Light source device and projection equipment

Abstract

The embodiments of the present application provide a light source device and a projection device. The light source device includes a base, a tube shell, a laser component, and a wavelength conversion component. The tube shell is buckled onto the base and encloses a receiving cavity. The tube shell is provided with a light exit hole. The laser component is arranged in the receiving cavity and includes a laser chip for emitting laser light. The wavelength conversion component is connected to the tube shell and corresponds to the light exit hole. The wavelength conversion component is arranged on the optical path of the light emitted by the laser chip and is used to convert part of the incident laser light into fluorescence. The incident surface of the wavelength conversion component is provided with an anti-reflection film. The laser light emitted by the laser chip is incident on the wavelength conversion component through the anti-reflection film. The fluorescence converted by the wavelength conversion component and the unconverted laser light are combined to form white light, which is emitted from the exit surface of the wavelength conversion component. By arranging the laser component in the receiving cavity and providing an anti-reflection film on the incident surface of the wavelength conversion component, the light source device can improve the light utilization efficiency while emitting white light that meets the requirements.

Description

Technical Field

[0001] The present application belongs to the field of optical technology, and more specifically, relates to a light source device and a projection device. Background Art

[0002] The technology of generating white light by laser-exciting phosphors is widely used in the lighting and display fields, such as in automotive lights, streetlights, and projectors. Laser-exciting phosphors can be used to create white light-emitting devices using TO packaging technology. TO packaging refers to transistor outline or through-hole packaging technology, meaning it is a fully enclosed packaging technology.

[0003] However, the light utilization efficiency of a white light emitting device currently formed using TO packaging technology is low. Summary of the Invention

[0004] The purpose of the present application includes, for example, providing a light source device to improve the above-mentioned problems.

[0005] The embodiments of the present application can be implemented as follows:

[0006] In a first aspect, a light source device is provided, comprising a base, a tube shell, a laser component and a wavelength conversion component; the tube shell is snap-fitted onto the base, the tube shell and the base form a receiving cavity, and the tube shell is provided with a light exit hole connected to the receiving cavity; the laser component is arranged in the receiving cavity, and the laser component includes a laser chip for emitting laser light; the wavelength conversion component is connected to the tube shell and corresponds to the light exit hole to seal the receiving cavity, the wavelength conversion component is arranged on the optical path of the light emitted by the laser chip and is used to convert part of the incident laser light into fluorescence, the incident surface of the wavelength conversion component is provided with an anti-reflection film, the laser emitted by the laser chip is incident on the wavelength conversion component through the anti-reflection film, the fluorescence converted by the wavelength conversion component and the unconverted laser light are combined to form white light, which is emitted from the exit surface of the wavelength conversion component.

[0007] Furthermore, the wavelength conversion component includes a fixedly connected substrate and a wavelength conversion layer, the incident surface is located on the side of the substrate away from the wavelength conversion layer, the exit surface is located on the side of the wavelength conversion layer away from the substrate, the substrate is connected to the tube shell, the wavelength conversion layer is used to convert part of the incident laser into fluorescence, and the wavelength conversion layer corresponds to the light output hole.

[0008] Furthermore, the antireflection film is a combined film, which can transmit laser light with an incident angle less than 16° and reflect laser light with an incident angle greater than 16° and fluorescence converted by the wavelength conversion component.

[0009] Furthermore, the light source device also includes a light output component, and the tube shell is also provided with a mounting portion, which is connected to the light output hole. The light output component is fixed to the mounting portion and is located at the output end of the wavelength conversion component, and is used to collect white light emitted from the output surface and output it at a preset angle.

[0010] Furthermore, the light output component includes a light incident surface and a light output surface that are arranged back to back, and both the light incident surface and the light output surface are provided with an anti-reflection film.

[0011] Furthermore, the mounting portion includes a first mounting portion and a second mounting portion, the first mounting portion is closer to the light exit hole relative to the second mounting portion, the wavelength conversion component is connected to the first mounting portion, the incident surface is connected to the bottom wall of the first mounting portion, and the light exit component is connected to the second mounting portion and has a distance between it and the exit surface.

[0012] Furthermore, the laser assembly also includes pins, the base is provided with through holes matching the pins, the pins are passed through the through holes one by one and are insulated and connected to the base through insulators, and the laser chip is arranged in the accommodating cavity and connected to the pins through gold wires.

[0013] Furthermore, the laser assembly also includes a heat sink, which is fixed to a side of the base close to the accommodating cavity. The laser chip is connected to the heat sink, and the laser emitted by the laser chip is located in the middle of the light output hole.

[0014] Furthermore, the light source device also includes a reflector, which is fixed to a side of the base close to the accommodating cavity. The reflector includes a reflective surface facing the laser chip, and the reflective surface is used to reflect the laser emitted by the laser chip to the incident surface.

[0015] Furthermore, a kovar ring is provided between the tube shell and the base, and the kovar ring is welded to the base.

[0016] Furthermore, the reflecting surface includes a first reflecting surface and a second reflecting surface having an included angle, the first reflecting surface is closer to the base relative to the second reflecting surface, the reflector also includes a first fixed surface for connecting to the base, the included angle between the first reflecting surface and the first fixed surface is smaller than the included angle between the second reflecting surface and the first fixed surface, and the height of the intersection line between the first reflecting surface and the second reflecting surface relative to the base is equal to the height of the center position of the laser emitting surface of the laser chip relative to the base.

[0017] In a second aspect, a projection device is provided, comprising a device body and the above-mentioned light source device.

