Electrode patch and tumor electric field therapy system

Abstract

The present invention provides an electrode sheet for use in electric field therapy of tumors, comprising a flexible circuit board, at least one high-dielectric sheet disposed on the flexible circuit board, and a conductive wire electrically connected to the flexible circuit board. The flexible circuit board is provided with a connection portion welded to the conductive wire and a reinforcing plate disposed on the connection portion. The connection portion has a plurality of gold fingers welded to the conductive wires and conductive traces electrically connected to the corresponding gold fingers. The reinforcing plate is disposed at a position relative to the connection portion between the gold fingers and the conductive traces of the connection portion. The flexible circuit board of the electrode sheet of the present invention includes a reinforcing plate disposed on the connection portion, which can improve the strength of the connection portion and greatly disperse the pulling force of the wire on the connection portion during the process of moving or flipping the flexible circuit board after the wire is welded to the flexible circuit board. This can prevent the connection between the gold fingers and the conductive trace from breaking when the connection portion is pulled by the wire, thereby improving product yield and reducing production costs.

Description

Technical Field

[0001] The present invention relates to an electrode sheet and a tumor electric field treatment system, belonging to the technical field of medical equipment. Background Art

[0002] Currently, the main treatments for tumors include surgery, radiotherapy, and chemotherapy, but all have corresponding disadvantages. For example, radiotherapy and chemotherapy can produce side effects and kill normal cells. Using electric fields to treat tumors is also one of the current research and development frontiers. Tumor treating fields use special electric field generating devices to emit waves with a high rate of change directed to the corresponding tissue, and then use radiation or induction to transmit energy through insulating materials to the corresponding parts of the human body. This can interfere with and destroy the mitosis process of cells and has a good effect on tumor treatment. Studies have shown that electric field therapy is significantly effective in the treatment of diseases such as glioblastoma, non-small cell lung cancer, and malignant pleural mesothelioma. The electric field applied by this method can affect the aggregation of microtubules, prevent spindle formation, inhibit the mitotic process, and induce apoptosis of cancer cells.

[0003] The existing tumor electric field therapy system includes an electric field generator and an electrode sheet electrically connected to the electric field generator. The electrode sheet includes a wire, a flexible circuit board welded to the wire, and a high dielectric sheet welded to the side of the flexible circuit board facing the patient's body surface. The flexible circuit board of the electrode sheet is flexible so that the electrode sheet can be adhered to the body surface corresponding to the patient's tumor site. The flexible circuit board is mainly composed of an insulating substrate, multiple conductive traces embedded in the insulating substrate, and a plurality of gold fingers exposed from the insulating substrate and electrically connected to the conductive traces. One end of the wire is welded to the gold finger of the flexible circuit board, and the other end is electrically connected to the electric field generator. When performing tumor electric field therapy on a patient, the alternating voltage of the electric field generator is transmitted to the flexible circuit board through the wire, and then the alternating electric field is coupled to the patient's tumor site through the high dielectric sheet to perform tumor electric field therapy.

[0004] During the manufacturing process of the electrode sheet, if the wire is welded to the flexible circuit board and then the flexible circuit board is moved or turned over, the wire will pull the corresponding part of the flexible circuit board to which it is welded, which may easily cause the corresponding part of the flexible circuit board to bend, further leading to the connection between the gold finger and the conductive trace to break, so that the entire electrode sheet is scrapped, affecting the yield of the electrode sheet.

[0005] Therefore, it is indeed necessary to provide an improved electrode sheet and tumor electric field treatment system to solve the problems existing in the electrode sheet of the above-mentioned tumor electric field treatment system. Summary of the Invention

[0006] The present invention provides an electrode sheet and a tumor electric field treatment system, which can prevent the connection between the gold finger and the conductive trace of the flexible circuit board from being broken.

[0007] The electrode sheet of the present invention is realized through the following technical solution: an electrode sheet for tumor electric field therapy, which includes a flexible circuit board, at least one high-dielectric sheet arranged on the flexible circuit board, and a wire electrically connected to the flexible circuit board. The flexible circuit board is provided with a connection portion welded to the wire and a reinforcement plate provided on the connection portion. The connection portion has multiple gold fingers welded to the wire and conductive traces electrically connected to the corresponding gold fingers. The reinforcement plate is provided at a position relative to the connection portion between the gold fingers and the conductive trace of the connection portion.

[0008] Furthermore, the reinforcing plate and the high dielectric sheet are located on opposite sides of the flexible circuit board.

[0009] Furthermore, the plurality of gold fingers are arranged on the side surface of the connection portion and the high dielectric sheet on the same side.

[0010] Furthermore, the plurality of gold fingers are staggered and arranged on two opposite sides of the wiring portion.

[0011] Furthermore, there are multiple reinforcing plates, which are respectively arranged on two opposite sides of the wiring portion.

[0012] Furthermore, the reinforcing plate is arranged at a position relative to the corresponding gold finger of the wiring portion and the conductive trace electrically connected thereto, and the reinforcing plate and its corresponding gold finger are respectively arranged on two opposite sides of the wiring portion.

[0013] Furthermore, the plurality of gold fingers include first gold fingers arranged in staggered rows, and the first gold fingers arranged in staggered rows are respectively arranged on two opposite sides of the wiring portion.

