Circuit board assembly and electronic device

Abstract

The present application discloses a circuit board assembly and an electronic device, belonging to the technical field of electronic products. The circuit board assembly includes: a first rigid-flexible printed circuit board, the first rigid-flexible printed circuit board includes a rigid board layer and a flexible board layer which are stacked, the rigid board layer covers the surface of the flexible board layer, the flexible board layer includes a flexible substrate and a heat conduction layer, the heat conduction layer covers the surface of the flexible substrate, a first electronic device is provided on the first rigid-flexible printed circuit board, the heat conduction layer has a heat dissipation area, and the heat dissipation area does not cover the rigid board layer; a first circuit board, a first cavity is formed by enclosing between the first circuit board and the first rigid-flexible printed circuit board, the heat dissipation area is located outside the first cavity, and the first electronic device is located inside the first cavity.

Description

Technical Field

[0001] This application relates to the technical field of electronic products, and particularly to a circuit board assembly and an electronic device. Background Art

[0002] With the continuous development of electronic devices, the functions of electronic devices are also constantly improving. Correspondingly, the power consumption required by the circuit boards in electronic devices is also increasing continuously, which in turn leads to an increase in the heat generated during the operation of electronic devices. Since the heat generated by electronic devices increases, and the heat dissipation capacity of the heat dissipation components in electronic devices is limited, it may cause the phenomenon of overheating during the operation of electronic devices. It can be seen that the existing electronic devices have the problem of poor heat dissipation effect. Summary of the Invention

[0003] This application provides a circuit board assembly and an electronic device, which can improve the heat dissipation effect of the electronic device.

[0004] In order to solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, an embodiment of this application provides a circuit board assembly, including:

[0006] A first rigid-flexible printed circuit board, the first rigid-flexible printed circuit board includes a rigid board layer and a flexible board layer arranged in a stacked manner, the rigid board layer covers the surface of the flexible board layer, the flexible board layer includes a flexible substrate and a heat conduction layer, the heat conduction layer covers the surface of the flexible substrate, a first electronic device is provided on the first rigid-flexible printed circuit board, the heat conduction layer has a heat dissipation area, and the heat dissipation area does not cover the rigid board layer;

[0007] A first circuit board, a first cavity is formed between the first circuit board and the first rigid-flexible printed circuit board, the heat dissipation area is located outside the first cavity, and the first electronic device is located inside the first cavity.

[0008] In a second aspect, an embodiment of this application provides an electronic device, including the circuit board assembly described in the first aspect above.

[0009] In the embodiment of this application, since the rigid-flexible printed circuit board includes a heat conduction layer, and the heat conduction layer includes a heat dissipation area located outside the first cavity. In this way, the heat generated by the first electronic device located inside the first cavity during operation can be conducted to the heat dissipation area through the heat conduction layer for heat dissipation, thereby improving the heat dissipation effect of the electronic device including the circuit board assembly. Further, the stacking thickness and the usage amount of board-to-board connectors can be reduced in a multi-layer circuit board, thereby reducing the size of the electronic device. Description of the Drawings

[0010] Figure 1It is one of the schematic diagrams of the results of the circuit board assembly provided by the embodiments of the present application;

[0011] Figure 2 It is the second of the schematic diagrams of the results of the circuit board assembly provided by the embodiments of the present application;

[0012] Figure 3 It is the third of the schematic diagrams of the results of the circuit board assembly provided by the embodiments of the present application;

[0013] Figure 4 It is the fourth of the schematic diagrams of the results of the circuit board assembly provided by the embodiments of the present application;

[0014] Figure 5 It is the fifth of the schematic diagrams of the results of the circuit board assembly provided by the embodiments of the present application;

[0015] Figure 6 It is the sixth of the schematic diagrams of the results of the circuit board assembly provided by the embodiments of the present application;

[0016] Figure 7 It is the unfolded schematic diagram of the first rigid-flexible printed circuit board in the embodiments of the present application;

[0017] Figure 8 It is one of the schematic diagrams of the structure of a connection end of the first rigid-flexible printed circuit board in the embodiments of the present application;

[0018] Figure 9 It is the second of the schematic diagrams of the structure of a connection end of the first rigid-flexible printed circuit board in the embodiments of the present application;

[0019] Figure 10 It is one of the schematic diagrams of the structure of the second rigid-flexible printed circuit board in the embodiments of the present application;

[0020] Figure 11 It is the second of the schematic diagrams of the structure of the second rigid-flexible printed circuit board in the embodiments of the present application;

[0021] Figure 12 It is the connection schematic diagram of the first circuit board assembly and the second circuit board assembly in the embodiments of the present application. Detailed implementation manners

[0022] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, rather than all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0023] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0024] With the continuous development of electronic devices, the functions of electronic devices are becoming more and more perfect. Correspondingly, the number of devices that need to be installed in electronic devices also increases accordingly. Therefore, it is usually necessary to increase the size of the circuit board inside the electronic device so that the circuit board can provide more installation space. Based on this, the related art proposes that the installation space of the circuit board can be increased by stacking multiple layers of circuit boards. However, in a multi-layer stacked circuit board, a relatively closed space is usually formed between two adjacent circuit boards. This will cause the heat generated by the electronic devices installed between the two adjacent circuit boards to be difficult to dissipate. It can be seen that the existing multi-layer stacked circuit boards have the problem of poor heat dissipation effect.

