Silicon rod cutting and grinding integrated machine

Abstract

The application discloses a silicon rod cutting and grinding integrated machine, which integrates a silicon rod cutting device and a grinding device, and is provided with the silicon rod cutting device and the grinding device arranged at a first machining position and a second machining position of a silicon rod machining platform respectively, and provided with a first transfer device and a second transfer device penetrating through the first machining position and the second machining position simultaneously, and provided with a silicon rod clamp and a driving mechanism for the first and second transfer devices respectively, and through coordinated control of the first and second transfer devices and the silicon rod cutting device and the grinding device, the silicon rod cutting device at the first machining position and the grinding device at the second machining position are both in a working state at the same time, so that the integrated operation of the silicon rod opening and grinding multi-process is completed, and the production efficiency and the product machining operation quality are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon workpiece processing, in particular to a silicon rod cutting and grinding integrated machine. BACKGROUND

[0002] At present, with the attention and opening of society to green renewable energy utilization, the field of photovoltaic solar power generation is paid more and more attention and developed. In the field of photovoltaic power generation, the common crystalline silicon solar cell is made of high-quality silicon wafer, which is cut by multi-wire saw from a pulled or cast silicon ingot and then processed.

[0003] The existing silicon wafer manufacturing process takes a single crystal silicon product as an example. Generally, the approximate operation procedure can include: first, using a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, using a silicon rod squaring machine to square the cut short silicon rods to form rectangular cut silicon rods; then performing surface grinding, chamfering and other finishing operations on each cut silicon rod to shape the surface of the silicon rod to meet the corresponding flatness and dimensional tolerance requirements; then using a slicing machine to slice the silicon rod to obtain a single crystal silicon wafer.

[0004] However, in the related art, the operation required for each operation procedure (such as squaring and cutting, grinding, chamfering, etc.) is independently arranged, and the corresponding processing devices are scattered in different production units or production workshops or different production areas of a production workshop. The conversion of workpieces performing different operation procedures needs to be transported and allocated, and preprocessing work may be required before performing each operation procedure. Thus, the operation procedure is complicated, the efficiency is low, and the quality of the silicon rod finishing operation is easily affected, more manpower or transportation equipment is needed, the safety hidden danger is large, in addition, there are many flow links between the operation devices of each procedure, which increases the risk of workpiece damage during workpiece transfer, and unqualified products caused by non-production factors are easily produced, which reduces the product qualification rate and the unreasonable loss caused by the existing processing mode. It is a major improvement issue faced by each company. SUMMARY

[0005] In view of the above-mentioned deficiencies of the related art, the purpose of the present application is to provide a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method to solve the problems of low efficiency between each operation procedure and poor silicon rod finishing operation effect in the existing related art.

[0006] To achieve the above-mentioned purposes and other related purposes, the present application discloses a silicon rod cutting and grinding integrated machine, comprising:

[0007] A machine base having a silicon rod processing platform; the silicon rod processing platform is provided with a first processing area and a second processing area;

[0008] a first transfer device disposed in the first transfer channel, the first transfer device comprising a first silicon rod clamp and a first transfer driving mechanism, the first transfer driving mechanism configured to drive the first silicon rod clamp and a silicon rod clamped thereby to move along the first direction and transfer between the first processing location and the second processing location;

[0009] a second transfer device disposed in the second transfer channel, the second transfer device comprising a second silicon rod clamp and a second transfer driving mechanism, the second transfer driving mechanism configured to drive the second silicon rod clamp and a silicon rod clamped thereby to move along the first direction and transfer between the first processing location and the second processing location;

[0010] a silicon rod cutting device disposed at the first processing location of the silicon rod processing platform, the silicon rod cutting device configured to perform a cutting operation on a to-be-cut silicon rod clamped by the first transfer device on the first transfer channel or a to-be-cut silicon rod clamped by the second transfer device on the second transfer channel; and

[0011] a silicon rod grinding device disposed at the second processing location of the silicon rod processing platform, the silicon rod grinding device configured to perform a grinding operation on a cut silicon rod clamped by the first transfer device on the first transfer channel or a cut silicon rod clamped by the second transfer device on the second transfer channel.

[0012] In some embodiments of the present application, the first transfer device and the second transfer device are disposed above the silicon rod processing platform via a mounting frame, or the first transfer device is disposed above the silicon rod processing platform via a first mounting frame and the second transfer device is disposed above the silicon rod processing platform via a second mounting frame.

[0013] In some embodiments of the present application, the first silicon rod clamp comprises: a first clamp arm mounting seat; at least one pair of first clamp arms disposed on the first clamp arm mounting seat in opposition along the first direction, configured to clamp two end faces of a silicon rod; wherein any one of the at least one pair of first clamp arms is provided with a clamping portion; and a first clamp arm driving mechanism configured to drive at least one of the at least one pair of first clamp arms to move along the first direction to adjust the clamping spacing between the at least one pair of first clamp arms.

[0014] In some embodiments of the present application, the first transfer driving mechanism comprises: a first transfer guide rail arranged along the first direction, configured to dispose the first clamp arm mounting seat; and a first transfer driving unit configured to drive the first clamp arm mounting seat and the at least one pair of first clamp arms thereof to move along the first transfer guide rail.

[0015] In some embodiments of the present application, the first transfer driving unit comprises a moving rack rail arranged along a first direction; a driving gear arranged on the first clamp arm mounting seat and engaged with the moving rack rail; and a driving source configured to drive the driving gear to move the associated first clamp arm mounting seat and the at least one pair of first clamp arms along the first transfer rail.

[0016] In some embodiments of the present application, the first transfer driving unit comprises a moving rack rail arranged along a first direction; a driving gear arranged on the first clamp arm mounting seat and engaged with the moving rack rail; and a driving source configured to drive the driving gear to move the associated first clamp arm mounting seat and the at least one pair of first clamp arms along the first transfer rail.

[0017] In some embodiments of the present application, the at least one pair of first clamp arms is of a rotating structure; and the first silicon rod clamp further comprises a first clamp arm rotating mechanism arranged on at least one of the at least one pair of first clamp arms and configured to drive the clamping portion of the at least one first clamp arm to rotate.

[0018] In some embodiments of the present application, the second silicon rod clamp comprises a second clamp arm mounting seat; and at least one pair of second clamp arms arranged on the second clamp arm mounting seat in a first direction and configured to clamp two end faces of a silicon rod; wherein any one of the at least one pair of second clamp arms is provided with a clamping portion; and a second clamp arm driving mechanism configured to drive at least one of the at least one pair of second clamp arms to move along the first direction to adjust the clamping spacing between the at least one pair of second clamp arms.

[0019] In some embodiments of the present application, the second transfer driving mechanism comprises a second transfer rail arranged along a first direction and configured to arrange the second clamp arm mounting seat; and a second transfer driving unit configured to drive the second clamp arm mounting seat and the at least one pair of second clamp arms to move along the second transfer rail.

[0020] In some embodiments of the present application, the second transfer driving unit comprises a moving rack rail arranged along a first direction; a driving gear arranged on the second clamp arm mounting seat and engaged with the moving rack rail; and a driving source configured to drive the driving gear to move the associated second clamp arm mounting seat and the at least one pair of second clamp arms along the second transfer rail.

[0021] In some embodiments of the present application, the second transfer driving unit comprises a moving rack rail arranged along a first direction; a driving gear arranged on the second clamp arm mounting seat and engaged with the moving rack rail; and a driving source configured to drive the driving gear to move the associated second clamp arm mounting seat and the at least one pair of second clamp arms along the second transfer rail.

[0022] In some embodiments of the present application, the at least one pair of second clamping arms is a rotating structure; and the second silicon rod clamp further comprises a second clamping arm rotating mechanism arranged on at least one of the at least one pair of second clamping arms, and configured to drive the clamping portion of the at least one second clamping arm to rotate.

[0023] In some embodiments of the present application, the silicon rod cutting device comprises: a cutting frame; at least one wire cutting unit arranged on the cutting frame; the wire cutting unit comprises: at least two cutting wheels, a transition wheel, and a cutting wire, the cutting wire being wound around the at least two cutting wheels and the transition wheel to form at least one cutting wire saw; and a cutting switching mechanism configured to drive the cutting frame and the at least one wire cutting unit thereon to switch between the first transfer channel and the second transfer channel.

[0024] In some embodiments of the present application, the wire cutting unit comprises: a cutting wire; a first cutting wheel and a second cutting wheel arranged on the cutting frame, the cutting wire being wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; wherein the wheel surface of the first cutting wheel is parallel or coplanar to the wheel surface of the second cutting wheel; a first transition wheel arranged adjacent to the first cutting wheel, the cutting wire of the first cutting wheel and the first transition wheel being located in a plane in which a first cutting wire groove for winding the cutting wire in the first cutting wheel is located in a state of pulling the cutting wire; a second transition wheel arranged adjacent to the second cutting wheel, the cutting wire of the second cutting wheel and the second transition wheel being located in a plane in which a second cutting wire groove for winding the cutting wire in the second cutting wheel is located in a state of pulling the cutting wire; and at least one third transition wheel arranged between the first transition wheel and the second transition wheel, configured to pull the cutting wire between the first transition wheel and the second transition wheel, so that a cutting accommodation space is formed in the wire cutting unit, and the cutting wire saw and the cutting accommodation space intersect in the silicon rod cutting device.

[0025] In some embodiments of the present application, the first transition wheel, the second transition wheel, and the at least one third transition wheel are configured to pull the cutting wire away from the cutting accommodation space.

[0026] In some embodiments of the present application, the cutting wire is wound between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel, and the third transition wheel to form a closed loop cutting wire.

[0027] In some embodiments of the present application, the wire cutting unit comprises two third transition wheels, wherein the cutting wire is wound in sequence around the first cutting wheel, the second cutting wheel, the second transition wheel, one third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form a closed loop cutting wire.

[0028] In some embodiments of the present application, the silicon rod cutting device further comprises a cutting wire driving device for driving the cutting wire to cut the silicon rod to be cut.

[0029] In some embodiments of the present application, the cutting wire driving device is a motor having a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel.

[0030] In some embodiments of the present application, the silicon rod cutting device further comprises at least one distance adjusting mechanism arranged in the at least one wire cutting unit for driving at least two cutting wheels in the wire cutting unit to move along a direction perpendicular to the wheel surface of the cutting wheel relative to the cutting frame.

[0031] In some embodiments of the present application, the silicon rod cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises a screw rod arranged along a direction perpendicular to the wheel surface of the cutting wheel and threadedly connected to the single wire cutting unit, and a driving source for driving the screw rod to rotate.

[0032] In some embodiments of the present application, the silicon rod cutting device comprises a single wire cutting unit, and the distance adjusting mechanism comprises a telescopic member arranged along a direction perpendicular to the wheel surface of the cutting wheel and associated with the single wire cutting unit, and a driving source for driving the telescopic member to perform telescopic movement along the direction perpendicular to the wheel surface of the cutting wheel.

[0033] In some embodiments of the present application, the silicon rod cutting device comprises a first wire cutting unit and a second wire cutting unit arranged in parallel and oppositely, and at least one of the first wire cutting unit and the second wire cutting unit is driven by the distance adjusting mechanism to move along a direction perpendicular to the wheel surface of the cutting wheel.

[0034] In some embodiments of the present application, the distance adjusting mechanism comprises a screw rod arranged along a direction perpendicular to the wheel surface of the cutting wheel and threadedly connected to the first wire cutting unit or the second wire cutting unit, and a driving source for driving the screw rod to rotate.

[0035] In some embodiments of the present application, the distance adjusting mechanism comprises a telescopic member arranged along a direction perpendicular to the wheel surface of the cutting wheel and associated with the first wire cutting unit or the second wire cutting unit, and a driving source for driving the telescopic member to perform telescopic movement along the direction perpendicular to the wheel surface of the cutting wheel.

[0036] In some embodiments of the present application, the distance adjusting mechanism comprises a bidirectional screw rod arranged along a direction perpendicular to the wheel surface of the cutting wheel and threadedly connected to the first wire cutting unit and the second wire cutting unit, and a driving source for driving the screw rod to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or move away from each other along the direction perpendicular to the wheel surface of the cutting wheel.

[0037] In some embodiments of the present application, the cutting conversion mechanism comprises: a cutting conversion guide rail arranged along a second direction for setting the cutting frame; the second direction is perpendicular to the first direction; a cutting conversion driving unit for driving the cutting frame and at least one linear cutting unit thereof to move along the cutting conversion guide rail.

[0038] In some embodiments of the present application, the cutting conversion driving unit comprises: a moving rack rail arranged along a second direction; a driving gear arranged on the cutting frame and engaged with the moving rack rail; a driving source for driving the driving gear to drive the associated cutting frame and at least one linear cutting unit thereof to move along the cutting conversion guide rail.

[0039] In some embodiments of the present application, the cutting conversion driving unit comprises: a moving rack rail arranged along a second direction and associated with the cutting frame; a driving source for driving the moving rack rail to rotate to drive the associated cutting frame and at least one linear cutting unit thereof to move along the cutting conversion guide rail.

[0040] In some embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises a side skin unloading device, the side skin unloading device comprises a side skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the side skin formed by cutting.

[0041] In some embodiments of the present application, the side skin supporting mechanism comprises: a supporting part; a driving unit connected to the supporting part to control the supporting part to move away from or abut against the side skin.

[0042] In some embodiments of the present application, the supporting part comprises: at least two supporting blocks arranged along the first direction and having a supporting surface for contacting and supporting the side skin.

[0043] In some embodiments of the present application, the supporting part comprises: at least two supporting rods arranged along the first direction for contacting and supporting the side skin; two connecting parts arranged on opposite sides of the cutting frame in the first direction to correspond to opposite ends of the at least two supporting rods, for connecting the at least two supporting rods and connecting with the driving unit.

[0044] In some embodiments of the present application, the supporting part comprises at least two supporting wheel sets arranged along the first direction, wherein the supporting wheel set comprises: at least two supporting wheels arranged for contacting and supporting the side skin; a supporting base for arranging the at least two supporting wheels and connecting with the driving unit.

[0045] In some embodiments of the present application, the driving unit comprises: a pneumatic cylinder or a hydraulic pump; a telescopic part connected to the supporting part and driven by the pneumatic cylinder or the hydraulic pump to extend or retract to control the supporting part to move away from or abut against the side skin.

[0046] In some embodiments of the present application, the driving unit comprises a driving motor, a screw rod assembly connected to the supporting part and driven to move by the driving motor to control the supporting part to move away from or against the edge skin.

[0047] In some embodiments of the present application, the edge skin unloading device further comprises an edge skin dislocation mechanism arranged on the machine base or the silicon rod cutting device, and used to push the edge skin in the first direction to make the edge skin disengage from the edge skin supporting mechanism.

[0048] In some embodiments of the present application, the edge skin dislocation mechanism comprises a pushing part, and a pneumatic cylinder or hydraulic pump used to drive the pushing part to push the telescopic rod of the edge skin in the first direction.

[0049] In some embodiments of the present application, the edge skin unloading device further comprises an edge skin conveying mechanism used to receive the edge skin formed by cutting and transfer the edge skin to an unloading area.

[0050] In some embodiments of the present application, the edge skin conveying mechanism comprises a conveying part used to carry the edge skin, and a conveying driving source used to drive the conveying part to move in the first direction to convey the edge skin.

[0051] In some embodiments of the present application, the silicon rod grinding device comprises a grinding tool mounting seat, at least one pair of grinding tools arranged oppositely on the grinding tool mounting seat, a grinding tool advancing and retreating mechanism used to drive at least one grinding tool of the at least one pair of grinding tools to move in a second direction, and a grinding tool switching mechanism used to drive the at least one pair of grinding tools to switch between a first transfer channel and a second transfer channel.

[0052] In some embodiments of the present application, any one of the at least one pair of grinding tools comprises a coarse grinding wheel and a fine grinding wheel nested with each other.

[0053] In some embodiments of the present application, the coarse grinding wheel is nested in the fine grinding wheel, and at least one of the coarse grinding wheel and the fine grinding wheel is provided with a telescopic driving mechanism; or the fine grinding wheel is nested in the coarse grinding wheel, and at least one of the coarse grinding wheel and the fine grinding wheel is provided with a telescopic driving mechanism.

[0054] In some embodiments of the present application, the grinding tool switching mechanism comprises a grinding tool switching guide rail arranged in the second direction and used to arrange the grinding tool mounting seat, and a grinding tool switching driving unit used to drive the grinding tool mounting seat and the at least one pair of grinding tools to move along the grinding tool switching guide rail.

[0055] In some embodiments of the present application, the grinding tool conversion driving unit comprises: a moving rack rail arranged along a second direction; a driving gear arranged on the grinding tool mounting seat and engaged with the moving rack rail; a driving source for driving the driving gear to move the associated grinding tool mounting seat and at least one pair of grinding tools thereon along the grinding tool conversion guide rail.

[0056] In some embodiments of the present application, the grinding tool conversion driving unit comprises: a moving rack rail arranged along a second direction; a driving gear arranged on the grinding tool mounting seat and engaged with the moving rack rail; a driving source for driving the driving gear to move the associated grinding tool mounting seat and at least one pair of grinding tools thereon along the grinding tool conversion guide rail.

[0057] In some embodiments of the present application, the silicon rod grinding device further comprises: at least one pair of chamfering grinding tools arranged on the grinding tool mounting seat.

[0058] In some embodiments of the present application, either of the first and second silicon rod clamps further comprises: a grinding repair device for grinding and repairing at least one pair of grinding tools in the corresponding silicon rod grinding device.

[0059] In some embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises: a silicon rod transfer device arranged at the loading area of the silicon rod processing platform for transferring the silicon rod to be processed to the first processing area of the silicon rod processing platform.

[0060] In some embodiments of the present application, the silicon rod transfer device comprises: a silicon rod carrying structure for carrying the silicon rod to be processed; a centering adjustment mechanism for adjusting the position of the silicon rod to be processed so that the axial center line thereof corresponds to the predetermined center line; and a feeding driving mechanism for driving the silicon rod carrying structure and the silicon rod to be processed carried thereby to move from the loading area to the first processing area along the second direction.

[0061] In some embodiments of the present application, the centering adjustment mechanism comprises a vertical lifting mechanism for driving the silicon rod carrying structure and the silicon rod to be processed carried thereby to perform vertical lifting movement so that the axial center line of the silicon rod to be processed is vertically aligned with the predetermined center line.

[0062] In some embodiments of the present application, the vertical lifting mechanism comprises: a vertical lifting guide rail arranged on the carrying base; a sliding block arranged on the carrying member; and a vertical lifting driving unit.

[0063] In some embodiments of the present application, the vertical lifting mechanism comprises: a vertical lifting guide rod for arranging the silicon rod carrying structure; and a vertical lifting driving unit for driving the silicon rod carrying structure to move up and down along the vertical lifting guide rod.

[0064] In some embodiments of the present application, the vertical lifting driving unit comprises a driving motor and a screw rod assembly arranged vertically and driven by the driving motor, or a driving motor and a gear-rack transmission assembly arranged vertically and driven by the driving motor.

[0065] In some embodiments of the present application, the silicon rod transferring device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so as to be located in the centering area of the silicon rod carrying structure.

[0066] In some embodiments of the present application, the centering adjustment mechanism comprises a bracket arranged on the machine base or the silicon rod carrying structure, an adjustment guide rail arranged on the bracket in the first direction, at least two pushers arranged on opposite sides of the bracket, and an adjustment driving unit for driving the at least two pushers to move towards each other along the adjustment guide rail so as to push the silicon rod to the centering area of the silicon rod carrying structure.

[0067] In some embodiments of the present application, the adjustment driving unit comprises a driving motor and a screw rod assembly arranged in the first direction and driven by the driving motor, or a driving motor and a gear-rack transmission assembly arranged in the first direction and driven by the driving motor.

[0068] In some embodiments of the present application, the silicon rod transferring device further comprises a silicon rod clamping mechanism arranged on the silicon rod carrying structure.

[0069] In some embodiments of the present application, the silicon rod clamping mechanism comprises a clamp mounting member arranged on the silicon rod carrying structure in the first direction, and at least two silicon rod clamping members arranged at intervals along the clamp mounting member.

[0070] In some embodiments of the present application, the silicon rod clamping member comprises a clamp arm mounting seat arranged on the clamp mounting member, two clamp arms movably arranged on the clamp arm mounting seat, and a clamp arm driving mechanism for driving the two clamp arms to open and close.

[0071] In some embodiments of the present application, the clamp arm driving mechanism comprises an opening and closing gear arranged on the clamp arm mounting seat, two racks each associated with one clamp arm and meshing with the opening and closing gear, and a driving source associated with the opening and closing gear for driving the opening and closing gear to rotate.

[0072] In some embodiments of the present application, in the silicon rod clamping mechanism, at least one of the at least two silicon rod clamping members is provided with an interval adjustment driving mechanism for driving it to move along the clamp mounting member so as to adjust the interval of the at least two silicon rod clamping members.

[0073] In some embodiments of the present application, the pitch adjustment driving mechanism is a screw rod adjustment mechanism, a chain conveying mechanism, a speed-up chain mechanism, or a transmission belt mechanism.

[0074] In some embodiments of the present application, the feeding driving mechanism comprises a feeding guide rod or a feeding guide rail arranged along the second direction for setting the silicon rod carrying structure; and a feeding driving unit for driving the silicon rod carrying structure to move along the feeding guide rod or the feeding guide rail.

[0075] In some embodiments of the present application, the silicon rod transferring device further comprises a crystal line detection unit.

[0076] In some embodiments of the present application, the silicon rod cutting and grinding all-in-one machine further comprises a silicon rod unloading device arranged in the workpiece unloading area of the silicon rod machining platform for unloading the ground silicon rod from the silicon rod machining platform.

[0077] The silicon rod cutting and grinding all-in-one machine disclosed in the present application integrates the silicon rod cutting device and the grinding device, and sets the silicon rod cutting device and the grinding device in the first machining area and the second machining area of the silicon rod machining platform, respectively, and sets the first transferring device and the second transferring device which simultaneously penetrate the first machining area and the second machining area, configures the silicon rod clamp and the driving mechanism for the first and second transferring devices, respectively, and controls the first and second transferring devices and the silicon rod cutting device and the grinding device coordinately, so that the silicon rod cutting device in the first machining area and the grinding device in the second machining area are both in working state at the same time, thereby completing the integrated operation of the silicon rod opening and grinding multi-process, improving the production efficiency and the quality of the product operation. BRIEF DESCRIPTION OF DRAWINGS

[0078] The specific features of the invention involved in the present application are shown in the appended claims. The features and advantages of the invention involved in the present application can be better understood by referring to the exemplary embodiments described in detail below and the accompanying drawings. A brief description of the drawings is as follows:

[0079] Figure 1 The structure schematic diagram of the silicon rod cutting and grinding all-in-one machine of the present application is shown in the first view of an embodiment.

[0080] Figure 2 The structure schematic diagram of the silicon rod cutting and grinding all-in-one machine of the present application is shown in the second view of an embodiment.

[0081] Figure 3 The top view of the silicon rod cutting and grinding all-in-one machine of the present application is shown in an embodiment.

[0082] Figure 4 The structure schematic diagram of the first silicon rod clamp or the second silicon rod clamp in the silicon rod cutting and grinding all-in-one machine of the present application is shown.

[0083] Figure 5 A schematic view of a silicon rod cutting device in an embodiment of the silicon rod cutting and grinding all-in-one machine of the present application is shown.

[0084] Figure 6 A schematic view of a silicon rod cutting device in an embodiment of the silicon rod cutting and grinding all-in-one machine of the present application is shown. Figure 5 A schematic view of a centerline cutting unit is shown.

[0085] Figure 7 A schematic view of a silicon rod grinding device in an embodiment of the silicon rod cutting and grinding all-in-one machine of the present application is shown.

[0086] Figure 8 A sectional view of a grinding tool of a silicon rod grinding device in an embodiment of the silicon rod cutting and grinding all-in-one machine of the present application is shown.

[0087] Figure 9 A schematic view of a silicon rod grinding device in an embodiment of the silicon rod cutting and grinding all-in-one machine of the present application is shown. Figure 1 An enlarged schematic view of the center A is shown. DETAILED DESCRIPTION

[0088] The following describes the embodiments of the present application by specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the description.

[0089] In the following description, several embodiments of the present application are described with reference to the accompanying drawings. It should be understood that other embodiments can also be used, and mechanical components, structures, and operations can be changed without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered as limiting, and the scope of the embodiments of the present application is only limited by the claims of the published patent. The terms used herein are only for describing specific embodiments, and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "under", "bottom", "above", "top", etc., can be used in the description to facilitate the description of the relationship between one element or feature shown in the drawings and another element or feature.

