Device comprising a cooler and a substrate for a power semiconductor module

Abstract

The invention relates to an arrangement (46) comprising a cooler (38) and a substrate (10) for a power semiconductor module, wherein the cooler (38) is provided with a cooling channel (26) adapted to provide a coolant flow (24), wherein the substrate (10) comprises a first side (12) adapted to carry an electronic circuit, the electronic circuit comprising at least one power semiconductor device (14), wherein the at least one power semiconductor device (14) forms at least one device area (16) on the first side (12), the device area being the footprint of the power semiconductor device (14), wherein the substrate (10) further comprises a second side (18) located opposite to the first side (12), wherein the substrate (10) on the second side (18) The substrate (10) further comprises a substrate (10) comprising at least one cooling region (20) on a second side (18) opposite to at least one device region (16), wherein the at least one cooling region (20) is adapted to dissipate heat from the substrate (10) by contacting the cooling region (20) with a coolant flow (24) in a cooling channel (26), wherein the substrate (10) additionally comprises an auxiliary region (22) on a second side (18) positioned adjacent to the cooling region (20), wherein the auxiliary region (22) comprises a flow guide (28) for reducing a flow rate of the coolant flow (24) in the auxiliary region (22), and wherein the cooling channel (26) is adapted to receive the at least one cooling region (20) and the at least one flow guide (28).

Description

Technical Field

[0001] The invention relates to an arrangement comprising a cooler and a substrate for a power semiconductor module. Background Art

[0002] Power semiconductor modules are generally well known in the art. The power semiconductor devices of the power semiconductor module generate heat, which needs to be dissipated in order to maintain the functionality of the power semiconductor module. There are different cooling technologies for dissipating heat from the substrate of the power semiconductor module, such as directly contacting a cooling structure integrated in the substrate with a coolant flow of a liquid coolant. The coolant flow can be provided in a cooling channel of a cooler.

[0003] The preferred cooling method is to use pin fins as the cooling structure. US2017 / 02877809 describes a pin fin heat sink in which a plurality of pins extend from a base plate and are integrally formed with the base plate by forging. The pin field defines a rectangular area with a long side of 25 mm.

[0004] US 5,978,220 A describes a liquid cooling device for a high-power semiconductor module, the liquid cooling device comprising a plurality of heat-generating submodules which are arranged adjacent to one another on a cooling surface and are moltenly bonded to the cooling surface, by means of which an improved load cycle resistance is achieved. The liquid cooling device has a housing which encloses a liquid space through which a cooling liquid flows and the upper side of which forms the cooling surface, and the housing of the liquid cooling device, at least in the region of the cooling surface consisting of a metal-ceramic composite material, has a thermal expansion coefficient adapted to the thermal expansion coefficient of the ceramic substrate or to the thermal expansion coefficient of the power semiconductor device of the submodule, and additional means for improving the heat transfer between the cooling surface and the cooling liquid are arranged in the liquid space of the liquid cooling device.

[0005] US2003 / 227732 A1 describes a heat transfer structure comprising a heat transfer module having a plurality of heat transfer members in a conduit chamber, wherein the density increases along the flow direction of the coolant and has the greatest density at a location close to a heat source, which is attached in thermal contact with the heat transfer module. The profile of the conduit chamber is adjusted according to the location of the heat source to increase the velocity of the coolant directly below the heat source and partially or completely block the coolant from flowing to areas where temperature regulation is not required. The heat transfer member may be formed as a pin fin made of a spring that is compressed to a predetermined density in a direction perpendicular to the longitudinal axis of the spring and / or parallel to the longitudinal axis of the heat transfer module.

[0006] However, the prior art such as according to the references cited above still offers room for improvement, in particular with regard to efficient cooling of power semiconductor modules. Summary of the invention

[0007] Therefore, it is an object of the present invention to provide a solution that at least partially overcomes at least one disadvantage of the prior art. In particular, it is an object of the present invention to provide a solution for uniformly and effectively cooling one or more power semiconductor devices on a substrate.