[0025] Based on this, an embodiment of the present application provides a circuit board assembly and an electronic device to solve the problem of poor heat dissipation effect of existing multi-layer stacked circuit boards.

[0026] The circuit board assembly and the electronic device provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0027] See also Figure 1-11 , is a schematic diagram of the structure of a circuit board assembly provided in an embodiment of the present application, wherein the circuit board assembly comprises:

[0028] A first rigid-flexible board 110, wherein the first rigid-flexible board 110 comprises a rigid board layer 111 and a flexible board layer 112 which are stacked, wherein the rigid board layer 111 covers the surface of the flexible board layer 112, wherein the flexible board layer 112 comprises a flexible substrate 1122 and a heat-conducting layer 1121, wherein the heat-conducting layer 1121 covers the surface of the flexible substrate 1122, wherein a first electronic device 130 is disposed on the first rigid-flexible board 110, and the electronic device is electrically connected to the heat-conducting layer 1121, and the heat-conducting layer 1121 has a heat dissipation region 113, and the heat dissipation region 113 does not cover the rigid board layer 111;

[0029] The first circuit board 140 and the first flexible-rigid printed circuit board 110 enclose a first cavity therebetween. The heat dissipation area 113 is located outside the first cavity, and the first electronic device 130 is located inside the first cavity.

[0030] Among them, the first flexible-rigid printed circuit board 110 can be various types of flexible-rigid printed circuit boards in the prior art. Please refer to Figure 1 , and the rigid board layers 111 can be respectively covered on both sides of the flexible board layer 112. It can be understood that the above-mentioned heat conduction layer 1121 can adopt a flexible conductive and heat-conductive etched metal layer, generally a copper layer, or a mixed metal laminate such as gold plating or nickel plating. In this way, different electronic devices disposed on the first flexible-rigid printed circuit board 110 can be electrically connected through the heat conduction layer 1121. At the same time, the heat generated by the electronic devices disposed on the first flexible-rigid printed circuit board 110 during operation can also be conducted to the heat dissipation area through the heat conduction layer 1121 for heat dissipation.

[0031] Please refer to Figure 1 , the first flexible-rigid printed circuit board 110 and the first circuit board 140 can form a multi-layer stacked circuit board, and the first flexible-rigid printed circuit board 110 and the first circuit board 140 can be respectively used to mount various devices in the electronic device, and the first flexible-rigid printed circuit board 110 and the first circuit board 140 can be electrically connected. For example, please refer to Figure 1 , the circuit board assembly can further include an annular connection board 200. The first flexible-rigid printed circuit board 110 is electrically connected to the first circuit board 140 through the connection board 200, and the first flexible-rigid printed circuit board 110, the connection board 200, and the first circuit board 140 jointly enclose the first cavity. Among them, the connection board 200 can be an interposer.

[0032] In addition, the first flexible-rigid printed circuit board 110 can also be directly electrically connected to the first circuit board 140. For example, please refer to Figure 3 , a groove is formed on one side of the first circuit board 140 facing the first flexible-rigid printed circuit board 110, and the first circuit board 140 is directly welded to the first flexible-rigid printed circuit board 110 to enclose the first cavity. Among them, the first circuit board 140 can be a Cavity connection board 200.

[0033] Please refer to Figure 1, since a part of the first flexible-rigid printed circuit board 110 forms a cavity wall of the first cavity. Therefore, the heat in the first cavity can be conducted to the heat dissipation device 120 through the flexible board layer 112 of the first flexible-rigid printed circuit board 110, that is, the heat generated during the operation of the electronic devices in the first cavity can be conducted to the heat dissipation device 120 through the flexible board layer 112 of the first flexible-rigid printed circuit board 110, thereby realizing the heat dissipation of the electronic devices in the first cavity. Among them, the electronic devices in the first cavity may include the first electronic device 130 mounted on the first flexible-rigid printed circuit board 110, or may be various electronic devices mounted on the first circuit board 140.

[0034] The above-mentioned first circuit board 140 may be various types of circuit boards commonly used in the prior art. In addition, the first circuit board 140 may also be a flexible-rigid printed circuit board. The number of the above-mentioned first electronic devices 130 may be multiple, and the multiple first electronic devices 130 may include various different types of electrical components in the electronic device.

[0035] The above-mentioned first electronic device 130 may be various electronic components in the electronic device. It can be understood that different electronic components in the electronic device can be connected through the first flexible-rigid printed circuit board 110 to form various circuits. Among them, the first electronic device 130 may be directly electrically connected to the flexible board layer 112. In addition, the first electronic device 130 may also be electrically connected to the flexible board layer 112 through the rigid board layer 111 covering the surface of the flexible board layer 112. In this way, different electronic components can be electrically conducted through the flexible board layer 112 of the first flexible-rigid printed circuit board 110.

[0036] Please refer to Figure 8 , the flexible board layer 112 may include a flexible substrate 1122 and heat conduction layers 1121 covering both sides of the flexible substrate 1122. The heat dissipation area 113 may be the area where the flexible board layer 112 does not cover the rigid board layer 111.

[0037] In this embodiment, since the flexible-rigid printed circuit board 110 includes the heat conduction layer 1121, and the heat conduction layer 1121 includes the heat dissipation area 113 located outside the first cavity. In this way, the heat generated during the operation of the first electronic device 130 located in the first cavity can be conducted to the heat dissipation area 113 through the heat conduction layer 1121 for heat dissipation, thereby improving the heat dissipation effect of the electronic device including the circuit board assembly. That is, the heat dissipation effect of the multi-layer stacked circuit board can be improved.