[0090] Although in some examples the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first transfer device can be called a second transfer device, and similarly, a second transfer device can be called a first transfer device without departing from the scope of various described embodiments. The first transfer device and the second transfer device are both describing a certain transfer device, but they are not the same transfer device unless the context clearly indicates otherwise. Similar cases also include a first transfer guide and a second transfer guide, a first processing location and a second processing location, a first transfer drive mechanism and a second transfer drive mechanism, a first silicon rod clamp and a second silicon rod clamp, etc.

[0091] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including" when used herein, specify the presence of stated features, steps, operations, elements, components, items, and / or groups but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, and / or groups thereof. As used herein, the terms "or" and "and / or" are to be interpreted as inclusive, i.e., as meaning one or any combination of the items. Thus, "A, B or C" or "A, B and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B and C". Exceptions to this definition apply only when the combination of elements, functions, steps or acts are mutually exclusive, as in some instances certain combinations are inherently mutually exclusive.

[0092] In the related technical field of the silicon rod processing operation, several processes such as square cutting, surface grinding, chamfering, etc. are involved.

[0093] Generally, the existing silicon rod is mostly in a cylindrical structure, and the silicon rod is cut by a silicon rod square cutting device to make the cross section of the silicon rod after square cutting processing to be a rectangle (including a square), and the processed silicon rod is in a cuboid shape as a whole.

[0094] Taking a single crystal silicon rod as an example, the forming process of the single crystal silicon rod can include: first cutting the original long silicon rod by a silicon rod cutting machine to form a plurality of short silicon rods; and then cutting the short silicon rod by a silicon rod square cutting machine to form a single crystal silicon rod with a rectangular cross section. The specific implementation of cutting the original long silicon rod by the silicon rod cutting machine to form a plurality of short silicon rods can be referred to, for example, CN105856445A, CN105946127A, and CN105196433A, and the specific implementation of cutting the short silicon rod by the silicon rod square cutting machine to form a single crystal silicon rod with a rectangular cross section can be referred to CN105818285A. However, the forming process of the single crystal silicon rod is not limited to the foregoing technology. In alternative examples, the forming process of the single crystal silicon rod can also include: first cutting the original long silicon rod by a full silicon rod square cutting machine to form a long single crystal silicon rod with a rectangular cross section; and then cutting the long single crystal silicon rod by a silicon rod cutting machine to form a short single crystal silicon rod. The specific implementation of cutting the original long silicon rod by the full silicon rod square cutting machine to form a long single crystal silicon rod with a rectangular cross section can be referred to, for example, CN106003443A.

[0095] After the cylindrical single crystal silicon rod is cut into a rectangular silicon rod by the squaring device, the rectangular silicon rod can be ground and chamfered by the grinding device.

[0096] The inventors of the present application find that in the related silicon rod processing technology, the squaring device, the grinding device (e.g., the surface grinding device, the chamfering device, etc.) are arranged separately and independently, and the conversion of the silicon rod for different processes needs to be handled and pre-processed, which causes complicated processes and low efficiency.

[0097] Therefore, the present application provides a silicon rod cutting and grinding all-in-one machine and a silicon rod cutting and grinding method. Through the equipment modification, multiple processing devices are integrated in one device, the squaring and cutting of the silicon rod and the grinding of the silicon rod can be automatically realized, the different processes are seamlessly connected, the labor cost is saved, the production efficiency is improved, and the quality of the silicon rod processing is improved.

[0098] In the embodiments provided by the present application, in order to define the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined, and the first direction, the second direction and the third direction are all straight lines and perpendicular to each other. The length extension direction of the silicon rod cutting and grinding all-in-one machine, that is, the length direction of the silicon rod placed thereon is defined as the first direction (i.e., the front-rear direction or the transfer direction), the width extension direction of the silicon rod cutting and grinding all-in-one machine, that is, the left-right direction is defined as the second direction (i.e., the left-right direction or the feeding direction), and the vertical direction, that is, the vertical direction, the perpendicular direction, the up-down direction or the lifting direction is defined as the third direction.

[0099] The present application discloses a silicon rod cutting and grinding all-in-one machine. The silicon rod cutting and grinding all-in-one machine is used for squaring and grinding a silicon rod, that is, cutting a silicon rod with a circular cross section (or approximately circular) to form a silicon rod with a rectangular cross section (including a square-like cross section), and grinding the silicon rod with a rectangular cross section (including a square-like cross section). Most of the silicon rods can be, for example, single crystal silicon rods or polycrystalline silicon rods. In the embodiments of the present application, the single crystal silicon rod is taken as an example for illustration.

[0100] Please refer to Figures 1 to 3 , wherein, Figure 1 which shows the structure of the silicon rod cutting and grinding all-in-one machine in the first view of an embodiment of the present application, Figure 2 which shows the structure of the silicon rod cutting and grinding all-in-one machine in the second view of an embodiment of the present application, Figure 3 which shows the top view of the silicon rod cutting and grinding all-in-one machine in an embodiment of the present application. As shown in the figure, the silicon rod cutting and grinding all-in-one machine comprises a machine base 1, a first transfer device 2, a second transfer device 3, a silicon rod cutting device 4, and a silicon rod grinding device 5.

[0101] The machine base has a silicon rod processing platform, which is provided with a first processing area and a second processing area. The silicon rod processing platform is arranged on the upper surface of the machine base. As shown in the figure, in the implementation mode of the embodiment, the machine base 1 is of a rectangular structure, and the processing platform is designed to be rectangular in shape in response to the shape of the machine base 1, and the first processing area and the second processing area correspond to the square processing area and the grinding processing area respectively. As shown in the figure, the first processing area and the second processing area are arranged on the front and rear sides of the silicon rod processing platform, and the single crystal silicon rod carried on the first processing area and the second processing area can be processed independently.

[0102] The first transfer device is arranged in the first transfer channel and used to transfer the silicon rod through the first transfer channel between the first processing area and the second processing area. The second transfer device is arranged in the second transfer channel and used to transfer the silicon rod through the second transfer channel between the first processing area and the second processing area.

[0103] The first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame. The mounting frame is arranged on the machine base in a vertical frame structure, and the upper surface of the frame is higher than the silicon rod processing platform and carries the first transfer device and the second transfer device. In some embodiments of the present application, as shown in the figure, a mounting frame is arranged above the silicon rod processing platform, and the first transfer device 2 and the second transfer device 3 are arranged on the left and right sides of the mounting frame in parallel. The support structure of the mounting frame is arranged on the upper surface of the machine base 1. In the illustrated embodiment, the upper surface of the machine base 1 is rectangular, and the support structure of the mounting frame is on the outer edge of the rectangle. The mounting frame and the machine base 1 are approximately the same in shape and size. Figure 1 In some embodiments of the present application, a first mounting frame and a second mounting frame are arranged above the silicon rod processing platform, and the first mounting frame and the second mounting frame are arranged on opposite sides of the silicon rod processing platform in the second direction. The first transfer device is arranged above the silicon rod processing platform through the first mounting frame, and the second transfer device is arranged above the silicon rod processing platform through the second mounting frame. The first mounting frame and the second mounting frame are the same or approximately the same in shape and size, for example, the first mounting frame and the second mounting frame are rectangular in shape.

[0104] Regarding the first transfer device, in the present application, the first transfer device arranged in the first transfer channel comprises a first silicon rod clamp and a first transfer driving mechanism. The first silicon rod clamp is used to clamp a silicon rod, and the silicon rod clamped by the first silicon rod clamp is in a horizontal position, that is, the silicon rod is clamped in a manner that the axis line of the silicon rod is consistent with the first direction. The first transfer driving mechanism is used to drive the first silicon rod clamp and the silicon rod clamped thereby to move along the first direction and transfer between the first processing area and the second processing area. The first transfer driving mechanism further comprises a first transfer guide rail and a first transfer driving unit, wherein the first transfer guide rail is arranged along the first direction and is used to arrange the first silicon rod clamp, and the first transfer driving unit is used to drive the first silicon rod clamp and the silicon rod clamped thereby to move along the first transfer guide rail.

[0105] The first silicon rod clamp comprises a first clamp arm mounting seat, at least one pair of first clamp arms is arranged on the first clamp arm mounting seat in a manner that the at least one pair of first clamp arms face each other along the first direction, and the at least one pair of first clamp arms is used to clamp two end faces of a silicon rod. At least one first clamp arm in the at least one pair of first clamp arms can move along the first direction by a first clamp arm driving mechanism to adjust the clamping spacing between the at least one pair of first clamp arms.

[0106] Please refer to Figure 4 , which shows the structural schematic diagram of the first silicon rod clamp or the second silicon rod clamp in the silicon rod cutting and grinding all-in-one machine of the present application. In some embodiments of the present application, as shown in Figure 4 , the first silicon rod clamp 21 as a whole presents that the first clamp arm mounting seat 211 is arranged above, the part outside the first clamp arm mounting seat 211 comprises the first clamp arm 213 in a suspended state, the first clamp arm mounting seat 211 is mounted on the mounting frame, and the first clamp arm 213 extends downward from the first clamp arm mounting seat 211 to the hollow part of the mounting frame to realize that the silicon rod clamped by the first clamp arm 213 (for example, the silicon rod to be cut 101 or the cut silicon rod) is on the processing surface of the silicon rod processing platform.

[0107] The first clamp arm mounting seat is arranged on the first transfer guide rail. In an implementation manner of the present embodiment, the bottom of the first clamp arm mounting seat is provided with a guide groove structure matched with the first transfer guide rail. The first transfer guide rail is arranged along the first direction, and the length range of the first transfer guide rail in the first direction covers at least the positions of the first working area and the second working area in the first direction to ensure the transfer of the silicon rod clamped by the first silicon rod clamp between the two working areas. In an implementation manner of the present embodiment, the first transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.

[0108] The first clamping arm mounting base is further provided with a first guide structure in the first direction, and the at least one pair of first clamping arms are arranged on the first clamping arm mounting base through the first guide structure and can move in the first direction. In actual application, the first guide structure can be, for example, a first clamping arm guide rail, a first clamping arm guide groove, or a first clamping arm guide rod, etc.

[0109] The at least one pair of first clamping arms are arranged opposite to each other in the first direction and used for clamping two end surfaces of the silicon rod.

[0110] For the silicon rod to be cut, the silicon rod is a cylindrical structure with a certain length, and the length direction is placed along the first direction, and the end surface is the cross section at both ends of the length direction. For the cut silicon rod, the silicon rod is a cuboid structure (the cross section is rectangular or similar) with a certain length, and the length direction is placed along the first direction, and the end surface is the cross section at both ends of the length direction.

[0111] The first clamping arm is hung down from the first clamping arm mounting base, and the lower side of the first clamping arm includes a clamping part used for directly contacting and clamping the silicon rod. As shown in the drawings, Figure 4 One end of the first clamping arm 213 is connected to the first clamping arm mounting base 211, and the other end of the first clamping arm 213 is connected with a clamping part 215 used for contacting the end surface of the silicon rod (for example, the silicon rod to be cut 101 or the cut silicon rod). The first clamping arm mounting base 211 is movably arranged on the first transfer guide rail and moves along the first transfer guide rail under the drive of the first transfer drive unit, thereby driving the first clamping arm 213 to move along the first transfer guide rail.

[0112] The first silicon rod clamp further includes a first clamping arm driving mechanism, which can drive at least one first clamping arm of the at least one pair of first clamping arms to move along the first direction, so as to adjust the clamping spacing between the pair of oppositely arranged first clamping arms. Thus, the clamping parts of the at least one pair of first clamping arms can approach or move away from each other under the action of the first clamping arm driving mechanism, so as to perform the clamping or releasing action on the silicon rod. For example, the clamping parts of the two first clamping arms oppositely arranged in the first direction approach each other to clamp the silicon rod under the drive of the first clamping arm driving mechanism, and the clamping state is maintained to transfer and process the silicon rod between different working areas. After the processing is completed, the silicon rod is transferred to the bearing position, and then the clamping parts move away from each other under the drive of the first clamping arm driving mechanism to release the processed silicon rod.

[0113] In some embodiments of the present application, the first clamping arm driving mechanism comprises a driving motor, a driving gear and a pair of racks. The driving motor drives the rotation of the driving gear, and the pair of racks are engaged with the two ends of the driving gear. When the driving gear rotates, the pair of racks move in opposite directions at different linear velocities, and thus the pair of racks move away from or close to each other. In one implementation of the present embodiment, one end of each rack of the pair of racks is engaged with the driving gear, and the other end of each rack is connected to a first clamping arm, so that the at least one pair of first clamping arms move away from or close to each other along the first clamping arm mounting seat guide in the first direction.

[0114] In some embodiments of the present application, the first clamping arm driving mechanism comprises a screw rod and a driving source. The screw rod is arranged in the first direction and associated with any one of the pair of first clamping arms. The driving source is connected to the screw rod to drive the rotation of the screw rod so that the associated first clamping arm moves in the first direction.

[0115] In some embodiments of the present application, the screw rod of the first clamping arm driving mechanism has a distal end and a proximal end. In a specific implementation, for example, the proximal end of the screw rod is connected to the driving source and rotates under the driving of the driving source, and the distal end of the screw rod is threadedly connected to any one of the pair of first clamping arms. Through the connection of the two ends of the screw rod, the screw rod can rotate based on the transmission of the driving source and convert the rotation of the screw rod into axial displacement by means of the threaded connection. The direction of the axial displacement is the arrangement direction of the screw rod, i.e. the first direction. The driving of the screw rod by the driving source can realize the movement of the first clamping arm connected to the distal end of the screw rod in the first direction. The rotation direction of the screw rod driven to rotate can change, so that the associated first clamping arm can move forward or backward in the first direction.

[0116] In some embodiments of the present application, the first clamping arm driving mechanism comprises a bidirectional screw rod arranged in the first direction and threadedly connected to the at least one pair of first clamping arms at both ends, and a driving source for driving the rotation of the screw rod so that the at least one pair of first clamping arms move towards or away from each other in the first direction.

[0117] In one implementation, the bidirectional screw rod of the first clamping arm driving mechanism is threadedly connected to the pair of first clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite threads at both ends. The driving source can be arranged at any one end of the bidirectional screw rod or connected to the bidirectional screw rod to drive the rotation of the bidirectional screw rod along the screw rod axis. Through the opposite threads at both ends of the bidirectional screw rod, the movement of the bidirectional screw rod at both ends is converted into linear motion in the opposite directions along the screw rod axis and in the first direction when the bidirectional screw rod rotates under the driving of the driving source. Under the driving of the driving source, the pair of first clamping arms can move towards or away from each other in the first direction.

[0118] In an embodiment, the first clamping arm mounting seat can be a plurality of mounting seats connected by the first clamping arm driving mechanism, any one of the pair of first clamping arms corresponds to a mounting seat, the driving source is arranged between the pair of first clamping arms, and any first clamping arm can move along the guide structure. When the first silicon rod clamp needs to move as a whole along the guide structure, the driving source of the first clamping arm driving mechanism can be controlled to keep the pair of first clamping arms relatively stationary, at this time, different mounting seats can be kept relatively stationary by the connection of the first clamping arm driving mechanism, and the driving source of the first silicon rod clamp can drive any mounting seat to move along the guide structure to realize the overall movement of the first silicon rod clamp.

[0119] In another embodiment, the first clamping arm driving mechanism comprises a first rack, a second rack and a driving gear. The first rack and the second rack are respectively connected to a first clamping arm. The driving gear is connected to the power output shaft (not shown) of the driving motor and is engaged with the first rack and the second rack. The driving gear is used to drive the pair of first clamping arms to move towards each other when rotating in a forward direction to perform a clamping action, and is used to drive the pair of first clamping arms to move away from each other when rotating in a reverse direction to perform a releasing action.

[0120] In an embodiment of the present application, the first clamping arm is in a rotating structure, for example, the first silicon rod clamp further comprises a first clamping arm rotating mechanism for driving the first clamping arm to rotate. In an embodiment, any clamping part of the at least one pair of first clamping arms or the two clamping parts of the pair of first clamping arms are provided with rotatable structures, which are driven by the first clamping arm rotating mechanism to rotate around the first direction as the axis of the clamping part of the first clamping arm, and the clamped silicon rod rotates around the first direction as the axis. For example, in some examples, the first clamping arm rotating mechanism can be a rotating motor, the clamping parts of the two first clamping arms are provided with rotatable structures, and the clamping parts of the two first clamping arms or the clamping part of one of the first clamping arms are connected with the output shaft of the rotating motor. For example, the clamping parts of the two first clamping arms are respectively connected with a rotating motor, and the clamping parts of the corresponding first clamping arms are driven to rotate by the two rotating motors respectively, or the clamping part of one of the first clamping arms is connected with a rotating motor, and the clamping part of the corresponding first clamping arm is driven to rotate by the rotating motor, and the other clamping part of the first clamping arm is also driven to rotate by the friction and the conduction of the clamped silicon rod.

[0121] In some embodiments of the present application, the clamping portion of the first clamping arm has a contact surface for clamping the silicon rod. When the clamping end of the silicon rod is a two end surface at both ends of the elongated structure, the contact surface of the clamping portion can be provided as a contact surface in the direction of the plumb line or a contact surface including a plane in the direction of the plumb line. The contact surface is provided on a rotatable platform, and the cross section of the platform can be provided as a regular geometric shape or an irregular geometric shape.

[0122] In an embodiment of the present application, the rotatable platform can be provided as a whole hinged by a hinge device with locking function, and can be rotated along the axis of the first direction. The axis of the rotation axis is connected to the first clamping arm rotating mechanism.

[0123] In an embodiment of the present application, the clamping portion of the first clamping arm can be provided as a rotatable circular platform, and the circular plane of the circular platform is in contact with the end surface of the silicon rod and remains relatively stationary after being in close contact with the end surface of the silicon rod. The clamping portion further includes a locking structure, and the clamping portion is in a locked state when performing corresponding work on the silicon rod (the work can be, for example, cutting, grinding, chamfering, etc.). In the switching of the silicon rod, such as the switching of the cutting position or the switching of the grinding surface, the clamping portion is rotated along the center of the circular platform under the driving of the first clamping arm rotating mechanism.

[0124] In an embodiment, the clamping portion of the first clamping arm includes a rotatable circular platform and a series of protruding contacts provided on the circular platform, and each contact has a contact surface. The circular platform is rotated under the driving of the first clamping arm rotating mechanism, and in an implementation of the present embodiment, the protruding length of the contact, i.e., the position in the first direction, can be adjusted, so that during the clamping of the silicon rod, for the silicon rod with a lower flatness of the end surface, the protruding length of the contact can be adjusted according to the end surface of the silicon rod, so that each contact surface is in close contact with the end surface of the silicon rod. The protruding length is the length in the first direction from the circular plane of the circular platform to the contact surface of the contact.

[0125] In an embodiment of the present application, the clamping portion of the first silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact points based on the detected pressure state. Generally, during the clamping of the silicon rod, the pair of first clamping arms of the first silicon rod clamp is driven by the first clamping arm driving mechanism to move towards each other along a first direction until the contact surface of the clamping portion contacts the end surface of the silicon rod to be clamped. When the clamping portion is provided with a plurality of contact points and it is detected that the pressure value of the contact between part of the contact points and the end surface of the contacted silicon rod is less than a set value or set range, the clamping degree can be changed by adjusting the protruding length of the contact points (generally in the direction of approaching the end surface of the silicon rod). Alternatively, each clamping portion of the pair of first clamping arms is provided with a contact surface. During the clamping of the silicon rod, the first clamping arm driving mechanism drives the pair of first clamping arms to move towards each other along the end surface of the silicon rod to achieve that, after the clamping portion contacts the end surface of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor. When the set pressure range is reached, the first clamping arm driving mechanism controls the movement of the pair of first clamping arms to stop.

[0126] The first clamping arm rotating mechanism can be provided on one of the pair of first clamping arms (the other first clamping arm only has rotating function) to drive the clamping portion of the pair of first clamping arms to rotate with the clamped silicon rod. Alternatively, the first clamping arm rotating mechanism is provided on each of the pair of first clamping arms and cooperatively controls the two clamping portions of the pair of first clamping arms to rotate by the same angle and direction. In some implementations, the first clamping arm rotating mechanism can be provided as a driving motor.

[0127] During the cutting of the silicon rod by the silicon rod cutting device, the clamping portion can be driven to rotate by the first clamping arm rotating mechanism. Generally, during the cutting of the single crystal silicon rod, the first clamping arm rotating mechanism controls the clamping portion to rotate by a certain angle, for example 90°, to cut one side or opposite two sides of the silicon rod by the silicon rod cutting device.

[0128] When the different sides of the silicon rod are ground or the edges are chamfered by the silicon rod cutting and grinding all-in-one machine, the clamping part is rotated by the first clamping arm rotating mechanism to achieve. Generally, for the single crystal silicon rod after being opened, when the different sides are ground, the first clamping arm rotating mechanism can control the clamping part to rotate by a certain angle, for example, 90°, to achieve, and when the different edges are chamfered, the clamping part can be controlled to rotate by a certain angle, for example, 45°, 135°, etc. to achieve. In the case that the grinding surface provided by the grinding device is planar, when chamfering the silicon rod, the first clamping arm rotating mechanism can control the clamping part to rotate by different angles with the silicon rod clamped thereby to achieve multiple chamfering, for example, after the grinding of one side of the silicon rod is completed, one edge adjacent to the side and the edge opposite to the edge can be chamfered by rotating by a certain angle, for example, 40°, 45°, 50°, to obtain a silicon rod with a more smooth transition at the junction of different sides. The angle is the rotation angle from the initial position of grinding. The chamfering manner can be referred to, for example, CN108942570A and other patent disclosure documents, by driving the silicon rod to rotate by a certain angle, and the grinding tool is matched to achieve grinding in the second direction.

[0129] In an embodiment of the present application, the first silicon rod clamp is a lifting type silicon rod clamp. In an implementation, the first silicon rod clamp includes a lifting guide rail and a driving device in the lifting direction, and the first clamping arm of the first silicon rod clamp and the clamping arm guide rail carrying the first clamping arm on the first clamping arm mounting seat can move along the lifting guide rail in the third direction (i.e., the direction of the perpendicular line), which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the direction of the perpendicular line, so as to select the cutting area of the cutting region of the silicon rod cutting device for cutting or select the grinding area of the grinding tool for grinding. In an implementation of the embodiment, the lifting guide rail is arranged on the vertical surface of the first clamping arm mounting seat, and a guide groove matched with the lifting guide rail and a driving mechanism driving the lifting movement of the first clamping arm are correspondingly arranged on the first clamping arm; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected with the traveling motor, and the traveling screw is driven by the traveling motor to move the first clamping arm in the third direction. In another implementation, each first clamping arm of the pair of first clamping arms is arranged as a telescopic device, and simultaneously performs the lifting movement under the driving of the telescopic driving mechanism.

[0130] Regarding the first transfer driving mechanism, the first transfer driving mechanism includes a first transfer guide rail and a first transfer driving unit, wherein the first transfer guide rail is arranged along a first direction for arranging the first clamping arm mounting seat, and the first transfer driving unit is used to drive the first clamping arm mounting seat and at least one pair of first clamping arms thereof to move along the first transfer guide rail.

[0131] The first transfer driving unit comprises a first moving rack, a first driving gear and a first driving source. The first moving rack is arranged along the first direction and parallel to the first transfer rail. In an embodiment, the first moving rack is fixed on the upper surface, side surface or lower surface of the mounting frame and arranged with approximately the same first direction dimension as the first transfer rail, parallel and adjacent to the first transfer rail.

[0132] The first driving gear is arranged on the first silicon rod clamp and engaged with the first moving rack to drive the movement of the first silicon rod clamp along the first transfer rail. The first driving source is used to drive the first driving gear. In an implementation of the present application, the first driving gear is arranged on the first clamp arm mounting seat of the first silicon rod clamp. The first driving gear is driven to rotate by the first driving source. The teeth of the first driving gear are engaged with the first moving rack to travel along the first moving rack. The first silicon rod clamp connected with the first driving gear is thereby moved correspondingly on the first transfer rail.

[0133] In an embodiment of the present application, the first transfer driving unit can be arranged on the first silicon rod clamp and comprises a first moving screw rod and a first driving source. The first moving screw rod is arranged along the first direction and associated with the first clamp arm mounting seat. The first driving source is used to drive the first moving screw rod to rotate so as to move the associated first clamp arm mounting seat and at least one pair of first clamp arms along the first transfer rail.

[0134] In an implementation of the present embodiment, the first driving source can be arranged as a driving motor. The power output shaft of the driving motor is connected with the first driving gear to control the movement state of the first driving gear, and in turn, the first driving source controls the movement of the first silicon rod clamp and the silicon rod clamped thereby in the first direction.

