figure 17 is a schematic top view of the electronic component 3, Figure 18 It is a schematic cross-sectional view of the electronic component 3 . Figure 19 : is a schematic bottom view of the electronic component 3. In addition, Figure 18 yes Figure 17 The cross section is shown along the dashed line XVI-XVI.

[0229] The electronic component 3 includes: a single-layer glass plate 10A; an outer surface conductor 31 serving as a portion of the inductor element L or the capacitor elements Cap1 and Cap2, which is respectively arranged above the bottom surface 100Ab and the top surface 100At serving as the outer surface of the single-layer glass plate 10A (in the direction opposite to the z direction, in the z direction); and a terminal electrode 32 serving as a terminal of the inductor element L or the capacitor elements Cap1 and Cap2, which is arranged above the bottom surface 100Ab (in the direction opposite to the z direction) and is electrically connected to the outer surface conductor 31.

[0230] In addition, with Figure 6 Similarly to the slot conductor 11g shown, the outer surface conductors 31 arranged above the top surface 100At are slot conductors 31ga, 31gb, and 31gc.

[0231] According to the above configuration, in the electronic component 3 , the outer surface conductors 31 are arranged on the outer surfaces 100Ab and 100At of the single glass plate 10A, so that the outer surface conductors 31 are not taken into the single glass plate 10A.

[0232] The electronic component 3 further includes a second single-layer glass plate 10B, which is different from the single-layer glass plate 10A. The second single-layer glass plate 10B is arranged above the groove conductors 31ga, 31gb, and 31gc (in the z-direction). Conversely, this means that the groove conductors 31ga, 31gb, and 31gc can also be arranged above the bottom surface 100Bb, which is the outer surface of the second single-layer glass plate 10B (in the opposite direction of the z-direction).

[0233] With the above-described structure, the slot conductors 31ga, 31gb, and 31gc can be used as internal conductors in the electronic component 3, enabling three-dimensional wiring through multilayering. This improves the design freedom of the electronic component 3. Furthermore, as described above, the slot conductors 31ga, 31gb, and 31gc are located above the top surface 100At and above the bottom surface 100Bb, which are the outer surfaces of each of the single-layer glass plate 10A and the second single-layer glass plate 10B. Therefore, the slot conductors 31ga, 31gb, and 31gc are not incorporated into the single-layer glass plate 10A or the second single-layer glass plate. Therefore, with the above-described structure, the effects of firing can also be reduced in the electronic component 3.

[0234] Furthermore, in the electronic component 3, the top surface 100At of the single-layer glass plate 10A and the bottom surface 100Bb of the second single-layer glass plate 10B are bonded to each other. This allows the electronic component 3 to have a laminated structure. A method for bonding the single-layer glass plate 10A and the second single-layer glass plate 10B after forming the groove conductors 31ga, 31gb, and 31gc after sintering the single-layer glass plate 10A and the second single-layer glass plate 10B will be described later.

[0235] The electronic component 3 also includes an outer surface conductor 41, which serves as a portion of the inductance element L. This outer surface conductor 41 is disposed above (in the z direction) the top surface 100Bt, which serves as the outer surface of the second single-layer glass plate 10B. With this configuration, the outer surface conductor 41 is disposed above the outer surface of the second single-layer glass plate 10B in the electronic component 3. Therefore, the outer surface conductor 41 is not incorporated into the second single-layer glass plate 10B. Consequently, the effects of firing can be reduced in the electronic component 3.

[0236] In the electronic component 3 , the groove conductors 31 ga , 31 gb , and 31 gc include flat groove plate electrodes 31 ga and 31 gc , and the outer surface conductor 31 includes a flat opposing plate electrode 31 b opposing the groove plate electrodes 31 ga and 31 gc via the single glass plate 10A.

[0237] With the above structure, in electronic component 3, groove plate electrodes 31ga and 31gc and opposing plate electrode 31b constitute capacitor elements Cap1 and Cap2. Specifically, opposing plate electrode 31b includes opposing plate electrodes 31ba and 31bc that oppose groove plate electrodes 31ga and 31gc, respectively. Groove plate electrodes 31ga and 31ba constitute capacitor element Cap1, while groove plate electrode 31gc and opposing plate electrode 31bc constitute capacitor element Cap2. In this way, capacitor elements Cap1 and Cap2 can be built into electronic component 3.

[0238] Furthermore, in the electronic component 3, as Figure 18 、 19 As shown, the counter plate electrode 31 b includes a third terminal electrode 323 which is a portion exposed from the protective film 34 , thereby serving as the terminal electrode 32 .