[0014] Furthermore, the reinforcing plate includes a first reinforcing plate and a second reinforcing plate respectively provided on two opposite sides of the connecting portion.

[0015] Furthermore, the first reinforcing plate and the high dielectric sheet are located on the same side, and the first gold finger provided on the connection portion and on a different side from the high dielectric sheet is located on opposite sides of the connection portion.

[0016] Furthermore, the first reinforcing plate is provided at a position opposite to the first gold finger and the conductive trace electrically connected to the first gold finger, which are located on different sides of the connection portion and the high-dielectric sheet.

[0017] Furthermore, the second reinforcing plate is provided on a side surface of the wiring portion that is on a different side from the high dielectric sheet.

[0018] Furthermore, the second reinforcing plate and the high dielectric sheet are located on different sides.

[0019] Furthermore, the second reinforcing plate and the first gold finger provided on the connection portion and located on the same side as the high-dielectric sheet are located on opposite sides of the connection portion.

[0020] Furthermore, the second reinforcing plate is provided at a position opposite to the first gold finger and the conductive trace electrically connected to the first gold finger, on the same side of the connection portion and the high-dielectric sheet.

[0021] Furthermore, the gold finger further includes a second gold finger provided on the connection portion and located on the same side as the high dielectric sheet.

[0022] Furthermore, the second golden finger and the first golden finger located on the same side thereof are arranged in an interval shape.

[0023] Furthermore, the first gold finger located on the same side as the high dielectric sheet is arranged close to the end of the connection portion, and the first gold finger located on a different side from the high dielectric sheet is arranged away from the end of the connection portion.

[0024] Furthermore, the distance from the first gold finger located on the same side as the high-dielectric sheet to the end of the connection portion is smaller than the distance from the first gold finger located on a different side from the high-dielectric sheet to the end of the connection portion.

[0025] Furthermore, the first gold finger located on the same side as the high dielectric sheet is arranged between the first gold finger and the second gold finger located on different sides of the wiring portion as viewed from the thickness direction of the wiring portion.

[0026] Furthermore, the second reinforcing plate and the second gold finger are located on opposite sides of the wiring portion, and the second reinforcing plate is arranged at a position opposite to the first gold finger, the second gold finger and the conductive traces electrically connected to the first gold finger and the second gold finger respectively, which are located on the same side of the wiring portion and the high dielectric sheet.

[0027] Furthermore, the second golden finger is arranged near the end of the wiring portion.

[0028] Furthermore, the first gold finger located on the same side as the high dielectric sheet is arranged away from the end of the connection portion, and the first gold finger located on a different side from the high dielectric sheet is arranged close to the end of the connection portion.

[0029] Furthermore, the distance from the first gold finger located on the same side as the high-dielectric sheet to the end of the connection portion is greater than the distance from the first gold finger located on a different side from the high-dielectric sheet to the end of the connection portion.

[0030] Furthermore, the first gold finger located on a different side from the high dielectric sheet is arranged between the first gold finger and the second gold finger located on the same side as the high dielectric sheet of the wiring portion when viewed from the thickness direction of the wiring portion.

[0031] Furthermore, the reinforcing plate is made of polyimide material and has a thickness of 0.6 mm to 1 mm.

[0032] Furthermore, the reinforcing plate is made of epoxy glass fiber material and has a thickness of 0.2mm-0.5mm.

[0033] Furthermore, it also includes a heat shrink tubing covering the connection between the wiring part of the flexible circuit board and the wire.

[0034] The tumor electric field treatment system of the present invention is realized by the following technical solution: a tumor electric field treatment system, which includes an electric field generator and the above-mentioned electrode sheet electrically connected to the electric field generator.

[0035] Furthermore, it also includes an adapter electrically connected to the electric field generator, and the electrode sheet is detachably assembled on the adapter.

[0036] The flexible printed circuit board of the electrode sheet of the present invention includes a reinforcing plate positioned on the connection portion, located opposite the connection point between the gold finger and the conductive trace. This plate enhances the strength of the connection portion and significantly disperses the pulling force exerted by the wires on the connection portion during movement or flipping of the flexible circuit board after soldering the wires to the flexible circuit board. This prevents the connection between the gold finger and the conductive trace from breaking when the wires pull on the connection portion, thereby improving product yield and reducing production costs. Furthermore, it ensures that the electrode sheet adheres snugly to the patient's body surface corresponding to the tumor site.

[0037] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 3D diagram of the electrode sheet of the first embodiment of the tumor electric field treatment system of the present invention.

[0039] Figure 2 for Figure 1 The three-dimensional exploded view of the electrode sheet shown.

[0040] Figure 3 for Figure 2 An exploded perspective view of the electrical functional components shown.

[0041] Figure 4 for Figure 3 A plan view of a flexible circuit board showing electrical functional components.

[0042] Figure 5 for Figure 4 Another plan view of the flexible circuit board showing the electrical functional components.

[0043] Figure 6 for Figure 2A perspective view of a high dielectric sheet of an electrical functional component is shown.

[0044] Figure 7 3D diagram of the electrode sheet of the second embodiment of the tumor treating field system of the present invention.

[0045] Figure 8 for Figure 7 The three-dimensional exploded view of the electrode sheet shown.

[0046] Figure 9 for Figure 8 A plan view of the flexible printed circuit board and temperature sensor of the electrical functional components is shown.

