Method of manufacturing a window

Abstract

The present disclosure relates to a method of manufacturing a window. The method of manufacturing a window includes: providing an ink pattern to a printing pad; providing the printing pad and the ink pattern to a target substrate; and removing the printing pad from the target substrate, the ink pattern including a first border line surrounding at least one aperture and a second border line surrounding the first border line, the printing pad including a top surface, a bottom surface, and a side surface connecting the top surface and the bottom surface, the side surface including a first pattern portion and a second pattern portion, the first border line being formed in the first pattern portion, the second border line being formed in the second pattern portion. The first pattern portion has an inclination angle based on the bottom surface of the printing pad equal to or greater than about 46 degrees and equal to or less than about 90 degrees.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0125121, filed on September 25, 2020, which is incorporated herein by reference as fully set forth herein for all purposes. Technical Field

[0003] The embodiments of the present invention generally relate to printing pads, methods of manufacturing windows using the printing pads, and methods of manufacturing electronic devices using the printing pads, and more specifically to printing pads having printed patterns on their side surfaces, methods of manufacturing windows using the printing pads, and methods of manufacturing electronic devices using the printing pads. Background Technology

[0004] Electronic devices include windows mounted on the display panel to protect it from external impacts. These windows are located on the outer surface of the electronic device. The placement of windows on the outer surface of the electronic device can influence its design.

[0005] Therefore, the patterned windows not only protect the display panel but also provide a variety of design options for electronic devices. For example, patterns are formed on the windows by transferring ink onto them using a printing pad.

[0006] In recent years, pad printing methods have been developed to reduce the defect rate in window manufacturing processes and to print clear patterns on windows.

[0007] The information disclosed in this background section is only for understanding the background technology of the inventive concept, and therefore may include information that does not constitute prior art. Summary of the Invention

[0008] The applicant discovered that in patterns formed or printed on windows for electronic devices using a printing pad with a printed pattern in a printing process, the printed pattern on the window may be distorted, resulting in reduced print quality or reliability of the printing process.

[0009] The printing pad constructed according to the principle of the present invention can improve printing quality or printing process reliability by adjusting the tilt angle of the printing pattern of the printing pad, thereby improving the quality of the printed pattern on the window of electronic equipment.

[0010] The method for manufacturing a window for an electronic device according to the principles of the present invention can improve printing quality or printing process reliability by adjusting the tilt angle of the printed pattern on the printing pad, thereby improving the quality of the printed pattern on the window of the electronic device.

[0011] According to one aspect of the invention, a method of manufacturing a window includes the steps of: providing an ink pattern to a printing pad; providing the printing pad and the ink pattern to a target substrate such that the ink pattern is transferred to the target substrate; and removing the printing pad from the target substrate, the ink pattern including a first border line around at least one hole and a second border line around the first border line, the printing pad including a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface, the side surface including a first pattern portion and a second pattern portion, the first border line being formed in the first pattern portion, the second border line being formed in the second pattern portion, wherein the first pattern portion of the printing pad has a tilt angle equal to or greater than about 46 degrees and equal to or less than about 90 degrees based on the bottom surface of the printing pad.

[0012] The steps of providing the printing pad and ink pattern may include pressing the printing pad toward the target substrate.

[0013] The steps of providing the printing pad and ink pattern may include moving the printing pad and ink pattern to contact the target substrate.

[0014] Ink patterns may include light-blocking materials.

[0015] After the step of removing the printed pad, the target substrate may include a first border region, a transmissive region, and a second border region surrounding the transmissive region, wherein each of the first border region and the second border region may be a light-blocking region, and the transmissive region may be a light-transmitting region.

[0016] The printing pad may include at least one of silicone and rubber.

[0017] The target substrate may include glass material.

[0018] The target substrate may have a thickness equal to or greater than about 20 μm and equal to or less than about 80 μm.

[0019] The target substrate may include synthetic resin.

[0020] The target substrate can be flexible.

[0021] According to another aspect of the present invention, a method of manufacturing an electronic device includes the steps of: providing an ink pattern to a printing pad; providing the printing pad and the ink pattern to a target substrate such that the ink pattern is transferred to the target substrate; removing the printing pad from the target substrate; and placing a display panel including pixels under the target substrate, wherein the ink pattern includes a first border line around at least one hole and a second border line around the first border line, the printing pad includes a top surface, a bottom surface and a side surface connecting the top surface and the bottom surface, the side surface includes a first pattern portion and a second pattern portion, the first border line is formed in the first pattern portion, the second border line is formed in the second pattern portion, wherein the first pattern portion of the printing pad has a tilt angle equal to or greater than about 46 degrees and equal to or less than about 90 degrees based on the bottom surface of the printing pad.

[0022] Ink patterns may include light-blocking materials.

[0023] The display panel may also include multiple signal lines, and these signal lines do not overlap with the holes.

[0024] Pixels do not have to overlap with holes.

[0025] The method may also include a step of placing at least one electro-optical module below the display panel after the step of placing the display panel, wherein the electro-optical module overlaps with the hole.

[0026] An electro-optical module can be a camera module.

