A silicon wafer loading and unloading system

Abstract

The present invention discloses a silicon wafer loading and unloading system, comprising a wafer guide device, a silicon wafer turning device and a conveying device. The wafer guide device controls the flow of silicon wafers to the silicon wafer turning device and controls the internal flow of a flower basket. The silicon wafer turning device controls the suction, turning and separation and combination of silicon wafers. The conveying device controls the flow of silicon wafers between a main machine and the silicon wafer turning device. The present invention adopts a sensor to detect the full or short state of the flower basket, thereby realizing fine control of the number of silicon wafers. The present invention adopts a through-beam sensor to detect the remaining silicon wafers in the flower basket, and simultaneously adopts a direction sensor to detect the direction of the flower basket, thereby preventing the flower basket from being reversed during transportation, thereby improving the degree of automated control of the equipment. The present invention realizes the loading process of silicon wafers from the wafer guide device to the main machine and the unloading process from the main machine to the wafer guide device, thereby realizing a cyclic loading and unloading process of silicon wafers.

Description

Technical Field

[0001] The invention belongs to the field of photovoltaics and relates to a silicon wafer loading and unloading system. Background Art

[0002] In the prior art, the unloading process of silicon wafers from the main machine to the wafer guide machine and the loading process from the wafer guide machine to the main machine are operated separately, which are complex in structure and high in cost. At the same time, the two sets of systems occupy a large space. This invention effectively solves this problem. Summary of the Invention

[0003] In order to overcome the deficiencies of the prior art, the present invention provides a silicon wafer loading and unloading system.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a silicon wafer loading and unloading system, characterized in that: it includes a wafer guide device, a silicon wafer turning device and a conveying device, the wafer guide device includes a loading guide assembly, a unloading guide assembly and a transverse conveying mechanism connecting the loading guide assembly and the unloading guide assembly, the loading guide assembly controls the silicon wafer loading process, the unloading guide assembly controls the silicon wafer unloading process, the transverse conveying mechanism circulates the flower baskets of the loading guide assembly and the unloading guide assembly, the silicon wafer turning device includes a silicon wafer turning mechanism, a silicon wafer transverse mechanism and a silicon wafer offset mechanism, the silicon wafer transverse mechanism and the silicon wafer offset mechanism control the movement of the silicon wafer turning mechanism, the silicon wafer turning mechanism controls the suction and turning of the silicon wafer, and the conveying device controls the flow of silicon wafers between the main machine and the silicon wafer turning device.

[0005] Furthermore, the loading guide assembly includes a loading incoming material docking conveying mechanism, a loading buffer conveying mechanism, a loading flower basket lifting mechanism, a loading flower basket conveying mechanism, a loading silicon wafer conveying mechanism, a loading silicon wafer buffer mechanism and a loading splicing mechanism. The loading flower basket conveying mechanism is located at the lower side of the loading flower basket lifting mechanism. The unloading guide assembly includes a unloading incoming material docking conveying mechanism, a unloading buffer conveying mechanism, a unloading flower basket lifting mechanism, a unloading flower basket conveying mechanism, a unloading silicon wafer conveying mechanism, a unloading silicon wafer buffer mechanism and a unloading splicing mechanism. The unloading flower basket conveying mechanism is located at the lower side of the unloading flower basket lifting mechanism. The transverse conveying mechanism is respectively connected to the loading flower basket conveying mechanism and the unloading flower basket conveying mechanism. The flower basket flows between the loading guide assembly and the unloading guide assembly through the loading flower basket conveying mechanism, the transverse conveying mechanism and the unloading flower basket conveying mechanism.

[0006] Furthermore; the silicon wafer flipping mechanism includes a suction component, the suction component includes a flipping motor and a suction component, the flipping motor and the suction component control the flipping of the silicon wafer, and there are two groups of suction components, one group of flipping motors is connected to the two groups of suction components, one group of suction components includes a first suction plate and a suction cup, and the other group of suction components includes a second suction plate and a suction cup, the output shaft of the flipping motor is respectively connected to the first suction plate and the second suction plate, and a number of suction cups are sequentially installed on the first suction plate and the second suction plate, and the spacing between the suction cups on the first suction plate and the second suction plate matches the spacing between the two groups of feeding and splicing mechanisms, and the suction cups suck or place the silicon wafers.

[0007] Furthermore, the transport device includes a flower basket positioning and moving mechanism, a flower basket silicon wafer lifting mechanism, a silicon wafer regularization mechanism, a quartz boat silicon wafer lifting mechanism, a suction cup transverse movement mechanism, a quartz boat positioning and moving mechanism, a quartz boat flipping and transporting assembly and a quartz boat support and conveying mechanism. The flower basket positioning and moving mechanism, the flower basket silicon wafer lifting mechanism, the quartz boat silicon wafer lifting mechanism, the suction cup transverse movement mechanism and the quartz boat positioning and moving mechanism control the transport and flow of silicon wafers. The silicon wafer regularization mechanism lifts the flower basket silicon wafer lifting mechanism and adjusts the silicon wafers in the quartz boat silicon wafer lifting mechanism. The quartz boat flipping and transporting assembly transports and flips the quartz boat. The quartz boat support and conveying mechanism is connected to the host to control the input or output of silicon wafers into or out of the host.

[0008] Furthermore; the flower basket positioning and moving mechanism is provided with two groups, including a supporting assembly for carrying the flower basket and a driving assembly for moving the supporting assembly, the driving assembly drives the supporting assembly for transporting silicon wafers; the flower basket silicon wafer jacking mechanism includes a carrying frame and a jacking assembly, the carrying frame includes a jacking power assembly, the jacking power assembly controls the lifting and lowering of the jacking assembly, the jacking assembly includes a jacking connecting plate and a jacking part, the jacking part includes a jacking frame assembly, a top tooth fixing plate and a top tooth assembly, the top tooth assembly is installed on the jacking frame plate through the top tooth fixing plate, the top tooth assembly is composed of a plurality of top teeth, and a group of top teeth is provided with a plurality of slots, and the silicon wafers are imported into or exported from the slots.