[0018] The light source device and projection equipment provided in the embodiments of the present application are constructed by enclosing a housing and a base to form a cavity. The laser assembly is disposed within the cavity, and the wavelength conversion assembly is connected to the housing. The wavelength conversion assembly's exit surface aligns with the housing's light exit hole. When the laser chip emits laser light, the laser light incident on the wavelength conversion assembly is stimulated to produce fluorescence. The converted fluorescence combines with unconverted laser light emitted from the laser chip to produce white light, which is then emitted from the exit surface. By providing an anti-reflection film on the incident surface of the wavelength conversion assembly, the output light efficiency can be greatly improved, thereby enabling the light source device to improve light utilization while still emitting white light that meets the requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A cross-sectional view of a light source device provided in the first embodiment of the present application;

[0021] Figure 2 for Figure 1 A magnified schematic diagram of point A in the middle;

[0022] Figure 3 A schematic structural diagram of a base in a light source device provided in the first embodiment of the present application;

[0023] Figure 4 A schematic structural diagram of a tube shell in a light source device provided in the first embodiment of the present application;

[0024] Figure 5 A cross-sectional view of a tube cap in a light source device provided in the first embodiment of the present application;

[0025] Figure 6 A cross-sectional view of a laser assembly in a light source device provided in the first embodiment of the present application;

[0026] Figure 7 for Figure 1 Cross-sectional view along section BB;

[0027] Figure 8 A cross-sectional view of a wavelength conversion component in a light source device provided in the first embodiment of the present application;

[0028] Figure 9 for Figure 8 A top view of

[0029] Figure 10A schematic diagram of another structure of a wavelength conversion component in the light source device provided in the first embodiment of the present application;

[0030] Figure 11 A schematic structural diagram of a light emitting component in a light source device provided in the first embodiment of the present application;

[0031] Figure 12 A cross-sectional view of a light source device provided in a second embodiment of the present application;

[0032] Figure 13 A cross-sectional view of a tube shell in a light source device provided in a second embodiment of the present application;

[0033] Figure 14 An exploded view of a tube shell in a light source device provided in a second embodiment of the present application;

[0034] Figure 15 A cross-sectional view of a light source device provided in a third embodiment of the present application;

[0035] Figure 16 for Figure 15 Cross-sectional view along CC section;

[0036] Figure 17 for Figure 16 Schematic diagram of the structure of the middle reflector;

[0037] Figure 18 for Figure 15 Relative energy surface distribution diagram of the blue laser spot on the incident surface of the wavelength conversion layer for the corresponding structure;

[0038] Figure 19 for Figure 15 Relative energy distribution diagram of blue laser on the center line of the laser spot fast axis direction for the corresponding structure;

[0039] Figure 20 A cross-sectional view of a light source device provided in a fourth embodiment of the present application;

[0040] Figure 21 for Figure 20 Schematic diagram of the structure of the middle reflector;

[0041] Figure 22 for Figure 20 Schematic diagram of the optical path of the laser chip;

[0042] Figure 23 for Figure 20 Relative energy surface distribution diagram of the blue laser spot on the incident surface of the wavelength conversion layer for the corresponding structure;

[0043] Figure 24 for Figure 20 Relative energy distribution diagram of blue laser on the center line of the laser spot fast axis direction for the corresponding structure;

[0044] Figure 25 This is the relative energy surface distribution diagram of the blue laser spot on the incident surface of the wavelength conversion layer after the laser energy at the center of the laser spot is lowered;

[0045] Figure 26 The relative energy distribution diagram of the blue laser on the center line of the laser spot fast axis direction after the laser energy at the center of the laser spot is lowered;

[0046] Figure 27 A cross-sectional view of a light source device provided in a fifth embodiment of the present application;

[0047] Figure 28 A cross-sectional view of a wavelength conversion component in a light source device provided in a fifth embodiment of the present application;

[0048] Figure 29 A top view of a wavelength conversion component in a light source device provided in a fifth embodiment of the present application;

[0049] Figure 30 A cross-sectional view of a light source device provided in a sixth embodiment of the present application;

[0050] Figure 31 A cross-sectional view of a tube shell in a light source device provided in a sixth embodiment of the present application;

[0051] Figure 32 This is a cross-sectional view of a wavelength conversion component that matches the tube shell in the light source device provided in the sixth embodiment of the present application. DETAILED DESCRIPTION

[0052] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0053] It should be noted that, in the absence of conflict, the features in the embodiments of this application can be combined with each other.

[0054] First embodiment

[0055] The present application provides a light source device. Figure 1 , which is a cross-sectional view of the light source device 100.

[0056] The light source device 100 may include a base 110, a housing 120, a laser assembly 130, and a wavelength conversion assembly 140. The housing 120 is snap-fitted onto the base 110, and the housing 120 and the base 110 form a receiving cavity 124. The laser assembly 130 is disposed within the receiving cavity 124, and the wavelength conversion assembly 140 is connected to the housing 120.

[0057] like Figure 2 The laser component 130 may include a laser chip 133, which is used to emit laser light. The tube shell 120 is provided with a light emitting hole 126 connected to the accommodating cavity 124. The light emitting hole 126 is located at the end of the tube shell 120 away from the base 110. The wavelength conversion component 140 corresponds to the light emitting hole 126 to seal the accommodating cavity 124. At the same time, the wavelength conversion component 140 is arranged on the optical path of the laser emitted by the laser chip 133, and the incident surface 1410 of the wavelength conversion component 140 is provided with an anti-reflection film 145.

[0058] Laser light emitted by the laser chip 133 can be emitted toward the light exit hole 126 of the housing 120. The exit surface 1430 of the wavelength conversion component 140 corresponds to the position of the light exit hole 126. That is, when the wavelength conversion component 140 is connected to the housing 120, the exit surface 1430 of the wavelength conversion component 140 is located precisely within the region of the light exit hole 126 of the housing 120. It should be noted that two configurations are possible: In the first configuration, the shape and size of the exit surface 1430 coincide with those of the light exit hole 126 of the housing 120; in the second configuration, the size of the exit surface 1430 is smaller than that of the light exit hole 126. In other words, the exit surface 1430 is located within the region of the light exit hole 126 of the housing 120.

[0059] An antireflection film 145 is provided on the incident surface 1410 of the wavelength conversion component 140 to improve the light utilization efficiency of the light source device 100. Optionally, the antireflection film 145 may include a composite film formed, for example, of silicon nitride Si3N4 and aluminum oxide Al2O3 to allow transmission of blue light with an incident angle within a range of 16° and reflect blue light with an incident angle greater than 16°.

[0060] For further information, please refer to Figure 3 , Figure 3 This is a structural diagram of the base 110 in the light source device 100 provided in an embodiment of the present application.