[0027] According to another aspect of the invention, a printing pad includes: a first portion comprising a bottom surface substantially parallel to a plane defined by a first direction and a second direction intersecting the first direction, a first upper surface facing the bottom surface, and a first side surface connecting the bottom surface and the first upper surface; and a second portion extending from the first portion and having a convex shape projecting in a direction intersecting the first and second directions, the second portion comprising a second upper surface facing the bottom surface of the first portion and a second side surface connecting the second upper surface and the first upper surface of the first portion, the second side surface of the second portion comprising a first pattern portion disposed adjacent to the second upper surface of the second portion and a second pattern portion disposed between the first pattern portion and the first upper surface of the first portion, wherein the first pattern portion of the second side surface of the second portion has a tilt angle equal to or greater than about 46 degrees and equal to or less than about 90 degrees based on the bottom surface of the first portion.

[0028] The first and second parts may include at least one of silicone and rubber.

[0029] The first side surface of the first part, the second side surface of the second part, the first upper surface of the first part, and the second upper surface of the second part may include curved surfaces.

[0030] The area of ​​the second upper surface of the second part can be smaller than the area of ​​the bottom surface of the first part.

[0031] It should be understood that both the foregoing general description and the following detailed description are illustrative and explanatory, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0032] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate illustrative embodiments of the invention and, together with the specification, serve to illustrate the inventive concept.

[0033] Figure 1 This is a perspective view of an embodiment of an electronic device constructed according to the principles of the present invention.

[0034] Figure 2 yes Figure 1 An exploded 3D view of an electronic device.

[0035] Figure 3 yes Figure 1 A block diagram of an electronic device.

[0036] Figure 4A and Figure 4B yes Figure 2 A cross-sectional view of an embodiment of the display device.

[0037] Figure 5 yes Figure 2 A plan view of an embodiment of the display panel.

[0038] Figure 6 and Figure 7 This is a plan view of an embodiment of a printing pad constructed according to the principles of the present invention.

[0039] Figure 8 It shows the manufacturing process. Figure 1 A flowchart illustrating an implementation method for an electronic device.

[0040] Figure 9A , Figure 9B , Figure 9C and Figure 9D This illustrates the manufacturing process according to the principles of the present invention. Figure 2 A view of an implementation method for a window.

[0041] Figure 10 yes Figure 2 A floor plan of the implementation method of the window.

[0042] Figure 11A This is a view showing a printed image formed using a printing pad exemplified by an embodiment based on the principles of the present invention.

[0043] Figure 11B and Figure 11C This is a view showing a printed image formed using a printing pad as a contrasting example according to conventional methods.

[0044] Figure 12A This illustrates the manufacturing process according to the principles of the present invention. Figure 2 A view of an implementation method for a window.

[0045] Figure 12B This is a view showing a method of manufacturing a window using a conventional printing pad, according to conventional methods. Detailed Implementation

[0046] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various embodiments or implementations of the invention. As used herein, “implementation” and “method” are interchangeable terms and are non-limiting examples of apparatus or methods employing one or more inventive concepts disclosed herein. However, it will be apparent that various embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the embodiments. Furthermore, the embodiments may differ but are not necessarily exclusive. For example, the specific shape, configuration, and characteristics of an embodiment may be used or implemented in another embodiment without departing from the inventive concept.

[0047] Unless otherwise stated, the embodiments shown should be understood as illustrative features providing different details of some methods in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter individually or collectively referred to as “elements”) may be combined, separated, exchanged and / or rearranged in other ways without departing from the inventive concept.

[0048] Crosshairs and / or shading are typically used in accompanying drawings to clarify the boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not express or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between the elements shown, or any other characteristics, properties, etc., of the elements. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When embodiments can be implemented differently, the specific process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of their description. Additionally, the same reference numerals denote the same elements.

[0049] When an element, such as a layer, is referred to as being "on" another element or layer, "connected to," or "attached to" another element or layer, it can be directly on, directly connected to, or attached to another element or layer, or there may be intermediate elements or intermediate layers. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly attached to" another element or layer, there are no intermediate elements or intermediate layers. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without intermediate elements. Furthermore, the DR1, DR2, and DR3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the DR1, DR2, and DR3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as X only, Y only, Z only, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0050] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0051] Spatial relative terms such as “below,” “under,” “below,” “lower,” “above,” “upper,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and to describe the relationship of one element to other elements(s) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to include different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will subsequently be oriented “above” other elements or features. Thus, the term “below” can include both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and thus, the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0052] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. Furthermore, when used in this specification, the terms “comprises,” “comprising,” “includes,” and / or “including” specify the presence of stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximations, not as terms of degree, and thus to account for inherent deviations in measured, calculated, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0053] The embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic diagrams of idealized embodiments and / or intermediate structures. Thus, deviations from the illustrated shapes should be expected, for example, due to manufacturing techniques and / or tolerances. Therefore, the embodiments disclosed herein should not necessarily be interpreted as limited to the specific illustrated shapes of the areas, but rather include deviations in shape, for example, due to manufacturing processes. Thus, the areas shown in the figures may be schematic in nature, and the shapes of these areas may not reflect the actual shapes of the areas of the device, and are therefore not necessarily intended to be limiting.

[0054] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly stated herein.

