Heat sink shield with thermal contact recess for heat dissipation in radar assemblies

Abstract

A heat sink shield with thermally contacting recesses can improve heat dissipation in a radar assembly. The radar assembly includes a printed circuit board (PCB), a heat sink shield, a radome, and a housing. The PCB may include integrated circuits and other components, as well as a thermally conductive material covering at least a portion of the PCB surface. The heat sink shield includes a plurality of recesses that are in thermal contact with the thermally conductive material. The heat sink shield is configured to dissipate heat generated, at least in part, by the PCB components to the housing. In this way, the described techniques and systems allow the radar assembly to better dissipate heat from the PCB components to the rest of the PCB and through the housing.

Description

Background Art

[0001] Radar systems use electromagnetic signals to detect and track objects. For many applications (e.g., in automobiles), engineers face challenges with electromagnetic interference (EMI) and thermal management when packaging the radar system's electronic components. For example, a radar system's monolithic microwave integrated circuits (MMICs), processors, and / or power supply circuits are typically shielded from EMI. Heat energy from the MMICs and other circuitry is typically distributed throughout the radar system to prevent localized heating that could exceed the temperature limits of the silicon components and printed circuit boards (PCBs). As manufacturers add more components to radar system PCBs, systems and techniques that provide effective EMI shielding and thermal management are increasingly sought after. Summary of the Invention

[0002] This document describes techniques and systems for a heat sink shield with thermal contact recesses for a radar assembly. For example, a radar system may include a PCB, a heat sink shield, a radome, and a housing. The PCB includes a multifunctional microcontroller (MMIC) and a thermally conductive material covering a portion of a first surface and a second surface of the PCB. The heat sink shield includes a plurality of recesses that are in thermal contact with the thermally conductive material (e.g., copper circuit traces) of the PCB. The heat sink shield is adjacent to at least one of the first surface or the second surface of the PCB and the MMIC. The heat sink shield dissipates heat energy generated at least in part by the MMIC to a housing adjacent to the second surface of the PCB. The radome is adjacent to the heat sink shield and at least a portion of the housing. The radome and the housing surround the PCB and the heat sink shield.

[0003] This document also describes methods performed by the systems summarized above and other methods set forth herein, as well as apparatus for performing these methods and various configurations of the systems.

[0004] This summary introduces a simplified concept for a heat sink shield with thermal contact recesses for a radar assembly, which is further described below in the detailed description and accompanying figures. This summary is not intended to identify essential features of the claimed subject matter, nor is it intended to be used to determine the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Details of one or more aspects of a heat sink shield with thermal contact recesses for a radar assembly are described herein with reference to the following figures. Like numbers are generally used throughout the figures to reference similar features and components:

[0006] Figure 1 An example environment is shown in which a radar assembly having a heat sink shield with thermal contact recesses may be implemented;

[0007] Figures 2 to 4shows an exploded partial cross-section of an example radar assembly having a recessed radiator shield;

[0008] Figures 5 to 7 shows a cross-section of an example radar assembly having a recessed radiator shield; and

[0009] Figure 8 An example method of assembling a radar system having a radiator shield with a recess is depicted. DETAILED DESCRIPTION

[0010] Overview

[0011] Radar systems are an important sensing technology that several vehicle-based systems rely on to obtain information about their surroundings. Some radar systems can be susceptible to overheating and electromagnetic interference, leading to issues related to thermal management and shielding.

[0012] Some radar systems rely on through-board cooling to dissipate heat generated by the MMIC (or other discrete components) through the housing and other parts of the radar assembly. This approach to thermal management can be particularly challenging when the MMIC is mounted on the same side of the PCB as the radome (also referred to as the "radome side" of the PCB). In such implementations, through-board cooling may not be possible because the PCB may include other discrete components, including those located on the opposite side of the PCB from the MMIC.

[0013] In contrast, this document describes techniques and systems for improving thermal management in radar systems using a heat sink shield. For example, a radar assembly can include a heat sink shield that extends to an unpopulated area of a PCB and is thermally connected to its ground plane. A thermal depression in the heat sink shield is thermally connected to the PCB. Pressure applied by the enclosure containing the radar system ensures that the depression is in thermal contact with the surface of the PCB. In this way, the heat sink shield transfers at least some of the heat generated by the MMIC and other discrete components to the housing side of the PCB (which has thermal vias) and the housing. Compared to other thermal management techniques, the described heat sink shield with thermally contacting depressions allows the radar assembly to better dissipate heat from relatively hot components (such as the MMIC) to the rest of the PCB and the housing. The described heat sink shield can also enable the radar assembly to be manufactured with fewer steps than other radar assemblies, which require, for example, soldering and placing a shield frame. Furthermore, by providing full access to the ball grid assembly (BGA) package, the described systems and techniques can simplify underfill and corner adhesive dispensing processes.