[0009] Furthermore, the jacking frame assembly is composed of two groups of jacking frame plates distributed horizontally and symmetrically, one group of jacking parts is provided with two groups of top tooth assemblies, one group of top tooth assemblies corresponds to one group of jacking frame plates, the top tooth fixing plate is fixedly connected to the jacking frame plate, the top tooth assembly is fixedly connected to the top tooth fixing plate, a connection stabilization device is provided between the top tooth fixing plate and the jacking frame plate, the connection stabilization device includes a connection stabilization fixing part and a connection stabilization adjustment part, the connection stabilization fixing part and the connection stabilization adjustment part are fixedly connected, and the connection stabilization fixing part is fixedly connected to the connection stabilization adjustment part. The part is fixedly connected to the lower end surface of the top tooth fixing plate, the connection stabilization adjustment part is opposite to the jacking frame plate, the connection stabilization adjustment part is fixedly provided with a connection stabilization through-hole, the connection stabilization through-hole is provided with a connection stabilization adjustment rod, the jacking frame plate is fixedly provided with a frame adjustment waist hole, the connection stabilization adjustment rod extends into the frame adjustment waist hole, and the position of the top tooth fixing plate relative to the jacking frame plate is controlled by adjusting the length of the connection stabilization adjustment rod extending into the frame adjustment waist hole. Adjacent top teeth are connected, and a guide cavity is provided at the upper end of the slot. The spacing between adjacent slots on each group of top tooth components is kept consistent, so that the silicon wafers are introduced into the slots in sequence.

[0010] Furthermore, the silicon wafer regularization mechanism includes a silicon wafer regularization component and a silicon wafer regularization limiting component. The silicon wafer regularization component includes a silicon wafer regularization power component and a silicon wafer regularization adjustment component. The silicon wafer regularization power component drives the silicon wafer regularization adjustment component to move relative or oppositely. The silicon wafer regularization limiting component limits the movement of the silicon wafer regularization adjustment component and detects the silicon wafer.

[0011] Furthermore, the quartz boat silicon wafer lifting mechanism includes a silicon wafer lifting moving assembly and a quartz boat top tooth assembly. The power assembly of the silicon wafer lifting moving assembly controls the reciprocating movement of the quartz boat top tooth assembly. The quartz boat top tooth assembly ejects the silicon wafer located in the quartz boat positioning moving mechanism or places the silicon wafer located in the quartz boat top tooth assembly into the quartz boat positioning moving mechanism. The suction cup transverse movement mechanism includes a transverse movement mechanism and a silicon wafer separation moving mechanism. The silicon wafer suction and separation device controls the suction and separation of the silicon wafer. The transverse movement mechanism controls the horizontal movement of the silicon wafer suction and separation device, thereby controlling the flow of silicon wafers between the flower basket silicon wafer lifting mechanism and the quartz boat silicon wafer lifting mechanism. The quartz boat support conveying mechanism includes a quartz boat support assembly that carries the quartz boat support and a moving assembly that drives the quartz boat support assembly to move. The moving assembly includes a conveying power assembly, and the conveying power assembly drives the quartz boat support assembly to move.

[0012] Furthermore, the transverse conveying mechanism includes a flow conveying component and a flow moving component, the flow moving component includes a transverse moving force component, the transverse moving force component drives the flow conveying component to move relative to the flow moving component, the flow conveying component is respectively connected to the loading flower basket conveying mechanism and the unloading flower basket conveying mechanism, the upper end surface of the flow conveying component is in the same horizontal plane as the upper end surface of the loading flower basket conveying mechanism and the unloading flower basket conveying mechanism, which facilitates the flow of flower baskets.

[0013] Furthermore, the length of the loading and incoming material docking conveying mechanism can accommodate the simultaneous conveying of multiple groups of flower baskets. The loading and incoming material docking conveying mechanism is fixed with incoming material blocking cylinders at both ends of the conveying direction, and two symmetrical groups of incoming material shooting sensors are fixed on both sides. The two groups of incoming material shooting sensors and the incoming material blocking cylinders operate synchronously to convey the flower baskets one by one to the loading buffer conveying mechanism. The loading and incoming material docking conveying mechanism is provided with an incoming material weight sensor, which detects the full or insufficient state of the flower basket.

[0014] In summary, the present invention is beneficial in that:

[0015] 1) The present invention uses sensors to detect the full or insufficient state of the flower basket, thereby achieving precise control of the number of silicon wafers. The present invention uses a through-beam sensor to detect the remaining silicon wafers in the flower basket, and uses an orientation sensor to detect the orientation of the flower basket, thereby preventing the flower basket from being reversed during transportation and improving the degree of automated control of the equipment.

[0016] 2) The present invention realizes the purpose of sequentially introducing the silicon wafers transported on the silicon wafer output assembly into the loading and splicing slot by controlling the lifting and lowering of the splicing assembly by the splicing lifting assembly, and realizes the purpose of sequentially introducing the silicon wafers transported on the silicon wafer output assembly into the cache slot by controlling the lifting and lowering of the cache assembly by the cache lifting assembly.

[0017] 3) The present invention realizes the loading process of silicon wafers from the wafer guide device to the host computer and the unloading process from the host computer to the wafer guide device, realizing the cyclic loading and unloading process of silicon wafers.

[0018] 4) The present invention inserts suction cups into adjacent loading and unloading slots in sequence to absorb or place silicon wafers, thereby realizing the export or introduction of silicon wafers into the wafer guide device, and the silicon wafer flipping mechanism realizes the flipping of silicon wafers. In the loading system, a group of suction components are used to flip the silicon wafers sucked from the loading and unloading mechanism to pre-process the subsequent back-to-back wafer bonding. In the unloading system, another group of suction components are used to flip the back-to-back silicon wafers so that the silicon wafers introduced into the unloading and unloading mechanism have the same orientation.

[0019] 5) The present invention designs a jacking connection adjustment hole on the top gear fixing plate to fine-tune the installation of the top gear fixing plate and the jacking frame plate. On the one hand, it reduces the adaptability of the two and reduces the processing requirements of the two. On the other hand, it prevents the problem of unstable installation of the two after long-term use and wear, thereby increasing the service life of the parts. The present invention designs a connection stabilization device, which not only facilitates the adjustment of the position of the top gear fixing plate and the jacking frame plate, but also fixes the installation of the two on the side to ensure the stability of the installation of the two. The present invention designs a funnel-shaped guide cavity at the upper end of the slot to facilitate the introduction and export of silicon wafers. The present invention designs a top gear installation cavity on the top gear fixing plate to facilitate the positioning and installation of the top gear fixing plate and the top gear.

[0020] 6) The present invention designs a wafer aligning mechanism to align the wafers in the flower basket wafer lifting mechanism, ensuring the neatness of the wafers, facilitating the next operation, and improving efficiency. The present invention controls the synchronous movement of the wafer aligning adjustment plate through the wafer aligning cylinder, thereby improving the aligning efficiency of the wafers. The present invention designs the wafer aligning slot hole as an open structure, which is convenient for the entry and exit of the wafers. The present invention uses a wafer aligning limiting component to prevent the wafer aligning slider from moving beyond the limit. At the same time, the wafer aligning sensor can determine whether there are wafers on the flower basket wafer lifting mechanism to prevent the problem of empty lifting. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a top view of the device of the present invention.

