Light sensor module

Abstract

The optical sensor module comprises: a substrate (20) having an electrode pattern formed on the surface; a light detecting element (10) for detecting light, which is electrically connected to the electrode pattern and fixed to the substrate (20); and a lens holding component (80) having a lens (90) fixed thereto and bonded to the substrate (20) by an adhesive at a position surrounding the light detecting element (10), wherein the bottom surface (84) of the lens holding component (80) bonded to the substrate (20) has protrusions (82) arranged in a dispersed manner, and the ends of the protrusions (82) are in contact with the substrate (20).

Description

Technical Field

[0001] The present application relates to a light sensor module. Background Art

[0002] Conventionally, there is known a photosensor module including an infrared detection element, a lens holding member accommodating the infrared detection element, and a lens arranged in front of the infrared detection element and fixed to the lens holding member so that a light-converging point overlaps a light-receiving portion of the infrared detection element.

[0003] The above-mentioned optical sensor module positions a lens holding component that fixes and holds the lens relative to the infrared detection element bonded to the insulating substrate, for example, in such a way that the focal point of the lens overlaps with the light receiving part of the infrared detection element. To this end, an adhesive (ultraviolet (UV) curing adhesive) is pre-coated at a position where the bottom surface of the positioned lens holding component contacts the insulating substrate, and then the lens holding component is arranged at the positioned position. Thereafter, the adhesive is cured by irradiating the adhesive coating with ultraviolet light, thereby preventing the relative position of the lens fixed to the lens holding component and the infrared detection element from changing.

[0004] By curing the adhesive, the lens holding component to which the lens is fixed and the insulating substrate to which the infrared detection element is joined are bonded, and the relative positions of the light receiving part of the infrared detection element and the light focusing point of the lens do not change. However, the conventional optical sensor module cannot control the thickness of the adhesive between the substrate and the lens holding component after the lens holding component is arranged. Therefore, when bonding is performed using a device without an active alignment function that arranges the lens holding component while observing an image obtained by operating the infrared detection element, the lens holding component is sometimes arranged at an angle relative to the substrate due to factors such as uneven thickness of the adhesive, small load on the lens holding component, and offset of the position of the adsorbed lens holding component. As a result, there is a possibility that the light focusing point of the lens is separated from the light receiving part of the infrared detection element, and the optical sensor module cannot receive light normally.

[0005] In the optical sensor module, in order to correctly take pictures with the infrared detection element, the position of the lens is assembled in such a way that the focusing point of the lens overlaps the light receiving part of the infrared detection element. However, especially in the case where the lens and the lens holding component are formed integrally, when the lens holding component is tilted relative to the infrared detection element, there is a possibility that the focusing point of the lens is separated from the light receiving part of the infrared detection element and cannot receive light normally. In addition, when the lens holding component is provided, there is a wiring component for operating the infrared detection element on the substrate accommodated in the lens holding component. Therefore, when the lens holding component is provided on the adhesive, if the amount of adhesive applied is large or the load of the lens holding component is large, the adhesive that is flattened by the lens holding component and wets and diffuses to the inside of the lens holding component contacts the wiring component inside the lens holding component. The wiring component that contacts the adhesive may contact the surrounding wiring components due to deformation, or the wiring may be disconnected, causing the infrared detection element to be unable to operate.

[0006] In addition, in a conventional optical sensor module, the lens holding component and the lens are different components. Therefore, after the lens holding component is bonded to the substrate and before the lens is mounted on the lens holding component, it is possible to check whether the adhesive that overflows to the inside of the lens holding component contacts the wiring component or whether the lens holding component is tilted. Therefore, in the event of a problem, the position of the wiring component can be corrected, or the lens can be installed in a manner that absorbs the tilt of the lens holding component, and in the worst case, it can be discarded on the spot. However, in an optical sensor module in which the lens and the lens holding component are formed as one body in order to achieve miniaturization compared to a conventional optical sensor module, although the cost required for the components can be reduced, the tilt of the lens cannot be corrected after the lens holding component is bonded to the substrate. In addition, since malfunction caused by the contact between the adhesive and the wiring component cannot be checked until the sensor is actually operated, the loss cost in the event of a malfunction is greater than that of a conventional optical sensor module.

[0007] In order to solve such a problem, a structure is proposed for an optical sensor module in which the lens holding component is abutted against the substrate and a space for filling the adhesive is formed on the outer peripheral side of the lens holding component in the abutting portion to bond the lens holding component to the substrate so as to prevent the adhesive from entering the inner side of the lens holding component and also to suppress the tilt of the lens holding component (see patent document 1).

[0008] Patent Document 1: Japanese Patent Application Publication No. 2006-86672

[0009] In the optical sensor module described in Patent Document 1, since the lens holding component and the substrate are in contact at the contact surface of the lens holding component, the tilt of the lens holding component is suppressed, and the possibility of the adhesive entering the inner side of the lens holding component is small. However, in order to make the lens holding component contact with the substrate without a gap, the processing accuracy of the contact surface of the lens holding component is required, and it is necessary to fill a predetermined amount of adhesive into the filling space formed on the periphery of the lens holding component while making the lens holding component contact with the substrate. Therefore, the process of filling the adhesive becomes complicated. Summary of the invention

[0010] The present application discloses a technique for solving the above-mentioned problems, and an object of the present application is to provide an optical sensor module in which application of an adhesive is simple and in which tilting of a lens holding member is suppressed.