[0014] This is just one example of how the described techniques and systems can provide a heat sink shield with a recess for a radar assembly. Other examples and configurations are described throughout this document.

[0015] Operating Environment

[0016] Figure 1 An example environment 100 is shown in which a radar assembly 102 having a recessed radiator shield may be implemented. In the depicted environment 100, radar assembly 102 is mounted to or integrated within a vehicle 104. Radar assembly 102 is capable of detecting one or more objects 108 in the vicinity of vehicle 104. Although shown as an automobile, vehicle 104 may represent other types of motorized vehicles (e.g., motorcycles, buses, tractors, semi-trailers, or construction equipment), non-motorized vehicles (e.g., bicycles), rail vehicles (e.g., trains or trams), watercraft (e.g., boats or ships), aircraft (e.g., airplanes or helicopters), or spacecraft (e.g., satellites). Generally, manufacturers may mount radar assembly 102 to any mobile platform, including mobile machinery or robotic equipment.

[0017] In the depicted implementation, radar assembly 102 is mounted on the front of vehicle 104 and provides a field of view 106 that illuminates one or more objects 108. Radar assembly 102 can project field of view 106 from any exterior surface of vehicle 104. For example, a vehicle manufacturer can integrate radar assembly 102 into a bumper, side mirrors, headlights, taillights, or any other interior or exterior location where objects 108 need to be detected. In some cases, vehicle 104 includes multiple radar assemblies 102, such as a first radar assembly 102 and a second radar assembly 102 that together provide a larger field of view 106. Generally speaking, a vehicle manufacturer can design the position of one or more radar assemblies 102 to provide a specific field of view 106 encompassing an area of interest where objects 108 may be present. Example fields of view 106 include a 360-degree field of view, one or more 180-degree fields of view, one or more 90-degree fields of view, and the like, which can overlap or be combined to form a field of view 106 of a specific size.

[0018] Object 108 is composed of one or more materials that reflect radar signals. Depending on the application, object 108 may represent a target of interest. In some cases, object 108 may be a moving object or a stationary object. A stationary object may be continuous (e.g., a concrete barrier, a guardrail) or discontinuous (e.g., a traffic cone) along a portion of a road.

[0019] Radar assembly 102 emits electromagnetic radiation by transmitting one or more electromagnetic signals or waveforms through active elements. In environment 100, radar assembly 102 can detect and track objects 108 by transmitting and receiving one or more radar signals. For example, radar assembly 102 can transmit electromagnetic signals between 100 and 400 gigahertz (GHz), between 4 and 100 GHz, or between approximately 70 and 80 GHz.

[0020] Radar assembly 102 may determine the distance to object 108 based on the time it takes for a signal to travel from radar assembly 102 to object 108 and back from object 108 to radar assembly 102. Radar assembly 102 may also determine the position of object 108 in angular terms based on the direction of the received maximum amplitude return signal.

[0021] Radar assembly 102 may be part of vehicle 104. Vehicle 104 may also include at least one vehicle system that relies on data from radar assembly 102, including a driver assistance system, an autonomous driving system, or a semi-autonomous driving system. Radar assembly 102 may include an interface to at least one vehicle system, wherein antenna 114 may output a signal via the interface based on electromagnetic energy received by antenna 114. Typically, vehicle systems use radar data provided by radar assembly 102 to perform functions. For example, a driver assistance system may provide blind spot monitoring and generate an alert indicating a potential collision with an object 108 detected by radar assembly 102. In this case, radar data from radar assembly 102 indicates when it is safe or unsafe to change lanes. An autonomous driving system may move vehicle 104 to a specific location on the road while avoiding a collision with object 108 detected by radar assembly 102. Radar data provided by radar assembly 102 may provide information regarding the distance to object 108 and the location of object 108, enabling the autonomous driving system to perform emergency braking, execute a lane change, or adjust the speed of vehicle 104.