[0008] A device is described comprising a cooler and a substrate for a power semiconductor module, wherein the cooler is provided with a cooling channel adapted to provide a coolant flow, wherein the substrate comprises a first side adapted to carry an electronic circuit, the electronic circuit comprising at least one power semiconductor device, wherein the at least one power semiconductor device forms at least one device area on the first side, the device area being a footprint of the power semiconductor device, wherein the substrate further comprises a second side located opposite to the first side, wherein the substrate comprises at least one cooling area on the second side opposite to the at least one device area, wherein the at least one cooling area is adapted to dissipate heat from the substrate by contacting the cooling area with the coolant flow in the cooling channel, wherein the substrate additionally comprises an auxiliary area on the second side positioned adjacent to the cooling area, wherein the auxiliary area comprises a guide for reducing a flow rate of the coolant flow in the auxiliary area, and wherein the cooling channel is adapted to receive the at least one cooling area and the at least one guide.

[0009] Such an arrangement offers significant advantages over prior art solutions, particularly with regard to efficient and / or uniform cooling of power semiconductor devices.

[0010] The invention therefore relates to an arrangement comprising a base plate having a flow guide and a cooler.During the production of a power semiconductor module, the base plate can be used with different arrangements of power semiconductor devices on the base plate.

[0011] The substrate of the present invention has a first side, which is suitable for carrying and in particular carries an electronic circuit including at least one power semiconductor device. The power semiconductor device may have functions known in the art. In order to reliably perform the functions of the power semiconductor device, the power semiconductor device needs to be cooled, that is, the heat generated by the power semiconductor device needs to be dissipated from the power semiconductor device.

[0012] The power semiconductor device forms a device area on the first side of the substrate. In the sense of the present invention, forming a device area means that the position, size, specification, geometry and / or arrangement of one or more power semiconductor devices on the first side of the substrate respectively define the position, size, specification, geometry and / or arrangement of one or more device areas on the first side of the substrate. Therefore, the area on the substrate where the power semiconductor device is placed, and therefore the contact area of ​​the power semiconductor device with the substrate, corresponds to the device area. In other words, the device area can be the footprint of the power semiconductor device on the first side of the substrate.

[0013] It is possible that the substrate is suitable for carrying a power semiconductor device on the first side of the substrate. In this case, there may also be a device region.

[0014] It is also possible that the substrate is adapted to carry more than one power semiconductor device on the first side of the substrate. For example, the substrate may be adapted to carry 2, 3, 4, or even more than 4 power semiconductor devices on the first side. In this case, there may also be 2, 3, 4, or even more device areas. Thus, in this case, each power semiconductor device defines a device area.

[0015] The layout of the power semiconductor device on the first side of the substrate can be arbitrary. Alternatively, the layout can be selected to enhance the function of the power semiconductor module, for example, the layout can be selected to reduce stray inductance, or to fully utilize the high switching frequency of the power semiconductor device.

[0016] The second side of the substrate is positioned opposite to the first side of the substrate. The second side of the substrate may be parallel to the first side of the substrate. For example, the first side of the substrate may be an upper side, and the second side of the substrate may be a lower side.

[0017] The second side of the substrate includes at least one cooling area opposite to at least one device area on the first side. The cooling area is suitable for dissipating heat from the substrate by contacting the cooling area with a coolant flow in a cooling channel, wherein the cooling channel is provided by a cooler. Therefore, the heat generated by one or more power semiconductor devices on the first side can be dissipated from the substrate, and therefore from the one or more power semiconductor devices to the coolant. The coolant flow in the cooling channel has a certain flow rate that can affect the heat dissipation from the substrate. The coolant in the cooling channel can be a liquid coolant, a gaseous coolant or a supercritical coolant. Preferably, the coolant is a liquid coolant, and more preferably, the coolant is a mixture of water and ethylene glycol.

[0018] In order to effectively cool the one or more power semiconductor devices, the position of the at least one cooling region may substantially correspond to the position of the at least one device region. The cooling region may not only be opposite to the device region, but also substantially correspond to the position of the device region in terms of the position of the cooling region. Furthermore, the size of the cooling region may be in the range of 100% to 500% of the size of the device region, and thus the size of the at least one cooling region corresponds to the size of the at least one device region.

[0019] There may be some heat diffusion in the substrate. In particular, heat injected by the power semiconductor devices on the first side of the substrate may diffuse over an area on the second side of the substrate that is larger than the device area. Therefore, for good cooling efficiency, it may be advantageous to have a cooling area that is larger than the device area. Preferably, the cooling area extends over the device area in a symmetrical manner. In other words, the device area and the cooling area may be similar in a geometric sense, in that they both have the same shape. More preferably, the cooling area may be obtained from the device area by uniform scaling. It may also be provided that a symmetrical arrangement of the cooling area relative to the device area has a higher priority than a priority of the size of the cooling area.