[0135] Regarding the second transfer device, in the present application, the second transfer device arranged in the second transfer channel comprises a second silicon rod clamp and a second transfer driving mechanism. The second silicon rod clamp is used to clamp a silicon rod. The silicon rod is clamped by the second silicon rod clamp in a horizontal manner, i.e., the silicon rod is clamped with the axis line consistent with the first direction. The second transfer driving mechanism is used to drive the second silicon rod clamp and the silicon rod clamped thereby to move along the first direction and transfer between the second processing position and the second processing position. The second transfer driving mechanism further comprises a second transfer rail and a second transfer driving unit. The second transfer rail is arranged along the first direction and used to arrange the second silicon rod clamp. The second transfer driving unit is used to drive the second silicon rod clamp and the silicon rod clamped thereby to move along the second transfer rail.

[0136] The second silicon rod clamp comprises a second clamp arm mounting seat, at least one pair of second clamp arms are arranged on the second clamp arm mounting seat and face each other in the first direction, and are used for clamping two end faces of a silicon rod. At least one second clamp arm of the at least one pair of second clamp arms can be moved along the first direction by a second clamp arm driving mechanism to adjust the clamping spacing between the at least one pair of second clamp arms.

[0137] In some embodiments of the present application, as shown in Figure 4 The second silicon rod clamp 31 is arranged above the second clamp arm mounting seat 311, and the second clamp arm mounting seat 311 is mounted on the mounting frame. The second clamp arm 313 is suspended from the second clamp arm mounting seat 311 and extends below the hollow part of the mounting frame, so that the silicon rod (for example, the silicon rod to be cut 101 or the cut silicon rod) clamped by the second clamp arm 313 is on the processing surface of the silicon rod processing platform.

[0138] The second clamp arm mounting seat is arranged on the second transfer guide rail. In an implementation manner of the present embodiment, the bottom of the second clamp arm mounting seat is provided with a guide groove structure matched with the second transfer guide rail. The second transfer guide rail is arranged in the first direction, and the length range of the second transfer guide rail in the first direction covers at least the positions of the first working area and the second working area in the first direction, so as to ensure the transfer of the silicon rod clamped by the second silicon rod clamp between the two working areas. In an implementation manner of the present embodiment, the second transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.

[0139] The second clamp arm mounting seat is further provided with a second guide structure in the first direction. The at least one pair of second clamp arms are arranged on the second clamp arm mounting seat through the second guide structure and can move in the first direction. In actual application, the second guide structure can be, for example, a second clamp arm guide rail, a second clamp arm guide groove, or a second clamp arm guide rod, etc.

[0140] The at least one pair of second clamp arms are arranged to face each other in the first direction and are used for clamping two end faces of a silicon rod.

[0141] For the silicon rod to be cut, the silicon rod is a cylindrical structure with a certain length, and the length direction is placed along the first direction. The end face is the cross section at both ends of the length direction. For the cut silicon rod, the silicon rod is a cuboid structure (the cross section is rectangular or similar) with a certain length, and the length direction is placed along the first direction. The end face is the cross section at both ends of the length direction.

[0142] The second clamping arm is hung from a second clamping arm mounting seat, and includes a clamping portion below the second clamping arm for directly contacting and clamping the silicon rod. As shown in Figure 4 One end of the second clamping arm 313 is connected to the second clamping arm mounting seat 311, and the other end of the second clamping arm 313 is connected with a clamping portion 315 for contacting the end face of the silicon rod (for example, the silicon rod to be cut 101 or the cut silicon rod). The second clamping arm mounting seat 311 is movably arranged on the second transfer guide and moves along the second transfer guide under the drive of the second transfer drive unit, thereby driving the second clamping arm 313 to move along the second transfer guide.

[0143] The second silicon rod clamp further includes a second clamping arm drive mechanism, which can drive at least one second clamping arm of the at least one pair of second clamping arms to move along the first direction, so as to adjust the clamping spacing between the pair of oppositely arranged second clamping arms. Thus, the clamping portions of the at least one pair of second clamping arms can approach or move away from each other under the action of the second clamping arm drive mechanism, so as to perform the clamping or releasing action on the silicon rod. For example, the clamping portions of the two second clamping arms oppositely arranged along the first direction approach each other under the drive of the second clamping arm drive mechanism to clamp the silicon rod, and keep the clamped state to transfer and process the silicon rod between different working areas. After the processing of the silicon rod is completed, the silicon rod is transferred to the carrying position, and then the clamping portions of the two second clamping arms move away from each other under the drive of the second clamping arm drive mechanism to release the processed silicon rod.

[0144] In some embodiments of the present application, the second clamping arm drive mechanism includes a drive motor, a drive gear and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks are engaged with the opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven to move at a linear speed in opposite directions of the two ends of the gear, and thus the pair of racks approach or move away from each other. In one implementation of the present embodiment, one end of each rack of the pair of racks is engaged with the drive gear, and the other end of each rack is connected with a second clamping arm, respectively. Thus, the at least one pair of second clamping arms move away from or approach each other along the second clamping arm mounting seat guide in the first direction.

[0145] In some embodiments of the present application, the second clamping arm drive mechanism includes a lead screw and a driving source. The lead screw is arranged along the first direction and associated with any second clamping arm of the pair of second clamping arms. The driving source is connected with the lead screw, and is used to drive the lead screw to rotate so as to drive the associated second clamping arm to move along the first direction.

[0146] The second clamping arm driving mechanism has a screw rod with a distal end and a proximal end. In a specific implementation, the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to any one of the second clamping arms. Through the connection of the two ends of the screw rod, the screw rod can rotate based on the transmission of the driving source and convert the rotation of the screw rod into axial displacement through the threaded connection. The axial displacement direction is the setting direction of the screw rod, i.e., the first direction. The movement of the second clamping arm connected to the distal end of the screw rod in the first direction can be realized by driving the screw rod to rotate through the driving source. The rotation direction of the screw rod driven to rotate can change, so that the associated second clamping arm can advance or retreat in the first direction.

[0147] In some embodiments of the present application, the second clamping arm driving mechanism includes a bidirectional screw rod arranged in the first direction and threadedly connected to the at least one pair of second clamping arms at both ends, and a driving source for driving the screw rod to rotate so that the at least one pair of second clamping arms move towards or away from each other in the first direction.

[0148] In an implementation, the bidirectional screw rod of the second clamping arm driving mechanism is threadedly connected to the pair of second clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod with opposite thread directions at both ends. The driving source can be arranged at any one end of the bidirectional screw rod or connected to the bidirectional screw rod to drive the bidirectional screw rod to rotate along the screw rod axis. Through the opposite threads at both ends of the bidirectional screw rod, the movement of both ends of the bidirectional screw rod is converted into linear motion in the opposite directions along the screw rod axis and in the first direction when the bidirectional screw rod is driven to rotate. Under the driving of the driving source, the pair of second clamping arms can move towards or away from each other in the first direction.

[0149] In an implementation, the second clamping arm mounting seat can be a plurality of mounting seats connected by the second clamping arm driving mechanism. Any one of the pair of second clamping arms corresponds to a mounting seat, and the driving source is arranged between the pair of second clamping arms, in which any second clamping arm can move along the guide structure. When the second silicon rod clamp needs to move as a whole along the guide structure, the driving source of the second clamping arm driving mechanism can be controlled to keep the pair of second clamping arms relatively stationary. At this time, different mounting seats can be kept relatively stationary through the connection of the second clamping arm driving mechanism. The power source of the second silicon rod clamp can drive any mounting seat to move along the guide structure, so that the second silicon rod clamp moves as a whole.

[0150] In another implementation, the second clamping arm drive mechanism includes a first rack, a second rack, and a drive gear; the first rack and the second rack are respectively linked to a second clamping arm, and the drive gear is connected to the power output shaft of the drive motor (not shown) and meshes with the first rack and the second rack. The drive gear is used to drive the pair of second clamping arms to move towards each other to perform a clamping action when rotating in the forward direction, and to drive the pair of second clamping arms to move away from each other to perform a releasing action when rotating in the reverse direction.

[0151] In one embodiment of this application, the second clamping arm has a rotary structure. For example, the second silicon rod clamp further includes a second clamping arm rotation mechanism for driving the second clamping arm to rotate. In one implementation of this embodiment, any one clamping part of the at least one pair of second clamping arms or both clamping parts of a pair of second clamping arms are provided with a rotatable structure. Driven by the second clamping arm rotation mechanism, the clamping part of the second clamping arm rotates about the length direction of the silicon rod, i.e., the first direction, as the axis, and the clamped silicon rod rotates accordingly about the first direction as the axis. For example, in some examples, the second clamping arm rotation mechanism may be a rotary motor, wherein the clamping parts of both second clamping arms in the pair of second clamping arms are provided with rotatable structures, and the clamping parts of the two second clamping arms or one of the clamping parts of the second clamping arms are connected to the output shaft of the rotary motor. For example, the clamping parts of the two second clamping arms are each connected to a rotary motor, and the two rotary motors drive the corresponding clamping parts of the second clamping arms to rotate, or the clamping part of one of the second clamping arms is connected to a rotary motor, and the rotary motor drives the clamping part of the corresponding second clamping arm to rotate, and by means of friction, through the conduction of the clamped silicon rod, the clamping part of the other second clamping arm also rotates accordingly.

[0152] In some embodiments of this example, the clamping portion of the at least one pair of second clamping arms has a contact surface for clamping the silicon rod. When the clamping end of the silicon rod is two end faces at both ends of an elongated structure, the contact surface of the clamping portion can be configured as a contact surface in the direction of the perpendicular or a contact surface including a plane in the direction of the perpendicular. The contact surface is disposed on a rotatable platform, and the cross-section of the platform can be configured as a custom regular geometry or an irregular geometry.

[0153] In one embodiment of this application, the rotatable platform may be configured as a whole hinged together by a hinge device with a locking function, and may rotate along an axis in a first direction. The axis of rotation is connected to the second clamping arm rotating mechanism.

[0154] In an embodiment of the present application, the clamping portion of the second clamping arm is provided as a rotatable circular platform, the circular plane of the circular platform is in contact with the end face of the silicon rod and remains relatively static after being in contact with the end face of the silicon rod. The clamping portion further comprises a locking structure, the clamping portion is in a locked state when the silicon rod is subjected to a corresponding work operation (the work operation can be, for example, cutting, surface grinding, chamfering, etc.). In the switching of the silicon rod, for example, the switching of the cutting position or the switching of the grinding surface, the clamping portion is rotated along the center of the circular platform under the driving of the second clamping arm rotating mechanism.

[0155] In an embodiment, the clamping portion of the second clamping arm comprises a rotatable circular platform and a series of protruding contacts provided on the circular platform, each contact has a contact plane. The circular platform is rotated under the driving of the second clamping arm rotating mechanism, in an implementation of the embodiment, the protruding length of the contact, i.e., the position in the first direction, is adjustable, so that during the clamping of the silicon rod, for the silicon rod with a lower flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact plane is in close contact with the end face of the silicon rod. The protruding length is the length in the first direction from the circular plane of the circular platform to the contact plane of the contact.

[0156] In an embodiment of the present application, the clamping portion of the second silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, during the clamping of the silicon rod, a pair of second clamping arms of the second silicon rod clamp are driven by the second clamping arm driving mechanism to move towards each other in the first direction until the contact planes of the clamping portions are in contact with the end faces of the silicon rod to be clamped. When the clamping portion is provided with a plurality of contacts and it is detected that the pressure value of the contact between some contacts and the end face of the contacted silicon rod is less than a set value or a set range, the clamping degree can be changed by adjusting the protruding length of the contact (generally in the direction close to the end face of the silicon rod); alternatively, each clamping portion of a pair of second clamping arms is provided as a contact plane, during the clamping of the silicon rod, a pair of second clamping arms are driven by the second clamping arm driving mechanism to move towards each other to achieve the end faces of the silicon rod, after the clamping portion is in contact with the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the second clamping arm driving mechanism controls the movement of the pair of second clamping arms to stop.

[0157] The second clamping arm rotating mechanism can be provided on one of the pair of second clamping arms (the other second clamping arm only has a rotating function) to drive the clamping portions of the pair of second clamping arms to rotate with the clamped silicon rod; or the second clamping arm rotating mechanism is provided on each of the pair of second clamping arms and cooperatively controls the two clamping portions of the pair of second clamping arms to rotate by the same angle and direction. In some implementations, the second clamping arm rotating mechanism can be provided as a driving motor.

[0158] In the process of cutting the silicon rod by the silicon rod cutting device, the rotation of the clamping part can be driven by the second clamping arm rotation mechanism. In the process of cutting a single crystal silicon rod, the second clamping arm rotation mechanism can control the rotation of the clamping part by an angle of 90°, so that the silicon rod cutting device can cut one side or two opposite sides of the silicon rod.

[0159] In the process of grinding the different sides of the silicon rod or chamfering the edges of the silicon rod by the silicon rod cutting and grinding all-in-one machine, the rotation of the clamping part can be driven by the second clamping arm rotation mechanism. In the process of grinding the different sides of a single crystal silicon rod, the second clamping arm rotation mechanism can control the rotation of the clamping part by an angle of 90°, so that the grinding device can grind the different sides of the silicon rod. In the process of chamfering the different edges of the silicon rod, the second clamping arm rotation mechanism can control the rotation of the clamping part by an angle of 45°, 135°, etc. In the case where the grinding surface provided by the grinding device is a plane, in the process of chamfering the silicon rod, the second clamping arm rotation mechanism can control the rotation of the clamping part and the silicon rod clamped thereby by different angles to achieve multiple chamfering, for example, after the grinding of one side of the silicon rod is completed, one edge adjacent to the side and the edge opposite to the edge can be chamfered by an angle of 40°, 45°, 50°, etc., so that the transition at the junction of the different sides of the silicon rod is smoother. The angle is the rotation angle from the initial position of the grinding. The chamfering method can refer to the patent disclosure such as CN108942570A, etc., the grinding of the edge is achieved by driving the silicon rod to rotate by an angle and the grinding tool to move in the second direction.

[0160] In an embodiment of the present application, the second silicon rod clamp is a lifting type silicon rod clamp. In an implementation, the second silicon rod clamp includes a lifting guide rail and a driving device in the lifting direction, the second clamping arm of the second silicon rod clamp and the clamping arm guide rail carrying the second clamping arm on the second clamping arm mounting seat can move in the third direction along the lifting guide rail, which can be used to control the relative position of the outer surface of the silicon rod and the silicon rod cutting device or the silicon rod grinding device in the vertical direction, so as to select the cutting surface of the silicon rod and the cutting area of the silicon rod cutting device for cutting, or select the grinding surface of the silicon rod and the grinding area of the grinding tool for grinding. In an implementation of the embodiment, the lifting guide rail is arranged on the vertical surface of the second clamping arm mounting seat, and a guide groove matched with the lifting guide rail and a driving mechanism driving the second clamping arm to move up and down are arranged on the second clamping arm correspondingly; the driving mechanism includes a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected with the traveling motor, and the traveling screw is driven by the traveling motor to move the second clamping arm in the third direction. In another implementation, each second clamping arm of the pair of second clamping arms is arranged as a telescopic device, and the telescopic device moves up and down simultaneously under the driving of the telescopic driving mechanism.

[0161] The second transfer driving mechanism comprises a second transfer rail and a second transfer driving unit. The second transfer rail is arranged along the first direction and is used to arrange the second clamping arm mounting seat. The second transfer driving unit is used to drive the second clamping arm mounting seat and at least one pair of second clamping arms to move along the second transfer rail.

[0162] The second transfer driving unit comprises a second moving rack, a second driving gear and a second driving source. The second moving rack is arranged along the first direction and is parallel to the second transfer rail. In an embodiment, the second moving rack is fixed on the upper surface, the side surface or the lower surface of the mounting frame and is arranged to have approximately the same first direction dimension as the second transfer rail, and is arranged in parallel and adjacent to the second transfer rail.

[0163] The second driving gear is arranged on the second silicon rod clamp and is engaged with the second moving rack to drive the second silicon rod clamp to move along the second transfer rail. The second driving source is used to drive the second driving gear. In an implementation of the present application, the second driving gear is arranged on the second clamping arm mounting seat of the second silicon rod clamp. The second driving gear is driven to rotate by the second driving source. The teeth of the second driving gear are engaged with the second moving rack to travel along the second moving rack. The second silicon rod clamp connected with the second driving gear is thus moved on the second transfer rail.

[0164] In an embodiment of the present application, the second transfer driving unit can be arranged on the second silicon rod clamp and comprises a second moving screw and a second driving source. The second moving screw is arranged along the first direction and is associated with the second clamping arm mounting seat. The second driving source is used to drive the second moving screw to rotate to drive the associated second clamping arm mounting seat and at least one pair of second clamping arms to move along the second transfer rail.

[0165] In an implementation of the present embodiment, the second driving source can be arranged as a driving motor. The power output shaft of the driving motor is connected with the second driving gear to control the movement state of the second driving gear, and the second driving source thus controls the movement of the second silicon rod clamp and the silicon rod clamped thereby in the first direction.

[0166] The second transfer guide rail in the second transfer device and the first transfer guide rail in the first transfer device are both arranged in parallel along the first direction, and the first silicon rod clamp in the first transfer device and the second silicon rod clamp in the second transfer device move along the paths defined by the first transfer guide rail and the second transfer guide rail, respectively. When the first silicon rod clamp and the silicon rod clamped thereby are transferred between different processing positions, the second silicon rod clamp and the silicon rod clamped thereby can also be transferred between different processing positions, and the movements of the first silicon rod clamp and the second silicon rod clamp are independent of each other. The first transfer guide rail and the second transfer guide rail are arranged at different spatial positions and do not interfere with each other. In an embodiment of the present application, the machine base of the silicon rod cutting and grinding all-in-one machine and the top view of the mounting frame are both regular rectangles. The first transfer guide rail and the second transfer guide rail are both arranged along the first direction and are arranged in parallel and symmetrically. The symmetry line is the center axis of the machine base in the first direction.

[0167] As can be seen from the above, the first transfer device and the second transfer device are used to control the movement of the silicon rod. For example, the first transfer device clamps the silicon rod and drives the silicon rod to move along the first direction, and the second transfer device clamps the silicon rod and drives the silicon rod to move along the first direction. Thus, any silicon rod can be moved relative to the silicon rod cutting device located at the first processing position or the grinding device located at the second processing position along the first direction to perform a preset cutting operation or grinding operation.

[0168] In the silicon rod cutting and grinding all-in-one machine of the present application, the silicon rod cutting device is arranged at the first processing position of the silicon rod processing platform and is used to perform a cutting operation on the silicon rod clamped by the first transfer device on the first transfer channel or the silicon rod clamped by the second transfer device on the second transfer channel.

[0169] The silicon rod cutting device includes a plurality of cutting wheels and a cutting wire saw formed by winding the plurality of cutting wheels. The first silicon rod clamp or the second silicon rod clamp drives the silicon rod to move along the first direction. Thus, the silicon rod cutting device can be set in a fixed state when performing a cutting operation to realize the relative feeding between the cutting wire saw and the silicon rod. In a conventional silicon rod cutting and grinding all-in-one machine, the cutting wire saw needs to be moved in space to cut the silicon rod. Therefore, a driving device and a guide structure need to be configured for the cutting wheels and the cutting wire to realize the feeding of the cutting wire saw relative to the silicon rod. In the present application, the structure of the silicon rod cutting device can be simplified. The cutting wheels can be fixed to the main body of the silicon rod cutting device, such as a cutting frame, and the guide structure and the driving device for moving the cutting wheels along the axis of the silicon rod can be omitted. Thus, the structure of the silicon rod cutting device and the space occupied by the silicon rod cutting device can be reduced.

[0170] The silicon rod cutting device is arranged at the first machining position of the silicon rod machining platform, and is used for cutting the silicon rod to be cut clamped by the first transfer device on the first transfer channel or the silicon rod to be cut clamped by the second transfer device on the second transfer channel.

[0171] In some embodiments, the silicon rod cutting device comprises a cutting frame, at least one wire cutting unit, and a cutting conversion mechanism; wherein the at least one wire cutting unit is arranged on the cutting frame, and the cutting conversion mechanism is used for driving the cutting frame and the at least one wire cutting unit thereon to convert between the first transfer channel and the second transfer channel.

[0172] The at least one wire cutting unit is arranged on the cutting frame, and the wire cutting unit comprises a plurality of cutting wheels, a transition wheel, and a cutting wire, wherein the cutting wire is wound around the plurality of cutting wheels and the transition wheel to form at least one wire saw.

[0173] The cutting frame is used for arranging the wire cutting unit, wherein the specific structure of the cutting frame can be different forms based on the arrangement requirements of the cutting wheels and the transition wheel, such as a column, a beam, or a rack.

[0174] In some embodiments, the plurality of cutting wheels and the transition wheel in the wire cutting unit are connected to the cutting frame, or the plurality of cutting wheels and the transition wheel are arranged on the cutting frame through a support, a connecting plate, or a mounting frame, wherein the carrier for arranging the plurality of cutting wheels and the transition wheel can be different forms, which are not limited in the present application.

[0175] Please refer to Figure 5 , which shows a schematic diagram of the silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine in an embodiment.

[0176] In some embodiments, as shown in the embodiment of Figure 5 , the silicon rod cutting device 4 comprises a cutting frame 41, at least one wire cutting unit 43, and a cutting conversion mechanism, wherein the wire cutting unit 43 is arranged on the cutting frame 41 through a wire cutting support 430. Herein, the wire cutting support 430 serves as a carrier for associating the plurality of cutting wheels and the transition wheel in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam, a rack, or a support, etc.

[0177] In an implementation, the wire cutting support is arranged on the cutting frame through a guide structure such as a guide rail or a guide column, wherein the guide rail or the guide column is arranged along the perpendicular direction of the wheel surface of the cutting wheel in the wire cutting unit, so that the wire cutting unit arranged has the freedom of moving along the perpendicular direction of the wheel surface of the cutting wheel. Under this arrangement, the wire cutting support can move along the orthogonal direction of the wheel surface of the cutting wheel under the action of the driving source.

[0178] When the wire cutting unit moves along the perpendicular direction of the cutting wheel surface, the cutting wire saw in the wire cutting unit moves along the perpendicular direction of the cutting wheel surface correspondingly, i.e. the cutting wire saw moves away from or approaches the axis of the silicon rod, thereby the cutting amount or cutting position of the silicon rod can be adjusted.

[0179] The cutting wheel is provided with at least one cutting wire groove for winding the cutting wire, and the cutting wire groove can define the position of the cutting wire to control the cutting precision. Any cutting wire saw is formed by winding the cutting wire between two cutting wheels, and the position of the two cutting wheels and the positional relationship between the two cutting wheels can be used to determine the direction of the cutting wire saw.

[0180] The transition wheel is used to reverse or guide the cutting wire, or the transition wheel can be used to adjust the tension of the cutting wire.

[0181] In the silicon rod cutting and grinding all-in-one machine of the present application, during the cutting process, the cutting wire is driven to run in the winding direction, and the silicon rod held by the first silicon rod clamp or the second silicon rod clamp is moved along the axial direction of the silicon rod, i.e. the first direction, to realize the feeding relative to the cutting wire saw, wherein the cutting wire saw can be arranged in the second direction or the perpendicular direction.

[0182] It should be noted that the direction of the cutting wire saw can only realize cutting when it is orthogonal to the axial direction of the silicon rod, and therefore, in specific scenarios, the direction of the cutting wire saw can be located in the perpendicular plane of the first direction. In order to facilitate the control of the cutting amount of the silicon rod and the arrangement of the cutting wheel and the transition wheel, and to facilitate the description of the structure and the arrangement of the components of the silicon rod cutting device of the present application, the following embodiments will be described by taking the cutting wire saw arranged in the second direction or the perpendicular direction as an example.

[0183] In an embodiment, the wire cutting unit comprises: a cutting wire; a first cutting wheel and a second cutting wheel arranged in the cutting frame, and the cutting wire is wound around the first cutting wheel and the second cutting wheel to form a cutting wire saw; wherein the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; a first transition wheel adjacent to the first cutting wheel, and in the state of pulling the cutting wire, the cutting wire between the first cutting wheel and the first transition wheel is located in the plane of the first cutting wire groove in the first cutting wheel for winding the cutting wire; a second transition wheel adjacent to the second cutting wheel, and in the state of pulling the cutting wire, the cutting wire between the second cutting wheel and the second transition wheel is located in the plane of the second cutting wire groove in the second cutting wheel for winding the cutting wire; at least one third transition wheel arranged between the first transition wheel and the second transition wheel, used to pull the cutting wire between the first transition wheel and the second transition wheel, so as to form a cutting accommodation space in the wire cutting unit, and the cutting accommodation space can accommodate the silicon rod to be cut, and only the cutting wire saw and the cutting accommodation space intersect in the silicon rod cutting device.