[0022] Radar assembly 102 includes a transmitter 110 and at least one antenna 114 for transmitting electromagnetic signals, and a receiver 112 and at least one antenna 114 for receiving reflected versions of these electromagnetic signals. Transmitter 110 includes components for transmitting electromagnetic signals. Receiver 112 includes one or more components for detecting reflected electromagnetic signals. Transmitter 110 and receiver 112, sometimes also referred to as transceivers, may be separate or combined and may be incorporated together on the same integrated circuit (e.g., a transceiver integrated circuit) or, if separate, incorporated separately on different integrated circuits. Radar assembly 102 may also include other components and integrated circuits (e.g., MMICs) to perform frequency mixing, power amplification, low-noise amplification, high-frequency switching, and other functions on transmitted and / or received electromagnetic signals.

[0023] Radar assembly 102 also includes one or more processors 116 and a computer-readable storage medium (CRM) 118. Processor 116 may be a microprocessor or a system-on-chip. Processor 116 executes instructions stored in CRM 118. For example, processor 116 may process electromagnetic energy received by antenna 114 and determine the position of object 108 relative to radar system 102. Processor 116 may also generate radar data for automotive systems. For example, processor 116 may control an autonomous or semi-autonomous driving system of vehicle 104 based on the processed electromagnetic energy from antenna 114.

[0024] Figure 2 An exploded partial cross-section of an example radar assembly 200 is shown having a radiator shield 202 with a recess 212. Radar assembly 200 includes radiator shield 202, radome 204, PCB 206, and housing 210.

[0025] Radome 204 may be an enclosure positioned adjacent to radiator shield 202 and at least a portion of housing 210. For example, radome 204 may be a dielectric material such as plastic. Housing 210 may be a protective structure positioned adjacent to a surface of PCB 206. Housing 210 may be made of, for example, a plastic material or a plastic material with metal reinforcements. Suitable plastic materials include, for example, thermoplastics. Selecting a thermoplastic filled with metal or carbon fillers as the material for housing 210 allows for the use of metal reinforcements within housing 210. Radome 204 and housing 210 together may form an enclosure surrounding radar assembly 200.

[0026] PCB 206 is a circuit board to which transmitter 110, receiver 112, antenna 114, processor 116, and CRM 118 may be attached. PCB 206 may be a standard circuit board of a flat laminate composite material made of a non-conductive substrate material with one or more layers of copper circuitry.

[0027] PCB 206 may include a plurality of thermal vias 214 between the surfaces of PCB 206. Thermally conductive material 208 (e.g., copper circuit traces) covers at least a portion of the surface of PCB 206 and the inner surface(s) of thermal vias 214. Thermally conductive material 208 may also cover distal ends of thermal vias 214, such as Figure 2 The thermally conductive material 208 may be metal (eg, including a copper alloy) and covers an unloaded area of the surface of the PCB 206 .

[0028] Heat sink shield 202 includes a plurality of recesses 212 that are in thermal contact with thermally conductive material 208 of PCB 206. Heat sink shield 202 distributes heat generated by components of radar assembly 200 (e.g., processor 116, integrated circuits, MMICs) away from these components and toward housing 210 via thermally conductive material 208 and thermal vias 214. Heat sink shield 202 may extend to an unloaded area of PCB 206 and be thermally connected to a ground plane of PCB 206 via thermally conductive material 208. Heat sink shield 202 may be metal, including a copper alloy or a copper alloy plated with nickel and gold.

[0029] Figure 3 An exploded partial cross-section of another example radar assembly 300 is shown having a radiator shield 202 with a recess 212. The radar assembly 300 is similar to Figure 2 Radar assembly 200. Figure 2 1 , the radar assembly 300 includes a radiator shield 202 , a radome 204 , a PCB 206 , and a housing 210 .

[0030] Similar to Figure 2 , the thermally conductive material 304 covers at least a portion of the surface of the PCB 206 and the inner surface of the thermal via 214. In this implementation, the thermally conductive material 304 does not cover the distal end of the thermal via 214.

[0031] Radar assembly 300 also includes an elastomeric pad 302 positioned between radome 204 and heat sink shield 202. Elastomeric pad 302 may include a recess configured to fit within a recess created by recess 212 of heat sink shield 202. Elastomeric pad 302 may provide sufficient pressure in radar assembly 300 to compress heat sink shield 202 against thermally conductive material 304 of PCB 206.