[0061] The base 110 can be a circular plate-shaped structure. A through hole 112 communicating with the accommodating cavity 124 can be defined in the center of the base 110. The number of through holes 112 is equal to the number of pins 135 in the laser assembly 130, both being two. The outer surface of the base 110 can also be provided with positioning grooves for easy installation. The number of positioning grooves can be multiple, and their distribution depends on the installation requirements.

[0062] Please refer to Figure 4 and Figure 5 , Figure 4 This is a structural diagram of the tube shell 120 in the light source device 100 provided in an embodiment of the present application. Figure 5 FIG. 2 is a cross-sectional view of the tube shell 120 .

[0063] The tube shell 120 can be a hollow rotating body structure, and the tube shell 120 is inverted on the base 110. The light outlet hole 126 is opened in the middle position of the top of the tube shell 120. The light outlet hole 126 can be a circular structure, and the central axis of the light outlet hole 126 can coincide with the central axis of the tube shell 120.

[0064] The wavelength conversion component 140 is connected to a side of the tube shell 120 close to the accommodating cavity 124 . To improve the stability of welding between the wavelength conversion component 140 and the tube shell 120 , a metal layer may be plated on the connection surface between the wavelength conversion component 140 and the tube shell 120 .

[0065] Optionally, the tube shell 120 includes a top surface 1201 (eg, Figure 5 ), a metal layer may be plated on the top surface 1201 of the tube shell 120. Plating the metal layer facilitates a sealed connection between the wavelength conversion component 140 and the tube shell 120 during welding. Optionally, the metal layer may be made of NiAu (nickel gold). In other optional embodiments, the metal layer may also be made of other metals or a combination of multiple metals, which is not limited in this application.

[0066] Please continue to refer to Figure 1 In order to facilitate the matching of the light source device 100 provided in the embodiment of the present application with the optical system of the client, the light source device 100 provided in the embodiment of the present application may further include a light emitting component 150 , which is connected to the tube housing 120 and is located at the emission end of the wavelength conversion component 140 .

[0067] In order to facilitate the connection of the light emitting assembly 150 to the tube housing 120, please continue to refer to Figure 4 and Figure 5 A mounting portion 1202 is further provided on the side of the tube shell 120 away from the accommodating cavity 124. The mounting portion 1202 is a groove-shaped structure. The mounting portion 1202 is connected to the light output hole 126. The shape of the mounting portion 1202 matches the shape of the light output component 150. The light output component 150 can be fixedly connected to the mounting portion 1202 by gluing.

[0068] In order to further improve the stability of the connection between the light output assembly 150 and the tube housing 120, a glue dispensing groove 1205 is provided on the side wall of the mounting portion 1202 of the tube housing 120. The number of glue dispensing grooves 1205 can be multiple, and the multiple glue dispensing grooves 1205 are evenly distributed along the circumference of the mounting portion 1202. During assembly, the light output assembly 150 and the tube housing 120 are bonded and fixed through the glue dispensing grooves 1205, and the stability of the bonding can be improved.

[0069] Optionally, the base 110 and the tube shell 120 can be welded or bonded. When the base 110 and the tube shell 120 are welded, a stored energy sealing welding machine can be used, and the base 110 can be made of Kovar material.

[0070] To improve the heat dissipation of the wavelength conversion component 140, the housing 120 can also be made of copper or other metal materials with good thermal conductivity. When copper or other metal materials with good thermal conductivity are used for the housing 120, the housing 120 and the base 110 need to be eutectic-vacuum-bonded using solder sheets or pre-plated solder to achieve a seal. Furthermore, the welding surface between the housing 120 and the base 110 can be plated with a solder metal layer, such as NiAu (nickel gold).

[0071] It is understood that the base 110 and the tube shell 120 can also be sealed by welding with a welding piece or pre-plated solder eutectic vacuum welding. When the base 110 and the tube shell 120 are welded with a welding piece or pre-plated solder, the base 110 can be made of copper with good thermal conductivity.

[0072] Furthermore, if Figure 6 The laser assembly 130 may include a heat sink 131 , a laser chip 133 disposed on the heat sink 131 , and pins 135 .

[0073] A heat sink 131 is connected to the side of the base 110 near the accommodating cavity 124. The heat sink 131 protrudes from the surface of the base 110 near the accommodating cavity 124. The heat sink 131 secures the laser chip 133 and also serves to conduct heat away from the laser chip 133. The laser chip 133 is connected to the heat sink 131 and positioned within the accommodating cavity 124. The laser chip 133 is connected to the pin 135 via a gold wire 139 for laser emission. Laser light emitted from the laser chip 133 can pass through the antireflection coating 145 on the incident surface 1410 of the wavelength conversion assembly 140 before exiting through the exit surface 1430.

[0074] Optionally, the heat sink 131 and the base 110 can be welded. Brazing can be used to facilitate heat conduction. The heat sink 131 can be made of copper to achieve better heat dissipation. It is understood that the heat sink 131 and the base 110 can also be integrally formed.

[0075] like Figure 7 Optionally, the heat sink 131 can be a semi-cylindrical structure and include a connecting surface 1311, which is a vertical surface parallel to the central axis of the tube shell 120. When the heat sink 131 is connected to the base 110, the center line of the connecting surface 1311 coincides with the central axis of the base 110. During installation, the laser chip 133 can be vertically fixed at the middle position of the connecting surface 1311, so that the laser light emitted by the laser chip 133 can be located at the center position of the base 110 and finally emitted from the middle position of the light exit hole 126 of the tube shell 120 (such as Figure 2 ).

[0076] Optionally, the connection surface 1311 of the heat sink 131 further includes a vertically defined avoidance groove 1313. The location and size of the avoidance groove 1313 match the location and size of the pins 135 to prevent interference between the pins 135 and the heat sink 131 during installation. The number of avoidance grooves 1313 can be the same as the number of pins 135, which can be two. The two pins 135 correspond to the positive and negative electrodes of the laser chip 133, respectively.

[0077] The laser chip 133 can be soldered to the heat sink 131 using solder paste, soldering pads, or the like. Alternatively, the laser chip 133 can be sintered to the heat sink 131 using nano-gold glue or nano-silver glue. This method can reduce the thermal resistance between the laser chip 133 and the heat sink 131. The laser chip 133 is located between the two avoidance grooves 1313 and is disposed within the accommodating cavity 124 via the heat sink 131. The positive and negative electrodes of the laser chip 133 can be led to the outside of the base 110 via pins 135 and gold wires 139, facilitating power supply and drive.