[0038] Optionally, the circuit board assembly further includes a heat dissipation device 120, and the heat dissipation device 120 is disposed in the heat dissipation area 113.

[0039] The above heat dissipation device 120 can be various components for heat dissipation in an electronic device. For example, it can be a housing, a bracket, a vapor chamber, etc. in the electronic device. In this way, the heat generated during the operation of the electronic device can be conducted to the heat dissipation component for heat dissipation. In addition, the heat dissipation device 120 can also be an electronic device in the electronic device that generates less heat during operation. For example, it can be a battery 310, a speaker, etc. In this way, the heat in each part of the electronic device can be balanced, and the problem of local high temperature can be avoided.

[0040] It can be understood that when the heat dissipation device 120 is an electronic device, the heat dissipation device 120 can be electrically connected to the first flexible-rigid printed circuit board 110 based on its own terminals while being thermally conductive connected to the heat dissipation area 113. To realize conducting the heat dissipation device 120 and other electronic devices in the electronic device through the first flexible-rigid printed circuit board 110.

[0041] In this embodiment, the heat dissipation device 120 can be directly attached to the heat dissipation area 113 or can be connected through a heat conductive component. In this way, the heat generated during the operation of the electronic device connected to the first flexible-rigid printed circuit board 110 can be directly conducted to the heat dissipation area 113 through the heat conductive layer 1121 of the flexible board layer 112, and the heat conducted to the heat dissipation area 113 can be further conducted to the heat dissipation device 120, so as to realize heat dissipation of the heat generated during the operation of the electronic device.

[0042] Optionally, the heat conductive layer 1121 has a heat conductive area 114, the heat conductive area 114 does not cover the rigid board layer 111, and the heat conductive area 114 is located in the first cavity;

[0043] The first cavity is filled with a first insulating heat conductive medium 150.

[0044] Among them, the first insulating heat conductive medium 150 can be various types of insulating heat conductive media in the prior art. For example, it can be heat conductive silicone grease. The electronic device in the first cavity can be connected to the heat conductive area 114 through the first insulating heat conductive medium 150. For example, the first cavity can be filled with the first insulating heat conductive medium 150. In this way, the heat generated during the operation of the electronic device in the first cavity can be conducted to the heat conductive area 114 through the first insulating heat conductive medium 150, and the heat conducted to the heat conductive area 114 can be conducted to the heat dissipation area 113 through the flexible board layer 112. Then, the heat in the heat dissipation area 113 can be further conducted to the heat dissipation device 120 for heat dissipation.

[0045] The above-mentioned first flexible-rigid combination board 110 or the first circuit board 140 may be provided with an injection hole 141 and an exhaust hole 142 for injecting the first insulating and heat-conducting medium 150. For example, please refer to Figure 1 , in an embodiment of the present application, injection holes 141 and exhaust holes 142 for communicating with the first cavity are respectively formed on the surface of the first circuit board 140. In this way, the first insulating and heat-conducting medium 150 can be injected into the first cavity through the injection holes 141, so that during the injection process, the air in the first cavity can be discharged through the exhaust holes 142.

[0046] In this embodiment, by filling the first insulating and heat-conducting medium 150 in the first cavity, the heat generated by the electronic devices inside the first cavity can be quickly conducted to the heat-conducting area 114 through the first insulating and heat-conducting medium 150, which is beneficial to further improving the heat dissipation effect of the electronic devices in the first cavity.

[0047] In the related art, since different components of an electronic device may affect each other during operation, generally, a shielding cover is provided inside the existing electronic device to isolate the components that may affect each other through the shielding cover. However, since the shielding cover usually needs to be sealed at a specific position of the circuit board to isolate the electronic devices installed at the specific position, usually, a closed space is formed between the shielding cover and the circuit board, and the heat generated by the electronic devices inside the shielding cover is usually difficult to dissipate. This leads to the problem of poor heat dissipation effect inside the shielding cover.

[0048] Based on this, in an optional embodiment of the present application, the circuit board assembly further includes a first shielding cover 180. The first shielding cover 180 is located on the side of the first flexible-rigid combination board 110 facing away from the first circuit board 140, and the first shielding cover 180 is connected to the first flexible-rigid combination board 110. A second cavity is formed by enclosing between the first shielding cover 180 and the first flexible-rigid combination board 110;

[0049] A second electronic device 160 is provided on the first flexible-rigid combination board 110. The second electronic device 160 is located inside the second cavity, and a second insulating and heat-conducting medium 170 is provided inside the second cavity.

[0050] Among them, the number of the second electronic devices 160 may be multiple, and the multiple second electronic devices 160 may include various different types of electrical components in the electronic device.

[0051] The above-mentioned second insulating and heat-conducting medium 170 can be various types of insulating and heat-conducting media in the prior art. For example, it can be heat-conducting silicone grease. The second electronic device 160 can be connected to the first shielding cover 180 through the second insulating and heat-conducting medium 170. In this way, the heat generated during the operation of the second electronic device 160 can be quickly conducted to the first shielding cover 180 through the second insulating and heat-conducting medium 170 for heat dissipation through the first shielding cover 180.