[0047] Figure 10 for Figure 9 Another plan view of the flexible circuit board is shown.

[0048] Figure 11 A plan view of the connection portion and reinforcement plate of the flexible printed circuit board of the electrode sheet of the third embodiment of the tumor electric field treatment system of the present invention.

[0049] Figure 12 for Figure 11 Another plan view of the wiring portion and the reinforcing plate of the flexible circuit board is shown.

[0050] Figure 13 This is a schematic block diagram of the tumor electric field therapy system of the present invention.

[0051] Description of reference numerals:

[0052] Tumor therapy field system 1000, electrode pads 100, 100', backing 2, 2', electrical functional components 1, 1', flexible printed circuit board 11, 11', 11", insulating substrate 11A, 11A', main body 111, 111', peripheral main body 111A', central main body 111B', spacer C, connecting portion 112', connecting portion 113, 113', 113", conductive plate 114, conductive core 115, gold fingers 116, 116', 116", first gold finger 1161' , 1161", second gold finger 1162', 1162", pad 117, insulating plate 12, 12', high dielectric sheet 13, 13', metal layer 131, opening 132, reinforcement plate 15, 15', 15", first reinforcement plate 151', 151", second reinforcement plate 152', 152", support part 3, 3', through hole 31, adhesive part 4, 4', temperature sensor 14, 14', wire 6, 6', heat shrink tubing 61, plug 62, electric field generator 200, adapter 300. DETAILED DESCRIPTION

[0053] Exemplary embodiments are described in detail herein, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present invention. Rather, they are merely examples of devices, systems, apparatus, and methods consistent with certain aspects of the present invention.

[0054] Please refer to Figures 1 to 13 As shown, the tumor electric field therapy system 1000 of the present invention includes an electric field generator 200, an adapter 300 electrically connected to the electric field generator 200, and electrode sheets 100, 100' electrically connected to the electric field generator 200 through the adapter 300. The electrode sheets 100, 100' are applied to the patient's body surface to apply the therapeutic electric field generated by the electric field generator 200 to the human body. The electrode sheets 100, 100' according to the embodiments of the present invention can be applied to the human body's trunk, such as the chest, abdomen, etc., or can be applied to the human head. In other embodiments, the electrode sheets 100, 100' of the tumor electric field therapy system can be directly electrically connected to the electric field generator 200.

[0055] First embodiment

[0056] refer to Figures 1 to 6 As shown, the electrode sheet 100 in the first embodiment of the present invention includes a backing 2, an electrical functional component 1 adhered to the backing 2, a support member 3 adhered to the backing 2, an adhesive member 4 covering the corresponding portion of the support member 3 and the electrical functional component 1, and a wire 6 welded to the electrical functional component 1. The electrode sheet 100 of the present invention is attached to the body surface corresponding to the patient's tumor site through the backing 2, and applies an alternating electric field to the patient's tumor site through the electrical functional component 1 to interfere with or prevent the mitosis of the patient's tumor cells, thereby achieving the purpose of treating the tumor. The electrode sheet 100 of this embodiment is suitable for application to the patient's torso or head for electric field therapy, and multiple electrode sheets 100 can be freely combined for use.

[0057] The electrical component 1 comprises a flexible circuit board 11, an insulating plate 12 and a high-dielectric sheet 13, respectively, located on opposite sides of the flexible circuit board 11; a temperature sensor 14, located on the same side of the flexible circuit board 11 as the high-dielectric sheet 13; and a reinforcing plate 15, located on one side of the flexible circuit board 11. The high-dielectric sheet 13 and temperature sensor 14 are located on the side of the flexible circuit board 11 closest to the patient's body surface, while the insulating plate 12 is located on the side of the flexible circuit board 11 facing away from the patient's body surface. The electrical component 1 is securely attached to the backing 2 by adhering corresponding portions of the insulating plate 12 and the flexible circuit board 11 to the backing 2.

[0058] The flexible circuit board 11 includes a main body 111 and a connection portion 113 extending outward from the main body 111 and electrically connected to the wire 6. In this embodiment, the connection portion 113 is arranged in a strip or ribbon shape. The connection portion 113 of the flexible circuit board 11 is welded to the wire 6 to achieve electrical connection between the wire 6 and the electrical functional component 1. The weld between the wire 6 and the connection portion 113 is covered with a heat shrink tubing 61, which is used to seal and insulate the connection between the wire 6 and the connection portion 113 on the flexible circuit board 11, provide increased strength and support, prevent breakage at the connection between the wire 6 and the electrical functional component 1, and provide dust and water resistance. One end of the wire 6 is welded to the connection portion 113 of the electrical functional component 1, and the other end is provided with a plug 62 electrically connected to the adapter 300. Optionally, the plug 62 of the wire 6 is directly electrically connected to the electric field generator 200.

[0059] The main body 111 is provided in a circular sheet shape. A conductive disk 114 corresponding to the high dielectric sheet 13 is provided on the main body 111, which can be soldered to the high dielectric sheet 13 by solder (not shown) to assemble the high dielectric sheet 13 on the main body 111 of the flexible circuit board 11. The center of the conductive disk 114 coincides with the center of the main body 111. The conductive disk 114 has four conductive cores 115 protruding or exposed from the main body 111. The conductive cores 115 are arranged in a centrally symmetrical shape, which can effectively prevent the position of the high dielectric sheet 13 from being shifted due to the stacking of solder (not shown) during the welding process. The four conductive cores 115 are arranged in an intermittent shape, which can reduce the amount of copper foil used to manufacture the conductive core 115 and reduce material costs; at the same time, it can also save the amount of solder (not shown) used to solder the conductive core 115 and the high dielectric sheet 13, further reducing material costs. In other embodiments, the main body 111 can be arranged in other polygonal sheet shapes.

