Lighting device and its heat dissipation structure

Abstract

This application provides a lighting device and its heat dissipation structure. The heat dissipation structure includes: a plastic frame with a first protrusion and a second protrusion spaced apart on its inner circumferential surface; and a heat dissipation plate installed inside the plastic frame, with a first slot and a second slot respectively formed on the heat dissipation plate. The first protrusion extends into the first slot to push the heat dissipation plate in a first direction, and the second protrusion extends into the second slot to push the heat dissipation plate in a second direction. The first and second directions are opposite to each other along the thickness direction of the heat dissipation plate. The lighting device includes the above-described heat dissipation structure. When relative deformation occurs between the heat dissipation plate and the plastic frame, causing the heat dissipation plate to exert a force along the thickness direction of the heat dissipation plate on the plastic frame, the first or second protrusion on the plastic frame will exert a reverse force on the corresponding first or second slot, thereby preventing the heat dissipation plate from detaching from the plastic frame and ensuring the reliability of the connection between the heat dissipation plate and the plastic frame.

Description

Technical Field

[0001] This application belongs to the field of lighting technology, and more specifically, relates to a lighting device and its heat dissipation structure. Background Technology

[0002] When conducting inspections outdoors or at night, multi-functional lighting devices are sometimes necessary to reduce the amount of equipment personnel need to carry during the inspection process. Some lighting devices include, in addition to the lighting components, a display screen and a mainboard.

[0003] Currently, lighting devices incorporate a heat sink between the display screen and the motherboard to facilitate faster heat dissipation for both components. The heat sink is housed within the plastic frame of the lighting device and is integrated with the frame using a two-color injection molding process.

[0004] However, since the heat sink is made of metal, when the assembly formed by the heat sink and the plastic frame is demolded from the mold, the heat sink and the plastic frame shrink and deform to different degrees during the cooling process, and the heat sink is easy to fall off the plastic frame. Summary of the Invention

[0005] The purpose of this application is to provide a lighting device and its heat dissipation structure to solve the problem in the related art that the heat dissipation plate is easy to fall off the plastic frame.

[0006] To achieve the above objectives, the technical solution adopted in the embodiments of this application is as follows:

[0007] On the one hand, a heat dissipation structure is provided, including:

[0008] A plastic frame, wherein a first protrusion and a second protrusion are spaced apart on the inner circumferential surface of the plastic frame;

[0009] A heat sink is installed inside the plastic frame, and the heat sink is provided with a first slot and a second slot respectively.

[0010] Wherein, the first protrusion extends into the first slot to push the heat sink plate in a first direction, and the second protrusion extends into the second slot to push the heat sink plate in a second direction. The first direction and the second direction are two directions that are opposite to each other along the thickness direction of the heat sink plate.

[0011] In one embodiment, the width of the first protrusion gradually decreases along the first direction, and the width of the first slot gradually decreases along the first direction; the width of the second protrusion gradually decreases along the second direction, and the width of the second slot gradually decreases along the second direction.

[0012] In this structure, when the first protrusion extends into the first slot and the second protrusion extends into the second slot, the first protrusion can push against the heat sink in a first direction, and the second protrusion can push against the heat sink in a second direction. Simultaneously, the thickness of the first protrusion can be equal to the thickness of the first slot, and the thickness of the second protrusion can be equal to the thickness of the second slot. The first and second protrusions will not protrude from the heat sink along its thickness direction, facilitating the mounting of other components of the lighting device on the heat sink.

[0013] In one embodiment, the first protrusion has a first inclined surface and a second inclined surface, and the inner wall of the first slot has a first abutting surface that abuts against the first inclined surface and a second abutting surface that abuts against the second inclined surface; the second protrusion has a third inclined surface and a fourth inclined surface, and the inner wall of the second slot has a third abutting surface that abuts against the third inclined surface and a fourth abutting surface that abuts against the fourth inclined surface, the first abutting surface being parallel to the fourth abutting surface, and the second abutting surface being parallel to the third abutting surface.

[0014] This structure facilitates the machining of the first and second slots on the heat sink using cutting processes, while also ensuring the stability of the first and second protrusions pushing against the heat sink.