[0052] It can be understood that an injection hole 141 for injecting the second insulating and heat-conducting medium 170 into the second cavity can also be provided on the first shielding cover 180. Please refer to Figure 1 In an embodiment of the present application, an injection hole 141 is provided on the first shielding cover 180. After injecting the second insulating and heat-conducting medium 170 into the second cavity through the injection hole 141 of the first shielding cover 180, a sealing plate 190 for closing the injection hole 141 can be connected to the first shielding cover 180.

[0053] In this embodiment, by connecting the first shielding cover 180 to the first flexible-rigid printed circuit board 110, the heat generated by the second electronic device 160 inside the first shielding cover 180 can be conducted to the heat dissipation device 120 through the flexible board layer 112 of the first flexible-rigid printed circuit board 110, thereby improving the heat dissipation effect of the second electronic device 160 inside the first shielding cover 180.

[0054] Optionally, please refer to Figure 3 In an embodiment of the present application, the circuit board assembly further includes a second shielding cover 330. The second shielding cover 330 is located on the side of the first circuit board 140 facing away from the first flexible-rigid printed circuit board 110, and the second shielding cover 330 is connected to the first circuit board 140. A third cavity is formed by enclosing between the second shielding cover 330 and the first circuit board 140;

[0055] A seventh electronic device 340 is provided on the side of the first circuit board 140 facing away from the first flexible-rigid printed circuit board 110. The third cavity is filled with a third insulating and heat-conducting medium 350. The seventh electronic device 340 is connected to the second shielding cover 330 through the third insulating and heat-conducting medium 350.

[0056] In this embodiment, by connecting the second shielding cover 330 to the first circuit board 140, the heat generated by the seventh electronic device 340 inside the second shielding cover 330 can be quickly conducted to the second shielding cover 330 through the third insulating and heat-conducting medium 350 for heat dissipation through the second shielding cover 330.

[0057] Optionally, the flexible board layer 112 includes a first segment 1124 that does not cover the rigid board layer 111. The first segment 1124 includes a winding portion wound around the heat dissipation device 120, and the heat dissipation area 113 is located in the winding portion.

[0058] Specifically, since the flexible board layer 112 forms the flexible board layer of the rigid-flex board, the flexible board layer 112 can adopt a flexible circuit board. Since the first segment 1124 of the flexible board layer 112 does not cover the rigid board layer 111, that is, the first segment 1124 does not cover the rigid board layer. Therefore, the first segment 1124 can be arbitrarily wound inside the electronic device. In this way, more electronic devices in the electronic device can be electrically connected to the first rigid-flex board 110 by winding the first segment 1124 inside the electronic device, so as to realize the interconnection between more electronic devices in the electronic device based on the first rigid-flex board 110.

[0059] In addition, the first segment 1124 can be wound around the heat dissipation device 120, where the winding portion can be wound in contact with the heat dissipation device 120.

[0060] In this embodiment, by winding the first segment 1124 of the flexible board layer 112 around the heat dissipation device 120, the contact area between the heat dissipation device 120 and the first segment 1124 can be increased, that is, the area of the heat dissipation area 113 can be increased, so as to further improve the heat dissipation effect during the heat dissipation process based on the first rigid-flex board 110.

[0061] Optionally, the circuit board assembly includes at least two of the heat dissipation devices 120.

[0062] Specifically, the heat dissipation area 113 can include at least two heat conduction sub-areas, where one heat conduction sub-area corresponds to one heat dissipation device 120, and the heat dissipation device 120 is connected to the heat conduction sub-area corresponding to the heat dissipation device 120.

[0063] Since the at least two heat dissipation devices 120 are usually distributed at different positions inside the electronic device. Therefore, in an embodiment of the present application, the first segment 1124 of the flexible board layer 112 can be bent or wound inside the electronic device to realize the connection between the flexible board layer 112 and the at least two heat dissipation devices 120 respectively.

[0064] For example, please refer to Figure 2, the at least two heat dissipation components include a battery 310, a speaker module 260, and a middle frame 300. The first segment 1124 includes a first sub-segment 11241 and a second sub-segment 11242. The first sub-segment 11241 and the second sub-segment 11242 respectively extend outward from both ends of the rigid board layer 111. A part of the first sub-segment 11241 is attached to the middle frame 300, and another part of the first sub-segment 11241 winds around the battery 310. At the same time, a first electrical connection area 1125 for electrically connecting with the battery 310 is provided on the first sub-segment 11241. The first flexible-rigid combination board 110 is electrically connected to the battery 310 through the first electrical connection area 1125. A part of the second sub-segment 11242 is attached to the middle frame 300, and another part of the second sub-segment 11242 is attached to the speaker module 260. And a second electrical connection area 1126 for electrically connecting with the speaker module 260 is provided on the second sub-segment 11242. The first flexible-rigid combination board 110 is electrically connected to the speaker module 260 through the second electrical connection area 1126.

[0065] In this embodiment, by connecting the flexible board layer 112 to at least two heat dissipation devices 120 respectively, in this way, the heat conducted to the flexible board layer 112 can be conducted to the at least two heat dissipation components respectively, thereby further improving the heat dissipation effect in the heat dissipation process based on the first flexible-rigid combination board 110.