[0060] The main body 111 also has two solder pads 117 protruding from or exposed on the main body 111. The two solder pads 117 are located approximately in the center of the area surrounded by the conductive pads 114. The temperature sensor 14 has a signal terminal (not shown) and a ground terminal (not shown). One of the solder pads 117 on the main body 111 is soldered to the signal terminal (not shown) of the temperature sensor 14, and the other solder pad 117 is soldered to the ground terminal (not shown) of the temperature sensor 14 to achieve an electrical connection between the main body 111 and the temperature sensor 14.

[0061] Both the main body 111 and the connection portion 113 are comprised of an insulating substrate 11A and multiple conductive traces (not shown) embedded within the insulating substrate 11A. The multiple conductive traces (not shown) within the insulating substrate 11A of the main body 111 are electrically connected one-to-one with the multiple conductive traces (not shown) within the insulating substrate 11A of the connection portion 113. In other words, the flexible printed circuit board 11 is comprised of the insulating substrate 11A and the multiple conductive traces (not shown) embedded within the insulating substrate 11A. In this embodiment, the main body 111 and the connection portion 113 each have three conductive traces (not shown). In other words, the flexible printed circuit board 11 has three conductive traces (not shown). The three conductive traces (not shown) include a conductive trace (not shown) connecting in series all the conductive cores 115 of the conductive disk 114 located on the main body 111, a conductive trace (not shown) electrically connecting a soldering pad 117 located on the main body 111 and soldered to the ground terminal (not shown) of the temperature sensor 14, and a conductive trace (not shown) electrically connecting a soldering pad 117 located on the main body 111 and soldered to the signal terminal (not shown) of the temperature sensor 14.

[0062] A plurality of gold fingers 116 electrically connected to the three conductive traces (not shown) are provided on one side surface of the wiring portion 113. The number of the gold fingers 116 is consistent with the number of the conductive traces (not shown). In this embodiment, the number of the gold fingers is 3. The three gold fingers 116 are welded to the wire 6 to realize the electrical connection between the wire 6 and the three conductive traces (not shown) of the flexible circuit board 11, and then the high dielectric sheet 13 welded to the conductive plate 114 and the temperature sensor 14 welded to the pad 117 are electrically connected through the three conductive traces (not shown). Specifically, the wire 6 has three signal lines (not shown), and the three wires (not shown) of the wire 6 are respectively welded to the corresponding gold fingers 116.

[0063] refer to Figure 5As shown, the reinforcing plate 15 is arranged in a strip or ribbon shape. The reinforcing plate 15 and the multiple gold fingers 116 of the wiring portion 113 are respectively arranged on opposite sides of the wiring portion 113. The reinforcing plate 15 is located on the side of the wiring portion 113 away from the gold fingers 116 and is arranged opposite the gold fingers 116. This greatly disperses the pulling force of the wire 6 on the wiring portion 113 during the process of moving or flipping the flexible circuit board 11 after the wire 6 is soldered to the flexible circuit board 11, transferring most of the pulling force to the reinforcing plate 15. This can prevent the connection between the gold fingers 116 and the conductive traces (not shown) from breaking when the wiring portion 113 is pulled by the wire 6. Preferably, the reinforcing plate 15 is arranged on the side of the wiring portion 113 away from the gold fingers 116 and is arranged opposite the corresponding portions of the three gold fingers and the three conductive traces (not shown). That is, the reinforcing plate 15 is not only arranged opposite the gold fingers 116, but also opposite the portion of the conductive traces (not shown) connected to the gold fingers 116. The area of the reinforcing plate 15 is larger than the area of the corresponding gold finger 116. In this embodiment, the area of the reinforcing plate 15 is larger than 10mm 2 . The length of the reinforcing plate 15 is not greater than the length of the wiring portion 113. The area of the reinforcing plate 15 is not greater than the area of the wiring portion 113. Preferably, the wiring portion 113 and the reinforcing plate 15 are set to have the same width. The length of the reinforcing plate 15 is 5mm-40mm. The reinforcing plate 15 is made of a rigid reinforcing material with a thickness of 0.2.mm-1mm, such as epoxy glass fiber material, metal material, etc. Preferably, the reinforcing plate 15 is made of an epoxy glass fiber material with a thickness of 0.2mm-0.5mm. Optionally, the reinforcing plate 15 is made of a polyimide material with a thickness of 0.6mm-1mm.

[0064] The insulating plate 12 is in the form of a circular sheet. Made of an insulating material, the insulating plate 12 is adhered to the side of the main body 111 of the flexible circuit board 11 away from the patient's body surface via a sealant (not shown). While reinforcing the strength of the flexible circuit board 11, it also provides a smooth soldering surface for soldering between the conductive plate 114 and the high-dielectric sheet 13, thereby improving product yield. The insulating plate 12 can isolate moisture from the air on the side of the electrical functional component 1 away from the patient's body surface, preventing moisture from entering the electrical functional component 1. This prevents moisture from coming into contact with the solder (not shown) between the high-dielectric sheet 13 and the main body 111, which could affect the electrical connection between the main body 111 and the high-dielectric sheet 13.