[0015] In one embodiment, the inner circumferential surface of the plastic frame includes two opposing first side surfaces, the heat sink includes two opposing first side ends, the number of first protrusions and the number of second protrusions are multiple, and a plurality of first protrusions and a plurality of second protrusions are alternately distributed on each first side surface; the number of first slots is the same as the number of first protrusions, the number of second slots is the same as the number of second protrusions, and a plurality of first slots and a plurality of second slots are alternately distributed on each first side end.

[0016] This structure ensures that the two first ends of the heat sink are subjected to uniform force along the thickness direction of the heat sink.

[0017] In one embodiment, the inner circumferential surface of the plastic frame further includes two opposing second side surfaces, which are respectively connected to two first side surfaces. The two second side surfaces and the two first side surfaces enclose an accommodating area for accommodating the heat sink. The heat sink further includes two opposing second side ends, on which a first slot group and a second slot group are arranged at intervals along the thickness direction of the heat sink. The first slot group and the second slot group each include a plurality of third slots arranged at intervals along the length direction of the heat sink. The plurality of third slots in the first slot group and the plurality of third slots in the second slot group are staggered along the thickness direction of the heat sink. Each second side surface is provided with a plurality of third protrusions, which are divided into two groups. The two groups of third protrusions are respectively aligned with the first slot group and the second slot group, and each third protrusion extends into the corresponding third slot.

[0018] This structure prevents the two second-side ends of the heat sink from detaching from the plastic frame along the thickness direction of the heat sink.

[0019] In one embodiment, the heat sink is provided with a plurality of positioning parts for supporting the motherboard, and the plurality of positioning parts are respectively spaced apart from the first slot and the second slot.

[0020] This structure, with its positioning part, facilitates the positioning and connection between the heatsink and the motherboard, thereby improving motherboard assembly efficiency.

[0021] In one embodiment, each of the positioning portions includes a positioning block, and each positioning block has a notch at its top for the motherboard to extend into.

[0022] With this structure, when the motherboard extends into the notches of each positioning block, each positioning block can limit the motherboard, improving the alignment accuracy and efficiency between the motherboard and the heat sink.

[0023] In one embodiment, the heat dissipation structure further includes a plurality of fasteners; the heat dissipation plate is also equipped with a plurality of connecting posts spaced apart from the plurality of positioning parts, each of the connecting posts having an installation hole, and each of the fasteners being used to pass through the motherboard and lock onto the corresponding connecting post.

[0024] This structure allows the motherboard to be securely mounted to the heatsink, enabling the heatsink to dissipate heat from the motherboard.

[0025] In one embodiment, the heat sink is further provided with wire-passing holes, which are respectively spaced apart from the first card slot and the second card slot.

[0026] In this structure, cable routing holes are opened on the heat sink, allowing cables for other components of the lighting device to pass through the holes and connect electrically to the motherboard.

[0027] On the other hand, a lighting device is provided, including the heat dissipation structure provided in any of the above embodiments.

[0028] In this structure, the lighting device using the above-mentioned heat dissipation structure can limit the heat sink plate by the protrusion of the plastic frame, which can prevent the heat sink plate from coming out of the plastic frame along its own thickness direction, thus ensuring the heat dissipation effect of the heat sink plate on the display screen and motherboard.

[0029] The lighting device with the above-mentioned heat dissipation structure can limit the heat sink plate by the first and second protrusions on the plastic frame, thus preventing the heat sink plate from coming out of the plastic frame along its own thickness direction and ensuring the heat dissipation effect of the heat sink plate on the display screen and motherboard.