[0184] The direction of the cutting wheel surface corresponds to the direction of the wire saw. It should be understood that the cutting wheel surface is parallel to the plane containing any cutting groove in the cutting wheel. To control the cutting accuracy and the stability of the cutting process, the wire saw should be located in the plane containing the cutting groove used to wind the cutting wire. At the same time, during the cutting process, the direction of the force applied by the silicon rod to the cutting wire should be parallel to the cutting groove, that is, the cutting wheel surface is parallel to the cutting direction. The cutting direction in the squaring operation is the direction of the silicon rod's axis.

[0185] In the silicon rod cutting device of this application, the cutting wire saw is located in the second direction or the direction of the double vertical line. Correspondingly, the surface of the cutting wheel is parallel to the second direction and the direction of the silicon rod axis, that is, the surface of the cutting wheel is located in the horizontal plane direction, or the surface of the cutting wheel is parallel to the direction of the double vertical line and the direction of the silicon rod axis, that is, the surface of the cutting wheel is located in the vertical plane direction.

[0186] The silicon rod cutting device includes two wire cutting units arranged opposite each other, each wire cutting unit having at least one wire saw; therefore, the two wire cutting units form at least two parallel wire saws. Figure 5 In the example shown, the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other along the second direction. Each wire cutting unit 43 has a wire saw 439. The wire saw 439 can be arranged in the perpendicular direction. Thus, the two wire saws 439 belonging to the two wire cutting units 43 are both arranged in the perpendicular direction.

[0187] Please see Figure 6 Displayed as Figure 5 A schematic diagram of the centerline cutting unit. Figure 6 In the example shown, any of the wire cutting units 43 includes a first cutting wheel 431 and a second cutting wheel 433, and a cutting wire 438 is wound around the first cutting wheel 431 and the second cutting wheel 433 to form a wire saw 439.

[0188] The first cutting wheel includes at least one first cutting groove, and the plane in which any of the first cutting grooves is located is parallel to the surface of the first cutting wheel; the second cutting wheel includes at least one second cutting groove, and the plane in which any of the second cutting grooves is located is parallel to the surface of the second cutting wheel.

[0189] The wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel, so that the cutting line is in the same plane when wound around the first cutting wheel and the second cutting wheel, respectively, and the first cutting line groove and the second cutting line groove for winding the cutting line are in the same plane, so that the direction of the cutting line saw is in the plane of the first cutting line groove and the second cutting line groove for winding the cutting line. It should be understood that the cutting line is in a running state during cutting, so the space position of the cutting line saw is defined. In the embodiments of the present application, the cutting line wound between the first cutting wheel and the second cutting wheel is the cutting line saw.

[0190] It should be understood that when the cutting line is wound around any cutting wheel, the cutting line on both sides of the cutting wheel should be in the plane of the cutting line groove in the cutting wheel for winding the cutting line.

[0191] When the cutting line is wound around the first cutting wheel, the cutting line at one end of the first cutting line groove is wound around the second cutting wheel to form a cutting line saw, and the cutting line at the other end of the first cutting line groove is wound around the first transition wheel. As shown in Figure 6 The first transition wheel 432 is adjacent to the first cutting wheel 431, and in the state of pulling the cutting line around the first cutting wheel 431, the cutting line around the first cutting wheel 431 is in the plane of the first cutting line groove in the first cutting wheel 431 for winding the cutting line.

[0192] When the cutting line is wound around the second cutting wheel, the cutting line at one end of the second cutting line groove is wound around the first cutting wheel to form a cutting line saw, and the cutting line at the other end of the second cutting line groove is wound around the second transition wheel. As shown in Figure 6 The second transition wheel 434 is adjacent to the second cutting wheel 433, and in the state of pulling the cutting line around the second cutting wheel 433, the cutting line around the second cutting wheel 433 is in the plane of the second cutting line groove in the second cutting wheel 433 for winding the cutting line.

[0193] The first transition wheel and the second transition wheel each have at least one guide groove for pulling the cutting line. The first transition wheel and the second transition wheel are respectively adjacent to the first cutting wheel and the second cutting wheel, and here, the adjacent can be left, right, top, bottom, etc., which is not limited in the present application.

[0194] It should be understood that when the cutting line is wound around any cutting wheel or transition wheel, the direction of the cutting line wound around the cutting wheel or the transition wheel is the tangent direction of the corresponding cutting line groove or guide groove.

[0195] As Figure 6As shown, the at least one third transition wheel 436 is arranged between the first transition wheel 432 and the second transition wheel 434 to pull the cutting wire between the first transition wheel 432 and the second transition wheel 434, so as to form a cutting accommodation space in the wire cutting unit, which can accommodate the to-be-cut silicon rod and only the cutting wire saw intersects with the cutting accommodation space in the silicon rod cutting device.

[0196] In the cutting operation, the first silicon rod clamp or the second silicon rod clamp drives the clamped silicon rod to feed along the axial line of the silicon rod relative to the cutting wire saw, and the cutting accommodation space is the movement range of the silicon rod from the beginning of contacting the cutting wire to moving to the cutting wire penetrating the silicon rod to form a skin.

[0197] The cutting accommodation space can accommodate the to-be-cut silicon rod and only the cutting wire saw intersects with the cutting accommodation space in the silicon rod cutting device. It should be understood that, in the cutting process, the first silicon rod clamp or the second silicon rod clamp and the to-be-cut silicon rod clamped thereby collide with other components in the silicon rod cutting machine including the cutting wire (the cutting wire here excludes the cutting wire saw) in the movement, which is a problem to be avoided; at the same time, in order to achieve cutting, the cutting wire saw feeds relative to the silicon rod in the movement of the first silicon rod clamp or the second silicon rod clamp clamping the silicon rod, and therefore, it should be ensured that the cutting accommodation space includes and only includes the silicon rod and the cutting wire saw.

[0198] The first transition wheel, the second transition wheel, and the at least one third transition wheel can be used to pull the cutting wire, and the third transition wheel is used to pull the cutting wire between the first transition wheel and the second transition wheel to form the cutting accommodation space.

[0199] In some embodiments, the first transition wheel, the second transition wheel, and the at least one third transition wheel are used to pull the cutting wire away from the to-be-cut silicon rod. It should be understood that the cutting wire between the first cutting wheel and the first transition wheel and the cutting wire between the second cutting wheel and the second transition wheel are located in the plane of the first cutting wire groove (or the second cutting wire groove) for winding the cutting wire. In order to form the cutting accommodation space, in one implementation, the length of the cutting wire between the first cutting wheel and the first transition wheel and the length of the cutting wire between the second cutting wheel and the second transition wheel are long enough, for example, greater than the length of the to-be-cut silicon rod, but in this arrangement, the cutting frame occupies too much space of the device, and the layout is unreasonable.

[0200] In some embodiments, the first transition wheel, the second transition wheel, and the at least one third transition wheel are used to pull the cutting wire away from the cutting accommodation space.

[0201] This application provides an implementation method for forming the cutting and receiving space using a first transition wheel, a second transition wheel, and a third transition wheel. In one implementation, the surface of at least one of the first, second, and third transition wheels forms a certain angle with the surface of the first or second cutting wheel, so that the cutting line deviates from the plane where the first (or second) cutting groove for winding the cutting line is located. To optimize the overall structural layout of the silicon rod cutting device and the silicon rod cutting and grinding integrated machine, the direction of deviation can be selected as a direction away from the cutting and receiving space.

[0202] Taking the silicon rod cutting device as an example, which includes two wire cutting units arranged opposite each other, as shown in the figure... Figure 6 In the illustrated embodiment, by setting the first transition wheel 432, the second transition wheel 434, and the third transition wheel 436 to be tilted toward the direction away from the cutting and receiving space, or by setting each transition wheel on the side of the cutting frame away from the cutting and receiving space, the cutting line can be moved away from the cutting and receiving space. Under this layout, the equipment space required for the wire cutting unit can be effectively reduced, which is beneficial to the overall equipment layout of the silicon rod cutting and grinding machine.

[0203] Here, for any of the wire cutting units, the direction away from the cutting receiving space is a vector perpendicular to the cutting wheel surface, so as to... Figure 5 In the illustrated embodiment, the directions of the two opposing wire cutting units 43 that are away from the cutting and receiving space are opposite, as shown by the arrows in the figure.

[0204] In some embodiments, the surface of the first transition wheel may be at a certain angle to the surface of the first cutting wheel, and the surface of the second transition wheel may be at a certain angle to the surface of the second cutting wheel. The orientation of the first transition wheel is such that the cutting line at the other end of the first cutting wheel lies within the intersection of the plane containing the first cutting groove for winding the cutting line and the plane containing the wire groove for winding the cutting line in the first transition wheel; and the orientation of the second transition wheel is such that the cutting line at the other end of the second cutting wheel lies within the intersection of the plane containing the second cutting groove for winding the cutting line and the plane containing the wire groove for winding the cutting line in the second transition wheel.

[0205] By setting the first transition wheel and the second transition wheel to form a certain angle with the wheel surface of the first cutting wheel or the second cutting wheel, wherein the direction of the angle is such that the first transition wheel or the second transition wheel is tilted away from the cutting accommodation space, it is beneficial to reduce the number of the required third transition wheels and to reduce the length of the wire cutting support in the first direction.

[0206] In some embodiments, the cutting wire is wound in a looped manner between the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel, and the third transition wheel to form a closed loop cutting wire. Figure 6 As shown, the cutting wire 438 is a closed loop cutting wire.

[0207] The cutting wheels and transition wheels in the wire cutting unit are wound by a looped cutting wire, and in this example, the wire storage drum can be omitted. The looped cutting wire is driven to cut.

[0208] In the existing silicon rod cutting device, the cutting wire is wound from the wire storage drum to the cutting wheels and transition wheels in the wire cutting unit, and from the wire cutting unit to the wire collection drum. During the cutting operation, the cutting wire is driven to run in an alternating acceleration and deceleration process. In the silicon rod cutting device of the present application, the looped cutting wire in the wire cutting unit can be kept running at a high speed continuously, and at the same time, the looped cutting wire can run in the same direction during the cutting operation. In this way, the wire cutting unit of the present application can achieve high-precision cutting operation, avoiding the problems of the existing cutting method, such as the cutting surface having ripples caused by the change of direction or the running speed of the cutting wire. At the same time, the looped cutting wire can effectively reduce the total length of the cutting wire required by the wire cutting unit, thereby reducing the production cost.

[0209] In some embodiments, the wire cutting unit includes two third transition wheels, wherein the cutting wire is sequentially wound around the first cutting wheel, the second cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form a closed loop cutting wire.

[0210] Please refer to Figure 6 For example, taking the first cutting wheel 431 as the starting point of the looped cutting wire winding, the cutting wire is wound from the first cutting wheel 431 to the second cutting wheel 433 to form a cutting wire saw 439 between the two cutting wheels. The cutting wire is sequentially wound from the second cutting wheel 433 to the second transition wheel 434, a third transition wheel 436, another third transition wheel 436, the first transition wheel 432, and the first cutting wheel 431, thereby forming a closed loop winding, and at the same time, the cutting accommodation space is formed in the wire cutting unit through the traction and guidance of the cutting wire by the multiple transition wheels.

[0211] Of course, it should be understood that the positions of the first transition wheel, the second transition wheel, and the third transition wheel relative to the cutting wheels and the inclined directions of the wheel surfaces are not limited to the illustrated embodiments, and only when the cutting wire is wound between the multiple cutting wheels and transition wheels in the wire cutting unit to form the cutting accommodation space. At the same time, the third transition wheel of the wire cutting unit can also be provided as three, four, or the like, which is not limited in the present application.

[0212] In some embodiments, the silicon rod cutting device further comprises a cutting wire driving device for driving the cutting wire to run to cut the silicon rod.

[0213] The principle of wire cutting is that the cutting blade attached to the steel wire is driven by the high-speed running steel wire or directly uses diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. Here, the cutting wire driving device is used to drive the cutting wire to run.

[0214] In some embodiments, the cutting wire driving device is a motor with a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel. In this way, the cutting wire can be driven to run in the winding direction by the cutting wheel. Of course, in specific embodiments, the cutting wire driving device can also be other driving sources such as a hydraulic motor, as long as it can drive the cutting wire to run, which is not limited in the present application.

[0215] In some embodiments, the silicon rod cutting device further comprises a tension detection mechanism. In wire cutting processing, the size of the cutting wire tension affects the yield and processing accuracy in cutting. The tension detection mechanism detects the tension and adjusts the tension of the cutting wire to a certain threshold value and keeps a constant value or a certain range allowed by the numerical center of the constant value during cutting.

[0216] In an embodiment, the transition wheel in the wire cutting unit functions as a tension wheel for adjusting the tension of the cutting wire when guiding and pulling the cutting wire.

[0217] The tension wheel is used to adjust the tension of the cutting wire, which can reduce the probability of cutting wire breakage and reduce consumables. In cutting operation, the cutting wire plays an important role, but even the best cutting wire has limited elongation and wear resistance. That is, the cutting wire will gradually thin out during continuous operation and eventually be pulled apart. Therefore, the wire cutting equipment is generally designed with a cutting wire tension compensation mechanism to compensate for the elongation of the cutting wire during reciprocating travel, and the tension wheel is one of the implementation means.

[0218] In some embodiments of the application, the tension detection mechanism at least comprises a tension sensor, a servo motor and a lead screw; the tension sensor is arranged on the transition wheel and continuously senses the tension value of the cutting wire on the transition wheel, and sends a driving signal when the tension value is less than a preset value; the servo motor is electrically connected to the tension sensor and starts to work after receiving the driving signal sent by the tension sensor; one end of the lead screw is connected to the tension wheel, and the other end is connected to the servo motor, and the lead screw pulls the transition wheel to move unidirectionally when the servo motor works, so as to adjust the tension of the cutting wire.

[0219] In some embodiments, the silicon rod cutting apparatus further comprises at least one distance adjusting mechanism disposed in the at least one wire cutting unit for driving the plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame in a direction perpendicular to the cutting wheel surface. The silicon rod cutting apparatus can switch the cutting wire between different cutting slots of the cutting wheels based on the distance adjusting mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod.

[0220] In some implementations, please refer to Figure 5 and Figure 6 for a wire cutting unit in a silicon rod cutting apparatus, which comprises a plurality of cutting wheels and a transition wheel. A carrier, such as the wire cutting support 430 shown in Figure 5 , is used to carry the plurality of cutting wheels and the transition wheel. The distance adjusting mechanism can be used to drive the wire cutting support 430 as a whole to move in a direction perpendicular to the cutting wheel surface, and the transition wheel and the cutting wheel move together with the wire cutting support in the direction perpendicular to the cutting wheel surface (i.e., the second direction). In this state, the plurality of cutting wheels and the transition wheel are relatively static, i.e., the positional relationship between the transition wheel and the cutting wheel does not change. At this time, the distance adjusting mechanism is used to adjust the cutting position of at least one cutting wire saw in the at least one wire cutting unit relative to the silicon rod.

[0221] In some implementations, each cutting wheel has at least two cutting wire slots, and different cutting wire slots are parallel to each other and have a cutting offset in the direction perpendicular to the cutting wheel surface. When the distance adjusting mechanism is used to drive the plurality of cutting wheels in the wire cutting unit to move relative to the wire cutting support, the position of the cutting wire around the wire slots on the cutting wheels can be changed. In an implementation, the plurality of cutting wheels in the wire cutting unit can be connected to a support, wherein the support is movably arranged on the wire cutting support and driven by the distance adjusting mechanism to move in the direction perpendicular to the cutting wheel surface.

[0222] When the at least one lead adjusting mechanism is used to realize the transformation of the cutting line winding the cutting line groove of the plurality of cutting wheels in the at least one wire cutting unit, in the actual scene, the cutting line groove corresponding to the cutting line before and after the transformation can be determined in advance, for example, the position of the cutting line before the transformation is the cutting line groove a1, and the cutting line after the transformation winds the cutting line groove a2. The displacement of the plurality of cutting wheels in the wire cutting unit driven by the at least one lead adjusting mechanism is determined based on the cutting offset between the cutting line groove a1 and the cutting line groove a2, that is, the displacement is set as the cutting offset between the cutting line groove a1 and the cutting line groove a2, so as to realize the transformation of the cutting line from the cutting line groove a1 to the cutting line groove a2. It should be noted that the plurality of cutting wheels in the wire cutting unit driven by the at least one lead adjusting mechanism moves in the direction of the vertical line of the cutting wheel surface, that is, the direction of the cutting line groove a2 pointing to the direction of the cutting line groove a1. After the transformation, the cutting position of the cutting wire saw in space does not change, so that the step of further calibrating the position of the cutting wheel or other components is omitted, and the silicon rod can be cut according to the preset cutting amount, so that the transformation process is simplified.

[0223] In order to further illustrate the implementation manner of the at least one lead adjusting mechanism for realizing the movement of the plurality of cutting wheels in the wire cutting unit relative to the cutting frame in the direction perpendicular to the cutting wheel surface, the present application provides the following embodiments. When the number of wire cutting units in the silicon rod cutting device is different, the specific form of the at least one lead adjusting mechanism can be changed accordingly.

[0224] In an embodiment, the wire silicon rod cutting device includes a single wire cutting unit; the lead adjusting mechanism includes a lead screw arranged in the orthogonal direction of the cutting wheel surface and threadedly connected with the single wire cutting unit; and a driving source for driving the rotation of the lead screw.

[0225] Here, the single wire cutting unit is one wire cutting unit, and the single wire cutting unit in the wire silicon rod cutting device includes a plurality of cutting wheels, and the cutting wire is wound around the plurality of cutting wheels to form at least one cutting wire saw. The lead screw of the lead adjusting mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the lead screw can be connected to the driving source and rotated under the driving of the driving source, and the distal end of the lead screw is threadedly connected to the single wire cutting unit. Through the connection mode of the two ends of the lead screw, the lead screw can rotate based on the transmission of the driving source and convert the rotation of the lead screw into axial displacement through the thread connection. The axial displacement direction is the arrangement direction of the lead screw, that is, the orthogonal direction of the cutting wheel surface. By driving the rotation of the lead screw in the lead adjusting mechanism, the displacement of the single wire cutting unit in the orthogonal direction of the cutting wheel surface can be realized. By changing the rotation direction of the lead screw driven to rotate, the advance or retreat of the cutting wheel of the single wire cutting unit in the orthogonal direction of the cutting wheel surface can be realized.

[0226] In another embodiment, the wire saw device comprises a single wire cutting unit; the distance adjusting mechanism comprises: a telescopic member arranged along the normal direction of the cutting wheel surface and associated with the single wire cutting unit; a driving source for driving the telescopic member to perform telescopic movement along the normal direction of the cutting wheel surface. Here, the telescopic member can be arranged in a rod structure, and the rod extension direction is the normal direction of the cutting wheel surface. The telescopic member can perform telescopic movement along its extension direction under the driving of the driving source. One end of the telescopic member can be connected to the driving source, and the freely telescopic end is associated with the single wire cutting unit, that is, the single wire cutting unit can be driven by the driving source to move the cutting wheel in the normal direction of the cutting wheel surface. The telescopic member is, for example, an electric telescopic rod, and the like, or a connecting rod connected to the taper rod of a pneumatic cylinder. The pneumatic cylinder can serve as the driving source, and the present application is not limited thereto. The telescopic rod can be directly connected or indirectly connected to the single wire cutting unit, for example, it can be directly connected to the wire cutting support or the cutting wheel support of the single wire cutting unit, or it can be indirectly connected to the single wire cutting unit through a support or a bearing. It should be understood that the extension or contraction of the telescopic member corresponds to the forward movement or backward movement of the single wire cutting unit along the normal direction of the cutting wheel surface.

[0227] Here, in the embodiments provided in the present application, the association can be achieved by one or more of clamping, screwing, bonding, and welding, for example, in the above-mentioned embodiments, the telescopic rod can be associated with the wire cutting unit by one or more of clamping, screwing, bonding, and welding. Of course, the implementation of the association is not limited thereto, but aims to achieve transmission in the second direction.

[0228] In yet another embodiment, the wire saw device comprises a single wire cutting unit; the distance adjusting mechanism comprises: a rack arranged along the normal direction of the cutting wheel surface and associated with the single wire cutting unit; a transmission gear meshing with the rack; and a driving source for driving the transmission gear to rotate. The transmission gear rotates under the driving of the driving source, and the rack meshing with the transmission gear moves correspondingly along the rack direction. In this example, by cooperation of the rack and the transmission gear, the rotary motion of the driving source can be converted into linear motion along the rack direction. The rack is arranged along the normal direction of the cutting wheel surface and associated with the single wire cutting unit, so as to drive the cutting wheel of the single wire cutting unit to move along the normal direction of the cutting wheel surface. At the same time, the rotation direction of the transmission gear can be controlled and switched by the driving source, so as to make the plurality of cutting wheels of the single wire cutting unit move forward or backward along the normal direction of the cutting wheel surface.

[0229] In one embodiment, the silicon rod cutting device comprises a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite directions, at least one of the first wire cutting unit and the second wire cutting unit is driven to move in the orthogonal direction of the cutting wheel surface by the at least one distance adjusting mechanism, for adjusting the wire saw distance between at least one wire saw in the first wire cutting unit and at least one wire saw in the second wire cutting unit, or changing the cutting wire slot of the plurality of cutting wheels in the first wire cutting unit and / or the cutting wire slot of the plurality of cutting wheels in the second wire cutting unit.

[0230] The at least one distance adjusting mechanism can be connected to the first wire cutting unit or the second wire cutting unit, or simultaneously associated with the first wire cutting unit and the second wire cutting unit, to drive the plurality of cutting wheels in the connected or associated first wire cutting unit or / and second wire cutting unit to move in the orthogonal direction of the cutting wheel surface.

[0231] In one embodiment, the distance adjusting mechanism comprises a screw rod arranged in the orthogonal direction of the cutting wheel surface and threadedly connected to the first wire cutting unit or the second wire cutting unit, and a driving source for driving the screw rod to rotate. The screw rod and the driving source drive the plurality of cutting wheels in the first wire cutting unit or the second wire cutting unit to move in the orthogonal direction of the cutting wheel surface in a similar manner as the previous embodiment. The first cutting unit or the second wire cutting unit driven by the distance adjusting mechanism can be regarded as a single wire cutting unit, which will not be described here. It should be understood that the distance adjusting mechanism arranged on any wire cutting unit can realize the increase and decrease of the parallel wire saw distance between the first wire cutting unit and the second wire cutting unit, and the silicon rod cutting device can cut silicon rods into different specifications.

[0232] In another embodiment, the distance adjusting mechanism comprises a telescopic member arranged in the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit, and a driving source for driving the telescopic member to perform telescopic motion in the orthogonal direction of the cutting wheel surface. Here, the first cutting unit or the second wire cutting unit provided with the distance adjusting mechanism can be regarded as a single wire cutting unit, and the specific implementation manner can refer to the previous embodiment, which will not be described here.

[0233] In yet another embodiment, the distance adjusting mechanism comprises a rack arranged in the orthogonal direction of the cutting wheel surface and associated with the first wire cutting unit or the second wire cutting unit, a transmission gear meshing with the rack, and a driving source for driving the transmission gear to rotate. Through the meshing transmission gear and the rack, the driving source can control the rack to move in the rack direction, and the first wire cutting unit or the second wire cutting unit associated with the rack can be driven by the rack to move the plurality of cutting wheels in the orthogonal direction of the cutting wheel surface.

[0234] In an embodiment, the distance adjusting mechanism comprises a bidirectional screw rod arranged along the orthogonal direction of the cutting wheel surface and threadedly connected with the first wire cutting unit and the second wire cutting unit; and a driving source for driving the screw rod to rotate so as to move the first wire cutting unit and the second wire cutting unit towards or away from each other along the orthogonal direction of the cutting wheel surface. In an implementation, the bidirectional screw rod is a double-thread screw rod, the two ends of the bidirectional screw rod are respectively provided with threads with opposite directions, and the driving source can be arranged at either end of the bidirectional screw rod to drive the bidirectional screw rod to rotate along the screw rod axis. When the bidirectional screw rod is driven to rotate, the movements of the two ends of the bidirectional screw rod are converted into axial movements with opposite directions by virtue of the threads with opposite directions at the two ends of the bidirectional screw rod, and the axial direction is the orthogonal direction of the cutting wheel surface where the bidirectional screw rod is arranged. Under the driving of the driving source, the plurality of cutting wheels corresponding to the first wire cutting unit and the second wire cutting unit can move towards or away from each other.

