Semiconductor devices

Abstract

A semiconductor device capable of visualizing internal temperature for two or more different purposes is provided. The semiconductor device comprises: at least one component partially encapsulated by an encapsulation material and partially exposed from the encapsulation material; a reversible temperature indicating material; and an irreversible temperature indicating material, wherein the reversible temperature indicating material and the irreversible temperature indicating material are each disposed on the surface of any one of the at least one component.

Description

Technical Field

[0001] The present invention relates to semiconductor devices. Background Art

[0002] Heat generation is a major problem in semiconductor devices. For example, in power semiconductor modules, use at high temperatures can lead to damage, so protection functions and temperature usage conditions are standardized for each product.

[0003] As a method for confirming the temperature of a semiconductor chip of a semiconductor device, Patent Document 1 discloses a technique of providing a temperature indicating material on a suspension lead in order to simply and accurately evaluate the temperature of a semiconductor chip encapsulated by a resin.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2008-103434

[0005] Patent document 1 shows a structure in which a temperature indicating material is provided on a suspension lead, but there is a problem that since the structure functions only by visualizing information on the internal temperature when power is supplied through a change in color, it is difficult to visualize the temperature change for two or more different purposes. Summary of the invention

[0006] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a semiconductor device capable of visualizing the internal temperature for two or more different purposes.

[0007] The semiconductor device of the present invention comprises: at least one semiconductor chip; a packaging material that integrally packages the at least one semiconductor chip; at least one component that is partially packaged by the packaging material and partially exposed from the packaging material; a reversible temperature indicating material; and an irreversible temperature indicating material, the reversible temperature indicating material and the irreversible temperature indicating material are each arranged on the surface of any one of the at least one component.

[0008] Effects of the Invention

[0009] The semiconductor device of the present invention has at least one component, the at least one component is partially encapsulated by an encapsulating material, and a part is exposed from the encapsulating material, and a reversible temperature indicating material and an irreversible temperature indicating material are respectively provided on the surface of any one of the at least one component. Thus, the internal temperature can be visualized for two or more different purposes. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 (a) is a top view of the semiconductor device according to the first embodiment, and (b) is a cross-sectional view of the semiconductor device according to the first embodiment.

[0011] Figure 2Cross-sectional view of the semiconductor device of Embodiment 2.

[0012] Figure 3 Cross-sectional view of the semiconductor device of Embodiment 3.

[0013] Figure 4 In (a), it is a cross-sectional view of the semiconductor device of Embodiment 4, and in (b), it is a side view of the semiconductor device of Embodiment 4.

[0014] Figure 5 Side view of the semiconductor device of Embodiment 5.

[0015] Figure 6 Side view of the semiconductor device of Embodiment 6. Detailed Embodiments

[0016] <A. Embodiment 1>

[0017] <A-1. Structure and Operation>

[0018] Figure 1 (a) is a top view of the semiconductor device 1, Figure 1 (b) is Figure 1 a cross-sectional view taken along the line A-A of (a). For ease of explanation, in Figure 1 (b), elements that are not on the cross-section are also shown.

[0019] As Figure 1 (a) shows, the semiconductor device 1 includes power semiconductor chips 2, 3, a control IC 4, a lead frame 10a, a lead frame 10b, and a molding resin 9.

[0020] In Figure 1 (a), a case where the semiconductor device 1 includes a plurality of power semiconductor chips 2, a plurality of power semiconductor chips 3, and a plurality of control ICs 4 is illustrated, but the number of each of the power semiconductor chips 2, 3, and the control IC 4 can be arbitrary. In addition, in this embodiment, a case where the semiconductor device 1 is assumed to be a power semiconductor module and includes power semiconductor chips 2, 3, and a control IC 4 as semiconductor chips is shown, but the semiconductor device 1 only needs to include at least one semiconductor chip.

[0021] The molding resin 9 is a packaging material, and the power semiconductor chips 2, 3, and the control IC 4, which are semiconductor chips included in the semiconductor device 1, are integrally encapsulated by the molding resin 9.

[0022] The lead frame 10a has a plurality of lead terminals 100a. The lead frame 10b has a plurality of lead terminals 100b. When it is not necessary to distinguish between the lead terminals 100a and the lead terminals 100b, each of the lead terminals 100a or the lead terminals 100b is referred to as a lead terminal 100.