[0239] According to the above structure, the electronic component 3, as an electronic component including an LC filter, can be made smaller and lower in height. In conventional stacked electronic components, to ensure strength, the outer layer between the internal electrode and the outer surface of the component is formed thicker than the internal interlayer insulation layer. Therefore, if the opposing plate electrode is arranged on the outer surface of the component, the electrode spacing between it and the plate electrode inside the stack becomes larger, and sometimes the necessary electrical characteristics cannot be achieved. Therefore, the opposing plate electrode that opposes the plate electrode inside the stack is usually also arranged inside the stack. As a result, based on the three-layer structure of plate electrode, opposing plate electrode, and terminal electrode, the outer layer between the opposing plate electrode and the terminal electrode is thicker than the interlayer insulation layer between the plate electrode and the opposing plate electrode, resulting in an overall increased thickness.

[0240] On the other hand, in the electronic component 3, the single-layer glass plate 10A ensures sufficient strength, allowing it to be processed thinner than conventional structures, and the opposing plate electrode 31b can be arranged on the outer surface 100Ab. As a result, the electronic component 3 has a two-layer structure consisting of the groove plate electrodes 31ga, 31gc and the opposing plate electrode 31b, and the single-layer glass plate 10A can be made sufficiently thin, thereby achieving a smaller and lower-profile electronic component 3 compared to conventional structures. In particular, in the electronic component 3, the groove plate electrodes 31ga, 31gc are formed on the top surface 100At side of the single-layer glass plate 10A, thereby reducing the impact on the strength (thickness) of the single-layer glass plate 10A and further reducing the distance between the electrodes of the capacitor elements Cap1 and Cap2.

[0241] Furthermore, in the electronic component 3 , as described above, the opposing plate electrodes 31 b also serve as the terminal electrodes 32 . This reduces the number of electrodes forming the capacitor elements Cap1 and Cap2 , thereby reducing parasitic capacitance, improving electrical characteristics, and reducing characteristic variations.

[0242] The electronic component 3 further includes at least partially through-wirings 33 and 43 serving as the inductance element L or the capacitor elements Cap1 and Cap2 . The through-wirings 33 and 43 respectively penetrate through through holes V formed in the single glass plates 10A and 10B and are electrically connected to the outer surface conductors 31 and 41 .

[0243] With the above configuration, in the electronic component 3 , wiring can be formed perpendicularly to the outer surface conductors 31 , 41 and the terminal electrodes 32 arranged above the outer surface 100 , thereby increasing the degree of freedom in forming the inductor element L or the capacitor elements Cap1 , Cap2 .

[0244] Furthermore, in electronic component 3, through-wiring 33 serves as wiring that connects slot plate electrodes 31ga and 31gc to first and second terminal electrodes 321 and 322. Furthermore, in electronic component 3, through-wiring 43 connects slot conductor 31gb to outer surface conductor 41. The wound wiring formed by slot conductor 31gb, outer surface conductor 41, and through-wiring 43 is wound around a winding axis (not shown) parallel to bottom surface 100Ab. With this structure, the wound wiring constitutes a major portion of inductor element L, resulting in electronic component 3 including inductor element L.

[0245] In addition, in the electronic component 3, the terminal electrode 32 includes the input and output terminals of the inductor element L or any one of the capacitor elements Cap1 and Cap2, namely the first terminal electrode 321, the second terminal electrode 322 and the third terminal electrode 323. The first terminal electrode 321, the second terminal electrode 322 and the third terminal electrode 323 are above the bottom surface 100Ab (in the opposite direction of the z direction) and have a main surface shape parallel to the bottom surface 100Ab.

[0246] According to the above structure, the electronic component 3 has input and output terminals of the inductor element L or the capacitor elements Cap1 and Cap2 on the bottom surface 100Ab side. The input and output terminals of the inductor element L or the capacitor elements Cap1 and Cap2 have a surface for solder attachment in a direction parallel to the bottom surface 100Ab, thereby becoming a surface-mounted electronic component that can be surface-mounted with the bottom surface 100Ab as the mounting surface and can reduce the mounting area.

[0247] Electronic component 3 also includes a protective film 24 that covers a portion of opposing plate electrode 31b, specifically opposing plate electrodes 31ba and 31bc. This protects opposing plate electrodes 31ba and 31bc from damage and improves insulation. In particular, protective film 24 exposes a portion of opposing plate electrode 31b, allowing this portion to serve as terminal electrode 32 (third terminal electrode 323).

[0248] (Method of Joining Single-Ply Glass Sheet 10A and Second Single-Ply Glass Sheet 10B)

[0249] In the electronic component 3, the top surface 100At of the single-layer glass plate 10A and the bottom surface 100Bb of the second single-layer glass plate 10B are bonded to each other. For example, the single-layer glass plate 10A or the second single-layer glass plate 10B may be made of photosensitive glass and the surface of the photosensitive glass may be activated by wet etching or dry etching to directly bond the glass plates to each other. Alternatively, the top surface 100At of the single-layer glass plate 10A and the bottom surface 100Bb of the second single-layer glass plate 10B may be bonded to each other by interposing an adhesive layer of, for example, a thermosetting resin or a thermoplastic resin between them.