[0011] The optical sensor module disclosed in the present application comprises: a substrate having an electrode pattern formed on the surface; a light detecting element for detecting light, which is electrically connected to the electrode pattern and fixed to the substrate; and a lens holding component, to which a lens is fixed and which is bonded to the substrate by an adhesive at a position surrounding the light detecting element, wherein the bottom surface of the lens holding component bonded to the substrate has dispersedly arranged protrusions, and the ends of the protrusions are in contact with the substrate.

[0012] According to the optical sensor module disclosed in the present application, it is possible to obtain an optical sensor module in which application of an adhesive is simple and in which tilting of a lens holding member is suppressed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a plan view showing the structure of the optical sensor module according to the first embodiment.

[0014] Figure 2 The structure of the optical sensor module of Embodiment 1 is shown in FIG. Figure 1 Cross-sectional view at position A-A.

[0015] Figure 3 It is an enlarged cross-sectional view showing the structure of a main part of a photosensor module according to a comparative example.

[0016] Figure 4 This is an enlarged cross-sectional view showing the main structure of the optical sensor module according to the first embodiment.

[0017] Figure 5 This is a diagram showing a cross section of a main part of the optical sensor module according to Embodiment 1 by means of a photograph.

[0018] Figure 6 This is a plan view showing another structure of the optical sensor module according to the first embodiment.

[0019] Figure 7Another structure of the optical sensor module according to the first embodiment is shown in FIG. Figure 6 Cross-sectional view at position A-A.

[0020] Figure 8 This is a plan view showing still another structure of the optical sensor module according to the first embodiment.

[0021] Fig. 9 This is another structure of the optical sensor module of Embodiment 1. Figure 8 Cross-sectional view at position A-A.

[0022] Fig.10 This is an enlarged cross-sectional view showing the structure of another main part of the optical sensor module according to the first embodiment.

[0023] Fig.11 It is a plan view showing the structure of the optical sensor module according to the second embodiment.

[0024] Fig.12 The structure of the optical sensor module of Embodiment 2 is shown in FIG. Fig.11 Cross-sectional view at position A-A.

[0025] Fig.13 It is a plan view showing the structure of a photosensor module according to Embodiment 3.

[0026] Fig.14 The structure of the optical sensor module of Embodiment 3 is shown in FIG. Fig.13 Cross-sectional view at position A-A. DETAILED DESCRIPTION

[0027] The embodiments of the optical sensor module of the present application are described with reference to the accompanying drawings. In addition, in each figure, the same or similar components are marked with the same reference numerals. In addition, in order to avoid the following description from becoming unnecessarily long and to make it easier for the parties to understand, the description of matters that are already known and the repeated description of substantially the same structure are sometimes omitted.

[0028] In addition, the sizes or scales of the corresponding components are independent of each other between the figures. For example, in a figure obtained by changing a part of the structure and in a figure that has not been changed, the sizes or scales of the same component are different. In addition, although the structure of the optical sensor module actually has multiple components, only the parts required for the description of this application are recorded, and the description of other parts is omitted. In addition, although in the following description, as an optical sensor module, an optical sensor module that detects infrared rays is used as an example, each embodiment can also be applied to various optical sensor modules such as an optical sensor module that detects visible light instead of infrared rays with the same subject.

[0029] Implementation Method 1

[0030] Figure 1 is a plan view showing a schematic structure of the optical sensor module 101 according to the first embodiment, Figure 2 yes Figure 1 The optical sensor module 101 has, as a basic structure, an infrared detection element 10 as a light detection element; an epoxy glass substrate 20 as a substrate; and a lens holding component 80, which is inserted into the lens 90 after molding and is fixed around the lens 90 by resin caulking to become one with the lens 90. The infrared detection element 10 is fixed to one surface of the epoxy glass substrate 20 by Ag paste 60, and is fixed and accommodated in the inside of the lens holding component 80. The lens 90 for transmitting and focusing infrared rays is fixed integrally to the lens holding component 80, and the bottom surface 84 of the lens holding component 80 is bonded to the epoxy glass substrate 20 by an adhesive 70.

[0031] In addition, Figure 1 as well as Figure 2 , only the basic components of the optical sensor module 101 are shown, and other components bonded to the glass epoxy substrate 20, that is, dedicated ICs, metal wires, capacitors, connectors, etc., which are not directly related to the present application, are omitted from the illustration.

[0032] The infrared detection element 10 is a thermal infrared sensor, for example, a resistance bolometer sensor represented by vanadium oxide (VOx) or a SOI (Silicon on Insulator) diode bolometer sensor using the temperature characteristics of a PN diode, and is made of Si.

[0033] The epoxy glass substrate 20 is a substrate including circuits that perform various functions. The epoxy glass substrate 20 has a plate-shaped epoxy glass substrate 20a, and electrode patterns 20b and 20c formed on both surfaces of the epoxy glass substrate 20a. The electrode patterns 20b and 20c electrically connect the infrared detection element 10 fixed on the epoxy glass substrate 20 and other electronic devices not shown, and provide interfaces for connecting to other circuit substrates and external power supplies. The epoxy glass substrate 20a is an electrical insulator, and due to the difference in linear expansion coefficient between the lens holding component 80 bonded to the epoxy glass substrate 20 by the adhesive 70, the infrared detection element 10 bonded to the electrode patterns 20b and 20c by the Ag paste 60, and other electronic devices, stress is generated due to temperature rise during the operation of the optical sensor module 101. The glass epoxy substrate 20 a is preferably thick so that deformation such as warping due to the stress is less likely to occur. Generally, for example, the glass epoxy substrate 20 a having a thickness of about 0.8 mm to 1.0 mm is used.