[0023] One of the lead terminals 100a, namely the lead terminal 101a, has a die pad 102a, to which the power semiconductor chips 2 and 3 are bonded respectively by bonding materials 5 and 6. The lead terminal 100a other than the lead terminal 101a, namely the lead terminal 103a, is connected to the power semiconductor chips 2 and 3 by a metal fine wire, namely a wire 30.

[0024] One of the lead terminals 100b, namely the lead terminal 101b, has a die pad 102b, and the control IC 4 is bonded to the die pad 102b via a bonding material 7. Lead terminals 100b other than the lead terminal 101b (referred to as lead terminals 103b) are connected to the control IC 4 via wires 30.

[0025] Each of the bonding materials 5 , 6 , 7 is, for example, solder.

[0026] Each lead terminal 100 is partially encapsulated by the mold resin 9 , and a portion is exposed from the mold resin 9 .

[0027] The semiconductor device 1 is inserted into the substrate 12 and connected to the substrate pattern 11 of the substrate 12 using the bonding material 8. A device including the substrate 12 is referred to as a semiconductor device 1. The bonding material 8 is, for example, solder.

[0028] In the case of the semiconductor device 1, Figure 1 As shown, two temperature indicating materials 13 and 14 having different characteristics are provided on one or more surfaces of the lead terminal 100. That is, the number of lead terminals 100 provided with both the temperature indicating materials 13 and 14 is one or more. The number of lead terminals 100 provided with both the temperature indicating materials 13 and 14 may be plural. The temperature indicating materials 13 and 14 are provided on the exposed surface of the lead terminal 100, that is, on the surface of the portion exposed from the molding resin 9.

[0029] For example, the two temperature indicating materials 13 and 14 having different characteristics are irreversible and reversible. The following description assumes that the temperature indicating material 13 is an irreversible temperature indicating material and the temperature indicating material 14 is a reversible temperature indicating material.

[0030] Temperature indicating materials 13 and 14 are, for example, paints, applied to the surface of lead terminal 100, and provided on the surface of lead terminal 100. Temperature indicating materials 13 and 14 are, for example, seals, attached to the surface of lead terminal 100, and provided on the surface of lead terminal 100.

[0031] Both reversible and irreversible temperature indicating materials 13 and 14 are provided on the surface of one or more lead terminals 100 of the semiconductor device 1, and the materials are changed in color based on the temperature inside the molding resin 9. By selecting the material of the temperature indicating material, the temperature at which the reversible and irreversible temperature indicating materials change in color can be set arbitrarily according to the purpose. The temperature at which the reversible temperature indicating material changes in color and the temperature at which the irreversible temperature indicating material changes in color can be the same or different.

[0032] like Figure 1 As shown, by providing temperature indicating materials 13 and 14 on the surface of the lead terminal 101b bonded to at least one of the control ICs 4, the heat generation of at least one of the control ICs 4 can be continuously visualized and retained as a history. If temperature indicating materials 13 and 14 are provided on the surface of the lead terminal 101a bonded to at least one of the power semiconductor chips 2 and 3, the heat generation of at least one of the power semiconductor chips 2 and 3 can be continuously visualized and retained as a history. Instead of continuously visualizing the heat generation of the power semiconductor chips 2 and 3 or the control IC 4, the heat generation of the lead terminals 101b and 101a can be continuously visualized and retained as a history.

[0033] Temperature indicating materials 13 and 14 may be provided on the surfaces of lead terminals 100 not having a die pad, that is, lead terminals 103 a and 103 b , so that the heat generation of the lead terminals 100 can be continuously visualized and stored as a history.

[0034] It is considered that the tip of the lead terminal 100 is exposed to high temperature during soldering when the semiconductor device 1 is mounted on the substrate 12. It is preferable that the irreversible temperature indicating material 13 is as follows: Figure 1 As shown, it is provided at the base of the lead terminal 100. For example, in the lead terminal 100 that protrudes from the molded resin 9 and partially exposes, the irreversible temperature indicating material 13 is provided on the surface of the portion protruding from the molded resin 9 closer to the molded resin 9 than the tip.

[0035] By using both the reversible thermochromic material 14 and the irreversible thermochromic material 13, depending on the reversible thermochromic material 14, it is possible to continuously visualize whether the internal temperature reaches a specific temperature, confirm initial faults, aging, etc. inside, and depending on the irreversible thermochromic material 13, it is possible to retain the fact that a specific temperature has been reached as a record. In this way, by using reversible and irreversible thermochromic materials, it is possible to visualize the internal temperature for different purposes of at least two. By arranging the reversible thermochromic material 14 and the irreversible thermochromic material 13 on the surface of the same lead terminal 100, it is possible to suppress the temperature difference between the reversible thermochromic material 14 and the irreversible thermochromic material 13.