[0022] Figure 2 It is a schematic diagram of the film guide device of the present invention.

[0023] Figure 3 This is a schematic diagram of the assembly of the silicon wafer feeding conveying mechanism and the silicon wafer feeding buffer mechanism of the present invention.

[0024] Figure 4 It is a schematic diagram of the feeding and splicing mechanism of the present invention.

[0025] Figure 5 Schematic diagram of the silicon wafer turning device and transport device of the present invention.

[0026] Figure 6 Schematic diagram of the silicon wafer flipping device of the present invention.

[0027] Figure 7 Schematic diagram of the silicon wafer flipping mechanism of the present invention.

[0028] Figure 8 This is a schematic diagram of the flower basket silicon wafer lifting mechanism of the present invention.

[0029] Figure 9 for Figure 8 A is an enlarged schematic diagram.

[0030] Figure 10 Schematic diagram of the connection stabilization device of the present invention.

[0031] Figure 11 Schematic diagram of the silicon wafer regularization mechanism of the present invention.

[0032] Markings in the figure: feeding incoming material docking conveying mechanism 11, feeding material buffer conveying mechanism 12, feeding flower basket lifting mechanism 13, feeding flower basket conveying mechanism 14, feeding silicon wafer conveying mechanism 15, feeding silicon wafer buffer mechanism 16, feeding wafer splicing mechanism 17, unloading incoming material docking conveying mechanism 21, unloading material buffer conveying mechanism 22, unloading flower basket lifting mechanism 23, unloading flower basket conveying mechanism 24, unloading silicon wafer conveying mechanism 25, unloading silicon wafer buffer mechanism 26, unloading wafer splicing mechanism 27, transverse conveying mechanism 30, incoming material blocking cylinder 111, incoming material shooting sensor 112, cache blocking cylinder 12, cache shooting sensor 122, lifting and conveying assembly 131, basket lifting assembly 132, shooting sensor 133, silicon wafer input assembly 151, silicon wafer conveying adjustment 152, silicon wafer output assembly 153, wafer splicing assembly 171, wafer splicing lifting assembly 172, wafer splicing plate 173, buffer assembly 161, buffer lifting assembly 162, buffer plate 163, flow conveying assembly 301, flow moving assembly 302, silicon wafer turning mechanism 40, silicon wafer transverse movement mechanism 41, silicon wafer offset mechanism 42, suction assembly 400, turning motor 401, first U-shaped sensor 402, baffle 403, first suction plate 404, second Suction plate 405, second U-shaped sensor 406, longitudinal movement assembly 407, suction cup 409, flower basket positioning and moving mechanism 50, flower basket silicon wafer lifting mechanism 51, silicon wafer regularization mechanism 52, quartz boat silicon wafer lifting mechanism 53, suction cup transverse movement mechanism 54, quartz boat positioning and moving mechanism 55, quartz boat flipping and transporting assembly 56, quartz boat support and conveying mechanism 57, supporting assembly 501, driving assembly 502, carrying frame 511, guide cavity 51233, quartz boat support assembly 572, moving assembly 571, suction assembly 400, lifting assembly 512, lifting power assembly 513, lifting part 5121, lifting Frame assembly 51210, top tooth fixing plate 5122, top tooth assembly 5123, lifting frame assembly 51210, top tooth 51231, silicon wafer regularization fixing plate 521, silicon wafer regularization cylinder 522, silicon wafer regularization moving assembly 523, silicon wafer regularization slide rail 524, silicon wafer regularization slider 525, silicon wafer regularization connecting plate 5231, silicon wafer regularization adjustment plate 5232, silicon wafer regularization slider plate 5233, silicon wafer regularization slot plate 527, silicon wafer regularization buckle plate 528, silicon wafer regularization slot hole 5271, silicon wafer regularization limiting block 526, silicon wafer regularization adjustment rod 5261, silicon wafer regularization sensor 529. DETAILED DESCRIPTION

[0033] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0034] It should be noted that the illustrations provided in the following embodiments are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be changed arbitrarily, and the component layout may also be more complex.

[0035] All directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, horizontal, vertical...) are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0036] Example 1:

[0037] like Figure 1-11 As shown, a silicon wafer loading and unloading system includes a wafer guide device, a silicon wafer turning device and a conveying device, the wafer guide device includes a loading guide assembly, a unloading guide assembly and a transverse conveying mechanism 30 connecting the loading guide assembly and the unloading guide assembly, the loading guide assembly controls the silicon wafer loading process, the unloading guide assembly controls the silicon wafer unloading process, the transverse conveying mechanism 30 circulates the flower baskets of the loading guide assembly and the unloading guide assembly, the silicon wafer turning device includes a silicon wafer turning mechanism 40, a silicon wafer transverse mechanism 41 and a silicon wafer offset mechanism 42, the silicon wafer transverse mechanism 41 and the silicon wafer offset mechanism 42 control the movement of the silicon wafer turning mechanism 40, the silicon wafer turning mechanism 40 controls the suction and turning of the silicon wafer, and the silicon wafer turning device conveying device controls the flow of silicon wafers between the host and the silicon wafer turning device.

[0038] The feeding guide assembly includes a feeding incoming material docking conveying mechanism 11, a feeding buffer conveying mechanism 12, a feeding basket lifting mechanism 13, a feeding basket conveying mechanism 14, a feeding silicon wafer conveying mechanism 15, a feeding silicon wafer buffer mechanism 16 and a feeding piece mechanism 17. The feeding basket conveying mechanism 14 is located at the lower side of the feeding basket lifting mechanism 13. The unloading guide assembly includes a unloading incoming material docking conveying mechanism 21, a unloading buffer conveying mechanism 22, an unloading basket lifting mechanism 2 3. The unloading flower basket conveying mechanism 24, the unloading silicon wafer conveying mechanism 25, the unloading silicon wafer buffer mechanism 26 and the unloading wafer splicing mechanism 27. The unloading flower basket conveying mechanism 24 is located on the lower side of the unloading flower basket lifting mechanism 23. The transverse conveying mechanism 30 is respectively connected to the loading flower basket conveying mechanism 14 and the unloading flower basket conveying mechanism 24. The flower basket flows between the loading flower basket conveying mechanism 14, the transverse conveying mechanism 30 and the unloading flower basket conveying mechanism 24.