[0065] The high-dielectric sheet 13 is circular and made of a high-dielectric constant material. Its properties prevent direct current (DC) but allow alternating current (AC) to pass through, ensuring human safety. The high-dielectric sheet 13 has a dielectric constant of at least 1000. An annular metal layer 131 is attached to the side of the high-dielectric sheet 13 facing the main body 111. This layer can be soldered to the conductive plate 114 on the main body 111 (not shown). The gap (not shown) formed by welding between the high-dielectric sheet 13 and the main body 111 is filled with a sealant (not shown) to protect the solder (not shown) between the high-dielectric sheet 13 and the main body 111, preventing the high-dielectric sheet 13 from being affected by external forces and causing the weld to break, thereby preventing the alternating electric field from being applied to the patient's tumor through the high-dielectric sheet 13. It also prevents moisture in the air from entering the gap (not shown) and corroding the solder (not shown) between the high-dielectric sheet 13 and the main body 111, thereby affecting the electrical connection between the high-dielectric sheet 13 and the main body 111. The outer ring of the metal layer 131 is spaced apart from the outer edge of the high-dielectric sheet 13 to prevent the solder (not shown) between the metal layer 131 of the high-dielectric sheet 13 and the main body 111 from overflowing into the main body 111 when heated and melted. This prevents the direct current, which is not blocked by the high-dielectric sheet 13, from directly acting on the patient's body surface when the electrode sheet 100 is applied to the patient's tumor site. The high-dielectric sheet 13 has an opening 132 extending through it for accommodating the temperature sensor 14. The edge of the opening 132 in the high-dielectric sheet 13 is spaced apart from the inner ring of the metal layer 131 of the high-dielectric sheet 13. This prevents the solder (not shown) between the metal layer 131 of the high-dielectric sheet 13 and the main body 111 from melting and spreading toward the opening 132 of the high-dielectric sheet 13, potentially short-circuiting the temperature sensor 14. The main body 111, insulating plate 12, and high-dielectric sheet 13 are arranged in a one-to-one correspondence, with their centers aligned.

[0066] The temperature sensor 14 is fixed at the center of the main body 111 and is used to monitor the temperature of the adhesive member 4, thereby monitoring the temperature of the human skin attached to the adhesive member 4. When the temperature monitored by the temperature sensor 14 exceeds the upper limit of the human body's safe temperature, the electric field therapy device (not shown) can promptly reduce or shut down the alternating current transmitted to the electrode sheet 100 to avoid low-temperature burns on the human body. The temperature sensor 14 is welded to the two pads 117 of the main body 111 and then sealed with a sealant (not shown) to prevent water vapor from corroding the temperature sensor 14 and causing the temperature sensor 14 to fail. In this embodiment, the temperature sensor 14 is set to one. In other embodiments, multiple temperature sensors 14 can be set on the main body 111.

[0067] The support member 3 is provided in a sheet shape. The support member 3 is provided around the high dielectric sheet 13 and is adhered to the backing 2. The support member 3 has a through hole 31 extending therethrough for accommodating the high dielectric sheet 13. The surface of the support member 3 close to the patient's body surface is flush with the surface of the high dielectric sheet 13 close to the patient's body surface, so that the adhesive member 4 can be smoothly covered on the support member 3 and the high dielectric sheet 13, thereby improving the comfort of electrode application. In this embodiment, the number of the support member 3 is one.

[0068] The support member 3 can be made of polyethylene (PE) material, PET material, thermally conductive silicone sheet, or a composite of polyurethane, polyethylene, dispersant, flame retardant, carbon fiber, etc., which is soft, chemically stable, lightweight, non-deformable, and non-toxic insulating material. Preferably, the support member 3 can be made of flexible foam.

[0069] The adhesive member 4 is provided in a sheet-like shape and has double-sided adhesive properties. One side of the adhesive member 4 adheres to the support member 3 and the high-dielectric sheet 13, and the other side adheres to the patient's body surface. Preferably, the adhesive member 4 is a conductive hydrogel to act as a conductive medium, conducting the alternating current passing through the high-dielectric sheet 13 to the patient's tumor site. The number of adhesive members 4 is the same as the number of support members 3. In this embodiment, the number of adhesive members is one. The size of the adhesive member 4 is approximately the same as that of the support member 3. With the support of the support member 3, the adhesive member 4 has better adhesion to the human skin.

[0070] The flexible printed circuit board 11 of the electrode sheet 100 of the tumor electric field therapy system 1000 of the present invention includes a reinforcing plate 15 located on the same side of the connection portion 113 as the insulating plate 12 and opposite the gold fingers 116 of the connection portion 113. This reinforces the connection between the gold fingers 116 of the connection portion 113 and its conductive traces (not shown). This significantly reduces the pulling force of the wire 6 on the connection portion 113 during movement or flipping of the flexible printed circuit board 111 via the wire 6, preventing the connection between the gold fingers 116 and its conductive traces (not shown) from breaking when the wire 6 pulls on the connection portion 113, thereby rendering the electrode sheet 100 unusable.

