Power supply control module and method for preparing the same

Abstract

The embodiment of the present application provides a power control module and a method for preparing the power control module, wherein the power control module comprises: a printed circuit board with a layer structure, and electrically connected to the printed circuit board: a micro control unit, a first connector, a second connector, a body controller group, a relay, and a current terminal; the printed circuit board with a layer structure comprises a current layer and a signal layer; the current layer and the signal layer are insulated and connected; the current terminal, the relay, and the first connector are electrically connected to the current layer, respectively; the relay, the micro control unit, the body controller group, and the second connector are electrically connected to the signal layer, respectively; the embodiment of the present application can solve the problem that it is difficult to lock the fault location when the power control module fails and needs to be repaired.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and in particular, relates to a power control module and a method for preparing the power control module. Background Art

[0002] In engineering construction, engineering vehicles are often needed, and electronic equipment plays a vital role in the control of engineering vehicles. For example, the power control module can control the opening or closing of various electrical components in the vehicle body. The powerful control function of the power control module comes from the functional coordination of its various control components. However, the wiring arrangement between the various control components in the existing power control module is complicated, and when the power control module fails and needs to be repaired, it is difficult to locate the fault location. Summary of the invention

[0003] The embodiments of the present application provide a power control module and a method for preparing the power control module, which can solve the problem that it is difficult to locate the fault location when the power control module fails and needs to be repaired.

[0004] In a first aspect, an embodiment of the present application provides a power control module, comprising: a printed circuit board of a layer structure, and electrically connected to the printed circuit board: a micro control unit, a first connector, a second connector, a body controller group, a relay, and a current terminal;

[0005] The printed circuit board of the layer structure includes a current layer and a signal layer; the current layer and the signal layer are insulated and connected;

[0006] The current terminal, the relay, and the first connector are electrically connected to the current layer respectively;

[0007] The relay, the micro control unit, the body controller group and the second connector are electrically connected to the signal layer respectively.

[0008] In one embodiment, the current layer includes two layers, a first current layer and a second current layer:

[0009] The second current layer is disposed between the two first current layers;

[0010] The first current layer and the second current layer are electrically connected to the current terminal, the relay, and the first connector, respectively.

[0011] In one embodiment, the vehicle body controller group includes a first vehicle body control unit and a second vehicle body control unit; the first connector includes two first connection components; the second connector includes two second connection components;

[0012] The first body control unit and the second body control unit are electrically connected to the signal layer respectively;

[0013] The two first connecting components are electrically connected to the current layer;

[0014] The two second connecting components are electrically connected to the signal layer.

[0015] In one embodiment, the current terminal is connected to the printed circuit board using a plurality of copper pins.

[0016] In one embodiment, the microcontroller unit, the first connector, the second connector, the vehicle body controller group, and the relay are connected to the printed circuit board by using a copper strip welded by a window; or,

[0017] The micro control unit, the first connector, the second connector, the vehicle body controller group, and the relay are connected to the printed circuit board by using patch tinning.

[0018] In one embodiment, the power control module further includes a fuse electrically connected to the surface of the printed circuit board;

[0019] The fuse is electrically connected to the current layer.

[0020] In one embodiment, the layer-structured printed circuit board further comprises a ground layer;

[0021] The grounding layer is arranged between the two first current layers and is used for grounding.

[0022] In a second aspect, an embodiment of the present application provides a method for preparing a power control module as described in the first aspect, the method comprising:

[0023] The printed circuit board is arranged as a layer structure, wherein the layer structure comprises a current layer and a signal layer; the signal layer is arranged between the current layers;

[0024] Electrically connecting the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal to the printed circuit board;

[0025] The current terminal, the relay, and the first connector are electrically connected to the current layer respectively;

[0026] The relay, the micro control unit, the body controller group and the second connector are electrically connected to the signal layer respectively.

[0027] In one embodiment, the microcontroller unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to a printed circuit board, including:

[0028] A number of copper pins are used to connect the current terminal to the current layer;

[0029] The microcontroller unit, the first connector, the second connector, the vehicle body controller group, the relay, and the current terminal are electrically connected to the printed circuit board by using a window-welded copper strip; or,

[0030] The micro control unit, the first connector, the second connector, the body controller group, and the relay are electrically connected to the printed circuit board by using patch tinning.

[0031] In one embodiment, the method further comprises:

[0032] Connect the fuse to the current layer.