[0039] In this embodiment, the loading guide assembly and the unloading guide assembly have the same structure. The loading guide assembly and the unloading guide assembly are respectively provided with two groups symmetrically distributed. The loading guide assembly is taken as an example for explanation below. The loading and incoming material docking conveying mechanism 11 adopts an AGV conveyor line, and its length can accommodate multiple groups of flower baskets for simultaneous transportation. The loading and incoming material docking conveying mechanism 11 is fixed with incoming material blocking cylinders 111 at both ends of the conveying direction. Two symmetrical groups of incoming material matching sensors 112 are fixed on both sides of the end face of the loading and incoming material docking conveying mechanism 11 near the loading and incoming material buffer conveying mechanism 12. The two groups of incoming material matching sensors 112 and the incoming material blocking cylinders 111 cooperate to achieve the purpose of conveying the flower baskets one by one to the loading and incoming material buffer conveying mechanism 12 in sequence. In addition, the loading and incoming material docking conveying mechanism 11 is also provided with a number of sensors (not shown in the figure). The number of sensors is consistent with the number of flower baskets carried by the loading and incoming material docking conveying mechanism 11 at one time, and the spacing between adjacent sensors is adjustable. The sensors detect the full or insufficient state of the flower basket, thereby realizing fine control of the number of silicon wafers.

[0040] The length of the loading buffer conveying mechanism 12 matches the length of a single flower basket, that is, the loading buffer conveying mechanism 12 is used to convey a single flower basket. The loading buffer conveying mechanism 12 is fixedly provided with a cache blocking cylinder 12 on the end face in the conveying direction. Two symmetrical groups of cache opposing beam sensors 122 are fixedly provided on both sides of the cache blocking cylinder 12. The two groups of cache opposing beam sensors 122 and the cache blocking cylinder 12 cooperate together to achieve the purpose of conveying a single flower basket and control the flower basket conveying speed and time at the same time. In this embodiment, the loading flower basket conveying mechanism 14 has the same structure as the loading buffer conveying mechanism 12.

[0041] The loading flower basket lifting mechanism 13 includes a lifting and conveying assembly 131 and a flower basket lifting assembly 132. The flower basket lifting assembly 132 controls the lifting and conveying assembly 131. The length of the lifting and conveying assembly 131 matches the length of a single flower basket. The loading buffer conveying mechanism 12 conveys a single flower basket to the lifting and conveying assembly 131. The flower basket on the lifting and conveying assembly 131 is fixed by a clamping device to prevent the loading silicon wafer conveying mechanism 15 from shifting when removing the wafer, thereby affecting the wafer removal efficiency. In this embodiment, the flower basket lifting assembly 132 uses a ball screw transmission to control the lifting and conveying assembly 131. The loading flower basket lifting mechanism 13 also includes a beam sensor 133 for detecting the remaining silicon wafers in the flower basket and an orientation sensor (not shown) for detecting the orientation of the incoming flower basket. The orientation sensor prevents the flower basket from being placed upside down during transportation.

[0042] The loading silicon wafer conveying mechanism 15 includes a silicon wafer input component 151, a silicon wafer conveying adjustment 152 and a silicon wafer output component 153. The silicon wafer input component 151 extends to the loading flower basket lifting mechanism 13. The silicon wafers in the flower basket on the loading flower basket lifting mechanism 13 are taken out through the silicon wafer input component 151, and the function of taking out the wafers in sequence is realized through the flower basket lifting component 132. The silicon wafer output component 153 extends the loading silicon wafer buffer mechanism 16 and the loading wafer splicing mechanism 17 in sequence. The silicon wafers are conveyed from the silicon wafer input component 151 to the silicon wafer output component 153, and the silicon wafers flow into the loading wafer splicing mechanism 17 through the silicon wafer output component 153. The silicon wafer conveying adjustment 152 is located between the silicon wafer input component 151 and the silicon wafer output component 153. The silicon wafer conveying adjustment 152 adjusts the silicon wafers so that the silicon wafers remain neat during the transmission process, facilitate the inflow of silicon wafers, and improve the inflow efficiency of silicon wafers.

[0043] The loading silicon wafer cache mechanism 16 is located between the loading silicon wafer conveying mechanism 15 and the loading wafer splicing mechanism 17. The loading silicon wafer cache mechanism 16 includes a cache component 161 and a cache lifting component 162. The cache component 161 includes two groups of symmetrically arranged cache plates 163. The cache lifting component 162 uses a ball transmission method to control the lifting and lowering of the cache component 161. The two groups of cache plates 163 are respectively provided with a number of cache slots (not marked in the figure). The length direction of the cache slot is consistent with the silicon wafer conveying direction of the silicon wafer output component 153. Adjacent cache slots are arranged vertically and parallel. The loading silicon wafer cache mechanism 16 serves as a mechanism for temporarily storing silicon wafers to avoid the situation where the loading wafer splicing slots in the loading wafer splicing mechanism 17 are full of silicon wafers but no wafers are taken. At the same time, the lifting and lowering control of the cache component 161 by the cache lifting component 162 is achieved, so that the silicon wafers conveyed on the silicon wafer output component 153 are introduced into the cache slots in sequence.

[0044] The feeding splicing mechanism 17 includes a splicing assembly 171 and a splicing lifting assembly 172. The splicing assembly 171 includes two groups of symmetrically arranged splicing plates 173 and a power assembly that drives one group of splicing plates 173 to move. The splicing lifting assembly 172 uses a ball transmission method to control the lifting and lowering of the splicing assembly 171, and the power assembly uses a ball screw transmission method to move a group of splicing plates 173, thereby controlling the spacing between the two groups of splicing plates 173. The opposite sides of the two groups of splicing plates 173 are respectively fixed with a number of feeding splicing grooves (not marked in the figure). The length direction of the feeding splicing groove is consistent with the silicon wafer conveying direction of the silicon wafer output assembly 153. Adjacent feeding splicing grooves are arranged vertically and parallel, and the silicon wafers flow into the feeding splicing grooves. The splicing lifting assembly 172 controls the lifting and lowering of the splicing assembly 171, thereby achieving the purpose of sequentially introducing the silicon wafers conveyed on the silicon wafer output assembly 153 into the feeding splicing grooves.

[0045] The transverse conveying mechanism 30 includes a flow conveying component 301 and a flow moving component 302. The flow moving component 302 includes a transverse moving force component. The transverse moving force component uses a ball screw transmission to drive the flow conveying component 301 to move relative to the flow moving component 302. During the movement, the flow conveying component 301 is respectively connected with the loading flower basket conveying mechanism 14 and the unloading flower basket conveying mechanism 24. The upper end surface of the flow conveying component 301 is in the same horizontal plane as the upper end surfaces of the loading flower basket conveying mechanism 14 and the unloading flower basket conveying mechanism 24, ensuring a smooth transition of the flower basket.

