Apparatus for processing substrates

Abstract

The present invention relates to an apparatus for processing a substrate, the apparatus comprising a process chamber for processing the substrate, a buffer module for accommodating an annular member to be transferred into the process chamber, and a load lock chamber having an inner space. The buffer module comprises a buffer chamber having a buffer space in which the annular member is accommodated, a support frame, the support frame supporting the annular member in the buffer space, and a driving member for moving the support frame.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0123002 filed on September 23, 2020, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments of the inventive concepts described herein relate to apparatuses for processing substrates. Background Art

[0004] Plasma refers to an ionized gas state of matter containing ions, radicals, and electrons. Plasma is generated by heating a neutral gas to a very high temperature or subjecting a neutral gas to a strong electric field or RF electromagnetic field. Semiconductor component manufacturing processes may include an etching process that uses plasma to remove a thin film on a substrate (such as a wafer). The etching process is performed by ions and / or radicals contained in the plasma colliding or reacting with a thin film on the substrate.

[0005] An apparatus for treating a substrate using plasma includes a process chamber under a vacuum atmosphere, a support chuck for supporting the substrate in the process chamber, and a focus ring surrounding the substrate located on the support chuck. The focus ring is installed to evenly distribute the plasma on the surface of the substrate, and is etched together with the substrate by the plasma. When the etching process is repeatedly performed on the substrate, the focus ring is also etched together so that the shape of the focus ring gradually changes. Due to the change in the shape of the focus ring, the direction in which ions and / or radicals are incident on the substrate changes, thereby changing the etching characteristics of the substrate. Therefore, when the etching process is performed on a predetermined number or more of substrates, or when the focus ring is deformed and deviates from the allowable range, the focus ring needs to be replaced.

[0006] Figure 1 FIG. 2 is a diagram showing a transfer sequence of a focus ring in a conventional substrate processing apparatus. Figure 1A conventional substrate processing device 10 includes: a loading port 11, on which a carrier is located, the carrier having a substrate (e.g., a wafer) or a focus ring accommodated therein; an atmospheric pressure chamber 13, the interior of which is maintained in an atmospheric pressure atmosphere; a first transfer robot 14, which is disposed in the atmospheric pressure chamber 13 and transfers the substrate or the focus ring in the carrier located on the loading port 11 to a loading lock chamber 15; a loading lock chamber 15, the inside of which is switched between an atmospheric pressure atmosphere and a vacuum atmosphere; a vacuum chamber 16, the inside of which is maintained in a vacuum atmosphere; and a second transfer robot 17, which is disposed in the vacuum chamber 16 and transfers the substrate or the focus ring from the loading lock chamber 15 to a process chamber 18 for processing the substrate.

[0007] like Figure 1 As shown, the transfer sequence for loading the focus ring into the process chamber 18 includes: a first step of unloading the focus ring contained in the carrier located on the loading port 11 into the atmospheric pressure chamber 13; a second step of loading the focus ring unloaded into the atmospheric pressure chamber 13 into the load lock chamber 15; a third step of unloading the focus ring loaded into the load lock chamber 15 into the vacuum chamber 16; and a fourth step of loading the focus ring unloaded into the vacuum chamber 16 into the process chamber 18. The transfer sequence for unloading the focus ring from the process chamber 18 is performed in the reverse order of the four steps. That is, the conventional replacement sequence of the focus ring is very complicated. Due to this, the time spent on replacing the focus ring may increase, which may result in a reduction in the number of substrates that can be processed per hour. In addition, since the focus ring is replaced through multiple steps, the accuracy of transferring the focus ring may be reduced. Summary of the invention

[0008] Embodiments of the inventive concept provide a substrate processing apparatus for increasing the number of substrates that can be processed per hour.

[0009] Furthermore, embodiments of the inventive concept provide a substrate processing apparatus for improving the accuracy of a transfer ring member.

[0010] Furthermore, embodiments of the inventive concept provide a substrate processing apparatus for simplifying a transfer sequence of a ring-shaped member.

[0011] The technical problems to be solved by the present inventive concept are not limited to the above-mentioned problems, and any other technical problems not mentioned herein will be clearly understood by those skilled in the art to which the present inventive concept belongs from the following description.

[0012] According to one embodiment, an apparatus for processing a substrate includes: a process chamber that processes a substrate; a buffer module that accommodates an annular member to be transferred into the process chamber; and a load lock chamber that has an inner space. The buffer module includes: a buffer chamber that has a buffer space in which the annular member is accommodated; a support frame that supports the annular member in the buffer space; and a driving member that moves the support frame.