[0020] The second side of the substrate additionally includes an auxiliary region, which is adjacent to the cooling region and is therefore particularly different from the device region. In particular, adjacent to the cooling region refers to the plane of the second side close to the cooling region. In the case of multiple cooling regions, there may be an auxiliary region adjacent to each cooling region. Alternatively, there may be an auxiliary region adjacent to only some cooling regions, or there may be an auxiliary region adjacent to only one cooling region. The auxiliary region includes a guide for reducing the flow rate or flow rate of the coolant flow at the auxiliary region. Since the auxiliary region is adjacent to the cooling region of the second side, and since the cooling region is opposite to the device region, the region opposite to the auxiliary region on the first side of the substrate may not be part of the device region. Therefore, the substrate may not carry a power semiconductor device on the first side of the substrate opposite to the auxiliary region. Therefore, cooling the auxiliary region at the same cooling rate as the cooling region will hinder the benefit of uniform cooling of the power semiconductor device. Therefore, by using a guide to reduce the flow rate of the coolant flow at the auxiliary region, uniform cooling of the power semiconductor device can be achieved.

[0021] The guide member may be a mechanical part suitable for reducing the rate of the coolant flow at the auxiliary region. The flow rate may be reduced by preventing high flow rates at the auxiliary region or by displacing the coolant at the auxiliary region. In other words, the auxiliary region may include a guide member for reducing the flow rate of the coolant flow that will bypass the cooling region. Since the flow rate at the auxiliary region is reduced, the heat dissipation from the auxiliary region is also reduced. However, since the substrate may not carry a power semiconductor device on the first side of the substrate opposite to the auxiliary region, the reduced heat dissipation in this region will not adversely affect the function of the power semiconductor module. On the contrary, since the cooling capacity of the coolant will not be wasted in areas that do not need cooling, all cooling capacity can be used in areas that need cooling, i.e., cooling areas opposite to the device area. Cooling capacity can also be used in any other area that needs better cooling than the auxiliary region.

[0022] Therefore, by using the flow guide, the cooling area can be cooled more effectively and the heat dissipation from the power semiconductor device can be enhanced. This in turn can result in a more reliable function of the power semiconductor device and even a prolonged life of the power semiconductor device.

[0023] With regard to effective cooling of the cooling region, a base plate may be provided, wherein the cooling region comprises a cooling structure, wherein the cooling structure is adapted to be placed in a cooling channel and to be flowed through by a coolant flow. Particularly effective heat transfer may be achieved by increasing the surface of the cooling region in contact with the coolant flow, in particular compared to a flat surface. Thus, by using a cooling structure through which a coolant flow may be flowed, a particularly high heat dissipation may be achieved.

[0024] In this regard, it is preferred that the cooling structure comprises a plurality of cooling pins. Preferably, the coolant is in direct contact with the cooling pins of the cooling structure. The cooling pins may protrude from the second side of the substrate in a vertical manner. The coolant may flow between the cooling pins. Thus, the cooling pins provide a large surface for heat transfer to the coolant, and thus the cooling pins are a particularly effective way to dissipate heat. The cooling pins may have different cross-sections. For example, the cross-section may be circular, oval or diamond-shaped.

[0025] For example, the pins of the cooling structure are most effective when they are allocated below a heat source, such as below a power semiconductor device. Pins allocated away from the power semiconductor device contribute to a much lesser extent to cooling the power semiconductor device, but instead contribute entirely to the pressure drop to the coolant flow. Therefore, the pin field as a cooling structure advantageously extends over approximately the same area as the cooling area.

[0026] However, the layout of the power semiconductor devices on the substrate and therefore the areas that need cooling may vary. For example, the layout of the power semiconductor devices may be staggered to minimize stray inductance and to fully utilize high-frequency switching. The layout may also vary due to different suppliers of power semiconductor devices.

[0027] Even if the layout of the power semiconductor devices on the substrate is different, it is attractive to keep the interface to the cooler the same in order to reduce the number of different parts required for manufacturing the power semiconductor module. This is possible without problems according to the invention, especially compared to the prior art.