[0034] In addition, although Figure 1 as well as Figure 2 In the figure, an example is shown in which only one infrared detection element 10 is arranged on the epoxy glass substrate 20, but a plurality of infrared detection elements 10 may be arranged on the epoxy glass substrate 20. Furthermore, although the number of epoxy glass substrates 20 is one, the number of epoxy glass substrates 20 is not limited to one. For example, it is also possible to configure a plurality of identical electrode patterns 20b and 20c in one epoxy glass substrate 20, and to arrange the infrared detection element 10 and other electronic components one by one on each electrode pattern 20b and 20c for bonding, and to cover the area of ​​each infrared detection element 10 with a lens holding member 80 for sealing, and then cut each electrode pattern 20b and 20c one by one for segmentation.

[0035] The electrode pattern 20b and the electrode pattern 20c are usually made of the same material. The infrared detection element 10 is bonded to the electrode pattern 20b on one side through the Ag paste 60. In addition, the electrode pattern 20b forms a bonding portion through Au metal wires, etc., thereby electrically connecting other electronic devices to the infrared detection element 10. Such an electrode pattern 20b is a wiring component for electrically connecting the infrared detection element 10 to an external circuit, so it is preferably a metal with low resistance. Therefore, the electrode patterns 20b and 20c generally use Cu foil of, for example, 10 to 40 μm.

[0036] The electrode pattern 20b formed on the epoxy glass substrate 20 is joined to the infrared detection element 10 by the Ag paste 60 as a bonding material. When the infrared detection element 10 is bonded by the Ag paste 60, other electronic components have been bonded to the epoxy glass substrate 20 by solder. Therefore, in order to prevent the surrounding solder from melting again when the infrared detection element 10 is bonded, it is preferred that the curing temperature of the Ag paste 60 is lower than the melting point of the solder. In addition, in order to avoid the temperature rise of the infrared detection element 10, it is preferred that the thermal conductivity of the bonding material is large. Therefore, the bonding material is not limited to Ag paste, but may also be other conductive adhesives, or sintered bonding materials such as Ag nanoparticle paste, but from the viewpoints of bonding temperature, thermal conductivity, cost, etc., it is preferred to use Ag paste.

[0037] The adhesive 70 bonds the bottom surface 84 of the lens holding component 80 to the surface of the epoxy glass substrate 20 on which the infrared detection element 10 is bonded. When the lens holding component 80 is bonded by the adhesive 70, the infrared detection element 10 is bonded to the surface of the epoxy glass substrate 20 by the Ag paste 60, other electronic components are bonded by solder, and components for electrically connecting these components, such as Au metal wires, are provided. Therefore, it is preferred that the curing temperature of the adhesive 70 is lower than the heat resistance temperature of the infrared detection element 10, other electronic components, the lens holding component 80, and the melting point of the solder, so that other components mounted on the epoxy glass substrate 20 are not damaged or the solder does not melt when the adhesive 70 is cured.

[0038] In addition, since these components are housed inside the lens holding component 80, it is preferred that the adhesive 70 is set not to wet and spread inside the lens holding component 80 so that the metal wire does not fall off or the adjacent metal wires do not contact each other. In addition, if the adhesive 70 is applied to the epoxy glass substrate 20 and the lens holding component 80 is arranged on the applied adhesive 70, and before the adhesive 70 is cured, it enters the transportation process performed by the operator, the lens holding component 80 is peeled off or moved due to vibration during transportation or impact during falling. As a result, infrared rays cannot be focused on the infrared detection element 10, and problems such as inability to take pictures, image loss, or focus shift may occur. Therefore, it is preferred that the adhesive 70 can be cured in the same device as the device that arranges the lens holding component 80 on the applied adhesive 70, so that the adhesive 70 can be cured without causing damage to surrounding components. Therefore, the adhesive 70 is preferably a UV curing adhesive that is cured by UV irradiation or a UV thermosetting adhesive that is cured by a combination of UV and heating at a temperature lower than the melting point of solder or the heat resistance temperature of surrounding members.

[0039] Similarly, when the lens holding component 80 is arranged on the applied adhesive 70, if the load for mounting the lens holding component 80 is small or the amount of adhesive 70 applied is too much, the lens holding component 80 may be tilted relative to the glass epoxy substrate 20 and may not be able to focus the infrared light on the infrared detection element 10. On the contrary, if the load for mounting the lens holding component 80 is too large, the adhesive 70 may be deformed and wet and spread to the inside and outside of the bottom surface 84 of the lens holding component 80 beyond the design value. The adhesive 70 wet and spread to the outside of the lens holding component 80 may hinder the assembly of the optical sensor module 101 to the product. In addition, the adhesive 70 wet and spread to the inside of the lens holding component 80 may come into contact with wiring components such as metal wires, causing the joint between the metal wire and the glass epoxy substrate 20 to fall off, or the metal wire may be skewed and come into contact with a nearby metal wire. On the other hand, if the amount of adhesive 70 applied is too small, the adhesive 70 does not sufficiently wet and spread on the bottom surface 84 of the lens holding member 80 , and the bonding strength becomes weak, which may reduce the reliability of the optical sensor module 101 .