[0013] According to one embodiment, the driving member may move the support frame so that the annular member supported on the support frame moves between the buffer space and the inner space.

[0014] According to one embodiment, the apparatus may further include a controller and a transfer robot that transfers the substrate or the annular member between the load lock chamber and the process chamber. The controller may control the transfer robot and the driving member so that the annular member moves from the buffer space to the inner space, and the transfer robot unloads the annular member from the inner space and transfers the annular member to the process chamber.

[0015] According to an embodiment, the buffer chamber may have an opening through which the annular member enters and exits the buffer chamber, and the buffer module may further include a door that selectively opens and closes the opening.

[0016] According to one embodiment, the apparatus may further include a shutoff valve disposed between the buffer chamber and the load lock chamber and selectively fluidly connecting the buffer space and the internal space.

[0017] According to one embodiment, the buffer chamber and the load lock chamber may be disposed in an up / down direction.

[0018] According to one embodiment, the load lock chamber may be disposed below the buffer chamber.

[0019] According to an embodiment, the buffer module may include: a gas supply unit which supplies an inert gas into the buffer space; and a decompression line which provides decompression to the buffer space.

[0020] According to an embodiment, the apparatus may further include: a load lock module including a load lock chamber, a gas supply line supplying an inert gas into an inner space, and a decompression line providing decompression to the inner space.

[0021] According to an embodiment, the support bracket may include: a support part supporting a lower surface of the ring-shaped member; and an alignment pin inserted into an alignment groove formed on the lower surface of the ring-shaped member.

[0022] According to one embodiment, an apparatus for processing a substrate includes: a process chamber that processes the substrate using plasma; a buffer chamber that has a buffer space in which an annular member to be transferred to the process chamber is accommodated; a load lock chamber that has an internal space whose pressure switches between a vacuum atmosphere and an atmospheric atmosphere; a support frame that supports the annular member in the buffer space; and a driving member that moves the annular member between the internal space and the buffer space.

[0023] According to one embodiment, the drive member may be coupled to the support frame.

[0024] According to one embodiment, the apparatus may further include a shutoff valve disposed between the buffer chamber and the load lock chamber and selectively fluidly connecting the buffer space and the internal space.

[0025] According to one embodiment, the device may further include a controller, and the controller may control the shutoff valve and the driving member so that the shutoff valve is opened to fluidly connect the buffer space and the inner space, and the driving member moves the support frame to move the annular member from the buffer space to the inner space.

[0026] According to one embodiment, the apparatus may further include a transfer robot that transfers the substrate or the annular member between the load lock chamber and the process chamber. The controller may control the transfer robot and the driving member to unload the annular member moved into the inner space from the inner space and transfer the annular member into the process chamber.

[0027] According to one embodiment, the device may also include: a first gas supply pipeline, which supplies gas to the internal space; a first pressure reduction pipeline, which provides pressure reduction to the internal space; a second gas supply pipeline, which supplies gas to the buffer space; and a second pressure reduction pipeline, which provides pressure reduction to the buffer space.

[0028] According to an embodiment, the support bracket may include a support part which supports a lower surface of the ring-shaped member; and an alignment pin which is inserted into an alignment groove formed on the lower surface of the ring-shaped member.

[0029] According to one embodiment, an apparatus for processing a substrate includes: an index unit having a loading port, a carrier having a substrate accommodated therein is located on the loading port; and a process unit having a process chamber, the process chamber using plasma to process the substrate and equipped with a ring-shaped member. The index unit includes: an index chamber, the index chamber is arranged between the loading port and the process unit, the inner side of the index chamber is kept in an atmospheric atmosphere; and a first transfer robot, the first transfer robot transfers the substrate accommodated in the carrier to the process unit. The process unit includes: a loading lock chamber, the loading lock chamber having an internal space, the pressure of the internal space is switched between a vacuum atmosphere and an atmospheric atmosphere; a buffer chamber, the buffer chamber is arranged above the loading lock chamber and has a buffer space, the ring-shaped member is accommodated in the buffer chamber; a second transfer robot, the second transfer robot unloads the substrate or the ring-shaped member from the loading lock chamber and transfers the substrate or the ring-shaped member to the process chamber; a support frame, the support frame supports the ring-shaped member in the buffer space; and a driving member, the driving member moves the support frame.

[0030] According to one embodiment, the driving member may move the support frame so that the annular member supported on the support frame moves between the buffer space and the inner space.