[0030] The beneficial effects of the lighting device and its heat dissipation structure provided in this application are as follows: A first protrusion and a second protrusion are spaced apart on the inner circumferential surface of the plastic frame, and a first slot and a second slot are respectively formed on the heat dissipation plate. The first protrusion extends into the first slot and pushes the heat dissipation plate in a first direction, while the second protrusion extends into the second slot and pushes the heat dissipation plate in a second direction. Thus, after the assembly formed by the plastic frame and the heat dissipation plate is demolded from the mold, during the cooling process, when relative deformation occurs between the heat dissipation plate and the plastic frame, causing the heat dissipation plate to exert a force along the thickness direction of the heat dissipation plate on the plastic frame, the first or second protrusion on the plastic frame will exert a reverse force on the corresponding first or second slot, thereby preventing the heat dissipation plate from detaching from the plastic frame and ensuring the reliability of the connection between the heat dissipation plate and the plastic frame. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or exemplary technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a partial structural schematic diagram of the lighting device provided in the embodiments of this application;

[0033] Figure 2 for Figure 1 Cross-sectional view at point AA;

[0034] Figure 3 for Figure 2 A magnified view of a portion of point C in the middle;

[0035] Figure 4 for Figure 1 Cross-sectional view at point BB;

[0036] Figure 5 Schematic diagram of the structure of the heat sink provided in the embodiments of this application Figure 1 ;

[0037] Figure 6 for Figure 5 Cross-sectional view at point DD;

[0038] Figure 7 for Figure 5 Cross-sectional view at the EE section;

[0039] Figure 8 Schematic diagram of the structure of the heat sink provided in the embodiments of this application Figure 2 ;

[0040] Figure 9 This is a schematic diagram of the structure of the plastic frame provided in an embodiment of this application.

[0041] The main markings in the attached figures are as follows:

[0042] 1. Plastic frame; 11. First protrusion; 12. Second protrusion; 13. First side; 14. Second side; 141. Third protrusion;

[0043] 2. Heat sink; 21. First slot; 211. First contact surface; 212. Second contact surface; 22. Second slot; 221. Third contact surface; 222. Fourth contact surface; 23. First side end; 24. Second side end; 241. First slot group; 242. Second slot group; 243. Third slot; 25. Positioning block; 251. Notch; 26. Connecting post; 261. Mounting hole; 27. Wiring hole. Detailed Implementation

[0044] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0046] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly specified. "Several" means one or more, unless otherwise expressly specified.

[0047] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0048] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0049] Throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, and not all refer to the same embodiment. Furthermore, in one or more embodiments, particular features, structures, or characteristics may be combined in any suitable manner.

[0050] Please see Figures 1-3 The heat dissipation structure provided in the embodiments of this application will now be described. This heat dissipation structure includes a plastic frame 1 and a heat sink 2. The heat sink 2 is made of metal, and the plastic frame 1 is made of plastic. Schematic, the heat sink 2 is approximately rectangular in shape, and the plastic frame 1 is a rectangular frame structure matching the shape of the heat sink 2. Please refer to... Figure 2 and Figure 9The inner circumferential surface of the plastic frame 1 is provided with a first protrusion 11 and a second protrusion 12 spaced apart. In one possible implementation, both the first protrusion 11 and the second protrusion 12 are dovetail blocks. Taking the first protrusion 11 as an example, the width of the first protrusion 11 gradually increases from the inner circumferential surface of the plastic frame 1 inwards. Please refer to [link / reference]. Figure 2 , Figure 5 and Figure 8 The heat sink 2 is installed inside the plastic frame 1, specifically, the heat sink 2 and the plastic frame 1 are formed as a single piece. The side end of the heat sink 2 abuts against the inner circumferential surface of the plastic frame 1, and the heat sink 2 is provided with a first slot 21 and a second slot 22. Both the first slot 21 and the second slot 22 are located on the side end of the heat sink 2. Schematic, both the first slot 21 and the second slot 22 are dovetail grooves. Taking the first slot 21 as an example, the width of the first slot 21 gradually increases from the side of the heat sink 2 towards its interior.