[0028] According to the prior art, a possibility to keep the interface to the cooler independent of the layout of the power semiconductor devices is to keep the area of ​​the pin field as cooling structure constant for all different layouts. In order to avoid any uncooled power semiconductor devices, the pin field needs to extend over an area covering all different layouts. Therefore, for some layouts there are pins that are distributed far from the power semiconductor devices.

[0029] However, the pins allocated away from the power semiconductor device contribute to cooling the power semiconductor device to a much smaller extent. However, if the pins allocated away from the power semiconductor device are connected in series with other pin fluids, they contribute entirely to the pressure drop of the coolant flow. The pins allocated away from the power semiconductor device consume part of the coolant flow, thereby reducing the flow rate available for cooling the pins allocated under the heat source. Therefore, the overall cooling performance is reduced. In addition, because some power semiconductor devices are surrounded by more pins than other power semiconductor devices, the cooling rates for different power semiconductor devices are not equal. This uneven cooling may result in different temperatures of the power semiconductor devices, thereby affecting the electrical performance of the power semiconductor devices. Uneven cooling may even result in uneven current distribution.

[0030] It is unwise to omit pins that are distributed away from the power semiconductor device without changing the geometry of the cooling channel. By omitting these pins, the pin field will be smaller than the cooling channel, and this will lead to a significant bypass of the coolant flowing through the remaining pins. This in turn will lead to a reduced cooling efficiency of the power semiconductor device.

[0031] Since according to the invention, preferably, the size and in particular the position of at least one cooling area corresponds to the size and in particular the position of the device area as described above, the disadvantages described above can be overcome. The area on the first side of the substrate opposite the auxiliary area is not part of the device area. Therefore, the correspondence of the size and position of the cooling area with the size and position of the device area results in a highly uniform cooling of the device area. In addition, the interface of such a substrate with the cooler is independent of the geometry and arrangement of the power semiconductor devices on the substrate. Therefore, in the process of producing power semiconductor modules, such a substrate can be used with different arrangements of power semiconductor devices on the substrate.

[0032] As already mentioned, the auxiliary area comprises a guide for reducing the flow rate of the coolant flow at the auxiliary area. Generally, the reduction of the flow rate at the auxiliary area can be achieved by different designs of the guide. However, it may be preferred that the guide comprises a profile arranged corresponding to the profile of the auxiliary area. Since the profile of the auxiliary area has a closed form, this has several advantages. As non-binding examples of closed forms, the closed form may have the shape of an "o" or a rectangular shape. Furthermore, the guide may have substantially the same size, profile and position as the auxiliary area. Therefore, the guide will only reduce the flow rate of the coolant in the auxiliary area.

[0033] According to the above, the guide can be formed by an edge. Preferably, the edge protrudes from the second side of the substrate in a vertical manner. More preferably, the guide is hollow, which means that a cavity is provided inside the area enclosed by the edge. This has the advantage that very little material needs to be used to provide the guide. Therefore, the additional weight and cost of introducing the guide are also low. In addition, the coolant in the cavity of the guide can have a very slow flow rate, until a flow rate of substantially zero. Therefore, the guide does not contribute substantially to heat dissipation, and a highly uniform cooling of the device area is achieved. The guide can have different shapes. Preferably, the shape of the guide is selected in consideration of the device area and / or the auxiliary area. The shape of the guide can be substantially rectangular, for example, the shape of the guide can have the shape of a rectangle with rounded corners. It may be a circular shape, such as an oval or elliptical shape. Alternatively, the shape of the guide can be substantially quadrilateral, trapezoidal, polygonal or polygonal. Alternatively, the guide may have a "U" shape, or an "L" shape, or an "H" shape, ie, the edge has two or more ends. Different shapes of the guide may result in suppression of coolant flow through the guide, so the guide may function as a baffle.

[0034] It can further be provided that the flow guide is formed by a massive part. Therefore, the flow guide is not hollow. In the auxiliary area, all coolant is displaced by the massive flow guide. This is particularly advantageous in combination with a flow guide made of a lightweight material with low thermal conductivity, such as plastic.

[0035] The guide may include a substantially rectangular shape, a U-shape, or an L-shape. The rectangular shape may be a rectangular shape with or without rounded corners, or a parallelogram shape. Since a plurality of power semiconductor devices have a rectangular shape, forming the guide in a rectangular shape may be advantageous for uniform cooling.