[0040] The lens holding component 80 is a box made of thermoplastic resin, thermosetting resin, metal, etc., and has a flat upper surface portion, a side portion connected to the outer edge of the upper surface portion, and an opening portion surrounded by the side portion. The shape of the upper surface portion is square in the present embodiment 1, but it can also be rectangular, circular, or elliptical. In addition, the lens holding component 80 has a lens 90 fixed integrally in its upper surface portion, and the entire circumference of the bottom surface 84 is bonded to the epoxy glass substrate 20 by the adhesive 70 at the position where the infrared rays that have passed through the lens 90 are focused on the light receiving portion of the infrared detection element 10. The infrared detection element 10 is sealed by evacuating the inner side of the lens holding component 80. In order to increase the bonding surface of the lens holding component 80, that is, the bonding area of ​​the bottom surface 84 to improve the bonding strength, as Figure 1 as well as Figure 2 As shown in FIG. 1 , the edge portion 81 is formed in such a manner that each side of the square extends outward. In addition, at the portions corresponding to the four corners of the square, a projection 82 having a truncated cone shape whose bottom diameter is less than the width of the bottom surface 84 of the lens holding component 80 is formed from the bottom surface 84 of the lens holding component 80 toward the epoxy glass substrate 20 side facing the lens holding component 80, and the bottom surface 84 of the lens holding component 80 and the epoxy glass substrate 20 are bonded in such a manner that the tip of the projection 82 abuts against the epoxy glass substrate 20.

[0041] When a thermoplastic resin is used for the lens holding component 80, PC (Polycarbonate) is generally used. In addition to PC, PA66 (NYLON66), PBT (Polybutylene Terephthalate), PPS (PolyPhenylene Sulfide), etc. can also be used. These resins are preferred because they have high heat resistance, so even if heating is required when curing the adhesive 70, the heating temperature can be set high. Since the adhesive 70 is sandwiched between the bottom surface 84 of the lens holding component 80 and the epoxy glass substrate 20 for bonding, the height of the protrusion 82 becomes the thickness of the adhesive. The height of the protrusion 82 can be set to a degree that can absorb the warping of the epoxy glass substrate 20 and the stress generated by the difference in linear expansion coefficient between the lens holding component 80 and the epoxy glass substrate 20, and is lower than the thickness of the adhesive 70 after application. Specifically, it is preferably about 10 to 200 μm.

[0042] In the first embodiment, the lens 90 is a silicon lens having convex spherical surfaces on both sides, and the outer periphery is covered by the lens holding member 80 to form an integral body, thereby being fixed to the upper surface portion of the lens holding member 80. Therefore, when the lens holding member 80 moves, the lens 90 also moves together with the lens holding member 80, and thus the relative position between the lens holding member 80 and the infrared detection element 10 changes due to the movement of the lens holding member 80. In addition, since the lens 90 transmits infrared rays but not visible light, the interior of the lens holding member 80 cannot be observed through the lens 90.

[0043] In order to correctly take pictures using the infrared detection element 10, the position of the lens 90 is assembled in such a way that the light-converging point of the lens 90 overlaps with the light-receiving part of the infrared detection element 10. However, especially when the lens 90 and the lens holding member 80 are formed integrally, if the lens holding member 80 is tilted relative to the infrared detection element 10, the light-converging point of the lens 90 deviates from the light-receiving part of the infrared detection element 10, and the infrared detection element 10 may not receive light normally. Therefore, the infrared detection element 10 may not be able to take pictures, and even a slight displacement may cause the image to be missing or the focus to be lost.

[0044] Furthermore, when the lens holding member 80 is disposed, wiring members and the like for operating the infrared detection element 10 exist on the electrode pattern 20b of the epoxy glass substrate 20 housed in the lens holding member 80. Therefore, when the lens holding member 80 is disposed on the adhesive 70, if the amount of the adhesive 70 applied is large or the load of the nozzle carrying the lens holding member 80 is large, the adhesive 70 that is flattened by the lens holding member 80 and wets and spreads to the inside of the lens holding member 80 contacts the wiring members inside the lens holding member 80. The wiring members that contact the adhesive 70 may contact the surrounding wiring members due to deformation, or the wiring may be disconnected, resulting in a defect such as the optical sensor module 101 not operating.

[0045] In the case of an optical sensor module in which the lens holding component and the lens are configured as separate bodies, the position of the lens can be readjusted by a slight displacement in such a way that the light-converging point of the lens overlaps with the light-receiving part of the infrared detection element again after the adhesive that adheres the lens holding component to the substrate is cured. However, in the optical sensor module of the present application, in order to reduce the number of components and thus cut costs, the lens holding component 80 and the lens 90 are formed integrally, and the position of the lens 90 cannot be readjusted after the lens holding component 80 is mounted on the adhesive 70. Therefore, even before the adhesive 70 is cured, the possibility of a defect caused by the relative position mismatch between the light-receiving part of the infrared detection element 10 and the light-converging point of the lens 90 is greater than in an optical sensor module in which the lens holding component 80 and the lens 90 are configured as separate bodies.