[0032] Figure 4 A partial cross-section of an example radar assembly 400 is shown having a recessed radiator shield 202. The radar assembly 400 is similar to Figure 2 The radar assembly 200 and Figure 3 Like radar assembly 300 , radar assembly 400 includes radiator shield 202 , radome 204 , PCB 206 , housing 210 , and elastomeric pad 302 .

[0033] The thermally conductive material 208 covers at least a portion of the surface of the PCB 206 and the inner surface(s) of the thermal vias 214. In this implementation, the thermally conductive material 208 also covers the distal ends of the thermal vias 214.

[0034] Radar assembly 400 also includes a plurality of alignment pins 402, for example, protruding from surfaces of radiator shield 202, radome 204, and / or housing 210. Alignment pins 402 may align radiator shield 202 with PCB 206, radome 204, and housing 210. Alignment pins 402 may extend through radiator shield 202 and PCB 206 between recesses in radiator shield 202. Alignment pins 402 may also be partially embedded in radome 204 and housing 210.

[0035] Figure 5 A cross section of an example radar assembly 500 is shown having a radiator shield 202 with recesses. The recesses may have an approximately spherical shape. As a non-limiting example, the recesses may also be arranged in an aligned or staggered pattern with a depth of approximately 0.25 to 0.50 mm, a diameter of approximately 1 mm, and a pitch of approximately 2.5 mm. The radar assembly 500 is similar to Figure 2 Like radar assembly 200 , radar assembly 500 includes a radiator shield 202 , a radome 204 , a PCB 206 , and a housing 210 .

[0036] Radar assembly 500 may also include an integrated circuit (IC) 502 and a processor 504. IC 502 may be, for example, an MMIC. IC 502 may be operatively connected to a circuit board via a BGA, which may be operatively connected to a surface of PCB 206 via another BGA. Figure 5 As shown, thermally conductive material 208 does not cover the surface of PCB 206 beneath IC 502 to avoid interfering with the connection between IC 502 and PCB 206 .

[0037] Processor 504 may be, for example, a microprocessor. Similar to IC 502, processor 504 may be operatively connected to a circuit board via a BGA, which in turn may be operatively connected to a surface of PCB 206 via another BGA. In this implementation, processor 504 is connected to a different surface of PCB 206 than IC 502. In other implementations, processor 504 and IC 502 may be connected to the same surface of PCB 206. Thermally conductive material 208 does not cover the surface of PCB 206 beneath processor 504.

[0038] In the depicted implementation, the processor 504 is positioned nearly opposite the IC 502. In this or other implementations, other discrete components ( Figure 5504) can be positioned on another surface of PCB 206 opposite IC 502. In such an implementation, through-board cooling may not be possible. However, heat sink shield 202 can spread heat energy from IC 502 and processor 504 to housing 210. In this way, heat sink shield 202 can prevent overheating.

[0039] Figure 6 A cross section of another example radar assembly 600 is shown having a recessed radiator shield 202. The radar assembly 600 is similar to Figure 5 Radar assembly 500. Like radar assembly 500, radar assembly 600 includes heat sink shield 202, radome 204, PCB 206, housing 210, IC 502, and processor 504.

[0040] Radar assembly 600 may also include a shield 602 positioned around IC 502 and processor 504. Shield 602 may increase the structural strength of radar assembly 600. Shield 602 may also provide additional shielding to IC 502 and processor 504 from electromagnetic interference.

[0041] Figure 7 A cross section of another example radar assembly 700 is shown having a recessed radiator shield 202. The radar assembly 700 is similar to Figure 5 Radar assembly 500. Like radar assembly 500, radar assembly 700 includes radiator shield 202, radome 204, PCB 206, housing 210, IC 502, and processor 504. Figure 4 Radar assembly 700 , as shown in FIG. 4 , further includes alignment pin 402 .

[0042] Radar assembly 700 may also include antenna 702. In some implementations, antenna 702 may be a stamped antenna waveguide. Antenna 702 may be positioned between radome 204 and radiator shield 202. In some implementations, antenna 702 may be incorporated into radiator shield 202.

[0043] Example Method

[0044] Figure 8 An example method 800 for assembling a radar assembly 102 having a radiator shield 202 with a recess 212 is depicted. The method 800 is shown as a plurality of sets of operations (or actions) being performed, but is not necessarily limited to the order or combination of operations shown herein. In addition, any one or more of the operations may be repeated, combined, or reorganized to provide other methods. In the following discussion, reference may be made to each of the methods. Figure 1 The radar assembly 102 or Figure 2 and Figure 5Radar assemblies 200 and 500 and entities described in detail herein are referenced for example only. The technology is not limited to being performed by one entity or multiple entities.