[0066] Optionally, the circuit board assembly further includes a fifth electronic device. The first flexible-rigid combination board 110 includes a combination board body and an extension board 320 extending outward from one side of the combination board body. The fifth electronic device is electrically connected to the first flexible-rigid combination board 110 through the extension board 320.

[0067] The above-mentioned first electrical connection area 1125 and second electrical connection area 1126 are respectively located at both ends of the combination board body, and a third electrical connection area 1127 is further provided on the extension board 320.

[0068] Please refer to Figure 2 , in an embodiment of the present application, the fifth electronic device is a display module 270, and the display module 270 is electrically connected to the third electrical connection area 1127.

[0069] In addition, the extension plate 320 includes a first portion perpendicular to the bonding plate body and a second portion opposite to the bonding plate body, and the fifth electronic device is located on a side of the second portion facing away from the first flexible-rigid printed circuit board 110. A third insulating and heat-conducting medium 350 is provided between the second portion and the first shielding cover 180, and the second portion is connected to the first shielding cover 180 through the third insulating and heat-conducting medium 350. Since the display module 270 is located on the outer surface of the electronic device, the display module 270 can serve as a heat-dissipating component. In this way, the heat transferred from the first flexible-rigid printed circuit board 110 to the first shielding cover 180 can be sequentially transferred to the display module 270 through the third insulating and heat-conducting medium 350 and the second portion and dissipated.

[0070] In this embodiment, by making the first flexible-rigid printed circuit board 110 include a bonding plate body and an extension plate 320, the first flexible-rigid printed circuit board 110 can be enabled to connect more electronic devices. Since the bonding plate body and the extension plate 320 are integrally formed, the usage amount of board-to-board connectors can also be reduced, thereby reducing the size of the electronic device. In addition, the heat generated by the fifth electronic device mounted on the extension plate 320 can be sequentially transferred to the heat-dissipating component through the extension plate 320 and the first flexible-rigid printed circuit board 110. When the fifth electronic device is a heat-dissipating component, the heat on the first flexible-rigid printed circuit board 110 can also be transferred to the fifth electronic device through the extension plate 320 for heat dissipation.

[0071] Optionally, the flexible board layer 112 includes a heat-conducting layer 1121 and a heat-conducting film 1123, and the heat-conducting film 1123 covers the surface of the heat-conducting layer 1121.

[0072] Among them, the heat-conducting film 1123 can be various types of insulating and heat-conducting film materials in the prior art. For example, it can be a film material formed by incorporating graphite into a common insulating film material.

[0073] It can be understood that the electronic device electrically connected to the first flexible-rigid printed circuit board 110 can penetrate the heat-conducting film 1123 and be electrically connected to the flexible circuit board.

[0074] In this embodiment, by covering the surface of the heat-conducting layer 1121 with the heat-conducting film 1123, the heat-conducting effect of the flexible board layer 112 can be further improved. In this way, when the heat conducts to the heat-conducting area 114 of the heat-conducting film 1123, the heat can be conducted through the heat-conducting film 1123 and conducted to the heat-dissipating area 113 to improve the heat-conduction efficiency in the flexible board layer 112, thereby further improving the heat-dissipating effect in the heat-dissipating process based on the first flexible-rigid printed circuit board 110.

[0075] Optionally, the circuit board assembly further includes a third electronic device 210. A connection hole 11231 is formed on the surface of the heat-conducting film 1123. The connection terminal of the third electronic device 210 passes through the connection hole 11231 and is electrically connected to the heat-conducting layer 1121.

[0076] Specifically, please refer to Figure 6 , a part of the heat-conducting layer 1121 opposite to the connection hole 11231 may be exposed outside the heat-conducting film 1123. In an embodiment of the present application, a plurality of connection holes 11231 may be formed in the heat-conducting film 1123. In this way, the parts of the heat-conducting layer 1121 opposite to the plurality of connection holes 11231 may jointly form a solder pad, so that the heat-conducting layer 1121 is soldered to the third electronic device 210 through the solder pad. Specifically, the heat-conducting layer 1121 is soldered to the third electronic device 210 through spherical solder balls, and the solder balls are in contact with the heat-conducting film 1123, so as to conduct the heat generated by the third electronic device 210 during operation to the heat-conducting film 1123 through the solder balls for heat dissipation.

[0077] In this embodiment, since the third electronic device 210 is directly soldered to the heat-conducting layer 1121, the heat generated by the third electronic device 210 during operation can be directly transferred to the heat-conducting layer 1121 and the heat-conducting film 1123, and then directly transferred to the heat dissipation area 113 through the heat-conducting layer 1121 and the heat-conducting film 1123, so as to further improve the heat dissipation effect during the heat dissipation process based on the first rigid-flexible printed circuit board 110.

[0078] Optionally, the rigid board layer 111 includes an annular first area 1111. The circuit board assembly further includes a fourth electronic device 280 and a sixth electronic device 290. The fourth electronic device 280 is electrically connected to the heat-conducting layer 1121, and the first area 1111 surrounds the fourth electronic device 280, and the sixth electronic device 290 is located in the first area 1111.

[0079] In the related art, the thickness dimension of an electronic device is related to the height dimension of the electronic devices installed in the electronic device to a certain extent. And various different types of electronic devices need to be installed inside the electronic device, and the shapes of the electronic devices are usually different. When the height dimension of some electronic devices is relatively large, it may usually cause the overall thickness of the electronic device to increase, which is not conducive to the thin and light design of the electronic device.