[0036] It may further be provided that the flow guide has a U-shape. The U-shape may be achieved by omitting one side of the rectangular shape. A flow guide having a U-shape may have the advantage that less material is used to manufacture the flow guide.

[0037] Furthermore, in yet another embodiment, the guide may have an L-shape. The L-shape may be achieved by omitting two adjacent sides of the rectangular shape. The guide having an L-shape may have the advantage of requiring less material for manufacturing the guide.

[0038] It is possible that the guide is made into an integral type by forging together with the cooling pins of the cooling structure as part of the substrate. In this case, the guide can be made of the same material as the substrate. Preferably, the substrate is made of copper or a copper alloy, aluminum or an aluminum alloy, and / or a metal matrix composite material including an aluminum matrix (AlSiC) with silicon carbide particles. Alternatively, the substrate can be made of a layered compound of copper and aluminum, a layered compound of an aluminum alloy, and / or a layered compound of a copper alloy.

[0039] Besides this, the flow guide can be fixed to the body of the substrate by brazing, welding or gluing. For example, the flow guide can be fixed to the body by brazing. It is also possible to glue the flow guide to the substrate or the body of the substrate, in which case different materials can be used for the flow guide and the substrate. For example, the flow guide can be made of plastic. Using plastic can be advantageous because plastic is light in weight and has a very low thermal conductivity. Therefore, a flow guide made of plastic has little effect on the heat transfer.

[0040] The body can be, for example, a major part of the base plate which is formed as a plate and forms, for example, a support for the flow guide and optionally for the cooling pins.

[0041] It may further be preferred that the height of the guide corresponds to the height of the cooling structure. For example, the height of the edge of the guide may be substantially equal to the height of the cooling pins of the cooling structure. Thus, the cooling structure and the guide are immersed in the coolant at the same depth. This may result in improved cooling performance for the power semiconductor device. The same height may include that there may be a small deviation in the range of + / -5% regarding the height of the guide corresponding to the height of the cooling structure relative to the part with a larger height. Thus, there may be a small deviation in the range of + / -5% regarding the depth of immersion.

[0042] The cooler is provided with (e.g., includes) a cooling channel, which is suitable for providing a coolant flow. The cooler can be a mechanical part that can be connected to a substrate, and in this state, a cooling channel can be formed. Therefore, a cooling channel can be formed by a space that opens to one side of the cooler. The side of the cooler having an open end of the space can be fixed to the substrate in a sealed manner so that the space forms a cooling channel. In the connection form, the cooling channel of the cooler can close the cooling area, and in particular at least partially close the auxiliary area of ​​the substrate. Preferably, the coolant is a liquid coolant that flows in the cooling channel of the cooler. The cooling channel can have a flat bottom and two side walls substantially perpendicular to the bottom, wherein the side walls can be fixed to the substrate as described above. Preferably, the two side walls are substantially parallel to each other. In this case, the cross section perpendicular to the coolant flow has a substantially rectangular shape. Small deviations within the range of + / -5% in terms of angular deviations regarding the parallelism and verticality of the side walls can be included in this description.

[0043] However, the geometry of the cooling channel is not strictly limited. The cooling channel of the cooler is adapted to receive the cooling area and at least one flow guide. Thus, the device is capable of effectively and uniformly cooling the power semiconductor device that may be arranged on the first side of the substrate.

[0044] It may be preferred that the auxiliary region and the cooling region together have a width corresponding to the width of the cooling channel. The shortest distance between the two side walls of the cooling channel defines the width of the cooling channel. In order to reduce bypass flows of coolant, the width of the cooling channel is substantially equal to the width of the auxiliary region and the cooling region together. With regard to the expression "corresponding", there may be small deviations between the width of the cooling channel and the common width of the auxiliary region and the cooling region, which may be in the range of + / -5% with reference to larger values.

[0045] Due to this correspondence of the common width of the cooling region and the auxiliary region (such as the collective width of the cooling structure and the flow guide on one side) and the width of the cooling channel on the other side, substantially the entire coolant in the cooling channel contributes to cooling the cooling region, and there is no bypass flow around the cooling region. For example, almost all of the coolant can flow through the cooling structure in the cooling region.