[0078] The two pins correspond to the avoidance groove 1313 and the through-hole 112 of the base 110, respectively. During installation, the pins 135 are inserted into the through-holes 112 in a one-to-one correspondence. The pins 135 are insulated from the base 110 by insulators 137, which can be made of low-temperature glass or ceramic. The laser light emitted by the laser chip 133 extends in the opposite direction of the pins 135. The laser chip 133 is electrically connected to the pins 135 via gold wires 139.

[0079] Optionally, the laser chip 133 can be a blue laser chip, and the emission wavelength of the blue laser is within the range of 430nm to 470nm. The laser chip 133 includes a semiconductor laser chip, which is a chip integrated with the submount (substrate), and the positive and negative electrodes are both arranged on the upper surface of the chip. The heat dissipation path of the laser chip 133 in the light source device 100 provided in the first embodiment of the present application is: Figure 6The laser chip 133 first transfers the heat to the heat sink 131, and then the heat sink 131 transfers the heat to the base 110, and finally the base 110 dissipates the heat to the outside to achieve the purpose of heat dissipation.

[0080] It can be understood that the laser chip 133 in the first embodiment of the present application is not limited to the above-mentioned semiconductor laser chip chip. For example, a conventional chip with positive and negative poles respectively arranged on the upper and lower surfaces, and a laser chip chip connected to an independent submount by eutectic welding can also be applied to the first embodiment of the present application.

[0081] For further information, please refer to Figure 8 , which is a cross-sectional view of the wavelength conversion component 140 . The wavelength conversion component 140 may be circular, and the area of ​​the exit surface 1430 of the wavelength conversion component 140 may be smaller than the area of ​​the light exit hole 126 .

[0082] The wavelength conversion component 140 may include a fixedly connected base 141 and a wavelength conversion layer 143. The base 141 is a plate-like structure, which is used to be fixedly connected to the tube shell 120. The wavelength conversion layer 143 is connected to one side of the base 141 along the thickness direction and is located at the center of the base 141.

[0083] The incident surface 1410 of the wavelength conversion component 140 is located on a side of the base 141 away from the wavelength conversion layer 143 , and the emitting surface 1430 is disposed on a side of the wavelength conversion layer 143 away from the base 141 .

[0084] The base 141 is connected to the tube shell 120, and the wavelength conversion layer 143 is used to convert part of the incident laser light into fluorescence, and the wavelength conversion layer 143 corresponds to the light exit hole 126. That is, when the base 141 is connected to the tube shell 120, the wavelength conversion layer 143 will be embedded in the light exit hole 126 (such as Figure 1 ), the emission surface 1430 on the wavelength conversion layer 143 falls within the range of the light exit hole 126. Optionally, the center of the emission surface 1430 coincides with the center of the light exit hole 126, so that the emission surface 1430 is located at the center of the light exit hole 126.

[0085] The side of substrate 141 facing away from wavelength conversion layer 143 includes an incident surface 1410, which is provided with an antireflection coating 145 to improve light utilization. Optionally, antireflection coating 145 can be a combination coating. The combination coating is required to transmit laser light with an incident angle less than 15° (blue light with a wavelength of 430nm to 470nm), while reflecting laser light with an incident angle greater than 15° (blue light with a wavelength of 430nm to 470nm) and fluorescent light (with a wavelength of 470nm to 700nm) converted by wavelength conversion layer 143. The transmittance and reflectivity of antireflection coating 145 are set to the maximum values ​​achievable by the coating.

[0086] The fluorescent light converted by wavelength conversion component 140, along with a small portion of incompletely absorbed laser light (blue light with a wavelength of 430nm to 470nm), is emitted from output surface 1430, thereby forming white light. It is understood that in order to meet the desired correlated color temperature and color coordinate requirements for the output white light, in addition to selecting yellow and green phosphors with different emission spectra, the phosphor content and thickness of wavelength conversion layer 143 can also be adjusted to meet the desired output white light.

[0087] Furthermore, the side of the base 141 near the wavelength conversion layer 143 includes a second fixing surface 147, through which the base 141 is fixedly connected to the housing 120. During installation, the second fixing surface 147 and the top surface 1201 of the housing 120 are welded together, with the incident surface 1410 facing the emission side of the laser chip 133, and the wavelength conversion layer 143 corresponding to the light output hole 126 of the housing 120.

[0088] It is worth noting that the cross-sectional area of ​​the wavelength conversion layer 143 can be greater than or equal to the area of ​​the laser spot emitted on the wavelength conversion layer 143, so that part of the laser incident on the wavelength conversion layer 143 can be converted into fluorescence to a large extent.

[0089] Alternatively, the substrate 141 may be made of sapphire or other optical glass. The wavelength conversion layer 143 may be formed of phosphor and inorganic material. The phosphor may be YAG phosphor with high heat resistance or other types of phosphor.

[0090] Please refer to Figure 9, which is a top view of the wavelength conversion component 140. A sealing welding metal layer 128 can be provided on the second fixing surface 147 of the substrate 141 in the wavelength conversion component 140. The provision of the metal layer 128 facilitates the welding fixation between the substrate 141 and the tube shell 120. It should be noted that the metal layer 128 is provided between the top surface 1201 of the tube shell 120 and the second fixing surface 147 of the substrate 141. There are three ways to provide the metal layer: providing the metal layer only on the top surface 1201 of the tube shell 120; providing the metal layer only on the second fixing surface 147 of the substrate 141; and providing the metal layer on both the top surface 1201 of the tube shell 120 and the second fixing surface 147 of the substrate 141. This application does not impose any restrictions on the specific setting of the metal layer, which shall be determined according to actual needs.

[0091] When the sealing welding metal layer 128 is provided on the second fixing surface 147 of the substrate 141, the metal layer 128 is plated on the second fixing surface 147 and arranged around the circumference of the wavelength conversion layer 143. A gap may be provided between the metal layer 128 and the wavelength conversion layer 143. The metal layer may be made of TiPtAu (titanium platinum gold) or other weldable metal combination materials, such as NiAu (nickel gold). Alternatively, the metal layer may be plated on the substrate 141 by evaporation, sputtering, electroplating, chemical plating, or other methods.