[0080] Based on this, in the embodiments of the present application, the fourth electronic device 280 may be an electronic device with a relatively large height dimension in the electronic device. By forming an annular first region 1111 on the rigid board layer 111, in this way, an electronic device with a relatively large height dimension can be installed inside the first region 1111, that is, the fourth electronic device 280 is directly electrically connected to the flexible board layer 112. At this time, after the fourth electronic device 280 is installed, the sum of the thicknesses of the fourth electronic device 280 and the first rigid-flex board 110 is: the sum of the height of the fourth electronic device 280 and the thickness of the flexible board layer 112. Correspondingly, if the fourth electronic device 280 is installed on the rigid board layer 111, that is, the fourth electronic device 280 is connected to the flexible board layer 112 through the rigid board layer 111, then after the fourth electronic device 280 is installed, the sum of the heights of the fourth electronic device 280 and the first rigid-flex board 110 is: the sum of the height of the fourth electronic device 280, the thickness of the rigid board layer 111, and the thickness of the flexible board layer 112. It can be seen that by directly connecting the fourth electronic device 280 to the flexible board layer 112 in the embodiments of the present application, it is beneficial to reduce the overall thickness of the circuit board assembly, and thus beneficial to the thinning of the electronic device.

[0081] Please refer to Figures 2 to 10 , in an embodiment of the present application, a sixth electronic device 290 may further be provided in the first region 1111, and the sixth electronic device 290 may be electrically connected to the flexible board layer 112 through the rigid board layer 111.

[0082] In this embodiment, by installing the fourth electronic device 280 inside the annular region, in this way, it is beneficial to reduce the overall thickness of the circuit board assembly. At the same time, since the annular region is a rigid board layer, the annular region effectively supports the flexible board region inside the annular region, avoiding bending of the flexible board region inside the annular region, thereby improving the connection stability between the fourth electronic device 280 and the flexible board layer 112.

[0083] Optionally, the circuit board assembly includes a connector 220, a reinforcing plate 230, and a second circuit board. The connector 220 and the reinforcing plate 230 are respectively disposed on two opposite sides of the first rigid-flex board 110, and the first rigid-flex board 110 is electrically connected to the second circuit board through the connector 220.

[0084] Among them, the connector 220 may be various types of connectors for connecting different electronic devices in the prior art. For example, please refer to Figure 8, in an embodiment of the present application, the connector 220 may be a BTB connector. The BTB connector is disposed at one end of the flexible printed circuit (FPC) layer 112. The first rigid-flex printed circuit board 110 may be electrically connected to the second circuit board through the BTB connector 220. Meanwhile, to improve the connection stability of the BTB connector 220, a reinforcing plate 230 may be disposed on the side of the FPC layer 112 facing away from the BTB connector 220. In this way, the supporting effect of the first rigid-flex printed circuit board 110 on the BTB connector 220 can be enhanced, and the phenomenon of bending at the connection between the first rigid-flex printed circuit board 110 and the BTB connector 220 can be avoided.

[0085] In addition, in another embodiment of the present application, the circuit board assembly includes a second circuit board. The heat-conducting layer 1121 includes a second region that does not cover the rigid board layer 111, and the second region forms a gold finger 250 or a pad 240. The first rigid-flex printed circuit board 110 is electrically connected to the second circuit board through the second region, where the pad 240 may be an electroless gold pad.

[0086] In this embodiment, by providing the above different types of connection structures, different connection methods can be adopted to electrically connect the second circuit board and the first rigid-flex printed circuit board 110 according to the specific type of the second circuit board.

[0087] Optionally, the second circuit board includes a second rigid-flex printed circuit board 360, a third shielding cover 390, an eighth electronic device 400, and a ninth electronic device 410. The third shielding cover 390 is connected to the second rigid-flex printed circuit board 360, and the third shielding cover 390 and the second rigid-flex printed circuit board 360 enclose a fourth cavity. The eighth electronic device 400 and the ninth electronic device 410 are respectively electrically connected to the second rigid-flex printed circuit board 360, and the eighth electronic device 400 and the ninth electronic device 410 are respectively located in the fourth cavity;

[0088] The second rigid-flex printed circuit board 360 includes a second rigid board layer 3601 and a second FPC layer 3602. The second rigid board layer 3601 covers the surface of the second FPC layer 3602. A first groove with an opening facing the third shielding cover 390 is formed on the second rigid board layer 3601. At least a part of the eighth electronic device 400 is embedded in the first groove, and the ninth electronic device 410 is located outside the first groove;

[0089] The eighth electronic device 400 and the ninth electronic device 410 are respectively electrically connected to the second rigid board layer 3601.

[0090] It can be understood that the above-mentioned first rigid-flex printed circuit board 110 and the second rigid-flex printed circuit board 360 can be different circuit boards in the same electronic device, and the first rigid-flex printed circuit board 110 is electrically connected to the second rigid-flex printed circuit board 360. The above-mentioned eighth electronic component 400 and the ninth electronic component 410 can be any electronic components in the electronic device, and the eighth electronic component 400 can be an electronic component with a relatively large height dimension in the electronic device.

[0091] Among them, since the first groove formed in the second rigid board layer 3601 does not penetrate the second rigid board layer 3601, electrical connection positions of the second rigid board layer 3601 can be provided at the bottom or the wall of the first groove for installing electronic components.