[0046] The flow direction of the coolant is perpendicular to the width of the cooling channel. In order to achieve a high heat dissipation from the substrate, an arrangement may be provided in which the auxiliary region and the cooling region are arranged along the width of the cooling channel. Thus, the arrangement of the auxiliary region and the cooling region is perpendicular to the flow direction of the coolant flow and the coolant flow is not obstructed by the flow guide. The arrangement of the auxiliary region and the cooling region perpendicular to the width of the cooling channel and thus along the flow direction of the coolant flow may result in the coolant flow being obstructed by the flow guide and may therefore affect the heat dissipation in the cooling region in an unfavorable manner.

[0047] According to the above, the following arrangement can be provided, wherein the guide comprises a U-shape, a rectangular shape or an L-shape, and wherein the longer axis of the guide of the shape is parallel to the flow direction of the coolant flow. For example, the following arrangement can be provided, wherein the guide comprises a U-shape, and wherein the legs of the U-shape are arranged parallel to the flow direction of the coolant flow. Preferably, the opening of the U-shape faces the direction of the coolant flow, and is therefore at the downstream end of the guide. Alternatively, the opening of the U-shape faces the direction opposite to the coolant flow, and is therefore at the upstream end of the guide. It is also possible that the guide comprises a substantially rectangular shape, wherein the longer axis of the rectangular shape is parallel to the flow direction of the coolant flow. It is also possible that the guide comprises an L-shape, wherein the longer axis of the L-shape is parallel to the flow direction of the coolant flow. In the case where the lengths of the L-shaped legs are different, the shorter legs of the L-shape can be at the downstream or upstream end of the guide.

[0048] Likewise, small deviations in the range of + / - 5% in terms of angular deviation with respect to the parallelism of the longer axis of the flow guide of the described shape with respect to the flow direction of the coolant flow may be included in the present description.

[0049] With regard to effective cooling, an arrangement may be provided in which the cooling region comprises a cooling structure and in which the cooling structure and the guide are in mechanical contact with the bottom of the cooling channel. As already mentioned, this may be advantageous if the height of the guide corresponds to the height of the cooling structure. This is even more advantageous in combination with a cooling channel which may have a flat bottom when the guide and the cooling structure are in mechanical contact with the bottom of the cooling channel. Thus, substantially all of the coolant flows through the cooling structure and contributes to cooling the cooling region. In other words, there is no bypass flow of coolant between the cooling structure and the bottom of the cooling channel or between the guide and the bottom of the cooling channel. Thus, efficient cooling is achieved.

[0050] In summary, the present invention solves the important purpose of how to effectively and / or uniformly cool the power semiconductor devices on the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] These and other aspects of the invention will become apparent and elucidated with reference to the embodiments described below. The various features disclosed in the embodiments may constitute aspects of the invention individually or in combination. Features of different embodiments may be transferred from one embodiment to another.

[0052] In the attached picture:

[0053] Figure 1 A schematic diagram showing a first side of a substrate for a power semiconductor module according to a first embodiment of the present invention;

[0054] Figure 2 A schematic diagram showing a second side of a substrate for a power semiconductor module according to a second embodiment of the present invention;

[0055] Figure 3 The cooler according to the present invention is shown Figure 2 A cross-sectional view of a device having a substrate; and

[0056] Figure 4 A schematic diagram showing another arrangement of a base plate and a cooler according to another embodiment of the present invention. DETAILED DESCRIPTION

[0057] Figure 1 A substrate 10 for a power semiconductor module is shown, wherein reference numeral 10 may particularly indicate a body of the substrate 10. The substrate 10 comprises a first side 12 adapted to carry an electronic circuit comprising at least one power semiconductor device 14. Figure 1In the first embodiment shown, the substrate 10 is adapted to carry four power semiconductor devices 14. Each of the power semiconductor devices 14 defines a device area 16 on the first side 12 of the substrate 10, respectively. For the sake of clarity, the device area 16 is shown as being slightly larger than the device 14 actually defines, wherein it should be noted that the device area 16 is the footprint of the power semiconductor device 14. The substrate 10 also includes a second side 18 opposite the first side 12. In this embodiment, the second side 18 is the lower side of the substrate 10 and is parallel to the first side 12. The second side 18 includes at least one cooling area 20 opposite to the at least one device area 16. In this first embodiment, the second side 18 includes a cooling area 20 opposite to each device area 16. Therefore, the second side 18 includes four cooling areas 20. The size and position of each cooling area 20 corresponds to the size and position of each device area 16, and therefore corresponds to the size and position of the corresponding power semiconductor device 14. The second side 18 additionally includes an auxiliary area 22 positioned adjacent to the cooling area 20. In this first embodiment, there is an auxiliary region 22 which is located between the two cooling regions 20 .