[0036] It is also possible to measure the temperature of the semiconductor device 1 using a device such as a thermal imager. However, the internal temperature of the molding resin 9 is different from the surface temperature, and it is difficult to accurately measure the internal temperature using a thermal imager or the like. By using the reversible thermochromic material 14 and the irreversible thermochromic material 13 arranged on the lead terminal 100, it is possible to accurately visualize the internal temperature of the molding resin 9 and retain it as a record.

[0037] <A - 2. Effects>

[0038] The semiconductor device 1 has at least one component, namely the lead terminal 100. The at least one component is partially encapsulated by the molding resin 9, and a part thereof is exposed from the encapsulating material. The reversible thermochromic material 14 and the irreversible thermochromic material 13 are respectively arranged on the surface of any one of the at least one lead terminal 100. Thus, it is possible to visualize the internal temperature for different purposes of at least two.

[0039] The reversible thermochromic material 14 and the irreversible thermochromic material 13 are respectively arranged on the surface of the part of any one of the at least one lead terminal 100 that is exposed from the molding resin 9. Thus, it is possible to visualize the internal temperature for different purposes of at least two.

[0040] Both the reversible thermochromic material 14 and the irreversible thermochromic material 13 are arranged on the surface of the same lead terminal 100. Thus, it is possible to suppress the temperature difference between the reversible thermochromic material 14 and the irreversible thermochromic material 13.

[0041] The irreversible thermochromic material 13 is arranged on the surface of the part of the lead terminal 100 that protrudes from the molding resin 9 and is close to the molding resin 9 on the side where a part is exposed in a form protruding from the molding resin 9. Thus, it is possible to suppress the irreversible thermochromic material 13 from being exposed to high temperatures during soldering.

[0042] <B. Embodiment 2>

[0043] Figure 2 This is a cross-sectional view of the semiconductor device 1b of Embodiment 2. The semiconductor device 1b is the same as the semiconductor device 1 of Embodiment 1 except for the arrangement of the temperature indicating materials 13 and 14. In this embodiment as well, the temperature indicating material 14 is reversible and the temperature indicating material 13 is irreversible.

[0044] As Figure 2 shown, the irreversible temperature indicating material 13 may be provided not only at the root of the lead terminal 100. If the irreversible temperature indicating material 13 is provided over a wide range on the surface of the lead terminal 100, even if a part of the irreversible temperature indicating material 13 changes color during soldering, the temperature history during operation can be retained by other parts.

[0045] The semiconductor device 1b of this embodiment is characterized by a structure in which the temperature indicating materials 13 and 14 are caused to change color by controlling the temperature of the control IC 4. As Figure 2 shown, the temperature indicating material 13 and the temperature indicating material 14 are provided on the same lead terminal 101b that is bonded to the control IC 4 through the die pad 102b.

[0046] In the case of a power semiconductor module, depending on the product, it has a temperature output function that outputs information on the temperature of the control IC 4 as a voltage and feeds it back to an MCU (Micro Controller Unit) or the like to activate the protection function.

[0047] The irreversible temperature indicating material 13 changes color at a temperature higher than the temperature at which the protection function operates. The temperature at which the reversible temperature indicating material 14 changes color can be arbitrarily selected according to the purpose.

[0048] When the reversible temperature indicating material 14 changes color at a temperature higher than the temperature at which the protection function operates, if the temperature indicating material 14 changes color before the protection function operates, it can be confirmed that the temperature output function of the semiconductor device 1b has not been correctly used or a failure has occurred, etc.

[0049] When the reversible temperature indicating material 14 changes color at a temperature lower than the temperature at which the protection function operates, the fact that the temperature output function is operating without initial failure and without aging can be continuously visualized and confirmed through the reversible temperature indicating material.

[0050] In addition, when the irreversible temperature indicating material 13 that changes color at a temperature higher than the temperature at which the protection function operates changes color before the protection function operates, the fact that the temperature output function of the semiconductor device 1b has not been correctly used or a failure has occurred, etc. can be retained as a history.

[0051] <C. Embodiment 3>

[0052] Figure 3 This is a cross-sectional view of the semiconductor device 1c of Embodiment 3.