[0055] In the following text, embodiments will be described in detail with reference to the accompanying drawings.

[0056] Figure 1 This is a perspective view showing an electronic device ED according to an embodiment. Figure 2 This is an exploded perspective view showing an electronic device ED according to an embodiment. Figure 3 This is a block diagram illustrating an electronic device ED according to an embodiment.

[0057] Reference Figure 1An electronic device ED can display an image IM via a display surface ED-IS. The display surface ED-IS can be substantially parallel to the plane defined by a first direction DR1 and a second direction DR2. A third direction DR3 indicates the normal direction of the display surface ED-IS, i.e., the thickness direction of the electronic device ED. The display surface ED-IS of the electronic device ED can correspond to the front surface of the electronic device ED and can correspond to the window WM (see reference). Figure 2 The upper surface of ).

[0058] In the following text, the front (e.g., upper) surface and rear (e.g., lower) surface of each component or unit are distinguished from each other by a third direction DR3. However, the first direction DR1, the second direction DR2, and the third direction DR3 are merely exemplary. In the following text, the first direction, the second direction, and the third direction are defined as the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 shown in the accompanying drawings.

[0059] The display surface ED-IS may include a display area DA and non-display areas NDA1 and NDA2 adjacent to the display area DA. Non-display areas NDA1 and NDA2 may be areas through which no image is displayed. Non-display areas NDA1 and NDA2 may include a first non-display area NDA1 and a second non-display area NDA2.

[0060] For example, the first non-display area NDA1 can be the area surrounding the sensor area. The sensor area can be the area that transmits or receives external optical signals. For example, the optical signal can be natural light from the outside or infrared light generated by a light-emitting element.

[0061] Figure 1 The diagram illustrates a first sensor region SA1, a second sensor region SA2, and a third sensor region SA3 as sensor regions. However, the implementation is not limited to this. For example, at least one of the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 may be omitted, or four or more sensor regions may be provided.

[0062] also, Figure 1 The diagram illustrates a structure in which a first sensor region SA1, a second sensor region SA2, and a third sensor region SA3 are defined in the upper left corner of a display region DA. However, the implementation is not limited to this. For example, according to another embodiment, the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 may be defined in various regions such as the upper right corner, the center, the lower left corner, or the lower right corner of the display region DA.

[0063] For example, a first non-display area NDA1 can be surrounded by a display area DA. The display area DA can display an image IM externally. The image IM can include video images and still images. Figure 1 The magnifying glass icon and search window are shown as representative examples.

[0064] The second non-display area NDA2 can be a region that blocks optical signals. For example, the second non-display area NDA2 can be disposed outside the display area DA to surround the display area DA. According to one embodiment, the second non-display area NDA2 can be defined in the side surface of the electronic device ED, rather than the front surface of the electronic device ED. According to another embodiment, the second non-display area NDA2 can be omitted.

[0065] For example, a second non-display area NDA2 surrounds the display area DA, but the implementation is not limited to this or by this limitation. The second non-display area NDA2 may be located only on one side of the display area DA. According to an embodiment, a portion of the second non-display area NDA2 may extend from the first non-display area NDA1.

[0066] In one embodiment, the display surface ED-IS is shown as flat; however, according to another embodiment, a curved region may be defined on opposite sides of the display surface ED-IS facing each other in the second direction DR2.

[0067] A mobile phone is shown as a representative example; however, the electronic device ED according to the embodiments is not limited to mobile phones, but can be applied to various information providing devices such as televisions, navigation units, computer monitors, game units, etc.

[0068] Reference Figure 2 and Figure 3 The electronic device ED may include a display device DD, an electronic module EM, an electronic optical module ELM1, ELM2 and ELM3, a power module PSM and a housing HM.

[0069] The display device DD can generate images. The display device DD may include a display panel DP, a top component UM, and a window WM. However, the implementation is not limited to this. For example, the display panel DP may be a light-emitting display panel such as an organic light-emitting display panel or a quantum dot light-emitting display panel.

[0070] Depending on the configuration of the upper component UM, the display device DD can sense external inputs and / or external pressure. The upper component UM can include various components.

[0071] For example, the upper component UM may include an optical film and an input sensor.

[0072] Optical films can reduce the reflectivity of external light incident through the window WM.

[0073] Optical films may include polarizers and retarders. Retarders may be film-type or liquid crystal-coated retarders, and may include λ / 2 retarders and / or λ / 4 retarders. Polarizers may be film-type polarizers or liquid crystal-coated polarizers.

[0074] In another embodiment, the optical film may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer disposed on different layers from each other. The first reflected light and the second reflected light reflected by the first reflective layer and the second reflective layer, respectively, can destructively interfere with each other, and therefore, the reflectivity of external light can be reduced.

[0075] Input sensors can sense external input generated by the user. Input sensors can sense external input through capacitive sensing, pressure sensing, or electromagnetic induction methods.

[0076] The upper component UM may also include an adhesive layer for attaching the optical film to the input sensor.

[0077] A window membrane (WM) can provide the appearance of an electronic device (ED). A window membrane can include a base substrate and may also include functional layers such as anti-reflective layers and anti-fingerprint layers.