[0071] Second embodiment

[0072] Figures 7 to 10 The electrode sheet 100' of the second embodiment of the present invention is also suitable for application to the patient's torso for electric field therapy. The electrode sheet 100' also includes a backing 2', an electrical functional component 1' adhered to the backing 2', a support 3' adhered to the backing 2', an adhesive member 4' covering the corresponding parts of the support 3' and the electrical functional component 1', and a wire 6' electrically connected to the electrical functional component 1'. The difference between the electrode sheet 100' and the electrode sheet assembly 100 of the first embodiment is:

[0073] The electrical functional component 1' includes a flexible circuit board 11', a plurality of high dielectric sheets 13' and a plurality of insulating sheets 12' arranged on opposite sides of the flexible circuit board 11', and a plurality of temperature sensors 14' arranged on the same side of the flexible circuit board 11' as the plurality of high dielectric sheets 13'. The flexible circuit board 11' of the electrical functional component 1' includes a plurality of main body portions 111' arranged at intervals, a connecting portion 112' located between two adjacent main body portions 111', and a wiring portion 113' connected to the connecting portion 112'. The plurality of main body portions 111' are roughly arranged in an array. In this embodiment, the number of the main body portions 111' is 20, and they are distributed in an array area of four rows and six columns. The 20 main body portions 111' are distributed in an array area of four rows and six columns in a manner that four main body portions 111' are provided in each of the first and last rows, and six main body portions 111' are provided in each of the two middle rows. From the perspective of column arrangement, each of the first and sixth columns is provided with two main bodies 111', and each of the four middle columns is provided with four main bodies 111'. Specifically, the four main bodies 111' of the first row are respectively located in each of the second to fifth columns, the six main bodies 111' of each of the two middle rows are respectively located in each of the first to sixth columns, and the four main bodies 111' of the last row are respectively located in each of the second to fifth columns. The multiple main bodies 111' of the electrical functional component 1' are arranged in an axially symmetrical shape. The multiple main bodies 111' of the electrical functional component 1' are arranged in an axially symmetrical shape in both the row direction and the column direction. The twenty main bodies 111' are arranged in an octagonal shape. In other embodiments, the number of the main bodies 111' is not limited to 20, and can be 9, 13, and so on.

[0074] The connecting portion 112' connects all two adjacent main body portions 111' located at the periphery of the array, and at least one adjacent two main body portions 111' among the two adjacent main body portions 111' located at the inner layer of the array is arranged in a disconnected state. Specifically, the connecting portion 112' is provided between all two adjacent main body portions 111' except between the two main body portions 111' located at the second row and third column and the second row and fourth column, and between the two main body portions 111' located at the third row and third column and the third row and fourth column. The connecting portion 112' is located between two adjacent main body portions 111' arranged in rows, between two main body portions 111' arranged in columns, and between two adjacent main body portions 111' arranged diagonally in adjacent rows and adjacent columns at the periphery of the array.

[0075] From the distribution position of the main body 111' in the array, the multiple main body 111' can be divided into a plurality of peripheral main body 111A' located at the periphery and a plurality of central main body 111B' surrounded by the peripheral main body 111A'. In this embodiment, there are 12 peripheral main body 111A' and 8 central main body 111B'. All peripheral main body 111A' are connected in pairs by connecting parts 112'. That is, the connecting part 112' is provided between all two adjacent peripheral main body 111A'. At least two of the multiple central main body 111B' are located in a disconnected state between the adjacent central main body 111B' in the same row or column, and a gap C is formed between the two for the wiring part 113' to pass through.

[0076] The interval C is provided between two adjacent central body portions 111B' located in the second row, third column and the second row, fourth column, and between two adjacent central body portions 111B' located in the third row, third column and the third row, fourth column. The connecting portion 113' is generally arranged in a "T" shape, which passes through the interval C and bridges the connecting portion 112' between the two adjacent central body portions 111B' in the middle of the third column and the connecting portion 112' between the two adjacent central body portions 111B' in the middle of the fourth column. The connecting portion 113' and the two adjacent connecting portions 112' connected thereto are arranged in an axially symmetrical shape. Optionally, the connecting portion 113' is arranged in an "I" shape and is extended laterally toward the interval C from the connecting portion 112' corresponding to the interval C.

[0077] The electrical functional component 1' is provided with a plurality of temperature sensors 14'. In this embodiment, eight temperature sensors 14' are provided, and are respectively provided on eight main body portions 111' located in the third column of the first row, the fourth column of the first row, the third column of the last row, the fourth column of the last row, the second column of the second row, the fifth column of the second row, the second column of the third row, and the fifth column of the third row.

[0078] In this embodiment, the flexible circuit board 11' is provided with 10 conductive traces (not shown). The number of these conductive traces (not shown) is two more than the number of the temperature sensors 14'. The 10 conductive traces (not shown) include one conductive trace (not shown) connecting all the conductive cores 115' of the conductive disk 114' located in each main body 111' in series, one conductive trace (not shown) connecting the ground terminals (not shown) of the multiple temperature sensors 14' located on the corresponding main body 111' in series, and eight conductive traces (not shown) connecting the signal terminals (not shown) of the eight temperature sensors 14' located on the corresponding main body 111' in parallel.