[0058] exist Figure 2 , another embodiment of the substrate 10 is shown, wherein Figure 1 Compared to the above, the same or corresponding parts are defined by the same reference numerals.

[0059] exist Figure 2 In FIG. 1 , the substrate 10 is shown as lying flat on the first side 12 of the substrate. Therefore, the device region 16 on the first side 12 is Figure 2 However, a cooling region 20 on the second side 18 is shown. In this second embodiment, the second side 18 includes a cooling region 20. The cooling region 20 is adapted to dissipate heat from the substrate 10 by contacting the cooling region 20 with a coolant flow 24 in a cooling channel 26, wherein the cooling channel 26 is disposed at a position substantially parallel to the substrate 10. Figure 2 Not shown, but in Figure 3 The auxiliary region 22 is located adjacent to the cooling region 20 . Figure 2 The auxiliary region 22 is shown to include a flow guide 28. The flow guide 28 is adapted to reduce the flow rate of the coolant flow 24 at the auxiliary region 22.

[0060] Figure 2 It is also shown that the cooling region 20 comprises a cooling structure 30 adapted to be placed in the cooling channel 26 and flowed through by the coolant flow 24. In this second embodiment, the cooling structure 30 comprises a plurality of cooling pins 32. The cooling pins 32 protrude from the second side 18 of the base plate 10 in a perpendicular manner.

[0061] The flow guide 28 and the cooling structure 30 may be understood to be part of the base plate 10 .

[0062] exist Figure 2 In a second embodiment of the invention, the guide 28 is formed by an edge 34, which is arranged corresponding to the contour of the auxiliary area 22. The guide 28 comprises a substantially rectangular shape. The edges of the rectangular-shaped edge 34 are rounded. The height of the guide 28 and therefore the height of the edge 34 corresponds to the height of the cooling structure 30 and therefore to the height of the cooling pins 32. The guide 28 is hollow inside the guide. Therefore, only very little material is used for the production of the guide 28. The longer axis 36 of the rectangular-shaped guide 28 is parallel to the flow direction of the coolant flow 24.

[0063] Figure 3 The cooler 38 is shown with Figure 2 The cooler 38 comprises a cooling channel 26 adapted to provide a coolant flow 24. The cooling channel 26 has a flat bottom 40 and two side walls 42 substantially perpendicular to the bottom 40. The shortest distance between the two side walls 42 of the cooling channel 26 defines a width 44 of the cooling channel 26.

[0064] The cooling passage 26 of the cooler 38 is adapted to receive the cooling structure 30 and the at least one flow guide 28 .

[0065] As from Figure 2 and Figure 3 As can be seen, the auxiliary region 22 and the cooling region 20 together have a width corresponding to the width 44 of the cooling channel 26. The auxiliary region 22 and the cooling region 20 are arranged along the width 44 of the cooling channel 26. Therefore, the coolant flow 24 through the cooling region 20 is not hindered by the flow guide 28. Therefore, efficient and uniform cooling of the device 14 is achieved. In addition, the cooling structure 30 and the flow guide 28 are in mechanical contact with the bottom 40 of the cooling channel 26. This effectively prevents the coolant from bypassing between the bottom 40 of the cooling channel 26 and the cooling structure 30 or the flow guide 28.

[0066] Figure 4 The arrangement of the base plate 10 and the cooler 38 is shown. The view is from the top, so Figure 4Only the side wall 42 of the cooler 38 is visible. The substrate 10 is suitable for carrying 12 power semiconductor devices 14. The 12 power semiconductor devices 14 are arranged on the first side 12 of the substrate 10 so that there are 12 cooling areas 20 on the second side 18 of the substrate, wherein each cooling area 20 corresponds to a device area 16. However, since the 12 cooling areas 20 are arranged in two groups of 6 cooling areas 20 each, and the 6 cooling areas 20 in each group form a continuous area, it can also be said that the second side 18 includes two cooling areas 20. In addition, the second side 18 includes a guide 28 in the auxiliary area 22. In this embodiment, the guide 28 has an L-shape. The longer axis 36 of the guide 28 in the L-shape is parallel to the flow direction of the coolant flow 24.