[0051] In this embodiment, a first protrusion 11 extends into a first slot 21 to push the heat sink 2 in a first direction, and a second protrusion 12 extends into a second slot 22 to push the heat sink 2 in a second direction. The first and second directions are two directions that are opposite to each other along the thickness direction of the heat sink 2. In one possible implementation, each first protrusion 11 is provided with a first protrusion extending from the main body of the first protrusion 11, and each second protrusion 12 is provided with a second protrusion extending from the main body of the second protrusion 12. When the first protrusion 11 extends into the first slot 21 and the second protrusion 12 extends into the second slot 22, the first protrusion and the second protrusion are respectively located on both sides of the heat sink 2 along its own thickness direction, and both the first protrusion 11 and the second protrusion 12 abut against the heat sink 2, so that the first protrusion 11 pushes the heat sink 2 in the first direction and the second protrusion 12 pushes the heat sink 2 in the second direction. Of course, this embodiment is only exemplary. Those skilled in the art can also set other ways to make the first protrusion 11 push against the heat sink 2 in the first direction and the second protrusion 12 push against the heat sink 2 in the second direction. This is not a unique limitation.

[0052] In the production process of the heat dissipation structure provided in this embodiment, the first slot 21 and the second slot 22 are first processed on the heat dissipation plate 2, for example, by cutting the first slot 21 and the second slot 22 on the heat dissipation plate 2 using a cutting machine. Then, the edges of the cut first slot 21 and the second slot 22 are polished to remove burrs. The polished heat dissipation plate 2 is fixed inside the mold, and plastic raw material is injected into the mold cavity. After the raw material cools and solidifies in the mold, the heat dissipation structure is removed. After the heat dissipation structure is removed from the mold, during the cooling process, due to the different degrees of deformation and cooling rates of the heat dissipation plate 2 and the plastic frame 1, the heat dissipation plate 2 will exert a force on the plastic frame 1 along the first direction or the second direction. Due to the pushing action of the first protrusion 11 and the second protrusion 12 on the heat dissipation plate 2, it can be ensured that the heat dissipation plate 2 will not detach from the plastic frame 1.

[0053] The beneficial effect of the heat dissipation structure provided in this embodiment is that, after the heat dissipation structure is demolded from the mold, during the cooling process, when the relative deformation between the heat dissipation plate 2 and the plastic frame 1 causes the heat dissipation plate 2 to apply a force along the thickness direction of the plastic frame 1, the first protrusion 11 or the second protrusion 12 on the plastic frame 1 will apply a reverse force to the corresponding first slot 21 or the second slot 22, thereby preventing the heat dissipation plate 2 from coming off the plastic frame 1 and ensuring the reliability of the connection between the heat dissipation plate 2 and the plastic frame 1.

[0054] In one embodiment, see Figures 3-5 As a specific embodiment of the heat dissipation structure provided in this application, the width of the first protrusion 11 gradually decreases along the first direction, and the width of the first slot 21 gradually decreases along the first direction. Indicatively, the cross-sectional shape of the first protrusion 11 can be any suitable shape, such as a semi-circle or trapezoid; that is, the sidewall of the first protrusion 11 can be a plane or an arc surface. It is easy to understand that the cross-sectional shape of the first slot 21 matches the cross-sectional shape of the first protrusion 11, so that when the first protrusion 11 extends into the interior of the first slot 21, the first protrusion 11 can push against the heat dissipation plate 2 in the first direction. The width of the second protrusion 12 gradually decreases along the second direction, and the width of the second slot 22 gradually decreases along the second direction. It is easy to understand that the sidewall of the second protrusion 12 can also be a plane or an arc surface, and the cross-sectional shape of the second slot 22 matches the cross-sectional shape of the second protrusion 12. When the second protrusion 12 extends into the interior of the second slot 22, the second protrusion 12 can push against the heat dissipation plate 2 in the second direction.

[0055] Please see Figure 3When the heat dissipation structure is cooling down, when the heat dissipation plate 2 applies a force F1 to the plastic frame 1 along the first direction, the plastic frame 1 pushes against the heat dissipation plate 2 through the second protrusion 12, that is, the second protrusion 12 applies a reverse force F11 to the heat dissipation plate 2. In another possible implementation, when the heat dissipation plate 2 applies a force F2 to the plastic frame 1 along the second direction, the plastic frame 1 pushes against the heat dissipation plate 2 through the first protrusion 11, that is, the first protrusion 11 applies a reverse force F22 to the heat dissipation plate 2.