[0079] The connecting portion 112' is composed of an insulating substrate 11A' and multiple conductive traces (not shown) embedded in the insulating substrate 11A'. The conductive traces (not shown) in the insulating substrate 11A' of the connecting portion 112' are electrically connected to the conductive traces (not shown) in the insulating substrate 11A' of the main body 111' and the conductive traces (not shown) in the insulating substrate 11A' of the connection portion 113'. Of the multiple connecting portions 112', only some of the connecting portions 112' may have multiple conductive traces (not shown) embedded in the insulating substrate 11A', while some of the connecting portions 112' may not have conductive traces (not shown) embedded in the insulating substrate 11A'.

[0080] Multiple gold fingers 116' are provided on opposite sides of the connection portion 113'. In this embodiment, the multiple gold fingers 116' include ten first gold fingers 1161' and one second gold finger 1162'. The number of the first gold fingers 1161' matches the number of the conductive traces (not shown). The ten first gold fingers 1161' include one first gold finger 1161' connected in series with the ground terminals (not shown) of eight temperature sensors 14' via a corresponding one conductive trace (not shown), eight first gold fingers 1161' connected in parallel with the signal terminals (not shown) of the eight temperature sensors 14' via eight corresponding eight conductive traces (not shown), and one first gold finger 1161' electrically connected to a high-dielectric dielectric sheet (not shown) via a corresponding one conductive trace (not shown). In this embodiment, the wire 6' includes ten signal lines (not shown) and a shielding line (not shown) surrounding the ten signal lines (not shown). The ten signal wires (not shown) of the wire 6' are welded to the ten first gold fingers 1161' in a one-to-one correspondence. The shielding wires (not shown) of the wire 6' are welded to the second gold fingers 1162'.

[0081] In this embodiment, the ten first gold fingers 1161' are arranged in staggered rows on opposite sides of the connection portion 113'. Five first gold fingers 1161' are arranged in a row on the flexible circuit board 11' and are located on the same side as the high-dielectric sheet 13'. Five first gold fingers 1161' are arranged in a row on the flexible circuit board 11' and are located on the same side as the insulating plate 12'. The second gold fingers 1162' are arranged on the same side of the flexible circuit board 11' as the high-dielectric sheet 13'. The second gold fingers 1162' are arranged at the end of the connection portion 113'. The five first gold fingers 1161' and the second gold fingers 1162' on the same side are arranged in two alternate rows. The first gold fingers 1161' on the same side as the second gold fingers 1162' are arranged close to the second gold fingers 1162'. The first gold finger 1161', located on the side of the connection portion 113' away from the high-dielectric sheet 13', is positioned away from the second gold finger 1162'. That is, the distance between the first gold finger 1161' and the second gold finger 1162', located on the same side as the second gold finger 1162', is shorter than the distance between the first gold finger 1161' and a position opposite the second gold finger 1162', located on a different side from the second gold finger 1162'. The first gold finger 1161' located on the same side as the second gold finger 1162' is closer to the end of the connection portion 113' than the first gold finger 1161' located on a different side from the second gold finger 1162'. That is, the distance between the first gold finger 1161' and the end of the connection portion 113', located on the same side as the second gold finger 1162', is shorter than the distance between the first gold finger 1161' and the end of the connection portion 113', located on a different side from the second gold finger 1162'. That is, viewed from the thickness direction of the connection portion 113 ′, the first golden finger 1161 ′ on the same side as the second golden finger 1162 ′ is disposed between the first golden finger 1161 ′ and the second golden finger 1162 ′ on different sides.

[0082] The two reinforcing plates 15' are provided with two. The two reinforcing plates 15' include a

[0083] A first reinforcing plate 151' is attached to the connection portion 113' and located on the same side as the high-dielectric sheet 13', and a second reinforcing plate 152' is attached to the connection portion 113' and located on the same side as the insulating plate 12'. The first reinforcing plate 151' is positioned opposite five first gold fingers 1161' located on the connection portion 113' and located on the same side as the insulating plate 12', as well as corresponding portions of a plurality of conductive traces (not shown) electrically connected to the five first gold fingers 1161'. The second reinforcing plate 152' is positioned opposite five first gold fingers 1161' located on the connection portion 113' and located on the same side as the high-dielectric sheet 13', as well as corresponding portions of a plurality of conductive traces (not shown) electrically connected to the five first gold fingers 1161', and second gold fingers 1162. The areas of the first and second reinforcing plates 151' and 152' are both larger than the areas of the gold fingers 116' they are positioned opposite. In this embodiment, the area of the first reinforcing plate 151' and the second reinforcing plate 152' are both larger than 20mm 2 The first reinforcing plate 151 ′ and the second reinforcing plate 152 ′ are substantially staggered.