[0045] At 802, a PCB is positioned within a housing. The PCB includes an IC and a thermally conductive material covering at least a portion of a first surface and a second surface of the PCB. The housing is adjacent to the second surface of the PCB. For example, radar assembly 102 includes PCB 206 positioned within housing 210. PCB 206 includes IC 502 and thermally conductive material 208 covering at least a portion of a first surface and a second surface of PCB 206. The second surface of PCB 206 is opposite the first surface of the PCB. Housing 210 is adjacent to the second surface of PCB 206.

[0046] At 804, a heat sink shield is positioned adjacent to at least one of the first or second surfaces of the PCB and the IC. The heat sink shield includes a plurality of recesses that are in thermal contact with the thermally conductive material of the PCB. The heat sink shield is configured to dissipate heat energy generated by the IC to the housing. For example, radar assembly 102 also includes heat sink shield 202 positioned adjacent to at least one of the first or second surfaces of PCB 206 and IC 502. Heat sink shield 202 includes a plurality of recesses 212 that are in thermal contact with the thermally conductive material 208 of PCB 206. Heat sink shield 202 is configured to dissipate heat energy generated by IC 502 to the housing 210.

[0047] At 808, the radome is positioned adjacent to the radiator shield and at least a portion of the housing. The radome and housing enclose the PCB and radiator shield. For example, radar assembly 102 also includes radome 204, which can be positioned adjacent to radiator shield 202 and at least a portion of housing 210. Radome 204 and housing 210 enclose PCB 206 and radiator shield 202 to form radar assembly 102.

[0048] At 808, the housing, PCB, radiator shield, and radome are attached to form the radar system. For example, housing 210, PCB 206, radiator shield 202, and radome 204 are attached (including by laser welding) to form radar assembly 102. Alignment pins 402 may be used to align housing 210, PCB 206, and radiator shield 202.

[0049] Example

[0050] In the following sections, examples are provided.

[0051] Example 1: A radar assembly comprises: a printed circuit board (PCB), the printed circuit board (PCB) including an integrated circuit (IC) and a thermally conductive material, the thermally conductive material covering at least a portion of a first surface of the PCB and at least a portion of a second surface of the PCB opposite to the first surface of the PCB; a heat sink shield, the heat sink shield including a plurality of recesses in thermal contact with the thermally conductive material of the PCB, the heat sink shield being adjacent to at least one of the first surface of the PCB or the second surface of the PCB and the IC, the heat sink shield being configured to dissipate heat energy at least partially generated by the IC to a housing adjacent to the second surface of the PCB; and a radome, the radome being adjacent to the radiator shield and at least a portion of the housing, the radome and the housing enclosing the PCB and the heat sink shield.

[0052] Example 2: The radar assembly of Example 1, further comprising: a plurality of alignment pins configured to align the assembly, the PCB, the heat sink shield, and the housing.

[0053] Example 3: The radar assembly of Example 2, wherein the plurality of alignment pins pass through the radiator shield between at least some of the plurality of recesses.

[0054] Example 4: The radar assembly of Example 2 or 3, further comprising: an elastomeric pad positioned between the radome and the heat sink shield to provide sufficient pressure in the radar assembly to press the heat sink shield against the thermally conductive material of the PCB, the elastomeric pad comprising a recess configured to fit within a recess created by the recess of the heat sink shield.

[0055] Example 5: The radar assembly of any one of Examples 1 to 4, further comprising: an antenna positioned between the radome and the radiator shield.

[0056] Example 6: The radar assembly of any one of Examples 1 to 5, wherein: the IC is a monolithic microwave integrated circuit (MMIC) and is positioned on the first surface of the PCB; the PCB further includes a plurality of thermal vias between the first surface of the PCB and the second surface of the PCB, the plurality of thermal vias being configured to dissipate thermal energy generated at least in part by the MMIC from the first surface of the PCB to the second surface of the PCB; and the thermally conductive material covers inner surfaces of the thermal vias.

[0057] Example 7: The radar assembly of Example 6, wherein the thermally conductive material further covers the first distal end and the second distal end of the thermal via to spread the thermal energy generated at least in part by the MMIC along the first surface of the PCB.

[0058] Example 8: The radar assembly of Example 6, wherein the first distal end and the second distal end of the thermal via are not covered by the thermally conductive material.