[0053] The semiconductor device 1c is characterized in that a structure is provided in which both a reversible temperature indicating material 15 and an irreversible temperature indicating material 16 are coated or pasted on the same lead terminal 101a having a die pad 102a bonded to the power semiconductor chips 2 and 3.

[0054] The temperature of the control IC 4 is output as a voltage through the temperature output function described in Embodiment 2. However, it is also conceivable that, for example, when a malfunction occurs inside the semiconductor device 1 and the temperature of the power semiconductor chips 2 and 3 rises rapidly, element breakage of the power semiconductor chips 2 and 3 and the control IC 4 occurs, and temperature information cannot be obtained through the temperature output function.

[0055] By coating or pasting the reversible and irreversible temperature indicating materials 15 and 16 on the lead terminal 101a bonded to the power semiconductor chips 2 and 3, the temperature information of the power semiconductor chips 2 and 3, which is higher than the temperature of the control IC 4, can be continuously visualized through the reversible temperature indicating material 15, and the temperature history can be retained for the rapid temperature rise of the power semiconductor chips 2 and 3 that may not be obtained through the temperature output function of the control IC 4.

[0056] Alternatively, instead of the lead terminal 101a, reversible and irreversible temperature indicating materials may be provided on the surface of the lead terminal 103a connected to the power semiconductor chips 2 and 3 through the wire 30 to continuously visualize the rapid temperature rise of the lead terminal 103a and retain the history.

[0057] <D. Embodiment 4>

[0058] Figure 4 (a) is a cross-sectional view of the semiconductor device 1d of Embodiment 4, Figure 4 (b) is a side view of the semiconductor device 1d of Embodiment 4 as viewed from the side of the power semiconductor chips 2 and 3, that is, Figure 4 the side B of the arrow in (a).

[0059] The semiconductor device 1d has the same structure except for the arrangement of the semiconductor device 1, each lead terminal 100a and the lead terminal 100b, and the setting method of the temperature indicating material.

[0060] The semiconductor device 1d is characterized in that a structure is provided in which reversible and irreversible temperature indicating materials are coated or pasted on both sides of one lead terminal 100.

[0061] The lead terminal is usually flat and has a main surface and another main surface on the side opposite to the main surface. In the present embodiment, a reversible thermochromic material is coated or pasted on one main surface of a certain lead terminal 100, and an irreversible thermochromic material is coated or pasted on the other main surface of the certain lead terminal 100. In addition, no irreversible thermochromic material is provided on this one main surface, and no reversible thermochromic material is provided on the other main surface. In this way, thermochromic materials are provided on the two main surfaces of the lead terminal 100 to change colors for different purposes. The number of lead terminals 100 with a reversible thermochromic material provided on one main surface and an irreversible thermochromic material provided on the other main surface can be arbitrary. In Figure 4 (a) shows the case where the reversible thermochromic material is provided on one main surface of each of the lead terminal 101a and the lead terminal 101b, and the irreversible thermochromic material is provided on the other main surface.

[0062] Either the reversible or irreversible thermochromic material can be coated or pasted on either main surface. However, after the semiconductor device 1d is mounted on the substrate 12, it is difficult to confirm Figure 4 (a) the surface on the side of the semiconductor device 1d such as the surface provided with the thermochromic materials 13 and 16. Therefore, it is preferable that, like the thermochromic materials 14 and 15, the reversible thermochromic material is coated or pasted on the surface facing outward when the semiconductor device 1d is mounted on the substrate 12, and the irreversible thermochromic material is coated or pasted on its back surface like the thermochromic materials 13 and 16.

[0063] By coating or pasting a reversible thermochromic material on one main surface of one lead terminal 100 and an irreversible thermochromic material on the other main surface, the area coated or pasted with one thermochromic material becomes larger, and it is easier to confirm the state of the thermochromic material compared to providing both the reversible and irreversible thermochromic materials on one surface.

[0064] <E. Embodiment 5>

[0065] Figure 5 (a) and Figure 5 (b) are side views of the semiconductor device 1e of Embodiment 5.

[0066] In Figure 5In (a), on two regions longitudinally divided on one exposed surface portion of the lead terminal 100, a reversible temperature indicating material 17 and an irreversible temperature indicating material 18 are respectively coated or pasted. That is, a reversible temperature indicating material 17 is provided in one of the two regions obtained by dividing the exposed surface portion of one main surface of the lead terminal 100 along the boundary in the direction in which the lead terminal 100 protrudes from the molding resin 9, and an irreversible temperature indicating material 18 is provided in the other of the two regions. When the temperature becomes greater than or equal to the discoloration temperature, the reversible temperature indicating material 17 and the irreversible temperature indicating material 18 change color to different colors.