[0033] The embodiment of the present application adopts a printed circuit board with a layered structure, and the current layer and signal layer of the printed circuit board are designed in a layered manner, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; and the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board, thereby achieving a high degree of integration of the power control module. When the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0035] Figure 1 is a structural schematic diagram of a power control module provided in an embodiment of the present application;

[0036] Figure 2 It is a structural schematic diagram of a printed circuit board provided in an embodiment of the present application;

[0037] Figure 3 It is a structural schematic diagram of another printed circuit board provided in an embodiment of the present application;

[0038] Figure 4 It is a flow chart of a method for preparing a power control module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0039] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0040] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0041] Based on the distributed design of each control device in the existing power control module, the wiring arrangement is complicated. When the power control module fails and needs to be repaired, it is difficult to locate the fault location.

[0042] In order to solve the problems of the prior art, an embodiment of the present application provides a power control module. The embodiment of the present application adopts a printed circuit board (PCB) with a layer structure, and the current layer and signal layer of the printed circuit board are designed in layers, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; and the microcontroller unit (MCU), the first connector, the second connector, the body control module (BCM) group, the relay, and the current terminal are electrically connected to the printed circuit board, so that the power control module is highly integrated, and when the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location. The power control module provided in the embodiment of the present application is first introduced below.

[0043] Figure 1 FIG. 1 is a schematic diagram showing the structure of a power control module provided by an embodiment of the present application. Figure 1 As shown, the power control module may include:

[0044] The printed circuit board 110 has a layer structure, and the micro control unit 120, the first connector 130, the second connector 140, the vehicle body controller group 150, the relay 160, and the current terminal 170 are electrically connected to the printed circuit board 110.

[0045] Among them, the microcontroller unit 120 is used to send a first control signal to the body controller group 150 and the relay 160; the body controller group 150 is used to connect to various electrical components of the body through the second connector 140, and control the opening or closing of various electrical components of the body according to the control signal; the relay 160 is used to connect to various electrical components of the body through the first connector 130, and control the current output to various electrical components of the body according to the control signal; the current terminal 170 is used to electrically connect to the vehicle power supply and provide current to the relay 160.

[0046] Figure 2 The structure diagram of the printed circuit board is shown in FIG. Figure 2 As shown, the layer-structured printed circuit board 110 may include a current layer 1101 and a signal layer 1102. The current layer 1101 and the signal layer 1102 are insulated and connected.

[0047] The current terminal 170 , the relay 160 , and the first connector 130 are electrically connected to the current layer 1101 , respectively.

[0048] The relay 160 , the micro control unit 120 , the vehicle body controller group 150 , and the second connector 140 are electrically connected to the signal layer 1102 , respectively.

[0049] The embodiment of the present application adopts a printed circuit board with a layered structure, and the current layer and signal layer of the printed circuit board are designed in a layered manner, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; and the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board, thereby achieving a high degree of integration of the power control module. When the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location.

[0050] Figure 3 The structure diagram of the printed circuit board is shown in FIG. Figure 3 As shown, in one embodiment, the current layer 1101 may include two layers, a first current layer 11011 and a second current layer 11012 .

[0051] The second current layer 11012 is disposed between two first current layers 11011 .

[0052] The first current layer 11011 transmits a first current between the current terminal 170 , the relay 160 , and the first connector 130 , and the first current is greater than a first preset threshold.

[0053] Among them, the first current layer that transmits a first current greater than a first preset threshold is set on the surface of the printed circuit board, and the heat dissipation is faster. The first current layer can power body components with higher power consumption, such as headlights and taillights.

[0054] The second current layer 11012 transmits a second current between the current terminal 170 , the relay 160 , and the first connector 130 , and the second current is not greater than a first preset threshold.

[0055] Among them, the second current layer can supply power to vehicle body components with lower power consumption, such as car locks, wipers, etc.

[0056] The embodiment of the present application adopts a printed circuit board with a layered structure, and the current layer and signal layer of the printed circuit board are designed in layers, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; the first current layer that transmits a first current greater than a first preset threshold is arranged on the surface of the printed circuit board, and the heat dissipation is faster; and the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board, thereby realizing a high degree of integration of the power control module. When the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location.

[0057] In one embodiment, if Figure 1 As shown, the vehicle body controller group 150 may include a first vehicle body control unit 1501 and a second vehicle body control unit 1502. The first connector 130 may include two first connection components 1301. The second connector 140 may include two second connection components 1302.

[0058] The first body control unit 1501 and the second body control unit 1502 are electrically connected to the signal layer 1102 respectively;

[0059] The two first connecting components 1301 are electrically connected to the current layer 1101;

[0060] The two second connection components 1302 are electrically connected to the signal layer 1102 .