[0046] The silicon wafer flipping device includes a silicon wafer flipping mechanism 40, a silicon wafer lateral movement mechanism 41 and a silicon wafer offset mechanism 42. The silicon wafer lateral movement mechanism 41 includes a silicon wafer lateral movement force component, and the silicon wafer offset mechanism 42 includes a silicon wafer offset power component. The silicon wafer lateral movement force component and the silicon wafer offset power component adopt a ball screw transmission method. Through the above-mentioned driving method, the silicon wafer flipping mechanism 40 is moved in the horizontal direction to realize the transportation of the silicon wafer. The silicon wafer flipping mechanism 40 includes a suction component 400, and the suction component 400 includes a flipping motor 401 and a suction component 408. The flipping motor 401 and the suction component 408 control the flipping of the silicon wafer.

[0047] The wafer flipping mechanism 40 includes a longitudinal movement component 407 and a suction component 400. The longitudinal movement component 407 includes a power component. The power component uses a ball screw transmission to drive the suction component 400 to move vertically relative to the longitudinal movement component 407. The suction component 400 includes a flip motor 401 and a suction member 408. The suction member 408 is provided with two groups. One group of flip motors 401 is connected to the two groups of suction members 408. In this embodiment, Figure 7As shown, one group of suction components 408 includes a first suction plate 404 and a suction cup 409, and the other group of suction components 408 includes a second suction plate 405 and a suction cup 409. The output shaft of the flip motor 401 is connected to the first suction plate 404 and the second suction plate 405 respectively. A plurality of suction cups 409 are sequentially installed on the first suction plate 404 and the second suction plate 405. The spacing between the suction cups 409 on the first suction plate 404 and the second suction plate 405 matches the spacing between the two groups of feeding and splicing mechanisms 17. The suction cups 409 are sequentially inserted into adjacent feeding and splicing slots or unloading and splicing slots to absorb or place the silicon wafers, thereby achieving When the silicon wafer is exported or imported into the wafer guide device, the second suction plate 405 is horizontally flipped relative to the first suction plate 404 at a flipping angle of 180 degrees. Before and after the second suction plate 405 is flipped, the second suction plate 405 and the first suction plate 404 remain parallel, thereby realizing the flipping of the silicon wafer. In the loading system, the silicon wafer sucked from the loading and splicing mechanism 17 is flipped by the second suction plate 405 to pre-process the subsequent back-to-back silicon wafers. In the unloading system, the back-to-back silicon wafers are flipped by the second suction plate 405 to make the silicon wafers introduced into the unloading and splicing mechanism 27 have the same orientation.

[0048] The silicon wafer flipping mechanism also includes a coordinated first U-shaped sensor 402 and baffle 403 and a coordinated second U-shaped sensor 406 and flip baffle (not shown in the figure). The first U-shaped sensor 402 and baffle 403 cooperate to detect the horizontal state of the first suction plate 404 and the second suction plate 405, and the second U-shaped sensor 406 and flip baffle cooperate to detect the flipping state of the second suction plate 405.

[0049] The transport device includes a flower basket positioning and moving mechanism 50, a flower basket silicon wafer lifting mechanism 51, a silicon wafer regularization mechanism 52, a quartz boat silicon wafer lifting mechanism 53, a suction cup transverse movement mechanism 54, a quartz boat positioning and moving mechanism 55, a quartz boat flipping and transporting assembly 56 and a quartz boat support and conveying mechanism 57. The flower basket positioning and moving mechanism 50, the flower basket silicon wafer lifting mechanism 51, the quartz boat silicon wafer lifting mechanism 53, the suction cup transverse movement mechanism 54 and the quartz boat positioning and moving mechanism 55 control the transport and flow of silicon wafers. The silicon wafer regularization mechanism 52 lifts the flower basket silicon wafer lifting mechanism 51 and adjusts the silicon wafers in the quartz boat silicon wafer lifting mechanism 53. The quartz boat flipping and transporting assembly 56 transports and flips the quartz boat. The quartz boat support and conveying mechanism 57 is connected to the host to control the input or output of silicon wafers into or out of the host.

[0050] The flower basket positioning and moving mechanism 50 is provided with two groups, which include a supporting component 501 for carrying the flower basket and a driving component 502 for moving the supporting component 501. In this embodiment, one group of driving components 502 is connected to the two groups of supporting components 501, that is, one group of driving components 502 drives the two groups of supporting components 501 to move. The driving component 502 includes a moving positioning power component, and the moving positioning power component uses a ball screw transmission method to drive the supporting component 501 to realize the transportation of silicon wafers.

[0051] The flower basket silicon wafer lifting mechanism 51 includes a supporting frame 511 and a lifting assembly 512. The supporting frame 511 includes a lifting power assembly 513. The lifting power assembly 513 controls the lifting and lowering of the lifting assembly 512. The lifting assembly 512 includes a lifting connecting plate 5120 and a lifting member 5121. The lifting member 5121 includes a lifting frame assembly 51210, a top tooth fixing plate 5122 and a top tooth assembly 5123. The top tooth assembly 5123 is installed on the lifting frame plate through the top tooth fixing plate 5122. The top tooth assembly 5123 is composed of a plurality of top teeth 51231. A group of top teeth 51231 is provided with a plurality of slots 51234. Silicon wafers are introduced into or out of the slots 51234.

[0052] The lifting power assembly 513 adopts a ball screw transmission method.

[0053] There are two groups of lifting members 5121, which are installed at both ends of the lifting connecting plate 5120 in a horizontally symmetrical manner. The spacing between the two groups of lifting members 5121 matches the spacing between the two groups of suction members 408. The lifting assembly 512 lifts the silicon wafer from the supporting assembly 501 or transfers the silicon wafer to the supporting assembly 501. The lifting frame assembly 51210 is composed of two groups of horizontally symmetrically distributed lifting frame plates (not shown in the figure), and the lifting frame plates are connected by lifting frame connecting rods. In this embodiment, a group of lifting members 5121 is provided with two groups of top tooth assemblies 5123, and the two groups of top tooth assemblies 5123 correspond to a group of supporting assemblies 501, that is, the two groups of top tooth assemblies 5123 lift the silicon wafer located in a group of supporting assemblies 501 or place the silicon wafer in a group of supporting assemblies 501. In this embodiment, a group of top tooth assemblies 5123 corresponds to a group of lifting frame plates.