[0235] In some embodiments, the distance adjusting mechanism is a servo motor arranged on the at least one wire cutting unit. In actual scenarios, a servo motor is arranged on each wire cutting unit or at least one wire cutting unit of the wire rod cutting device, and the servo motor is used to control the displacement of the corresponding wire cutting unit along the orthogonal direction of the cutting wheel surface. The wire cutting unit can be pre-set with a cutting offset amount of slot changing or an adjustment amount of cutting position changing of the cutting wire, and the servo motor is used to drive the plurality of cutting wheels in the wire cutting unit to move along the orthogonal direction of the cutting wheel surface by a preset displacement amount by virtue of the precise positioning function of the servo motor. For example, a single wire cutting unit is arranged in the wire rod cutting device, and a servo motor is arranged on the single wire cutting unit to drive the single wire cutting unit to move along the orthogonal direction of the cutting wheel surface. For another example, a first wire cutting unit and a second wire cutting unit are arranged in the wire rod cutting device, and the first wire cutting unit and / or the second wire cutting unit move along the orthogonal direction of the cutting wheel surface independently under the driving of the corresponding servo motor. In some examples, the servo motor can also be replaced by a traveling motor and a traveling screw rod. It should be understood that the distance adjusting mechanism is a driving device for driving the plurality of cutting wheels in the wire cutting unit to move relative to the cutting frame, and the specific form of the distance adjusting mechanism is not limited in the present application.

[0236] In an embodiment of the present application, the cutting conversion mechanism is used to drive the cutting frame and the at least one wire cutting unit thereon to convert between the first transfer channel and the second transfer channel.

[0237] In the embodiments of the present application, the silicon rod processing platform is sequentially provided with a first processing area and a second processing area along a first direction, and the first processing area and the second processing area cross the width dimension of the silicon rod processing platform in a second direction. The first transfer device and the second transfer device are arranged in parallel along the first direction, wherein the first transfer channel in the first transfer device passes through the first processing area and the second processing area along the first direction, and the second transfer channel in the second transfer device passes through the first processing area and the second processing area along the first direction. In the embodiments of the present application, the silicon rod cutting device is provided with a cutting conversion mechanism, by which the cutting frame and the at least one linear cutting unit thereon can be driven to move along the second direction to switch between the first transfer channel and the second transfer channel. For example, the cutting frame and the at least one linear cutting unit thereon are driven to move along the second direction by the cutting conversion mechanism to switch from the first transfer channel to the second transfer channel, or the cutting frame and the at least one linear cutting unit thereon are driven to move along the second direction by the cutting conversion mechanism to switch from the second transfer channel to the first transfer channel.

[0238] In an embodiment, the cutting conversion mechanism comprises a cutting conversion guide rail and a cutting conversion driving unit.

[0239] The cutting conversion guide rail is arranged along the second direction for arranging the cutting frame. In some embodiments, the cutting conversion guide rail is arranged on the silicon rod processing platform along the second direction, and the cutting frame is arranged on the cutting conversion guide rail by means of a slider or the like.

[0240] The cutting conversion driving unit is used to drive the cutting frame and the at least one linear cutting unit thereon to move along the cutting conversion guide rail.

[0241] In some embodiments, the cutting conversion driving unit comprises a moving rack, a driving gear and a driving source. The moving rack is arranged along the second direction and in parallel with the cutting conversion guide rail. The moving rack is fixed on the silicon rod processing platform and arranged in approximately the same second direction dimension as the cutting conversion guide rail, and is arranged in parallel and adjacent to the cutting conversion guide rail.

[0242] The driving gear is arranged on the cutting frame and engages with the moving rack to drive the cutting frame to move along the cutting conversion guide rail. The driving source is used to drive the driving gear. In an implementation of the present application, the driving gear is arranged on the cutting frame, the driving gear is driven to rotate by the driving source, the teeth of the driving gear engage with the moving rack, and the cutting frame and the at least one linear cutting unit thereon connected to the driving gear are thus moved on the cutting conversion guide rail.

[0243] In some embodiments, the cutting conversion driving unit can be arranged on the cutting frame, comprising a moving lead screw and a driving source, wherein the moving lead screw is arranged along the second direction and associated with the cutting frame, and the driving source is used to drive the moving lead screw to rotate so as to move the associated cutting frame and at least one cutting unit thereon along the cutting conversion guide rail.

[0244] The silicon rod cutting and grinding all-in-one machine can further comprise a side skin unloading device for unloading the side skin formed by the silicon rod cutting device during the cutting operation on the silicon rod.

[0245] The side skin unloading device can comprise a side skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the side skin formed by cutting.

[0246] It should be understood that, whether it is the first transfer device or the second transfer device, the silicon rod clamped by the first silicon rod clamp in the first transfer device or the second silicon rod clamp in the second transfer device is in a horizontal position, i.e., the axis of the silicon rod is consistent with the first direction. Therefore, the side skin formed by the cutting operation of the silicon rod cutting device on the silicon rod is also in a horizontal position, and the side skin supporting mechanism supports the side skin to assist in unloading the side skin.

[0247] The side skin supporting mechanism comprises a supporting part and a driving unit connected to the supporting part to control the supporting part to move away from or abut against the side skin.

[0248] In some examples, the silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine can convert the cutting position during the silicon rod processing, for example, the silicon rod processing platform is provided with a first processing area and a second processing area, and the silicon rod cutting device is arranged on the machine base by a cutting conversion mechanism and can be driven by the cutting conversion mechanism to convert the position between the first processing area and the second processing area. In this arrangement, the side skin supporting mechanism can be arranged on the silicon rod cutting device, for example, through a mounting part, so that the side skin supporting mechanism remains relatively stationary relative to the cutting assembly when the silicon rod cutting device converts the processing area. In some examples, the mounting part is detachably connected with the cutting frame, and based on the need for the silicon rod supporting position, the mounting part can be arranged at different positions on the silicon rod cutting device.

[0249] The position of the side skin supporting mechanism arranged on the silicon rod cutting device can be determined based on the specific structure of the linear cutting unit in the silicon rod cutting device. Please refer to Figure 5 , which shows a structural schematic diagram of the silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine in an embodiment. As Figure 5As shown, the silicon rod cutting device includes a cutting frame 41 and a wire cutting unit 43, which is arranged on the cutting frame 41 by a wire cutting support 430. Here, the wire cutting support 430 serves as a carrier for associating multiple cutting wheels and transition wheels in the wire cutting unit 43 with the cutting frame 41, and the specific form of the wire cutting support 430 can be a beam body, a plate frame, a bracket, etc. In this example, the edge skin supporting mechanism can be arranged on the wire cutting support 430 by the mounting portion.

[0250] In other examples, for example, when the position of the silicon rod cutting device in the first direction remains unchanged, the edge skin supporting mechanism can be arranged on the machine base by the mounting portion, for example, the mounting portion is a support column or a bracket, which is used to arrange the edge skin supporting mechanism so that the supporting portion in the edge skin supporting mechanism can achieve the support of the edge skin under the driving of the driving unit.

[0251] The edge skin supporting mechanism includes a supporting portion, which is used to contact and abut against the silicon rod to achieve the supporting effect of the edge skin. It should be noted that in the embodiments of the present application, the supporting effect is to apply force to the edge skin to maintain the stable state of the edge skin. For example, the cutting wire saw is arranged in the horizontal direction (i.e., the second direction), and the edge skin formed by cutting is located on the upper side, the lower side, or the upper side and the lower side of the silicon rod. At this time, the supporting portion can provide support force to the edge skin on the lower side of the silicon rod to prevent the edge skin from breaking, thereby maintaining the stable state of the edge skin. Alternatively, when the cutting wire saw is arranged in the perpendicular direction, the edge skin formed by cutting is located on the side (left side, right side, or left side and right side) of the silicon rod. The supporting portion can be provided with a structure adapted to the outer arc surface of the silicon rod to provide support force to the edge skin, or by abutting against the edge skin to maintain the stable state of the edge skin by the friction force. Figure 5 As shown in the example, the silicon rod cutting device includes two wire cutting units 43 arranged opposite to each other in the second direction, and each wire cutting unit 43 has a cutting wire saw 439, which can be arranged in the perpendicular direction. Thus, the two cutting wire saws 439 belonging to the two wire cutting units 43 are both arranged in the perpendicular direction. The edge skin formed by cutting is located on the left side and the right side of the silicon rod. The supporting portion can be provided with a structure adapted to the outer arc surface of the silicon rod to provide support force to the edge skin, or by abutting against the edge skin to maintain the stable state of the edge skin by the friction force.

[0252] The driving unit is used to drive the supporting portion away from or abut against the edge skin. The direction of the supporting portion away from or abutting against the edge skin can be multiple directions, for example, abutting against the edge skin means that the supporting portion moves from the state away from the edge skin to the state contacting the edge skin under the driving of the driving unit, and the specific movement direction of the supporting portion is not limited in the present application.

[0253] In an implementation, the driving unit comprises a cylinder or a hydraulic pump; a telescopic part connected to the supporting part, which is driven to extend or retract by the cylinder or the hydraulic pump to control the supporting part to move away from or against the edge.

[0254] The telescopic part is driven to extend or retract by the cylinder or the hydraulic pump, and the telescopic part is connected to the supporting part, and the telescopic part is driven to extend or retract in a direction away from or towards the axis of the silicon rod, thereby driving the connected supporting part to move away from or against the edge.

[0255] In another implementation, the driving unit comprises a driving motor and a screw rod assembly driven by the driving motor. The screw rod assembly is threadedly connected to the supporting part at one end, and the driving motor drives the screw rod to rotate to move the supporting part along the direction of the screw rod. By controlling the rotation direction of the screw rod by the driving motor, the supporting part can be controlled to move towards or away from the edge.

[0256] The supporting part can be provided in different structures to achieve the supporting effect. For example, the supporting part can be a supporting plate with a curved surface for contacting the edge, or the supporting part can be a supporting plate with a folded edge to prevent the edge from rolling, such as a groove structure with a trapezoidal cross-section (where the groove opening is the lower base of the trapezoid). It should be understood that the supporting part for achieving the supporting of the edge can have various implementations, which are not limited by the present application.

[0257] To achieve the stable supporting of the edge formed by cutting to prevent the edge from breaking, or to simplify the unloading and transportation of the edge, the present application further provides the following implementations:

[0258] In an embodiment, the supporting part comprises at least two supporting blocks arranged at intervals along the first direction and having a bearing surface for contacting and bearing the edge. The bearing surface of the supporting block can be provided with a curved surface to adapt to the supported edge, or can be provided with different levels of contact surfaces to prevent the edge from rolling. In some implementations, each supporting block can be provided with a driving unit.

[0259] It should be understood that in some processing scenarios, the supporting of the edge can be achieved by one supporting block. In this regard, the present application further provides an embodiment of supporting the edge by at least two supporting blocks arranged at intervals along the first direction. By arranging the at least two supporting blocks at intervals along the first direction, the supporting of the edge formed by cutting the silicon rod of different length specifications can be achieved, and at the same time, the edge is subjected to the force of the supporting part in the direction of different length (i.e. the first direction) by the supporting of the edge by the at least two supporting blocks arranged at intervals, thereby facilitating the prevention of the edge from breaking before the cutting wire saw penetrates the silicon rod. After the cutting wire saw penetrates the silicon rod to form an edge independent of the silicon rod, the at least two supporting blocks arranged at intervals can be used to support the edge to prevent the edge from tilting and falling over.

[0260] In some embodiments, the supporting part of the edge skin stripping mechanism is a supporting wheel set, wherein the supporting wheel set can be at least two, the interval or span of the at least two supporting wheel sets along the first direction is set, and each of the at least two supporting wheel sets comprises: at least two supporting wheels, the at least two supporting wheels are spaced along the second direction, and are used for contacting and supporting the edge skin; and a supporting base connected to the driving unit, used for setting the at least two supporting wheels to drive the at least two supporting wheels away from or against the edge skin.

[0261] In another embodiment, the edge skin supporting mechanism comprises at least two supporting parts, the at least two supporting parts are spaced along the first direction on the silicon rod cutting device or the machine base. Wherein the supporting part is a supporting wheel set, any of the supporting wheel sets comprises at least two supporting wheels, the at least two supporting wheels are spaced along the second direction, so that the center of gravity of the supported edge skin in the second direction is located between the at least two supporting wheels. The supporting wheels are used for contacting and supporting the edge skin, and the tangent direction of the supporting wheels contacting the silicon rod edge skin is along the first direction.

[0262] In some implementations, the supporting wheels can roll along the supporting wheel shaft center, and the supporting wheel shaft center is set in the second direction. In this arrangement, when the cutting wire saw penetrates the silicon rod to form an independent edge skin, and the edge skin is to be transported subsequently, when the edge skin moves relative to the supporting wheel set along the first direction, the edge skin and the supporting wheels are in rolling friction, so that the subsequent transportation of the edge skin along the first direction is facilitated.

[0263] The edge skin supporting mechanism further comprises a driving unit, the driving unit is used for driving the supporting wheel set to move away from or against the edge skin. In an implementation, when the cutting wire saw of the silicon rod cutting device in the silicon rod cutting and grinding integrated machine is set in the second direction, the driving unit drives the supporting wheel set to move along the perpendicular direction to support and hold the edge skin during the cutting process. The driving unit is, for example, a pneumatic cylinder or a driving motor, and the pneumatic cylinder or the driving motor is connected to the supporting base of the supporting wheel set to drive the supporting wheel set to move up and down along the perpendicular direction.

[0264] In yet another embodiment, the supporting part comprises: at least two supporting rods, arranged along the first direction, used for contacting and supporting the edge skin; and two connecting parts, respectively arranged at opposite ends of the supporting rods along the first direction, used for connecting the at least two supporting rods and the driving unit.

[0265] Please refer to Figure 5 and Figure 6 , which show the partial structure schematic diagram of the edge skin supporting mechanism in an embodiment of the present application. As shown in the figure, the supporting part 611 comprises two supporting rods 6111 spaced along the second direction, and the rod body of the supporting rod 6111 is along the first direction.

[0266] Here, the at least two supporting rods 6111 can achieve the supporting effect on the edge skin, and it should be understood that the supporting effect on the edge skin can be achieved as long as the center of gravity of the edge skin formed by cutting is located between the at least two supporting rods 6111; meanwhile, any supporting rod 6111 is in linear contact with the supported edge skin, and under this setting, the friction between the supporting part 611 and the edge skin can be reduced.

[0267] The connecting part 6113 is arranged on both sides of the supporting rod 6111, which can make the supporting rod 6111 bear force symmetrically when the supporting part 611 is away from or close to the silicon rod, thereby improving the structural stability of the supporting part. Figure 5 and Figure 6 In the embodiment shown, the connecting part 6113 connects the supporting rod 6111 and the driving unit, respectively, wherein the driving unit 613 is connected to the wire cutting support 430 or the cutting frame 41 through the mounting part, and the free end of the telescopic movement is connected to the connecting part 6113 to drive the supporting part 611 to move along the telescopic direction of the driving unit 613. Figure 5 and Figure 6 In the example shown, the driving unit 613 is a cylinder with a telescopic part, and the telescopic part of the cylinder 613 is connected to the connecting part 6113.

[0268] In the example shown, Figure 5 and Figure 6 The supporting part 611 is controlled to move in the second direction to be away from or close to the edge skin. It should be understood that when the direction of the cutting wire saw in the silicon rod cutting device is different, or when the structure of the supporting part is different, the driving unit in the corresponding edge skin supporting mechanism can be arranged in different directions to adapt to the needs of supporting the edge skin. For example, when the cutting wire saw in the silicon rod cutting device is in the direction of the vertical line, the driving unit can be arranged, for example, in the second direction of the telescopic movement, so that the supporting part moves in the second direction to be close to or away from the edge skin. For example, when the cutting wire saw in the silicon rod cutting device is in the second direction, the driving unit can be arranged, for example, in the third direction (i.e., the direction of the vertical line) of the telescopic movement, so that the supporting part moves in the third direction to be close to or away from the edge skin. The direction of the controlled movement of the supporting part is not limited in the present application, as long as the supporting part can achieve the supporting effect on the edge skin.

[0269] The number of the supporting parts can correspond to the supporting needs of the edge skin. For example, when the silicon rod cutting device includes a cutting wire saw, one supporting part can be arranged on the silicon rod cutting device to support the edge skin corresponding to the formation of one edge skin in one cutting operation. For another example, when the silicon rod cutting device includes two parallel cutting wire saws, two supporting parts can be arranged on the silicon rod cutting device to support the edge skins on both sides of the silicon rod respectively corresponding to the formation of two edge skins in one cutting operation.

[0270] In some embodiments, the edge skin unloading device further comprises an edge skin misalignment mechanism arranged on the machine base or the silicon rod cutting device, and used to push the edge skin in a first direction to make the edge skin separate from the edge skin supporting mechanism.

[0271] In some embodiments, the edge skin misalignment mechanism is arranged on the machine base or the silicon rod cutting device at a preset interval in the first direction relative to the cutting wire saw, wherein the first direction is parallel to the axis direction of the silicon rod. It should be understood that when the cutting wire saw penetrates the silicon rod, the edge skin independent of the silicon rod is formed, at this time, the position of one end surface of the edge skin supported by the supporting part in the first direction is aligned with the cutting wire saw, the interval between the edge skin misalignment mechanism and the cutting wire saw in the first direction is determined, and the displacement amount of the edge skin misalignment mechanism moving in the first direction determines the pushing distance of the edge skin.

[0272] The edge skin misalignment mechanism can be arranged on the machine base or the silicon rod cutting device, which can be determined based on the silicon rod cutting and grinding all-in-one machine in specific scenarios. For example, when the position of the silicon rod cutting device in the first direction is constant during the silicon rod machining process, the edge skin misalignment mechanism can be arranged on either the machine base or the silicon rod cutting device. When the position of the silicon rod cutting device in the first direction is not a constant value in different machining states or cutting processes, for example, the silicon rod cutting device moves in the first direction to realize the feeding cutting of the silicon rod, the edge skin misalignment mechanism can be arranged on the silicon rod cutting device.

[0273] It should be understood that the axis direction of the silicon rod to be cut is along the first direction, and the edge skin formed in the cutting is also along the first direction in the supported state. The edge skin misalignment mechanism can push the edge skin in the first direction to make the edge skin move relative to the edge skin supporting mechanism, so that the edge skin can be unloaded from the edge skin supporting mechanism for subsequent transportation process.

[0274] In some embodiments, the edge skin misalignment mechanism comprises: a power source; and a telescopic rod arranged in the first direction and used to move telescopically under the driving of the power source to push the edge skin.

[0275] In an implementation, the power source of the edge skin misalignment mechanism is a pneumatic cylinder or a hydraulic pump, wherein the telescopic rod of the pneumatic cylinder or the hydraulic pump is arranged in the first direction. For example Figure 5 or Figure 6In the illustrated embodiment, the silicon rod cutting device is provided with two wire cutting units in parallel, and the edge skin discharging device includes two edge skin misalignment mechanisms, which are respectively arranged at the left and right wire cutting units of the cutting frame. The edge skin misalignment mechanism is a pneumatic cylinder with a telescopic rod, and the telescopic rod is arranged in the first direction and aligned to the edge skin end face. After the cutting wire saw penetrates the silicon rod to form an independent edge skin, the edge skin misalignment mechanism moves in the first direction to abut against the edge skin end face and push the edge skin to move, so that the edge skin can be separated from the edge skin supporting mechanism or the cut silicon rod. Here, the telescopic range of the telescopic rod of the edge skin misalignment mechanism can be determined based on the length specification of the silicon rod, or based on the span of the supporting part in the first direction in the edge skin supporting mechanism, to control the stroke of the edge skin pushed in the first direction to ensure that the edge skin can be separated.

[0276] Of course, it should be understood that the specific structure and position of the edge skin misalignment mechanism are not limited to Figure 5 and Figure 6 the illustrated embodiment. For example, in some examples, the edge skin misalignment mechanism can also be arranged on the base of the silicon rod cutting and grinding all-in-one machine. At the same time, the edge skin misalignment mechanism can be suitable for different types of supporting parts. Generally, the edge skin misalignment mechanism can push the edge skin in the first direction to make the edge skin separate from the supporting part, and at this time, the specific form of the supporting part does not necessarily limit to Figure 5 and Figure 6 the illustrated embodiment.

[0277] In some embodiments, the edge skin discharging device further includes an edge skin conveying mechanism for receiving the edge skin formed by cutting and conveying the edge skin to a discharging area. Here, the discharging area is the edge skin discharging area.

[0278] In an embodiment, the position of the edge skin conveying structure in the second direction can be arranged to be aligned with the silicon rod cutting device in the silicon rod cutting and grinding all-in-one machine, so that the edge skin formed by cutting the silicon rod can be conveyed by the corresponding edge skin conveying structure, thereby reducing the conveying of the edge skin.

[0279] The direction and position of the edge skin conveying mechanism can be determined by the positional relationship between the cutting area and the edge skin discharging area.

[0280] In one embodiment, the edge discharging area is arranged adjacent to the cutting area along a first direction, and the edge conveying structure is arranged along the first direction and is connected to the silicon rod cutting device, so that the silicon rod pushes the edge along the first direction after cutting to separate the cutting silicon rod or the edge supporting mechanism, and then the edge is transferred to the edge conveying structure, thereby simplifying the transfer path of the edge. The number of edge conveying mechanisms can also be determined according to the number, structure or working mode of the silicon rod cutting device in the silicon rod cutting and grinding integrated machine. For example, when the silicon rod cutting and grinding integrated machine is provided with different processing area positions, and a plurality of processing area positions are provided with silicon rod cutting devices, the edge conveying mechanism can be correspondingly provided on the plurality of processing area positions to correspond to the silicon rod cutting device. For another example, when the silicon rod cutting device can simultaneously cut a plurality of silicon rods, the edge conveying mechanism is provided as a plurality of edge conveying mechanisms, so that each edge conveying mechanism corresponds to a silicon rod.

[0281] In some embodiments, the edge conveying mechanism is a chain conveying mechanism, a speed-up chain mechanism, or a conveyor belt mechanism.

[0282] In one embodiment, the edge conveying mechanism includes a conveying part for carrying the edge, and a conveying driving source for driving the conveying part to move to convey the edge.

[0283] The conveying part can be arranged along a first direction and can transport the carried edge along the first direction under the driving of the conveying driving source. The movement direction of the conveying part can be arranged to be towards the direction of the edge discharging area, so as to transport the carried edge to the edge discharging area.

[0284] The conveying driving source is, for example, a motor for driving the conveying part to move and controlling the transportation speed of the conveying part.

[0285] In some examples, in order to avoid the edge from being damaged by collision during conveying, in some embodiments, the conveying part is provided with a buffer pad for contacting the edge, or the conveying part is made of a buffer material. The buffer pad or buffer material is, for example, rubber, silicone or other materials with elastic deformation, damping characteristics or buffer characteristics. In this way, the risk of damage to the edge conveying is reduced, and the reuse of the edge is facilitated.

[0286] In this application, an embodiment of a silicon rod cutting and grinding all-in-one machine with a side skin unloading device is provided. The side skin unloading device includes a side skin supporting mechanism. The supporting part of the side skin supporting mechanism is driven by a driving source to abut against the side skin to support the side skin. During the process of cutting the silicon rod lying on the side, the side skin supporting mechanism can avoid the side skin from falling off by the supporting action of the supporting part. The supporting part can be used to support the side skin to prevent the side skin from falling off, so that the complete side skin can be formed to assist the subsequent side skin transfer process. In some examples, the side skin unloading device also includes a side skin misalignment mechanism, which can be used to push the side skin in a first direction to make the side skin separate from the supporting part. The side skin misalignment mechanism can also be used to transfer the side skin separated from the supporting part to the unloading area by a side skin conveying mechanism, so as to achieve the unloading and subsequent transfer of the side skin.

[0287] The silicon rod cutting and grinding all-in-one machine in the application also includes a silicon rod grinding device, which is arranged at the second machining position of the silicon rod machining platform and is used to grind the cut silicon rod held by the first transfer device on the first transfer channel or the cut silicon rod held by the second transfer device on the second transfer channel.

[0288] The silicon rod grinding device includes at least one pair of grinding tools. The first silicon rod clamp or the second silicon rod clamp drives the silicon rod to move in a first direction, so that the silicon rod grinding device can be set in a fixed state when performing the grinding operation to realize the relative feeding between the grinding tool and the silicon rod.

[0289] In an embodiment, the silicon rod grinding device includes a grinding tool mounting seat, at least one pair of grinding tools, a grinding tool advancing and retreating mechanism, and a grinding tool switching mechanism.

[0290] The grinding tool mounting seat is used to arrange the at least one pair of grinding tools. The specific structure of the grinding tool mounting seat can be different forms based on the arrangement requirements of the grinding tools, such as a beam body, a plate frame, etc.

[0291] In some embodiments, the at least one pair of grinding tools are arranged on the grinding tool mounting seat, or the at least one pair of grinding tools are arranged on the grinding tool mounting seat by a support, a connecting plate, or a mounting frame. The carrier for arranging the at least one pair of grinding tools can be different forms, which is not limited in the application.