[0092] Optionally, the substrate 141 and the wavelength conversion layer 143 may both be circular (eg Figure 9 It is understood that the shape of the wavelength conversion layer 143 can also be a rectangle or other polygon (such as Figure 10 ), when the shape of the wavelength conversion layer 143 is a rectangle or other polygon, the gap between the metal layer 128 set on the second fixing surface 147 of the substrate 141 and the wavelength conversion layer 143 is also modified to be a rectangle or other polygon. At the same time, the light output hole 126 opened at the top of the tube shell 120 corresponding to the wavelength conversion layer 143 also needs to be designed to be a rectangle or other polygon.

[0093] Please refer to Figure 11 The light output assembly 150 may include a collection lens for collecting the white light emitted from the output surface 1430 of the wavelength conversion assembly 140 and emitting the light at a predetermined angle, such as 120°. It is understood that the output angle of the white light output by the light output assembly 150 is not limited to the aforementioned angles and may be other angles. The specific output angle can be achieved by using different lens designs according to actual needs.

[0094] To improve the efficiency of collecting Lambertian light by the light-emitting assembly 150, two methods can be used to improve the NA value of the collecting lens and the diameter of the collecting lens. The specific design is based on actual needs. During installation, the collecting lens can be fixed to the mounting portion 1202 at the top of the tube shell 120 using glue.

[0095] To improve the light transmittance of the collection lens, the light output assembly 150 may optionally include a light incident surface 151 and a light exit surface 153 disposed opposite each other. Anti-reflection coatings 145 are provided on both the light incident surface 151 and the light exit surface 153 to reduce end face reflection. Specifically, an AR coating (anti-reflective coating) that covers the entire visible light band (430 nm to 700 nm) is provided on both the light incident surface 151 and the light exit surface 153, which are disposed opposite each other.

[0096] In the light source device 100 provided in the first embodiment of the present application, a laser assembly 130 is disposed within a receiving cavity 124, and an antireflection film 145 is coated on the incident surface 1410 of the wavelength conversion component 140. Laser light emitted by the laser chip 133 first passes through the antireflection film 145 disposed on the incident surface 1410 before entering the wavelength conversion layer 143. Wavelength conversion layer 143 converts a portion of the incident laser light into fluorescent light, so that the converted fluorescent light and the unconverted laser light can be combined to form white light, which is then emitted from the exit surface 1430 and finally emitted through the light output component 150. Coating the antireflection film 145 on the incident surface 1410 can greatly improve the output light efficiency. The inventors have verified through experiments that coating the incident surface 1410 with the antireflection film 145 can approximately double the output light efficiency compared to not coating the incident surface 1410 with the antireflection film.

[0097] Second embodiment

[0098] like Figure 12 , which is a cross-sectional view of a light source device 200 provided in a second embodiment of the present application. The structure of the light source device 200 provided in the second embodiment is substantially the same as that of the light source device 100 provided in the first embodiment, and the main difference is:

[0099] In order to improve the heat dissipation performance after the wavelength conversion component 140 and the tube shell 120 are installed, the tube shell 120 can also be a split structure. Figure 12 、 Figure 13 and Figure 14 , Figure 13 FIG. 1 is a cross-sectional view of another structure of the tube shell 120. Figure 14 FIG2 is an exploded view of another structure of the tube housing 120. The tube housing 120 may further include a top portion 121 and a side portion 122, and the top portion 121 and the side portion 122 may be fixedly connected by welding.

[0100] The side portion 122 includes two opposing open ends, namely an open end 1221 and a closed end 1223. The closed end 1223 of the side portion 122 is fixedly connected to the top portion 121, while the open end 1221 is snap-fitted to the base 110. The closed end 1223 has a through hole to facilitate connection with the top portion 121 and to allow the wavelength conversion component 140 to convert the combined light into white light for output.

[0101] The top portion 121 is a circular plate-like structure, and a light exit hole 126 is formed at the center of the top portion 121. When the top portion 121 is fixedly connected to the closing end 1223, the center of the light exit hole 126 coincides with the center of the closing end 1223.

[0102] The top 121 includes a first side and a second side that are arranged in back-to-back relation along the thickness direction. The first side is a plane, and the second side is provided with an annular boss 1210. During installation, the first side is closer to the accommodating cavity 124 relative to the second side, and the first side is used to be welded and fixed to the wavelength conversion component 140. The annular boss 1210 provided on the second side includes an inner side and an outer side. The outer side cooperates with the through hole opened at the closing end 1223 of the side portion 122, and the inner side is used to cooperate and connect with the light output component 150 to form the mounting portion 1202 of the tube shell 120. The top 121 and the side portion 122 can be welded or bonded. If the top 121 and the side portion 122 are welded, they can be welded and fixed using an energy storage sealing machine. By designing the tube shell 120 as a split structure, the heat dissipation performance of the wavelength conversion component 140 after installation is improved.

[0103] It is understandable that in order to improve the stability of the bonding between the light emitting component 150 and the top 121, a glue groove 1205 (such as Figure 13 ), the number of the glue dispensing groove 1205 is at least one, and the light output component 150 is connected to the annular boss 1210 of the top 121 by bonding.

[0104] Alternatively, the top portion 121 can be made of copper, and the side portions 122 can be made of Kovar. When the base 110 is also made of Kovar, the top portion 121 and side portions 122 can be fixed by brazing, and the base 110 and side portions 122 can be welded. This achieves good sealing and strength requirements while enhancing the heat dissipation performance of the wavelength conversion assembly 140.

[0105] Third embodiment

[0106] like Figure 15 , which is a cross-sectional view of a light source device 300 provided in a third embodiment of the present application. The structure of the light source device 300 provided in the third embodiment of the present application is substantially the same as that of the light source device 100 provided in the first embodiment. The main differences are:

[0107] In order to improve the heat dissipation performance of the laser chip 133, the heat dissipation path of the laser chip 133 can be reduced. For example, please refer to Figure 15 and Figure 16 The laser assembly 130 does not include a heat sink, but directly fixes the laser chip 133 to a side of the base 110 close to the accommodating cavity 124 .