[0046] In order to prevent this, it is important to arrange the lens holding member 80 so that the bottom surface 84 of the lens holding member 80 is parallel to the glass epoxy substrate 20 regardless of the amount of adhesive 70 applied or the load of the lens holding member 80. Therefore, in the optical sensor module of the first embodiment, Figure 1 as well as Figure 2 As shown, protrusions 82 having the same height are provided on the bottom surface 84 of four corners of the lens holding member 80 to which the lens 90 is fixed.

[0047] Thus, a space corresponding to the height of the protrusion 82 is formed between the glass epoxy substrate 20 and the bottom surface 84 of the lens holding member 80. Therefore, compared with a case where the bottom surface of the lens holding member is a flat surface and there is no protrusion 82, the volume of the adhesive 70 that is crushed by the lens holding member 80 and comes out from under the bottom surface 84 of the lens holding member 80 and wets and spreads to the inside of the lens holding member 80 can be suppressed. Figure 3 In the optical sensor module without protrusions of the comparative example shown in FIG. 1 , the adhesive 70 that has wetted and spread to the inner side of the lens holding member 80 has a shape close to a semicircle. In contrast, in the optical sensor module 101 of the first embodiment, the adhesive 70 that has wetted and spread to the inner side of the lens holding member 80 has a shape close to a semicircle. Figure 4 The adhesive 70 on the inner side is shaped close to a fan, so the distance A of the adhesive 70 wetting and spreading to the surface of the glass epoxy substrate 20 can be suppressed. Therefore, the adhesive 70 squashed by the lens holding member 80 and wetting and spreading to the inner side of the lens holding member 80 can be suppressed from contacting the wiring member on the inner side of the lens holding member 80.

[0048] In addition, by setting the heights of the protrusions 82 formed at four locations to be the same and making the tips of the protrusions 82 abut against the glass epoxy substrate 20, the lens holding member 80 can be prevented from tilting relative to the glass epoxy substrate 20. Therefore, the lens 90 formed and fixed integrally with the lens holding member 80 can be prevented from tilting relative to the infrared detection element 10 bonded to the glass epoxy substrate 20. At this time, by setting the shape of the protrusions 82 to be a truncated cone whose bottom diameter is smaller than the width of the bottom surface 84 of the lens holding member 80, when the lens holding member 80 is arranged on the adhesive 70, even with a very small load, the tips of the protrusions 82 can push the adhesive 70 away and abut against the surface of the glass epoxy substrate 20 after contacting the adhesive 70. Figure 5 The cross section of the lens holding member 80 is shown in which the protrusions 82 are provided on the bottom surface 84 and the lens holding member 80 is bonded to the glass epoxy substrate 20 with the adhesive 70 .

[0049] In addition, since the linear expansion coefficients of the glass epoxy resin, which is the main material of the epoxy glass substrate 20, and the thermoplastic plastic, which is the main material of the lens holding component 80, are different, stress is generated in the bonding portion due to the driving of the infrared detection element or the temperature change of the surroundings. Since the stress is generated more repeatedly as the optical sensor module is used for a longer time, the bonding portion may be damaged or peeled off due to fatigue. As a result, the position of the lens holding component 80 also changes, causing the relative position of the light receiving part of the infrared detection element 10 and the focusing point of the lens 90 to change, which may cause the infrared detection element 10 to be unable to take pictures, the image to be missing, or the inability to focus.

[0050] In the optical sensor module of the first embodiment, the adhesive 70 wets and spreads into the space between the glass epoxy substrate 20 and the bottom surface 84 of the lens holding member 80 formed corresponding to the height of the protrusion 82, thereby making the adhesive 70 thicker than the optical sensor module without the protrusion. As a result, the shear strain generated in the adhesive 70 due to the difference in linear expansion coefficient between the glass epoxy substrate 20 and the lens holding member 80 can be reduced compared with the optical sensor module without the protrusion, so that the life of the bonding portion by the adhesive 70 can be extended.

[0051] The projections 82 may be formed in any number and in any shape on any portion of the bottom surface 84 of the lens holding member 80 that is bonded to the adhesive 70. Figure 6A top view of Figure 6 The cross-sectional view at the A-A position Figure 7 As shown in FIG. 1 , cylindrical protrusions may be provided at eight locations, in the center of each corner and each side of the lens holding member 80. Alternatively, prism-shaped protrusions may be provided. Alternatively, Figure 8 A top view of Figure 8 The cross-sectional view at the A-A position Fig. 9 As shown in FIG. 1 , a triangular pyramid-shaped protrusion may be provided at a total of four locations in the center of each side of the lens holding member 80. Alternatively, a quadrangular pyramid-shaped protrusion may be provided.

[0052] When the lens holding member 80 is disposed on the adhesive 70, if a protrusion 82 is formed at a portion where the end contacts the adhesive 70, the protrusion 82 is preferably shaped such that the area of ​​the end is sufficiently smaller than the bottom surface 84 of the lens holding member 80 so that the protrusion 82 can push the adhesive 70 away and contact the surface of the epoxy glass substrate 20 even with a very small load. For example, it is preferably a cylindrical shape or a prism such as a column whose side length is less than the square of the width of the bottom surface 84, a cone such as a cone, a pyramid, a truncated cone, a truncated cone such as a truncated pyramid. A cone or a truncated cone whose cross-sectional area decreases from the bottom surface 84 to the end is particularly preferred because it is easy to be pulled out from a metal mold and easy to push the adhesive 70 away when the lens holding member 80 is formed by injection molding. In addition, it may be a protrusion having a curved surface such as a hemisphere.