[0054] like Figure 8-9As shown, in this embodiment, the top gear fixing plate 5122 is fixedly connected to the jacking frame plate, and the top gear assembly 5123 is fixedly connected to the top gear fixing plate 5122, thereby realizing the relative fixed installation of the top gear assembly 5123 and the jacking frame plate. Specifically, a plurality of jacking connection through holes 51213 are provided on the jacking frame plate, and a jacking connection adjustment hole 51221 matching the jacking connection through holes 51213 is fixed on the top gear fixing plate 5122, and the jacking connection through holes 51213 and the jacking connection adjustment hole 51221 are one-to-one. The fixed connection between the two can be achieved through corresponding connecting devices (not shown in the figure). Conventional devices such as bolts and screws can be used for the connecting devices. The design of the lifting connection adjustment hole 51221 can fine-tune the installation of the two. On the one hand, it can reduce the adaptability of the two and reduce the processing requirements of the two. On the other hand, it can prevent the problem of unstable installation of the two after long-term use and wear, thereby increasing the service life of the parts. Preferably, in order to further ensure the stability of the installation of the two, a connection stabilization device 5124 is also provided between the two. Figure 10 As shown, the connection and stabilization device 5124 includes a connection and stabilization fixing part 51241 and a connection and stabilization adjustment part 51242. The connection and stabilization fixing part 51241 and the connection and stabilization adjustment part 51242 are fixedly connected. The connection and stabilization fixing part 51241 is fixedly connected to the lower end surface of the top tooth fixing plate 5122. The connection and stabilization adjustment part 51242 is opposite to the jacking frame plate. A connection and stabilization through-hole 51243 is fixedly provided on the connection and stabilization adjustment part 51242. The connection and stabilization through-hole 51243 is provided with a connection and stabilization adjustment rod 51241. The jacking frame plate is fixedly provided with a frame adjustment waist hole 51211. The connection and stabilization adjustment rod 51241 extends into the frame adjustment waist hole 51211. By adjusting the length of the connection and stabilization adjustment rod 51241 extending into the frame adjustment waist hole 51211, the position of the top tooth fixing plate 5122 relative to the jacking frame plate is controlled, which not only facilitates the adjustment of the positions of the two, but also fixes the installation of the two on the side to ensure the stability of the installation of the two.

[0055] The adjacent top teeth 51231 are tightly connected, and a cushion block 51235 for buffering is fixed on the lower end surface of the slot 51234. The upper end of the slot 51234 is connected to a guide cavity 51233. The side angles of the two groups of guide cavities 51233 are set to an acute angle, and the angle between the side of each group of guide cavities 51233 and the side of the slot 51234 is set to an obtuse angle. The cross-section of the guide cavity 51233 and the slot 51234 forms a funnel-shaped structure, which is convenient for the introduction and export of silicon wafers. The spacing between adjacent slots 51234 on each group of top tooth components 5123 is kept consistent, so that the silicon wafers can be introduced into the slots 51234 in sequence.

[0056] A plurality of top tooth connecting holes 51232 are fixedly provided on the top tooth 51231, and a top tooth fixing hole 51222 matching the top tooth connecting holes 51232 is fixedly provided on the top tooth fixing plate 5122. The top tooth connecting holes 51232 correspond to the top tooth fixing holes 51222 one-to-one, and a fixed connection between the two is achieved by a corresponding connecting device (not shown in the figure). The connecting device can adopt a conventional device, such as a bolt, a screw, etc. Furthermore, a top tooth mounting cavity 51223 is fixedly provided on the top tooth fixing plate 5122, and the lower end surface of the top tooth assembly 5123 is against the top tooth mounting cavity 51223, which facilitates the positioning and installation of the top tooth fixing plate 5122 and the top tooth 51231.

[0057] The silicon wafer regularization mechanism 52 includes a silicon wafer regularization component and a silicon wafer regularization limiting component. The silicon wafer regularization component includes a silicon wafer regularization power component and a silicon wafer regularization adjustment component. The silicon wafer regularization power component drives the silicon wafer regularization adjustment component to move relative to or opposite to each other. The silicon wafer regularization limiting component limits the movement of the silicon wafer regularization adjustment component and detects the silicon wafer. In this embodiment, the silicon wafer regularization components are set in two groups and are symmetrically arranged. The silicon wafer regularization power component includes a silicon wafer regularization fixing plate 521. A silicon wafer regularization cylinder 522 is fixed on the silicon wafer regularization fixing plate 521. The silicon wafer regularization cylinder 522 is connected to the silicon wafer regularization adjustment component. The silicon wafer regularization adjustment component is connected to include a silicon wafer regularization moving component 523. The silicon wafer regularization moving component 523 includes a silicon wafer regularization connecting plate 5231 And the silicon wafer regularization adjustment plate 5232, the silicon wafer regularization connecting plate 5231 and the silicon wafer regularization adjustment plate 5232 are fixedly connected, the silicon wafer regularization connecting plate 5231 is fixedly connected to the output shaft of the silicon wafer regularization cylinder 522, the silicon wafer regularization cylinder 522 drives the silicon wafer regularization adjustment plate 5232 to move through the silicon wafer regularization connecting plate 5231, a silicon wafer regularization slide rail 524 is fixedly provided on the silicon wafer regularization fixed plate 521, a silicon wafer regularization slider 525 is slidingly provided on the silicon wafer regularization slide rail 524, a silicon wafer regularization slider plate 5233 is fixedly provided on the silicon wafer regularization slider 525, and the silicon wafer regularization slider plate 5233 is fixedly connected to the silicon wafer regularization adjustment plate 5232 through the silicon wafer regularization reinforcement plate 5234. In this embodiment, the silicon wafer regularization cylinders 522 of the two groups of silicon wafer regularization assemblies control the two groups of silicon wafer regularization adjustment plates 5232 to move synchronously relative to or oppositely, such as Figure 11As shown, the two sets of silicon wafer regularization adjustment plates 5232 are respectively fixed with silicon wafer regularization slot plates 527 and silicon wafer regularization buckle plates 528 on opposite sides. The silicon wafer regularization slot plates 527 are fixed with silicon wafer regularization slot holes 5271. The number and position of the silicon wafer regularization slot holes 5271 match the number and position of the silicon wafers on the flower basket silicon wafer lifting mechanism 51. The corresponding silicon wafer regularization slot holes 5271 on the two sets of silicon wafer regularization slot plates 527 are fixed with silicon wafer regularization slot holes 5271. The connecting line is parallel to the silicon wafer on the flower basket silicon wafer lifting mechanism 51, and the opening direction of the silicon wafer regularization slot hole 5271 is opposite to the silicon wafer. When the silicon wafer regularization mechanism 52 adjusts the silicon wafer, the silicon wafer regularization cylinder 522 controls the two groups of silicon wafer regularization adjustment plates 5232 to move synchronously relative to each other, so that the two sides of the silicon wafer are buckled into the silicon wafer regularization slot hole 5271, and the silicon wafer regularization buckle plate 528 restricts the insertion of the silicon wafer regularization slot hole 5271; the silicon wafer regularization slot hole 5271 is designed as an open structure to facilitate the entry and exit of the silicon wafer.