[0031] According to an embodiment, the buffer chamber may have an opening through which the annular member enters and exits the buffer chamber, and the device may further include a door that selectively opens and closes the opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other objects and features will become apparent from the following description with reference to the following drawings, wherein like reference numerals refer to like parts throughout the various drawings unless otherwise specified, and in which:

[0033] Figure 1 is a view showing a transport sequence of transporting a focus ring in a conventional substrate processing apparatus;

[0034] Figure 2 is a schematic diagram illustrating a substrate processing apparatus according to an embodiment of the present inventive concept;

[0035] Figure 3 It shows Figure 2 A view of a load lock module and a buffer module;

[0036] Figure 4 is shown in Figure 1. Figure 3 A schematic diagram of the state of the supporting member;

[0037] Figure 5 is a diagram showing the annular member located at Figure 3A schematic diagram of the state of the supporting member;

[0038] Figure 6 is a diagram showing the annular member located at Figure 3 A view on the support frame;

[0039] Figure 7 It shows Figure 3 A schematic diagram of a state in which a driving member moves the annular member; and

[0040] Figure 8 2 is a view illustrating a transport sequence of a transport ring member in a substrate treating apparatus according to an embodiment of the present inventive concept. DETAILED DESCRIPTION

[0041] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that the present invention can be easily implemented by those skilled in the art. However, the present invention can be implemented in various forms and is not limited to the embodiments described herein. In addition, when describing the embodiments of the present invention, when the detailed description related to the known functions or configurations may make the subject matter of the present invention unnecessarily difficult to understand, the detailed description is omitted. In addition, throughout the drawings, components that perform similar functions and operations have the same reference numerals.

[0042] The terms "include" and "comprise" in the specification are "open" expressions, which are only used to illustrate the existence of corresponding components, and unless otherwise specifically stated, additional components are not excluded but may be included. In particular, it should be understood that the terms "include", "comprising" and "having", when used in this document, specifically refer to the existence of the features, integers, steps, operations, components and / or parts, but do not exclude the existence or addition of one or more other features, integers, steps, operations, components, parts and / or groups thereof.

[0043] Unless otherwise specified, terms in the singular form may include plural forms. Furthermore, in the drawings, the shapes and sizes of components may be exaggerated for clear illustration.

[0044] In the following, reference will be made to Figures 2 to 8 Embodiments of the inventive concept are described in detail.

[0045] Figure 2 Schematic diagram showing a substrate processing apparatus according to an embodiment of the inventive concept. Figure 2, a substrate processing apparatus 1000 according to an embodiment of the inventive concept includes an index unit 100, a process unit 300, and a controller 500. When viewed from above, the index unit 100 and the process unit 300 may be arranged in a first direction X. Hereinafter, when viewed from above, a direction perpendicular to the first direction X is defined as a second direction Y. In addition, a direction perpendicular to the first direction X and the second direction Y is defined as a third direction Z. Herein, the third direction Z may refer to a direction perpendicular to the ground.

[0046] The index unit 100 may include a load port 110 , an index chamber 130 , and a first transfer robot 150 .

[0047] The carrier 200 may be located on the load port 110. The substrate W (e.g., wafer) to be transferred to the process unit 300 may be accommodated in at least some of the carriers 200 located on the load port 110. The carrier 200 may be transferred by a carrier transfer device and loaded onto the load port 110, or may be unloaded and transferred from the load port 110. The carrier transfer device may be an overhead transport apparatus (OHT). However, the inventive concept is not limited thereto, and the carrier 200 may be transferred by various devices for transferring the carrier 200. In addition, the operator may directly load the carrier 200 onto the load port 110, or may directly unload the carrier 200 from the load port 110.

[0048] The index chamber 130 may be disposed between the load port 110 and the process unit 300. The interior of the index chamber 130 may be maintained at an atmospheric atmosphere. The first transfer robot 150 may be disposed in the index chamber 130. The first transfer robot 150 may transfer the substrate W accommodated in the carrier 200 to an inner space 312 of a load lock chamber 311 (to be described below).

[0049] The process unit 300 may include a load lock module 310 , a shutoff valve 320 , a buffer module 330 , first and second gate valves 351 and 352 , a transfer chamber 360 , a second transfer robot 370 , and a process chamber 380 .