[0078] For example, the display device DD may also include at least one adhesive layer. The adhesive layer can attach the window WM to the upper component UM, or it can attach the upper component UM to the display panel DP. The adhesive layer may be an optically transparent adhesive layer or a pressure-sensitive adhesive layer.

[0079] The electronic module EM may include a control module 10, a wireless communication module 20, an image input module 30, an audio input module 40, an audio output module 50, a memory 60, and an external interface module 70. The components of the electronic module EM may be mounted on a circuit board or electrically connected to the circuit board via a flexible circuit board. The electronic module EM may be electrically connected to the power supply module PSM.

[0080] The control module 10 can control the overall operation of the electronic device ED. For example, the control module 10 can activate or deactivate the display device DD in response to user input. The control module 10 can also control other modules such as the image input module 30, the audio input module 40, and the audio output module 50 in response to user input. The control module 10 may include at least one microprocessor.

[0081] The wireless communication module 20 can use a Bluetooth or WiFi link to send wireless signals to or receive wireless signals from other terminals. The wireless communication module 20 can use a common communication line to send or receive voice signals. The wireless communication module 20 may include a transmitter 22 and a receiver 24; the transmitter 22 modulates the signal to be transmitted and transmits the modulated signal, and the receiver 24 demodulates the signal applied to it.

[0082] The image input module 30 can process image signals and convert them into image data that can be displayed on the display device DD. The audio input module 40 can receive external sound signals through a microphone in recording mode or voice recognition mode and convert the external sound signals into electronic voice data. The audio output module 50 can convert sound data provided to it by the wireless communication module 20 or sound data stored in the memory 60, and can output the converted sound data to the outside.

[0083] The external interface module 70 can be used as an interface between the control module 10 and external devices such as an external charger, a wired data port, a wireless data port, a card slot (e.g., a memory card, a user identification module (SIM) card, and a user identity module (UIM) card).

[0084] A power supply module (PSM) can provide the power required for the overall operation of an electronic device (ED). A PSM may include conventional battery devices.

[0085] Figure 2 The housing HM shown is connected to the display device DD (specifically the window WM) to accommodate other modules. Figure 2 The diagram shows a housing HM formed as a single unit as a representative example. However, a housing HM may include two or more components assembled together.

[0086] An electro-optical module (ELM) can be an electronic component that outputs or receives optical signals. The ELM can be located below the display device (DD), and more specifically, below the display panel (DP). The display device (DD) may include at least one ELM.

[0087] For example, the electro-optical module (ELM) can overlap with the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3.

[0088] According to an embodiment, the regions of the display device DD that overlap with the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 may have a higher transmittance than other regions of the display device DD that do not overlap with the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3. For example, components of the display panel DP and components of the upper component UM can be removed in the regions that overlap with the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3. In another embodiment, the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 may be through-holes. According to an embodiment, at least one electro-optical module ELM may be housed in the through-hole.

[0089] Therefore, the electro-optical module (ELM) can easily send or receive signals through the first sensor region SA1, the second sensor region SA2, and the third sensor region SA3.

[0090] Electro-optical module (ELM) can be used Figure 2 The first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 shown transmit or receive optical signals. For example, in one embodiment, the electro-optical module (ELM) may include a camera module. The ELM can receive natural light to capture images of external objects. In another embodiment, the ELM may include a proximity sensor or an infrared light sensor. According to an embodiment, ELM1 and ELM3 may be infrared light sensors. ELM2 may be a camera module.

[0091] The display device DD will be described in detail below.

[0092] Figure 4A and Figure 4B This is a cross-sectional view showing a display device DD according to an embodiment. Figure 4A and Figure 4B In, the same reference mark indicates Figure 1 , Figure 2 and Figure 3 The same elements are used in the same way, and therefore, detailed descriptions of the same elements will be omitted.

[0093] Reference Figure 4A and Figure 4B The display device DD may include a display panel DP, an upper component UM, and a window WM. The upper component UM may include an input sensor UM-1 and an optical film UM-2. For example... Figure 4A and Figure 4B As shown, the window WM and the optical film UM-2 can be connected to each other through the adhesive layer OCA.

[0094] The optical film UM-2 can have a multi-layer structure including an adhesive layer. The optical film UM-2 can be attached to the upper surface of the input sensor UM-1 via the adhesive layer.

[0095] An opening region can be defined in the optical film UM-2 to interact with... Figure 2 The first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 shown correspond to each other. Due to the open area, the transmittance of natural light can be increased.

[0096] like Figure 4A and Figure 4B As shown, the display device DD may include a display panel DP, a top component UM, and a window WM stacked on top of each other in sequence.

[0097] The window WM may include a base substrate WM-BS and a border pattern WM-BZ. The base substrate WM-BS may include an optically transparent insulating material.

[0098] The base substrate WM-BS can be flexible. For example, the base substrate WM-BS can include synthetic resins such as polyimide.