[0061] The embodiment of the present application adopts a printed circuit board with a layered structure, and the current layer and signal layer of the printed circuit board are designed in layers, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; and the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board using the above layout, thereby achieving a high degree of integration of the power control module. When the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location.

[0062] In one embodiment, the current terminal 170 is connected to the printed circuit board 110 using a plurality of copper pins.

[0063] The embodiment of the present application uses a number of copper pins to connect the current terminal and the printed circuit board, and the electrical connection is stable, which can ensure that the current terminal can receive a larger current, so that the power of the power control module can reach 3000W, ensuring sufficient power supply.

[0064] In one embodiment, the micro control unit 120 , the first connector 130 , the second connector 140 , the vehicle body controller group 150 , and the relay 160 are connected to the printed circuit board 110 by using copper strips welded by opening windows.

[0065] The microcontroller unit, the first connector, the second connector, the body controller group, and the relay in the embodiment of the present application are connected to the printed circuit board by using window-welded copper strips, so that the components are firmly connected and stable power supply is ensured.

[0066] In one embodiment, the micro control unit 120 , the first connector 130 , the second connector 140 , the vehicle body controller group 150 , and the relay 160 are connected to the printed circuit board 110 by using SMD soldering.

[0067] The microcontroller unit, the first connector, the second connector, the body controller group, and the relay in the embodiment of the present application are tin-connected to the printed circuit board patch, so that the components are firmly connected and the power supply is stable.

[0068] In one embodiment, the power control module may further include a fuse 180 electrically connected to the surface of the printed circuit board 110 .

[0069] The fuse 180 is electrically connected to the current layer 1101 .

[0070] The power control module of the embodiment of the present application is also provided with a fuse electrically connected to the surface of the printed circuit board, which ensures that the current can be cut off when a short circuit occurs in the circuit, thereby improving the safety of electricity use.

[0071] Figure 3 The structure diagram of the printed circuit board is shown in FIG. Figure 3 As shown, in one embodiment, the layer-structured printed circuit board 110 may further include a ground layer 11013 .

[0072] The grounding layer 11013 is disposed between the two first current layers 11011 for grounding.

[0073] The embodiment of the present application also provides a grounding layer for grounding, which can prevent personal electric shock, damage to equipment and lines, prevent fire and lightning strikes, and prevent electrostatic damage, thereby ensuring the normal operation of the power system of the power control module.

[0074] The embodiment of the present application adopts a printed circuit board with a layered structure, and the current layer and signal layer of the printed circuit board are designed in layers, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; the first current layer that transmits a first current greater than a first preset threshold is arranged on the surface of the printed circuit board, and the heat dissipation is faster; and the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board, thereby realizing a high degree of integration of the power control module. When the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location.

[0075] Figure 1-3 The power control module is described below. Figure 4 The method provided in the embodiment of the present application is described.

[0076] Figure 4 A schematic flow chart of a method for preparing a power control module provided in one embodiment of the present application is shown. Figure 4 The method shown is used to prepare Figure 1 As shown in the module. Figure 4 As shown, the method may include:

[0077] S410, setting the printed circuit board into a layer structure.

[0078] The layer structure includes a current layer and a signal layer, and the signal layer is arranged between the current layers.

[0079] S420, electrically connecting the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal to the printed circuit board.

[0080] Among them, the current terminal, the relay, and the first connector are electrically connected to the current layer respectively; the relay, the micro control unit, the body controller group and the second connector are electrically connected to the signal layer respectively.

[0081] The embodiment of the present application adopts a printed circuit board with a layered structure, and the current layer and signal layer of the printed circuit board are designed in layers, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; the first current layer that transmits a first current greater than a first preset threshold is arranged on the surface of the printed circuit board, and the heat dissipation is faster; and the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board, thereby realizing a high degree of integration of the power control module. When the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location.

[0082] In one embodiment, the microcontroller unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to a printed circuit board, including:

[0083] A plurality of copper pins are used to connect the current terminal to the current layer, and a window-welded copper strip is used to electrically connect the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal to the printed circuit board.

[0084] The embodiment of the present application uses a number of copper pins to connect the current terminal and the printed circuit board, and uses window-welded copper bars to connect the microcontroller unit, the first connector, the second connector, the body controller group, and the relay to the printed circuit board, so that the components are firmly connected, ensuring stable power supply and electrical connection, and being able to ensure that the current terminal can connect to a larger current, so that the power of the power control module can reach 3000W, ensuring sufficient power supply.