[0050] The transfer chamber 360 may be disposed between the load lock module 310 and the process chamber 380. The interior of the transfer chamber 360 may be maintained in a vacuum atmosphere. The second transfer robot 370 may be disposed in the transfer chamber 360. The second transfer robot 370 may transfer the substrate W or the ring-shaped member FR between the load lock module 310 and the process chamber 380. Figure 2 As shown, the second transfer robot 370 can move along the track or rail in the transfer chamber 360. Figure 2Unlike shown, the second transfer robot 370 may be accessible to all of the process chambers 380 coupled to the transfer chamber 360 without moving.

[0051] In one embodiment, a plurality of transport modules may be coupled such that the transport chamber 360 is implemented in a modular form. Figure 2 The transport chamber 360 shown in FIG. 1 may be a transport module. Figure 2 Not shown, additional modular transport modules may be coupled to the transport chamber 360. One or more transport chambers 360 may be coupled to a transport module. The number of transport modules and the number of transport chambers 360 coupled to a transport module are not limited to Figure 2 The embodiment shown. When multiple transport modules are coupled, the second transport robot 370 can move in the multiple transport modules. One or more second transport robots 370 can be provided. The second transport robot 370 can be provided in each transport module.

[0052] One or more process chambers 380 may be connected to the transfer chamber 360. The process chamber 380 may be a chamber that performs a process on the substrate W. For example, the process chamber 380 may be a liquid processing chamber that processes the substrate W by dispensing a processing liquid onto the substrate W. Alternatively, the process chamber 380 may be a plasma chamber that processes the substrate W by using plasma. In another case, some process chambers 380 may be liquid processing chambers that process the substrate W by dispensing a processing liquid onto the substrate W, and other process chambers 380 may be plasma chambers that process the substrate W by using plasma. However, without limitation thereto, the substrate processing process performed in the process chamber 380 may be variously modified using a well-known substrate processing process. When the process chamber 380 is a plasma chamber that processes the substrate W by using plasma, the plasma chamber may be a chamber that performs an etching process or an ashing process that removes a thin film on the substrate W by using plasma. However, without limitation thereto, the plasma processing process performed in the process chamber 380 may be variously modified using a well-known plasma processing process.

[0053] The controller 500 may control the substrate processing apparatus 1000. The controller 500 may include a process controller, a user interface, and a storage unit. The process controller may be implemented with a microprocessor (computer) that performs control of the substrate processing apparatus 1000. The user interface may include: a keyboard through which an operator inputs commands to manage the substrate processing apparatus 1000; or a display that visually displays the operating state of the substrate processing apparatus 1000. The storage unit may store a process recipe, for example, a control program for executing a process performed in the substrate processing apparatus 1000 under the control of the process controller, or a program for causing each component to perform a process according to various types of data and process conditions. The user interface and the storage unit may be connected to the process controller. The process recipe may be stored in a storage medium of the storage unit. The storage medium may be a hard disk, a portable disk (e.g., a CD-ROM, a DVD, etc.), or a semiconductor memory (e.g., a flash memory, etc.).

[0054] The controller 500 may control the substrate processing apparatus 1000 to perform a treatment process on the substrate W. For example, the controller 500 may control the substrate processing apparatus 1000 to unload the substrate W to be processed from the carrier 200 accommodating the substrate W therein and transfer the unloaded substrate W to the process chamber 380 .

[0055] In addition, when a predetermined number of substrates W are processed in the process chamber 380, or the ring-shaped member FR in the process chamber 380 is deformed to deviate from the allowable range, the controller 500 may control the substrate processing apparatus 1000 to replace the ring-shaped member FR in the process chamber 380. For example, the controller 500 may control the second transfer robot 370 to unload the used ring-shaped member FR from the process chamber 380. In addition, the controller 500 may control the second transfer robot 370 to transfer the used ring-shaped member FR unloaded from the process chamber 380 to the load lock module 310. In addition, the controller 500 may control the second transfer robot 370 to transfer the unused ring-shaped member FR from the load lock module 310 to the process chamber 380.

[0056] Hereinafter, the load lock module 310 , the cut-off valve 320 , and the buffer module 330 according to an embodiment of the present inventive concept will be described in detail.

[0057] Figure 3 It shows Figure 2 View of the load lock module and buffer module. Figure 3The load lock module 310 may include a load lock chamber 211, a first gas supply line 313, a first gas supply source 314, a first decompression line 315, a first decompression member 316, and a support member 317. The load lock module 310 may be provided with an inner space 312 in which a substrate W is temporarily stored so that the substrate W transferred from the index chamber 130 having an atmospheric atmosphere is transferred to the transfer chamber 360 having a vacuum atmosphere.