[0058] The silicon wafer regularization limiting assembly is located between the two groups of silicon wafer regularization assemblies. The silicon wafer regularization limiting assembly includes a silicon wafer regularization limiting block 526. The two groups of side surfaces of the silicon wafer regularization limiting block 526 opposite to the silicon wafer regularization slider 525 are fixed with silicon wafer regularization adjusting rods 5261. The end face of the silicon wafer regularization adjusting rod 5261 can be provided with elastic material to prevent the silicon wafer regularization slider 525 from moving beyond the limit. A silicon wafer regularization sensor 529 is fixed on the silicon wafer regularization limiting block 526. The silicon wafer regularization sensor 529 is used to detect the full or insufficient material status of the flower basket silicon wafer lifting mechanism 51 to prevent the problem of empty lifting.

[0059] The quartz boat silicon wafer lifting mechanism 53 includes a silicon wafer lifting moving component and a quartz boat top gear component. The power component of the silicon wafer lifting moving component uses a ball screw drive to drive the quartz boat top gear component to move back and forth. The quartz boat top gear component pushes out the silicon wafer located in the quartz boat positioning moving mechanism 55 or places the silicon wafer located in the quartz boat top gear component into the quartz boat positioning moving mechanism 55.

[0060] The suction cup transverse movement mechanism 54 includes a transverse movement mechanism and a silicon wafer separation movement mechanism. The silicon wafer suction and separation device controls the suction and separation of the silicon wafers, and the transverse movement mechanism controls the horizontal movement of the silicon wafer suction and separation device, thereby controlling the flow of silicon wafers between the flower basket silicon wafer lifting mechanism 51 and the quartz boat silicon wafer lifting mechanism 53.

[0061] The quartz boat support conveying mechanism 57 includes a quartz boat support assembly 572 that carries the quartz boat support and a moving assembly 571 that drives the quartz boat support assembly 572 to move. The moving assembly 571 includes a conveying power assembly that uses a synchronous belt drive to drive the quartz boat support assembly 572 to move.

[0062] In the present embodiment, during the silicon wafer loading process, a flower basket filled with silicon wafers is sequentially transported by the loading incoming material docking conveying mechanism 11 to the loading buffer conveying mechanism 12, and the loading buffer conveying mechanism 12 transports the flower basket to the loading flower basket lifting mechanism 13. The silicon wafers in the flower basket are output in sequence by the coordinated operation of the silicon wafer input component 151 and the flower basket lifting component 132 of the loading silicon wafer conveying mechanism 15. The silicon wafers on the conveyor line flow into the loading splicing slot of the loading splicing mechanism 17 in sequence by the coordinated operation of the silicon wafer output component 153 and the splicing lifting component 172. The silicon wafer flipping device takes out the silicon wafers in the loading splicing slot through the suction cup 409. At this time, the second suction plate 405 is flipped so that the silicon wafers on the first suction plate 404 and the second suction plate 405 face opposite directions. The silicon wafer flipping device places the silicon wafers into the flower basket positioning position. The moving mechanism 50, the flower basket positioning moving mechanism 50 moves to above the flower basket silicon wafer lifting mechanism 51, the lifting component 512 moves upward to lift the silicon wafer, and the lifted silicon wafer is adjusted by the silicon wafer regularization mechanism 52, the suction cup transverse movement mechanism 54 moves the lifted silicon wafer to the quartz boat silicon wafer lifting mechanism 53, the quartz boat top gear component moves downward to place the silicon wafer on the quartz boat positioning moving mechanism 55 for wafer closing, and the above steps are repeated until the quartz boat positioning moving mechanism 55 is full of silicon wafers, the quartz boat flipping and conveying component 56 flips the quartz boat full of silicon wafers and conveys it to the quartz boat support of the quartz boat support conveying mechanism 57, the quartz boat support conveying mechanism 57 inputs the silicon wafer into the main machine, thereby realizing the loading process of the silicon wafer from the wafer guide device to the main machine, and when the silicon wafer flows in reverse through the above structure, the unloading process of the silicon wafer from the main machine to the wafer guide device is realized.

[0063] In addition, in this embodiment, the driving method of the above-mentioned power assembly can adopt a motor + synchronous belt, a motor + gear rack or a cylinder.

[0064] Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

Claims

1. A silicon wafer loading and unloading system, characterized by: The present invention relates to a wafer handling device, a wafer transfer device and a wafer transfer device. The wafer handling device comprises a wafer loading guide assembly, a wafer unloading guide assembly and a transverse conveying mechanism connecting the wafer loading guide assembly and the wafer unloading guide assembly. The wafer loading guide assembly controls the wafer loading process, the wafer unloading guide assembly controls the wafer unloading process, the transverse conveying mechanism transfers the flower baskets of the wafer loading guide assembly and the wafer unloading guide assembly, the wafer unloading device comprises a wafer unloading mechanism, a wafer transverse mechanism and a wafer offset mechanism, the wafer transverse mechanism and the wafer offset mechanism control the movement of the wafer unloading mechanism, the wafer unloading mechanism controls the suction and flipping of the wafer, the transport device controls the flow of the wafer between the main machine and the wafer unloading device, the wafer unloading mechanism comprises a suction assembly, the suction assembly comprises a flipping motor and a suction component, the flipping motor and the suction component control the flipping of the wafer, the suction component is provided with two groups, one group of suction components comprises a first suction plate and a suction cup, the other group of suction components comprises a second suction plate and a suction cup, the second suction plate is horizontally flipped relative to the first suction plate.

2. The silicon wafer loading and unloading system according to claim 1, characterized in that: The loading guide assembly includes a loading incoming material docking conveying mechanism, a loading buffer conveying mechanism, a loading flower basket lifting mechanism, a loading flower basket conveying mechanism, a loading silicon wafer conveying mechanism, a loading silicon wafer buffer mechanism and a loading splicing mechanism. The loading flower basket conveying mechanism is located at the lower side of the loading flower basket lifting mechanism. The unloading guide assembly includes a unloading incoming material docking conveying mechanism, a unloading buffer conveying mechanism, a unloading flower basket lifting mechanism, a unloading flower basket conveying mechanism, a unloading silicon wafer conveying mechanism, a unloading silicon wafer buffer mechanism and a unloading splicing mechanism. The unloading flower basket conveying mechanism is located at the lower side of the unloading flower basket lifting mechanism. The transverse conveying mechanism is respectively connected to the loading flower basket conveying mechanism and the unloading flower basket conveying mechanism. The flower basket flows between the loading guide assembly and the unloading guide assembly through the loading flower basket conveying mechanism, the transverse conveying mechanism and the unloading flower basket conveying mechanism.

3. The silicon wafer loading and unloading system according to claim 1, characterized in that: A group of flip motors is connected to two groups of suction components, and the output shafts of the flip motors are respectively connected to the first suction plate and the second suction plate. Several suction cups are sequentially installed on the first suction plate and the second suction plate. The distance between the suction cups on the first suction plate and the second suction plate matches the distance between the two groups of feeding and splicing mechanisms. The suction cups absorb or place the silicon wafers.