[0108] Specifically, if Figure 15 and Figure 16 The laser assembly 130 includes a reflector 160, a laser chip 133, and a pin 135. The reflector 160 is connected to the side of the base 110 near the accommodating cavity 124. The laser chip 133 is welded to the base 110. The laser chip 133 emits laser light onto the reflector 160, which then reflects the laser light into the wavelength conversion assembly 140. The laser light is then converted and combined by the wavelength conversion assembly 140 and emitted from the output surface 1430.

[0109] After the laser chip 133 is fixed on the base 110, the emission direction of the laser chip 133 is parallel to the plane of the base 110 close to the accommodating cavity 124. The reflector 160 includes a reflective surface 163 (such as Figure 17 ), the reflector 160 is fixed on the base 110 and the reflective surface 163 faces the emission direction of the laser chip 133, so that the reflective surface 163 reflects the laser emitted by the laser chip 133 to the incident surface 1410, and after passing through the anti-reflection film 145, it is incident on the wavelength conversion layer 143 and converted into fluorescence. The converted fluorescence and the unconverted laser are combined to form white light, which is emitted from the exit surface 1430.

[0110] Optionally, in order to enable the base 110 and the tube shell 120 to be sealed and welded, a Kovar ring 170 (such as Figure 15 ), the Kovar ring 170 and the base 110 can be fixed by brazing to ensure good structural strength. When connected, the Kovar ring 170 and the tube shell 120 can be sealed and welded using an energy storage sealing welding machine.

[0111] Please refer to Figure 17, shown is a schematic diagram of the reflector 160. The reflector 160 can be made of optical glass. The reflector 160 includes a first fixed surface 161 and a reflecting surface 163. The first fixed surface 161 is fixedly connected to the plane of the base 110 close to the accommodating cavity 124. There is an angle α between the reflecting surface 163 and the first fixed surface 161. Optionally, the angle α can be 45°, and the reflecting surface 163 can reflect the laser light emitted from the laser chip 133 to the reflecting surface 163 into the wavelength conversion component 140. The reflector 160 is fixed to the base 110 through the first fixed surface 161. For example, it can be bonded with convenient and quick UV glue. This application does not limit this fixing method and it can be determined according to actual needs.

[0112] Optionally, a HR film (High Reflective film) having a wavelength corresponding to the laser chip 133 (blue laser) may be coated on the reflective surface 163 to achieve maximum reflection efficiency.

[0113] like Figure 15 The laser light path emitted by laser chip 133 is as follows: laser chip 133 emits blue laser light, which is reflected by reflective surface 163 of reflector 160 onto wavelength conversion component 140. Because reflection by reflector 160 increases the optical path length, the height of the inner cavity of tube housing 120 can be reduced, thereby obtaining a laser spot of an appropriately sized size on wavelength conversion component 140.

[0114] Fourth embodiment

[0115] The structure of the light source device 400 provided in the fourth embodiment of the present application is substantially the same as that of the light source device 300 provided in the third embodiment, and the main differences are:

[0116] The laser light emitted by the laser chip 133 has a Gaussian distribution of light energy. Figure 18 and Figure 19 Since the center energy of the laser chip 133 is relatively high, the center light energy of the laser incident on the wavelength conversion component 140 is relatively high, which will make the center of the light-emitting area of ​​the exit surface 1430 brighter and the uniformity of the laser energy distribution poor. Figure 18 The figure shows that when the height h between the laser emission position of the laser chip 133 and the incident surface of the wavelength conversion layer 143 is 1 mm (as shown in FIG. Figure 15 ), relative energy surface distribution of the blue laser spot on the incident surface of the wavelength conversion layer 143; Figure 19 Shown is the relative energy distribution of the blue laser on the center line of the laser spot fast axis direction (Y direction).

[0117] like Figure 20 , shown is a cross-sectional view of a light source device 400 provided in the fourth embodiment of the present application.

[0118] Please refer to Figure 21 and Figure 22 The reflective surface 163 of the reflector 160 may include a first reflective surface 165 and a second reflective surface 167 having an angle therebetween, that is, the reflective surface is designed as two planes having an angle therebetween. The first reflective surface 165 is closer to the first fixed surface 161 relative to the second reflective surface 167. The angle between the first reflective surface 165 and the first fixed surface 161 is M, and the angle between the second reflective surface 167 and the first fixed surface 161 is N, and N is greater than M. For example, N is 60° and M is 30°. When the reflector 160 and the laser chip 133 are respectively fixed to the base 110, the height of the intersection line between the first reflective surface 165 and the second reflective surface 167 relative to the base 110 is equal to the height of the center position of the laser emitting surface of the laser chip 133 relative to the base 110. When the central axis of the light-emitting device provided in the embodiment of the present application is vertical, the intersection line between the first reflection surface 165 and the second reflection surface 167 is a horizontal straight line and its height relative to the base 141 is equal to the height of the center position of the laser emitting surface of the laser chip 133 relative to the base 141.

[0119] like Figure 22 The laser emitted by the laser chip 133 is divergent. The light rays with smaller angles in the middle and center are reflected by the reflector 160 and incident on the circumferential position of the wavelength conversion component 140. The light rays with larger angles at the edge and center are reflected by the reflector 160 and incident on the central part of the wavelength conversion component 140, thereby making the laser energy distribution incident on the wavelength conversion component 140 more uniform.

[0120] Please refer to Figure 23 and Figure 24 , Figure 23 The figure shows the relative energy distribution of blue laser light under the same conditions when the reflective surfaces include first reflective surface 165 and second reflective surface 167. As can be clearly seen from the figure, compared to when only reflective surface 163 is used, the energy distribution of blue laser light on wavelength conversion assembly 140 is more uniform when the reflective surfaces include first reflective surface 165 and second reflective surface 167, and the brightness and uniformity of the light emitted from combined light exit surface 1430 are better.