[0056] In this embodiment, when the first protrusion 11 extends into the first slot 21 and the second protrusion 12 extends into the second slot 22, the first protrusion 11 can push against the heat sink 2 in a first direction, and the second protrusion 12 can push against the heat sink 2 in a second direction. Simultaneously, the thickness of the first protrusion 11 can be equal to the thickness of the first slot 21, and the thickness of the second protrusion 12 can be equal to the thickness of the second slot 22. The first protrusion 11 and the second protrusion 12 will not protrude from the heat sink 2 along its thickness direction, facilitating the mounting of other components of the lighting device on the heat sink 2.

[0057] In one embodiment, see Figure 3 , Figure 6 and Figure 7 As a specific embodiment of the heat dissipation structure provided in this application, the first protrusion 11 has a first inclined surface and a second inclined surface, wherein the first inclined surface and the second inclined surface are two opposite sides of the first protrusion 11. Schematic, the cross-sectional shape of the first protrusion 11 can be an isosceles trapezoid. It is easy to understand that both the first inclined surface and the second inclined surface are inclined in the thickness direction of the first protrusion 11. This embodiment does not limit the inclination angle between the first inclined surface and the second inclined surface and the thickness direction of the first protrusion 11, and those skilled in the art can set it according to actual needs. The inner wall of the first slot 21 has a first abutting surface 211 that abuts against the first inclined surface and a second abutting surface 212 that abuts against the second inclined surface. The first abutting surface 211 is positioned directly opposite the first inclined surface, and the inclination angle of the first abutting surface 211 is the same as the inclination angle of the first inclined surface; the second abutting surface 212 is positioned directly opposite the second inclined surface, and the inclination angle of the second abutting surface 212 is the same as the inclination angle of the second inclined surface. The second protrusion 12 has a third inclined surface and a fourth inclined surface. The inner wall of the second slot 22 has a third abutting surface 221 that abuts against the third inclined surface and a fourth abutting surface 222 that abuts against the fourth inclined surface. It is easy to understand that both the third and fourth inclined surfaces are inclined in the thickness direction of the second protrusion 12. The third abutting surface 221 is positioned directly opposite the third inclined surface, and its inclination angle is the same as that of the third inclined surface. The fourth abutting surface 222 is positioned directly opposite the fourth inclined surface, and its inclination angle is the same as that of the fourth inclined surface. The first abutting surface 211 is parallel to the fourth abutting surface 222, and the second abutting surface 212 is parallel to the third abutting surface 221.

[0058] In this embodiment, a first abutting surface 211 abutting against the first inclined surface and a second abutting surface 212 abutting against the second inclined surface are provided on the inner wall of the first slot 21. A third abutting surface 221 abutting against the third inclined surface and a fourth abutting surface 222 abutting against the fourth inclined surface are provided on the inner wall of the second slot 22. This facilitates the machining of the first slot 21 and the second slot 22 on the heat sink 2 by a cutting process. At the same time, after the first protrusion 11 extends into the first slot 21 and the second protrusion 12 extends into the second slot 22, the stability of the first protrusion 11 and the second protrusion 12 pushing against the heat sink 2 can be guaranteed.

[0059] In one embodiment, see Figure 5 , Figure 8 and Figure 9 As a specific embodiment of the heat dissipation structure provided in this application, the inner circumferential surface of the plastic frame 1 includes two opposing first side surfaces 13. Figure 9 As shown, when the plastic frame 1 is a rectangular frame structure, the two first side surfaces 13 can be the side surfaces on the two short sides of the plastic frame 1, respectively. The heat sink 2 includes two opposing first side ends 23. Figure 8 As shown, when the shape of the heat sink 2 is approximately rectangular, the two first side ends 23 can be the two short sides of the heat sink 2, respectively. There are multiple first protrusions 11 and second protrusions 12, with a plurality of first protrusions 11 and a plurality of second protrusions 12 alternately distributed on each first side 13. In one possible implementation, please refer to... Figure 9 The first side 13 at the top of the plastic frame 1 may be provided with a first protrusion 11 and a second protrusion 12, with the first protrusion 11 and the second protrusion 12 located at opposite ends of the first side 13. The first side 13 at the bottom of the plastic frame 1 may be provided with a plurality of first protrusions 11 and a plurality of second protrusions 12, which are alternately distributed on this side. It should be noted that the number of first protrusions 11 and second protrusions 12 on each first side 13 is not limited, and those skilled in the art can set it according to actual needs.