[0092] Specifically, the area of the second rigid board layer 3601 facing the third shielding cover 390 can be divided into a first connection area and a second connection area. Among them, the bottom of the first groove forms the first connection area, and the other areas outside the first groove form the second connection area. Since the first connection area and the second connection area are located on different planes respectively, the first connection area and the second connection area together form a stepped position. Since the first groove is formed in the first connection area, that is, there is partial hollowing in the first connection area of the second rigid board layer 3601, the thickness dimension of the second rigid board layer 3601 in the first connection area is relatively thin. In this way, the eighth electronic component 400 with a relatively large height dimension in the electronic device can be arranged in the first connection area, that is, the eighth electronic component 400 is embedded in the first groove to reduce the total thickness after the eighth electronic component 400 is connected to the second rigid board layer 3601. Correspondingly, the ninth electronic component 410 with a relatively small height dimension can be arranged in the second connection area. Specifically, the eighth electronic component 400 and the ninth electronic component 410 can be respectively surface-mounted on the second rigid board layer 3601 to form a stepped surface mounting.

[0093] In this embodiment, by providing the third shielding cover 390, the electronic components in the fourth cavity are relatively isolated from other electronic components in the electronic device to avoid the problem of mutual interference between the components in the electronic device. At the same time, by forming the first groove in the second rigid board layer 3601 and embedding the eighth electronic component 400 in the first groove, the overall thickness of the second rigid-flex printed circuit board 360 after the eighth electronic component 400 is installed can be reduced, which is beneficial to the thinning of the electronic device.

[0094] Another embodiment of the present application further provides an electronic device, and the electronic device includes the circuit board assembly described in the above embodiment.

[0095] Among them, the electronic device can be various types of electronic devices. For example, it can be various types of mobile phones, tablet computers, smart wearable devices, etc.

[0096] It can be understood that the above-mentioned first electronic device 130, second electronic device 160, third electronic device 210, fourth electronic device 280, fifth electronic device, sixth electronic device 290, etc. can be various types of electronic devices in the electronic device. The electronic devices deployed on the first rigid-flexible combination board 110 can be directly electrically connected to the flexible board layer 112, or can be electrically connected to the flexible board layer 112 through the rigid board layer 111.

[0097] In the embodiment of the present application, since the electronic device includes the circuit board assembly in the above-mentioned embodiment, therefore, the electronic device can achieve all the beneficial effects of the circuit board assembly in the above-mentioned embodiment. To avoid repetition, it will not be elaborated here.

[0098] Optionally, please refer to Figure 12 , the electronic device includes a first housing and a second housing. A first circuit board assembly 420 is provided in the first housing, and a second circuit board assembly 370 is provided in the second housing. At least one of the first circuit board assembly 420 and the second circuit board assembly 370 is the circuit board assembly;

[0099] The first circuit board assembly 420 includes a first combination board, and the second circuit board assembly 370 includes a second combination board. The first end of the first combination board is electrically connected to the first end of the second combination board;

[0100] Among them, when the first circuit board assembly 420 is the circuit board assembly, the first combination board is the first rigid-flexible combination board 110;

[0101] When the second circuit board assembly 370 is the circuit board assembly, the second combination board is the first rigid-flexible combination board 110.

[0102] In this embodiment, the electronic device is a folding screen electronic device. The first combination board and the second combination board can be rigid-flexible combination boards respectively. In this way, the flexible board layer of the first combination board can be electrically connected to the flexible board layer of the second combination board. Since the first combination board and the second combination board are connected through the flexible board layer, the connection part between the first combination board and the second combination board can be bent relatively, which is beneficial to the folding of the folding screen electronic device.

[0103] Among them, the first combination board and the second combination board can be electrically connected through any one of the Figures 8 to 11 connection methods.

[0104] Specifically, during the rotation of the first housing relative to the second housing, the first housing folds or unfolds relative to the second housing. Meanwhile, the first bonding plate rotates relative to the second bonding plate.

[0105] In addition, please refer to Figure 12 , to improve the waterproof performance of the electronic device, waterproof glue 380 can be respectively provided at each welding position for connecting different components.

[0106] In this embodiment, by applying the circuit board assembly to a folding screen electronic device, it is beneficial to improve the heat dissipation effect of the folding screen electronic device.

[0107] It should be noted that in this article, the terms "including", "comprising" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, the features described with reference to certain examples may be combined in other examples.

[0108] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them fall within the protection scope of the present application.

Claims

1. A circuit board assembly, characterized in that, Comprising: A first rigid-flex board (110), the first rigid-flex board (110) includes a rigid board layer (111) and a flexible board layer (112) arranged in a stacked manner, the rigid board layer (111) covers the surface of the flexible board layer (112), the flexible board layer (112) includes a flexible substrate (1122) and a heat-conducting layer (1121), the heat-conducting layer (1121) covers the surface of the flexible substrate (1122), a first electronic device (130) is provided on the first rigid-flex board (110), the heat-conducting layer (1121) has a heat dissipation area (113), and the heat dissipation area (113) does not cover the rigid board layer (111); A first circuit board (140), a first cavity is formed by enclosing between the first circuit board (140) and the first rigid-flex board (110), the heat dissipation area (113) is located outside the first cavity, and the first electronic device (130) is located inside the first cavity; The heat-conducting layer (1121) has a heat-conducting area (114), the heat-conducting area (114) is located inside the first cavity; the first cavity is filled with a first insulating heat-conducting medium (150), both sides of the flexible board layer (112) cover the rigid board layer (111), and an opening opposite to the heat-conducting area (114) is formed in the rigid board layer (111) on the side facing the first cavity, so that the heat-conducting area (114) does not cover the rigid board layer (111), and the electronic device inside the first cavity is connected to the heat-conducting area (114) through the first insulating heat-conducting medium (150).