[0053] Furthermore, when the lens holding member 80 is disposed on the adhesive 70 applied on the glass epoxy substrate 20 , three or more protrusions 82 having the same height are required in order to make the lens 90 formed integrally with the lens holding member 80 parallel to the glass epoxy substrate 20 .

[0054] In addition, if Fig.10 As shown in the enlarged cross-sectional view of FIG, if the protrusion 82 is formed in a manner that the corners of the ends of the protrusion 82 that contact the adhesive 70 and the epoxy glass substrate 20 are rounded, the stress generated by the temperature change of the optical sensor module 101 is not concentrated on the corners of the ends of the protrusion 82. Therefore, the adhesive is prevented from being peeled off from the inner periphery of the lens holding member due to the stress concentration caused by the thermal stress, and the life of the optical sensor module 101 can be extended. In addition, since the positional displacement of the lens holding member 80 in the height direction can also be prevented, it is more preferable.

[0055] Furthermore, if the surface roughness of the bottom surface 84 of the lens holding member 80 is set to be rougher than other parts of the lens holding member 80, the bonding strength between the lens holding member 80 and the adhesive 70 becomes greater, so that the bonding reliability can be improved, which is more preferable.

[0056] Furthermore, if the surface roughness of the tip of the protrusion 82 that contacts the glass epoxy substrate 20 is set to be rougher than the other surfaces of the lens holding member 80, the friction between the glass epoxy substrate 20 and the lens holding member 80 becomes larger. Therefore, it is possible to suppress the positional displacement of the light receiving portion of the infrared detection element 10 and the optical center of the lens 90 caused by the positional displacement of the lens holding member 80 due to the curing shrinkage of the adhesive 70, which is more preferable.

[0057] As described above, according to the optical sensor module 101 of the first embodiment, the protrusion 82 is provided on the bottom surface 84, which is the bonding surface of the lens holding member 80 bonded with the adhesive 70, so that a space is formed between the glass epoxy substrate 20 and the bottom surface 84 of the lens holding member 80 corresponding to the height of the protrusion 82. As a result, the volume of the adhesive 70 that wets and spreads to the inside of the lens holding member 80 can be suppressed. In addition, even if the adhesive 70 wets and spreads to the inside of the lens holding member 80, the wet and spread adhesive 70 has a shape close to a fan, so that the distance A of the adhesive 70 wet and spread on the surface of the glass epoxy substrate 20 can be suppressed. Therefore, the adhesive 70 that wets and spreads to the inside of the lens holding member 80 can be prevented from contacting the wiring member inside the lens holding member 80. In addition, by setting the heights of the plurality of protrusions 82 to be the same and making the ends of the protrusions 82 contact the glass epoxy substrate 20, it is possible to prevent the lens 90 formed integrally with the lens holding member 80 from tilting relative to the infrared detection element 10, thereby preventing the infrared detection element 10 from being unable to capture images, missing images, or being unable to focus. In addition, since the adhesive 70 is thicker than in an optical sensor module without protrusions, the shear strain generated in the adhesive 70 due to the difference in linear expansion coefficients between the glass epoxy substrate 20 and the lens holding member 80 can be reduced, thereby achieving a longer life of the bonding portion by the adhesive 70, and a high-quality optical sensor module 101 can be obtained.

[0058] Implementation Method 2

[0059] Fig.11 is a plan view showing a schematic structure of an optical sensor module 102 according to Embodiment 2. Fig.12 yes Fig.11 A cross-sectional view at the position A-A of the optical sensor module 102 of the second embodiment basically has the same structure as the optical sensor module 101 in the first embodiment, but is different in the following aspects. Here, the differences are mainly described, and the description of the same components is omitted. In addition, Fig.11 as well as Fig.12 This is a schematic diagram showing only the basic components of the optical sensor module 102, and description of other components is omitted.

[0060] In the first embodiment, after the bottom surface 84 of the lens holding member 80 is bonded to the entire periphery with the adhesive 70, the inside of the lens holding member 80 is made vacuum to seal the infrared detection element 10. In contrast, in the second embodiment, Fig.11 as well as Fig.12 As shown, the light-transmitting plate 15 as a light-transmitting component is bonded to the infrared detection element 10 at a distance from the surface of the infrared detection element 10 via a frame 151. The difference from the first embodiment is that the infrared detection element 10 is sealed by setting the space formed between the infrared detection element 10 and the light-transmitting plate 15 to be vacuum, and the lens holding component 80 is not vacuum-sealed.

[0061] The light-transmitting plate 15, which is made of the same infrared-transmitting material as the lens 90, that is, silicon, is coated with metal at the portion joined to the frame 151, and is welded to the frame 151 joined to the surface of the infrared detection element 10. In this way, the light-transmitting plate 15 is fixed to the light incident side of the light-receiving portion of the infrared detection element 10 and becomes one with the infrared detection element 10, thereby covering the light-receiving portion of the infrared detection element 10. The interior surrounded by the infrared detection element 10, the frame 151, and the light-transmitting plate 15 is vacuum-sealed. In addition, although the light-transmitting plate 15 transmits infrared rays, it does not transmit visible light, so the light-receiving portion of the infrared detection element 10 cannot be observed through the light-transmitting plate 15.