[0060] The number of first slots 21 is the same as the number of first protrusions 11, and the number of second slots 22 is the same as the number of second protrusions 12. A plurality of first slots 21 and a plurality of second slots 22 are alternately distributed on each first side end 23. For details, please refer to [link / reference]. Figure 8A first slot 21 and a second slot 22 are provided on one first side end 23 of the plastic frame 1, and the first slot 21 and the second slot 22 form a dovetail block on the first side end 23. A plurality of first slots 21 and a plurality of second slots 22 are provided on the other first side end 23 of the plastic frame 1, and the plurality of first slots 21 and the plurality of second slots 22 are alternately distributed on the first side end 23.

[0061] In this embodiment, the above-mentioned arrangement can ensure that the two first side ends 23 of the heat sink 2 are uniformly stressed along the thickness direction of the heat sink 2, thereby ensuring that the two first side ends 23 of the heat sink 2 will not come out of the plastic frame 1 along the thickness direction of the heat sink 2.

[0062] In one embodiment, see Figure 5 , Figure 8 and Figure 9 As a specific embodiment of the heat dissipation structure provided in this application, the inner peripheral surface of the plastic frame 1 further includes two opposing second side surfaces 14, which are respectively connected to two first side surfaces 13. The two second side surfaces 14 and the two first side surfaces 13 form a receiving area for accommodating the heat dissipation plate 2. The heat dissipation plate 2 also includes two opposing second side ends 24. Figure 8 and Figure 9 As shown, the two second side surfaces 14 are the side surfaces on the two long sides of the plastic frame 1, and the two second side ends 24 are the two long sides of the heat sink 2. A first slot group 241 and a second slot group 242 are arranged at intervals along the thickness direction of the heat sink 2 on each second side end 24. Schematically, the first slot group 241 is located above the second slot group 242. Both the first slot group 241 and the second slot group 242 include a plurality of third slots 243 arranged at intervals along the length direction of the heat sink 2. The plurality of third slots 243 in the first slot group 241 and the plurality of third slots 243 in the second slot group 242 are staggered along the thickness direction of the heat sink 2. The sidewalls of the third slots 243 can be inclined to the thickness direction of the heat sink 2 or parallel to the thickness direction of the heat sink 2; no single limitation is made here.

[0063] In one possible implementation, each third slot 243 is a dovetail groove, meaning the width of each third slot 243 gradually increases from the sidewall of the corresponding second side 24 towards the interior of the heat sink 2. Each second side 14 has multiple third protrusions 141, divided into two groups. These two groups of third protrusions 141 are respectively aligned with the first slot group 241 and the second slot group 242, with each third protrusion 141 extending into its corresponding third slot 243. Schematably, each third protrusion 141 is a dovetail block that matches its corresponding third slot 243. When each third protrusion 141 extends into its corresponding third slot 243, it prevents the third protrusion 141 from dislodging from the third slot 243 along the width direction of the heat sink 2. It is worth mentioning that the third protrusion 141 extending into the plurality of third slots 243 in the first slot group 241 can push the heat sink 2 in the first direction, and the third protrusion 141 extending into the plurality of third slots 243 in the second slot group 242 can push the heat sink 2 in the second direction. The above arrangement can prevent the two second side ends 24 of the heat sink 2 from coming out of the plastic frame 1 along the thickness direction of the heat sink 2.

[0064] In one embodiment, as a specific implementation of the heat dissipation structure provided in this application, the heat sink 2 is provided with a plurality of positioning parts for supporting the motherboard, and the plurality of positioning parts are respectively spaced apart from the first slot 21 and the second slot 22. The number of positioning parts is not limited, and those skilled in the art can set it according to actual needs. It is easy to understand that when the motherboard and the heat dissipation structure are assembled, each positioning part abuts against the motherboard. In one possible implementation, the positioning part includes a positioning post, and a through hole is formed on the motherboard for the top end of the positioning post to pass through. When the end of the positioning post passes through the through hole of the motherboard, the motherboard can be fixed in a position facing the heat sink 2. By setting the positioning parts, the positioning between the heat sink 2 and the motherboard is facilitated, which improves the assembly efficiency of the motherboard and ensures that the heat dissipation structure can reliably dissipate heat from the motherboard.