[0099] In another embodiment, the base substrate WM-BS may include ultrathin glass (UTG). Specifically, the base substrate WM-BS may include a glass material and may have a thickness equal to or greater than about 20 μm and equal to or less than about 80 μm. When the thickness of the base substrate WM-BS is less than about 20 μm, the window WM may not have sufficient strength and may be easily damaged by external impacts. For example, the window WM of the flexible display device DD may be damaged when the display device DD is repeatedly folded and unfolded. When the thickness of the base substrate WM-BS is greater than about 80 μm, the flexibility of the window WM may be reduced, and therefore, the folding and unfolding operations of the display device DD may not be performed smoothly.

[0100] The border pattern WM-BZ can have a multi-layer structure. The border pattern WM-BZ may include at least one of a colored layer and a light-blocking layer having a black color. The border pattern WM-BZ can be formed on a base substrate WM-BS by deposition, printing, and coating processes. As an example, the border pattern WM-BZ can be formed by printing ink containing a light-blocking material onto the base substrate WM-BS.

[0101] Figure 4AThe input sensor UM-1 shown can be directly mounted on the base surface provided by the display panel DP. In the specification, the statement that component "B" is directly mounted on component "A" means that no separate adhesive layer is provided between component "B" and component "A". Component "B" can be formed on the base surface provided by component "A" through a continuous process after component "A" is formed.

[0102] like Figure 4B As shown, the input sensor UM-1 can be attached to the display panel DP after being formed separately. The adhesive layer OCA can be disposed between the input sensor UM-1 and the display panel DP.

[0103] Figure 5 This is a plan view showing the display panel DP according to an embodiment.

[0104] Reference Figure 5 The display panel DP may include an active area DP-DA and a passive area DP-NDA defined therein.

[0105] The display panel (DP) may include multiple signal lines (SGL), multiple pixels (PX), and a driving circuit (GDC). Pixels (PX) may be located in the active region (DP-DA). Each pixel (PX) may include an organic light-emitting diode (OLED) and pixel driving circuitry connected to the OLED. Pixels (PX) may not be located in the passive region (DP-NDA). The passive region (DP-NDA) may have a higher light transmittance than the active region (DP-DA). The passive region (DP-NDA) can be used as a transmission channel or path for optical signals.

[0106] The passive region DP-NDA may include a first passive region DP-BA and a second passive region DP-TA. The first passive region DP-BA may surround the active region DP-DA. The second passive region DP-TA may be confined within the active region DP-DA. The signal line SGL, pixel PX, and drive circuit GDC may not be located within the second passive region DP-TA.

[0107] Figure 5 A second passive region DP-TA is shown as a representative example, and the second passive region DP-TA can be compared with... Figure 2 The second sensor region SA2 shown overlaps with the second sensor region SA2. However, the implementation is not limited to this. For example, two or more second passive regions DP-TA can be provided, and these two or more second passive regions DP-TA can be... Figure 2 The first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 shown overlap.

[0108] The driving circuit GDC can be located in the first passive region DP-BA. In an embodiment, the driving circuit GDC may include a scan driving circuit. The scan driving circuit can generate multiple scan signals and sequentially output multiple scan signals to multiple scan lines GL. The scan driving circuit can also output another control signal to the pixel driving circuit of pixel PX.

[0109] The scan driving circuit may include multiple thin-film transistors formed using the same process (e.g., low-temperature polycrystalline silicon (LTPS) or low-temperature polycrystalline oxide (LTPO) process). For example, a pixel driving circuit may be formed using the same process to form multiple thin-film transistors and pixels (PX).

[0110] The signal line SGL may include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. The signal line SGL may also include a separate reset line and a separate transmit line. Each scan line GL can be connected to a corresponding pixel PX among multiple pixels PX, and each data line DL can be connected to a corresponding pixel PX among multiple pixels PX. The power line PL can be connected to a pixel PX. The control signal line CSL applies control signals to the scan drive circuitry.

[0111] The SGL signal line can be connected to a circuit board. The SGL signal line can be connected to a timing controller that is mounted on the circuit board as an integrated chip.

[0112] Figure 6 and Figure 7 This is a plan view showing a printed pad PAD according to an embodiment. For example, Figure 6 and Figure 7 This is a plan view of the printed pad PAD when viewed in the first direction DR1.

[0113] Reference Figure 6 The printed pad PAD may include a first part PT1 and a second part PT2. The first part PT1 and the second part PT2 may include at least one of silicone and rubber.

[0114] The first part PT1 may include a bottom surface BF that is substantially parallel to the plane defined by the first direction DR1 and the second direction DR2, a first upper surface TF1 facing the bottom surface BF, and a first side surface SF1 connecting the bottom surface BF and the first upper surface TF1.

[0115] The bottom surface BF can be a flat surface, and the first upper surface TF1 and the first side surface SF1 can be curved surfaces.

[0116] The second part PT2 can extend from the first part PT1. The second part PT2 can extend from the first upper surface TF1 of the first part PT1 in a direction intersecting the first direction DR1 and the second direction DR2. Specifically, the second part PT2 can have a shape that protrudes from the first upper surface TF1 in a direction opposite to the third direction DR3.

[0117] The first part PT1 and the second part PT2 can be distinguished from each other by the inflection point IP, which serves as their boundary. Specifically, the first part PT1 and the second part PT2 can be distinguished from each other by the inflection point IP of the tilt angle between the first upper surface TF1 and the second side surface SF2.