4. The silicon wafer loading and unloading system according to claim 1, characterized in that: The transport device includes a flower basket positioning and moving mechanism, a flower basket silicon wafer lifting mechanism, a silicon wafer regularization mechanism, a quartz boat silicon wafer lifting mechanism, a suction cup transverse movement mechanism, a quartz boat positioning and moving mechanism, a quartz boat flipping and transporting assembly and a quartz boat support and conveying mechanism. The flower basket positioning and moving mechanism, the flower basket silicon wafer lifting mechanism, the quartz boat silicon wafer lifting mechanism, the suction cup transverse movement mechanism and the quartz boat positioning and moving mechanism control the transport and circulation of silicon wafers. The silicon wafer regularization mechanism lifts the flower basket silicon wafer lifting mechanism and adjusts the silicon wafers in the quartz boat silicon wafer lifting mechanism. The quartz boat flipping and transporting assembly transports and flips the quartz boat. The quartz boat support and conveying mechanism is connected to the host to control the input or output of silicon wafers into or out of the host.

5. The silicon wafer loading and unloading system according to claim 4, characterized in that: The flower basket positioning and moving mechanism is provided with two groups, including a supporting assembly for carrying the flower basket and a driving assembly for moving the supporting assembly, the driving assembly drives the supporting assembly for transporting silicon wafers; the flower basket silicon wafer jacking mechanism includes a carrying frame and a jacking assembly, the carrying frame includes a jacking power assembly, the jacking power assembly controls the lifting and lowering of the jacking assembly, the jacking assembly includes a jacking connecting plate and a jacking part, the jacking part includes a jacking frame assembly, a top tooth fixing plate and a top tooth assembly, the top tooth assembly is installed on the jacking frame plate through the top tooth fixing plate, the top tooth assembly is composed of a plurality of top teeth, a group of top teeth is provided with a plurality of slots, and the silicon wafers are introduced into or out of the slots.

6. The silicon wafer loading and unloading system according to claim 5, characterized in that: The jacking frame assembly is composed of two groups of jacking frame plates distributed horizontally and symmetrically. One group of jacking parts is provided with two groups of top tooth assemblies. One group of top tooth assemblies corresponds to one group of jacking frame plates. The top tooth fixing plate is fixedly connected to the jacking frame plate. The top tooth assembly is fixedly connected to the top tooth fixing plate. A connecting and stabilizing device is provided between the top tooth fixing plate and the jacking frame plate. The connecting and stabilizing device is located between the top tooth fixing plate and the jacking frame plate. The connecting and stabilizing device includes a connecting and stabilizing fixing portion and a connecting and stabilizing adjusting portion. The connecting and stabilizing fixing portion and the connecting and stabilizing adjusting portion are fixedly connected. The connecting and stabilizing fixing portion and the connecting and stabilizing adjusting portion are fixedly connected. The lower end surface of the top tooth fixing plate is fixed with a connection, and the connection stabilization adjustment part is opposite to the jacking frame plate. The connection stabilization adjustment part is fixed with a connection stabilization through-hole, and the connection stabilization through-hole is provided with a connection stabilization adjustment rod. The jacking frame plate is fixed with a frame adjustment waist hole, and the connection stabilization adjustment rod extends into the frame adjustment waist hole. By adjusting the length of the connection stabilization adjustment rod extending into the frame adjustment waist hole, the position of the top tooth fixing plate relative to the jacking frame plate is controlled. Adjacent top teeth are connected, and the upper ends of the slots are connected with a guide cavity. The spacing between adjacent slots on each group of top tooth components is kept consistent, so that the silicon wafers are introduced into the slots in sequence.

7. The silicon wafer loading and unloading system according to claim 4, characterized in that: The silicon wafer regularization mechanism includes a silicon wafer regularization component and a silicon wafer regularization limiting component. The silicon wafer regularization component includes a silicon wafer regularization power component and a silicon wafer regularization adjustment component. The silicon wafer regularization power component drives the silicon wafer regularization adjustment component to move relative or opposite to each other, and the silicon wafer regularization limiting component limits the movement of the silicon wafer regularization adjustment component and detects the silicon wafer.

8. The silicon wafer loading and unloading system according to claim 4, characterized in that: The quartz boat silicon wafer lifting mechanism includes a silicon wafer lifting moving assembly and a quartz boat top gear assembly. The power assembly of the silicon wafer lifting moving assembly controls the reciprocating movement of the quartz boat top gear assembly. The quartz boat top gear assembly ejects the silicon wafer located in the quartz boat positioning moving mechanism or places the silicon wafer located in the quartz boat top gear assembly into the quartz boat positioning moving mechanism. The suction cup transverse movement mechanism includes a transverse movement mechanism and a silicon wafer separation moving mechanism. The silicon wafer suction and separation device controls the suction and separation of the silicon wafer. The transverse movement mechanism controls the horizontal movement of the silicon wafer suction and separation device, thereby controlling the flow of silicon wafers between the flower basket silicon wafer lifting mechanism and the quartz boat silicon wafer lifting mechanism. The quartz boat support conveying mechanism includes a quartz boat support assembly that carries the quartz boat support and a moving assembly that drives the quartz boat support assembly to move. The moving assembly includes a conveying power assembly, and the conveying power assembly drives the quartz boat support assembly to move.

9. The silicon wafer loading and unloading system according to claim 2, characterized in that: The transverse conveying mechanism includes a flow conveying component and a flow moving component. The flow moving component includes a transverse moving force component. The transverse moving force component drives the flow conveying component to move relative to the flow moving component. The flow conveying component is respectively connected to the loading flower basket conveying mechanism and the unloading flower basket conveying mechanism. The upper end surface of the flow conveying component is in the same horizontal plane as the upper end surface of the loading flower basket conveying mechanism and the unloading flower basket conveying mechanism, which facilitates the flow of flower baskets.

10. The silicon wafer loading and unloading system according to claim 2, characterized in that: The length of the loading and incoming material docking conveying mechanism can accommodate multiple groups of flower baskets for simultaneous conveying. The loading and incoming material docking conveying mechanism is fixed with incoming material blocking cylinders at both ends of the conveying direction, and two symmetrical groups of incoming material shooting sensors are fixed on both sides. The two groups of incoming material shooting sensors and the incoming material blocking cylinders operate synchronously to convey the flower baskets one by one to the loading and incoming material buffer conveying mechanism. The loading and incoming material docking conveying mechanism is provided with an incoming material weight sensor, which detects the full or insufficient material status of the flower basket.

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