[0065] In one embodiment, see Figure 8 As a specific embodiment of the heat dissipation structure provided in this application, each positioning part includes a positioning block 25. The positioning block 25 can be a rectangular block structure. Multiple positioning blocks 25 can be divided into two groups. The two groups of positioning blocks 25 can be respectively arranged on the two second side ends 24 of the heat sink 2. A plurality of positioning blocks 25 in each group are spaced apart along the length direction of the heat sink 2. The top end of each positioning block 25 has a notch 251 for the motherboard to extend into. Specifically, the notch 251 of each positioning block 25 is located on the side of the top end of the positioning block 25 facing the center of the heat sink 2, and each notch 251 abuts against the edge of the motherboard.

[0066] In this embodiment, when the edge of the motherboard abuts against the notch 251 of each positioning block 25, each positioning block 25 can limit the motherboard, thereby improving the alignment accuracy and efficiency between the motherboard and the heat sink 2.

[0067] In one embodiment, see Figure 8 As a specific embodiment of the heat dissipation structure provided in this application, the heat dissipation structure also includes multiple fasteners. Multiple connecting posts 26, spaced apart from multiple positioning parts, are also installed on the heat sink 2. The number of connecting posts 26 is the same as the number of fasteners, and the axis of each connecting post 26 is perpendicular to the heat sink 2. Each connecting post 26 has a mounting hole 261, which, schematically, can be an internally threaded hole coaxial with the connecting post 26. Each fastener is used to pass through the motherboard and lock onto the corresponding connecting post 26. Specifically, the end of each connecting post 26 away from the heat sink 2 is used to abut against the motherboard. After passing through the motherboard, each fastener is screwed into the internally threaded hole of the corresponding connecting post 26, thereby locking the motherboard onto the corresponding connecting post 26. By providing connecting posts 26 on the heat sink 2, and using fasteners to lock the motherboard onto each connecting post 26 after each connecting post 26 abuts against the motherboard, a reliable connection between the motherboard and the heat sink 2 can be ensured, thereby enabling the heat sink 2 to reliably dissipate heat from the motherboard.

[0068] In one embodiment, see Figure 1 , Figure 5 and Figure 8 As a specific embodiment of the heat dissipation structure provided in this application, the heat sink 2 also has a cable pass-through hole 27, which is spaced apart from the first slot 21 and the second slot 22. In one possible implementation, the lighting device has a display screen mounted on the side of the heat sink 2 away from the motherboard, which can display the usage status of various functional components of the lighting device. The display screen and the motherboard transmit signals via a ribbon cable, with one end of the ribbon cable connected to the display screen and the other end passing through the cable pass-through hole 27 of the heat sink 2 and then to the motherboard. The shape and specific position of the cable pass-through hole 27 can be set according to the cables of the display screen and are not uniquely limited here. By providing the cable pass-through hole 27 on the heat sink 2, the cables of other components of the lighting device can pass through the cable pass-through hole 27 and be electrically connected to the motherboard.

[0069] This application also provides a lighting device including the heat dissipation structure provided in any of the above embodiments. In one possible implementation, the lighting device further includes a display screen and a motherboard, which are respectively mounted on opposite sides of the heat dissipation plate 2 of the heat dissipation structure, so that the heat dissipation structure can dissipate heat from the display screen and the motherboard respectively.

[0070] In this structure, the lighting device using the above-mentioned heat dissipation structure can limit the heat sink 2 by the first protrusion 11 and the second protrusion 12 on the plastic frame 1, thus preventing the heat sink 2 from coming out of the plastic frame 1 along its own thickness direction, and ensuring the heat dissipation effect of the heat sink 2 on the display screen and the motherboard.