[0059] Example 9: The radar assembly of any of Examples 1 to 8, wherein: the housing comprises thermoplastic; the thermally conductive material comprises circuit traces; and the thermally conductive material and the heat sink shield are metal.

[0060] Example 10: The radar assembly of Example 9, wherein the thermally conductive material and the heat sink shield comprise a copper alloy.

[0061] Example 11: The radar assembly of any one of Examples 1 to 10, wherein the thermally conductive material covers the first surface of the PCB and unloaded areas of the second surface of the PCB to avoid interfering with the connection between the IC and the PCB.

[0062] Example 12: The radar assembly of Example 11, wherein the thermally conductive material does not cover loaded areas of the first surface of the PCB and the second surface of the PCB.

[0063] Example 13: The radar assembly of any of Examples 1 to 12, wherein the recesses have a depth of approximately 0.25 to 0.50 mm, a diameter of approximately 1 mm, and a pitch of approximately 2.5 mm.

[0064] Example 14: The radar assembly of any of Examples 1 to 13, wherein the recesses are arranged on the radiator shield in an aligned or staggered pattern.

[0065] Example 15: A method of assembling a radar system, the method comprising: positioning a printed circuit board (PCB) into a housing, the PCB including an integrated circuit (IC) and a thermally conductive material, the thermally conductive material covering at least a portion of a first surface of the PCB and at least a portion of a second surface of the PCB opposite to the first surface of the PCB, the housing being adjacent to the second surface of the PCB; positioning a heat sink shield adjacent to at least one of the first surface of the PCB or the second surface of the PCB and the IC, the heat sink shield including a plurality of recesses in thermal contact with the thermally conductive material of the PCB, and the heat sink shield being configured to dissipate heat energy at least partially generated by the IC to the housing; positioning a radome adjacent to the radiator shield and at least a portion of the housing, the radome and the housing surrounding the PCB and the radiator shield; and attaching the housing, the PCB, the radiator shield, and the radome together to form the radar system.

[0066] Example 16: The method of Example 15, further comprising aligning the PCB, the heat sink shield, and the housing using a plurality of alignment pins.

[0067] Example 17: The method of Example 16, further comprising positioning an elastomeric pad between the radome and the heat sink shield to provide sufficient pressure in the radar assembly to press the heat sink shield against the thermally conductive material of the PCB, the elastomeric pad comprising a recess configured to fit within a recess created by the recess of the heat sink shield.

[0068] Example 18: The method of any of Examples 15 to 17, further comprising positioning an antenna between the radome and the radiator shield.

[0069] Example 19: A method as described in any one of Examples 15 to 18, wherein: the IC is a monolithic microwave integrated circuit (MMIC) and is positioned on the first surface of the PCB; the PCB further includes a plurality of thermal vias between the first surface of the PCB and the second surface of the PCB, the plurality of thermal vias being configured to spread heat energy at least partially generated by the MMIC from the first surface of the PCB to the second surface of the PCB; and the thermally conductive material covers inner surfaces of the thermal vias.

[0070] Example 20: A method as described in any one of Examples 15 to 19, wherein: the IC is positioned on the first surface of the PCB; the PCB also includes a processor, which is positioned on the second surface of the PCB and is generally opposite the IC; and the heat sink shield is positioned adjacent to both the first surface of the PCB and the second surface of the PCB.

[0071] in conclusion

[0072] Although various embodiments of the present disclosure have been described in the foregoing description and shown in the accompanying drawings, it should be understood that the present disclosure is not limited thereto but may be implemented in various ways within the scope of the following claims. From the foregoing description, it will be apparent that various modifications may be made without departing from the spirit and scope of the present disclosure as defined by the following claims.

Claims

1. A radar assembly comprising: a printed circuit board (PCB) comprising an integrated circuit (IC) and a thermally conductive material covering at least a portion of a first surface of the PCB and at least a portion of a second surface of the PCB opposite the first surface of the PCB; a heat sink shield comprising a plurality of recesses in thermal contact with the thermally conductive material of the PCB, the heat sink shield being adjacent to the IC and the first surface of the PCB, the heat sink shield being configured to dissipate heat energy generated at least in part by the IC to a housing adjacent to the second surface of the PCB; as well as A radome is adjacent to at least a portion of the housing, the radome and the housing surrounding the PCB and the heat sink shield.