[0118] The second part PT2 may include a second upper surface TF2 facing away from the bottom surface BF and a second side surface SF2 connecting the second upper surface TF2 and the first upper surface TF1. The second upper surface TF2 and the second side surface SF2 may be curved surfaces.

[0119] The second side surface SF2 may include a first patterned portion PP1 and a second patterned portion PP2. When viewed in the first direction DR1, the first patterned portion PP1 may be positioned closer to the second upper surface TF2 than the second patterned portion PP2. Furthermore, when viewed in the first direction DR1, the second patterned portion PP2 may be positioned between the first patterned portion PP1 and the first upper surface TF1. In the manufacturing method of the window WM, each of the first patterned portion PP1 and the second patterned portion PP2 may be a portion in which ink is transferred in the printing pad PAD.

[0120] Reference Figure 7 The tilt angle θ of the first pattern portion PP1 based on the bottom surface BF can be in the range of approximately 46 degrees or greater and approximately 90 degrees or less. For example, the tilt angle θ of the first pattern portion PP1 based on the bottom surface BF can be in the range of approximately 46 degrees or greater and approximately 80 degrees or less. The tilt angle θ of the first pattern portion PP1 can be defined as the angle between a line substantially parallel to the bottom surface BF and the tangent to the center PP1-C of the first pattern portion PP1. (Refer to...) Figure 12A and Figure 12B Describe in detail the tilt angle θ of the first pattern part PP1.

[0121] Figure 8 This is a flowchart illustrating a method S10 for manufacturing an electronic device ED according to an embodiment. Figure 9A , Figure 9B , Figure 9C and 9D This is a view illustrating a method for manufacturing a window WM according to an embodiment.

[0122] Reference Figure 8The manufacturing method S10 of the electronic device ED may include a first step S100 of providing an ink pattern PN on a printed pad PAD, a second step S200 of providing a printed pad PAD and an ink pattern PN on a target substrate BS, a third step S300 of removing the printed pad PAD from the target substrate BS, a fourth step S400 of placing a display panel DP including pixels PX under the target substrate BS, and a fifth step S500 of placing at least one electro-optical module ELM under the display panel DP.

[0123] For example, the first step S100, the second step S200, and the third step S300 can be a method for manufacturing a window WM. When the fourth step S400 and the fifth step S500 are applied to the window WM formed by the first step S100, the second step S200, and the third step S300, an electronic device ED can be formed.

[0124] Reference Figure 8 , Figure 9A and Figure 9B Describe the first step S100.

[0125] Figure 9A This diagram illustrates the process of imprinting a mold MD onto a printing pad PAD. An ink INK can be provided in the mold MD. The ink INK may include a light-blocking material. Specifically, the ink INK may include a black material, such as carbon black.

[0126] Reference Figure 9B After the mold MD is imprinted onto the printing pad PAD, an ink pattern PN can be formed on the printing pad PAD. The ink pattern PN can be made of essentially the same material as the ink INK.

[0127] The ink pattern PN may include a first border line BZL1 surrounding at least one hole and a second border line BZL2 surrounding the first border line BZL1. For example, the first border line BZL1 may have a shape surrounding a first hole OP1, a second hole OP2, and a third hole OP3. The first hole OP1, the second hole OP2, and the third hole OP3 may be... Figure 2 The first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 shown correspond to each other.

[0128] However, the shape of the first border line BZL1 should not be limited to or restricted by this, and should be taken into account Figure 2 The sensor areas SA1, SA2, and SA3 can have two or fewer holes, or four or more holes.

[0129] For example, when forming an ink pattern PN on a printing pad PAD, a first border line BZL1 can be formed in the first pattern portion PP1 (see reference). Figure 6And a second border line BZL2 can be formed in the second pattern portion PP2 (refer to...). Figure 6 ).

[0130] Therefore, when the printing pad PAD is pressed towards the target substrate BS, the first border line BZL1 can be transferred without deformation. Thus, printing quality can be improved when printing on the target substrate BS using the printing pad PAD.

[0131] Reference Figure 8 and Figure 9C In the second step S200, the printed pad PAD and the ink pattern PN can be provided to the target substrate BS. Specifically, the second step S200 can be a process of pressing the printed pad PAD toward the target substrate BS. Due to the second step S200, the printed pad PAD and the ink pattern PN can come into contact with the target substrate BS, and the ink pattern PN can be transferred to the target substrate BS.

[0132] The target substrate BS can be an optically transparent substrate. For example, the target substrate BS can include a synthetic resin such as polyimide or ultrathin glass. The above description of the base substrate WM-BS can be applied to the target substrate BS.

[0133] Reference Figure 8 and Figure 9D The third step, S300, can be a process of removing the printed pad PAD from the target substrate BS. Due to the first step S100, the second step S200, and the third step S300, the ink pattern PN can be formed on the target substrate BS. The target substrate BS and the ink pattern PN can be used as a window WM.

[0134] The target substrate BS can have the same characteristics as the reference substrate. Figure 4A and Figure 4B The described window WM base substrate WM-BS has essentially the same function. Figure 4A and Figure 4B The described window WM has a border pattern WM-BZ that has essentially the same function. The first step S100, the second step S200, and the third step S300 can be a method for manufacturing the window WM according to the embodiment.