[0121] It should be noted that, for the case where the laser is completely evenly distributed, when the laser chip 133 is stimulated to produce fluorescence under the action of the wavelength conversion component 140, the heat generated by the entire laser spot is uniform. However, due to the accumulation of heat at the center of the laser spot, the temperature of the laser spot is distributed from high to low from the center to the edge. The luminous efficiency of the center position with high temperature will decrease, thereby affecting the brightness uniformity of the luminous light. If the laser energy at the center of the laser spot is slightly reduced, it will help to improve the temperature uniformity of the entire laser spot area. Alternatively, slightly reducing the temperature at the center of the laser spot will help to improve the fluorescence conversion efficiency, thereby obtaining better brightness uniformity (such as Figure 25 and Figure 26 ).

[0122] It should be understood that the angle M between the first reflective surface 165 and the first fixed surface 161, and the angle N between the second reflective surface 167 and the first fixed surface 161 are described using an example of 30° for M and 60° for N. During specific design, these angles M and N can be adjusted appropriately based on the required laser spot size and specific laser energy distribution requirements. When adjusting these angles, the distance h between the light-emitting position of the laser chip 133 and the fluorescence incident surface should be considered.

[0123] Fifth embodiment

[0124] like Figure 27 , which is a cross-sectional view of a light source device 500 provided in a fifth embodiment of the present application. The structure of the light source device 500 provided in the fifth embodiment of the present application is substantially the same as that of the light source device 100 provided in the first embodiment, and the main differences are:

[0125] Please refer to Figure 28 and Figure 29 , which is a cross-sectional view of another structure of the wavelength conversion component 140. In the fifth embodiment of the present application, the wavelength conversion component 140 may not include a substrate, but is directly formed by sintering the phosphor powder, alumina ceramic powder, and a binder that volatilizes during sintering to form a conversion body 149. The two opposite surfaces of the conversion body 149 are polished, and the anti-reflection film 145 and the metal layer 128 are respectively coated at the corresponding positions. The polished portion in the middle of the metal layer 128 can serve as the light-combining exit surface 1430 (as shown in FIG. Figure 28 ) to convert the laser light that passes through the anti-reflection film 145 and is incident on the conversion body 149.

[0126] The wavelength conversion layer 143 may be a fluorescent single crystal. Wavelength conversion layers formed from inorganic materials offer better heat and light resistance than those formed from organic materials, resulting in improved reliability. When the wavelength conversion layer is formed from an inorganic material, the inorganic material may be alumina ceramic, which has better thermal properties, or a glass-like material.

[0127] In the fifth embodiment of the present application, the phosphor is mixed with alumina ceramic powder and a binder that volatilizes during sintering to form a slurry, which is then evenly applied to the conversion body 149 and sintered into one piece at high temperature.

[0128] Alternatively, the wavelength conversion component 140 can be soldered to the top surface 1201 of the housing 120 using a preformed solder sheet, such as an 80Au20Sn solder sheet. During soldering, the wavelength conversion layer 143 must be positioned centrally within the light exit aperture 126 of the housing 120. This ensures that the weld between the wavelength conversion component 140 and the housing 120 not only seals the surface but also facilitates heat dissipation from the wavelength conversion component 140.

[0129] It is understood that, in addition to using solder tabs to weld the wavelength conversion component 140 to the tube housing 120, a layer of 80Au20Sn can also be pre-plated on the TiPtAu surface. This allows the wavelength conversion component 140 to be directly sealed and welded to the tube housing 120 without the need for additional materials (solder tabs), simplifying the process and improving product consistency. The light source device 100 provided in the present embodiment is not limited to this welding method and can also adopt other sealing and fixing methods, such as low-temperature glass glue sealing.

[0130] To make the white light emitted from the wavelength conversion layer 143 more uniform, a diffusion powder having a particle size of 1 / 3 to 2 / 3 the size of the phosphor particles can be added to the wavelength conversion layer 143. The diffusion powder diffuses and evens the light within the wavelength conversion layer 143, thereby making the light emitted from the wavelength conversion layer 143 more uniform.

[0131] Sixth embodiment

[0132] like Figure 30 , which is a cross-sectional view of a light source device 600 provided in a sixth embodiment of the present application. The structure of the light source device 600 provided in the sixth embodiment of the present application is substantially the same as that of the light source device 100 provided in the first embodiment, and the main differences are:

[0133] Please refer to Figure 31, which shows a cross-sectional view of the tube housing 120 in the light source device 600 according to the sixth embodiment of the present application. A mounting portion 1202 is defined on the side of the tube housing 120 facing away from the accommodating cavity 124. The mounting portion 1202 includes a first mounting portion 1203 and a second mounting portion 1204. The first mounting portion 1203 and the second mounting portion 1204 are arranged axially along the tube housing 120 and communicate with the light exit hole 126. The first mounting portion 1203 is positioned closer to the light exit hole 126 than the second mounting portion 1204. The bottom wall of the first mounting portion 1203 can be plated with NiAu or other metal layer conducive to welding, facilitating sealed welding with the wavelength conversion component 140.

[0134] During installation, wavelength conversion assembly 140 is mounted on first mounting portion 1203, with incident surface 1410 of wavelength conversion assembly 140 connected to the bottom wall of first mounting portion 1203. Light output assembly 150 is mounted on second mounting portion 1204, with a gap between light output assembly 150 and exit surface 1430 of wavelength conversion assembly 140. Light output assembly 150 is mounted on second mounting portion 1204 and can be secured using UV adhesive. Glue dispensing grooves 1205 can also be provided on the sidewalls of second mounting portion 1204 to facilitate adhesive dispensing and securing.

[0135] Please refer to Figure 32 , Figure 32 Shown with Figure 31 A cross-sectional view of another structure of the wavelength conversion component 140 matched with the middle tube shell 120.

[0136] Because the side of the substrate 141 facing away from the wavelength conversion layer 143 is connected to the bottom wall of the first mounting portion 1203, the side of the substrate 141 facing away from the wavelength conversion layer 143 optionally serves as an incident surface 1410. The incident surface 1410 and the bottom wall of the first mounting portion 1203 can be sealed and welded, and the incident surface 1410 can be plated with a sealing and welding metal layer 128. Since the wavelength conversion assembly 140 is mounted on the top 121 of the tube shell 120, and the light exit hole 126 of the tube shell 120 is located below the substrate 141, when the laser light is emitted from the laser chip 133, it diverges, passes through the light exit hole 126, and is incident on the anti-reflection film 145 of the wavelength conversion assembly 140, and then passes through the anti-reflection film 145 and is incident on the wavelength conversion layer 143.