2. The circuit board assembly according to claim 1, wherein the circuit board assembly further comprises a heat dissipation device (120), and the heat dissipation device (120) is disposed in the heat dissipation area (113).

3. The circuit board assembly according to claim 1, wherein the circuit board assembly further comprises a first shielding cover (180), the first shielding cover (180) is located on a side of the first flexible-rigid printed circuit board (110) facing away from the first circuit board (140), and the first shielding cover (180) is connected to the first flexible-rigid printed circuit board (110), and a second cavity is formed by enclosing between the first shielding cover (180) and the first flexible-rigid printed circuit board (110); A second electronic device (160) is provided on the first flexible-rigid printed circuit board (110), the second electronic device (160) is located in the second cavity, and a second insulating and heat-conducting medium (170) is provided in the second cavity.

4. The circuit board assembly according to claim 2, wherein the flexible board layer (112) comprises a first segment (1124), the first segment (1124) does not cover the rigid board layer (111), the first segment (1124) comprises a winding portion wound around the heat dissipation device (120), and the heat dissipation area (113) is located in the winding portion.

5. The circuit board assembly according to claim 1, wherein the flexible board layer (112) further comprises a heat-conducting film (1123), and the heat-conducting film (1123) covers the surface of the heat-conducting layer (1121).

6. The circuit board assembly according to claim 5, wherein the circuit board assembly further comprises a third electronic device (210), a connection hole (11231) is formed on the surface of the heat-conducting film (1123), and a connection terminal of the third electronic device (210) passes through the connection hole (11231) and is electrically connected to the heat-conducting layer (1121).

7. The circuit board assembly according to claim 1, wherein the rigid board layer (111) comprises an annular first area (1111), the circuit board assembly further comprises a fourth electronic device (280) and a sixth electronic device (290), the fourth electronic device (280) is electrically connected to the heat-conducting layer (1121), and the first area (1111) surrounds the fourth electronic device (280), and the sixth electronic device (290) is located in the first area (1111).

8. The circuit board assembly according to claim 1, wherein the circuit board assembly includes a connector (220), a reinforcing plate (230), and a second circuit board. The connector (220) and the reinforcing plate (230) are respectively disposed on opposite sides of the first rigid-flexible printed circuit board (110), and the first rigid-flexible printed circuit board (110) is electrically connected to the second circuit board through the connector (220); or, The circuit board assembly includes a second circuit board. The heat conducting layer (1121) includes a second region that does not cover the rigid board layer (111), and the second region forms a gold finger (250) or a pad (240). The first rigid-flexible printed circuit board (110) is electrically connected to the second circuit board through the second region.

9. The circuit board assembly according to claim 8, wherein the second circuit board includes a second rigid-flexible printed circuit board (360), a third shielding cover (390), an eighth electronic device (400), and a ninth electronic device (410). The third shielding cover (390) is connected to the second rigid-flexible printed circuit board (360), and the third shielding cover (390) and the second rigid-flexible printed circuit board (360) enclose a fourth cavity. The eighth electronic device (400) and the ninth electronic device (410) are respectively electrically connected to the second rigid-flexible printed circuit board (360), and the eighth electronic device (400) and the ninth electronic device (410) are respectively located in the fourth cavity.

10. The circuit board assembly according to claim 9, wherein the second rigid-flexible printed circuit board (360) includes a second rigid board layer (3601) and a second flexible board layer (3602). The second rigid board layer (3601) covers the surface of the second flexible board layer (3602). A first groove with an opening facing the third shielding cover (390) is formed on the second rigid board layer (3601). At least a part of the eighth electronic device (400) is embedded in the first groove, and the ninth electronic device (410) is located outside the first groove; The eighth electronic device (400) and the ninth electronic device (410) are respectively electrically connected to the second rigid board layer (3601).

11. The circuit board assembly according to claim 1, wherein the circuit board assembly further includes a fifth electronic device. The first rigid-flexible printed circuit board (110) includes a combined board body and an extension board (320) extending outward from one side of the combined board body. The fifth electronic device is electrically connected to the first rigid-flexible printed circuit board (110) through the extension board (320).

12. An electronic device, characterized in that Comprising the circuit board assembly according to any one of claims 1-11.

13. The electronic device according to claim 12, wherein the electronic device comprises a first housing and a second housing, a first circuit board assembly (420) is disposed in the first housing, a second circuit board assembly (370) is disposed in the second housing, and at least one of the first circuit board assembly (420) and the second circuit board assembly (370) is the circuit board assembly; The first circuit board assembly (420) comprises a first bonding board, the second circuit board assembly (370) comprises a second bonding board, and a first end of the first bonding board is electrically connected to a first end of the second bonding board; Wherein, In the case where the first circuit board assembly (420) is the circuit board assembly, the first bonding board is the first rigid-flex board (110); In the case where the second circuit board assembly (370) is the circuit board assembly, the second bonding board is the first rigid-flex board (110).

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