[0067] In Figure 5 In (b), the reversible temperature indicating material 19 and the irreversible temperature indicating material 20 are provided on the exposed surface portion of one main surface of the lead terminal 100 in a manner such that they are each in a strip shape and together form a mesh shape. When the temperature becomes greater than or equal to the discoloration temperature, the reversible temperature indicating material 19 and the irreversible temperature indicating material 20 change color to different colors.

[0068] In the present embodiment, as described above, both a reversible temperature indicating material and an irreversible temperature indicating material are provided on one main surface of the lead terminal 100.

[0069] After the semiconductor device 1e is mounted on the substrate, the surface on the semiconductor device 1e side becomes difficult to confirm. Therefore, it is preferable to coat or paste reversible and irreversible temperature indicating materials on the surface that becomes the outer side when the semiconductor device 1e is mounted on the substrate.

[0070] It is also possible to divide the exposed portion of the lead terminal 100 vertically, that is, into a side close to the molding resin 9 and a side far from it, and coat or paste a reversible temperature indicating material and an irreversible temperature indicating material. However, it is considered that the temperature distributions are different on the side close to the molding resin 9 and the side far from it. By longitudinally dividing as shown in Figure 5 (a), or by coating or pasting the temperature indicating materials in a mesh shape as shown in Figure 5 (b), it is possible to suppress the temperature difference between the reversible temperature indicating material 17 and the irreversible temperature indicating material 18.

[0071] In the present embodiment, since the reversible and irreversible temperature indicating materials are coated or pasted on one surface of the lead terminal 100, it is easier to confirm the state of each temperature indicating material than when they are coated or pasted on both surfaces of the lead terminal 100.

[0072] <F. Embodiment 6>

[0073] Figure 6 It is a side view of the semiconductor device 1f of Embodiment 6 as viewed from the power semiconductor chips 2 and 3 side.

[0074] When the temperature indicating material 21 is provided on the lead terminal 100, by setting it such that characters appear if the temperature rises, it can be made more visually prominent compared to simply changing the color of the temperature indicating material. The characters can also be, for example, numbers representing the temperature. In Figure 6 FIG. shows a case where the temperature indicating material 21 is provided in such a way that characters such as "NG" appear if the temperature rises.

[0075] The temperature indicating material 21 is, for example, an irreversible temperature indicating material, and a reversible temperature indicating material is provided on the surface of the lead terminal 100 opposite to the surface on which the temperature indicating material 21 is provided. Alternatively, the temperature indicating material 21 is, for example, a reversible temperature indicating material, and an irreversible temperature indicating material is provided on the surface of the lead terminal 100 opposite to the surface on which the temperature indicating material 21 is provided. In this way, at least one of the reversible temperature indicating material and the irreversible temperature indicating material is provided on the surface of the lead terminal 100 in such a way that characters appear if the temperature rises. It is also possible that both the reversible temperature indicating material and the irreversible temperature indicating material are provided on the surface of the lead terminal 100 in such a way that characters appear if the temperature rises.

[0076] <G. Embodiment 7>

[0077] In Embodiments 1 to 6, a case where both a reversible temperature indicating material and an irreversible temperature indicating material are provided on one lead terminal 100 is shown, but it is also possible to provide a reversible temperature indicating material on one lead terminal 100 and an irreversible temperature indicating material on another lead terminal 100. With such a structure, it is also possible to continuously visualize the temperature inside the molding resin 9 and retain it as a record.

[0078] In addition, the reversible temperature indicating material and the irreversible temperature indicating material may be provided not on the surface of the lead terminal 100 but on the surface of a hanging lead that is not used for electrical connection of the semiconductor device. Moreover, more generally, the reversible temperature indicating material and the irreversible temperature indicating material may be provided on the surface of a component (hereinafter referred to as component 200) that is partially encapsulated by the molding resin 9 and a part of which protrudes from the molding resin 9.

[0079] That is, the semiconductor device may also be a structure including a molded resin 9 that integrally encapsulates at least one semiconductor chip, at least one component 200 that is partially encapsulated by the molded resin 9 and partially exposed from the molded resin 9, and a reversible temperature indicating material and an irreversible temperature indicating material are each provided on the surface of any one of the at least one component 200. In this case, by using a component having a higher thermal conductivity than the molded resin 9 as the component 200, and providing the reversible temperature indicating material and the irreversible temperature indicating material in the component 200, the temperature inside the molded resin 9 can be visualized for two or more different purposes, as described in the first to sixth embodiments. The lead terminal 100 of the first to sixth embodiments is an example of the component 200.