[0071] The above are merely optional embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation structure, characterized in that, include: A plastic frame, wherein a first protrusion and a second protrusion are spaced apart on the inner circumferential surface of the plastic frame; A heat sink is installed inside the plastic frame, and the heat sink is provided with a first slot and a second slot respectively. The first protrusion extends into the first slot to push the heat sink plate in a first direction, and the second protrusion extends into the second slot to push the heat sink plate in a second direction. The first direction and the second direction are two directions that are opposite to each other along the thickness direction of the heat sink plate. Each first protrusion has a first protrusion extending from the main body of the first protrusion, and each second protrusion has a second protrusion extending from the main body of the second protrusion. When the first protrusion extends into the first slot and the second protrusion extends into the second slot, the first protrusion and the second protrusion are respectively located on both sides of the heat sink plate along its own thickness direction, and both the first protrusion and the second protrusion abut against the heat sink plate, so that the first protrusion pushes the heat sink plate in the first direction and the second protrusion pushes the heat sink plate in the second direction.

2. The heat dissipation structure as described in claim 1, characterized in that, The width of the first protrusion gradually decreases along the first direction, and the width of the first slot gradually decreases along the first direction; the width of the second protrusion gradually decreases along the second direction, and the width of the second slot gradually decreases along the second direction.

3. The heat dissipation structure as described in claim 2, characterized in that, The first protrusion has a first inclined surface and a second inclined surface, and the inner wall of the first slot has a first abutting surface that abuts against the first inclined surface and a second abutting surface that abuts against the second inclined surface; the second protrusion has a third inclined surface and a fourth inclined surface, and the inner wall of the second slot has a third abutting surface that abuts against the third inclined surface and a fourth abutting surface that abuts against the fourth inclined surface, the first abutting surface being parallel to the fourth abutting surface, and the second abutting surface being parallel to the third abutting surface.

4. The heat dissipation structure as described in claim 1, characterized in that, The inner circumferential surface of the plastic frame includes two opposing first side surfaces, and the heat dissipation plate includes two opposing first side ends. The number of first protrusions and the number of second protrusions are multiple, and a plurality of first protrusions and a plurality of second protrusions are alternately distributed on each first side surface. The number of first slots is the same as the number of first protrusions, and the number of second slots is the same as the number of second protrusions. A plurality of first slots and a plurality of second slots are alternately distributed on each first side end.

5. The heat dissipation structure as described in claim 4, characterized in that, The inner circumferential surface of the plastic frame also includes two opposing second side surfaces, which are respectively connected to two first side surfaces. The two second side surfaces and the two first side surfaces enclose an accommodating area for accommodating the heat sink. The heat sink also includes two opposing second side ends. A first slot group and a second slot group are arranged at intervals along the thickness direction of the heat sink on each second side end. The first slot group and the second slot group each include a plurality of third slots arranged at intervals along the length direction of the heat sink. The plurality of third slots in the first slot group and the plurality of third slots in the second slot group are staggered along the thickness direction of the heat sink. A plurality of third protrusions are provided on each second side surface. The plurality of third protrusions are divided into two groups. The two groups of third protrusions are respectively aligned with the first slot group and the second slot group. Each third protrusion extends into the corresponding third slot.

6. The heat dissipation structure as described in claim 1, characterized in that, The heat sink is provided with a plurality of positioning parts for supporting the motherboard, and the plurality of positioning parts are respectively spaced apart from the first card slot and the second card slot.

7. The heat dissipation structure as described in claim 6, characterized in that, Each of the positioning parts includes a positioning block, and each positioning block has a notch at its top for the motherboard to extend into.

8. The heat dissipation structure as described in claim 6, characterized in that, The heat dissipation structure also includes a number of fasteners; the heat dissipation plate is also equipped with a number of connecting posts spaced apart from the number of positioning parts, each of the connecting posts has a mounting hole, and each of the fasteners is used to pass through the motherboard and lock onto the corresponding connecting post.

9. The heat dissipation structure according to any one of claims 1-8, characterized in that, The heat sink is also provided with wire-passing holes, which are respectively spaced apart from the first card slot and the second card slot.

10. A lighting device, characterized in that, Includes the heat dissipation structure as described in any one of claims 1-9.

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