[0067] Although the present invention has been illustrated and described in detail in the drawings and the foregoing description, such illustration and description are to be considered illustrative or exemplary rather than restrictive; the present invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments may be understood and implemented by those skilled in the art in practicing the claimed invention by studying the drawings, the disclosure and the appended claims. In the claims, the words "comprise" or "comprising" do not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality. The fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.

[0068] Reference numerals list

[0069] 10 substrates

[0070] 12 First side

[0071] 14Power semiconductor devices

[0072] 16 device areas

[0073] 18 Second side

[0074] 20 cooling zones

[0075] 22 Auxiliary Area

[0076] 24 Coolant flow

[0077] 26 cooling channels

[0078] 28 guide piece

[0079] 30 Cooling structure

[0080] 32 Cooling pins

[0081] 34 Edge

[0082] 36 Longer axis

[0083] 38 Cooler

[0084] 40 bottom

[0085] 42 side wall

[0086] 44Width

[0087] 46 devices

Claims

1. A device (46) comprising a cooler (38) and a substrate (10) for a power semiconductor module, wherein: The cooler (38) is provided with a cooling channel (26) suitable for providing a coolant flow (24), wherein the cooling channel (26) of the cooler (38) is formed by a space of the cooler (38) opened to one side, and wherein the side of the cooler (38) having the open end of the space is suitable for being fixed to the substrate (10) in a sealed manner, wherein the substrate (10) includes a first side (12) suitable for carrying an electronic circuit, the electronic circuit including at least one power semiconductor device (14), wherein the at least one power semiconductor device (14) forms at least one device area (16) on the first side (12), and the device area is a coverage area of ​​the power semiconductor device (14), wherein the substrate (10) also includes a second side (18) located opposite to the first side (12), wherein the substrate (10) includes at least one cooling area (20) on the second side (18) opposite to the at least one device area (16), wherein the at least one The cooling region (20) is adapted to dissipate heat from the substrate (10) by contacting the cooling region (20) with the coolant flow (24) in the cooling channel (26), wherein the substrate (10) additionally includes an auxiliary region (22) on the second side (18) positioned adjacent to the cooling region (20), wherein the substrate (10) in the auxiliary region (22) includes a guide (28) for reducing the flow rate of the coolant flow (24) in the auxiliary region (22), wherein the cooling channel (26) is adapted to receive the at least one cooling region (20) and the at least one guide (28), and wherein, in a state where the cooler (38) is fixed to the substrate (10), the cooling channel (26) of the cooler (38) closes the cooling region (20) and at least partially closes the auxiliary region (22) of the substrate (10), and wherein the guide (28) includes a hollow rectangular edge structure surrounding an open area.

2. The device (46) according to claim 1, characterized in that The cooling region (20) includes a cooling structure (30), wherein the cooling structure (30) is adapted to be placed in the cooling channel (26) and for the coolant flow (24) to flow through.

3. The device (46) according to claim 2, characterized in that The cooling structure (30) includes a plurality of cooling pins (32).

4. The device (46) according to any one of claims 1 to 3, characterized in that The dimensions of the at least one cooling region (20) substantially correspond to the dimensions of the at least one device region (16).

5. The device (46) according to any one of claims 1 to 3, characterized in that The flow guide (28) comprises a contour arranged corresponding to the contour of the auxiliary area (22).

6. The device (46) according to claim 2 or 3, characterized in that The height of the air guide (28) corresponds to the height of the cooling structure (30).

7. The device (46) according to any one of claims 1 to 3, characterized in that The guide member (28) is fixed to the body of the base plate (10) by soldering, welding or gluing.

8. The device (46) according to any one of claims 1 to 3, characterized in that The auxiliary region (22) and the cooling region (20) together have a width (44) corresponding to a width (44) of the cooling channel (26).

9. The device (46) according to any one of claims 1 to 3, characterized in that The auxiliary region (22) and the cooling region (20) are arranged along a width (44) of the cooling channel (26).

10. The device (46) according to any one of claims 1 to 3, characterized in that The longer axis (36) of the flow guide (28) is parallel to the flow direction of the coolant flow (24).

11. The device (46) according to any one of claims 1 to 3, characterized in that The cooling region (20) includes a cooling structure (30), wherein the cooling structure (30) and the flow guide (28) are in mechanical contact with a bottom (40) of the cooling channel (26).

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