[0135] The fourth step, S400, can be the display panel DP (refer to...). Figure 2 ) set in Figure 9D The process below the window WM. Specifically, the display panel DP (refer to...) Figure 2 It can be set below the target substrate BS and the ink pattern PN.

[0136] The fifth step, S500, may involve installing at least one electronic optical module (ELM) (see reference). Figure 2Placed on the display panel DP (refer to) Figure 2 The process below. For example, the electron optical module (ELM) (refer to...) Figure 2 This may include camera modules, infrared light sensors, etc.

[0137] Figure 10 This is a plan view showing the window WM according to an embodiment.

[0138] Figure 10 This is a plan view showing the window WM formed by the first step S100, the second step S200, and the third step S300.

[0139] The window WM may include a transmissive area TA defined therein and border areas BZA1 and BZA2.

[0140] The transmissive region TA can be an optically transparent region. The border regions BZA1 and BZA2 can have a lower transmittance than the transmissive region TA. The border regions BZA1 and BZA2 can include a first border region BZA1 and a second border region BZA2.

[0141] The first border region BZA1 may have a shape surrounding at least one hole. The first border region BZA1 may have a shape consistent with the first border line BZL1 (see reference). Figure 9C The shapes are basically the same. For example, the first border area BZA1 can have a shape surrounding the first hole OP1, the second hole OP2, and the third hole OP3.

[0142] The first hole OP1, the second hole OP2, and the third hole OP3 can be compared with the reference. Figure 2 The first sensor region SA1, the second sensor region SA2, and the third sensor region SA3 are described. The first border region BZA1 can be compared with the reference... Figure 1 The first non-display area NDA1 of the described electronic device ED corresponds to this.

[0143] The first border area BZA1 prevents internal components of the electronic device ED that overlap with the first border area BZA1 from being perceived or visually recognized by the user of the electronic device ED. The first border area BZA1 can improve the aesthetics of the electronic device ED.

[0144] The transmission region TA can surround the first border region BZA1. The transmission region TA can be compared with the reference. Figure 1 The description corresponds to the display area DA.

[0145] The second border region BZA2 can be configured to be adjacent to the transmission region TA and can surround the transmission region TA. The second border region BZA2 can have a connection with the second border line BZL2 (see reference). Figure 9CThe shapes are basically the same.

[0146] The second border area BZA2 can be compared with the reference. Figure 1 The second non-display area NDA2 of the described electronic device ED corresponds to this.

[0147] In addition, the second border area BZA2 can be compared with the reference. Figure 5 The description corresponds to the first passive region DP-BA of the display panel DP. The second bezel region BZA2 can cover the first passive region DP-BA to prevent the first passive region DP-BA from being observed or visually identified from the outside.

[0148] Figure 10 Window WM is shown as a representative example, and the first border region BZA1 and the second border region BZA2 can have various shapes. In another embodiment, at least one of the first border region BZA1 and the second border region BZA2 can be omitted.

[0149] The print quality is assessed based on the shape of the printing pad.

[0150] The printing quality of the printing pads is evaluated. Ink patterns are transferred onto a target substrate using printing pads from Embodiment Example 1, Comparative Example 1, and Comparative Example 2. The printing pad of Embodiment Example 1 corresponds to the printing pad according to the embodiment. However, the embodiments are not limited thereto.

[0151] The printing pad of Example 1 corresponds to the printing pad with a tilt angle θ of approximately 46 degrees for the first pattern portion PP1 according to the embodiment. Figure 11A A printed image of the first border line BZL1 formed by the printing pad of Embodiment Example 1 is shown.

[0152] The printing pad of Comparative Example 1 corresponds to a conventional printing pad, in which the tilt angle of the area corresponding to the first pattern portion PP1 is approximately 35 degrees. Figure 11B A printed image of the first border line BZL1 formed by the printing pad of Comparative Example 1 is shown.

[0153] The printing pad of Comparative Example 2 corresponds to a conventional printing pad, in which the tilt angle of the area corresponding to the first pattern portion PP1 is approximately 23 degrees. Figure 11C A printed image of the first border line BZL1 formed by the printing pad of Comparative Example 2 is shown.

[0154] Reference Figure 11A The lines A-A' and B-B' of the printed image are printed to be substantially parallel to each other. Therefore, the printing quality of the printing pad in Example 1 of Embodiment 1 is observed to be normal.

[0155] Reference Figure 11B In this case, lines C-C' and D-D' of the printed image are printed as non-parallel to each other. Specifically, the portion of line C-C' is distorted. Therefore, the printing quality of the printing pad in Comparative Example 1 is observed to be defective.

[0156] Reference Figure 11C In this case, the lines E-E' and F-F' of the printed image are printed as non-parallel to each other. Specifically, the portion of line E-E' is distorted. Therefore, the printing quality of the printing pad in Comparative Example 2 is observed to be defective.

[0157] Reference Figure 11A Since the tilt angle θ of the first pattern portion PP1 is controlled to be equal to or greater than about 46 degrees and equal to or less than about 90 degrees, the printing pad of this embodiment can be printed normally without deforming the printed image.