[0250] In this case, the groove conductors 31ga, 31gb, and 31gc may be formed in the single-layer glass plate 10A before joining, or may be formed after joining the single-layer glass plate 10A and the second single-layer glass plate 10B. Specifically, for example, a groove may be formed in the top surface 100At of the single-layer glass plate 10A, and after the groove conductors 31ga, 31gb, and 31gc are disposed in the groove, the top surface 100At of the single-layer glass plate 10A and the bottom surface 100Bb of the second single-layer glass plate 10B may be joined to each other.

[0251] However, this is not limiting. For example, a groove may be formed on the top surface 100At of the single glass sheet 10A after being joined to the second single glass sheet 10B, or after forming a groove on the top surface 100At, the single glass sheet 10A and the second single glass sheet 10B are joined, and then the groove conductors 31ga, 31gb, and 31gc may be formed in the groove. Furthermore, it is preferable that the groove conductors 31ga, 31gb, and 31gc be formed in the groove after joining, so that they are in close contact with the top surface 100At of the single glass sheet 10A and the bottom surface 100Bb of the second single glass sheet 10B. Furthermore, when an adhesive layer is used, it is preferable that the adhesive layer plastically deforms to fill the space between the groove conductors 31ga, 31gb, and 31gc, the top surface 100At of the single glass sheet 10A, and the bottom surface 100Bb of the second single glass sheet 10B.

[0252] In the electronic component 3 , the groove plate electrodes 31 ga and 31 gc and the opposing plate electrodes 31 a and 31 c face each other via the single glass plate 10A. However, the outer surface conductor 41 may include a flat opposing plate electrode or a terminal electrode facing each other via the second single glass plate 10B.

[0253] In the electronic component 3 , the opposing plate electrode 31 b may be used as a groove plate electrode. In this case, the groove plate electrode serves as the terminal electrode 32 .

[0254] In the electronic component 3 , the main portion of the inductance element L, namely the wound wiring, is wound on the second single glass plate 10B side, but may be wound on the single glass plate 10A side.

[0255] <Fourth Reference Example>

[0256] In the first to third reference examples, surface-mount electronic components are used, but the present invention is not limited thereto. For example, electronic components for three-dimensional mounting may also be used. Figure 20 4 is a schematic perspective view of an electronic component 4 according to a fourth reference example. The electronic component 4 is a sensor for three-dimensional mounting including a sensor element for detecting the presence or flow rate of a fluid F.

[0257] In electronic component 4, the top and bottom plate electrodes 51t and 51b, respectively located above the top and bottom surfaces 100t and 100b of the single-layer glass plate 10, serve as external surface conductors that form part of the sensor element and also function as terminal electrodes that serve as terminals of the sensor element. Specifically, electronic component 4 also includes the single-layer glass plate 10 and the top and bottom plate electrodes 51t and 51b, which serve as terminals. These top and bottom plate electrodes 51t and 51b are located above the outer surfaces 100t and 100b of the single-layer glass plate 10 and form part of the sensor element. Consequently, the effects of firing can be reduced in electronic component 4.

[0258] In addition, in the electronic component 4, terminal electrodes 51t and 51b are provided on the top surface 100t and the bottom surface 100b. Therefore, for example, if one of the terminal electrodes 51t and 51b is mounted on a pad of a substrate such as an interposer or a substrate, and the other of the terminal electrodes 51t and 51b is connected to a terminal of a semiconductor chip using solder, a bonding wire, etc., three-dimensional mounting can be performed.

[0259] In the electronic component 4, the single-layer glass plate 10 has: a main surface, i.e., a top surface 100t and a bottom surface 100b, which are outer surfaces on which outer surface conductors, i.e., the top surface flat electrode 51t and the bottom surface flat electrode 51b, are arranged; and a side surface 100s orthogonal to the top surface 100t and the bottom surface 100b, with a cavity C4 having an opening on the side surface 100s.

[0260] According to the above structure, it is possible to design an electrical component using the cavity C4. Specifically, in the electronic component 4, the cavity C4 is used as a flow path, and the presence or absence of the fluid flowing in the cavity C4 and the flow rate are detected as changes in electrostatic capacitance using the top surface plate electrode 51t and the bottom surface plate electrode 51b, so that it can be used as a fluid sensor. However, the method of utilizing the cavity C4 is not limited to this. For example, by using the cavity C4 as a through hole configured with a through wiring, a more complex electrical component can be designed. For example, if the through wiring is connected to the ground electrode of the mounting substrate via the side 100s, then when a surge voltage such as static electricity or lightning is generated, a path can be formed to allow the surge current to flow into the ground electrode side, and an electrostatic countermeasure function can be added to the electronic component 4.