2. The radar assembly according to claim 1, wherein The radar assembly further comprises: A plurality of alignment pins are configured to align the assembly, the PCB, the heat sink shield, and the housing.

3. The radar assembly according to claim 2, wherein: The plurality of alignment pins passes through the radiator shield between at least some of the plurality of recesses.

4. The radar assembly according to claim 2, wherein: The radar assembly further comprises: an elastomeric pad positioned between the radome and the heat sink shield for providing sufficient pressure in the radar assembly to compress the heat sink shield against the thermally conductive material of the PCB, the elastomeric pad including a recess configured to fit within a recess created by the recess of the heat sink shield.

5. The radar assembly according to claim 1, wherein The radar assembly further comprises: An antenna is positioned between the radome and the radiator shield.

6. The radar assembly according to claim 1, wherein: The IC is a monolithic microwave integrated circuit (MMIC) and is positioned on the first surface of the PCB; the PCB further comprising a plurality of thermal vias between the first surface of the PCB and the second surface of the PCB, the plurality of thermal vias being configured to spread heat energy generated at least in part by the MMIC from the first surface of the PCB to the second surface of the PCB; and The thermal conductive material covers the inner surface of the thermal via.

7. The radar assembly according to claim 6, wherein: The thermally conductive material also covers the first distal end and the second distal end of the thermal via to spread the thermal energy generated at least in part by the MMIC along the first surface of the PCB.

8. The radar assembly according to claim 6, wherein: The first distal end and the second distal end of the thermal via are not covered by the thermally conductive material.

9. The radar assembly according to claim 1, wherein: The housing comprises thermoplastic; The thermally conductive material includes circuit traces; and The thermally conductive material and the heat sink shield are metal.

10. The radar assembly according to claim 9, wherein: The thermally conductive material and the heat sink shield include a copper alloy.

11. The radar assembly according to claim 1, wherein The thermally conductive material covers the first surface of the PCB and an unloaded area of the second surface of the PCB to avoid interfering with the connection between the IC and the PCB.

12. The radar assembly according to claim 11, wherein The thermally conductive material does not cover the first surface of the PCB and the loaded areas of the second surface of the PCB.

13. The radar assembly according to claim 1, wherein The depressions have a depth of about 0.25 to 0.50 mm, a diameter of about 1 mm, and a spacing of about 2.5 mm.

14. The radar assembly according to claim 1, wherein The recesses are arranged on the heat sink shield in an aligned or staggered pattern.

15. A method of assembling a radar system, the method comprising: Positioning a printed circuit board (PCB) into a housing, the PCB including an integrated circuit (IC) and a thermally conductive material, the thermally conductive material covering at least a portion of a first surface of the PCB and at least a portion of a second surface of the PCB opposite the first surface of the PCB, the housing being adjacent to the second surface of the PCB; positioning a heat sink shield adjacent the IC and the first surface of the PCB, the heat sink shield including a plurality of recesses in thermal contact with the thermally conductive material of the PCB, and the heat sink shield configured to spread thermal energy generated at least in part by the IC to the housing; positioning a radome adjacent to at least a portion of the housing, the radome and the housing surrounding the PCB and the heat sink shield; as well as The housing, the PCB, the heat sink shield, and the radome are attached together to form the radar system.

16. The method according to claim 15, wherein The method further comprises: The PCB, the heat sink shield, and the housing are aligned using a plurality of alignment pins.

17. The method according to claim 16, wherein The method further comprises: An elastomeric pad is positioned between the radome and the heat sink shield for providing sufficient pressure in the radar system to compress the heat sink shield against the thermally conductive material of the PCB, the elastomeric pad including a recess configured to fit within a recess created by the recess of the heat sink shield.

18. The method according to claim 15, wherein The method further comprises: An antenna is positioned between the radome and the radiator shield.

19. The method according to claim 15, wherein: The IC is a monolithic microwave integrated circuit (MMIC) and is positioned on the first surface of the PCB; the PCB further comprising a plurality of thermal vias between the first surface of the PCB and the second surface of the PCB, the plurality of thermal vias being configured to spread heat energy generated at least in part by the MMIC from the first surface of the PCB to the second surface of the PCB; and The thermal conductive material covers the inner surface of the thermal via.

20. The method of claim 15, wherein: The IC is positioned on the first surface of the PCB; The PCB further includes a processor positioned on the second surface of the PCB and generally opposite the IC; and The heat sink shield is positioned adjacent to both the first surface of the PCB and the second surface of the PCB.

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