[0292] The grinding tool advancing and retreating mechanism is configured to drive at least one of the at least one pair of grinding tools to move along the second direction to adjust the relative distance between the two grinding tools of the at least one pair of grinding tools in the second direction, thereby controlling the feed amount in the grinding process, i.e., determining the grinding amount. According to the grinding requirement, one or both of the at least one pair of grinding tools is driven by the grinding tool advancing and retreating mechanism to move along the second direction by a predetermined distance to adjust the feed amount. In this way, the first silicon rod clamp or the second silicon rod clamp drives the silicon rod to move along the first direction and contact and relatively feed the at least one pair of grinding tools of the silicon rod grinding device to achieve the grinding of the silicon rod.

[0293] The grinding tool switching mechanism is configured to drive the grinding tool mounting seat and the at least one pair of grinding tools thereon to switch between the first transfer channel and the second transfer channel, so that the at least one pair of grinding tools performs the grinding work on the silicon rod clamped by the first silicon rod clamp on the first transfer channel or performs the grinding work on the silicon rod clamped by the second silicon rod clamp on the second transfer channel.

[0294] Please refer to Figure 7 , which shows the structural schematic diagram of the silicon rod grinding device in the silicon rod cutting and grinding all-in-one machine. In combination with Figure 1 and Figure 7 , as shown in Figure 1 and Figure 7 , the silicon rod grinding device 5 includes a grinding tool mounting seat 51, at least one pair of grinding tools 53, a grinding tool advancing and retreating mechanism, and a grinding tool switching mechanism.

[0295] The grinding tool mounting seat 51 is arranged on the second machining area of the silicon rod machining platform and is configured to arrange the at least one pair of grinding tools 53. In some embodiments, the grinding tool mounting seat 51 spans the width dimension of the silicon rod machining platform in the second direction.

[0296] The at least one pair of grinding tools 53 is arranged on the grinding tool mounting seat 51, and the at least one pair of grinding tools is arranged opposite to each other in the second direction. In some embodiments, any one of the grinding tools 53 can be arranged on the grinding tool mounting seat 51 by a grinding tool support.

[0297] In some embodiments, any one of the grinding tools includes a rotating shaft and a grinding wheel. The grinding wheel has a certain granularity and roughness, and the two grinding wheels arranged opposite to each other provide two symmetrical grinding surfaces for the clamped silicon rod.

[0298] In the embodiments of the present application, any one of the at least one pair of grinding tools includes a coarse grinding wheel and a fine grinding wheel nested with each other. For example, the coarse grinding wheel is nested in the fine grinding wheel, or the fine grinding wheel is nested in the coarse grinding wheel.

[0299] In some embodiments, please refer to Figure 8, which shows a cross-sectional view of a grinding tool of a silicon rod grinding device in a silicon rod cutting and grinding all-in-one machine of the present application. As shown in Figure 8 The grinding tool 53 comprises a grinding head base 531 and a coarse grinding wheel 533 and a fine grinding wheel 535 arranged on the grinding head base 531, wherein the coarse grinding wheel 533 is nested in the fine grinding wheel 535, the fine grinding wheel 535 is larger than the coarse grinding wheel 533, the fine grinding wheel 535 is circular and hollow in the middle (i.e. a circular ring structure), and the coarse grinding wheel 533 can be circular or circular and hollow in the middle (i.e. a circular ring structure). Generally, whether it is a coarse grinding wheel or a fine grinding wheel, the grinding wheel is formed by consolidating abrasive grains and a binder to form a surface with abrasive grain part in contact with the surface of the silicon rod to be ground and rotated. The grinding wheel has a certain abrasive grain size and abrasive grain density, and the grinding wheel has pores. The abrasive of the grinding wheel can be set to be harder than the hardness of the silicon material, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc. according to the need of grinding the silicon rod. The abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0300] When the grinding tool comprises a coarse grinding wheel and a fine grinding wheel, the silicon rod clamped by the first silicon rod clamp or the second silicon rod clamp can be subjected to coarse grinding and fine grinding by using the grinding tool. Therefore, at least one of the coarse grinding wheel and the fine grinding wheel is provided with a telescopic driving mechanism. For example, when the coarse grinding wheel is nested in the fine grinding wheel, the coarse grinding wheel can be provided with a telescopic driving mechanism, in the coarse grinding process, the telescopic driving mechanism is used to drive the coarse grinding wheel to extend and protrude out of the fine grinding wheel, so that the protruding coarse grinding wheel is used to grind the silicon rod, and in the fine grinding process, the telescopic driving mechanism is used to drive the coarse grinding wheel to retract and recess in the fine grinding wheel, so that the fine grinding wheel is used to grind the silicon rod. Or, when the coarse grinding wheel is nested in the fine grinding wheel, the fine grinding wheel can be provided with a telescopic driving mechanism, in the coarse grinding process, the telescopic driving mechanism is used to drive the fine grinding wheel to retract and recess in the coarse grinding wheel, so that the coarse grinding wheel is used to grind the silicon rod, and in the fine grinding process, the telescopic driving mechanism is used to drive the fine grinding wheel to extend and protrude out of the coarse grinding wheel, so that the protruding fine grinding wheel is used to grind the silicon rod.

[0301] In some embodiments, the fine grinding wheel is nested in the coarse grinding wheel, the coarse grinding wheel is larger than the fine grinding wheel, the coarse grinding wheel is circular and hollow (i.e. a circular ring structure), and the fine grinding wheel can be circular or circular and hollow (i.e. a circular ring structure). Generally, whether it is a coarse grinding wheel or a fine grinding wheel, the grinding wheel is formed by consolidating abrasive grains with a binder to form a surface with abrasive grain portions that contact and rotate against the surface of the silicon rod to be ground. The grinding wheel has a certain abrasive grain size and abrasive grain density, and at the same time has air holes in the grinding wheel. The abrasive of the grinding wheel can be set to be alumina, silicon carbide, diamond, cubic boron nitride, etc. with a hardness greater than that of silicon material according to the need for grinding the silicon rod. Among them, the abrasive grain size of the fine grinding wheel is smaller than that of the coarse grinding wheel, and the abrasive grain density of the fine grinding wheel is greater than that of the coarse grinding wheel.

[0302] When the grinding tool includes a coarse grinding wheel and a fine grinding wheel, the grinding tool can be used to perform coarse grinding and fine grinding on a silicon rod held by the first silicon rod clamp or the second silicon rod clamp. Therefore, at least one of the coarse grinding wheel and the fine grinding wheel is provided with a telescopic driving mechanism. For example, when the fine grinding wheel is nested in the coarse grinding wheel, the coarse grinding wheel can be provided with a telescopic driving mechanism, and when performing coarse grinding, the telescopic driving mechanism is used to drive the coarse grinding wheel to extend and protrude out of the fine grinding wheel, so that the protruding coarse grinding wheel is used to perform coarse grinding on the silicon rod, and when performing fine grinding, the telescopic driving mechanism is used to drive the coarse grinding wheel to retract and recess in the fine grinding wheel, so that the fine grinding wheel is used to perform fine grinding on the silicon rod. Alternatively, when the fine grinding wheel is nested in the coarse grinding wheel, the fine grinding wheel can be provided with a telescopic driving mechanism, and when performing coarse grinding, the telescopic driving mechanism is used to drive the fine grinding wheel to retract and recess in the coarse grinding wheel, so that the coarse grinding wheel is used to perform coarse grinding on the silicon rod, and when performing fine grinding, the telescopic driving mechanism is used to drive the fine grinding wheel to extend and protrude out of the coarse grinding wheel, so that the protruding fine grinding wheel is used to perform fine grinding on the silicon rod.

[0303] The grinding tool advancing and retracting mechanism is used to drive at least one grinding tool of the at least one pair of grinding tools to move in the second direction. The grinding tool advancing and retracting mechanism controls at least one grinding tool of the at least one pair of grinding tools to move in the second direction, so as to adjust the relative distance between the two grinding tools of the at least one pair of grinding tools in the second direction, and in turn control the feed amount in the grinding process, i.e. determine the grinding amount.

[0304] For example, each pair of grinding tools is provided with a grinding tool advancing and retracting mechanism. In an embodiment, the grinding tool advancing and retracting mechanism includes an advancing and retracting guide rail and an advancing and retracting driving unit. For example, as shown in FIG. 1, the grinding tool advancing and retracting mechanism includes an advancing and retracting guide rail 10 and an advancing and retracting driving unit 20. Figure 1 and Figure 3In the embodiment shown, the grinding tool advancing / retracting mechanism comprises an advancing / retracting guide rail and an advancing / retracting driving unit (not shown in the drawings), wherein the advancing / retracting guide rail is arranged on the first mounting side of the grinding tool mounting base along the second direction, and the bottom of the grinding tool is provided with a guide groove structure or a guide block structure along the second direction which cooperates with the advancing / retracting guide rail. The advancing / retracting driving unit may, for example, comprise a ball screw and a driving motor, the ball screw is arranged along the advancing / retracting guide rail, and the ball screw is associated with the corresponding grinding tool and is connected with the driving motor in a shaft manner.

[0305] In an embodiment of the present application, one of the at least one pair of grinding tools is provided with a ball screw and a driving motor, the ball screw is arranged along the second direction and is associated with the grinding tool. In this way, the driving motor is used to drive the ball screw to rotate in a forward direction so that the grinding tool associated with the ball screw moves along the advancing / retracting guide rail to face the other grinding tool arranged oppositely to reduce the grinding gap between the two grinding tools (or adjust the feed amount of grinding), or the driving motor is used to drive the ball screw to rotate in a reverse direction so that the grinding tool associated with the ball screw moves along the advancing / retracting guide rail to face away from the other grinding tool arranged oppositely to increase the grinding gap between the two grinding tools.

[0306] In an embodiment of the present application, each of the at least one pair of grinding tools is provided with a ball screw and a driving motor, and for each grinding tool, the ball screw is arranged along the second direction and is associated with the grinding tool. In this way, the driving motor is used to drive the ball screw to rotate in a forward direction so that the grinding tool associated with the ball screw moves along the advancing / retracting guide rail to face the other grinding tool arranged oppositely to reduce the grinding gap between the two grinding tools (or adjust the feed amount of grinding), or the driving motor is used to drive the ball screw to rotate in a reverse direction so that the grinding tool associated with the ball screw moves along the advancing / retracting guide rail to face away from the other grinding tool arranged oppositely to increase the grinding gap between the two grinding tools.

[0307] In an embodiment of the present application, the two grinding tools in the at least one pair of grinding tools share a ball screw and a driving motor. The ball screw can be a bidirectional screw, for example, which is arranged in the second direction. The screw shaft of the bidirectional screw is provided with two threads with opposite rotation directions, which are associated with the two grinding tools, respectively. The driving motor is associated with the bidirectional screw. The driving motor drives the bidirectional screw to rotate, so that the two grinding tools associated with the bidirectional screw move towards or away from each other along the advancing and retreating guide based on a certain cooperative relationship. For example, the driving motor drives the bidirectional screw to rotate in a forward direction, so as to drive the two associated grinding tools to move towards each other along the perpendicular line (i.e., to move close to each other), thereby reducing the grinding gap between the two grinding tools (or adjusting the grinding feed amount). Alternatively, the driving motor drives the bidirectional screw to rotate in a reverse direction, so as to drive the two associated grinding tools to move away from each other along the perpendicular line (i.e., to move away from each other), thereby increasing the grinding gap between the two grinding tools.

[0308] In an embodiment of the present application, the grinding tool conversion mechanism is used to drive the at least one pair of grinding tools to convert between the first transfer channel and the second transfer channel along the grinding tool mounting seat.

[0309] In an embodiment of the present application, the silicon rod processing platform is sequentially provided with a first processing site and a second processing site in the first direction, and the first processing site and the second processing site cross the width dimension of the silicon rod processing platform in the second direction. The first transfer device and the second transfer device are arranged in parallel in the first direction, wherein the first transfer channel in the first transfer device passes through the first processing site and the second processing site in the first direction, and the second transfer channel in the second transfer device passes through the first processing site and the second processing site in the first direction. In an embodiment of the present application, the silicon rod grinding device includes a grinding tool mounting seat and at least one pair of grinding tools arranged on the grinding tool mounting seat. The grinding tool conversion mechanism is used to drive the at least one pair of grinding tools to move in the second direction to convert between the first transfer channel and the second transfer channel. For example, the grinding tool conversion mechanism is used to drive the at least one pair of grinding tools to move on the grinding tool mounting seat in the second direction to convert from the first transfer channel to the second transfer channel, or the grinding tool conversion mechanism is used to drive the at least one pair of grinding tools to move on the grinding tool mounting seat in the second direction to convert from the second transfer channel to the first transfer channel.

[0310] In an embodiment, the grinding tool conversion mechanism includes a grinding tool conversion guide rail and a grinding tool conversion driving unit.

[0311] The grinding tool conversion guide rail is arranged in the second direction for arranging the grinding tools. In some embodiments, the grinding tool conversion guide rail is arranged on the silicon rod processing platform in the second direction, and the at least one pair of grinding tools is arranged on the grinding tool conversion guide rail by means of a slider or the like.

[0312] A grinding wheel transfer driving unit is configured to drive the at least one pair of grinding wheels to move along the grinding wheel transfer rail.

[0313] In some embodiments, the grinding wheel transfer driving unit comprises a moving rack, a driving gear and a driving source. The moving rack is arranged along the second direction and parallel to the grinding wheel transfer rail. The moving rack is fixed on the silicon rod processing platform and arranged with approximately the same first direction dimension as the grinding wheel transfer rail, and is arranged parallel and adjacent to the grinding wheel transfer rail.

[0314] The driving gear is arranged on the grinding wheel mounting seat and engaged with the moving rack to drive the at least one pair of grinding wheels to move along the grinding wheel transfer rail. The driving source is configured to drive the driving gear. In an implementation of the present application, the driving gear is arranged on the grinding wheel mounting seat, the driving gear is driven to rotate by the driving source, the gear teeth of the driving gear are engaged with the moving rack, and the at least one pair of grinding wheels connected with the driving gear are moved on the grinding wheel transfer rail accordingly.

[0315] In some embodiments, the grinding wheel transfer driving unit can be arranged on the grinding wheel mounting seat and comprises a moving screw rod and a driving source. The moving screw rod is arranged along the second direction and associated with the at least one pair of grinding wheels, and the driving source is configured to drive the moving screw rod to rotate to move the associated at least one pair of grinding wheels along the grinding wheel transfer rail.

[0316] As described above, the grinding wheel advancing and retreating mechanism is configured to drive at least one grinding wheel of the at least one pair of grinding wheels to move along the second direction, and the grinding wheel transfer mechanism is configured to drive the at least one pair of grinding wheels to transfer along the second direction between the first transfer channel and the second transfer channel. Therefore, in some embodiments, the grinding wheel advancing and retreating mechanism and the grinding wheel transfer mechanism can be combined into one set of driving mechanism to realize the functions of the grinding wheel advancing and retreating mechanism and the grinding wheel transfer mechanism.

[0317] When the grinding wheels are used to grind the silicon rod located at the second processing position, the grinding wheel advancing and retreating mechanism of the grinding wheels is configured to drive the grinding wheels of the at least one pair of grinding wheels to move along the second direction to determine the feed amount of the grinding wheels and the silicon rod grinding surface, the grinding wheel advancing mechanism is configured to drive the at least one pair of grinding wheels to move along the horizontal line until the entire silicon rod is ground, and if necessary, the grinding wheel advancing mechanism is configured to drive the at least one pair of grinding wheels to move along the horizontal line reciprocally to ensure that the silicon rod is sufficiently ground in the length direction of the silicon rod. Meanwhile, the grinding wheel advancing and retreating mechanism is configured to drive the at least one pair of grinding wheels arranged oppositely to move along the second direction to determine the feed amount of the grinding wheels and the silicon rod grinding surface. Figure 1 and Figure 3In the illustrated embodiment, at least one pair of grinding wheels are arranged opposite each other along a second direction, and the grinding surfaces of the at least one pair of grinding wheels are located in opposing vertical planes, wherein the vertical planes are perpendicular to the horizontal line, when grinding silicon rods (such as...) Figure 3 When the cut silicon rod 102 shown is being ground, the feed amount is adjusted by driving at least one of the at least one pair of grinding tools to move up and down along the second direction through the grinding tool advance and retract mechanism, so as to grind the left and right sides of the silicon rod along the second direction.

[0318] In one embodiment of this application, the silicon rod grinding device can also be used to perform chamfering on the silicon rod.

[0319] In some embodiments, any one of the at least one pair of grinding wheels includes a coarse grinding wheel and a fine grinding wheel nested together, the fine grinding wheel being used to chamfer the silicon rod.

[0320] In some embodiments, the silicon rod grinding apparatus further includes a chamfering device, which further includes at least one pair of chamfering grinding tools and a chamfering grinding tool advance / retreat mechanism. Each of the at least one pair of chamfering grinding tools is disposed adjacent to the grinding tool, and the two chamfering grinding tools of the at least one pair are disposed opposite to each other on the grinding tool mounting base. The grinding surfaces of the at least one pair of chamfering grinding tools are located in opposing vertical planes, that is, the grinding surfaces of the two chamfering grinding tools of the at least one pair are respectively located in a first vertical plane and a second vertical plane.

[0321] Regarding the chamfering abrasive, in some implementations, the chamfering abrasive includes a chamfering grinding wheel and a rotary motor connected to the chamfering grinding wheel. The chamfering grinding wheel has a certain grit size and roughness. Two opposing chamfering grinding wheels in the at least one pair of chamfering abrasives provide two symmetrical grinding surfaces to the held silicon rod. In some embodiments, the chamfering grinding wheel is circular. Since the chamfering abrasive is used to chamfer the edges of the silicon rod, the grinding amount required for the edges of the silicon rod is smaller than that for the sides of the silicon rod. Therefore, the size of the chamfering grinding wheel can be set to be smaller than the size of a coarse grinding wheel (or a fine grinding wheel) used as a coarse grinding wheel (or a fine grinding wheel used as a fine grinding wheel). The chamfering grinding wheel is formed by bonding abrasive grains with a binder, forming a surface with abrasive grains that rotates in contact with the surface of the silicon rod to be ground. The chamfering grinding wheel has a certain abrasive grain size and density, and also contains pores. The abrasive of the chamfering wheel can be set to abrasive grains with a hardness greater than that of silicon, such as aluminum oxide, silicon carbide, diamond, or cubic boron nitride, depending on the needs of grinding the silicon rod. The rotary motor is connected to the chamfering wheel via a rotating shaft and is used to drive the chamfering wheel to rotate at a predetermined speed.

[0322] The chamfering tool in-and-out mechanism is configured to drive at least one chamfering tool of the at least one pair of chamfering tools to move in the second direction. The chamfering tool in-and-out mechanism controls the at least one chamfering tool of the at least one pair of chamfering tools to move in the second direction to adjust the relative distance between the two chamfering tools of the at least one pair of chamfering tools in the second direction, thereby controlling the feed amount in the grinding process, i.e., determining the grinding amount.

[0323] In the chamfering operation of the silicon rod located in the second processing position by the chamfering tools, the chamfering tool in-and-out mechanism of the chamfering tools drives the chamfering tools to move in the second direction to determine the feed amount of the chamfering tools and the silicon rod edge grinding. The first silicon rod clamp or the second silicon rod clamp drives the silicon rod to move in the first direction until the entire silicon rod passes through the chamfering tools. If necessary, the first silicon rod clamp or the second silicon rod clamp can also drive the silicon rod to reciprocate in the first direction to ensure sufficient grinding of the silicon rod in the length direction. In addition, the clamping part rotating mechanism of the first silicon rod clamp or the second silicon rod clamp drives the clamping part to rotate to drive the clamped silicon rod to rotate by a bias angle. The chamfering tool in-and-out mechanism drives the at least one pair of oppositely arranged chamfering tools to move in the second direction to determine the feed amount of the chamfering tools and the silicon rod edge grinding.

[0324] In an embodiment of the present application, at least one of the first silicon rod clamp and the second silicon rod clamp can also be provided with a grinding repair device for grinding the corresponding grinding tool, i.e., grinding the coarse grinding tool in the corresponding coarse grinding device, grinding the fine grinding tool in the corresponding fine grinding device, or grinding the coarse grinding tool in the corresponding coarse grinding device and the fine grinding tool in the corresponding fine grinding device. By using the grinding repair device, the grinding tool can be repaired by grinding to ensure that the grinding tool can achieve the required accuracy after being used for silicon rod grinding.

[0325] In an implementation, the grinding repair device includes a mounting body and at least one grinding part. The mounting body can be provided on the silicon rod clamp, and the at least one grinding part is provided on the mounting body for grinding the corresponding at least one grinding tool. Please refer to Figure 4The mounting body 56 of the grinding repair device is arranged on at least one clamping arm of the silicon rod clamp, such as the first clamping arm 213 of the first silicon rod clamp 21 or the second clamping arm 313 of the second silicon rod clamp 31, and a grinding part 58 is arranged on each of the opposite sides of the mounting body 56. Taking the grinding of the lapping tool in the lapping device as an example, the lapping device includes a pair of lapping tools, and the pair of lapping tools arranged oppositely are moved to the outside of the grinding part in the second direction, the silicon rod clamp is driven to move along the horizontal line so that the two grinding parts on the opposite sides of the mounting body reciprocate in the first direction, and in this state, the pair of lapping tools in the lapping device can be allowed to approach the grinding part (for example, in the second direction) to contact the surface of the grinding part to achieve grinding.

[0326] The grinding part can be, for example, an oil stone. Here, the oil stone is, for example, a diamond oil stone, a boron carbide oil stone, a lapping oil stone, a general oil stone, etc. The oil stone can achieve the dressing of the surface of the lapping tool in contact by means of the particle size of the surface of the oil stone. In the grinding process, the surface of the oil stone contacts the lapping tool, and the surface of the lapping tool is dressed to be of uniform particle size and to improve the flatness and perpendicularity of the surface of the lapping tool.

[0327] In an embodiment of the present application, the silicon rod grinding device further includes a cooling device to cool the at least one pair of lapping tools, reduce the damage to the surface layer of the silicon rod in the grinding process, and improve the grinding efficiency and service life of the lapping tool. In an implementation manner of the embodiment, the cooling device includes a cooling water pipe, a flow guide groove, and a flow guide hole. In some embodiments, the outer edge of the circumference of the lapping tool is provided with a protective cover for placing cooling water into the rotating drive motor of the lapping tool. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the lapping tool. The flow guide groove is arranged on the protective cover as the contact point of the protective cover and the cooling water pipe, and the flow guide hole is arranged in the flow guide groove. The coolant of the cooling device can be common cooling water. The cooling water pipe is connected to the cooling water source, the cooling water sucked through the cooling water pipe is guided to the flow guide groove and the flow guide hole on the surface of the lapping tool, and is guided to the contact surface between the lapping tool and the ground silicon rod for cooling. In the grinding of the lapping tool, the cooling water in the flow guide hole is fully cooled by centrifugal action into the interior of the lapping tool.

[0328] In an embodiment of the present application, the silicon rod cutting and grinding all-in-one machine further includes a silicon rod transfer device arranged in the loading area of the silicon rod processing platform and used to transfer the silicon rod to be processed to the first processing area of the silicon rod processing platform.

[0329] In the present application, the silicon rod transfer device can move the silicon rod to be processed from the loading area to the first processing area and can make the silicon rod complete the centering operation before the cutting operation.

[0330] Please refer to Figure 9, shown as Figure 1 An enlarged view of the center A. The silicon rod cutting and grinding all-in-one machine comprises a silicon rod transfer device, which comprises a silicon rod carrying structure, a centering adjustment mechanism, and a feeding drive mechanism.

[0331] The silicon rod carrying structure is used to carry the silicon rod to be processed. In an embodiment of the present application, the silicon rod carrying structure is used to carry the silicon rod to be processed. In Figure 9 In the shown embodiment, the silicon rod carrying structure 71 comprises a carrying base and a first loading component and a second loading component oppositely arranged along the second direction, wherein the first loading component and the second loading component cooperate to carry the silicon rod to be processed, and each of the first loading component and the second loading component can be provided with a plurality of rollers arranged along the first direction, so that a row of rollers on the first loading component and a row of rollers on the second loading component together serve to carry the silicon rod. In other embodiments, the silicon rod carrying structure can be a whole, for example, a plate-shaped structure, for example, a rectangular carrying plate, which can be provided with a certain arc or a recess, and a pillow bar can be arranged on the rectangular carrying plate, which is made of a flexible material, for example, rubber, plastic, etc., to protect the carried silicon rod.

[0332] The silicon rod transfer device disclosed in the present application can adjust the position of the silicon rod carried by the silicon rod carrying structure through the centering adjustment mechanism, so that the axial center line of the silicon rod corresponds to the predetermined center line.