[0058] The load lock chamber 311 may have an inner space 312. The inner space 312 may be a space for temporarily storing a substrate W and / or an annular member FR. The substrate W may be a wafer. Alternatively, the substrate W may refer to a substrate type sensor. The substrate type sensor may be loaded into the process chamber 380 and may monitor a process performed in the process chamber 380. The annular member FR may be a process kit disposed in the process chamber 380. The annular member FR may be a focus ring. Alternatively, the annular member FR may be a quartz ring (or, an insulating ring).

[0059] The first gas supply line 313 connected to the first gas supply source 314 can supply gas to the internal space 312. The gas supplied by the first gas supply line 313 can be an inert gas. The inert gas can be a gas containing nitrogen or argon. However, it is not limited to this, and the inert gas can be variously changed using well-known inert gases. The first decompression line 315 connected to the first decompression member 316 can provide decompression to the internal space 312. The first decompression member 316 can be a pump. However, it is not limited to this, and the first decompression member 316 can be implemented using various well-known devices that can provide decompression. Since the first gas supply line 313 supplies gas to the internal space 312, and the first decompression member 316 provides decompression to the internal space 312, the pressure in the internal space 312 can be switched between a vacuum atmosphere and an atmospheric atmosphere.

[0060] The load lock chamber 311 may have openings formed at the front and rear thereof. The opening formed at the front of the load lock chamber 311 may be an opening adjacent to the transfer chamber 360. The opening formed at the rear of the load lock chamber 311 may be an opening adjacent to the index chamber 130. The openings formed at the front and rear of the load lock chamber 311 may be selectively opened and closed by the first gate valve 351 and the second gate valve 352, respectively. For example, Figure 2 As shown, the opening formed at the front of the load lock chamber 311 may be selectively opened and closed by the first gate valve 351. The opening formed at the rear of the load lock chamber 311 may be selectively opened and closed by the second gate valve 352.

[0061] Refer again Figure 3 , the support member 317 may support the substrate W. The support member 317 may support the substrate W in the internal space 312. A first pad 318 and a second pad 319 may be disposed on the upper surface of the support member 317. The second pad 319 may be located farther from the center of the substrate W supported on the support member 317 than the first pad 318. One or more support members 317 may be provided. For example, a plurality of support members 317 may be provided. For example, Figure 4 As shown, three support members 317 may support the lower surface of the substrate W. When the substrate W (eg, a wafer) is supported by the support members 317, the lower surface of the substrate W may contact the first pad 318. Figure 5 As shown, when the ring-shaped member FR is supported by the support member 317, the lower surface of the ring-shaped member FR may contact the second pad 319. That is, since the first pad 318 and the second pad 319 are disposed on the upper surface of the support member 317 according to an embodiment of the inventive concept, the support member 317 may selectively support the substrate W or the ring-shaped member FR.

[0062] Refer again Figure 3 The buffer module 330 may include a buffer chamber 331, a second gas supply line 333, a second gas supply source 334, a second decompression line 335, a second decompression member 336, a support frame 337, a driving member 342, and a door 340. The buffer module 330 may accommodate the annular member FR to be transferred into the process chamber 380.

[0063] The buffer chamber 331 may have a buffer space 332. The buffer space 332 may be a space for accommodating the annular member FR. The second gas supply line 333 connected to the second gas supply source 334 may supply gas to the buffer space 332. The gas supplied by the second gas supply line 333 may be an inert gas. The inert gas may be a gas containing nitrogen or argon. However, it is not limited thereto, and the inert gas may be variously changed using well-known inert gases. The second decompression line 335 connected to the second decompression member 336 may provide decompression to the buffer space 332. The second decompression member may be a pump. However, it is not limited thereto, and the second decompression member 336 may be implemented using various well-known devices capable of providing decompression. Since the second gas supply line 333 supplies gas to the buffer space 332 and the second decompression member 336 provides decompression to the buffer space 332, the pressure in the buffer space 332 may be switched between a vacuum atmosphere and an atmospheric atmosphere.