[0080] For example, by using a member having a higher thermal conductivity than the lead terminal 100 as the member 200 , the temperature inside the mold resin 9 can be more accurately visualized.

[0081] In addition, it is also conceivable that a component 200 is exposed from multiple locations of the molded resin 9, but in order to suppress the temperature difference, it is preferred that both the reversible temperature indicating material and the irreversible temperature indicating material are provided on a series of exposed surfaces of the same component 200 that are exposed from the molded resin 9.

[0082] In Embodiments 1 to 6, the cases where both reversible and irreversible temperature indicating materials are provided on the exposed surface of the lead terminal 100 are shown, but irreversible temperature indicating materials may be provided on the surface of a portion not exposed from the molding resin 9 .

[0083] Furthermore, the various embodiments may be freely combined, and the various embodiments may be appropriately modified or omitted.

[0084] Description of the label

[0085] 1, 1b, 1c, 1d, 1e, 1f semiconductor device, 2, 3 power semiconductor chip, 4 control IC, 5, 6, 7, 8 bonding material, 9 molding resin, 10a, 10b lead frame, 11 substrate pattern, 12 substrate, 13, 14, 15, 16, 17, 18, 19, 20, 21 temperature indicating material, 30 wire, 100, 100a, 100b, 101a, 101b, 103a, 103b lead terminal, 102a, 102b die pad.

Claims

1. A semiconductor device comprising: At least 1 semiconductor chip; A packaging material that integrally packages the at least one semiconductor chip; at least one component partially encapsulated by the encapsulating material and partially exposed from the encapsulating material; Reversible temperature indicating materials; as well as Irreversible temperature indicating materials, The reversible temperature-indicating material and the irreversible temperature-indicating material are each disposed on a surface of any one of the at least one component. The reversible temperature indicating material and the irreversible temperature indicating material are both provided on the surface of the same one of the components. Both the reversible temperature indicating material and the irreversible temperature indicating material are provided on one of the main surfaces of the one of the components. The reversible temperature indicating material and the irreversible temperature indicating material are arranged on the main surface of the one of the components in strips with different directions, and together form a mesh shape.

2. The semiconductor device according to claim 1, wherein The reversible temperature-indicating material is provided on a surface of a portion of any of the at least one component that is exposed from the packaging material.

3. The semiconductor device according to claim 1, wherein The reversible temperature-indicating material and the irreversible temperature-indicating material are each provided on a surface of a portion of any one of the at least one member that is exposed from the packaging material.

4. The semiconductor device according to claim 3, wherein: The irreversible temperature indicating material is provided on a surface of a portion of the portion protruding from the sealing material that is closer to the sealing material than the front end in the portion protruding from the sealing material, in the member that exposes the portion in a state of protruding from the sealing material.

5. The semiconductor device according to claim 1, wherein Both the reversible temperature indicating material and the irreversible temperature indicating material are provided on a series of exposed surfaces of the one of the components which are exposed from the packaging material.

6. The semiconductor device according to claim 1, wherein The one of the components is bonded to any one of the at least one semiconductor chip.

7. The semiconductor device according to claim 1, wherein The one of the components is connected to a power semiconductor chip that is any one of the at least one semiconductor chip through a wire.

8. The semiconductor device according to claim 1, wherein The one of the components is bonded to a power semiconductor chip that is any one of the at least one semiconductor chip.

9. The semiconductor device according to claim 1, wherein: The reversible temperature indicating material is provided in one of two areas after the exposed surface portion of the one main surface of the one of the components is divided by a boundary along the direction in which the one of the components protrudes from the packaging material, and the irreversible temperature indicating material is provided in the other of the two areas.

10. The semiconductor device according to claim 1, wherein At least one of the reversible temperature indicating material and the irreversible temperature indicating material is provided on the surface of the member so that characters emerge when the temperature rises.

11. The semiconductor device according to claim 1, wherein The component has a higher thermal conductivity than the packaging material.

12. The semiconductor device according to claim 1, wherein The component is a lead terminal.

13. The semiconductor device according to claim 1, wherein It also has lead terminals, The thermal conductivity of the component is higher than that of the lead terminal.

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