[0062] In the second embodiment, the positions where the bottom surface 84 of the lens holding component 80 and the epoxy glass substrate 20 are bonded with the adhesive 70 are only set at the four corners of the lens holding component 80, and protrusions 82 of the same height are set at a total of four locations on the bottom surface 84 of the lens holding component 80 in the center of each side of the lens holding component 80.

[0063] Since the infrared detection element 10 is vacuum-sealed by the light-transmitting plate 15, it is not necessary to vacuum-seale the inside of the lens holding member 80, and therefore it is not necessary to bond the entire circumference of the bottom surface 84 of the lens holding member 80 with the adhesive 70. The adhesive 70 only needs to be applied to a degree that the bonded portion does not break or peel due to fatigue, for example, Fig.11 as well as Fig.12As shown in FIG. 1 , it is also possible to apply the coating only to the four corners of the lens holding member 80. In this case, by providing the edge portions 81 only at the four corners of the lens holding member 80 bonded by the adhesive 70, the area of ​​the bottom surface 84 can be reduced by the amount of reduction in the bonding area of ​​the lens holding member 80, thereby achieving the miniaturization of the entire optical sensor module 102. In addition, compared with the case where the entire periphery is bonded by the adhesive 70, the bonding area of ​​the adhesive 70 becomes smaller, so the shear strain generated in the adhesive 70 due to the difference in linear expansion coefficient between the epoxy glass substrate 20 and the lens holding member 80 is reduced. Therefore, the effect of the optical sensor module disclosed in the present application, such as the extension of the life of the bonding portion by the adhesive 70, is more effective.

[0064] And, if Fig.11 as well as Fig.12 As shown in the figure, the protrusions 82 are provided at four locations in the center of each side of the lens holding member 80, etc., so that it becomes easy to provide the protrusions 82 in the part where the adhesive 70 is not applied, so the shape of the protrusions 82 can be selected more freely. In addition, since the adhesive does not enter between the tip of the protrusion 82 and the epoxy glass substrate 20, the tip of the protrusion 82 can be reliably abutted against the surface of the epoxy glass substrate 20. As a result, the effect of preventing the lens 90 formed integrally with the lens holding member 80 from tilting relative to the infrared detection element 10 bonded to the epoxy glass substrate 20, which causes the inability to capture images, image loss, or inability to focus, is also more reliable.

[0065] In the above description, although bonding is performed only at the four corners instead of the entire circumference of the bottom surface 84 of the lens holding member 80, in a structure in which vacuum sealing is performed by the light-transmitting plate 15 and the frame 151, the entire circumference of the bottom surface 84 of the lens holding member 80 may be bonded by the adhesive 70 in the same manner as described in Embodiment 1. Even in this case, since it is not necessary to vacuum-seal the interior of the lens holding member 80, the bonding does not need to be airtight.

[0066] Implementation 3

[0067] Fig.13 is a plan view showing a schematic structure of an optical sensor module 103 according to Embodiment 3. Fig.14 yes Fig.13 The optical sensor module 103 of the third embodiment basically has the same structure as the optical sensor module 101 of the first embodiment, but is different in the following aspects. Here, only the differences are described, and the description of the same components is omitted. In addition, Fig.13 as well as Fig.14 This is a schematic diagram showing only the basic components of the optical sensor module 103, and description of other components is omitted.

[0068] In this embodiment 3, if Fig.13 as well as Fig.14 As shown in FIG. 1 , at the tip of the protrusion 82 provided on the bottom surface 84 of the lens holding member 80, a positioning protrusion 82a having a truncated cone shape is formed integrally with the protrusion 82 from the tip of the protrusion 82. A positioning hole 21 is formed at a position of the epoxy glass substrate 20 opposite to the positioning protrusion 82a, and the bottom surface 84 of the lens holding member 80 and the epoxy glass substrate 20 are bonded together in a state where the positioning protrusion 82a is inserted into the positioning hole 21.

[0069] When the lens holding member 80 is disposed on the adhesive 70 applied to the glass epoxy substrate 20, after the positioning protrusion 82a is inserted into the positioning hole 21, the tip of the protrusion 82 abuts against the glass epoxy substrate 20, and the glass epoxy substrate 20 and the lens holding member 80 are bonded by the adhesive 70. Thus, for example, when the lens holding member 80 is disposed on the adhesive 70 applied to the glass epoxy substrate 20, even if the position of the lens holding member 80 is slightly moved or rotated due to the deformation of the adhesive 70, the lens holding member 80 can be bonded without displacement because the positioning protrusion 82a is inserted into the positioning hole 21.

[0070] Furthermore, by setting the diameter of the bottom surface of the positioning protrusion 82a to be the same as the diameter of the positioning hole 21, even if the adhesive 70 shrinks when the lens holding member 80 is bonded, or the adhesive 70 deforms due to the driving of the optical sensor module 103 or the ambient temperature change, the positioning protrusion 82a inserted into the positioning hole 21 contacts the entrance of the positioning hole 21 at the bottom surface portion, so that the relative position of the positioning protrusion 82a and the positioning hole 21 does not change. Therefore, it is possible to prevent the position of the lens holding member 80 from changing, thereby preventing the relative position of the light receiving portion of the infrared detection element 10 and the light focusing point of the lens 90 from changing, thereby preventing the occurrence of defects such as failure to capture images, image loss, or failure to focus.