[0064] The support frame 337 may support the annular member FR in the buffer space 332. The support frame 337 may extend in the up / down direction and may include one or more support parts 338. For example, the support frame 337 may include a plurality of support parts 338. The support part 338 may support the lower surface of the annular member FR. The support frame 337 may include an alignment pin 339. The alignment pin 339 may be inserted into an alignment groove G formed on the lower surface of the annular member FR (see Figure 6 ). The user can open the door 340, which can selectively open and close the opening formed in the side wall of the buffer chamber 331, and the annular member FR enters and exits the buffer chamber 331 through the opening. The user can load the annular member FR into the buffer space 332 and can place the annular member FR on the support frame 337. At this time, the alignment pin 339 can be inserted into the alignment groove G of the annular member FR. That is, regardless of the user's proficiency, the position of the annular member FR can be properly aligned, so the annular member FR can be more accurately transferred.

[0065] The driving member 342 may move the support frame 337. The driving member 342 may be coupled to the support frame 337. The driving member 342 may move the support frame 337 so that the annular member FR supported on the support frame 337 moves between the buffer space 332 and the inner space 312. The driving member 342 may be an LM guide rail for moving the support frame 337. However, it is not limited thereto, and the driving member 342 may be implemented using various well-known means for moving the support frame 337 upward and downward.

[0066] The loading lock chamber 311 and the buffer chamber 331 may be arranged in the up / down direction. For example, the buffer chamber 331 may be arranged above the loading lock chamber 311. The stop valve 320 may be arranged between the buffer chamber 331 and the loading lock chamber 311. The stop valve 320 may selectively fluidly connect the buffer space 332 of the buffer chamber 331 and the internal space 312 of the loading lock chamber 311. For example, when the substrate W is loaded into the internal space 312 of the loading lock chamber 311, the stop valve 320 may isolate the buffer space 332 and the internal space 312 from each other. In addition, when the annular member FR is replaced, the stop valve 320 may fluidly connect the buffer space 332 and the internal space 312. Therefore, the support frame 337 may move downward to move the annular member FR from the buffer space 332 to the internal space 312.

[0067] Figure 7 It shows Figure 3 a view of a state in which the driving member moves the annular member, and Figure 81 is a view showing a transfer sequence of a ring-shaped member transferred in a substrate processing apparatus according to an embodiment of the inventive concept. Figure 7 and Figure 8 The transmission sequence of the annular member according to the embodiment of the inventive concept is described in detail. In order to perform the transmission sequence to be described below, the controller 500 may control the substrate processing device 1000. For example, in order to perform the transmission sequence to be described below, the controller 500 may control the loading lock module 310, the buffer module 330, the first gate valve 351 and the second gate valve 352, the transmission chamber 360, the second transmission robot 370 and the process chamber 380. In addition, in order to perform the transmission sequence to be described below, the controller 500 may control the driving member 342, the shut-off valve 320, the first gas supply source 314, the first decompression member 316, the second gas supply source 334, and the second decompression member 336.

[0068] First, a transfer sequence in which the ring-shaped member FR is loaded into the process chamber 380 will be described.

[0069] Before the user loads the annular member FR into the buffer chamber 331, the pressure in the buffer space 332 may be switched to the atmospheric pressure state. For example, before the user loads the annular member FR into the buffer chamber 331, the second gas supply source 334 may supply gas into the buffer space 332 and may switch the pressure in the buffer space 332 to the atmospheric pressure state. At this time, the shut-off valve 320 may be closed to isolate the buffer space 332 and the internal space 312 from each other.

[0070] When the pressure in the buffer space 332 is completely switched to the atmospheric pressure state, the user can open the door 340 and can load the annular member FR into the buffer space 332. The loaded annular member FR can be placed on the support part 338 of the support frame 337. As described above, the alignment pin 339 can be provided on the support frame 337. The alignment pin 339 can be inserted into the alignment groove G formed on the annular member FR. Therefore, the user can position the annular member FR in the correct position only by fitting the alignment groove G on the alignment pin 339.

[0071] When the annular member FR is completely loaded into the buffer space 332, the pressure in the buffer space 332 can be switched to a vacuum atmosphere. For example, when the annular member FR is completely loaded into the buffer space 332, the second decompression member 336 can provide decompression to the buffer space 332 to switch the atmosphere of the buffer space 332 to a vacuum atmosphere.

[0072] When the atmosphere of the buffer space 332 is switched to the vacuum atmosphere, the shutoff valve 320 may fluidly connect the buffer space 332 and the internal space 312 .

[0073] When the shutoff valve 320 fluidly connects the buffer space 332 and the inner space 312 , the driving member 342 may move the support bracket 337 . Specifically, the driving member 342 may move the support bracket 337 downward to move the annular member FR from the buffer space 332 to the inner space 312 .