[0333] As mentioned above, the centering operation specifically refers to making the axial center line of the silicon rod coincide with the clamping center line of the first silicon rod clamp or the second silicon rod clamp, i.e., the axial center line of the silicon rod coincides with the clamping center line of the first silicon rod clamp or the second silicon rod clamp. In one implementation, the first silicon rod clamp is the same as the second silicon rod clamp, so the clamping center line of the first silicon rod clamp coincides with the clamping center line of the second silicon rod clamp in the perpendicular direction. In another implementation, the first silicon rod clamp can be different from the second silicon rod clamp, so the clamping center line of the first silicon rod clamp does not coincide with the clamping center line of the second silicon rod clamp in the perpendicular direction.

[0334] In actual application, taking the first silicon rod clamp as an example, the clamping center line of the first silicon rod clamp (or the clamping center line of the second silicon rod clamp) can be determined in advance, and the predetermined center line is determined based on the clamping center line of the first silicon rod clamp (or the clamping center line of the second silicon rod clamp), wherein the predetermined center line is the same as (i.e., consistent with) the clamping center line of the first silicon rod clamp (or the clamping center line of the second silicon rod clamp) in the plumb line direction. Therefore, the centering adjustment mechanism is used to adjust the position of the silicon rod to be machined so that the axial center line thereof corresponds to the predetermined center line, which is used to adjust the position of the silicon rod to be machined in the plumb line direction so that the axial center line thereof is consistent with the predetermined center line in the plumb line direction.

[0335] Regarding the centering adjustment mechanism, in an embodiment of the present application, the centering adjustment mechanism comprises a vertical lifting mechanism for driving the silicon rod carrying structure and the silicon rod carried thereby to make vertical lifting movement so that the axial center line of the silicon rod is aligned with the predetermined center line in the plumb line direction.

[0336] In some embodiments, the vertical lifting mechanism as the centering adjustment mechanism further comprises a vertical lifting guide rail, a sliding block, and a vertical lifting driving unit.

[0337] The vertical lifting driving unit is used to drive the silicon rod carrying structure to move up and down along the vertical lifting guide rail. In the above vertical lifting driving unit, a driving motor and a screw rod assembly driven by the driving motor are included, the driving motor can be arranged on the mounting structure, and the screw rod assembly is connected with the driving motor and the carrying base in the silicon rod carrying structure. When the vertical lifting driving unit is used, the driving motor drives the connected screw rod assembly to rotate forward, thereby driving the silicon rod carrying structure to move upward along the vertical lifting guide rail, or the driving motor drives the connected screw rod assembly to rotate reversely, thereby driving the silicon rod carrying structure to move downward along the vertical lifting guide rail.

[0338] Of course, the vertical lifting driving unit can still be changed in other ways. For example, in an embodiment, the vertical lifting driving unit can also comprise a driving motor and a gear and rack transmission assembly driven by the driving motor, wherein the gear and rack transmission assembly can comprise a driving gear and a lifting rack, the driving motor can be arranged on the mounting structure, the lifting rack is arranged in the plumb line direction and connected with the carrying base of the silicon rod carrying structure, and the driving gear is engaged with the lifting rack and controlled by the driving motor. When the vertical lifting driving unit is used, the driving motor drives the driving gear to rotate forward, thereby driving the lifting rack and the silicon rod carrying structure connected therewith to move upward along the vertical lifting guide rail, or the driving motor drives the driving gear to rotate reversely, thereby driving the lifting rack and the silicon rod carrying structure connected therewith to move downward along the vertical lifting guide rail.

[0339] In some embodiments, the vertical lifting mechanism comprises a vertical lifting guide rod and a vertical lifting driving unit.

[0340] The vertical lifting guide rod can be arranged on the carrying base of the silicon rod carrying structure along the vertical direction. For example, the silicon rod transfer device further comprises a mounting structure, and the vertical lifting guide rod is arranged on the mounting structure and passes through the carrying base of the silicon rod carrying structure. In order to ensure the stability of the lifting movement of the silicon rod loading carrying structure along the vertical lifting guide rod, the number of vertical lifting guide rods can be multiple, for example, four vertical lifting guide rods corresponding to the four corners of the carrying base of the silicon rod carrying structure. Of course, the number of vertical lifting guide rods can also be other numbers, for example, three, five, six or more. Taking three as an example, three vertical lifting guide rods can be arranged in the form of an isosceles triangle. Taking five as an example, five vertical lifting guide rods can be arranged by adding one vertical lifting guide rod in the central region on the basis of the layout of the four vertical lifting guide rods.

[0341] The vertical lifting driving unit is used to drive the silicon rod carrying structure to move up and down along the vertical lifting guide rod. In the vertical lifting driving unit, a driving motor and a screw rod assembly driven by the driving motor are included. The driving motor can be arranged on the mounting structure, and the screw rod assembly is connected with the driving motor and the carrying base of the silicon rod carrying structure. In use of the vertical lifting driving unit, the driving motor drives the connected screw rod assembly to rotate forward, thereby driving the silicon rod carrying structure to move upward along the vertical lifting guide rod, or the driving motor drives the connected screw rod assembly to rotate reversely, thereby driving the silicon rod carrying structure to move downward along the vertical lifting guide rod.

[0342] Of course, the vertical lifting driving unit can still be changed in other ways. For example, in an embodiment, the vertical lifting driving unit can also comprise a driving motor and a gear and rack transmission assembly driven by the driving motor. The gear and rack transmission assembly can comprise a driving gear and a lifting rack. The driving motor can be arranged on the mounting structure, the lifting rack is arranged along the vertical direction and connected with the carrying base of the silicon rod carrying structure, and the driving gear is engaged with the lifting rack and controlled by the driving motor. In use of the vertical lifting driving unit, the driving motor drives the driving gear to rotate forward, thereby driving the lifting rack and the connected silicon rod carrying structure to move upward along the vertical lifting guide rod, or the driving motor drives the driving gear to rotate reversely, thereby driving the lifting rack and the connected silicon rod carrying structure to move downward along the vertical lifting guide rod.

[0343] In addition, the vertical lifting driving unit can further comprise an auxiliary lifting assembly, which further comprises a cylinder and a lifting rod connected with the cylinder, wherein the cylinder is arranged on the mounting structure, and the lifting rod is connected with the cylinder and associated with the bearing base in the silicon rod bearing structure. The association between the lifting rod and the bearing base in the silicon rod bearing structure can be achieved in various ways. For example, in one implementation, the lifting rod is connected with the bearing base, and in another implementation, the lifting rod is in contact with the bearing base. In this way, when the vertical lifting driving unit is used, the auxiliary lifting assembly adjusted thereby can assist the bearing base in lifting along the vertical lifting guide rod, thereby ensuring the stability of the lifting of the bearing base.

[0344] In the present application, by driving the silicon rod carried by the silicon rod bearing structure to perform vertical lifting movement by using the aforementioned vertical lifting mechanism as the centering adjustment mechanism, the axial center line of the silicon rod can be aligned with the predetermined center line in the plumb direction, wherein the predetermined center line can be obtained according to the clamping center of the first silicon rod clamp or the clamping center of the second silicon rod clamp. Generally, since the clamping center of the first silicon rod clamp or the clamping center of the second silicon rod clamp is determined, the predetermined center line is also determined (if the clamping center line of the first silicon rod clamp and the clamping center line of the second silicon rod clamp are inconsistent in the plumb direction, then the first predetermined center line corresponding to the clamping center line of the first silicon rod clamp and the second predetermined center line corresponding to the clamping center line of the second silicon rod clamp can be included). In this way, when the vertical lifting mechanism is used, in order to ensure the lifting value of the silicon rod carried by the silicon rod bearing structure in the plumb direction, it is also necessary to determine the current dimension of the silicon rod in the plumb direction or the height difference between the silicon rod and the clamping center of the first silicon rod clamp or the clamping center of the second silicon rod clamp in the plumb direction. Therefore, in an embodiment of the present application, the centering adjustment mechanism further comprises a height detector for detecting the position information of the axial center line of the silicon rod carried by the silicon rod bearing structure in the plumb direction.

[0345] The silicon rod transfer device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that the silicon rod is located in the centered area of the silicon rod bearing structure in the first direction.

[0346] As Figure 9As shown, the silicon rod transferring device can further comprise a centering adjustment mechanism 73, which can comprise a bracket 731, an adjustment rail 733 arranged on the bracket, two pushers 735 oppositely arranged on two sides of the bracket and capable of moving relatively on the adjustment rail, and a pusher driving unit. The adjustment rail 733 is arranged along the first direction, and the two pushers 735 are arranged on the adjustment rail and oppositely arranged on two sides of the bracket respectively. The pusher driving unit further comprises a bidirectional screw rod and a driving source. The bidirectional screw rod is arranged along the first direction and threadedly connected with the two pushers at two ends respectively. The driving source is connected with the bidirectional screw rod for driving the bidirectional screw rod to rotate so that the two pushers 735 move towards or away from each other along the first direction. When the centering adjustment mechanism disclosed in the embodiment is used, the driving source is driven to rotate the bidirectional screw rod in a forward direction, so that the two pushers move towards each other along the adjustment rail (arranged along the first direction) to perform a closing action, or the driving source is driven to rotate the bidirectional screw rod in a reverse direction, so that the two pushers move away from each other along the adjustment rail (arranged along the first direction) to perform an opening action. The control source can be, for example, a servo motor.

[0347] As can be seen from the above, by using the centering adjustment mechanism, the position of the silicon rod carried on the silicon rod carrying structure in the first direction is pushed by the two pushers, so that the silicon rod is adjusted to the centering area of the silicon rod carrying structure.

[0348] As described above, the centering adjustment mechanism further comprises a height detector for detecting the position information of the axial center line of the silicon rod carried by the silicon rod carrying structure in the plumb line direction. As shown, in the embodiment of the present application, the centering adjustment mechanism comprises a height detector arranged on the centering adjustment mechanism. For example, the height detector is arranged on the adjustment rail of the centering adjustment mechanism, and can be controlled by a control source (such as a servo motor) to move in the plumb line direction and the first direction and / or the second direction. In an implementation, the height detector can be, for example, a contact sensor or a distance measuring sensor. Taking the contact sensor as an example, the contact sensor has a probe head for contacting the silicon rod. In some embodiments, a telescopic spring can be further arranged on the probe head of the contact sensor, which can be retracted under the driving of the telescopic spring when the probe head contacts the silicon rod, which can be used to protect the probe head from being damaged by being hard touched or pressed.

[0349] As can be seen from the above, by using the height detector, the height of the silicon rod can be obtained through multi-point detection of the silicon rod, and then the position information of the axial center line of the silicon rod in the plumb line direction can be obtained, so as to facilitate subsequent adjustment by the centering adjustment mechanism.

[0350] The silicon rod transferring device further comprises a silicon rod clamping mechanism arranged on the silicon rod bearing structure for clamping the silicon rod carried by the silicon rod bearing structure and making the axial center line of the silicon rod correspond to the center line of the silicon rod bearing structure. In an embodiment of the present application, the silicon rod clamping mechanism comprises a clamp mounting member and a silicon rod clamping member.

[0351] As shown in Figure 9 the silicon rod clamping mechanism 75 comprises a clamp mounting member 751 and a silicon rod clamping member 753.

[0352] The clamp mounting member 751 is arranged on the silicon rod bearing structure 71 along a first direction.

[0353] The silicon rod clamping member 753 is arranged on the clamp mounting member 751. In some embodiments, the silicon rod clamping member can be at least two, and the at least two silicon rod clamping members can be arranged at intervals along the clamp mounting member. In some embodiments, each silicon rod clamping member can further comprise a clamp arm mounting seat, two clamp arms, and a clamp arm driving mechanism. The clamp arm mounting seat is arranged on the clamp mounting member, the two clamp arms are movably arranged on the clamp arm mounting seat and oppositely arranged along a second direction, and the clamp arm driving mechanism is used to drive the two clamp arms to open and close.

[0354] In this way, when the to-be-processed silicon rod is placed on the silicon rod bearing structure, the clamp arms of the two silicon rod clamping members of the silicon rod clamping mechanism are loosened, the to-be-processed silicon rod is located between the two clamp arms of each silicon rod clamping member, and for each silicon rod clamping member, the two clamp arms are driven to clamp by the clamp arm driving mechanism of the silicon rod clamping member, so as to clamp the silicon rod.

[0355] In some embodiments, the clamp arm driving mechanism can comprise an opening and closing gear arranged on the clamp arm mounting seat, two racks each associated with a corresponding clamp arm and meshing with the opening and closing gear, and a driving source associated with the opening and closing gear for driving the opening and closing gear to rotate. The two racks are arranged in parallel and the opening and closing gear is located between the two racks, and the side of the rack facing the opening and closing gear is provided with teeth. The driving source can be, for example, a servo motor.

[0356] In this way, when the two clamp arms are driven to open and close by the clamp arm driving mechanism, the opening and closing gear is driven to rotate forward by the driving source, thereby driving the two racks meshing with the opening and closing gear and the two clamp arms associated with the two racks to move towards each other to clamp, or the opening and closing gear is driven to rotate reversely by the driving source, thereby driving the two racks meshing with the opening and closing gear and the two clamp arms associated with the two racks to move away from each other to open.

[0357] Of course, the above-mentioned clamping arm driving mechanism is not limited thereto, and in other embodiments, the clamping arm driving mechanism can still be changed in other ways, for example, the clamping arm driving mechanism can also use a screw adjusting mechanism, a chain conveying mechanism, or a speed-up chain mechanism, etc.

[0358] In addition, in the silicon rod clamping mechanism, at least one of the at least two silicon rod clamping members is provided with a spacing adjustment driving mechanism for driving the at least one silicon rod clamping member to move along the clamp mounting member to adjust the spacing of the at least two silicon rod clamping members.

[0359] In an example, the at least two silicon rod clamping members are a chain conveying mechanism driven by a motor. The chain conveying mechanism includes a ring chain and a sprocket for driving the ring chain. The ring chain is arranged in a first direction, and both ends of the ring chain are respectively provided with sprockets, the teeth of the sprockets are engaged with the chain and drive the chain to run when rotating. One of the two sprockets is used as a driving sprocket, which can be power-coupled to a motor shaft, i.e. a power output shaft. The driving sprocket is engaged with the sprockets of the two ring chains, and the conveying speed of the chain is controlled by the driving motor, i.e. the moving speed of the at least one silicon rod clamping member on the clamp mounting member is controlled.

[0360] In other feasible examples, the spacing adjustment driving mechanism can also be provided as a speed-up chain mechanism, or a transmission belt mechanism, etc.

[0361] The silicon rod conveying device further includes a feeding driving mechanism for driving the silicon rod carrying structure and the to-be-processed silicon rod carried thereby to move from the loading area to the first processing area in a second direction.

[0362] The feeding driving mechanism is arranged below the silicon rod bearing structure, and includes a feeding guide rod or feeding guide rail and a feeding driving unit. The feeding guide rod or feeding guide rail is arranged along the second direction and is used for arranging the silicon rod bearing structure, and is arranged across the base along the second direction. The feeding driving unit is used for driving the silicon rod bearing structure to move along the feeding guide rod or feeding rail. In an implementation, the feeding driving unit includes a driving motor and a screw rod assembly arranged along the second direction and driven by the driving motor. The driving motor can be arranged at one end of the screw rod assembly. The screw rod assembly is controlled by the driving motor and is screwed with the silicon rod bearing structure. Thus, when the feeding driving mechanism is used, the screw rod assembly is driven by the driving motor to rotate forward, thereby driving the silicon rod bearing structure connected with the screw rod assembly to move along the feeding guide rod or feeding guide rail (along the second direction) to the first machining position. Alternatively, the screw rod assembly is driven by the driving motor to rotate reversely, thereby driving the silicon rod bearing structure connected with the screw rod assembly to move along the feeding guide rod or feeding guide rail (along the second direction) to the loading and unloading position, so as to transfer the silicon rod carried by the silicon rod bearing structure between the loading and unloading position and the first machining position.

[0363] The silicon rod transferring device further includes a crystal line detection unit used for detecting the crystal line of the silicon rod to be machined to determine the crystal line position of the silicon rod. Figure 9 As shown in the figure, the crystal line detection unit 77 can be arranged on the silicon rod bearing structure or the silicon rod clamping mechanism. Taking the silicon rod clamping mechanism as an example, the crystal line detection unit 77 can be arranged on the silicon rod clamping member 753, for example, the clamping arm mounting seat or the clamping arm of the silicon rod clamping member 753.

[0364] In actual application, when the above-mentioned silicon rod transferring device is used, the specific operation process can generally include: the silicon rod bearing structure is located at the initial position of the loading and unloading area, and the silicon rod to be processed is placed on the silicon rod bearing structure; the position of the silicon rod to be processed in the first direction is adjusted by using the centering adjusting mechanism so that the silicon rod is located in the centering area of the silicon rod bearing structure in the first direction, and the silicon rod bearing structure carried silicon rod is clamped by using the silicon rod clamping mechanism, so that the axis of the silicon rod corresponds to the center line of the silicon rod bearing structure; the silicon rod is detected by using the height detector to obtain the position information of the axis of the silicon rod in the vertical direction, and the difference between the position information of the axis of the silicon rod in the vertical direction and the position information of the clamping center line of the first silicon rod clamp or the second silicon rod clamp in the vertical direction at the first processing area is determined, and the vertical lifting mechanism is used to drive the silicon rod bearing structure and the silicon rod carried thereby to perform lifting action in the vertical direction, so that the axis of the silicon rod is aligned with the clamping center line of the first silicon rod clamp or the second silicon rod clamp in the vertical direction at the first processing area; the silicon rod bearing structure and the silicon rod carried thereby are moved to the first processing area along the second direction by using the feeding driving mechanism, so that the silicon rod is clamped by the first silicon rod clamp or the second silicon rod clamp at the first processing area; the first silicon rod clamp or the second silicon rod clamp drives the silicon rod to rotate at a predetermined rotating speed, and the crystal line detection unit detects the crystal line of the silicon rod to determine the crystal line position of the silicon rod, and the first silicon rod clamp or the second silicon rod clamp adjusts the clamped silicon rod to the position according to the determined crystal line position of the silicon rod, thereby completing the loading of the silicon rod.

[0365] In an embodiment of the present application, the silicon rod cutting and grinding integrated machine further comprises a silicon rod unloading device arranged in the workpiece unloading area of the silicon rod processing platform, for unloading the ground silicon rod from the silicon rod processing platform.

[0366] The direction and position of the silicon rod unloading device can be determined by the position relationship of the workpiece unloading area.

[0367] In an embodiment, the workpiece unloading area is arranged adjacent along the first direction, and here, the silicon rod unloading device can be arranged along the first direction and docked with the silicon rod grinding device, so that the ground silicon rod is transported out along the first direction after being ground. The number of the silicon rod unloading device can also be determined according to the number, structure or working mode of the silicon rod grinding device or the transfer channel in the silicon rod cutting and grinding integrated machine, for example, in the embodiments shown in Figure 1 and Figure 3

[0368] ​When the first transfer channel and the second transfer channel are provided in the silicon rod cutting and grinding all-in-one machine, the silicon rod grinding device can be switched between different transfer channels and perform grinding work on the silicon rods on different transfer channels. In one embodiment, the silicon rod unloading device can be provided in two corresponding to the transfer channels, and each silicon rod unloading device is connected to one transfer channel, so that each silicon rod unloading device can unload the silicon rods on the corresponding transfer channel. Alternatively, in another embodiment, as shown in the silicon rod cutting device and the silicon rod grinding device, only one silicon rod unloading device is provided, and the silicon rod unloading device can be switched between the first transfer channel and the second transfer channel through, for example, an unloading switching mechanism, so that the silicon rod unloading device can unload the silicon rods on different transfer channels.

[0369] In some embodiments, the silicon rod unloading device can employ a silicon rod conveying device.

[0370] The silicon rod conveying device can be, for example, a chain conveying mechanism, a speed-up chain mechanism, or a conveyor belt mechanism.

[0371] In one embodiment, the silicon rod conveying mechanism includes a conveying part for carrying the silicon rod, and a conveying drive source for driving the conveying part to move to convey the silicon rod.

[0372] The conveying part can be arranged in a first direction and transport the carried silicon rod in the first direction under the driving of the conveying drive source. The movement direction of the conveying part can be arranged in a direction towards the workpiece unloading area to deliver the carried silicon rod to the workpiece unloading area.

[0373] The conveying drive source, for example, a motor, is used to drive the conveying part to move and control the transport speed of the conveying part.

[0374] In some examples, in order to avoid the silicon rod from being damaged by collision during conveying, in some embodiments, the conveying part is provided with a buffer pad for contacting the silicon rod, or the conveying part is made of a buffer material. The buffer pad or buffer material is, for example, rubber, silicone, or other materials with elastic deformation, damping characteristics, or buffering characteristics to reduce the risk of damage to the silicon rod during conveying.

[0375] In some embodiments, the silicon rod unloading device can employ a silicon rod pinch device.

[0376] The silicon rod pinch device includes a clamping part for clamping the silicon rod, and a conveying drive source for driving the clamping part to move to convey the silicon rod.

[0377] The clamping part can be arranged in a first direction for clamping two end faces of the silicon rod, and transport the carried silicon rod in the first direction under the driving of the conveying drive source.

[0378] The conveying drive source is, for example, a motor for driving the clamping portion to move and controlling the conveying speed of the clamping portion.

[0379] In this application, the disclosed silicon rod cutting and grinding integrated machine integrates the silicon rod cutting device and the grinding device, and sets the silicon rod cutting device and the grinding device in the first processing area and the second processing area of the silicon rod processing platform respectively, and sets the first transfer device and the second transfer device which penetrate through the first processing area and the second processing area, and configures the silicon rod clamp and the driving mechanism for the first and second transfer devices respectively, and coordinates the control of the first and second transfer devices and the silicon rod cutting device and the grinding device, so that the silicon rod cutting device in the first processing area and the grinding device in the second processing area are both in working state at the same time, thereby completing the integrated operation of the silicon rod squaring and grinding multi-process, improving the production efficiency and the quality of the product operation.

[0380] When the silicon rod cutting and grinding integrated machine in the embodiment shown in the figure is used for silicon rod operation, the specific process can be roughly as follows: Figure 1 and Figure 2 When the silicon rod cutting and grinding integrated machine in the embodiment shown in the figure is used for silicon rod operation, the specific process can be roughly as follows:

[0381] The first silicon rod is placed on the silicon rod transfer device 7 located at the loading and unloading area.

[0382] The first silicon rod is transferred to the first processing area by the silicon rod transfer device 7, and the first silicon rod is clamped by the first silicon rod clamp 2 located on the first transfer channel in the first processing area to complete the loading. Among them, the center line of the first silicon rod is on the same straight line with the clamping center line of the first silicon rod clamp 2. At this time, the silicon rod cutting device 4 is located on the first transfer channel, and the silicon rod grinding device 5 is located on the second transfer channel.

[0383] The first silicon rod clamp 2 and the first silicon rod clamped by it are driven to move along the first direction, so that the silicon rod cutting device 4 cuts the first silicon rod. When the silicon rod cutting device cuts the first silicon rod, first, the two parallel cutting line saws formed in the silicon rod cutting device cut the first silicon rod for the first time, so that the opposite two side surfaces of the first silicon rod are cut, and the edge skin left after cutting is removed. The first silicon rod clamp is driven to retreat to the initial position along the first direction, the first silicon rod is rotated by 90° by the first silicon rod clamp to adjust the cutting surface, and the first silicon rod clamp and the first silicon rod clamped by it are continuously driven to move along the first direction, so that the silicon rod cutting device cuts the remaining two side surfaces of the first silicon rod, removes the edge skin left after cutting, forms a silicon rod with a rectangular cross section, and completes the squaring of the silicon rod.

[0384] The silicon rod cutting device 4 is switched from the first transfer channel to the second transfer channel, and the silicon rod grinding device 5 is switched from the second transfer channel to the first transfer channel.

[0385] The second silicon rod is transferred to the first processing position by the silicon rod transfer device 7, and the second silicon rod is clamped by the second silicon rod clamp 3 in the first processing position to complete the loading. The center line of the second silicon rod is in line with the clamping center line of the second silicon rod clamp 3.

[0386] The first silicon rod clamp 2 and the first silicon rod clamped thereby are driven to move in the first direction, and the silicon rod grinding device 5 performs a grinding operation on the first silicon rod. In some embodiments, the grinding operation includes a rough grinding operation and a fine grinding operation. For example, the first silicon rod is first subjected to a rough grinding operation by a rough grinding tool in the silicon rod grinding device, and then subjected to a fine grinding operation by a fine grinding tool in the silicon rod grinding device. In some embodiments, the grinding operation includes a rough grinding operation, a fine grinding operation, and a chamfering operation. For example, the first silicon rod is first subjected to a rough grinding operation by a rough grinding tool in the silicon rod grinding device, then subjected to a fine grinding operation by a fine grinding tool in the silicon rod grinding device, and finally subjected to a chamfering operation by a fine grinding tool or a chamfering tool in the silicon rod grinding device. At the same time, the second silicon rod clamp 3 and the second silicon rod clamped thereby are driven to move in the first direction, and the silicon rod cutting device 4 performs a cutting operation on the second silicon rod to form a silicon rod with a rectangular cross section, thereby completing the square of the silicon rod.