[0071] As described above, by forming the positioning protrusion 82a at the end of the protrusion 82, forming the positioning hole 21 in the epoxy glass substrate 20, and inserting the positioning protrusion 82a into the positioning hole 21, the lens holding member 80 can be reliably positioned on the epoxy glass substrate 20. In addition, during bonding, the position of the lens holding member 80 will not be shifted due to the deformation of the adhesive 70 after bonding or the thermal stress caused by the temperature change, so the position of the light receiving part of the infrared detection element 10 and the optical center of the lens 90 can be prevented from being shifted.

[0072] In the third embodiment, the protrusions 82 are formed at the four corners of the lens holding member 80, and the positioning protrusions 82a are provided on each of the protrusions 82, and the positioning holes 21 are formed at positions of the epoxy glass substrate that are opposite to the positioning protrusions 82a. However, the present invention is not limited thereto, and the protrusions 82 having the positioning protrusions 82a may be provided at eight positions in the center of each corner and each side of the lens holding member 80, or may be provided at four positions in the center of each side of the lens holding member 80. In addition, the positioning protrusions 82a may be provided only on a part of the protrusions 82 instead of on all the protrusions 82. However, in order to obtain the effect of positioning the lens holding member 80 on the epoxy glass substrate 20 and preventing the positional deviation of the lens holding member 80 during and after bonding, the positioning protrusions 82a and the positioning holes 21 are arranged at positions that are opposite to each other, and at least two or more positions are arranged.

[0073] Furthermore, as in the second embodiment, the light-transmitting plate 15 as a light-transmitting component may be welded to the infrared detection element 10, and the space formed between the infrared detection element 10 and the light-transmitting plate 15 may be set to a vacuum state to seal the infrared detection element 10, while the lens holding component 80 may be set to a structure that is not vacuum-sealed. Since it is not necessary to vacuum-seal the lens holding component 80, it is not necessary to apply the adhesive 70 to the entire circumference of the bottom surface 84 of the lens holding component 80, and it is easy to set the protrusion 82 at a position where the adhesive 70 is not applied. Furthermore, the effect of the third embodiment, which can prevent the adhesive 70 from leaking from the positioning hole 21 to the back side of the epoxy glass substrate 20 and can prevent the position of the lens holding component 80 from shifting during and after bonding by positioning the lens holding component 80 on the epoxy glass substrate 20, is more reliable.

[0074] Although various illustrative embodiments and examples are described in this application, the various features, forms, and functions described in one or more embodiments are not limited to the application of a specific embodiment, and can also be applied to the embodiment alone or in various combinations. Therefore, countless unillustrated variations can be imagined within the technical scope disclosed in the specification of this application. For example, it includes the case where at least one constituent element is deformed, added, or omitted, and also includes the case where at least one constituent element is extracted and combined with the structural elements of other embodiments.

[0075] Description of Reference Numerals

[0076] 10...infrared detection element (light detection element); 15...light-transmitting plate (light-transmitting component); 20...epoxy glass substrate (substrate); 20a...epoxy glass base material; 20b, 20c...electrode pattern; 21...positioning hole; 60...Ag paste; 70...adhesive; 80...lens holding component; 82...protrusion; 82a...positioning protrusion; 84...bottom surface; 90...lens; 101, 102, 103...optical sensor module.

Claims

1. A light sensor module, The optical sensor module comprises: a substrate having an electrode pattern formed on a surface thereof; a light detecting element for detecting light, electrically connected to the electrode pattern and fixed to the substrate; and A lens holding component, the lens holding component is a box having a flat upper surface portion, a side portion connected to the outer edge of the upper surface portion, and an opening portion surrounded by the side portion, a lens is fixed to the upper surface portion, and a bottom surface of the side portion is bonded to the substrate by an adhesive at a position surrounding the light detection element, The optical sensor module is characterized in that The side portion of the lens holding component is bonded to the bottom surface of the substrate and has dispersedly arranged protrusions, the protrusions have a surface at the end and the surface roughness of the end is rougher than the surface roughness of other surfaces of the lens holding component, the end of the protrusion is in contact with the substrate, and the adhesive wets and diffuses in the space formed between the substrate and the bottom surface of the side portion through the protrusions.

2. The optical sensor module according to claim 1, characterized in that: The light incident side of the light detection element is vacuum-sealed by a member including a light-transmitting member.

3. The optical sensor module according to claim 1, characterized in that: There are three or more protrusions.

4. The optical sensor module according to claim 1, wherein: The cross-sectional area of ​​the protrusion in a section parallel to the bottom surface of the side portion is narrower at the distal end than at the bottom.

5. The optical sensor module according to claim 4, characterized in that: The protrusion is in the shape of a truncated cone or a truncated pyramid.

6. The optical sensor module according to claim 1, wherein: The protrusion is in a columnar shape.

7. The optical sensor module according to any one of claims 4 to 6, characterized in that: Corners of the protrusions are rounded.

8. The optical sensor module according to any one of claims 1 to 6, characterized in that: A positioning protrusion is provided which protrudes from a distal end of the protrusion and is inserted into a positioning hole provided in the substrate.

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