[0085] In one embodiment, the microcontroller unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to a printed circuit board, including:

[0086] A plurality of copper pins are used to connect the current terminal with the current layer, and a micro control unit, a first connector, a second connector, a body controller group, and a relay are electrically connected to a printed circuit board by using patch tinning.

[0087] The embodiment of the present application uses a number of copper pins to connect the current terminal and the printed circuit board, and uses patch tinning to connect the micro control unit, the first connector, the second connector, the body controller group, and the relay to the printed circuit board, so that the components are firmly connected, ensuring stable power supply and electrical connection, and ensuring that the current terminal can connect to a larger current, so that the power of the power control module can reach 3000W, ensuring sufficient power supply.

[0088] In one embodiment, the method further comprises:

[0089] Connect the fuse to the current layer.

[0090] The power control module of the embodiment of the present application is also provided with a fuse electrically connected to the surface of the printed circuit board, which ensures that the current can be cut off when a short circuit occurs in the circuit, thereby improving the safety of electricity use.

[0091] The embodiment of the present application adopts a printed circuit board with a layered structure, and the current layer and signal layer of the printed circuit board are designed in layers, so that the signal transmission of the signal power control module is less affected by the high-power current transmission; the first current layer that transmits a first current greater than a first preset threshold is arranged on the surface of the printed circuit board, and the heat dissipation is faster; and the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board, thereby realizing a high degree of integration of the power control module. When the power control module fails and needs to be repaired, it is convenient to quickly lock the fault location.

[0092] It should be clear that the present application is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present application.

[0093] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0094] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A power control module, characterized in that: include: A printed circuit board with a layer structure, and electrically connected to the printed circuit board: a micro control unit, a first connector, a second connector, a body controller group, a relay, and a current terminal; The printed circuit board of the layer structure comprises a current layer and a signal layer; the current layer and the signal layer are insulated and connected; The current terminal, the relay, and the first connector are electrically connected to the current layer respectively; The relay, the micro control unit, the vehicle body controller group and the second connector are electrically connected to the signal layer respectively.

2. The power control module according to claim 1, characterized in that: The current layer includes two layers, a first current layer and a second current layer: The second current layer is arranged between the two first current layers; The first current layer and the second current layer are electrically connected to the current terminal, the relay, and the first connector, respectively.

3. The power control module according to claim 1, characterized in that: The vehicle body controller group includes a first vehicle body control unit and a second vehicle body control unit; the first connector includes two first connection components; the second connector includes two second connection components; The first body control unit and the second body control unit are electrically connected to the signal layer respectively; The two first connecting components are electrically connected to the current layer; The two second connecting components are electrically connected to the signal layer.

4. The power control module according to claim 1, characterized in that: The current terminal is connected to the printed circuit board by using a plurality of copper pins.

5. The power control module according to claim 1, characterized in that: The micro control unit, the first connector, the second connector, the vehicle body controller group, and the relay are connected to the printed circuit board by using a copper strip welded by a window; or, The micro control unit, the first connector, the second connector, the vehicle body controller group, and the relay are connected to the printed circuit board by using chip stacking tin.

6. The power control module according to claim 1, characterized in that: The power control module also includes a fuse electrically connected to the surface of the printed circuit board; The fuse is electrically connected to the current layer.

7. The power control module according to claim 2, characterized in that: The printed circuit board of the layer structure further comprises a ground layer; The grounding layer is disposed between the two first current layers, and the grounding layer is grounded.

8. The method for preparing a power control module according to claim 1, characterized in that: include: The printed circuit board is arranged as a layer structure, wherein the layer structure comprises a current layer and a signal layer; the signal layer is arranged between the current layers; Electrically connecting the micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal to the printed circuit board; The current terminal, the relay, and the first connector are electrically connected to the current layer respectively; The relay, the micro control unit, the vehicle body controller group and the second connector are electrically connected to the signal layer respectively.

9. The method for preparing a power control module according to claim 8, characterized in that: The method of electrically connecting the micro control unit, the first connector, the second connector, the vehicle body controller group, the relay, and the current terminal to the printed circuit board includes: Connecting the current terminal to the current layer using a plurality of copper pins; The micro control unit, the first connector, the second connector, the body controller group, the relay, and the current terminal are electrically connected to the printed circuit board by using a window-welded copper strip; or, The micro control unit, the first connector, the second connector, the body controller group, and the relay are electrically connected to the printed circuit board by using patch tinning.

10. The method for preparing a power control module according to claim 8, characterized in that: The method further comprises: A fuse is electrically connected to the current layer.

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