[0084] Third embodiment

[0085] Figure 11 and Figure 12FIG. 3 shows a third embodiment of a tumor electric field therapy system 1000 according to the present invention, illustrating only a plan view of the connection portion 113" and the reinforcing plate 15" of the flexible circuit board 11". The third embodiment differs from the second embodiment in that a first gold finger 1161" located on the same side of the connection portion 113" as a second gold finger 1162" is positioned away from the end of the connection portion 113", while a first gold finger 1161" located on a different side of the connection portion 113" from the second gold finger 1162" is positioned closer to the second gold finger 1162". The first gold finger 1161" located on a different side from the second gold finger 1162" is positioned closer to the end of the connection portion 113". The distance from the first gold finger 1161" located on the same side as the second gold finger 1162" to the end of the connection portion 113" is greater than the distance from the first gold finger 1161" located on a different side from the second gold finger 1162". Viewed from the thickness direction of the connection portion 113 ″, the first golden finger 1161 ″ located on a different side from the second golden finger 1162 ″ is disposed between the first golden finger 1161 ″ and the second golden finger 1162 ″ located on the same side as the second golden finger 1162 ″. One first reinforcing plate 151" is provided, and is disposed between the second gold finger 1162" and the first gold finger 1161" on the same side as the connection portion 113'. This plate is used to strengthen the connection between the first gold finger 1161" and the corresponding conductive trace (not shown), which is located on a different side from the second gold finger 1162". Two second reinforcing plates 152" are provided, one of which is disposed at opposite ends of the first gold finger 1161" on different sides from the connection portion 113". One of the two second reinforcing plates 152" is disposed at a position opposite the second gold finger 1162" on the connection portion 113", and is used to strengthen the connection between the second gold finger 1162" and the conductive trace (not shown) connected thereto. The other second reinforcing plate 152" is disposed at a position opposite the first gold finger 1161" on the same side as the connection portion 113", and is used to strengthen the connection between the first gold finger 1161" and the second gold finger 1162". There is a gap of 1 mm or more between the reinforcing plate 15 ″ and the gold finger 116 ″ located on the same side of the connection portion 113 ″ to prevent the reinforcing plate 15 ″ from affecting the welding between the gold finger 116 ″ and the wire 6 ″.

[0086] The electrode sheets 100, 100' of the present invention are provided with reinforcing plates 15, 15', 15" at positions opposite to the connection points between the gold fingers 116' of the connection parts 113, 113', 113" and the conductive traces (not shown) to improve the strength of the connection parts 113, 113', 113" and to greatly disperse the contact of the wires 6, 6' with the connection parts 113, 113' during the process of moving or turning the flexible circuit boards 11, 11' after the wires 6, 6' are welded to the flexible circuit boards 11, 11'. The pulling force of 3', 113" is reduced to prevent the connection between the gold fingers 116, 116', 116" of the wiring parts 113, 113', 113" and the conductive traces (not shown) from breaking when the wiring parts 113, 113', 113" are pulled by the wires 6, 6', thereby preventing the electrode sheets 100, 100' from being unusable, thereby improving the product yield and reducing the production cost. At the same time, it can also ensure that the electrode sheets 100, 100' can be adhered to the body surface corresponding to the patient's tumor site.

[0087] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An electrode sheet for electric field therapy of tumors, comprising a flexible circuit board, at least one high dielectric sheet disposed on the flexible circuit board, and a wire electrically connected to the flexible circuit board, characterized in that: The flexible circuit board is provided with a connection portion welded to the wire and a plurality of reinforcing plates provided on the connection portion. The flexible circuit board is provided with a first side surface and a second side surface opposite to each other. The first side surface and the second side surface of the connection portion respectively have a row of first gold fingers welded to the wire and a plurality of conductive traces electrically connected to the corresponding first gold fingers. The first gold fingers located on the first side surface and the first gold fingers located on the second side surface are staggered along the extension direction of the connection portion. The plurality of reinforcing plates include a first reinforcing plate and a second reinforcing plate. The first reinforcing plate is provided on the first side surface of the connection portion and supports the connection between the first gold fingers located on the second side surface and the conductive trace. The second reinforcing plate is provided on the second side surface of the connection portion and supports the connection between the first gold fingers located on the first side surface and the conductive trace.

2. The electrode sheet according to claim 1, characterized in that The high dielectric sheet is located on the first side of the flexible circuit board.

3. The electrode sheet according to claim 1, characterized in that The first side surface of the connection portion is further provided with second gold fingers arranged in a staggered arrangement with a plurality of the first gold fingers.

4. The electrode sheet according to claim 3, characterized in that Along the extending direction of the connection portion, the first golden finger located on the first side surface is disposed between the first golden finger located on the second side surface and the second golden finger located on the first side surface.

5. The electrode sheet according to claim 4, characterized in that The second reinforcing plate further supports the second gold finger of the wiring portion located on the first side surface thereof.

6. The electrode sheet according to claim 3, characterized in that The second golden finger is arranged near the end of the connection portion.

7. The electrode sheet according to claim 6, characterized in that Along the extending direction of the connecting portion, the first golden finger located on the second side surface is arranged between the first golden finger located on the first side surface and the second golden finger located on the first side surface.

8. The electrode sheet according to any one of claims 1 to 7, characterized in that: The reinforcing plate is made of polyimide material and has a thickness of 0.6 mm to 1 mm.

9. The electrode sheet according to any one of claims 1 to 7, characterized in that: The reinforcing plate is made of epoxy glass fiber material and has a thickness of 0.2mm-0.5mm.

10. The electrode sheet according to claim 1, characterized in that The invention also includes a heat shrink tubing covering the connection between the wiring part of the flexible circuit board and the wire.

11. A tumor electric field treatment system, characterized in that: The electric field generator comprises an electric field generator and an electrode sheet according to any one of claims 1 to 10 electrically connected to the electric field generator.

12. The tumor electric field treatment system according to claim 11, characterized in that: It also includes an adapter electrically connected to the electric field generator, and the electrode sheet is detachably assembled on the adapter.

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