[0261] <Other reference examples>

[0262] The various features described in the first, second, third, and fourth reference examples can be independently added, deleted, or modified in each reference example or in other reference examples. Furthermore, known structures can also be added, deleted, or modified in these embodiments.

[0263] Furthermore, the electronic components of the first to fourth reference examples or the reference examples in which the reference examples are appropriately modified as described above are preferably mounted on a specific mounting substrate. Figure 21 It is a schematic cross-sectional view of the electronic component mounting substrate 5 .

[0264] The electronic component mounting substrate 5 includes the inductor component 1 of the first reference example, the capacitor component 2 of the second reference example, and a glass substrate 10C on which the inductor component 1 and the capacitor component 2 of the second reference example are mounted.

[0265] According to the above structure, the structural bodies of the inductor component 1 and the capacitor component 2, namely the single-layer glass plate 10 and the glass substrate 10C, are made of the same material and have similar linear expansion coefficients. Therefore, for the inductor component 1 and the capacitor component 2, the reliability of the thermal expansion and thermal contraction generated in the glass substrate 10C during thermal shock tests can be improved.

[0266] Furthermore, as described above, any component mounted on the glass substrate 10C can be any electronic component using a single glass plate within the structure, and for example, electronic components 3 and 4 may be used. Furthermore, electronic components other than these components may be mounted. In this case, the reliability of at least the electronic component using a single glass plate within the structure can be improved.

[0267] The glass substrate 10C may correspond to a printed wiring board used in electronic devices, may be an auxiliary substrate mounted on a printed wiring board such as a motherboard, or may be an internal substrate such as an interposer or substrate used in semiconductors or electronic modules.

[0268] Although preferred reference examples incorporating the present invention in various ways have been described above, modifications and variations are apparent to those skilled in the art without departing from the scope and spirit of the present invention. Therefore, the scope of the present invention should be determined solely by the claims.

Claims

1. An inductor component, characterized in that: have: a single-layer glass plate having a rectangular parallelepiped shape having a length, a width, and a height, the length being longer than the width, a bottom surface defined by the length and the width, and a top surface located on the back side of the bottom surface; a bottom surface conductor and a top surface conductor, which are respectively arranged above the bottom surface and above the top surface; a through wiring extending through a through hole formed in the single-layer glass plate; a base insulating layer disposed above the bottom conductor; as well as a first terminal electrode and a second terminal electrode, which are arranged above the base insulating layer; The wound wiring formed by electrically connecting the bottom surface conductor, the top surface conductor and the through wiring is wound around a winding axis parallel to the bottom surface and the length. The winding wiring, the first terminal electrode, and the second terminal electrode are electrically connected to form an inductor element. When viewed from a direction parallel to the height, the first terminal electrode and the second terminal electrode are located at positions overlapping the bottom conductor. The base insulating layer is composed of an inorganic film, The single-layer glass plate has a reinforcement portion having a higher hardness than the surrounding portion. The first terminal electrode and the second terminal electrode are arranged above the reinforcing portion.

2. An inductor component, characterized in that: have: a single-layer glass plate having a rectangular parallelepiped shape having a length, a width, and a height, the length being longer than the width, a bottom surface defined by the length and the width, and a top surface located on the back side of the bottom surface; a bottom surface conductor and a top surface conductor, which are respectively arranged above the bottom surface and above the top surface; a through wiring extending through a through hole formed in the single-layer glass plate; a base insulating layer disposed above the bottom conductor; as well as a first terminal electrode and a second terminal electrode, which are arranged above the base insulating layer; The wound wiring formed by electrically connecting the bottom surface conductor, the top surface conductor and the through wiring is wound around a winding axis parallel to the bottom surface and the length. The winding wiring, the first terminal electrode, and the second terminal electrode are electrically connected to form an inductor element. When viewed from a direction parallel to the height, the first terminal electrode and the second terminal electrode are located at positions overlapping the bottom conductor. The base insulating layer is composed of an inorganic film, The single glass plate has a cavity around the terminal electrode.

3. The inductor component according to claim 1 or 2, characterized in that: The first terminal electrode and the second terminal electrode have a shape having a main surface above the bottom surface and parallel to the bottom surface.

4. The inductor component according to claim 1 or 2, characterized in that: The wound wiring is wound one or more times at a position overlapping with the first terminal electrode when viewed from a direction parallel to the height.

5. The inductor component according to claim 1 or 2, characterized in that: When viewed from a direction parallel to the height, the wound wiring is not wound three or more times at a position overlapping the first terminal electrode.

6. The inductor component according to claim 1 or 2, characterized in that: The base insulating layer covers the entire bottom surface.

7. The inductor component according to claim 1 or 2, characterized in that: The base insulating layer covers the entire bottom conductor.

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