[0387] The first silicon rod after the grinding operation is unloaded, the silicon rod cutting device 2 is switched from the second transfer channel to the first transfer channel, and the silicon rod grinding device 3 is switched from the first transfer channel to the second transfer channel.

[0388] The third silicon rod is transferred to the first processing position by the silicon rod transfer device 7, and the third silicon rod is clamped by the first silicon rod clamp in the first processing position to complete the loading.

[0389] The second silicon rod clamp 3 and the second silicon rod clamped thereby are driven to move in the first direction, and the silicon rod grinding device 5 performs a grinding operation on the second silicon rod. At the same time, the first silicon rod clamp 2 and the third silicon rod clamped thereby are driven to move in the first direction, and the silicon rod cutting device 4 performs a cutting operation on the third silicon rod.

[0390] The above operation process is repeated to complete the integrated operation of the square of the silicon rod and the grinding process.

[0391] The above embodiments are only illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed in the present application should be covered by the claims of the present application.

Claims

1. A silicon rod cutting and grinding all-in-one machine, characterized in that, The application relates to a silicon rod cutting and grinding integrated machine. The machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a first processing position and a second processing position; A first transfer device is arranged in a first transfer channel and comprises a first silicon rod clamp and a first transfer driving mechanism; the first silicon rod clamp is used for clamping two end faces of a silicon rod and can drive the clamped silicon rod to rotate; the first transfer driving mechanism is used for driving the first silicon rod clamp and the clamped silicon rod to move along a first direction and transfer between the first processing position and the second processing position; after the silicon rod is clamped by the first silicon rod clamp, the silicon rod is in a horizontal type, that is, the silicon rod is clamped in a mode that the axial center line of the silicon rod is consistent with the first direction; The first direction is the length extension direction of the silicon rod cutting and grinding integrated machine; A second transfer device is arranged in a second transfer channel and comprises a second silicon rod clamp and a second transfer driving mechanism; the second silicon rod clamp is used for clamping two end faces of a silicon rod and can drive the clamped silicon rod to rotate; the second transfer driving mechanism is used for driving the second silicon rod clamp and the clamped silicon rod to move along the first direction and transfer between the first processing position and the second processing position; after the silicon rod is clamped by the second silicon rod clamp, the silicon rod is in a horizontal type, that is, the silicon rod is clamped in a mode that the axial center line of the silicon rod is consistent with the first direction; A silicon rod cutting device is arranged at the first processing position of the silicon rod processing platform and can move along a second direction to switch between the first transfer channel and the second transfer channel; the silicon rod cutting device is used for cutting a to-be-cut silicon rod clamped by the first transfer device on the first transfer channel or a to-be-cut silicon rod clamped by the second transfer device on the second transfer channel; The second direction is perpendicular to the first direction, and the second direction is the width extension direction of the silicon rod cutting and grinding integrated machine; A silicon rod grinding device is arranged at the second processing position of the silicon rod processing platform and can move along the second direction to switch between the first transfer channel and the second transfer channel; the silicon rod grinding device is used for grinding a cut silicon rod clamped by the first transfer device on the first transfer channel or a cut silicon rod clamped by the second transfer device on the second transfer channel. The first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, or the first transfer device is arranged above the silicon rod processing platform through a first mounting frame and the second transfer device is arranged above the silicon rod processing platform through a second mounting frame.

2. The silicon rod cutting and grinding all-in-one machine according to claim 1, characterized in that, The first silicon rod clamp comprises:

3. The silicon rod cutting and grinding all-in-one machine according to claim 1, characterized in that, A first clamp arm mounting seat; At least one pair of first clamp arms is arranged on the first clamp arm mounting seat in a first direction and is used for clamping two end faces of a silicon rod; wherein any one of the at least one pair of first clamp arms is provided with a clamping part; and A first clamp arm driving mechanism is used for driving at least one of the at least one pair of first clamp arms to move along the first direction to adjust the clamping spacing between the at least one pair of first clamp arms. The first transfer driving mechanism comprises:

4. The silicon rod cutting and grinding all-in-one machine according to claim 3, characterized in that, A first transfer guide rail arranged along the first direction and used for arranging the first clamp arm mounting seat; and A first transfer driving unit used for driving the first clamp arm mounting seat and the at least one pair of first clamp arms to move along the first transfer guide rail. ​ 5. The silicon rod cutting and grinding all-in-one machine according to claim 4, characterized in that, The first transfer driving unit comprises: a first moving rack rail arranged along a first direction; a first driving gear arranged on the first clamp arm mounting seat and engaged with the first moving rack rail; and a first driving source for driving the first driving gear to move the associated first clamp arm mounting seat and at least one pair of first clamp arms along the first transfer guide rail.

6. The silicon rod cutting and grinding all-in-one machine according to claim 4, characterized in that, The first transfer driving unit comprises: a first moving rack rail arranged along a first direction; a first driving gear arranged on the first clamp arm mounting seat and engaged with the first moving rack rail; and 7. The silicon rod cutting and grinding all-in-one machine according to claim 3, characterized in that, a first driving source for driving the first driving gear to move the associated first clamp arm mounting seat and at least one pair of first clamp arms along the first transfer guide rail.

8. The silicon rod cutting and grinding all-in-one machine according to claim 1, characterized in that, The at least one pair of first clamp arms is of a rotating structure; the first silicon rod clamp further comprises a first clamp arm rotating mechanism arranged on at least one first clamp arm of the at least one pair of first clamp arms, for driving the clamping portion of the at least one first clamp arm to rotate. The second silicon rod clamp comprises: a second clamp arm mounting seat; at least one pair of second clamp arms arranged on the second clamp arm mounting seat in a first direction and facing each other, for clamping two end faces of a silicon rod; wherein any one second clamp arm of the at least one pair of second clamp arms is provided with a clamping portion; and 9. The silicon rod cutting and grinding all-in-one machine according to claim 8, characterized in that, a second clamp arm driving mechanism for driving at least one second clamp arm of the at least one pair of second clamp arms to move along the first direction to adjust the clamping spacing between the at least one pair of second clamp arms. The second transfer driving mechanism comprises: a second transfer guide rail arranged along a first direction for arranging the second clamp arm mounting seat; and 10. The silicon rod cutting and grinding all-in-one machine according to claim 9, characterized in that, a second transfer driving unit for driving the second clamp arm mounting seat and at least one pair of second clamp arms along the second transfer guide rail. The second transfer driving unit comprises: a second moving rack rail arranged along a first direction; a second driving gear arranged on the second clamp arm mounting seat and engaged with the second moving rack rail; and 11. The silicon rod cutting and grinding all-in-one machine according to claim 9, characterized in that, a second driving source for driving the second driving gear to move the associated second clamp arm mounting seat and at least one pair of second clamp arms along the second transfer guide rail. The second transfer driving unit comprises: a second moving rack rail arranged along a first direction; 12. The silicon rod cutting and grinding all-in-one machine according to claim 8, characterized in that, a second driving gear arranged on the second clamp arm mounting seat and engaged with the second moving rack rail; and 13. The silicon rod cutting and grinding all-in-one machine according to claim 1, characterized in that, a second driving source for driving the second driving gear to move the associated second clamp arm mounting seat and at least one pair of second clamp arms along the second transfer guide rail. The at least one pair of second clamp arms is of a rotating structure; the second silicon rod clamp further comprises a second clamp arm rotating mechanism arranged on at least one second clamp arm of the at least one pair of second clamp arms, for driving the clamping portion of the at least one second clamp arm to rotate. The silicon rod cutting device comprises: a cutting frame; 14. The silicon rod cutting and grinding all-in-one machine according to claim 13, characterized in that, at least one wire cutting unit arranged on the cutting frame; the wire cutting unit comprises: at least two cutting wheels, a transition wheel, and a cutting wire, the cutting wire being wound around the at least two cutting wheels and the transition wheel to form at least one wire saw; and a cutting conversion mechanism for driving the cutting frame and the at least one wire cutting unit thereon to convert between a first transfer channel and a second transfer channel. The wire cutting unit comprises: Cutting line; A first cutting wheel and a second cutting wheel are provided on the cutting frame, and the cutting line is wound around the first cutting wheel and the second cutting wheel to form a cutting line saw; wherein the wheel surface of the first cutting wheel is parallel or coplanar with the wheel surface of the second cutting wheel; A first transition wheel is provided adjacent to the first cutting wheel, and in the state of pulling the cutting line, the cutting line of the first cutting wheel and the first transition wheel is located in the plane of the first cutting line groove in the first cutting wheel for winding the cutting line; A second transition wheel is provided adjacent to the second cutting wheel, and in the state of pulling the cutting line, the cutting line of the second cutting wheel and the second transition wheel is located in the plane of the second cutting line groove in the second cutting wheel for winding the cutting line; and At least one third transition wheel is provided between the first transition wheel and the second transition wheel, and is used to pull the cutting line between the first transition wheel and the second transition wheel, so as to form a cutting accommodation space in the wire cutting unit.

15. The silicon rod cutting and grinding all-in-one machine according to claim 14, characterized in that, The first transition wheel, the second transition wheel, and the at least one third transition wheel are used to pull the cutting line away from the cutting accommodation space.

16. The silicon rod cutting and grinding all-in-one machine according to claim 14, characterized in that, The cutting line is wound around the first cutting wheel, the second cutting wheel, the first transition wheel, the second transition wheel, and the third transition wheel to form a closed loop cutting line.

17. The silicon rod cutting and grinding all-in-one machine according to claim 16, characterized in that, The wire cutting unit includes two third transition wheels, wherein the cutting line is sequentially wound around the first cutting wheel, the second cutting wheel, the second transition wheel, a third transition wheel, another third transition wheel, the first transition wheel, and the first cutting wheel to form a closed loop cutting line.

18. The silicon rod cutting and grinding all-in-one machine according to claim 14, characterized in that, The silicon rod cutting device further comprises a cutting line driving device for driving the cutting line to operate to cut the silicon rod to be cut.

19. The silicon-rod cutting and grinding all-in-one machine according to claim 18, characterized in that, The cutting line driving device is a motor having a power output shaft, and the power output shaft is connected to the first cutting wheel or the second cutting wheel.

20. The silicon rod cutting and grinding all-in-one machine according to claim 14, characterized in that, The silicon rod cutting device further comprises: At least one distance adjusting mechanism is provided in the at least one wire cutting unit, and is used to drive at least two cutting wheels in the wire cutting unit to move relative to the cutting frame in a direction perpendicular to the cutting wheel surface.

21. The silicon rod cutting and grinding all-in-one machine according to claim 20, characterized in that, The silicon rod cutting device includes a single-wire cutting unit, and the distance adjusting mechanism includes: A lead screw is arranged in a direction perpendicular to the cutting wheel surface and is threadedly connected to the single-wire cutting unit; and A driving source is used to drive the lead screw to rotate.

22. The silicon rod cutting and grinding all-in-one machine according to claim 20, characterized in that, The silicon rod cutting device includes a single-wire cutting unit, and the distance adjusting mechanism includes: An extension member is arranged in a direction perpendicular to the cutting wheel surface and is associated with the single-wire cutting unit; and A driving source is used to drive the extension member to extend and retract in a direction perpendicular to the cutting wheel surface.

23. The silicon-rod cutting and grinding all-in-one machine according to claim 20, characterized in that, The silicon rod cutting device includes a first wire cutting unit and a second wire cutting unit arranged in parallel and opposite directions, and at least one of the first wire cutting unit and the second wire cutting unit is driven to move in a direction perpendicular to the cutting wheel surface by the distance adjusting mechanism.

24. The silicon-rod cutting and grinding all-in-one machine according to claim 23, characterized in that, The distance adjusting mechanism includes: A lead screw is arranged in a direction perpendicular to the cutting wheel surface and is threadedly connected to the first wire cutting unit or the second wire cutting unit; and A driving source is used to drive the lead screw to rotate.

25. The silicon-rod cutting and grinding all-in-one machine according to claim 23, characterized in that, The distance adjusting mechanism includes: a telescopic member arranged along a direction orthogonal to the wheel surface of the cutting wheel and associated with the first or second wire cutting unit; and a driving source for driving the telescopic member to perform telescopic movement along the direction orthogonal to the wheel surface of the cutting wheel.

26. The silicon-rod sawing and grinding all-in-one machine according to claim 23, characterized in that, The distance adjusting mechanism comprises: a bidirectional screw rod arranged along a direction orthogonal to the wheel surface of the cutting wheel and threadedly connected with the first and second wire cutting units; and a driving source for driving the bidirectional screw rod to rotate so as to move the first and second wire cutting units towards or away from each other along the direction orthogonal to the wheel surface of the cutting wheel.

27. The silicon-rod cutting and grinding all-in-one machine according to claim 13, characterized in that, The cutting conversion mechanism comprises: a cutting conversion guide rail arranged along a second direction for arranging the cutting frame; the second direction being perpendicular to the first direction; and a cutting conversion driving unit for driving the cutting frame and at least one wire cutting unit thereof to move along the cutting conversion guide rail.

28. The silicon-rod sawing and grinding all-in-one machine according to claim 27, characterized in that, The cutting conversion driving unit comprises: a moving rack arranged along a second direction; a driving gear arranged on the cutting frame and engaged with the moving rack; and a driving source for driving the driving gear to move the associated cutting frame and at least one wire cutting unit thereof along the cutting conversion guide rail.

29. The silicon-rod sawing and grinding all-in-one machine according to claim 27, characterized in that, The cutting conversion driving unit comprises: a moving screw rod arranged along a second direction and associated with the cutting frame; and a driving source for driving the moving screw rod to rotate so as to move the associated cutting frame and at least one wire cutting unit thereof along the cutting conversion guide rail.

30. The silicon-rod sawing and grinding all-in-one machine according to claim 13, characterized in that, Further comprising a side skin unloading device, the side skin unloading device comprising a side skin supporting mechanism for abutting against the outer side of the silicon rod and supporting the side skin formed by cutting.

31. The silicon-rod cutting and grinding all-in-one machine according to claim 30, characterized in that, The side skin supporting mechanism comprises: a supporting portion; and a driving unit connected with the supporting portion to control the supporting portion to move away from or abut against the side skin.

32. The silicon-rod sawing and grinding all-in-one machine according to claim 31, characterized in that, The supporting portion comprises: at least two supporting blocks arranged along the first direction and having supporting surfaces for contacting and supporting the side skin.

33. The silicon-rod sawing and grinding all-in-one machine according to claim 31, characterized in that, The supporting portion comprises: at least two supporting rods arranged along the first direction for contacting and supporting the side skin; and two connecting portions arranged on opposite sides of the cutting frame in the first direction to correspond to opposite ends of the at least two supporting rods, for connecting the at least two supporting rods and connecting with the driving unit.

34. The silicon-rod sawing and grinding all-in-one machine according to claim 31, characterized in that, The supporting portion comprises at least two supporting wheel sets arranged along the first direction, wherein the supporting wheel set comprises: at least two supporting wheels arranged at intervals for contacting and supporting the side skin; and a supporting base for arranging the at least two supporting wheels and connecting with the driving unit.

35. The silicon-rod sawing and grinding all-in-one machine according to claim 31, characterized in that, The driving unit comprises: a pneumatic cylinder or hydraulic pump; and a telescopic portion connected with the supporting portion and driven to perform telescopic movement by the pneumatic cylinder or hydraulic pump to control the supporting portion to move away from or abut against the side skin.

36. The silicon-rod sawing and grinding all-in-one machine according to claim 31, characterized in that, The driving unit comprises: a driving motor; and a screw rod assembly connected with the supporting portion and driven to move by the driving motor to control the supporting portion to move away from or abut against the side skin.

37. The silicon-rod sawing and grinding all-in-one machine according to claim 30, characterized in that, The side skin unloading device further comprises a side skin misalignment mechanism arranged on the machine base or the silicon rod cutting device, for pushing the side skin along the first direction to make the side skin disengage from the side skin supporting mechanism.

38. The silicon-rod sawing and grinding all-in-one machine according to claim 37, characterized in that, The side skin misalignment mechanism comprises: a pushing portion; and a A cylinder or a hydraulic pump is arranged along the first direction to drive the telescopic rod to push the edge in the first direction.

39. The silicon-rod sawing and grinding all-in-one machine according to claim 30, characterized in that, The edge discharging device further comprises an edge conveying mechanism arranged to receive the cut edge and to transfer the edge to a discharging area.

40. The silicon-rod sawing and grinding all-in-one machine according to claim 39, characterized in that, The edge conveying mechanism comprises: a conveying part arranged to receive the edge; and a conveying drive source arranged to drive the conveying part to move in the first direction to convey the edge.

41. The silicon-rod cutting and grinding all-in-one machine according to claim 1, characterized in that, The silicon rod grinding device comprises: a grinding tool mounting base; at least one pair of grinding tools arranged on the grinding tool mounting base; a grinding tool advancing and retreating mechanism arranged to drive at least one grinding tool of the at least one pair of grinding tools to move in a second direction, wherein the second direction is perpendicular to the first direction; and a grinding tool switching mechanism arranged to drive the at least one pair of grinding tools to switch between a first switching path and a second switching path along the grinding tool mounting base.

42. The silicon-rod sawing and grinding all-in-one machine according to claim 41, characterized in that, Any one of the at least one pair of grinding tools comprises a coarse grinding wheel and a fine grinding wheel nested with each other.

43. The silicon-rod sawing and grinding all-in-one machine according to claim 42, characterized in that, The coarse grinding wheel is nested in the fine grinding wheel, and at least one of the coarse grinding wheel and the fine grinding wheel is provided with a telescopic driving mechanism; or the fine grinding wheel is nested in the coarse grinding wheel, and at least one of the coarse grinding wheel and the fine grinding wheel is provided with a telescopic driving mechanism.

44. The silicon-rod sawing and grinding all-in-one machine according to claim 41, characterized in that, The grinding tool switching mechanism comprises: a grinding tool switching guide rail arranged along the second direction and arranged to arrange the grinding tool mounting base; and a grinding tool switching drive unit arranged to drive the at least one pair of grinding tools to move along the grinding tool switching guide rail.

45. The silicon-rod sawing and grinding all-in-one machine according to claim 44, characterized in that, The grinding tool switching drive unit comprises: a moving rack arranged along the second direction; a driving gear arranged on the grinding tool mounting base and engaged with the moving rack; and a drive source arranged to drive the driving gear to drive the associated grinding tool mounting base and the at least one pair of grinding tools to move along the grinding tool switching guide rail.

46. The silicon-rod sawing and grinding all-in-one machine according to claim 44, characterized in that, The grinding tool switching drive unit comprises: a moving lead screw arranged along the second direction and associated with the grinding tool mounting base; and a drive source arranged to drive the moving lead screw to rotate to drive the associated grinding tool mounting base and the at least one pair of grinding tools to move along the grinding tool switching guide rail.

47. The silicon-rod sawing and grinding all-in-one machine according to claim 41, characterized in that, The silicon rod grinding device further comprises at least one pair of chamfering grinding tools arranged on the grinding tool mounting base.

48. The silicon-rod sawing and grinding all-in-one machine according to claim 41, characterized in that, Any one of the first silicon rod clamp and the second silicon rod clamp further comprises a grinding repairing device arranged to repair at least one pair of grinding tools in the corresponding silicon rod grinding device.

49. The silicon-rod cutting and grinding all-in-one machine according to claim 1, characterized in that, Further comprising: a silicon rod transferring device arranged at a loading area of the silicon rod processing platform and arranged to transfer a to-be-processed silicon rod to a first processing area of the silicon rod processing platform.

50. The silicon-rod sawing and grinding all-in-one machine according to claim 49, characterized in that, The silicon rod transferring device comprises: a silicon rod receiving structure arranged to receive the to-be-processed silicon rod; a centering adjusting mechanism arranged to adjust a position of the to-be-processed silicon rod to correspond to a predetermined center line; and a feeding drive mechanism arranged to drive the silicon rod receiving structure and the to-be-processed silicon rod received thereby to move from the loading area to the first processing area in the second direction.

51. The silicon-rod sawing and grinding all-in-one machine according to claim 50, characterized in that, The centering adjustment mechanism comprises a vertical lifting mechanism for driving the silicon rod carrying structure and the carried silicon rod to be processed to make vertical lifting movement so that the axial center line of the silicon rod to be processed is vertically aligned with the predetermined center line.

52. The silicon-rod sawing and grinding all-in-one machine according to claim 51, characterized in that, The vertical lifting mechanism comprises: a vertical lifting guide rail arranged on the silicon rod carrying structure; a sliding block arranged on the silicon rod carrying structure; and a vertical lifting driving unit.

53. The silicon-rod sawing and grinding all-in-one machine according to claim 51, characterized in that, The vertical lifting mechanism comprises: a vertical lifting guide rail for arranging the silicon rod carrying structure; and a vertical lifting driving unit for driving the silicon rod carrying structure to move up and down along the vertical lifting guide rail.

54. The silicon-rod sawing and grinding all-in-one machine according to claim 52 or 53, characterized in that, The vertical lifting driving unit comprises a driving motor and a screw rod assembly arranged vertically and driven by the driving motor, or a driving motor and a gear and rack transmission assembly arranged vertically and driven by the driving motor.

55. The silicon-rod sawing and grinding all-in-one machine according to claim 50, characterized in that, The silicon rod transferring device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be processed in the first direction so that it is located in the centering area of the silicon rod carrying structure.

56. The silicon-rod sawing and grinding all-in-one machine according to claim 55, characterized in that, The centering adjustment mechanism comprises: a support arranged on the machine base or the silicon rod carrying structure; an adjustment guide rail arranged on the support in the first direction; at least two pushers arranged on opposite sides of the support, respectively; an adjustment driving unit for driving the at least two pushers to move towards each other along the adjustment guide rail to push the silicon rod to the centering area of the silicon rod carrying structure.

57. The silicon-rod sawing and grinding all-in-one machine according to claim 56, characterized in that, The adjustment driving unit comprises a driving motor and a screw rod assembly arranged in the first direction and driven by the driving motor, or a driving motor and a gear and rack transmission assembly arranged in the first direction and driven by the driving motor.

58. The silicon-rod sawing and grinding all-in-one machine according to claim 50, characterized in that, The silicon rod transferring device further comprises a silicon rod clamping mechanism arranged on the silicon rod carrying structure.

59. The silicon-rod sawing and grinding all-in-one machine according to claim 58, characterized in that, The silicon rod clamping mechanism comprises: a clamp mounting member arranged on the silicon rod carrying structure in the first direction; and at least two silicon rod clamping members arranged at intervals along the clamp mounting member.

60. The silicon-rod sawing and grinding all-in-one machine according to claim 59, characterized in that, The silicon rod clamping member comprises: a clamp arm mounting seat arranged on the clamp mounting member; two clamp arms movably arranged on the clamp arm mounting seat; and a clamp arm driving mechanism for driving the two clamp arms to open and close.

61. The silicon-rod sawing and grinding all-in-one machine according to claim 60, characterized in that, The clamp arm driving mechanism comprises: an opening and closing gear arranged on the clamp arm mounting seat; two racks, each associated with a clamp arm and meshing with the opening and closing gear; and a driving source associated with the opening and closing gear for driving the opening and closing gear to rotate.

62. The silicon-rod sawing and grinding all-in-one machine according to claim 59, characterized in that, In the silicon rod clamping mechanism, at least one silicon rod clamping member of the at least two silicon rod clamping members is provided with an interval adjustment driving mechanism for driving it to move along the clamp mounting member to adjust the interval of the at least two silicon rod clamping members.

63. The silicon-rod sawing and grinding all-in-one machine according to claim 62, characterized in that, The interval adjustment driving mechanism is a screw rod adjustment mechanism, a chain conveying mechanism, a speed-up chain mechanism, or a transmission belt mechanism.

64. The silicon-rod sawing and grinding all-in-one machine according to claim 50, characterized in that, The feeding driving mechanism comprises: a feeding guide rail or feeding guide rail arranged in the second direction for arranging the silicon rod carrying structure; and a feeding driving unit for driving the silicon rod carrying structure to move along the feeding guide rail or feeding guide rail.

65. The silicon-rod sawing and grinding all-in-one machine according to claim 50, characterized in that, The silicon rod transferring device further comprises a crystal line detection unit.

66. The integrated ingot sawing and grinding machine of claim 1, wherein, Further comprising: The silicon rod unloading device is arranged in a workpiece unloading area of the silicon rod processing platform and is used for unloading the silicon rod after grinding from the silicon rod processing platform.

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