[0137] It is understandable that the size of the light exit hole 126 of the tube shell 120 can be relatively reduced under the premise that all laser energy can pass through. Since the laser is divergent, the size of the light exit hole 126 can be smaller than that of the wavelength conversion layer 143.

[0138] When the size of the light-emitting hole 126 is reduced, the welding area between the base 141 and the tube shell 120 becomes larger, the area of ​​the sealing welding metal layer 128 also becomes larger accordingly, and the heat conduction area of ​​the wavelength conversion component 140 also becomes larger accordingly, which is conducive to obtaining better heat dissipation performance, thereby improving the luminous efficiency and service life of the wavelength conversion component 140.

[0139] It is understood that the light exit hole 126 of the tube housing 120 can be formed as a rectangular through hole to reduce the area of ​​the light exit hole 126 and increase the heat dissipation area of ​​the wavelength conversion component 140. Of course, the light exit hole 126 can also adopt other shapes such as square, circular, polygonal, etc., and this embodiment of the application is not limited to this.

[0140] Seventh embodiment

[0141] The seventh embodiment of the present application further provides a projection device, comprising a device body and the aforementioned light source device. The device body may be a cinema projector, a laser TV, an engineering projector, a business or educational projector, a video wall, or a micro projector, and the light source device is installed in the device body.

[0142] The light source device and projection apparatus provided in the embodiments of the present application are configured such that the laser assembly 130 is housed in the housing 124 formed by the base 110 and the housing 120, the wavelength conversion assembly 140 is connected to the housing 120, and the emission surface 1430 of the wavelength conversion assembly 140 is aligned with the light emission hole 126 of the housing 120. By providing an anti-reflection film 145 on the incident surface 1410 of the wavelength conversion assembly 140, the light source device 100 can emit white light that meets requirements and improve light utilization efficiency. By installing the wavelength conversion component 140 on the first mounting portion 1203 of the tube shell 120 and installing the light output component 150 on the second mounting portion 1204 of the tube shell 120, it is beneficial to improve the heat dissipation performance of the wavelength conversion component 140 and improve the luminous efficiency. By arranging the reflector 160 in the accommodating cavity 124, the heat dissipation performance of the laser chip 133 can be enhanced. By arranging the reflector 160 to include a first reflecting surface 165 and a second reflecting surface 167 with an angle, it is beneficial to improve the uniformity of the white light emitted from the output surface 1430.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A light source device, characterized in that: include: base; a tube shell, the tube shell being buckled and arranged on the base, the tube shell and the base forming a receiving cavity, and the tube shell being provided with a light emitting hole communicating with the receiving cavity; a laser assembly, the laser assembly being disposed in the accommodating cavity, the laser assembly comprising a laser chip for emitting laser light; and a wavelength conversion component connected to the tube shell and corresponding to the light output hole to seal the accommodating cavity; the wavelength conversion component is disposed on the optical path of light output from the laser chip and is used to convert part of the incident laser light into fluorescence; the incident surface of the wavelength conversion component is provided with an anti-reflection film; the laser light output from the laser chip passes through the anti-reflection film and enters the wavelength conversion component; the fluorescence converted by the wavelength conversion component and the unconverted laser light are combined to form white light, which is emitted from the output surface of the wavelength conversion component; The wavelength conversion component includes a base and a wavelength conversion layer that are fixedly connected. The wavelength conversion layer is used to convert part of the incident laser light into fluorescent light. The wavelength conversion layer corresponds to the light exit hole. The incident surface is located on a side of the base away from the wavelength conversion layer, and the exit surface is located on a side of the wavelength conversion layer away from the base. The tube shell has a top surface close to the accommodating cavity, and the side of the base close to the wavelength conversion layer includes a second fixing surface, the second fixing surface is provided with a metal layer, and the base is welded to the top surface through the metal layer; The light source device also includes a light output component. The tube shell is also provided with a mounting portion, which is connected to the light output hole. The light output component is fixed to the mounting portion and is located at the output end of the wavelength conversion component, and is used to collect the white light emitted from the output surface and output it at a preset angle.

2. The light source device according to claim 1, wherein The antireflection film is a combined film that can transmit laser light with an incident angle less than 16° and reflect laser light with an incident angle greater than 16° and the fluorescence converted by the wavelength conversion component.

3. The light source device according to claim 1, wherein The light emitting component comprises a light incident surface and a light emitting surface which are arranged back to back, and both the light incident surface and the light emitting surface are provided with an antireflection film.

4. The light source device according to claim 1, wherein The laser assembly also includes pins, the base is provided with through holes matching the pins, the pins are passed through the through holes in a one-to-one correspondence and are insulated and connected to the base via insulators, and the laser chip is arranged in the accommodating cavity and connected to the pins via gold wires.

5. The light source device according to claim 4, wherein: The laser assembly further includes a heat sink fixed to a side of the base close to the accommodating cavity. The laser chip is connected to the heat sink, and the laser emitted by the laser chip is located in the middle of the light exit hole.

6. The light source device according to claim 4, wherein: The light source device further includes a reflector fixed to a side of the base close to the accommodating cavity. The reflector includes a reflective surface facing the laser chip, and the reflective surface is used to reflect the laser light emitted by the laser chip to the incident surface.

7. The light source device according to claim 6, wherein: A Kovar ring is further provided between the tube shell and the base, and the Kovar ring is welded to the base.

8. The light source device according to claim 6, wherein The reflecting surface includes a first reflecting surface and a second reflecting surface with an included angle, the first reflecting surface is closer to the base relative to the second reflecting surface, the reflecting mirror also includes a first fixing surface for connecting to the base, the included angle between the first reflecting surface and the first fixing surface is smaller than the included angle between the second reflecting surface and the first fixing surface, and the height of the intersection line between the first reflecting surface and the second reflecting surface relative to the base is equal to the height of the center position of the laser emitting surface of the laser chip relative to the base.

9. A projection device, characterized in that: The device comprises a device body and the light source device according to any one of claims 1 to 8.

Images