[0158] Figure 12A and Figure 12B This is a view illustrating a method for manufacturing a window according to an embodiment. (Refer to...) Figure 12A and Figure 12B Describe the printing performance of the printing pad based on the tilt angle.

[0159] Figure 12A A printed pad PAD according to an embodiment is schematically shown, in which a printed pad PAD contains Figure 7 The tilt angle θ defined in the middle is equal to or greater than approximately 46 degrees. Figure 12B The illustration schematically shows a conventional printed pad PAD, in which... Figure 7 The tilt angle θ is less than approximately 46 degrees.

[0160] Reference Figure 12A In the process of contacting the printed pad PAD with the target substrate BS in this embodiment, air between the printed pad PAD and the target substrate BS can be expelled. Therefore, the printed pad PAD and the target substrate BS can be in complete contact with each other, and thus, the printed pad PAD can transfer ink onto the target substrate BS without deforming the shape of the ink. For example, the ink can be provided to the first patterned portion PP1 (see reference...). Figure 6 The first border line BZL1 (refer to) Figure 9B According to the embodiment, the printed pad PAD can transfer the first border line BZL1 onto the target substrate BS without deforming the shape of the first border line BZL1.

[0161] For example, a printed pad PAD according to an embodiment includes a top surface, a bottom surface BF, and a side surface connecting the top surface and the bottom surface BF. The side surface of the printed pad PAD may include a first patterned portion PP1 and a second patterned portion PP2. When an ink pattern PN is provided to the printed pad PAD, a first border line BZL1 may be formed in the first patterned portion PP1, and a second border line BZL2 may be formed in the second patterned portion PP2. When the printed pad PAD is not deformed or pressed, the first patterned portion PP1 of the printed pad PAD has a tilt angle θ equal to or greater than about 46 degrees based on its bottom surface BF. When the printed pad PAD is pressed or deformed to transfer the first border line BZL1 to the target substrate BS, the top surface of the printed pad PAD and the first patterned portion PP1 are substantially flat, with no gap between the first patterned portion PP1 and the target substrate BS, such that the first border line BZL1 is transferred to the target substrate BS without deforming its shape.

[0162] Reference Figure 12B When the tilt angle θ of the first patterned portion PP1 of the printed pad PAD is less than about 46 degrees before the printed pad PAD is pressed or deformed, air (AIR) may remain between the printed pad PAD and the target substrate BS during the process of contacting the printed pad PAD with the target substrate BS. In other words, when the tilt angle θ of the first patterned portion PP1 of the printed pad PAD is less than about 46 degrees before the printed pad PAD is pressed or deformed, the top surface of the printed pad PAD and the first patterned portion PP1 are not substantially flat during the process of contacting the printed pad PAD with the target substrate BS. Therefore, when the ink provided to the printed pad PAD is transferred onto the target substrate BS, the shape of the ink may be deformed. For example, the ink may be provided to the first patterned portion PP1 (see reference). Figure 6 The first border line BZL1 (refer to) Figure 9B The shape of the first border line BZL1, which is transferred to the target substrate BS by the printed pad PAD using conventional techniques, may be deformed.

[0163] The window manufacturing method according to this embodiment can improve the reliability of the process of printing ink patterns on a target substrate using a printing pad.

[0164] The manufacturing method of the electronic device according to this embodiment can reduce the defect rate of the manufacturing process of electronic devices using printed pads.

[0165] Although specific embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this specification. Therefore, the inventive concept is not limited to these embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. A method for manufacturing a window, the method comprising the following steps: Provide the ink pattern to the printing pad; The printing pad and the ink pattern are provided to the target substrate, such that the ink pattern is transferred to the target substrate; as well as Remove the printed pad from the target substrate, the ink pattern comprising: A first border line surrounds at least one hole; and A second border line surrounds the first border line, and the printing pad includes: Top surface; Bottom surface; and A side surface, connecting the top surface and the bottom surface, includes a first pattern portion and a second pattern portion, wherein a first border line is formed in the first pattern portion and a second border line is formed in the second pattern portion. The first patterned portion of the printing pad has a tilt angle of 46 degrees or greater and 90 degrees or less based on the bottom surface of the printing pad.

2. The method according to claim 1, wherein, The steps of providing the printing pad and the ink pattern include pressing the printing pad toward the target substrate.

3. The method according to claim 1, wherein, The steps of providing the printing pad and the ink pattern include moving the printing pad and the ink pattern to contact the target substrate.

4. The method according to claim 1, wherein, The ink pattern includes a light-blocking material.

5. The method according to claim 1, wherein, After the step of removing the printed pad, the target substrate includes a first border region defined in the target substrate, a transmissive region, and a second border region surrounding the transmissive region, wherein: Each of the first border region and the second border region is a light-blocking region, and the transmission region is a light-transmitting region.

6. The method according to claim 1, wherein, The printed pad includes at least one of silicone and rubber.

7. The method according to claim 1, wherein, The target substrate comprises a glass material.

8. The method according to claim 1, wherein, The target substrate has a thickness of 20 μm or greater and 80 μm or less.

9. The method according to claim 1, wherein, The target substrate comprises a synthetic resin.

10. The method according to claim 1, wherein, The target substrate is flexible.

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