[0074] When the ring member FR moves from the buffer space 332 to the inner space 312 , the first gate valve 351 may be opened. Thereafter, the second transfer robot 370 may unload the ring member FR from the inner space 312 and may transfer the ring member FR to the process chamber 380 .

[0075] The transfer order of unloading the annular member FR from the process chamber 380 may be performed in the reverse order of the above-described embodiment. However, when the annular member FR used in the process chamber 380 is loaded into the buffer chamber 331, the used annular member FR may be transferred to a position lower than the unused annular member FR supported on the support member 338 and may be supported by the support frame 337. This is to minimize the transfer of impurities attached to the used annular member FR to the unused annular member FR.

[0076] The transfer sequence of the ring-shaped member FR according to an embodiment of the inventive concept includes: unloading the ring-shaped member FR from the load lock chamber 311 to the transfer chamber 360 (first step), and loading the ring-shaped member FR unloaded to the transfer chamber 360 into the process chamber 380 (second step). Figure 1 As shown, the transfer sequence of the ring-shaped member FR in the conventional substrate processing apparatus includes: unloading the ring-shaped member FR from the carrier 200 (first step), loading the ring-shaped member FR into the load lock chamber 311 (second step), unloading the ring-shaped member FR into the transfer chamber 360 (third step), and loading the ring-shaped member FR into the process chamber 380 (fourth step). In other words, in the conventional substrate processing apparatus, a total of four steps are performed until the ring-shaped member FR is loaded into the process chamber 380.

[0077] According to an embodiment of the inventive concept, the process of unloading the ring-shaped member FR from the carrier 200 and the process of loading the ring-shaped member FR from the index chamber 130 to the load lock chamber 311 are omitted, so the transfer sequence of the ring-shaped member FR can be further simplified. Since the transfer sequence of the ring-shaped member FR is simplified, the accuracy in transferring the ring-shaped member FR can be improved. In addition, the number of substrates W that can be processed per hour in the substrate processing apparatus 1000 can be increased.

[0078] According to an embodiment of the inventive concept, a substrate processing apparatus can increase the number of substrates that can be processed per hour.

[0079] Furthermore, according to an embodiment of the inventive concept, a substrate processing apparatus may improve accuracy in a transfer ring member.

[0080] Furthermore, according to an embodiment of the inventive concept, a substrate processing apparatus may simplify a transfer sequence of the ring-shaped member.

[0081] Effects of the inventive concept are not limited to the above-mentioned effects, and any other effects not mentioned herein can be clearly understood by those skilled in the art to which the inventive concept belongs from the present specification and the accompanying drawings.

[0082] The above description illustrates the inventive concept. In addition, the above content describes the embodiment of the inventive concept, and the inventive concept can be used in various other combinations, variations and environments. That is to say, without departing from the scope of the inventive concept disclosed in this specification, the equivalent scope of the written disclosure, and / or the technology or knowledge scope of those skilled in the art, the inventive concept can be changed or modified. The written embodiment describes the best state of the technical spirit of the inventive concept, and various changes required for the specific application and purpose of the inventive concept can be made. Therefore, the detailed description of the inventive concept is not intended to limit the inventive concept to the disclosed embodiment state. In addition, it should be understood that the attached claims include other embodiments.

[0083] Although the present invention has been described with reference to exemplary embodiments, it will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the present invention. Therefore, it should be understood that the above embodiments are not restrictive, but illustrative.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a process chamber configured to process the substrate; a buffer module configured to accommodate an annular member to be transferred into the process chamber; a load lock chamber having an interior space; a shut-off valve disposed between the buffer chamber and the load lock chamber and configured to selectively fluidly connect the buffer space and the inner space; as well as Controller, Wherein, the buffer module comprises: a buffer chamber, the buffer chamber having a buffer space, the annular member being accommodated in the buffer space; a support frame configured to support the annular member in the buffer space; and a driving member configured to move the support frame; wherein the driving member moves the support frame so that the annular member supported on the support frame moves between the buffer space and the inner space; Wherein, the controller controls the stop valve and the driving member so that when the stop valve is closed, the buffer space and the internal space are isolated from each other, and when the stop valve is opened, the buffer space and the internal space are fluidly connected and the driving member moves the support frame to move the annular member from the buffer space to the internal space.

2. The device according to claim 1, further comprising: a transfer robot configured to transfer the substrate or the ring-shaped member between the load lock chamber and the process chamber, The controller controls the transfer robot and the driving member so that the annular member moves from the buffer space to the inner space, and the transfer robot unloads the annular member from the inner space and transfers the annular member to the process chamber.

3. The device according to claim 1, wherein: The buffer chamber has an opening through which the annular member enters and exits the buffer chamber, and Wherein, the buffer module further includes a door configured to selectively open and close the opening.

4. The device according to any one of claims 1 to 3, wherein: The buffer chamber and the load lock chamber are disposed in an up / down direction.

5. The device according to claim 4, wherein: The load lock chamber is disposed below the buffer chamber.

6. The device according to any one of claims 1 to 3, wherein: The buffer module comprises: a gas supply unit configured to supply an inert gas into the buffer space; and A pressure relief line is provided, wherein the pressure relief line is configured to provide a reduced pressure to the buffer space.

7. The device according to any one of claims 1 to 3, further comprising: A load lock module includes a load lock chamber, a gas supply line configured to supply an inert gas into the interior space, and a decompression line configured to provide a decompression to the interior space.

8. The device according to any one of claims 1 to 3, wherein: The support frame comprises: a supporting member configured to support a lower surface of the annular member; and An alignment pin is inserted into an alignment groove formed on the lower surface of the annular member.

9. An apparatus for processing a substrate, the apparatus comprising: a process chamber configured to process the substrate using plasma; a buffer chamber, the buffer chamber having a buffer space, in which the annular member to be transferred to the process chamber is accommodated; a load lock chamber having an internal space whose pressure is switched between a vacuum atmosphere and an atmospheric atmosphere; a support frame configured to support the annular member in the buffer space; a driving member configured to move the annular member between the inner space and the buffer space; a shut-off valve disposed between the buffer chamber and the load lock chamber and configured to selectively fluidly connect the buffer space and the inner space; as well as Controller, Wherein, the controller controls the stop valve and the driving member so that when the stop valve is closed, the buffer space and the internal space are isolated from each other, and when the stop valve is opened, the buffer space and the internal space are fluidly connected and the driving member moves the support frame to move the annular member from the buffer space to the internal space.

10. The device according to claim 9, wherein: The drive member is coupled to the support frame.

11. The device according to claim 9, further comprising: a transfer robot configured to transfer the substrate or the ring-shaped member between the load lock chamber and the process chamber, The controller controls the transfer robot and the driving member to unload the annular member moved into the inner space from the inner space and transfer the annular member into the process chamber.

12. The device according to claim 9 or 10, further comprising: a first gas supply line configured to supply gas into the interior space; a first pressure-reducing line configured to provide reduced pressure to the interior space; a second gas supply line configured to supply gas into the buffer space; A second pressure-reducing line is configured to provide a reduced pressure to the buffer space.

13. The device according to claim 9 or 10, wherein: The support frame comprises: a supporting member configured to support a lower surface of the annular member; and An alignment pin is inserted into an alignment groove formed on the lower surface of the annular member.

14. An apparatus for processing a substrate, the apparatus comprising: an index unit having a loading port on which a carrier is located, the carrier having the substrate accommodated therein; as well as a process unit having a process chamber configured to process the substrate using plasma and equipped with a ring-shaped member, Wherein, the index unit includes: an index chamber disposed between the load port and the process unit, the inner side of the index chamber being maintained in an atmospheric atmosphere; and a first transfer robot configured to transfer the substrate contained in the carrier to the process unit, and Wherein, the process unit comprises: a load lock chamber having an internal space whose pressure is switched between a vacuum atmosphere and an atmospheric atmosphere; a buffer chamber, the buffer chamber being disposed above the load lock chamber, the buffer chamber having a buffer space, the annular member being accommodated in the buffer space; a second transfer robot configured to unload the substrate or the ring-shaped member from the load lock chamber and transfer the substrate or the ring-shaped member into the process chamber; a support frame configured to support the annular member in the buffer space; a driving member configured to move the support frame; a shut-off valve disposed between the buffer chamber and the load lock chamber and configured to selectively fluidly connect the buffer space and the inner space; and Controller, wherein the driving member moves the support frame so that the annular member supported on the support frame moves between the buffer space and the inner space, Wherein, the controller controls the stop valve and the driving member so that when the stop valve is closed, the buffer space and the internal space are isolated from each other, and when the stop valve is opened, the buffer space and the internal space are fluidly connected and the driving member moves the support frame to move the annular member from the buffer space to the internal space.

15. The device according to claim 14, wherein: The buffer chamber has an opening through which the annular member enters and exits the buffer chamber, and Wherein, the device further comprises a door configured to selectively open and close the opening.

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